JP6927696B2

JP6927696B2 - Ultrasonic oscillator

Info

Publication number: JP6927696B2
Application number: JP2016247425A
Authority: JP
Inventors: 賢志関森
Original assignee: Nisshinbo Holdings Inc; Japan Radio Co Ltd; Ueda Japan Radio Co Ltd
Current assignee: Nisshinbo Holdings Inc; Japan Radio Co Ltd; Ueda Japan Radio Co Ltd
Priority date: 2016-12-21
Filing date: 2016-12-21
Publication date: 2021-09-01
Anticipated expiration: 2036-12-21
Also published as: JP2018101924A

Description

本発明は、超音波振動子に関し、特に、ケース外部に接続ピンが導出された超音波振動子に関する。 The present invention relates to an ultrasonic vibrator, and more particularly to an ultrasonic vibrator in which a connecting pin is derived outside the case.

超音波を送信して、その反射波を受信する超音波振動子が様々な用途で利用されている。例えば、医療分野における被検体の検査や、自動車を駐車場に駐車する際の障害物の検出等に超音波振動子が利用されている。 Ultrasonic transducers that transmit ultrasonic waves and receive the reflected waves are used in various applications. For example, ultrasonic vibrators are used for inspection of subjects in the medical field, detection of obstacles when parking an automobile in a parking lot, and the like.

この超音波振動子は、外部の回路基板との間で信号の入出力を行っている。回路基板との接続には、超音波振動子から導出されたリード線を回路基板に接続する構成（例えば、特許文献１参照）や、超音波振動子の接続ピンを回路基板に直接接続する構成（例えば、特許文献２参照）等が知られている。 This ultrasonic transducer inputs and outputs signals to and from an external circuit board. For connection with the circuit board, a lead wire derived from the ultrasonic vibrator is connected to the circuit board (see, for example, Patent Document 1), or a connection pin of the ultrasonic vibrator is directly connected to the circuit board. (See, for example, Patent Document 2) and the like are known.

特開２００６−２０４５５２号公報Japanese Unexamined Patent Publication No. 2006-20452 特開２００６−２７９５６７号公報Japanese Unexamined Patent Publication No. 2006-279567

特許文献１に記載の構成では、超音波振動子と回路基板との間にリード線が必要であり、超音波振動子と回路基板との間にリード線が介在することから小型化を図ることが困難である。また、特許文献２に記載の構成では、リード線が不要であり、小型化を図ることが可能である。 In the configuration described in Patent Document 1, a lead wire is required between the ultrasonic vibrator and the circuit board, and the lead wire is interposed between the ultrasonic vibrator and the circuit board, so that the size can be reduced. Is difficult. Further, the configuration described in Patent Document 2 does not require a lead wire, and can be miniaturized.

しかし、一般的に超音波振動子をケース等で基板上に固定するが、この際、超音波振動子と回路基板との位置関係に、製造誤差や組立誤差等により位置ずれが生じた場合、この位置ずれ状態において超音波振動子の接続ピンと回路基板とを接続すると、接続部分に応力が作用し、接続ピンと回路基板との接続不良が発生する可能性がある。また、超音波振動子の振動や、外部からの振動（衝撃を含む）によって、超音波振動子の接続ピンと回路基板と間に応力が作用することもある。 However, in general, the ultrasonic vibrator is fixed on the substrate with a case or the like, but at this time, if the positional relationship between the ultrasonic vibrator and the circuit board is displaced due to manufacturing error, assembly error, etc., If the connection pin of the ultrasonic vibrator and the circuit board are connected in this misaligned state, stress acts on the connection portion, and there is a possibility that a poor connection between the connection pin and the circuit board may occur. In addition, stress may act between the connection pin of the ultrasonic vibrator and the circuit board due to the vibration of the ultrasonic vibrator or the vibration (including impact) from the outside.

