JP6430154B2 - Mirror device for imaging unit - Google Patents

Description

  The present invention relates to an imaging unit mirror device used in an imaging unit such as a monitoring camera and an inspection monitor.

  In recent years, in imaging units such as business surveillance cameras at financial institutions, medical surveillance cameras in medical settings, home surveillance cameras for crime prevention, and inspection monitors for industrial equipment, production facilities, medical equipment, etc. The mirror device for the imaging unit used has been remarkably developed.

  A first conventional mirror device for an imaging unit includes a hollow inclined box having one end attached to a lens portion of a surveillance camera, a hollow mirror box connected to and supported by the other end of the hollow inclined box, and an open end of the hollow mirror box. A first mirror attached to the upper part of the inner side surface and capable of swinging in the vertical direction; and a second mirror provided on the inner surface of the connecting end side of the hollow mirror box and reflecting the mirror image of the first mirror to the lens part of the surveillance camera And. Thereby, the monitoring target area is expanded by swinging the first mirror in the vertical direction and rotating the hollow mirror box itself (see Patent Document 1).

  However, in the first conventional imaging unit mirror device described above, the monitoring target area is limited to the swing range of the first mirror and the circumferential rotation range of the hollow mirror box, and is not wide. In addition, a plurality of monitored areas cannot be monitored simultaneously. Furthermore, since both the swing speed of the first mirror and the peripheral rotation speed of the hollow mirror box are relatively small, a monitoring target area that is not monitored for a long time occurs. Furthermore, the swinging of the first mirror and the circumferential rotation of the hollow mirror box require a mechanical unit such as a mirror rotation mechanism and a motor, and are therefore large.

  A second conventional mirror device for an imaging unit includes a rotating unit that rotatably holds the surveillance camera, a micro switch and a projection for defining the turning range of the monitoring camera by switching the rotation direction of the rotating unit, and the rotating unit. And a power supply pattern protrusion that is damaged by the pressing portion when the rotation of the motor is rotated by a predetermined angle or more. As a result, a wide monitoring target area is secured and overrun of the turn is prevented (see Patent Document 2).

  However, in the second conventional imaging unit mirror device described above, the monitoring target area is limited to the turning range and is not wide. In addition, a plurality of monitored areas cannot be monitored simultaneously. Furthermore, since the turning speed of the monitoring camera is relatively low, a monitoring target area that is not monitored for a long time occurs. Furthermore, the pivoting of the surveillance camera requires a mechanical unit such as a drive motor and is therefore large.

  A third conventional mirror device for an imaging unit is provided with a mirror body that is rotatable with respect to a rotation axis, and the reflected light from the mirror body that rotates the mirror body in one direction at high speed is photographed with a video camera. Then, an image that can be monitored by a plurality of monitors is created while adjusting the sampling of the image on a frame-by-frame basis using a special image processing unit and a synchronization signal with the rotation speed of the mirror surface (see Patent Document 3).

  According to the above-described third conventional mirror device for an imaging unit, the monitoring target area is a wide 360 ° circumference with a freely tiltable angle. In addition, a plurality of monitoring target areas can be monitored simultaneously. Further, since the mirror body is rotated at a high speed, there is no occurrence of a monitoring target area that is not monitored for a long time.

JP-A-60-169840 JP-A-5-191946 JP 2008-263251 A

  However, in the third conventional imaging unit mirror device described above, it is possible to simultaneously monitor a plurality of monitoring target areas, but a problem that a special image processing unit is required for image adjustment and creation. There is.

  Further, in the third conventional mirror device for an imaging unit, since a mechanical unit such as a stepping motor is required for high-speed rotation of the mirror body, there is also a problem that it is large.

In order to solve the above-described problem, an imaging unit mirror device according to the present invention is a mirror device for an imaging unit, and includes at least one mirror device provided to be inclined with respect to the imaging direction of the imaging unit. The mirror device includes first and second transparent substrates facing each other, first and second transparent electrode layers provided inside the first and second transparent substrates, and first and second transparent devices. And an electrolytic solution containing an electrodeposition agent sealed between the transparent electrode layers. The first transparent electrode layer is composed of a plurality of segment transparent electrode layers, the second transparent electrode layer is composed of a plurality of common transparent electrode layers, and the mirror device has a plurality of dots by the segment transparent electrode layer and the common transparent electrode layer. It is divided into Furthermore, the mirror device includes a microplanar lens between the second transparent substrate and the second transparent electrode layer. Furthermore, the mirror device includes a microprism between the second transparent substrate and the second transparent electrode layer.

  According to the present invention, a plurality of target areas can be imaged simultaneously without requiring a special image processing apparatus. Each mirror device is thin and has no movable part such as a mechanical unit, so that it can be miniaturized.

