JP6507706B2 - Method of manufacturing mold for nanoimprint - Google Patents

Description

  The present invention relates to a method for producing a mold for nanoimprinting having on its surface a fine uneven structure composed of a plurality of pores.

  In recent years, an article such as a film having on its surface a fine concavo-convex structure with a period equal to or less than the wavelength of visible light is known to exhibit an antireflective effect, a lotus effect, and the like. In particular, a concavo-convex structure called a moth-eye structure is known to be an effective means of anti-reflection by continuously increasing the refractive index from the refractive index of air to the refractive index of the material of the article.

  As a method of forming a fine concavo-convex structure on the surface of an article, using a mold (mold) on which the reverse structure of the fine concavo-convex structure is formed on the surface, curing is possible between the mold and the article main body (substrate) A method (nanoimprinting method) of supplying and curing a resin composition and transferring the microrelief structure of a mold to the surface of an article body has attracted attention.

  As a method of manufacturing a mold for nanoimprinting, a step of anodizing an aluminum substrate with an electrolytic solution to form an oxide film having pores, and a step of enlarging pores of the oxide film by etching are alternately performed. There is known a method of repeatedly forming an oxide film having a plurality of pores (recesses) on the surface of an aluminum base (for example, Patent Documents 1 and 2).

Patent No. 4617402 International Publication No. 2008/001847

As a method of grinding | polishing the whole outer peripheral surface of a roll-shaped aluminum base material, the method shown below is considered, for example.
As shown in FIG. 5, while the polishing body 116 is pressed against and rubbed against the outer peripheral surface 114 of the roll-shaped aluminum substrate 112 rotated about the axis by the rotation shaft 110, the first axial direction of the aluminum substrate 112 is A method of axially moving the polishing body 116 in the range from the end 112a to the second end 112b.

Moreover, the roll-shaped aluminum base material before grinding is processed into a predetermined shape from the aluminum block by machining such as cutting, and it is necessary to finish the outer peripheral surface to a mirror surface by grinding. As a polishing method for finishing the machined outer peripheral surface to a mirror surface, it is preferable to use a polishing method having a relatively high polishing rate, since it is necessary to remove the rough shape of the surface formed by machining, In some cases, chemical mechanical polishing (CMP polishing) is used in which mechanical polishing is performed while the surface of the material is dissolved.

In CMP polishing, abrasive grains are used, but it is difficult to form an oxide film having a recess of a desired shape if anodizing treatment and etching treatment are carried out with the abrasive grains attached to the surface of the aluminum base In some cases, the abrasive grains and the polishing liquid may contaminate the anodizing equipment to impair the function of the equipment. Therefore, it is necessary to remove the abrasive grains, the polishing liquid, and the like used for the CMP polishing from the surface of the aluminum substrate before performing the anodic oxidation treatment, the etching treatment and the like. However, the present inventors have found that once the surface of the aluminum substrate is dried, it is difficult to remove the abrasive grains and the like from the surface of the aluminum substrate by the conventionally known cleaning method. When the roll-shaped aluminum substrate is subjected to CMP, while the aluminum substrate is rotated, the polishing body is pressed against the aluminum substrate and the polishing body is moved along the central axis direction of the aluminum substrate while being aluminum-based Although a method of polishing the entire surface of the material is used, it has been found that there is a problem in that the thickness unevenness of the striped polishing liquid is generated on the surface of the aluminum substrate. When such a stripe pattern unevenness occurs, the polishing liquid is dried immediately at the portion where the polishing liquid is thin, which makes it difficult to remove the abrasive grains.

As a result of intensive investigations, the inventors of the present invention have found a method capable of reliably removing abrasive grains and the like from the surface of an aluminum substrate after CMP polishing and mirror-finishing the surface of the aluminum substrate, and a mold for nanoimprinting efficiently. We came to complete the method of manufacturing.

That is, the present invention has the following features.
A method for producing a roll-like mold for nanoimprinting, wherein an oxide film having a plurality of pores is formed on the outer peripheral surface of a roll-like aluminum substrate,
Abrasive grains and a polishing liquid are provided at a portion of the outer peripheral surface of the aluminum base material in contact with the abrasive body, the abrasive body having a length along the axial direction shorter than the axial length of the aluminum base material. The polishing slurry is supplied, and the polishing body and the outer peripheral surface of the aluminum base are rubbed while relatively moving the polishing body and the aluminum base in the axial direction, and the outer periphery of the aluminum base is Polishing the surface (I);
Continuously applying the polishing slurry on the outer peripheral surface of the aluminum substrate continuously after the step (I);
After the step (II), cleaning the outer peripheral surface of the aluminum substrate (III);
After the step (III), the step (IV) of forming the oxide film on the outer peripheral surface of the aluminum substrate by anodizing,
In the process (I) to the process (III), a method for manufacturing a roll-shaped nanoimprint mold, in which the outer peripheral surface of the aluminum base material is always kept wet.

  As a result of intensive investigations by the present inventors, in a state where the aluminum substrate is rotationally driven, the slurry is supplied to the contact portion between the polishing body and the aluminum substrate, and moved in the axial direction of the polishing body to polish the surface of the aluminum substrate. It was found that when the polishing slurry was formed, the thick and thin portions became streaky spots and remained on the aluminum substrate. If such streaky spots occur, the thin streaky portion of the slurry will dry before the cleaning step is carried out, and streaky spots will occur on the surface of the aluminum substrate. However, in the method configured as described above, since the slurry is uniformly applied on the aluminum base after the step (I), the generation of the streaky spots as described above is suppressed. be able to. Thereby, before carrying out the step (III), the surface of the aluminum substrate is dried, and it is possible to suppress that streaky spots remain.

  According to one aspect of the present invention, there is provided a method for producing a roll-shaped nanoimprinting mold, wherein the rotational speed of the mold base is set to 65 m / min or less at the step (II).

According to another aspect of the present invention, in the steps (I) and (II), the rotational speed of the mold base is 65 m / min or less at a peripheral speed of at least 65 m / min. Method of manufacturing a mold.

