JP6638177B2 - Internal temperature measuring device, internal temperature measuring method and internal temperature measuring program - Google Patents

Description

  The present invention relates to an internal temperature measurement device, an internal temperature measurement method, and an internal temperature measurement program applied to temperature monitoring of a ground coil for a magnetically levitated railway.

  As a general method for monitoring the temperature of railway equipment and the like, a contact-type detection unit such as a thermo label, a thermistor, or a thermocouple is used, or a non-contact detection unit such as a radiation thermometer or a thermography is known.

In addition, in a magnetically levitated railway using superconductivity, a ground coil whose coil conductor is covered with a mold resin is used.
This ground coil is affected by electromagnetic force due to interaction with the superconducting magnet mounted on the vehicle, and further applies a high voltage. Therefore, high mechanical strength and high dielectric strength are required for the mold resin that covers the coil conductor of the ground coil.

Further, the mechanical strength and dielectric strength of the mold resin used in the ground coil are affected by temperature, so that temperature management is very important.
As a means for detecting the temperature of the ground coil, for example, application of an optical fiber temperature sensor or the like disclosed in Patent Document 1 is considered.

JP-A-11-165324

By the way, in the above-mentioned ground coil for a magnetic levitation type railway, by energizing the coil conductor, the temperature inside the mold resin near the conductor becomes higher than the surface of the mold resin, and therefore, it is necessary to measure the resin internal temperature. It is needed for temperature control of ground coils for magnetically levitated railways.
However, in the case of the above-mentioned ground coil for a magnetic levitation railway, although it is necessary to embed a thermistor or a thermocouple in the mold resin in order to measure the temperature inside the mold resin, It is difficult to embed the sensor without impairing the insulation performance of the sensor. If the optical fiber temperature sensor described in Patent Document 1 is embedded at the time of manufacturing, the sensor itself is an insulator, so it is expected that the insulation performance is maintained. If this is the case, the dielectric strength is reduced, so a high resin molding technique is required, and furthermore, cost and labor are required for optical fiber wiring work and measurement in the field. Therefore, it has been necessary to develop a new method capable of easily detecting the resin internal temperature.
As a method of measuring the temperature inside the mold resin, assuming the temperature difference between the resin surface and the resin inside considering the usage conditions of the ground coil, the resin inside temperature is estimated from the measured value of the resin surface temperature based on the assumed value However, the magnitude of the current flowing through the ground coil varies depending on the running conditions and is affected by the outside air temperature and the train wind. It was difficult to determine the value of.

  The present invention has been made in view of the above circumstances, and measures an internal temperature without embedding a temperature detecting unit in a mold resin, and without causing a decrease in mechanical strength or dielectric strength of the resin. The present invention provides an internal temperature measuring device, an internal temperature measuring method, and an internal temperature measuring program that can perform the internal temperature measuring.

In order to solve the above problems, the present invention proposes the following means.
That is, according to the present invention, there is provided an internal temperature measuring device that has a heat source therein and measures the internal temperature of a measurement target whose surface is covered with a coating layer, wherein the surface temperature of the measurement target is measured. , A heat flow sensor for measuring the heat flux on the surface of the object to be measured, the measured values of the temperature sensor and the heat flow sensor, the thickness of the coating layer covering the object to be measured, A calculating unit for calculating the internal temperature of the object to be measured from the thermal conductivity of the layer.

In the present invention, the measured object from the temperature sensor and the heat flow sensor provided on the surface of the measured object, the thickness of the coating layer covering the measured object, and the thermal conductivity of the coating layer Can be calculated.
That is, in the present invention, the internal temperature of the measurement target can be measured only by providing the temperature sensor and the heat flow sensor on the surface of the measurement target. The effect is obtained that the internal temperature can be measured without lowering the dielectric strength of the resin.

Further, according to the present invention, in the calculation unit, a preset “T ₂ = qd / λ + T ₁ ” (T ₁ : surface temperature of the measurement object, T ₂ : internal temperature of the measurement object, q: heat flow The internal temperature of the object to be measured is obtained based on a calculation formula of bundle, d: resin thickness, λ: thermal conductivity).

