JP6733966B2 - Board assembly apparatus and board assembly method - Google Patents

Description

The present invention relates to a substrate assembling apparatus and a substrate assembling method for manufacturing a liquid crystal display, an organic EL display, or the like that bonds substrates in a vacuum.

As a technique relating to a substrate assembling apparatus that bonds substrates in a vacuum, for example, in Patent Document 1, by moving an upper substrate up and down during a vacuuming process, a separation distance between the upper substrate and a lower substrate is changed. Then, a substrate assembling apparatus that efficiently removes gas from between the upper substrate and the lower substrate is disclosed.
Further, Patent Document 2 proposes a work bonding apparatus having a table with an antistatic means.
In Patent Document 3, in order to reduce distortion due to adiabatic compression/temperature change of the table, a plurality of convex portions and concave portions are formed on the surfaces of the first and second holding members that contact the non-bonding surface of the work, There is disclosed a vacuum bonding device that suppresses the influence of temperature change due to adiabatic expansion or adiabatic compression in a minute space on a work by improving exhaust during depressurization (during vacuuming).

Further, Patent Document 4 discloses a substrate assembling apparatus in which unevenness and grooves are formed on a sheet surface in order to improve the problem of displacement of the lower substrate due to residual air expansion on the lower table side under reduced pressure.
Patent Document 5 discloses a substrate assembling apparatus capable of performing accurate bonding without causing a shift in the peeling pin up/down mechanism or the adhesive pad up/down mechanism.

JP, 2017-80868, A Japanese Patent No. 5654155 Japanese Patent No. 6255546 JP, 2003-283185, A JP, 2005-134687, A

However, in recent years, the size of glass substrates to be bonded in a vacuum has been increasing, and in the assembling apparatus disclosed in Patent Documents 1 to 3, air remaining in the table groove or the like during vacuuming is exhausted at high speed. There is concern that static electricity may be generated or the glass substrate may be bent.

Further, in the assembling apparatuses disclosed in Patent Documents 4 and 5, there is a concern that the substrate may be bent during the ascending operation due to the increase in speed.

Therefore, the present invention provides a board assembling apparatus and a board assembling method capable of reducing the bending of the board.

To solve the above problems, engaging Ru board assembling apparatus of the present invention holds the one of the substrates on the lower table, and holds the other substrate is opposed to the one of the substrate on the table, either one A substrate assembling apparatus for adhering in a vacuum chamber with an adhesive provided on a substrate of the substrate, comprising: a coarsely arranged first lifter and a densely arranged second lifter; The second lifter is capable of penetrating the lower table, and after raising the substrate by a predetermined amount by the second lifter, further raising the substrate by the first lifter . The second lifter has a through hole through which the second lifter can penetrate, and when the substrate is raised by a predetermined amount by the second lifter, the purge gas or the atmosphere is discharged from the gap between the inner peripheral surface of the through hole and the outer peripheral surface of the second lifter. There characterized that you entering into the back surface of the substrate.

Another substrate assembling apparatus according to the present invention is characterized in that a lift amount of the substrate by the first lifter is larger than a lift amount of the substrate by the second lifter.

Another substrate assembling apparatus according to the present invention is characterized in that an ascending amount of the substrate by the first lifter is approximately 33 to 200 times an ascending amount of the substrate by the second lifter.

Further, engagement Ru board assembling method of the present invention includes the step of holding one of the substrates on the lower table, a step of holding said is opposed to one substrate on the table the other substrate, one of the A method of assembling a substrate, the method comprising: bonding a substrate in a vacuum chamber with an adhesive provided on the substrate, wherein the first lifter is arranged roughly and the second lifter is arranged densely. The second lifter is capable of penetrating the lower table, and after raising the substrate by a predetermined amount by the second lifter, further raising the substrate by the first lifter , Has a through hole through which the second lifter can penetrate, and when the substrate is raised by a predetermined amount by the second lifter, a gap between the inner peripheral surface of the through hole and the outer peripheral surface of the second lifter. purge gas or air is characterized that you entering into the back surface of the substrate from.

According to the present invention, it is possible to provide a substrate assembling apparatus and a substrate assembling method that can reduce the bending of a glass substrate.
Problems, configurations, and effects other than those described above will be clarified by the following description of the embodiments.

