JP6841246B2 - Manufacturing line of laminated electronic parts and manufacturing method of laminated electronic parts - Google Patents

Description

The present invention relates to a production line for laminated electronic components and a method for producing laminated electronic components.

Laminated electronic components such as multilayer ceramic capacitors are manufactured by laminating ceramic green sheets on which an internal conductor layer is formed.
Patent Document 1 discloses a green sheet printing laminating method and an apparatus therefor.

Special Fair 7-93231

In the production of laminated electronic components, a ceramic slurry is applied to a carrier film such as a PET film to a certain thickness to form a ceramic green sheet on the carrier film. Further, the conductive paste to be the inner conductor layer is printed on the ceramic green sheet. Then, the ceramic green sheet on which the conductive paste is printed is laminated and the carrier film is peeled off to form a laminate.

Patent Document 1 discloses a green sheet printing laminating method and an apparatus thereof used in such a process, and can manufacture a laminated body.
Patent Document 1 describes that a conductive paste is printed on a green sheet with a carrier tape (hereinafter referred to as a carrier film) and then dried.
This drying step is a step performed before the laminating step.

Here, in the drying step performed on each green sheet before the laminating step, if the degree of drying varies, the amount of moisture absorbed by each green sheet after drying will be different.
When green sheets with different amounts of moisture absorption are stacked and compressed, the reduction rate (the degree of crushing and thinning) of each green sheet due to compression varies, so there is a problem that the dimensional variation of the laminated electronic components obtained by the laminating process becomes large. ..
According to the studies by the present inventors, it was found that when the degree of drying is high (the amount of moisture absorption is small), the reduction rate is large (the green sheet becomes thin), and the degree of drying is low (the amount of moisture absorption is large). ), It was found that the reduction rate becomes smaller (the green sheet is less likely to become thinner).
As described above, it has not been known so far that the difference in the amount of moisture absorbed by each green sheet before the laminating process causes a large dimensional variation of the laminated electronic components obtained by the laminating process.

The present invention has been made to solve the above problems, and manufactures a laminated electronic component capable of obtaining a laminated electronic component having a small dimensional variation by drying and laminating a drying object placed on a carrier film. It is an object of the present invention to provide a line and a method of manufacturing a laminated electronic component.

In the production line of the laminated electronic component of the present invention for achieving the above object, a drying furnace for drying the material to be dried as a material for the laminated electronic component on a carrier film and a dried product after drying are laminated. It is a production line for laminated electronic components including a laminating device for peeling the carrier film, and is characterized in that the drying furnace is provided with a humidifying mechanism for preventing a decrease in humidity due to an increase in temperature. ..

The production line of the laminated electronic component of the present invention includes a drying furnace and a laminating device. Since the drying furnace is provided with a humidifying mechanism for preventing a decrease in humidity due to a temperature rise, drying in the drying furnace can be performed in a humidified atmosphere. When the drying in the drying furnace is performed in a humidified atmosphere, it is possible to reduce the variation in the amount of moisture absorbed by each dried product after drying, so that the reduction rate of each dried product in the laminating step can be made uniform. As a result, by using the production line of the laminated electronic component of the present invention, it is possible to manufacture the laminated electronic component with small dimensional variation.
In the present specification, the object to be dried is referred to as an object to be dried before being dried in the drying oven, and is referred to as an object to be dried after being dried in the drying oven.

The production line of the laminated electronic component of the present invention includes a transport mechanism for carrying the carrier film on which the object to be dried is placed into the drying furnace and carrying out the carrier film on which the dried product after drying is carried out from the drying furnace. It is preferable to provide a dried product processing mechanism that continuously processes the dried product carried out from the drying furnace by the transport mechanism in the next step.

The production line for the laminated electronic components is provided with a transfer mechanism and a drying furnace in the production line so that the object to be dried placed on the carrier film can be continuously dried in the drying furnace. Further, the dried product dried in the drying oven can be continuously processed in the next step.
Since the drying furnace is provided with a humidifying mechanism for preventing a decrease in humidity due to a temperature rise, drying in the drying furnace can be performed in a humidified atmosphere. When drying in a drying oven is performed in a humidified atmosphere, shrinkage of the carrier film due to drying can be suppressed. Therefore, the shrinkage of the carrier film when it is carried out from the drying furnace is small, and no problem occurs even if the carrier film is continuously advanced to the next process without being left unattended.
Therefore, by using the above-mentioned production line of the laminated electronic component, the lead time at the time of manufacturing can be shortened and the laminated electronic component can be manufactured.

In the production line of the laminated electronic component of the present invention, the humidifying mechanism has a humidity control mechanism for matching the humidity in the drying furnace with the atmospheric humidity before the drying furnace is charged and the atmospheric humidity after the drying furnace is charged. Is preferable.
If the humidification mechanism has a humidity control mechanism capable of matching the humidity in the drying furnace with the atmospheric humidity before and after the drying furnace is put into the drying furnace, the variation in the amount of moisture absorbed by each drying object and the dried product before and after the drying process can be increased. It can be reduced. Therefore, it is possible to manufacture a laminated electronic component having a smaller dimensional variation.
In addition, shrinkage of the carrier film in the drying step is suppressed. Since the amount of moisture contained in the ambient air absorbed by the carrier film after the carrier film on which the dried product is placed is carried out from the drying furnace is also reduced, the dimensional change of the carrier film is small, and the carrier film is moved to the next step after the drying step. It is preferable to proceed continuously. To match the humidity in the drying furnace with the atmospheric humidity before and after the drying furnace is charged, the humidity in the drying furnace should be within ± 10% of the atmospheric humidity before the drying furnace is charged, and after the drying furnace is charged. It means that it is within the range of ± 10% of the atmospheric humidity of. The atmospheric humidity before the drying furnace is charged and the atmospheric humidity after the drying furnace is charged are usually the same because they are measured in the same working environment.