Then, in the present invention, the arithmetic unit sets “T ₂ = qd / λ + T ₁ ” (T ₁ : surface temperature of the measurement object, T ₂ : internal temperature of the measurement object, q: heat flux, d: resin thickness, λ: thermal conductivity), so that the internal temperature of the object to be measured is determined. Therefore, the temperature detection means is not embedded in the mold resin, and the decrease in the dielectric strength of the resin is determined. The internal temperature can be measured without inviting.

  Further, according to the present invention, the object to be measured is a ground coil for a magnetic levitation railway in which a coil conductor serving as the heat source is provided inside and the surface of the coil conductor is covered with a mold resin. And

  In the present invention, the ground coil for a magnetic levitation railway in which a coil conductor serving as a heat source is provided inside and the surface of the coil conductor is covered with a mold resin is set as an object to be measured. The temperature inside the mold resin can be measured without embedding the temperature detecting means in the mold resin without lowering the dielectric strength of the mold resin.

  Further, according to the present invention, the arithmetic unit is further provided with a wireless device for transmitting internal temperature arithmetic data on the measurement object.

  According to the present invention, since the arithmetic unit is provided with the wireless device for transmitting the internal temperature calculation data at the object to be measured, the risk of electric shock due to contact with the ground coil, which becomes high voltage, is provided through this wireless device. While avoiding, it is possible to monitor the internal temperature of the measurement object from the outside.

  Further, according to the present invention, an administrator who maintains and manages the object to be measured or a receiving terminal of a maintenance vehicle receives internal temperature calculation data transmitted from the wireless device.

  Then, in the present invention, since the internal temperature calculation data transmitted from the wireless device can be received by the administrator who maintains and manages the object to be measured or the receiving terminal of the maintenance vehicle, the ground which becomes a high voltage through the receiving terminal can be received. The internal temperature of the measurement object can be monitored from the outside while avoiding the risk of electric shock due to contact with the coil.

  Further, according to the present invention, the arithmetic unit outputs internal temperature calculation data having the highest value among the internal temperatures measured each time the train passes.

  In the present invention, the internal temperature calculation data is output after a predetermined time has elapsed after the detection of the passage of the linear vehicle, so that it is not affected by an external environment such as a strong magnetic field or a train wind, and furthermore, the heat of the conductor is reduced on the resin surface. , The internal temperature calculation data can be obtained.

  Further, according to the present invention, at least one of the arithmetic unit and the receiving terminal is provided with a notifying means for instructing maintenance when the internal temperature calculation data exceeds a predetermined threshold. Features.

  In the present invention, at least one of the calculation unit and the receiving terminal is provided with a notifying means for instructing maintenance when the internal temperature calculation data exceeds a predetermined threshold value. By referring to the maintenance and inspection instructions, a measurement target having an abnormality in the internal temperature can be immediately grasped, and early maintenance can be performed.

  According to the invention, the internal temperature calculation data is provided with identification information for identifying the measurement object.

  In the present invention, since the internal temperature calculation data is provided with identification information for identifying the measurement target, the internal temperature of the measurement target at a specific location can be immediately recognized and monitored through the identification information. Can be.

  Further, the present invention is an internal temperature measurement method for measuring an internal temperature of a measurement target having a heat source therein and a surface of the heat source covered by a coating layer, wherein the surface temperature of the measurement target is measured. Temperature measuring step, the heat flux measuring step of measuring the heat flux on the surface of the measurement object, the measured values of the temperature and heat flux obtained in the measurement step, and the thickness of the coating layer covering the measurement object And a calculating step of calculating the internal temperature of the object to be measured from the thermal conductivity of the coating layer.

According to the internal temperature measurement method shown in the present invention, each measurement value from the temperature sensor and the heat flow sensor provided on the surface of the measurement object, the thickness of the coating layer covering the measurement object, and the coating layer The internal temperature of the measurement object can be calculated from the thermal conductivity of the object.
That is, in the present invention, the temperature sensor and the heat flow sensor are provided only on the surface of the measurement target, and the internal temperature of the measurement target can be measured.Thus, the temperature detection unit is not embedded in the mold resin. The effect is obtained that the internal temperature can be measured without lowering the dielectric strength of the resin.

  Further, the present invention is an internal temperature measurement program for measuring an internal temperature of an object to be measured having a heat source inside and a surface of the heat source covered by a coating layer, wherein the surface temperature of the object to be measured is measured. Temperature measuring step, the heat flux measuring step of measuring the heat flux on the surface of the measurement object, the measured values of the temperature and heat flux obtained in the measurement step, and the thickness of the coating layer covering the measurement object And a calculating step of calculating the internal temperature of the object from the thermal conductivity of the coating layer.

