JP6826718B2 - Board dividing device and board dividing method - Google Patents

Description

In the present invention, a substrate dividing device, particularly a first substrate in which a first scribe line for separating an end portion is formed on the front surface and a first substrate formed on the front surface thereof and a back surface of the first substrate, are attached to the end side of the first scribe line. 2 The present invention relates to a bonding substrate dividing device having a second substrate on which a scribe line is formed. The present invention also relates to a substrate dividing method.

The liquid crystal device is composed of a bonded substrate in which a first substrate and a second substrate are bonded by a sealing material so as to interpose a liquid crystal layer. In such a bonded substrate, a color filter is patterned on one of the above substrates (for example, the first substrate), and a TFT (Thin Film Transistor) and a connection terminal are formed on the other substrate (for example, the second substrate). Is formed.

In the above-mentioned bonded substrate, in order to connect to an external electronic device, it is necessary to expose the connection terminals formed on the second substrate. Patent Document 1 discloses a method for separating a substrate for exposing a surface on which a connection terminal is formed (exposing an inner side surface of one of the bonded substrates) in a bonded substrate which is a liquid crystal device. ing.

In Patent Document 1, first, when forming a scribe line, the scribe line is formed by shifting the arrangement position of the cutter that forms the scribe line on the first substrate and the arrangement position of the cutter that forms the scribe line on the second substrate. .. After that, when the bonded substrate (scrap) that becomes the piece and the bonded board that becomes the device are separated to expose the connection terminals, the chuck member is held in a state where the scrap is held by the chuck member. Is kept away from the laminated board that will be the device.

Japanese Unexamined Patent Publication No. 2012-250871

As described above, when the scraps are removed by the method of holding and moving the scraps with the chuck member, chipping may occur at the end on the side where the scraps of the bonded substrate existed. Such chipping is mainly caused by the end material coming into contact with the end portion of the bonded substrate by changing the distance between the chuck member and the table holding the bonded substrate. The occurrence of the above-mentioned chipping deteriorates the condition of the edge portion and the exposed surface of the bonded substrate.

An object of the present invention is to suppress the occurrence of chipping when removing the scraps from the bonded substrate when the scraps are removed after forming the scribe line to expose the inner side surface of any of the bonded substrates. To do.

The substrate dividing device according to the first aspect of the present invention has a first substrate in which a first scribe line for separating an end portion is formed on the front surface and a back surface of the first substrate, and is attached to the end side of the first scribe line. It is a bonding substrate dividing device having a second substrate on which a second scribe line that does not penetrate in the thickness direction is formed.
The dividing device includes a table and a pressing device.
The table supports the bonded substrate so that there is no table mounting surface below the edges .
The pressing device divides the end portion along the first scribe line and the second scribe line by pressing the end portion from the first substrate side.

In this device, even after each of the first scribe line and the second scribe line penetrates in the thickness direction of the first substrate and the second substrate, the pressing device further presses the end portion. When the end portion is further pressed after the scribe line has penetrated the substrate, the end portion moves away from the bonded substrate and is divided.

Due to such division, when the scribe line penetrates the substrate and the end portion becomes movable with respect to the bonded substrate, the end portion does not move in the direction approaching the bonded substrate. As a result, it is possible to prevent chipping from occurring due to contact between the end portion and the bonded substrate.

The second scribe line may be located inside the edge of the table. Here, the second scribe line formed on the second substrate facing the table is arranged inside the edge of the table, so that when the end portion is separated from the bonded substrate, the end portion and the table Interference can be reduced.

In the substrate dividing method according to another viewpoint of the present invention, the first substrate in which the first scribe line for separating the end portion is formed on the front surface and the back surface of the first substrate are bonded to each other and the end from the first scribe line. This is a method for dividing a bonded substrate having a second substrate on which a second scribe line that does not penetrate in the thickness direction is formed on the side. And it has the following steps.

a: A mounting step in which the bonded substrate is mounted on the table so that the mounting surface of the table does not exist below the end portion .

b: A dividing step in which the end portion is divided along the first scribe line and the second scribe line by pressing the end portion from the first substrate side.

