JP6435545B2 - Individual piece manufacturing method - Google Patents

Description

  The present invention relates to an individual piece manufacturing method.

  A plate-like member such as a semiconductor wafer (hereinafter sometimes abbreviated as “wafer”) has a diameter of 300 mm so that a thickness of 200 mm is 725 μm, for example, according to SEMI (Semiconductor Equipment and Materials International) standards. The thing is specified to have a thickness of 775 μm. Since such a wafer is formed with a large number of electronic circuits such as ICs and LSIs (hereinafter sometimes abbreviated as circuits), it is ground to, for example, about 50 μm to form semiconductor chips (individual pieces). More than 90% of them will be thrown away.

  Patent Document 1 discloses a step of diffusing impurities on both sides of a semiconductor substrate (plate-like member) to form a diffusion region, a step of dividing the semiconductor substrate into two in the thickness direction, and a semiconductor substrate divided into two. And a step of polishing the opposite surface of the diffusion region to make a mirror surface. Then, each of the two semiconductor substrates divided into two pieces is separated into individual pieces in a dicing process, and is mounted on an object to be mounted such as a lead frame.

Japanese Patent Laid-Open No. 1-114044

However, the individual pieces formed by the conventional method of manufacturing the individual pieces must be individually laminated with an adhesive before being mounted on the mounted object, and the individual pieces are mounted on the mounted object. There exists a subject that the manufacturing process of the individual piece including a mounting process becomes complicated.
In addition, the individual pieces formed by the conventional method for manufacturing the individual pieces are individually mounted when a protective member such as a resin or an adhesive is laminated to protect the individual pieces after being mounted on the mounted object. Therefore, there is a problem that the manufacturing process of the individual pieces including the mounting step of mounting the individual pieces on the mounted object becomes complicated.

  An object of the present invention is to provide an individual piece manufacturing method capable of simplifying the manufacturing process of an individual piece.

In order to solve the above-mentioned object, a method for producing a single piece according to the present invention includes a plate-shaped member preparation step of preparing a plate-shaped member in which a through electrode is embedded, and a fixing member on at least one surface of the plate-shaped member. A laminating step for laminating, and a surface on which the fixing member is laminated by forming a cut along one or the other surface of the plate-like member from the side surface of the plate-like member on which the fixing member is laminated; A notch forming step for forming a thin sliced plate-like member having a penetrating electrode capable of contacting the mounted member on the opposite surface, and cutting the thin sliced plate-like member together with the fixed member, and the fixed member on one surface And a thin sliced plate member cutting step of forming a plurality of individual pieces having through electrodes that can be brought into contact with the mounted member on the opposite surface .

The individual piece manufacturing method of the present invention includes a plate-shaped member preparing step of preparing a plate-shaped member in which a through electrode is embedded, and at least one surface of the plate-shaped member is penetrated to the other surface. A groove forming step for forming a non-groove, a laminating step for laminating a fixing member on at least one surface of the plate-like member, and one or the other of the plate-like members from the side surface of the plate-like member on which the fixing member is laminated By forming a cut along the other surface, the fixing member is laminated on one surface, and a plurality of individual pieces having through electrodes that can contact the mounted member on the opposite surface are formed. It has the notch formation process and the fixing member cutting process which forms the several piece body with a fixing member by cut | disconnecting the said fixing member along the said groove | channel.

According to the present invention, since a plurality of individual pieces with a fixing member can be formed, when the fixing member functions as an adhesive, individual pieces are mounted in the previous stage of mounting the individual piece on the mounted object. It is not necessary to laminate an adhesive on the single body, and the manufacturing process of the single body including the mounting process of mounting the single body on the mounted object can be simplified.
In addition, since a plurality of individual pieces with a fixing member can be formed, when the fixing member functions as a protective member, the individual piece is protected after being mounted on the mounted object. It is no longer necessary to laminate protective members such as resin and adhesive for each individual piece, and the manufacturing process of the individual piece including the mounting step of mounting the individual piece on the mounted object can be simplified. it can.