The 1st example of the mirror device applied to the mirror device for image pick-up units concerning the present invention is shown, (A) is a sectional view and (B) is a top view of a transparent electrode layer pattern. It is sectional drawing for demonstrating an effect | action of the mirror device of FIG. 1, Comprising: (A) shows a transparent state, (B) shows a plane mirror state. The characteristics of the mirror device of FIG. 1 are shown, (A) is a graph showing reflectance characteristics, and (B) is a graph showing transmittance characteristics. It is a flowchart for demonstrating the manufacturing method of the mirror device of FIG. It is sectional drawing which shows the 2nd example of the mirror device applied to the mirror apparatus for imaging units which concerns on this invention. FIG. 6 is an enlarged view of the concentric microplanar lens in FIG. 5, (A) is a perspective sectional view, and (B) is a top view. It is sectional drawing for demonstrating an effect | action of the mirror device of FIG. 5, (A) is a transparent state, (B) is a concave (convex) mirror state, (C) shows a plane mirror state. It is sectional drawing which shows the example of a change of the mirror device of FIG. It is a flowchart for demonstrating the manufacturing method of the mirror device of FIG.5 and FIG.8. It is sectional drawing which shows the 3rd example of the mirror device applied to the mirror apparatus for imaging units which concerns on this invention. It is an enlarged view of the micro prism of FIG. 10, (A) is a perspective sectional view, (B) is a top view. It is sectional drawing for demonstrating the effect | action of the mirror device of FIG. 10, Comprising: (A) is a transparent state, (B) is a non-specular reflection mirror state, (C) shows a regular reflection mirror state. It is a flowchart for demonstrating the manufacturing method of the mirror device of FIG. It is sectional drawing which shows the imaging device containing 1st Embodiment of the mirror apparatus for imaging units which concerns on this invention. It is sectional drawing for demonstrating operation | movement of the mirror apparatus for imaging units of FIG. 14 using the mirror device of FIG. It is a figure for demonstrating the image obtained by the operation | movement of (A) of FIG. It is a figure for demonstrating the image obtained by the operation | movement of (B) of FIG. It is a figure for demonstrating the image obtained by the operation | movement of (C) of FIG. It is a figure for demonstrating the image obtained by the operation | movement of (D) of FIG. It is a figure for demonstrating the image obtained by the operation | movement of (E) of FIG. It is sectional drawing for demonstrating operation | movement of the mirror apparatus for imaging units of FIG. 14 using the mirror device of FIG. It is a figure for demonstrating the image obtained by the operation | movement of (A) of FIG. It is a figure for demonstrating the image obtained by the operation | movement of (B) of FIG. It is a figure for demonstrating the image obtained by the operation | movement of (C) of FIG. It is a figure for demonstrating the image obtained by the operation | movement of (D) of FIG. It is a figure for demonstrating the image obtained by the operation | movement of (E) of FIG. It is sectional drawing for demonstrating operation | movement of the mirror apparatus for imaging units of FIG. 14 using the mirror device of FIG. The imaging device containing 2nd Embodiment of the mirror device for imaging units which concerns on this invention is shown, (A) is whole sectional drawing, (B) is a top view of the transparent electrode layer pattern of a mirror device. It is sectional drawing for demonstrating operation | movement of the mirror apparatus for imaging units of FIG. 28 using the mirror device of FIG. 1 divided into 4 parts. It is a figure for demonstrating the image obtained by the operation | movement of FIG. 5 shows the mirror device of FIG. 5 divided into four parts, (A) shows one transparent substrate side before bonding, (B) shows the other transparent substrate side before bonding, and (C) shows after bonding. It is sectional drawing for demonstrating the image obtained by the imaging unit of the imaging device of FIG. 28 using the mirror device of FIG. 31, (A) is the case where each area | region of a mirror device is a plane lens state, (B) is The case where each area | region of a mirror device is an expansion / contraction state is shown. 10 shows the mirror device of FIG. 10 divided into four, (A) shows one transparent substrate side before bonding, (B) shows the other transparent substrate side before bonding, and (C) shows after bonding. 1 shows the mirror device of FIG. 1 divided into 16 parts, (A) shows one transparent substrate side before bonding, (B) shows the other transparent substrate side before bonding, and (C) shows after bonding. FIG. 28B shows another example of the transparent electrode layer pattern, where (A) is one transparent substrate side before bonding, (B) is the other transparent substrate side before bonding, and (C) is It shows after pasting.

  1A and 1B show a first example of a mirror device applied to a mirror device for an imaging unit according to the present invention. FIG. 1A is a cross-sectional view and FIG. 1B is a top view of a transparent electrode layer pattern.

  In FIG. 1A, the mirror device M1 is a cellized electrodeposition type device, which is formed on parallel transparent substrates 1 and 2 made of glass or polycarbonate, and inner surfaces of the transparent substrates 1 and 2. Transparent electrode layers 3 and 4 made of indium tin oxide (ITO), a transparent seal portion 5, and an electrolytic solution 6 sealed between the transparent electrode layers 3 and 4 and sealed by the transparent seal portion 5. ing. As shown in FIG. 1B, voltages xi and yi are applied to the transparent electrode layers 3 and 4.

As shown in FIG. 2A, the transparent electrode layers 3 and 4 are transparent when no voltage is applied. On the other hand, as shown in FIG. 2 (B), when applying a DC bias voltage _{V d} of about 1.5~8V between the transparent electrode layer 3, 4, Ag layer by reduction to the transparent electrode layer 4 of the negative potential side It is formed on the surface and becomes a plane mirror state. That is, the mirror device M1 is a device that can be switched between a transparent state and a planar mirror state. In this case, the plane mirror state is generated when silver ions contained in the electrolytic solution 6 are converted into metallic silver and deposited (electrodeposition) near the transparent electrode layer 4 on the negative potential side. In order to return to the transparent state, a voltage is not applied, but when a DC reverse bias voltage, for example, -1 V is applied, the transparent state is quickly returned.

  For example, FIG. 3A shows the result of measuring the reflected light with a spectroscope after the measurement light by the halogen light source is incident on the mirror device M1 of FIG. 1 from the transparent substrate 1 opposite to the transparent electrode layer 4 on which Ag is deposited. Show. On the other hand, FIG. 3B shows the result of measuring the transmitted light with a spectroscope after the measurement light by the halogen light source is incident on the mirror substrate M1 of FIG. 1 from the transparent substrate 2 on the transparent electrode layer 4 side where Ag is deposited. . According to FIG. 3, in a state where no voltage is applied, a transparent state in which the reflectance R is low and the transmittance T is high is obtained. On the other hand, in a voltage application state of, for example, 2.5V, the planar mirror has a high reflectance R and a low transmittance T. It becomes a state.

  A method for manufacturing the mirror device M1 of FIG. 1 will be described with reference to the flowchart of FIG.

  First, in a transparent electrode layer forming step 401, transparent electrode layers 3 and 4 made of ITO are formed on the transparent substrates 1 and 2 by a magnetron sputtering method, a chemical vapor deposition (CVD) method, or a vapor deposition method. If necessary, the transparent electrode layers 3 and 4 are patterned by an etching method using a SUS mask or a photolithography / etching method.

Next, in a gap control agent spraying step 402, 1 to 3 pieces / mm ² of a gap control agent of 20 μm to several hundred μm, for example, 100 μm, is sprayed on one transparent substrate. Instead of the gap control agent, a protrusion such as a rib may be used. Further, in the case of a small cell, a film-like spacer may be provided on a seal portion described later.

  Next, in a seal pattern forming step 403, a seal pattern is formed on one transparent substrate. The seal pattern is made of transparent and non-light-scattering ultraviolet and thermosetting resin, photocurable resin, or thermosetting resin. In this case, a resin that can withstand the electrolytic solution is preferable.

  Next, in an electrolytic droplet dropping step 404, an electrolytic solution is dropped on the transparent substrate on which the seal pattern is formed by a liquid crystal dropping (ODF) method. In addition, the dripping method can use various printing methods including a dispenser and an inkjet.

As an electrolytic solution, an electrodeposition agent containing Ag such as 50 mM AgNO _{3 in} a solvent is added, a supporting electrolyte such as 250 mM LiBr is added, and a mediator such as 10 mM CuCl ₂ is added.

  In addition, a solvent will not be limited if it can hold | maintain an electrodeposition agent etc. stably. For example, polar solvents such as water and propylene carbonate, non-polar organic solvents, ionic liquids, ionic conductive polymers, polymer electrolytes, and the like. Specifically, propylene carbonate, dimethyl sulfoxide (DMSO), N, N-dimethylformamide, tetrahydrofuran, acetonitrile, polyvinyl sulfuric acid, polystyrene sulfonic acid, polyacrylic acid, or the like can be used.

