JP6521990B2 - Board-to-board work machine and mounting method - Google Patents

Description

  BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a board-to-board working machine for mounting an electrical component having a lead on a circuit substrate, and a mounting method for mounting an electrical component having a lead on the circuit substrate.

  When an electrical component having a lead (hereinafter sometimes referred to as "lead component") is mounted on a circuit substrate, the lead is inserted into a through hole formed in the circuit substrate, and the tip of the lead Molten solder is applied to the part. At this time, when the molten solder is applied to the lead, the lead part may float and the lead may come out of the through hole. Therefore, in the case of the work-to-board work machine described in the following patent document, the molten solder is applied to the lead wire in a state where the lead part is pressed against the circuit base material by the pressing device.

International Publication No. 2014/045370

  According to the work-to-board work machine described in the above-mentioned patent document, it becomes possible to prevent the lead from coming off from the through hole when applying the molten solder to the lead. However, since the lead parts are attached to the circuit base in various manners depending on the type of parts, there are lead parts not suitable for the soldering operation in a state where the lead parts are pressed against the circuit base. The present invention has been made in view of such circumstances, and an object of the present invention is to provide a technique capable of soldering lead components to a circuit substrate according to various aspects.

In order to solve the above problems, the work-to-board work machine according to the present invention is a work-to-board work machine in which a work head mounts an electrical part having a lead on a circuit substrate. It holds an electric component having a lead, and a holding device for inserting the lead into the through hole formed in the circuit substrate, provided in the working head, the state that the lead in the through hole is inserted A pressing device for holding an electrical component, a solder coating device for applying molten solder to the lead inserted into the through hole, and a through hole formed in the circuit substrate and held by the holding device the rie de electrical components in the state, first a coating work of applying the molten solder by the solder coating device, is inserted into the through hole formed in said circuit substrate and said press The rie de of the electrical component is a retainer was state by the apparatus, further comprising a controller having a working execution unit for selectively executing a second application operation of applying the molten solder by the solder coating apparatus It features.

In order to solve the above problems, an electric component mounting method according to the present invention is an electric component mounting method in which a working head mounts an electric component having a lead on a circuit substrate, the electric component mounting method being provided in the working head It holds an electric component having a lead, and a holding device for inserting the lead into the through hole formed in the circuit substrate, provided in the working head, the state that the lead in the through hole is inserted wherein a pressing device for pressing the electrical component, the substrate-related-operation performing apparatus having a solder coating apparatus for applying molten solder to inserted the lead into the through-hole, by the holding device, the rie de of the electrical component in a state of being inserted into penetrations holes in the circuit substrate, the rie de of the electrical component is a state of being held by the holding device, coating the molten solder by the solder coating apparatus A first coating operation of the in rie de of the electrical component is a state of being pressed by the pressing device, as applied engineering for selectively executing a second application operation of applying the molten solder by the solder coating apparatus It is characterized by including.

The substrate-related-operation performing apparatus and mounting method according to the present invention, first a coating work of applying molten solder to the lead parts of the lead is held by the holding device, the lead component is a state of being pressed by the pressing device And a second application operation of applying molten solder to the leads of the first and second leads are selectively performed. Thus, for example, the lead component is soldered to the circuit board in a state in which the main body portion and the circuit base material are separated by holding the lead component by the holding device in a state where the main body portion of the lead component is floated from the circuit base material It becomes possible to attach it. Further, for example, by pressing the lead component against the circuit base by the pressing device, it becomes possible to solder the lead component to the circuit board in a state where the main body portion and the circuit base are in contact. As described above, according to the work-to-board work machine and the mounting method described in the present invention, it is possible to solder the lead component to the circuit substrate in various aspects. The "lead" in the present invention includes a lead wire, a lead pin, a connector pin and the like, and is also called a terminal or a terminal. Further, the “electrical component having a lead” in the present invention includes package components such as SIP (abbreviation of single in line package), DIP (abbreviation of dual in line package), PGA (abbreviation of pin grid array) and the like.