It is a schematic block diagram of the board|substrate assembly apparatus of Example 1 which concerns on one Example of this invention. It is explanatory drawing of the guide mechanism which comprises the board|substrate assembly apparatus shown in FIG. It is a schematic explanatory drawing of an adhesive pin mechanism. It is a longitudinal cross-sectional view of the elastic body of the upper table and the lower table shown in FIG. 3 is a flowchart showing an operation flow of the board assembling apparatus shown in FIG. 1. It is the schematic of the board|substrate assembly apparatus of Example 2 which concerns on the other Example of this invention, Comprising: It is a top view and side view of a lower table. 9 is a flowchart showing an operation flow of the board assembling apparatus according to the second embodiment. FIG. 7 is a vertical cross-sectional view showing a state where the lower glass substrate is raised by a predetermined amount by the second lifter shown in FIG. 6. FIG. 7 is a vertical cross-sectional view showing a state where the lower glass substrate is raised by a predetermined amount by the first lifter shown in FIG. 6.

In this specification, a glass substrate is described as an example of a substrate to be bonded in vacuum, but the substrate to be bonded is not limited to a glass substrate.
Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic configuration diagram of a board assembling apparatus according to a first embodiment of the present invention. As shown in FIG. 1, the substrate assembly apparatus 1 includes a pedestal 15 and an upper frame 5 as a rigid support member, and an upper chamber 7 and a lower chamber 8 inside thereof. The upper frame 5 rotates the ball screw 2b of the Z-axis drive motor 2a that constitutes the Z-axis drive mechanism 2 provided on the pedestal 15 side, so that the upper frame 5 passes through the ball screw receiving portion 2c provided on the upper frame 5. 5 is configured to move vertically with respect to the pedestal 15. Four guide mechanisms 3 are provided when the upper frame 5 moves up and down.
FIG. 2 shows an explanatory view of a guide mechanism that constitutes the board assembling apparatus shown in FIG. FIG. 2 shows a partial cross-sectional view of the guide mechanism 3. As shown in FIG. 2, the beam 17 fixed to the gantry 15 side is provided with two linear guides 3a, and the beam 18 fixed to the upper frame 5 side is provided with a linear moving portion 3b. As shown in FIG. 2, one guide surface is assembled so as to be perpendicular to the other guide surface.

Returning to FIG. 1, a plurality of lower shafts 12 for supporting the lower table 10 are attached above the pedestal 15. Each lower shaft 12 projects into the lower chamber 8 via a vacuum seal (not shown) to maintain airtightness with the lower chamber 8. Further, an XYθ moving unit 13 configured to be independently movable in the XYθ directions is attached between each lower shaft 12 and the lower table 10. The XYθ moving unit 13 may be configured by a mechanism that uses a ball bear or the like that is fixed in the vertical direction and is freely movable in the horizontal direction. A plurality of lower table horizontal drive mechanisms (not shown) are provided outside the lower chamber 8 in the horizontal direction (X, Y directions) of the lower table 10, and a side surface of the lower table (thickness direction of the lower table) is provided by a shaft provided in the drive mechanism. By pressing, positioning in the XYθ directions can be performed.
Further, the lower chamber 8 and the upper chamber 7 are configured so as to be separable, and a seal ring (not shown) is provided at the connecting portion thereof, whereby the upper chamber 7 and the lower chamber 8 are united, and when the inside is exhausted. Prevents air leakage.

A load cell 4 is provided at a connecting portion between the upper frame 5 and the Z-axis drive mechanism 2. Inside the upper frame 5, an upper chamber 7 is attached. The upper chamber 7 is structured to be suspended from the upper frame 5 by the support shaft 6c and the bracket 7b. By vertically moving the upper frame 5, the upper chamber 7 can be separated from the lower chamber 8. Further, the upper frame 5 is provided with a plurality of upper shafts 6 toward the inside of the upper chamber 7 for supporting the upper table 9. A vacuum seal is connected between the upper shaft 6 and the upper chamber 7 in order to maintain airtightness inside the chamber. Further, the upper table 9 is fixed to the upper shaft 6 and has a structure in which the load cell 4 can detect the force when the glass substrate is pressed. The Z-axis drive mechanism 2 can move the upper chamber 7 and the upper table 9 up and down. Therefore, the support shaft 6c provided on the upper frame 5 for the upper chamber 7 and the upper table 9 for the upper table 9 are provided. The support shaft (upper shaft 6) provided in the above is separately provided. Therefore, the support shaft 6c of the upper chamber 7 has a playable support structure so that, when the upper chamber 7 is united with the lower chamber 8, the downward moving force from the upper chamber 7 does not act on the lower chamber 8. There is. That is, the bracket 7b having a predetermined height is attached to the upper portion of the upper chamber 7, and the flange portion contacts the tip of the support shaft 6c of the upper chamber 7 inside the bracket 7b. When the upper chamber 7 is lifted, the flange portion of the support shaft 6c contacts (abuts) the bracket 7b, so that the upper chamber 7 and the upper table 9 can be integrally moved upward. That is, when the upper shaft 6 is lifted and the upper table 9 is moved upward in the upper chamber 7 by a predetermined amount, the flange portion of the support shaft 6c comes into contact with the bracket 7b, and when it is further lifted, the upper table 9 and the upper chamber 7 are separated from each other. It is configured to move upward together. Further, the upper chamber 7 and the upper table 9 move integrally until the upper chamber 7 moves downward and becomes integral with the lower chamber 8, and after the upper chamber 7 and the lower chamber 8 become integral, 9 can be independently moved to the lower table 10 side.