In the production line of the laminated electronic component of the present invention, the object to be dried is a ceramic green sheet, a ceramic green sheet on which a via conductor is formed, a ceramic green sheet on which a conductive paste is arranged, or a ceramic green. It is preferable that the conductive paste arranged on the sheet is patterned by etching or development.
These drying objects are suitable as materials for forming laminated electronic components through a drying step and a laminating step.

In the production line of the laminated electronic component of the present invention, it is also preferable to provide a drilling device for drilling the dried product.
The drilling device is provided between the drying furnace and the laminating device.
Even when the step after the drying step is the drilling step, it is effective in that the accuracy of the drilling position can be improved by suppressing the shrinkage of the carrier film due to the drying. In this case as well, the drilling is performed from the drying step. The lead time between processes can be shortened.

In the method for manufacturing a laminated electronic component of the present invention, the object to be dried, which is the material of the laminated electronic component, is placed on a carrier film and dried in the above-mentioned drying furnace having a humidified atmosphere inside the drying furnace to obtain a dried product. It is characterized in that a drying step and a laminating step of laminating the dried product and peeling off the carrier film are performed.
In the above step, since the drying in the drying furnace is performed in a humidified atmosphere, it is possible to reduce the variation in the amount of moisture absorbed by each dried product after drying. Therefore, the reduction rate of each dried product in the laminating process can be made uniform. As a result, it is possible to manufacture a laminated electronic component having a small dimensional variation.

In the method for manufacturing a laminated electronic component of the present invention, the carrier film on which the object to be dried is carried is carried into the drying furnace, and the carrier film on which the dried product is dried is carried out from the drying furnace. It is preferable to carry out the carry-out step and further to continuously treat the dried product carried out from the drying furnace in the next step.

In the above step, since the drying in the drying furnace is performed in a humidified atmosphere, the shrinkage of the carrier film is suppressed. Therefore, the shrinkage of the carrier film when it is carried out from the drying furnace is small, and no problem occurs even if the carrier film is continuously advanced to the next process without being left unattended.
Therefore, the dried product carried out from the drying furnace can be continuously processed in the next step, and the lead time at the time of manufacturing can be shortened to manufacture the laminated electronic component.

In the method for producing laminated electronic components of the present invention, the carrier film is preferably a PET film or a PEN film.
The PET film or PEN film is suitable as a carrier film for manufacturing laminated electronic components. These films have the property of shrinking and expanding by releasing and absorbing moisture, but in the method for manufacturing laminated electronic components of the present invention, drying in the drying step is performed in a humidified atmosphere, so that the film is dried before and after the drying step. Shrinkage and expansion of the carrier film are suppressed.
Therefore, the method for manufacturing laminated electronic components of the present invention is particularly effective when these films are used.

In the method for manufacturing a laminated electronic component of the present invention, the object to be dried is a ceramic green sheet, a ceramic green sheet on which a via conductor is formed, a ceramic green sheet on which a conductive paste is arranged, or a ceramic green. It is preferable that the conductive paste arranged on the sheet is patterned by etching or development.
These drying objects are suitable as materials for forming laminated electronic components through a drying step and a laminating step.

In the method for manufacturing a laminated electronic component of the present invention, it is also preferable to perform a drilling step of drilling a hole in the dried product.
If the dimensional change of the carrier film from the time when the carrier film on which the dried product is placed is carried out from the drying furnace to the drilling process is suppressed, the hole position will be displaced even if the drilling process is performed immediately after the drying process. It is prevented from occurring.
That is, in the above step, it is possible to manufacture a multilayer ceramic substrate or the like as a laminated electronic component by shortening the lead time at the time of manufacturing.

In the method for manufacturing a laminated electronic component of the present invention, the temperature in the drying furnace in the drying step is preferably 20 ° C. or higher and 70 ° C. or lower.
Further, the humidity in the drying furnace in the drying step is preferably 40% or more and 60% or less. Further, the drying time in the drying step is preferably 10 minutes or less.
Under such drying conditions, the effect of the present invention of manufacturing a laminated electronic component with small dimensional variation and the effect of the present invention of manufacturing a laminated electronic component by shortening the lead time at the time of manufacturing are more preferable. It is demonstrated in.

In the method for producing laminated electronic components of the present invention, it is preferable that the humidity in the drying furnace is matched with the atmospheric humidity before the drying furnace is charged and the atmospheric humidity after the drying furnace is charged by the humidifying mechanism.
When the humidity in the drying furnace is matched with the atmospheric humidity before and after the drying furnace is charged by the humidifying mechanism, it is possible to further reduce the variation in the amount of moisture absorbed by each object to be dried and the dried product before and after the drying step. Therefore, it is possible to manufacture a laminated electronic component having a smaller dimensional variation.
Further, when the humidity in the drying furnace is matched with the atmospheric humidity before and after the drying furnace is charged by the humidifying mechanism, the shrinkage of the carrier film in the drying step is suppressed. Since the amount of moisture contained in the ambient air absorbed by the carrier film after the carrier film on which the dried product is placed is carried out from the drying furnace is also reduced, the dimensional change of the carrier film is small, and the carrier film is moved to the next step after the drying step. It is preferable to proceed continuously.
To match the humidity in the drying furnace with the atmospheric humidity before putting in the drying furnace and the atmospheric humidity after putting in the drying furnace, the humidity in the drying furnace should be within ± 10% of the atmospheric humidity before putting in the drying furnace. Moreover, it means that the humidity is within ± 10% of the atmospheric humidity after being put into the drying furnace.

