JP6522360B2 - Storage system and withdrawal method - Google Patents

Description

  The present invention relates to a storage system including a storage case for storing a plate-like storage member by supporting the storage member at both ends thereof, and a method for drawing out the storage member from the storage case.

  Some mounting work machines and the like for mounting electronic components on circuit boards and the like include a storage case for storing a plate-shaped receiving member such as a wafer by supporting at both ends thereof. At the time of operation, a plate-shaped receiving member such as a wafer is pulled out from the storage case. The following patent documents describe an example of a storage system provided with such storage.

JP 2012-084715 A

  In a storage having a structure in which a plate-like receiving member such as a wafer is supported at both ends thereof, the thin receiving member may be stored in a bent state. As described above, when the accommodated member housed in a bent state is pulled out from the storage case and held by the holding tool, the accommodated member may be damaged. In addition, the accommodated member gripped in a bent state is difficult to pull out from the storage, and if the accommodated member is pulled out forcibly, the accommodated member may be damaged. This invention is made in view of such a situation, and makes it a subject to suppress the holding | grip by the holding | gripping tool in the bending state of the to-be-stored member.

In order to solve the above-mentioned subject, the storage system of the present invention supports a plate-shaped receiving member by supporting it in the both edges of the storage, and the receiving member stored in the storage. A lower arm inserted below the upper arm and an upper arm inserted above the received member, and a holding tool for holding the received member by the lower arm and the upper arm; A first moving device for moving in a direction to move closer to and away from the storage, a second moving device for moving the holding tool and the storage relatively in the vertical direction, the holding tool, the first moving device, and And a control device for controlling operation with the second moving device, wherein the control device moves the lower arm toward the upper arm, thereby gripping the accommodated member by the grasping tool, and The grasping the housing member and the gripper is moved in a direction away from said repository, said to draw the accommodated member from said storage case, by controlling the operation of the gripper and the first moving device Before the control device grips the accommodated member by the gripper, the gripper is moved upward, and after the upward movement of the gripper, the accommodated member is gripped by the gripper. The operation of the gripping tool, the first moving device, and the second moving device is controlled so as to pull out the storage member gripped by the gripping tool from the storage case . Moreover, the storage system of the present invention is inserted below a storage case to be stored by supporting a plate-like storage member at both edge portions thereof and the storage member stored in the storage case. A holding tool having a lower arm and an upper arm inserted above the received member, the holding arm holding the received member by the lower arm and the upper arm, and the holding tool moved closer to or away from the storage case The first moving device for moving in the direction, the second moving device for moving the holding tool and the storage relatively in the vertical direction, and the vertical position of the received member stored in the storage And a control device for controlling the operation of the holding tool, the first moving device, and the second moving device, wherein the control device directs the lower arm to the upper arm. The receiving member is held by the holding tool by moving the holding member, and the holding member holding the receiving member is moved in a direction away from the storage case to move the storage member from the storage case A storage system characterized by controlling the operation of the grasper and the first moving device so as to pull out, wherein the control device is located on the lowermost side of the received member detected by the detection sensor. The lower arm is inserted below the receiving member stored in the storage using the detection value of the located point, and the upper arm is inserted above the receiving member. The operation of the first moving device and the second moving device is controlled. Moreover, the storage system of the present invention is inserted below a storage case to be stored by supporting a plate-like storage member at both edge portions thereof and the storage member stored in the storage case. A holding tool having a lower arm and an upper arm inserted above the received member, the holding arm holding the received member by the lower arm and the upper arm, and the holding tool moved closer to or away from the storage case Of the first moving device for moving in the direction, the second moving device for moving the holding tool and the storage relatively in the vertical direction, the holding tool, the first moving device, and the second moving device A control device for controlling the operation, the control device holding the receiving member by the holding tool by moving the lower arm toward the upper arm, and holding the receiving member By moving the holding tool away from the storage case, the operation of the holding tool and the first moving device is controlled so as to pull out the receiving member from the storage case. A storage system, wherein the control device moves the lower arm upward so as to reduce deflection of the received member, and grips the received member with the holding tool after moving the lower arm upward. The operation of the gripping tool, the first moving device, and the second moving device is controlled so as to pull out the storage member gripped by the gripping tool from the storage case.

