JP6686470B2 - Printing device and method for manufacturing electronic component - Google Patents

Description

  The present invention relates to a printing apparatus and an electronic component manufacturing method, and more particularly, to a gravure offset printing apparatus and an electronic component manufacturing method using the same.

  As a prior document disclosing the configuration of the gravure offset printing apparatus, there is Japanese Patent No. 5574209 (Patent Document 1). The gravure offset printing apparatus described in Patent Document 1 includes a gravure plate in which concave portions corresponding to a desired printing pattern are formed, and a blanket whose surface is made of silicone rubber.

Patent No. 5574209

  When the gravure offset printing apparatus is used when the internal electrode pattern of the monolithic ceramic capacitor is provided on the ceramic dielectric sheet, the blanket and the ceramic dielectric sheet may come into contact with each other. In this case, a part of the ceramic dielectric sheet may adhere to the blanket and the ceramic dielectric sheet may be damaged.

  The present invention has been made in view of the above problems, and it is possible to prevent a part of the member to be printed from adhering to the transfer member and damage to the member to be printed, a printer, and an electronic component manufacturing method. The purpose is to provide a method.

  A printing apparatus according to the present invention includes an intaglio plate provided with a recess filled with a paste, the paste being transferred by contact with the intaglio plate, and the transferred paste being transferred to a print target member in contact with the print target member. And a drive unit for bringing the transfer member into contact with each of the intaglio plate and the member to be printed. The transfer member has a release layer on the outer peripheral surface.

  In one embodiment of the present invention, the release layer is made of a material containing at least one of silicone, carbon, melamine resin, acrylic resin and fluorine.

In one embodiment of the present invention, the intaglio plate has a flat outer shape.
In one embodiment of the present invention, the intaglio plate has a cylindrical outer shape.

  In one aspect of the present invention, the printing apparatus further includes a printing stage having a flat outer shape. The member to be printed held on the printing stage contacts the transfer member.

  In one aspect of the present invention, the printing apparatus further includes a printing stage having a cylindrical outer shape. The member to be printed held on the printing stage contacts the transfer member.

In one aspect of the present invention, the member to be printed is a ceramic dielectric sheet.
In one embodiment of the present invention, the release layer is made of a material containing fluorine. The fluorine contained in the release layer is fluorinated with the material of the portion of the transfer member that is in contact with the release layer.

  In one embodiment of the present invention, the release layer is made of a material containing carbon. The carbon contained in the release layer is in an amorphous state in which diamond bonds and graphite bonds are combined.

  A method of manufacturing an electronic component based on the present invention includes a step of filling a paste in a concave portion of an intaglio plate, and a step of bringing a cylindrical transfer member having a release layer on an outer peripheral surface into contact with an intaglio plate to transfer the paste to the transfer member. And a step of bringing the member to be printed and the transfer member into contact with each other to transfer the paste to the member to be printed.

  In one aspect of the present invention, the paste is a conductive paste that becomes an internal electrode pattern.

  In one form of the invention, the paste is a ceramic-ceramic dielectric paste that provides a dielectric pattern.

  In one aspect of the present invention, the thickness of the ceramic dielectric sheet is 0.4 μm or more and 4 μm or less.

  In one form of the invention, the ceramic dielectric sheet is lined with a resin film. The adhesive force between the ceramic dielectric sheet and the resin film is larger than the adhesive force between the ceramic dielectric sheet and the release layer of the transfer member.

  In one form of the present invention, the ceramic dielectric sheet contains polyvinyl butyral as a binder. The paste contains at least one of ethyl cellulose, acrylic resin, and polyvinyl butyral as a binder.

In one embodiment of the present invention, the thickness of the internal electrode pattern is 0.2 μm or more and 1.0 μm or less. The area of the internal electrode pattern is 0.01 mm ² or more and 0.2 mm ² or less.

  In one form of the present invention, the electronic component is a monolithic ceramic capacitor. The method for manufacturing an electronic component is a step of stacking a plurality of ceramic dielectric sheets to which internal electrode patterns are transferred to form a rectangular parallelepiped laminated body, a step of firing the laminated body, and a surface of the laminated body. And an external electrode connected to the internal electrode pattern.

  ADVANTAGE OF THE INVENTION According to this invention, it can suppress that a part of member to be printed adheres to a transfer member and a member to be printed is damaged.

1 is a plan view showing a configuration of a printing apparatus according to a first embodiment of the present invention. It is sectional drawing seen from the II-II line arrow direction of FIG. FIG. 3 is a cross-sectional view showing a state in which the transfer member is lowered and brought into contact with the intaglio plate in the printing apparatus according to the first embodiment of the present invention. FIG. 6 is a cross-sectional view showing a state where the intaglio is being moved toward one side in the X-axis direction in the printing apparatus according to the first embodiment of the present invention. FIG. 6 is a cross-sectional view showing a state in which the transfer member is raised to be separated from the intaglio plate and the print stage is moved toward the other side in the X-axis direction in the printing apparatus according to the first embodiment of the present invention. FIG. 6 is a cross-sectional view showing a state in which the transfer member is lowered and brought into contact with the ceramic dielectric sheet held on the printing stage in the printing apparatus according to the first embodiment of the present invention. FIG. 3 is a cross-sectional view showing a state where the printing stage is moved toward one side in the X-axis direction in the printing apparatus according to the first embodiment of the present invention. FIG. 1 is a perspective view showing an appearance of a monolithic ceramic capacitor according to Embodiment 1 of the present invention. FIG. 9 is a cross-sectional view of the monolithic ceramic capacitor of FIG. 8 viewed from the direction of arrows along line IX-IX. FIG. 9 is a cross-sectional view of the monolithic ceramic capacitor of FIG. 8 as seen from the direction of arrows along line XX. FIG. 3 is a flow chart showing a method for manufacturing the multilayer ceramic capacitor according to the first embodiment of the present invention. FIG. 3 is an exploded perspective view showing the laminated structure of the laminated ceramic capacitor according to the first embodiment of the present invention. FIG. 3 is a cross-sectional view showing a state where a dielectric pattern is formed using the printing device according to the first embodiment of the present invention. It is a top view showing the appearance of a mother sheet in which a strip-shaped dielectric pattern was formed. FIG. 6 is a plan view showing a configuration of a printing device according to a second embodiment of the present invention. It is sectional drawing seen from the XVI-XVI line arrow direction of FIG. FIG. 9 is a cross-sectional view showing a state in which a conductive paste is transferred from an intaglio to a transfer member in the printing apparatus according to the third embodiment of the present invention. FIG. 9 is a cross-sectional view showing a state in which a conductive paste is being transferred from a transfer member to a member to be printed in the printing apparatus according to the third embodiment of the present invention. FIG. 11 is a cross-sectional view showing a state in which the conductive paste is transferred from the transfer member to the printing target member while the conductive paste is transferred from the intaglio plate to the transfer member in the printing apparatus according to the fourth embodiment of the present invention. It is the front view which looked at the state of FIG. 19 from the arrow XX direction.

