JP6885966B2 - Manufacturing method of dicing die bonding sheet and semiconductor chip - Google Patents

Description

The present invention relates to a dicing die bonding sheet and a method for manufacturing a semiconductor chip.
The present application claims priority based on Japanese Patent Application No. 2016-214161 filed in Japan on November 1, 2016, the contents of which are incorporated herein by reference.

The dicing die bonding sheet is composed of, for example, a base material, an adhesive layer, and a film-like adhesive in this order, and is used by being attached to a semiconductor wafer by the film-like adhesive (see Patent Document 1). Dicing The semiconductor wafer fixed on the die bonding sheet is divided together with the pressure-sensitive adhesive layer and the film-like adhesive by dicing and separated into semiconductor chips. After that, the semiconductor chip with the film-like adhesive after cutting is separated from the pressure-sensitive adhesive layer and picked up. When the pressure-sensitive adhesive layer is curable, the pressure-sensitive adhesive layer is cured after dicing to reduce the adhesiveness, so that the semiconductor chip provided with the film-like adhesive can be easily picked up. The semiconductor chip picked up together with the film-like adhesive is die-bonded to the circuit forming surface of the substrate by the film-like adhesive, and if necessary, one or more other semiconductor chips are laminated on the semiconductor chip to form a wire. Bonded. Next, the entire obtained product is sealed with a resin to produce a semiconductor package, and finally, the target semiconductor device is manufactured using this semiconductor package.

Dicing is performed, for example, by using a dicing blade and cutting a semiconductor wafer while rotating the dicing blade. However, in this dicing method, cut pieces derived from each layer such as a base material are generated. If the amount of the cut pieces generated is large, the cut pieces are likely to adhere to the side surface of the semiconductor chip or the circuit forming surface, and the semiconductor chip with such the cut pieces still attached has a process abnormality until the subsequent pickup. Can cause the occurrence of. Further, when the configuration of the dicing die bonding sheet or the process from dicing to picking up is changed in order to reduce the amount of cut pieces generated, this change itself may cause a process abnormality.
On the other hand, in the invention described in Patent Document 1, it is not clear whether the amount of cut pieces generated can be reduced while suppressing the occurrence of the above-mentioned process abnormalities.

Japanese Unexamined Patent Publication No. 2009-12822

INDUSTRIAL APPLICABILITY The present invention can reduce the amount of cut pieces generated during dicing using a dicing blade, and can suppress the occurrence of process abnormalities between dicing and picking up a semiconductor chip provided with a film-like adhesive. It is an object of the present invention to provide a bonding sheet and a method for manufacturing a semiconductor chip using the dicing die bonding sheet.

The present invention includes a base material, a pressure-sensitive adhesive layer formed on the base material, an intermediate layer formed on the pressure-sensitive adhesive layer, and a film-like adhesive formed on the intermediate layer. The intermediate layer is made of resin, the interface of the intermediate layer on the side provided with the film-like adhesive is peeled off, and the tensile elasticity of the intermediate layer is 3500 MPa or more. I will provide a.
In the dicing die bonding sheet of the present invention, the adhesive force between the pressure-sensitive adhesive layer and the intermediate layer may be 0.3 N / 25 mm or more.

Further, the present invention comprises a step of forming a laminated structure in which a semiconductor wafer is provided on a surface of the dicing die bonding sheet opposite to the side on which the intermediate layer is provided. In the laminated structure, the semiconductor wafer is divided into semiconductor chips by forming a notch that reaches the intermediate layer from the surface of the semiconductor wafer and does not reach the base material by using a dicing blade. Provided is a method for manufacturing a semiconductor chip, which comprises a step of forming a semiconductor chip.

By manufacturing a semiconductor chip using the dicing die bonding sheet of the present invention, it is possible to reduce the amount of cut pieces generated during dicing using a dicing blade. As a result, it is possible to suppress the occurrence of process abnormalities between dicing and picking up a semiconductor chip provided with a film-like adhesive.

It is sectional drawing which shows typically one Embodiment of the dicing die bonding sheet of this invention. It is sectional drawing for schematically explaining one Embodiment of the manufacturing method of the semiconductor chip of this invention. It is an enlarged cross-sectional view which shows typically one Embodiment of the semiconductor chip obtained by the manufacturing method of this invention. It is an enlarged sectional view schematically showing another embodiment of the semiconductor chip obtained by the manufacturing method of this invention. It is sectional drawing for schematically explaining one Embodiment of the manufacturing method of the semiconductor device using the manufacturing method of the semiconductor chip of this invention. FIG. 5 is an enlarged cross-sectional view schematically showing an embodiment of the semiconductor chip obtained in Comparative Example 1. FIG. 5 is an enlarged cross-sectional view schematically showing an embodiment of the semiconductor chip obtained in Comparative Example 2. FIG. 5 is an enlarged cross-sectional view schematically showing an embodiment of the semiconductor chip obtained in Comparative Example 3. FIG. 5 is an enlarged cross-sectional view schematically showing an embodiment of the semiconductor chip obtained in Comparative Example 4.

-Dicing Die Bonding Sheet The dicing die bonding sheet of the present invention is formed on a base material, a pressure-sensitive adhesive layer formed on the base material, an intermediate layer formed on the pressure-sensitive adhesive layer, and the intermediate layer. The intermediate layer is made of resin, and the interface of the intermediate layer on the side containing the film-like adhesive is peeled off, and the tensile elasticity of the intermediate layer is Is 3500 MPa or more.
The dicing die bonding sheet of the present invention is a semiconductor chip (present) provided with dicing using a dicing blade of a semiconductor wafer (hereinafter, may be referred to as “blade dicing”) followed by a film-like adhesive after cutting. In the specification, it is suitable for picking up a "semiconductor chip with a film-like adhesive").

In blade dicing, the dicing blade is rotated to cut a semiconductor wafer. At this time, the dicing blade cuts at least a part of the semiconductor wafer and the dicing die bonding sheet, so that cut pieces are generated. This cut piece is generated from either a layer of a semiconductor wafer or a dicing die bonding sheet, and is a floating substance such as a powder or a fibrous material, or is not completely separated from any of the above-mentioned layers. , It remains like a whiskers. If the amount of the cut pieces generated is large, a part of the cut pieces tends to adhere to the circuit forming surface or the side surface of the semiconductor chip and remain. If the cut pieces remain in this way, the semiconductor chip with the film-like adhesive may not be picked up normally, which causes a pickup failure. Further, even if it can be picked up, the semiconductor device manufactured with the cut pieces remaining may not function normally.

On the other hand, since the dicing die bonding sheet of the present invention is provided with the intermediate layer, it is possible to suppress the occurrence of poor pickup of the semiconductor chip with a film-like adhesive. Further, when the tensile elastic modulus of the intermediate layer is 3500 MPa or more, the amount of cut pieces generated during blade dicing can be reduced.
Hereinafter, first, each layer constituting the dicing die bonding sheet of the present invention will be described.

○ Base material The base material is preferably in the form of a sheet or a film, and the constituent material thereof is preferably various resins.
Specific examples of the resin include polyethylene (low density polyethylene (LDPE), linear low density polyethylene (LLDPE), high density polyethylene (HDPE, etc.)), polypropylene, polybutene, polybutadiene, polymethylpentene, and styrene. Ethylenebutylene / styrene block copolymer, polyvinyl chloride, vinyl chloride copolymer, polyethylene terephthalate, polybutylene terephthalate, polyurethane, polyurethane acrylate, polyimide, ethylene vinyl acetate copolymer, ionomer resin, ethylene / (meth) acrylic acid Copolymers, ethylene / (meth) acrylic acid ester copolymers, ethylene / (meth) acrylic acid copolymers and ethylene copolymers other than ethylene / (meth) acrylic acid ester copolymers, polystyrene, polycarbonate, fluorine Examples thereof include resins, water additives, modified products, cross-linked products or copolymers of any of these resins.

In addition, in this specification, "(meth) acrylic acid" is a concept including both "acrylic acid" and "methacrylic acid". The same applies to terms similar to (meth) acrylic acid, for example, "(meth) acrylate" is a concept that includes both "acrylate" and "methacrylate", and is a "(meth) acryloyl group". Is a concept that includes both an "acryloyl group" and a "methacryloyl group".

The resin constituting the base material may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected.

The base material may be composed of one layer (single layer) or may be composed of two or more layers. When the base material is composed of a plurality of layers, the plurality of layers may be the same or different from each other, and the combination of the plurality of layers is not particularly limited as long as the effects of the present invention are not impaired.
In the present specification, not only in the case of a base material, "a plurality of layers may be the same or different from each other" means "all layers may be the same or all layers are different". It means that only some of the layers may be the same, and further, "multiple layers are different from each other" means that "at least one of the constituent materials and thicknesses of each layer is different from each other". Means.

The thickness of the base material can be appropriately selected depending on the intended purpose, but is preferably 50 to 300 μm, more preferably 60 to 100 μm.
Here, the "thickness of the base material" means the thickness of the entire base material, and for example, the thickness of the base material composed of a plurality of layers means the total thickness of all the layers constituting the base material. means.

In order to improve the adhesion of the base material to other layers such as the pressure-sensitive adhesive layer provided on the base material, unevenness treatment by sandblasting treatment, solvent treatment, embossing treatment, etc., corona discharge treatment, electron beam irradiation, etc. The surface may be subjected to oxidation treatment such as treatment, plasma treatment, ozone / ultraviolet irradiation treatment, flame treatment, chromic acid treatment, and hot air treatment.
Further, the base material may have a surface surface that has been subjected to a primer treatment.
Further, the base material is a layer that prevents the base material from adhering to another sheet or the base material from adhering to the adsorption table when the antistatic coat layer and the dicing die bonding sheet are stacked and stored. It may have.
Among them, the base material subjected to the electron beam irradiation treatment is preferable in that the generation of cut pieces derived from the base material is suppressed in the dicing step described later.

In addition to the main constituent materials such as the resin, the base material contains various known additives such as fillers, colorants, antistatic agents, antioxidants, organic lubricants, catalysts, and softeners (plasticizers). You may.

The optical properties of the base material are not particularly limited as long as the effects of the present invention are not impaired, but the base material is preferably one that transmits laser light or energy rays.

The base material can be produced by a known method. For example, a base material containing a resin can be produced by molding a resin composition containing the resin.

○ Adhesive layer The adhesive layer is in the form of a sheet or a film and contains an adhesive.
Then, the pressure-sensitive adhesive layer can be formed by using a pressure-sensitive adhesive composition containing the pressure-sensitive adhesive. For example, the pressure-sensitive adhesive layer can be formed on a target portion by applying the pressure-sensitive adhesive composition to the surface to be formed of the pressure-sensitive adhesive layer and drying it if necessary. A more specific method for forming the pressure-sensitive adhesive layer will be described in detail later together with a method for forming the other layers.

The pressure-sensitive adhesive composition may be applied by a known method, for example, an air knife coater, a blade coater, a bar coater, a gravure coater, a roll coater, a roll knife coater, a curtain coater, a die coater, a knife coater, and a screen coater. , A method using various coaters such as a Meyer bar coater and a kiss coater.

The drying conditions of the pressure-sensitive adhesive composition are not particularly limited, but when the pressure-sensitive adhesive composition contains a solvent described later, it is preferable to heat-dry the pressure-sensitive adhesive composition. The solvent-containing pressure-sensitive adhesive composition is preferably dried at 70 to 130 ° C. for 10 seconds to 5 minutes, for example.

Examples of the pressure-sensitive adhesive include adhesive resins such as acrylic resin, urethane resin, rubber resin, silicone resin, epoxy resin, polyvinyl ether, polycarbonate, and ester resin, and acrylic resin is preferable. ..

In the present invention, the "adhesive resin" is a concept including both a resin having adhesiveness and a resin having adhesiveness. For example, not only the resin itself has adhesiveness but also the resin itself has adhesiveness. It also includes a resin that exhibits adhesiveness when used in combination with other components such as additives, and a resin that exhibits adhesiveness due to the presence of a trigger such as heat or water.

The pressure-sensitive adhesive layer may be either energy ray-curable or non-energy ray-curable. The energy ray-curable pressure-sensitive adhesive layer can easily adjust the physical properties before and after curing.

In the present invention, the "energy beam" means an electromagnetic wave or a charged particle beam having an energy quantum, and examples thereof include ultraviolet rays, radiation, and electron beams.
Ultraviolet rays can be irradiated by using, for example, a high-pressure mercury lamp, a fusion H lamp, a xenon lamp, a black light, an LED lamp, or the like as an ultraviolet source. The electron beam can be irradiated with an electron beam generated by an electron beam accelerator or the like.
In the present invention, "energy ray curable" means a property of being cured by irradiating with energy rays, and "non-energy ray curable" means a property of not being cured by irradiating with energy rays. ..

The pressure-sensitive adhesive layer may be composed of one layer (single layer), may be composed of two or more layers, and when composed of a plurality of layers, the plurality of layers may be the same or different from each other. The combination of multiple layers is not particularly limited.

The thickness of the pressure-sensitive adhesive layer is preferably 1 to 100 μm, more preferably 1 to 60 μm, and particularly preferably 1 to 30 μm.
Here, the "thickness of the pressure-sensitive adhesive layer" means the thickness of the entire pressure-sensitive adhesive layer, and for example, the thickness of the pressure-sensitive adhesive layer composed of a plurality of layers is the sum of all the layers constituting the pressure-sensitive adhesive layer. Means the thickness of.

The optical properties of the pressure-sensitive adhesive layer are not particularly limited as long as the effects of the present invention are not impaired. For example, the pressure-sensitive adhesive layer may be one that allows energy rays to pass through.

When the dicing die bonding sheet of the present invention is attached to a jig such as a ring frame for fixing a semiconductor wafer by its adhesive layer at the time of manufacturing a semiconductor chip, the adhesive layer and jig of the dicing die bonding sheet are used. The adhesive strength between the two is preferably 0.05 to 50 N / 25 mm, more preferably 0.1 to 40 N / 25 mm, and particularly preferably 0.2 to 30 N / 25 mm. When the adhesive force is at least the lower limit value, the dicing die bonding sheet can be more stably fixed to the jig in the process of manufacturing the semiconductor chip. When the adhesive strength is not more than the upper limit value, the used dicing die bonding sheet can be more easily peeled off from the jig.

The adhesive strength between the pressure-sensitive adhesive layer and the jig can be appropriately adjusted by, for example, adjusting the type and amount of the components contained in the pressure-sensitive adhesive layer, the thickness of the pressure-sensitive adhesive layer, and the like. For example, the adhesive strength can be easily adjusted by adjusting the type of the structural unit and the content ratio thereof in the adhesive resin described later, which is a component contained in the pressure-sensitive adhesive layer. Further, the adhesive force can be easily adjusted by adjusting the content of the adhesive resin and the cross-linking agent in the adhesive layer. However, these are only examples of the method for adjusting the adhesive strength.

Examples of the constituent material of the jig to which the dicing die bonding sheet of the present invention is attached include stainless steel (SUS), synthetic resin and the like.

The adhesive force (N / 25 mm) between the adhesive layer and the jig can be measured by the following method.
That is, first, in the dicing die bonding sheet of the present invention, a laminate in which each layer on the film-like adhesive side of the adhesive layer is removed, that is, a laminate from the base material to the adhesive layer, having a width of 25 mm. Make a test piece of any length.
Then, at room temperature (for example, 23 ° C.), the test piece is attached to the fixing base material by the pressure-sensitive adhesive layer. At this time, the entire surface of the pressure-sensitive adhesive layer of the test piece is attached to the fixing base material. Here, the "fixing base material" is made of the same constituent material as the jig such as a ring frame, and the surface to which the test piece of the fixing base material is attached is in the same state as the surface of the jig, and the fixing base is used. The material may be the jig itself.
Then, at room temperature (for example, 23 ° C.), the laminate from the base material to the pressure-sensitive adhesive layer is peeled off from the fixing base material. At this time, so-called 180 ° peeling is performed by peeling at a peeling speed of 300 mm / min so that the surfaces of the pressure-sensitive adhesive layer and the fixing base material that are in contact with each other form an angle of 180 °. The peeling force at this time is measured, and the measured value is defined as the adhesive force (N / 25 mm). The length of the test piece to be used for measurement is not particularly limited as long as the peeling force can be stably measured.

In addition, in this specification, "room temperature" means a temperature which is not particularly cooled or heated, that is, a normal temperature, and examples thereof include a temperature of 15 to 25 ° C.

○ Intermediate layer The intermediate layer is in the form of a sheet or a film.
The intermediate layer is made of resin.
The surface (interface) of the intermediate layer on the side of the intermediate layer provided with the film-like adhesive is peeled off. That is, the intermediate layer includes the resin main body (resin layer), and further has a peeling treatment layer on one surface of the main body, and is composed of a plurality of layers.

