JP6465768B2 - Solder jet measurement method and solder jet measurement jig - Google Patents

Description

  The present invention relates to a solder jet measurement method and a solder jet measurement jig, and more particularly to a solder jet measurement method and a measurement jig in a flow soldering apparatus.

  2. Description of the Related Art A flow soldering apparatus that solders electronic circuit components and structural components to a printed circuit board by bringing molten solder into contact with the surface of the printed circuit board is widely used. Flow soldering is mainly used to connect a component for inserting a lead into a printed circuit board with a component at a portion where the lead is inserted. The flow soldering device causes the printed circuit board to be soldered to flow directly above the solder bath containing the molten solder, and generates a solder jet in which the molten solder liquid level rises from the solder bath. An apparatus for supplying molten solder to the surface of a substrate.

  In order to improve the flow soldering technology, it is necessary to appropriately manage the height of the solder jet, and in order to confirm whether the solder jet can be in good contact with the printed circuit board, the shape of the solder jet must be adjusted. It is necessary to confirm. For this reason, as a means for confirming the shape of the solder jet, for example, the jigs disclosed in Japanese Utility Model Laid-Open No. 63-180157 (Patent Document 1) and Japanese Utility Model Laid-Open No. 2-59862 (Patent Document 2) are disclosed. The contact shape of the solder jet to the board can be confirmed using the jig. Further, for example, a jig disclosed in JP-A-8-70175 (Patent Document 3) measures the height of solder jetted from an opening using a scale.

Japanese Utility Model Publication No. 63-180157 Japanese Utility Model Publication 2-59862 JP-A-8-70175

  However, when the jig disclosed in each of the above patent documents is used, it is necessary to measure the width or height of the solder jet when the solder jet is generated. In each of the above-mentioned patent documents, after the solder jet is generated, a trace corresponding to the width or height of the generated solder jet does not remain, but it is necessary to make an observation on the spot at the moment when the solder jet is generated. For this reason, it is difficult to accurately measure the width or height of the solder jet, which may cause a measurement error by the operator.

  The present invention has been made in view of the above-described problems, and its purpose is to provide a solder that can accurately and easily measure the height and shape of a molten solder jet so that no error occurs between workers. To provide a jet measurement method and a solder jet measurement jig.

  The solder jet measurement method of the present invention includes the following steps. The jig that holds the thermoplastic sheet along the vertical direction is set in the area directly above the solder jet nozzle in the transfer conveyor that can be transferred directly above the solder jet nozzle for soldering the object. The In a state where the jig is set on the solder jet nozzle, a solder jet is generated from the solder jet nozzle to generate a waveform of the solder jet, and the waveform is transferred to the thermoplastic sheet. The waveform transferred to the thermoplastic sheet is measured.

  The solder jet measurement jig of the present invention includes a housing, a fixing portion, and a support material. The casing is included in the flow soldering apparatus and can be conveyed on a solder jet nozzle that supplies a solder jet formed in the vertical direction. The fixing part can be fixed to the housing. The support material is supported by the fixing portion, and can hold the thermoplastic sheet along the vertical direction to which the waveform of the solder jet supplied upward in the vertical direction can be transferred.

  According to the present invention, the waveform of the solder jet is transferred to the thermoplastic sheet held along the vertical direction. For this reason, traces of solder jets can be left on the thermoplastic sheet, and the overall waveform of the solder jets can be measured using it, making it accurate and easy to avoid errors due to differences between workers. In addition, the entire solder jet can be measured.

It is a schematic top view which shows the structure of a flow soldering apparatus. It is a schematic top view which shows the state by which the solder jet measurement jig | tool was set to the flow soldering apparatus of FIG. In Embodiment 1, it is a schematic perspective view which shows the aspect of the solder jet measurement jig | tool arrange | positioned in the position right above the solder tank in which the jet of molten solder has arisen. FIG. 3 is a schematic diagram showing a mode in which a solder jet is transferred to a thermoplastic sheet in the first embodiment. 3 is a flowchart showing a solder jet measurement method using the solder jet measurement jig of the first embodiment. It is a schematic perspective view which shows the aspect of the process in which a solder jet measurement jig | tool is set to the area | region right above a solder jet nozzle. It is a schematic perspective view which shows the aspect of the process of transferring the waveform of a solder jet to a thermoplastic sheet. 6 is a flowchart showing details of a step of analyzing the formed transfer waveform shown in step (S50) in FIG. In Embodiment 2, it is a schematic perspective view which shows the aspect of the solder jet measurement jig | tool arrange | positioned in the position right above the solder tank in which the jet of molten solder has arisen. In Embodiment 3, it is a schematic perspective view which shows the aspect of the solder jet measurement jig | tool arrange | positioned in the position right above the solder tank in which the jet of molten solder has arisen. In Embodiment 4, it is a schematic perspective view which shows the aspect of the solder jet measurement jig | tool arrange | positioned in the position right above the solder tank in which the jet of molten solder has arisen. In the first example of the fifth embodiment, a schematic perspective view (A) showing an aspect of a solder jet measurement jig arranged at a position directly above a solder bath where a molten solder jet is generated, and FIG. FIG. 3B is a schematic perspective view (B) showing the configuration of the substrate simulation material shown in FIG. It is a schematic sectional drawing of the part which follows the XIII-XIII line | wire of FIG. 12 (A). FIG. 10 is a schematic diagram showing a positional relationship between a thermoplastic sheet and a substrate simulation material in the fifth embodiment, particularly in the Z direction. In the second example of the fifth embodiment, a schematic perspective view (A) showing an aspect of a solder jet measuring jig arranged at a position directly above a solder bath where a molten solder jet is generated, and FIG. FIG. 3B is a schematic perspective view (B) showing the configuration of the substrate simulation material shown in FIG. It is a schematic sectional drawing of the part which follows the XVI-XVI line | wire of FIG. 15 (A). In Embodiment 6, it is a schematic perspective view which shows the aspect of the target object of soldering, such as a printed circuit board arrange | positioned in the position right above the solder tank in which the jet of molten solder has arisen.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. For convenience of explanation, an X direction, a Y direction, and a Z direction are introduced.

(Embodiment 1)
First, the configuration of a flow soldering apparatus that generates a solder jet measured by the solder jet measuring jig of the present embodiment will be described with reference to FIGS. 1 and 2.

  With reference to FIG. 1, the flow soldering apparatus 100 of this Embodiment is mainly provided with the solder tank 10, the solder jet nozzle 20, and the conveyance conveyor 30. FIG. Among them, the solder bath 10 is a box-shaped member that stores molten solder supplied to the surface of the printed circuit board and the like, and molten solder for soldering an object such as the printed circuit board is stored therein. ing.

  The solder jet nozzle 20 is installed in the solder bath 10, and solder for soldering an object such as a printed circuit board by spraying molten solder in the solder bath 10 upward in the vertical direction (Z direction). A nozzle that generates a jet. For this reason, the solder jet nozzle 20 is formed with a nozzle hole which is a passage for molten solder to be spouted and is also an outlet. The solder jet nozzle 20 has a long shape arranged in the solder bath 10 so as to extend in the Y direction, for example.

  The solder jet nozzle 20 has, for example, a primary solder jet nozzle 21 and a secondary solder jet nozzle 22. The primary solder jet nozzle 21 is formed so that a large number of relatively small nozzle holes are lined up, so that a solder jet having a relatively small waveform can be generated. Small corrugated solder jets allow this to be spread to every corner on a surface such as a printed circuit board. On the other hand, the secondary solder jet nozzle 22 is formed so that a large number of relatively large nozzle holes are lined up, whereby a solder jet having a relatively large waveform can be generated. .

  The large corrugated solder jet makes it possible to adjust the shape of the entire solder jet spouted from the solder bath 10. A solder bridge in which a pair of adjacent soldering portions are short-circuited and a solder rise failure in a hole of an object due to a lack of heat can be suppressed by controlling a large corrugated solder jet.

  For example, a pair (two) of the conveyers 30 are arranged at intervals with respect to the Y direction, for example, so as to pass through (above) the Z direction of the solder bath 10. The conveyor 30 extends in a direction (X direction) that intersects the direction (Y direction) in which the solder jet nozzle 20 extends. In this way, by providing the solder tank 10 with an inclination angle of about 5 °, the conveyance conveyor 30 can also be provided with an inclination angle of about 5 ° in the extending direction.

  Referring to FIG. 2, for example, a solder jet measurement jig 40 is placed so as to straddle both one and the other of the pair of transfer conveyors 30. The conveyor 30 can move along its extending direction, here the X direction. That is, the solder jet measurement jig 40 placed on the transport conveyor 30 can be transported to a position directly above the solder bath 10 while moving in the X direction of FIG. As described above, the solder jet measurement jig 40 is a unit that can be placed on the conveyor 30 and transported alone. However, the solder jet measurement jig 40 may be set right above the solder bath 10 from the beginning without using the transport by the transport conveyor 30.

  Referring to FIG. 3, the solder jet measurement jig 40 mainly includes a housing 41, a claw hook portion 42, a support material fixing portion 43, and a support material 44. The housing 41 is, for example, a flat plate member having a quadrangular shape (rectangular shape or square shape) in a plan view and having a housing opening 41c that is, for example, a quadrangular opening at the center. In other words, the casing 41 has a configuration in which a rectangular member surrounds the central casing opening 41c in an annular shape. The housing 41 has a housing upper surface 41a which is a surface above the Z direction in FIG. 3 and a housing lower surface 41b which is a surface below the Z direction in FIG. The housing 41 is a member that forms the main body of the solder jet measurement jig 40, and is transported by the transport conveyor 30 so that the solder jet measurement is performed on the solder bath 10 (solder jet nozzle 20) that supplies the solder jet. The jig 40 can be placed. In addition, the conveyor 30 has a configuration in which a plurality of conveyor claw 31 for holding the solder jet measurement jig 40 and the like are arranged in a plurality along the direction in which the conveyor conveyor claw 31 is conveyed (X direction: the direction indicated by arrow M in FIG. 3). have.

  The casing 41 may be dedicated to the measurement of a solder jet, on which it is assumed that an object to be soldered such as a printed circuit board is not placed thereon. However, the housing 41 may be a so-called board transport pallet on which a soldering object such as a printed circuit board can be placed. In any case, the casing 41 can convey the same up to the solder jet nozzle 20. That is, particularly in the case of the latter substrate transport pallet, the casing 41 can be used as a jig for both fixing and transporting an object such as a printed circuit board and a soldering process. In particular, the casing 41 in the latter case is often manufactured as a dedicated jig for each object mounted thereon, and may have different sizes and specifications.

  Of the rectangle (planar shape) constituting the casing 41, the claw hook portion 42 is attached to each of two edges (end faces) facing each other in the Y direction, and each of the two edges. It is a thin plate-like and long-shaped member extending along the extending direction. The solder jet measurement jig 40 may be placed on each of the pair of transport conveyors 30, and in particular, each of the pair of upper and lower nail hook portions 42 grips the plurality of transport conveyor claws 31 of the transport conveyor 30. (The conveyor claw 31 sandwiches the claw catching portion 42 from both the upper and lower sides). The plurality of transport conveyor claws 31 of the transport conveyor 30 have a configuration capable of gripping the entire solder jet measurement jig 40 by, for example, placing or gripping the claw hook portion 42. Therefore, the claw hook 42 holds the solder jet measurement jig 40 firmly in the flow soldering apparatus 100 or conveys the solder jet measurement jig 40 after holding the solder jet measurement jig 40 firmly. It is possible to do.

  The support material fixing portion 43 (fixation portion) is, for example, a columnar member for supporting and fixing the support material 44. The support material fixing portion 43 is a member installed for the purpose of supporting and fixing the end portion of the support material 44. For this reason, for example, the support material fixing portion 43 can be fixed to each central portion of a pair of regions extending along the Y direction on the upper surface 41a of the housing, and is installed as such in FIG. Yes. In other words, the support material fixing portions 43 can be arranged on the housing 41 in pairs with a distance from each other in the conveying direction (X direction) of the solder jet measurement jig 40 and the object such as a substrate. It is installed as follows.

  The support material 44 is supported by the support material fixing portion 43 by being installed so as to straddle both of the pair of support material fixing portions 43, and the thermoplastic sheet 45 extends along the vertical direction (Z direction) upward. It is a member that can be held on the surface. Therefore, the support material 44 is supported by the support material fixing portion 43 so that both ends are arranged at a place where the pair of support material fixing portions 43 are fixed, and specifically, extends in the X direction of FIG. Are arranged as follows. Since the thermoplastic sheet 45 is held mainly in the region extending in the X direction of FIG. 3 of the support material 44, the thermoplastic sheet 45 is also along the X direction along the conveying direction of the object such as the substrate with respect to the horizontal direction of FIG. And is held along the vertical direction so as to stand upright on the housing 41.

  The solder jet generated by the solder jet nozzle 20 can come into contact with the thermoplastic sheet 45 in a state where the thermoplastic sheet 45 supported by the support material 44 is conveyed directly above the solder bath 10 (solder jet nozzle 20). ing. Specifically, the primary solder jet 12 in which the molten solder 11 in the solder tank 10 is jetted by the primary solder jet nozzle 21 and the secondary solder jet 13 jetted by the secondary solder jet nozzle 22 are heated. It can adhere to the surface of the plastic sheet 45. As the molten solder 11, lead-containing solder (tin-lead eutectic solder) or lead-free solder (lead-free solder) is used.

  With reference to FIG. 4, the support member 44 has an attachment upper reference surface 46 (reference surface) and a pre-attachment reference surface 47. The upper mounting reference surface 46 is a position in the Z direction of the lower surface LF of the conveying surface which is the lowermost surface (the solder jet nozzle 20 side, that is, the lower side in the Z direction) of an object such as a printed circuit board placed on the housing 41. On the other hand, it is located on the side opposite to the solder jet nozzle 20 in the Z direction (upward in the Z direction) so as to extend substantially parallel to the lower surface LF of the transport surface. Further, the pre-attachment side reference surface 47 extends so as to be substantially perpendicular to the attachment upper reference surface 46, and is configured to extend in the Z direction when the thermoplastic sheet 45 is installed on the solder jet measurement jig 40.

  The vertical edge portion (end surface) and the horizontal edge portion (end surface) of the thermoplastic sheet 45 having a rectangular planar shape come into contact with the upper mounting side reference surface 46 and the front mounting side reference surface 47, thereby generating heat. The plastic sheet 45 is always held at the same position of the support member 44 (at the same position, that is, a position based on the attachment base point 48 where the attachment upper reference surface 46 and the attachment upper reference surface 47 intersect). Therefore, when the support material 44 holding the thermoplastic sheet 45 is fixed to the support material fixing portion 43 (housing 41), the thermoplastic sheet 45 is always based on each member included in the solder jet measurement jig 40. Mounted at approximately the same position.

  Thus, the position of the thermoplastic sheet 45 with respect to the support material 44 and the solder jet measurement jig 40 is adjusted with high accuracy. Accordingly, as described later, the solder jet measurement jig 40 is measured by measuring the position (with respect to the Z direction and the X direction) from the attachment upper reference surface 46 to which the thermoplastic sheet 45 is attached when measuring the solder jet shape. The coordinates of the maximum height of the solder jets 12, 13 with respect to can be determined.

  In this manner, the solder jet measurement jig 40 is placed in the solder bath 10 (solder jet) with the support material 44 and the thermoplastic sheet 45 being installed with high positional accuracy with respect to each member included in the solder jet measurement jig 40. It is conveyed to just above the nozzle 20). At this time, for example, if the primary solder jet 12 and the secondary solder jet 13 are supplied upward from the solder jet nozzle 20 in the Z direction, the primary solder jet from below is applied to the thermoplastic sheet 45 standing upright in the vertical direction. The waveforms of the twelfth and secondary solder jets 13 are transferred as shown by the transfer waveform 49 in FIG. This is because when the molten solder 11 that has been heated comes into contact with the thermoplastic sheet 45, the thermoplastic sheet 45 is thermally deformed at the contacted portion.

  Thus, in order to transfer the waveforms of the solder jets 12 and 13 with high accuracy, it is preferable that the thermoplastic sheet 45 of the present embodiment has the following characteristics. Next, preferable characteristics of the thermoplastic sheet 45 will be described.

  The thermoplastic sheet 45 is made of, for example, low-expandable polystyrene formed into a sheet shape by an extruder. The thermoplastic sheet 45 has the following three characteristics. First, the thermoplastic sheet 45 is easily decomposed, melted, or retracted by contact with the molten solder 11 and can transfer the shapes of the primary solder jet 12 and the secondary solder jet 13 as they are. It consists of material which has. The temperature of the molten solder 11 used in the flow soldering apparatus 100 is generally around 250 ° C. Here, if a low foam polystyrene sheet is used as the thermoplastic sheet 45, the softening temperature thereof is 80 ° C. or higher and 90 ° C. or lower. For this reason, the thermoplastic sheet 45 of low-expandable polystyrene has the property of being easily softened and retracted by contact with the jet of molten solder 11.

  Here, the softening temperature of the thermoplastic sheet 45 is a temperature at which the thermoplastic sheet 45 softens and the sheet starts deformation such as shrinkage. Alternatively, as described later, the softened state of the thermoplastic sheet 45 can be confirmed by electronic image data. The softening temperature can be said to be a temperature at which the thermoplastic sheet 45 is softened to such an extent that the confirmation is possible.

  In summary, the thermoplastic sheet 45 is preferably made of a material that does not soften by radiant heat due to room temperature or ambient heating, but softens only when it comes into contact with molten solder. However, the specific temperature of the softening varies depending on the material of the molten solder.

  Secondly, the thermoplastic sheet 45 is made of a material having a low thermal conductivity so that only the portion where the solder jets 12 and 13 are in contact is softened and the deformed portion does not expand due to the heat conduction in the thermoplastic sheet 45. . Since the low-expandable polystyrene sheet has a thermal conductivity of about 0.03 W / mK, it has sufficient thermal insulation.

  Thirdly, it is preferable that the thermoplastic sheet 45 has an appropriate thickness for retaining its own shape on the solder jets 12 and 13. Here, when a low-foaming polystyrene sheet is used as the thermoplastic sheet 45, the thickness can be set to about 1 mm or more and 3 mm or less, and the shape can be maintained. If the thickness is within this range, as will be described later, the shape of the thermoplastic sheet 45 is imaged using a flat-bed image scanner, which is a general-purpose imaging device, and the shape is converted into electronic image data. Can do. Therefore, measurement data can be easily stored and viewed.

  It can be said that the low foam polystyrene sheet satisfying the above three characteristics is suitable as a material constituting the thermoplastic sheet 45. However, the thermoplastic sheet 45 is not limited to a low-expandable polystyrene sheet, and other materials satisfying the above three characteristics, such as polyvinyl chloride or polypropylene, may be used. A material obtained by processing a thermoplastic resin such as polyvinyl chloride or polypropylene into a foamable sheet has faster thermal deformation characteristics and lower thermal conductivity than an unfoamed sheet. It is particularly suitable as a material constituting the plastic sheet 45.

  The casing 41, the claw hook portion 42, the support material fixing portion 43, the support material 44, and the like constituting the solder jet measurement jig 40 are preferably formed of a material having excellent heat resistance, for example, glass fiber and heat resistance. It is preferably formed of a composite material with resin. Specifically, these are materials called high heat-resistant glass epoxy, for example.

  Next, a solder jet measurement method using the solder jet measurement jig 40 of the present embodiment will be described with reference to FIGS.

  Referring to FIG. 5, first, the solder jet flow rate is adjusted (S10). Specifically, the amounts of the primary solder jet 12 and the secondary solder jet 13 (see FIG. 3) are adjusted by a method using an apparatus or manually.

  Next, the solder jet measurement jig 40 placed on the transport conveyor 30 (held by the transport conveyor claws 31) is set in a region directly above the solder jet nozzle 20 (S20). Specifically, referring to FIG. 6, first, thermoplastic sheet 45 is held by solder jet measurement jig 40 (jig) along the Z direction by support material 44 fixed to support material fixing portion 43. Is done. The thermoplastic sheet 45 spans between a pair of regions extending in the Y direction facing each other across the central housing opening 41c in the annular housing 41 (direction along the conveyance direction of the object, that is, X The casing opening 41c is present immediately below the thermoplastic sheet 45. The position of the thermoplastic sheet 45 is fixed by the attachment base point 48, the pre-attachment reference surface 47 and the attachment upper reference surface 46. When the thermoplastic sheet 45 is attached to the solder jet measurement jig 40, the lowermost surface in the Z direction is the same as the height of the lower surface LF of the conveying surface or lower than the lower direction LF (set on the conveying conveyor 30). It is preferable to have a dimension (in the Z direction) that is arranged on the solder jet nozzle 20 side of the hour.

  In this state, the solder jet measurement jig 40 is set immediately above the solder jet nozzle 20 in the solder bath 10 in which the molten solder 11 is accommodated. Specifically, a pair of claw catching portions 42 included in the solder jet measurement jig 40 are gripped by a plurality of transport conveyor claws 31 constituting each of the pair of transport conveyors 30.

  With reference to FIG. 6, in a state where the solder jet measurement jig 40 is disposed directly above the solder jet nozzle 20, there is a housing opening 41 c immediately below the thermoplastic sheet 45, and between the molten solder 11. There is no member. For this reason, the thermoplastic sheet 45 will be in the state which the molten solder 11 can contact directly.

  The solder jet measurement jig 40 is set on the conveyor 30 in a region other than directly above the solder jet nozzle 20, and then conveyed (moved) by driving the conveyor 30 to a region directly above the solder jet nozzle 20. May be.

  Referring to FIG. 5 again, next, in a state where the solder jet measurement jig 40 is set on the solder jet nozzle 20, the molten solder 11 is jetted from the solder jet nozzle 20, and the waveforms of the solder jets 12, 13 are shown. Then, the waveform is transferred to the thermoplastic sheet 45 (S30). Specifically, referring to FIG. 7, the solder jet from the primary solder jet nozzle 21 and the secondary solder jet nozzle 22 is started, and the small corrugated primary solder jet 12 and the large corrugated secondary solder jet. 13 occurs.

  Since the primary solder jet 12 from the primary solder jet nozzle 21 and the secondary solder jet 13 from the secondary solder jet nozzle 22 can be turned on / off individually, only one or both of them can be turned on. Can be freely turned on to supply a jet.

  After the elapse of time and it is confirmed that the primary solder jet 12 and the secondary solder jet 13 are stable, the primary solder jet 12 and the secondary solder jet 13 are stopped (S40). Then, the thermoplastic sheet 45 is removed from the solder jet measurement jig 40. The waveform of the solder jet transferred to the thermoplastic sheet 45 is measured, for example, the distance from the uppermost surface of the thermoplastic sheet 45 to the uppermost portion of the portion softened by the heat is measured (S50).

Specifically, the position (coordinates) and dimensions of the deformed portion with reference to the attachment base point 48 are confirmed. More specifically, referring again to FIG. 4, for example, the uppermost portion in the Z direction of the transfer waveform 49 that is a portion softened by the heat of the secondary solder jet 13, the mounting upper reference surface 46 of the support member 44, The distance W _min (with respect to the Z direction) is determined. Further, the height H _j in the Z direction of the mounting upper reference surface 46 with respect to the conveying surface lower surface LF of the solder jet measurement jig 40 is obtained. As a result, the maximum height H _f of the secondary solder jet 13 is

Can be obtained. The maximum height of the primary solder jet 12 is also determined in the same manner as described above.

As described above, in the present embodiment, the solder jet measurement jig 40 and the solder jets 12 and 13 are measured by measuring the distance W _min from the mounting upper reference surface 46 of the support member 44 on which the thermoplastic sheet 45 is held. The distance in the Z direction can be measured.

  Referring to FIG. 8, during such measurement, the waveform transferred to the thermoplastic sheet 45 may be converted into electronic data (S51), and the electronic data may be numerically determined (S52). Specifically, for example, when a flatbed image scanner, which is a general-purpose imaging device, is used, the reference point at which the thermoplastic sheet 45 is arranged at the position of the reference point at the reading end of the flatbed image scanner. An electronic image can be obtained by matching the attachment base points 48. Then, by measuring the number of pixels from the base point on the electronic image on the electronic computer, the dimensions of an arbitrary position of the thermoplastic sheet 45 can be measured. In addition, it is possible to easily compare and evaluate a reference image such as an image captured in the past.

Next, after obtaining the information of the transfer waveform 49 as described above, it is determined whether or not the numerical values related to the solder jets 12 and 13 are within an appropriate range (height and shape) (J10). Depending on the result of the determination step (J10), for example, when the solder jets 12 and 13 are not in an appropriate state, the solder jet flow rate is adjusted again (S10), and the following steps (S20) to (S50). ) And the process similar to the process (J10) are repeated until the distance W _min of the solder jets 12 and 13 is within an appropriate range. If it does in this way, it can adjust so that a solder jet flow volume may become an appropriate value certainly.

If the above is within an appropriate range, the measurement result is stored (S60). As a storage method, for example, the height of the solder jets 12 and 13 obtained from the information of the relative distance W _min of the transfer waveform 49 from the mounting base point 48 is left as a numerical value, or a thermoplastic sheet is obtained by a flat bed type image scanner. 45 images are digitized and stored. Thereby, the information of the shape of the solder jets 12 and 13 imaged in the past can be referred, and the traceability of the quality of a soldering process can be improved. Further, the shape of the solder jets 12 and 13 at a past time when the soldering state was good can be used as reference data, and the data can be used when adjusting the shape of the solder jets 12 and 13 thereafter.

  By the way, in general, in a flow soldering apparatus, in order to supply an appropriate amount of molten solder to the surface of an object such as a printed circuit board that flows therethrough, a solder jet is in contact with the lower surface LF of the conveyance surface of the object. The height of the solder jet is adjusted so that the height becomes. If the solder jet is excessively lower than the above, the solder jet does not reach the lowermost surface of the desired object, for example, the printed circuit board, and the molten solder cannot be supplied to the printed circuit board. On the other hand, when the solder jet is excessively higher than the above, the molten solder may unintentionally run up to the upper side of the printed circuit board or the conveyor claw, which may cause a short circuit and poor appearance.

  Considering the above, for example, the lowermost part is set on the lower side in the Z direction (solder jet nozzle 20 side) by about 3 mm or more and 5 mm or less from the conveyance surface lower surface LF of the printed circuit board set on the solder jet measurement jig 40. It is preferable to use a thermoplastic sheet 45 having such dimensions. In this way, an appropriate amount of molten solder can be reliably brought into contact with the thermoplastic sheet 45 by the solder jet.

Next, the effect of this Embodiment is demonstrated.
As described above, in the flow soldering process, it is important to manage the height and shape of the solder jet. Lead-free solder as molten solder has a higher melting temperature and inferior solderability than tin-lead eutectic solder. For this reason, particularly when lead-free solder is used as the molten solder, a high soldering technique is required, and the height and shape of the solder jet need to be controlled more precisely.

  As an example, a solder jet is brought into contact with, for example, a heat-resistant glass arranged along the horizontal direction, the width of the contacted solder jet is measured in real time, and the correlation between the measured width and the height of the solder jet is calculated. A method is used to determine the appropriate soldering conditions. However, in this case, when the solder jet comes into contact with the heat-resistant glass, it is difficult to accurately measure the width that changes due to the flow at any time, and there may be a large error in the measured value between operators.

  In addition, when the method of measuring the width of the solder jet in contact with the heat-resistant glass arranged along the horizontal direction is used, the strong jet from the narrow nozzle and the weak jet from the wide nozzle (actual May be measured as approximately the same width (even though the former is a much higher jet). For this reason, it may be difficult to appropriately measure the height of the intended solder jet. Further, when the measurement method is used, a specific position (point) such as the position of the maximum height of the solder jet can be measured, but the waveform of the entire solder jet cannot be measured.

  Based on the above problems, as another example, a new jig for measuring the height of the solder jet has been devised. For example, a jig has been devised in which an opening is provided in a plate material that can contact a solder jet, the solder jet is passed through the opening, and the height of the solder jet is measured. In this jig, the height of the solder jet can be measured using a scale provided on the cross section of the opening at the moment when the solder jet rises in the opening. However, there is a problem that it is difficult to accurately read the scale at the moment when the solder jet rises. Even when the jig is used, a specific position (point) such as the position of the maximum height of the solder jet can be measured, but the waveform of the entire solder jet cannot be measured.

  As described above, in the above example and other examples, it is difficult to quantitatively measure the height of the solder jet easily and with high accuracy.

  Therefore, in the present embodiment, the solder jet measurement jig 40 holding the thermoplastic sheet 45 along the vertical direction is set directly above the solder jet nozzle 20, and the waveforms of the solder jets 12 and 13 are thermoplastic. A transfer waveform 49 is formed by being transferred to the sheet 45. The solder jet measurement jig 40 has a casing 41, a claw, and a nail so that the thermoplastic sheet 45 can be set right above the solder jet nozzle 20 in such a state that the thermoplastic sheet 45 is held along the vertical direction. A hanging portion 42, a support material fixing portion 43, and a support material 44 are provided.

  Since the thermoplastic sheet 45 is disposed immediately above the solder jet nozzle 20, the waveforms of the solder jets 12 and 13 ejected therefrom can be directly transferred to the thermoplastic sheet 45 with high accuracy. It is possible to transfer the waveforms of the solder jets 12 and 13 as they are because the thermoplastic sheet 45 is set along the vertical direction. Since the softening deformation of the thermoplastic sheet 45 due to the heat of the solder jet 12 remains as it is as the transfer waveform 49 (see FIG. 4), for example, there is no need to measure at the moment when the solder jets 12 and 13 are generated. The measured thermoplastic sheet 45 can be measured later. For this reason, the dispersion | variation in the measurement precision between operators can be suppressed, and it can measure easily with high precision.

  Further, not only the specific positions of the solder jets 12 and 13 are measured, but the shape of the entire transfer waveform 49 can be measured. For this reason, a minute change in waveform can be captured. That is, for example, when the accuracy of adjustment of the movable adjustment portion of the solder jet nozzle 20 is out of order and when the solder oxide is deposited in the solder jet nozzle 20, the fine fluctuations in the waveforms of the solder jets 12 and 13 may occur. However, if the solder jet measuring method and the solder jet measuring jig 40 of the present embodiment are used, they can be detected effectively.

  By considering the transfer waveform 49 of the solder jets 12 and 13, it is possible to obtain an index for controlling the amount of heat transfer to the printed circuit board to which the molten solder 11 is supplied using the solder jets 12 and 13. It is possible to control the attachment conditions (parameters) more accurately.

  The thermoplastic sheet 45 is fixed in position with the attachment base point 48 and the attachment upper reference surface 46 as reference positions. Therefore, by measuring the distance from the mounting upper reference surface 46 of the transfer waveform 49 of the solder jets 12 and 13 to the thermoplastic sheet 45, the height of the solder jets 12 and 13 relative to the lower surface LF of the conveying surface is accurately specified. can do. This is because the distance of the transfer waveform 49 from the attachment upper reference surface 46 relatively indicates the maximum height of the solder jets 12 and 13 from the conveyance surface lower surface LF.

  In the present embodiment, the thermoplastic sheet 45 is arranged so as to extend in the X direction along the conveyance direction of the object with respect to the horizontal direction, depending on the arrangement of the support material fixing portion 43 and the support material 44. Thereby, especially the change of the waveform of the solder jets 12 and 13 with respect to each position of the conveyance direction of a target object is detectable.

(Embodiment 2)
Referring to FIG. 9, solder jet measurement jig 40 of the present embodiment basically has the same configuration as solder jet measurement jig 40 shown in FIG. However, in FIG. 9, a plurality of support material fixing portions 43 that are fixed to each of a pair of opposing regions extending along the Y direction on the housing upper surface 41 a are provided in each of the pair of the regions ( In FIG. 9, five are installed). As described above, in FIG. 9, a plurality of pairs (five pairs in this case) of the support material fixing portions 43 are spaced from each other with respect to the Y direction intersecting (for example, orthogonal to) the X direction that is the object transport direction. Opened and installed.

  Accordingly, a plurality of support members 44 can be installed on each pair of support member fixing portions 43. Specifically, although a maximum of five support members 44 can be installed here, in FIG. 9, the two support members 44 are installed at intervals with respect to the Y direction. By holding the thermoplastic sheet 45 on each support member 44, the solder jet measurement jig 40 of the present embodiment can hold a plurality of thermoplastic sheets 45.

  In FIG. 9, two thermoplastic sheets 45 are held on the solder jet measurement jig 40 (support material 44) at a distance from each other in the Y direction. One of the thermoplastic sheets 45 (support material 44) is held by the deepest support material fixing portion 43 indicated by arrow B among the five support material fixing portions 43 arranged in the Y direction. Is supported by the central support member fixing portion 43 among the five support member fixing portions 43 arranged in the Y direction.

  Note that the configuration for holding the plurality of support members 44 with respect to the housing upper surface 41a is not limited to the configuration in which the thermoplastic sheet 45 is held by the slit-like support member 44 as described above. For example, although not shown, the case 41 and the support member 44 may be combined with a generally known slide mechanism, or the case 41 and the support member 44 may be fixed with a magnet. Good.

  In addition, since the structure of this Embodiment other than this is as substantially the same as the structure of Embodiment 1, the same code | symbol is attached | subjected about the same element and the description is not repeated.

  Next, the effect of this Embodiment is demonstrated. In addition to the same functions and effects as those of the first embodiment, the present embodiment has the following functions and effects.

  In general, in the flow soldering apparatus 100, a solder duct (not shown) is arranged at the lower part of the solder jet nozzle 20 in the Z direction. The molten solder 11 in the solder bath 10 is jetted by being pressurized by a pump mechanism through the solder duct. For this reason, the height and shape of the solder jets 12 and 13 are not limited between the near side indicated by the arrow F in the Y direction of the flow soldering apparatus 100 and the back side indicated by the arrow B side. The parallelism of the solder jets 12 and 13 may change due to the difference in height and shape of the solder jets 12 and 13 between the front side and the back side.

  If the parallelism of the solder jets 12 and 13 deteriorates, both the portion where the solder jets 12 and 13 are in strong contact with the object during the flow soldering process and the portion where the solder jets 12 and 13 are not in contact with the object at all are obtained. It may occur within one process. As a result, a solder bridge and a region where no solder is supplied are formed, and soldering failure may occur. From the viewpoint of suppressing such problems, it is preferable that the parallelism of the solder jets 12 and 13 can be quantitatively grasped.

  Therefore, in the present embodiment, a plurality of (for example, two) thermoplastic sheets 45 are held at intervals with respect to the Y direction that intersects the conveyance direction of the object in the horizontal direction. Thereby, the shape of the solder jets 12 and 13 on both the front side F and the back side B of the flow soldering apparatus 100 can be measured simultaneously. Therefore, for example, the difference in the shape of the solder jets 12 and 13 between the front side F and the back side B in the Y direction of the solder bath 10 can be easily and quantitatively measured. Thereby, the parallelism of the solder jets 12 and 13 can be measured easily.

  The adjustment method of the solder jets 12 and 13 according to the present embodiment is the same as the adjustment method shown in the flowchart of FIG. However, in the present embodiment, when adjusting the height of the solder jets 12 and 13 and the like, the parallelism of the solder jets 12 and 13 is also adjusted so that the printed circuit board or the like which is the object can be soldered. A suitable parallelism can be obtained.

  Further, according to the aspect of the present embodiment, the support material 44 and the thermoplastic are provided on the support material fixing portion 43 at an arbitrary position among the five support material fixing portions 43 that are installed (for example, spaced from each other in the Y direction). The sheet 45 can be gripped. For this reason, it is possible to measure the solder jets 12 and 13 at an arbitrary position particularly in the Y direction.

(Embodiment 3)
Referring to FIG. 10, solder jet measurement jig 40 of the present embodiment basically has the same configuration as solder jet measurement jig 40 shown in FIG. However, in FIG. 10, the claw hook portion 42 is attached to all four edges (end surfaces) constituting the rectangle of the casing 41 having a rectangular planar shape. In this respect, in the solder jet measurement jig 40 of the present embodiment, the claw hook portion 42 is formed only on two of the four edge portions constituting the rectangle of the casing 41 (a pair facing each other). This is different from the solder jet measurement jig 40 of the first embodiment.

  In addition, since the structure of this Embodiment other than this is as substantially the same as the structure of Embodiment 1, the same code | symbol is attached | subjected about the same element and the description is not repeated.

  Next, the effect of this Embodiment is demonstrated. In addition to the same functions and effects as those of the first embodiment, the present embodiment has the following functions and effects.

  In the present embodiment, the claw hooks 42 are attached to all four edges constituting the rectangle of the casing 41. Accordingly, as shown in FIG. 10, the casing 41 can be gripped by the conveyor claw 31 so that the thermoplastic sheet 45 is set so as to extend in the X direction. For example, the casing 41 can be set so as to be gripped by the transport conveyor pawl 31 in a state in which the casing 41 is rotated 90 degrees in a plan view with respect to FIG. If it does in this way, the thermoplastic sheet 45 can also be easily set with respect to the conveyance conveyor 30 so that it may extend in a Y direction, without changing installation positions, such as the support material fixing | fixed part 43. FIG. For this reason, the freedom degree of the direction in which the solder jet measurement jig | tool 40 is installed can be raised.

(Embodiment 4)
Referring to FIG. 11, solder jet measurement jig 40 of the present embodiment basically has the same configuration as solder jet measurement jig 40 shown in FIG. However, in FIG. 11, the support material fixing portion 43 can be fixed to the center of each of a pair of regions facing each other extending along the X direction on the housing upper surface 41 a, for example, in FIG. 11. Is installed. That is, a pair of support material fixing portions 43 can be arranged on the housing 41 with a space from each other with respect to a direction (Y direction) intersecting the conveying direction of an object such as the solder jet measurement jig 40 and the substrate. 11 is installed as such. For this reason, the thermoplastic sheet 45 extends along the Y direction intersecting the conveyance direction of the object such as the substrate with respect to the horizontal direction in FIG. 11 and is held along the vertical direction so as to stand upright on the housing 41. The Thus, in the present embodiment, the thermoplastic sheet 45 is fixed so as to be rotated 90 degrees compared to the first embodiment in plan view.

  In addition, the nail | claw hook part 42 may be attached to all the four edge parts (end surface) which comprise the housing | casing 41 of FIG. In this way, as in the third embodiment, the direction in which the casing 41 is gripped with respect to the transport conveyor 30 can be rotated by 90 degrees in a plan view. Similarly to the first to third embodiments, the thermoplastic sheet 45 can be set so as to extend in the X direction.

  In addition, since the structure of this Embodiment other than this is as substantially the same as the structure of Embodiment 1, the same code | symbol is attached | subjected about the same element and the description is not repeated.

  Next, the effect of this Embodiment is demonstrated. In addition to the same functions and effects as those of the first embodiment, the present embodiment has the following functions and effects.

  If the thermoplastic sheet 45 is installed so as to extend in the Y direction as in the present embodiment, it is the same as when a plurality of thermoplastic sheets 45 are installed at intervals in the Y direction as in the second embodiment. Moreover, the difference and parallelism of the solder jets 12 and 13 between the near side F and the back side B in the Y direction can be measured. Moreover, in the second embodiment, the solder jets 12 and 13 can be compared at intermittent positions in the Y direction where each of the plurality of thermoplastic sheets 45 is installed. It is possible to continuously measure the solder jets 12 and 13 in the entire region where the thermoplastic sheet 45 is arranged in the Y direction. Therefore, the parallelism of the solder jets 12 and 13 can be evaluated with higher accuracy than in the second embodiment. That is, for example, by continuously considering the solder jets 12 and 13 over the entire Y direction, it is possible to specify a place where clogging due to an oxide of the molten solder 11 occurs.

  Also in the present embodiment, as in the second embodiment, the parallelism of the solder jets 12 and 13 can be adjusted together when the height of the solder jets 12 and 13 is adjusted.

(Embodiment 5)
Referring to FIG. 12A, the solder jet measurement jig 40 of the present embodiment basically has the same configuration as the solder jet measurement jig 40 shown in FIG. However, in FIG. 12A, a single substrate simulation material 50 (plate material) is installed on the upper surface 41a of the housing so as to fit into the housing opening 41c, for example. In other words, in the case 41 of the present embodiment, one board simulation material 50 can be placed thereon, and in the solder jet measurement process, one board simulation material 50 is arranged on the case 41. Is done.

  As described in the first embodiment, the solder jet measurement jig 40 has an object to be soldered such as a printed circuit board placed on the housing 41, and in this state, the solder jet measurement jig 40 is placed on the solder jet nozzle 20 to the solder jet measurement nozzle 40. It may be used in applications where it is transported and molten solder is supplied onto the lower surface of the object. The shape of the solder jets 12 and 13 received by the solder jet measurement jig 40 differs depending on whether the soldering object is conveyed and arranged on the solder jet nozzle 20 or not. . Specifically, when the object is conveyed (passed) on the solder jet nozzle 20 as indicated by the arrow M, the solder jets 12 and 13 are in contact with the lower surface LF of the object. . Therefore, the solder jets 12 and 13 are blocked by the lower surface LF of the object to be conveyed, and forward (downstream of conveyance) and backward (upstream of conveyance) with respect to the object conveyance direction (X direction). Expanded shape.

  Therefore, in the present embodiment, the solder jets 12 and 13 are transferred to the thermoplastic sheet 45 held by the solder jet measurement jig 40 in a state where the board simulation material 50 is placed on the housing 41. If it does in this way, a solder jet will be contacted and intercepted on the Z direction lower surface (solder jet nozzle 20 side) of substrate simulation material 50, for example, will become the shape which spreads ahead and back to the X direction. Therefore, the substrate simulation material 50 can reproduce a state similar to the state in which the soldering target is placed on the solder jet measurement jig 40 in a pseudo manner.

  In the present embodiment, compared to the case where the board simulation material 50 is not placed, a transfer waveform 49 having a waveform closer to the waveform of the solder jet when the soldering target is placed on the solder jet measurement jig 40. (See FIG. 4) can be formed. Accordingly, it is possible to further increase the accuracy of measurement such as the shape of the solder jets 12 and 13 particularly when an object to be soldered is placed on the housing 41.

  Referring to FIG. 12B, the substrate simulation material 50 is a flat plate member made of a substrate simulation material body 50a. The substrate simulation material main body 50a can be formed of a material used for a printed circuit board such as a glass epoxy composite material, or an arbitrary material whose shape change due to contact of the solder jets 12 and 13 such as heat-resistant glass is relatively small. .

  For example, a slit 50b that penetrates through the substrate simulation material body 50a at the center of the substrate simulation material body 50a so as to reach from the one main surface (lower surface) of the substrate simulation material body 50a to the other main surface (upper surface) opposite to the main surface. (Hole). The slit 50b extends, for example, along the X direction in FIG. 12, and is configured such that the thermoplastic sheet 45 held by the support material fixing portion 43 and the support material 44 can be inserted from above in the Z direction. .

  With reference to FIGS. 13 and 14, the thermoplastic sheet 45 is inserted into the slit 50b so as to penetrate the entire inside of the slit 50b from one main surface to the other main surface of the substrate simulation material body 50a. Placed in. As a result, the thermoplastic sheet 45 has a lower region of the substrate simulation material body 50a, that is, a height equal to the position in the Z direction and the lower surface LF of the object to be soldered, or a height below the Z direction. It can be arranged to reach the position. In FIG. 14, from the viewpoint of making this easy to understand, the thermoplastic sheet 45 and the substrate simulation material 50 are shown to be arranged in the X direction. However, in some cases, they are not actually arranged in this way. .

  For this reason, also in the present embodiment, similarly to the first embodiment, the waveforms of the solder jets 12 and 13 can be transferred with high accuracy as they are to the thermoplastic sheet 45 set along the Z direction. .

  Further, in the substrate simulation material 50 of the present embodiment, a through-hole 50c different from the slit 50b is formed in the substrate simulation material main body 50a so as to penetrate from the main surface to the other main surface. It is preferable.

  In the present embodiment, the molten solder enters beyond the position of the lower surface LF of the conveyance surface and further upward in the Z direction by the pressure of the solder jets 12 and 13, and contacts the thermoplastic sheet 45 to thermally deform it. . The penetration of the molten solder upward in the Z direction is caused by the solder entering the slits, through holes, and through-hole portions to be soldered, which are formed in the actual printed circuit board. It is similar to the state in which molten solder enters the surface side. For this reason, it is preferable that the substrate simulation material 50 is also provided with a through hole 50c and a through hole portion separately from the slit 50b so as to be closer to an actual printed circuit board. By doing so, by evaluating the shape and the like of the transfer waveform 49, it is possible to more accurately evaluate the upward characteristic of the molten solder rising in the Z direction with respect to the through hole 50c and the through hole portion.

  Referring to FIG. 15A, the solder jet measurement jig 40 of the present embodiment simulates two boards so as to fit, for example, a part of the housing opening 41c on the housing upper surface 41a. A material 50 (plate material) may be installed. In other words, in the case 41 of the present embodiment, two board simulation materials 50 can be placed thereon, and in the solder jet measurement process, two board simulation materials 50 are arranged on the case 41. Is done.

  Referring to FIG. 15B, the substrate simulation material 50 of FIG. 15A is composed of a substrate simulation material body 50a that is elongated compared to the substrate simulation material 50 of FIG. For this reason, it is possible to fit two board | substrate simulation material main bodies 50a with the housing | casing opening 41c. Each of these two substrate simulation materials 50 is formed with a through hole 50c.

  The two board simulation material bodies 50a are fitted into the housing opening 41c with a space therebetween. Thus, a slit 50d (hole) is formed between one of the two substrate simulation materials 50 and the other substrate simulation material 50. Similar to the slit 50b of FIG. 12 (B), the slit 50d is configured such that the thermoplastic sheet 45 held by the support material fixing portion 43 and the support material 44 can be inserted from above in the Z direction. . Note that there may be a configuration in which there are three or more (a plurality of) substrate simulation material bodies 50a and a slit is formed between them.

  Therefore, with reference to FIG. 16, even when the substrate simulation material 50 of FIG. 15 is used, the thermoplastic sheet 45 is inserted into the slit 50d so that the thermoplastic sheet 45 is one main surface of the substrate simulation material body 50a in the Z direction. To the position corresponding to the other main surface so as to penetrate the entire slit 50d. Here, this state is expressed as the thermoplastic sheet 45 penetrating the slit 50d of the substrate simulation material 50.

  In addition, since the structure of this Embodiment other than this is as substantially the same as the structure of Embodiment 1, the same code | symbol is attached | subjected about the same element and the description is not repeated.

  Next, the effect of this Embodiment is demonstrated. The present embodiment has the following operational effects in addition to the operational effects similar to those of the first embodiment and the effects of the arrangement of the substrate simulation material 50 described above.

  In the present embodiment, for example, when the thickness of the thermoplastic sheet 45 inserted into the slit 50b is changed, when the width of the slit into which the object to be actually soldered is inserted is changed or The case where the size of the through hole formed in the printed circuit board as the object is changed can be reproduced with high accuracy. For example, when the thickness of the thermoplastic sheet 45 is changed from 1 mm to 3 mm, if the transfer waveform 49 to the thermoplastic sheet 45 by the solder jet is higher than the thickness of the printed circuit board, the actual soldering sheet 45 Even in the case of using a printed circuit board, it can be said that there is a possibility that a defect in which the solder spouts onto the upper surface in the Z direction from a wide slit or the like may occur.

(Embodiment 6)
Referring to FIG. 17, in the present embodiment, the printed circuit board or the like as the object 51 to be actually soldered does not pass through the solder jet measurement jig 40, and the flow soldering apparatus 100 1 It is set directly across the pair of conveyors 30. As described above, the printed circuit board or the like as the object 51 to be soldered by the flow soldering apparatus 100 does not necessarily need to be set on the solder jet measurement jig 40, and is directly placed on the conveyor 30 as shown in FIG. It may be set. Also in this case, if the target object 51 is disposed immediately above the solder jet nozzle 20 by conveyance in the direction indicated by the arrow M, the molten solder 11 can be appropriately supplied to the lower surface of the target object 51 or the like.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  DESCRIPTION OF SYMBOLS 10 Solder tank, 11 Molten solder, 12 Primary solder jet, 13 Secondary solder jet, 20 Solder jet nozzle, 21 Primary solder jet nozzle, 22 Secondary solder jet nozzle, 30 Conveyor, 31 Conveyor claw, 40 Solder Jet measurement jig, 41 housing, 41a housing upper surface, 41b housing lower surface, 41c housing opening, 42 nail hook portion, 43 support material fixing portion, 44 support material, 45 thermoplastic sheet, 46 mounting upper reference surface, 47 Front mounting reference surface, 48 Mounting base point, 49 Transfer waveform, 50 Substrate simulation material, 50a Substrate simulation material body, 50b, 50d Slit, 50c Through hole, 51 Target, 100 Flow soldering device, LF Lower surface of transport surface.

Claims (18)

A jig holding the thermoplastic sheet so as to be along the vertical direction is set in a region directly above the solder jet nozzle in the transfer conveyor that can be transferred directly above the solder jet nozzle for soldering the object. And a process of
In a state where the jig is set on the solder jet nozzle, generating a solder jet from the solder jet nozzle to generate a waveform of the solder jet, and transferring the waveform to the thermoplastic sheet;
A method for measuring a solder jet, comprising measuring a waveform transferred to the thermoplastic sheet.   The solder jet measuring method according to claim 1, wherein in the setting step, the thermoplastic sheet is arranged so as to extend in a direction along a conveyance direction of the object with respect to a horizontal direction.   3. The solder jet measurement method according to claim 2, wherein, in the setting step, a plurality of the thermoplastic sheets are held at intervals with respect to a direction intersecting a conveyance direction of the object in a horizontal direction.   2. The solder jet measurement method according to claim 1, wherein in the setting step, the thermoplastic sheet is disposed so as to extend in a direction intersecting a conveyance direction of the object with respect to a horizontal direction.   In the setting step, the thermoplastic sheet is a reference surface located on the opposite side of the solder jet nozzle with respect to the vertical direction with respect to the position of the lower surface of the object set on the conveyor on the solder jet nozzle side. The solder jet measurement method according to any one of claims 1 to 4, wherein the position is fixed by the method. The measuring step includes
Converting the waveform into electronic image data using an imaging device;
And a step of numerically determining the electronic image data.
The solder jet measuring method according to any one of claims 1 to 5. The step of setting includes a step of arranging one or two plates on the jig,
The transferring step includes a step of bringing the solder jet into contact with a lower surface of the plate material on the solder jet nozzle side,
When the one plate material is arranged, a hole reaching the upper surface from the lower surface to the lower surface is formed in the plate material, and when the two plate materials are arranged, one of the two plates The two plates are arranged so that a hole is formed between the plate and the other plate,
The solder jet measurement method according to claim 1, wherein the thermoplastic sheet is disposed so as to penetrate the plate material from the upper surface to the lower surface in the hole. Determining whether the numerical value obtained by the step of measuring the waveform is within an appropriate range;
The solder jet measurement method according to claim 1, further comprising a step of adjusting a jet flow rate according to a result of the determination step.   The solder jet measuring method according to claim 1, wherein the thermoplastic sheet has a thickness of 1 mm or more and 3 mm or less.   The solder jet measuring jig used for the solder jet measuring method of any one of Claims 1-9. A case that is included in a flow soldering apparatus that solders an object, and that can be conveyed on a solder jet nozzle that supplies a solder jet formed in a vertical direction;
A fixing portion that can be fixed to the housing;
A solder jet measurement jig comprising: a support member that is supported by the fixing portion and is capable of holding a thermoplastic sheet that can transfer a waveform of the solder jet supplied upward in the vertical direction, along the vertical direction. The fixing parts can be arranged in a pair on the casing with a space from each other with respect to the conveyance direction of the object,
The support material is interposed between the pair of fixing portions so as to straddle one fixing portion of the pair of fixing portions and the other fixing portion opposite to the one fixing portion. The solder jet measurement jig according to claim 11, wherein the solder jet measurement jig is arranged so that the sheet can be held so as to extend in a direction along a conveyance direction of the object with respect to a horizontal direction.   A plurality of pairs of the fixing portions and a plurality of the support members are provided on the housing in a direction intersecting with the conveyance direction of the object so as to be arranged in the conveyance direction of the object on the housing. The solder jet measurement jig according to claim 12, wherein a plurality of the thermoplastic sheets can be held at intervals with respect to the intersecting direction. The fixing portions can be arranged in a pair on the casing with a space from each other with respect to the direction intersecting the conveyance direction of the object.
The support material is interposed between the pair of fixing portions so as to straddle one fixing portion of the pair of fixing portions and the other fixing portion opposite to the one fixing portion. The solder jet measurement jig according to claim 11, wherein the solder jet measurement jig is arranged so that the sheet can be held so as to extend in a direction intersecting a conveyance direction of the object with respect to a horizontal direction.   The support material includes a reference surface positioned on the opposite side of the solder jet nozzle with respect to a vertical direction with respect to a position of a lower surface of the object placed on the casing on the solder jet nozzle side. The solder jet measurement jig of any one of 11-14.   The board | plate material which has one hole which can insert the said thermoplastic sheet in the said housing | casing, or two board | plate materials can be mounted so that the said hole part may be formed in between. The solder jet measurement jig according to any one of -15.   The claw hook part for making the conveyance conveyor for conveying the said solder jet measuring jig in the said flow soldering apparatus grip the said solder jet measuring jig further in any one of Claims 11-16. The solder jet measuring jig described. The housing has a rectangular planar shape;
The solder jet measurement jig according to claim 17, wherein the claw-hanging portion is included in all four edge portions constituting the rectangle of the housing.

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