  Hereinafter, a printing apparatus according to each embodiment of the present invention and a method for manufacturing an electronic component will be described in detail with reference to the drawings. In the following embodiments, the same or corresponding parts will be denoted by the same reference symbols in the drawings, and the description thereof will not be repeated.

(Embodiment 1)
FIG. 1 is a plan view showing the configuration of the printing apparatus according to the first embodiment of the present invention. FIG. 2 is a cross-sectional view as seen from the direction of arrows II-II in FIG. As shown in FIGS. 1 and 2, the printing apparatus 100 according to the first embodiment of the present invention includes a base 110 extending in the X-axis direction and having a flat surface on the upper surface, and a base 110 provided on the base 110. And a linear guide 120 extending in the direction.

  The printing apparatus 100 further includes an intaglio plate 130 attached to the linear guide 120 so as to be movable in the X-axis direction. The main surface of the intaglio plate 130 is provided with a plurality of recesses 131 filled with paste. In the present embodiment, the intaglio plate 130 has a flat outer shape.

  The intaglio 130 is connected to a servo cylinder 181 to which a motor 180 is connected. When the motor 180 is driven, the intaglio plate 130 moves linearly in an arbitrary direction along the X-axis. The intaglio 130 may be connected to a ball screw to which the motor 180 is connected, so that the intaglio 130 linearly moves in an arbitrary direction along the X-axis.

  Each of the plurality of recesses 131 has, for example, a length in the X-axis direction of 200 μm or more and 1100 μm or less, a width in the Y-axis direction of 60 μm or more and 220 μm or less, and a depth in the Z-axis direction of 1 μm or more and 10 μm or less. From the viewpoint of applying the present invention, it is preferable that the length in the X-axis direction is 200 μm or more and 750 μm or less, the width in the Y-axis direction is 60 μm or more and 150 μm or less, and the depth in the Z-axis direction is 1 μm or more and 5 μm or less. In the present embodiment, each of the plurality of recesses 131 has a rectangular shape in plan view.

  In the present embodiment, the intaglio plate 130 is composed of a glass plate that is hard-plated, but the structure of the intaglio plate 130 is not limited to the above, and is formed by a hard-plated copper plate or an electroforming method. It may be composed of a Ni plate.

  The printing apparatus 100 further includes a dispenser (not shown) that fills each of the plurality of recesses 131 with paste. In this embodiment, the paste is a conductive paste 13a that will be an internal electrode pattern described later.

  The printing apparatus 100 further includes a first blade 170 and a second blade 171 for scraping out excess paste filled in each of the plurality of recesses 131. The length of each of the first blade 170 and the second blade 171 in the Y-axis direction is longer than the length of the range in which all the recesses 131 arranged in the Y-axis direction are located.

  The first blade 170 and the second blade 171 are inclined in opposite directions when viewed from the Y-axis direction. The first blade 170 slides on the upper surface of the intaglio 130 when the intaglio 130 moves toward one side in the X-axis direction. The second blade 171 slides on the upper surface of the intaglio 130 when the intaglio 130 moves toward the other side in the X-axis direction. Each of the first blade 170 and the second blade 171 is provided with a height adjusting mechanism (not shown).

  The printing apparatus 100 further includes a printing stage 140 attached to the linear guide 120 so as to be movable in the X-axis direction. The printing stage 140 includes a holding mechanism (not shown) that holds a member to be printed. In the present embodiment, the holding mechanism holds the member to be printed by vacuum suction, but the method of holding the member to be printed by the holding mechanism is not limited to vacuum suction, and electrostatic suction or the like may be used. In this embodiment, the printing stage 140 has a flat plate-shaped outer shape. The member to be printed is the ceramic dielectric sheet 12a.

  The print stage 140 is connected to the servo cylinder 181. By driving the motor 180, the printing stage 140 linearly moves in an arbitrary direction along the X-axis. The printing stage 140 is located at a certain distance from the intaglio 130 in the X-axis direction, and is located on one side in the X-axis direction when viewed from the intaglio 130. The printing stage 140 may be driven by a motor other than the motor 180 that drives the intaglio 130. In this case, it is possible to drive the intaglio 130 and the printing stage 140 separately.

  As shown in FIG. 2, the printing apparatus 100 includes a cylindrical transfer member 150 that contacts the intaglio 130 to displace the paste, and also contacts the printing target member to transfer the transferred paste to the printing target member. Further prepare. At both ends of the transfer member 150 in the Y-axis direction, shaft portions that are rotatably supported around the axis are provided, and rotation drive portions that rotate the transfer member 150 around the axis are provided.

  The printing apparatus 100 further includes a pair of transfer member support mechanisms 160 that are provided on the base 110 and face each other at intervals in the Y-axis direction. The linear guide 120 is located between the pair of transfer member support mechanisms 160 when viewed from the Z direction. One of the pair of transfer member support mechanisms 160 supports one shaft of the transfer member 150, and the other of the pair of transfer member support mechanisms 160 supports the other shaft of the transfer member 150. is doing. The transfer member 150 is supported by a pair of transfer member support mechanisms 160 with the central axis of the transfer member 150 parallel to the main surface of the intaglio 130.

