JP6444273B2 - Large format substrate and manufacturing method thereof - Google Patents

Description

  The present invention relates to a large-sized substrate from which a large number of circuit boards can be obtained when divided and a method for manufacturing the same.

  In an electronic device, a small circuit module specialized for one function (hereinafter referred to as a light emitting module specialized for a light emitting function among the circuit modules) may be connected around a large substrate. Since the circuit board included in this light emitting module is small, workability is poor when individual electronic components are mounted. Therefore, there are cases where electronic components are mounted on a large board that can be divided to obtain a large number of circuit boards, and then the large board is divided, and a large number of light emitting modules including the circuit boards are manufactured at the same time.

  An example of such a manufacturing method is shown in Patent Document 1. In the manufacturing method disclosed in Patent Document 1, a semiconductor light emitting element (electronic component) is mounted on a connection wiring board (large format board) having a long hole along an outline line of the wiring board (circuit board), and then gold The circuit board is punched by punching with a mold.

JP 2009-152331 A (FIGS. 1 to 3)

  A light emitting module including the above circuit board is often used by being fitted into a housing or chassis of an electronic device. This severely limits the outer tolerance of the circuit board. However, even if the accuracy of the long hole processing is high, in a manufacturing method in which a circuit board is punched out from a large-sized substrate, positional displacement and burrs are caused by the punch. In other words, a circuit board divided by a punch or the like may not satisfy the outer tolerance regardless of whether or not components are mounted on the circuit board.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a large-sized board having a structure in which the circuit board can easily satisfy the external tolerance when divided.

  Another object of the present invention is to provide a method for manufacturing a large-sized board having a structure in which the circuit board can easily satisfy the external tolerance when divided.

In order to achieve the above object, a large-sized substrate of the present invention includes a region for forming a circuit board and other regions, and a large-sized substrate from which a large number of the circuit substrates can be obtained when divided, and the region for forming the circuit substrate and the other a connecting portion for connecting the regions, adjacent to the connecting portion and a step portion provided in the region for forming the circuit board, the thickness of the connecting portion than a thickness of the other region small, the width of the step portion in a direction towards the region for forming the circuit board from the connecting part, the rather less than the thickness of the other regions, both end portions adjacent to the stepped portion in a direction perpendicular to said direction Is thicker than the thickness of the stepped portion .

The large-sized substrate of the present invention includes a step portion in a region where a circuit substrate is formed. This step portion is adjacent to a connection portion that connects the region for forming the circuit board and the other region, and is formed at the same time when the connection portion is thinly processed. When this connection part is thinned, when a large substrate is divided to obtain a circuit board, laser processing can be easily applied to cut the connection part. Further, by providing a stepped portion in the region where the circuit board is formed and thinning the periphery of the portion to be laser processed, high cutting quality and high dimensional accuracy are ensured during cutting. At this time, the width of the stepped portion in the direction from the connecting portion to the region where the circuit board is formed is determined by the accuracy of laser processing. That is, this width can be a small value based on the fact that the connecting portion and the stepped portion are thin, and may be smaller than the thickness of the other area of the large substrate that is not processed to be thinned.

There are two step portions , and the step portions may be arranged opposite to each other across an area for forming the circuit board.

  There may be a curved portion on the side surface of the region where the circuit board is formed.

In order to achieve the above object, a method for manufacturing a large-sized board according to the present invention includes a region for forming a circuit board and other regions, and a method for manufacturing a large-sized board in which a large number of the circuit boards are obtained when divided. and forming to length holes slot step along a portion of the outer shape of a region, the smaller the thickness of the connecting portion connecting the circuit region to form a substrate and said other region, further to the connection portion A stepped portion is formed in a region where the circuit board is adjacently formed, and the width of the stepped portion in the direction from the connecting portion toward the region where the circuit board is formed is smaller than the thickness of the other region, with respect to the direction. A connecting portion and a step portion forming step are provided, wherein the thickness of both end portions adjacent to the step portion in the vertical direction is larger than the thickness of the step portion.

  In the method for manufacturing a large board according to the present invention, an elongated hole is formed along a part of the outer shape of the circuit board in a region for forming the circuit board included in the large board. In parallel with this, the connecting portion that connects the region where the circuit board is formed and other regions is made thin. Further, a step portion is formed in a portion adjacent to the connection portion in the region where the circuit board is formed. Since the large-sized substrate prepared in this manner has a thin connection portion, laser processing can be easily applied to cut the connection portion when the large-sized substrate is divided to obtain a circuit board. Further, by providing a step in the region where the circuit board is formed and thinning the periphery of the portion to be laser processed, high cutting quality and high dimensional accuracy can be ensured during cutting.

  You may have the electronic component mounting process which mounts an electronic component in the area | region which forms the said circuit board after the said long hole process and the said connection part and level | step-difference part formation process.

  As described above, the large substrate and the manufacturing method thereof according to the present invention can improve the cutting quality and the dimensional accuracy, so that the outer tolerance of the circuit substrate divided from the large substrate is easily satisfied.