Further, in order to solve the above-mentioned problems, according to the pulling method of the present invention, a holding tool having a lower arm and an upper arm from a storage case for storing a plate-like receiving member by supporting it at both edges thereof The lower arm is inserted below the storage member stored in the storage, and the upper arm is inserted above the storage member. And moving the grasping tool upward before the grasping tool is grasped by the grasping tool to move the grasping tool upward. later, by moving towards the lower arm to the upper arm, said a gripping step of gripping by a the accommodated member the gripper, the gripper gripping the object to be receiving member wherein By moving in a direction away from the pay box, characterized in that it comprises a spacing step of pulling out said the accommodated member from the repository. Further, according to the pulling method of the present invention, the holding member having the lower arm and the upper arm pulls out the storage member by holding the plate-shaped storage member by supporting the storage member at both edges thereof. It is a method, The said extraction method detects the point located in the lowest position of the said to-be-stored member detected by the detection sensor for detecting the position of the up-down direction of the said to-be-stored member accommodated in the said storage. The lower arm is inserted below the receiving member stored in the storage using the value, and the grasping tool is inserted into the storage such that the upper arm is inserted above the receiving member An approaching step of approaching, a gripping step of gripping the accommodated member by the grasping tool by moving the lower arm toward the upper arm, and a grasping of the accommodated member Wherein the gripper is moved in a direction away from the storage case has, characterized in that it comprises a spacing step of pulling out said the accommodated member from the repository.

  In the storage system and the pull-out method of the present invention, the upper arm of the holding tool is inserted above the received member stored in the storage, and the lower arm of the holding tool is inserted below the received member. Then, by moving the lower arm toward the upper arm, the storage member is held by the holding tool, and the holding tool holding the storage member moves in a direction away from the storage case, whereby the storage member is stored. It is pulled out of the storage. That is, in the state where the accommodated member in a bent state is lifted from below by the lower arm, the accommodated member is gripped by the upper arm and the lower arm. Thus, the storage member can be gripped by the upper arm and the lower arm in a state in which the amount of bending is reduced.

It is a perspective view which shows an electronic component mounting machine. It is a top view which shows an electronic component mounting machine. It is a perspective view showing a die supply device. It is a block diagram showing a control device with which an electronic component mounting machine is provided. FIG. 5 is a schematic view showing a die assembly housed in a rack. FIG. 6 is a schematic view showing a die assembly gripped by an upper arm and a lower arm in a bent state. FIG. 7 is a schematic view showing a die assembly gripped by an upper arm and a lower arm in a flat state. It is the schematic which shows the state in which the clamp was inserted in the rack. It is the schematic which shows the state to which the clamp was moved upward. FIG. 7 is a schematic view showing a die assembly gripped by an upper arm and a lower arm in a flat state.

  Hereinafter, as a mode for carrying out the present invention, an embodiment of the present invention will be described in detail with reference to the drawings.

<Configuration of Electronic Component Mounting Machine>
1 and 2 show an electronic component mounting machine 10 according to an embodiment of the present invention. FIG. 1 is a perspective view of the electronic component mounting machine 10, and FIG. 2 is a view showing the electronic component mounting machine 10 from which the electronic component mounting machine 10 is removed with the cover 12 etc. removed. The electronic component mounting machine 10 is a work machine for mounting an electronic component on a circuit board. The electronic component mounting apparatus 10 includes a transport device 20, a mounting head moving device (hereinafter, may be abbreviated as a “moving device”) 22, a mounting head 24, and a die supply device 30. In the following description, the width direction of the electronic component mounting machine 10 is referred to as an X-axis direction, and a horizontal direction perpendicular to the direction is referred to as a Y-axis direction.

  The transfer device 20 includes two conveyor devices 40 and 42. The two conveyor devices 40 and 42 are disposed on the base 46 so as to extend parallel to each other and in the X-axis direction. Each of the two conveyor devices 40 and 42 transports the circuit board in the X-axis direction by driving an electromagnetic motor (see FIG. 4) 47. In addition, the circuit board is fixedly held by the board holding device (see FIG. 4) 48 at a predetermined position.