  Each of the pair of transfer member support mechanisms 160 is provided with a guide hole 161 extending in the Z-axis direction in order to adjust the height of the transfer member 150. A motor 190 for moving the transfer member 150 up and down along the guide hole 161 is provided on one of the pair of transfer member support mechanisms 160. A motor 190 may be provided in each of the pair of transfer member supporting mechanisms 160, and the parallelism of the transfer member 150 with respect to the intaglio 130 may be adjusted by independently driving the two motors 190.

  When the transfer member 150 is lowered, the motor 180 is driven to move the intaglio 130 in the X-axis direction while contacting the transfer member 150. As a result, the transfer member 150 makes rolling contact with the upper surface of the intaglio 130. The rotation driving unit may synchronize the movement of the intaglio 130 in the X-axis direction with the rotation movement of the transfer member 150. Similarly, when the transfer member 150 is lowered, the motor 180 is driven to move the member to be printed held on the printing stage 140 in the X-axis direction while being in contact with the transfer member 150. As a result, the transfer member 150 makes rolling contact with the upper surface of the printing target member. The rotation drive unit may synchronize the movement of the printing stage 140 in the X-axis direction with the rotation movement of the transfer member 150. In the present embodiment, the motor 180 serves as a driving unit that causes the transfer member 150 to make rolling contact with each of the intaglio 130 and the member to be printed.

  The transfer member 150 includes a cylindrical body portion 151, an elastic body portion 152 that covers the outer periphery of the body portion 151, and a release layer 153 that covers the entire surface of the elastic body portion 152. That is, the transfer member 150 has the release layer 153 on the outer peripheral surface. The release layer 153 is harder than the elastic body portion 152 and has a high release property.

  In the present embodiment, the body 151 is made of iron, but the material of the body 151 is not limited to iron, but may be another metal or a composite material such as CFRP (Carbon Fiber Reinforced Plastics). Good.

  In the present embodiment, the elastic body portion 152 is made of silicone rubber, but the material of the elastic body portion 152 is not limited to silicone rubber, and other rubber having an appropriate deformation resistance may be used. In this embodiment, the elastic body portion 152 is formed by winding the silicone rubber sheet around the body portion 151.

  In the present embodiment, the release layer 153 is composed of a silicone layer having a higher crosslink density and a higher hardness than silicone rubber. However, the material forming the release layer 153 is not limited to silicone, and may be any material containing at least one of silicone, carbon, melamine resin, acrylic resin and fluorine.

  When the release layer 153 is made of a material containing fluorine, the fluorine contained in the release layer 153 is fluorinated with the material of the portion of the transfer member 150 which is in contact with the release layer 153. That is, the fluorine contained in the release layer 153 is fluorinated with the silicone rubber forming the outer peripheral surface of the elastic body portion 152.

  When the release layer 153 is made of a material containing carbon, the carbon contained in the release layer 153 is in an amorphous state in which diamond bonds and graphite bonds are combined.

  Hereinafter, the operation of the printing apparatus 100 according to the first embodiment of the present invention will be described. First, each of the plurality of concave portions 131 of the intaglio plate 130 is filled with the conductive paste 13a by a dispenser. Excessive conductive paste 13a on the intaglio plate 130 is scraped off by the first blade 170 and the second blade 171.

  FIG. 3 is a cross-sectional view showing a state where the transfer member is lowered and brought into contact with the intaglio plate in the printing apparatus according to the first embodiment of the present invention. As shown in FIGS. 2 and 3, the motor 190 is driven to lower the transfer member 150 along the guide hole 161 as indicated by the arrow 1. When the transfer member 150 comes into contact with the end of the upper surface of the intaglio 130 on one side in the X-axis direction, the motor 190 is stopped.

  FIG. 4 is a cross-sectional view showing a state where the intaglio is being moved toward one side in the X-axis direction in the printing apparatus according to the first embodiment of the present invention. As shown in FIGS. 1, 2, and 4, the motor 180 is driven to move the intaglio 130 toward one side in the X-axis direction as indicated by arrow 2, whereby the transfer member 150 is moved as indicated by arrow 3. It rotates and comes into rolling contact with the upper surface of the intaglio 130. At this time, the conductive paste 13 a filled in each of the plurality of recesses 131 is sequentially displaced on the release layer 153 of the transfer member 150.

  FIG. 5 is a cross-sectional view showing a state in which the transfer member is raised to be separated from the intaglio plate and the print stage is moved toward the other side in the X-axis direction in the printing apparatus according to the first embodiment of the present invention. . As shown in FIGS. 1, 2, and 5, the motor 190 is driven to raise the transfer member 150 along the guide hole 161 as indicated by the arrow 4. Further, by driving the motor 180 to move the print stage 140 toward the other side in the X-axis direction as indicated by arrow 5, the ceramic dielectric sheet 12a held on the print stage 140 is moved in the X-axis direction. The transfer member 150 is positioned above the one end.

  FIG. 6 is a cross-sectional view showing a state in which the transfer member is lowered and brought into contact with the ceramic dielectric sheet 12a held on the printing stage in the printing apparatus according to the first embodiment of the present invention. As shown in FIGS. 2 and 6, the motor 190 is driven to lower the transfer member 150 along the guide hole 161 as indicated by arrow 1. When the transfer member 150 comes into contact with one end of the upper surface of the ceramic dielectric sheet 12 a held on the printing stage 140 in the X-axis direction, the motor 190 is stopped.

  FIG. 7 is a cross-sectional view showing a state where the printing stage is moved toward one side in the X-axis direction in the printing apparatus according to the first embodiment of the present invention. As shown in FIGS. 1, 2, and 7, the motor 180 is driven to move the print stage 140 toward one side in the X-axis direction as shown by arrow 2, whereby the transfer member 150 is moved as shown by arrow 3. And is in contact with the upper surface of the ceramic dielectric sheet 12a held on the printing stage 140. At this time, the conductive paste 13a transferred to the transfer member 150 is sequentially transferred onto the ceramic dielectric sheet 12a.