Further, according to the present invention, there is provided a method for producing a roll-shaped nanoimprint mold having the following features.
A method for producing a roll-like mold for nanoimprinting, wherein an oxide film having a plurality of pores is formed on the outer peripheral surface of a roll-like aluminum substrate,
Abrasive grains and a polishing liquid are provided at a portion of the outer peripheral surface of the aluminum base material in contact with the abrasive body, the abrasive body having a length along the axial direction shorter than the axial length of the aluminum base material. And supplying the polishing slurry containing the slurry, and rubbing the polishing body and the outer peripheral surface of the aluminum base rotating around the central axis while relatively moving the polishing body and the aluminum base in the axial direction. Polishing the outer peripheral surface of the aluminum substrate (I);
Applying the polishing slurry to the outer peripheral surface of the aluminum substrate continuously after the step (I);
After the step (II), cleaning the outer peripheral surface of the aluminum substrate (III);
After the step (III), the step (IV) of forming the oxide film on the outer peripheral surface of the aluminum substrate by anodizing,
In the process (I) to the process (III), a method for manufacturing a roll-shaped nanoimprint mold, in which the outer peripheral surface of the aluminum base material is always kept wet.

  According to an embodiment of the present invention, in the step (II), the polishing slurry is supplied to the contact portion between the polishing body and the outer peripheral surface of the aluminum substrate with the polishing body, and the polishing body and the polishing body A roll-like nanoimprint characterized in that the abrasive is relatively moved in the axial direction of the aluminum base at a speed higher than the step (I) while rubbing against the outer peripheral surface of the aluminum base. A method of manufacturing a mold is provided.

According to another embodiment of the present invention, there is provided a method for producing a roll-shaped nanoimprinting mold, wherein in the step (II), the moving speed of the polishing body satisfies the following formula.

In the formula, L is the length in the direction along the central axis of the aluminum base, T is the moving speed of the polishing body in the direction along the central axis of the aluminum base, and W is the center of the aluminum base The length of the polishing body in the direction along the axis, R represents the radius of the aluminum base, and S represents the rotational speed (circumferential speed) of the aluminum base.

According to another embodiment of the present invention, the step (III) is a step of supplying a cleaning solution to the outer peripheral surface of the aluminum substrate to remove the polishing slurry, and the temperature of the cleaning solution is 50 ° C. The manufacturing method of the roll-shaped nanoimprinting mold characterized by being the following is provided.

  ADVANTAGE OF THE INVENTION According to this invention, after mirror-polishing aluminum base material by CMP grinding | polishing, abrasive grains etc. can be reliably removed from the aluminum base-material surface, and the method of manufacturing the mold for nanoimprint efficiently can be provided.

It is the perspective view which showed the apparatus used in the manufacturing method of this invention. It is a top view of process (I) shown in FIG. It is sectional drawing which showed an example of process (IV) in the manufacturing method of this invention. It is the figure which showed typically the streak-like spot which generate | occur | produces after grinding | polishing the outer peripheral surface of an aluminum base material. It is a figure explaining process (III) in the manufacturing method of this invention. FIG. 7 is a perspective view of another embodiment of the apparatus used in the present invention.

In the present specification, the "pores" refer to recesses of a micro uneven structure formed on an oxide film on the surface of an aluminum substrate.
Moreover, "the space | interval of a pore" means the center-to-center distance of adjacent pores.
Moreover, a "protrusion" means the convex part of the fine concavo-convex structure formed in the surface of a molded object.
Moreover, "fine concavo-convex structure" means the structure whose average space | interval of a convex part or a recessed part is 10-400 nm.
Also, “roll-like” means that the outer shape is a cylindrical shape, and it is a substantially cylindrical shape in which a hollow cylindrical shape, a cylindrical shape, or a cylindrical outer diameter is partially provided with a notch, a convex portion, etc. It also includes the shape.

  The method for producing a roll-shaped nanoimprint mold (hereinafter simply referred to as "mold") according to the present invention is a method for producing a mold in which an oxide film having a plurality of pores is formed on the outer peripheral surface of a roll-shaped aluminum substrate. It is.

  Hereinafter, an example of a method for manufacturing a mold of the present invention and a polishing apparatus used for the method will be described.

  First, a polishing apparatus used in the present invention will be described with reference to FIGS.

  In the polishing apparatus used in the present invention, as shown in FIG. 1 and FIG. 2, the length W along the axial direction is shorter than the axial length L of the roll-like aluminum substrate 10 Polishing means 14 is provided in contact with the roll-shaped aluminum substrate surface. The polishing means 14 comprises, for example, a strip-like polishing body 18, a polishing roll 20 for conveying the polishing body 18 in the longitudinal direction while bringing the polishing body 18 into contact with an aluminum substrate, and a polishing slurry supply unit 22 for supplying polishing slurry. Have.

  The polishing means 14 and the aluminum base 10 are moved relative to each other by a rubbing means (not shown) in a region where the surface of the roll-like aluminum base and the polishing means 14 are in contact with each other. The substrate 10 is configured to be abraded. For example, the aluminum base 10 is rotationally driven about the central axis of the polishing means 14 and the aluminum base 10, and the rotation direction of the aluminum base 10 and the direction in which the polishing body 18 is conveyed are opposite. Thus, the polishing bodies 18 may be rubbed against each other by being transported by the transport roll 20. Alternatively, the aluminum base 10 may be rubbed against each other by being rotationally driven about the central axis in a state where the polishing body 18 of the polishing means 14 is fixed.

  The polishing apparatus used in the present invention performs polishing at least in a region where the aluminum substrate 10 and the polishing means 14 abut (that is, in the contact portion 24 with the polishing body 18 on the outer peripheral surface 12 of the aluminum substrate 10). A polishing slurry supply unit 22 (polishing slurry supply means) for supplying a slurry is provided. The polishing slurry supply unit 22 is composed of, for example, a pipe 22a for feeding a polishing slurry, and a nozzle 22b provided at the end of the pipe 22a.

  The polishing apparatus used in the present invention comprises moving means (not shown) for relatively moving the polishing means 14 and the aluminum base 10 along the axial direction of the aluminum base. The moving means presses the polishing body 18 pressing against the outer circumferential surface 12 of the aluminum substrate 10 so that the entire outer circumferential surface 12 can be polished from the first end 10 a to the second end 10 b of the aluminum substrate 10. , And relatively move along the axial direction of the aluminum base 10.

  The polishing apparatus used in the present invention is not limited to the above-described one. For example, as shown in FIG. 6A, polishing is performed using a pressing member 26 having a reverse structure of a part of the outer peripheral surface of the aluminum substrate 10. The body 18 may be pressed against the aluminum substrate 10. Further, for example, as shown in FIG. 6B, the structure may be such that the aluminum base 10 is pressed against the polishing body 18 in a state in which the two tension rolls 28 stretch the pin.

  Next, an example of the method for producing a mold of the present invention will be described.