  The moving device 22 includes a pair of Y-axis direction guide rails 50 extending in the Y-axis direction and an X-axis direction guide rail 52 extending in the X-axis direction. The X-axis direction guide rail 52 is mounted on a pair of Y-axis direction guide rails 50. Then, the X-axis direction guide rail 52 is moved to an arbitrary position in the Y-axis direction by the drive of the electromagnetic motor (see FIG. 4) 53. Also, the X-axis direction guide rail 52 holds the slider 54 so as to be movable along its own axis. The slider 54 is moved to an arbitrary position in the X-axis direction by driving of the electromagnetic motor (see FIG. 4) 55. The mounting head 24 is attached to the slider 54. With such a structure, the mounting head 24 moves to any position on the base 46.

  The mounting head 24 mounts the electronic component on the circuit board. The mounting head 24 has a suction nozzle 60 provided on the lower end surface. The suction nozzle 60 communicates with a positive / negative pressure supply device (see FIG. 4) 62 through a negative pressure air and a positive pressure air passage. The suction nozzle 60 sucks and holds the electronic component by the negative pressure and separates the held electronic component by the positive pressure. Further, the mounting head 24 has a nozzle lifting device (see FIG. 4) 64 for moving the suction nozzle 60 up and down. The mounting head 24 changes the vertical position of the electronic component to be held by the nozzle lifting device 64. The suction nozzle 60 is removable from the mounting head 24.

  The die supply device 30 is provided at one end of the base 46 in the Y-axis direction. Specifically, a recessed storage portion 86 is formed at the edge of the base 46, and a part of the die supply device 30 is stored in the storage portion 86. The die supply apparatus 30 supplies the die 92 from the die assembly 90 as shown in FIG. The die assembly 90 is formed by dicing a wafer having a dicing sheet attached thereto.

  The die supply unit 30 has a main frame 100, a die assembly accommodation unit 102, a die assembly holding unit 104, a pickup head 106, and a pickup head moving unit (hereinafter may be abbreviated as "moving unit") 108. ing.

  The upper surface of the main frame 100 is generally rectangular, and the die assembly holding device 104, the pickup head 106, and the moving device 108 are disposed on the upper surface. Then, the main frame 100 is housed in the housing portion 86, whereby the die supply device 30 is attached to the base 46.

  The die assembly accommodating device 102 has a rack 110 and a lift table 112. The rack 110 is disposed on the elevating table 112, and a plurality of die assemblies 90 are accommodated in the stacked state in the rack 110. Specifically, the rack 110 is generally box-shaped and open at the front. Then, as shown in FIG. 4, a plurality of wafer receiving portions 114 are formed in a shelf shape inside the pair of side surfaces 113 facing each other of the rack 110. The plurality of wafer receiving portions 114 are shaped so as to protrude toward the inside of the rack 110, and are formed at equal intervals in the vertical direction. Further, the wafer receiving portion 114 formed on one of the pair of side surfaces 113 and the wafer receiving portion 114 formed on the other of the pair of side surfaces 113 are substantially horizontally positioned. Thus, the die assembly 90 is mounted on the wafer receiving portion 114 formed on each of the pair of side surfaces 113 and in a horizontal position to each other. With such a structure, a plurality of die assemblies 90 are accommodated in the rack 110 in a stacked state. Further, the lifting table 112 is moved vertically by being lifted and lowered by a table lifting mechanism (see FIG. 4). As a result, the die assembly 90 accommodated in the rack 110 moves to any position in the vertical direction.

  In addition, the die assembly holding device 104 has a pair of guide rails 116 and a holding frame 118 as shown in FIGS. 2 and 3. The pair of guide rails 116 is disposed on the main frame 100 so as to extend in the Y-axis direction, and movably supports the holding frame 118 in the Y-axis direction. Then, the holding frame 118 is moved in the Y-axis direction along the guide rail 116 by the frame moving mechanism (see FIG. 4) 119.