In the present specification, not only in the case of the intermediate layer, but also in the case of the intermediate layer, "the surface is peeled off" means that the layer in contact with the target surface is applied with a force when necessary. It means that this surface is treated so that it can be easily peeled off from the surface. The "peeling-treated surface" means a surface of the target layer (film, sheet) that has been subjected to such peeling treatment.

Of the intermediate layers, the resin layer can be produced by molding a resin composition containing the resin.
The intermediate layer can be produced by peeling off one surface of the resin layer.

The peeling treatment of the surface (interface) of the intermediate layer can be performed by using various known stripping agents such as alkyd-based, silicone-based, fluorine-based, unsaturated polyester-based, polyolefin-based or wax-based. it can.
The release agent is preferably an alkyd-based, silicone-based or fluorine-based release agent in terms of having heat resistance.

The resin that is the constituent material of the intermediate layer is not particularly limited as long as the tensile elastic modulus of the intermediate layer is 3500 MPa or more. Preferred such resins include, for example, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT), polyethylene (PE), polypropylene (PP) and the like.

Of the intermediate layers, the resin layer to be the main body other than the peeling treatment layer may be composed of one layer (single layer), may be composed of two or more layers, or may be composed of a plurality of layers. The plurality of layers may be the same as or different from each other, and the combination of the plurality of layers is not particularly limited.

In the intermediate layer in which the resin layer is composed of a plurality of layers, the interface on the film-like adhesive side (the outermost interface on the film-like adhesive side) is in the outermost resin layer on the side provided with the film-like adhesive. It suffices if it has been peeled off.

The thickness of the intermediate layer is preferably 10 to 200 μm, more preferably 15 to 150 μm, particularly preferably 25 to 120 μm, for example, 25 to 100 μm, 25 to 80 μm, 25 to 60 μm, and It may be any of 25 to 50 μm and the like. When the thickness of the intermediate layer is at least the above lower limit value, the handling of the intermediate layer becomes better, and the effect of suppressing damage such as cutting of the intermediate layer becomes higher. When the thickness of the intermediate layer is not more than the above upper limit value, when picking up the semiconductor chip with the film-like adhesive, the pushing force is easily transmitted to the semiconductor chip with the film-like adhesive, and the pickup can be performed more easily. it can.
Here, the "thickness of the intermediate layer" means the thickness of the entire intermediate layer, and means the total thickness of all the layers constituting the intermediate layer. For example, of the resin layer and the peeling treatment layer. Means total thickness.

The tensile elastic modulus (Young's modulus) of the intermediate layer is 3500 MPa or more, preferably 3500 to 10000 MPa, more preferably 3800 to 8000 MPa, further preferably 420 to 7500 MPa, and 4500 to 7000 MPa. It is particularly preferable to have. When the tensile elastic modulus of the intermediate layer is at least the above lower limit value, a remarkable effect of reducing the amount of cut pieces derived from the intermediate layer can be obtained during blade dicing. When the tensile elastic modulus of the intermediate layer is not more than the upper limit value, the intermediate layer is more stably attached to a layer adjacent to the intermediate layer, such as a pressure-sensitive adhesive layer or a film-like adhesive.

The tensile elastic modulus of the intermediate layer can be measured according to JIS K 7161: 1994 (ISO 5271: 1993).

From the viewpoint that the effect of the present invention becomes more remarkable, the indentation hardness of the intermediate layer is preferably 1.6 to 5 GPa, more preferably 2 to 4.5 GPa, and 2.5 to 4 GPa. Is particularly preferred.

The indentation hardness of the intermediate layer can be measured according to JIS Z 2255: 2003.

The tensile elastic modulus and the indentation hardness of the intermediate layer can be appropriately adjusted by, for example, adjusting the constituent materials of the intermediate layer, that is, the type and amount of the components contained in the intermediate layer.

In the dicing die bonding sheet of the present invention, the adhesive force between the pressure-sensitive adhesive layer and the intermediate layer is preferably 0.3 N / 25 mm or more, more preferably 0.5 N / 25 mm or more, and 1 N / It is more preferably 25 mm or more, and may be, for example, 2N / 25 mm or more, 3N / 25 mm or more, 4N / 25 mm or more, 5N / 25 mm or more, 6N / 25 mm or more, 7N / 25 mm or more, or the like. .. When the adhesive strength is at least the lower limit value, high adhesion between the pressure-sensitive adhesive layer and the intermediate layer can be maintained in the process of manufacturing the semiconductor chip.

The upper limit of the adhesive strength is not particularly limited as long as the effect of the present invention is not impaired. The adhesive strength is preferably 100 N / 25 mm or less, for example.

In addition, in this specification, "adhesive force between the pressure-sensitive adhesive layer and the intermediate layer" means that when the pressure-sensitive adhesive layer has curability, it is intermediate with the pressure-sensitive adhesive layer before curing unless otherwise specified. It means the adhesive force between the layers.

The adhesive strength between the pressure-sensitive adhesive layer and the intermediate layer can be appropriately set so as to be in a numerical range in which any of the above-mentioned lower limit values and upper limit values are combined.
For example, the adhesive force between the pressure-sensitive adhesive layer and the intermediate layer is preferably 0.3 to 100 N / 25 mm, more preferably 0.5 to 100 N / 25 mm, still more preferably 1 to 100 N / 25 mm, for example. It may be any one of 2 to 100 N / 25 mm, 3 to 100 N / 25 mm, 4 to 100 N / 25 mm, 5 to 100 N / 25 mm, 6 to 100 N / 25 mm, 7 to 100 N / 25 mm and the like. However, these are examples of the adhesive strength.

The adhesive strength between the pressure-sensitive adhesive layer and the intermediate layer is, for example, the type and amount of components contained in the pressure-sensitive adhesive layer, the thickness of the pressure-sensitive adhesive layer, the constituent materials of the intermediate layer, and the contact surface of the intermediate layer with the pressure-sensitive adhesive layer. It can be adjusted as appropriate by adjusting the surface condition of the above. For example, the adhesive strength can be easily adjusted by adjusting the type of the structural unit and the content ratio thereof in the adhesive resin described later, which is a component contained in the pressure-sensitive adhesive layer. Further, the adhesive force can be easily adjusted by adjusting the content of the adhesive resin and the cross-linking agent in the adhesive layer. However, these are only examples of the method for adjusting the adhesive strength.

The adhesive strength (N / 25 mm) between the pressure-sensitive adhesive layer and the intermediate layer can be measured by the following method.
That is, first, the dicing die bonding sheet having a width of 25 mm and an arbitrary length is produced.
Next, at room temperature (for example, 23 ° C.), the dicing die bonding sheet is attached to the fixing base material with a film-like adhesive. Here, the "fixing base material" may be any shape as long as it can firmly fix the film-like adhesive of the dicing die bonding sheet, and the shape may be a sheet shape or any other shape. Often, for example, an adhesive base material having an adhesive surface as a fixing surface of a film-like adhesive (in other words, a dicing die bonding sheet) can be mentioned.
Then, at room temperature (for example, 23 ° C.), the laminate from the base material to the pressure-sensitive adhesive layer is peeled off from the intermediate layer. At this time, so-called 180 ° peeling is performed by peeling at a peeling speed of 300 mm / min so that the surfaces of the intermediate layer and the pressure-sensitive adhesive layer that are in contact with each other form an angle of 180 °. The peeling force at this time is measured, and the measured value is defined as the adhesive force (N / 25 mm). The length of the dicing die bonding sheet used for the measurement is not particularly limited as long as the peeling force can be stably measured.

An example of a preferable dicing die bonding sheet of the present invention is one that satisfies both the above-mentioned tensile elastic modulus of the intermediate layer and the adhesive force between the above-mentioned pressure-sensitive adhesive layer and the above-mentioned intermediate layer.
That is, as an example of the dicing die bonding sheet, preferably, the tensile elastic modulus of the intermediate layer is 3500 MPa or more, and the adhesive force between the pressure-sensitive adhesive layer and the intermediate layer is 0.3 N / 25 mm or more. More preferably, the tensile elastic modulus of the intermediate layer is 3500 to 10000 MPa, and the adhesive force between the pressure-sensitive adhesive layer and the intermediate layer is 0.3 N / 25 mm or more, which is even more preferable. The tensile elastic modulus of the intermediate layer is 3800 to 8000 MPa, and the adhesive force between the pressure-sensitive adhesive layer and the intermediate layer is 0.5 N / 25 mm or more, and the tension of the intermediate layer is particularly preferable. Examples thereof include those having an elastic modulus of 420 to 7500 MPa and an adhesive force between the pressure-sensitive adhesive layer and the intermediate layer of 1 N / 25 mm or more. For example, the tensile elastic modulus of the intermediate layer is 4000 to 7000 MPa and The adhesive strength between the pressure-sensitive adhesive layer and the intermediate layer is one of 2N / 25 mm or more, 3N / 25 mm or more, 4N / 25 mm or more, 5N / 25 mm or more, 6N / 25 mm or more, and 7N / 25 mm or more. Can also be mentioned.
However, these are examples of the dicing die bonding sheet, and the combination of the numerical range of the tensile elastic modulus of the intermediate layer and the adhesive force between the pressure-sensitive adhesive layer and the intermediate layer in the dicing die bonding sheet is , Not limited to the above.

○ Film-shaped adhesive The film-shaped adhesive is not particularly limited as long as the effects of the present invention are not impaired, and known ones can be appropriately used.
The film-like adhesive can be formed by using an adhesive composition containing the constituent material. For example, the film-like adhesive can be formed on a target portion by applying the adhesive composition to the surface to be formed of the film-like adhesive and drying it if necessary. A more specific method for forming the film-like adhesive will be described in detail later together with a method for forming other layers. The ratio of the contents of the components that do not vaporize at room temperature in the adhesive composition is usually the same as the ratio of the contents of the components in the film-like adhesive.

The coating of the adhesive composition can be carried out in the same manner as in the case of coating the adhesive composition described above.

The drying conditions of the adhesive composition are not particularly limited, but when the adhesive composition contains a solvent described later, it is preferable to heat-dry the adhesive composition. The solvent-containing adhesive composition is preferably dried, for example, at 70 to 130 ° C. for 10 seconds to 5 minutes.

The film-like adhesive has curability, preferably thermosetting, and preferably pressure-sensitive adhesive. The film-like adhesive having both thermosetting property and pressure-sensitive adhesive property can be attached by lightly pressing against various adherends in an uncured state. Further, the film-like adhesive may be one that can be attached to various adherends by heating and softening. The film-like adhesive eventually becomes a cured product having high impact resistance by curing, and this cured product can maintain sufficient adhesive properties even under severe high temperature and high humidity conditions.

The film-like adhesive may be composed of one layer (single layer), may be composed of two or more layers, and when composed of a plurality of layers, the plurality of layers may be the same or different from each other. The combination of these multiple layers is not particularly limited.

The thickness of the film-like adhesive is not particularly limited, but is preferably 1 to 50 μm, more preferably 3 to 40 μm, and is, for example, 5 to 30 μm, 10 to 25 μm, or the like. May be good. When the thickness of the film-like adhesive is at least the above lower limit value, the adhesive force of the film-like adhesive to the adherend (semiconductor wafer, semiconductor chip) becomes higher. When the thickness of the film-like adhesive is not more than the above upper limit value, the film-like adhesive can be cut more easily in the dicing step described later, and the amount of cut pieces generated from the film-like adhesive can be increased. Can be reduced.
Here, the "thickness of the film-like adhesive" means the thickness of the entire film-like adhesive, and for example, the thickness of the film-like adhesive composed of a plurality of layers is all that constitute the film-like adhesive. Means the total thickness of the layers of.

In the dicing die bonding sheet of the present invention, the adhesive force between the intermediate layer and the film-like adhesive is preferably 0.01 to 2 N / 25 mm, more preferably 0.02 to 1.5 N / 25 mm. It is preferably 0.03 to 1 N / 25 mm, and may be, for example, 0.03 to 0.5 N / 25 mm. When the adhesive force is at least the lower limit value, it is possible to maintain an appropriate high degree of adhesion between the intermediate layer and the film-like adhesive in the process of manufacturing the semiconductor chip. When the adhesive force is not more than the upper limit value, the semiconductor chip with a film-like adhesive can be picked up more easily.

In the present specification, the "adhesive force between the intermediate layer and the film-like adhesive" means the adhesive force between the film-like adhesive and the intermediate layer before curing unless otherwise specified. ..

The adhesive strength between the intermediate layer and the film-like adhesive is, for example, the type and amount of components contained in the film-like adhesive, the thickness of the film-like adhesive, the constituent materials of the intermediate layer, and the film-like adhesive of the intermediate layer. It can be adjusted as appropriate by adjusting the surface condition of the contact surface (interface) with. For example, the molecular weight of the polymer component (a), which will be described later, which is a component contained in the film-like adhesive, the type and content ratio of the constituent units in the polymer component (a), and the epoxy-based thermosetting resin (b) are configured. The adhesive strength can be easily adjusted by adjusting the softening point of the components to be softened, the content of each component contained in the film-like adhesive, and the like. However, these adjustment methods are only an example.

The adhesive force (N / 25 mm) between the intermediate layer and the film-like adhesive can be measured by the following method.
That is, first, the dicing die bonding sheet having a width of 25 mm and an arbitrary length is produced.
Next, at room temperature (for example, 23 ° C.), the dicing die bonding sheet is attached to the fixing base material with a film-like adhesive. Here, the "fixing base material" is the same as the fixing base material used when measuring the adhesive force between the adhesive layer and the intermediate layer described above.
Then, at room temperature (for example, 23 ° C.), the laminate from the base material to the intermediate layer is peeled off from the film-like adhesive. At this time, so-called 180 ° peeling is performed by peeling at a peeling speed of 300 mm / min so that the surfaces (interfaces) of the intermediate layer and the film-like adhesive that are in contact with each other form an angle of 180 °. The peeling force at this time is measured, and the measured value is defined as the adhesive force (N / 25 mm). The length of the dicing die bonding sheet used for the measurement is not particularly limited as long as the peeling force can be stably measured.

As an example of a preferable dicing die bonding sheet of the present invention, the tensile elastic modulus of the above-mentioned intermediate layer, the indentation hardness of the above-mentioned intermediate layer, the adhesive force between the above-mentioned pressure-sensitive adhesive layer and the above-mentioned intermediate layer, and the above-mentioned Those that satisfy all the conditions of the adhesive force between the intermediate layer and the film-like adhesive can be mentioned.
That is, as an example of the preferable dicing die bonding sheet, the tensile elastic modulus of the intermediate layer is 3500 MPa or more, the indentation hardness of the intermediate layer is 1.6 to 5 GPa, and the pressure-sensitive adhesive layer and the intermediate layer are used. Examples thereof include those having an adhesive force of 0.3 N / 25 mm or more and an adhesive force between the intermediate layer and the film-like adhesive of 0.01 to 2 N / 25 mm. Then, in the dicing die bonding sheet that satisfies the condition of such a combination of physical characteristic values, one or more of these physical characteristic values have a more limited numerical range as described above. It may be either.

Next, the dicing die bonding sheet of the present invention will be described in more detail with reference to the drawings. In addition, in the figure used in the following description, in order to make it easy to understand the features of the present invention, the main part may be enlarged and shown, and the dimensional ratio of each component is the same as the actual one. Is not always the case.

FIG. 1 is a cross-sectional view schematically showing an embodiment of a dicing die bonding sheet of the present invention.
The dicing die bonding sheet 101 shown here includes a base material 11, a pressure-sensitive adhesive layer 12 on the base material 11, an intermediate layer 13 on the pressure-sensitive adhesive layer 12, and a film-like adhesive 14 on the intermediate layer 13. It has. The dicing die bonding sheet 101 further includes a release film 15 on the film-like adhesive 14.

In the dicing die bonding sheet 101, the pressure-sensitive adhesive layer 12 is laminated on one surface (hereinafter, may be referred to as “first surface”) 11a of the base material 11, and the base material 11 of the pressure-sensitive adhesive layer 12 is provided. What is the side on which the intermediate layer 13 is laminated and the adhesive layer 12 of the intermediate layer 13 is provided on the surface (hereinafter, may be referred to as "first surface") 12a opposite to the side on which the film is formed. The film-like adhesive 14 is laminated on the opposite surface (hereinafter, may be referred to as "first surface") 13a, and the side opposite to the side on which the intermediate layer 13 of the film-like adhesive 14 is provided. The release film 15 is laminated on the surface (hereinafter, may be referred to as “first surface”) 14a. As described above, the dicing die bonding sheet 101 is composed of the base material 11, the pressure-sensitive adhesive layer 12, the intermediate layer 13, and the film-like adhesive 14 laminated in this order in the thickness direction thereof.

