JP6658048B2 - Inspection device, method of manufacturing inspection device - Google Patents

Description

  The present invention relates to an inspection device and a method for manufacturing the inspection device.

  Patent Literature 1 discloses a board inspection apparatus that performs an electrical inspection of a board to be inspected by bringing a tip portion of a probe pin into contact with the board to be inspected.

JP 2012-88065 A

  In a configuration in which a conductor, such as a probe pin, whose tip contacts a contact portion such as a pad of a substrate to be inspected, is connected by a wire to a substrate that transmits a signal for electrical inspection to the contact portion, the wire is connected to the wire. Noise may occur.

  An object of the present invention is to suppress inspection defects due to noise as compared with a configuration in which a current conductor is connected to a substrate by a wire.

The invention according to claim 1 is a positioning portion for positioning a substrate to be inspected having a contact portion, and a moving body that moves in a direction approaching and separating from the substrate to be inspected positioned by the positioning portion , the press-fit hole Is formed, and a moving body in which a large-diameter hole having a diameter larger than the press-fitting hole is overlapped with another insulating plate formed coaxially with the press-fitting hole, and at an intermediate portion in the axial direction around the entire circumference. A current-carrying body formed with a flange-shaped protrusion protruding outward in the radial direction, wherein the protrusion is fixed to the movable body by press-fitting the protrusion into the press-fitting hole of the insulating plate , and one end of the current-carrying body is fixed to the moving body. The current-carrying body that contacts the contact portion, the other end of the current-carrying member is joined by a conductive bonding material, and a substrate that transmits or receives a signal to the contact portion through the current-carrying member, provided, said other insulating plate that are superimposed on the side projecting little vent collector in the insulating plate

  In the invention of claim 2, the other end of the current-carrying member is joined to the substrate by the joining material in a state of being inserted into a hole penetrating the substrate.

In the invention according to claim 3, the current-carrying body has a bottomed first cylindrical body having an opening, an elastic body inserted inside the first cylindrical body, and a tip part protruding from the opening. A shaft inserted into the first cylinder and pushed toward the substrate to be inspected by the elastic force of the elastic body, and a second cylinder having an opening at one end and a bottom at the other end Wherein the overhanging portion formed at the axial intermediate portion is fixed to the insulating plate of the moving body , and the other end portion is joined to the substrate, a second cylindrical body, The first cylinder is fitted to the second cylinder from an opening of the second cylinder.

In the invention according to claim 4, the current-carrying body is a cylindrical body having an opening at one end and a bottom at the other end, and the projecting portion formed at an intermediate portion in the axial direction is provided with the projecting portion. A cylinder fixed to the insulating plate of the moving body, the other end of which is joined to the substrate, an elastic body inserted into the interior of the cylinder, and the cylinder having a tip protruding from the opening; A shaft inserted into the body and pushed toward the substrate to be inspected by the elastic force of the elastic body.

According to a fifth aspect of the present invention, the projecting portion formed at the intermediate portion of the second cylindrical body according to the third aspect of the present invention is press-fitted into the press- fitting hole of the insulating plate of the moving body . And inserting the other end of the second cylinder press-fitted into the press- fitting hole of the insulating plate in the moving body into the hole of the substrate; and inserting the second cylinder inserted into the hole of the substrate. Bonding to the substrate with the bonding material.

According to a sixth aspect of the present invention, a step of press- fitting the projecting portion formed at the intermediate portion of the cylindrical body according to claim 4 into the press-fitting hole of the insulating plate of the moving body . A step of inserting the other end of the cylindrical body press-fitted into the press- fitting hole of the insulating plate in the moving body into the hole of the substrate; and bonding the cylindrical body inserted into the hole of the substrate with the bonding material. Bonding to the substrate.

According to the configuration of claim 1 of the present invention, inspection failure due to noise can be suppressed as compared with the configuration in which the current-carrying body is connected to the substrate by a wire.
Further, according to the configuration of claim 1 of the present invention, when replacing the second cylindrical body, compared with a configuration in which a large-diameter hole larger in diameter than the press-fit hole is not formed coaxially with the press-fit hole. A large-diameter hole can be used as a hole into which a tool for gripping the second cylindrical body is inserted, so that replacement workability can be improved.