Further, as described above, in this embodiment, since the upper table 9 and the lower table 10 are arranged apart from the upper chamber 7 and the lower chamber 8, the chamber is deformed when the pressure inside the chamber is reduced, The glass substrate can be held horizontally without this deformation being transmitted to the upper table 9 and the lower table 10.

An elastic plate 11 made of iron is provided on the upper table 9. An elastic body 11a is provided on the entire surface of the elastic body plate 11 that contacts the glass substrate. The elastic plate 11 is replaceable by being fixed by the magnetic force of a plurality of magnets embedded in the upper table 9 and screw fastening. Here, the upper table 9 is made of, for example, an aluminum alloy, and although omitted in FIG. 1, the lower table 10 is also provided with an elastic plate 11 made of iron. An elastic body 11b is provided on the entire surface in contact with the glass substrate. In this embodiment, the upper table 9 is provided with the elastic plate 11 and the elastic body 11a, and the lower table 10 is provided with the elastic plate 11 and the elastic body 11b. However, the present invention is not limited to this. That is, the elastic plate and the elastic body may be provided on only one of the upper table 9 and the lower table 10.

FIG. 3 is a schematic explanatory view of the adhesive pin mechanism. As shown in FIG. 3, an adhesive pin drive mechanism 14 that can operate independently of the upper table 9 is installed on the upper chamber 7 or the upper frame 5. The adhesive pin drive mechanism 14 includes a vertical drive motor 14a, an adhesive pin plate 14b having a plurality of adhesive pins 14c attached thereto, and an adhesive pin up/down mechanism 14d. The adhesive pin plate 14b and the adhesive pin 14c have a vacuum suction mechanism, and an adhesive sheet 14e is attached to the tip of the adhesive pin 14c. Further, the adhesive pin 14c has a structure that can be removed from the adhesive pin plate 14b (it is detachable by a screw mechanism) and can be replaced. Inside the adhesive pin plate 14b, a negative pressure chamber for supplying a negative pressure and a negative pressure channel (not shown) provided in the central portion of the adhesive pin 14c from the negative pressure chamber are connected, and an opening provided at the tip of the adhesive pin 14c is connected. Negative pressure can be supplied to the holes. An adhesive sheet 14e is provided at the tip of the adhesive pin 14c except for the opening. The adhesive pin up-and-down mechanism 14d for moving the adhesive pin plate 14b up and down and the upper chamber 7 are connected by a bellows-like elastic body, whereby a vacuum state can be maintained.

FIG. 4 is a longitudinal sectional view of the elastic bodies (11a, 11b) on the surfaces of the upper table 9 and the lower table 10 shown in FIG. FIG. 4 shows a vertical cross-sectional view of the elastic body 11b on the surface of the lower table 10, and has a structure in which the back surface of the glass substrate can abut on the upper portion in the vertical cross section. Therefore, strictly speaking, in the elastic body 11a on the surface of the upper table 9, the vertical cross section shown in FIG. 4 is turned upside down. Further, FIG. 4 is an enlarged view showing an example of the cross-sectional shape of the elastic body having the convex portion and the concave portion and their dimensions. As shown in FIG. 4, the elastic body 11b on the surface of the lower table 10 has a plurality of convex portions and concave portions arranged adjacent to each other. The height of the protrusions is, for example, 25 μm, and the pitch of the protrusions (the pitch along the width direction of the lower table 10) is about 500 μm. The length of the convex lower table 10 in the width direction is about 460 μm, and the length of the concave lower table 10 in the width direction is about 40 μm. Further, although not shown, the elastic bodies (11a, 11b) having a plurality of convex portions and concave portions arranged adjacent to each other in this manner are top views, and the plurality of convex portions are in a square lattice shape, a triangular lattice shape, or a staggered pattern. They are arranged in a grid. On the other hand, in recent years, as described above, the size of glass substrates to be bonded in a vacuum is increasing, and the size of the glass substrate is 3 m×3 m, for example. Therefore, the width of the elastic body 11a and/or the elastic body 11b with respect to the width of the upper table 9 and/or the lower table 10 holding such a glass substrate (along the width direction of the upper table 9 and/or the lower table 10) The width) has a ratio of 10 ⁻⁶ to 10 ⁻⁴ .
Thereby, when the air remaining in the recesses (grooves) of the elastic body 11a and/or the elastic body 11b during evacuation is exhausted, it is possible to prevent a large flow rate of airflow from being generated. In other words, a plurality of thin exhaust passages are formed on the surface of the elastic body 11a and/or the elastic body 11b, and the exhaust air of the air remaining in the recess (groove) can be dispersed. As a result, by reducing the occurrence of unevenness due to frictional electrification with the substrate, preventing unevenness due to temperature drop due to rapid adiabatic expansion, and improving the bonding accuracy of the substrates, the size and thickness of next-generation high-definition displays can be made smaller and thinner. It is possible to contribute to the manufacture of a display with no color unevenness for forming a fine pattern.