According to the internal temperature measurement program shown in the present invention, each measurement value from the temperature sensor and the heat flow sensor provided on the surface of the measurement object, the thickness of the coating layer covering the measurement object, The internal temperature of the measurement object can be calculated from the thermal conductivity of the object.
That is, in the present invention, the temperature sensor and the heat flow sensor are provided only on the surface of the measurement target, and the internal temperature of the measurement target can be measured.Thus, the temperature detection unit is not embedded in the mold resin. The effect is obtained that the internal temperature can be measured without lowering the dielectric strength of the resin.

  According to the present invention, it is possible to measure the internal temperature of the measurement target simply by providing the temperature sensor and the heat flow sensor on the surface of the measurement target, whereby the temperature detection unit is not embedded in the mold resin, The effect is obtained that the internal temperature can be measured without lowering the dielectric strength of the resin.

It is a figure which shows the internal temperature measuring device which concerns on 1st Embodiment of this invention, (A) is a front view which shows the sensor position with respect to a ground coil, (B) is a figure which shows the detail of an internal temperature measuring device. It is a figure for explaining the principle of a heat flow sensor, (A) is a perspective view showing the whole, and (B) is a side view of (A). It is a figure which shows the ground coil used as a test object which measures internal temperature, (A) is a front view which shows the whole, (B) is a rear view of (A). 4 is a graph showing a measurement result (resin internal temperature) according to FIG. 3, and a surface temperature and a coil conductor temperature to be compared with the measurement result. It is a figure showing the control flow concerning a 2nd embodiment of the present invention. (A) is a graph showing the time until the surface temperature of the ground coil used in the control flow of FIG. 5 is stabilized, and (B) is a graph showing a change in the internal temperature in the ground coil. It is a schematic structure figure showing the radio equipment concerning a 3rd embodiment of the present invention. It is a figure which shows the portable terminal installed in the maintenance vehicle.

(1st Embodiment)
A first embodiment of the present invention will be described with reference to FIGS.
FIG. 1 is a layout diagram of an internal temperature measuring device 100 according to a first embodiment of the present invention, which is installed in a measurement object denoted by reference numeral 1.
In this example, a magnetic levitation railway in which a coil conductor 2 serving as a heat source is provided inside and the surface of the coil conductor 2 is covered with a mold resin 3 as shown in FIG. A ground coil C (hereinafter, referred to as a ground coil) is shown, and the internal temperature is measured by an internal temperature measuring device 100 attached thereto.

  As shown in a partial side view of FIG. 1B, the internal temperature measuring device 100 includes a temperature sensor 10 for measuring a surface temperature of the mold resin 3 which is a coating layer of the ground coil C, and a temperature sensor 10 for measuring the surface temperature. It has a heat flow sensor 11 for measuring the heat flux on the surface of the mold resin 3 located in the vicinity, and a calculation unit 20 for calculating the internal temperature of the ground coil C from the measured values of the temperature sensor 10 and the heat flow sensor 11.

The heat flow sensor 11 is a rectangle having a certain length to ensure sensitivity, and is arranged on the surface of the molding resin 3 of the ground coil C so that the longitudinal direction is along the winding direction of the coil conductor 2. The length in the short direction is sufficiently shorter than the conductor width, and the center in the short direction is located at or near the center of the conductor width. The temperature sensor 10 is arranged near the heat flow sensor 11 at a position where the temperature can be regarded as the same as the heat flow sensor installation position.
As shown in FIG. 2 and the following arithmetic expression (Equation 1), when the heat flow penetrates the planar minute thermal resistor serving as a detection element (the direction of penetration is indicated by an arrow x), as shown in FIG. The thickness of the planar micro thermal resistor along the same direction is indicated by δX), and the difference (δT) between the temperatures (t1, t2) generated on the front and back surfaces of the thermal resistor in proportion to the magnitude of the heat flow is detected. By doing so, the heat flux q (W / m ² ) that becomes the heat flow density is detected.
Then, the arithmetic expression (Equation 1) is measured by covering the coil conductor 2 serving as a heat source inside with the mold resin 3 having the thickness “d” and the thermal conductivity “λ”. The above calculation unit 20 applies the object 1 to estimate the internal temperature of the ground coil C by calculation.