In the present specification, a laminate containing a base material and a pressure-sensitive adhesive layer and not containing an intermediate layer and a film-like adhesive may be referred to as a "support sheet". In FIG. 1, a support sheet is indicated by reference numeral 1.

In the dicing die bonding sheet 101, the intermediate layer 13 is made of resin, and the first surface 13a thereof is peeled off. In the dicing die bonding sheet 101, the first surface 13a of the intermediate layer 13 is an interface on the side of the intermediate layer 13 provided with the film-like adhesive 14 (in other words, a contact surface with the film-like adhesive 14 or a film. The interface with the adhesive 14).
The tensile elastic modulus of the intermediate layer 13 is 3500 MPa or more.

The dicing die bonding sheet 101 may further include a jig adhesive layer in a part of the first surface 14a of the film-like adhesive 14, that is, in a region near the peripheral edge portion (not shown). Here, the "jig adhesive layer" is used to attach the dicing die bonding sheet 101 to a jig such as a ring frame for fixing a semiconductor wafer when dicing a semiconductor wafer. The adhesive layer for jigs may be a known one, for example, a single-layer structure containing an adhesive component, or layers containing an adhesive component on both sides of a sheet serving as a core material. It may have a laminated multi-layer structure.

In the dicing die bonding sheet 101 shown in FIG. 1, in a state where the release film 15 is removed, the first surface 14a of the film-like adhesive 14 is the surface on which the circuit of the semiconductor wafer (not shown) is formed (the present specification). It is used by being affixed to the surface opposite to the "circuit forming surface" (which may be abbreviated as "circuit forming surface" in this specification) (which may be abbreviated as "back surface" in this specification).

The dicing die bonding sheet of the present invention is not limited to the one shown in FIG. 1, and a part of the structure shown in FIG. 1 has been changed, deleted or added within the range not impairing the effect of the present invention. There may be.
For example, the dicing die bonding sheet of the present invention may include other layers other than the base material, the pressure-sensitive adhesive layer, the intermediate layer, the film-like adhesive, the release film, and the adhesive layer for jigs. However, as shown in FIG. 1, the dicing die bonding sheet of the present invention is provided with an adhesive layer in direct contact with the base material and an intermediate layer in direct contact with the adhesive layer, and is a film-like adhesive. Is preferably provided in direct contact with the intermediate layer.

The structure of the dicing die bonding sheet of the present invention can be simplified, for example, the adhesive layer for jigs is not an essential configuration. Then, by using such a dicing die bonding sheet, the manufacturing process of the semiconductor chip can be simplified. Therefore, by using the dicing die bonding sheet of the present invention, the semiconductor chip can be supplied at low cost.

Next, the constituent materials of the pressure-sensitive adhesive layer and the film-like adhesive in the dicing die bonding sheet of the present invention will be described.

<< Adhesive composition >>
When the pressure-sensitive adhesive layer is energy ray-curable, the pressure-sensitive adhesive composition containing the energy ray-curable pressure-sensitive adhesive, that is, the energy ray-curable pressure-sensitive adhesive composition, for example, is a non-energy ray-curable pressure-sensitive adhesive. Adhesive composition (I-1) containing a resin (I-1a) (hereinafter, may be abbreviated as "adhesive resin (I-1a)") and an energy ray-curable compound; non-energy An energy ray-curable adhesive resin (I-2a) in which an unsaturated group is introduced into the side chain of the linear curable adhesive resin (I-1a) (hereinafter referred to as "adhesive resin (I-2a)"). A pressure-sensitive adhesive composition (I-2) containing (may be abbreviated); a pressure-sensitive adhesive composition (I-3) containing the pressure-sensitive resin (I-2a) and an energy ray-curable compound, etc. Can be mentioned.

<Adhesive composition (I-1)>
As described above, the pressure-sensitive adhesive composition (I-1) contains a non-energy ray-curable pressure-sensitive adhesive resin (I-1a) and an energy ray-curable compound.

[Adhesive resin (I-1a)]
The adhesive resin (I-1a) is preferably an acrylic resin.
Examples of the acrylic resin include an acrylic polymer having a structural unit derived from at least a (meth) acrylic acid alkyl ester.
The constituent unit of the acrylic resin may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected.

Examples of the (meth) acrylic acid alkyl ester include those in which the alkyl group constituting the alkyl ester has 1 to 20 carbon atoms, and the alkyl group is linear or branched. Is preferable.
More specifically, as the (meth) acrylic acid alkyl ester, methyl (meth) acrylic acid, ethyl (meth) acrylic acid, n-propyl (meth) acrylic acid, isopropyl (meth) acrylic acid, (meth) acrylic acid. n-butyl, isobutyl (meth) acrylate, sec-butyl (meth) acrylate, tert-butyl (meth) acrylate, pentyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, 2-Ethylhexyl (meth) acrylate, isooctyl (meth) acrylate, n-octyl (meth) acrylate, n-nonyl (meth) acrylate, isononyl (meth) acrylate, decyl (meth) acrylate, (meth) ) Undecyl acrylate, dodecyl (meth) acrylate (lauryl acrylate (meth), tridecyl (meth) acrylate, tetradecyl (meth) acrylate (myristyl (meth) acrylate), pentadecyl (meth) acrylate, ( Hexadecyl acrylate ((meth) palmityl acrylate), heptadecyl (meth) acrylate, octadecyl (meth) acrylate (stearyl acrylate), nonadecil (meth) acrylate, icosyl (meth) acrylate, etc. Can be mentioned.

From the viewpoint of improving the adhesive strength of the pressure-sensitive adhesive layer, the acrylic polymer preferably has a structural unit derived from a (meth) acrylic acid alkyl ester having 4 or more carbon atoms in the alkyl group. The alkyl group preferably has 4 to 12 carbon atoms, and more preferably 4 to 8 carbon atoms, from the viewpoint of further improving the adhesive force of the pressure-sensitive adhesive layer. The (meth) acrylic acid alkyl ester having 4 or more carbon atoms in the alkyl group is preferably an acrylic acid alkyl ester.

The acrylic polymer preferably has a structural unit derived from a functional group-containing monomer in addition to the structural unit derived from the (meth) acrylic acid alkyl ester.
As the functional group-containing monomer, for example, the functional group may be a starting point of cross-linking by reacting with a cross-linking agent described later, or the functional group may react with an unsaturated group in an unsaturated group-containing compound described later. Then, there is one that enables the introduction of an unsaturated group into the side chain of the acrylic polymer.

Examples of the functional group in the functional group-containing monomer include a hydroxyl group, a carboxy group, an amino group, an epoxy group and the like.
That is, examples of the functional group-containing monomer include a hydroxyl group-containing monomer, a carboxy group-containing monomer, an amino group-containing monomer, and an epoxy group-containing monomer.

Examples of the hydroxyl group-containing monomer include hydroxymethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, and (meth). Hydroxyalkyl (meth) acrylates such as 2-hydroxybutyl acrylate, 3-hydroxybutyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate; non- (meth) acrylics such as vinyl alcohol and allyl alcohol. Saturated alcohol (unsaturated alcohol having no (meth) acrylic skeleton) and the like can be mentioned.

Examples of the carboxy group-containing monomer include ethylenically unsaturated monocarboxylic acids (monocarboxylic acids having ethylenically unsaturated bonds) such as (meth) acrylic acid and crotonic acid; fumaric acid, itaconic acid, maleic acid, and citracon. Ethylene unsaturated dicarboxylic acids such as acids (dicarboxylic acids having ethylenically unsaturated bonds); anhydrides of the ethylenically unsaturated dicarboxylic acids; (meth) acrylic acid carboxyalkyl esters such as 2-carboxyethyl methacrylate and the like. Be done.

As the functional group-containing monomer, a hydroxyl group-containing monomer and a carboxy group-containing monomer are preferable, and a hydroxyl group-containing monomer is more preferable.

The functional group-containing monomer constituting the acrylic polymer may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected.

In the acrylic polymer, the content of the structural unit derived from the functional group-containing monomer is preferably 1 to 35% by mass, more preferably 2 to 32% by mass, based on the total amount of the structural units. It is particularly preferably 3 to 30% by mass.

The acrylic polymer may further have a structural unit derived from another monomer in addition to the structural unit derived from the (meth) acrylic acid alkyl ester and the structural unit derived from the functional group-containing monomer.
The other monomer is not particularly limited as long as it can be copolymerized with a (meth) acrylic acid alkyl ester or the like.
Examples of the other monomer include styrene, α-methylstyrene, vinyltoluene, vinyl formate, vinyl acetate, acrylonitrile, acrylamide and the like.

The other monomer constituting the acrylic polymer may be only one kind, may be two or more kinds, and when there are two or more kinds, the combination and ratio thereof can be arbitrarily selected.

The acrylic polymer can be used as the above-mentioned non-energy ray-curable adhesive resin (I-1a).
On the other hand, a product obtained by reacting a functional group in the acrylic polymer with an unsaturated group-containing compound having an energy ray-polymerizable unsaturated group (energy ray-polymerizable group) has the above-mentioned energy ray-curable adhesiveness. It can be used as a resin (I-2a).

The pressure-sensitive adhesive resin (I-1a) contained in the pressure-sensitive adhesive composition (I-1) may be of only one type, may be of two or more types, and when there are two or more types, the combination and ratio thereof may be arbitrary. You can choose.

In the pressure-sensitive adhesive composition (I-1), the content of the pressure-sensitive resin (I-1a) is preferably 5 to 99% by mass, more preferably 10 to 95% by mass, and 15 to 90% by mass. It is particularly preferably mass%.

[Energy ray curable compound]
Examples of the energy ray-curable compound contained in the pressure-sensitive adhesive composition (I-1) include monomers or oligomers having an energy ray-polymerizable unsaturated group and curable by irradiation with energy rays.
Among the energy ray-curable compounds, examples of the monomer include trimethylpropantri (meth) acrylate, pentaerythritol (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, 1,4. Polyvalent (meth) acrylates such as −butylene glycol di (meth) acrylate, 1,6-hexanediol (meth) acrylate; urethane (meth) acrylate; polyester (meth) acrylate; polyether (meth) acrylate; epoxy ( Meta) Acrylate and the like can be mentioned.
Among the energy ray-curable compounds, examples of the oligomer include an oligomer obtained by polymerizing the monomers exemplified above.
The energy ray-curable compound has a relatively large molecular weight, and urethane (meth) acrylate and urethane (meth) acrylate oligomer are preferable in that the storage elastic modulus of the pressure-sensitive adhesive layer is unlikely to be lowered.

The energy ray-curable compound contained in the pressure-sensitive adhesive composition (I-1) may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected. ..

In the pressure-sensitive adhesive composition (I-1), the content of the energy ray-curable compound is preferably 1 to 95% by mass, more preferably 5 to 90% by mass, and 10 to 85% by mass. % Is particularly preferable.

[Crosslinking agent]
When the acrylic polymer having a structural unit derived from a functional group-containing monomer in addition to the structural unit derived from the (meth) acrylic acid alkyl ester is used as the adhesive resin (I-1a), the pressure-sensitive adhesive composition ( I-1) preferably further contains a cross-linking agent.

The cross-linking agent reacts with the functional group, for example, to cross-link the adhesive resins (I-1a) with each other.
Examples of the cross-linking agent include isocyanate-based cross-linking agents such as tolylene diisocyanate, hexamethylene diisocyanate, xylylene diisocyanate, and adducts of these diisocyanates (cross-linking agents having an isocyanate group); and epoxy-based cross-linking agents such as ethylene glycol glycidyl ether (cross-linking agents). Cross-linking agent having a glycidyl group); Isocyanate-based cross-linking agent such as hexa [1- (2-methyl) -aziridinyl] triphosphatriazine (cross-linking agent having an aziridinyl group); Metal chelate-based cross-linking agent such as aluminum chelate (metal) Crosslinking agent having a chelate structure); Isocyanurate-based crosslinking agent (crosslinking agent having an isocyanurate skeleton) and the like can be mentioned.
The cross-linking agent is preferably an isocyanate-based cross-linking agent from the viewpoints of improving the cohesive force of the pressure-sensitive adhesive to improve the adhesive force of the pressure-sensitive adhesive layer and being easily available.

The cross-linking agent contained in the pressure-sensitive adhesive composition (I-1) may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected.

In the pressure-sensitive adhesive composition (I-1), the content of the cross-linking agent is preferably 0.01 to 50 parts by mass with respect to 100 parts by mass of the content of the pressure-sensitive adhesive resin (I-1a). It is more preferably 0.1 to 20 parts by mass, and particularly preferably 0.3 to 15 parts by mass.

[Photopolymerization initiator]
The pressure-sensitive adhesive composition (I-1) may further contain a photopolymerization initiator. The pressure-sensitive adhesive composition (I-1) containing a photopolymerization initiator sufficiently undergoes a curing reaction even when irradiated with relatively low-energy energy rays such as ultraviolet rays.

Examples of the photopolymerization initiator include benzoin compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, methyl benzoin benzoate, and benzoin dimethyl ketal; acetophenone and 2-hydroxy. Acetphenone compounds such as -2-methyl-1-phenyl-propane-1-one, 2,2-dimethoxy-1,2-diphenylethane-1-one; bis (2,4,6-trimethylbenzoyl) phenylphosphine Acylphosphine oxide compounds such as oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide; sulfide compounds such as benzylphenyl sulfide and tetramethylthium monosulfide; α-ketol compounds such as 1-hydroxycyclohexylphenylketone; azo Azo compounds such as bisisobutyronitrile; titanocene compounds such as titanosen; thioxanthone compounds such as thioxanthone; peroxide compounds; diketone compounds such as diacetyl; benzyl; dibenzyl; benzophenone; 2,4-diethylthioxanthone; 1,2-diphenylmethane 2-Hydroxy-2-methyl-1- [4- (1-methylvinyl) phenyl] propanone; 2-chloroanthraquinone and the like.
Further, as the photopolymerization initiator, for example, a quinone compound such as 1-chloroanthraquinone; a photosensitizer such as amine can also be used.

The photopolymerization initiator contained in the pressure-sensitive adhesive composition (I-1) may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected.

In the pressure-sensitive adhesive composition (I-1), the content of the photopolymerization initiator is preferably 0.01 to 20 parts by mass with respect to 100 parts by mass of the content of the energy ray-curable compound, and is 0. It is more preferably .03 to 10 parts by mass, and particularly preferably 0.05 to 5 parts by mass.

[Other additives]
The pressure-sensitive adhesive composition (I-1) may contain other additives that do not fall under any of the above-mentioned components as long as the effects of the present invention are not impaired.
Examples of the other additives include antioxidants, antioxidants, softeners (plasticizers), fillers (fillers), rust inhibitors, colorants (pigments, dyes), sensitizers, and tackifiers. , Known additives such as reaction retarders and cross-linking accelerators (catalysts).
The reaction retarder means, for example, that an unintended cross-linking reaction occurs in the pressure-sensitive adhesive composition (I-1) during storage due to the action of a catalyst mixed in the pressure-sensitive adhesive composition (I-1). It suppresses the progress. Examples of the reaction retarder include those that form a chelate complex by chelating to a catalyst, and more specifically, those having two or more carbonyl groups (-C (= O)-) in one molecule. Can be mentioned.

The other additives contained in the pressure-sensitive adhesive composition (I-1) may be only one type, may be two or more types, and when there are two or more types, their combinations and ratios can be arbitrarily selected.

The content of the other additives in the pressure-sensitive adhesive composition (I-1) is not particularly limited, and may be appropriately selected depending on the type thereof.

[solvent]
The pressure-sensitive adhesive composition (I-1) may contain a solvent. Since the pressure-sensitive adhesive composition (I-1) contains a solvent, the suitability for coating on the surface to be coated is improved.

The solvent is preferably an organic solvent, and examples of the organic solvent include ketones such as methyl ethyl ketone and acetone; esters such as ethyl acetate (carboxylic acid esters); ethers such as tetrahydrofuran and dioxane; cyclohexane, n-hexane and the like. Lipid hydrocarbons; aromatic hydrocarbons such as toluene and xylene; alcohols such as 1-propanol and 2-propanol.

As the solvent, for example, the solvent used in the production of the pressure-sensitive adhesive resin (I-1a) may be used as it is in the pressure-sensitive adhesive composition (I-1) without being removed from the pressure-sensitive adhesive resin (I-1a). However, the same or different type of solvent as that used in the production of the pressure-sensitive adhesive resin (I-1a) may be added separately during the production of the pressure-sensitive adhesive composition (I-1).

The solvent contained in the pressure-sensitive adhesive composition (I-1) may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected.

