JP6978890B2 - Manufacturing method of dicing die bonding sheet and semiconductor chip - Google Patents

Description

The present invention relates to a method for manufacturing a dicing die bonding sheet and a semiconductor chip.

The dicing die bonding sheet is, for example, configured by providing an adhesive layer and a film-like adhesive on a substrate in this order, and the film-like adhesive is attached to a semiconductor wafer for use (see Patent Documents 1 and 2). ). The semiconductor wafer fixed on the dicing die bonding sheet is divided together with the pressure-sensitive adhesive layer and the film-like adhesive by dicing and is separated into semiconductor chips. After that, the semiconductor chip having the film-like adhesive after cutting is separated from the pressure-sensitive adhesive layer and picked up. When the pressure-sensitive adhesive layer is curable, it is easy to pick up by curing the pressure-sensitive adhesive layer after dicing to reduce the adhesiveness. The picked up semiconductor chip is die-bonded to the circuit forming surface of the substrate by a film-like adhesive, and if necessary, one or more other semiconductor chips are laminated on the semiconductor chip and wire-bonded. The whole is sealed with resin. Finally, the target semiconductor device is manufactured using the semiconductor package thus obtained.

Japanese Unexamined Patent Publication No. 2011-198976 Japanese Unexamined Patent Publication No. 2015-005636

Dicing is performed, for example, by using a dicing blade and cutting the semiconductor wafer while rotating the dicing blade. However, in this dicing method, cutting chips derived from each layer such as a base material are generated. If the amount of cutting chips generated is large, the cutting chips tend to adhere to the side surface of the semiconductor chip or the circuit forming surface, and the semiconductor chip with such cutting chips still attached causes a process abnormality in the subsequent process. Can be. Further, when the configuration of the dicing die bonding sheet or the process from dicing to picking up is changed in order to reduce the amount of cutting chips generated, this change itself may cause a process abnormality.

When a base material obtained by subjecting an olefin resin such as an ethylene-methacrylic acid (EMAA) copolymer to an electron beam irradiation (EB) treatment is used, the olefin resin is crosslinked and the amount of cutting chips generated can be reduced. However, the olefin resin and the film-like adhesive are firmly adhered to each other, and the semiconductor chip cannot be picked up satisfactorily. Generally, the film is subjected to a thermosetting peeling treatment, but an olefin resin such as an ethylene-methacrylic acid (EMAA) copolymer that has been subjected to an electron beam irradiation (EB) treatment is subjected to a thermosetting peeling treatment. When the layer is to be provided, the base material is deformed due to insufficient heat resistance of the olefin resin.

Further, as in Patent Documents 1 and 2, when the pressure-sensitive adhesive layer is curable, the pressure-sensitive adhesive layer is cured after dying so that the pressure-sensitive adhesive layer and the film-like adhesive can be easily peeled off. However, it is difficult to adjust the adhesiveness between the pressure-sensitive adhesive layer and the film-like adhesive so that dicing can be performed without going through the curing treatment step of the pressure-sensitive adhesive layer. There is a demand for a dicing die bonding sheet that can be diced without going through a curing treatment step for the pressure-sensitive adhesive layer.

Therefore, the present invention provides a dicing die bonding sheet capable of reducing the amount of cutting chips generated during dicing using a dicing blade, and after dicing, a semiconductor chip provided with a film-like adhesive can be satisfactorily picked up. It is an object of the present invention to provide a method for manufacturing a semiconductor chip using this.

That is, the present invention provides the following dicing die bonding sheet and a method for manufacturing a semiconductor chip using the following dicing die bonding sheet.
(1) On a base material made of an olefin resin film subjected to electron beam irradiation treatment, an energy ray-cured peeling treatment layer provided on the base material, and the energy ray curing treatment peeling treatment layer. na and a provided a film-like adhesive is,
The total number of silicon atoms relative to the total number of total silicon atoms, total carbon atoms, and total oxygen atoms when the surface of the energy ray-cured stripping layer is measured by X-ray photoelectron spectroscopy (XPS). the ratio of Ru 5~25Atomic% der, the dicing die bonding sheet.

( 2 ) The dicing die bonding sheet according to (1 ) above, wherein the surface free energy of the peeling treatment layer on the film-like adhesive side at 23 ° C. is 37 to 46 mN / m.
( 3 ) The dicing die bonding sheet according to (1) or (2) above, wherein the peeling force between the peeling treatment layer and the film-like adhesive is 0.013 to 0.20 N / 25 mm.
( 4 ) The dicing die bonding sheet according to any one of (1) to (3 ) above, wherein the adhesive layer for a jig is provided on the film-shaped adhesive.

( 5 ) The step of preparing the dicing die bonding sheet according to any one of (1) to ( 4 ) above, and the side of the film-like adhesive opposite to the side on which the peeling treatment layer is provided. A step of forming a laminated structure in which a semiconductor wafer is provided on the surface of the semiconductor wafer and a dicing blade are used to form a notch in the laminated structure that reaches the peeling treatment layer from the surface of the semiconductor wafer. A method for manufacturing a semiconductor chip, comprising a step of dividing the semiconductor wafer to form a semiconductor chip.

According to the present invention, a dicing die bonding sheet capable of reducing the amount of cutting chips generated during dicing using a dicing blade and satisfactorily picking up a semiconductor chip provided with a film-like adhesive after dicing. And a method for manufacturing a semiconductor chip using the same.

It is sectional drawing which shows typically one Embodiment of the dicing die bonding sheet of this invention. It is sectional drawing which shows the other embodiment of the dicing die bonding sheet of this invention schematically. It is sectional drawing for schematically explaining one Embodiment of the manufacturing method of the semiconductor chip of this invention. It is sectional drawing for schematically explaining one Embodiment of the manufacturing method of the semiconductor device using the manufacturing method of the semiconductor chip of this invention.

<< Dicing Die Bonding Sheet >>
The dicing die bonding sheet of the present invention has a base material made of an electron beam irradiation-treated olefin resin film, an energy ray-cured peeling treatment layer provided on the base material, and the energy ray-curing treatment. It is provided with a film-like adhesive provided on the peeling treatment layer.
The dicing die bonding sheet of the present invention is a semiconductor chip (present) provided with dicing using a dicing blade of a semiconductor wafer (hereinafter, may be referred to as “blade dicing”) followed by a film-like adhesive after cutting. In the specification, it is suitable for picking up a "semiconductor chip with a film-like adhesive").

In blade dicing, the dicing blade is rotated to cut a semiconductor wafer. At this time, since the semiconductor wafer and at least a part of the dicing die bonding sheet are cut by the dicing blade, cutting chips are generated in the conventional dicing die bonding sheet. The cutting chips are generated from one or both layers of the semiconductor wafer and the dicing die bonding sheet, and may be suspended matter such as powder or fibrous, or completely from any of the above layers. It remains in the shape of a whiskers without being separated. If the amount of cutting chips generated is large, a part of the cutting chips tends to adhere to the circuit forming surface or the side surface of the semiconductor chip and remain. If the cutting chips remain in this way, the semiconductor chip with a film-like adhesive may not be picked up normally, which causes a pickup failure. Further, even if it can be picked up, the semiconductor device manufactured with the cutting chips remaining may not function normally.

On the other hand, the dicing die bonding sheet of the present invention can reduce the amount of cutting chips generated during dicing using a dicing blade by using a base material made of an olefin resin film that has been subjected to electron beam irradiation treatment. .. Then, since the energy ray-cured peeling treatment layer provided on the substrate and the film-like adhesive provided on the energy ray-curing peeling treatment layer are provided, the adhesive is adhered after dicing. It is possible to suppress the occurrence of pick-up defects in the semiconductor chip with a film-like adhesive without going through the curing treatment step of the agent layer.
Hereinafter, each layer constituting the dicing die bonding sheet of the present invention will be described first.

<Base material>
The base material is made of an olefin resin film that has been subjected to electron beam irradiation treatment. The olefin resin film forms crosslinks and becomes stronger by electron beam irradiation treatment, so that the amount of cutting chips generated when dicing a semiconductor wafer fixed on a dicing die bonding sheet using this is reduced. Can be reduced.

The olefin-based resin film is not limited as long as it has the property of forming crosslinks and becoming strong by electron beam irradiation treatment, and is not limited to ethylene-methacrylic acid (EMAA) copolymer film and ethylene- (meth) acrylate. (EMMA) Copolymer film, ethylene propylene rubber film, polyethylene film, polypropylene film and the like can be mentioned. Ethylene-methacrylic acid (EMAA) copolymer film and ethylene- (meth) acrylate (EMMA) copolymer film are preferable, and ethylene-methacrylic acid (EMAA) copolymer film is preferable from the viewpoint of chip control and expandability. Especially preferable.

The thickness of the base material can be appropriately selected depending on the intended purpose, but is preferably 50 to 300 μm, more preferably 60 to 150 μm.
Here, the "thickness of the base material" means the thickness of the entire base material, and for example, the thickness of the base material composed of a plurality of layers means the total thickness of all the layers constituting the base material. means.

The base material may have an antistatic coat layer on the side opposite to the peeling treatment layer, and when the dicing die bonding sheet is laminated and stored, the base material adheres to another sheet or It may have a layer or the like for preventing the base material from adhering to the adsorption table.

<Peeling treatment layer treated with energy ray hardening>
As the peeling treatment layer, an energy ray-hardening treated peeling treatment layer generally used for imparting peelability of the adhesive layer or the pressure-sensitive adhesive layer can be used. Since the exfoliation-treated layer has been subjected to energy ray-curing treatment, the heat history of the base material is smaller than that of the heat-curing treatment, and the base material can be cured at a low temperature. Therefore, thermal deformation of the base material is suppressed. can do.
In the present specification, the "energy beam" means an electromagnetic wave or a charged particle beam having an energy quantum, and examples thereof include ultraviolet rays, radiation, and electron beams. Ultraviolet rays can be irradiated by using, for example, a high-pressure mercury lamp, a fusion H lamp, a xenon lamp, a black light, an LED lamp, or the like as an ultraviolet source. The electron beam can be irradiated with an electron beam generated by an electron beam accelerator or the like.
Further, in the present specification, "energy ray curable" means a property of being cured by irradiating with energy rays.