That is, the arithmetic unit 20 calculates the measurement values of the temperature sensor 10 and the heat flow sensor 11, the thickness (d) of the molding resin 3 covering the ground coil C, and the molding resin The internal temperature of the ground coil C is estimated by calculation by substituting the thermal conductivity (λ) of FIG.
The specific arithmetic expression (Equation 1) stored in the arithmetic unit 20 will be described with reference to FIGS. 1 and 2. In the arithmetic unit 20, the heat flux q (W / m ²⁾ detected by the heat flow sensor 11 is used. ), The mold resin thickness (mold resin thickness in the x direction: d) corresponding to the solid thickness, the temperature difference ΔT (T ₂ −T ₁ ) that changes when heat passes through the resin thickness, and the solid. The following relationship is set based on the thermal conductivity (λ) of the mold resin.

Heat flux q = −λδT / δX = λ (T ₂ −T ₁ ) / d (W / m ² ) Equation 1
In the above formula 1, the mold resin thickness d indicates the thickness of the mold resin 3 located between the coil conductor 2 serving as a heat source and the heat flow sensor 11 on the outer surface, and T ₁ is the mold resin thickness. ground coils surface temperature of the outer portion at the measurement position of d, T ₂ represents the resin temperature inside the inner portion at the measurement position of the mold resin thickness d.
Then, the surface temperature of the ground coils C, indicated at T _1, when detected by the heat flow sensor 11 near the temperature sensor 10, based on Equation 2 below, the coil conductor 2 near the ground coils, indicated at T ₂ The internal temperature (° C.) of C can be obtained by calculation.
Internal temperature T ₂ = qd / λ + T ₁ (° C.) Equation 2

Then, it was confirmed by an experiment described below that the relationship represented by the above-described Expression 2 was established.
As shown in FIGS. 3A and 3B, a plurality of sets (P1 to P6) of the temperature sensor 10 and the heat flow sensor 11 are arranged on the surface of the ground coil C serving as the measurement object 1.
At this time, the temperature sensor 10 and the heat flow sensor 11 are arranged along the coil conductor 2 and on the mold resin 3 located outside the coil conductor 2, and then at each of these positions (P 1 to P 6). Based on the detection values of the temperature sensor 10 and the heat flow sensor 11, the internal temperature serving as the monitoring point PA was obtained.
The monitoring point PA indicates a position in contact with the coil conductor 2 of the mold resin 3 which is immediately adjacent to the heat flow sensor 11, and indicates a measured value of the heat flow sensor 11 and a vicinity of the vicinity where the installation temperature of the heat flow sensor 11 can be regarded as the same temperature. Based on the measurement value of the temperature sensor 10 and Equation 2 described above, the internal temperature of the ground coil C serving as the monitoring point PA is calculated.

The ground coil C used in this experiment uses a ground coil (PLG coil) for both propulsion, levitation, and guidance for a magnetically levitated railway. For a coil conductor width of 100 mm, the mold resin thickness d is It is about 15mm. On the epoxy resin surface on the upper coil conductor in the coil, a thermocouple serving as the temperature sensor 10 and a heat flow sensor 11 were arranged close to and side by side.
Then, in this state, a DC current is applied to the levitation system circuit (eight-shaped circuit), and after confirming that the surface temperature and the heat flux are saturated, the surface temperature and the heat flux are measured at regular time intervals. The internal temperature (T ₂ ) of the ground coil C was determined by averaging except for noise.

In FIG. 4, when the direct current supplied to the ground coil C is 90 A, based on the values measured by the thermocouple and the heat flow sensor 11 serving as the temperature sensor 10 and the mathematical expression 2, each position (P1 to P6) The result of estimating the resin internal temperature (T ₂ ) by calculation is shown.
In the test results of FIG. 4, the surface temperature of the ground coil C is indicated by (a), the resin internal temperature of the ground coil C is indicated by (b), and the actual conductor temperature of the ground coil C is indicated by (b). C).