  In the printing apparatus 100 according to the first embodiment of the present invention, the transfer member 150 has the release layer 153 on the outer peripheral surface. Therefore, after the transfer member 150 and the ceramic dielectric sheet 12a are in contact with each other as shown in FIG. 6, when the printing stage 140 is moved toward one side in the X-axis direction as shown in FIG. The sheet 12 a does not adhere to the release layer 153. As described above, the printing apparatus 100 according to the first embodiment of the present invention can prevent a part of the ceramic dielectric sheet 12a from adhering to the transfer member 150 and being damaged.

  Here, a laminated ceramic capacitor which is an electronic component according to the present embodiment will be described. FIG. 8 is a perspective view showing the appearance of the monolithic ceramic capacitor according to Embodiment 1 of the present invention. FIG. 9 is a cross-sectional view of the monolithic ceramic capacitor of FIG. 8 as seen from the direction of arrow IX-IX. FIG. 10 is a cross-sectional view of the monolithic ceramic capacitor of FIG. 8 as seen from the direction of arrows along line XX.

  As shown in FIGS. 8 to 9, the laminated ceramic capacitor 10 according to the first embodiment of the present invention includes a laminated body 11 and a pair of external electrodes 14.

  The laminated body 11 has a substantially rectangular parallelepiped outer shape. The laminated body 11 includes a plurality of laminated dielectric layers 12 and a plurality of internal electrode layers 13. The stacked body 11 is orthogonal to both the stacking direction T and the width direction W, and the pair of main surfaces 16 facing each other in the stacking direction T, the pair of side surfaces 17 facing each other in the width direction W orthogonal to the stacking direction T. And a pair of end faces 15 facing each other in the length direction L.

  As described above, the laminated body 11 has a substantially rectangular parallelepiped outer shape, but it is preferable that the corners and the ridges are rounded. The corner portion is a portion where the three surfaces of the laminated body 11 intersect, and the ridge portion is a portion where the two surfaces of the laminated body 11 intersect. Concavities and convexities may be formed on at least one of the pair of main surfaces 16, the pair of side surfaces 17, and the pair of end surfaces 15.

  In the laminated body 11, the outer dimension in the length direction L is not always larger than the outer dimension in the width direction W. In the present embodiment, the laminated body 11 has an outer dimension in the length direction L of 250 μm or more and 700 μm or less, an outer dimension in the width direction W of 120 μm or more and 350 μm or less, and an outer dimension in the laminating direction T of 50 μm or more and 350 μm. It is the following. The above external dimensions can be measured by using a micrometer or by observing the laminated body 11 with a microscope.

  The laminated body 11 is divided in the laminating direction T into a pair of an outer layer portion and an inner layer portion. The pair of outer layer portions are located adjacent to the pair of main surfaces 16 of the laminated body 11, respectively, and are located between the main surface 16 and the inner electrode layer 13 closest to the main surface 16 of the dielectric layer 12. It is composed of. The inner layer portion is a region sandwiched by a pair of outer layer portions. That is, the inner layer portion is composed of a plurality of dielectric layers 12 that do not form the outer layer portion and all the internal electrode layers 13.

  The number of laminated dielectric layers 12 is preferably 3 or more and 10 or less. The thickness of each of the pair of outer layer portions is preferably 0.8 μm or more and 8 μm or less. The thickness of each of the plurality of dielectric layers 12 included in the inner layer portion is preferably 0.4 μm or more and 4 μm or less. In particular, from the viewpoint of applying the present invention, each of the plurality of dielectric layers 12 included in the inner layer portion has a thickness of 0.5 μm or more and 1.0 μm or less, or 0.3 μm or more and less than 0.5 μm. Is preferred.

The dielectric layer 12 is composed of a perovskite type compound containing Ba or Ti. As a material forming the dielectric layer 12, a dielectric ceramic containing BaTiO ₃ , CaTiO ₃ , SrTiO _3, CaZrO ₃ or the like as a main component can be used. Further, a material in which a Mn compound, a Mg compound, a Si compound, a Fe compound, a Cr compound, a Co compound, a Ni compound, an Al compound, a V compound, a rare earth compound or the like is added to these main components as a subcomponent is used. Good.

As a method for producing the dielectric ceramics, a known method such as a solid phase method, a hydrothermal synthesis method or a hydrolysis method can be adopted. When the dielectric ceramic contains Ba, a Ba compound such as BaCO ₃ , when it contains Ti, a Ti compound such as TiO _2, and when it contains Ca, a Ca compound such as CaCO ₃ forms the dielectric ceramic. It is suitable for use.

  The plurality of inner electrode layers 13 include a plurality of first inner electrode layers electrically connected to the first outer electrode of the pair of outer electrodes 14 and a second outer electrode of the pair of outer electrodes 14. And a plurality of second internal electrode layers electrically connected to.

  The number of laminated internal electrode layers 13 is preferably 20 or more and 250 or less. The thickness of each of the plurality of internal electrode layers 13 is preferably 0.2 μm or more and 1.0 μm or less. It is preferable that the coverage of each of the plurality of internal electrode layers 13 covering the dielectric layer 12 without a gap is 70% or more and 100% or less.

  Each of the first internal electrode layer and the second internal electrode layer has a substantially rectangular shape in plan view. The first internal electrode layers and the second internal electrode layers are alternately arranged at equal intervals in the stacking direction T of the stacked body 11. Further, the first internal electrode layer and the second internal electrode layer are arranged so as to face each other with the dielectric layer 12 interposed therebetween. Each of the first internal electrode layer and the second internal electrode layer includes a counter electrode portion facing each other and a lead electrode portion led from the counter electrode portion to the end surface 15 side of the laminate 11. . Capacitance is formed by the dielectric layer 12 being located between the opposing electrode portions. This causes the function of the capacitor.

  When viewed from the stacking direction T, the stacked body 11 has a side portion located between the counter electrode portion and each of the pair of side surfaces 17, and an end portion positioned between the counter electrode portion and each of the pair of end surfaces 15. Includes and.

  The material forming the internal electrode layer 13 is made of one kind of metal selected from the group consisting of Ni, Cu, Ag, Pd and Au, or an alloy containing this metal. Alloys and the like can be used. The internal electrode layer 13 may include particles of a dielectric material having the same composition as the dielectric ceramics included in the dielectric layer 12. The conductive paste 13a to be the internal electrode layer 13 contains at least one of ethyl cellulose, acrylic resin, and polyvinyl butyral as a binder.

