JP6796963B2 - Soldering equipment - Google Patents

Description

The present invention relates to a soldering apparatus, and more specifically, to a soldering apparatus in which a solder material is heated and melted to make it liquid, and the liquid solder material is brought into contact with an object for soldering.

Conventionally, the following soldering devices are known as soldering devices that heat and melt a solder material to make it liquid, and bring the liquid solder material into contact with a substrate which is an object to perform soldering.

For example, it is a soldering apparatus in which a solder material is housed in a solder tank made of a non-conductive material, and the solder material is induced to be heated and melted by an electromagnetic induction heater arranged outside the solder tank. In such a soldering apparatus, the molten solder material is jetted by a jet means and brought into contact with the substrate to perform soldering (see, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2003-053527

By the way, in recent years, printed circuit boards used for power supply boards tend to have thicker copper conductor patterns, larger components, and larger heat sinks mounted on the printed circuit boards as the current increases. In such a printed circuit board, the heat capacity of the substrate becomes large, and a large amount of heat must be supplied for soldering. Therefore, in the soldering apparatus, the temperature of the solder material to be brought into contact with the substrate is raised.

However, in the above-mentioned conventional soldering apparatus, all the solder materials housed in the soldering tank are heated to a temperature suitable for soldering, so that the amount of heating becomes excessive. Moreover, when raising the temperature of the solder material in order to cope with a substrate having a large heat capacity, it is necessary to heat all of the solder material to raise the temperature, which takes time to adjust the temperature and is easily adjusted. It was difficult to do.

In view of the above circumstances, it is an object of the present invention to provide a soldering apparatus capable of easily adjusting a solder material to a suitable temperature while suppressing an excessive heating amount.

In order to achieve the above object, the soldering apparatus according to the present invention ejects a first heating means for heating and melting the solder material contained in the solder tank and a solder material melted by the first heating means. In a soldering apparatus for soldering an object, the soldering apparatus is provided with a soldering means for ejecting a solder material from the injection port to bring the solder material into contact with the object, and is provided in the vicinity of the injection port and by the injection means. The solder material to be jetted is provided with a second heating means for heating by induction heating.

Further, according to the present invention, in the soldering apparatus, the second heating means is arranged by being immersed in a solder material housed in the solder tank in a manner of being surrounded by an insulator composed of an insulating material. It is characterized by.

Further, according to the present invention, in the soldering apparatus, the insulator is composed of one insulating material, an insulating case accommodating the second heating means, and another insulating material different from the insulating case. , The insulating case is provided with an insulating material to be filled inside the insulating case.

Further, in the above-mentioned soldering apparatus, the present invention approximates the temperature detecting means for detecting the temperature of the solder material ejected from the jet port and the detection temperature detected by the temperature detecting means to a predetermined target temperature. It is characterized in that it is provided with a control means for adjusting the output of the second heating means.

Further, the present invention is characterized in that, in the soldering apparatus, the control means adjusts the output of the second heating means with the ejection height of the solder material ejected from the jet port as a parameter.

According to the present invention, the second heating means provided in the vicinity of the jet port is heated by the first heating means and the molten solder material jetted by the jet means is heated by induction heating. It is not necessary to heat all of the solder materials contained in the soldering material to a temperature suitable for soldering. Moreover, since the molten solder material jetted toward the jet port is heated by induction heating, the time required for temperature adjustment can be shortened. Therefore, it is possible to easily adjust the solder material to a suitable temperature while suppressing the heating amount from becoming excessive.

FIG. 1 is an explanatory diagram schematically showing a soldering apparatus according to a first embodiment of the present invention. FIG. 2 is a block diagram showing a characteristic control system of the soldering apparatus according to the first embodiment of the present invention. FIG. 3 is a flowchart showing the processing content of the temperature adjustment process performed by the control unit shown in FIG. FIG. 4 is an explanatory diagram schematically showing a soldering apparatus according to a second embodiment of the present invention. FIG. 5 is a block diagram showing a characteristic control system of the soldering apparatus according to the second embodiment of the present invention. FIG. 6 is a chart showing the relationship between the propeller rotation speed and the ejection height. FIG. 7 is a chart showing the relationship between the ejection height and the required heating amount. FIG. 8 is a chart showing the relationship between the current value and the required heating amount. FIG. 9 is a flowchart showing the processing content of the rotation speed adjustment process performed by the control unit shown in FIG. FIG. 10 is a flowchart showing the processing content of the temperature adjustment process performed by the control unit shown in FIG.