According to the production line of the present invention and the method for producing a laminated electronic component of the present invention, the object to be dried placed on the carrier film can be dried and laminated to obtain a laminated electronic component having small dimensional variation.

FIG. 1 is a cross-sectional view schematically showing an example of a production line for a laminated electronic component of the present invention.

Hereinafter, a manufacturing line for the laminated electronic component of the present invention and a method for manufacturing the laminated electronic component of the present invention will be described.
However, the present invention is not limited to the following configurations, and can be appropriately modified and applied without changing the gist of the present invention.
A combination of two or more of the individual desirable configurations of the invention described below is also the invention.
It goes without saying that each of the embodiments shown below is an example, and partial replacement or combination of the configurations shown in different embodiments is possible.

FIG. 1 is a cross-sectional view schematically showing an example of a production line for a laminated electronic component of the present invention.
The production line 1 shown in FIG. 1 includes a transport mechanism 10, a drying furnace 20, and a dried product processing mechanism 60. This production line 1 can be said to be a continuous production line because the transport mechanism 10, the drying furnace 20, and the dried product processing mechanism 60 are continuously arranged.
Since the dried product processing mechanism 60 may have various forms, it is not shown as a specific device form in FIG.

FIG. 1 shows a ceramic green sheet 41 on which a conductive paste 42 is printed, as an example of a drying object 40 that is a material for laminated electronic components.
The object to be dried 40 is placed on the carrier film 30.
The carrier film 30 on which the object to be dried 40 is placed is mounted on the transport mechanism 10.
The object to be dried 40 is a material for laminated electronic components.
Details of the object to be dried, which is a material for laminated electronic components, will be described later.

The transport mechanism 10 transports the carrier film 30 on which the object to be dried 40 is placed in the direction of arrow A shown in FIG. Specifically, the carrier film 30 on which the object to be dried 40 is placed is carried into the drying furnace 20 from the carry-in port 23 of the drying furnace 20, is carried in the drying furnace 20, and is carried out from the carry-out port 24 of the drying furnace 20. .. In the process of transporting in the drying furnace 20, the object to be dried 40 placed on the carrier film 30 is dried to become a dried product 50, and is carried out as a dried product 50 from the carry-out port 24 of the drying furnace 20 while still mounted on the carrier film 30. ..
The transport mechanism 10 continuously transports the carrier film 30 on which the dried product 50 is carried out from the carry-out port 24 to the dried product processing mechanism 60. Then, the processing of the next step by the dried product processing mechanism 60 is continuously performed.
As the transport mechanism, a known transport device such as a belt conveyor, a roller conveyor, or a suction conveyor can be used.

In the drying furnace 20, the object to be dried 40 placed on the carrier film 30 is dried.
The drying furnace 20 shown in FIG. 1 is provided with a heater 21 in the drying furnace 20, and includes a carry-in inlet 23 into which the drying object 40 is carried in and an carry-out outlet 24 in which the dried product 50 is carried out.
A part of the transport mechanism 10 passes between the carry-in inlet 23 and the carry-out port 24, and the transport mechanism 10 can transport the drying object 40 and the dried material 50 between the carry-in inlet 23 and the carry-out port 24. it can.
When the drying furnace 20 is used as a continuous furnace by constantly driving the transport mechanism 10, the carry-in inlet 23 and the carry-out outlet 24 are left open. When the transport mechanism 10 is repeatedly driven and stopped, the carry-in inlet 23 and the carry-out outlet 24 may be closed while the transport mechanism 10 is stopped.

The drying furnace 20 includes a humidifying mechanism 22.
The humidification mechanism is a mechanism for supplying water to the drying furnace to increase the humidity in the drying furnace in order to prevent a decrease in humidity due to a temperature rise.
Humidification mechanisms include a vaporization-type humidification mechanism that humidifies by evaporating room-temperature water, a water-spray-type humidification mechanism that sprays room-temperature water into fine water droplets, and a steam-type humidification that introduces steam to humidify. The mechanism and the like can be mentioned.
Examples of the vaporization type humidification mechanism include a moisture permeable membrane type, a dripping permeation type, a capillary type, and a rotary type. Examples of the water spray type humidification mechanism include an ultrasonic type, a centrifugal type, a high pressure spray type, and a two-fluid spray type. Examples of the steam type humidification mechanism include a steam piping type, an electric heating type, and an electrode type.
Among these humidifying mechanisms, a vaporization type, a steam type, a water spray type, or a combination of these is preferable.