なお、特許文献１に記載の構成であれば、超音波振動子と回路基板との位置関係に製造誤差や組立誤差等による位置ずれが発生しても、超音波振動子のリード線により位置ずれによる応力は吸収されるが、上述したように小型化を図ることは困難である。 In the configuration described in Patent Document 1, even if the positional relationship between the ultrasonic vibrator and the circuit board is displaced due to manufacturing error, assembly error, or the like, the position shift is caused by the lead wire of the ultrasonic vibrator. Although the stress caused by the above is absorbed, it is difficult to reduce the size as described above.

そこで、本発明では、超音波振動子の小型化と、超音波振動子の接続部分への応力集中の抑制とを両立する超音波振動子を提供することを目的とする。 Therefore, an object of the present invention is to provide an ultrasonic vibrator that achieves both miniaturization of the ultrasonic vibrator and suppression of stress concentration on the connecting portion of the ultrasonic vibrator.

本発明の超音波振動子は、筒状のケースと、前記ケースの内部の一端側に配置された圧電素子と、前記ケースの内部の他端側に配置され、前記圧電素子と電気的に接続された基板と、前記基板に固定されて、一端が前記ケースの外部に導出された接続ピンと、前記ケースの内部に充填された樹脂とを備え、前記基板が、前記ケースに対して非接触状態で前記樹脂により保持されており、前記樹脂は、前記圧電素子の周囲と前記圧電素子よりも前記基板側に充填される第１の樹脂と、前記第１の樹脂よりも前記基板側で、前記基板の周囲に充填される第２の樹脂とを有し、前記接続ピンは、前記ケースの外部における回路基板固定部に固定された回路基板に接続され、前記ケースは、前記回路基板固定部とは別に設けられた超音波振動子固定部に固定され、前記第１の樹脂の弾性率は、前記第２の樹脂の弾性率よりも小さく、前記第２の樹脂は、前記接続ピンおよび前記基板が動くことが可能な程度の弾性を有することを特徴とする。望ましくは、前記圧電素子よりも前記ケース内側に前記圧電素子に隣接して配置されたバッキング材を備え、前記第１の樹脂は、前記圧電素子および前記バッキング材の周囲と、前記バッキング材よりも前記基板側に充填される。また、本発明の超音波振動子は、筒状のケースと、前記ケースの内部の一端側に配置された圧電素子と、前記圧電素子よりも前記ケース内側に前記圧電素子に隣接して配置されたバッキング材と、前記ケースの内部の他端側に配置され、前記圧電素子と電気的に接続された基板と、前記基板に固定されて、一端が前記ケースの外部に導出された接続ピンと、前記ケースの内部に充填された樹脂であって、前記圧電素子および前記バッキング材の周囲と、前記バッキング材よりも前記基板側に充填される樹脂とを備え、前記接続ピンは、前記ケースの外部における回路基板固定部に固定された回路基板に接続され、前記ケースは、前記回路基板固定部とは別に設けられた超音波振動子固定部に固定され、前記基板が、前記ケースに対して非接触状態で前記樹脂により保持されており、前記樹脂は、前記接続ピンおよび前記基板が動くことが可能な程度の弾性を有することを特徴とする。 The ultrasonic vibrator of the present invention is arranged on a tubular case, a piezoelectric element arranged on one end side inside the case, and on the other end side inside the case, and is electrically connected to the piezoelectric element. The substrate is in a non-contact state with respect to the case. The resin is held by the resin, and the resin is filled around the piezoelectric element, on the substrate side of the piezoelectric element, and on the substrate side of the first resin. It has a second resin filled around the substrate, the connection pin is connected to a circuit board fixed to a circuit board fixing portion outside the case, and the case is connected to the circuit board fixing portion. is fixed to the ultrasonic vibrator fixing portion provided separately from the elastic modulus of the first resin, the second rather smaller than the elastic modulus of the resin, the second resin, said connecting pin and said It is characterized by having elasticity to the extent that the substrate can move. Desirably, a backing material arranged adjacent to the piezoelectric element is provided inside the case of the piezoelectric element, and the first resin is present around the piezoelectric element and the backing material, and more than the backing material. The substrate side is filled. Further, the ultrasonic vibrator of the present invention has a tubular case, a piezoelectric element arranged on one end side inside the case, and a piezoelectric element arranged adjacent to the piezoelectric element inside the case with respect to the piezoelectric element. A backing material, a substrate arranged on the other end side inside the case and electrically connected to the piezoelectric element, and a connection pin fixed to the substrate and one end led out to the outside of the case. A resin filled inside the case, including a resin filled around the piezoelectric element and the backing material and a resin filled on the substrate side of the backing material, and the connection pin is outside the case. The case is connected to a circuit board fixed to the circuit board fixing portion in the above, and the case is fixed to an ultrasonic transducer fixing portion provided separately from the circuit board fixing portion, and the substrate is not attached to the case. It is held by the resin in a contact state, and the resin is characterized by having elasticity to such an extent that the connection pin and the substrate can move .