It is a perspective view showing a component mounting device It is a perspective view which shows the components mounting apparatus with which a components mounting apparatus is provided. It is a side view showing the 1st component holder. It is a front view which shows a 1st component holder. It is a front view which shows a 2nd components holder. It is a block diagram which shows the control apparatus with which a component mounting apparatus is provided. It is the schematic at the time of the lead components of the state pressed by the pusher of a 1st component holder being soldered to a circuit base material. It is the schematic at the time of lead components being soldered to a circuit base material in the conventional component mounting apparatus. It is the schematic at the time of the lead component of the state hold | maintained by the claw part of a 1st component holder being soldered to a circuit base material. It is the schematic at the time of lead components being soldered to a circuit base material in the conventional component mounting apparatus. It is the schematic at the time of the lead component of the state hold | maintained by the nail | claw part of a 2nd component holder being soldered to a circuit base material. It is the schematic at the time of lead components being soldered to a circuit base material in the conventional component mounting apparatus. It is the schematic at the time of the lead components of the state pressed by the pusher of a 2nd component holder being soldered to a circuit base material.

  Hereinafter, as a mode for carrying out the present invention, an embodiment of the present invention will be described in detail with reference to the drawings.

<Configuration of component mounting device>
A component mounting apparatus 10 is shown in FIG. The component mounting apparatus 10 is an apparatus for performing a component mounting operation on the circuit substrate 12. The component mounting apparatus 10 includes an apparatus main body 20, a base material conveyance and holding device 22, a component supply device 24, a bulk component supply device 26, a component mounting device 28, a solder coating device 30, and imaging devices 32 and 34. In addition, a circuit board, a base material of a three-dimensional structure, etc. are mentioned as circuit base material 12, A printed wiring board, a printed circuit board, etc. are mentioned as a circuit board.

  The apparatus body 20 is constituted by a frame portion 40 and a beam portion 42 mounted on the frame portion 40. The base material transport and holding device 22 is disposed at the center of the frame portion 40 in the front-rear direction, and includes a transport device 50 and a clamp device 52. The transfer device 50 is a device for transferring the circuit substrate 12, and the clamp device 52 is a device for holding the circuit substrate 12. Thus, the base material transport and holding device 22 transports the circuit base material 12 and holds the circuit base material 12 fixedly at a predetermined position. In the following description, the transport direction of the circuit substrate 12 is referred to as the X direction, the horizontal direction perpendicular to the direction is referred to as the Y direction, and the vertical direction is referred to as the Z direction. That is, the width direction of the component mounting apparatus 10 is the X direction, and the front-rear direction is the Y direction.

  The component supply device 24 is disposed at one end of the frame portion 40 in the front-rear direction. The component supply device 24 has a tray type component supply device 60 and a feeder type component supply device (see FIG. 6) 62. The tray-type component supply device 60 is a device that supplies components in a state of being placed on the tray. The feeder type component supply apparatus is an apparatus for supplying components by a tape feeder (not shown).

  The bulk parts supply device 26 is disposed at the other end of the frame portion 40 in the front-rear direction. The loose parts feeder 26 is a device for aligning a plurality of parts in a scattered state and supplying the parts in an aligned state. That is, it is an apparatus which aligns a plurality of parts of an arbitrary posture to a predetermined posture and supplies the components of the predetermined posture. Examples of components supplied by the component supply device 24 and the bulk component supply device 26 include electrical components, components of solar cells, components of power modules, and the like. Further, there are electrical components including components having lead wires (hereinafter sometimes abbreviated as “lead components”), components having no lead wire, and the like.

  The component mounting device 28 is disposed in the beam unit 42 and has two working heads 64 and 66 and a working head moving device 68. The working head moving device 68 includes an X direction moving device 70, a Y direction moving device 71, and a Z direction moving device 72. The two working heads 64 and 66 are integrally moved to an arbitrary position on the frame 40 by the X-direction moving device 70 and the Y-direction moving device 71. The work heads 64 and 66 are detachably mounted on the sliders 73 and 74 as shown in FIG. 2, and the Z-direction moving device 72 moves the sliders 73 and 74 in the vertical direction separately. That is, the work heads 64 and 66 are individually moved in the vertical direction by the Z-direction moving device 72.