The humidifying mechanism makes the atmosphere inside the drying oven a humidified atmosphere.
FIG. 1 shows that an in-core hygrometer 25 for measuring the humidity in the drying furnace is provided in the drying furnace 20.
Further, FIG. 1 shows that a carry-in inlet side hygrometer 26 for measuring the atmospheric humidity before the drying furnace is put in and a carry-out side hygrometer 27 for measuring the atmospheric humidity after the drying furnace is put in are provided. ..
It is preferable that the humidity in the drying furnace is matched with the atmospheric humidity before the drying furnace is charged and the atmospheric humidity after the drying furnace is charged.
Therefore, the humidification mechanism adjusts the humidity in the drying furnace to match the atmospheric humidity before charging the drying furnace measured by the hygrometer on the carry-in inlet side and the atmospheric humidity after charging the drying furnace measured by the hygrometer on the carrying-out port side. It is preferable to have a humidity control mechanism that controls while measuring with an internal hygrometer.
Although not shown in FIG. 1, it is preferable that an in-core thermometer for controlling the temperature in the drying furnace is provided in the drying furnace, based on the temperature in the drying furnace measured by the in-core thermometer. It may have a temperature control mechanism that controls the output of the heater.
Further, the inside of the drying furnace may or may not be blown.

In the drying furnace, the temperature inside the drying furnace is preferably 20 ° C. or higher and 70 ° C. or lower, and the humidity inside the drying furnace is preferably 40% or higher and 60% or lower, depending on the setting of the humidifying mechanism and the operating conditions of the heater. .. It is more preferable that the temperature in the drying furnace can be set to 30 ° C. or higher and 50 ° C. or lower, and it is further preferable that the humidity in the drying furnace can be set to 45% or higher and 55% or lower. To match the humidity in the drying furnace with the atmospheric humidity before and after the drying furnace is charged, the humidity in the drying furnace should be within ± 10% of the atmospheric humidity before the drying furnace is charged, and after the drying furnace is charged. It should be within the range of ± 10% of the atmospheric humidity. In addition, the relationship between the size of the drying furnace and the operating conditions (transporting speed) of the transport mechanism must be determined so that the drying time for drying the object to be dried in the drying furnace is 10 minutes or less. preferable.

What kind of mechanism is provided as the dried product processing mechanism 60 differs depending on the type of the laminated electronic component to be manufactured and the type of the dried product to be processed by the dried product processing mechanism.
Examples of the dry matter processing mechanism include a laminating device, a drilling device, an exposure device, and the like.

The production line of the laminated electronic component of the present invention includes a laminating device for laminating the dried product after drying and peeling off the carrier film.
The laminating device may be provided as a dry matter processing mechanism that continuously processes the dried matter carried out by the transport mechanism in the next step, and is not continuous but after undergoing another step. It may be provided in the production line as a device for laminating dried products.
In the laminating device, the dried product is placed on the carrier film so that the dried product is on the bottom and the carrier film is on the top, the carrier film is peeled off, and the next dried product is placed on the carrier film and dried. Place the object so that the object is on the bottom and the carrier film on the top, and peel off the carrier film. .. .. The apparatus may be an apparatus for laminating dried products by repeating the above steps.
Further, an apparatus may be used in which a dried product is peeled from the carrier film, and the peeled dried product is conveyed and laminated.
That is, as long as the device is capable of both laminating the dried product and peeling the carrier film, the order of laminating the dried product and peeling the carrier film in the laminating device does not matter.

As the object to be dried as a material for laminated electronic components, a ceramic green sheet, a ceramic green sheet on which a via conductor is formed, a ceramic green sheet on which a conductive paste is arranged, or a ceramic green sheet on which a conductive paste is arranged. It is possible to use a conductive paste whose pattern is formed by etching or development. The "arrangement" referred to here includes "printing" and "transfer". Further, the object to be dried is not limited to the ceramic green sheet, and may be a resin multilayer sheet.
When the laminated electronic component is a laminated ceramic electronic component such as a laminated ceramic capacitor and the dried product is a ceramic green sheet on which a conductive paste is arranged, the dried product is laminated and a carrier film is used as a dry product processing mechanism. A laminating device that peels off can be used.
Examples of the laminating device include a laminating device for laminating a ceramic green sheet on which a conductive paste is arranged and for peeling off a carrier film. As such a laminating device, a known device conventionally used for manufacturing a monolithic ceramic electronic component such as a monolithic ceramic capacitor can be used.

When the laminated electronic component is a multilayer ceramic substrate and the dried product is a ceramic green sheet on which a conductive paste is arranged, a laminating device for laminating the dried product and peeling the carrier film is used as the dried product processing mechanism. can do.
The conductive paste is formed on a ceramic green sheet in a predetermined pattern by screen printing or the like.
Examples of the laminating device include a laminating device for laminating a ceramic green sheet on which a conductive paste is arranged and for peeling off a carrier film. As such a laminating device, a known device conventionally used for manufacturing a multilayer ceramic substrate can be used.

When the laminated electronic component is a multilayer ceramic substrate and the dried product is a ceramic green sheet, a drilling device for drilling holes in the ceramic green sheet can be used as the dried product processing mechanism.
As the drilling device, a mechanical punch, a CO ₂ laser, a UV laser, or the like can be used.
The drilling device is preferably a device capable of continuously performing the drilling process while transporting the ceramic green sheet placed on the carrier film by the transport mechanism.