A preferred embodiment of the soldering apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

<Embodiment 1>
FIG. 1 is an explanatory diagram schematically showing a soldering device according to a first embodiment of the present invention, and FIG. 2 shows a characteristic control system of the soldering device according to the first embodiment of the present invention. It is a block diagram. The soldering device illustrated here includes a solder tank 10, a heating unit 20, an introduction flow path 30, a temperature detection sensor S1, and a control unit 40.

The solder tank 10 has a box-like shape with an open upper surface. The solder tank 10 is made of a metal material such as SUS316 or cast iron, and houses the solder material (for example, lead-free solder) inside. The solder tank 10 is provided with a jet portion 11 and a heater plate (first heating means) 12.

The jet portion 11 has a tubular shape provided so as to project upward from the upper end of the solder tank 10. The jet portion 11 is configured such that the cross-sectional area gradually decreases toward the upper side, and the upper surface opening forms the jet port 11a.

The heater plate 12 is attached to the side surface and the lower surface of the solder tank 10. The heater plate 12 generates heat when a drive command is given and is energized, and heats the solder material contained in the solder tank 10 to, for example, about 220 ° C. and holds it in a molten state.

The heating unit 20 includes a unit main body 21. The unit main body 21 has a square tubular shape, and the upper wall portion 21a, the lower wall portion 21b, the inner peripheral wall portion 21c, and the outer peripheral wall portion 21d are made of a heat-resistant resin such as polyimide or an insulating material such as ceramics. It is a constructed insulating case.

In addition, any one or all of the upper wall portion 21a, the lower wall portion 21b, and the outer peripheral wall portion 21d may be used as a magnetic material such as ferrite, thereby improving the heating performance and concentrating the heat generation on the jet portion 11. Can be done. Further, if the upper wall portion 21a is made of a magnetic material such as ferrite, leakage of magnetic flux to the outside of the device can be suppressed.

Such a unit main body 21 is installed in such a manner that the hollow portion 22 formed by the inner peripheral wall portion 21c communicates with the jet portion 11, that is, the upper surface opening of the hollow portion 22 communicates with the jet port 11a. That is, the unit main body 21 is arranged so as to be immersed in the solder material housed in the solder tank 10. In other words, the jet portion 11 is provided so as to project upward from the upper end of the solder tank 10 as described above by being attached to the unit main body 21.

Inside the unit body 21, an induction heating coil (second heating means) 23 is provided together with the heat-resistant cement 24. The induction heating coil 23 is composed of a cylindrical copper pipe, and is provided in such a manner that the inner peripheral wall portion 21c is wound while being separated from each wall portion 21a or the like of the unit main body 21.

Such an induction heating coil 23 is electrically connected to the inverter 25 and passes through the hollow portion 22 of the unit main body 21 when a voltage of a specific frequency (for example, 25 kHz) is applied from the inverter 25. It is a heating means that induces and heats a fluid. Here, the inverter 25 gives the alternating current supplied from a commercial power source (not shown) to the induction heating coil 23 as an alternating current having a specific frequency.

Further, the induction heating coil 23 is a water-cooled type in which cooling water passes through the hollow portion 23a. The heat-resistant cement 24 is an insulating material filled inside the unit body 21.

The introduction flow path 30 is a rectangular shape made of, for example, a stainless steel material such as SUS304 or SUS316 or a casting, and the discharge port 31 formed on the upper surface is continuous with the lower surface opening of the hollow portion 22 of the unit main body 21. It is provided inside the solder tank 10 in such a manner. A propeller 32 is provided inside the introduction flow path 30.