The method for producing a mold of the present embodiment includes the following steps (I) to (IV).
(I) As shown in FIG. 1 and FIG. 2, an abrasive body 18 whose length W along the axial direction is shorter than the axial length L of the roll-like aluminum substrate 10, and the aluminum substrate 10 The polishing slurry containing polishing abrasives and the polishing liquid is supplied between them, and the polishing body 18 and the aluminum base 10 are rubbed while relatively moving the aluminum base 10 and the polishing body 18 in the axial direction. The outer peripheral surface 12 of the aluminum base 10 is polished by moving.
(II) After the step (I), a polishing slurry is supplied between the polishing body 18 and the outer peripheral surface 12 of the aluminum base 10 to rub the polishing body 18 and the outer peripheral surface 12 of the aluminum base 10. The polishing body 18 is relatively moved in the axial direction of the aluminum base 10 at a speed higher than that of the step (I), and the polishing slurry is uniformly applied to the outer peripheral surface 12 of the aluminum base 10.
(III) After the step (II), the outer peripheral surface 12 of the aluminum base 10 is cleaned.
(IV) After the step (III), an oxide film 24 is formed on the outer peripheral surface 12 of the aluminum base 10 by anodic oxidation.

[Step (I)]
In step (I) of this example, the rolled aluminum substrate 10 is configured to rotate around an axis about a central axis.
The outer peripheral surface 12 of the aluminum substrate 10 is polished by the polishing means 14 which moves in the axial direction of the aluminum substrate 10. The polishing means 14 has a strip-like polishing body 18, a polishing roll 20 for transporting the polishing body 18 while pressing the polishing body 18 against the aluminum substrate 10, and a polishing slurry supply unit 22 for supplying a polishing liquid. doing.

The polishing body 18 has a length W (FIG. 2) along the axial direction of the aluminum base 10 shorter than an axial length L (FIG. 2) of the aluminum base 10.
The polishing body 18 may be any one as long as it can polish the surface of the aluminum substrate to a desired state, and examples thereof include non-woven fabric and suede-type polishing pads.

The polishing roll 20 is configured to transport the polishing body 18 in the longitudinal direction thereof while pressing the polishing body 18 against the outer peripheral surface 12 of the aluminum base 10.
In this example, in the portion where the outer peripheral surface 12 of the aluminum base 10 and the polishing body 18 are in contact, polishing is performed such that the rotation direction of the aluminum base 10 and the direction in which the polishing body 18 is transported are reverse. A body 18 is to be transported by the polishing roll 20.

  The polishing slurry supply unit 22 has a pipe 22a for feeding the polishing slurry, and a nozzle 22b provided at the end of the pipe 22a. The polishing slurry supply unit 22 is arranged to supply the polishing slurry to a portion 24 of the outer peripheral surface 12 of the aluminum substrate 10 in contact with the polishing body 18.

The polishing slurry used for polishing is a polishing slurry for chemical mechanical polishing, and may be appropriately selected depending on various purposes such as eliminating scratches attached to the outer peripheral surface 12 of the aluminum base 10 and mirror polishing the outer peripheral surface 12. Just do it.
As a polishing slurry for chemical mechanical polishing, for example, an acidic or alkaline solution (abrasive liquid) in which an abrasive (abrasive grain) such as SiC, Al ₂ O ₃ , SiO ₂ or ZrO ₂ has the effect of corroding aluminum Polishing slurry etc. which were disperse | distributed to. An acidic polishing slurry is used for the rough surface state of the machined surface of the aluminum substrate, and an alkaline polishing slurry is used for finishing the mirror surface, so that the polishing efficiency is good.

  The polishing means 14 can move in the axial direction of the aluminum base 10. That is, by moving the polishing body 18 pressed against the outer peripheral surface 12 of the aluminum base 10 in the axial direction of the aluminum base 10, the first end 10a to the second end of the aluminum base 10 can be obtained. The entire outer peripheral surface 12 can be polished over 10 b.

  In step (I) of this example, the aluminum base 10 is rotated about its axis, and the polishing body 18 is pressed against the outer peripheral surface 12 of the aluminum base 10 and rubbed, and from one axial end to the other axis The polishing body 18 is moved along the axial direction to the direction end to polish the entire outer circumferential surface 12 of the aluminum base 10. This operation is repeated until the outer peripheral surface 12 of the aluminum base 10 is in a desired state. At this time, the polishing slurry is supplied from the polishing slurry supply unit 22 to the contact portion 24 of the outer peripheral surface 12 of the aluminum substrate 10 with the polishing body 18. The rotational speed of the aluminum base 10 (relative movement speed with the polishing body 18 in the circumferential direction of the aluminum base 12 in a plan view observed in the direction along the central axis of the aluminum base 10) )) May be arbitrarily set as long as the outer peripheral surface 12 of the aluminum base material 10 can be mirror-polished uniformly, but if the peripheral speed is slowed down, the time required for polishing the aluminum base material may increase. And 60 m / min or more. Moreover, it is preferable that the moving speed of the grinding | polishing body 18 is 5 mm / min or more from the same viewpoint.

  99.5 mass% or more is preferable, and, as for the purity of the aluminum of the aluminum base material 10, 99.9 mass% or more is more preferable. If the purity of aluminum is equal to or higher than the lower limit value, pores having high regularity can be formed with higher accuracy in the step (IV).

In the case of using aluminum having high purity, the aluminum base 10 may be too soft to be processed when processed into a roll shape. In this case, magnesium added to aluminum and processed into a roll may be used as the aluminum base 10. By adding magnesium, the strength of the aluminum is increased, which facilitates processing.
When adding magnesium to aluminum, the addition amount of magnesium is preferably 0.1 to 3% by mass with respect to the total mass of the aluminum base 10.

[Step (II)]
In the above-described step (I), when the outer peripheral surface 12 of the aluminum base 10 is polished, the outer peripheral surface 12 of the aluminum base 10 is selected according to the peripheral speed of the aluminum base 10 and the moving speed of the polishing body 18. As shown in FIGS. 4 (a) and 4 (b), the polishing slurry remains as streaked unevenness. The striped unevenness is formed by the thick portion and the thin portion of the polishing slurry. In the polishing slurry, for example, polishing abrasives such as SiC, Al ₂ O ₃ , SiO ₂ , and ZrO ₂ are dispersed, but when the polishing slurry is dried, these abrasives can be used as the aluminum base 10. It becomes extremely difficult to remove from the outer circumferential surface 12. When an anodic oxidation process described later is performed in a state where the abrasive grains remain on the surface, desired pores may not be formed, or unevenness of the abrasive may be transferred to the molded body, and the optical performance may be lowered. Therefore, it is necessary to wash and remove the polishing slurry after polishing is completed. However, as shown in FIGS. 4 (a) and 4 (b), when the thickly coated portion and the thinly coated portion of the polishing slurry occur, the thinly coated portion of the polishing slurry is immediately dried. The inventors of the present invention have found that streak-like polishing liquid drying unevenness remains on the outer peripheral surface 12.