Next, an example of the laminated electronic component and the object to be dried (dried substance) will be described.
The laminated electronic component that can be manufactured by the manufacturing line of the laminated electronic component of the present invention and can be manufactured by the manufacturing method of the laminated electronic component of the present invention includes a laminated ceramic capacitor, a laminated inductor, and a laminated filter (LC composite component). ) And other multilayer ceramic electronic components.
Further, examples of the multilayer ceramic substrate include an LTCC substrate using a low-temperature sintered ceramic material.
Further, a resin multilayer substrate using a resin for the insulating layer can also be mentioned.

Hereinafter, preferred examples of the object to be dried will be described for each type of laminated electronic component.
When the laminated electronic component is a laminated ceramic electronic component, the object to be dried is a ceramic green sheet, a ceramic green sheet on which a via conductor is formed, a ceramic green sheet on which a conductive paste is arranged, or a ceramic green. Examples thereof include those in which the conductive paste arranged on the sheet is patterned by etching or development.
The ceramic green sheet contains, for example _{, a ceramic material containing barium titanate (BaTIO 3} ), calcium titanate (CaTIO ₃ ), strontium titanate (SrTIO ₃ ), calcium zirconate (CaZrO ₃ ), or the like as a main component. Further, the ceramic material may contain Mn, Mg, Si, Co, Ni, rare earths and the like as subcomponents having a content smaller than that of the main component.
Examples of the organic substance contained in the ceramic green sheet include a polyvinyl butyral-based binder as a binder, a phthalate ester-based binder, and the like.
The thickness of the ceramic green sheet is preferably 0.5 μm or more and 1.2 μm or less.

The conductive paste preferably contains a metal material such as Ni powder, a solvent, a dispersant and a binder. The metal material preferably contains a metal material such as Ni, Cu, Ag, Pd, Ag-Pd alloy or Au. It is also preferable that a dielectric material having the same composition as the ceramic material contained in the ceramic green sheet is contained.
The thickness of the conductive paste is preferably 0.2 μm or more and 1.5 μm or less.

When the laminated electronic component is a multilayer ceramic substrate, the objects to be dried include a ceramic green sheet, a ceramic green sheet on which a via conductor is formed, a ceramic green sheet on which a conductive paste is arranged, and a ceramic green sheet. Examples thereof include those in which the obtained conductive paste is patterned by etching or development, or ceramic green sheets provided with a photosensitive pattern-forming material.
Regardless of the object to be dried, the ceramic green sheet preferably contains a low-temperature sintered ceramic material. The low-temperature sintered ceramic material means a ceramic material that can be sintered at a firing temperature of 1000 ° C. or lower and can be simultaneously fired with Ag, Cu, or the like.
The low-temperature co-fired ceramic material, for example, quartz, alumina, glass composite-based low-temperature co-fired ceramic material obtained by mixing borosilicate glass ceramic material such as _{forsterite, ZnO-MgO-Al 2 O} 3 -SiO 2 system crystallized glass-based low-temperature co-fired ceramic material with crystallized _{glass, BaO-Al 2 O 3 -SiO} 2 based ceramic material and _{Al 2 O 3 -CaO-SiO 2} -MgO-B 2 O 3 based ceramic material or the like Examples thereof include non-glass-based low-temperature sintered ceramic materials using. Further, the ceramic green sheet may contain a binder and a plasticizer.
Further, the ceramic green sheet may be provided with via holes for interlayer connection, and it is preferable that the via holes are filled with a conductive paste.
The thickness of the ceramic green sheet is preferably 5 μm or more and 100 μm or less.

When the object to be dried, which is the material of the multilayer ceramic substrate, is a ceramic green sheet on which the conductive paste is arranged, the conductive paste may be a photosensitive conductive paste, or a metal powder, a plasticizer, or a binder. A conductive paste having a composition consisting of the above can be used. The metal powder preferably contains Au, Ag or Cu, and more preferably contains Ag or Cu.
The conductive paste may be a paste to which a consortium (ceramic, glass) is added for adjusting the amount of shrinkage with the ceramic.
In this case, the conductive paste formed on the ceramic green sheet in a predetermined pattern by screen printing or the like becomes the inner conductor layer of the multilayer ceramic substrate.
The thickness of the conductive paste is preferably 1 μm or more and 10 μm or less.

Subsequently, an example of the carrier film will be described.
As the carrier film, the same one can be used regardless of the type of laminated electronic component to be manufactured.
As the carrier film, a PET film, a PEN film, or the like can be used. It is preferably a PET film or a PEN film.
Further, it is preferable to use a film made of a material having a water absorption rate of 0% or more and 0.5% or less as the carrier film. With a film having such a water absorption rate, the effect of drying in the drying step in a humidified atmosphere is preferably exhibited. Further, the water absorption rate of the carrier film is more preferably 0% or more and 0.4% or less.

Subsequently, the method for manufacturing the laminated electronic component of the present invention will be described in order of steps.
The method for manufacturing a laminated electronic component of the present invention can be performed using the manufacturing line for the laminated electronic component of the present invention described so far. Further, as the laminated electronic component, the one described above can be manufactured, and the object to be dried (dried substance) and the carrier film as the material of the laminated electronic component are the same as those described above.

First, a method for manufacturing a laminated electronic component of the present invention will be described by taking as an example a case where a multilayer ceramic substrate is manufactured as a laminated electronic component.
In the following example, the object to be dried (dried product) is a ceramic green sheet in which a via conductor is formed, and a conductive paste arranged on the ceramic green sheet is patterned by etching or development. The conductive paste formed on the ceramic green sheet in a predetermined pattern serves as the inner conductor layer of the multilayer ceramic substrate.
The dried product processing mechanism is a laminating device, and the dried product processing step is a laminating process.