  The first external electrode is provided from one end surface 15 of the stacked body 11 to each of the pair of main surfaces 16 and the pair of side surfaces 17. The second external electrode is provided from the other end surface 15 of the stacked body 11 to each of the pair of main surfaces 16 and the pair of side surfaces 17.

  Each of the pair of external electrodes 14 includes a base electrode layer and a plating layer disposed on the base electrode layer. The base electrode layer includes at least one of a baking layer, a resin layer and a thin film layer.

  The baking layer includes glass and metal. The material forming the baking layer is composed of one kind of metal selected from the group consisting of Ni, Cu, Ag, Pd and Au, or an alloy containing this metal, for example, an alloy of Ag and Pd. Can be used. The baking layer may be composed of a plurality of laminated layers. The baking layer may be a layer obtained by applying a conductive paste to the laminate 11 and baking it, or a layer baked at the same time as the internal electrode layers 13. The thickness of the baking layer is preferably 10 μm or more and 100 μm or less.

  The resin layer contains conductive particles and a thermosetting resin. When the resin layer is provided, the resin layer may be directly provided on the laminate 11 without providing the baking layer. The resin layer may be composed of a plurality of laminated layers. The thickness of the resin layer is preferably 10 μm or more and 150 μm or less.

  The thin film layer is formed by a thin film forming method such as a sputtering method or a vapor deposition method. The thin film layer is a layer of 1 μm or less in which metal particles are deposited.

  The material forming the plating layer is composed of one kind of metal selected from the group consisting of Ni, Cu, Ag, Pd, and Au, or an alloy containing this metal, for example, an alloy of Ag and Pd. Can be used.

  The plating layer may be composed of a plurality of laminated layers. In this case, the plating layer preferably has a two-layer structure in which the Sn plating layer is formed on the Ni plating layer. The Ni plating layer has a function of preventing the base electrode layer from being eroded by solder when mounting the ceramic electronic component. The Sn plating layer has a function of improving wettability with solder when mounting the ceramic electronic component and facilitating mounting of the ceramic electronic component. The thickness of each plated layer is preferably 1.0 μm or more and 10.0 μm or less.

  Each of the pair of external electrodes 14 may be composed of a plating layer provided on the stacked body 11. In this case, a catalyst layer may be provided on the laminated body 11. The plating layer is preferably composed of a first plating layer and a second plating layer provided on the first plating layer. The material forming each of the first plating layer and the second plating layer is one metal selected from the group consisting of Ni, Cu, Ag, Pd, Au, Sn, Pb, Bi and Zn, or this metal. It is preferably composed of an alloy containing. It is preferable that each of the first plating layer and the second plating layer does not contain a glass component.

  For example, when the material forming the internal electrode layers 13 is Ni, the material forming the first plating layer is preferably Cu, which has good bondability with Ni. It is preferable that the first plating layer is made of Ni having a function of preventing corrosion by solder, and the second plating layer is made of Sn or Au having a function of improving wettability with solder.

  The second plating layer is not necessarily provided, and each of the pair of external electrodes 14 may be composed of only the first plating layer. Alternatively, at least one plating layer may be further formed on the second plating layer. The thickness of each plated layer is preferably 1.0 μm or more and 10.0 μm or less. The ratio of the metal component contained per unit volume of the plating layer is preferably 99% by volume or more.

  Hereinafter, a method for manufacturing the monolithic ceramic capacitor 10 according to Embodiment 1 of the present invention will be described with reference to the drawings. FIG. 11 is a flowchart showing the method for manufacturing the monolithic ceramic capacitor according to the first embodiment of the present invention.

  As shown in FIG. 11, when manufacturing the monolithic ceramic capacitor 10 according to Embodiment 1 of the present invention, first, a ceramic dielectric slurry is prepared (step S1). Specifically, the ceramic dielectric powder, the additive powder, the binder resin, the solution, and the like are dispersed and mixed, whereby a ceramic dielectric slurry is prepared. The ceramic dielectric slurry may be solvent-based or water-based. When the ceramic dielectric slurry is used as a water-based paint, the ceramic dielectric slurry is prepared by mixing a water-soluble binder and a dispersant with a dielectric material dissolved in water. In the present embodiment, the ceramic dielectric slurry contains polyvinyl butyral as a binder.

  Next, a ceramic dielectric sheet is formed (step S2). Specifically, the ceramic dielectric slurry is formed into a sheet on a carrier film by using a die coater, a gravure coater, a microgravure coater, or the like and dried to form a ceramic dielectric sheet.

  Next, a mother sheet is formed (step S3). Specifically, a conductive paste is applied to the ceramic dielectric sheet by the printing apparatus 100 so as to have a predetermined pattern, thereby forming a mother sheet having a predetermined internal electrode pattern on the ceramic dielectric sheet. To be done. As the mother sheet, in addition to the mother sheet having the internal electrode pattern, a ceramic dielectric sheet that has not undergone the above step S3 is also prepared.

  Here, the formed mother sheet will be described. FIG. 12 is an exploded perspective view showing the laminated structure of the laminated ceramic capacitor according to the first embodiment of the present invention. In FIG. 12, only a portion corresponding to one chip 11a in the mother sheet group is shown.

As shown in FIGS. 11 and 12, a plurality of mother sheets 11a1, 11a2, 11a3 are stacked (step S4). Specifically, a predetermined number of mother sheets 11a1 that are not formed with internal electrode patterns and are made of only the ceramic dielectric sheets 12a are laminated. A mother sheet 11a2 having an internal electrode pattern made of the conductive paste 13a and serving as a first internal electrode layer formed in a matrix on the ceramic dielectric sheet 12a, and a second internal electrode layer made of the conductive paste 13a thereon. A predetermined number of internal sheets of the internal electrode pattern are alternately laminated with the mother sheet 11a3 in which the ceramic dielectric sheet 12a is formed in a matrix. Further, a predetermined number of mother sheets 11a1 which are not formed with the internal electrode patterns and are composed only of the ceramic dielectric sheets 12a are laminated thereon. This constitutes a mother sheet group. In this embodiment, the thickness of the internal electrode pattern is 0.2 μm or more and 1.0 μm or less. The area of the internal electrode pattern is 0.01 mm ² or more and 0.2 mm ² or less. From the viewpoint of applying the present invention, the thickness of the internal electrode pattern is preferably 0.4 μm or more and 0.8 μm or less. Area of the internal electrode pattern is preferably 0.02 mm ² or more 0.1 mm ² or less.