  As a method of suppressing the generation of such streaky unevenness of the polishing slurry, in the step (II), after the completion of the step (I), before the polishing slurry is dried, the outer peripheral surface 12 of the aluminum substrate 10 is uniformly formed. It is effective to apply an abrasive slurry. Thereby, it is possible to suppress that the polishing slurry is dried in the portion where the polishing slurry is thinly applied and the polishing material is fixed to the surface of the aluminum base 10.

  According to one embodiment of the present invention, in the step (II), the polishing slurry is supplied to the contact portion between the polishing body 18 and the aluminum substrate 10, and at a predetermined speed around the central axis of the aluminum substrate 10. The polishing slurry is uniformly applied to the outer peripheral surface 12 of the aluminum base 10 by moving the polishing body 18 from the axial end of the aluminum base 10 toward the other end while rotating. It is preferable that it is 65 m / min or less, and, as for the rotational speed (circumferential speed) of the aluminum base material 10 in process (II), it is more preferable that it is 40 m / min or less. This is because the faster the circumferential speed of the aluminum substrate 10, the larger the centrifugal force, and the higher the tendency of the uneven application of the polishing slurry to be maintained. By setting the circumferential speed of the aluminum base 10 to 60 m / min or less, even if coating unevenness of the polishing slurry occurs in the above-mentioned step (I) and step (II), the unevenness can be eliminated naturally. In addition, when the rotation speed (peripheral speed) of the aluminum substrate 10 is less than 5 m / min, the polishing slurry is unevenly distributed in the downward direction of the gravity of the aluminum substrate 10, and after completion of step (II) Drying of the polishing slurry may begin immediately above the direction of gravity. Therefore, it is preferable that the rotational speed of the aluminum base material 10 in process (II) is 5 m / min or more.

  As a method of applying the polishing slurry uniformly to the outer peripheral surface 12 of the aluminum substrate 10, the polishing slurry is applied to the contact portion between the polishing body 18 and the aluminum substrate 10 while rotating the aluminum substrate 10 about the central axis. While being supplied, the polishing body 18 may be moved from the axial end of the aluminum base 10 toward the other end. At this time, the polishing slurry can be uniformly applied to the surface of the aluminum substrate 10 by appropriately setting the rotation speed (that is, the circumferential speed) of the aluminum substrate 10 and / or the moving speed of the polishing pad. .

In the step (II), the peripheral speed of the aluminum substrate 10 is preferably 65 m / min or less, more preferably 40 m / min or less. This is because the faster the circumferential speed of the aluminum substrate 10, the larger the centrifugal force, and the higher the tendency of the uneven application of the polishing slurry to be maintained. By setting the peripheral speed of the aluminum base 10 to 60 m / min or less, even if the application unevenness of the polishing slurry occurs to some extent, the unevenness can be naturally eliminated.

In addition, even when coating unevenness of the polishing slurry occurs, if the polishing slurry is washed before drying, it is possible to suppress the occurrence of streaky unevenness due to the drying of the polishing slurry. That is, the polishing body 18 is quickly moved from one axial end to the other end of the aluminum substrate 10 to apply the polishing slurry to the outer peripheral surface 12 of the aluminum substrate 10, and the polishing slurry is dried. By washing and removing this before, it is possible to suppress the occurrence of streaky unevenness.

According to one embodiment of the present invention, in step (II), the polishing body 18 is moved from one axial end of the aluminum substrate 10 to the other end at a higher moving speed than in step (I). . As a result, since it is possible to quickly start step (III) to be described later while suppressing the start of drying of the polishing slurry while performing step (II), application of the polishing slurry in step (I) and step (II) Even if unevenness occurs, since this can be easily washed and removed, generation of streaky unevenness on the surface of the aluminum substrate 10 can be suppressed. When the radius of the aluminum base is R, the peripheral speed is S, the moving speed of the polishing body is T, and the width of the polishing body 18 in the direction along the central axis of the aluminum base 10 is W, It is preferable that the value satisfy the following formula (1). If W exceeds the value on the left side, application unevenness of the polishing slurry tends to be promoted. In addition, as described later, if two minutes or more have passed after the application of the polishing slurry, drying of the applied polishing slurry may start. Therefore, when the central axis direction of the aluminum substrate 10 is L, polishing is performed. The moving speed T of the body 18 is preferably a value satisfying L / 2 <T. Further, as derived from the formula (1), the moving speed T is preferably in the range satisfying the following formula (2).

... (Equation 1)

... (Equation 2)

[Step (III)]
Before the polishing slurry uniformly applied to the outer circumferential surface 12 of the aluminum substrate 10 in the step (II) is dried, the polishing slurry is washed and removed from the outer circumferential surface 12 of the aluminum substrate 10. In addition, when the application nonuniformity of polishing slurry is confirmed after the above-mentioned process (II), since drying of the part to which polishing slurry was thinly applied will start if 2 minutes or more pass, process (III), It is preferable to start within 2 minutes after the end of step (II), and more preferable to start washing within 1 minute. If the polishing slurry is uniformly applied and no coating unevenness is confirmed after the above-mentioned step (II), it is not necessary to start the washing step within 2 minutes, but in any case before the drying of the polishing slurry starts It is necessary to carry out step (III) and wash out the polishing slurry. As a method of cleaning and removing the polishing slurry, a method of immersing the aluminum base 12 in the cleaning liquid held in the cleaning tank, a method of supplying the cleaning liquid to the outer peripheral surface 12 while rotating the aluminum base 12, and the like can be mentioned. . However, in the method of immersing the aluminum base 10 in the cleaning liquid, the polishing slurry may be dried while the aluminum base 10 is transported to the cleaning tank. Therefore, as in the steps (I) and (II), while the aluminum base 10 is attached to the polishing apparatus, the cleaning liquid is supplied to the outer peripheral surface 12 of the aluminum base 10 while rotating the aluminum base 10. And a method of washing and removing the polishing slurry is preferable.

  Here, with reference to FIG. 5, the specific example which wash-removes the polishing slurry apply | coated to the aluminum base material 10 is demonstrated. FIG. 5 is a view showing an example of the cleaning apparatus used in the present invention.

