JP6912964B2 - Direct blow molding machine - Google Patents

Description

The present invention relates to a direct blow molding machine .

Non-contact wireless identification terminals such as non-contact IC tags that can read and write a large amount of information data have been attracting attention for some time because they have a larger data capacity than barcodes and can sufficiently maintain physical strength. More recently, due to technological advances, the capacity of non-contact wireless identification terminals has increased, while the price has also decreased significantly, so that their use is being desired by various industries. In particular, it is being considered to mount a non-contact type IC tag or the like on a blow-molded container.

As a non-contact wireless identification terminal mounted on a blow-molded container, for example, there is one disclosed in Patent Document 1. The blow-molded container with a non-contact IC tag according to Patent Document 1 has a non-contact IC tag attached to the bottom surface of a storage recess integrally molded by a blow molding device together with the mouth, shoulder, body, and bottom of the container. It was pasted by. In the process of attaching the non-contact type IC tag to the molded container, there is a risk of damage during stacking even when the non-contact IC tag is exposed to the outer surface of the container body and attached, but according to Patent Document 1, the damage is prevented. It was possible.

JP-A-2007-230644

According to Patent Document 1, a non-contact type IC tag is provided on a non-contact type IC on the bottom surface of a storage recess of the container after the blow molding container is molded by the blow molding device and before the label is coated on the container. The tag is attached so that the outer surface of the tag is flush with the outer surface of the body of the container. However, since the molding of the non-contact type IC-tagged container disclosed in Patent Document 1 requires the above-mentioned steps, it has been desired to reduce the man-hours and improve the efficiency of the steps.

The present invention has been made by paying attention to such a problem, and it is possible to reduce the man-hours required for molding a container with a non-contact wireless identification terminal such as a non-contact IC tag, improve the efficiency of the process, and surely. It provides a direct blow molding machine capable of molding such a container.

The present invention, in the direct blowｰ_Naru form machine, there is better out of the mold consisting of a pair of split molds, in a direction crossing the opening and closing directions of the pair of split molds, in order toward the outside, provided with a contactless RFID terminal label magazine and the label covers each of the surfaces a plurality of loading, said to be adjacent to the label magazine, provided the magazine loaded with a plurality of said contactless RFID terminal, withdrawn from the magazine The non-contact type wireless identification terminal is provided with a mechanism for pulling out the label in a state where the label is pressed against the corresponding label of the label magazine and attached to the label, and the label is pulled out by advancing and retreating to the pair of open split molds . An inserter for transferring the non-contact wireless identification terminal and the label into the pair of split molds is provided , and the non-contact wireless identification terminal and the label are sucked from the inserter that has entered the pair of split molds. This is a direct blow molding machine characterized in that a mechanism for holding the label in the pair of split molds is provided .

Further, in the second problem-solving means, in the first problem-solving means, the non-contact wireless identification terminal and the mechanism for holding the label attach the non-contact wireless identification terminal and the label to the mold. It is configured to include an air suction portion to be held on the cavity surface.

The action of the first problem-solving means is as follows. That is, the non-contact wireless identification terminal and the label were automatically pulled out from the respective magazines, held in the mold, and the parison was directly blow-molded as it was, and the non-contact wireless identification terminal was attached by in-mold label molding. Since the container can be manufactured efficiently and reliably, the process of manufacturing a container in which a recess for storing the non-contact IC tag is formed from the preform as in the conventional case is not required, and the non-contact IC tag is stored in the recess. The process of doing this is no longer necessary, and the number of steps can be significantly reduced. Thereby, the efficiency of the manufacturing process can be achieved.

The action of the second problem-solving means is that the non-contact wireless identification terminal and the label can be reliably held in the mold by the air suction unit, so that the in-mold label molding can be performed reliably and easily.

According to the present invention, it is possible to achieve a reduction in man-hours and an efficiency in the manufacturing process as compared with a molding method in which a non-contact type IC tag is stored and labeled from a conventional preform.