  Further, as shown in FIG. 2, a first component holder 76 is attached to the lower end surface of the working head 64. The first component holder 76 holds the lead wire of the electric component, and as shown in FIGS. 3 and 4, the main body 80, the pair of claws 82, the auxiliary plate 84, and the opening / closing device (FIG. 6) See also) 86, pushers 88 and lifting devices 90 (see FIG. 6). Incidentally, FIG. 3 is a side view of the first component holder 76, and FIG. 4 is a front view of the first component holder 76.

  The pair of claws 82 are held by the main body 80 so as to be able to move in a peristaltic manner, and by the operation of the opening and closing device 86, the tip portions of the two approach and separate from each other. Inside the pair of claws 82, a recess (not shown) having a size corresponding to the wire diameter of the lead wire 98 of the lead component 96 to be held is formed. In addition, the auxiliary plate 84 is located between the pair of claws 82, and intrudes between the two lead wires 98 of the lead component 96 as the pair of claws 82 approach. Then, each of the two lead wires 98 of the lead component 96 is sandwiched from both side surfaces by the concave portion of the claw portion 82 and the auxiliary plate 84. Thus, the lead component 96 is held by the pair of claws 82 in the two lead wires 98. Further, the pusher 88 is movably held in the vertical direction by the main body 80, and is moved up and down by the operation of the lifting device 90. When the pusher 88 is lowered, the pusher 88 contacts the main body 100 of the lead component 96 held by the pair of claws 82 and presses the lead component 96 downward.

  In addition, a second component holder (see FIG. 5) 108 is attached to the lower end surface of the working head 66. As shown in FIG. 5, the second component holder 108 includes a main body 110, a pair of claws 112, an opening / closing device 114, a pusher 116, and an elevating device (see FIG. 6) 118. The pair of claws 112 is disposed so as to extend downward from the lower surface of the main body 110, and slide in an approachable / separable manner. Further, the opening and closing device 114 slides the pair of claws 112 in a direction to approach and separate. With such a structure, the component to be held is held between the pair of claws 112 by the approach of the pair of claws 112, whereby the second component holder 108 holds the component to be held. When the lead component 96 is held by the second component holder 108, the main body 100 of the lead component 96 is held by the pair of claws 112. In addition, the second component holder 108 can also hold components without lead wires. The pusher 116 is movably held in the vertical direction by the main body 110, and is raised and lowered by the operation of the raising and lowering device 118. When the pusher 116 is lowered, the pusher 116 contacts the main body of the lead component held by the pair of claws 112 and presses the lead component downward.

  Also, the solder coating device 30 is disposed below the base material transport and holding device 22, and is located on the lower surface side of the circuit base material 12 held by the clamp device 52 of the base material transport and holding device 22. The solder coating device 30 includes a solder jet device (see FIG. 7) 120 and a moving device (see FIG. 6) 122. The solder jet apparatus 120 includes a solder bath 126 and a jet nozzle 128, as shown in FIG. The molten solder is stored in the solder tank 126, and the jet nozzle 128 is disposed upright at the central portion of the solder tank 126. The molten solder stored in the solder tank 126 jets upward from the tip of the jet nozzle 128 by the operation of a pump (not shown). In addition, the moving device 122 moves the solder jet device 120 to an arbitrary position below the base material conveyance and holding device 22. Thereby, the solder jet device 120 can jet the molten solder toward any position on the lower surface side of the circuit substrate 12.

  Further, as shown in FIG. 2, the imaging device 32 is attached to the slider 73 in a state of facing downward, and is moved together with the working head 64 in the X direction, the Y direction and the Z direction. Thus, the imaging device 32 captures an arbitrary position on the frame unit 40. As shown in FIG. 1, the imaging device 34 is disposed between the base material conveyance and holding device 22 on the frame portion 40 and the component supply device 24 so as to face upward. Thereby, the imaging device 34 images a component held by the first component holder 76 or the second component holder 108 of the working head 64, 66.

  The component mounting apparatus 10 further includes a control device 130, as shown in FIG. The control device 130 is mainly composed of a computer, and is connected to the base material conveyance and holding device 22, the component supply device 24, the bulk component supply device 26, the component mounting device 28, and the solder coating device 30. Thus, the control device 130 controls the operation of the base material conveyance and holding device 22, the component supply device 24, the bulk component supply device 26, the component mounting device 28, and the solder coating device 30. The control device 130 is also connected to the imaging device 32 and the imaging device 34 via the image processing device 132. Thereby, the control device 130 acquires imaging data captured by the imaging devices 32 and 34.