The light emitting module (circuit board) obtained by dividing | segmenting from the large format circuit board of embodiment of this invention is shown, (a) is a top view, (b) is a bottom view. It is a perspective view for demonstrating the relationship between the light emitting module (circuit board) shown in FIG. 1, and a large sized board. It is a top view for demonstrating the relationship between the large format board | substrate shown in FIG. 2, and a circuit board. It is sectional drawing for demonstrating the relationship between the large format board | substrate shown in FIG. 3, and a circuit board.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to FIGS. In the description of the drawings, the same or equivalent elements will be denoted by the same reference numerals, and redundant description will be omitted. For the sake of explanation, the scale of the members is changed as appropriate. () The invention specific matters are shown.

FIG. 1 shows a light emitting module 10 using a circuit board 11 obtained by dividing a large substrate 23 (see FIG. 2) according to an embodiment of the present invention. 1A is a plan view and FIG. 1B is a bottom view. The light emitting module 10 is a light source for flash, and two LEDs 16 are mounted on the upper surface of the circuit board 11, and an EEPROM 18 is mounted on the lower surface. Further, the lower surface electrode 17 is observed on the lower surface of the circuit board 11. The circuit board 11 has a substantially rectangular planar shape with corners notched, and stepped portions 12 and 13 and through holes 14 and 15 are provided at two locations in the upper and lower portions of FIG. The step portions 12 and 13 have an extremely narrow width in the vertical direction (short direction) compared to the width in the horizontal direction.

  The two LEDs 16 have different emission colors. The EEPROM 18 stores data relating to the light emission characteristics of the LED 16. Based on this data, a control device provided on the main body side of the camera or the like sets optimum conditions (brightness and color development) according to the surrounding conditions, and flashes the light emitting module 10.

  FIG. 2 is a perspective view for explaining the relationship between the large format board 20 and the light emitting module 10 including the circuit board 11. The large substrate 20 has a region 11 where a plurality of circuit boards are formed. The region 11 for forming the circuit board is basically the same as the circuit board 11 shown in FIG. In the following description, the region 11 for forming the circuit board is simply referred to as the circuit board 11.

  The large substrate 20 includes a frame 23 (another region) surrounding each circuit board 11, connection portions 21 and 22 that connect each circuit substrate 11 and the frame 23, and step portions 12 and 13 that connect the connection portions 21 and 22. There is. The connection portions 21 and 22 and the step portions 12 and 13 are arranged to face each other with the circuit board 11 interposed therebetween. The outer shape of the circuit board 11 is defined by elongated holes 24 and 25 except for the step portions 12 and 13.

  FIG. 3 is a plan view of the large-sized substrate 20 in which the peripheral portion of the connecting portion 21 is enlarged in order to explain the relationship between the large-sized substrate 20 and the circuit board 11. In the large-sized substrate 20, the connection portion 21 and the step portion 12 are integrally formed. In this region, since the long holes 24 and 25 formed by the router are inserted, the planar shape is such that both ends of the ellipse are cut out into a semicircle.

  As described above, the side surfaces of the large substrate 20 other than the connection portions 21 and 22 of the circuit board 11 are processed by the router (the long holes 24 and 25). On the other hand, when the large board 20 is divided to obtain the circuit board 11 as will be described later, the connecting portions 21 and 22 are cut by laser processing along the outer shape of the circuit board 11. As shown in FIG. 1, the circuit board 11 has an oblique cutout at one corner, and the other corner is chamfered. That is, since the router can easily form the curved long holes 24 and 25, the circuit board 11 has three corners processed in a curved manner.

  FIG. 4 is a cross-sectional view taken along the line AA ′ of FIG. 3 for explaining the relationship between the large-sized board 20 and the circuit board 11. In FIG. 4, the long hole 25 and the through hole 14 are observed. The connecting portion 21 is thinner than other portions. The bottom surface 12 c of the step portion 12 is flush with the top surface of the connection portion 21. In FIG. 4, the distance between the right side surface 12 a of the long hole 25 and the upper side surface 12 b of the step portion 12 corresponds to the width of the step portion 12 in the short direction (the direction from the connection portion toward the region where the circuit board is formed). To do. The position of the right side surface 12 a of the long hole 25 is the outer shape of the circuit board 11 in the step portion 12. Note that the thickness of the other regions (the frame 23 and the like) of the large substrate 20 is 1.15 mm, whereas the thickness of the connection portions 21 and 22 is 0.40 mm.

As shown in FIGS. 2 to 4, the circuit board 11 is provided with stepped portions 12 and 13 in the vicinity of the portions (connecting portions 21 and 22) connected to the large-sized substrate 20. As described above, the stepped portions 12 and 13 and the connecting portions 21 and 22 were thinner than other portions of the large substrate 20. That is, the large-sized substrate 20 can be used with laser processing that is usually applicable only to a thin substrate by providing a thin portion.