The perspective view of the hollow molding machine which concerns on one Embodiment of this invention. An enlarged perspective view showing a supply magazine for supplying an IC label as a non-contact wireless identification terminal shown in FIG. 1, a label supply magazine for supplying a label for covering the IC label, and a mechanism for pulling out a label with an IC label. .. An enlarged perspective view showing a mechanism for pulling out the label with an IC label shown in FIG. An enlarged perspective view of the inserter shown in FIG. An enlarged perspective view of a hollow molding machine in which an IC label is pulled out from a magazine using the hollow molding machine shown in FIG. 1 and which is partially omitted. An enlarged perspective view of a hollow molding machine in which a part is omitted showing a state in which an IC label pulled out after shifting from the state shown in FIG. 5 is attached to a label in a label magazine. An enlarged perspective view of a hollow molding machine in which a part is omitted showing a state in which the inserter advances toward the mold after shifting from the state shown in FIG. An enlarged perspective view of a hollow molding machine in which a part of the hollow molding machine is omitted showing a state in which the label to which the IC label is attached is air-sucked into the cavity surface of the mold after shifting from the state shown in FIG. The block diagram which shows the electric control system of the hollow molding machine shown in FIG. The flowchart which shows the process of molding using the hollow molding machine shown in FIG. FIG. 3 is a perspective view of a container to which a label with an IC label, which is molded by using the hollow molding machine shown in FIG. 1, is affixed. An enlarged cross-sectional view of the container shown in FIG. 11 along the line AA.

As shown in FIG. 1, the hollow molding machine includes a molten resin extruder 2 connected to a hopper 1 into which a molten resin is charged, a die head 3 connected to the extruder 2, and a tubular parison extruded from the die head 3. A molding die 4 having a cavity for molding into a hollow molded product, a molding die 7 equipped with an electric machine for closing, molding and opening the front platen 5, the rear platen 6 and the molding die 4, and a parison are specified. A nozzle driving device including a parison cutting device (not shown) for cutting to the length of the above, a mold transfer device (not shown) for moving the molding die 4, and an air blowing nozzle 8 for blowing air into the parison. The device 9 is basically composed of a safety door 10 for partitioning an in-machine space area in which the molding die 4 and the like operate and move and a work area for performing operation operations and monitoring connected to the device 9.

The die or core provided at the bottom of the die head 3 (not shown) is connected to the ball screw by a coupling, and the ball screw is rotationally driven by the servomotor 3a to adjust the elevation of the die or core (not shown). It is configured to do. The die head 3 is formed with an annular discharge port for discharging the molten resin. This discharge port is formed in an annular shape by a die and a core provided so as to be relatively movable up and down in the center of the die head 3, and the gap spacing of the discharge port can be freely changed to change the wall thickness of the extruded parison. It has become like.

The molding die 4 is as shown in FIG. It is composed of a pair of split molds 4a and 4b, and a tubular parison is inserted into these split molds 4a and 4b to form a cavity 4c for molding a container. The molding die 4 may be alternately reciprocated in the horizontal direction between a position directly below the die head 3 and a position directly below the air blowing nozzle 8 of the nozzle driving device 9 by a mold transfer device (not shown). You can do it.

The nozzle driving device 9 raises and lowers the air blowing nozzle 8 for inserting into the tubular parison and blowing compressed air and the air blowing nozzle 8 above the left and right cavities 4c of the molding die 4. The air blowing nozzle driving device 11 is provided.

The air blowing nozzle 8 is adapted to supply compressed air from an air source (not shown) and blow compressed air into the tubular parison supplied into the cavity 4c of the molding die 4. The shaft core of the air blowing nozzle 8 is always located on an extension of the parting line of the molding die 4 to be used. This parting line and its extended line are mechanically set so that they are always on the same line even if the molding die used is changed depending on the product to be molded.

The mold clamping device 7 is inserted through the front platen 5 and the rear platen 6 and these platens 5 and 6, and the platens 5 and 6 are synchronized with the putting line of the molding mold 4 in the approaching / separating direction. It is equipped with left and right reverse lead ball screws to be moved, and a platen moving electric motor located behind the rear platen 6 and connected to the left and right reverse lead ball screws.

In the mold transfer device (not shown), a pair of rails extending in the direction of extending the parting line and a slide base on which the molding mold 4 is placed are placed on the pair of rails in order to move the molding mold 4 in the extending direction of the parting line. It is provided with a ball screw that reciprocates and reciprocates, and a servomotor that rotationally drives the ball screw.

On one outer side of the molding die 4, a pair of IC label magazines 20, a label magazine 30 for a pair of sheet-fed labels, a mechanism 40 for pulling out IC labels and labels from these magazines 20 and 30, and a pulled out IC label. And an inserter 60 for transferring the label into the cavity 4c of the molding die 4 is arranged.