In the pressure-sensitive adhesive composition (I-1), the content of the solvent is not particularly limited and may be appropriately adjusted.

<Adhesive composition (I-2)>
As described above, the pressure-sensitive adhesive composition (I-2) is an energy ray-curable pressure-sensitive adhesive resin in which an unsaturated group is introduced into the side chain of the non-energy ray-curable pressure-sensitive adhesive resin (I-1a). (I-2a) is contained.

[Adhesive resin (I-2a)]
The adhesive resin (I-2a) can be obtained, for example, by reacting a functional group in the adhesive resin (I-1a) with an unsaturated group-containing compound having an energy ray-polymerizable unsaturated group.

The unsaturated group-containing compound can be bonded to the adhesive resin (I-1a) by further reacting with a functional group in the adhesive resin (I-1a) in addition to the energy ray-polymerizable unsaturated group. It is a compound having a group.
Examples of the energy ray-polymerizable unsaturated group include (meth) acryloyl group, vinyl group (ethenyl group), allyl group (2-propenyl group) and the like, and (meth) acryloyl group is preferable.
Examples of the group that can be bonded to the functional group in the adhesive resin (I-1a) include an isocyanate group and a glycidyl group that can be bonded to a hydroxyl group or an amino group, and a hydroxyl group and an amino group that can be bonded to a carboxy group or an epoxy group. And so on.

Examples of the unsaturated group-containing compound include (meth) acryloyloxyethyl isocyanate, (meth) acryloyl isocyanate, and glycidyl (meth) acrylate.

The pressure-sensitive adhesive resin (I-2a) contained in the pressure-sensitive adhesive composition (I-2) may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof may be arbitrary. You can choose.

In the pressure-sensitive adhesive composition (I-2), the content of the pressure-sensitive resin (I-2a) is preferably 5 to 99% by mass, more preferably 10 to 95% by mass, and 10 to 90% by mass. It is particularly preferably mass%.

[Crosslinking agent]
When the acrylic polymer having a structural unit derived from a functional group-containing monomer similar to that in the adhesive resin (I-1a) is used as the adhesive resin (I-2a), for example, the pressure-sensitive adhesive composition ( I-2) may further contain a cross-linking agent.

Examples of the cross-linking agent in the pressure-sensitive adhesive composition (I-2) include the same cross-linking agents as those in the pressure-sensitive adhesive composition (I-1).
The cross-linking agent contained in the pressure-sensitive adhesive composition (I-2) may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected.

In the pressure-sensitive adhesive composition (I-2), the content of the cross-linking agent is preferably 0.01 to 50 parts by mass with respect to 100 parts by mass of the content of the pressure-sensitive adhesive resin (I-2a). It is more preferably 0.1 to 20 parts by mass, and particularly preferably 0.3 to 15 parts by mass.

[Photopolymerization initiator]
The pressure-sensitive adhesive composition (I-2) may further contain a photopolymerization initiator. The pressure-sensitive adhesive composition (I-2) containing a photopolymerization initiator sufficiently undergoes a curing reaction even when irradiated with relatively low-energy energy rays such as ultraviolet rays.

Examples of the photopolymerization initiator in the pressure-sensitive adhesive composition (I-2) include the same photopolymerization initiators in the pressure-sensitive adhesive composition (I-1).
The photopolymerization initiator contained in the pressure-sensitive adhesive composition (I-2) may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected.

In the pressure-sensitive adhesive composition (I-2), the content of the photopolymerization initiator is preferably 0.01 to 20 parts by mass with respect to 100 parts by mass of the content of the pressure-sensitive adhesive resin (I-2a). , 0.03 to 10 parts by mass, and particularly preferably 0.05 to 5 parts by mass.

[Other additives]
The pressure-sensitive adhesive composition (I-2) may contain other additives that do not fall under any of the above-mentioned components as long as the effects of the present invention are not impaired.
Examples of the other additive in the pressure-sensitive adhesive composition (I-2) include the same as the other additives in the pressure-sensitive adhesive composition (I-1).
The other additives contained in the pressure-sensitive adhesive composition (I-2) may be only one type, may be two or more types, and when there are two or more types, their combinations and ratios can be arbitrarily selected.

The content of the other additives in the pressure-sensitive adhesive composition (I-2) is not particularly limited, and may be appropriately selected depending on the type thereof.

[solvent]
The pressure-sensitive adhesive composition (I-2) may contain a solvent for the same purpose as in the case of the pressure-sensitive adhesive composition (I-1).
Examples of the solvent in the pressure-sensitive adhesive composition (I-2) include the same solvents as those in the pressure-sensitive adhesive composition (I-1).
The solvent contained in the pressure-sensitive adhesive composition (I-2) may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected.
In the pressure-sensitive adhesive composition (I-2), the content of the solvent is not particularly limited and may be appropriately adjusted.

<Adhesive composition (I-3)>
As described above, the pressure-sensitive adhesive composition (I-3) contains the pressure-sensitive resin (I-2a) and an energy ray-curable compound.

In the pressure-sensitive adhesive composition (I-3), the content of the pressure-sensitive resin (I-2a) is preferably 5 to 99% by mass, more preferably 10 to 95% by mass, and 15 to 90% by mass. It is particularly preferably mass%.

[Energy ray curable compound]
Examples of the energy ray-curable compound contained in the pressure-sensitive adhesive composition (I-3) include monomers and oligomers having an energy ray-polymerizable unsaturated group and curable by irradiation with energy rays, and the pressure-sensitive adhesive composition. Examples thereof include the same energy ray-curable compounds contained in the substance (I-1).
The energy ray-curable compound contained in the pressure-sensitive adhesive composition (I-3) may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected. ..

In the pressure-sensitive adhesive composition (I-3), the content of the energy ray-curable compound is 0.01 to 300 parts by mass with respect to 100 parts by mass of the content of the pressure-sensitive resin (I-2a). It is preferably 0.03 to 200 parts by mass, and particularly preferably 0.05 to 100 parts by mass.

[Photopolymerization initiator]
The pressure-sensitive adhesive composition (I-3) may further contain a photopolymerization initiator. The pressure-sensitive adhesive composition (I-3) containing a photopolymerization initiator sufficiently undergoes a curing reaction even when irradiated with relatively low-energy energy rays such as ultraviolet rays.

Examples of the photopolymerization initiator in the pressure-sensitive adhesive composition (I-3) include the same photopolymerization initiators in the pressure-sensitive adhesive composition (I-1).
The photopolymerization initiator contained in the pressure-sensitive adhesive composition (I-3) may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected.

In the pressure-sensitive adhesive composition (I-3), the content of the photopolymerization initiator is 0.01 to 100 parts by mass with respect to 100 parts by mass of the total content of the pressure-sensitive adhesive resin (I-2a) and the energy ray-curable compound. It is preferably 20 parts by mass, more preferably 0.03 to 10 parts by mass, and particularly preferably 0.05 to 5 parts by mass.

[Other additives]
The pressure-sensitive adhesive composition (I-3) may contain other additives that do not fall under any of the above-mentioned components as long as the effects of the present invention are not impaired.
Examples of the other additive include the same as the other additive in the pressure-sensitive adhesive composition (I-1).
The other additives contained in the pressure-sensitive adhesive composition (I-3) may be only one type, may be two or more types, and when there are two or more types, their combinations and ratios can be arbitrarily selected.

The content of the other additives in the pressure-sensitive adhesive composition (I-3) is not particularly limited, and may be appropriately selected depending on the type thereof.

[solvent]
The pressure-sensitive adhesive composition (I-3) may contain a solvent for the same purpose as in the case of the pressure-sensitive adhesive composition (I-1).
Examples of the solvent in the pressure-sensitive adhesive composition (I-3) include the same solvents as those in the pressure-sensitive adhesive composition (I-1).
The solvent contained in the pressure-sensitive adhesive composition (I-3) may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected.
In the pressure-sensitive adhesive composition (I-3), the content of the solvent is not particularly limited and may be appropriately adjusted.

<Adhesive compositions other than adhesive compositions (I-1) to (I-3)>
Up to this point, the pressure-sensitive adhesive composition (I-1), the pressure-sensitive adhesive composition (I-2), and the pressure-sensitive adhesive composition (I-3) have been mainly described. General pressure-sensitive adhesive compositions other than these three types of pressure-sensitive adhesive compositions (referred to in the present specification as "pressure-sensitive adhesive compositions other than pressure-sensitive adhesive compositions (I-1) to (I-3)"). However, it can be used in the same way.

Examples of the pressure-sensitive adhesive composition other than the pressure-sensitive adhesive compositions (I-1) to (I-3) include non-energy ray-curable pressure-sensitive adhesive compositions in addition to the energy-ray-curable pressure-sensitive adhesive composition.
Examples of the non-energy ray-curable pressure-sensitive adhesive composition include non-energy ray-curable resins such as acrylic resins, urethane resins, rubber resins, silicone resins, epoxy resins, polyvinyl ethers, polycarbonates, and ester resins. Examples thereof include a pressure-sensitive adhesive composition (I-4) containing a sex-sensitive adhesive resin (I-1a), and those containing an acrylic resin are preferable.

The pressure-sensitive adhesive compositions other than the pressure-sensitive adhesive compositions (I-1) to (I-3) preferably contain one or more cross-linking agents, and the content thereof is the above-mentioned pressure-sensitive adhesive composition. The same can be applied to the case of (I-1) and the like.

<Adhesive composition (I-4)>
Preferred pressure-sensitive adhesive compositions (I-4) include, for example, those containing the pressure-sensitive adhesive resin (I-1a) and a cross-linking agent.

[Adhesive resin (I-1a)]
Examples of the adhesive resin (I-1a) in the pressure-sensitive adhesive composition (I-4) include the same adhesive resin (I-1a) as in the pressure-sensitive adhesive composition (I-1).
The pressure-sensitive adhesive resin (I-1a) contained in the pressure-sensitive adhesive composition (I-4) may be of only one type, may be of two or more types, and when there are two or more types, the combination and ratio thereof may be arbitrary. You can choose.

In the pressure-sensitive adhesive composition (I-4), the content of the pressure-sensitive resin (I-1a) is preferably 5 to 99% by mass, more preferably 10 to 95% by mass, and 15 to 90% by mass. It is particularly preferably mass%.

[Crosslinking agent]
When the acrylic polymer having a structural unit derived from a functional group-containing monomer in addition to the structural unit derived from the (meth) acrylic acid alkyl ester is used as the adhesive resin (I-1a), the pressure-sensitive adhesive composition ( I-4) preferably further contains a cross-linking agent.

Examples of the cross-linking agent in the pressure-sensitive adhesive composition (I-4) include the same cross-linking agents as those in the pressure-sensitive adhesive composition (I-1).
The cross-linking agent contained in the pressure-sensitive adhesive composition (I-4) may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected.

In the pressure-sensitive adhesive composition (I-4), the content of the cross-linking agent is preferably 0.01 to 150 parts by mass with respect to 100 parts by mass of the content of the pressure-sensitive adhesive resin (I-1a). It is more preferably 0.05 to 130 parts by mass, and particularly preferably 0.1 to 110 parts by mass.

[Other additives]
The pressure-sensitive adhesive composition (I-4) may contain other additives that do not fall under any of the above-mentioned components as long as the effects of the present invention are not impaired.
Examples of the other additive include the same as the other additive in the pressure-sensitive adhesive composition (I-1).
The other additives contained in the pressure-sensitive adhesive composition (I-4) may be only one type, may be two or more types, and when there are two or more types, their combinations and ratios can be arbitrarily selected.

The content of the other additives in the pressure-sensitive adhesive composition (I-4) is not particularly limited, and may be appropriately selected depending on the type thereof.

[solvent]
The pressure-sensitive adhesive composition (I-4) may contain a solvent for the same purpose as in the case of the pressure-sensitive adhesive composition (I-1).
Examples of the solvent in the pressure-sensitive adhesive composition (I-4) include the same solvents as those in the pressure-sensitive adhesive composition (I-1).
The solvent contained in the pressure-sensitive adhesive composition (I-4) may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected.
In the pressure-sensitive adhesive composition (I-4), the content of the solvent is not particularly limited and may be appropriately adjusted.

<< Manufacturing method of adhesive composition >>
The pressure-sensitive adhesive compositions other than the pressure-sensitive adhesive compositions (I-1) to (I-3) and the pressure-sensitive adhesive compositions (I-1) to (I-3) such as the pressure-sensitive adhesive composition (I-4) , The pressure-sensitive adhesive and, if necessary, components other than the pressure-sensitive adhesive, and the like, are obtained by blending each component for forming a pressure-sensitive adhesive composition.
The order of addition of each component at the time of blending is not particularly limited, and two or more kinds of components may be added at the same time.
When a solvent is used, it may be used by mixing the solvent with any compounding component other than the solvent and diluting the compounding component in advance, or diluting any of the compounding components other than the solvent in advance. You may use it by mixing the solvent with these compounding components without leaving.
The method of mixing each component at the time of blending is not particularly limited, and from known methods such as a method of rotating a stirrer or a stirring blade to mix; a method of mixing using a mixer; a method of adding ultrasonic waves to mix. It may be selected as appropriate.
The temperature and time at the time of adding and mixing each component are not particularly limited as long as each compounding component does not deteriorate, and may be appropriately adjusted, but the temperature is preferably 15 to 30 ° C.

<< Adhesive composition >>
Preferred adhesive compositions include, for example, those containing a polymer component (a) and an epoxy-based thermosetting resin (b). Hereinafter, each component will be described.

(Polymer component (a))
The polymer component (a) is a component that can be regarded as being formed by a polymerization reaction of a polymerizable compound, and imparts film-forming property, flexibility, etc. to the film-like adhesive and is attached to an object to be adhered to a semiconductor chip or the like. It is a polymer compound for improving adhesiveness (stickability). Further, the polymer component (a) is also a component that does not correspond to the epoxy resin (b1) and the thermosetting agent (b2) described later.

The polymer component (a) contained in the adhesive composition and the film-like adhesive may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected. ..

Examples of the polymer component (a) include acrylic resins, polyesters, urethane resins, acrylic urethane resins, silicone resins, rubber resins, phenoxy resins, thermosetting polyimides, and the like, and acrylic resins are preferable. ..

Examples of the acrylic resin in the polymer component (a) include known acrylic polymers.
The weight average molecular weight (Mw) of the acrylic resin is preferably 1000 to 2000000, and more preferably 100,000 to 1500,000. When the weight average molecular weight of the acrylic resin is within such a range, it becomes easy to adjust the adhesive force between the film-like adhesive and the intermediate layer to the above-mentioned range.
On the other hand, when the weight average molecular weight of the acrylic resin is at least the above lower limit value, the shape stability (stability with time during storage) of the film-like adhesive is improved. Further, when the weight average molecular weight of the acrylic resin is not more than the above upper limit value, the film-like adhesive easily follows the uneven surface of the adherend, and voids or the like are formed between the adherend and the film-like adhesive. Is more suppressed.
In the present specification, the "weight average molecular weight" is a polystyrene-equivalent value measured by a gel permeation chromatography (GPC) method unless otherwise specified.

The glass transition temperature (Tg) of the acrylic resin is preferably -60 to 70 ° C, more preferably -30 to 50 ° C. When the Tg of the acrylic resin is at least the above lower limit value, the adhesive force between the film-like adhesive and the intermediate layer is suppressed, and the semiconductor chip with the film-like adhesive is separated from the intermediate layer at the time of pickup. Will be easier. When the Tg of the acrylic resin is not more than the above upper limit value, the adhesive force between the film-like adhesive and the semiconductor chip is improved.