The supporting electrolyte is not limited as long as it promotes the redox reaction of Ag of the electrodeposition agent. For example, lithium salts such as LiCl, LiBr, LiI, LiBF ₄ , LiClO ₄ , KCl, KBr, A potassium salt such as KI and a sodium salt such as NaCl, NaBr and NaI are preferred. The concentration of the supporting electrolyte is preferably, for example, 10 mM or more and 1 M or less, but is not limited thereto.

  Furthermore, the mediator is a material that performs oxidation-reduction with energy lower than that of Ag, and the oxidant of the mediator assists the decoloring reaction due to oxidation by transferring electrons from Ag at any time. The material of the mediator is not limited as long as it exhibits such a function, but a copper (Cu) ion salt is preferable. The concentration of the mediator is preferably 5 mM or more and 20 mM or less, but is not limited thereto. The concentration ratio of Cu ions to Ag ions is preferably 0.1 to 0.3, but is not limited thereto.

  When the electrolyte is gelled, a 10 wt% host polymer such as vinyl butyral (PVB) is added.

  Next, in the substrate bonding step 405, the other transparent substrate is bonded to one transparent substrate to which the electrolyte solution has been dropped in a vacuum, in the air, or in a nitrogen atmosphere.

Finally, in the seal pattern curing step 406, for example, ultraviolet rays having an energy of 6 J / cm ² are irradiated to cure the seal pattern, thereby forming the transparent seal portion 5. In this case, a mask made of SUS or the like is used so that only the seal pattern is irradiated with ultraviolet rays.

  FIG. 5 is a cross-sectional view showing a second example of a mirror device applied to the mirror device for an imaging unit according to the present invention. In the mirror device M2 of FIG. 5, a concentric microplanar lens 7 is provided on the transparent substrate 2 of the mirror device M1 of FIG.

  6A and 6B are enlarged views of the concentric microplanar lens 7 of FIG. 5, where FIG. 6A is a perspective sectional view and FIG. 6B is a top view. As shown in FIG. 6A, the cross-sectional shape is a single sawtooth shape toward the center, and as shown in FIG. 6B, it is concentric (or elliptical) in plan view. ing. The height of the prismatic cross section of the concentric microplanar lens 7 is several tens of μm. The concentric microplanar lens 7 does not necessarily have to be concentric.

As shown in FIG. 7A, the transparent electrode layers 3 and 4 are transparent when no voltage is applied. On the other hand, as shown in FIGS. 7B and 7C, when a DC bias voltage _Vd is applied between the transparent electrode layers 3 and 4, an Ag layer is formed on the surface of the negative electrode side transparent electrode layer by reduction. In the mirror state. In the case of FIG. 7B, an Ag layer is formed on the transparent electrode layer 4 on the negative potential side, and a concave mirror state as a magnifying mirror is obtained in a bottom view, while a convex mirror state is employed as a reduction mirror in a top view. It becomes. Further, in the case of FIG. 7C, an Ag layer is formed on the negative electrode side transparent electrode layer 3 to be in a plane mirror state. That is, the mirror device M2 is a switchable device in three states: a transparent state, a concave mirror state (or a convex mirror state), and a plane mirror state.

  Note that the concentric microplanar lens 7 of the mirror device M2 can be formed in a single sawtooth shape with the cross-sectional shape toward the periphery as shown in FIG. In this case, the Ag layer on the transparent electrode layer 4 is in a convex mirror state in the bottom view, and on the other hand in the concave mirror state in the top view.

The manufacturing method of the mirror device M2 of FIGS. 5 and 8 is shown in FIG. 9, and a concentric microplanar lens forming step 901 is added before the transparent electrode layer forming step 401 in the manufacturing method shown in FIG. In the concentric microplanar lens forming step 901, the concentric microplanar lens 7 is formed on the transparent substrate 2 . This will be described in detail below.

First, an ultraviolet curable resin is dropped on the transparent substrate 2 . Next, the back side of the transparent substrate 2 is reinforced with a thick quartz glass plate, pressed using a mold having a reversal pattern of the concentric microplanar lens 7, and left for 1 minute. Next, the ultraviolet curable resin is cured by irradiating the quartz glass plate with ultraviolet rays at 5 J / cm ² . Next, the mold and the quartz glass plate are removed, and the transparent substrate 2 on which the concentric microplanar lens 7 is formed is washed with a washing machine. The cleaning method is performed in the order of brush cleaning using an alkaline detergent, pure water cleaning, air blow, UV irradiation, and IR drying. However, the cleaning method is not limited to this. High pressure spray cleaning or plasma cleaning may be performed. Then, the process proceeds to the transparent electrode layer forming step 401.

  FIG. 10 is a sectional view showing a third example of a mirror device applied to the mirror device for an imaging unit according to the present invention. In the mirror device M3 of FIG. 10, the micro prism 8 is provided on the transparent substrate 2 of the mirror device M1 of FIG.

  FIGS. 11A and 11B are enlarged views of the microprism 8 of FIG. 10, in which FIG. 11A is a perspective sectional view, and FIG. 11B is a top view. As shown in FIG. 11A, the cross-sectional shape is a single sawtooth shape, and as shown in FIG. 11B, it is a line shape in plan view. The height of the prism-shaped cross section of the microprism 8 is several tens of μm.

As shown in FIG. 12A, the transparent electrode layers 3 and 4 are transparent when no voltage is applied. On the other hand, as shown in FIGS. 12B and 12C, when a DC bias voltage _Vd is applied between the transparent electrode layers 3 and 4, an Ag layer is formed on the surface by reduction of the transparent electrode layer on the negative potential side. In the mirror state. In the case of FIG. 12B, an Ag layer is formed on the transparent electrode layer 4 on the negative potential side, and when light is incident in the normal direction of the mirror device M3, the incident direction and the emission direction are different. It becomes a regular reflection mirror state. In the case of FIG. 12C, when an Ag layer is formed on the transparent electrode layer 3 on the negative potential side and light is incident in the normal direction of the mirror device M3, the incident direction and the emission direction are the same. It becomes a regular reflection mirror state. That is, the mirror device M3 is a switchable device in three states: a transparent state, a non-specular reflection mirror state, and a regular reflection mirror state.

The manufacturing method of the mirror device M3 of FIG. 10 is shown in FIG. 13, and a micro prism forming step 1301 is added before the transparent electrode layer forming step 401 in the manufacturing method shown in FIG. In this microprism formation step 1301, the microprism 8 is formed on the transparent substrate 2 . This will be described in detail below.