In the cleaning apparatus shown in FIG. 5, the mechanism for rotatably holding the aluminum substrate 10 has the same configuration as the polishing apparatus shown in FIG. 1, and the mechanism of the polishing apparatus shown in FIG. It can be used as it is. The cleaning device moves the cleaning nozzle 30 for supplying the cleaning liquid to the aluminum substrate 10, and moving means (shown in the figure, relative to the aluminum substrate 10 along the central axis direction of the aluminum substrate 10). Not have).

The cleaning nozzle 30 sprays a cleaning solution on the aluminum substrate 10 with a constant width. The size of the fixed width is not particularly limited, but is preferably narrower than the axial length of the aluminum substrate 10. The shape of the discharge port of the cleaning liquid for the cleaning nozzle is not particularly limited as long as the cleaning liquid is sprayed with a constant width, and rectangular, circular, elliptical, etc. may be mentioned. Further, as the hole shape of the nozzle, a shape in which a plurality of holes are linearly arranged, an elongated continuous slot shape, etc. may be mentioned.

It is preferable that the cleaning nozzle 30 be disposed so that the direction with respect to the aluminum substrate 10 satisfies the following (1) to (3).
(1) When the aluminum substrate 10 is viewed from the horizontal direction (see the front view in FIG. 5), an acute angle (nozzle attack angle α formed by a line connecting the central axis of the aluminum substrate 10 and the center of the tip of the cleaning nozzle ) Is 5 degrees or more (90 degrees).
(2) When the aluminum substrate 10 is viewed from above in the direction of gravity (see the plan view in FIG. 5), the acute angle (nozzle swing angle) formed by the straight line orthogonal to the center of the cleaning nozzle tip and the central axis of the aluminum substrate 10 β) is 10 degrees or more and less than 90 degrees.
(3) When viewed from the direction along the central axis of the aluminum base 10 and from the rear of the cleaning nozzle (see the side view in FIG. 5), the cleaning nozzle 30 is disposed above the central axis of the aluminum base 10 and cleaning The supply direction of supplying the cleaning liquid from the nozzle is opposite to the rotation direction of the aluminum substrate 10.

Here, the above (1) to (3) will be described with reference to FIG. Hereinafter, (1) to (3) will be referred to as conditions (1) to (3).

Condition (1):
Condition (1), as shown in the front view of FIG. 5A, when the aluminum substrate 10 is viewed from the horizontal direction, a line connecting the central axis of the aluminum substrate 10 and the tip center of the cleaning nozzle The acute angle (nozzle angle of attack) that is formed is within the range of 5 degrees or more and less than 90 degrees.
If the nozzle attack angle is within the above range, the cleaning liquid can be sufficiently sprayed onto the peripheral surface of the aluminum base 10, and the polishing slurry can be sent forward in the moving direction of the cleaning nozzle on the peripheral surface. Therefore, it is possible to suppress that the polishing slurry removed by cleaning wraps around in the moving direction of the cleaning nozzle and contaminates the surface of the aluminum substrate 10 after cleaning.
When the nozzle attack angle is 5 degrees or less, the cleaning solution and the polishing slurry are wound back in the moving direction of the cleaning nozzle 30 under the influence of the entrained flow of the rotating aluminum substrate 10 and polishing from the aluminum substrate 10 The slurry may not be washed out enough. On the other hand, when the nozzle attack angle is 90 degrees or more, the cleaning liquid is not sufficiently applied to the outer peripheral surface 12 of the rotating aluminum base material 10, which tends to require a long time for cleaning. The nozzle attack angle is preferably 8 degrees or more and 60 degrees or less, and more preferably 10 degrees or more and 45 degrees or less.

Condition (2):
Condition (2) is, as shown in the top view of FIG. 5B, a straight line perpendicular to the center of the tip of the cleaning nozzle and the central axis of the aluminum substrate 10 when the aluminum substrate 10 is viewed from above in the direction of gravity. The acute angle (nozzle swing angle) formed by and is in the range of 10 degrees or more and less than 90 degrees.
If the swing angle of the nozzle is less than 90 °, the outer peripheral surface 12 of the aluminum substrate 10 can be efficiently prevented while suppressing the abrasive slurry attached to the circumferential surface of the aluminum substrate 10 from moving backward in the moving direction of the cleaning nozzle 30. Can be washed. The nozzle swing angle is preferably 15 degrees or more and 60 degrees or less, and more preferably 20 degrees or more and 45 degrees or less.

Condition (3):
In condition (3), as shown in the side view of FIG. 5 (c), when viewed from the direction along the central axis of the aluminum base 10 and from the rear of the cleaning nozzle, The cleaning nozzle 30 is disposed such that the supply direction, which is disposed above the central axis and supplies the cleaning liquid from the cleaning nozzle, is opposed to the rotation direction of the aluminum substrate 10.
By arranging the cleaning nozzle as described above, the cleaning solution and the polishing slurry are wound back in the moving direction of the cleaning nozzle 30 under the influence of the entrained flow of the rotating aluminum substrate 10, and from the aluminum substrate 10 It can be suppressed that the polishing slurry can not be sufficiently cleaned and removed.
Further, it is preferable that the cleaning nozzle 30 be disposed so that the shortest horizontal distance from the outer peripheral surface 12 of the aluminum base 10 to the cleaning nozzle 30 is 50 to 200 mm.

  As a cleaning solution used for cleaning, conventionally known cleaning solutions such as alcohol, water, organic solvents and the like may be used, and water is preferably used. In addition, the temperature of the cleaning solution is set to 50 ° C. or less. In the present invention, an aluminum substrate 10 made of high purity aluminum is used. High purity aluminum may form white aluminum hydroxide when contacted with water in a high temperature environment. When the outer peripheral surface 12 of the aluminum base 10 forms an aluminum hydroxide layer, desired pores may not be formed by an anodic oxidation treatment described later. Therefore, the temperature of the cleaning solution is 50 ° C. or less, and more preferably 40 ° C. or less.

  In the present invention, an aluminum substrate 10 made of high purity aluminum is used, but high purity aluminum is a very soft material. When a cleaning solution is supplied at high pressure to the aluminum substrate 10 having the abrasive slurry applied to the surface, the abrasive contained in the abrasive slurry may be stuck in the surface of the aluminum substrate 10, and the abrasive slurry may not be removed. . Therefore, it is preferable to supply the cleaning solution to the outer peripheral surface 12 of the aluminum substrate 10 by increasing the flow rate at a relatively low pressure. It is preferable that the pressure which supplies a washing | cleaning liquid to the outer peripheral surface 12 of the aluminum base material 10 is 15 Mpa or less, and it is more preferable that it is 10 Mpa or less. The flow rate of the cleaning solution is preferably 0.5 liter / minute or more, more preferably 1 liter / minute or more, and still more preferably 2 liters / minute or more.