The propeller 32 is linked to the motor 34 through a rotating rod 33 extending in the vertical direction, and rotates around the central axis of the rotating rod 33 when the motor 34 is driven.

By rotating the propeller 32, a solder material in a molten state is introduced from the introduction port 35 formed on the lower surface of the introduction flow path 30 and passed through the introduction flow path 30, and then from the discharge port 31. It is a jet means for bringing a solder material into contact with a substrate 1 which is an object by ejecting the hollow portion 22 into the hollow portion 22 of the unit main body 21 and causing the hollow portion 22 to be jetted upward and ejected from the jet port 11a. ..

As a result, the induction heating coil 23 is provided in the vicinity of the jet port 11a, and the molten solder material that is jetted by the propeller 32 and passes through the hollow portion 22 is heated by induction heating to, for example, about 250 ° C. It is a means.

The temperature detection sensor S1 is a temperature detecting means for detecting the temperature of the solder material passing through the jet port 11a. When the temperature detection sensor S1 detects the temperature of the solder material passing through the jet port 11a, the temperature detection sensor S1 sends the detected temperature as a signal to the control unit 40.

The control unit 40 comprehensively controls the operation of the soldering device according to the programs and data stored in the memory 49, and includes an input processing unit 41, a calculation processing unit 42, and an output processing unit 43. The control unit 40 may be realized by, for example, a processing device such as a CPU (Central Processing Unit), that is, software, or hardware such as an IC (Integrated Circuit). Alternatively, it may be realized by using software and hardware together.

The input processing unit 41 inputs a signal (detection temperature) transmitted from the temperature detection sensor S1. The calculation processing unit 42 has a heating amount calculation unit 42a and a current value calculation unit 42b.

The heating amount calculation unit 42a reads out the target temperature stored in the memory 49 and calculates the required heating amount from the deviation between the target temperature and the detection temperature input through the input processing unit 41 by a predetermined relational expression. The target temperature is a memory 49 that stores the temperature input through an input means (not shown).

The current value calculation unit 42b calculates the current value to be output by a predetermined relational expression from the required heating amount calculated through the heating amount calculation unit 42a.

The output processing unit 43 outputs a command to the inverter 25 so that a current having a predetermined current value flows through the induction heating coil 23.

In the soldering apparatus having the above configuration, the solder material can be brought into contact with the substrate 1 to perform soldering as follows.

In the soldering apparatus, when the heater plate 12 is energized, the solder material contained in the solder tank 10 is heated to, for example, about 220 ° C. and melted. After all the solder materials contained in the solder tank 10 are melted in this way, the propeller 32 rotates, so that the melted solder material is introduced into the introduction flow path 30 through the introduction port 35 and jetted to flow. After passing through the road 30, the hollow portion 22 of the unit main body 21 is jetted upward.

Then, when a voltage of, for example, about 25 kHz is applied to the induction heating coil 23 and a current of, for example, about 150 A flows, the solder material passing through the hollow portion 22 is induced and heated to, for example, about 250 ° C. As a result, the solder material ejected from the jet port 11a can be brought into contact with the substrate 1 for soldering.

When performing such soldering, the control unit 40 of the soldering device performs the following temperature adjustment process.

FIG. 3 is a flowchart showing the processing content of the temperature adjustment process performed by the control unit 40 shown in FIG.

In this temperature adjustment process, when the control unit 40 inputs the detection temperature sent from the temperature detection sensor S1 through the input processing unit 41 (step S101: Yes), the control unit 40 reads out the target temperature from the memory 49 through the heating amount calculation unit 42a (step S101: Yes). Step S102).

The control unit 40 that has read out the target temperature calculates the required heating amount from the deviation between the target temperature and the detected temperature input through the input processing unit 41 through the heating amount calculation unit 42a by a predetermined relational expression (step S103).

After that, the control unit 40 calculates the current value to be output by a predetermined relational expression from the required heating amount calculated by the heating amount calculation unit 42a through the current value calculation unit 42b (step S104).