<Mounting work by the component mounting apparatus 10>
With the configuration described above, in the component mounting apparatus 10, the component is mounted on the circuit substrate 12. Specifically, the circuit substrate 12 is transported to the working position by the operation of the transport device 50, and the circuit substrate 12 is fixedly held by the operation of the clamp device 52 at that position. Further, the component supply device 24 or the bulk component supply device 26 supplies components at a predetermined supply position. Then, the working head 64 or the working head 66 moves above the supply position by the operation of the working head moving device 68, and holds the part by the first part holder 76 or the second part holder 108. Since the first component holder 76 is structured to hold the two lead wires 98 of the lead component 96, the lead component 96 having the two lead wires 98 is held by the first component holder 76. Ru. Further, components other than the lead component 96 having the two lead wires 98 can be held by the second component holder 108.

  When the lead component 96 having the two lead wires 98 is held by the first component holder 76, the working head 64 operates the X direction moving device 70 and the Y direction moving device 71 to operate the circuit substrate Move to a predetermined position on 12. Specifically, as shown in FIG. 7, through holes 140 for inserting the lead wires 98 of the lead component 96 are formed in the circuit base 12. The lead component 96 held by the first component holder 76 is imaged by the imaging device 34, and the through hole 140 of the circuit substrate 12 is imaged by the imaging device 32, and the holding posture of the lead component 96, etc. The information related to the position of the through hole 140 and the position information of the through hole 140 are calculated by the control device 130 based on the imaging data. Then, according to the calculated information, the working head 64 is moved onto the circuit substrate 12 so that the through holes 140 of the circuit substrate 12 and the lead wires 98 coincide in the vertical direction. Then, the work head 64 is lowered by the operation of the Z-direction moving device 72, whereby the lead wire 98 of the lead component 96 held by the first component holder 76 is inserted into the through hole 140 of the circuit substrate 12. Do. Since the first component holder 76 holds the lead wire 98, the lead wire 98 can be suitably inserted into the through hole 140.

  When the lead wire 98 of the lead part 96 is inserted into the through hole 140, the first part holder 76 separates the pair of claws 82 by the operation of the opening / closing device 86 and releases the holding of the lead part 96. Then, the pusher 88 is lowered by the operation of the lifting device 90. As a result, as shown in FIG. 7, the lead parts 96 are pressed against the circuit base 12 so that the lead wires 98 are inserted into the through holes 140 up to the root, and the main body 100 is the surface of the circuit base 12. Contact Further, before the lead wire 98 of the lead part 96 is inserted into the through hole 140, the solder jet device 120 moves below the through hole 140 of the circuit substrate 12 by the operation of the moving device 122. Thus, the solder jet device 120 is located below the lead wire 98 inserted into the through hole 140.

  Next, the solder jet device 120 jets the molten solder from the jet nozzle 128 toward the lead 98 of the lead part 96 by the operation of the pump. At this time, the lead component 96 is pressed against the circuit substrate 12 by the pusher 88 of the first component holder 76. That is, the lead component 96 is soldered by the solder jet device 120 while being held down by the pusher 88. Thereby, the floating of the lead component 96 due to the jet of molten solder is prevented. Then, after the jet of molten solder is performed for a predetermined time, the jet of molten solder is stopped. The pressing of the lead component 96 by the pusher 88 is performed until the solder solidifies even after the jet of the molten solder stops, and the pressing of the lead component 96 by the pusher 88 is released after the solder solidifies. . The lead wire 98 and the circuit substrate 12 are connected by the above-described operation, and an electric circuit is formed.

  Thus, in the component mounting apparatus 10, the lead component 96 is soldered while being pressed by the pusher 88. On the other hand, in the conventional component mounting apparatus, when the lead component 96 is soldered to the circuit base 12, as shown in FIG. 8, the weight 150 is placed on the main body 100 of the lead component 96. That is, in the conventional component mounting apparatus, the lead component 96 is soldered while being held down by the weight 150, and the weight 150 prevents the lead component 96 from rising due to the jet of molten solder.