  Moreover, when the drying nonuniformity of a washing | cleaning liquid generate | occur | produces, especially in the case of the mold which has the fine uneven | corrugated structure of nano order, the influence of such a drying nonuniformity appears notably. Therefore, after the polishing slurry is washed and removed, a gas is sprayed from the air nozzle or the like onto the surface of the aluminum base 10 before the washing is naturally dried, and the washing is removed from the outer peripheral surface 12 of the aluminum base 10. It is preferred to dry. The aluminum substrate 10 may be dried by any method capable of removing the cleaning solution from the surface of the aluminum substrate 10 before the cleaning solution naturally dries. For example, an air nozzle configured in the same manner as the cleaning nozzle described above can be used. . In the case where water is used as the cleaning liquid, an aluminum hydroxide layer may be formed on the surface when a high temperature gas is sprayed to the aluminum base 10, so the temperature of the sprayed gas is 50 ° C. or less. Is preferable, and 40.degree. C. or less is more preferable.

[Step (IV)]
After the step (III), an oxide film (anodized porous alumina) having a plurality of pores is formed on the outer peripheral surface 12 of the aluminum base 10 by anodic oxidation. As a method of forming the said oxide film, the method of having following process (a)-(f) is mentioned, for example.
(A) Anodizing the aluminum substrate 10 in an electrolytic solution under a constant voltage to form an oxide film 34 on the outer peripheral surface 12 of the aluminum substrate 10 as shown in FIG.
(B) A portion or all of the oxide film 34 is removed, and a pore generation point 36 of anodization is formed on the outer peripheral surface 12 of the aluminum substrate 10.
(C) The aluminum base 10 is anodized again in the electrolytic solution to form an oxide film 34 having pores 38 at the pore generation points 36.
(D) A portion of the oxide film 34 is removed to enlarge the diameter of the pores 38.
(E) After the step (d), the aluminum substrate 10 is anodized again in the electrolytic solution.
(F) A roll-shaped nanoimprint mold 1 (hereinafter referred to as "mold 1") in which an oxide film 34 having a plurality of pores 38 is formed on the outer peripheral surface 12 by repeatedly performing the step (d) and the step (e). Get

(Step (a))
When the aluminum base 10 is anodized in an electrolytic solution under a constant voltage, an oxide film 34 having pores 38 is formed on the outer peripheral surface 12.
Examples of the electrolyte include aqueous sulfuric acid, aqueous oxalic acid, and aqueous phosphoric acid.

When an oxalic acid aqueous solution is used as the electrolytic solution, the concentration of oxalic acid is preferably 0.7 M or less. If the concentration of oxalic acid is 0.7 M or less, it is easy to suppress that the current value becomes too high and the surface of the oxide film 34 becomes rough.
Moreover, in this case, the applied voltage is preferably 30 to 60V. If the applied voltage is within the above range, pores 38 with high regularity can be easily formed.
Moreover, 60 degrees C or less is preferable, and, as for the temperature of electrolyte solution, 45 degrees C or less is more preferable. When the temperature of the electrolytic solution is 60 ° C. or less, it is easy to suppress the occurrence of a so-called “burn” phenomenon, so it is easy to form pores 38 with high regularity.

When a sulfuric acid aqueous solution is used as the electrolytic solution, the concentration of sulfuric acid is preferably 0.7 M or less. If the concentration of sulfuric acid is 0.7 M or less, it becomes easy to suppress that the current value becomes too high, and it becomes easy to maintain a constant voltage.
Moreover, as for an applied voltage, in this case, 25-30V is preferable. If the applied voltage is within the above range, pores 38 with high regularity can be easily formed.
Moreover, 30 degrees C or less is preferable, and, as for the temperature of electrolyte solution, 20 degrees C or less is more preferable. When the temperature of the electrolytic solution is 30 ° C. or lower, it is easy to suppress the occurrence of a so-called “burn” phenomenon, so it is easy to form pores 38 with high regularity.

(Step (b))
A part or all of the oxide film 34 is once removed, and this is used as a pore generation point 36 of anodization. This can increase the regularity of the pores. Also, as shown in the step (b ′), even if a part of the oxide film 34 is left without being removed, the regularity of the remaining part of the oxide film 34 is sufficiently high. For example, the effect of oxide film removal can be obtained.
As a method of removing the oxide film, there is a method of dissolving and removing the oxide film in a solution which does not dissolve aluminum but dissolves the oxide film selectively. As such a solution, for example, a mixed solution of chromic acid and phosphoric acid can be mentioned.

(Step (c))
When the aluminum substrate 10 from which at least a part of the oxide film 34 has been removed is anodized again, the oxide film 34 having cylindrical pores 38 is formed.
Anodizing may be performed under the same conditions as in the step (a). The longer the time of anodic oxidation, the deeper the pores 38 can be formed. If the effect of the step (b) is not lost, the voltage of the anodic oxidation in the step (c), the type of the electrolytic solution, the temperature and the like can be appropriately adjusted.

(Step (d))
A process of expanding the diameter of the pores 38 (hereinafter, referred to as "pore diameter expansion process") is performed.
The pore diameter expanding process is a process of immersing the oxide film in a solution which dissolves the oxide film to enlarge the diameter of pores obtained by anodic oxidation. As a solution which melt | dissolves an oxide film, the phosphoric acid aqueous solution of about 5 mass% etc. are mentioned, for example.
The pore diameter becomes larger as the time for the pore diameter expansion treatment is longer.

(Step (e))
After step (d), the aluminum substrate 10 is anodized again to further form small diameter cylindrical pores 38 extending downward from the bottom of the cylindrical pores 38.
Anodizing may be performed under the same conditions as in the step (a). The longer the time of anodic oxidation, the deeper the pores 38 can be formed.

(Step (f))
When the pore diameter expanding process of step (d) and the anodic oxidation of step (e) are repeated, pores having a shape in which the diameter continuously decreases in the depth direction from the opening in the outer peripheral surface 12 of the aluminum substrate 10 The mold 1 in which the oxide film 34 having 38 is formed is obtained.
It is preferred that the final step end in step (d).