The control unit 40 that has calculated the current value to be output in this way outputs a command to the inverter 25 through the output processing unit 43 so that a current having a magnitude of the current value flows through the induction heating coil 23 (step S105). ), Then the procedure is returned to end this process.

According to this, the temperature of the solder material passing through the jet port 11a can be approximated to the target temperature.

As described above, according to the soldering apparatus according to the first embodiment, the induction heating coil 23 provided in the vicinity of the injection port 11a is heated by the heater plate 12 and melted by the propeller 32. Since the solder material in the state is heated by induction heating, it is not necessary to heat all the solder materials housed in the solder tank 10 to a temperature suitable for soldering (for example, about 250 ° C.). Moreover, since the molten solder material jetted toward the jet port 11a is heated by induction heating, the time required for temperature adjustment can be shortened. Therefore, the solder material can be easily adjusted to a suitable temperature while suppressing an excessive heating amount.

According to the soldering apparatus, since the unit main body 21 accommodating the induction heating coil 23 is immersed in the solder material accommodated in the solder tank 10 and arranged, the entire apparatus can be miniaturized.

According to the soldering apparatus, the induction heating coil 23 is housed inside the unit main body 21 made of one insulating material together with the heat-resistant cement 24 made of another insulating material, and the heat-resistant cement 24 is the unit. Since it is filled inside the main body 21, it is possible to maintain good insulation against thermal stress caused by heating and cooling of the induction heating coil 23. As a result, the service life can be extended.

According to the soldering device, the control unit 40 adjusts the output of the induction heating coil 23 so that the detection temperature detected by the temperature detection sensor S1 approximates a predetermined target temperature, so that the output is ejected from the injection port 11a. The solder material to be produced can be adjusted to approximate the target temperature at an early stage.

<Embodiment 2>
FIG. 4 is an explanatory diagram schematically showing the soldering apparatus according to the second embodiment of the present invention, and FIG. 5 shows a characteristic control system of the soldering apparatus according to the second embodiment of the present invention. It is a block diagram. The same reference numerals are given to those having the same configuration as the soldering apparatus of the first embodiment described above, and duplicate description will be omitted as appropriate.

The soldering device illustrated here includes a solder tank 10, a heating unit 20, an introduction flow path 30, a temperature detection sensor S1, a height detection sensor S2, a speed control inverter 36, and a control unit 50.

The height detection sensor S2 is a height detecting means for detecting the ejection height of the solder material ejected from the jet port 11a using, for example, a laser beam. When the height detection sensor S2 detects the ejection height of the solder material, the height detection sensor S2 sends the height detection value as a signal to the control unit 50.

The speed control inverter 36 supplies the alternating current supplied from a commercial power source (not shown) to the motor 34 as an alternating current having a specific frequency.

The control unit 50 comprehensively controls the operation of the soldering device according to the programs and data stored in the memory 59, and includes an input processing unit 51, a calculation processing unit 52, and an output processing unit 53. The control unit 50 may be realized by, for example, a processing device such as a CPU (Central Processing Unit) executing a program, that is, by software, or by hardware such as an IC (Integrated Circuit). Alternatively, it may be realized by using software and hardware together.

The input processing unit 51 receives a signal (detection temperature or height detection value) sent from the temperature detection sensor S1 or height detection sensor S2, or a signal (target temperature or height target value) input through the input means 2. It is something to enter. Here, the input means 2 is for the user to directly operate and input. The signal (target temperature and height target value) input and given by the input means 2 is stored in the memory 59.

The calculation processing unit 52 includes a rotation speed calculation unit 52a, a heating amount calculation unit 52b, and a current value calculation unit 52c. The rotation speed calculation unit 52a calculates the initial rotation speed value from the height target value stored in the memory 59 based on the following relational expression (1).

Relational expression (1)
h = a · n−b (h: ejection height, n: propeller rotation speed, a, b: constant)

This relational expression (1) shows a function of the propeller rotation speed and the ejection height as shown in FIG.

Further, the rotation speed calculation unit 52a calculates the rotation speed from the height detection value input through the input processing unit 51 based on the above relational expression (1).