  Next, the mother sheet group is pressure-bonded to form a dielectric block (step S5). Specifically, the dielectric block is formed by pressing the mother sheet group in the stacking direction by a hydrostatic press or a rigid press to press-bond it.

  Next, the dielectric block is divided to form the chip 11a (step S6). Specifically, the dielectric block is divided into a matrix by push cutting or dicing, and is divided into a plurality of chips 11a.

  In the above step S6, the end of the internal electrode pattern to be the first internal electrode layer is exposed on one end surface of the chip 11a, and the end of the internal electrode pattern to be the second internal electrode layer is the chip. The dielectric block is cut so as to be exposed at the other end surface of 11a.

  Next, barrel polishing of the chip 11a is performed (step S7). Specifically, the chip 11a is enclosed in a small box called a barrel together with a media ball having a hardness higher than that of the dielectric material, and the barrel is rotated to polish the chip 11a. As a result, the corners and ridges of the chip 11a are rounded.

  Next, the chips 11a are fired (step S8). Specifically, the chip 11a is heated, whereby the dielectric material and the conductive material contained in the chip 11a are fired to form the laminated body 11.

The firing temperature is appropriately set depending on the dielectric material and the conductive material. For example, after heating the chip 11a at a temperature of 350 ° C. for 3 hours in an N ₂ atmosphere to burn the binder, By firing for 3 minutes at a temperature of 1145 ° C. or more and 1195 ° C. or less in a reducing atmosphere composed of H ₂ —N ₂ —H ₂ O gas having an oxygen partial pressure of 10 ⁻¹² MPa or more and 10 ⁻⁹ MPa or less. The laminated body 11 may be manufactured.

  Next, external electrodes are formed (step S9). For example, the base electrode layer is formed by firing the conductive paste applied to both end surfaces 15 of the laminate 11, and the base electrode layer is subjected to Ni plating and Sn plating in this order to form a plated layer. As a result, a pair of external electrodes 14 is formed on the outer surface of the laminated body 11.

  Through the series of steps described above, the monolithic ceramic capacitor 10 according to Embodiment 1 of the present invention can be manufactured. The printing apparatus 100 according to the first embodiment of the present invention transfers the conductive paste 13a onto the ceramic dielectric sheet 12a when manufacturing the laminated ceramic capacitor 10.

  The thickness of the ceramic dielectric sheet 12a is 0.4 μm or more and 4 μm or less. In this embodiment, the ceramic dielectric sheet 12a is lined with a resin film. The fixing force between the ceramic dielectric sheet 12a and the resin film is larger than the fixing force between the ceramic dielectric sheet 12a and the release layer 153 of the transfer member 150. This can prevent the ceramic dielectric sheet 12 a from adhering to the release layer 153 of the transfer member 150.

  Note that the printing device 100 may be used to transfer the ceramic dielectric paste to be the dielectric pattern onto the ceramic dielectric sheet 12a. Specifically, the dielectric pattern may be formed by using the printing apparatus 100 at the positions where the internal electrode patterns of the mother sheets 11a2 and 11a3 are not formed.

  FIG. 13 is a sectional view showing a state in which a dielectric pattern is formed using the printing apparatus according to the first embodiment of the present invention. FIG. 14 is a plan view showing the appearance of a mother sheet on which a strip-shaped dielectric pattern is formed. In FIG. 13, it is shown in the same sectional view as FIG. 7.

  As shown in FIG. 13, the printing apparatus 100 is used to transfer the ceramic dielectric paste 12as to be a dielectric pattern onto the ceramic dielectric sheet 12a. The physical properties of the ceramic dielectric paste 12as are close to those of the conductive paste 13a, and easily adhere to the release layer 153 of the transfer member 150. The ceramic dielectric paste 12as may have the same material composition as the ceramic dielectric paste forming the ceramic dielectric sheet 12a, or may have a different material composition. In the present embodiment, the ceramic dielectric paste 12as contains at least one of ethyl cellulose, acrylic resin, and polyvinyl butyral as a binder. In particular, the binder included in the ceramic dielectric sheet 12a and the binder included in the ceramic dielectric paste 12as are preferably different.

  Although FIG. 13 shows a state in which the ceramic dielectric paste 12as is transferred at intervals in the X-axis direction, the ceramic dielectric paste 12as is transferred in a continuous band shape in the X-axis direction as shown in FIG. You may.

  As shown in FIGS. 13 and 14, by disposing the dielectric pattern at a position where the internal electrode patterns of the mother sheets 11a2 and 11a3 are not formed, a step is generated on the side portion and the end portion of the laminated body 11. Can be suppressed. The dielectric pattern may be formed on the mother sheets 11a2 and 11a3 at the positions where the internal electrode patterns are not formed. As shown in FIG. 14, the dielectric patterns correspond to the side portions of the laminated body 11. It may be formed only at the position to be formed. Furthermore, the dielectric pattern may be formed so as to overlap the internal electrode pattern, or may be formed with a space from the internal electrode pattern.

  Here, an example in which the conductive paste 13a is transferred to the 10 ceramic dielectric sheets 12a using the printing apparatus 100 according to the present embodiment and the release layer 153 are not provided are different from the printing apparatus 100. An experimental example in which the probability of peeling between the ceramic dielectric sheet 12a and the resin film was tested in a comparative example in which the conductive paste 13a was transferred to ten ceramic dielectric sheets 12a using a printing device will be described.

  In the present experimental example, if even a part of the ceramic dielectric sheet 12a was peeled from the resin film, it was judged that the peeling occurred. The incidence of peeling was 0/10 in the example and 9/10 in the comparative example. From the results of this experiment, it was confirmed that by providing the release layer 153, it is possible to prevent damage to the print-receiving member due to a part of the print-receiving member being attached to the transfer member.