As shown in FIG. 2, the IC label magazine 20 is a long strip-shaped base in which a large number of IC labels 21, which are one of non-contact wireless identification terminals (non-contact wireless communication terminals or IC tags), are wound in a roll shape. It is attached to paper tape 22 in parallel at a predetermined interval in the winding direction. When the backing tape 22 fed and moved from the IC label magazine 20 bends and passes through the feed pole 23 having a small radius, the edge of the IC label 21 is slightly lifted from the backing tape 22, and the edge portion is referred to as a label described later. The pulling mechanism 40 captures and pulls out the IC label 21. The mount tape 22 from which the IC label 21 has been pulled out is wound around the reel 24. The IC label magazine 20 and the reel 24 are rotatably arranged on the first support base 26.

The reel 24 is configured to intermittently wind up the mount tape 22 by the servomotor 25, whereby the IC label magazine 20 is also able to intermittently feed the mount tape 22 by the action of a sensor (not shown). There is. As a result, the IC label 21 intermittently passes through the feed pole 23.

As shown in FIG. 2, the label magazine 30 loads a large number of labels 31, for example, about 1,000, into a magazine case, and sequentially sends out one label at a time by a spring-forced force in the take-out direction. .. The label magazine 30 is arranged on the second support base 32.

As shown in FIGS. 2 and 3, the mechanism 40 for pulling out the IC label 21 and the label 31 includes an arm opening / closing servomotor 41 fixed to the feed plate 61 of the inserter 60, and a speed reducer 42 connected to the servomotor 41. The first pulley 44 is coupled to the coupling 43 connected to the speed reducer 42, and the timing belt 46 is suspended between the first pulley 44 and the other second pulley 45.

A first slider 47 and a second slider 48 are mounted on the timing belt 46 by biting from either the upper or lower side. The base of the first arm 49 having an L-shaped vertical cross section is fixed to the leg of the first slider 47, and the base of the second arm 50 having an L-shaped vertical cross section is fixed to the second slider 48. The front air suction pads 51 are provided up and down at the front of the first arm 49, and the rear air suction pads 52 are provided up and down behind them. These pads 51 and 52 suck the IC label 21 from the IC label magazine 20 and peel it off. The front air suction pads 53 are also provided above and below the front of the second arm 50, and the rear air suction pads 54 are provided above and below them. These pads 53 and 54 also suck the IC label 21 from the IC label magazine 20 and peel it off.

When the first slider 47 and the second slider 48 move as the first pulley 44 and the second pulley 45 rotate in the positive direction, that is, in the right direction in FIG. 3, the first arm 49 and the second arm 50 are separated from each other. The front air suction pad 51 and the rear air suction pad 52 connected to the first arm 49 move in the opening direction, and are close to the IC label magazine 20, and the front air suction pad 53 and the rear air suction pad 53 similarly connected to the second arm 50. The rear air suction pad 54 is close to the IC label magazine 20.

On the other hand, when the first slider 47 and the second slider 48 move in the opposite direction, that is, as the first pulley 44 and the second pulley 45 rotate to the left in FIG. 3, the first arm 49 and the second arm 50 move to each other. The front air suction pad 51 and the rear air suction pad 52 connected to the first arm 49 move closer to each other in the closing direction, and separate from the IC label magazine 20, and the front air suction pad similarly connected to the second arm 50. The 53 and the rear air suction pad 54 are separated from the IC label magazine 20.

As shown in FIG. 4, the inserter 60 includes a feed plate 61 and a drive mechanism that drives the feed plate 61 to move forward and backward with respect to the molding die 4. This drive mechanism is suspended between the advance / retreat servomotor 62, the speed reducer 63, the coupling 64, the pulley connected to the coupling 64 (not shown), the front pulley (not shown), and the pulleys. It consists of a timing belt (not shown). The feed plate 61 is attached to this timing belt.

The fed plate 61 is connected to a guide 66 that slides on a pair of left and right rail bases 65 that are spaced apart from each other, so that the feed plate 61 can be smoothly moved forward and backward with respect to the molding die 4. A table 67 is provided above the feed plate 61, and air hoses 51a, 53a, 52a, 54a extending from the front air suction pads 51, 53 and the rear air suction pads 52, 54 are connected to the air turnout 55 on the table 67. However, the air is supplied from the original air hose 56. These original air hoses 56 are connected to an air supply source (not shown) via a flexible cable rack 57.