First, an ultraviolet curable resin is dropped on the transparent substrate 2 . Subsequently, the back side of the transparent substrate 2 is reinforced with a thick quartz glass plate, pressed using a mold having a reversal pattern of the microprisms 8 and left for 1 minute. Next, the ultraviolet curable resin is cured by irradiating the quartz glass plate with ultraviolet rays at 5 J / cm ² . Next, the mold and the quartz glass plate are removed, and the transparent substrate 1 on which the microprisms 8 are formed is washed with a washing machine. The cleaning method is performed in the order of brush cleaning using an alkaline detergent, pure water cleaning, air blow, UV irradiation, and IR drying. However, the cleaning method is not limited to this. High pressure spray cleaning or plasma cleaning may be performed. Then, the process proceeds to the transparent electrode layer forming step 401.

  FIG. 14 is a sectional view showing an imaging apparatus including the first embodiment of the mirror device for an imaging unit according to the present invention.

  In the imaging apparatus of FIG. 14, a mirror comprising mirror devices 121, 122, 123, and 124 that are inclined at 45 °, for example, in the photographing direction of the imaging unit 11 made of a charge storage element (CCD) or the like, and a mirror 125 that is always in a plane mirror state. A device 12 is arranged.

  The mirror devices 121, 122, 123, and 124 have the same cell structure as the mirror device M1 in FIG. 1, that is, the transparent substrates 1 and 2, the transparent electrode layers 3 and 4 patterned in a rectangular shape, and the transparent seal portion. 5 and the electrolyte solution 6, and is in one of two states, a transparent state and a plane mirror state. On the other hand, the mirror 125 is a plane mirror, and acts as an always-on mirror device M1.

  The imaging unit 11 and the mirror devices 121, 122, 123, 124 are controlled by the control unit 13. The control unit 13 is constituted by a microcomputer, for example. The control unit 13 applies voltages x1, x2, x3, x4 to the transparent electrode layer 3 of the mirror devices 121, 122, 123, 124, and applies voltages y1, y2, y3, y4 of the mirror devices 121, 122, 123, 124. Applied to the transparent electrode layer 4. That is, the control unit 13 statically drives the mirror devices 121, 122, 123, and 124.

  Light absorption plates 14 and 15 are arranged around the imaging unit 11 and on the opposite side of the mirror devices 121, 122, 123, and 124 and the opening side of the mirror 125 of the mirror device 12. The light absorption plates 14 and 15 are constituted by, for example, a ceiling, a wall, or the like at a set place. In this case, the mirror devices 121, 122, 123, and 124 and the mirror 125 are attached to the ceiling, wall, etc. at the same inclination angle. A transparent plate 16 is disposed in the opening of the mirror device 12. The transparent plate 16 may be provided with a lens cut that adjusts the visual field range to some extent. However, the transparent plate 16 may not exist.

  The operation of the imaging apparatus of FIG. 14 using the mirror device M1 of FIG. 1 will be described with reference to FIG.

First, at time t1 shown in FIG.
x1 = V _d , y1 = 0V
x2 = x3 = x4 = 0V (may be floating)
y2 = y3 = y4 = 0V (may be floating)
However, _{V d} is a positive drive voltage for example 1.5~8.0V
The mirror device 121 is turned on, while the mirror devices 122, 123, and 124 are kept off. That is, in the mirror device 121, a DC bias voltage V _d is applied between the transparent electrode layers 3 and 4, and an Ag film is formed on the transparent electrode layer 4 to be in a plane mirror state. Therefore, the light L1 is reflected by the Ag film on the transparent electrode layer 4 of the mirror device 121 in a plane mirror state and travels toward the imaging unit 11. As described above, the mirror device 121 is in a plane mirror state, but the mirror devices 122, 123, and 124 maintain a transparent state. In this case, the mirror 125 is in a plane mirror state, and the light L5 reflected by the mirror 125 is transmitted through the transparent mirror devices 124, 123, and 122, but is blocked by the mirror device 121 in the plane mirror state. It does not relate to the operation of. As a result, as shown in FIG. 16, the image incident on the mirror device 121 is directly captured by the imaging unit 11.

Next, at time t2 shown in FIG.
x2 = V _d , y2 = 0V
x1 = x3 = x4 = 0V (may be floating)
y1 = y3 = y4 = 0V (may be floating)
The mirror device 122 is turned on, while the mirror devices 121, 123, and 124 are kept off. That is, in the mirror device 122, an Ag film is formed on the transparent electrode layer 4 to be in a plane mirror state. Accordingly, the light L2 is reflected by the Ag film on the transparent electrode layer 4 of the mirror device 122 in the plane mirror state, passes through the mirror device 121 in the transparent state, and travels toward the imaging unit 11. As described above, the mirror device 122 is in a plane mirror state, but the mirror devices 121, 123, and 124 maintain a transparent state. In this case, the mirror 125 is also in the plane mirror state, and the light L5 reflected by the mirror 125 passes through the transparent mirror devices 124 and 123, but is blocked by the mirror device 122 in the plane mirror state. It doesn't matter. As a result, as shown in FIG. 17, the image incident on the mirror device 122 is directly captured by the imaging unit 11.

Next, at time t3 shown in FIG.
x3 = V _d , y3 = 0V
x1 = x2 = x4 = 0V (may be floating)
y1 = y2 = y4 = 0V (may be floating)
The mirror device 123 is turned on, while the mirror devices 121, 122, and 124 are kept off. That is, in the mirror device 123, an Ag film is formed on the transparent electrode layer 4 to be in a plane mirror state. Therefore, the light L3 is reflected by the Ag film on the transparent electrode layer 4 of the mirror device 123 in the plane mirror state, passes through the mirror devices 122 and 121 in the transparent state, and travels toward the imaging unit 11. As described above, the mirror device 123 is in a plane mirror state, but the mirror devices 121, 122, and 124 maintain a transparent state. Also in this case, the mirror 125 is in the plane mirror state, and the light L5 reflected by the mirror 125 is transmitted through the transparent mirror device 124, but is blocked by the mirror device 123 in the plane mirror state. It doesn't matter. As a result, as shown in FIG. 18, the image incident on the mirror device 123 is directly captured by the imaging unit 11.