(Embodiment 2)
Hereinafter, the printing apparatus according to the second embodiment of the present invention will be described with reference to the drawings. The printing apparatus 200 according to the second embodiment of the present invention is different from the printing apparatus 100 according to the first embodiment of the present invention mainly in that the ceramic dielectric sheet has a long shape. The description of the configuration similar to that of the printing apparatus 100 according to No. 1 will not be repeated.

  FIG. 15 is a plan view showing the configuration of the printing apparatus according to the second embodiment of the present invention. 16 is a cross-sectional view as seen from the direction of arrows XVI-XVI in FIG. As shown in FIGS. 15 and 16, in the printing apparatus 200 according to the second embodiment of the present invention, the conductive paste 13a is transferred to the long ceramic dielectric sheet 12aL.

  The printing device 200 according to the second embodiment of the present invention further includes a sheet winding device (not shown) that moves the portion of the ceramic dielectric sheet 12aL to which the conductive paste 13a is transferred in the Y-axis direction. The linear guide 120 is provided with an opening for moving the portion of the ceramic dielectric sheet 12aL to which the conductive paste 13a is transferred in the Y-axis direction.

  Each of the intaglio 130 and the printing stage 140 is fixed on the base 110. The intaglio 130 and the printing stage 140 are located at a distance from each other in the X-axis direction.

  The pair of transfer member support mechanisms 160 are attached to the linear guide 120 so as to be movable in the X-axis direction. The pair of transfer member support mechanisms 160 is connected to a servo cylinder 181 to which a motor 180 is connected. By driving the motor 180, the pair of transfer member support mechanisms 160 linearly moves in an arbitrary direction along the X-axis. As a result, the transfer member 150 supported by the pair of transfer member support mechanisms 160 linearly moves in the X-axis direction.

  When the transfer member 150 descends, the motor 180 is driven to move the transfer member 150 in the X-axis direction while contacting the intaglio 130. As a result, the transfer member 150 makes rolling contact with the upper surface of the intaglio 130. Similarly, when the transfer member 150 is lowered, the motor 180 is driven to move the transfer member 150 in the X-axis direction while contacting the member to be printed held on the printing stage 140. As a result, the transfer member 150 makes rolling contact with the upper surface of the printing target member.

  In the printing apparatus 200 according to the second embodiment of the present invention, the printing efficiency of the printing apparatus 200 can be improved by continuously transferring the conductive paste 13a to the long ceramic dielectric sheet 12aL. .

(Embodiment 3)
Hereinafter, a printing apparatus according to the third embodiment of the present invention will be described with reference to the drawings. The printing apparatus 300 according to the third embodiment of the present invention is different from the printing apparatus 200 according to the second embodiment of the present invention mainly in that the intaglio plate has a cylindrical outer shape. The description of the same configuration as the printing apparatus 200 will not be repeated.

  FIG. 17 is a cross-sectional view showing a state in which the conductive paste is transferred from the intaglio plate to the transfer member in the printing apparatus according to the third embodiment of the present invention. FIG. 18 is a cross-sectional view showing a state where the conductive paste is being transferred from the transfer member to the printing target member in the printing apparatus according to the third embodiment of the present invention.

  As shown in FIGS. 17 and 18, in the printing apparatus 300 according to the third embodiment of the present invention, the intaglio 330 has a columnar outer shape. The intaglio plate 330 is provided with a plurality of recesses 331 filled with paste. A container 310 that stores the conductive paste 13 a is arranged on the base 110.

  The intaglio plate 330 is arranged on the container 310 such that a part of the intaglio plate 330 is located inside the container 310. The intaglio 330 is driven by a motor (not shown) to rotate as shown by an arrow 6, whereby each of the plurality of recesses 331 is filled with the conductive paste 13a. The first blade 170 is arranged so as to contact the outer peripheral surface of the intaglio 330.

  The operation of the printing apparatus 300 according to the third embodiment of the present invention will be described below. First, as shown in FIG. 17, with the intaglio 330 and the transfer member 150 in contact with each other, the motor is driven to rotate the intaglio 330. As a result, the intaglio 330 and the transfer member 150 make rolling contact. As a result, the conductive paste 13a filled in the plurality of recesses 331 is sequentially transferred to the transfer member 150.

  Next, the motor 190 is driven to raise the transfer member 150 along the guide hole 161. Further, by driving the motor 180 to move the transfer member 150 toward one side in the X-axis direction, one end of the ceramic dielectric sheet 12a held on the printing stage 140 on the one side in the X-axis direction is moved. The transfer member 150 is positioned above.

  Further, the motor 190 is driven to lower the transfer member 150 along the guide hole 161. When the transfer member 150 comes into contact with one end of the upper surface of the ceramic dielectric sheet 12 a held on the printing stage 140 in the X-axis direction, the motor 190 is stopped.

  Next, as shown in FIG. 18, by driving the motor 180 to move the transfer member 150 toward the other side in the X-axis direction, the transfer member 150 rotates as indicated by arrow 3, and the printing stage 140. It makes rolling contact with the upper surface of the ceramic dielectric sheet 12a held above. At this time, the conductive paste 13a transferred to the transfer member 150 is sequentially transferred onto the ceramic dielectric sheet 12a.

  In the printing apparatus 300 according to the third embodiment of the present invention, the step of filling each of the plurality of concave portions 331 of the intaglio 330 with the conductive paste 13a and the transfer member 150 of the conductive paste 13a filled in the plurality of concave portions 331. Since the step of sequentially rearranging the sheets can be performed in the same step, the printing efficiency of the printing apparatus 300 can be improved.

(Embodiment 4)
Hereinafter, a printing apparatus according to the fourth embodiment of the present invention will be described with reference to the drawings. The printing apparatus 400 according to the fourth embodiment of the present invention is different from the printing apparatus 300 according to the third embodiment of the present invention mainly in that the printing stage is a cylindrical impression cylinder. The description of the configuration similar to that of the printing apparatus 300 according to No. 3 will not be repeated.