Examples of the (meth) acrylic acid ester constituting the acrylic resin include methyl (meth) acrylic acid, ethyl (meth) acrylic acid, n-propyl (meth) acrylic acid, isopropyl (meth) acrylic acid, and (meth). ) N-butyl acrylate, isobutyl (meth) acrylate, sec-butyl (meth) acrylate, tert-butyl (meth) acrylate, pentyl (meth) acrylate, hexyl (meth) acrylate, (meth) acrylic Heptyl acid, 2-ethylhexyl (meth) acrylate, isooctyl (meth) acrylate, n-octyl (meth) acrylate, n-nonyl (meth) acrylate, isononyl (meth) acrylate, decyl (meth) acrylate , (Meta) undecyl acrylate, (meth) dodecyl acrylate ((meth) lauryl acrylate), (meth) tridecyl acrylate, tetradecyl (meth) acrylate (myristyl (meth) acrylate), (meth) acrylate Alkyl groups constituting alkyl esters such as pentadecyl, hexadecyl (meth) acrylate (palmityl (meth) acrylate), heptadecyl (meth) acrylate, octadecyl (meth) acrylate (stearyl (meth) acrylate), etc. (Meta) acrylic acid alkyl ester having a chain structure with 1 to 18 carbon atoms;
(Meta) Acrylic acid cycloalkyl esters such as (meth) acrylate isobornyl, (meth) acrylate dicyclopentanyl;
(Meta) Acrylic acid aralkyl esters such as benzyl (meth) acrylic acid;
(Meta) Acrylic acid cycloalkenyl ester such as (meth) acrylic acid dicyclopentenyl ester;
(Meta) Acrylic acid cycloalkenyloxyalkyl ester such as (meth) acrylic acid dicyclopentenyloxyethyl ester;
(Meta) acrylate imide;
A glycidyl group-containing (meth) acrylic acid ester such as glycidyl (meth) acrylate;
Hydroxymethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, (meth) ) A hydroxyl group-containing (meth) acrylic acid ester such as 3-hydroxybutyl acrylate and 4-hydroxybutyl (meth) acrylate;
Examples thereof include substituted amino group-containing (meth) acrylic acid esters such as N-methylaminoethyl (meth) acrylic acid. Here, the "substituted amino group" means a group in which one or two hydrogen atoms of the amino group are substituted with a group other than the hydrogen atom.

The acrylic resin is, for example, one or more monomers selected from (meth) acrylic acid, itaconic acid, vinyl acetate, acrylonitrile, styrene, N-methylolacrylamide and the like, in addition to the (meth) acrylic acid ester. May be copolymerized with each other.

The monomer constituting the acrylic resin may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected.

The acrylic resin may have a functional group capable of binding to other compounds such as a vinyl group, a (meth) acryloyl group, an amino group, a carboxy group and an isocyanate group, in addition to the above-mentioned hydroxyl group. These functional groups such as the hydroxyl group of the acrylic resin may be bonded to another compound via a cross-linking agent (f) described later, or may be directly bonded to another compound without a cross-linking agent (f). You may be doing it. When the acrylic resin is bonded to another compound by the functional group, the reliability of the package obtained by using the film-like adhesive tends to be improved.

In the present invention, as the polymer component (a), a thermoplastic resin other than the acrylic resin (hereinafter, may be simply abbreviated as “thermoplastic resin”) is used alone without using the acrylic resin. Alternatively, it may be used in combination with an acrylic resin. By using the thermoplastic resin, it becomes easier to separate the semiconductor chip with the film-like adhesive from the intermediate layer at the time of picking up, and the film-like adhesive can easily follow the uneven surface of the adherend. The generation of voids and the like may be further suppressed between the adherend and the film-like adhesive.

The weight average molecular weight of the thermoplastic resin is preferably 1000 to 100,000, more preferably 3000 to 80,000.

The glass transition temperature (Tg) of the thermoplastic resin is preferably -30 to 150 ° C, more preferably -20 to 120 ° C.

Examples of the thermoplastic resin include polyester, polyurethane, phenoxy resin, polybutene, polybutadiene, polystyrene and the like.

The thermoplastic resin contained in the adhesive composition and the film-like adhesive may be of only one type, of two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected.

In the adhesive composition, the ratio of the content of the polymer component (a) to the total content of all the components other than the solvent (that is, the content of the polymer component (a) of the film-like adhesive) is the polymer. Regardless of the type of the component (a), it is preferably 20 to 75% by mass, more preferably 30 to 65% by mass, and may be, for example, 40 to 60% by mass.

(Epoxy thermosetting resin (b))
The epoxy-based thermosetting resin (b) is composed of an epoxy resin (b1) and a thermosetting agent (b2).
The epoxy-based thermosetting resin (b) contained in the adhesive composition and the film-like adhesive may be of only one type, of two or more types, and when there are two or more types, the combination and ratio thereof are arbitrary. Can be selected.

-Epoxy resin (b1)
Examples of the epoxy resin (b1) include known ones, such as polyfunctional epoxy resin, biphenyl compound, bisphenol A diglycidyl ether and its hydrogenated product, orthocresol novolac epoxy resin, dicyclopentadiene type epoxy resin, and the like. Biphenyl type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenylene skeleton type epoxy resin, and other bifunctional or higher functional epoxy compounds can be mentioned.

As the epoxy resin (b1), an epoxy resin having an unsaturated hydrocarbon group may be used. Epoxy resins having unsaturated hydrocarbon groups have higher compatibility with acrylic resins than epoxy resins having no unsaturated hydrocarbon groups. Therefore, by using an epoxy resin having an unsaturated hydrocarbon group, the reliability of the package obtained by using the film-like adhesive is improved.

Examples of the epoxy resin having an unsaturated hydrocarbon group include a compound obtained by converting a part of the epoxy group of the polyfunctional epoxy resin into a group having an unsaturated hydrocarbon group. Such a compound can be obtained, for example, by subjecting an epoxy group to an addition reaction of (meth) acrylic acid or a derivative thereof. In the present specification, the term "derivative" means a compound in which one or more groups of the original compound are substituted with other groups (substituents) unless otherwise specified. Here, the "group" includes not only an atomic group formed by bonding a plurality of atoms but also one atom.

Examples of the epoxy resin having an unsaturated hydrocarbon group include a compound in which a group having an unsaturated hydrocarbon group is directly bonded to an aromatic ring or the like constituting the epoxy resin.
The unsaturated hydrocarbon group is a polymerizable unsaturated group, and specific examples thereof include an ethenyl group (vinyl group), a 2-propenyl group (allyl group), a (meth) acryloyl group, and a (meth) group. Examples thereof include an acrylamide group, and an acryloyl group is preferable.

The number average molecular weight of the epoxy resin (b1) is not particularly limited, but is preferably 300 to 30,000 from the viewpoint of the curability of the film-like adhesive and the strength and heat resistance of the film-like adhesive after curing. It is more preferably 400 to 10000, and particularly preferably 500 to 3000.
The epoxy equivalent of the epoxy resin (b1) is preferably 100 to 1000 g / eq, more preferably 150 to 800 g / eq.

The epoxy resin (b1) contained in the adhesive composition and the film-like adhesive may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected.

・ Thermosetting agent (b2)
The thermosetting agent (b2) functions as a curing agent for the epoxy resin (b1).
Examples of the thermosetting agent (b2) include compounds having two or more functional groups capable of reacting with epoxy groups in one molecule. Examples of the functional group include a phenolic hydroxyl group, an alcoholic hydroxyl group, an amino group, a carboxy group, a group in which an acid group is annealed, and the like, and the phenolic hydroxyl group, an amino group, or an acid group is annealed. It is preferably a group, more preferably a phenolic hydroxyl group or an amino group.

Among the heat-curing agents (b2), examples of the phenol-based curing agent having a phenolic hydroxyl group include polyfunctional phenol resins, biphenols, novolak-type phenol resins, dicyclopentadiene-type phenol resins, and aralkyl-type phenol resins. ..
Among the thermosetting agents (b2), examples of the amine-based curing agent having an amino group include dicyandiamide (DICY) and the like.

The thermosetting agent (b2) may have an unsaturated hydrocarbon group.
The thermosetting agent (b2) having an unsaturated hydrocarbon group is, for example, a compound in which a part of the hydroxyl group of the phenol resin is replaced with a group having an unsaturated hydrocarbon group, which is not suitable for the aromatic ring of the phenol resin. Examples thereof include compounds in which a group having a saturated hydrocarbon group is directly bonded.
The unsaturated hydrocarbon group in the thermosetting agent (b2) is the same as the unsaturated hydrocarbon group in the epoxy resin having the unsaturated hydrocarbon group described above.

When a phenolic curing agent is used as the thermosetting agent (b2), the thermosetting agent (b2) can be easily adjusted to the above-mentioned range in the adhesive force between the film-like adhesive and the intermediate layer. b2) preferably has a high softening point or glass transition temperature.

Among the thermosetting agents (b2), the number average molecular weight of resin components such as polyfunctional phenol resin, novolak type phenol resin, dicyclopentadiene type phenol resin, and aralkyl type phenol resin is preferably 300 to 30,000. , 400 to 10000, more preferably 500 to 3000.
The molecular weight of the non-resin component such as biphenol and dicyandiamide in the thermosetting agent (b2) is not particularly limited, but is preferably 60 to 500, for example.

The thermosetting agent (b2) contained in the adhesive composition and the film-like adhesive may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected. ..

In the adhesive composition and the film-like adhesive, the content of the heat-curing agent (b2) is preferably 0.1 to 500 parts by mass with respect to 100 parts by mass of the epoxy resin (b1). It is more preferably 1 to 200 parts by mass, for example, 2.5 to 100 parts by mass, 5 to 80 parts by mass, 7.5 to 60 parts by mass, 10 to 40 parts by mass, or the like. Good. When the content of the thermosetting agent (b2) is at least the lower limit value, the curing of the film-like adhesive becomes easier to proceed. When the content of the thermosetting agent (b2) is not more than the upper limit value, the hygroscopicity of the film-like adhesive is reduced, and the reliability of the package obtained by using the film-like adhesive is further improved. ..

In the adhesive composition and the film-like adhesive, the content of the epoxy-based thermosetting resin (b) (total content of the epoxy resin (b1) and the thermosetting agent (b2)) is the content of the polymer component (a). The content is preferably 5 to 100 parts by mass, more preferably 7 to 90 parts by mass, particularly preferably 9 to 80 parts by mass, and for example, 9 to 60 parts by mass with respect to 100 parts by mass. It may be any of parts, 9 to 40 parts by mass, 9 to 20 parts by mass, and the like. When the content of the epoxy-based thermosetting resin (b) is in such a range, it becomes easy to adjust the adhesive force between the film-like adhesive and the intermediate layer to the above-mentioned range.

In addition to the polymer component (a) and the epoxy-based thermosetting resin (b), the film-like adhesive further contains other components that do not fall under these, if necessary, in order to improve its various physical properties. You may be doing it.
Other preferable components contained in the film-like adhesive include, for example, a curing accelerator (c), a filler (d), a coupling agent (e), a cross-linking agent (f), and an energy ray-curable resin. (G), photopolymerization initiator (h), general-purpose additive (i) and the like can be mentioned.

(Curing accelerator (c))
The curing accelerator (c) is a component for adjusting the curing rate of the adhesive composition.
Preferred curing accelerators (c) include, for example, tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris (dimethylaminomethyl) phenol; 2-methylimidazole, 2-phenylimidazole. , 2-Phenyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole and other imidazoles (one or more hydrogen atoms other than hydrogen atoms) (Imidazole substituted with an organic group); organic phosphines such as tributylphosphine, diphenylphosphine, triphenylphosphine (phosphine in which one or more hydrogen atoms are substituted with an organic group); tetraphenylphosphonium tetraphenylborate, triphenylphosphine Examples thereof include tetraphenylborone salts such as tetraphenylborate.

The curing accelerator (c) contained in the adhesive composition and the film-like adhesive may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected. ..

When the curing accelerator (c) is used, the content of the curing accelerator (c) in the adhesive composition and the film-like adhesive is based on 100 parts by mass of the content of the epoxy thermosetting resin (b). , 0.01 to 10 parts by mass, more preferably 0.1 to 5 parts by mass. When the content of the curing accelerator (c) is at least the lower limit value, the effect of using the curing accelerator (c) is more remarkable. When the content of the curing accelerator (c) is not more than the above upper limit value, for example, the highly polar curing accelerator (c) is attached to the adherend in the film-like adhesive under high temperature and high humidity conditions. The effect of suppressing segregation by moving to the bonding interface side is enhanced, and the reliability of the package obtained by using the film-like adhesive is further improved.

(Filler (d))
By containing the filler (d), the film-like adhesive makes it easy to adjust its coefficient of thermal expansion, and by optimizing this coefficient of thermal expansion for the object to which the film-like adhesive is attached, the film The reliability of the package obtained by using the state adhesive is further improved. Further, when the film-like adhesive contains the filler (d), it is possible to reduce the hygroscopicity of the film-like adhesive after curing and improve the heat dissipation.

The filler (d) may be either an organic filler or an inorganic filler, but is preferably an inorganic filler.
Preferred inorganic fillers include, for example, powders of silica, alumina, talc, calcium carbonate, titanium white, red iron oxide, silicon carbide, boron nitride and the like; spherical beads of these inorganic fillers; surface modification of these inorganic fillers. Goods; Single crystal fibers of these inorganic fillers; Glass fibers and the like.
Among these, the inorganic filler is preferably silica or alumina.

The filler (d) contained in the adhesive composition and the film-like adhesive may be of only one type, of two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected.

When the filler (d) is used, the ratio of the content of the filler (d) to the total content of all the components other than the solvent in the adhesive composition (that is, of the filler (d) of the film-like adhesive). The content) is preferably 5 to 80% by mass, more preferably 7 to 60% by mass, for example, 10 to 55% by mass, 15 to 50% by mass, 20 to 45% by mass, and 25. It may be any of ~ 42 mass and the like. When the content of the filler (d) is in such a range, the above-mentioned coefficient of thermal expansion can be more easily adjusted.

(Coupling agent (e))
By containing the coupling agent (e) in the film-like adhesive, the adhesiveness and adhesion to the adherend are improved. Further, when the film-like adhesive contains the coupling agent (e), the cured product has improved water resistance without impairing heat resistance. The coupling agent (e) has a functional group capable of reacting with an inorganic compound or an organic compound.

The coupling agent (e) is preferably a compound having a functional group capable of reacting with the functional group of the polymer component (a), the epoxy thermosetting resin (b), etc., and is a silane coupling agent. Is more preferable.
Preferred silane coupling agents include, for example, 3-glycidyloxypropyltrimethoxysilane, 3-glycidyloxypropylmethyldiethoxysilane, 3-glycidyloxypropyltriethoxysilane, 3-glycidyloxymethyldiethoxysilane, 2-. (3,4-Epoxycyclohexyl) ethyltrimethoxysilane, 3-methacryloyloxypropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3- (2-aminoethylamino) propyltrimethoxysilane, 3- (2-amino) Ethylamino) propylmethyldiethoxysilane, 3- (phenylamino) propyltrimethoxysilane, 3-anilinopropyltrimethoxysilane, 3-ureidopropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-mercaptopropylmethyl Examples thereof include dimethoxysilane, bis (3-triethoxysilylpropyl) tetrasulfane, methyltrimethoxysilane, methyltriethoxysilane, vinyltrimethoxysilane, vinyltriacetoxysilane, and imidazolesilane.

The coupling agent (e) contained in the adhesive composition and the film-like adhesive may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected. ..

When the coupling agent (e) is used, the content of the coupling agent (e) in the adhesive composition and the film-like adhesive is the total of the polymer component (a) and the epoxy thermosetting resin (b). The content is preferably 0.03 to 20 parts by mass, more preferably 0.05 to 10 parts by mass, and particularly preferably 0.1 to 5 parts by mass with respect to 100 parts by mass. When the content of the coupling agent (e) is equal to or higher than the lower limit value, the dispersibility of the filler (d) in the resin is improved, the adhesiveness of the film-like adhesive to the adherend is improved, and the like. , The effect of using the coupling agent (e) is more remarkable. When the content of the coupling agent (e) is not more than the upper limit value, the generation of outgas is further suppressed.

(Crosslinking agent (f))
As the polymer component (a), one having a functional group such as a vinyl group capable of binding to another compound such as the above-mentioned acrylic resin, a (meth) acryloyl group, an amino group, a hydroxyl group, a carboxy group and an isocyanate group. When used, the adhesive composition and the film-like adhesive may contain a cross-linking agent (f) for bonding the functional group with another compound to cross-link. By cross-linking with the cross-linking agent (f), the initial adhesive force and the cohesive force of the film-like adhesive can be adjusted.

Examples of the cross-linking agent (f) include an organic polyvalent isocyanate compound, an organic polyvalent imine compound, a metal chelate-based cross-linking agent (a cross-linking agent having a metal chelate structure), an aziridine-based cross-linking agent (a cross-linking agent having an aziridine group), and the like. Can be mentioned.

Examples of the organic polyvalent isocyanate compound include an aromatic polyvalent isocyanate compound, an aliphatic polyhydric isocyanate compound, and an alicyclic polyvalent isocyanate compound (hereinafter, these compounds are collectively referred to as "aromatic polyvalent isocyanate compound and the like". (May be abbreviated); trimerics such as the aromatic polyvalent isocyanate compound, isocyanurates and adducts; terminal isocyanate urethane prepolymer obtained by reacting the aromatic polyvalent isocyanate compound and the like with a polyol compound. And so on. The "adduct" includes the aromatic polyhydric isocyanate compound, the aliphatic polyhydric isocyanate compound, or the alicyclic polyvalent isocyanate compound, and low ethylene glycol, propylene glycol, neopentyl glycol, trimethylolpropane, castor oil, and the like. It means a reaction product with a molecularly active hydrogen-containing compound. Examples of the adduct body include a xylylene diisocyanate adduct of trimethylolpropane, which will be described later. Further, the "terminal isocyanate urethane prepolymer" is as described above.