(1) Step of preparing a ceramic green sheet A slurry is prepared by mixing an arbitrary amount of a low-temperature sintered ceramic material, a binder and a plasticizer. By applying this slurry on a carrier film and forming a sheet, a ceramic green sheet is produced on the carrier film.
A device such as a lip coater or a doctor blade can be used for applying the slurry.

(2) Step of processing via holes for interlayer connection on the ceramic green sheet _{A device such as a mechanical punch, a CO 2} laser, or a UV laser can be used for processing the via holes. The hole diameter is not limited, but is preferably 20 μm or more and 200 μm or less.

(3) Step of filling the via hole with the conductive paste The via hole is filled with the conductive paste composed of metal powder, a plasticizer, and a binder. It is preferable to use the same conductive paste as the conductive paste used to form the inner conductor layer.
A co-based material (ceramic powder) for adjusting the shrinkage rate may be added to the conductive paste used for filling the via holes.

(4) Step of forming a pattern of the conductive paste A predetermined pattern is formed by the conductive paste. As a method for forming a predetermined pattern, a method such as screen printing, inkjet printing, gravure printing, photolithography method, blanket printing or the like can be used. Further, a copper foil whose pattern is formed by etching may be used.
The via conductor is formed on the ceramic green sheet and the conductive paste arranged on the ceramic green sheet is patterned, which is the object to be dried.
It should be noted that the steps up to this point may be carried out while being carried on the carrying mechanism, and may be carried out continuously with the subsequent steps.

(5) Carry-in process, drying process and unloading process The drying furnace is set to a predetermined temperature, and the inside of the drying furnace is set to a humidified atmosphere by using a humidifying mechanism.
The temperature in the drying furnace is preferably 20 ° C. or higher and 70 ° C. or lower, and the humidity in the drying furnace is preferably 40% or higher and 60% or lower. Further, it is more preferable that the temperature in the drying furnace is 30 ° C. or higher and 50 ° C. or lower, and it is more preferable that the humidity in the drying furnace can be 45% or higher and 55% or lower.
Further, it is preferable that the humidity in the drying furnace is matched with the atmospheric humidity before the drying furnace is charged and the atmospheric humidity after the drying furnace is charged. Specifically, it is preferable that the humidity in the drying furnace is within the range of ± 10% of the atmospheric humidity before the drying furnace is charged and within ± 10% of the atmospheric humidity after the drying furnace is charged.
The carrier film on which the ceramic green sheet is placed is placed on the transfer mechanism and carried into the drying furnace using the transfer mechanism.
The transfer mechanism is continuously driven to dry the ceramic green sheet placed on the carrier film while moving it in the drying oven. By drying, the ceramic green sheet becomes a dried product.
The transport mechanism is continuously driven to remove the carrier film on which the dried ceramic green sheet is placed from the drying oven.
The drying time can be adjusted by adjusting the moving speed of the transport mechanism. The drying time is preferably 1 minute or more, and preferably 10 minutes or less.
Further, the ceramic green sheet may be dried under the condition that the tackiness of the ceramic green sheet remains.

(6) Laminating Step In the laminating step, the dried ceramic green sheet carried out from the drying furnace by the transport mechanism is laminated by the laminating device and the carrier film is peeled off.
In the laminating apparatus, a laminated body is formed by repeating the steps of laminating ceramic green sheets, peeling off the carrier film, and laminating another ceramic green sheet.
The number of stacked electronic components can be appropriately determined according to the dimensions of the laminated electronic components to be manufactured, the required performance, and the like.

(7) Subsequent process The laminated body is placed in a mold and crimped. The pressure and temperature at the time of crimping can be set arbitrarily.
Subsequently, the laminate is placed in a firing jig such as a setter or a sheath and put into a firing furnace for firing. As the firing furnace, a batch furnace or a belt furnace can be used.
When Cu is used as the metal material constituting the conductive paste, it is preferable to bake it in a reducing atmosphere.
If necessary, it is preferable to form a break line before firing. As a method for forming the break line, a laser, a guillotine cut (half cut), a dicer (half cut), or the like can be selected.
If necessary, it is preferable to plate the conductor layer of the outer layer after firing. As the plating, Ni—Sn plating, electroless Au plating and the like can be selected.
Then, a break is performed along the break line, and each laminated electronic component is divided.

Here, the continuity between the drying process and the laminating process in the manufacture of laminated electronic components will be considered.
When considering the continuous production of laminated electronic components, it is preferable to perform the laminating step immediately after the drying step from the viewpoint of shortening the lead time during manufacturing, but the laminating step is performed immediately after the drying step. That was actually difficult.

So far, the reason why it has been difficult to perform the laminating process immediately after the drying process will be described.
When the conductive paste was printed on the green sheet with the carrier film, the drying process was performed, and the green sheet with the carrier film was taken out from the drying oven, the moisture originally contained in the carrier film was removed by drying and shrunk. It is in a state. Therefore, when the laminating step is performed using the green sheet with the carrier film in which the carrier film is shrunk, the position of the ceramic green sheet and the conductive paste in the laminated body may be displaced.
In order to prevent this misalignment, measures are taken to take out the green sheet with the carrier film from the drying oven and then leave it outside the drying oven for a while. When left outside the drying oven, the carrier film absorbs the moisture contained in the surrounding air, the shrinkage of the carrier film is eliminated, and the dimensions of the carrier film are restored. Then, when the laminating step is performed using the green sheet with the carrier film in which the dimensions of the carrier film are restored to the original dimensions, the misalignment in the laminated body is prevented.