As can be seen by referring to the calculated value of the internal resin temperature (b) resulting from this, the calculated value must be higher by 6 to 12 ° C than the corresponding measured surface temperature of the ground coil C (a). Was confirmed. It was also confirmed that the calculated value of the resin internal temperature (b) from the front side almost coincided with the calculated value of the resin internal temperature (b) from the back side.
Further, in order to confirm the validity of the calculated value of the resin internal temperature (b), the average value of the upper coil conductor temperature (c) measured by the resistance method is also shown. As can be understood by referring to the temperature values shown in (b) and (c), since these temperature values are almost the same, the surface temperature of the ground coil C can be calculated as expected using Expression 2. It is considered that.

  The calculation is performed by the calculation unit 20, and the internal temperature calculation data (indicated by the symbol Z 1) as the calculation result is displayed on a separately provided display unit 21 as shown in FIG. Is transmitted to the external terminal through the network (details will be described in the following third embodiment).

As described above in detail, according to the internal temperature measuring device 100 according to the first embodiment, the measured values from the temperature sensor 10 and the heat flow sensor 11 provided on the surface of the ground coil C and the ground coil C are covered. The internal temperature of the ground coil C can be calculated from the thickness of the molding resin 3 and the thermal conductivity of the molding resin 3.
That is, in the internal temperature measuring device 100, the internal temperature of the ground coil C can be measured only by providing the temperature sensor 10 and the heat flow sensor 11 on the surface of the ground coil C. The effect is obtained that the internal temperature can be measured without embedding the detecting means and without lowering the dielectric strength of the resin.

  Further, in the internal temperature measuring device 100, the internal temperature of the ground coil C is obtained based on the calculation formula shown in Expression 2, so that the temperature detecting means is not embedded in the mold resin, and the dielectric strength of the resin is measured. The internal temperature can be measured without lowering.

(2nd Embodiment)
Next, an internal temperature measurement method and an internal temperature measurement program according to the second embodiment will be described with reference to FIGS. 5 to 6A and 6B.
The internal temperature measuring method and the internal temperature measuring program are the same as those shown in FIG. 1 for measuring the heat flux of the mold resin 3 serving as the coating layer of the ground coil C and the position of the heat flow sensor 11. The process is executed based on the value measured by the temperature sensor 10 for measuring the surface temperature of the mold resin 3 which can be regarded as being performed, and is performed for each process and step (hereinafter, referred to as a step) shown in FIG.
The following steps are assumed to be used in a magnetically levitated railway, and are executed each time a vehicle passes by the magnetically levitated railway.
Further, the program relating to the following steps is set in the arithmetic unit 20, but is not limited to this. The program is set in an administrator for maintaining and managing the ground coil C or in a receiving terminal of the maintenance vehicle, and May be executed.

<< Step 1 >>
It is determined whether or not the train has passed, and the process proceeds to step 2 if YES.

<< Step 2 >>
It is determined whether or not a predetermined time has elapsed after the vehicle has passed, and the process proceeds to the next step 3 if YES. Note that the predetermined time set here is to prevent measurement noise due to a strong magnetic field or the train wind 50 (see FIG. 1), and to allow a certain period of time to elapse after energization before the heat of the conductor is sufficiently transmitted to the resin surface. For example, as shown in FIG. 6A, the saturation time (ta) until the temperature change converges to 0 is set in advance by measuring in advance.

<< Step 3 >>
After a lapse of the time measured in step 2, measured values are taken from the temperature sensor 10 and the heat flow sensor 11 located on the surface of the ground coil C at predetermined time intervals.

<< Step 4 >>
Noise is removed from the measured values of the temperature sensor 10 and the heat flow sensor 11 taken in a plurality of times in step 3, and an average value of these measured values is obtained.

<< Step 5 >>
Based on the measured values of the temperature sensor 10 and the heat flow sensor 11 obtained in step 4 and the above-described formula 2, the internal temperature (T ₂ ) of the ground coil C serving as the monitoring point PA is calculated, and the calculation result is recorded. .

<< Step 6 >>
Based on the recorded data of step 5, the temporal change of the internal temperature (T ₂ ) in the ground coil C as shown in FIG. 6B is observed, and within the set time, the internal temperature (T ₂ ) peaks. The maximum value (Tmax) is output.

<< Step 7 >>
It is determined whether or not the maximum value (Tmax) of the internal temperature (T ₂ ) in the ground coil C obtained in step 6 has exceeded a preset temperature reference value. If YES, proceed to step 8; Return to step 1 above.