Next, at time t4 shown in FIG.
x4 = V _d , y4 = 0V
x1 = x2 = x3 = 0V (may be floating)
y1 = y2 = y3 = 0V (may be floating)
The mirror device 124 is turned on, while the mirror devices 121, 122, and 123 are kept off. That is, in the mirror device 124, an Ag film is formed on the transparent electrode layer 4 to be in a plane mirror state. Accordingly, the light L4 is reflected by the Ag film on the transparent electrode layer 4 of the mirror device 124 in the plane mirror state, passes through the mirror devices 123, 122, and 121 in the transparent state and travels toward the imaging unit 11. As described above, the mirror device 124 is in a plane mirror state, but the mirror devices 121, 122, and 123 maintain a transparent state. In this case, the mirror 125 is also in the plane mirror state, and the light L5 reflected by the mirror 125 is blocked by the mirror device 124 in the plane mirror state, and thus is not related to the overall operation. As a result, as shown in FIG. 19, the image incident on the mirror device 124 is directly captured by the imaging unit 11.

Finally, at time t5 shown in FIG. 15E, the control unit 13
x1 = x2 = x3 = x4 = 0V (may be floating)
y1 = y2 = y3 = y4 = 0V (may be floating)
And all the mirror devices 121, 122, 123, and 124 are kept off. Therefore, the mirror devices 121, 122, 123, and 124 maintain a transparent state. In this case, the mirror 125 is in a plane mirror state, and the light L5 reflected by the mirror 125 passes through the transparent mirror devices 124, 123, 122, 121 and travels toward the imaging unit 11. As a result, as shown in FIG. 20, the image incident on the mirror 125 is directly captured by the imaging unit 11.

  The control unit 13 repeatedly executes the above-described operations at times t1, t2, t3, t4, and t5.

  The mirror devices 121, 122, 123, and 124 in FIG. 14 may have the same cell structure as the mirror device M2 in FIG. 5, that is, the transparent substrates 1 and 2 and the transparent electrode layer 3 patterned in a rectangular shape. 4, the transparent seal portion 5, the electrolytic solution 6, and the concentric microplanar lens 7, and can be in three states: a transparent state, a concave mirror state (or a convex mirror state), and a plane mirror state. In this case, only one of the concave mirror (enlargement mirror) state and the convex mirror (reduction mirror) state of one mirror device is possible. For example, the mirror devices 121 and 122 are in one of three states: a transparent state, a concave mirror (enlarged mirror) state, and a plane mirror state, and the mirror devices 123 and 124 are transparent, convex surface (reduced mirror) states, and flat surfaces. One of the three states of the mirror state.

  The operation of the imaging apparatus of FIG. 14 using the mirror device M2 of FIG. 5 will be described with reference to FIG.

First, at time t1 shown in FIG.
x1 = 0V, y1 = _{V d}
x2 = x3 = x4 = 0V (may be floating)
y2 = y3 = y4 = 0V (may be floating)
Then, the mirror device 121 is turned on, and in this case, a plane mirror state is set. On the other hand, the mirror devices 122, 123, and 124 are kept off. Therefore, the light L1 is reflected by the mirror device 121 in a plane mirror state and travels toward the imaging unit 11. As described above, the mirror device 121 is in a plane mirror state, but the mirror devices 122, 123, and 124 maintain a transparent state. In this case, the mirror 125 is in a plane mirror state, and the light L5 reflected by the mirror 125 is transmitted through the transparent mirror devices 124, 123, and 122, but is blocked by the mirror device 121 in the plane mirror state. It does not relate to the operation of. As a result, as shown in FIG. 22, the image incident on the mirror device 121 is directly captured by the imaging unit 11.

Next, at time t2 shown in FIG.
x2 = V _d , y2 = 0V
x1 = x3 = x4 = 0V (may be floating)
y1 = y3 = y4 = 0V (may be floating)
Then, the mirror device 122 is turned on, and in this case, the magnifying mirror state is set. On the other hand, the mirror devices 121, 123, and 124 are kept off. Therefore, the image of the light L2 is reflected by the mirror device 122 in the plane mirror state, passes through the mirror device 121 in the transparent state, and travels toward the imaging unit 11. As described above, the mirror device 122 enters the magnifying mirror state, but the mirror devices 121, 123, and 124 maintain the transparent state. In this case, the mirror 125 is also in a plane mirror state, and the light L5 reflected by the mirror 125 passes through the transparent mirror devices 124 and 123, but is blocked by the mirror device 122 in the magnifying mirror state, so that the entire operation is performed. It doesn't matter. As a result, as shown in FIG. 23, the image incident on the mirror device 122 is enlarged and picked up by the image pickup unit 11.

Next, at time t3 shown in FIG.
x3 = 0V, y3 = _{V d}
x1 = x2 = x4 = 0V (may be floating)
y1 = y2 = y4 = 0V (may be floating)
Then, the mirror device 123 is turned on, and in this case, the plane mirror state is set. On the other hand, the mirror devices 121, 122, and 124 are kept off. Accordingly, the light L3 is reflected by the mirror device 123 in the plane mirror state, passes through the transparent mirror devices 122 and 121, and travels toward the imaging unit 11. As described above, the mirror device 123 is in a plane mirror state, but the mirror devices 121, 122, and 124 maintain a transparent state. Also in this case, the mirror 125 is in the plane mirror state, and the light L5 reflected by the mirror 125 is transmitted through the transparent mirror device 124, but is blocked by the mirror device 123 in the plane mirror state. It doesn't matter. As a result, as shown in FIG. 24, the image incident on the mirror device 123 is picked up by the image pickup unit 11 as it is.

Next, at time t4 shown in FIG.
x3 = V _d , y3 = 0V
x1 = x2 = x4 = 0V (may be floating)
y1 = y2 = y4 = 0V (may be floating)
The mirror device 124 is turned on, and in this case, the reduced mirror state is set. On the other hand, the mirror devices 121, 122, and 123 are kept off. Accordingly, the light L4 is reflected by the mirror device 124 in the reduction mirror state, passes through the mirror devices 123, 122, 121 in the transparent state, and travels toward the imaging unit 11. As described above, the mirror device 124 is in the reduction mirror state, but the mirror devices 121, 122, and 123 maintain the transparent state. In this case, the mirror 125 is also in the plane mirror state, and the light L5 reflected by the mirror 125 is blocked by the mirror device 124 in the plane mirror state, and thus is not related to the overall operation. As a result, as shown in FIG. 25, the image incident on the mirror device 124 is reduced and picked up by the image pickup unit 11.

Finally, at time t5 shown in (E) of FIG.
x1 = x2 = x3 = x4 = 0V (may be floating)
y1 = y2 = y3 = y4 = 0V (may be floating)
And all the mirror devices 121, 122, 123, and 124 are kept off. Therefore, the mirror devices 121, 122, 123, and 124 maintain a transparent state. In this case, the mirror 125 is in a plane mirror state, and the light L5 reflected by the mirror 125 passes through the transparent mirror devices 124, 123, 122, 121 and travels toward the imaging unit 11. As a result, as shown in FIG. 26, the image incident on the mirror 125 is directly captured by the imaging unit 11.