  According to the configuration of claim 2 of the present invention, compared to a configuration in which the other end of the current-carrying body is joined while the end surface of the other end of the current-carrying body is in contact with the surface of the substrate on the one end side of the current-carrying body. In addition, it is easy to make an electrical connection between the back surface of the substrate (the surface opposite to one end of the current-carrying body) and the current-carrying body.

  According to the configuration of the third aspect of the present invention, the first cylindrical body including the shaft body and the elastic body can be easily replaced as compared with the configuration in which the first cylindrical body is joined to the substrate.

  According to the configuration of claim 4 of the present invention, the impact when one end of the current-carrying portion comes into contact with the contact portion is less likely to be transmitted to the substrate as compared with the configuration having no elastic body.

  According to the configuration of claim 5 of the present invention, compared to the case where the other end of the second cylindrical body is inserted into the hole of the substrate and then press-fitted into the moving body, the positioning accuracy of the conductive body is ensured while maintaining the positioning accuracy of the conductive body. An inspection device can be manufactured by bonding to a substrate.

  According to the configuration of claim 6 of the present invention, compared with the case where the other end of the cylindrical body is inserted into the hole of the substrate and then press-fitted into the moving body, the positioning accuracy of the conductive body is ensured, and the conductive body is attached to the substrate. Inspection devices can be manufactured by joining the two.

It is a schematic diagram showing the composition of the inspection device concerning a first embodiment. FIG. 2 is a schematic diagram illustrating a configuration of an electric conductor according to the first embodiment. It is a schematic diagram showing a press fitting process in a manufacturing method of an inspection device concerning a first embodiment. It is a schematic diagram showing an insertion process in a manufacturing method of an inspection device concerning a first embodiment. It is a schematic diagram showing an insertion process in a manufacturing method of an inspection device concerning a first embodiment. It is a schematic diagram showing a joining process in a manufacturing method of an inspection device concerning a first embodiment. It is a schematic diagram showing the composition of the inspection device concerning a second embodiment. It is the schematic which shows the structure of the electric conduction body which concerns on 2nd embodiment. It is a schematic diagram showing a press fitting process in a manufacturing method of an inspection device concerning a second embodiment. It is a schematic diagram showing an insertion process in a manufacturing method of an inspection device concerning a second embodiment. It is a schematic diagram showing an insertion process in a manufacturing method of an inspection device concerning a second embodiment. It is a schematic diagram showing a joining process in a manufacturing method of an inspection device concerning a second embodiment. It is a schematic diagram showing the composition of the inspection device concerning a modification.

  Hereinafter, an example of an embodiment according to the present invention will be described with reference to the drawings.

<First embodiment>
(Configuration of the inspection device 10)
First, the configuration of the inspection device 10 will be described. FIG. 1 is a schematic diagram illustrating a configuration of an inspection device 10 according to the first embodiment.

  The inspection apparatus 10 is an apparatus that performs an electrical inspection on a printed board 100 (an example of a board to be inspected) to be inspected. Examples of the electrical inspection include an in-circuit inspection and a function inspection. The printed circuit board 100 to be inspected has a pad 102 (an example of a contact portion) formed on a surface thereof (an upper surface in FIG. 1) and three or more positioning holes 104 into which positioning pins 24 described later are inserted. are doing.

  The inspection apparatus 10 has, specifically, as shown in FIG. 1, a positioning section 20, a moving body 30, a conducting body 40, and a jig substrate 50 (an example of a substrate).

  The positioning section 20 is for positioning the printed circuit board 100. Specifically, the positioning section 20 includes a table 22 on which the printed circuit board 100 is mounted, and three or more positioning pins 24 projecting upward from the table 22.

  In the positioning section 20, the printed circuit board 100 is placed on the table 22 with the positioning pins 24 inserted into the three or more positioning holes 104 of the printed circuit board 100. Thus, the printed circuit board 100 is positioned on the table 22 in the left-right direction and the front-rear direction in FIG. The table 22 is provided with a holding unit (not shown) for holding the printed circuit board 100 so that the printed circuit board 100 does not rise from above the table 22.

  The moving body 30 moves in a direction approaching and separating from the printed circuit board 100 positioned by the positioning section 20 along the thickness direction of the printed circuit board 100. Specifically, the moving body 30 is configured to be able to move upward (in the direction of separation) and downward (in the direction of approach) by the drive unit 32.