More specifically, as the organic polyvalent isocyanate compound, for example, 2,4-tolylene diisocyanate; 2,6-tolylene diisocyanate; 1,3-xylylene diisocyanate; 1,4-xylene diisocyanate; diphenylmethane-4. , 4'-diisocyanate; diphenylmethane-2,4'-diisocyanate; 3-methyldiphenylmethane diisocyanate; hexamethylene diisocyanate; isophorone diisocyanate; dicyclohexylmethane-4,4'-diisocyanate; dicyclohexylmethane-2,4'-diisocyanate; trimethylol Compounds in which one or more of tolylene diisocyanate, hexamethylene diisocyanate and xylylene diisocyanate are added to all or some hydroxyl groups of a polyol such as propane; lysine diisocyanate and the like can be mentioned.

Examples of the organic polyvalent imine compound include N, N'-diphenylmethane-4,4'-bis (1-aziridinecarboxyamide), trimethylolpropane-tri-β-aziridinyl propionate, and tetramethylolmethane. Examples thereof include -tri-β-aziridinyl propionate, N, N'-toluene-2,4-bis (1-aziridinecarboxyamide) triethylene melamine and the like.

When an organic multivalent isocyanate compound is used as the cross-linking agent (f), it is preferable to use a hydroxyl group-containing polymer as the polymer component (a). When the cross-linking agent (f) has an isocyanate group and the polymer component (a) has a hydroxyl group, the cross-linking structure is simplified to a film-like adhesive by the reaction between the cross-linking agent (f) and the polymer component (a). Can be introduced in.

The cross-linking agent (f) contained in the adhesive composition and the film-like adhesive may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected.

When the cross-linking agent (f) is used, the content of the cross-linking agent (f) in the adhesive composition is 0.01 to 20 parts by mass with respect to 100 parts by mass of the content of the polymer component (a). It is preferably 0.1 to 10 parts by mass, and particularly preferably 0.3 to 5 parts by mass. When the content of the cross-linking agent (f) is at least the lower limit value, the effect of using the cross-linking agent (f) can be obtained more remarkably. When the content of the cross-linking agent (f) is not more than the upper limit value, the excessive use of the cross-linking agent (f) is suppressed.

(Energy ray curable resin (g))
Since the film-like adhesive contains an energy ray-curable resin (g), its characteristics can be changed by irradiation with energy rays.

The energy ray-curable resin (g) is obtained by polymerizing (curing) an energy ray-curable compound.
Examples of the energy ray-curable compound include compounds having at least one polymerizable double bond in the molecule, and acrylate-based compounds having a (meth) acryloyl group are preferable.

Examples of the acrylate-based compound include trimethylolpropantri (meth) acrylate, tetramethylolmethanetetra (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, and dipentaerythritol monohydroxypenta (dipentaerythritol monohydroxypenta). Chain aliphatic skeleton-containing (meth) acrylates such as meta) acrylates, dipentaerythritol hexa (meth) acrylates, 1,4-butylene glycol di (meth) acrylates, and 1,6-hexanediol di (meth) acrylates; Cyclic aliphatic skeleton-containing (meth) acrylate such as cyclopentanyldi (meth) acrylate; Polyalkylene glycol (meth) acrylate such as polyethylene glycol di (meth) acrylate; Oligoester (meth) acrylate; Urethane (meth) acrylate oligomer ; Epoxy-modified (meth) acrylate; polyether (meth) acrylate other than the polyalkylene glycol (meth) acrylate; itaconic acid oligomer and the like.

The weight average molecular weight of the energy ray-curable resin (g) is preferably 100 to 30,000, and more preferably 300 to 10,000.

The energy ray-curable resin (g) contained in the adhesive composition may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected.

When the energy ray-curable resin (g) is used, the content of the energy ray-curable resin (g) in the adhesive composition is preferably 1 to 95% by mass, preferably 5 to 90% by mass. Is more preferable, and 10 to 85% by mass is particularly preferable.

(Photopolymerization Initiator (h))
When the adhesive composition contains the energy ray-curable resin (g), even if it contains the photopolymerization initiator (h) in order to efficiently proceed with the polymerization reaction of the energy ray-curable resin (g). Good.

Examples of the photopolymerization initiator (h) in the adhesive composition include benzoins such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, methyl benzoin benzoate, and benzoin dimethyl ketal. Compounds; Acetphenone compounds such as acetophenone, 2-hydroxy-2-methyl-1-phenyl-propan-1-one, 2,2-dimethoxy-1,2-diphenylethane-1-one; bis (2,4,6) -Trimethylbenzoyl) Acylphosphine oxide compounds such as phenylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide; sulfide compounds such as benzylphenyl sulfide and tetramethylthium monosulfide; 1-hydroxycyclohexylphenylketone and the like. Α-Ketol compounds; azo compounds such as azobisisobutyronitrile; titanosen compounds such as titanosen; thioxanthone compounds such as thioxanthone; peroxide compounds; diketone compounds such as diacetyl; benzyl; dibenzyl; benzophenone; 2,4-diethyl Thioxanthone; 1,2-diphenylmethane; 2-hydroxy-2-methyl-1- [4- (1-methylvinyl) phenyl] propanone; quinone compounds such as 1-chloroanthraquinone and 2-chloroanthraquinone can be mentioned.
Further, examples of the photopolymerization initiator (h) include a photosensitizer such as amine.

The photopolymerization initiator (h) contained in the adhesive composition may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected.

When the photopolymerization initiator (h) is used, the content of the photopolymerization initiator (h) in the adhesive composition is 0.1 with respect to 100 parts by mass of the content of the energy ray-curable resin (g). It is preferably ~ 20 parts by mass, more preferably 1 to 10 parts by mass, and particularly preferably 2 to 5 parts by mass.

(General-purpose additive (i))
The general-purpose additive (I) may be a known one, and may be arbitrarily selected depending on the intended purpose, and is not particularly limited. Preferred general-purpose additives (I) include, for example, plasticizers, antistatic agents, antioxidants, colorants (dye, pigment), gettering agents and the like.

The general-purpose additive (i) contained in the adhesive composition and the film-like adhesive may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected. ..
The content of the general-purpose additive (i) in the adhesive composition and the film-like adhesive is not particularly limited and may be appropriately selected depending on the intended purpose.

(solvent)
The adhesive composition preferably further contains a solvent. The adhesive composition containing a solvent has good handleability.
The solvent is not particularly limited, but preferred ones are, for example, hydrocarbons such as toluene and xylene; alcohols such as methanol, ethanol, 2-propanol, isobutyl alcohol (2-methylpropan-1-ol) and 1-butanol. Examples thereof include esters such as ethyl acetate; ketones such as acetone and methyl ethyl ketone; ethers such as tetrahydrofuran; amides such as dimethylformamide and N-methylpyrrolidone (compounds having an amide bond).
The solvent contained in the adhesive composition may be only one type, may be two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected.

The solvent contained in the adhesive composition is preferably methyl ethyl ketone or the like from the viewpoint that the components contained in the adhesive composition can be mixed more uniformly.

<< Manufacturing method of adhesive composition >>
The adhesive composition is obtained by blending each component for constituting the adhesive composition.
The order of addition of each component at the time of blending is not particularly limited, and two or more kinds of components may be added at the same time.
When a solvent is used, it may be used by mixing the solvent with any compounding component other than the solvent and diluting the compounding component in advance, or diluting any of the compounding components other than the solvent in advance. You may use it by mixing the solvent with these compounding components without leaving.

The method of mixing each component at the time of blending is not particularly limited, and from known methods such as a method of rotating a stirrer or a stirring blade to mix; a method of mixing using a mixer; a method of adding ultrasonic waves to mix. It may be selected as appropriate.
The temperature and time at the time of adding and mixing each component are not particularly limited as long as each compounding component does not deteriorate, and may be appropriately adjusted, but the temperature is preferably 15 to 30 ° C.

◇ Method for manufacturing dicing die bonding sheet The dicing die bonding sheet can be manufactured by sequentially laminating the above-mentioned layers so as to have a corresponding positional relationship. The method of forming each layer is as described above.
Hereinafter, an example of a method for manufacturing a dicing die bonding sheet will be described.

First, the above-mentioned pressure-sensitive adhesive composition is applied onto the base material and, if necessary, dried to laminate the pressure-sensitive adhesive layer on the base material. Alternatively, the pressure-sensitive adhesive composition is applied to the peel-treated surface of the release film and dried if necessary to form a pressure-sensitive adhesive layer. Then, the pressure-sensitive adhesive layer may be laminated on the base material by attaching the base material to the exposed surface of the pressure-sensitive adhesive layer (that is, the surface opposite to the side provided with the release film). .. In this case, the release film may be removed at a necessary stage.

On the other hand, a film-like adhesive is formed by applying an adhesive composition to the peeled surface of the release film and drying it if necessary. Further, the release film is formed by attaching the release-treated surface (that is, the first surface) of the intermediate layer to the exposed surface of the film-like adhesive (that is, the surface opposite to the side provided with the release film). A film-like adhesive and an intermediate layer are laminated on the film in this order in these thickness directions to obtain a laminate.

Then, on the exposed surface of the pressure-sensitive adhesive layer on the base material (that is, the side of the pressure-sensitive adhesive layer opposite to the side on which the base material is provided), the exposed surface of the intermediate layer of the laminate (that is, the first surface). Is a dicing die bonding sheet formed by laminating a base material, an adhesive layer, an intermediate layer, a film-like adhesive, and a release film in this order in these thickness directions by attaching (the surface on the opposite side). Is obtained.
The peeling film of the outermost layer may be peeled off from the film-like adhesive and removed when the dicing die bonding sheet is used.
In addition, the dicing die bonding sheet provided with another layer other than the base material, the pressure-sensitive adhesive layer, the intermediate layer, the film-like adhesive and the release film has the other layer at an appropriate timing in the above-mentioned manufacturing method. It can be manufactured by adding a step of forming.

-Method for manufacturing a semiconductor chip The method for manufacturing a semiconductor chip of the present invention is a method for manufacturing a semiconductor chip using the dicing die bonding sheet of the present invention described above, wherein the film-like adhesive in the dicing die bonding sheet is used. A step of forming a laminated structure in which a semiconductor wafer is provided on a surface opposite to the side on which the intermediate layer is provided (hereinafter, may be abbreviated as "laminated structure forming step"). The semiconductor chip is divided into semiconductor chips by using a dicing blade to form a notch in the laminated structure that reaches the intermediate layer from the surface of the semiconductor wafer and does not reach the base material. It has a step of forming (hereinafter, may be abbreviated as "dicing step").

By using the dicing die bonding sheet of the present invention, the amount of cut pieces generated in the dicing step can be significantly reduced as compared with the conventional case. Here, the "cut piece" is the one described above.

Hereinafter, a method for manufacturing the semiconductor chip will be described with reference to FIG. FIG. 2 is a cross-sectional view for schematically explaining an embodiment of the method for manufacturing a semiconductor chip of the present invention. Here, a manufacturing method when the dicing die bonding sheet shown in FIG. 1 is used will be described.
In the drawings after FIG. 2, the same components as those shown in the already explained figures are designated by the same reference numerals as in the case of the already explained figures, and detailed description thereof will be omitted.

<Laminate structure forming process>
In the laminated structure forming step, as shown in FIG. 2A, the surface of the film-like adhesive 14 in the dicing die bonding sheet 101 opposite to the side on which the intermediate layer 13 is provided, that is, the first. A laminated structure 201 provided with a semiconductor wafer 9'on one surface 14a is formed.
The thickness of the semiconductor wafer 9'is not particularly limited, but is preferably 10 to 100 μm, and more preferably 30 to 90 μm.

Although not explicitly shown in FIGS. 1 and 2, in the dicing die bonding sheet 101, the intermediate layer 13 and the film-like adhesive 14 may have the same size as the semiconductor wafer 9'. That is, the area of the first surface 13a of the intermediate layer 13 and the area of the first surface 14a of the film-like adhesive 14 are both the same as or slightly larger than the area of the surface 9a'of the semiconductor wafer 9'. It may be degree (ie, equivalent). However, in such a case, the film-like adhesive 14 is arranged so as not to protrude from the intermediate layer 13, and the semiconductor wafer 9'is arranged so as not to protrude from the film-like adhesive 14.

<Dicing process>
Next, in the dicing step, the dicing blade is used to form a notch 10 in the laminated structure 201 that reaches the intermediate layer 13 from the surface 9a'of the semiconductor wafer 9'and does not reach the base material 11. By doing so, as shown in FIG. 2B, the semiconductor wafer 9'is divided to form the semiconductor chip 9. In FIG. 2, the laminated structure after forming the notch 10 is indicated by reference numeral 201'. Here, a case where the notch 10 is formed so as not to reach the pressure-sensitive adhesive layer 12 will be described.
The thickness of the semiconductor chip 9 is the same as the thickness of the above-mentioned semiconductor wafer 9'.

In the dicing step, for example, as described above, the first surface 14a of the film-like adhesive 14 in the dicing die bonding sheet 101 is attached to a jig (not shown) such as a ring frame for fixing a semiconductor wafer. The dicing die bonding sheet 101 can be fixed to the jig by attaching the jig adhesive layer (not shown) provided on the jig.
On the other hand, as described above, when the intermediate layer 13 and the film-like adhesive 14 have the same size as the semiconductor wafer 9', for example, the pressure-sensitive adhesive layer 12 which is not covered by the intermediate layer 13 and is exposed. Can be fixed to the jig by attaching the dicing die bonding sheet 101 to the jig. Further, the dicing die bonding sheet 101 can also be attached to the jig by attaching the adhesive layer for jigs (not shown) provided on the first surface 12a of the exposed adhesive layer 12 to the jig. Can be fixed to.

FIG. 3 is an enlarged cross-sectional view schematically showing the obtained semiconductor chip 9 together with the dicing die bonding sheet 101 in which the notch 10 is formed.
As shown in FIG. 3, in this step, as an example, the thickness T _{1 of the intermediate layer 13 and the depth T 2} of the notch 10 from the first surface 13 a of the intermediate layer 13 have a relationship of _{T 1} > T _2. The notch 10 can be formed so as to satisfy. In this case, the notch 10 is formed in the laminated structure 201 over the entire area of the film-like adhesive 14 in the thickness direction and does not reach the pressure-sensitive adhesive layer 12.
When the bottom surface 130a of the notch portion in the intermediate layer 13 is not flat, the portion closest to the pressure-sensitive adhesive layer 12 on the bottom surface 130a (in other words, the portion in the intermediate layer 13 where the depth of the notch 10 is the deepest) is selected. It may be used as one of the criteria for calculating _{T 2.}

In this way, by forming the notch 10 so as to stay in the intermediate layer 13 without reaching the first surface 11a of the base material 11, it is possible to prevent the generation of cut pieces derived from the base material 11. Further, when the tensile elastic modulus of the intermediate layer 13 is 3500 MPa or more, the amount of cut pieces generated from the intermediate layer 13 can be reduced in the dicing step. As described above, the amount of cut pieces generated can be remarkably reduced in the dicing step.

The fact that the amount of cut pieces generated in the dicing step can be reduced means that, for example, when the semiconductor chip is observed with a microscope, the number of cut pieces remaining on the surface of the semiconductor chip is reduced, or the semiconductor This can be confirmed by the fact that no cut pieces remain on the surface of the chip. Here, the "surface of the semiconductor chip" means the circuit forming surface and the side surface of the semiconductor chip.

Further, by forming the notch 10 so as to stay in the intermediate layer 13 in this way, peeling of the semiconductor chip from the support sheet or the dicing die bonding sheet, so-called chip skipping, is suppressed during blade dicing. This is because the dicing blade does not come into contact with the base material, and as a result, the vibration of the dicing blade is not directly transmitted to the base material, so that the occurrence of excessive vibration in the dicing die bonding sheet is suppressed. It is presumed to be from.

The ratio _{of the depth T 2} of the notch 10 in the intermediate layer 13 to the thickness T _{1 of the intermediate layer 13 (T 2} / T ₁ ) is greater than 0 and less than or equal to 1, for example, 0.1 to 0.9, It may be any of 0.2 to 0.8 and 0.3 to 0.7. However, these are examples of the above ratio. When the ratio is at least the lower limit value, the semiconductor chip 9 with a film-like adhesive, which will be described later, can be more easily picked up. When the ratio is not more than the upper limit value, the amount of cut pieces generated can be further reduced.