In this embodiment, the elastic plate 11 and the elastic body 11a are provided on the upper table 9, and the elastic plate 11 and the elastic body 11b are provided on the lower table 10, or either the upper table 9 or the lower table 10 is provided. Although the configuration in which the elastic plate and the elastic body are provided on only one side has been described, the present invention is not limited to this. For example, an embossed sheet having a plurality of convex portions and concave portions arranged adjacent to each other as described above may be attached to the surface of the aluminum alloy upper table 9 holding the glass substrate with an adhesive. Here, the embossed sheet is formed in a corrugated shape by, for example, embossing a polyethylene terephthalate (referred to as PET) sheet. Further, similarly, as a configuration in which an embossed sheet having a plurality of convex portions and concave portions arranged adjacent to each other as described above is attached to the surface of the lower table 10 made of aluminum alloy holding the glass substrate with an adhesive. Is also good. Alternatively, the embossed sheet may be attached to only one of the upper table 9 and the lower table 10 with an adhesive.
As described above, by using the embossed sheet having the plurality of convex portions and concave portions arranged adjacent to each other, the above-mentioned embossed sheet is bonded to the upper table and/or the lower table constituting the existing board assembling apparatus with an adhesive. The substrate assembling apparatus 1 of the present embodiment can be obtained only by sticking.

Next, the operation of the board assembly apparatus 1 will be described. FIG. 5 is a flowchart showing an operation flow of the board assembling apparatus 1 shown in FIG.
As shown in FIG. 5, in step S11, the upper glass substrate whose bonding surface faces the lower table 10 side is carried into the lower surface of the upper table 9 using a robot hand (not shown). The plurality of suction support nozzles (not shown) and the adhesive pin driving mechanism 14 (FIG. 3) are lowered from the upper table 9 to first suck the upper glass substrate onto the tip of the suction support nozzle (not shown). After that, the suction support nozzle is raised until the tip of the suction support nozzle reaches the position of the adhesive pin surface, and a negative pressure is supplied to the adhesive pin suction suction hole (not shown) provided in the adhesive pin 14c (FIG. 3). The glass substrate is held on the surface of the adhesive sheet 14e. In the present embodiment, the suction support nozzle is used separately from the adhesive pin mechanism. However, the present invention is not limited to this, and the suction support nozzle may not be provided and only the adhesive pin 14c may be used for suction suction/adhesion holding. good. With the upper glass substrate being held by the adhesive sheet 14e provided at the tip of the adhesive pin 14c, the adhesive pin 14c is lifted to bring the upper glass substrate into contact with and hold the elastic body 11a surface of the elastic plate 11 attached to the upper table 9.

In step S12, a ring-shaped adhesive (sealant) is applied to the surface of the lower glass substrate, and the lower glass substrate on which an appropriate amount of liquid crystal has been dropped in the area surrounded by the adhesive is moved to the position of the lower table 10 by the robot hand. And load it on the support pin. Note that the adhesive may be provided on the upper glass substrate side instead of being provided on the lower glass substrate, or may be provided on both upper and lower glass substrates.

Next, the support pin is retracted to the lower table 10 side until the tip end is on the table surface or inside the table surface, and negative pressure is supplied to and held in the suction holes provided in the lower table 10. It should be noted that the lower table 10 is provided with an electrostatic adsorption mechanism so that the glass substrate can be held so as not to be displaced even when the chamber is evacuated. The lower table 10 may be provided with an adhesive pin mechanism like the upper table 9. In this case, the moving distance of the adhesive pin can be set smaller than that of the upper table 9.