The cavity 4c of the molding die 4 is provided with a mechanism for holding the IC label 21 and the label 31 sent by the inserter 60. As shown in FIG. 5, this mechanism includes an air suction hole 4d, which is an air suction portion provided above and below two in the cavity 4c, and an air suction mechanism (not shown) connected to the air suction hole 4d.

As shown in FIG. 9, the electrical control system for in-mold label molding of the IC label 21 and the label 31 incorporates a programmable logic controller 80 incorporating an in-mold label / IC label sequencer and a molding machine sequencer. The programmable logic controller 90 is mainly provided. The operation touch panel 81 is connected to the in-mold label / IC label programmable logic controller 80, and the arm opening / closing servo amplifier 82 and the arm opening / closing servomotor 41 of the mechanism 40 for pulling out the label are connected to the programmable logic controller 80. Is connected and the drive servo amplifier 83 and the advance / retreat servomotor 62 that enable the mechanism 40 to pull out the label are connected to carry out the arm opening / closing drive and the advance / retreat drive of the mechanism 40 to pull out the label as described above. You can do it.

A touch panel 91 for operation is connected to the programmable logic controller 90 for a molding machine, and a servo amplifier 92 is connected so that the molding machine drive servomotor 93 and the like can be driven. The programmable logic controller 90 for the molding machine is also connected to the inverter 94 to drive the driving motor of the extruder 2, and is also connected to the temperature controller 95 to be connected to the extruder 2 and the die head 3. The temperature can be controlled.

The operation flowchart of the above-mentioned electrical control system is as shown in FIG. That is, in one molding cycle, the slide going step S1 by the mold transfer device, which omits the illustration of the mold 4 in the mold open state, the mold closing step S2 of the mold 4 by the mold clamping device 7, and the illustration are omitted. Step S3 of raising the parison cut and air blowing nozzle 8 by the parison cutting device, step S4 of sliding back by the mold transfer device (not shown) of the molding die 4, and lowering of the air blowing nozzle 8 by the nozzle driving device 9. Step S5, step S6 for blowing compressed air by the air blowing nozzle 8 into the parison housed in the cavity 4c of the molding die 4, step S7 for air exhaust in the parison, step S8 for raising the air blowing nozzle 8 by one step. After that, one molding cycle is completed by step S9 of opening the molding die 4.

On the other hand, the flowchart of the driving step of the label / IC label inserter is also as shown in FIG. That is, as shown in FIG. 5, the arm opening / closing servomotor 41 of the mechanism 40 for pulling out the label is driven to open the first arm 49 and the second arm 50, and the cavity 4c on the right side in the drawing of the molding die 4 (hereinafter referred to as the cavity 4c). , D2), the IC label 21 whose edge is lifted by the feed pole 23 is sucked from the backing tape 22 of the IC label 21 by the front air suction pads 51 and 53. In that state, the arm opening / closing servomotor 41 of the mechanism 40 for pulling out the label is driven to close the first arm 49 and the second arm 50, and the step S21 for pulling out the IC label 21 from the backing tape 22 is performed. There is.

Subsequently, step S22 is performed in which the advance / retreat servomotor 62 of the inserter 60 is driven to advance the plate 61, and the first arm 49 and the second arm 50 are advanced by one step to the label magazine 30. ing.

Further, as shown in FIG. 6, the arm opening / closing servomotor 41 of the label pulling-out mechanism 40 was driven to open the first arm 49 and the second arm 50, and the label was pulled out to the exposed label 31 of the label magazine 30. The IC label 21 is pressed and attached. At the same time, the IC label 21 whose edge is lifted by the feed pole 23 from the backing tape 22 of the IC label 21 for the cavity 4c (hereinafter referred to as D1) on the left side in the drawing of the molding die 4 is transferred to the rear air suction pad 52, It is sucked by 54. In this state, the arm opening / closing servomotor 41 of the mechanism 40 for pulling out the label is driven to close the first arm 49 and the second arm 50, and the label 31 with the IC label for the cavity D2 and the IC label 21 for the cavity D1 are pulled out. , Step S23 is to be carried out.