  The pickup head 106 picks up the die 92 from the die assembly 90, and a plurality of suction nozzles 120 are mounted on the lower surface. Each suction nozzle 120 communicates with a positive / negative pressure supply device (see FIG. 4) 121. The suction nozzle 120 sucks and holds the die 92 by negative pressure, and releases the held die 92 by positive pressure. Further, the pickup head 106 can be turned up and down, and the nozzle port of the suction nozzle 120 can be directed upward. Thus, the die 92 suctioned and held by the suction nozzle 120 is supplied at the top of the pickup head 106.

  The moving device 108 includes a pair of Y-axis direction guide rails 122 extending in the Y-axis direction and an X-axis direction guide rail 124 extending in the X-axis direction. The X-axis direction guide rail 124 is mounted on a pair of Y-axis direction guide rails 122. Then, the X-axis direction guide rail 124 is moved to an arbitrary position in the Y-axis direction by driving of the electromagnetic motor (see FIG. 4) 125. Also, the X-direction guide rail 124 holds the slider 126 so as to be movable along its own axis. The slider 126 is moved to an arbitrary position in the X-axis direction by driving of the electromagnetic motor (see FIG. 4) 127. A pickup head 106 is attached to the slider 126. With such a structure, the pickup head 106 moves to an arbitrary position on the main frame 100.

  A clamp 128 is attached to the back of the X-direction guide rail 124 of the moving device 108. The clamp 128 holds the die assembly 90 accommodated in the rack 110 of the die assembly accommodation device 102. Specifically, the clamp 128 includes an upper arm 130 and a lower arm 132 (see FIG. 5) extending toward the inside of the rack 110. The upper arm 130 and the lower arm 132 are disposed vertically separated from each other, and the upper arm 130 is located above the lower arm 132. The lower arm 132 approaches the upper arm 130 by driving of an electromagnetic motor (not shown). Thereby, the die assembly 90 located between the upper arm 130 and the lower arm 132 is gripped by the upper arm 130 and the lower arm 132. The clamp 128 also includes a position sensor 134, which is one of a plurality of die assemblies 90 housed in the rack 110, the upper and lower sides of the die assembly 90 at a position facing the clamp 128. Detect the position of the direction.

  Moreover, the electronic component mounting machine 10 is provided with the control apparatus 150, as shown in FIG. The controller 150 includes a controller 152 and a plurality of drive circuits 154. The plurality of drive circuits 154 are connected to the electromagnetic motors 47, 53, 55, 125, 127, the substrate holding device 48, the positive / negative pressure supply devices 62, 121, the nozzle lifting device 64, the table lifting mechanism 115, and the frame moving mechanism 119. ing. The controller 152 includes a CPU, a ROM, a RAM, and the like, is mainly composed of a computer, and is connected to a plurality of drive circuits 154. Thus, the controller 152 controls the operation of the transfer device 20, the moving device 22, and the like.

<Installation work by electronic parts mounting machine>
With the configuration described above, in the electronic component mounting machine 10, a mounting operation for mounting the die 92 on the circuit board is performed. Specifically, the circuit board is transported to the work position by a command of the controller 152 of the electronic component mounting machine 10, and the circuit board is fixedly held at that position. Also, the die supply apparatus 30 supplies the die 92 using the pickup head 106.

  Specifically, the lift table 112 is moved up and down by the command of the controller 152, and any die assembly 90 among the plurality of die assemblies 90 housed in the rack 110 is moved to a position facing the clamp 128 Do. At this time, the X-axis direction guide rail 124 is moved in the direction away from the rack 110, and the clamp 128 is pulled out from the inside of the rack 110. Thereby, the die assembly 90 accommodated in the rack 110 moves up and down without interfering with the clamp 128.

  When any die assembly 90 among the plurality of die assemblies 90 housed in the rack 110 moves to a position facing the clamp 128, the X-axis direction guide rail 124 moves in the direction approaching the rack 110. The clamps 128 penetrate the inside of the rack 110. At this time, the upper arm 130 of the clamp 128 is inserted above the die assembly 90 at a position facing the clamp 128, and the lower arm 132 is inserted below the die assembly 90. Then, although the die assembly 90 is gripped by the upper arm 130 and the lower arm 132, there is a possibility that the die assembly 90 may be gripped in a bent state.