In step S13, when the upper and lower glass substrates are respectively held on the adhesive pin 14c and the lower table 10, the Z-axis drive mechanism 2 is operated to lower the upper frame 5, the upper chamber 7, and the upper table 9, and the upper chamber 7 The lower chamber 8 and the lower chamber 8 are united via a seal ring to form a vacuum chamber. In synchronization with this operation, the adhesive pin drive mechanism 14 is also lowered using the vertical drive motor 14a and the adhesive pin up/down mechanism 14d so that the positional relationship with the upper table 9 does not change. At this time, the distance between the opposing surfaces of the upper substrate held by the upper table 9 and the lower substrate held by the lower table 10 is kept about several millimeters, and the upper substrate and the lower substrate are not brought into contact with each other. Thereafter, although not shown, the air in the vacuum chamber is exhausted from the exhaust port provided on the lower chamber 8 side to reduce the pressure in the vacuum chamber. When the inside of the vacuum chamber is in a reduced pressure state for bonding, a positioning mark that is previously provided on the upper glass substrate and the lower glass substrate is misaligned using a camera (not shown) with a deep depth of focus provided on the lower unit side. Find the amount. However, when the depth of focus of the camera is shallow, a mechanism for moving the camera up and down is provided to first recognize the positioning mark of the upper glass substrate and then move the camera downward to recognize the positioning mark of the lower glass substrate and recognize the upper and lower glass. A method of obtaining the displacement amount of the positioning mark on the substrate is used. After that, the XYθ moving unit 13 is driven to move the lower table 10 to correct the displacement of the upper and lower substrates in the XYθ directions. It should be noted that this positioning operation can be performed during the depressurization process for bonding.
In step S14, when the alignment of the upper and lower substrates is completed, the Z-axis drive mechanism 2 is operated to move the upper table 9 via the frame 5, and the adhesive pin drive mechanism 14 is moved to the lower table 10 side in synchronization therewith. The upper and lower glass substrates are brought into contact by moving. While the upper and lower glass substrates are in contact with each other, the amount of displacement of the positioning marks on the upper and lower glass substrates is checked again, and if they are displaced, the positioning operation is performed again. When the checking and positioning operations are completed, only the upper table 9 is further lowered to apply pressure and separate the upper glass substrate from the adhesive pin 14c. When the substrate is pressed, the elastic body 11a on the elastic plate 11 attached to the upper table 9 is deformed, so that the entire substrate can be uniformly pressed. There is a case where the glass substrates held on both tables are displaced during pressing, and it is better to observe the positioning mark from time to time to correct the displacement.

In step 15, when the upper and lower glass substrates are pressurized and the bonding is completed, a purge gas is introduced into the vacuum chamber by a purge gas blow mechanism (not shown). At this time, the atmosphere is also introduced to return to atmospheric pressure. When the glass substrate is returned to the atmospheric pressure, the pressing force is further applied, and the glass substrate is pressed to a specified thickness. In that state, a UV irradiation mechanism (not shown) is operated to cure the adhesive at a plurality of points to temporarily fix the adhesive, and the bonding of the liquid crystal substrates is completed.

In the above operation, the substrate is held by the adhesive pin 14c until the upper and lower glass substrates come into contact with the adhesive (sealant) provided on one of the glass substrates, and the adhesive pin 14c is moved downward beyond that. Instead, by moving only the upper table 9 downward, the adhesive pin 14c is peeled off from the substrate surface. At this time, by moving the adhesive pin 14c in the direction opposite to the moving direction of the glass substrate, the adhesive pin 14c can be reliably peeled from the substrate surface.
When the pressure is applied to the substrate, the adhesive pin is moved to the lower table 10 side at the same time, and after the pressurization is completed, the pressure is returned to the atmospheric pressure, and then the table maintains the same state as that in the pressurization. It is also possible to lift the adhesive pin drive mechanism 14 to separate the adhesive pin from the substrate. At this time, the adhesive pin can be easily peeled off from the substrate surface by raising the adhesive pin while feeding a positive pressure gas or clean air into the suction adsorption hole at the tip of the adhesive pin.

In step S16, the bonded substrates are carried out of the vacuum chamber using a robot hand (not shown).

As described above, according to this embodiment, it is possible to provide a substrate assembling apparatus and a substrate assembling method capable of reducing the bending of the glass substrate.
Further, according to the present embodiment, the generation of unevenness due to frictional electrification with the substrate is reduced, the occurrence of unevenness due to the temperature decrease due to rapid adiabatic expansion is prevented, and the bonding accuracy of the substrate is improved. -For thinning and fine patterning, it is possible to contribute to the manufacture of displays without color unevenness.

FIG. 6 is a schematic view of a board assembling apparatus according to a second embodiment of the present invention, which is a top view and a side view of a lower table. The present embodiment differs from the above-described first embodiment in that the first lifter 21 that is roughly arranged and the second lifter 22 that is densely arranged so as to be able to penetrate the lower table 10 are provided. In the following, the same components as those in the first embodiment will be designated by the same reference numerals, and the description overlapping with the first embodiment will be omitted.