  The moving body 30 is formed by stacking insulating plates 34 and 36 made of resin or the like. A press-fit hole 35 into which the current-carrying member 40 is press-fitted is formed in the insulating plate 34. The press-fit hole 35 penetrates in the thickness direction of the insulating plate 34. Specifically, a projecting portion 42 </ b> B of the second cylindrical body 42, which will be described later, in the conductive body 40 is press-fitted into the press-fit hole 35. The inner diameter of the press-fitting hole 35 is smaller than the outer diameter of the overhang portion 42B.

  A large-diameter hole 37 having a larger diameter than the press-fit hole 35 is formed on the insulating plate 36 on the same axis as the press-fit hole 35. The large diameter hole 37 has a tapered shape whose diameter gradually decreases downward. The large-diameter hole 37 is used, for example, as a hole for inserting a tool for gripping the second cylinder 42 when the second cylinder 42 described below is removed from the moving body 30 and replaced. The removal of the second cylindrical body 42 from the moving body 30 is performed after melting and removing solder 59 described later.

  The conductive body 40 supplies current to the printed circuit board 100 and has a length in the vertical direction. The current conductor 40 is formed of a conductive material such as a metal. Further, the current-carrying body 40 is fixed to the moving body 30 by press-fitting an intermediate portion in the longitudinal direction into the press-fit hole 35 of the moving body 30. The lower end (one example of one end) of the current-carrying body 40 fixed to the moving body 30 contacts the pad 102 of the printed circuit board 100 as the moving body 30 moves downward.

  Specifically, as shown in FIG. 2, the current-carrying body 40 includes a first cylindrical body 41, an elastic body 43, a pin 44 (an example of a shaft body), and a second cylindrical body 42. ing. The first cylindrical body 41 has an opening 41A at a lower end (an example of one end), and is formed of a cylindrical body having a bottom at an upper end (an example of the other end). The elastic body 43 is configured by a compression coil spring inserted inside the first cylindrical body 41.

  The pin 44 is inserted inside the first cylindrical body 41 such that the tip end protrudes from the opening 41A and is movable in the axial direction (vertical direction). The pin 44 is pressed downward (toward the printed circuit board 100) by the elastic force of the elastic body 43. The pin 44 has a tapered shape that is pointed toward the tip (downward). The first cylindrical body 41 is provided with a stopper (not shown) for preventing the pin 44 from coming out of the opening 41A.

  The second cylindrical body 42 has an opening 42A at a lower end (an example of one end), and is formed of a cylindrical body having a bottom at an upper end (an example of the other end). By inserting the upper end side of the first cylinder 41 from the opening 42A of the second cylinder 42, the first cylinder 41 is removably fitted to the second cylinder 42. Note that the first cylindrical body 41 is positioned by a positioning portion (not shown) provided inside the second cylindrical body 42 at a position where the tip (the end on the side of the opening 41A) protrudes from the opening 42A. And is fitted to the second cylindrical body 42.

  A protruding portion 42B that protrudes radially outward is formed at an intermediate portion in the axial direction on the outer periphery of the second cylindrical body 42. The projecting portion 42B projects radially outward over the entire circumference of the second cylindrical body 42 and is formed in a flange shape. Further, the overhang portions 42B are formed at two places along the axial direction of the second cylindrical body 42. The second cylindrical body 42 is fixed to the insulating plate 34 by press-fitting the protruding portion 42B into the press-fitting hole 35 of the insulating plate 34.

  The jig board 50 is a board (printed board) that transmits or receives a signal to or from the pad 102 via the conductor 40. In the jig substrate 50, a through hole 52 (an example of a hole) is formed as a through hole penetrating the jig substrate 50. The pad portion 54 is formed in the through hole 52. The pad portion 54 includes, for example, a cylindrical portion 54A formed in a cylindrical shape on the inner periphery of the through hole 52 and an annular portion 54B formed annularly on the opening edge of the through hole 52 on the back surface (upper surface) of the jig substrate 50. And The inner diameter of the through hole 52 (the cylindrical portion 54A of the pad portion 54) is larger than the outer diameter of the second cylindrical body 42.