For example, a release agent solution prepared by dissolving an energy ray-curable release agent such as a commercially available ultraviolet curable release agent in an appropriate solvent is applied onto the electron beam irradiation-treated substrate, dried, and then dried. The release agent composition can be cured by irradiating with energy rays to form an energy ray-cured release-treated layer on the substrate.

The total number of silicon atoms relative to the total number of total silicon atoms, total carbon atoms, and total oxygen atoms when the surface of the energy ray-cured stripping layer is measured by X-ray photoelectron spectroscopy (XPS). The ratio is preferably 5 to 25 Atomic%, more preferably 7.5 to 25 Atomic%, and particularly preferably 10 to 20 Atomic%. By using a silicone-type ultraviolet curable release agent, a release-treated layer having an appropriate amount of silicon can be obtained, and the surface free energy and energy ray-curing treatment of the surface of the release-treated layer on the film-like adhesive side are performed. The peeling force between the peeling treatment layer and the film-like adhesive can be adjusted.
Here, the ratio of the total number of silicon atoms to the total number of total silicon atoms, total carbon atoms, and total oxygen atoms is calculated by the following equation (1).
[Ratio of total silicon atoms (Atomic%)] = [Ratio of total silicon atoms (Atomic%)] / {[Ratio of total carbon atoms (Atomic%)] + [Ratio of total oxygen atoms (Atomic%)] )] + [Ratio of total number of silicon atoms (Atomic%)]} x 100 ... (1)

The surface free energy of the energy ray-hardened peeling-treated layer on the surface of the film-like adhesive side at 23 ° C. is preferably 37 to 46 mN / m, more preferably 38 to 45 mN / m. , 39-44 mN / m is particularly preferable. By setting the surface free energy of the surface of the peeling treatment layer on the film-like adhesive side to the above lower limit value or more, it is possible to prevent chip skipping during dicing using a dicing blade, and it is equal to or less than the above upper limit value. By setting to, the semiconductor chip with a film-like adhesive can be picked up satisfactorily.

The peeling force between the energy ray-cured peeling treatment layer and the film-like adhesive is preferably 0.013 to 0.20 N / 25 mm, preferably 0.015 to 0.15 N / 25 mm. It is more preferably 0.020 to 0.10 N / 25 mm, and particularly preferably 0.020 to 0.10 N / 25 mm. By setting the peeling force between the peeling treatment layer and the film-like adhesive to be equal to or higher than the above lower limit, chip skipping can be suppressed during dicing using a dicing blade, and the setting is set to be equal to or lower than the above upper limit. By doing so, the semiconductor chip with a film-like adhesive after dicing can be easily separated from the peeling treatment layer subjected to the energy ray curing treatment and picked up. Further, at this time, it is suppressed that the semiconductor chip with the film-shaped adhesive is picked up while a part of the peeling-treated layer that has been subjected to the energy ray-curing treatment adheres to the film-shaped adhesive and remains. Further, since the peeling force is 100 mN / 25 mm or less, when a semiconductor chip with a film-like adhesive is pushed up and pulled away from the peeling treatment layer for picking up, it can be easily picked up with a small pushing amount, for example, a semiconductor chip. So-called chipping, in which cracks and chips occur, is further suppressed.

In the present specification, the "peeling force between the peeling-treated layer and the film-like adhesive" means the peeling force of the peeling-treated layer at room temperature (23 ° C.) unless otherwise specified.

In the present invention, the peeling force (N / 25 mm) can be measured by the following method.
That is, the dicing die bonding sheet having a width of 25 mm and an arbitrary length is produced. Then, at room temperature (for example, 23 ° C.), the dicing die bonding sheet is attached to the fixing substrate with a film-like adhesive.
Here, the "fixing base material" may be any as long as it can firmly fix the film-like adhesive of the dicing die bonding sheet, and the shape may be a film-like shape or a sheet-like shape. Other shapes may be used, for example, an adhesive base material having an adhesive surface such as a PVC plate to which a double-sided tape is attached as a fixing surface of a film-like adhesive (in other words, a dicing die bonding sheet). May be good. It may be a Si wafer to which a double-sided tape is attached, a simple PVC plate, or a Si wafer.
Next, at room temperature (for example, 23 ° C.), the laminate of the base material and the peeling treatment layer is formed from the film-like adhesive, and the surfaces of the film-like adhesive and the peeling treatment layer that have been in contact with each other are at an angle of 180 °. As is to be done, peeling is performed at a peeling speed of 300 mm / min, so-called 180 ° peeling. The peeling force at this time is measured, and the measured value is defined as the peeling force (N / 25 mm). The length of the dicing die bonding sheet used for the measurement is not particularly limited as long as the peeling force can be stably measured.

The peeling force between the peeling treatment layer and the film-like adhesive can be appropriately adjusted by, for example, adjusting the type and amount of the components contained in the peeling treatment layer, the thickness of the peeling treatment layer, and the like. For example, the peeling force can be easily adjusted by adjusting the type of the structural unit of the polymer compound constituting the peeling treatment layer, which is a component contained in the peeling treatment layer, and the content ratio thereof. Further, the peeling force can be easily adjusted by adjusting the content of the polymer compound or the cross-linking agent constituting the peeling treatment layer. However, these adjustment methods are only an example.

The thickness of the energy ray-hardened peeling treatment layer is preferably 5 μm or less, more preferably 2 μm or less, and particularly preferably 0.5 μm or less. Since the energy ray-cured peeling treatment layer can be thinned in this way, the peeling treatment layer is formed on a substrate made of an olefin resin film such as an ethylene-methacrylic acid copolymer that has been subjected to electron beam irradiation treatment. When it is provided, the energy consumption for curing with ultraviolet rays can be reduced. The thickness of the energy ray-hardened peeling-treated layer may be 10 nm or more, 20 nm or more, or 30 nm or more.

<Film-like adhesive>
The film-like adhesive is not particularly limited as long as the effect of the present invention is not impaired, and known ones can be appropriately used.

The film-shaped adhesive is curable, preferably thermosetting, and preferably pressure-sensitive adhesive. The film-like adhesive having both thermosetting property and pressure-sensitive adhesive property can be attached by lightly pressing against various adherends in an uncured state. Further, the film-like adhesive may be one that can be attached to various adherends by heating and softening the adhesive. The film-like adhesive eventually becomes a cured product having high impact resistance by curing, and this cured product can maintain sufficient adhesive properties even under severe high temperature and high humidity conditions.

The thickness of the film-like adhesive is not particularly limited, but is preferably 1 to 50 μm, more preferably 3 to 40 μm. When the thickness of the film-shaped adhesive is at least the above lower limit value, higher adhesive force to the adherend (semiconductor chip) can be obtained. On the other hand, when the thickness of the film-like adhesive is not more than the upper limit, the film-like adhesive can be cut more easily in the division step described later, and cutting chips are generated during dicing using a dicing blade. The amount can be further reduced.

Here, the "thickness of the film-like adhesive" means the thickness of the entire film-like adhesive, and for example, the thickness of the film-like adhesive composed of a plurality of layers is all that constitute the film-like adhesive. Means the total thickness of the layers of.

[Adhesive composition]
The film-like adhesive can be formed by using an adhesive composition containing the constituent material. For example, the film-like adhesive can be formed on a target portion by applying the adhesive composition to the surface to be formed of the film-like adhesive and drying it if necessary. The ratio of the contents of the components that do not vaporize at room temperature in the adhesive composition is usually the same as the ratio of the contents of the components of the film-like adhesive. Here, "normal temperature" is as described above.

The coating of the adhesive composition may be carried out by a known method, for example, an air knife coater, a blade coater, a bar coater, a gravure coater, a roll coater, a roll knife coater, a curtain coater, a die coater, a knife coater, and a screen coater. , A method using various coaters such as a Meyer bar coater and a knife coater.

The drying conditions of the adhesive composition are not particularly limited, but when the adhesive composition contains a solvent described later, it is preferably heat-dried. In this case, for example, at 70 to 130 ° C. for 10 seconds to dry. It is preferable to dry under the condition of 5 minutes.

Preferred adhesive compositions include, for example, those containing a polymer component (a) and an epoxy-based thermosetting resin (b). Hereinafter, each component will be described.

(Polymer component (a))
The polymer component (a) is a component that can be regarded as being formed by a polymerization reaction of a polymerizable compound, and imparts film-forming property, flexibility, etc. to the film-like adhesive and is attached to an object to be bonded such as a semiconductor chip. It is a polymer compound for improving adhesiveness (stickability). Further, the polymer component (a) is also a component that does not correspond to the epoxy resin (b1) and the thermosetting agent (b2) described later. However, even if it is a polymerizable compound having a glycidyl group, a compound obtained by reacting and polymerizing a polymerizable group other than the glycidyl group, for example, a component formed by polymerizing glycidyl (meth) acrylate is a polymer component. It is regarded as (a).

As the polymer component (a), one type may be used alone, two or more types may be used in combination, and when two or more types are used in combination, the combination and ratio thereof can be arbitrarily selected.

Examples of the polymer component (a) include acrylic resin (resin having (meth) acryloyl group), polyester, urethane resin (resin having urethane bond), acrylic urethane resin, and silicone resin (having siloxane bond). (Resin), rubber-based resin (resin having a rubber structure), phenoxy resin, thermosetting polyimide and the like, and acrylic resin is preferable.

In addition, in this specification, "(meth) acrylic acid" is a concept including both "acrylic acid" and "methacrylic acid". The same applies to terms similar to (meth) acrylic acid, for example, "(meth) acrylate" is a concept that includes both "acrylate" and "methacrylate", and is referred to as "(meth) acryloyl group". Is a concept that includes both "acryloyl group" and "methacryloyl group".