また、本発明の超音波振動子は、筒状のケースと、前記ケースの内部の一端側に配置された圧電素子と、前記ケースの内部の他端側に配置され、前記圧電素子と電気的に接続された基板と、前記基板に固定されて、一端が前記ケースの外部に導出された接続ピンと、前記ケースの内部に充填された樹脂とを備え、前記ケースは、前記圧電素子が収容された第１の収容部と、前記基板が収容された第２の収容部と、前記第１の収容部と前記第２の収容部との境に形成された段差であって、前記第２の収容部から内側に広がる段差と、を有し、前記基板は、前記段差に載置されており、前記樹脂は、前記圧電素子の周囲と前記圧電素子よりも前記基板側に充填される第１の樹脂と、前記第１の樹脂よりも前記基板側で、前記基板の周囲に充填される第２の樹脂とを有し、前記接続ピンは、前記ケースの外部における回路基板固定部に固定された回路基板に接続され、前記ケースは、前記回路基板固定部とは別に設けられた超音波振動子固定部に固定され、前記第１の樹脂の弾性率は、前記第２の樹脂の弾性率よりも小さく、前記第２の樹脂は、前記接続ピンおよび前記基板が動くことが可能な程度の弾性を有することを特徴とする。望ましくは、前記圧電素子よりも前記ケース内側に前記圧電素子に隣接して配置されたバッキング材を備え、前記第１の樹脂は、前記圧電素子および前記バッキング材の周囲と、前記バッキング材よりも前記基板側に充填される。また、本発明の超音波振動子は、筒状のケースと、前記ケースの内部の一端側に配置された圧電素子と、前記圧電素子よりも前記ケース内側に前記圧電素子に隣接して配置されたバッキング材と、前記ケースの内部の他端側に配置され、前記圧電素子と電気的に接続された基板と、前記基板に固定されて、一端が前記ケースの外部に導出された接続ピンと、前記ケースの内部に充填された樹脂であって、前記圧電素子および前記バッキング材の周囲と、前記バッキング材よりも前記基板側に充填される樹脂とを備え、前記ケースは、前記圧電素子が収容された第１の収容部と、前記基板が収容された第２の収容部と、前記第１の収容部と前記第２の収容部との境に形成された段差であって、前記第２の収容部から内側に広がる段差と、を有し、前記接続ピンは、前記ケースの外部における回路基板固定部に固定された回路基板に接続され、前記ケースは、前記回路基板固定部とは別に設けられた超音波振動子固定部に固定され、前記基板は、前記段差に載置されており、前記樹脂は、前記接続ピンおよび前記基板が動くことが可能な程度の弾性を有することを特徴とする。 Further, the ultrasonic transducer of the present invention has a tubular case, a piezoelectric element arranged on one end side inside the case, and a piezoelectric element arranged on the other end side inside the case, and is electrically connected to the piezoelectric element. The case includes a substrate connected to the substrate, a connection pin fixed to the substrate and one end of which is led out to the outside of the case, and a resin filled inside the case. The case contains the piezoelectric element. A step formed at the boundary between the first accommodating portion, the second accommodating portion in which the substrate is accommodated, and the first accommodating portion and the second accommodating portion, and the second accommodating portion. The first substrate has a step extending inward from the accommodating portion, the substrate is placed on the step, and the resin is filled around the piezoelectric element and on the substrate side of the piezoelectric element. And a second resin that is filled around the substrate on the substrate side of the first resin, and the connection pin is fixed to a circuit board fixing portion outside the case. The case is fixed to an ultrasonic vibrator fixing portion provided separately from the circuit board fixing portion, and the elasticity of the first resin is the elasticity of the second resin. rather smaller than, the second resin is characterized by having a degree of elasticity capable of the connecting pins and the substrate is moved. Desirably, a backing material arranged adjacent to the piezoelectric element is provided inside the case of the piezoelectric element, and the first resin is present around the piezoelectric element and the backing material, and more than the backing material. The substrate side is filled. Further, the ultrasonic transducer of the present invention has a tubular case, a piezoelectric element arranged on one end side inside the case, and a piezoelectric element arranged adjacent to the piezoelectric element inside the case with respect to the piezoelectric element. A backing material, a substrate arranged on the other end side inside the case and electrically connected to the piezoelectric element, and a connection pin fixed to the substrate and one end led out to the outside of the case. A resin filled inside the case, including a resin filled around the piezoelectric element and the backing material and a resin filled on the substrate side of the backing material, and the case accommodates the piezoelectric element. The second accommodating portion formed at the boundary between the first accommodating portion, the second accommodating portion in which the substrate is accommodated, and the first accommodating portion and the second accommodating portion. The connection pin is connected to a circuit board fixed to a circuit board fixing portion outside the case, and the case is separated from the circuit board fixing portion. Rukoto fixed to the ultrasonic transducer fixed portion provided, the substrate is placed on the step, the resin is to have a degree of elasticity capable of the connecting pins and the substrate is moved It is characterized by .