  However, in the soldering work using the weight 150, the work of placing the weight 150 on the lead part 96 before the soldering work and the work of recovering the weight 150 from above the lead part 96 after the soldering work is necessary. Furthermore, solder may adhere to the weight 150, and in such a case, the weight 150 needs to be cleaned. As described above, at the time of the soldering operation using the weight 150, it is necessary to carry out the work related to the weight 150, which is extremely inconvenient. On the other hand, in the component mounting apparatus 10, since it is soldered in the state pressed down with the pusher 88, it is not necessary to use the weight 150, and it is very convenient.

  Further, as described above, the lead component 96 is not mounted on the circuit base 12 in a state where the main body 100 is in contact with the surface of the circuit base 12, and the main body 100 is separated from the surface of the circuit base 12. It may be mounted on the circuit substrate 12 in a state. Specifically, when the lead wire 98 of the lead part 96 is inserted into the through hole 140, as shown in FIG. 9, the main body 100 of the lead part 96 is separated from the upper surface of the circuit base 12. The lead component 96 is held by the claws 82 of the first component holder 76. At this time, the pusher 88 is not lowered, and the lead component 96 is not pressed by the pusher 88. As described above, in the state where the lead component 96 is held by the claws 82 of the first component holder 76, the solder jet device 120 jets the molten solder toward the lead wire 98.

  Then, after the jet of molten solder is performed for a predetermined time, the jet of molten solder is stopped. The holding of the lead component 96 by the claws 82 of the first component holder 76 is continued until the solder solidifies even after the jet of molten solder stops, and after the solder solidifies, the lead components by the claw 82 Holding of 96 is released. Thus, the lead component 96 is attached to the circuit base 12 in a state where the main body 100 is separated from the surface of the circuit base 12.

  On the other hand, in the conventional component mounting apparatus, as shown in FIG. 10, a bent portion 152 is formed at the central portion of the lead 98, and the main portion 100 of the lead component 96 is the surface of the circuit substrate 12 by the bent portion 152. Away from Then, the lead component 96 is soldered by the solder jet device 120 in that state, but in order to separate the main body portion 100 from the surface of the circuit substrate 12, it is necessary to form a bent portion 152 in the lead wire 98 It is very uneconomical. However, in the component mounting apparatus 10, since the first component holder 76 is soldered to the circuit base 12 in the state of being held by the first component holder 76, it is necessary to form the bent portion 152 in the lead 98 It is economical.

  Further, components other than the lead component 96 having the two lead wires 98 are held by the second component holder 108 as described above. Specifically, for example, as shown in FIG. 11, a lead component 164 composed of one lead wire 160 and a main body portion 162 is held by a pair of claw portions 112 in the main body portion 162. , And held by the second component holder 108. Since the lead component 164 is a component mounted on the circuit base 12 with the main body portion 162 being separated from the surface of the circuit base 12, the lead wire 160 of the lead component 164 is inserted into the through hole 140 and the main body It is held by the claws 112 of the second component holder 108 with the portion 162 separated from the surface of the circuit substrate 12.

  As described above, the solder jet device 120 jets the molten solder toward the lead wire 160 in a state where the lead component 164 is held by the claws 112. Then, after the jet of molten solder is performed for a predetermined time, the jet of molten solder is stopped. The holding of the lead component 164 by the claws 112 of the second component holder 108 is continued until the solder solidifies even after the jet of molten solder stops, and after the solder solidifies, the lead components by the claws 112 164 is released. Thus, the lead component 164 is mounted on the circuit base 12 in a state where the main body portion 162 is separated from the surface of the circuit base 12.

  On the other hand, in the conventional component mounting apparatus, as shown in FIG. 12, in order to stabilize the lead component 164 in the state where the main body portion 162 is separated from the surface of the circuit substrate 12, jigs 168 are provided on the surface of the circuit substrate 12. Are placed, and the main body portion 162 is placed on the jig 168. As described above, by using the jig 168, it becomes possible to solder the lead part 164, but like the weight 150, it is necessary to perform the mounting operation, the recovery operation, the cleaning operation, etc. of the jig 168. There is very little convenience. However, since the component mounting apparatus 10 is soldered while being held by the second component holder 108, there is no need to use the jig 168, which is very convenient.