Examples of the acrylic resin in the polymer component (a) include known acrylic polymers.
The weight average molecular weight (Mw) of the acrylic resin is preferably 1000 to 2000000, and more preferably 100,000 to 1500,000. When the weight average molecular weight of the acrylic resin is within such a range, it becomes easy to adjust the adhesive force of the film-like adhesive before curing to the semiconductor wafer.
On the other hand, when the weight average molecular weight of the acrylic resin is at least the above lower limit value, the shape stability (stability over time during storage) of the film-like adhesive is improved. Further, when the weight average molecular weight of the acrylic resin is not more than the above upper limit value, the film-like adhesive can easily follow the uneven surface of the adherend, and voids or the like can be formed between the adherend and the film-like adhesive. Is more suppressed.
In the present specification, the "weight average molecular weight" is a polystyrene-equivalent value measured by a gel permeation chromatography (GPC) method unless otherwise specified.

The glass transition temperature (Tg) of the acrylic resin is preferably -60 to 70 ° C, more preferably -30 to 50 ° C. When the Tg of the acrylic resin is not more than the above upper limit value, the adhesive strength between the film-like adhesive and the semiconductor chip is improved.

Examples of the (meth) acrylic acid ester constituting the acrylic resin include methyl (meth) acrylic acid, ethyl (meth) acrylic acid, n-propyl (meth) acrylic acid, isopropyl (meth) acrylic acid, and (meth) acrylic acid. ) N-butyl acrylate, isobutyl (meth) acrylate, sec-butyl (meth) acrylate, tert-butyl (meth) acrylate, pentyl (meth) acrylate, hexyl (meth) acrylate, (meth) acrylic Heptyl acid, 2-ethylhexyl (meth) acrylate, isooctyl (meth) acrylate, n-octyl (meth) acrylate, n-nonyl (meth) acrylate, isononyl (meth) acrylate, decyl (meth) acrylate , (Meta) undecyl acrylate, (meth) dodecyl acrylate ((meth) lauryl acrylate), (meth) tridecyl acrylate, (meth) tetradecyl acrylate ((meth) myristyl acrylate), (meth) acrylate The alkyl groups constituting the alkyl ester such as pentadecyl, hexadecyl (meth) acrylate (palmicyl (meth) acrylate), heptadecyl (meth) acrylate, octadecyl (meth) acrylate (stearyl (meth) acrylate), etc. (Meta) acrylic acid alkyl ester having a chain structure with 1 to 18 carbon atoms;
(Meta) Acrylic acid cycloalkyl esters such as (meth) acrylate isobornyl, (meth) acrylate dicyclopentanyl;
(Meta) Acrylic acid aralkyl esters such as benzyl (meth) acrylic acid;
(Meta) Acrylic acid cycloalkenyl ester such as (meth) acrylic acid dicyclopentenyl ester;
(Meta) Acrylic acid cycloalkenyloxyalkyl ester such as (meth) acrylic acid dicyclopentenyloxyethyl ester;
(Meta) Acrylic acid imide;
A glycidyl group-containing (meth) acrylic acid ester such as glycidyl (meth) acrylic acid;
(Meta) hydroxymethyl acrylate, (meth) 2-hydroxyethyl acrylate, (meth) 2-hydroxypropyl acrylate, (meth) 3-hydroxypropyl acrylate, (meth) 2-hydroxybutyl acrylate, (meth) ) Hydroxyl-containing (meth) acrylic acid esters such as 3-hydroxybutyl acrylate and 4-hydroxybutyl (meth) acrylate;
Examples thereof include substituted amino group-containing (meth) acrylic acid esters such as N-methylaminoethyl (meth) acrylic acid. Here, the "substituted amino group" means a group in which one or two hydrogen atoms of an amino group are substituted with a group other than a hydrogen atom.

The acrylic resin is, for example, one or more monomers selected from (meth) acrylic acid, itaconic acid, vinyl acetate, acrylonitrile, styrene, N-methylolacrylamide and the like, in addition to the (meth) acrylic acid ester. May be copolymerized with each other.

The monomer constituting the acrylic resin may be only one kind, may be two or more kinds, and when there are two or more kinds, the combination and ratio thereof can be arbitrarily selected.

The acrylic resin may have a functional group capable of binding to other compounds such as a vinyl group, a (meth) acryloyl group, an amino group, a hydroxyl group, a carboxy group and an isocyanate group. The functional group of the acrylic resin may be bonded to another compound via a cross-linking agent (f) described later, or may be directly bonded to another compound without a cross-linking agent (f). .. When the acrylic resin is bonded to other compounds by the functional group, the reliability of the package obtained by using the dicing die bonding sheet tends to be improved.

In the present invention, as the polymer component (a), a thermoplastic resin other than the acrylic resin (hereinafter, may be simply abbreviated as “thermoplastic resin”) is used alone without using the acrylic resin. It may be used in combination with an acrylic resin. By using the thermoplastic resin, the film-like adhesive can easily follow the uneven surface of the adherend, and the generation of voids and the like between the adherend and the film-like adhesive may be further suppressed. ..

The weight average molecular weight of the thermoplastic resin is preferably 1000 to 100,000, more preferably 3000 to 80000.

The glass transition temperature (Tg) of the thermoplastic resin is preferably -30 to 150 ° C, more preferably -20 to 120 ° C.

Examples of the thermoplastic resin include polyester, polyurethane, phenoxy resin, polybutene, polybutadiene, polystyrene and the like.

The thermoplastic resin contained in the adhesive composition and the film-like adhesive may be of only one type, may be of two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected.

In the adhesive composition, the ratio of the content of the acrylic resin as the polymer component (a) to the total content of all the components other than the solvent (that is, the polymer component (a) of the film-like adhesive. The content of a certain acrylic resin) is preferably 5 to 40% by mass, more preferably 7 to 25% by mass.

In the adhesive composition, the ratio of the content of the polymer component (a) to the total content of all the components other than the solvent (that is, the content of the polymer component (a) of the film-like adhesive) is the polymer. Regardless of the type of the component (a), it is preferably 5 to 85% by mass, more preferably 7 to 80% by mass.

While the above-mentioned effects can be obtained by using the thermoplastic resin, when the film-like adhesive before curing is exposed to a high temperature, its hardness decreases, and the film-like adhesive is in an uncured or semi-cured state. There is a concern that the wire bonding suitability of the adhesive may decrease. Therefore, it is preferable to set the content of the polymer component (a) in the adhesive composition in consideration of such an influence.

(Epoxy-based thermosetting resin (b))
The epoxy-based thermosetting resin (b) is composed of an epoxy resin (b1) and a thermosetting agent (b2).
The epoxy-based thermosetting resin (b) contained in the adhesive composition and the film-like adhesive may be of only one type, may be of two or more types, and when there are two or more types, the combination and ratio thereof are arbitrary. Can be selected.

-Epoxy resin (b1)
Examples of the epoxy resin (b1) include known ones, such as polyfunctional epoxy resin, biphenyl compound, bisphenol A diglycidyl ether and its hydrogenated product, orthocresol novolac epoxy resin, dicyclopentadiene type epoxy resin, and the like. Examples thereof include biphenyl type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenylene skeleton type epoxy resin, and other bifunctional or higher functional epoxy compounds.

As the epoxy resin (b1), an epoxy resin having an unsaturated hydrocarbon group may be used. Epoxy resins having unsaturated hydrocarbon groups have higher compatibility with acrylic resins than epoxy resins having no unsaturated hydrocarbon groups. Therefore, by using an epoxy resin having an unsaturated hydrocarbon group, the reliability of the package obtained by using the dicing die bonding sheet is improved.

Examples of the epoxy resin having an unsaturated hydrocarbon group include a compound obtained by converting a part of the epoxy group of the polyfunctional epoxy resin into a group having an unsaturated hydrocarbon group. Such a compound can be obtained, for example, by subjecting an epoxy group to an addition reaction of (meth) acrylic acid or a derivative thereof. In the present specification, the term "derivative" means a compound in which one or more groups of the original compound are substituted with other groups (substituents) unless otherwise specified. Here, the "group" includes not only an atomic group formed by bonding a plurality of atoms but also one atom.

Examples of the epoxy resin having an unsaturated hydrocarbon group include a compound in which a group having an unsaturated hydrocarbon group is directly bonded to an aromatic ring or the like constituting the epoxy resin.
The unsaturated hydrocarbon group is a polymerizable unsaturated group, and specific examples thereof include an ethenyl group (vinyl group), a 2-propenyl group (allyl group), a (meth) acryloyl group, and a (meth) group. Examples thereof include an acrylamide group, and an acryloyl group is preferable.

The weight average molecular weight of the epoxy resin (b1) is not particularly limited, but is preferably 300 to 30,000 from the viewpoint of the curability of the film-shaped adhesive and the strength and heat resistance of the film-shaped adhesive after curing.
The epoxy equivalent of the epoxy resin (b1) is preferably 100 to 1000 g / eq, more preferably 150 to 800 g / eq.

As the epoxy resin (b1), one type may be used alone, two or more types may be used in combination, and when two or more types are used in combination, the combination and ratio thereof can be arbitrarily selected.

-Thermosetting agent (b2)
The thermosetting agent (b2) functions as a curing agent for the epoxy resin (b1).
Examples of the thermosetting agent (b2) include compounds having two or more functional groups capable of reacting with an epoxy group in one molecule. Examples of the functional group include a phenolic hydroxyl group, an alcoholic hydroxyl group, an amino group, a carboxy group, a group in which an acid group is annealed, and the like, and the phenolic hydroxyl group, an amino group, or an acid group is annealed. It is preferably a group, more preferably a phenolic hydroxyl group or an amino group.

Among the thermosetting agents (b2), examples of the phenol-based curing agent having a phenolic hydroxyl group include polyfunctional phenol resin, biphenol, novolak type phenol resin, dicyclopentadiene type phenol resin, biphenyl type phenol resin, and aralkyl type phenol. Examples include resin.
Among the thermosetting agents (B2), examples of the amine-based curing agent having an amino group include dicyandiamide (hereinafter, may be abbreviated as "DICY") and the like.

The thermosetting agent (b2) may have an unsaturated hydrocarbon group.
The thermosetting agent (b2) having an unsaturated hydrocarbon group is, for example, a compound in which a part of the hydroxyl group of the phenol resin is replaced with a group having an unsaturated hydrocarbon group, which is not suitable for the aromatic ring of the phenol resin. Examples thereof include compounds in which a group having a saturated hydrocarbon group is directly bonded.
The unsaturated hydrocarbon group in the thermosetting agent (b2) is the same as the unsaturated hydrocarbon group in the above-mentioned epoxy resin having an unsaturated hydrocarbon group.

