JP6721589B2 - Component mounter - Google Patents

Description

The present invention relates to a component mounter configured such that a gap size between a board conveying surface of a conveyor device and a mounting head can be changed according to a height (height) of a component mounted on a circuit board.

In the component mounter, for example, as described in Japanese Patent Laid-Open No. 2014-123597, a circuit board is carried in by a conveyor device, and components supplied by a component supply device are mounted on a mounting head. It is designed to be picked up by a suction nozzle or a chuck and mounted on a circuit board.

JP, 2014-123597, A

In recent years, the component mounting machine is required to increase the component mounting speed in order to improve productivity, and therefore, the interval between the circuit board on the conveyor device and the mounting head is narrowed so that the component mounting operation is performed. The ascending/descending stroke of the suction nozzle etc. is made as short as possible. Therefore, even if you try to mount a large component such as a tall connector component on the circuit board, the large component may interfere with the mounting head and cannot be mounted.In that case, the operator manually mounts the large component. Since it has to be mounted on a circuit board, there is a problem that productivity is reduced.

In order to solve the above problems, the present invention provides a conveyor device that conveys a circuit board, a mounting head that picks up a component supplied by a component supply device and mounts the component on the circuit board, and the mounting head in the XY directions. In a component mounter including an XY-axis moving device for moving, the conveyor device is configured to be able to change the height of a board transfer surface, and the board transfer surface and the mounting are changed by changing the height of the board transfer surface. The height of the board transfer surface of the component mounter is changed so that the height of the board transfer surface of the component mounter is adjacent to the base of the component mounter. If the height of the board transfer surface of the other component mounting machine is different from the height of the board transfer surface of the other component mounter, the height of the board transfer surface of the component mounter matches the height of the board transfer surface of the other component mounter. A first feature is that a height adjusting mechanism for adjusting the height of the base portion is provided , and further, the conveyor device is configured such that the conveyor device mounts a side edge portion of the circuit board. A conveyor belt for carrying, a conveyor rail section for regulating the carrying direction of the circuit board in the traveling direction of the conveyor belt, and a conveyor leg section for supporting the conveyor belt and the conveyor rail section, the conveyor leg section, , For changing the height of the conveyor legs, which are detachably mounted on a conveyor base plate provided on the base part of the component mounter and are different in height according to the height of components mounted on the circuit board. The second feature is that it is configured to change the height of the substrate transfer surface by replacing it with the conveyor leg part.

For example, when a large component such as a tall connector component is mounted on the circuit board, the height of the substrate carrying surface of the conveyor device may be changed to be low. This widens the distance between the board conveying surface of the conveyor device and the mounting head so that the problem of interference with large components does not occur, and provides a mounting space for large components between the circuit board on the conveyor device and the mounting head. Therefore, it is possible to secure large parts and mount large parts on the circuit board. On the contrary, when a small-sized component or a medium-sized component having a short height is mounted on the circuit board, the height of the board transfer surface of the conveyor device may be changed so as to be high within a range where interference does not occur. This makes it possible to narrow the distance between the board transfer surface of the conveyor device and the mounting head within the range that does not cause interference problems, and shorten the lifting stroke of the suction nozzle during component mounting operation. Can be speeded up.
By the way, when the height of the board transfer surface of the component mounter is changed and the height of the board transfer surface of the component mounter is different from the height of the board transfer surface of another component mounter installed adjacent to the mounter. May interfere with the loading and unloading of the circuit board.
As a countermeasure against this, in the present invention, the height of the board transfer surface of the component mounter is changed and the heights of the board transfer surfaces of the component mounters are installed adjacent to each other in the base portion of the component mounter. When the height of the board transfer surface of the other component mounter is different, the height of the board transfer surface of the component mounter is adjusted so as to match the height of the board transfer surface of the other component mounter. A height adjustment mechanism is provided for adjusting the height. As a result, when the height of the board transfer surface of another component mounter adjacent to the component mounter is changed, the height adjustment mechanism provided at the base of the component mounter causes the component mounter to move. By adjusting the height of the base portion of, the height of the board transfer surface of the component mounter can be made equal to the height of the board transfer surface of another adjacent component mounter.

Specifically, the conveyor device includes a conveyor belt that carries a side edge portion of a circuit board and conveys the conveyor board, a conveyor rail portion that regulates a conveyance direction of the circuit board in a traveling direction (circulation direction) of the conveyor belt, and the conveyor. A belt and a conveyor leg portion supporting the conveyor rail portion are provided, the conveyor leg portion is supported on a conveyor base plate provided in a base portion of the component mounter, and the height of a component mounted on the circuit board is high. Depending on the height, the height of the substrate transfer surface may be changed by replacing the conveyor leg with a height-changing conveyor leg having a different height.

Or, the height at which the height of the board conveying surface is changed by changing the height at which the conveyor belt and the conveyor rail are supported on the conveyor leg of the conveyor device according to the height of the components mounted on the circuit board. A changing means may be provided.

In general, a mark image pickup camera that picks up an image of a reference mark on a circuit board is designed to move integrally with a mounting head by an XY axis moving device. Therefore, the distance between the board conveying surface of the conveyor device and the mounting head is changed. Then, the distance between the reference mark on the circuit board and the mark imaging camera may be changed, and the focus of the mark imaging camera may not be aligned with the reference mark on the circuit board.

As a countermeasure against this, the mounting head is attached to the XY-axis moving device via a Z-axis moving device that moves the mounting head up and down, and the mark imaging camera is integrated with the mounting head in the Z-axis moving device. It is good to attach it so that it moves up and down. In this way, even if the height of the board conveying surface of the conveyor device is changed, the height of the mark image pickup camera is changed by the Z-axis moving device so that the mark image pickup camera and the circuit board are changed. The distance from the reference mark can be kept constant, and the mark imaging camera can be focused on the reference mark on the circuit board.

Further, a backup plate for placing a backup member supporting the circuit board from below is arranged below the board conveying surface of the conveyor device, and the backup position for supporting the circuit board with the backup member and the backup member are retracted downward. A lifting device for lifting the backup plate between the retracted position and the retracted position is provided, and the lifting device is configured to change the height of the backup position according to the change of the height of the substrate transfer surface of the conveyor device. good. In this way, if the height of the board transfer surface of the conveyor device is changed, the height of the backup position where the circuit board is supported by the backup member can be changed accordingly, and the circuit board is backed up when the components are mounted. It can be reliably supported by members.

FIG. 1A is a perspective view showing the configuration of a module-type component mounting system according to the first embodiment of the present invention. 2A is a vertical sectional side view of the component mounter showing a normal state in which the height of the board transfer surface of the conveyor device is set to a standard height, and FIG. 2B is the height of the board transfer surface of the conveyor device. FIG. 4 is a vertical cross-sectional side view of a component mounter showing a state when mounting a large component in which is reduced to a height for a large component. FIG. 3 is a perspective view showing a conveyor device in which the height of the substrate transfer surface is a standard height. FIG. 4 is a perspective view showing a conveyer device in which the height of the substrate carrying surface is for large parts. FIG. 5 is a perspective view showing a mark imaging camera integrated with a mounting head. FIG. 6 is a perspective view showing the conveyor device of the second embodiment. FIG. 7 is an enlarged perspective view showing the structure of the height changing means.

Hereinafter, two Embodiments 1 and 2 which are embodied by applying a mode for carrying out the present invention to a module-type component mounting system will be described.

A first embodiment of the present invention will be described with reference to FIGS.
First, the configuration of the modular component mounting system will be described with reference to FIG.

The modular component mounting system according to the first embodiment includes one or a plurality of narrow component mounting machines (hereinafter referred to as “narrow mounting machines”) 11 and one or a plurality of wide component mounting machines ( Hereinafter, referred to as a "wide mounting machine" 12 is arranged adjacent to each other in the transfer direction (X direction) of the circuit board so as to be interchangeable. The narrow mounter 11 is used to mount relatively small components on the circuit board, and the wide mounter 12 is used to mount relatively large components on the circuit board. The first embodiment is an embodiment in which the present invention is applied to the wide mounting machine 12.

In the first embodiment, two narrow mounting machines 11 are installed on one base 13a (base section) , and one wide mounting machine 12 is installed on one base 13b (base section). is set up. Each of the mounting machines 11 and 12 includes a component supply device 14 such as a tape feeder or a tray feeder, two conveyor devices 15 that convey a circuit board, and one or a plurality of component holders 16 (see FIG. 2). The mounting head 17 for holding the suction nozzle or the chuck, etc. in a replaceable manner, the XY axis moving device 18 for moving the mounting head 17 in the XY directions (see FIG. 2), and the component holder 16 of the mounting head 17. The upper frame 20 is provided with a display device 21 such as a liquid crystal display and a CRT, and an operation unit 22 such as operation keys and a touch panel. ing.

The mounting head 17 is attached to the XY-axis moving device 18 via a Z-axis moving device 25 that moves the mounting head 17 up and down. The Z-axis moving device 25 picks up a mark for picking up a reference mark on a circuit board. A camera 26 (see FIG. 5) is attached so as to move up and down integrally with the mounting head 17.

As shown in FIG. 2, the two conveyor devices 15 of the respective mounting machines 11 and 12 respectively include two conveyor belts 27 on which both side edges of the circuit board are placed and conveyed, and a conveyor direction of the circuit board. It is configured to include two conveyor rail portions 28 that regulate the belt 27 in the traveling direction (circling direction), a conveyor belt 27, a conveyor leg portion 29 that supports the conveyor rail portion 28, and the like. The conveyor belt 27 and the conveyor rail portion 28 are configured as a conveyor rail unit 30 that integrates the two, and the conveyor rail unit 30 is detachably attached to the conveyor leg portion 29 with screws or the like. Each conveyor leg 29 is detachably attached to the conveyor base plate 32 provided on the bases 13a and 13b of the mounting machines 11 and 12 with screws or the like.

In the first embodiment, the height of the board transfer surface of the conveyor device 15 of the wide mounting machine 12 is configured to be changeable, and the height of the board transfer surface is increased according to the height (height) of the components mounted on the circuit board. By changing the height, the distance between the substrate carrying surface and the mounting head 17 can be changed. Specifically, a conveyor leg portion 29 having a standard height and a conveyor leg portion 29a for a large component (for height change) lower than that are prepared in advance, and a small component that is a standard-sized component or When mounting a medium-sized component, the conveyor leg 29 of standard height is used as the conveyor leg of the conveyor device 15, and when mounting a large component such as a tall connector component, a conveyor leg for a large component is used. Replace with 29a. The height of the conveyor leg portion 29a for large parts is lower than the height of the conveyor leg portion 29 of the standard height by an amount corresponding to the difference in height of the components to be mounted or a dimension with a little margin. Has become. In addition to the standard height conveyor leg 29, two or more height-changing conveyor legs 29a having different heights are prepared so that the height of the substrate transfer surface can be changed in three or more steps. It may be configured.

The wide mounter 12 normally mounts small-sized components and medium-sized components, which are standard-sized components, so that the conveyor legs 29 of standard height are used as shown in FIGS. The height of the substrate transfer surface of the conveyor device 15 is set to the standard height. Then, during production, the wide mounting machine 12 conveys the circuit board to the component mounting area by the conveyor device 15 and clamps it by the clamp mechanism (not shown), and the mark imaging camera 26 sets the reference mark of the circuit board. By picking up an image and processing the image, the position of the reference mark is recognized as the reference position of the circuit board, and the small component or the medium component supplied by the component supply device 14 is attached to the component holder of the mounting head 17. 16 picks it up and moves it to the upper part of the component image pickup camera 19, picks up the image of the component with the component image pickup camera 19 and processes the image, thereby recognizing the holding posture and position shift of the component. Then, the mounting position of the component is corrected based on the recognition result, and the component is mounted on the circuit board.

On the other hand, when the height of the board conveying surface of the conveyor device 15 of the wide mounter 12 is the standard height, when mounting a large component such as a tall connector component that causes a problem of interference on the circuit board, the configuration shown in FIG. (B) As shown in FIG. 4, before the production is started, the conveyor leg 29 of the standard height of the conveyor device 15 is replaced with the conveyor leg 29a for a large component having a low height, and the conveyor device 15 of the conveyor device 15 is replaced. Set the height of the board transfer surface to a height for large parts that is lower than the standard height. In this state, the circuit board is conveyed, the reference mark image is recognized, the large component is picked up, the image is recognized, and mounting is performed in the same manner as described above.

By the way, when the height of the board transfer surface of the wide mounter 12 among the plurality of mounters 11 and 12 that configure the modular component mounting system is changed, the heights of the board transfer surfaces of the wide mounters 12 are adjacent to each other. Since the height of the substrate mounting surface of the narrow mounting machine 11 is different from that of the narrow mounting device 11, the loading and unloading of the circuit board may be hindered.

As a countermeasure against this, in the first embodiment, a height adjusting mechanism 35 such as a screw type for adjusting the height of the base 13b of the wide mounter 12 is provided at the lower end portion of the base 13b of the wide mounter 12, and the wide mounter 12 is provided. When the height of the board transfer surface of the machine 12 is changed, the operator operates the height adjustment mechanism 35 of the wide mounter 12 to adjust the height of the base 13b of the wide mounter 12. The height of the board transfer surface of the wide mounter 12 is made to match the height of the board transfer surface of the adjacent narrow mounter 11.

In addition, as shown in FIGS. 2 to 4, a backup plate 33 is arranged to be movable up and down below the substrate transfer surface of the conveyor device 15, and a backup member 31 that supports the circuit board from below is provided on the backup plate 33. Can be exchangeably placed. The backup plate 33 is configured to be moved up and down by an elevating device 34. After the circuit board is carried in and clamped, the backup plate 33 is lifted to a backup position where the circuit board is supported by the backup member 31 to mount components. After mounting the components, the backup plate 33 is lowered to the retracted position where the backup member 31 is retracted downward. In this case, if the height of the substrate transfer surface of the conveyor device 15 of the wide mounter 12 is changed, the backup position, which is the upper limit position of the backup plate 33, must be changed accordingly. The elevating device 34 changes the height of the backup position, which is the upper limit position of the backup plate 33, in accordance with the change of the height of the substrate transfer surface of the conveyor device 15. The method of changing the height of the backup position may be such that an operator manually changes the amount of elevation of the elevating device 34 when changing the height of the substrate transfer surface of the conveyor device 15. Alternatively, a sensor or the like for detecting the height of the substrate transfer surface of the conveyor device 15 may be provided, and the amount of elevation of the elevating device 34 may be automatically changed based on the detection result of the sensor or the like.

In this way, if the height of the backup position, which is the upper limit position of the backup plate 33, is changed in accordance with the change in the height of the board transfer surface of the conveyor device 15, the height of the board transfer surface of the conveyor device 15 is changed. Even if is changed, the height of the backup position at which the circuit board is supported by the backup member 31 can be changed accordingly, and the circuit board can be reliably supported by the backup member 31 during component mounting.

In the first embodiment described above, in the wide mounting machine 12, the conveyor leg 29 having the standard height used when mounting the small size component and the medium size component, which are the standard size components to be mounted on the circuit board, and the height. When preparing a large component conveyor leg 29a to be used when mounting a large component such as a high connector component, and mounting a large tall component on a circuit board, the standard height of the conveyor device 15 By replacing the conveyor leg 29 with the conveyor leg 29a for large parts, the height of the substrate transfer surface of the conveyor device 15 can be lowered so that the problem of interference with the large parts does not occur. Thus, when mounting a large component having a large height on a circuit board, the distance between the board conveying surface of the conveyor device 15 and the mounting head 17 is widened so as not to cause a problem of interference, and the circuit board on the conveyor device 15 is expanded. A mounting space for a large component can be secured between the mounting head 17 and the mounting head 17, and the large component can be mounted on the circuit board. On the other hand, when mounting small-sized components or medium-sized components having a short height on the circuit board, the height of the board conveying surface of the conveyor device 15 does not cause a problem of interference by replacing the height of the conveyor leg 15 with the standard conveyor leg 29. It can be higher within the range. As a result, the distance between the board conveying surface of the conveyor device 15 and the mounting head 17 can be narrowed within a range where the problem of interference does not occur, and the lifting stroke of the suction nozzle during the component mounting operation can be shortened. The mounting speed can be increased.

Next, a second embodiment of the present invention will be described with reference to FIGS. 6 and 7. However, substantially the same parts as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted or simplified, and mainly different parts will be described.

In the first embodiment, the height of the substrate transfer surface of the conveyor device 15 is increased by replacing the standard height conveyor leg 29 of the conveyor device 15 of the wide mounter 12 with the conveyor leg 29a for large parts. Although the height is lowered so that the problem of interference with the conveyor does not occur, in the second embodiment of the present invention, the conveyor rail unit 30 and the conveyor leg in which the conveyor belt 27 and the conveyor rail portion 28 of the wide mounting machine 12 are integrated. A height changing means 40 for changing the height for supporting the conveyor rail unit 30 to change the height of the substrate carrying surface is provided at the mounting portion of the portion 29.

Specifically, as shown in FIGS. 6 and 7, the height changing means 40 forms a stepped elongated hole 41 for height adjustment extending in the vertical direction at the upper end portion of the conveyor leg 29. The height of the conveyor rail unit 30 is changed by changing the height position of the bolt 42 by inserting the bolt 42 into the long hole 41 and tightening the bolt to the conveyor rail unit 30 and changing the height position of tightening the bolt 42 in the long hole 41. The height of the substrate transfer surface 15 is changed. For example, in the case of mounting a small short component on a circuit board, the height position of the conveyor device 15 is adjusted by setting the height position where the bolt 42 is tightened to the height position of the upper end of the long hole 41. When the height of the uppermost stage is set and the medium-sized component is mounted on the circuit board, the height position where the bolt 42 is tightened is set to the intermediate height position of the long hole 41, so that the board transfer surface of the conveyor device 15 is set. Is set to an adjustable intermediate height, and when mounting a large tall component on the circuit board, the height position where the bolt 42 is tightened is the height position of the lower end of the long hole 41. The height of the substrate transfer surface of the conveyor device 15 is set to the adjustable bottom height.

Also in the second embodiment described above, the same effect as in the first embodiment can be obtained.
The present invention is not limited to the first and second embodiments, and may be changed to a configuration in which one conveyor device is provided in the component mounter, or the conveyor leg attachment method may be appropriately changed.

In addition, according to the present invention, a plurality of the wide mounters 12 may be arranged, and the narrow mounter 11 may be configured such that the height of the substrate transfer surface can be changed similarly to the wide mounter 12. Needless to say, various modifications can be made without departing from the scope of the invention.

11... Narrow mounter, 12... Wide mounter (component mounter), 14... Component supply device, 15... Conveyor device, 16... Component holder, 17... Mounting head, 18... XY axis moving device, 19... Component Imaging camera, 25... Z-axis moving device, 26... Mark imaging camera, 27... Conveyor belt, 28... Conveyor rail part, 29... Standard height conveyor leg part, 29a... Large part conveyor leg part, 30 ...Conveyor rail unit, 31... Backup member, 33... Backup plate, 34... Lifting device, 40... Height changing means, 41... Height adjustment long hole, 42... Bolt

Claims (4)

Component mounting including a conveyor device that conveys a circuit board, a mounting head that picks up a component supplied by a component supply device and mounts the component on the circuit board, and an XY axis moving device that moves the mounting head in XY directions. In the machine
The conveyor device is configured to be able to change the height of the substrate transfer surface, is configured to change the distance between the substrate transfer surface and the mounting head by changing the height of the substrate transfer surface,
In the base part of the component mounter, the height of the board transfer surface of the component mounter is changed, and the height of the board transfer surface of the component mounter is adjacent to the board of another mounter. A height for adjusting the height of the base part so that the height of the board transfer surface of the component mounter is equal to the height of the board transfer surface of the other component mounter when the height is different from the transfer surface. A component mounter provided with a height adjustment mechanism ,
The conveyor device is a conveyor belt that carries a side edge portion of the circuit board and conveys it, a conveyor rail portion that regulates a conveyance direction of the circuit board to a traveling direction of the conveyor belt, the conveyor belt and the conveyor rail portion. With a conveyor leg to support
The conveyor leg is detachably attached on a conveyor base plate provided in the base of the component mounter,
According to the height of the components to be mounted on the circuit board, by replacing the conveyor leg portion with a conveyor leg portion for height change of different height, it is configured to change the height of the substrate transfer surface. mounter, characterized in that there. Component mounting including a conveyor device that conveys a circuit board, a mounting head that picks up a component supplied by a component supply device and mounts the component on the circuit board, and an XY axis moving device that moves the mounting head in XY directions. In the machine
The conveyor device is configured to be able to change the height of the substrate transfer surface, is configured to change the distance between the substrate transfer surface and the mounting head by changing the height of the substrate transfer surface,
In the base part of the component mounter, the height of the board transfer surface of the component mounter is changed, and the height of the board transfer surface of the component mounter is adjacent to the board of another mounter. A height for adjusting the height of the base part so that the height of the board transfer surface of the component mounter is equal to the height of the board transfer surface of the other component mounter when the height is different from the transfer surface. A component mounter provided with a height adjustment mechanism,
The conveyor device is a conveyor belt that carries a side edge portion of the circuit board and conveys it, a conveyor rail portion that regulates a conveyance direction of the circuit board to a traveling direction of the conveyor belt, the conveyor belt and the conveyor rail portion. With a conveyor leg to support
The conveyor leg is supported on a conveyor base plate provided in the base of the component mounter,
The conveyor leg has a height change for changing the height of the board conveying surface by changing the height for supporting the conveyor belt and the conveyor rail according to the height of the components mounted on the circuit board. A component mounter characterized in that means are provided. The mounting head is attached to the XY-axis moving device via a Z-axis moving device that moves the mounting head up and down.
The said Z-axis moving device, according to claim 1 or 2, characterized in that said circuit mark imaging camera for imaging the reference mark of the substrate is mounted for integrally move up and down with said mounting head Component mounting machine. A backup plate on which a backup member that supports the circuit board from below is placed is arranged below the board transfer surface of the conveyor device.
An elevating device is provided for elevating the backup plate between a backup position that supports the circuit board with the backup member and a retracted position where the backup member is retracted downward,
The lifting device, the component mounting machine according to any of claims 1 to 3, characterized in that it is configured to change the height of the backup position in accordance with the change in the height of the substrate transport surface ..

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