FIG. 6 shows a top view and a side view of the lower table 10 that constitutes the substrate assembly apparatus 1 of this embodiment. As shown in the top view, the board assembling apparatus 1 according to the present embodiment includes a rod-shaped first lifter 21 extending in one direction and a through hole 23 provided in the lower table 10 as shown in the side view. And a second lifter 22 that is vertically movable. For convenience of description, FIG. 6 shows a case where two first lifters 21 and 24 second lifters 22 are provided, but the number of first lifters 21 and second lifters 22 is not limited to this. Absent. However, as shown in FIG. 6, the arrangement density of the first lifters 21 is coarse, and the arrangement density of the second lifters 22 is high. In other words, if the first lifters 21 are roughly arranged and the second lifters 22 are densely arranged, the number of the first lifters 21 and the second lifters 22 may be set appropriately.

FIG. 7 is a flow chart showing the operation flow of the board assembly apparatus of this embodiment.
Since steps S21 to S25 in FIG. 7 are the same as steps S11 to S15 shown in FIG. 5 in the above-described first embodiment, description thereof will be omitted here.

In step S27, the second lifter 22 is lifted by a predetermined amount, the bonded substrate is protruded by a predetermined amount from the holding surface (front surface) of the lower table 10, and after bonding from the holding surface (front surface) of the lower table 10. Float the substrate. Here, FIG. 8 is a vertical cross-sectional view showing a state where the lower glass substrate 16 is raised by a predetermined amount by the second lifter 22 shown in FIG. For convenience of description, FIG. 8 shows a state in which the lower glass substrate 16 is raised by a predetermined amount, but this means the substrate after being bonded. As shown in FIG. 8, the pitch P1 of the second lifter 22 (the pitch along the width direction of the lower table 10) is, for example, 80 mm to 100 mm, and the diameter D1 of the second lifter 22 is, for example, 5 mm. The hole diameter of the through hole 23 is, for example, 8 mm. The amount of rise h1 from the holding surface (surface) of the lower table 10 of the second lifter 22 is, for example, 1 mm to 3 mm. The second lifter 22 is formed of, for example, a resin of PEEK (polyetheretherketone), and the tip end portion that comes into contact with the back surface of the lower glass substrate 16 is a curved surface having a predetermined radius of curvature. Therefore, it is possible to prevent the back surface of the lower glass substrate 16 from being damaged or scratched. The purge gas or the atmosphere introduced by the purge gas blowing mechanism passes through the gap between the inner peripheral surface of the through hole 23 and the outer peripheral surface of the second lifter 22 as shown by the arrow in FIG. Sprayed on the back. In other words, the purge gas or the atmosphere enters the back surface of the lower glass substrate 16 through the gap between the inner peripheral surface of the through hole 23 and the outer peripheral surface of the second lifter 22.

Returning to FIG. 7, in step S27, the first lifter 21 is raised by a predetermined amount to further separate the lower glass substrate 16 from the holding surface (front surface) of the lower table 10. Here, FIG. 9 is a vertical cross-sectional view showing a state where the lower glass substrate 16 is raised by a predetermined amount by the first lifter 21 shown in FIG. For convenience of explanation, FIG. 9 also shows a state in which the lower glass substrate 16 is raised by a predetermined amount for convenience of description, but this means the substrate after bonding. As shown in FIG. 9, the pitch P2 of the first lifter 21 (the pitch along the width direction of the lower table 10) is, for example, 200 mm to 250 mm, and the holding surface (the surface of the lower table 10 of the first lifter 21). The amount of increase h2 from () is, for example, 100 to 200 mm. Therefore, the amount of rise h2 from the holding surface (front surface) of the lower table 10 of the first lifter 21 is approximately 33 times to 200 times the amount of rise h1 from the holding surface (front surface) of the lower table 10 of the second lifter 22. Double.

As described above, in step S26 described above, in the initial stage in which the back surface of the lower glass substrate 16 that constitutes the bonded substrates is separated from the holding surface (front surface) of the lower table 10, the purge gas or the atmosphere penetrates through holes. It penetrates into the back surface of the lower glass substrate 16 through the gap between the inner peripheral surface of 23 and the outer peripheral surface of the second lifter 22. At this time, the negative pressure between the back surface of the lower glass substrate 16 and the holding surface (front surface) of the lower table 10 is released through the through holes 23, and the bending of the substrates after the bonding due to the negative pressure is prevented. It becomes possible. Then, in step S27 described above, the lower glass substrate 16 is further separated from the holding surface (front surface) of the lower table 10 by the first lifter 21, so that the substrates after bonding can be suitably bonded while preventing the substrates from bending. It is possible to further separate the combined substrate from the holding surface (front surface) of the lower table 10. As a result, it prevents the occurrence of unevenness due to the bending of the glass substrate, contributes to the manufacture of next-generation high-definition displays in the manufacture of large-sized, thin-shaped, and fine-patterned products, and improves quality and yield. -It is possible to reduce costs and improve productivity.