Explanatory drawing of the process of the individual piece manufacturing method which concerns on 1st Embodiment. Explanatory drawing of the process of the individual piece manufacturing method which concerns on the said embodiment. Explanatory drawing of the process of the individual piece manufacturing method which concerns on the said embodiment. Explanatory drawing of the process of the individual piece manufacturing method which concerns on 2nd Embodiment. Explanatory drawing of the process of the individual piece manufacturing method which concerns on the said embodiment. Explanatory drawing of the process of the individual piece manufacturing method which concerns on the said embodiment. Explanatory drawing of the process of the individual piece manufacturing method of a modification.

(First embodiment)
For example, when a direction such as up, down, left, right, or front and back is shown without giving a reference figure in each embodiment, all of FIG. The direction from the top to the bottom is the direction parallel to the page, the front is the front direction orthogonal to the page, and the back is the back direction orthogonal to the page. And

  1 to 3, the method for manufacturing a single piece according to the first embodiment includes a plate-shaped member preparing step for preparing a wafer WF as a plate-shaped member, and a stacking step for stacking the fixing members 10 on both surfaces of the wafer WF. By forming the notch 11 along one or the other surface of the wafer WF from the side surface of the wafer WF on which the fixing member 10 is laminated, the sliced wafers WF1 and WF2 as the sliced plate-like members are formed from the wafer WF. A notch forming step to be formed, and the sliced wafers WF1 and WF2 are cut together with the fixing member 10 to form semiconductor chips (hereinafter sometimes abbreviated as chips) CP as a plurality of individual pieces with the fixing member 10. A thin-cut plate-like member cutting step.

  As shown in FIGS. 1A and 1B, the plate-shaped member preparing step prepares a disk-shaped wafer, and circuit forming means 20 as a modeled object forming means on both one surface and the other surface. A circuit CA as a large number of shaped objects is formed by (a shaped object forming step). On both surfaces of the wafer WF on which the circuit CA is formed, as shown in FIG. 1C, streets ST are formed between the circuits CA in a lattice pattern.

  As shown in FIG. 2A, the laminating step is a fixing member made of, for example, resin, adhesive, adhesive, rubber or the like on both surfaces of the wafer WF prepared in the plate-like member preparing step. 10 are stacked. The fixing member 10 may be laminated so that the fixing member 10 is not temporarily or permanently displaced with respect to the wafer WF, such as adhesion or welding.

  In the notch forming step, as shown in FIG. 2B, the notch 11 is formed on the wafer WF having the fixing member 10 laminated on both surfaces by a cutting means 30 such as a wire saw, a laser irradiation device, and a blade. Then, the wafer WF is divided into two within the thickness to form thinly cut wafers WF1 and WF2. Note that the thickness of the thinly cut wafers WF1 and WF2 can be adjusted by changing the wire diameter, laser width, and blade width of the cutting means 30. For example, if the cutting means 30 having a wire diameter of 675 μm, a laser width, and a blade width is used for a wafer WF having a thickness of 775 μm, thin wafers WF 1 and WF 2 having a thickness of 50 μm can be formed. In this case, the back grinding process is not necessary, and the manufacturing process of the individual pieces can be shortened. However, the thin wafers WF1 and WF2 may be more thinly ground in the back grinding process.

  As shown in FIG. 3A, the sliced plate member cutting process cuts each sliced wafer WF1 and WF2 together with the fixing member 10 along the street ST by a cutting means BL such as a cutting blade, a laser irradiation device, and pressurized water. To do. As a result, the thin wafers WF1 and WF2 are separated into a plurality of chips CP with the fixing member 10.