In the dicing step, the rotation speed of the dicing blade is preferably 1000 to 60,000 rpm, more preferably 2000 to 50000 rpm.
The moving speed of the dicing blade is preferably 20 to 80 mm / sec, more preferably 40 to 60 mm / sec.
When the dicing blade is operated, it is preferable to flow cutting water at an amount of, for example, about 0.5 to 1.5 L / min to the dicing portion.

Here, in the laminated structure 201, a case where a notch 10 that reaches the intermediate layer 13 from the surface 9a'of the semiconductor wafer 9'and does not reach the adhesive layer 12 is formed has been described, but in the dicing step. May form a notch 10 so as to reach the pressure-sensitive adhesive layer 12 if it has not reached the base material 11.

FIG. 4 is an enlarged cross-sectional view schematically showing the obtained semiconductor chip 9 together with the dicing die bonding sheet 101 in which the notch 10 reaching the pressure-sensitive adhesive layer 12 is formed.

As shown in FIG. 4, in this step, as an example, the thickness T _{3 of the pressure-sensitive adhesive layer 12 and the depth T 4} of the notch 10 from the first surface 12 a of the pressure-sensitive adhesive layer 12 are T ₃ > T ₄ The notch 10 can be formed so as to satisfy the relationship of. In this case, the notch 10 is formed in the laminated structure 201 over the entire area of the film-like adhesive 14 and the intermediate layer 13 in the thickness direction (T ₂ / T _{1 is set} to 1), and is formed in the base material 11. Is formed so that it does not reach.
When the bottom surface 120a of the notch portion in the pressure-sensitive adhesive layer 12 is not flat, the portion closest to the base material 11 of the bottom surface 120a (in other words, the portion having the deepest depth of the notch 10 in the pressure-sensitive adhesive layer 12) is used. , T ₄ may be used as one of the criteria for calculation.

The ratio _{of the depth T 4} of the notch 10 in the pressure-sensitive adhesive layer 12 to the thickness T ₃ of the pressure-sensitive adhesive layer 12 _{(T 4} / T ₃ ) is greater than 0 and less than or equal to 1, for example, 0.1 to 0. It may be any of 9, 0.2 to 0.8 and 0.3 to 0.7. However, these are examples of the above ratio. When the ratio is at least the lower limit value, the semiconductor chip 9 with a film-like adhesive, which will be described later, can be more easily picked up. When the ratio is not more than the upper limit value, the amount of cut pieces generated can be further reduced.

-Method for manufacturing a semiconductor device As a method for manufacturing a semiconductor device using the above-mentioned method for manufacturing a semiconductor chip of the present invention, a step (dicing step) for forming the semiconductor chip was performed by the method for manufacturing the semiconductor chip. After that, a step of applying a force to the dicing die bonding sheet after forming the notch from the base material side and separating the semiconductor chip from the intermediate layer together with the film-like adhesive after cutting (hereinafter, "" (Sometimes abbreviated as "pulling step").

By utilizing the above-mentioned method for manufacturing a semiconductor chip of the present invention, the amount of cut pieces generated in the dicing step can be remarkably reduced, and the dicing die bonding sheet of the present invention provided with an intermediate layer is used. Therefore, in the pulling step, the occurrence of pick-up failure of the semiconductor chip with the film-like adhesive is suppressed.
As described above, according to the present invention, it is possible to suppress the occurrence of process abnormalities between dicing and picking up the semiconductor chip with a film-like adhesive.

In the method for manufacturing a semiconductor device, the target of pulling the semiconductor chip with the film-like adhesive is not the pressure-sensitive adhesive layer but the intermediate layer. Therefore, as described above, the pressure-sensitive adhesive layer may be either energy ray-curable or non-energy ray-curable, but even if it is energy ray-curable, it cannot be cured before the separation step. Not needed.

Hereinafter, a method for manufacturing the semiconductor device will be described with reference to FIG. FIG. 5 is a cross-sectional view for schematically explaining an embodiment of a method for manufacturing a semiconductor device using the method for manufacturing a semiconductor chip of the present invention. Here, a manufacturing method when the dicing die bonding sheet shown in FIG. 1 is used will be described. In FIG. 5, only the configuration related to the dicing die bonding sheet and the semiconductor chip is shown in cross section.

<Pulling process>
In the pulling step, as shown in FIG. 5, a force is applied to the dicing die bonding sheet 101 after forming the notch 10 from the base material 11 side, and the semiconductor chip 9 is bonded to the film after cutting. Separate (pick up) from the intermediate layer 13 together with the agent 14.

Here, the protrusion (pin) 70 is projected from a push-up portion (not shown) in the semiconductor device manufacturing apparatus, and the tip portion of the protrusion 70 pushes up the dicing die bonding sheet 101 from the base material 11 side, whereby the notch 10 is formed. An example is shown in which a force is applied to the laminated structure 201'in which the semiconductor chip 9 is formed in the protruding direction of the protrusion 70. At this time, the pushing conditions such as the protruding amount (pushing amount), the protruding speed (pushing speed), and the holding time of the protruding state (lifting waiting time) of the protrusion 70 can be appropriately adjusted.

The number of protrusions 70 is not particularly limited and may be appropriately selected. In FIG. 5, the number of protrusions 70 shown is one as a force applied to one semiconductor chip 9, but even one protrusion 70 applies a force to one semiconductor chip 9. It may be two or more.

In the pulling step, the method of pushing up the dicing die bonding sheet 101 may be a known method. For example, in addition to the method of pushing up by the protrusion as described above, the slider is moved along the dicing die bonding sheet 101. A method of pushing up the dicing die bonding sheet 101 can be mentioned.

Further, here, an example is shown in which the semiconductor chip 9 with the film-like adhesive is peeled off from the intermediate layer 13 by pulling up the semiconductor chip 9 by the pulling-up portion 71 of the semiconductor device manufacturing apparatus. The pulling direction of the semiconductor chip 9 is indicated by an arrow I.
The method of pulling up the semiconductor chip 9 may be a known method. As a specific method, for example, a method of adsorbing the surface of the semiconductor chip 9 with a vacuum collet and pulling up the semiconductor chip 9 can be mentioned.

In the pulling step, the dicing die bonding sheet 101 provided with the intermediate layer 13 is used, so that the semiconductor chip 9 with the film-like adhesive is peeled (the peeled surface) of the intermediate layer 13. It is easily separated from the surface 13a. On the other hand, in the step before the pulling step, the peeling of the film-like adhesive 14 from the intermediate layer 13 is suppressed.

In the above-mentioned method for manufacturing a semiconductor device, the picked up semiconductor chip with a film-like adhesive is used, and thereafter, the semiconductor device is manufactured by the same method as the conventional method. For example, the semiconductor chip is die-bonded to the circuit surface of the substrate with a film-like adhesive, and if necessary, one or more semiconductor chips are further laminated on the semiconductor chip to perform wire bonding, and then the whole is resin. By sealing with, it becomes a semiconductor package. Then, the target semiconductor device may be manufactured using this semiconductor package.

Hereinafter, the present invention will be described in more detail with reference to specific examples. However, the present invention is not limited to the examples shown below.

The components used in the production of the adhesive composition are shown below.
-Polymer component (a)
(A) -1: Copolymerization of methyl acrylate (hereinafter abbreviated as "MA") (95 parts by mass) and -2-hydroxyethyl acrylate (hereinafter abbreviated as "HEA") (5 parts by mass). Acrylic resin (weight average molecular weight 800,000, glass transition temperature 9 ° C.).
-Epoxy resin (b1)
(B1) -1: Cresol novolac type epoxy resin to which an acryloyl group is added (“CNA-147” manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent 518 g / eq, number average molecular weight 2100, unsaturated group content is epoxy group, etc. amount)
・ Thermosetting agent (b2)
(B2) -1: Aralkyl phenol resin ("Millex XLC-4L" manufactured by Mitsui Chemicals, Inc., number average molecular weight 1100)
・ Filler (d)
(D) -1: Spherical silica (“YA050C-SM1” manufactured by Admatex, average particle size (50) nm)
・ Coupling agent (e)
(E) -1: Silane coupling agent, 3-glycidoxypropylmethyldiethoxysilane ("KBE-402" manufactured by Shin-Etsu Chemical Co., Ltd.)
-Crosslinking agent (f)
(F) -1: Trimerizing isocyanate trimer adduct of trimethylolpropane ("Coronate L" manufactured by Nippon Polyurethane Industry Co., Ltd.)

[Example 1]
<Manufacturing of dicing die bonding sheet>
(Manufacturing of adhesive composition)
Polymer component (a) -1 (100 parts by mass), epoxy resin (b1) -1 (10 parts by mass), heat curing agent (b2) -1 (2 parts by mass), filler (d) -1 (75) By mass), the coupling agent (e) -1 (0.5 parts by mass), and the cross-linking agent (f) -1 (0.5 parts by mass) are dissolved or dispersed in methyl ethyl ketone and stirred at 23 ° C. To obtain an adhesive composition. The blending amounts of the components other than the methyl ethyl ketone shown here are all solid content conversion values.

(Manufacturing of film-like adhesive)
The adhesive composition obtained above is applied to the peeled surface of a release film (“SP-PET38131H” manufactured by Lintec Corporation, thickness 38 μm) in which one side of a polyethylene terephthalate (PET) film is peeled by a silicone treatment. A film-like adhesive having a thickness of 20 μm was formed by coating and heating and drying at 100 ° C. for 2 minutes.
Next, as a separate intermediate layer, a release film (manufactured by Mitsubishi Chemical Corporation, thickness 38 μm) in which one side of the polyethylene terephthalate film was peeled by silicone treatment was used, and the peeled surface of this release film was obtained as described above. A laminate having a structure in which release films are attached to both sides of the film-like adhesive by attaching it to the exposed surface of the film-like adhesive, in other words, the release film, the film-like adhesive and the intermediate layer are in this order. A laminate having a laminated structure in these thickness directions was obtained. The release film was attached to the film-like adhesive by sandwiching them between a silicone rubber roll and a metal roll at room temperature.

(Manufacturing of adhesive composition)
A cross-linking agent (1 part by mass) was added to the adhesive resin (1 part by mass) and stirred at 23 ° C. to obtain a non-energy ray-curable pressure-sensitive adhesive composition. The blending amounts shown here are all solid content conversion values.
The adhesive resin is an acrylic resin (“Olivine BPS 6637X” manufactured by Toyochem Co., Ltd.). The cross-linking agent is "BXX 5640" manufactured by Toyochem Co., Ltd.

(Manufacturing of support sheet)
The pressure-sensitive adhesive composition obtained above is applied to the peel-treated surface of a release film (“SP-PET382150” manufactured by Lintec Corporation, thickness 38 μm) in which one side of a polyethylene terephthalate (PET) film is peeled by a silicone treatment. A pressure-sensitive adhesive layer having a thickness of 10 μm was formed by coating and heating and drying at 100 ° C. for 2 minutes.
Next, the electron beam-irradiated surface of a substrate (thickness 80 μm) made of an ethylene / methacrylic acid copolymer (hereinafter, abbreviated as “EMAA”) and one surface of which has been electron-beam-irradiated is described. By sticking to the exposed surface of the pressure-sensitive adhesive layer, a support sheet having a structure in which the base material, the pressure-sensitive adhesive layer and the release film were laminated in this order in the thickness direction was obtained. The base material was attached to the pressure-sensitive adhesive layer by sandwiching them between a silicone rubber roll and a metal roll at room temperature.

(Manufacturing of dicing die bonding sheet)
The laminate was cut out into a circular shape having a diameter of 220 mm, and one of the release films (the release film not corresponding to the intermediate layer) was removed to obtain a laminate of the intermediate layer and the film-like adhesive.
Next, the intermediate layer obtained above and the intermediate layer of the laminate of the film-like adhesive were attached to the pressure-sensitive adhesive layer of the support sheet at room temperature.
As described above, a dicing die bonding sheet having a structure in which the base material, the pressure-sensitive adhesive layer, the intermediate layer, and the film-like adhesive are laminated in this order in the thickness direction was obtained.

<Evaluation of dicing die bonding sheet (1)>
(Measurement of tensile elastic modulus of intermediate layer)
A test piece is prepared by cutting an intermediate layer (the above-mentioned PET film on which one side has been peeled off), and the tensile elastic modulus (Young's modulus) of the test piece at 23 ° C. is determined in accordance with JIS K 7161: 1994. It was measured. At this time, the measured width of the test piece was set to 25 mm, and the distance between the gripping tools was set to 100 mm.

(Measurement of indentation hardness of intermediate layer)
An intermediate layer (the above-mentioned PET film having one side peeled off) was cut to prepare a test piece, and the indentation hardness of the test piece at 23 ° C. was measured in accordance with JIS Z 2255: 2003.

(Measurement of adhesive strength between the adhesive layer and the intermediate layer)
The dicing die bonding sheet was cut out so as to have a width of 25 mm and a length of 200 mm to prepare a test piece.
Then, at room temperature (23 ° C.), this test piece was attached to the adhesive surface of the adhesive sheet with a film-like adhesive.
Next, at room temperature (23 ° C.), the peeling speed of the laminate of the base material and the pressure-sensitive adhesive layer from the intermediate layer so that the surfaces of the intermediate layer and the pressure-sensitive adhesive layer that were in contact with each other form an angle of 180 °. It was peeled off at 300 mm / min to perform 180 ° peeling, and the peeling force at this time was measured to obtain the adhesive force (N / 25 mm) between the pressure-sensitive adhesive layer and the intermediate layer.

(Measurement of adhesive force between the intermediate layer and the film-like adhesive)
The dicing die bonding sheet was cut out so as to have a width of 25 mm and a length of 200 mm to prepare a test piece.
Then, at room temperature (23 ° C.), this test piece was attached to the adhesive surface of the adhesive sheet with a film-like adhesive.
Next, at room temperature (23 ° C.), the laminate of the base material, the pressure-sensitive adhesive layer, and the intermediate layer is formed into a film so that the surfaces of the intermediate layer and the film-like adhesive that have been in contact with each other form an angle of 180 °. The adhesive was peeled off at a peeling speed of 300 mm / min to perform 180 ° peeling, and the peeling force at this time was measured to obtain the adhesive force (N / 25 mm) between the intermediate layer and the film-like adhesive.

<Manufacturing of semiconductor chips (1) (Evaluation of dicing die bonding sheet (2))>
(Laminate structure forming process)
The dicing die bonding sheet obtained above was attached to one surface of an 8-inch silicon mirror wafer (thickness 40 μm) with a film-like adhesive heated to 60 ° C. to obtain a laminated structure.

(Dicing process)
Next, the obtained laminated structure was attached to and fixed to the dicing ring frame by the exposed surface of the pressure-sensitive adhesive layer.
Next, a dicing device (“DFD6361” manufactured by Disco Corporation) was used to form a notch in the laminated structure obtained above. The conditions at that time are as follows. As shown in FIG. 3, the dicing blade (dicing blade) penetrates the film-like adhesive from the surface of the silicon mirror wafer to a depth of 20 μm from the side surface (interface) of the intermediate layer provided with the film-like adhesive. It was cut using "27HECC" manufactured by DISCO Co., Ltd., and a notch was formed by a single cut. That is, the notch is formed in the laminated structure so as not to reach the base material and the pressure-sensitive adhesive layer, and the ratio of the notch depth T _{2 in the intermediate layer to the thickness T 1 of the intermediate layer (T 2).} / T ₁ ) was set to 0.53. The rotation speed of the dicing blade was 40,000 rpm, and the moving speed was 50 mm / sec. Further, dicing was performed while flowing cutting water at an amount of 1 L / min to the portion where the dicing was performed.
From the above, a silicon chip having a size of 5 mm × 5 mm was obtained.

(Measurement of adhesive strength between the adhesive layer and the ring frame)
The laminate of the base material and the pressure-sensitive adhesive layer was cut out so as to have a width of 25 mm and a length of 200 mm to obtain a test piece.
Next, at room temperature (23 ° C.), this test piece was attached to a fixing base material made of the same stainless steel (SUS) as the ring frame by an adhesive layer. At this time, the entire surface of the pressure-sensitive adhesive layer of the test piece was attached to the fixing base material.
Next, at room temperature (23 ° C.), the laminate of the base material and the pressure-sensitive adhesive layer is placed on the fixing base material so that the surfaces of the pressure-sensitive adhesive layer and the fixing base material that have been in contact with each other form an angle of 180 °. Then, it was peeled off at a peeling speed of 300 mm / min to perform 180 ° peeling, and the peeling force at this time was measured to obtain the adhesive force (N / 25 mm) between the adhesive layer and the ring frame.