Returning to FIG. 7, in step S28, the bonded substrates separated from the holding surface (front surface) of the lower table 10 by the first lifter 21 are transferred to a robot hand (not shown), and the robot hand moves the vacuum chamber to the vacuum chamber. It is carried out.

As described above, according to this embodiment, it is possible to provide a substrate assembling apparatus and a substrate assembling method capable of reducing the bending of the glass substrate.
In addition, according to the present embodiment, it is possible to prevent the occurrence of unevenness due to the bending of the glass substrate, and contribute to the production of a display with no color unevenness in the production of next-generation high-definition displays that are large, thin, and have a fine pattern. It is possible to improve, improve yield, reduce cost, and improve productivity.

Summarizing the above description of each embodiment, the board assembling apparatus and the board assembling method according to the embodiments have the following features.
(1) The substrate assembling apparatus holds one substrate on the lower table, holds the other substrate on the upper table so as to face the one substrate, and vacuums with an adhesive provided on one of the substrates. A substrate assembly apparatus for bonding in a chamber,
The surface of the upper table and/or the lower table holding the substrate has a plurality of convex portions and concave portions arranged adjacent to each other, and the width of the concave portion is the width of the upper table and/or the lower table. In contrast, the ratio is 10-6 to 10-4.
(2) In the board assembly apparatus of (1),
The plurality of convex portions and concave portions arranged adjacent to each other are formed on an embossed sheet, and are adhered to a surface of the upper table and/or the lower table holding the substrate with an adhesive. To do.
(3) In the board assembly apparatus of (2),
The embossed sheet is made of polyethylene terephthalate and has a corrugated longitudinal section.
(4) In the board assembly apparatus of (1),
The plurality of protrusions and recesses arranged adjacent to each other are formed on an elastic plate provided on a surface of the upper table and/or the lower table that holds the substrate.
(5) In the board assembly apparatus according to any one of (2) to (4),
The upper table provided inside the chamber is provided with a vacuum suction mechanism and a purge gas blow mechanism having a plurality of suction pins on a suction pin plate that can move up and down independently of the upper table. To do.
(6) Another board assembly apparatus holds one board on a lower table, holds the other board on an upper table so as to face the one board, and uses an adhesive provided on one of the boards. A substrate assembling device for bonding in a vacuum chamber,
It has a first lifter arranged roughly and a second lifter arranged densely, the second lifter is capable of penetrating the lower table, and the second lifter allows a predetermined amount of the substrate. After raising, the substrate is further raised by the first lifter.
(7) In the board assembly device of (6),
The amount of rise of the substrate by the first lifter is larger than the amount of rise of the substrate by the second lifter.
(8) In the board assembly device of (6) or (7),
The amount of rise of the substrate by the first lifter is approximately 33 to 200 times the amount of rise of the substrate by the second lifter.
(9) In the board assembly apparatus according to any one of (6) to (8),
The lower table is provided with a through hole through which the second lifter can penetrate, and when the substrate is raised by a predetermined amount by the second lifter, the inner peripheral surface of the through hole and the outer peripheral surface of the second lifter. The purge gas or the atmosphere penetrates into the back surface of the substrate through a gap between the substrate and the substrate.
(10) A board assembling method includes a step of holding one board on a lower table,
A step of holding the other substrate on the upper table so as to face the one substrate,
A substrate assembling method comprising a step of bonding in a vacuum chamber with an adhesive provided on one of the substrates,
A surface of the upper table and/or the lower table that holds the substrate has a plurality of convex portions and concave portions arranged adjacent to each other, and the width of the concave portion is the width of the upper table and/or the lower table. In contrast, the ratio is 10-6 to 10-4.
(11) In the board assembly method of (10),
The plurality of convex portions and concave portions arranged adjacent to each other are formed on an embossed sheet, and are adhered to a surface of the upper table and/or the lower table holding the substrate with an adhesive. To do.
(12) In the board assembly method of (11),
The embossed sheet is made of polyethylene terephthalate and has a corrugated longitudinal section.
(13) In the board assembly method of (10),
The plurality of protrusions and recesses arranged adjacent to each other are formed on an elastic plate provided on a surface of the upper table and/or the lower table that holds the substrate.
(14) Another board assembly method includes a step of holding one board on a lower table,
A step of holding the other substrate on the upper table so as to face the one substrate,
A substrate assembling method comprising a step of bonding in a vacuum chamber with an adhesive provided on one of the substrates,
It has a first lifter arranged roughly and a second lifter arranged densely, the second lifter is capable of penetrating the lower table, and the second lifter allows a predetermined amount of the substrate. After raising, the substrate is further raised by the first lifter.
(15) In the board assembly method of (14),
The amount of rise of the substrate by the first lifter is larger than the amount of rise of the substrate by the second lifter.
(16) In the board assembly method of (14) or (15),
The amount of rise of the substrate by the first lifter is approximately 33 to 200 times the amount of rise of the substrate by the second lifter.
(17) In the board assembly method according to any one of (14) to (16),
The lower table is provided with a through hole through which the second lifter can penetrate, and when the substrate is raised by a predetermined amount by the second lifter, the inner peripheral surface of the through hole and the outer peripheral surface of the second lifter. The purge gas or the atmosphere penetrates into the back surface of the substrate through a gap between the substrate and the substrate.
It should be noted that the present invention is not limited to the above-described embodiments, but includes various modifications. For example, the above-described embodiments have been described in detail for the purpose of explaining the present invention in an easy-to-understand manner, and are not necessarily limited to those having all the configurations described. Further, a part of the configuration of a certain embodiment can be replaced with the configuration of another embodiment, and the configuration of another embodiment can be added to the configuration of a certain embodiment.