  Each chip CP is mounted on a mounted member 40 such as a lead frame or a substrate by bonding or bonding in a chip mounting process. That is, in the chip mounting step, as shown in FIG. 3B, the chip CP with the fixing member 10 is turned upside down and placed on the mounted member 40 through the fixing member 10. At this time, the circuit CA of the chip CP is arranged such that an electrode (not shown) of the circuit CA is in contact with the electrode 50 on the mounted member 40. In the case where the fixing member 10 is made of resin, rubber, or the like, the fixing member 10 may be heated by a heating means such as a heater or a heat pipe heating side, and the fixing member 10 may be an adhesive, an adhesive, or the like. In this case, the chip CP with the fixing member 10 may be pressed against the mounted member 40 by an appropriate pressing means, or may be mounted on the mounted member 40 by ultrasonic vibration or the like. That is, in the chip mounting process, an appropriate means may be used according to the nature, material, composition, configuration, etc. of the fixing member 10 and the chip CP may be mounted on the mounted member 40 via the fixing member 10.

  According to the first embodiment as described above, since a plurality of chips CP with the fixing member 10 can be formed, when the fixing member 10 functions as an adhesive, the chip CP is attached to the mounted object 40. It is not necessary to laminate an adhesive on each chip CP before mounting, and the manufacturing process of the chip CP including the mounting process for mounting the chip CP on the mounted object 40 can be simplified.

(Second Embodiment)
4 to 6, the individual piece manufacturing method according to the second embodiment includes a plate-shaped member preparation step of preparing a wafer WF as a plate-shaped member, and both the one surface and the other surface of the wafer WF. A groove forming step of forming a groove 13 that does not penetrate the opposite surface, a stacking step of stacking the fixing member 10 on both surfaces of the wafer WF, and the wafer from the side surface of the wafer WF on which the fixing member 10 is stacked By forming the notch 11 along one or the other surface of the WF, the notch forming step for forming the chips CP as a plurality of individual pieces from the wafer WF, and the fixing member 10 along the groove 13 It has the fixing member cutting process which forms several chip | tip CP with the fixing member 10 by cut | disconnecting.

  As shown in FIGS. 4A to 4C, the plate-shaped member preparation step prepares a disk-shaped wafer, and a circuit as a large number of shaped objects by circuit forming means 20 as a shaped article forming means on both surfaces thereof. The CA and street ST are formed, and the through electrode 12 is embedded.

  In the groove forming step, as shown in FIG. 5A, the other surface is penetrated along the street ST on one surface of the wafer WF by the groove forming means BL such as a cutting blade, a laser irradiation device, and etching. A groove 13 having no gap is formed. Thereafter, the groove forming means BL forms one surface along the street ST of the other surface of the wafer WF3 and the groove 13 that does not penetrate the groove 13 formed from the one surface. Thereby, the wafer WF in which the groove 13 is formed along the periphery of the circuit CA on both sides is formed.

  In the laminating step, as shown in FIG. 5B, the fixing member 10 made of, for example, resin, adhesive, adhesive, rubber or the like is laminated on both surfaces of the wafer WF on which the grooves 13 are formed. The stacking of the fixing member 10 may be performed so that the fixing member 10 does not shift temporarily or permanently with respect to the wafer WF as in the first embodiment.

  In the notch forming step, as shown in FIG. 6A, the notch 11 is formed by the cutting means 30 on the wafer WF having the fixing member 10 laminated on both surfaces, and the wafer WF is divided into two within the thickness. Thus, a plurality of chips CP are formed. As in the first embodiment, the thickness of the chip CP after cutting can be adjusted by changing the wire diameter, laser width, and blade width of the cutting means 30, and each chip CP can be adjusted in the back surface grinding step. You may grind thinner.

  In the fixing member cutting step, as shown in FIG. 6B, when the fixing member 10 is cut along the streets ST by the cutting means BL, a plurality of chips CP with the fixing member 10 are formed.