When a phenolic curing agent is used as the thermosetting agent (b2), the thermosetting agent (b2) is softened because it is easy to adjust the adhesive force of the film-like adhesive before curing to the semiconductor wafer. Those having a high point or glass transition temperature are preferable.

The weight average molecular weight of the thermosetting agent (b2) is preferably, for example, 60 to 30,000.

As the thermosetting agent (b2), one type may be used alone, two or more types may be used in combination, and when two or more types are used in combination, the combination and ratio thereof can be arbitrarily selected.

In the adhesive composition and the film-like adhesive, the content of the thermosetting agent (b2) is preferably 0.1 to 500 parts by mass with respect to 100 parts by mass of the content of the epoxy resin (b1). It is more preferably 1 to 200 parts by mass. When the content of the thermosetting agent (b2) is at least the lower limit value, the curing of the film-like adhesive becomes easier to proceed. Further, when the content of the thermosetting agent (b2) is not more than the upper limit value, the hygroscopicity of the film-shaped adhesive is reduced, and the reliability of the package obtained by using the dicing die bonding sheet is further improved. improves.

In the adhesive composition and the film-like adhesive, the content of the epoxy-based thermosetting resin (b) (total content of the epoxy resin (b1) and the thermosetting agent (b2)) is the content of the polymer component (a). With respect to 100 parts by mass of the content, 5 to 1000 parts by mass is preferable, and 10 to 870 parts by mass is more preferable.

In addition to the polymer component (a) and the epoxy-based thermosetting resin (b), the film-like adhesive contains other components that do not fall under these, if necessary, in order to improve its various physical properties. You may be doing it.
Preferred other components contained in the film-like adhesive include, for example, a curing accelerator (c), a filler (d), a coupling agent (e), a cross-linking agent (f), and an energy ray-curable resin. (G), a photopolymerization initiator (h), a general-purpose additive (i) and the like can be mentioned.

(Curing accelerator (c))
The curing accelerator (c) is a component for adjusting the curing rate of the adhesive composition.
Preferred curing accelerators (c) include, for example, tertiary amines such as triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris (dimethylaminomethyl) phenol; 2-methylimidazole, 2-phenylimidazole. , 2-Phenyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole and other imidazoles (one or more hydrogen atoms other than hydrogen atom) (Imidazole substituted with an organic group); organic phosphines such as tributylphosphine, diphenylphosphine, triphenylphosphine (phosphine in which one or more hydrogen atoms are substituted with an organic group); tetraphenylphosphonium tetraphenylborate, triphenylphosphine. Examples thereof include tetraphenylboron salts such as tetraphenylborate.

The curing accelerator (c) contained in the adhesive composition and the film-like adhesive may be only one kind, may be two or more kinds, and when there are two or more kinds, the combination and ratio thereof can be arbitrarily selected. ..

When the curing accelerator (c) is used, the content of the curing accelerator (c) in the adhesive composition and the film-shaped adhesive is 100 parts by mass with respect to the content of the epoxy-based thermosetting resin (b). , 0.01 to 10 parts by mass, more preferably 0.1 to 5 parts by mass. When the content of the curing accelerator (c) is at least the lower limit value, the effect of using the curing accelerator (c) is more remarkable. Further, when the content of the curing accelerator (c) is not more than the above upper limit value, for example, the highly polar curing accelerator (c) is applied to the adherend in the film-like adhesive under high temperature and high humidity conditions. The effect of suppressing segregation by moving to the adhesive interface side with the dicing die is enhanced, and the reliability of the package obtained by using the dicing die bonding sheet is further improved.

(Filler (d))
The film-like adhesive contains the filler (d), which makes it easy to adjust the coefficient of thermal expansion. By optimizing this coefficient of thermal expansion for the object to which the film-like adhesive is applied, dicing is performed. The reliability of the package obtained by using the die bonding sheet is further improved. Further, by containing the filler (d) in the film-shaped adhesive, it is possible to reduce the hygroscopicity of the film-shaped adhesive after curing and improve the heat dissipation.

The filler (d) may be either an organic filler or an inorganic filler, but is preferably an inorganic filler.
Preferred inorganic fillers include, for example, powders of silica, alumina, talc, calcium carbonate, titanium white, red iron oxide, silicon carbide, boron nitride and the like; spherical beads of these inorganic fillers; surface modification of these inorganic fillers. Goods; Single crystal fibers of these inorganic fillers; Glass fibers and the like.
Among these, the inorganic filler is preferably silica or alumina.

The filler (d) contained in the adhesive composition and the film-like adhesive may be of only one type, may be of two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected.

When the filler (d) is used, the ratio of the content of the filler (d) to the total content of all the components other than the solvent in the adhesive composition (that is, the filler (d) of the film-like adhesive). The content) is preferably 5 to 80% by mass, more preferably 7 to 60% by mass. When the content of the filler (d) is in such a range, the above-mentioned coefficient of thermal expansion can be easily adjusted.

(Coupling agent (e))
By containing the coupling agent (e) in the film-like adhesive, the adhesiveness and adhesion to the adherend are improved. Further, when the film-like adhesive contains the coupling agent (e), the cured product has improved water resistance without impairing the heat resistance. The coupling agent (e) has a functional group capable of reacting with an inorganic compound or an organic compound.

The coupling agent (e) is preferably a compound having a functional group capable of reacting with the functional group of the polymer component (a), the epoxy thermosetting resin (b), etc., and is a silane coupling agent. Is more preferable.
Preferred silane coupling agents include, for example, 3-glycidyloxypropyltrimethoxysilane, 3-glycidyloxypropylmethyldiethoxysilane, 3-glycidyloxypropyltriethoxysilane, 3-glycidyloxymethyldiethoxysilane, 2-. (3,4-Epoxycyclohexyl) ethyltrimethoxysilane, 3-methacryloyloxypropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3- (2-aminoethylamino) propyltrimethoxysilane, 3- (2-amino) Ethylamino) propylmethyldiethoxysilane, 3- (phenylamino) propyltrimethoxysilane, 3-anilinopropyltrimethoxysilane, 3-ureidopropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-mercaptopropylmethyl Examples thereof include dimethoxysilane, bis (3-triethoxysilylpropyl) tetrasulfane, methyltrimethoxysilane, methyltriethoxysilane, vinyltrimethoxysilane, vinyltriacetoxysilane, imidazolesilane, and epoxy group-containing oligomers.

The coupling agent (e) contained in the adhesive composition and the film-like adhesive may be of only one type, of two or more types, and when there are two or more types, the combination and ratio thereof can be arbitrarily selected. ..

When the coupling agent (e) is used, the content of the coupling agent (e) in the adhesive composition and the film-like adhesive is the total of the polymer component (a) and the epoxy-based thermosetting resin (b). The content is preferably 0.03 to 20 parts by mass, more preferably 0.05 to 10 parts by mass, and particularly preferably 0.1 to 5 parts by mass with respect to 100 parts by mass.
When the content of the coupling agent (e) is at least the lower limit value, the dispersibility of the filler (d) in the resin is improved, the adhesiveness of the film-like adhesive to the adherend is improved, and the like. , The effect of using the coupling agent (e) is more remarkable. Further, when the content of the coupling agent (e) is not more than the upper limit value, the generation of outgas is further suppressed.

(Crosslinking agent (f))
As the polymer component (a), a polymer having a functional group such as a vinyl group capable of binding to another compound, a (meth) acryloyl group, an amino group, a hydroxyl group, a carboxy group, an isocyanate group, etc., such as the above-mentioned acrylic resin, is used. When used, the adhesive composition and the film-like adhesive may contain a cross-linking agent (f) for binding the functional group to another compound for cross-linking. By cross-linking with the cross-linking agent (f), the initial adhesive force and the cohesive force of the film-like adhesive can be adjusted.

Examples of the cross-linking agent (f) include an organic polyvalent isocyanate compound, an organic polyvalent imine compound, a metal chelate-based cross-linking agent (a cross-linking agent having a metal chelate structure), an aziridine-based cross-linking agent (a cross-linking agent having an aziridinyl group), and the like. Can be mentioned.

Examples of the organic polyvalent isocyanate compound include an aromatic polyhydric isocyanate compound, an aliphatic polyhydric isocyanate compound, and an alicyclic polyvalent isocyanate compound (hereinafter, these compounds are collectively referred to as “aromatic polyvalent isocyanate compound and the like”. (May be abbreviated); Trimerics such as the aromatic polyvalent isocyanate compound, isocyanurates and adducts; terminal isocyanate urethane prepolymer obtained by reacting the aromatic polyvalent isocyanate compounds and the like with a polyol compound. And so on. The "adduct" is a low content of the aromatic polyhydric isocyanate compound, the aliphatic polyhydric isocyanate compound or the alicyclic polyvalent isocyanate compound, and ethylene glycol, propylene glycol, neopentyl glycol, trimethylolpropane or castor oil. It means a reaction product with a molecularly active hydrogen-containing compound, and examples thereof include a xylylene diisocyanate adduct of trimethylol propane as described later. Further, the "terminal isocyanate urethane prepolymer" is as described above.

More specifically, as the organic polyvalent isocyanate compound, for example, 2,4-tolylene diisocyanate; 2,6-tolylene diisocyanate; 1,3-xylylene diisocyanate; 1,4-xylene diisocyanate; diphenylmethane-4. , 4'-diisocyanate; diphenylmethane-2,4'-diisocyanate; 3-methyldiphenylmethane diisocyanate; hexamethylene diisocyanate; isophorone diisocyanate; dicyclohexylmethane-4,4'-diisocyanate; dicyclohexylmethane-2,4'-diisocyanate; trimethylol Examples thereof include compounds in which one or more of tolylene diisocyanate, hexamethylene diisocyanate and xylylene diisocyanate are added to all or some hydroxylates of a polyol such as propane; lysine diisocyanate and the like.

Examples of the organic polyvalent imine compound include N, N'-diphenylmethane-4,4'-bis (1-aziridinecarboxyamide), trimethylolpropane-tri-β-aziridinyl propionate, and tetramethylolmethane. Examples thereof include -tri-β-aziridinyl propionate, N, N'-toluene-2,4-bis (1-aziridinecarboxyamide) triethylene melamine and the like.