Under these circumstances, in the manufacturing process of laminated electronic components, after taking out the green sheet with a carrier film from the drying oven, it is left for a while outside the drying oven, and after storing a predetermined number of green sheets with a carrier film, The laminating process was performed separately.
That is, it is difficult to perform continuous processing from the drying process to the next process (lamination process), which causes a long lead time during manufacturing.

However, according to the method for manufacturing laminated electronic components disclosed in the present application, since the object to be dried is dried in a humidified atmosphere, it is possible to suppress variations in the amount of moisture absorbed by the dried product after drying, and the reduction rate of the dried product in the laminating step can be reduced. It can be aligned. Therefore, after the drying step, the laminating step can be continuously performed, and the lead time can be shortened.

Next, another example of the method for manufacturing a laminated electronic component of the present invention will be described by taking the case of manufacturing a multilayer ceramic substrate as a laminated electronic component as an example.
In the following example, the object to be dried (dried material) is a ceramic green sheet.
The dry matter processing mechanism is a drilling device, and the dry matter processing step is a drilling step.

The steps up to step (1) shown above are carried out in the same manner to prepare a ceramic green sheet. This ceramic green sheet is the object to be dried.
Instead of performing the steps (2) to (4), the carry-in step, the drying step, and the carry-out step of (5) are performed. (5) The carry-in step, the drying step, and the carry-out step are the steps shown above by placing the carrier film on which the ceramic green sheet is placed on the transport mechanism and carrying it into the drying furnace using the transport mechanism. It can be carried out in the same manner as in (5).

Instead of the laminating step of (6), the following step (6') is performed.
(6') Drilling step In the drilling step, the dried ceramic green sheet carried out from the drying furnace by the transport mechanism is carried into the drilling device while being placed on the carrier film.
As the drilling device, a device such as a mechanical punch, a CO ₂ laser, or a UV laser can be used. The hole diameter is not limited, but is preferably 20 μm or more and 200 μm or less.
After that, the via holes formed by the drilling step may be filled with the conductive paste, the conductive paste may be printed, and the pattern may be formed.
Then, a multilayer ceramic substrate can be manufactured by performing the same laminating step as in (6) above and the subsequent step similar to (7) above on the ceramic green sheet processed after the drilling step. it can. It is preferable that the steps after the drilling step are also continuously performed.

As another example, a ceramic green sheet on which the conductive paste is arranged may be used as a dried product in the drilling step.
Further, the dried product processing mechanism may be an exposure apparatus, the dried product may be an exposed object, and the dried product processing step may be an exposure step.

Next, another example of the method for manufacturing a laminated electronic component of the present invention will be described by taking the case of manufacturing a laminated ceramic electronic component as a laminated electronic component as an example.
In the following example, the object to be dried (dried material) is a ceramic green sheet on which a conductive paste is arranged. The conductive paste formed on the ceramic green sheet in a predetermined pattern serves as the inner conductor layer of the laminated ceramic component.
The dried product processing mechanism is a laminating device, and the dried product processing step is a laminating process.

In this case, the steps are almost the same as the steps for manufacturing the multilayer ceramic substrate shown first, and the carry-in step, the drying step and the carry-out step of (5), and the laminating step of (6) are almost the same.
The preferred materials and thicknesses of the ceramic green sheet and the conductive paste, the number of laminated sheets, the firing temperature, and the like are different.
Further, the step of providing the via hole for interlayer connection in (2) and the step of filling the via hole in (3) with the conductive paste may not be performed depending on the type of the laminated ceramic electronic component.

Further, when a resin multilayer substrate is manufactured as a laminated electronic component, the same process may be performed except that a resin sheet is used instead of the ceramic green sheet, and detailed description thereof will be omitted. The same applies to the case where the dry matter processing mechanism is a laminating device, the case where it is a drilling device, and the like.

The following tests were conducted to investigate the effect of shrinkage of the carrier film in the drying process.
(Example 1)
A slurry containing a low-temperature sintered ceramic material, a binder and a plasticizer was applied on a PET film which is a carrier film by a doctor blade and sheet-formed to prepare a ceramic green sheet on the carrier film.
Two holes serving as marks for measuring the distance between two points were provided at predetermined positions of the ceramic green sheet placed on the carrier film, and the distance between the two points was measured.
The ceramic green sheet placed on the carrier film was dried in a drying oven (50 ° C./2.5 minutes). At this time, the inside of the drying furnace was dried in a humidified atmosphere with a humidity of 50% using a humidifying mechanism.
The distance between two points on the ceramic green sheet immediately after being taken out from the drying oven was measured.
The difference from the distance between the two points before drying was 5 μm or less.

(Comparative Example 1)
When the ceramic green sheet placed on the carrier film similar to Example 1 is dried in a drying oven (50 ° C./2.5 minutes), the humidification mechanism is not driven and the atmosphere is not humidified. Was dried.
When the distance between the two points on the ceramic green sheet immediately after being taken out from the drying furnace was measured in the same manner as in Example 1, the difference from the distance between the two points before drying was 20 μm or more.