<< Step 8 >>
Based on the determination result in step 7, an alarm is displayed on the display unit 21 and an alarm signal is transmitted to an external terminal via the wireless device 22. Then, the operator checks the ground coil C based on the alarm display and the alarm signal.
The above steps 1 to 7 continue to be executed unless an operator gives a stop instruction when the abnormality determination is not made in step 7.

As described in detail above, according to the internal temperature measurement method and the internal temperature measurement program shown in the second embodiment, the monitoring point PA and the monitoring point PA are calculated based on the measured values of the temperature sensor 10 and the heat flow sensor 11 and the above-described Expression 2. Then, the internal temperature (T ₂ ) of the ground coil C can be calculated.
That is, in the internal temperature measurement method and the internal temperature measurement program shown in the second embodiment, the internal temperature (T ₂ ) of the ground coil C is calculated simply by providing the temperature sensor 10 and the heat flow sensor 11 on the surface of the ground coil C. This has the effect that the internal temperature can be measured without embedding the temperature detecting means in the mold resin 3 and without lowering the dielectric strength of the resin.

  Further, in the second embodiment, when the internal temperature calculation data exceeds a predetermined threshold value, a notification means for instructing maintenance is provided. Therefore, the maintenance and inspection instruction from this notification means is referred to. Thus, the ground coil C having an abnormality in the internal temperature can be immediately grasped, and the maintenance can be performed at an early stage.

  In the second embodiment, by outputting the internal temperature calculation data having the maximum value (Tmax) within the set time, it is possible to obtain the normal internal temperature calculation data that is not affected by the external environment.

(Third embodiment)
A third embodiment of the present invention will be described with reference to FIGS.
The third embodiment is different from the first and second embodiments in that the operation data Z1 indicating the internal temperature (T ₂ ) of the ground coil C obtained by Expression 2 includes the ground coil. The point is that the identification information Z2 of C is added.
That is, in the third embodiment, as shown in FIG. 7, the internal temperature calculation data Z1 of the ground coil C calculated by the calculation unit 20 (specifically, the internal temperature of the ground coil C obtained in step 6 of FIG. 5) Of the ground coil C is added to the maximum value (Tmax) of the ground coil C, and the information is output from the wireless means 22 to the outside.
The internal temperature calculation data Z1 and the identification information Z2 of the ground coil C are transmitted to an administrator who maintains and manages the ground coil C or the receiving terminals 30 and 31 of the maintenance vehicle as shown in FIG.
For example, the receiving terminals 30 and 31 may be a smartphone 30 carried by a site manager, or a mobile terminal mounted on a maintenance vehicle 32 for track maintenance as shown in FIG.

  As described in detail above, according to the internal temperature measurement device according to the third embodiment, the arithmetic unit 20 is provided with the wireless device 22 that transmits the internal temperature calculation data Z1 in the ground coil C. Through the wireless device 22, the internal temperature of the ground coil C can be efficiently monitored from the outside while moving, and the risk of electric shock due to contact with the ground coil, which becomes high in voltage, can be avoided.

  Further, in the internal temperature measuring device according to the third embodiment, the internal temperature calculation data Z1 transmitted from the wireless device 22 is transmitted to the administrator who maintains and manages the ground coil C or the receiving terminals 30 and 31 of the maintenance vehicle 32. Since the signal can be received, the internal temperature of the ground coil C can be efficiently monitored from the outside while moving through the receiving terminals 30 and 31, and the danger of electric shock due to contact with the ground coil that becomes a high voltage can be avoided. .

  Further, in the internal temperature measurement device according to the third embodiment, since the identification information Z2 for identifying the ground coil C is added to the internal temperature calculation data Z1, the ground coil at the specific location is identified through the identification information Z2. The internal temperature of C can be immediately recognized and monitored.

  As described above, the embodiments of the present invention have been described in detail with reference to the drawings. However, the specific configuration is not limited to the embodiments, and includes design changes and the like without departing from the gist of the present invention.

  The present invention relates to an internal temperature measurement device, an internal temperature measurement method, and an internal temperature measurement program applied to temperature monitoring of a ground coil for a magnetically levitated railway.