When an organic multivalent isocyanate compound is used as the cross-linking agent (f), it is preferable to use a hydroxyl group-containing polymer as the polymer component (a). When the cross-linking agent (f) has an isocyanate group and the polymer component (a) has a hydroxyl group, the reaction between the cross-linking agent (f) and the polymer component (a) facilitates the cross-linking structure of the film-like adhesive. Can be introduced in.

The cross-linking agent (f) contained in the adhesive composition and the film-like adhesive may be only one kind, may be two or more kinds, and when there are two or more kinds, the combination and ratio thereof can be arbitrarily selected.

When the cross-linking agent (f) is used, the content of the cross-linking agent (f) in the adhesive composition is 0.01 to 20 parts by mass with respect to 100 parts by mass of the content of the polymer component (a). It is preferably 0.1 to 10 parts by mass, and particularly preferably 0.5 to 5 parts by mass. When the content of the cross-linking agent (f) is at least the lower limit value, the effect of using the cross-linking agent (f) is more remarkable. Further, when the content of the cross-linking agent (f) is not more than the upper limit value, the excessive use of the cross-linking agent (f) is suppressed.

(Energy ray curable resin (g))
Since the film-like adhesive contains the energy ray curable resin (g), its characteristics can be changed by irradiation with energy rays.

The energy ray curable resin (g) has a property of being cured (polymerized) by irradiating with energy rays.
Examples of the energy ray-curable compound include compounds having at least one polymerizable double bond in the molecule, and acrylate compounds having a (meth) acryloyl group are preferable.

Examples of the acrylate-based compound include trimethylolpropanetri (meth) acrylate, tetramethylolmethanetetra (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, and dipentaerythritol monohydroxypenta (dipentaerythritol monohydroxypenta). Chain aliphatic skeleton-containing (meth) acrylates such as meta) acrylates, dipentaerythritol hexa (meth) acrylates, 1,4-butylene glycol di (meth) acrylates, and 1,6-hexanediol di (meth) acrylates; Cyclic aliphatic skeleton-containing (meth) acrylates such as cyclopentanyldi (meth) acrylates and tricyclodecanedimethylol diacrylates; polyalkylene glycol (meth) acrylates such as polyethylene glycol di (meth) acrylates; oligoesters (meth) Examples thereof include acrylate; urethane (meth) acrylate oligomer; epoxy-modified (meth) acrylate; polyether (meth) acrylate other than the polyalkylene glycol (meth) acrylate; and itaconic acid oligomer.

The weight average molecular weight of the energy ray-curable resin (g) is preferably 100 to 30,000.

The energy ray-curable resin (g) contained in the adhesive composition may be of only one type, may be two or more types, and when two or more types are used, the combination and ratio thereof can be arbitrarily selected.

In the adhesive composition, the content of the energy ray-curable resin (g) is preferably 1 to 95% by mass, more preferably 3 to 90% by mass, and 5 to 85% by mass. Is particularly preferable.

(Photopolymerization Initiator (h))
When the adhesive composition contains the energy ray-curable resin (g), even if the photopolymerization initiator (h) is contained in order to efficiently proceed with the polymerization reaction of the energy ray-curable resin (g). good.

Examples of the photopolymerization initiator (h) in the adhesive composition include benzoins such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, methyl benzoin benzoate and benzoin dimethyl ketal. Compounds; Acetphenone compounds such as acetophenone, 2-hydroxy-2-methyl-1-phenyl-propane-1-one, 2,2-dimethoxy-1,2-diphenylethane-1-one; bis (2,4,6) -Trimethylbenzoyl) acylphosphine oxide compounds such as phenylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide; sulfide compounds such as benzylphenyl sulfide and tetramethylthium monosulfide; 1-hydroxycyclohexylphenylketone and the like. Α-Ketol compounds; azo compounds such as azobisisobutyronitrile; titanosen compounds such as titanosen; thioxanthone compounds such as thioxanthone; peroxide compounds; diketone compounds such as diacetyl; benzyl; dibenzyl; benzophenone; 2,4-diethyl Thioxanthone; 1,2-diphenylmethane; 2-hydroxy-2-methyl-1- [4- (1-methylvinyl) phenyl] propanone; quinone compounds such as 1-chloroanthraquinone and 2-chloroanthraquinone can be mentioned.
Further, examples of the photopolymerization initiator (h) include a photosensitizer such as an amine.

The photopolymerization initiator (h) contained in the adhesive composition may be only one kind, may be two or more kinds, and when it is two or more kinds, the combination and the ratio thereof can be arbitrarily selected.

In the adhesive composition, the content of the photopolymerization initiator (h) is preferably 0.1 to 20 parts by mass with respect to 100 parts by mass of the energy ray curable resin (g). It is more preferably 10 parts by mass, and particularly preferably 2 to 5 parts by mass.

(General-purpose additive (i))
The general-purpose additive (I) may be a known one and may be arbitrarily selected depending on the intended purpose, and is not particularly limited, but preferred ones are, for example, a plasticizer, an antistatic agent, an antioxidant, and a colorant (dye). , Pigments), gettering agents and the like.

The general-purpose additive (i) contained in the adhesive composition and the film-like adhesive may be only one kind, may be two or more kinds, and when there are two or more kinds, the combination and ratio thereof can be arbitrarily selected. ..
The contents of the adhesive composition and the film-like adhesive are not particularly limited and may be appropriately selected depending on the intended purpose.

(solvent)
The adhesive composition preferably further contains a solvent. The adhesive composition containing a solvent has good handleability.
The solvent is not particularly limited, but preferred ones are, for example, hydrocarbons such as toluene and xylene; alcohols such as methanol, ethanol, 2-propanol, isobutyl alcohol (2-methylpropan-1-ol) and 1-butanol. Examples thereof include esters such as ethyl acetate; ketones such as acetone and methyl ethyl ketone; ethers such as tetrahydrofuran; amides such as dimethylformamide and N-methylpyrrolidone (compounds having an amide bond).
The solvent contained in the adhesive composition may be only one type, may be two or more types, and when two or more types are used, the combination and ratio thereof can be arbitrarily selected.

The solvent contained in the adhesive composition is preferably methyl ethyl ketone or the like from the viewpoint that the components contained in the adhesive composition can be mixed more uniformly.

As the solvent contained in the adhesive composition, for example, the solvent used in the production of each component such as the polymer component (a) may be used as it is in the adhesive composition without being removed from each component. The same or different type of solvent as that used in the production of each component such as the polymer component (a) may be added separately during the production of the adhesive composition.

Each component such as the polymer component (a) contained in the adhesive composition and the film-like adhesive may be only one kind, may be two or more kinds, and when there are two or more kinds, the combination and ratio thereof are It can be selected arbitrarily.
The content of each component such as the polymer component (a) in the adhesive composition and the film-shaped adhesive is not particularly limited and may be appropriately selected depending on the intended purpose.

[Manufacturing method of adhesive composition]
The adhesive composition is obtained by blending each component for constituting the adhesive composition.
The order of addition of each component at the time of blending is not particularly limited, and two or more kinds of components may be added at the same time.
When a solvent is used, the solvent may be mixed with any compounding component other than the solvent and diluted in advance, or any compounding component other than the solvent may be diluted in advance. You may use it by mixing the solvent with these compounding components without leaving it.

The method of mixing each component at the time of blending is not particularly limited, and from known methods such as a method of rotating a stirrer or a stirring blade to mix; a method of mixing using a mixer; a method of adding ultrasonic waves to mix. It may be selected as appropriate.
The temperature and time at the time of addition and mixing of each component are not particularly limited as long as each compounding component is not deteriorated, and may be appropriately adjusted, but the temperature is preferably 15 to 30 ° C.

<< Manufacturing method of dicing die bonding sheet >>
The dicing die bonding sheet of the present invention can be manufactured by sequentially laminating the above-mentioned layers so as to have a corresponding positional relationship. The method of forming each layer is as described above.

For example, an energy ray-cured peeling treatment layer is provided on a substrate made of an electron beam irradiation-treated olefin resin film, and an adhesive composition is applied onto the energy ray-curing peeling treatment layer. Then, if necessary, the dicing die bonding sheet is obtained by laminating a film-like adhesive on the energy ray-cured peeling treatment layer.

The dicing die bonding sheet is usually stored in a state where a release film is attached to the surface of the outermost layer (for example, a film-like adhesive) on the side where the film-like adhesive is provided. Therefore, an energy ray-cured peeling-treated layer is provided in advance on a substrate made of an olefin-based resin film that has been subjected to electron beam irradiation treatment, and an adhesive composition is provided on the peeling film (preferably the peeling-treated surface). A film-like adhesive constituting the outermost layer is formed on the release film by applying a composition for forming a film-like adhesive constituting the outermost layer such as an object and drying it as necessary. On the exposed surface on the side opposite to the side in contact with the release film of this film-like adhesive, the energy ray-cured release treatment layer formed by the above method is laminated without removing the release film. A dying die bonding sheet can also be obtained by leaving the bonded state as it is.
The release film may be removed at any time after the desired laminated structure is formed.

Next, the dicing die bonding sheet of the present invention will be described in more detail with reference to the drawings. In addition, in the figure used in the following description, in order to make it easy to understand the features of the present invention, the main part may be enlarged and shown, and the dimensional ratio of each component is the same as the actual one. Is not always the case.

FIG. 1 is a cross-sectional view schematically showing an embodiment of a dicing die bonding sheet of the present invention.
The dicing die bonding sheet 101 shown here is provided with a peeling treatment layer 13 on the base material 11 and a film-like adhesive 14 on the peeling treatment layer 13. Further, the dicing die bonding sheet 101 further includes a release film 15 on the film-like adhesive 14.

In the dicing die bonding sheet 101, one surface of the base material 11 (hereinafter, may be referred to as “first surface”) 11a is subjected to electron beam irradiation treatment, and the surface of the base material 11 that has been subjected to electron beam irradiation treatment. The peeling treatment layer 13 is laminated on the surface, and the surface of the peeling treatment layer 13 opposite to the side on which the base material 11 is provided (hereinafter, may be referred to as “first surface”) 13a is in the form of a film. The adhesive 14 is laminated, and the release film 15 is laminated on the surface of the film-like adhesive 14 opposite to the side on which the release treatment layer 13 is provided (hereinafter, may be referred to as "first surface"). ing.