Comparing the results of Example 1 and Comparative Example 1 in this way, it can be seen that the shrinkage of the carrier film can be suppressed by drying in a humidified atmosphere. Therefore, by drying in a humidifying atmosphere in a drying furnace, the dried product can be continuously processed in the next step.

1 Production line 10 Conveyance mechanism 20 Drying furnace 21 Heater 22 Humidification mechanism 23 Carry-in port 24 Carry-out port 25 In-core hygrometer 26 Carry-in port side hygrometer 27 Carry-out port side hygrometer 30 Carrier film 40 Drying object 41 Ceramic green sheet 42 Conductive Sex paste 50 Dry matter 60 Dry matter processing mechanism

Claims (14)

A drying oven that dries the object to be dried, which is the material for laminated electronic components, on a carrier film.
A production line for laminated electronic components, which comprises a laminating device for laminating dried products after drying and for peeling off the carrier film.
The drying furnace is provided with a humidifying mechanism for preventing a decrease in humidity due to an increase in temperature .
The object to be dried is a ceramic green sheet, a ceramic green sheet having a via conductor formed on the ceramic green sheet, a conductive paste arranged on the ceramic green sheet, or the conductive paste arranged on the ceramic green sheet being etched or etched. The pattern was formed by development,
The humidification mechanism is a production line for laminated electronic components, characterized in that the humidifying mechanism has a humidity control mechanism for matching the humidity in the drying furnace with the atmospheric humidity in the laminating apparatus. A transport mechanism in which the carrier film on which the object to be dried is placed is carried into the drying furnace, and the carrier film on which the dried product after drying is carried is carried out from the drying furnace.
The production line for laminated electronic components according to claim 1, further comprising a dry matter processing mechanism for continuously treating the dried matter carried out from the drying furnace by the transport mechanism in the next step. The humidity control mechanism, the humidity of the drying oven, the drying oven is turned before the atmosphere humidity, prior Symbol drying furnace atmosphere humidity after turning and 請Motomeko 1 atmospheric humidity and Ru are aligned in the stacked device or 2. The production line for laminated electronic parts according to 2. With the object to be dried, which is the material of the laminated electronic component, placed on the carrier film,
A drying step in which the inside of the drying furnace is made into a humidified atmosphere and dried in the drying furnace to obtain a dried product,
Cormorants rows and laminating step of removing the carrier film with laminating the dried product, a manufacturing method of a multilayer electronic component,
The object to be dried is a ceramic green sheet, a ceramic green sheet having a via conductor formed on the ceramic green sheet, a conductive paste arranged on the ceramic green sheet, or the conductive paste arranged on the ceramic green sheet being etched or etched. The pattern was formed by development,
A method for manufacturing a laminated electronic component , which comprises matching the humidity in the drying furnace with the atmospheric humidity in the laminating step. A carry-in step of carrying the carrier film on which the object to be dried is placed into the drying furnace and a carry-out step of carrying out the carrier film on which the dried product after drying is carried out from the drying furnace are performed.
The method for manufacturing a laminated electronic component according to claim 4 , wherein the dried product carried out from the drying furnace is continuously processed in the next step. The method for manufacturing a laminated electronic component according to claim 4 or 5 , wherein the carrier film is a PET film or a PEN film. The method for manufacturing a laminated electronic component according to any one of claims 4 to 6 , wherein the temperature in the drying furnace in the drying step is 20 ° C. or higher and 70 ° C. or lower. The method for manufacturing a laminated electronic component according to any one of claims 4 to 7 , wherein the humidity in the drying furnace in the drying step is 40% or more and 60% or less. The method for manufacturing a laminated electronic component according to any one of claims 4 to 8 , wherein the drying time in the drying step is 10 minutes or less. The humidity of the drying oven, the drying oven is turned before the atmosphere humidity, multilayer electronic of any of claims 4-9 for matching with atmospheric humidity before SL after drying oven turned atmospheric humidity and the laminating step How to manufacture parts. A drying oven that dries the object to be dried, which is the material for laminated electronic components, on a carrier film.
A production line for laminated electronic components including a laminating device for laminating dried products after drying and peeling the carrier film, and a drilling device provided between the drying furnace and the laminating device.
The drying furnace is provided with a humidifying mechanism for preventing a decrease in humidity due to an increase in temperature.
The humidification mechanism is a production line for laminated electronic components, characterized in that the humidification mechanism has a humidity control mechanism for matching the humidity in the drying furnace with the atmospheric humidity in the drilling device. The laminated electron according to claim 11, wherein the humidity control mechanism matches the humidity in the drying furnace with the atmospheric humidity before the drying furnace is charged, the atmospheric humidity after the drying furnace is charged, and the atmospheric humidity in the drilling device. Parts production line. With the object to be dried, which is the material of the laminated electronic component, placed on the carrier film,
A drying step in which the inside of the drying furnace is made into a humidified atmosphere and dried in the drying furnace to obtain a dried product,
A drilling process for drilling holes in the dried product, and
A method for manufacturing a laminated electronic component, in which a laminating step of laminating the dried product and peeling off the carrier film is performed.
A method for manufacturing a laminated electronic component, which comprises matching the humidity in the drying furnace with the atmospheric humidity in the drilling step. The method for manufacturing a laminated electronic component according to claim 13, wherein the humidity in the drying furnace is matched with the atmospheric humidity before the drying furnace is charged, the atmospheric humidity after the drying furnace is charged, and the atmospheric humidity in the drilling step.

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