  The upper end (an example of the other end) of the current-carrying body 40 is joined with the solder 59 (an example of a conductive joining material) in a state of being inserted into the through hole 52. Specifically, with the upper end of the second cylindrical body 42 of the electric conductor 40 inserted into the cylindrical portion 54A, the second cylindrical body 42 is joined by the solder 59 applied to the annular portion 54B of the pad portion 54. As a result, the pad portion 54 of the jig substrate 50 and the conductor 40 are electrically connected. The jig substrate 50 is fixed to the upper surface of the insulating plate 36 of the moving body 30 via a plurality of spacers 60.

(Operation according to the first embodiment)
Next, an operation according to the first embodiment will be described.

  In the first embodiment, the upper end of the current-carrying body 40 is joined to the jig substrate 50 with the solder 59. That is, the upper end of the current-carrying body 40 is directly joined to the jig substrate 50 without using a wire such as a conductive wire.

  Here, in the configuration in which the conductor 40 is connected to the jig substrate 50 by a wire (first comparative example), noise may be added to the wire.

  On the other hand, in the first embodiment, as described above, since the upper end of the current-carrying body 40 is directly joined to the jig substrate 50 without using a wire such as a conductive wire, Noise is less likely to occur than in the first comparative example, and inspection failure due to noise is suppressed.

  Further, in the first embodiment, the electric conductor 40 is joined by the solder 59 in a state where the upper end is inserted into the through hole 52. For this reason, a configuration (second comparative example) is employed in which the upper end of the electric conductor 40 is joined to the surface (lower surface) on the lower end side of the electric conductor 40 of the jig substrate 50 while the end surface of the upper end of the electric conductor 40 is in contact therewith. In comparison, the electrical connection between the back surface (upper surface) of the jig substrate 50 and the conductor 40 is easier.

  In the first embodiment, the first cylinder 41 is removably fitted to the second cylinder 42 joined to the jig substrate 50. For this reason, the first cylindrical body 41 including the pins 44 and the elastic body 43 can be easily replaced as compared with the configuration in which the first cylindrical body 41 is joined to the jig substrate 50.

  In the first embodiment, since the current-carrying body 40 is directly joined to the jig substrate 50, the current-carrying body 40 is compared with the first comparative example in which the current-carrying body 40 is connected to the jig board 50 by a wire. The impact when the tip portion contacts the pad 102 of the printed circuit board 100 is easily transmitted to the jig substrate 50.

  However, in the first embodiment, since the elastic body 43 is inserted into the inside of the first cylindrical body 41, the impact due to the contact with the pad 102 is absorbed by the elastic body 43 as compared with the configuration without the elastic body 43. Therefore, it is difficult to transmit to the jig substrate 50.

(Method of Manufacturing Inspection Apparatus 10)
Next, a method for manufacturing the inspection device 10 will be described.

  The manufacturing method of the inspection device 10 includes a press-fitting process, a plug-in process, and a joining process. The press-fitting step, the inserting step, and the joining step are performed in this order.

  In the press-fitting step, as shown in FIG. 3, the projecting portion 42 </ b> B formed at the axially intermediate portion of the second cylindrical body 42 is press-fitted into the press-fitting hole 35 of the insulating plate 34. At this time, the projecting portion 42B of the second cylindrical body 42 is press-fitted such that the vertical position of the current-carrying body 40 with respect to the moving body 30 is located at a predetermined position.

  The predetermined position is, for example, a position at which the elastic body 43 contacts the pad 102 of the printed circuit board 100 by a predetermined amount of deformation when the moving body 30 moves downward. It is.

  In the insertion step, as shown in FIGS. 4 and 5, the upper end of the second cylinder 42 pressed into the moving body 30 is inserted into the through hole 52 of the jig substrate 50. The jig substrate 50 is fixed to the spacer 60 with the upper end of the second cylindrical body 42 inserted into the through hole 52.

  In the joining step, as shown in FIG. 6, the upper end of the second cylindrical body 42 inserted into the through hole 52 of the jig board 50 is joined to the jig board 50 by solder 59. Specifically, with the upper end of the second cylindrical body 42 inserted into the cylindrical portion 54A, the second cylindrical body 42 is joined to the jig substrate 50 by the solder 59 applied to the annular portion 54B of the pad portion 54.