Further, as shown in FIG. 7, the first arm 49 and the second arm 50 are further advanced by driving the advance / retreat servomotor 62 of the inserter 60 and advancing the plate 61 to further advance the rear air suction pad 52. , 54 is moved forward one step to the label magazine 30 by step S24.

Subsequently, the arm opening / closing servomotor 41 of the label pulling-out mechanism 40 is driven to open the first arm 49 and the second arm 50, and the pulled-out IC label 21 is pressed against the next exposed label 31 of the label magazine 30. Attach. Then, the arm opening / closing servomotor 41 of the label pulling-out mechanism 40 is driven to close the first arm 49 and the second arm 50, and the step S25 of pulling out the IC-labeled label 31 for the cavity D1 is carried out. There is. After the execution of step S25, step S1 for sliding the molding die 4 is performed.

Then, as shown in FIG. 8, the first arm 49 and the second arm 50 are inserted and advanced by driving the advance / retreat servomotor 62 of the inserter 60 to advance the plate 61, and the left and right sides of the molding die 4 are inserted and advanced. Step S26 for aligning the IC-labeled label 31 with each of the cavities D1 and D2 is performed.

Next, the arm opening / closing servomotor 41 of the mechanism 40 for pulling out the label is driven to open the first arm 49 and the second arm 50, and the label 31 with the IC label is placed in the cavity 4c of the mold 4 by the air suction hole 4d. Step 27 for sticking and holding is performed. Therefore, the air suction hole 4d functions as a part of the mechanism for holding the label 31 with the IC label 21 in the molding die 4.

Subsequently, the arm opening / closing servomotor 41 of the mechanism 40 for pulling out the label is driven to close the first arm 49 and the second arm 50, and the front air suction pads 51 and 53 and the rear air suction pads 52 and 54 are removed from the cavity 4c. Step S28 for separating is performed.

Finally, step S29 is executed in which the advance / retreat servomotor 62 of the inserter 60 is driven and sent to retract the plate 61 and return the first arm 49 and the second arm 50 to the original positions at the start of operation. ing. Following this step S29, the above-mentioned mold closing step S2 is carried out. After step 29, the steps after step S21 are repeated.

Next, a molding method using the above-mentioned hollow molding apparatus will be described.

The resin inserted from the hopper 1 is melted while passing through the extruder 2 and the die head 3, and the molten resin is extruded from the die head 3 as a tubular parison and hangs down, and is housed in the open molding die 4, and the parison is housed in the open molding die 4. It is cut by a parison cutting device (not shown). In this state, while the mold is molded by the mold clamping device 7, the mold is transferred directly under the nozzle driving device 9 by the mold transfer device (not shown) according to the flowchart shown in FIG.

The nozzle driving device 9 lowers the air blowing nozzle 8 and drives it into the molding die 4, blows compressed air into the tubular parison in the molding die 4, and forms the expanded parison in the molding die 4. The container is formed by pressure contacting with 4c. The molding die 4 moves directly under the die head 3 which is the original position in the open state. On the other hand, the air blowing nozzle 8 suspends the molded container, and the molded product holder (not shown) takes out the molded product from the air blowing nozzle 8 and carries the molded product to the outside.

The steps using the IC label magazine 20 and the label magazine 30 in the molding step will be described as follows. That is, as shown in FIG. 5, the arm opening / closing servomotor 41 of the mechanism 40 for pulling out the label is driven to open the first arm 49 and the second arm 50, and the cavity D2 on the right side in the drawing of the molding mold 4 is opened. The IC label 21 whose edge is lifted by the feed pole 23 is sucked from the backing tape 22 of the IC label 21 by the front air suction pads 51 and 53, and the arm opening / closing servomotor 41 of the mechanism 40 for pulling out the label is driven. Step S21 is performed in which the first arm 49 and the second arm 50 are closed and the IC label 21 is pulled out from the mount tape 22.

Subsequently, step S22 is carried out in which the advance / retreat servomotor 62 of the inserter 60 is driven to advance the plate 61, and the first arm 49 and the second arm 50 are advanced by one step to the label magazine 30.