  Each chip CP is mounted on the mounted member 40 by a chip mounting process. That is, in the chip mounting step, as shown in FIG. 6C, an adhesive member AD such as an adhesive or a resin is laminated on the surface formed by the cuts 11 in the chip CP with the fixing member 10. Next, the chip CP with the fixing member 10 is placed on the mounted member 40 via the adhesive member AD. At this time, the through electrode 12 of the chip CP is disposed so as to contact the electrode 50 on the mounted member 40. In the chip mounting step, the chip CP with the fixing member 10 can be mounted on the mounted member 40 by the same heating means, pressing means, ultrasonic vibration and the like as in the first embodiment.

  According to the second embodiment as described above, a plurality of chips CP with the fixing member 10 can be formed. Therefore, when the fixing member 10 functions as a protection member, the chip CP is attached to the mounted object 40. After mounting, there is no need to stack a protective member such as a resin or adhesive for protecting the chip CP on each chip CP, and the chip CP manufacturing process including the mounting process for mounting the chip CP on the mounted object Can be simplified.

  The means and steps in the present invention are not limited in any way as long as the operations, functions, or steps described for these means and steps can be performed. The process is not limited at all. For example, the laminating process is not limited as long as it is within the range in view of the technical common sense at the beginning of the application as long as the fixing member can be laminated on at least one surface of the plate member. The description of the means and process is omitted).

In the plate-like member preparation step, a number of circuits CA may be formed by the circuit forming means 20 on either one or the other surface. In this case, in the first embodiment, the fixing member 10 is stacked only on the surface on which the circuit CA is formed in one or the other surface in the stacking step, and the wafer WF is divided into two in the notch forming step. Only the sliced wafer on the side where 10 is laminated is mounted on the mounted member 40 through the sliced plate member cutting process and the chip mounting process. On the other hand, the thin sliced wafer on the side where the circuit CA is not formed is formed again in the plate-like member preparation process, and the fixing member 10 is laminated on the circuit in the lamination process. Then, it is mounted on the mounted member 40 through a sliced plate member cutting process and a chip mounting process.
In the plate-like member preparation step, when a large number of circuits CA are formed on either one or the other surface by the circuit forming means 20, in the second embodiment, one of the other surfaces in the groove forming step and the laminating step. The groove 13 is formed only on the surface on which the circuit CA is formed, the fixing member 10 is stacked, the wafer WF is divided into two in the incision forming process, and only the chip CP on the side where the fixing member 10 is stacked is cut. It mounts in the to-be-mounted member 40 through a process and a chip | tip mounting process. On the other hand, the wafer on the side where the circuit CA formed in the notch forming process is not formed becomes a thin-cut wafer, and a large number of circuits CA are formed again in the plate member preparing process, and the fixing member 10 is formed on the circuit in the laminating process. Are stacked, and then mounted on the mounted member 40 through a sliced plate member cutting process and a chip mounting process.
In the plate-like member preparation step, a wafer WF in which the circuit CA and the street ST are formed in advance on at least one surface may be prepared. In this case, the formation object forming step by the circuit forming unit is unnecessary.
The wafer WF may have any thickness such as 725 μm and 625 μm, and may have any diameter such as 300 mm and 450 mm.
Examples of the wafer WF include a silicon semiconductor wafer, a SiC (silicon carbide) wafer, a sapphire wafer, and a compound semiconductor wafer. Examples of the compound semiconductor wafer include a GaP (gallium phosphide) wafer, a GaA (gallium arsenide) wafer, an InP (indium gallium phosphide) wafer, and a GaN (gallium nitride) wafer.
The shape of the wafer WF may be any shape such as a circle, a D shape, an ellipse, a rectangle, and other polygons.
The circuit formed on the wafer WF may have a different size and pattern on one surface and the other surface.
The wafer WF may have a portion showing a crystal orientation such as a V notch and an orientation flat.
In addition to the wafer WF, the plate-like member may be any form of member or article, such as a circuit board, a base board, a lead frame, a glass plate, a steel plate, ceramics, a wooden plate, or a resin plate, and is not limited at all. is not. Therefore, the individual piece may be cut from any member or article in any form, and is not limited at all.
The modeled object is not limited to a circuit pattern CA, a predetermined pattern, a picture, a pattern, a character, a number, a three-dimensional diagram, a concavo-convex pattern, or a combination thereof. There is no limitation as long as it can be formed.