  FIG. 19 is a cross-sectional view showing a state in which the conductive paste is transferred from the transfer member to the printing target member while being transferred from the intaglio plate to the transfer member in the printing apparatus according to the fourth embodiment of the present invention. is there. FIG. 20 is a front view of the state of FIG. 19 seen from the arrow XX direction.

  As shown in FIGS. 19 and 20, in the printing apparatus 400 according to the fourth embodiment of the present invention, the printing stage 440 is a columnar impression cylinder. A long ceramic dielectric sheet 12aL is hung on the printing stage 440. The printing stage 440 is arranged so that the ceramic dielectric sheet 12aL can be pressed between the outer peripheral surface of the printing stage 440 and the outer peripheral surface of the transfer member 150. That is, the transfer member 150 makes rolling contact with the outer peripheral surface of the printing stage 440.

  The operation of the printing apparatus 400 according to the fourth embodiment of the present invention will be described below. As shown in FIG. 19, the intaglio 330 is rotated as indicated by arrow 6, the transfer member 150 is rotated as indicated by arrow 3, and the printing stage 440 is rotated as indicated by arrow 7. As a result, the conductive paste 13a filled in the plurality of recesses 331 is transferred to the transfer member 150, and the conductive paste 13a transferred to the transfer member 150 is sent by the printing stage 440 as shown by an arrow 8. It is transferred to the existing ceramic dielectric sheet 12aL.

  In the printing apparatus 400 according to the third embodiment of the present invention, the step of filling each of the plurality of recesses 331 of the intaglio 330 with the conductive paste 13a and the transfer member 150 of the conductive paste 13a filled in the plurality of recesses 331. Since the step of sequentially transposing to the transfer member 150 and the step of transferring the conductive paste 13a transferred to the transfer member 150 to the ceramic dielectric sheet 12aL can be performed in the same step, the printing efficiency of the printing apparatus 400 can be improved. it can.

  In the above description of the embodiments, combinable configurations may be combined with each other.

  The embodiments disclosed this time are to be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description but by the claims, and is intended to include meanings equivalent to the claims and all modifications within the scope.

  10 Multilayer Ceramic Capacitor, 11 Multilayer, 11a Chip, 11a1, 11a2, 11a3 Mother Sheet, 12 Dielectric Layer, 12a, 12aL Ceramic Dielectric Sheet, 12as Ceramic Dielectric Slurry, 13 Internal Electrode Layer, 13a Conductive Paste, 14 External electrode, 15 end surface, 16 main surface, 17 side surface, 100, 200, 300, 400 printing device, 110 base, 120 linear guide, 130, 330 intaglio plate, 131, 331 recessed part, 140, 440 printing stage, 150 transfer member, 151 body part, 152 elastic part, 153 release layer, 160 transfer member supporting mechanism, 161 guide hole, 170 first blade, 171 second blade, 180,190 motor, 181 servo cylinder, 310 container.

Claims (15)

An intaglio plate provided with a recess filled with paste,
A transfer member that transfers the paste transferred to the target member by contacting the target member with the paste transferred while contacting the intaglio plate,
A drive unit for bringing the transfer member into contact with each of the intaglio and the member to be printed,
The transfer member may have a release layer on the outer peripheral surface,
The release layer is made of a material containing fluorine,
The printing device , wherein the fluorine contained in the release layer is fluorinated with the material of the portion of the transfer member that is in contact with the release layer . The printing device according to claim 1 , wherein the intaglio plate has a flat outer shape. The printing device according to claim 1 , wherein the intaglio plate has a cylindrical outer shape. Further comprising a printing stage having a flat outer shape,
The printing apparatus according to any one of claims 1 to 3 , wherein the printing target member held on the printing stage contacts the transfer member. Further comprising a printing stage having a cylindrical outer shape,
The printing apparatus according to any one of claims 1 to 3 , wherein the printing target member held on the printing stage contacts the transfer member. The printing device according to any one of claims 1 to 5 , wherein the member to be printed is a ceramic dielectric sheet. A step of filling the concave portion of the intaglio with paste,
A step of bringing the cylindrical transfer member having a release layer on the outer peripheral surface thereof into contact with the intaglio to displace the paste to the transfer member,
E Bei a step of transferring the printing target the paste by contacting the transfer member and the printing member,
The release layer is made of a material containing fluorine,
The method of manufacturing an electronic component , wherein the fluorine contained in the release layer is fluorinated with the material of the portion of the transfer member that is in contact with the release layer . The method for manufacturing an electronic component according to claim 7 , wherein the member to be printed is a ceramic dielectric sheet. The method of manufacturing an electronic component according to claim 8 , wherein the paste is a conductive paste that becomes an internal electrode pattern. The paste is a dielectric pattern such ruse ceramic dielectric paste, method for manufacturing the electronic component according to claim 8. The ceramic dielectric thickness of the sheet is 0.4μm or more 4μm or less, a method of manufacturing an electronic component according to claims 8 to any one of claims 1 0. The ceramic dielectric sheet is lined with a resin film,
Fixing strength between the resin film and the ceramic dielectric sheets, the fixing strength is greater than the ceramic dielectric sheet and the release layer of the transfer member, in any one of claims 1 1 to claim 8 A method for manufacturing the described electronic component. The ceramic dielectric sheet contains polyvinyl butyral as a binder,
The paste, as the binder, ethyl cellulose, comprising at least one acrylic resin and polyvinyl butyral, a method of manufacturing an electronic component according to claim 9 or claim 1 0. The thickness of the internal electrode pattern is 0.2 μm or more and 1.0 μm or less,
The method of manufacturing an electronic component according to claim 9 , wherein the area of the internal electrode pattern is 0.01 mm ² or more and 0.2 mm ² or less. The electronic component is a monolithic ceramic capacitor,
Stacking a plurality of the ceramic dielectric sheets to which the internal electrode patterns have been transferred to form a rectangular parallelepiped stacked body;
A step of firing the laminate,
The method for manufacturing an electronic component according to claim 9 , further comprising: forming an external electrode connected to the internal electrode pattern on the surface of the laminated body.

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