  The number of repetitions of the step (d) and the step (e) is preferably 3 or more in total, more preferably 5 or more. If the number of repetitions is three or more, the mold 1 in which the oxide film 34 having pores 38 with a sufficient diameter is formed is easily obtained. Therefore, in the article to which the moth-eye structure is transferred by the mold 1, the reflectance reduction effect and the like can be easily obtained.

  Examples of the shape of the pores 38 include a substantially conical shape, a pyramidal shape, and a cylindrical shape. Among them, as the shape of the pores 38, a shape in which the pore cross-sectional area in the direction orthogonal to the depth direction continuously decreases in the depth direction from the outermost surface, such as a conical shape or a pyramid shape is preferable.

The average spacing between the pores 38 is preferably equal to or less than the wavelength of visible light, ie, 400 nm or less. The average spacing between the pores 38 is preferably 20 nm or more.
The average spacing between the pores 38 is obtained by measuring the distance between adjacent pores 38 (the distance from the center of the pores 38 to the center of the adjacent pores 38) by electron microscopy and averaging these values It is

When the average spacing is 100 nm, the depth of the pores 38 is preferably 80 to 500 nm, more preferably 120 to 400 nm, and particularly preferably 150 to 300 nm.
The depth of the pore 38 is a value obtained by measuring the distance between the bottom of the pore 38 and the top of the projection present between the pores 38 when observed at a magnification of 30,000 by electron microscopy. It is.
The aspect ratio of pores 38 (pore depth / average spacing between pores) is preferably 0.8 to 5.0, more preferably 1.2 to 4.0, and 1.5 to 3.0 Is particularly preferred.

  For example, by pressing the oxide film 34 formed on the outer peripheral surface of the mold 1 against the surface of the resin molded body, a fine concavo-convex structure consisting of projections of a shape complementary to the shape of the pores 38 formed in the oxide film 34 is obtained. An article having the surface is obtained.

[Function effect]
When polishing while moving the polishing body in the axial direction with the polishing body whose axial length is shorter than that of the aluminum base, the outer circumferential surface of the roll-shaped aluminum base is polished on the outer peripheral surface of the aluminum base The portion where the slurry is thick and the portion where the slurry is thin may remain as streaky unevenness. In particular, in the portion where the polishing slurry remains thin, the polishing slurry tends to dry naturally. When the polishing slurry is naturally dried, the polishing material contained in the polishing slurry adheres to the outer peripheral surface of the aluminum base, and it becomes extremely difficult to wash and remove it.
In addition, in the state where the abrasive adheres to the surface, it may be difficult to obtain desired pores in the anodizing step, and the optical performance of the article having a fine uneven structure may be impaired.

  On the other hand, in the method described above, after the outer peripheral surface 12 of the aluminum substrate 10 is polished, the polishing slurry is uniformly applied to the outer peripheral surface 12 of the aluminum substrate 10 and then the polishing slurry is washed from the aluminum substrate 10 Remove. Therefore, in the outer peripheral surface 12 of the aluminum base 10, the polishing slurry is naturally dried to suppress the occurrence of unevenness and the like. As described above, since generation of defects due to drying of the polishing slurry is suppressed on the outer peripheral surface 12 of the aluminum base material 10 after polishing, the mold 1 can be manufactured with high productivity.

Hereinafter, the present invention will be described in detail by way of examples, but the present invention is not limited by the following description.

[Surface roughness]
Arithmetic mean roughness Ra was measured on the outer peripheral surface of the aluminum base material in each example with a surface roughness shape measuring instrument SURFCOM 1500 DX manufactured by Tokyo Seimitsu Co., Ltd. based on the standard of JIS B 0601: 1994.

Example 1
As shown in FIGS. 1 and 2, the abrasive body 18 is axially moved from the first end 10 a to the second end 10 b of the roll-shaped aluminum base 10, and the outer peripheral surface of the aluminum base 10 is obtained. The entire 12 pieces were roughly polished until the arithmetic mean roughness Ra was 20 nm.
As the aluminum substrate 10, a roll-shaped aluminum substrate having an aluminum purity of 99.99%, an axial length L of 600 mm, and a radius R of 100 mm was used. Further, as the polishing body 18, a polyester non-woven fabric polishing pad having a length W of 100 mm along the axial direction of the aluminum base 10 was used. Then, rough polishing was performed using, as a polishing slurry, an acidic slurry having a pH of 2 to 6 containing alumina particles having an average particle diameter of 1 μm. At the time of rough polishing, the moving speed along the axial direction of the polishing body 18 is 20 mm / min, and the aluminum base 10 is repeatedly reciprocated so that the entire aluminum base 10 can be ground. It was 75 m / min.
Thereafter, a slurry of pH 8 to 14 containing SiO ₂ particles having an average particle diameter of 0.1 μm is used as the polishing slurry, and the moving speed along the axial direction of the polishing body 18 is 400 mm / min. The polishing was carried out until the mirror surface had an arithmetic mean roughness Ra of 5 nm.

Thereafter, the rotational speed of the aluminum base is 38 m / min, the moving speed of the polishing body 18 along the axial direction is 200 mm / min, and the polishing body 18 is unidirectionally along the axial direction of the aluminum base 10 The coating step was performed to apply the polishing slurry to the outer peripheral surface 12 of the aluminum substrate 10 before the polishing slurry used in the above-mentioned polishing was made to move and dried. The appearance was visually confirmed, but no coating unevenness of the polishing slurry was confirmed.

Cleaning of the aluminum substrate 10 was started within 2 minutes after the application step. Cleaning is performed at a nozzle attack angle of about 15 degrees, a nozzle swing angle of about 30 degrees, and a distance (height) of 10 cm from the aluminum substrate 10 to the nozzle, and so as to face the rotation direction of the aluminum substrate 10 From the cleaning nozzle that discharges water at a water temperature of 20 ° C at a water pressure of 7 MPa, while rotating the aluminum substrate at 30 rpm, while the cleaning nozzle is rotating at 200 cm / minute, The aluminum base 10 was cleaned by moving along the central axis direction. Then, after removing water from the aluminum base material 10 and making it dry, although the external appearance of the aluminum base material 10 was visually examined, the linear nonuniformity etc. by drying of polishing slurry were not confirmed.
Example 2
The same steps as in Example 1 were carried out except that the moving speed of the polishing body 18 in the coating step was 400 mm / min. During the coating process and after the coating process, the appearance was visually confirmed. During the coating process, uneven coating of the striped abrasive slurry was confirmed on the outer peripheral surface of the aluminum substrate 10, but immediately after the movement of the polishing body 18 Coating unevenness disappeared. Moreover, although the external appearance of the aluminum base material 10 was visually examined after washing | cleaning, the streak-like nonuniformity by drying of polishing slurry was not confirmed.