  Specifically, in recent years, there is a thin wafer having a thickness of 200 μm or less, and when the outer diameter of such a thin wafer is, for example, 6 inches, the die assembly 90 of such a wafer is in the rack 110. When it is housed in, it bends about 1.5 mm by its own weight. Therefore, for example, as shown in FIG. 6, there is a possibility that the die assembly 90 in a bent state is gripped by the upper arm 130 and the lower arm 132. Thus, if the die assembly 90 is gripped in a bent state, the die assembly 90 may be damaged. Also, although the die assembly 90 gripped by the clamp 128 is pulled out from the rack 110, the die assembly 90 gripped by the clamp 128 in a bent state becomes difficult to pull out from the rack 110, and the die assembly 90 When being pulled out of the rack 110, the die assembly 90 may be damaged.

  In view of this, in the die supply apparatus 30, the die assembly 90 is gripped by the clamp 128 in a flat state without bending. More specifically, the rack 110 is moved up and down by the elevating table 112 such that the die assembly 90 to be gripped of the plurality of die assemblies 90 housed in the rack 110 and the clamp 128 face each other. When the rack 110 moves up and down, the X-axis direction guide rail 124 is moved in the direction away from the rack 110 as described above, and the clamp 128 is pulled out from the inside of the rack 110. Then, when the rack 110 moves up and down, as shown in FIG. 5, the vertical position of the portion where the die assembly 90 to be gripped is supported by the wafer receiving portion 114 of the rack 110 and the lower surface of the upper arm 130. The rack 110 is raised and lowered by the raising and lowering table 112 so that the position in the vertical direction matches. That is, the vertical position of the uppermost position of the die assembly 90 in a bent state (hereinafter sometimes referred to as “the position of the uppermost point of the die assembly 90”) and the gripping of the upper arm 130 The rack 110 is raised and lowered by the raising and lowering table 112 so that the position in the vertical direction of the surface coincides. The position of the wafer receiving portion 114 of the rack 110 in the vertical direction is stored in the controller 152, and the position of the uppermost point of the die assembly 90 is calculated based on the position of the wafer receiving portion 114 in the vertical direction. Ru.

  When the elevation of the rack 110 is completed, the position sensor 134 attached to the clamp 128 detects the position of the die assembly 90 to be gripped in the vertical direction. At this time, the position sensor 134 detects the lowermost position of the die assembly 90 in a bent state. When the clamp 128 is inserted into the rack 110 while the position of the uppermost point of the die assembly 90 in a bent state coincides with the position of the gripping surface of the upper arm 130 in the vertical direction. Based on the detection value of the position sensor 134, it is determined whether or not the lower arm 132 is inserted below the die assembly 90 in a bent state.

  Specifically, the position of the top point of the die assembly 90 is calculated based on the amount of operation of the lifting table 112. Next, the position of the uppermost point of the die assembly 90 and the detection value of the position sensor 134, that is, the vertical position of the lowermost portion of the bent die assembly 90 (hereinafter referred to as “die” The amount of bending of the die assembly 90 is calculated based on “the position of the lowest point of the assembly 90”. Then, it is determined whether the amount of deflection of the die assembly 90 is smaller than the maximum distance between the gripping surface (lower surface) of the upper arm 130 of the clamp 128 and the gripping surface (upper surface) of the lower arm 132. The maximum distance between the grip surface of the upper arm 130 and the grip surface of the lower arm 132 is specified by the structure of the clamp 128. When the amount of deflection of the die assembly 90 is smaller than the maximum distance between the gripping surface of the upper arm 130 and the gripping surface of the lower arm 132, the clamp 128 is flexed when inserted into the rack 110. It is determined that the lower arm 132 is to be inserted below the die assembly 90 in the state. On the other hand, when the amount of deflection of the die assembly 90 is equal to or greater than the maximum distance between the gripping surface of the upper arm 130 and the gripping surface of the lower arm 132, the deflection occurs when the clamp 128 is inserted into the rack 110. It is determined that the lower arm 132 is not inserted below the die assembly 90 in the dead state.