  The control unit 13 repeatedly executes the above-described operations at times t1, t2, t3, t4, and t5.

  In the mirror device M2, as described with reference to FIG. 7, both a convex (concave) mirror state and a planar mirror state can be formed by applying a voltage. Therefore, the operation from time t6 to time t10 may be different from the operation from time t1 to time t5. For example, at time t6, the mirror device 121 is set in the magnifying mirror state, and the other mirror devices 122, 123, and 124 are kept off. At time t7, the mirror device 122 is set in a plane mirror state, and the other mirror devices 121, 123, and 124 are kept off. At time t8, the mirror device 123 is set in the reduction mirror state, and the other mirror devices 121, 122, and 124 are kept off. At time t9, the mirror device 124 is set to the plane mirror state, and the other mirror devices 121, 122, 123 are kept off. At time t10, all the mirror devices 121, 122, 123, and 124 are kept off, and an image reflected by the mirror 125 is captured. Therefore, in this case, the control unit 13 repeatedly executes the operations at times t1, t2, t3, t4, t5, t6, t7, t8, t9, and t10. Thus, in a series of operations, even in the same mirror device, it is possible to capture more various images by mirroring the opposing electrodes at different timings.

  The mirror devices 121, 122, 123, and 124 in FIG. 14 may have the same cell structure as the mirror device M3 in FIG. 10, that is, the transparent substrates 1 and 2 and the transparent electrode layer 3 patterned in a rectangular shape. 4, the transparent seal portion 5, the electrolytic solution 6, and the microprism 8, which are in one of three states: a transparent state, a non-specular reflection mirror state, and a regular reflection mirror state.

  With reference to FIG. 27, the operation of the imaging apparatus of FIG. 14 using the mirror device M3 of FIG. 10 will be described.

First, at time t1 shown in FIG.
x1 = V _d , y1 = 0V
x2 = x3 = x4 = 0V (may be floating)
y2 = y3 = y4 = 0V (may be floating)
The mirror device 121 is turned on, and in this case, the non-specular reflection mirror state is set. On the other hand, the mirror devices 122, 123, and 124 are kept off. Accordingly, the light L1 ′ that is perpendicularly incident on the mirror device 121 is reflected by the mirror device 121 in a non-specular reflection mirror state and travels toward the imaging unit 11. As described above, the mirror device 121 is in the non-specular reflection mirror state, but the mirror devices 122, 123, and 124 maintain the transparent state. In this case, the mirror 125 is in a plane mirror state, and the light L5 reflected by the mirror 125 passes through the transparent mirror devices 124, 123, and 122, but is blocked by the mirror device 121 in the non-specular reflection mirror state. , Not related to the overall operation. As a result, the image incident on the mirror device 121 is picked up by the image pickup unit 11 as it is.

Next, at time t2 shown in FIG.
x2 = V _d , y2 = 0V
x1 = x3 = x4 = 0V (may be floating)
y1 = y3 = y4 = 0V (may be floating)
The mirror device 122 is turned on, and in this case, the non-specular reflection mirror state is set. On the other hand, the mirror devices 121, 123, and 124 are kept off. Therefore, the image of the light L2 ′ that is perpendicularly incident on the mirror device 122 is reflected by the mirror device 122 in the non-specular reflection mirror state, passes through the mirror device 121 in the transparent state, and travels toward the imaging unit 11. As described above, the mirror device 122 is in the non-specular reflection mirror state, but the mirror devices 121, 123, and 124 maintain the transparent state. In this case, the mirror 125 is also in the plane mirror state, and the light L5 reflected by the mirror 125 passes through the transparent mirror devices 124 and 123, but is blocked by the mirror device 122 in the non-specular reflection mirror state. It does not relate to the operation of. As a result, the image incident on the mirror device 122 is picked up by the image pickup unit 11 as it is.

Next, at time t3 shown in FIG.
x3 = 0V, y3 = _{V d}
x1 = x2 = x4 = 0V (may be floating)
y1 = y2 = y4 = 0V (may be floating)
The mirror device 123 is turned on, and in this case, the specular reflection mirror state is set. On the other hand, the mirror devices 121, 122, and 124 are kept off. Therefore, the light L3 is reflected by the mirror device 123 in the regular reflection mirror state, passes through the transparent mirror devices 122 and 121, and travels toward the imaging unit 11. As described above, the mirror device 123 is in the regular reflection mirror state, but the mirror devices 121, 122, and 124 maintain the transparent state. Also in this case, the mirror 125 is in a plane mirror state, and the light L5 reflected by the mirror 125 is transmitted through the transparent mirror device 124, but is blocked by the mirror device 123 in the regular reflection mirror state. It doesn't matter. As a result, the image incident on the mirror device 123 is picked up by the image pickup unit 11 as it is.

Next, at time t4 shown in FIG.
x4 = 0V, y4 = _{V d}
x1 = x2 = x3 = 0V (may be floating)
y1 = y2 = y3 = 0V (may be floating)
The mirror device 124 is turned on, and in this case, the specular reflection mirror state is set. On the other hand, the mirror devices 121, 122, and 123 are kept off. Accordingly, the light L4 is reflected by the mirror device 124 in the regular reflection mirror state, passes through the transparent mirror devices 123, 122, 121, and travels toward the imaging unit 11. As described above, the mirror device 124 is in the regular reflection mirror state, but the mirror devices 121, 122, and 123 maintain the transparent state. In this case, the mirror 125 is also in the plane mirror state, and the light L5 reflected by the mirror 125 is blocked by the mirror device 124 in the plane mirror state, and thus is not related to the overall operation. As a result, the image incident on the mirror device 124 is picked up by the image pickup unit 11 as it is.

Finally, at time t5 shown in FIG. 27E, the control unit 13
x1 = x2 = x3 = x4 = 0V (may be floating)
y1 = y2 = y3 = y4 = 0V (may be floating)
And all the mirror devices 121, 122, 123, and 124 are kept off. Therefore, the mirror devices 121, 122, 123, and 124 maintain a transparent state. In this case, the mirror 125 is in a plane mirror state, and the light L5 reflected by the mirror 125 passes through the transparent mirror devices 124, 123, 122, 121 and travels toward the imaging unit 11. As a result, the image incident on the mirror 125 is directly captured by the imaging unit 11.

  The control unit 13 repeatedly executes the above-described operations at times t1, t2, t3, t4, and t5.