In the dicing die bonding sheet 101 shown in FIG. 1, in a state where the release film 15 is removed, the first surface 14a of the film-like adhesive 14 is a surface on which a circuit of a semiconductor wafer (not shown) is formed (the present specification). It is used by being affixed to the surface opposite to the "circuit forming surface" (which may be abbreviated as "circuit forming surface" in the present specification) (which may be abbreviated as "back surface" in the present specification).

FIG. 2 is a cross-sectional view schematically showing another embodiment of the dicing die bonding sheet of the present invention. In the drawings after FIG. 2, the same components as those shown in FIG. 1 are designated by the same reference numerals as those in FIG. 1, and detailed description thereof will be omitted.

In the dying die bonding sheet 102, one surface of the base material 11 (hereinafter, may be referred to as “first surface”) 11a is subjected to electron beam irradiation treatment, and the surface of the base material 11 that has been subjected to electron beam irradiation treatment. The peeling treatment layer 13 is laminated on the surface, and the surface of the peeling treatment layer 13 opposite to the side on which the base material 11 is provided (hereinafter, may be referred to as “first surface”) 13a is in the form of a film. A part of the surface (hereinafter, may be referred to as "first surface") 14a on the side opposite to the side on which the adhesive 14 is laminated and the peeling treatment layer 13 of the film-like adhesive 14 is provided, that is, The adhesive layer 16 for jigs is laminated in the region near the peripheral edge portion, and the surface of the first surface 14a of the film-like adhesive 14 on which the adhesive layer 16 for jigs is not laminated and the adhesive for jigs are laminated. The release film 15 is laminated on the surface (first surface 16a and side surface 16c) of the layer 16 that is not in contact with the film-like adhesive 14. The jig adhesive layer 16 imparts holdability to the fixing jig during the dicing process. The shape of the jig adhesive layer 16 is not limited as long as it matches the shape of the fixing jig. When the fixing jig is a ring frame, the jig adhesive layer 16 may be a ring-shaped ring frame fixing tape. Here, the first surface 16a of the jig adhesive layer 16 is the surface of the jig adhesive layer 16 opposite to the side in contact with the film-like adhesive 14, and is used for jig adhesion. In some cases, the boundaries between the first surface 16a and the side surface 16c of the agent layer 16 cannot be clearly distinguished.

The adhesive layer 16 for jigs may be, for example, a single-layer structure containing an adhesive component, or a plurality of layers in which layers containing an adhesive component are laminated on both sides of a sheet serving as a core material. It may be of a structure.

The dicing die bonding sheet 102 shown here is the same as the dicing die bonding sheet 101 shown in FIG. 1, except that the dicing die bonding sheet 102 is provided with the adhesive layer 16 for jigs.

That is, in the dicing die bonding sheet 102 shown in FIG. 2, in a state where the release film 15 is removed, a part of the first surface 14a of the film-like adhesive 14 on the central side is a semiconductor wafer (not shown). ), And further, the region near the peripheral edge portion of the first surface 14a of the film-like adhesive 14 is attached to a jig such as a ring frame and used.

The dicing die bonding sheet of the present invention is not limited to the one shown in FIGS. 1 and 2, and a part of the configurations shown in FIGS. 1 to 2 are changed or deleted within the range not impairing the effect of the present invention. Or it may be added.

<< Manufacturing method of semiconductor chip >>
The method for manufacturing a semiconductor chip of the present invention is a method for manufacturing a semiconductor chip using the above-mentioned dicing die bonding sheet of the present invention, wherein the step of preparing the dicing die bonding sheet and the film-like adhesive are used. A step of forming a laminated structure in which a semiconductor wafer is provided on a surface (that is, the first surface) opposite to the side on which the peeling treatment layer is provided (hereinafter, "laminated structure forming step"). By using a dicing blade to form a notch in the laminated structure that reaches the peeling treatment layer from the surface of the semiconductor wafer, the semiconductor wafer is divided into semiconductor chips. It has a step of forming (hereinafter, may be abbreviated as "dicing step").

In the method for manufacturing this semiconductor chip, by using the dicing die bonding sheet of the present invention described above, in addition to being able to significantly reduce the amount of cutting chips generated in the dicing step, the peeling treatment layer and the film form. It is possible to adjust the suitable peeling force with the adhesive. As a result, the occurrence of chip skipping defects is suppressed in the dicing step.

By using the dicing die bonding sheet of the present invention, in the dicing step, the amount of cutting chips generated during dicing using the dicing blade can be significantly reduced as compared with the conventional case. Here, the "cutting waste" is the one described above.

Hereinafter, a method for manufacturing the semiconductor chip will be described with reference to FIG. FIG. 3 is a cross-sectional view for schematically explaining an embodiment of the method for manufacturing a semiconductor chip of the present invention. Here, a manufacturing method when the dicing die bonding sheet shown in FIG. 2 is used will be described.

<Laminate structure forming process>
In the laminated structure forming step, as shown in FIG. 3A, the laminated structure 201 in which the semiconductor wafer 9'is provided on the first surface 14a of the film-like adhesive 14 in the dicing die bonding sheet 102. To form.
The thickness of the semiconductor wafer 9'in the laminated structure 201 is not particularly limited, but is preferably 10 to 100 μm, more preferably 30 to 90 μm.

<Dicing process>
Next, in the dicing step, as shown in FIG. 3B, the peeling treatment layer 13 is used from the surface (in other words, the circuit forming surface) 9a'of the semiconductor wafer 9'in the laminated structure 201 by using the dicing blade. The semiconductor wafer 9'is divided to form the semiconductor chip 9 by forming the notch 10 that reaches the base material 11 at the same time. The notch 10 needs to reach the peeling treatment layer 13, but does not have to reach the base material 11.
The thickness of the semiconductor chip 9 is the same as the thickness of the above-mentioned semiconductor wafer 9'.

In the dicing step, the rotation speed of the dicing blade is preferably 1000 to 60000 rpm, more preferably 20000 to 50000 rpm.
The moving speed of the dicing blade is preferably 20 to 80 mm / s, more preferably 40 to 60 mm / s.
Further, when the dicing blade is operated, it is preferable to flow cutting water in an amount of, for example, about 0.5 to 1.5 L / min to the dicing portion.

<< Manufacturing method of semiconductor device >>
The semiconductor device is manufactured by the above-mentioned method for manufacturing a semiconductor chip of the present invention with respect to the dicing die bonding sheet after the step of forming the semiconductor chip (dicing step) and then forming the notch. It has a step of applying a force from the base material side and pulling the semiconductor chip away from the peeling treatment layer together with the film-like adhesive after cutting (hereinafter, may be abbreviated as "pickup step").

In the method for manufacturing this semiconductor device, by using the dicing die bonding sheet of the present invention described above, in addition to being able to significantly reduce the amount of cutting chips generated in the dicing step, the peeling treatment layer and the film form are used. It is possible to adjust the suitable peeling force with the adhesive. As a result, in the pickup step, the occurrence of pickup failure of the semiconductor chip provided with the film-like adhesive (semiconductor chip with the film-like adhesive) is suppressed.

<Pickup process>
In the pickup step, as shown in FIG. 4, a force is applied to the dicing die bonding sheet 102 after forming the notch 10 from the base material 11 side, and the semiconductor chip 9 is bonded in a film shape after cutting. It is separated (picked up) from the peeling treatment layer 13 together with the agent 14.

Here, the protrusion (pin) 70 is projected from the push-up portion (not shown) in the semiconductor device manufacturing apparatus, and the tip portion of the protrusion 70 pushes up the dicing die bonding sheet 102 from the base material 11 side, whereby the notch 10 is formed. An example is shown in which a force is applied to the laminated structure 201'in which the semiconductor chip 9 is formed in the protruding direction of the protrusion 70. At this time, the pushing conditions such as the protruding amount (pushing amount), the protruding speed (pushing speed), and the holding time of the protruding state (lifting waiting time) of the protrusion 70 can be appropriately adjusted. The number of protrusions 70 is not particularly limited and may be appropriately selected.

In the pickup step, the method of pushing up the dicing die bonding sheet 102 may be a known method. For example, in addition to the method of pushing up by the protrusion as described above, the slider may be moved along the dicing die bonding sheet 102. A method of pushing up the dicing die bonding sheet 102 can be mentioned.

Further, here, an example is shown in which the semiconductor chip 9 is peeled off from the peeling treatment layer 13 together with the film-like adhesive 14 by pulling up the semiconductor chip 9 by the pulling-up portion 71 of the semiconductor device manufacturing apparatus. Here, the pulling direction of the semiconductor chip 9 is indicated by an arrow I.
The method of pulling up the semiconductor chip 9 may be a known method, and examples thereof include a method of adsorbing and pulling up the surface of the semiconductor chip 9 with a vacuum collet.

In the pick-up process, the dicing die bonding sheet 102 of the present invention is used, and by using the method for manufacturing the semiconductor chip of the present invention, the occurrence of pick-up defects of the semiconductor chip 9 with a film-like adhesive is suppressed.

In the method for manufacturing a semiconductor device, as described above, by using a dicing die bonding sheet in which the peeling force between the peeling treatment layer and the film-like adhesive is equal to or less than a specific value in the pick-up process, energy is used. The semiconductor chip with a film-like adhesive can be easily separated from the peeling treatment layer and picked up without curing by beam irradiation or the like. Since the semiconductor chip with a film-like adhesive can be picked up without curing, the manufacturing process of the semiconductor device can be simplified.

In the method for manufacturing the semiconductor device, the semiconductor chip separated (picked up) together with the film-like adhesive is used, and thereafter, the semiconductor device is manufactured by the same method as the conventional method. For example, the semiconductor chip is die-bonded to the circuit surface of the substrate with a film-like adhesive, and if necessary, one or more semiconductor chips are further laminated on the semiconductor chip to perform wire bonding, and then the whole is resin. By sealing with, it becomes a semiconductor package. Then, the target semiconductor device may be manufactured by using this semiconductor package.