The heating amount calculation unit 52b reads out the target temperature stored in the memory 59 and calculates the required heating amount from the deviation between the target temperature and the detection temperature input through the input processing unit 51 by the following relational expression (2). is there.

Relational expression (2)
Q = c · ΔT√h (Q: required heating amount, ΔT: target temperature-detection temperature, h: ejection height, c: constant)

This relational expression (2) shows a function of the ejection height and the required heating amount as shown in FIG.

The current value calculation unit 52c calculates the current value to be output by the following relational expression (3) from the required heating amount calculated through the heating amount calculation unit 52b.

Relational expression (3)
Q = k · I ² (I: current value, k: constant)

This relational expression (3) shows a function of the current value and the required heating amount as shown in FIG.

The output processing unit 53 outputs a command to the speed control inverter 36 so that the propeller 32 rotates at the rotation speed calculated by the above relational expression (1). Further, the output processing unit 53 outputs a command to the inverter 25 so that the current value calculated by the above relational expression (3) flows through the induction heating coil 23.

In the soldering apparatus having the above configuration, the solder material can be brought into contact with the substrate 1 to perform soldering as follows.

In the soldering apparatus, when the heater plate 12 is energized, the solder material contained in the solder tank 10 is heated to, for example, about 220 ° C. and melted. After all the solder materials contained in the solder tank 10 are melted in this way, the propeller 32 is rotated. Here, the initial value of the rotation speed of the propeller 32 is calculated by the above relational expression (1) from the height target value stored in the memory 59 by the control unit 50 through the rotation speed calculation unit 52a.

By rotating the propeller 32 at the initial rotation speed in this way, the molten solder material is introduced into the introduction flow path 30 through the introduction port 35 and jetted, and after passing through the introduction flow path 30, the unit main body 21 The hollow portion 22 of the solder is jetted upward.

Then, when a voltage of, for example, about 25 kHz is applied to the induction heating coil 23 and a current of, for example, about 150 A flows, the solder material passing through the hollow portion 22 is induced and heated to, for example, about 250 ° C. As a result, the solder material ejected from the jet port 11a can be brought into contact with the substrate 1 for soldering.

When performing such soldering, the control unit 50 of the soldering device performs the following rotation speed adjustment processing and temperature adjustment processing.

FIG. 9 is a flowchart showing the processing content of the rotation speed adjustment process performed by the control unit 50 shown in FIG.

In this rotation speed adjustment process, when the control unit 50 inputs the height detection value sent from the height detection sensor S2 through the input processing unit 51 (step S201: Yes), the above relational expression (step S201: Yes) is passed through the rotation speed calculation unit 52a. The rotation speed is calculated according to 1) (step S202).

The control unit 50 that has calculated the rotation speed in this way outputs a command to the speed control inverter 36 so that the propeller 32 rotates at the calculated rotation speed through the output processing unit 53 (step S203), and then the procedure. Is returned to end this process.

According to this, the ejection height of the solder material from the jet outlet 11a can be approximated to the height target value.

FIG. 10 is a flowchart showing the processing content of the temperature adjustment process performed by the control unit 50 shown in FIG.

In this temperature adjustment process, the control unit 50 inputs the detection temperature sent from the temperature detection sensor S1 and the height detection value sent from the height detection sensor S2 through the input processing unit 51 (step S211). : Yes, step S212: Yes), the target temperature is read out from the memory 59 through the heating amount calculation unit 52b (step S213).

The control unit 50 that reads out the target temperature obtains the deviation (ΔT) between the target temperature and the detection temperature input through the input processing unit 51 through the heating amount calculation unit 52b, and obtains the height detection value input through the input processing unit 51 and the height detection value. The required heating amount is calculated by the above relational expression (2) (step S214).

After that, the control unit 50 calculates the current value to be output by the above relational expression (3) from the required heating amount calculated by the heating amount calculation unit 52b through the current value calculation unit 52c (step S215).