  Here, since the inner diameter of the through hole 52 (the cylindrical portion 54A of the pad portion 54) is larger than the outer diameter of the second cylindrical body 42, the case where the press-fitting step is performed after the inserting step (comparative example) In (2), when the insertion step is performed, the current-carrying member 40 is not positioned at the predetermined position of the current-carrying member 40, but is positioned at the predetermined position by performing the press-fitting process. Further, if the press-fitting process is performed in a state where the upper end of the second cylindrical body 42 is inserted into the through hole 52, the positioning of the conductive body 40 becomes difficult because the conductive body 40 is inclined.

  On the other hand, in the first embodiment, since the insertion step is performed after the press-fitting step, the electric conductor 40 is positioned at a predetermined position before the insertion step is performed. For this reason, in the first embodiment, the inspection device is manufactured by bonding the current-carrying body 40 to the jig substrate 50 while ensuring the positioning accuracy of the current-carrying body 40 as compared with the comparative example described above.

<Second embodiment>
(Configuration of the inspection device 200)
In the inspection device 200 according to the second embodiment, as shown in FIG. 7, an electric conductor 240 is used instead of the electric conductor 40. In this respect, the inspection device 200 differs from the inspection device 10.

  The current-carrying body 240 differs from the current-carrying body 40 in that the current-carrying body 240 does not include the second cylindrical body 42. As shown in FIG. 8, specifically, the current-carrying body 240 has a cylindrical body 241, an elastic body 243, and a pin 244 (an example of a shaft body).

  The cylindrical body 241 has an opening 241A at a lower end (an example of one end) and is formed of a cylindrical body having a bottom at an upper end (an example of the other end). Further, a projecting portion 241B that projects radially outward is formed at an intermediate portion in the axial direction on the outer periphery of the cylindrical body 241. The overhang portion 241B extends radially outward around the entire circumference of the cylindrical body 241 and is formed in a flange shape. Further, the overhang portions 241B are formed at two positions along the axial direction of the cylindrical body 241. The cylindrical body 241 is fixed to the insulating plate 34 by press-fitting the overhang portion 241B into the press-fitting hole 35 of the insulating plate 34. Note that the inner diameter of the press-fit hole 35 is smaller than the outer diameter of the overhang portion 241B.

  The elastic body 243 is configured by a compression coil spring inserted inside the cylindrical body 241. The pin 244 is inserted into the cylindrical body 241 with its tip protruding from the opening 241A and movably in the axial direction (vertical direction). The pin 244 is pressed downward (toward the printed circuit board 100) by the elastic force of the elastic body 243. The pin 244 has a tapered shape that is pointed toward the tip (downward). The cylinder 241 is provided with a stopper (not shown) for preventing the pin 244 from falling out of the cylinder 241.

  The upper end portion (an example of the other end portion) of the conductor 240 is inserted into the through hole 52 and joined by the solder 59 (an example of a conductive bonding material). Specifically, in a state where the upper end of the cylindrical body 241 of the current-carrying body 240 is inserted into the cylindrical portion 54A, it is joined by the solder 59 applied to the annular portion 54B of the pad portion 54. It is joined by the solder 59 while being inserted into the through hole 52. As a result, the pad portion 54 of the jig substrate 50 and the conductor 240 are electrically connected. The inner diameter of the through hole 52 (the cylindrical portion 54A of the pad portion 54) is larger than the outer diameter of the cylindrical body 241.

(Operation according to the second embodiment)
In the second embodiment, the upper end of the current-carrying body 240 is joined to the jig substrate 50 by the solder 59. That is, the upper end of the current-carrying body 240 is directly joined to the jig substrate 50 without using a wire such as a conductive wire.

  Here, in the configuration in which the conductor 240 is connected to the jig substrate 50 by a wire (first comparative example), noise may be applied to the wire.

  On the other hand, in the second embodiment, as described above, the upper end of the current-carrying body 240 is directly joined to the jig substrate 50 without using a wire such as a conductive wire. Noise is less likely to occur than in the first comparative example, and inspection failure due to noise is suppressed.