  Further, the lead component 170 shown in FIG. 13 is composed of three or more lead wires (six lead wires in the figure) 172 and a main body 174, and is held by the pair of claws 112 in the main body 174. As a result, the second part holder 108 holds the same. The lead component 170 is a component mounted on the circuit base 12 with the main body 174 in contact with the surface of the circuit base 12. Therefore, after the lead wire 172 of the lead part 170 is inserted into the through hole 140, the pair of claws 112 are separated by the operation of the opening / closing device 114, and the holding of the lead part 170 is released. Then, the pusher 116 is lowered by the operation of the lifting device 118. As a result, as shown in FIG. 13, the lead component 170 is pressed against the circuit base 12, whereby the lead wire 172 is inserted into the through hole 140 up to the root, and the main body 174 is the surface of the circuit base 12. Contact

  At this time, the solder jet device 120 jets the molten solder toward the lead wire 172 in a state where the lead component 170 is pressed against the circuit substrate 12 by the pusher 116. Then, after the jet of molten solder is performed for a predetermined time, the jet of molten solder is stopped. The pressing of the lead component 170 by the pusher 116 is performed until the solder solidifies even after the jet of molten solder stops, and the pressing of the lead component 170 by the pusher 116 is released after the solder solidifies. As described above, also in the second component holder 108, the lead component 170 can be soldered to the circuit base 12 without using the weight 150 by pressing the lead component 170 with the pusher 116.

  The molten solder jetted from the jet nozzle 128 can not solder all the plurality of lead wires 172 at one time. Therefore, when the lead component 170 is soldered by the solder jet device 120, the solder jet device 120 is moved along the arrangement direction of the lead wires 172 by the operation of the moving device 122. This makes it possible to solder all of the plurality of lead wires 172.

  Further, in the component mounting apparatus 10, the soldering operation of the lead component in the state of being pressed by the pushers 88, 116 and the soldering operation of the lead component in the state of being held by the claw portions 82, 112 are optional. It is possible to change to Specifically, for example, in the above description, the lead component 170 is mounted on the circuit substrate 12 with the main body portion 174 in contact with the surface of the circuit substrate 12, but the operation of the component mounting device 28 etc. By changing the program to be controlled, the lead component 170 can be attached to the circuit base 12 with the main body 174 separated from the surface of the circuit base 12. As described above, by arbitrarily changing the soldering work using the pushers 88 and 116 and the soldering work using the claws 82 and 112, it is possible to easily cope with a change in the type of circuit board to be produced, etc. It becomes possible.

  In addition, it is possible to change the pressing time by the pushers 88 and 116 or the holding time by the claws 82 and 112 after the solder flow is stopped by changing the program that controls the operation of the component mounting device 28 or the like. is there. Moreover, it is also possible to change the amount of separation of the main body of the lead component and the surface of the circuit substrate 12 by changing the program for controlling the operation of the component mounting device 28 or the like.

  The control device 130 has a work execution unit 180 and a work change unit 182, as shown in FIG. The operation execution unit 180 performs a soldering operation using the pusher 88 of the first component holder 76, a soldering operation using the claw portion 82 of the first component holder 76, and a pusher 116 of the second component holder 108. And a soldering operation using the claw portion 112 of the second component holder 108 is selectively performed. In addition, the work change unit 182 is a functional unit for changing the soldering work preset for a predetermined lead component to another soldering work.

  Incidentally, in the above embodiment, the component mounting apparatus 10 is an example of a substrate work machine. The circuit substrate 12 is an example of a circuit substrate. The claw portion 82 is an example of a holding device. The pusher 88 is an example of a pressing device. The claw portion 112 is an example of a holding device. The pusher 116 is an example of a pressing device. The solder jet apparatus 120 is an example of a solder coating apparatus. The moving device 122 is an example of a moving device. Control device 130 is an example of a control device. The through hole 140 is an example of a through hole. The lead component 96 is an example of an electrical component. The lead 98 is an example of a lead. The lead wire 160 is an example of a lead. The lead component 164 is an example of an electrical component. The lead component 170 is an example of an electrical component. The lead wire 172 is an example of a lead. The task execution unit 180 is an example of a task execution unit. The work change unit 182 is an example of the work change unit.