DESCRIPTION OF SYMBOLS 1 Measurement object 2 Coil conductor 3 Mold resin 10 Temperature sensor 11 Heat flow sensor 20 Operation part 22 Wireless device 30 Receiving terminal 31 Receiving terminal 100 Internal temperature measuring device C Ground coil Z1 Internal temperature operation data Z2 Identification information

Claims (9)

An internal temperature measuring device that has a heat source inside and measures the internal temperature of a measurement target whose surface is covered with a coating layer,
A temperature sensor for measuring a surface temperature of the measurement object,
A heat flow sensor that measures a heat flux on the surface of the measurement object,
Yes and the measured value of these temperature sensors and the heat flow sensor, the thickness of the coating layer covering the measurement object, and a calculator for calculating the internal temperature of the measurement object from the thermal conductivity of the coating layer, the And
The object to be measured is a ground coil for a magnetic levitation railway in which a coil conductor serving as the heat source is provided inside and the surface of the coil conductor is covered with a mold resin, the heat flow sensor is rectangular, and the surface of the mold resin is The longitudinal direction is arranged along the winding direction of the coil conductor, the center in the transverse direction is installed at or near the center of the conductor width, and the temperature sensor is a mold resin surface near the heat flow sensor. The internal temperature measuring device is disposed at a position where the temperature can be regarded as the same as the heat flow sensor installation position .   In the calculation unit, a predetermined calculation formula “T2 = qd / λ + T1” (T1: surface temperature of the measurement target, T2: internal temperature of the measurement target, q: heat flux, d: resin thickness, λ: heat 2. The internal temperature measuring device according to claim 1, wherein the internal temperature of the object to be measured is determined based on the conductivity. Wherein the arithmetic unit, the internal temperature measuring device according to any one of claims 1 or 2, characterized in that the wireless device is further provided for transmitting the internal temperature calculation data in the measurement object. 4. The internal temperature measurement device according to claim 3 , wherein an internal temperature calculation data transmitted from the wireless device is received by an administrator who maintains and manages the measurement target or a reception terminal of a maintenance vehicle. 5. The internal temperature measurement device according to claim 3 , wherein the calculation unit outputs internal temperature calculation data having a maximum value within a set time. The arithmetic unit and at least one of the receiving terminal, according to claim 5, wherein when the internal temperature calculation data exceeds a predetermined threshold, wherein the notification means is provided for indicating the maintenance Internal temperature measuring device. The internal temperature measurement device according to claim 3 , wherein identification information for identifying the measurement target is attached to the internal temperature calculation data. An internal temperature measurement method for measuring an internal temperature of a measurement target having a heat source therein and a surface of the heat source covered by a coating layer,
A temperature measurement step of measuring the surface temperature of the measurement object,
A heat flux measurement step of measuring a heat flux on the surface of the measurement object,
A measurement value of the temperature and heat flux obtained in the measurement step, a thickness of a coating layer covering the measurement object, and a calculation step of calculating an internal temperature of the measurement object from the thermal conductivity of the coating layer. , And
The object to be measured is a ground coil for a magnetic levitation railway in which a coil conductor serving as the heat source is provided inside and the surface of the coil conductor is covered with a mold resin, the heat flow sensor is rectangular, and the surface of the mold resin is The longitudinal direction is arranged along the winding direction of the coil conductor, the center in the transverse direction is installed at or near the center of the conductor width, and the temperature sensor is a mold resin surface near the heat flow sensor. And an internal temperature measuring method, wherein the internal temperature measuring method is arranged at a position that can be regarded as the same temperature as the heat flow sensor installation position . An arithmetic unit, having an internal heat source and an internal temperature measurement program for measuring the internal temperature of the measurement target whose surface is covered with the coating layer,
In the calculation unit, a measured value of the surface temperature of the measurement object,
Capturing the measured value of the heat flux on the surface of the measurement object ,
The measured values of temperature and heat flux taken to execute the thickness of the coating layer covering the measurement object, and a calculation step of calculating the internal temperature of the measurement object from the thermal conductivity of the coating layer, the Internal temperature measurement program,
The object to be measured is a ground coil for a magnetic levitation railway in which a coil conductor serving as the heat source is internally provided and the surface of the coil conductor is covered with a mold resin, and the heat flow sensor is rectangular, and the surface of the mold resin is The longitudinal direction is arranged along the winding direction of the coil conductor, the center in the short direction is installed at or near the center of the conductor width, and the temperature sensor is a mold resin surface near the heat flow sensor. And an internal temperature measurement program , wherein the internal temperature measurement program is arranged at a position that can be regarded as the same temperature as the heat flow sensor installation position .

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