[Example 3]
The same steps as in Example 1 were carried out except that the moving speed of the polishing body 18 in the coating step was 800 mm / min. During the coating process and after the coating process, the appearance was visually confirmed. During the coating process, uneven coating of the striped abrasive slurry was confirmed on the outer peripheral surface of the aluminum substrate 10, but immediately after the movement of the polishing body 18 Coating unevenness disappeared. Moreover, although the external appearance of the aluminum base material 10 was visually examined after washing | cleaning, the streak-like nonuniformity by drying of polishing slurry was not confirmed.

Example 4
The same steps as in Example 1 were carried out except that the moving speed of the polishing body 18 in the coating step was 1200 mm / min. During the coating process and after the coating process, the appearance was visually confirmed. During the coating process, uneven coating of the striped abrasive slurry was thinly confirmed on the outer peripheral surface of the aluminum substrate 10, but before the abrasive slurry starts to dry Since the cleaning step could be carried out, no streaky unevenness due to drying of the polishing slurry was confirmed on the surface of the aluminum substrate 10 after cleaning.

[Example 5]
The same steps as in Example 1 were carried out except that the rotational speed of the aluminum base 10 in the coating step was 19 m / min. When the appearance was visually confirmed during and after the coating process, no coating unevenness of the polishing slurry was confirmed during and after the coating process. Moreover, although the external appearance of the aluminum base material 10 was visually examined after washing | cleaning, the streak-like nonuniformity by drying of polishing slurry was not confirmed.

Comparative Example 1
The same steps as in Example 1 were carried out except that the rotational speed of the aluminum base 10 in the coating step was changed to a peripheral speed of 113 m / min. During the coating process and after the coating process, the appearance was visually confirmed. During the coating process, uneven coating of the abrasive slurry with a strong stripe pattern was confirmed on the outer peripheral surface of the aluminum substrate 10, and the stripe pattern was It did not disappear. Cleaning was started in the same manner as in Example 1, but after completion of the cleaning, streaky unevenness due to drying of the polishing slurry was confirmed.

Comparative Example 2
The same steps as in Example 1 were carried out except that the rotational speed of the aluminum base material 10 in the coating step was 113 m / min, and the moving speed of the polishing body 18 was 300 mm / min. When the appearance was visually confirmed during the coating step and after the coating step, uneven coating of a strongly striped polishing slurry was confirmed on the outer peripheral surface of the aluminum base 10 during the coating step. Furthermore, part of the polishing slurry had dried before the end of the coating process. Thereafter, washing was started in the same manner as in Example 1, but after completion of washing, streaky unevenness due to drying of the polishing slurry was confirmed.

Comparative Example 3
The same steps as in Example 1 were carried out except that water with a water temperature of 60 ° C. was used for washing. Unevenness in the application of the abrasive slurry in the application step was not confirmed, and the abrasive slurry was removed by washing, but the surface of the aluminum substrate was cloudy.

  The mold obtained by the method for producing a mold of the present invention is useful for efficient mass production of antireflective articles, antifogging articles, antifouling articles, and water repellent articles.

DESCRIPTION OF SYMBOLS 10 Aluminum base 12 Outer peripheral surface 14 Polishing means 18 Polishing body 20 Polishing roll 22 Polishing slurry supply means 24 Contact part 26 Pressing member 28 Tension roll 30 Cleaning nozzle 34 Oxide film 36 Pore generation point 38 Pore

Claims (5)

A method for producing a roll-like mold for nanoimprinting, wherein an oxide film having a plurality of pores is formed on the outer peripheral surface of a roll-like aluminum substrate,
Abrasive grains and a polishing liquid are provided at a portion of the outer peripheral surface of the aluminum base material in contact with the abrasive body, the abrasive body having a length along the axial direction shorter than the axial length of the aluminum base material. And supplying the polishing slurry containing the slurry, and rubbing the polishing body and the outer peripheral surface of the aluminum base rotating around the central axis while relatively moving the polishing body and the aluminum base in the axial direction. Polishing the outer peripheral surface of the aluminum substrate (I);
Continuously applying the polishing slurry on the outer peripheral surface of the aluminum substrate continuously after the step (I);
After the step (II), cleaning the outer peripheral surface of the aluminum substrate (III);
After the step (III), the step (IV) of forming the oxide film on the outer peripheral surface of the aluminum substrate by anodizing,
In the process (I) to the process (III), a method for manufacturing a roll-shaped nanoimprint mold, in which the outer peripheral surface of the aluminum base material is always kept wet. The method for producing a roll-shaped nanoimprinting mold according to claim 1, wherein the rotational speed of the mold base is set to 65 m / min or less in the step (II). The method for producing a roll-shaped nanoimprint mold according to claim 2, wherein in the step (I), the rotational speed of the mold base is 65 m / min or less in peripheral speed. A method for producing a roll-like mold for nanoimprinting, wherein an oxide film having a plurality of pores is formed on the outer peripheral surface of a roll-like aluminum substrate,
Abrasive grains and a polishing liquid are provided at a portion of the outer peripheral surface of the aluminum base material in contact with the abrasive body, the abrasive body having a length along the axial direction shorter than the axial length of the aluminum base material. And supplying the polishing slurry containing the slurry, and rubbing the polishing body and the outer peripheral surface of the aluminum base rotating around the central axis while relatively moving the polishing body and the aluminum base in the axial direction. Polishing the outer peripheral surface of the aluminum substrate (I);
Applying the polishing slurry to the outer peripheral surface of the aluminum substrate continuously after the step (I);
After the step (II), cleaning the outer peripheral surface of the aluminum substrate (III);
After the step (III), the step (IV) of forming the oxide film on the outer peripheral surface of the aluminum substrate by anodizing,
In the process (I) to the process (III), a method for manufacturing a roll-shaped nanoimprint mold, in which the outer peripheral surface of the aluminum base material is always kept wet. In the step (II), the polishing slurry is supplied to the contact portion between the polishing body and the outer peripheral surface of the aluminum substrate with the polishing body, and the polishing body and the outer peripheral surface of the aluminum substrate are rubbed. 5. The process for producing a roll-shaped nanoimprint mold according to claim 4, wherein the polishing body is relatively moved in the axial direction of the aluminum base at a speed higher than the step (I) while being Method.