  In the stacking step, the fixing member 10 may be stacked on the entire wafer WF as shown in FIG.

In the notch forming process and the cutting means 30, the wire diameter, laser width, and blade width may be other than 675 μm. For example, for a wafer WF having a thickness of 625 μm, the wire diameter and laser width are 565 μm. If a cutting means having a blade width is used, it is possible to form thin cut wafers WF1, WF2 and chips CP each having a thickness of 30 μm.
The thickness of the thinly cut wafers WF1, WF2 or chip CP after the cut forming process or the back grinding process may be any thickness such as 20 μm, 30 μm, 60 μm, 100 μm, or the like.
In the incision forming step, the cutting means 30 may divide the wafer WF into three or more within the thickness, or two or more cutting means 30 may be used side by side.

  In the sliced plate member cutting step, a weakly modified layer along the street ST is formed on the sliced wafer with a laser or the like, and the plurality of chips CP with the fixing members 10 are formed by pulling or bending the sliced wafer. May be. In forming the modified layer, a weakening member such as a chemical or a chemical substance that can weaken the wafer WF may be used.

The depth of the groove 13 can be arbitrarily determined.
Instead of the groove forming step, a modified layer forming step of forming a fragile modified layer along the street ST with a laser or the like may be used. The modified layer formed in such a modified layer forming step is formed from both surfaces of one surface and the other surface and may be connected to each other or may not be connected.
In the groove forming step, a groove 13 having a depth that does not interfere with the notch 11, that is, a groove 13 having a depth that the notch 11 does not cross, is formed, and the fixing member 10 is pulled after the notch forming step, It may be ground or divided into a plurality of chips CP.

  In the fixing member cutting step, a fragile modified layer along the street ST is formed on the fixing member 10 with a laser or the like, and the plurality of chips CP with the fixing member 10 are formed by pulling or bending the fixing member 10. Also good.

10 fixing member 11 notch 13 groove WF semiconductor wafer (plate-like member)
WF1, WF2 Thin sliced semiconductor wafer (thin sliced plate member)
CP semiconductor chip (single piece)

Claims (2)

A plate-shaped member preparation step of preparing a plate-shaped member in which the through electrode is embedded ;
A laminating step of laminating a fixing member on at least one surface of the plate-like member;
By forming a notch along one or the other surface of the plate member from the side surface of the plate member on which the fixing member is stacked, the surface opposite to the surface on which the fixing member is stacked is covered. A notch forming step of forming a thin sliced plate-like member having a penetrating electrode capable of contacting the mounting member ;
The sliced plate-like member is cut together with the fixing member, and the sliced member is formed with a plurality of individual pieces each having a through electrode that can be abutted against the mounted member on the opposite surface with the fixing member laminated on one surface. It has a plate-shaped member cutting process, The individual piece manufacturing method characterized by the above-mentioned. A plate-shaped member preparation step of preparing a plate-shaped member in which the through electrode is embedded ;
A groove forming step of forming a groove not penetrating the other surface on at least one surface of the plate-like member;
A laminating step of laminating a fixing member on at least one surface of the plate-like member;
By forming a cut along one or the other surface of the plate member from the side surface of the plate member on which the fixing member is stacked, the fixing member is stacked on one surface and on the opposite surface A notch forming step of forming a plurality of individual pieces having penetrating electrodes capable of coming into contact with the mounted member ;
A method for producing an individual piece, comprising: a fixing member cutting step for forming a plurality of individual pieces with a fixing member by cutting the fixing member along the groove.

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