  According to the first embodiment described above, a plurality of target areas can be simultaneously imaged by simple control without using a special image processing apparatus. In addition, each mirror device 121, 122, 123, 124 and mirror 125 is thin and has no movable part, and thus can be miniaturized. Furthermore, since the imaging unit 11 does not need to be close to the mirror devices 121, 122, 123, 124, and the mirror 125 of the mirror device 12, it does not stand out from the person being monitored. In particular, if the imaging unit 11 is placed in a dark place, it is completely invisible to the monitored person, and is suitable for, for example, a shoplifting prevention surveillance camera and has a crime deterrent effect. The imaging device using the mirror device 12 of the present invention is also suitable in a medical field where a patient dislikes a monitoring camera.

  28A and 28B show an imaging apparatus including a second embodiment of a mirror device for an imaging unit according to the present invention. FIG. 28A is an overall sectional view, and FIG. 28B is a top view showing a transparent electrode layer pattern of the mirror device. is there.

  In FIG. 28A, the mirror devices 121 ', 122', 123 ', 124' of the mirror device 12 'are divided into 4-dot pixels. Therefore, as shown in FIG. 28B, each of the mirror devices 121 ′, 122 ′, 123 ′, and 124 ′ has two segment transparent electrode layers 3− instead of the transparent electrode layer 3 of FIG. 1 and 3-2, and two common transparent electrode layers 4-1 and 4-2 are provided instead of the transparent electrode layer 4 of FIG.

  The control unit 13 converts the segment voltages xi1, xi2 and the common voltages yi1, yi2 (i = 1, 2, 3, 4) into the segment transparent electrode layers 3-1, 3 of the mirror devices 121 ′, 122 ′, 123 ′, 124 ′. -2, applied to the common transparent electrode layers 4-1, 4-2.

  In FIG. 28, if xi1 = xi2 = xi and yi1 = yi2 = yi, that is, if the same voltage is applied to the pixels of the mirror devices 121 ′, 122 ′, 123 ′, and 124 ′, each mirror device Since the entire 121 ′, 122 ′, 123 ′, and 124 ′ are in a mirror state or a transparent state, the image pickup apparatus in FIG. 28 has one segment electrode and one common electrode, and is the same as the image pickup apparatus in FIG. Become.

  With reference to FIG. 29, the operation of the imaging apparatus of FIG. 28 using the mirror device M1 divided into four will be described.

The control unit 13 controls the mirror device 121 ′.
x11 = V _d , y11 = 0V
x12 and y12 are set in a floating state. As a result, the upper left quarter of the mirror device 121 ′ is turned on, and the rest is turned off. Accordingly, the upper left quarter of the mirror device 121 ′ is a plane mirror, and the remaining 3/4 is in a transparent state. Therefore, as shown in FIG. 30, the light L1 incident on the upper left quarter of the mirror device 121 ′ is reflected by the mirror device 121 ′ and travels toward the imaging unit 11. As a result, the image incident on the mirror device 121 ′ is picked up at the upper left quarter of the image pickup unit 11.

In addition, the control unit 13 controls the mirror device 122 ′.
x22 = V _d , y21 = 0V
x21 and y22 are set in a floating state. As a result, the upper right quarter of the mirror device 122 ′ is turned on, and the rest is turned off. Accordingly, the upper right quarter of the mirror device 122 ′ is a plane mirror, and the remaining 3/4 is in a transparent state. Therefore, as shown in FIG. 30, the light L2 that has entered the upper right quarter of the mirror device 122 ′ is reflected by the mirror device 122 ′, passes through the transparent portion of the mirror device 121 ′, and is then captured by the imaging unit 11. Head to. As a result, the image incident on the mirror device 122 ′ is picked up in the upper right quarter of the image pickup unit 11.

Furthermore, the control unit 13 performs the following operation on the mirror device 123 ′.
x31 = V _d , y32 = 0V
x32 and y31 are set in a floating state. As a result, the lower left quarter of the mirror device 123 ′ is turned on, and the rest are turned off. Accordingly, the lower left 1/4 of the mirror device 123 ′ is a plane mirror, and the remaining 3/4 is in a transparent state. Therefore, as shown in FIG. 30, the light L3 incident on the lower left quarter of the mirror device 123 ′ is reflected by the mirror device 123 ′ and passes through the transparent part of the mirror devices 122 ′ and 121 ′. Go to the imaging unit 11. As a result, the image incident on the mirror device 123 ′ is picked up at the lower left quarter of the image pickup unit 11.

Furthermore, the control unit 13 is connected to the mirror device 124 ′.
x42 = V _d , y42 = 0V
x41 and y41 are set in a floating state. As a result, the lower right quarter of the mirror device 124 ′ is turned on, and the rest are turned off. Accordingly, the lower right quarter of the mirror device 124 ′ is a plane mirror, and the remaining 3/4 is in a transparent state. Therefore, as shown in FIG. 30, the light L4 incident on the lower right quarter of the mirror device 124 ′ is reflected by the mirror device 124 ′, and the transparent portions of the mirror devices 123 ′, 122 ′, and 121 ′ are reflected. Pass through to the imaging unit 11. As a result, the image incident on the mirror device 124 ′ is captured in the lower right quarter of the imaging unit 11.

  In FIG. 30, the light L5 reflected by the mirror 125 is blocked by the plane mirrors of the mirror devices 121 ′, 122 ′, 123 ′, and 124 ′ that are turned on. . However, when a part of the light L5 reflected by the mirror 125, for example, the lower left quarter, is desired to be imaged by the imaging unit 11, the segment voltage x31 and the common voltage y32 are floated in the corresponding mirror device, for example, 123 ′. The entire device 123 ′ may be made transparent.

  The mirror devices 121 ′, 122 ′, 123 ′, and 124 ′ of FIG. 28 can also have the same cell structure as the mirror device M2 of FIG. 5, that is, the mirror devices 121 ′, 122 ′, 123 ′, and 124 can be formed. As shown in FIG. 31, the transparent substrates 1 and 2, the transparent electrode layers 3-1, 3-2, 4-1, and 4-2 patterned in a rectangular shape, the transparent seal portion 5, and the electrolyte 6 (Not shown) and four concentric microplanar lenses 7-1, 7-2, 7-3, 7-4, which are in three states of transparent state, concave mirror state (or convex mirror state), and plane mirror state It can be either. In FIG. 31, (A) shows the transparent substrate 1 side before bonding, (B) shows the transparent substrate 2 side before bonding, and (C) shows after bonding. In this case, each region of each concentric microplanar lens 7-1, 7-2, 7-3, 7-4 is either a concave mirror (enlarging mirror) state or a convex mirror (reducing mirror) state of one mirror device. Only one is possible. For example, the concentric microplanar lenses 7-1 and 7-3 are in three states of a transparent state, a concave mirror (magnifying mirror) state, and a plane mirror state, and the curvature of the concentric microplanar lens 7-1 is small, and the concentric microplanar lens is small. The curvature of 7-3 is large. The concentric microplanar lenses 7-2 and 7-4 are in three states of a transparent state, a convex mirror (reduction mirror) state, and a plane mirror state, and the curvature of the concentric microplanar lens 7-2 is large. The curvature of 7-4 is small.