(4) In the mounting step, the second scribe line may be arranged inside the edge of the table.

In the present invention, it is possible to suppress the occurrence of chipping when removing the scraps from the bonded substrate.

The schematic diagram of the substrate dividing apparatus according to one Embodiment of this invention. The schematic diagram (the 1) for demonstrating the division step of the substrate division method. The schematic diagram (2) for demonstrating the division step of the substrate division method. The schematic diagram which shows a mode that the scrap is separated in a dividing step.

FIG. 1 is a schematic view of a substrate dividing device according to an embodiment of the present invention. This device is a device for removing the end material GL located on one side of the bonded substrate G. As shown in FIG. 1, the bonded substrate G is composed of a first substrate G1 and a second substrate G2 bonded to the back surface of the first substrate G1. Here, the first scribe line S1 is formed on the surface of the first substrate G1, and the second scribe line S2 is formed on the surface of the second substrate G2 on the side placed on the table 2 (described later). The first scribe line S1 and the second scribe line S2 are cracks having a length in the thickness direction, and the scrap GL is separated along the first scribe line S1 and the second scribe line S2.

The length of the second scribe line S2 in the thickness direction of the second substrate G2 is preferably, for example, 75% or more, more preferably about 75% to 80% of the thickness of the second substrate G2. As a result, when the pressing device 1 (described later) presses the first substrate G1 downward in FIG. 1, the second scribe line S2 easily advances until it penetrates the thickness of the second substrate G2.

Further, by not forming the first scribe line S1 and the second scribe line S2 until they penetrate the first substrate G1 and the second substrate G2, respectively, for example, after forming the scribe lines S1 and S2 on the bonded substrate G, for example. It is possible to prevent the end material GL from being separated from the main body of the bonded substrate G when it is transported to the table 2.

The dividing device includes a pressing device 1 and a table 2. The pressing device 1 is supported by a support mechanism such as a gantry (not shown) in the direction perpendicular to the paper surface of FIG. The pressing device 1 is movable up and down by the drive mechanism M1 and has a pressing portion 11. The bonded substrate G is placed on the table 2 so that the first substrate G1 is located above.

Further, the pressing portion 11 is arranged at a position away from the end portion of the bonded substrate G (however, a position where the pressing portion 11 can press the first substrate G1) when the bonded substrate G is arranged on the table 2. Is preferable. As a result, when the end material GL is separated and freely falls, the pressing portion 11 and the end material GL can be less likely to interfere with each other.

The bonded substrate G is preferably arranged so that the second scribe line S2 is located inside the end of the table 2 (for example, about 500 μm inside from the end of the table 2). As a result, when the end material GL is separated from the bonded substrate G and freely falls, it is possible to prevent the end material GL and the bonded substrate G from interfering with each other.

The table 2 can be moved in the left-right direction of FIG. 1 by a drive mechanism M2 including a drive motor, a guide mechanism, and the like.

The pressing portion 11 of the pressing device 1 presses the end material GL from the first substrate G1 side against the bonded substrate G by the pressing surface 11a. As a result, the scrap GL is divided along the first scribe line S1 and the second scribe line S2. The pressing portion 11 is made of a resin or the like having a lower rigidity than the first substrate G1. Therefore, the pressing portion 11 is elastically deformable when the end material GL is pressed.

Next, a method of dividing and removing the scrap GL from the bonded substrate G will be described.

First, a bonded substrate G to which the first substrate G1 and the second substrate G2 are bonded is prepared, and the surface of the first substrate G1 (the surface on the side where the second substrate G2 is not bonded) is prepared by a scribe line forming apparatus (not shown). ) Is formed with the first scribe line S1 and the second scribe line S2 is formed on the surface of the second substrate G2 placed on the table 2.