DESCRIPTION OF SYMBOLS 1... Board assembly apparatus 2... Z-axis drive mechanism 2a... Z-axis drive motor 2b... Ball screw 2c... Ball screw receiving part 3... Guide mechanism 3a... Linear guide 3b... Linear moving part 4... Load cell 5... Upper frame 6... Upper shaft 7 ...Upper chamber 7b ...Bracket 8 ...Lower chamber 9 ...Upper table 10 ...Lower table 11 ...Elastic body plates 11a, 11b ...Elastic body 12 ...Lower shaft 13 ...XYθ moving unit 14 ...Adhesive pin drive mechanism 14a ...Vertical drive motor 14b... Adhesive pin plate 14c... Adhesive pin 14d... Adhesive pin up/down mechanism 14e... Adhesive sheet 15... Frame 16... Lower glass substrate 17, 18... Beam 21... First lifter 22... Second lifter 23... Through hole

Claims (6)

A substrate in which one substrate is held on the lower table, the other substrate is held on the upper table so as to face the one substrate, and the substrates are bonded in a vacuum chamber with an adhesive provided on one of the substrates. An assembly device,
The first lifter is arranged roughly and the second lifter is arranged densely, the second lifter is capable of penetrating the lower table, and the second lifter holds a substrate by a predetermined amount. After raising, the substrate is further raised by the first lifter ,
The lower table is provided with a through hole through which the second lifter can penetrate, and when the substrate is raised by a predetermined amount by the second lifter, the inner peripheral surface of the through hole and the outer peripheral surface of the second lifter. A substrate assembling apparatus, wherein the purge gas or the atmosphere enters the back surface of the substrate through a gap between the substrate and the substrate. The board assembly apparatus according to claim 1,
The substrate assembling apparatus according to claim 1, wherein a lift amount of the substrate by the first lifter is larger than a lift amount of the substrate by the second lifter. The board assembly apparatus according to claim 1 or 2,
The substrate assembling apparatus according to claim 1, wherein an ascending amount of the substrate by the first lifter is approximately 33 to 200 times an ascending amount of the substrate by the second lifter. A step of holding one of the substrates on the lower table,
A step of holding the other substrate on the upper table so as to face the one substrate,
A substrate assembling method comprising a step of bonding in a vacuum chamber with an adhesive provided on one of the substrates,
The first lifter is arranged roughly and the second lifter is arranged densely, the second lifter is capable of penetrating the lower table, and the second lifter holds a substrate by a predetermined amount. After raising, the substrate is further raised by the first lifter ,
The lower table is provided with a through hole through which the second lifter can penetrate, and when the substrate is raised by a predetermined amount by the second lifter, the inner peripheral surface of the through hole and the outer peripheral surface of the second lifter. A method of assembling a substrate, characterized in that the purge gas or the atmosphere penetrates into the back surface of the substrate through a gap between the substrate and the substrate. The board assembly method according to claim 4 ,
The substrate assembling method according to claim 1, wherein an amount of ascent of the substrate by the first lifter is larger than an amount of ascent of the substrate by the second lifter. The board assembly method according to claim 4 or 5 ,
The substrate assembling method according to claim 1, wherein an ascending amount of the substrate by the first lifter is approximately 33 to 200 times an ascending amount of the substrate by the second lifter.

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