  If it is determined that the lower arm 132 is inserted below the die assembly 90 in a bent state when the clamp 128 is inserted into the rack 110 according to the above procedure, the X-axis direction guide rail 124 is a rack Moving towards 110, clamps 128 are inserted into the interior of the rack 110. Thus, as shown in FIG. 5, the upper arm 130 is inserted above the die assembly 90 to be gripped, and the lower arm 132 is inserted below the die assembly 90 to be gripped. At this time, the position of the gripping surface of the upper arm 130 in the vertical direction coincides with the position of the uppermost point of the die assembly 90 as described above. Then, the lower arm 132 moves in the direction approaching the upper arm 130 by the command of the controller 152. Thereby, as shown in FIG. 7, the die assembly 90 to be gripped is gripped by the upper arm 130 and the lower arm 132 in a flat state without bending.

  In addition, when the die assembly 90 to be grasped is stored in the rack 110 in a largely bent state, the position of the uppermost point of the bent die assembly 90 and the upper and lower sides of the grasping surface of the upper arm 130 When the clamp 128 is inserted into the rack 110 with the position of the direction matched, the lower arm 132 may not be inserted below the die assembly 90 in a bent state. That is, it may be determined that the lower arm 132 is not inserted below the die assembly 90 in a bent state when the clamp 128 is inserted into the rack 110 according to the above procedure. In such a case, the die assembly 90 to be gripped is positioned between the upper arm 130 and the lower arm 132 based on the detection value of the position sensor 134, that is, the lowermost position of the die assembly 90. Thus, the lifting table 112 is lifted and lowered. In addition, at the time of lifting and lowering of the lifting and lowering table 112, as described above, the clamp 128 is not inserted into the rack 110.

  Then, when the lifting and lowering table 112 is completely lifted and lowered, the X-axis direction guide rail 124 moves toward the rack 110, and the clamp 128 is inserted into the rack 110. Thereby, as shown in FIG. 8, the upper arm 130 is inserted above the die assembly 90 to be gripped, and the lower arm 132 is inserted below the die assembly 90 to be gripped. However, the vertical position of the gripping surface of the upper arm 130 does not coincide with the position of the uppermost point of the die assembly 90 due to the elevation of the elevation table 112. For this reason, in a state where the clamp 128 is inserted into the rack 110, the lifting table 112 is lifted and lowered. At this time, as shown in FIG. 9, the elevating table 112 is moved up and down so that the position of the gripping surface of the upper arm 130 in the vertical direction coincides with the position of the uppermost point of the die assembly 90. Then, the lower arm 132 moves in the direction approaching the upper arm 130. Thereby, as shown in FIG. 10, the die assembly 90 to be gripped is gripped by the upper arm 130 and the lower arm 132 in a flat state without bending.

  Then, when the die assembly 90 is gripped by the upper arm 130 and the lower arm 132, the X-axis direction guide rail 124 moves in the X-axis direction. Thus, the die assembly 90 held by the upper arm 130 and the lower arm 132 is pulled out onto the holding frame 118. The die assembly 90 pulled out of the rack 110 is located on the holding frame 118 shown by a solid line in FIG. Next, the pickup head 106 moves above the die 92 to be picked up, and the suction nozzle 120 holds the die 92 by suction.

  Subsequently, the pickup head 106 is turned upside down. Thus, the die 92 suctioned and held by the suction nozzle 120 is supplied at the top of the pickup head 106. When the die 92 is supplied at the upper part of the pickup head 106, the mounting head 24 moves above the pickup head 106, and the suction nozzle 60 sucks and holds the die 92. Then, the mounting head 24 is moved onto the circuit board, and the die 92 is mounted on the circuit board.