  Further, in the second embodiment, the conductor 59 is joined by the solder 59 in a state where the upper end of the conductor 240 is inserted into the through hole 52. For this reason, a configuration (second comparative example) is employed in which the upper end portion of the conductor 240 is in contact with the surface (lower surface) on the lower end side of the conductor 240 of the jig substrate 50 while the end surface of the upper end portion is in contact with the surface. In comparison, electrical connection between the back surface (upper surface) of the jig substrate 50 and the conductive body 240 is easier.

  In the second embodiment, since the current-carrying body 240 is directly joined to the jig substrate 50, the current-carrying body 240 is compared with the first comparative example in which the current-carrying body 240 is connected to the jig board 50 by a wire. The impact when the tip portion contacts the pad 102 of the printed circuit board 100 is easily transmitted to the jig substrate 50.

  However, in the second embodiment, since the elastic body 243 is inserted into the inside of the cylindrical body 241, the impact due to the contact with the pad 102 is absorbed by the elastic body 243 as compared with the configuration without the elastic body 243. Is hardly transmitted to the jig substrate 50.

(Method of Manufacturing Inspection Apparatus 200)
The manufacturing method of the inspection device 200 includes a press-fitting step, a inserting step, and a joining step. The press-fitting step, the inserting step, and the joining step are performed in this order.

  In the press-fitting step, as shown in FIG. 9, the projecting portion 241 </ b> B formed at the axially intermediate portion of the cylindrical body 241 is press-fitted into the press-fitting hole 35 of the insulating plate 34. At this time, the projecting portion 241B of the cylindrical body 241 is press-fitted such that the vertical position of the conductive body 240 with respect to the moving body 30 is located at a predetermined position.

  The predetermined position is, for example, a position at which the tip of the pin 244 contacts the pad 102 of the printed circuit board 100 by a predetermined amount of deformation when the moving body 30 moves downward. It is.

  In the insertion step, as shown in FIGS. 10 and 11, the upper end of the cylinder 241 pressed into the moving body 30 is inserted into the through hole 52 of the jig substrate 50. The jig substrate 50 is fixed to the spacer 60 with the upper end of the cylindrical body 241 inserted into the through hole 52.

  In the joining step, as shown in FIG. 12, the upper end of the cylindrical body 241 inserted into the through hole 52 of the jig board 50 is joined to the jig board 50 by the solder 59. Specifically, in a state where the upper end of the cylindrical body 241 of the electric conductor 240 is inserted into the cylindrical portion 54A, the cylindrical body 241 is joined to the jig substrate 50 by the solder 59 applied to the annular portion 54B of the pad portion 54.

  Here, since the inner diameter of the through hole 52 (the cylindrical portion 54A of the pad portion 54) is larger than the outer diameter of the cylindrical body 241, when the press-fitting process is performed after the insertion process (comparative example). When the insertion process is performed, the current-carrying body 240 is not positioned at the predetermined position of the current-carrying body 240, but is positioned at the predetermined position by performing the press-fitting process. Further, if the press-fitting process is performed in a state where the upper end of the cylindrical body 241 is inserted into the through hole 52, the conductive body 240 is difficult to position because the conductive body 240 is inclined.

  On the other hand, in the second embodiment, since the insertion step is performed after the press-fitting step, before the insertion step is performed, the conductive body 240 is positioned at a predetermined position. For this reason, in the second embodiment, the inspection device is manufactured by joining the current-carrying body 240 to the jig substrate 50 while ensuring the positioning accuracy of the current-carrying body 240 as compared with the comparative example described above.

(Modification)
Although the current-carrying member 40 of the first embodiment is joined by the solder 59 in a state of being inserted into the through-hole 52, the present invention is not limited to this. For example, as shown in FIG. 13, soldering is performed in a state in which the end surface of the upper end of the conductor 40 is in contact with a pad 151 formed on the lower surface (lower surface) of the conductor 40 on the jig substrate 50. 159. In the same manner, in the conductive body 240 according to the second embodiment, a configuration in which the lower surface side (lower surface) of the conductive body 240 of the jig substrate 50 is joined by the solder 59 may be adopted.

  When the pad 102 (an example of a contact portion) is arranged on the lower surface of the printed circuit board 100, the movable body 30, the conductive body 40 (the conductive body 240), and the jig substrate 50 are turned upside down. A configuration that is arranged below the positioning unit 20 may be used. In this configuration, a hole through which the conductive body 40 (conductive body 240) passes is formed in the base 22. When the moving body 30 moves upward, the tip of the current-carrying body 40 (current-carrying body 240) that has passed through the hole comes into contact with the pad 102.

  The contact portion with which the conductor 40 (the conductor 240) contacts is not limited to the pad 102, but may be, for example, a lead of an electronic component provided on the printed circuit board 100. Further, the shape of the tip of the pin 44 (pin 244) may be changed in accordance with the location of the contact portion or the like.

  The present invention is not limited to the above embodiment, and various modifications, changes, and improvements can be made without departing from the gist of the present invention. For example, the above-described modifications may be appropriately combined with each other.

Reference Signs List 10 inspection device 20 positioning unit 30 moving body 40 conducting body 41 first cylindrical body 41A opening 42 second cylindrical body 42A opening 43 elastic body 44 pin (an example of a shaft body)
50 Jig substrate (an example of substrate)
52 through hole (example of hole)
59 Solder (an example of joining material)
100 Printed circuit board (example of inspected board)
102 pad (an example of a contact part)
159 Solder (an example of joining material)
200 inspection device 240 conducting body 241 cylindrical body 241A opening 243 elastic body 244 pin (an example of a shaft body)

Claims (6)

A positioning portion for positioning the substrate to be inspected having a contact portion,
A moving body that moves in a direction approaching and moving away from the substrate to be inspected positioned at the positioning portion, the insulating plate having a press-fit hole formed therein, and a large-diameter hole having a diameter larger than the press-fit hole. A moving body on which another insulating plate formed on the same axis as the press-fit hole is stacked ,
A current-carrying body in which a flange-shaped overhanging portion that projects radially outward over the entire circumference is formed at an intermediate portion in the axial direction, and the movement is performed by press-fitting the overhang into the press-in hole of the insulating plate. A current-carrying body fixed to the body, one end of which contacts the contact portion;
The other end of the current-carrying member is joined by a bonding material having conductivity, and a substrate that transmits or receives a signal to the contact portion through the current-carrying member,
Equipped with a,
It said other of the insulating plate, the inspection device that has been superimposed on the side projecting little vent collector in the insulating plate. The inspection device according to claim 1, wherein the other end of the current-carrying body is joined to the substrate by the joining material in a state of being inserted into a hole penetrating the substrate. The energizer is
A bottomed first cylindrical body having an opening,
An elastic body inserted inside the first cylindrical body,
A shaft body that is inserted into the first cylindrical body in a state where a tip end protrudes from the opening, and is pushed toward the substrate to be inspected by an elastic force of the elastic body;
One end has an opening, the other end is a second cylindrical body with a bottom, the overhang formed in the axially intermediate portion is fixed to the insulating plate of the moving body, The second end has a second cylindrical body joined to the substrate,
The inspection device according to claim 1, wherein the first cylinder is fitted to the second cylinder from an opening of the second cylinder. The energizer is
A cylindrical body having an opening at one end and a bottom at the other end , wherein the overhanging portion formed at an intermediate portion in the axial direction is fixed to the insulating plate of the moving body; A cylindrical body whose end is joined to the substrate,
An elastic body inserted inside the cylindrical body,
The inspection device according to claim 1, further comprising: a shaft body that is inserted into the cylindrical body with a front end portion protruding from the opening, and that is pushed toward the substrate to be inspected by an elastic force of the elastic body. . A step of press- fitting the projecting portion formed at the intermediate portion in the second cylindrical body according to claim 3 to the press-fitting hole of the insulating plate in the moving body;
Inserting the other end of the second cylindrical body press-fitted into the press- fitting hole of the insulating plate in the moving body into the hole of the substrate;
Bonding the second cylindrical body inserted into the hole of the substrate to the substrate by the bonding material,
A method for manufacturing an inspection apparatus having: A step of press- fitting the projecting portion formed in the intermediate portion of the cylindrical body according to claim 4 to the press-fitting hole of the insulating plate in the moving body;
Inserting the other end of the cylindrical body press-fitted into the press- fitting hole of the insulating plate in the moving body into the hole of the substrate;
Bonding the tubular body inserted into the hole of the substrate to the substrate by the bonding material;
A method for manufacturing an inspection apparatus having:

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