Further, as shown in FIG. 6, the arm opening / closing servomotor 41 of the label pulling-out mechanism 40 was driven to open the first arm 49 and the second arm 50, and the label was pulled out to the exposed label 31 of the label magazine 30. The IC label 21 is pressed and attached. At the same time, the IC label 21 whose edge is lifted by the feed pole 23 is sucked from the backing tape 22 of the IC label 21 for the cavity D1 on the left side of the molding die 4 by the rear air suction pads 52 and 54. In this state, the arm opening / closing servomotor 41 of the mechanism 40 for pulling out the label is driven to close the first arm 49 and the second arm 50, and the label 31 with the IC label for the cavity D2 and the IC label 21 for the cavity D1 are pulled out. , Step S23 is carried out.

Further, as shown in FIG. 7, the first arm 49 and the second arm 50 are further advanced by driving the advance / retreat servomotor 62 of the inserter 60 and advancing the plate 61 to further advance the rear air suction pad 52. , 54 is carried out in step S24 for advancing one step to the label magazine 30.

Subsequently, the arm opening / closing servomotor 41 of the label pulling-out mechanism 40 is driven to open the first arm 49 and the second arm 50, and the pulled-out IC label 21 is pressed against the next exposed label 31 of the label magazine 30. Attach. Then, the arm opening / closing servomotor 41 of the mechanism 40 for pulling out the label is driven to close the first arm 49 and the second arm 50, and step S25 for pulling out the label 31 with the IC label for the cavity D1 is carried out.

Then, as shown in FIG. 8, the first arm 49 and the second arm 50 are inserted and advanced by driving the advance / retreat servomotor 62 of the inserter 60 to advance the plate 61, and the left and right sides of the molding die 4 are inserted and advanced. Step S26 for aligning the IC-labeled label 31 with each of the cavities D1 and D2 is performed.

After the execution of step S26, step S1 for sliding the molding die 4 is performed.

Next, the arm opening / closing servomotor 41 of the mechanism 40 for pulling out the label is driven to open the first arm 49 and the second arm 50, and the label 31 with the IC label is placed in the cavities D1 and D2 of the mold 4. Step 27 of sticking and holding through 4d is carried out.

Subsequently, the arm opening / closing servomotor 41 of the mechanism 40 for pulling out the label is driven to close the first arm 49 and the second arm 50, and the front air suction pads 51, 53 and the rear air suction pads 52, 54 are closed in the cavities D1, Step S28 to move away from D2 is carried out.

Finally, step S29 is performed in which the advance / retreat servomotor 62 of the inserter 60 is driven and sent to retract the plate 61 to return the first arm 49 and the second arm 50 to the original positions at the start of operation.

Following this step S29, the above-mentioned mold closing step S2 is carried out. After that, the steps after step S21 will be repeated.

As shown in FIG. 11, the molded container P has a label 31 with an IC label 21 attached to the body P of the container P. Further, as shown in FIG. 12, the outer surface of the label 31 is flush with the outer surface of the body PD of the container P. As a result, a container can be obtained in which the IC label is not easily peeled off and the label 31 on the surface can protect the IC label 21 from damage.

3 ... Die head 4 ... Molding mold 4d ... Air suction hole (IC label and mechanism for holding the label)
7 ... Mold clamping device 8 ... Air blowing nozzle 9 ... Nozzle driving device 20 ... IC label magazine 21 ... IC label (non-contact wireless identification terminal)
30 ... Label magazine 31 ... Label 40 ... Mechanism for pulling out the label 60 ... Inserter

Claims (2)

In direct blowｰ_Naru form machine,
A label that covers the surface of each non-contact wireless identification terminal in the direction intersecting the opening / closing direction of the pair of split dies and in order toward the outside, which is the outer side of the molding die composed of the pair of split dies. the provided with a label magazine in which a plurality loaded, said to be adjacent to the label magazine, provided the magazine loaded with a plurality of said contactless radio identification terminal,
A mechanism for pulling out the label in a state where the non-contact wireless identification terminal pulled out from the magazine is pressed against the corresponding label of the label magazine and attached to the label is provided, and the non-contact wireless identification terminal is moved back and forth to the pair of open split molds. , the said non-contact type radio frequency identification terminal and the label is withdrawn, provided the inserter to be transferred into the said pair of split molds,
A direct blow molding machine provided with a mechanism for sucking the non-contact wireless identification terminal and the label from the inserter that has entered the pair of split molds and holding the label in the pair of split molds. 1. The non-contact wireless identification terminal and a mechanism for holding the label include the non-contact wireless identification terminal and an air suction portion for holding the label on the cavity surface of the mold. Direct blow molding machine described in.

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