また、前記基板は、弾性部材を介して前記段差に載置され、前記ケースに保持されている。さらに、前記弾性部材は、環状のシリコーンゴムである。 Further, the substrate is placed on the step via an elastic member and held in the case. Further, the elastic member is an annular silicone rubber.

本発明によれば、超音波振動子の小型化と、超音波振動子の接続部分への応力集中の抑制とを両立することができる。その結果、小型化により超音波振動子の適用範囲を拡げることができ、また、超音波振動子の接続ピンと回路基板との接続不良の発生を抑制することができる。 According to the present invention, it is possible to achieve both miniaturization of the ultrasonic vibrator and suppression of stress concentration on the connecting portion of the ultrasonic vibrator. As a result, the application range of the ultrasonic vibrator can be expanded by miniaturization, and the occurrence of poor connection between the connection pin of the ultrasonic vibrator and the circuit board can be suppressed.

第１の実施形態を示す超音波振動子の概略断面図である。It is the schematic sectional drawing of the ultrasonic vibrator which shows 1st Embodiment. 第２の実施形態を示す超音波振動子の概略断面図である。It is the schematic sectional drawing of the ultrasonic vibrator which shows the 2nd Embodiment. 第３の実施形態を示す超音波振動子の概略断面図である。It is the schematic sectional drawing of the ultrasonic vibrator which shows the 3rd Embodiment.

第１の実施形態について図１を参照して説明する。図１に示すように、超音波振動子１０は、ＰＢＴ樹脂（ポリブチレンテレフタレート樹脂）からなる円筒形状のケース１１と、ケース１１の一端に固定された整合層１２と、ケース１１の内部において、整合層１２と対向して配置された圧電素子１３と、圧電素子１３に隣接して配置されたバッキング材１４と、ケース１１の内部において、ケース１１の他端側に配置されたピンヘッダー１５と、ケース１１の内部に充填されたシリコーン樹脂１６とを備えている。 The first embodiment will be described with reference to FIG. As shown in FIG. 1, the ultrasonic vibrator 10 has a cylindrical case 11 made of PBT resin (polybutylene terephthalate resin), a matching layer 12 fixed to one end of the case 11, and inside the case 11. A piezoelectric element 13 arranged to face the matching layer 12, a backing material 14 arranged adjacent to the piezoelectric element 13, and a pin header 15 arranged on the other end side of the case 11 inside the case 11. , A silicone resin 16 filled inside the case 11 is provided.

圧電素子１３の両面には、図示しない電極が形成されている。これら電極は、リード線１７ａ，１７ｂによりピンヘッダー１５に接続されている。ピンヘッダー１５は、リード線１７ａ，１７ｂが接続される基板１５ａと、この基板１５ａに接続される複数の接続ピン１５ｂと、接続ピン１５ｂを基板１５ａに固定する固定樹脂１５ｃとを備えている。 Electrodes (not shown) are formed on both sides of the piezoelectric element 13. These electrodes are connected to the pin header 15 by lead wires 17a and 17b. The pin header 15 includes a substrate 15a to which lead wires 17a and 17b are connected, a plurality of connection pins 15b connected to the substrate 15a, and a fixing resin 15c for fixing the connection pins 15b to the substrate 15a.

接続ピン１５ｂは、ケース１１の外部に導出する長さを有しており、超音波振動子１０が取り付けられる回路基板ＫＢに、例えば、はんだ付け等により固定される。また、回路基板ＫＢは回路基板固定部ＦＰａに固定されている。 The connection pin 15b has a length that leads out to the outside of the case 11, and is fixed to the circuit board KB to which the ultrasonic vibrator 10 is mounted, for example, by soldering or the like. Further, the circuit board KB is fixed to the circuit board fixing portion FPa.

ケース１１の内部には、圧電素子１３、バッキング材１４、ピンヘッダー１５が配置された後に、シリコーン樹脂１６が充填される。シリコーン樹脂１６には硬化後も弾性を有するものを使用する。すなわち、シリコーン樹脂１６の硬化後もピンヘッダー１５がシリコーン樹脂１６において動くことが可能な弾性を有するものを使用する。また、シリコーン樹脂１６の充填時には、冶具等を用いてピンヘッダー１５をケース１１の内周面から離間させた位置に保持して、ケース１１の内部にシリコーン樹脂１６を充填する。そして、シリコーン樹脂１６の硬化後に、超音波振動子１０を回路基板ＫＢに取り付ける。 The inside of the case 11 is filled with the silicone resin 16 after the piezoelectric element 13, the backing material 14, and the pin header 15 are arranged. A silicone resin 16 having elasticity even after curing is used. That is, a pin header 15 having elasticity capable of moving in the silicone resin 16 even after the silicone resin 16 is cured is used. When filling the silicone resin 16, the pin header 15 is held at a position separated from the inner peripheral surface of the case 11 by using a jig or the like, and the inside of the case 11 is filled with the silicone resin 16. Then, after the silicone resin 16 is cured, the ultrasonic vibrator 10 is attached to the circuit board KB.

超音波振動子１０を回路基板ＫＢに取り付けたときに、ピンヘッダー１５の接続ピン１５ｂと回路基板ＫＢとの位置関係に製造誤差や組立誤差等により位置ずれが生じた場合や、外部から、超音波振動子１０を固定している超音波振動子固定部ＦＰｂを介して超音波振動子１０に振動が加わって位置ずれが生じた場合、あるいは、超音波振動子１０が振動して位置ずれが生じた場合でも、ピンヘッダー１５がケース１１の内部で動くことができるので、それら位置ずれを吸収することができ、接続部分への応力集中が抑制される。 When the ultrasonic vibrator 10 is attached to the circuit board KB, the positional relationship between the connection pin 15b of the pin header 15 and the circuit board KB may be displaced due to manufacturing error, assembly error, or the like, or from the outside. When vibration is applied to the ultrasonic vibrator 10 via the ultrasonic vibrator fixing portion FPb fixing the sound vibrator 10 to cause a misalignment, or when the ultrasonic vibrator 10 vibrates and the misalignment occurs. Even if it occurs, the pin header 15 can move inside the case 11, so that the misalignment can be absorbed and the stress concentration on the connecting portion is suppressed.

このため、接続ピン１５ｂと回路基板ＫＢとの接続不良の発生を抑制することができる。また、超音波振動子１０は、回路基板ＫＢに直接取り付けられるので、超音波振動子１０と回路基板ＫＢとの間のリード線を不要にすることができ、部品点数を削減して小型化を図ることができる。 Therefore, it is possible to suppress the occurrence of poor connection between the connection pin 15b and the circuit board KB. Further, since the ultrasonic vibrator 10 is directly attached to the circuit board KB, the lead wire between the ultrasonic vibrator 10 and the circuit board KB can be eliminated, and the number of parts can be reduced to reduce the size. Can be planned.

なお、圧電素子１３とピンヘッダー１５との間のリード線１７ａ，１７ｂの長さは、ピンヘッダー１５が動いても、このリード線１７ａ，１７ｂに張力が作用しないように、余裕を持った長さとすることが好ましい。 The lengths of the lead wires 17a and 17b between the piezoelectric element 13 and the pin header 15 are long enough so that tension does not act on the lead wires 17a and 17b even if the pin header 15 moves. It is preferable to use.

次に、第２の実施形態について図２を参照して説明する。以下に説明する各実施形態において、第１の実施形態において説明した構成要素と同様の構成要素には、同一の符号を付してその説明を省略する。 Next, the second embodiment will be described with reference to FIG. In each of the embodiments described below, the same components as those described in the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

図２に示すように、超音波振動子２０では、ケース１１に充填するシリコーン樹脂に、第１のシリコーン樹脂１８と第２のシリコーン樹脂１９との２種類のシリコーン樹脂を使用している。 As shown in FIG. 2, in the ultrasonic vibrator 20, two types of silicone resins, a first silicone resin 18 and a second silicone resin 19, are used as the silicone resin to be filled in the case 11.

ケース１１の内部において、圧電素子１３及びバッキング材１４の周囲には、第１のシリコーン樹脂１８が充填されている。また、ケース１１の内部において、ピンヘッダー１５の基板１５ａの周囲には、第２のシリコーン樹脂１９が充填されている。 Inside the case 11, the first silicone resin 18 is filled around the piezoelectric element 13 and the backing material 14. Further, inside the case 11, a second silicone resin 19 is filled around the substrate 15a of the pin header 15.

第１のシリコーン樹脂１８の弾性率は、第２のシリコーン樹脂１９の弾性率よりも小さい。すなわち、第１のシリコーン樹脂１８及び第２のシリコーン樹脂１９の充填後、圧電素子１３及びバッキング材１４の周囲の第１のシリコーン樹脂１８の方が、ピンヘッダー１５の基板１５ａの周囲の第２のシリコーン樹脂１９よりも柔らかくなっている。 The elastic modulus of the first silicone resin 18 is smaller than the elastic modulus of the second silicone resin 19. That is, after filling the first silicone resin 18 and the second silicone resin 19, the first silicone resin 18 around the piezoelectric element 13 and the backing material 14 is the second around the substrate 15a of the pin header 15. It is softer than the silicone resin 19 of.

このように、圧電素子１３及びバッキング材１４の周囲の第１のシリコーン樹脂１８と、ピンヘッダー１５の基板１５ａの周囲の第２のシリコーン樹脂１９とを異なる弾性率とすることによって、ケース１１の内部において、圧電素子１３やピンヘッダー１５の基板１５ａに対して最適な保持を行うことができる。 In this way, the first silicone resin 18 around the piezoelectric element 13 and the backing material 14 and the second silicone resin 19 around the substrate 15a of the pin header 15 have different elastic moduli, so that the case 11 has different elastic moduli. Inside, optimum holding can be performed on the substrate 15a of the piezoelectric element 13 and the pin header 15.

すなわち、外部から、超音波振動子１０を固定している超音波振動子固定部ＦＰｂを介して超音波振動子１０に振動が作用した場合、第１のシリコーン樹脂１８によって、圧電素子１３及びバッキング材１４への振動の伝達が抑制される。圧電素子１３はそれ自身が振動するため、外部からの振動伝達の抑制により、超音波振動子２０の動作精度の向上に繋がる。 That is, when vibration acts on the ultrasonic vibrator 10 from the outside via the ultrasonic vibrator fixing portion FPb fixing the ultrasonic vibrator 10, the first silicone resin 18 causes the piezoelectric element 13 and the backing. The transmission of vibration to the material 14 is suppressed. Since the piezoelectric element 13 vibrates itself, suppressing the transmission of vibration from the outside leads to an improvement in the operating accuracy of the ultrasonic vibrator 20.