The control unit 50 that has calculated the current value to be output in this way outputs a command to the inverter 25 through the output processing unit 53 so that a current having a magnitude of the current value flows through the induction heating coil 23 (step S216). ), Then the procedure is returned to end this process.

According to this, the temperature of the solder material passing through the jet port 11a can be approximated to the target temperature.

As described above, according to the soldering apparatus according to the second embodiment, the induction heating coil 23 provided in the vicinity of the injection port 11a is heated by the heater plate 12 and melted by the propeller 32. Since the solder material in the state is heated by induction heating, it is not necessary to heat all the solder materials housed in the solder tank 10 to a temperature suitable for soldering (for example, about 250 ° C.). Moreover, since the molten solder material jetted toward the jet port 11a is heated by induction heating, the time required for temperature adjustment can be shortened. Therefore, the solder material can be easily adjusted to a suitable temperature while suppressing an excessive heating amount.

According to the soldering apparatus, since the unit main body 21 accommodating the induction heating coil 23 is immersed in the solder material accommodated in the solder tank 10 and arranged, the entire apparatus can be miniaturized.

According to the soldering apparatus, the induction heating coil 23 is housed inside the unit main body 21 made of one insulating material together with the heat-resistant cement 24 made of another insulating material, and the heat-resistant cement 24 is the unit. Since it is filled inside the main body 21, it is possible to maintain good insulation against thermal stress caused by heating and cooling of the induction heating coil 23. As a result, the service life can be extended.

According to the soldering device, the control unit 50 outputs the output of the induction heating coil 23 using not only the detection temperature detected by the temperature detection sensor S1 but also the height detection value detected by the height detection sensor S2 as parameters. Since the adjustment is performed, the solder material ejected from the injection port 11a can be adjusted to be close to the target temperature quickly and with high accuracy.

Although preferred embodiments 1 and 2 of the present invention have been described above, the present invention is not limited to this, and various modifications can be made.

In the above-described first and second embodiments, the solder material contained in the solder tank 10 is heated by the heater plate 12, but in the present invention, the induction heating device provided outside the solder tank is used for induction heating. The solder material may be heated by

In the second embodiment described above, the ejection height is detected by the height detection sensor S2, but in the present invention, the ejection height of the solder material is calculated by detecting the rotation speed of the propeller (jet means). You may.

10 Solder tank 11 Jet flow part 11a Jet flow port 12 Heater plate 20 Heating unit 21 Unit body 22 Hollow part 23 Induction heating coil 24 Heat-resistant cement 25 Inverter 30 Introduction flow path 32 Propeller 34 Motor 40 Control unit 41 Input processing unit 42 Calculation processing unit 43 Output processing unit 49 Memory S1 Temperature detection sensor

Claims (3)

The first heating means for heating and melting the solder material contained in the solder tank,
In a soldering apparatus provided with a jet means for ejecting a solder material melted by the first heating means and ejecting the solder material from a jet port to bring the solder material into contact with an object, the soldering apparatus for soldering the object.
A second heating means provided near the jet port and heating the solder material jetted by the jet means by induction heating .
A temperature detecting means for detecting the temperature of the solder material ejected from the jet port, and
A height detecting means for detecting the ejection height of the solder material ejected from the jet port, and
A control means for adjusting the output of the jet means so that the jet height detected by the height detecting means approximates a predetermined height target value.
With
The control means calculates the required heating amount based on the deviation of the detected temperature detected by the temperature detecting means with respect to a predetermined target temperature and the ejection height detected by the height detecting means, and calculates the required heating. A soldering apparatus characterized in that an output current value is calculated from an amount and the output of the second heating means is adjusted so that a current having a magnitude of the output current value flows through the second heating means . The solder according to claim 1, wherein the second heating means is arranged by being immersed in a solder material housed in the solder tank in a manner of being surrounded by an insulator made of an insulating material. Soldering device. The insulator is
An insulating case made of one insulating material and accommodating the second heating means,
The soldering apparatus according to claim 2, wherein the soldering apparatus is made of another insulating material different from the insulating case, and is provided with an insulating material filled inside the insulating case.

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