  32A shows an imaging screen of the imaging unit 11 when each region of the mirror device in FIG. 31 is in a planar lens state, and FIG. 32B shows a concentric microplanar lens 7− of the mirror device in FIG. Imaging in each of the areas 1, 7-2, 7-3, and 7-4 in a magnifying mirror state with a high magnification, a reduction mirror state with a low reduction ratio, a magnifying mirror state with a low magnification, and a reduction mirror state with a high reduction ratio The imaging screen of the unit 11 is shown. In this way, four images of enlargement / reduction incident on one mirror device are simultaneously picked up by the image pickup unit 11.

  The mirror devices 121 ′, 122 ′, 123 ′, and 124 ′ of FIG. 28 can also have the same cell structure as the mirror device M3 of FIG. 10, that is, the mirror devices 121 ′, 122 ′, 123 ′, and 124, respectively. 33, as shown in FIG. 33, transparent substrates 1 and 2, transparent electrode layers 3-1, 3-2, 4-1, 4-2 patterned in a rectangular shape, transparent seal portion 5, electrolyte 6 (Not shown) and four micro prisms 8-1, 8-2, 8-3, and 8-4, and may be in one of three states: a transparent state, a non-specular reflection mirror state, and a regular reflection mirror state. it can. In this case, the microprisms 8-1, 8-2, 8-3, and 8-4 may have the same shape. However, as shown in FIG. 33, the microprisms 8-1, 8-2, 8 −3, 8-4, the slope of the cross-sectional shape of the single sawtooth is different, and / or the inclination of each microprism 8-1, 8-2, 8-3, 8-4 in a line view in plan view May be different.

  In the second embodiment described above, the mirror devices 121 ′, 122 ′, 123 ′, and 124 ′ of the mirror device 12 ′ are divided into 4 (= 2 × 2) dot pixels. It can also be done. For example, as shown in FIG. 34, it can be divided into 16 (= 4 × 4) dot pixels. In FIG. 34, (A) shows the transparent substrate 1 side before bonding, (B) shows the transparent substrate 2 side before bonding, and (C) shows after bonding. In FIG. 34, four segment transparent electrode layers 3-1, 3-2, 3-3, 3-4 and four common transparent electrode layers 4-1, 4-2, 4-3, 4-4 are provided. It is. In this case, as shown in FIG. 35, the number of the segment transparent electrode layers is increased to obtain eight segment transparent electrode layers 3-1, 3-2, 3-3, 3-4, 3-5, 3-6, 3 It is good also as -7 and 3-8. Moreover, you may apply a voltage to several segment transparent electrode layers and / or several common transparent electrode layers simultaneously.

  According to the above-described second embodiment, in addition to the effects of the above-described first embodiment, a plurality of enlargement / reduction imaging and imaging by the dot-divided mirror devices 121 ′, 122 ′, 123 ′, and 124 ′. A plurality of non-specular reflection and specular reflection imaging can be performed.

  In the first and second embodiments described above, the mirror devices 121, 122, 123, 124, 121 ′, 122 ′, 123 ′, 124 ′ are inclined at the same inclination angle with respect to the imaging unit 11. However, different inclination angles may be used. Further, although the number of mirror devices is four, other numbers may be used, and in particular, one may be used.

  The present invention can be applied to any modifications within the obvious scope of the above-described embodiments.

1,2. . . Transparent substrates 3, 4. . . 4. Transparent electrode layer . . Transparent seal part6. . . Electrolytes 7-1, 7-2, 7-3, 7-4. . . Concentric microplanar lens
8-1, 8-2, 8-3, 8-4. . . Microprism 11. . . Imaging units 12, 12 '. . . Mirror device 13. . . Control units 14, 15. . . Light absorbing plate 16. . . Transparent plates 121, 122, 123, 124, 121 ′, 122 ′, 123 ′, 124 ′. . . Mirror device 125. . . Mirrors M1, M2, M3. . . Mirror device

Claims (8)

A mirror device for an imaging unit,
Comprising at least one mirror device provided inclined with respect to the shooting direction of the imaging unit;
The mirror device is
First and second transparent substrates facing each other;
First and second transparent electrode layers provided inside each of the first and second transparent substrates;
An electrolyte containing an electrodeposition agent encapsulated between the first and second transparent electrode layers;
Comprising
The first transparent electrode layer includes a plurality of segment transparent electrode layers, the second transparent electrode layer includes a plurality of common transparent electrode layers, and the mirror device includes the segment transparent electrode layer and the common transparent electrode layer. A mirror device for an imaging unit divided into a plurality of dots. A mirror device for an imaging unit,
Comprising at least one mirror device provided inclined with respect to the shooting direction of the imaging unit;
The mirror device is
First and second transparent substrates facing each other;
First and second transparent electrode layers provided inside each of the first and second transparent substrates;
An electrolyte containing an electrodeposition agent encapsulated between the first and second transparent electrode layers;
A microplanar lens between the second transparent substrate and the second transparent electrode layer ;
An imaging unit mirror apparatus comprising: A mirror device for an imaging unit,
Comprising at least one mirror device provided inclined with respect to the shooting direction of the imaging unit;
The mirror device is
First and second transparent substrates facing each other;
First and second transparent electrode layers provided inside each of the first and second transparent substrates;
An electrolyte containing an electrodeposition agent encapsulated between the first and second transparent electrode layers;
A micro prism between the second transparent substrate and the second transparent electrode layer ;
An imaging unit mirror apparatus comprising: The mirror device further includes:
The mirror device for an imaging unit according to claim 1 , further comprising a minute planar lens provided for each of the dots between the second transparent substrate and the second transparent electrode layer. The mirror device further includes:
The imaging apparatus mirror device according to claim 1 , further comprising a minute prism provided for each of the dots between the second transparent substrate and the second transparent electrode layer. further,
The mirror device for an imaging unit according to claim 1 , further comprising a mirror that functions as a plane mirror provided on the opposite side of the mirror device from the imaging unit. The image pickup unit mirror device according to claim 1 , 2 or 3 ,
An imaging apparatus comprising: a control unit that controls the imaging unit while applying a DC bias voltage between the first and second transparent electrode layers of the mirror device to statically drive the mirror device. The imaging device mirror device according to claim 1 ;
A control unit for applying a segment voltage to at least one of the segment transparent electrode layers of the mirror device and applying a common voltage to at least one of the common transparent electrode layers for static driving, and for controlling the imaging unit; An imaging apparatus comprising: