JP6494307B2 - Developer container manufacturing method, developing device manufacturing method, and process cartridge manufacturing method - Google Patents

Description

The present invention relates to a method of manufacturing a developer container, a method of manufacturing a developing apparatus, and those concerning the manufacturing method of the process cartridge.

  Here, the developer container is a container for containing the developer. The developer container has a developer carrier and is used in a developing device that visualizes an electrostatic latent image with a developer. Further, the developer container alone is detachably used in the image forming apparatus.

  The process cartridge refers to a cartridge in which at least a developer container, a developer carrier, and an image carrier are integrally formed so as to be detachable from the image forming apparatus main body.

  A developer container or a developing device including a developer container is provided with means for detecting when the developer is consumed and notifying the user of the replacement time, that is, a developer remaining amount detecting means. Many.

  As the developer remaining amount detecting means, there is a method of detecting a developer remaining amount by detecting a change in electrostatic capacitance between a plurality of electrodes arranged in a developer container or a developing device. As one of such methods, there is a method disclosed in Patent Document 1. In Patent Document 1, a developer carrying member is used as an input side electrode, and a capacitance detecting member serving as an output side electrode is provided at a location facing the developer carrying member in the developing device, and an AC bias is applied to the developer carrying member. By doing so, the capacitance is detected.

  In this configuration, the developing device is provided with a contact member that electrically connects between the capacitance detection member and the main body-side developer remaining contact having springiness provided in the image forming apparatus main body. . When an AC bias is applied to the developer carrying member, a current corresponding to the capacitance (developer remaining amount) is induced between the developer carrying member and the capacitance detecting member. The remaining amount of developer is sequentially detected by measuring this current value with the developer remaining amount detecting device of the main body of the image forming apparatus via the contact member provided on the developing device side and the developer remaining amount contact of the main body side. It becomes possible to do.

JP 2003-248371 A

  The present invention is a further development of the above-described technique, and an object of the present invention is to make the configuration for detecting the capacitance provided in the developer container simpler.

In order to achieve the above object, the present invention provides a developer container comprising a frame for containing a developer and a conductive sheet member containing a resin for detecting the amount of developer using capacitance. In the process of molding the frame by injecting resin between the molds with the conductive sheet member interposed therebetween, a first molded portion is formed on one surface side of the conductive sheet member. And after forming the first molded portion, the other surface of the conductive sheet member is opposed to at least a part of the first molded portion via the conductive sheet member. Resin clogged by a part of the mold flows into a space formed by a part of the movable mold that is pressed away from the other surface of the conductive sheet member, and second molding is performed. Through the step of forming the part, before the conductive sheet member At least a part of the connecting part connected to the first exposed part exposed on the outer surface of the frame and the second exposed part exposed on the inner surface of the frame is formed by connecting the first molded part and the second part. The frame body sandwiched between the forming portions is formed, and the thickness of the first forming portion is formed thinner than the thickness of the second forming portion .

  According to the present invention, it is possible to simplify the configuration of parts for capacitance detection used in a developer container. In addition, it is possible to simplify the manufacturing process and the assembling process of parts for detecting capacitance used in the developer container.

Explanatory drawing of the process cartridge which has the image development apparatus concerning Example 1. FIG. 1 is an explanatory diagram of an image forming apparatus according to Embodiment 1. FIG. 1 is a perspective view of a developing device according to Embodiment 1. FIG. Sectional drawing of the image development apparatus shown about the outline | summary of the developer residual amount detection means based on Example 1. FIG. Explanatory drawing shown about the contact of the bearing which concerns on Example 1, and a residual amount detection member The perspective view shown about the contact of the residual amount detection member which concerns on Example 1. FIG. Sectional drawing which shows the connection part vicinity of the residual amount detection member which concerns on Example 1. FIG. Explanatory drawing using sectional drawing which shows the shaping | molding method of the connection part vicinity of the residual amount detection member which concerns on Example 1. FIG. Explanatory drawing which shows the shaping | molding state of the connection part vicinity of the residual amount detection member before and behind shape | molding the 2nd pinching shape part. Explanatory drawing explaining the relationship between the time of a contact part and a connection part periphery which concerns on Example 1, and temperature. Sectional drawing which shows the connection part vicinity of the residual amount detection member when the timing which moves the slide piece which is not related to a present Example is too early. Explanatory drawing which shows about the bearing and remaining amount detection member which are not related to a present Example Explanatory drawing explaining the relationship between the time and temperature around a contact part and a connection part at the time of not providing a thin shape in the 1st pinching shape part which is not related to a present Example The perspective view shown about the contact of the residual amount detection member at the time of providing thick shape in the resin inflow surface vicinity which concerns on Example 2. FIG. Explanatory drawing which shows the shaping | molding state of the connection part vicinity of the residual amount detection member before and behind shape | molding the 2nd pinching shape part which concerns on Example 2. FIG. Sectional drawing which shows the connection part vicinity of the residual amount detection member which concerns on Example 2. FIG. Explanatory drawing explaining the relationship between time and temperature at the time of providing thick shape in the resin inflow surface vicinity which concerns on Example 2. FIG. Sectional drawing which shows the connection part vicinity of the residual amount detection member which concerns on Example 3. FIG. Explanatory drawing explaining the relationship between time and temperature at the time of providing thick shape in the resin inflow surface vicinity which concerns on Example 3. FIG. Explanatory drawing for demonstrating the positional relationship of the slide, rib shape, and resin inflow surface concerning another Example.

[Example 1]
DETAILED DESCRIPTION Exemplary embodiments for carrying out the present invention will be described in detail below with reference to the drawings. However, the dimensions, materials, shapes, and relative arrangements of the components described in this embodiment should be appropriately changed according to the configuration of the apparatus to which the invention is applied and various conditions. It is not intended to limit the scope to the following embodiments. In the following description, the direction of the axis of rotation of the electrophotographic photosensitive drum, which is an image carrier, is the longitudinal direction.

  First, the configuration of the process cartridge A having the developing device according to the present embodiment and the image forming apparatus equipped with the process cartridge in a detachable manner will be described with reference to FIGS. 1 and 2. FIG. 1 is an explanatory diagram of a process cartridge having a developing device, and FIG. 2 is an explanatory diagram of an image forming apparatus that is detachably equipped with a process cartridge having a developing device.

  Here, the process cartridge includes an image carrier and process means acting on the image carrier. Examples of the process means include a charging means for charging the surface of the image carrier, a developing device for forming an image on the image carrier, and a developer (including toner, carrier, etc.) remaining on the surface of the image carrier. There is a cleaning means.

(Process cartridge configuration overview)
As shown in FIG. 1, the process cartridge A of this embodiment includes a charging roller 12 as a charging means around a photosensitive drum 11 as an image carrier, and a cleaner unit 34 having a cleaning blade 14 having elasticity as a cleaning means. It has. Further, the process cartridge A includes a developing device 39 having a developing roller 13, a developing blade 15, and a developer container 26 for containing the developer. The process cartridge A is configured such that the cleaner unit 34 and the developing device 39 are integrated, and is detachable from the image forming apparatus main body B as shown in FIG.

(Configuration outline of image forming apparatus)
The process cartridge A is mounted on an image forming apparatus main body B as shown in FIG. 2 and used for image formation. In the image forming apparatus, a sheet S serving as a recording medium such as paper is conveyed by a conveyance roller 207 from a sheet cassette 206 mounted at the lower part of the apparatus. In synchronization with this sheet conveyance, the photosensitive drum 11 is selectively exposed from the exposure device 208 to form a latent image. The developer supplied to the developing roller 13 (developer carrier) is carried on the surface of the developing roller 13 by a developing blade 15. Then, by applying a developing bias to the developing roller 13, a developer is supplied according to the latent image on the photosensitive drum 11 to develop the developer image. This image is transferred to the conveyed sheet S by applying a bias voltage to the transfer roller 209. After the sheet S is conveyed to the fixing device 210, the image is fixed, and the sheet S is discharged by a discharge roller 201 to a discharge unit 203 at the top of the device.

  Next, the developing device 39 and the second frame 18 will be described with reference to FIGS. 3, 4, and 5. 3 is a perspective view of the developing device, FIG. 4 is a cross-sectional view of the developing device showing an outline of the developer remaining amount detecting means, and FIG. 5 is an explanatory view showing contacts of the bearing and the remaining amount detecting member.

(Developer)
As shown in FIG. 3, the developing device 39 includes a developing roller 13, a developing blade 15, a first frame 17, a second frame 18, and bearings 20 and 25. The developer container 26 for storing the developer is formed by joining the first frame body 17 and the second frame body 18 and arranging bearings 20 and 25 at both ends in the longitudinal direction. Supports the developing roller 13 rotatably. Here, as shown in FIG. 5, an electrode member 21 is attached to the bearing 20.

(Developer remaining amount detection member)
As shown in FIG. 4, the second frame 18 has a conductive sheet member 24 (hereinafter referred to as a developer remaining amount detecting member containing a resin for detecting the developer amount using electrostatic capacity). , A remaining amount detecting member) is integrally formed. The remaining amount detecting member 24 includes a contact portion 24a that is a first exposed portion that comes into contact with the electrode member 21 and a detecting portion 24b that is a second exposed portion provided on a surface that comes into contact with the developer (an inner surface of the frame). Is provided.

  Here, the remaining amount detecting member 24 is formed of a conductive resin sheet, and in this embodiment, a resin sheet having a thickness of 0.1 mm was used. In addition, having the electrical conductivity described in the present embodiment means that the surface resistivity by the measuring method defined in JIS K 7194 is 10 kΩ / sq or less, and that having no electrical conductivity is from 10 kΩ / sq. It has a large surface resistivity. In addition, as a material for the second frame, polystyrene (PS) resin widely used for frames, parts, etc. is used, and as a material for a resin sheet having conductivity, ethylene black in which carbon black is dispersed is used. A vinyl acetate copolymer (EVA) resin was used. In the present embodiment, by using a molding method described later, an EVA resin is adhered to a PS resin by heat and pressure at the time of molding the second frame body, thereby providing a conductive resin sheet. The remaining amount detecting member 24 and the second frame 18 are formed integrally. However, the present invention is not limited to this, and other resin sheet thicknesses or combinations of resin materials may be used.

  More specifically, in this example, a 0.1 mm resin sheet was selected from the viewpoints of the influence on the deformation of the frame, the transferability to the frame shape, and the conductivity. You can choose. In addition, as the resin sheet material, the EVA-based resin having adhesiveness with the second frame material was selected, but the PS-based resin and the resin, which are the second frame material, melted, and the interface A compatible resin that can be integrated without any problem may be used as a material for the resin sheet. Resins that are compatible with PS resins include polystyrene (PS), acrylonitrile butadiene styrene (ABS), polyphenylene oxide (PPO) resins, and the like.

  In addition, the thermal deformation temperature (glass transition temperature) of the resin used in this example is about 90 ° C. for the polystyrene (PS) resin used for the second frame, and the remaining amount is a conductive resin sheet. The ethylene-vinyl acetate copolymer (EVA) resin used for the detection member was about 80 ° C. In addition, the heat deformation temperature of the second frame and the remaining amount detection member is an exemplification, and is not limited to this. The thermal deformation temperature of the resin forming the conductive sheet member (24) only needs to be lower than the thermal deformation temperature (about 90 ° C.) forming the frame (18).

(Developer remaining amount detection means)
Next, an outline of the developer remaining amount detecting means will be described with reference to FIG.

  Hereinafter, as a means for detecting the remaining amount of developer, a method of measuring the capacitance and detecting the remaining amount of developer (developer amount) will be described. The developing device 39 is provided with a remaining amount detecting member 24 as a capacitance detecting means. The remaining amount detection member 24 is electrically connected to the input unit 250 of the developer amount detection device 251 in the image forming apparatus via the electrode member 21.

  When an AC voltage is applied to the developing roller 13, a current corresponding to the electrostatic capacity between the developing roller 13 and the remaining amount detecting member 24 is induced. This electrostatic capacity changes in accordance with the amount of developer that occupies the space between the developing roller 13 and the detecting portion 24b of the remaining amount detecting member 24. The change in the electrostatic capacity is caused by a current value corresponding to the developer amount from the detection unit 24b of the remaining amount detection member 24 via the contact portion 24a of the remaining amount detection member 24 and the electrode member 21. The current value is output to the input unit 250. The developer amount between the developing roller 13 and the remaining amount detecting member 24 can be sequentially calculated based on the current value input to the developer amount detecting device 251.

  As shown in FIG. 4, the remaining amount detection member 24 is provided on the bottom surface of the second frame 18 in contact with the developer, so that the change in the developer amount between the developing roller 13 and the detection unit 24 b of the remaining amount detection member 24 is changed. Can know. In this embodiment, a change in electrostatic capacity from the time when the developer is consumed to some extent until the developer runs out is measured, and the remaining amount of the developer is notified to the user. However, the present invention is not limited to this, and the remaining amount of developer that can be detected varies depending on the arrangement of the remaining amount detection member, and may be appropriately disposed. Based on the detection result of the developer amount obtained by the developer remaining amount detecting means, for example, the user can be prompted to prepare a new process cartridge via the display means.

(Configuration around contact point and connecting part of remaining amount detection member)
Next, the configuration of the contact portion 24a and the connecting portion 24c of the remaining amount detecting member 24 will be described with reference to FIGS. Here, FIG. 6 is a perspective view showing the contact of the remaining amount detecting member, and FIG. 7 is a cross-sectional view taken along line AA of FIG. 6 showing the vicinity of the connecting portion of the remaining amount detecting member.

  As shown in FIG. 6, the remaining amount detection member 24 is formed integrally with the second frame 18, and the contact portion 24 a of the remaining amount detection member 24 is on the outer side in the longitudinal direction of the second frame 18. It was configured to be exposed on the surface opposite to the surface in contact with the developer (the outer surface of the frame). By adopting such a configuration, as shown in FIG. 5, the welding rib 18g for ultrasonically bonding the first frame 17 and the second frame 18 is avoided, and the remaining amount is left outside in the longitudinal direction. The contact portion 24a of the detection member 24 can be continuously connected. A contact portion 24 a of the remaining amount detection member 24 provided so as to protrude to one side in the longitudinal direction of the second frame 18 that is the developer container 26 is in contact with the electrode member 21 provided in the bearing 20. So that they are electrically connected. The electrode member 21 is provided with a leaf spring portion 21a, which is in contact with the contact portion 24a of the remaining amount detecting member 24 with a contact pressure of about 120 gf. Further, the input portion 250 of the developer amount detection device is also provided with a spring portion 250a, and is in contact with the electrode member 21 with a contact pressure of about 120 gf. As described above, the contact portion 24a of the remaining amount detection member 24 is provided on the outer side in the longitudinal direction of the portion where the developer is accommodated, and the contact portion 24a is the electrode member 21 and the electrode member 21 is the input portion of the developer amount detection device. 250 and contact with a contact pressure. As a result, a stable electrical connection is achieved.

  Next, with reference to FIG. 7, a configuration for allowing the contact portion 24a of the remaining amount detection member 24 to be exposed on the outer surface of the second frame 18 that is the surface opposite to the surface in contact with the developer will be described. explain.

  As shown in FIG. 7, the remaining amount detecting member 24 has a connecting portion 24 c sandwiched between the second frame 18 between the contact portion 24 a and the detecting portion 24 b. In FIG. 7, the range of L1 is the contact portion 24a, the range of L2 is the connecting portion 24c, and the range of L3 is the detecting portion 24b.

  The second frame 18 has a second sandwiched shape portion 18a, which is a second molded portion, on the surface side in contact with the developer, and the surface in contact with the developer is the first molded portion on the back surface side. It has the 1st pinching shape part 18b. The connecting portion 24c is integrally formed inside the frame body with at least a part thereof being sandwiched between the first sandwiching shape portion 18b and the second sandwiching shape portion 18a.

  Here, the first sandwiching shape portion 18b is configured such that the thickness t2 is thinner than the thickness t1 of the second frame 18 around the connection portion 24c. In the present embodiment, the thickness t1 of the second frame 18 around the connecting portion 24c is 1.5 mm (the portion where the connecting portion 24c of the remaining amount detecting member 24 is provided is 1.4 mm). On the other hand, the thickness t2 of the first sandwiched shape portion 18b was 0.5 mm.

  Next, a method for forming a frame around the detection portion 24b, the contact portion 24a, and the connection portion 24c of the remaining amount detection member 24 will be described with reference to FIGS. 7, 8, 9, and 10. FIG. FIG. 8 is an explanatory view using the AA cross-sectional view of FIG. 6 showing a molding method in the vicinity of the connecting portion of the remaining amount detecting member. FIG. 8A is an explanatory diagram of the state before the injection of resin from the injection portion starts, and FIG. 8B is the state before the injection of the resin starts from the injection portion and the second sandwiched shape portion is molded. FIG. 8C is an explanatory diagram of the state after the second sandwiching shape portion is formed. FIG. 9 is an explanatory view using the BB cross-sectional view of FIG. 6 showing a molding state in the vicinity of the connecting portion of the remaining amount detecting member before and after the second sandwiching shape portion is molded. FIG. 9A is an explanatory diagram of a state before the second sandwiching shape portion is molded, and FIG. 9B is an explanatory diagram of a state after the second sandwiching shape portion is molded. FIG. 10 is an explanatory diagram for explaining the relationship between time and temperature around the contact portion and the connecting portion.

(Forming method around the detection part of the remaining amount detection member)
As shown in FIG. 8A, the remaining amount detection member 24 is attached to the molds 100 and 101 for forming the second frame 18. In this embodiment, the remaining amount detecting member 24 is attached to one mold 100 by suction in the direction of the arrow E3. Next, as shown in FIG. 8B, the other mold 101 is moved in the mold clamping direction E1. In this way, the remaining amount detecting member 24 is interposed between the molds 100 and 101. And in order to shape | mold the 2nd frame 18, resin is inject | poured from the injection | pouring part G, and resin is inject | poured between the residual amount detection member 24 and the type | molds 100 and 101. FIG. In this way, the second frame 18 around the detection unit 24b is formed.

(Forming method around contact point and connecting part of remaining amount detection member)
As shown in FIG. 8B, when the molding of the second frame 18 around the detection part 24b proceeds, the molding around the contact part 24a and the connection part 24c is performed. Here, as shown in FIG. 7, it is necessary to expose the contact portion 24 a to the back surface of the contact portion 24 a with the developer in a state where the connecting portion 24 c of the remaining amount detecting member 24 is not broken and the elongation is suppressed. In order to mold in such a configuration, a movable slide piece 103 is provided in a part of one mold 100. The slide piece 103 is indicated by a one-dot chain line in FIGS. Here, a part of the slide piece 103 is provided with a fixing portion 103a having a width L4 in order to fix the remaining amount detecting member 24 by being sandwiched between the other mold 101.

  The second frame 18 is molded from the injection part G in a state where the slide piece 103 is fixed by sandwiching the remaining amount detection member 24 with the other mold 101 at the position as shown in FIG. Injection begins. When molding of the second frame 18 starts, the second frame 18 around the detection unit 24b is formed. Further, as shown in FIG. 8B, the molding around the connecting portion 24c also proceeds, and the first sandwiched shape portion 18b is formed on one surface side of the connecting portion 24c. Then, the second frame 18 is formed while the contact portion 24a is pressed against the other die 101 by fixing the remaining amount detecting member 24 to the other die 101 by the fixing portion 103a. In this way, the second frame 18 is molded. In this embodiment, the width L4 of the fixed portion 103a is 1.0 mm.

  As shown in FIG. 8C, when the molding around the connecting portion 24c of the remaining amount detecting member 24 is completed to some extent, the slide piece 103 is moved away from the other surface of the connecting portion 24c (in the direction of arrow E4). Move. At this time, as shown in FIG. 9 (b), the resin flows in the direction of arrow E5 from the resin inflow surface 18c shown in FIG. 9 (a) into the space (space) created by moving the slide piece 103. That is, the resin clogged by the slide piece 103 flows into a space formed by separating the slide piece 103 that has been holding the other surface of the connecting portion 24c away from the other surface of the connecting portion 24c. Thus, the second sandwiching shape portion 18a is formed so as to face at least a part of the first sandwiching shape portion 18b via the remaining amount detection member 24 (connecting portion 24c). Here, as shown in FIG. 6 and FIG. 9B, the surface on the side close to the injection portion G in the longitudinal direction on the surface in contact with the slide piece 103 in the second frame 18 around the connecting portion 24c. The resin inflow surface 18c is used. The timing of moving the slide piece 103 is a timing at which the first sandwiched shape portion 18b is solidified and the shape portion 18c1 around the resin inflow surface 18c, which is the second frame 18 around the connecting portion 24c, is not solidified. is there. Solidification in the present embodiment means that the solidification temperature of the PS-based resin that is the material of the second frame 18 is about 90 ° C.

  FIG. 10 is a table showing the relationship between the temperature around the contact portion 24a and the connecting portion 24c of the second frame 18 on the vertical axis and the time from the start of molding of the second frame 18 on the horizontal axis. is there. The origin of the table is 0 s, which is 35 ° C. which is the mold surface temperature during production on the vertical axis and 0 s which is the timing at which the injection part G opens on the horizontal axis and resin injection starts. The relationship between temperature and time is indicated by a one-dot chain line 50 for the first sandwiched shape portion 18b and a two-dot chain line 51 for the shape portion 18c1 around the resin inflow surface 18c. As shown by the thickness t2 in FIGS. 7 and 9, the first sandwiched shape portion 18b has a thinner shape than the thickness t1 of the second sandwiched shape portion 18a, so that the heat capacity of the shape portion is small. Easy to be cooled. Since the shape portion 18c1 around the resin inflow surface 18c is not made thinner than the first sandwich shape portion 18b as shown by the thickness t1 in FIGS. 7 and 9, the heat capacity is higher than that of the first sandwich shape portion 18b. Is large and cooling is delayed. For this reason, after the first sandwiched shape portion 18b is cooled to the solidification temperature, a time difference T1 is produced until the resin inflow surface 18c is cooled to the solidification temperature. By moving the slide piece 103 within this time difference T1, as shown in FIG. 9, the resin flows into the space created by moving the slide piece 103 from the unsolidified resin inflow surface 18c. The sandwiched shape portion 18a is formed. At this time, the connecting portion 24c is fixed to the already sandwiched first sandwiched portion 18b by the adhesiveness of the resin sheet. Therefore, the second sandwiching shape portion 18a is formed while the remaining amount detecting member 24, which is a resin sheet, is pressed against the first sandwiching shape portion 18b by the resin flowing from the resin inflow surface 18c that is not solidified.

  Here, as shown in FIG. 8, a fixing portion 103 a having a width L <b> 4 is provided in a part of the slide piece 103 in order to fix the remaining amount detection member 24 by sandwiching it with the other mold 101. Therefore, the second sandwiching shape portion 18a and the contact portion 24a of the remaining amount detecting member 24 are molded in an overlapping state within the range of the width L4 in FIG.

  In this way, not only the detection portion 24b of the remaining amount detection member 24 is provided on the surface in contact with the developer, but also the contact portion 24a is in contact with the developer in a state in which the connecting portion 24c is not broken and the elongation is suppressed. Can be provided on the back surface.

  Next, a case where the first sandwiching shape portion 18b that sandwiches the connecting portion 24c of the remaining amount detecting member 24 cannot be molded with respect to the present embodiment will be described as a comparative example with reference to FIGS. . 11 is a cross-sectional view taken along line AA of FIG. 6 showing the vicinity of the connecting portion of the remaining amount detection member when the timing of moving the slide piece is too early. FIG. 13 is an explanatory diagram for explaining the relationship between time and temperature around the contact portion and the connecting portion when the first sandwiched shape portion is not provided with a thin shape.

(Example when the shape that sandwiches the connecting part of the remaining amount detection member cannot be molded)
As a first example, an example in which the timing for moving the slide piece 103 is too early will be described. The timing when the slide piece 103 is moved is too early is when the slide piece 103 is moved during a time T2 earlier than the timing when the first sandwiching shape portion 18b shown in FIG. 10 is solidified. As shown in FIG. 11, if the timing of moving the slide piece 103 is too early, the first sandwiching shape portion 18b is not solidified. Therefore, the resin flows into the space created by moving the slide piece 103 not only from the resin inflow surface 18c but also from the first sandwiching shape portion 18b. The detection unit 24 b is fixed by being sandwiched between one mold 100 and the second frame 18, and a part of the connection part 24 c of the remaining amount detection member 24 is sandwiched between the fixing unit 103 a of the slide piece 103 and the other mold 101. Is fixed. If a resin flow in the direction of arrow E6 occurs in the connecting portion 24c in the meantime, the connecting portion 24c, which is a resin sheet, is extended and may be broken. If the remaining amount detection member 24 is extended, the conductivity deteriorates and the change in capacitance cannot be measured accurately. In addition, if it breaks, the conductivity is lost, so that the capacitance cannot be detected. As described above, when the timing of moving the slide piece 103 is too early, the resin flows into the space created by moving the slide piece 103 not only from the resin inflow surface 18c but also from the first sandwiching shape portion 18b. Thereby, the connection part 24c which is a resin sheet is extended, and there exists a possibility that it may fracture | rupture further.

  Next, an example in which the timing for moving the slide piece 103 is too late will be described. The timing for moving the slide piece 103 is too late when the slide piece 103 is moved during a time T3 that is later than the timing at which the resin inflow surface 18c shown in FIG. 10 is solidified. If the timing of moving the slide piece 103 is too late, even if a space is created by moving the slide piece 103, the resin inflow surface 18c is also solidified, so that the resin does not flow in. Therefore, the 2nd pinching shape part 18a cannot be shape | molded.

  Next, an example will be described in which a thin shape is not provided in the first sandwiching shape portion 18b. A dotted line 52 shown in FIG. 13 represents a relationship between time and temperature when the first sandwiched shape portion 18b is not provided with a thin shape. Since there is no thin shape, there is almost no time difference T4 until it is cooled to the solidification temperature of the two-dot chain line 51 of the resin inflow surface 18c with respect to the time when the dotted line 52 of the first sandwiching shape portion 18b is cooled to the solidification temperature. Does not occur. For this reason, there is a possibility that the shape of sandwiching the connecting portion 24c of the remaining amount detecting member 24 described above cannot be molded due to variations in the arrival time and temperature of the resin, variations in temperature, variations in operation of the slide piece, and the like.

  Thus, if the thickness t2 is provided in the first sandwiched shape portion 18b so as to be thinner than the peripheral thickness t1, and the slide piece 103 is not moved within an appropriate timing T1, the connecting portion 24c of the remaining amount detecting member 24 is provided. The shape portions 18a and 18b sandwiching the shape cannot be stably molded.

(Effect in the present embodiment)
As described above, first, in the step of forming the second frame 18, the first sandwiched shape portion 18b having a thickness t2 that is thinner than the peripheral thickness t1 is formed. Next, the slide piece 103 is moved within an appropriate timing T1, and the second sandwiching shape portion 18a is formed.

  Thus, by adopting the configuration and the molding process according to the present embodiment, not only the detection portion 24b of the remaining amount detection member 24 is provided on the surface in contact with the developer, but also the connection portion 24c is not broken and the elongation is suppressed. In this state, the contact portion 24a can be provided on the back surface from the surface in contact with the developer.

  That is, according to the present embodiment, it is possible to simplify the configuration around the parts for capacitance detection, simplify the manufacturing process and the assembly process, and detect the capacitance used in the developer container. The cost can be reduced.

  More specifically, as shown in FIG. 12, conventionally, when assembling a remaining amount detecting member for detecting capacitance, it is necessary to provide a remaining amount detecting member 94 and a contact member 95, respectively. FIG. 12 is an explanatory diagram showing the bearing and the remaining amount detection member. Further, when the contact portion 95a is provided on the outer side in the longitudinal direction while avoiding the welding rib 98g for ultrasonic bonding of the first frame body 97 and the second frame body 98, the second frame body 98 and the contact member. It is necessary to provide the sealing member 91 between 95. Thus, it was necessary to assemble the remaining amount detection member as a plurality of parts. However, with the configuration according to the present embodiment, these steps can be simplified, and the cost can be reduced.

[Example 2]
A method for forming a contact portion and a connecting portion of a remaining amount detecting member used in a process cartridge that can be attached to and detached from the image forming apparatus according to the second embodiment will be described. In the first embodiment, a molding method in which a thin shape is provided in the first sandwiching shape portion and a slide piece is moved within an appropriate time after injecting resin for molding the second frame is illustrated. On the other hand, the second embodiment is a molding method in which a thin shape (rib shape 28d) is provided on the resin inflow surface 28c without providing a thin shape on the first sandwiched shape portion 28b. Hereinafter, the second frame forming method of the present embodiment will be described with reference to FIGS. 14, 15, 16, and 17. The configuration of the cartridge, the image forming apparatus, the developer remaining amount detecting unit, and the configuration of the second frame body in which the remaining amount detecting member is integrally formed are the same as those in the first embodiment. It is the same composition. Therefore, in the present embodiment, a configuration different from that of the first embodiment will be described.

  In the following description, 103 is a slide piece, 28 is a second frame, 28a is a second sandwiching shape part, 28b is a first sandwiching shape part, 28c is a resin inflow surface, and 28d is a rib shape. . In addition, the same code | symbol is attached | subjected about the member similar to Example 1 mentioned above.

  FIG. 14 is a perspective view showing a contact of the remaining amount detection member when a thick shape is provided in the vicinity of the resin inflow surface. FIGS. 15A, 15B and 15C are explanatory views showing a molding state in the vicinity of the connecting portion of the remaining amount detecting member before and after the second sandwiching shape portion is molded. 16 is a cross-sectional view taken along the line AA of FIG. 14 showing the vicinity of the connecting portion of the remaining amount detecting member. FIG. 17 is an explanatory diagram for explaining the relationship between time and temperature when a thick shape is provided near the resin inflow surface.

(Configuration around contact point and connecting part of remaining amount detection member)
With respect to the wall thickness t3 of the second frame body 28 around the connecting portion 24c shown in FIG. 16, as shown in FIG. A rib shape 28d as a thick portion was provided at a position adjacent to the sandwiching shape portion 28a. Further, as shown in FIG. 16, the first sandwiched shape portion 28b does not have the thin shape as in the first embodiment, and has the same thickness t3 as the periphery. In the present embodiment, the thickness of the first sandwich-shaped portion 28b is 1.5 mm, which is the same as the surrounding thickness (the portion where the remaining amount detecting member 24 is provided is 1.4 mm). The rib shape 28d has a longitudinal width w1 shown in FIG. 15 of 2.0 mm and a height h1 shown in FIG. 16 of 2.0 mm.

(Relationship between the resin inflow surface and the first sandwiched part)
Similar to the first embodiment, the contact portion 24a is exposed to the back surface of the contact portion 24a with the developer in a state where the connecting portion 24c of the remaining amount detecting member 24 is not broken and the elongation is suppressed.

  Therefore, as shown in FIG. 16, when the molding around the connecting portion 24c of the remaining amount detecting member 24 is completed to some extent, the slide piece 103 is separated from the other surface of the connecting portion 24c as in the first embodiment. It moves to (arrow E4 direction), and the 2nd pinching shape part 28a is formed. Here, the timing at which the slide piece 103 is moved is the timing at which the first sandwiching shape portion 28b is solidified and the resin inflow surface 28c that is the second frame around the connecting portion 24c is not solidified. Accordingly, as in the first embodiment, the resin blocked by the slide piece 103 flows into the space formed by separating the slide piece 103 from the other surface of the connecting portion 24c, and the second sandwiching shape portion 28a. Is formed.

  FIG. 17 is a table showing the relationship between the temperature around the contact portion and the connecting portion of the second frame on the vertical axis and the time from the start of molding of the second frame 28 on the horizontal axis. In FIG. 17, the dotted line 52 is a line showing the relationship between the temperature and time of the first sandwiching shape portion 28 b that is not provided with a thin shape. An alternate long and two short dashes line 51 is a line showing the relationship between the temperature and time of the resin inflow surface 18c not provided with the rib shape shown in the first embodiment. A solid line 53 is a line showing the relationship between the temperature and time of the resin inflow surface 28c provided with the rib shape 28d shown in the present embodiment.

  By providing the rib shape 28d around the resin inflow surface 28c, the heat capacity around the resin inflow surface 28c is increased, and the cooling of the resin inflow surface 28c is delayed. The time until the dotted line 52 of the first sandwiched shape portion 28b not provided with the thin-walled shape is cooled to the solidification temperature until it is cooled to the solidification temperature of the solid line 53 of the resin inflow surface 28c provided with the rib shape 28d. The time difference is T5.

  By adopting such a configuration, it is possible to provide a longer time difference T5 with respect to the time difference T4 when the first sandwiched shape portion 28b is not provided with a thin shape and the resin inflow surface 28c is not provided with a rib shape. It becomes. Therefore, even if the arrival time of the resin, the temperature variation, the movement variation of the slide piece, and the like occur as described above, the second sandwiching shape portion 28a is moved by moving the slide piece 103 within the time difference T5. Can be molded. As shown in FIG. 16, the resin flows into the space created by moving the slide piece 103 from the resin inflow surface 28c provided with the non-solidified rib shape 28d, and the second sandwiching shape portion 28a is formed.

  As described above, effects similar to those of the first embodiment can be obtained by adopting the configuration and the molding process according to the present embodiment. That is, also in this embodiment, it is possible to simplify the structure around the parts for capacitance detection, simplify the manufacturing process and the assembly process, and to detect the capacitance used in the developer container. Cost can be reduced.

Example 3
In Example 3, the same effect can be obtained with a configuration in which a thin shape is provided in the first sandwiched shape portion and a thick shape (rib shape 38d) is provided in the resin inflow surface 38c, as shown in FIG. This will be described with reference to FIG. In this embodiment, a configuration different from the above-described embodiment will be described. 18 is a cross-sectional view taken along line AA of FIG. 14 showing the vicinity of the connecting portion of the remaining amount detecting member. FIG. 19 is an explanatory diagram for explaining the relationship between time and temperature when a thick shape is provided near the resin inflow surface.

  In the following description, 103 is a slide piece, 38 is a second frame, 38a is a second sandwiching shape portion, 38b is a first sandwiching shape portion, 38c is a resin inflow surface, and 38d is a rib shape. . In addition, the same code | symbol is attached | subjected about the member similar to Example 1 mentioned above.

(Configuration around contact point and connecting part of remaining amount detection member)
As shown in FIG. 18, with respect to the second frame body 38 around the connecting portion 24c, the thickness is increased at a position adjacent to the second sandwiched shape portion 38a so that the vicinity of the resin inflow surface 38c has a thick shape. A rib shape 38d as a portion was provided. In addition, the first sandwiching shape portion 38b has a thin shape (thickness t5) with respect to the thickness t4 of the second frame 38 around the connecting portion 24c. In the present embodiment, the thickness t4 of the second frame 38 around the connecting portion 24c is nominally 1.5 mm (the portion where the remaining amount detecting member 24 is provided is 1.4 mm). The wall thickness t5 of the first sandwiched shape portion 38b was 0.5 mm by name. Further, a rib shape 38d having a longitudinal width w2 shown in FIG. 15 of 2.0 mm and a height h2 shown in FIG.

(Relationship between the resin inflow surface and the first sandwiched part)
In the same manner as in the first and second embodiments, the contact portion 24a is exposed on the back surface from the surface in contact with the developer in a state where the connecting portion 24c of the remaining amount detecting member 24 is not broken and the elongation is suppressed.

  Therefore, as shown in FIG. 18, when the molding around the connecting portion 24c of the remaining amount detecting member 24 is completed to some extent, the slide piece 103 is separated from the other surface of the connecting portion 24c in the same manner as in the first embodiment. It moves to (arrow E4 direction), and the 2nd pinching shape part 38a is shape | molded. Here, the timing at which the slide piece 103 is moved is the timing at which the first sandwiching shape portion 38b is solidified and the resin inflow surface 38c which is the second frame around the connecting portion 24c is not solidified. Accordingly, as in the first embodiment, the resin blocked by the slide piece 103 flows into the space formed by separating the slide piece 103 from the other surface of the connecting portion 24c, and the second sandwiched shape portion 38a. Is formed.

  FIG. 19 is a table showing the relationship between the temperature around the contact portion 24a and the connecting portion 24c of the second frame 38 on the vertical axis and the time from the start of molding of the second frame 38 on the horizontal axis. is there.

  In FIG. 19, as described in the first embodiment and the second embodiment, the first sandwiched shape portion 38b is provided with a thin shape (thickness t5). Thereby, as shown with the dashed-dotted line 52 to the dashed-dotted line 50, the time until the 1st pinching shape part 38b is cooled and solidified after shaping | molding can be shortened. Further, by providing the rib shape 38d on the resin inflow surface 38c, as indicated by the two-dot chain line 51 to the solid line 53, it is possible to delay the time until the resin inflow surface 38c is cooled and solidified after being molded. Thus, a longer time difference T6 can be provided by combining a configuration in which a thin shape (thickness t5) is provided in the first sandwiched shape portion 38b and a rib shape 38d is provided in the resin inflow surface 38c.

  In this example, the time difference T4 when the thin shape was not provided in the first sandwiched shape portion and the rib shape was not provided on the resin inflow surface was approximately 0.1 s, and stable molding conditions were not obtained. .

  By adopting the configuration described in the present embodiment for such a configuration, it was possible to provide about 1.0 s as the time difference T6. Therefore, even if the arrival time or temperature of the resin reaches the molding part as described above, the movement of the slide piece, and the variation due to the increase in the number of pieces taken in the same mold during mass production, the second Can be formed stably.

  As described above, the same effects as those of the first and second embodiments can be obtained by adopting the configuration and the molding process according to the present embodiment. That is, also in this embodiment, it is possible to simplify the structure around the parts for capacitance detection, simplify the manufacturing process and the assembly process, and to detect the capacitance used in the developer container. Cost can be reduced.

[Other Examples]
As another embodiment, it will be described with reference to FIG. 20 that the same effect can be obtained even if a rib shape 48d which is a thick portion is provided at a position close to the second molding portion 48a. FIG. 20 is an explanatory diagram for explaining the positional relationship between the slide, the rib shape, and the resin inflow surface.

  FIG. 20A is an explanatory diagram in the case where a rib shape 38d as a thick portion is provided at a position adjacent to the second sandwiching shape portion 38a described in the third embodiment. The connecting portion 24c is sandwiched between the first sandwiching shape portion 38b and the second sandwiching shape portion 38a. FIG. 20B is not a configuration in which the rib shape 38d is provided on the resin inflow surface 38c described in the third embodiment, but a rib shape 48d as a thick portion is provided at a position close to the second molding portion 48a with a gap. FIG. A rib shape 48d is provided at a position of thickness 2 × t6 or less with respect to the thickness t6 in the vicinity of the resin inflow surface 48c. Even if the rib shape 48d is provided at such a position, the heat capacity around the resin inflow surface 48c can be increased and the cooling can be delayed. For example, by increasing the base width w2 of the rib shape 48d, the heat capacity around the resin inflow surface 48c can be further increased, and the cooling can be further delayed.

  Moreover, the same effect can be acquired also by setting it as the structure which provides a heater in a slide piece as another Example. 8 may be provided with a cooling unit (not shown) and a heater (not shown) in the slide piece 103 of the other die 100. Further, the material of the mold 101 and the slide piece 103 may be a metal having good thermal conductivity. By adopting such a configuration, the first sandwiching shape portion 38b can be more easily cooled, and the resin inflow surface 38c in contact with the slide piece 103 can be cooled and solidified.

  In the above-described embodiments, the developer container used in the process cartridge having the developing device has been described. However, the present invention is not limited to this. It may be a developer container used in the developing device, a developer container used in the image forming apparatus, or a developer container containing a developer that can be attached to and detached from the image forming apparatus. In forming the frames constituting these developer containers, the same effect can be obtained by applying the present invention.

  In the above-described embodiment, as a process cartridge that is detachable from the main body of the image forming apparatus, a process that integrally includes a photosensitive drum and a charging unit, a developing unit, and a cleaning unit as a process unit that acts on the photosensitive drum. A cartridge was illustrated. However, it is not limited to this. For example, in addition to the photosensitive drum and the developing unit, a process cartridge that integrally includes any one of a charging unit and a cleaning unit may be used.

  In the above-described embodiments, the printer is exemplified as the image forming apparatus, but the present invention is not limited to this. For example, the image forming apparatus may be another image forming apparatus such as a copying machine or a facsimile machine, or another image forming apparatus such as a multi-function machine combining these functions. Alternatively, an image forming apparatus that uses a recording medium carrier and sequentially superimposes and transfers the toner images of the respective colors onto the recording medium carried on the recording medium carrier. Alternatively, an image forming apparatus that uses an intermediate transfer member, sequentially transfers toner images of each color on the intermediate transfer member, and collectively transfers the toner images carried on the intermediate transfer member onto a recording medium. Also good. The same effect can be obtained by applying the present invention to a developer container used in these image forming apparatuses.

A ... Process cartridge B ... Image forming apparatus main body 11 ... Photosensitive drum 13 ... Developing roller 17 ... First frame 18 ... Second frame 18a ... Second sandwiching shape portion 18b ... First sandwiching shape portion 20 , 25 ... Bearing 21 ... Electrode member 21a ... Leaf spring part 24 ... Remaining amount detection member 24a ... Contact part 24b ... Detection part 24c ... Connection part 26 ... Developer container 39 ... Developing device 100, 101 ... Mold 103 ... Slide piece 103a ... fixed part 250 ... input part 250a ... spring part 251 ... developer amount detection device

Claims (9)

A frame for containing the developer;
A conductive sheet member containing a resin for detecting the developer amount using capacitance;
A developer container comprising:
In the step of injecting resin between the molds interposing the conductive sheet member to mold the frame,
Forming a first molding part on one surface side of the conductive sheet member;
After forming the first molded portion, the movable sheet member is movable while pressing the other surface of the conductive sheet member so as to face at least a part of the first molded portion via the conductive sheet member. A step of forming a second molded portion by the flow of the resin blocked by a part of the mold into a space formed by separating a part of the mold from the other surface of the conductive sheet member; ,
Through
At least a part of the connection portion of the conductive sheet member connected to the first exposed portion exposed on the outer surface of the frame body and the second exposed portion exposed on the inner surface of the frame body, Molding the frame sandwiched between the molding part and the second molding part,
A method for producing a developer container, wherein the thickness of the first molded part is formed thinner than the thickness of the second molded part. A frame for containing the developer;
A conductive sheet member containing a resin for detecting the developer amount using capacitance;
A developer container comprising:
In the step of injecting resin between the molds interposing the conductive sheet member to mold the frame,
Forming a first molding part on one surface side of the conductive sheet member;
After forming the first molded portion, the movable sheet member is movable while pressing the other surface of the conductive sheet member so as to face at least a part of the first molded portion via the conductive sheet member. A step of forming a second molded portion by the flow of the resin blocked by a part of the mold into a space formed by separating a part of the mold from the other surface of the conductive sheet member; ,
Through
At least a part of the connection portion of the conductive sheet member connected to the first exposed portion exposed on the outer surface of the frame body and the second exposed portion exposed on the inner surface of the frame body, Molding the frame sandwiched between the molding part and the second molding part,
A thick part is provided in a part in contact with or adjacent to the second molding part so that a part in contact with or close to the second molding part is thicker than the first molding part. A developer container manufacturing method, comprising: providing a developer container;   3. The method for manufacturing a developer container according to claim 1, wherein a heat deformation temperature of a resin forming the conductive sheet member is lower than a heat deformation temperature forming the frame body.   4. The developer container manufacturing method according to claim 1, wherein a heater is provided in a part of the movable mold that holds down the other surface of the connecting portion. 5. Method.   The method for manufacturing a developer container according to any one of claims 1 to 4, wherein the mold and a part of the mold are a metal having good thermal conductivity. A developer carrier for developing a developer image by supplying a developer to the image carrier;
A frame for containing the developer;
A conductive sheet member containing a resin for detecting the developer amount using capacitance;
A developing device manufacturing method comprising:
In the step of injecting resin between the molds interposing the conductive sheet member to mold the frame,
Forming a first molding part on one surface side of the conductive sheet member;
After forming the first molded portion, the movable sheet member is movable while pressing the other surface of the conductive sheet member so as to face at least a part of the first molded portion via the conductive sheet member. A step of forming a second molded portion by the flow of the resin blocked by a part of the mold into a space formed by separating a part of the mold from the other surface of the conductive sheet member; ,
Through
At least a part of the connection portion of the conductive sheet member connected to the first exposed portion exposed on the outer surface of the frame body and the second exposed portion exposed on the inner surface of the frame body, Molding the frame sandwiched between the molding part and the second molding part,
A developing device manufacturing method, wherein the thickness of the first molding part is made thinner than the thickness of the second molding part. A developer carrier for developing a developer image by supplying a developer to the image carrier;
A frame for containing the developer;
A conductive sheet member containing a resin for detecting the developer amount using capacitance;
A developing device manufacturing method comprising:
In the step of injecting resin between the molds interposing the conductive sheet member to mold the frame,
Forming a first molding part on one surface side of the conductive sheet member;
After forming the first molded portion, the movable sheet member is movable while pressing the other surface of the conductive sheet member so as to face at least a part of the first molded portion via the conductive sheet member. A step of forming a second molded portion by the flow of the resin blocked by a part of the mold into a space formed by separating a part of the mold from the other surface of the conductive sheet member; ,
Through
At least a part of the connection portion of the conductive sheet member connected to the first exposed portion exposed on the outer surface of the frame body and the second exposed portion exposed on the inner surface of the frame body, Molding the frame sandwiched between the molding part and the second molding part,
A thick part is provided in a part in contact with or adjacent to the second molding part so that a part in contact with or close to the second molding part is thicker than the first molding part. A developing device manufacturing method comprising: a developing device; An image carrier;
A developer carrier for developing a developer image by supplying a developer to the image carrier;
A frame for containing the developer;
A conductive sheet member containing a resin for detecting the developer amount using capacitance;
A process cartridge manufacturing method comprising:
In the step of injecting resin between the molds interposing the conductive sheet member to mold the frame,
Forming a first molding part on one surface side of the conductive sheet member;
After forming the first molded portion, the movable sheet member is movable while pressing the other surface of the conductive sheet member so as to face at least a part of the first molded portion via the conductive sheet member. A step of forming a second molded portion by the flow of the resin blocked by a part of the mold into a space formed by separating a part of the mold from the other surface of the conductive sheet member; ,
Through
At least a part of the connecting portion of the conductive sheet member connected to the first exposed portion exposed on the outer surface of the frame body and the second exposed portion exposed on the inner surface of the frame body, Molding the frame sandwiched between one molded part and the second molded part,
A process cartridge manufacturing method, wherein the thickness of the first molding part is formed thinner than the thickness of the second molding part. An image carrier;
A developer carrier for developing a developer image by supplying a developer to the image carrier;
A frame for containing the developer;
A conductive sheet member containing a resin for detecting the developer amount using capacitance;
A process cartridge manufacturing method comprising:
In the step of injecting resin between the molds interposing the conductive sheet member to mold the frame,
Forming a first molding part on one surface side of the conductive sheet member;
After forming the first molded portion, the movable sheet member is movable while pressing the other surface of the conductive sheet member so as to face at least a part of the first molded portion via the conductive sheet member. A step of forming a second molded portion by the flow of the resin blocked by a part of the mold into a space formed by separating a part of the mold from the other surface of the conductive sheet member; ,
Through
At least a part of the connection portion of the conductive sheet member connected to the first exposed portion exposed on the outer surface of the frame body and the second exposed portion exposed on the inner surface of the frame body, Molding the frame sandwiched between the molding part and the second molding part,
A thick part is provided in a part in contact with or adjacent to the second molding part so that a part in contact with or close to the second molding part is thicker than the first molding part. A method of manufacturing a process cartridge, comprising:

Images