Hereinafter, the present invention will be described in more detail with reference to specific examples. However, the present invention is not limited to the examples shown below.

(Preparation of release agent solution (formulation 1))
TA37-400A (manufactured by Hitachi Kasei Co., Ltd.) as an ultraviolet curable release agent was diluted with isopropyl alcohol to prepare a release agent solution (solid content 20% by mass) of Formulation 1.

(Preparation of release agent solution (prescription 2))
As an ultraviolet curable release agent, a 1: 1 (solid ratio) mixture of TA37-440D (manufactured by Hitachi Kasei Co., Ltd.) and TA37-411N (manufactured by Hitachi Kasei Co., Ltd.) was diluted with isopropyl alcohol. This was used as the release agent solution of Formulation 2 (solid content 20% by mass).

(Preparation of release agent solution (formulation 3))
TA37-440D (manufactured by Hitachi Kasei Co., Ltd.) as an ultraviolet curable release agent was diluted with isopropyl alcohol to prepare a release agent solution (solid content 20% by mass) of Formulation 3.

(Preparation of release agent solution (formulation 4))
As the UV curable release agent of Formula 2, a mixture of TA37-440D (manufactured by Hitachi Kasei Co., Ltd.) and TA37-411N (manufactured by Hitachi Kasei Co., Ltd.) at a ratio of 1: 9 (solid ratio) is diluted with isopropyl alcohol. Then, this was used as the release agent solution of Formulation 4 (solid content 20% by mass).

(Preparation of release agent solution (formulation 5))
Tessfine 309 (manufactured by Hitachi Kasei Co., Ltd.) as a thermosetting release agent of Formula 5 was diluted with isopropyl alcohol to prepare a release agent solution of Formula 5 (solid content 20% by mass).

(Preparation of solution of adhesive composition A)
Acrylic resin (trade name "Corponil N-7588" manufactured by Nippon Synthetic Industry Co., Ltd.): 100 parts, epoxy resin (trade name "CNA-147" manufactured by Nippon Kayaku Co., Ltd.): 10 parts, phenol resin ( Product name "Milex XLC-4L" manufactured by Mitsui Chemicals Co., Ltd.): 2 parts, spherical silica (trade name "YA050C-SV2" manufactured by Admatex Co., Ltd.): 40 parts, cross-linking agent (product name "BHS8515" manufactured by Toyochem Co., Ltd .: 0.5 part was dissolved in methyl ethyl ketone to prepare a solution of the adhesive composition A having a solid content concentration of 20% by weight.

(Preparation of solution of adhesive composition B)
Acrylic resin (trade name "Corponil N-2359-3" manufactured by Nippon Synthetic Industry Co., Ltd.): Silica-containing thermosetting resin (trade name "Seika Seven SS02-193" manufactured by Dainichiseika Kogyo Co., Ltd.) for 100 parts. ): 500 parts were dissolved in methyl ethyl ketone to prepare a solution of the adhesive composition B having a solid content concentration of 60% by weight.

[Example 1]
<Manufacturing of dicing die bonding sheet>
The release agent solution of Formulation 1 was applied with a Meyer bar on the surface of the EB-irradiated EMAA copolymer film (thickness 80 μm) on the EB-irradiated side, and dried at 60 ° C. for 1 minute. Then, it was irradiated with ultraviolet rays (integrated light amount: 50 mJ / cm ² ) to cure the release agent composition to form a release-treated layer on the substrate. The thickness of the peeling treatment layer after curing was 0.1 μm.

Immediately after applying the adhesive composition A to a polyethylene terephthalate-based release film (Lintec SPPET-381031 thickness: 38 μm) so that the film-like adhesive has a thickness of 20 μm and drying the solvent, the above By bonding the peeling treatment layer formed by using the release agent solution of Formulation 1 and the laminator, the EB-treated EMAA base material, the peeling treatment layer, the film-like adhesive, and the release film are laminated in this order. I got the tape. Then, the release film was peeled off, a ring frame fixing tape rounded out in a circle was attached, and precut to obtain a dicing die bonding sheet in the final form.
Substrate: EB irradiation EMA copolymer film peeling treatment layer: Yes (Prescription 1: Thickness 0.1 μm)
Peeling treatment: UV curable peeling agent (Prescription 1: TA37-400A (manufactured by Hitachi Kasei Co., Ltd.))
Film-like adhesive: Adhesive composition A

[Example 2]
<Manufacturing of dicing die bonding sheet>
A dicing die bonding sheet was obtained in the same manner as in Example 1 except that the adhesive composition A was changed to the adhesive composition B in Example 1.
Substrate: EB irradiation EMA copolymer film peeling treatment layer: Yes (Prescription 1: Thickness 0.1 μm)
Peeling treatment: UV curable peeling agent (Prescription 1: TA37-400A (manufactured by Hitachi Kasei Co., Ltd.))
Film-like adhesive: Adhesive composition B

[Example 3]
<Manufacturing of dicing die bonding sheet>
In Example 1, a dicing die bonding sheet was obtained in the same manner as in Example 1 except that the peeling treatment layer was formed by using the release agent solution of the above formulation 2.
Substrate: EB irradiation EMA copolymer film peeling treatment layer: Yes (Prescription 2: Thickness 0.1 μm)
Peeling treatment: UV curable stripping agent (formulation 2: TA37-440D (manufactured by Hitachi Kasei Co., Ltd.) and TA37-411N (manufactured by Hitachi Kasei Co., Ltd.) 1: 1 (solid ratio) mixed composition)
Film-like adhesive: Adhesive composition A

[Example 4]
<Manufacturing of dicing die bonding sheet>
In Example 1, a dicing die bonding sheet was obtained in the same manner as in Example 1 except that the peeling treatment layer was formed by using the release agent solution of the above formulation 3.
Substrate: EB irradiation EMA copolymer film peeling treatment layer: Yes (Prescription 3: Thickness 0.1 μm)
Peeling treatment: UV curable peeling agent (Prescription 3: TA37-440D (manufactured by Hitachi Kasei Co., Ltd.))
Film-like adhesive: Adhesive composition A

[Example 5]
<Manufacturing of dicing die bonding sheet>
In Example 1, a dicing die bonding sheet was obtained in the same manner as in Example 1 except that the peeling treatment layer was formed by using the release agent solution of the above formulation 4.
Substrate: EB irradiation EMA copolymer film peeling treatment layer: Yes (Prescription 4: Thickness 0.1 μm)
Peeling treatment: UV curable stripping agent (formulation 4: mixed composition of TA37-440D (manufactured by Hitachi Kasei Co., Ltd.) and TA37-411N (manufactured by Hitachi Kasei Co., Ltd.) 1: 9 (solid ratio))
Film-like adhesive: Adhesive composition A

[Comparative Example 1]
<Manufacturing of dicing die bonding sheet>
Immediately after applying the adhesive composition A to the release film so that the thickness of the film-like adhesive is 20 μm and drying the solvent, the EB irradiation EMA copolymer film (Achilles Co., Ltd., EANU80-) By laminating AL-ND-EW (thickness 80 μm) with a laminator, an EB-treated EMAA base material, a film-like adhesive, and a release film were laminated in this order to obtain a tape. Then, the release film was peeled off, a ring frame fixing tape rounded out in a circle was attached, and precut to obtain a dicing die bonding sheet in the final form.
Base material: EB irradiation EMA copolymer film Peeling treatment layer: None Film-like adhesive: Adhesive composition A

[Comparative Example 2]
<Manufacturing of dicing die bonding sheet>
Immediately after applying the adhesive composition A to the release film so that the thickness of the film-like adhesive is 20 μm and drying the solvent, a polyethylene (PE) film (manufactured by Gunze Co., Ltd., Juan Claire LRC111, thickness) The tape was obtained by laminating the PE base material, the film-like adhesive, and the release film in this order by laminating them together with a laminator. Then, the release film was peeled off, a ring frame fixing tape rounded out in a circle was attached, and precut to obtain a dicing die bonding sheet in the final form.
Base material: PE film Peeling treatment layer: None Film-like adhesive: Adhesive composition A

[Comparative Example 3]
<Manufacturing of dicing die bonding sheet>
The thermosetting release agent solution of Formulation 5 was applied onto the surface of the EMAA film, and the solvent contained in the release agent was volatilized and dried at 140 ° C. to form a release treatment layer.
Separately, the adhesive composition A is applied to the peeling-treated surface of the polyethylene terephthalate-based release film (SPPET-381031 made by Lintec, thickness: 38 μm), and the film-like adhesive is adhered in a film form so that the thickness of the film-like adhesive is 20 μm. Immediately after the agent is formed and the solvent is dried, the surface of the film-like adhesive is bonded to the peeling treatment layer laminated on the above-mentioned EMAA film using a laminator to form an EMAA base material, a peeling treatment layer, and the like. A tape formed by laminating a film-like adhesive and a release film in this order was obtained. Then, the release film was peeled off, a ring frame fixing tape rounded out in a circle was attached, and precut to obtain a dicing die bonding sheet in the final form.
Base material: EMAA film Peeling treatment layer: Yes Peeling treatment: Thermosetting type peeling agent (Prescription 5: Tessfine 309 (manufactured by Hitachi Kasei Co., Ltd.))
Film-like adhesive: Adhesive composition A

[Comparative Example 4]
<Manufacturing of dicing die bonding sheet>
On the surface of a polyethylene terephthalate (PET) film (manufactured by Mitsubishi Chemical Corporation, Diafoil T102-75S, thickness 75 μm), the release agent solution of Formulation 5 above is applied, and the solvent contained in the release agent is volatilized at 140 ° C. , It was dried to form a peeling treatment layer.
Separately, the adhesive composition A is applied to the peeling-treated surface of the polyethylene terephthalate-based release film (SPPET-381031 made by Lintec, thickness: 38 μm), and the film-like adhesive is adhered in a film form so that the thickness of the film-like adhesive is 20 μm. Immediately after the agent is formed and the solvent is dried, the surface of the film-like adhesive is bonded to the peeling treatment layer laminated on the PET film described above using a laminator to form a PET substrate, a peeling treatment layer, and the like. A tape formed by laminating a film-like adhesive and a release film in this order was obtained. Then, the release film was peeled off, a ring frame fixing tape rounded out in a circle was attached, and precut to obtain a dicing die bonding sheet in the final form.
Base material: PET film Peeling treatment layer: Yes Peeling treatment: Thermosetting type peeling agent (Prescription 5: Tessfine 309 (manufactured by Hitachi Kasei Co., Ltd.))
Film-like adhesive: Adhesive composition A