  The present invention is not limited to the above-described embodiments, and can be implemented in various modes in which various changes and improvements are made based on the knowledge of those skilled in the art. Specifically, for example, in the above embodiment, the molten solder is jetted toward the lead wire at the time of the soldering operation, but the molten solder may be applied to the lead wire. That is, for example, the lead wire may be immersed in the solder bath 126.

  In the above embodiment, the lead component is inserted from the upper side of the circuit base 12 and the molten solder is applied from the lower side of the circuit base 12, but the lead component is inserted from the lower side of the circuit base 12 A molten solder may be applied from above the substrate 12. Incidentally, when the molten solder is applied from above the circuit base 12, the molten solder may be dropped onto the circuit base 12.

  10: Component mounting device (to-board work machine) 12: Circuit base 82: claw portion (holding device) 88: pusher (pressing device) 96: lead component (electric component) 98: lead wire (lead) 112: claw portion (Holding device) 116: Pusher (pressing device) 120: Solder jet device (solder application device) 122: Moving device 130: Control device 140: Through hole 160: Lead wire (lead) 164: Lead component (electric component) 170: Lead parts (electrical parts) 172: Lead wire (lead) 180: Work execution part 182: Work change part

Claims (6)

A substrate-to-board work machine in which a working head mounts an electrical component having a lead on a circuit substrate,
Provided in the working head holds the electric component with the lead, and the holding device for inserting the lead into the through hole formed in the circuit substrate,
A pressing device provided in the working head for pressing the electrical component in a state in which the lead is inserted into the through hole;
A solder application device for applying molten solder to the lead inserted into the through hole;
Is inserted into a through hole formed in the circuit substrate, and the rie de of the electrical component is a state of being held by said holding device, a first application work of applying the molten solder by the solder coating apparatus, it is inserted into a through hole formed in the circuit substrate, and wherein the rie de of the electrical component is a state of being pressed by the pressing device, and a second coating operation of applying the molten solder by the solder coating apparatus And a control device having a work execution unit to selectively execute. The controller
The work-to-board work machine according to claim 1, further comprising a work change unit for changing one of the first application work and the second application work set in advance to the other. The electrical component is
A body portion, a rie de to be extended out from the main body portion plurality has,
The first application operation is
The solder coating device is applied to a plurality of leads extending from the main body of the electric component in a state in which the plurality of leads are inserted into the through hole and the main body is separated from the circuit base material It is the operation | work which apply | coats a fusion | melting solder, The board | substrate working machine of Claim 1 or Claim 2 characterized by the above-mentioned. The holding device is a pair of claws which approach and separate, and the pair of claws hold a plurality of leads extending from the main body in a direction orthogonal to the arrangement direction of the plurality of leads. The substrate working machine according to claim 3, characterized in that: The electrical component is a plurality a body portion, a lead extending out from said body portion has,
The substrate-to-substrate work machine includes a moving device for moving the solder coating device to an arbitrary position,
The work execution unit
When the first application operation and the second application operation are selectively performed, the moving device moves the solder application device along the direction in which the plurality of leads extending from the main body are arranged. 5. A machine according to any one of claims 1 to 4, wherein molten solder is applied to the plurality of leads. A method of mounting an electrical component, wherein a working head mounts an electrical component having a lead on a circuit substrate,
Provided in the working head holds the electric component with the lead, and the holding device for inserting the lead into the through hole formed in the circuit substrate, provided in the working head, the said through-hole In a work-to-board operation machine comprising: a pressing device for pressing the electrical component in a state in which a lead is inserted; and a solder coating device for applying molten solder to the lead inserted into the through hole.
By said holding device, in a state where the rie de of the electrical component is inserted into the penetrations holes in the circuit substrate, the rie de of the electrical component is a state of being held by the holding device, the solder coating a first coating work of applying the molten solder by the device, the on rie de of the electrical component is a state of being pressed by the pressing device, selectively a second coating operation of applying the molten solder by the solder coating apparatus EC mounting methods, including as applied engineering to be performed.

Images