  Further, in the die supply device 30, it is possible to supply the die 92 directly from the die supply device 30 without using the pickup head 106. Specifically, after the die assembly 90 is pulled out of the rack 110 onto the holding frame 118, the holding frame 118 is moved in the Y-axis direction. Thus, the die assembly 90 is located on the holding frame 118 shown by the dotted line in FIG. Then, the mounting head 24 moves above the die assembly 90, and the die 92 is adsorbed and held by the suction nozzle 60. Thereby, the die 92 picked up directly from the die assembly 90 is mounted on the circuit board.

  As described above, in the die supply device 30, the die assembly 90 accommodated in the rack 110 is gripped by the upper arm 130 and the lower arm 132 in a flat state without bending. Therefore, it is possible to prevent damage to the die assembly 90 due to gripping. Further, since the die assembly 90 gripped in a flat state is pulled out from the rack 110, the die assembly 90 can be easily pulled out from the rack 110, and damage to the die assembly 90 due to excessive pulling can be prevented. Is possible.

  Incidentally, in the above embodiment, the die supply apparatus 30 is an example of a storage system. The die assembly 90 is an example of a receiving member and a wafer. The moving device 108 is an example of a first moving device. The rack 110 is an example of a storage case. The lifting table 112 is an example of a second moving device. The clamp 128 is an example of a gripping tool. The upper arm 130 is an example of the upper arm. The lower arm 132 is an example of the lower arm. The position sensor 134 is an example of a detection sensor. Control device 150 is an example of a control device.

  The present invention is not limited to the above-described embodiments, and can be implemented in various modes in which various changes and improvements are made based on the knowledge of those skilled in the art. Specifically, for example, in the above embodiment, when the rack 110 in which the die assembly 90 is stored moves in the vertical direction, the relative vertical direction of the die assembly 90 to be gripped and the clamp 128 is increased. Although the position is changed, the relative vertical position of the die assembly 90 to be gripped and the clamp 128 may be changed by moving the clamp 128 in the vertical direction.

  In the above embodiment, the present invention is applied when the die assembly 90 is pulled out from the rack 110. However, the present invention can be applied when the tray or the like is pulled out from the storage. .

  In the above embodiment, the position of the uppermost point of the die assembly 90 is calculated based on the position of the wafer receiving portion 114 in the vertical direction, but the position sensor 134 detects the position of the uppermost point of the die assembly 90 It may be detected.

30: Die supply device (housing system) 90: Die assembly (housing member) (wafer)
108: moving device (first moving device) 110: rack (storage) 112: lifting table (second moving device) 128: clamp (gripping tool) 130: upper arm
132: lower arm 134: position sensor (detection sensor) 150: control device

Claims (9)