(Ratio of total silicon atoms in the stripping layer)
The amount of carbon atom, oxygen atom and silicon atom was measured on the surface of the above-mentioned peeling treatment layer by X-ray photoelectron spectroscopy (XPS) using PHI Quantera SXM manufactured by ULVAC-PHI Corporation. As measurement conditions, for carbon atom and oxygen atom, X-ray source: Mg Kα, X-ray diameter: 100 μm, X-ray output: 15 kV, 25 W, measurement area: 500 μm × 500 μm, Til Angle: 45 °, measurement room vacuum degree: 1.0 × ^10-7 Pa, Pass Energy: 112 eV, Energy Step: 0.1 eV, Time per Step: 20 ms, Swep: 1 time, Cycle: 3 times. For silicon atom and oxygen atom, X-ray source: Mg Kα, X-ray diameter: 100 μm, X-ray output: 15 kV, 25 W, measurement area: 500 μm × 500 μm, Til Energy: 45 °, measurement room vacuum degree: 1.0 × ^10-7 Pa, Pass Energy: 224 eV, Energy Step: 0.2 eV, Time per Step: 20 ms, Sweep: 20 times, Cycle: 3 times. After measuring the molar ratio of total carbon atoms to total oxygen atoms and the molar ratio of total silicon atoms to total oxygen atoms separately, {[ratio of total carbon atoms (Atomic%)] + [total number of oxygen atoms The ratio of the total number of silicon atoms in the peeling treatment layer was determined so that the ratio (Atomic%)] + [ratio of total number of silicon atoms (Atomic%)]} = 100%. The results are shown in Tables 1 and 2.

(Evaluation of base material distortion)
With respect to the above-mentioned sample provided with a peeling treatment layer having a thickness of 0.1 μm on the substrate, the size of the twist of the substrate was placed on a smooth desk and visually evaluated. Those that are not in contact with the desk are marked with x, and those that are in full contact with the desk are marked with ○. The results are shown in Tables 1 and 2.

(Calculation of surface free energy of peeling treatment layer)
For the above-mentioned sample provided with a peeling treatment layer having a thickness of 0.1 μm on the substrate, a contact angle measuring device (fully automatic contact angle meter, “DM-701” manufactured by Kyowa Interface Science Co., Ltd.) was used. , The contact angles of water, 1-bromonaphthalene and diiodomethane with respect to the exfoliated layer at 23 ° C. were measured. The contact angle was measured 5 times for each of the above solvents (water, 1-bromonaphthalene, diiodomethane), and the average value of the obtained 5 measured values was adopted as the contact angle of the solvent. Then, using the value of this contact angle, according to the Kitazaki-Hata method (see Yasuaki Kitazaki et al., Journal of Japan Adhesive Association, Vol.8, No.3, 1972, pp.131 --141), 23 of the peeling treatment layer. The surface free energy at ° C was calculated. The results are shown in Tables 1 and 2.

(Measurement of peeling force between the peeling layer and the film-like adhesive)
The dicing die bonding sheet was cut out to have a width of 25 mm and a length of about 200 mm to obtain a test piece.
Then, at room temperature (23 ° C.), the surface of the film-like adhesive of this test piece was fixed to the adhesive surface of the PVC plate to which the double-sided tape was attached.
Next, at room temperature (23 ° C.), the laminate of the base material and the peeling treatment layer is formed from the film-like adhesive so that the surfaces of the film-like adhesive and the peeling treatment layer that have been in contact with each other form an angle of 180 °. In addition, peeling was performed at a peeling speed of 300 mm / min to perform 180 ° peeling, and the peeling force at this time was measured to determine the peeling force (mN / 25 mm) between the peeling treatment layer and the film-like adhesive. The results are shown in Tables 1 and 2.

<Manufacturing and evaluation of semiconductor chips>
(Laminate structure forming process)
Obtained above using a fully automatic multi-wafer mounter (“ADWILL RAD-2700” manufactured by Lintec Corporation) on the polished surface (dry polished surface) of a silicon wafer (200 mm diameter, thickness 75 μm) that has been subjected to a dry polished finish. The dicing die bonding sheet was attached at 60 ° C. with the film-like adhesive to obtain a laminated structure.

(Evaluation of cutting chips)
Next, the obtained laminated structure was attached to and fixed to the dicing ring frame with the ring frame fixing tape.
Then, using a dicing device (“DFD6361” manufactured by Disco Corporation), a notch was formed in the laminated structure obtained above to a chip size of 8 mm × 8 mm. The amount of cut during dicing was such that the substrate was cut by 20 μm from the surface of the silicon wafer through the film-like adhesive and the peeling treatment layer. The conditions at that time are as follows.
Dicing blade: 27HEEE
Dicing speed: 50 mm / s
Dicing speed: 30,000 rpm
Cutting water volume: 1L / min

After dicing, observe the longest 2 lines in the MD and TD directions, that is, a total of 4 lines with a digital microscope (VHX-100 manufactured by KEYENCE) from the surface side of a silicon wafer with a diameter of 200 mm, and one piece of cutting chips with a length of 30 μm or more is observed. If there were more than one, it was marked as x, and if there were none, it was marked as ○. The results are shown in Tables 1 and 2.

(Evaluation of tip skipping)
At the time of dicing for evaluation of cutting chips, those with chip skipping were evaluated as x, and those without chip skipping were evaluated as ○. In this chip flying evaluation, the scattering of the triangular chips on the outer peripheral portion of the wafer is not evaluated. The results are shown in Tables 1 and 2.

(Pickup evaluation)
Furthermore, a semiconductor chip is picked up under the following conditions using a die-bonding device (BESTEM-D02 manufactured by Canon Machinery Co., Ltd.), and if it is possible to continuously pick up 27 chips without any problems, it is evaluated as 〇, otherwise it is evaluated as ×. did. The conditions at that time are as follows. The results are shown in Tables 1 and 2.
Pickup method: 5 pins Pickup speed: 20 mm / s
Pin push-up amount: 300 μm

In the dicing die bonding sheet of Comparative Example 1 in which the film-like adhesive was provided without providing the peeling treatment layer on the EMAA copolymer film, the peeling force between the EMAA copolymer film and the film-like adhesive was too large. , I couldn't pick it up.

In the dicing die bonding sheet of Comparative Example 2 in which the film-like adhesive was provided without providing the peeling treatment layer on the PE film, a large amount of cutting chips were generated on the dicing line.

In the dicing die bonding sheet of Comparative Example 3 in which a thermosetting type peeling treatment layer is provided on the EMAA copolymer film and a film-like adhesive is provided on the layer, the base material is twisted due to insufficient heat resistance. Since the peeling force between the peeling treatment layer and the film-like adhesive is small, chip skipping also occurs.

In the dicing die bonding sheet of Comparative Example 4 in which a heat-curable peeling treatment layer is provided on the PET film and a film-like adhesive is provided on the PET film, a large amount of cutting chips are generated on the dicing line, and peeling is performed. Since the peeling force between the treatment layer and the film-like adhesive was small, chip skipping also occurred.

With respect to these, a base material made of an olefin resin film subjected to electron beam irradiation treatment, an energy ray-cured peeling treatment layer provided on the base material, and an energy ray curing treated peeling treatment layer. In the dying die bonding sheets of Examples 1 to 5 provided with the film-like adhesive provided above, the base material is not twisted, and the surface free energy of the energy ray-cured peeling treatment layer is suitable. The peeling force between the energy ray-cured peeling treatment layer and the film-like adhesive could be adjusted to a suitable range. Therefore, it was possible to reduce the amount of cutting chips generated during dicing using a dicing blade, and it was possible to satisfactorily pick up a semiconductor chip with a film-like adhesive after dicing.

The present invention can be used in the manufacture of semiconductor devices.

101, 102 ... Dicing die bonding sheet, 11 ... Substrate, 11a ... First surface of base material, 13 ... Peeling treatment layer, 13a ... First surface of peeling treatment layer, 14 ... film-like adhesive, 14a ... first surface of film-like adhesive, 15 ... release film, 201,201'... laminated structure, 201' ... lamination after forming a notch Structure, 9 ... Semiconductor chip, 9'... Semiconductor wafer, 9a' ... Surface of semiconductor wafer, 10 ... Notch, 70 ... Protrusion, 71 ... Pulling part

Claims (5)

A base material made of an olefin resin film treated with an electron beam, an energy ray-cured peeling treatment layer provided on the base material, and an energy ray-curing peeling treatment layer provided on the base material. Ri Na and a film-like adhesive,
The total number of silicon atoms relative to the total number of total silicon atoms, total carbon atoms, and total oxygen atoms when the surface of the energy ray-cured stripping layer is measured by X-ray photoelectron spectroscopy (XPS). the ratio of Ru 5~25Atomic% der, the dicing die bonding sheet. Wherein the release treatment layer, the dicing die bonding sheet according to claim 1, wherein the surface free energy is 37~46mN / m at 23 ° C. of the film adhesive side of the surface. The dicing die bonding sheet according to claim 1 or 2 , wherein the peeling force between the peeling treatment layer and the film-like adhesive is 0.013 to 0.20 N / 25 mm. The dicing die bonding sheet according to any one of claims 1 to 3 , further comprising an adhesive layer for a jig on the film-like adhesive. The step of preparing the dicing die bonding sheet according to any one of claims 1 to 4 and the semiconductor wafer on the surface of the film-like adhesive on the side opposite to the side on which the peeling treatment layer is provided. The semiconductor wafer is formed by forming a notch in the laminated structure from the surface of the semiconductor wafer to reach the peeling treatment layer by using the step of forming the laminated structure provided with the semiconductor wafer and the dicing blade. A method for manufacturing a semiconductor chip, comprising a step of forming a semiconductor chip by dividing the semiconductor chip.

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