Next, the bonded substrate G is placed on the mounting surface of the table 2. Here, when the bonded substrate G is placed on the table 2, it is placed as follows. That is, as shown in FIG. 1, the first substrate G1 on which the first scribe line S1 is formed is located above, and the surface of the second substrate G2 on the side where the second scribe line S2 is formed is the table 2. The bonded substrate G is arranged on the table 2 so that the second scribe line S2 is located slightly inside the end of the table 2. Further, the portion to be pressed when the end material GL is separated is arranged so as to be located directly below the pressing portion 11.

Next, as shown in FIG. 2, the pressing portion 11 is lowered to bring the pressing surface 11a and the end material GL portion into contact with each other, and as shown in FIG. 3, the pressing portion 11 is further lowered to end the end by the pressing surface 11a. The material GL portion is pressed downward from the first substrate G1 side. At this time, since the mounting surface of the table 2 does not exist below the scrap material GL, the first substrate G1 and the second substrate G2 are respectively the first by pressing the scrap material GL portion by the pressing portion 11. The cracks in the scribe line S1 and the second scribe line S2 further extend in the substrate thickness direction, and the scrap GL is fully cut.

After that, as shown in FIG. 4, when the pressing portion 11 is further lowered, it rotates around the position where the second scribe line S2 of the second substrate G2 is formed, and the scrap GL is removed from the bonded substrate G. Completely separated. The end material GL completely separated from the bonded substrate G freely falls in the gap between the pressing portion 11 and the table 2.

In this way, even after the first scribe line S1 and the second scribe line S2 have penetrated the first substrate G1 and the second substrate G2, the scrap GL is continuously pressed and moved from the bonded substrate G. It is possible to prevent the end material GL from moving in the direction approaching the main body of the bonded substrate G. As a result, it is possible to prevent the scrap material GL and the bonded substrate G from coming into contact with each other and causing chipping. Thereby, for example, it is possible to prevent the chipping fragments from falling on the exposed surface of the second substrate G2 and deteriorating the quality of the exposed surface.

[Other Embodiments]
The present invention is not limited to the above embodiments, and various modifications or modifications can be made without departing from the scope of the present invention.

In the above embodiment, the pressing portion 11 is a rectangular member, but the present invention is not limited to this, and for example, the area of the pressing portion 11 on the pressing surface 11a side may be made smaller. For example, the pressing portion 11 may be tapered in the direction of the pressing surface 11a.

1 Pressing device 2 Table 11 Pressing part 11a Pressing surface G Laminated substrate G1 First substrate G2 Second substrate GL Scraps M1, M2 Drive mechanism S1 First scribe line S2 Second scribe line

Claims (4)

A first substrate having a first scribe line formed on the front surface for separating the end portion and a second scribe that is attached to the back surface of the first substrate and does not penetrate the end side from the first scribe line in the thickness direction. A bonding substrate dividing device having a second substrate on which a line is formed.
A table that supports the bonded substrate and
A pressing device that divides the end portion along the first scribe line and the second scribe line by pressing the end portion from the first substrate side.
Equipped with a,
A substrate dividing device , characterized in that there is no mounting surface for the table below the end portion . The substrate dividing device according to claim 1, wherein the second scribe line is arranged inside the edge of the table. A first substrate having a first scribe line formed on the front surface for separating the end portion and a second scribe that is attached to the back surface of the first substrate and does not penetrate the end side from the first scribe line in the thickness direction. It is a method of dividing a bonded substrate having a second substrate on which a line is formed.
The mounting step of mounting the bonded substrate on the table and
A dividing step of dividing the end portion along the first scribe line and the second scribe line by pressing the end portion from the first substrate side.
Equipped with a,
A method of dividing a substrate in which the bonded substrate is supported so that the mounting surface of the table does not exist below the end portion in the mounting step . The substrate dividing method according to claim 3, wherein in the preceding step, the second scribe line is arranged inside the edge of the table.

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