(Evaluation of chip skipping suppression effect)
In the above dicing step, the case where no chip skipping was observed was defined as A, and the case where chip skipping was observed even at one location was defined as B, and the effect of suppressing chip skipping was evaluated. The results are shown in Table 1.

(Evaluation of the effect of suppressing the generation of cut pieces)
Using a digital microscope, observe the silicon chip obtained in the above dicing step, and let A be the case where no cut pieces are seen on the surface of the silicon chip, and B be the case where even a small amount of cut pieces are seen. The effect of suppressing the generation of cut pieces was evaluated. The results are shown in Table 1.

<Manufacturing of semiconductor chips (2) (Evaluation of dicing die bonding sheet (3))>
(Laminate structure forming process)
The dicing die bonding sheet obtained above was attached to one surface of an 8-inch silicon mirror wafer (thickness 75 μm) with a film-like adhesive heated to 60 ° C. to obtain a laminated structure.

(Dicing process)
Next, a ring frame tape was provided on the exposed surface of the pressure-sensitive adhesive layer of the obtained laminated structure, and the laminated structure was fixed to the dicing ring frame by this tape.
Next, using a dicing device (“DFD6361” manufactured by Disco Corporation), dicing was performed by the same method as in the evaluation of the above-mentioned effect of suppressing chip skipping and the effect of suppressing the generation of cut pieces. However, the size of the silicon chip was 8 mm × 8 m.

(Pulling process (evaluation of semiconductor chip pickup suitability))
After the dicing step described above, the laminated structure after forming the silicon chip was installed in a pickup die bonding apparatus (“BESTEM-D02” manufactured by Canon Machinery Co., Ltd.). Then, at room temperature, the push-up speed is 20 mm / sec, the holding time is 300 msec, the push-up amount is set to a specific value, and the dicing die bonding sheet after the dicing process is carried out by a one-step push-up method using five pins. On the other hand, a force is applied from the base material side to push up the laminated structure after forming the silicon chip, and a collet (the size of the part where the semiconductor chip is separated is 8 mm × 8 mm) is used to obtain the film. An attempt was made to separate (pick up) the silicon chip with the adhesive from the intermediate layer. The push-up amount when the push-up of the laminated structure and the separation of the silicon chip with the film-like adhesive can be continuously performed by changing the push-up amount, and can be performed 135 times in succession without any abnormality. The minimum value of was obtained, and the pick-up suitability of the silicon chip with a film-like adhesive was evaluated. The results are shown in Table 1.

<Manufacturing and evaluation of dicing die bonding sheet, manufacturing and evaluation of semiconductor chips>
[Example 2]
The dicing die bonding sheet and the silicon chip were manufactured and evaluated by the same method as in Example 1 except that the depth of the cut formed in the intermediate layer in the dicing step was 10 μm instead of 20 μm. That is, in this embodiment, the notch is formed in the laminated structure over the entire area in the thickness direction of the film-like adhesive and is formed so as not to reach the base material and the pressure-sensitive adhesive layer. The ratio (T ₂ / T ₁ ) of the depth of cut T _{2 in} the intermediate layer to the thickness T ₁ of the intermediate layer was set to 0.26. The results are shown in Table 1.

[Example 3]
The dicing die bonding sheet and the silicon chip were manufactured and evaluated by the same method as in Example 1 except that the dicing step was changed as shown below.
In this embodiment, in the dicing step, as shown in FIG. 4, the surface (interface) of the silicon mirror wafer that penetrates the film-like adhesive and the intermediate layer and has the intermediate layer of the pressure-sensitive adhesive layer. ) To a depth of 10 μm, in other words, a notch was formed that penetrated the pressure-sensitive adhesive layer but did not reach the substrate. That is, the notch is formed in the laminated structure over the entire area of the film-like adhesive and the intermediate layer in the thickness direction (T ₂ / T _{1 is set} to 1) and does not reach the base material. The ratio _{of the depth of cut T 4} in the pressure-sensitive adhesive layer _{(T 4} / T ₃ ) to the thickness T ₃ of the pressure-sensitive adhesive layer was set to 1. The results are shown in Table 1.

[Example 4]
The dicing die bonding sheet and the silicon chip were manufactured and evaluated by the same method as in Example 1 except that the dicing step was changed as shown below.
In this embodiment, in the dicing step, as shown in FIG. 4, the surface (interface) on the side (interface) that penetrates the film-like adhesive and the intermediate layer from the surface of the silicon mirror wafer and has the intermediate layer of the pressure-sensitive adhesive layer. ) To a depth of 5 μm. That is, the notch is formed in the laminated structure over the entire area of the film-like adhesive and the intermediate layer in the thickness direction (T ₂ / T _{1 is set} to 1) and does not reach the base material. The ratio _{of the depth of cut T 4} in the pressure-sensitive adhesive layer _{(T 4} / T ₃ ) to the thickness T ₃ of the pressure-sensitive adhesive layer was set to 0.5. The results are shown in Table 1.

[Example 5]
Instead of a polyethylene terephthalate film (thickness 38 μm) whose one side has been peeled off by silicone treatment, a release film (thickness manufactured by Teijin DuPont Film Co., Ltd.) in which one side of a polyethylene naphthalate (PEN) film has been peeled off by silicone treatment. A dicing die bonding sheet and a silicon chip were produced and evaluated by the same method as in Example 1 except that the intermediate layer was 38 μm). Also in this example, the peeled surface of the peeled film was attached to the exposed surface of the film-like adhesive. The results are shown in Table 1.

[Comparative Example 1]
The dicing die bonding sheet and the silicon chip were manufactured and evaluated by the same method as in Example 1 except that the dicing step was changed as shown below.
In this comparative example, in the dicing step, as shown in FIG. 6, the side that penetrates the film-like adhesive, the intermediate layer, and the pressure-sensitive adhesive layer from the surface of the silicon mirror wafer and has the pressure-sensitive adhesive layer of the base material. A notch was formed from the surface (first surface) to a depth of 20 μm. That is, the notch is formed in the laminated structure over the entire area of the film-like adhesive, the intermediate layer, and the pressure-sensitive adhesive layer in the thickness direction, and T ₂ / T ₁ and T ₄ / T ₃ are set to 1. Further, a notch was formed in the base material to set the depth of the notch in the base material to 20 μm. The results are shown in Table 2.
In the figures after FIG. 6 cited in the explanation in the comparative example, the semiconductor chip 9 corresponds to a silicon chip.

[Comparative Example 2]
The dicing die bonding sheet and the silicon chip were manufactured and evaluated by the same method as in Comparative Example 1 except that the intermediate layer was not provided. That is, in this comparative example, as shown in FIG. 7, the notch is formed in the laminated structure over the entire area of the film-like adhesive and the pressure-sensitive adhesive layer in the thickness direction, and T ₄ / T ₃ is formed. In addition to setting 1, a notch was further formed in the base material to set the depth of cut T ₃ in the base material to 20 μm. The results are shown in Table 2.

[Comparative Example 3]
Instead of the polyethylene terephthalate film (thickness 38 μm) whose one side was peeled off by silicone treatment, a polyethylene (PE) film (Gunze Co., Ltd., thickness 80 μm) whose both sides were not peeled off was used as an intermediate layer. A dicing die bonding sheet and a silicon chip were produced and evaluated by the same method as in Example 1 except for the above. In this comparative example, as shown in FIG. 8, the notch is formed in the laminated structure so as not to reach the base material and the pressure-sensitive adhesive layer, and the notch in the intermediate layer is formed with _{respect to the thickness T 1} of the intermediate layer. The ratio of the depth T ₂ (T ₂ / T ₁ ) was set to 0.25. In FIG. 8, reference numeral 83 indicates an intermediate layer in this comparative example, and reference numeral 83a indicates a surface (interface, first surface) of the intermediate layer 83 opposite to the side on which the pressure-sensitive adhesive layer 12 is provided. The results are shown in Table 2.

[Comparative Example 4]
Instead of the one made of EMAA (thickness 80 μm), the one made of polyethylene copolymer (manufactured by Gunze Co., Ltd., thickness 80 μm) is used as a base material, and no intermediate layer and adhesive layer are provided. A dicing die bonding sheet is manufactured by the same method as in Example 1 except that a ring frame tape is provided on the exposed surface of the base material of the laminated structure and the laminated structure is fixed to the dicing ring frame by this tape. And evaluated.
Then, using this dicing die bonding sheet, a silicon chip was manufactured and evaluated by the same method as in Example 1 except that changes were made in the dicing step as shown below. In this comparative example, in the dicing step, as shown in FIG. 9, the film-like adhesive is penetrated from the surface of the silicon mirror wafer, and the surface (interface) of the base material provided with the film-like adhesive is used. A notch was formed to a depth of 20 μm. That is, the notch was formed in the laminated structure over the entire area of the film-like adhesive in the thickness direction, and further, the notch was also formed in the base material so that the depth of the notch in the base material was 20 μm. .. In FIG. 9, reference numeral 81 indicates a base material in this comparative example, and reference numeral 81a indicates one surface (interface, first surface) of the base material 81. The results are shown in Table 2.

[Comparative Example 5]
The dicing die bonding sheet and the silicon chip were prepared in the same manner as in Comparative Example 4 except that the base material was made of EMAA (thickness 80 μm) instead of the polyethylene copolymer (thickness 80 μm). , Manufactured and evaluated respectively. The pressure-sensitive adhesive layer was attached to the electron beam irradiation-treated surface of the base material to form a support sheet. The results are shown in Table 2.

[Comparative Example 6]
A polyethylene terephthalate film (thickness 38 μm) whose one side was peeled off by silicone treatment was replaced with a polyethylene film (Gunze Co., Ltd., thickness 40 μm) whose both sides were not peeled off as an intermediate layer. The dicing die bonding sheet and the silicon chip were manufactured and evaluated by the same method as in Example 1, respectively. In this comparative example, the notch is formed in the laminated structure so as not to reach the base material and the pressure-sensitive adhesive layer, and the ratio of the notch depth T _{2 in the intermediate layer to the thickness T 1 of the intermediate layer.} (T ₂ / T ₁ ) was set to 0.5. The results are shown in Table 2.

[Comparative Example 7]
Instead of the polyethylene terephthalate film (thickness 38 μm) whose one side was peeled off by silicone treatment, a polyethylene (PE) film (Gunze Co., Ltd., thickness 80 μm) whose both sides were not peeled off was used as an intermediate layer. A dicing die bonding sheet and a silicon chip were manufactured in the same manner as in Example 1 except for the above. Then, in the evaluation, only the effect of suppressing the generation of cut pieces was performed on the dicing die bonding sheet. The polyethylene film in this comparative example has a different tensile elastic modulus from the polyethylene film in comparative example 3. In this comparative example, the notch is formed in the laminated structure so as not to reach the base material and the pressure-sensitive adhesive layer, and the ratio of the notch depth T _{2 in the intermediate layer to the thickness T 1 of the intermediate layer.} (T ₂ / T ₁ ) was set to 0.25. The results are shown in Table 3.

[Comparative Example 8]
Except for the fact that a polypropylene (PP) film (Gunze Co., Ltd., thickness 80 μm) that has not been peeled off on both sides was used as an intermediate layer instead of a polyethylene film (thickness 80 μm) that had not been peeled off on both sides. A dicing die bonding sheet and a silicon chip were produced in the same manner as in Comparative Example 7, and the dicing die bonding sheet was evaluated. The results are shown in Table 3.

[Comparative Example 9]
Instead of a polyethylene film (thickness 80 μm) on which both sides have not been peeled off, a polybutylene terephthalate (PBT) film (manufactured by Aussie Film Co., Ltd., thickness 80 μm) on both sides has not been peeled off as an intermediate layer. A dicing die bonding sheet and a silicon chip were produced in the same manner as in Comparative Example 7 except for the above, and the dicing die bonding sheet was evaluated. The results are shown in Table 3.

[Comparative Example 10]
Except for the fact that a polyimide (PI) film (manufactured by Toray DuPont, thickness 50 μm) that is not peeled on both sides is used as an intermediate layer instead of a polyethylene film (thickness 80 μm) that is not peeled on both sides. Produced a dicing die bonding sheet and a silicon chip by the same method as in Comparative Example 7, and evaluated the dicing die bonding sheet. The results are shown in Table 3.

As is clear from the above results, in Examples 1 to 5, the generation of cut pieces can be suppressed during dicing, and process abnormalities occur between dicing and picking up the silicon chip with a film-like adhesive. Was also suppressed.

On the other hand, in Comparative Example 1, although the generation of cut pieces could be suppressed, the chip skipping could not be suppressed. It was speculated that this was due to the occurrence of excessive vibration in the dicing die bonding sheet at that time because a notch was formed in the base material during dicing.

In Comparative Example 2, although the generation of cut pieces could be suppressed, the silicon chip with a film-like adhesive could not be picked up. It was presumed that this was because the adhesive force between the adhesive layer and the film-like adhesive became excessively large because the intermediate layer was not provided in the dicing die bonding sheet.

In Comparative Examples 3 and 6 to 10, the generation of cut pieces could not be suppressed. This is because the constituent material of the resin layer of the intermediate layer is polyethylene (PE), polypropylene (PP), polybutylene terephthalate (PBT) or polyimide (PI), and the tensile elastic modulus of these intermediate layers is too low. It was speculated that the cause was an increase in the amount of cut pieces derived from the intermediate layer during dicing.
Further, in Comparative Examples 3 and 6, the pickup suitability was also slightly inferior. It was speculated that this was also due to the tensile elastic modulus of the intermediate layer being too low. However, in Comparative Example 6, the pickup suitability was better than that in Comparative Example 3 due to the difference in the thickness of the intermediate layer.

In Comparative Example 4, the generation of cut pieces could not be suppressed. The main reason for this is that a base material made of polyethylene was used and a notch was formed in this base material during dicing, so that the amount of cut pieces derived from the base material increased during dicing. It was guessed.

In Comparative Example 5, although the generation of cut pieces could be suppressed, the silicon chip with a film-like adhesive could not be picked up. As described above, in this Comparative Example, as in the case of Comparative Example 4, although a notch was formed in the base material during dicing, a result different from that of Comparative Example 4 was obtained. It was presumed that this was due to the fact that in this comparative example, a base material made of EMAA and subjected to electron beam irradiation treatment was used. Since such a base material is subjected to electron beam irradiation treatment, even if it is cut during dicing, the generation of cut pieces derived from the base material is suppressed, but on the other hand, it is made of EMAA, so that it can be combined with a film-like adhesive. The adhesive strength between them becomes excessively large.

In Comparative Examples 3, 4 and 6, the generation of cut pieces does not directly cause the deterioration of pickup suitability, but the amount of cut pieces generated depends on the conditions at the time of pickup, and the pickup is defective. It was a cause of occurrence.

The present invention can be used in the manufacture of semiconductor devices.

101 ... Dying die bonding sheet, 11 ... Base material, 11a ... First surface of base material, 12 ... Adhesive layer, 12a ... First surface of adhesive layer, 13 ... -Intermediate layer, 13a ... The first surface of the intermediate layer (the interface of the intermediate layer on the side provided with the film-like adhesive, or the contact surface of the intermediate layer with the film-like adhesive), 14 ... film-like Adhesive, 14a ... First surface of film-like adhesive, 201 ... Laminated structure, reference numeral 201'... Laminated structure after forming a notch, 9 ... Semiconductor chip, 9'... -Semiconductor wafer, 9a'... Surface of semiconductor wafer, 10 ... Notch, T ₁ ... Thickness of intermediate layer, T ₂ ... Depth of notch from the first surface of the intermediate layer, T ₃ ... Thickness of the adhesive layer, T ₄ ... Depth of the notch from the first surface of the adhesive layer

Claims (3)

A base material, a pressure-sensitive adhesive layer formed on the base material, an intermediate layer formed on the pressure-sensitive adhesive layer, and a film-like adhesive formed on the intermediate layer are provided.
The intermediate layer is made of resin and
The interface of the intermediate layer on the side provided with the film-like adhesive has been peeled off.
A dicing die bonding sheet having a tensile elastic modulus of 3500 MPa or more in the intermediate layer. The dicing die bonding sheet according to claim 1, wherein the adhesive force between the pressure-sensitive adhesive layer and the intermediate layer is 0.3 N / 25 mm or more. A step of forming a laminated structure in which a semiconductor wafer is provided on a surface of the film-like adhesive in the dicing die bonding sheet according to claim 1 or 2 opposite to the side on which the intermediate layer is provided. When,
The semiconductor wafer is divided into semiconductor chips by using a dicing blade to form a notch in the laminated structure that reaches the intermediate layer from the surface of the semiconductor wafer and does not reach the base material. A method for manufacturing a semiconductor chip, comprising a step of forming the semiconductor chip.

Images