A storage case for storing the plate-like receiving member by supporting the plate-like receiving member at both edges thereof;
A lower arm inserted below the storage member stored in the storage case and an upper arm inserted above the storage member, and the storage member is gripped by the lower arm and the upper arm Holding tools,
A first moving device for moving the grasping tool in a direction to move the holding tool closer to or away from the storage;
A second moving device for relatively moving the holding tool and the storage in the vertical direction;
And a control device that controls the operation of the holding tool, the first moving device, and the second moving device.
The controller
By moving the lower arm toward the upper arm, the storage member is held by the holding tool, and the holding tool holding the storage member is moved in a direction away from the storage case. A storage system characterized by controlling the operation of the grasping tool and the first moving device so as to pull out the storage member from the storage case .
The controller
Before grasping the received member by the grasping tool, the grasping tool is moved upward, and after the upward movement of the grasping tool, the grasped member is grasped by the grasping tool, and the grasping tool is moved by the grasping tool A storage system characterized by controlling operations of the gripping tool, the first moving device, and the second moving device so as to pull out the gripped receiving member from the storage. The storage system is
It has a detection sensor for detecting the vertical position of the receiving member stored in the storage case,
The controller
The lower arm may be inserted below the receiving member stored in the storage using the detection value detected by the detection sensor, and the upper arm may be inserted above the receiving member. The storage system according to claim 1, wherein the operation of the first moving device and the second moving device is controlled. The controller
The lower arm is inserted below the receiving member stored in the storage using the detection value of the lowermost position of the receiving member detected by the detection sensor, and the upper arm 3. The storage system according to claim 2, wherein the operation of the first moving device and the second moving device is controlled such that the second member is inserted above the receiving member. A storage case for storing the plate-like receiving member by supporting the plate-like receiving member at both edges thereof;
  A lower arm inserted below the storage member stored in the storage case and an upper arm inserted above the storage member, and the storage member is gripped by the lower arm and the upper arm Holding tools,
  A first moving device for moving the grasping tool in a direction to move the holding tool closer to or away from the storage;
  A second moving device for relatively moving the holding tool and the storage in the vertical direction;
  A detection sensor for detecting the vertical position of the receiving member accommodated in the storage case;
  A control device for controlling the operation of the holding tool, the first moving device, and the second moving device;
  Equipped with
  The controller
  By moving the lower arm toward the upper arm, the storage member is held by the holding tool, and the holding tool holding the storage member is moved in a direction away from the storage case. A storage system characterized by controlling the operation of the grasping tool and the first moving device so as to pull out the storage member from the storage case.
  The controller
  The lower arm is inserted below the receiving member stored in the storage using the detection value of the lowermost position of the receiving member detected by the detection sensor, and the upper arm Controlling the operation of the first moving device and the second moving device such that the second moving device is inserted above the receiving member. The controller
Before grasping the received member by the grasping tool, the grasping tool is moved upward, and after the upward movement of the grasping tool, the grasped member is grasped by the grasping tool, and the grasping tool is moved by the grasping tool The storage system according to claim 4 , wherein the operation of the gripping tool, the first moving device, and the second moving device is controlled so as to pull out the gripped receiving member from the storage. . The storage system according to any one of claims 1 to 5 , wherein the storage member is a wafer.   A storage case for storing the plate-like receiving member by supporting the plate-like receiving member at both edges thereof;
  A lower arm inserted below the storage member stored in the storage case and an upper arm inserted above the storage member, and the storage member is gripped by the lower arm and the upper arm Holding tools,
  A first moving device for moving the grasping tool in a direction to move the holding tool closer to or away from the storage;
  A second moving device for relatively moving the holding tool and the storage in the vertical direction;
  A control device for controlling the operation of the holding tool, the first moving device, and the second moving device;
  Equipped with
  The controller
  By moving the lower arm toward the upper arm, the storage member is held by the holding tool, and the holding tool holding the storage member is moved in a direction away from the storage case. A storage system characterized by controlling the operation of the grasping tool and the first moving device so as to pull out the storage member from the storage case.
  The controller
  The lower arm is moved upward so as to reduce the deflection of the accommodated member, and after the upward movement of the lower arm, the accommodated member is gripped by the grasping tool, and the grasped member is grasped by the grasping tool A storage system characterized by controlling operations of the gripping tool, the first moving device, and the second moving device so as to pull out the storage member from the storage. In a method of drawing out a storage member accommodated by holding a plate-shaped storage member at both edge portions thereof, the storage member is drawn by a holding tool having a lower arm and an upper arm,
The withdrawal method is
An approaching step of causing the grasping tool to approach the storage container such that the lower arm is inserted below the storage member stored in the storage container and the upper arm is inserted above the storage member;
The holding tool is moved upward before the holding member is held by the holding tool, and the lower arm is moved toward the upper arm after the holding tool is moved upward, so that the received member is received. A gripping step of gripping a member by the gripping tool;
And a separation step of drawing the storage member from the storage container by moving the holding tool holding the storage member away from the storage container.   In a method of drawing out a storage member accommodated by holding a plate-shaped storage member at both edge portions thereof, the storage member is drawn by a holding tool having a lower arm and an upper arm,
  The withdrawal method is
  In the storage using the detection value of the lowermost position of the received member detected by a detection sensor for detecting the vertical position of the received member stored in the storage. An approaching step of causing the grasping tool to approach the storage so that the lower arm is inserted below the accommodated member and the upper arm is inserted above the accommodated member;
  A holding step of holding the storage member by the holding tool by moving the lower arm toward the upper arm;
  And a separation step of pulling out the storage member from the storage container by moving the holding tool holding the storage member away from the storage container.
  A withdrawal method characterized by including.

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