  If you try to cut the thick part with a laser, you have to increase the laser dose. In this case, the cut surface is carbonized or the cutting accuracy is lowered. On the other hand, the large substrate 20 with the thinned connection portions 21 and 22 can be cut with a relatively weak laser to divide the circuit substrate 11. As a result, high dimensional accuracy is ensured with improvement in cutting quality.

  A method for manufacturing the circuit board 11 will be described with reference to FIGS. First, long holes 24 and 25 are formed in the large-sized board 20 along the outer shape of the circuit board 11 to be divided except for the connecting portions 21 and 22 (long hole process). In parallel with this, the connecting portions 21 and 22 and the stepped portions 12 and 13 are made thinner than other portions by the router (connecting portion and stepped portion forming step). In addition, the order of formation of the long holes 24 and 25 and formation of the connection parts 21 and 22 and the level | step-difference parts 12 and 13 is not ask | required.

  Next, electronic components such as the LED 16 and the EEPROM 18 are mounted on the large substrate 20 (electronic component mounting step). The electronic component may be mounted after the circuit board 11 is separated. However, since the circuit board 11 is small and difficult to handle, it is easier to manufacture if the electronic component is mounted in the state of the large-sized board 20.

  The connection portions 21 and 22 are cut by a laser with respect to the large-sized substrate 20 thus prepared, and the circuit substrate 11 is divided. As shown in FIG. 4, the connection portions 21 and 22 are cut by laser by irradiating a laser 41 from the lower surface side of the large-sized substrate 20. Irradiation with the laser 41 may be performed from the upper surface side of the large-sized substrate 20, but if a part of the laser spot 42 hits a thick portion at the longitudinal ends of the stepped portions 12 and 13, there is a problem in cutting. May occur. Therefore, it is preferable to irradiate the laser 41 from the lower surface side of the large-sized substrate 20 in which the connection portions 12 and 13 are flush with other portions.

  Further, as shown in FIG. 4, when the connection portions 21 and 22 are cut by the laser, a part of the spot 42 of the laser 41 is applied to the stepped portion 13. This is because the light emitting module 10 including the circuit board 11 is used by being fitted in a casing such as a case, and therefore, exceeding the reference value for the outer shape of the circuit board 11 is strictly limited. That is, since the step portions 12 and 13 are also thin like the connection portions 21 and 22, it is possible to keep the circuit board 11 within the range of the external tolerance while maintaining high cutting quality and cutting accuracy associated with laser processing.

  Incidentally, when the connection portions 21 and 22 were not thinned (when the thickness was 1.15 mm) and were cut with a laser, the number of irradiations was 7 times or more. On the other hand, the number of times of irradiation of the laser 41 can be reduced to 3 to 4 in the connection portions 21 and 22 which are thin (when the thickness is 0.40 mm). The single irradiation intensity of the laser 41 is the same in both cases. That is, the reduction in the number of times of irradiation (total irradiation intensity) leads to obtaining a good cut surface by laser processing and satisfying the outer tolerance of the circuit board 11 by reducing the damage.

10: Light emitting module,
11 ... Circuit board (area for forming the circuit board),
12, 13 ... stepped part,
14, 15 ... through holes,
16 ... LED,
17 ... bottom electrode,
18… EEPROM,
20 ... Large format board,
21, 22 ... connection part,
23 ... frame (other area),
24, 25 ... oblong holes,
41 ... Laser,
42 ... Spot.

Claims (5)

In a large-sized substrate that includes a region for forming a circuit board and other regions, and a large number of the circuit boards can be obtained when divided,
A connecting portion for connecting the region for forming the circuit board and the other region;
A step portion provided in a region where the circuit board is formed adjacent to the connection portion;
The thickness of the connecting portion is less than the thickness of the other regions,
Width of the step portion in a direction towards the region for forming the circuit board from the connecting portion, rather smaller than the thickness of the other regions,
A large-sized substrate , wherein a thickness of both end portions adjacent to the step portion in a direction perpendicular to the direction is larger than a thickness of the step portion . The large-sized board according to claim 1, wherein the stepped portions are provided in two locations and are arranged to face each other across a region where the circuit board is formed. The large-sized board according to claim 1, wherein a curved portion is provided on a side surface of a region where the circuit board is formed. In a method for manufacturing a large-sized substrate including a region for forming a circuit board and other regions, and obtaining a large number of the circuit boards when divided,
An elongate hole step of making an elongate hole along a part of the outer shape of the region forming the circuit board;
The smaller the thickness of the connecting portion connecting the circuit region to form a substrate and said other region, further the step portion is formed in the region for forming the circuit substrate adjacent to the connecting portion, from the connecting portion The width of the stepped portion in the direction toward the region where the circuit board is formed is smaller than the thickness of the other region, and the thickness of both end portions adjacent to the stepped portion in the direction perpendicular to the direction is the height of the stepped portion. A method for manufacturing a large-sized substrate, comprising: a connecting portion having a thickness greater than the thickness; and a step portion forming step. 5. The large-sized board manufacturing method according to claim 4, further comprising an electronic component mounting step of mounting an electronic component in a region where the circuit board is formed after the long hole step and the connection portion and stepped portion forming step. Method.

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