なお、第２のシリコーン樹脂１９は、基板１５ａと回路基板ＫＢとの位置ずれを吸収できればよく、また、基板１５ａがケース１１の内部において所定位置に保持されるだけの弾性率があれば良い。 The second silicone resin 19 only needs to be able to absorb the positional deviation between the substrate 15a and the circuit board KB, and has an elastic modulus sufficient to hold the substrate 15a in a predetermined position inside the case 11.

次に、第３の実施形態について図３を参照して説明する。図３に示すように、超音波振動子３０のケース３１の内周面には段部３２が形成されている。 Next, the third embodiment will be described with reference to FIG. As shown in FIG. 3, a step portion 32 is formed on the inner peripheral surface of the case 31 of the ultrasonic vibrator 30.

ケース３１は、圧電素子１３及びバッキング材１４を収容する第１の収容部３１ａと、ピンヘッダー１５を収容する第２の収容部３１ｂとを有している。第１の収容部３１ａの内径Ｒ１は、第２の収容部３１ｂの内径Ｒ２より小さく設定されている。すなわち、第１の収容部３１ａと第２の収容部３１ｂとの境において段部３２が形成されている。この段部３２には、シリコーンゴムからなるＯリング３３が載置されている。Ｏリング３３の弾性率としては、ケース３１の内部に充填するシリコーン樹脂１６よりも低いものを選択することが好ましい。なお、Ｏリング３３の材質をシリコーン樹脂１６と同様のものとしてもよい。 The case 31 has a first accommodating portion 31a accommodating the piezoelectric element 13 and the backing material 14, and a second accommodating portion 31b accommodating the pin header 15. The inner diameter R1 of the first accommodating portion 31a is set smaller than the inner diameter R2 of the second accommodating portion 31b. That is, the step portion 32 is formed at the boundary between the first accommodating portion 31a and the second accommodating portion 31b. An O-ring 33 made of silicone rubber is placed on the step portion 32. As the elastic modulus of the O-ring 33, it is preferable to select one having a modulus lower than that of the silicone resin 16 filled inside the case 31. The material of the O-ring 33 may be the same as that of the silicone resin 16.

Ｏリング３３の上には、ピンヘッダー１５の基板１５ａが載置されている。この状態で、ケース３１の内部にシリコーン樹脂１６が充填される。すなわち、第３の実施形態では、ピンヘッダー１５が、Ｏリング３３を介してケース３１の段部３２に載置されている。 The substrate 15a of the pin header 15 is placed on the O-ring 33. In this state, the inside of the case 31 is filled with the silicone resin 16. That is, in the third embodiment, the pin header 15 is placed on the step portion 32 of the case 31 via the O-ring 33.

このように、ピンヘッダー１５を、Ｏリング３３を介してケース３１の段部３２に載置することによって、ピンヘッダー１５の接続ピン１５ｂと回路基板ＫＢとの位置関係に製造誤差や組立誤差等により位置ずれが生じた場合や、外部から、超音波振動子１０を固定している超音波振動子固定部ＦＰｂを介して超音波振動子１０に振動が加わって位置ずれが生じた場合、あるいは、超音波振動子１０が振動して位置ずれが生じた場合でも、ピンヘッダー１５がＯリング３３を押し潰すことによりケース３１の内部で動くことができるので、それらの位置ずれを吸収することができ、接続ピン１５ｂへの応力集中が抑制される。その結果、接続ピン１５ｂと回路基板ＫＢとの接続不良の発生を抑制することができる。 By mounting the pin header 15 on the step portion 32 of the case 31 via the O-ring 33 in this way, the positional relationship between the connection pin 15b of the pin header 15 and the circuit board KB has manufacturing errors, assembly errors, and the like. When the position shift occurs due to the vibration, or when vibration is applied to the ultrasonic vibrator 10 from the outside via the ultrasonic vibrator fixing portion FPb which fixes the ultrasonic vibrator 10, or the position shift occurs. Even if the ultrasonic vibrator 10 vibrates and causes misalignment, the pin header 15 can move inside the case 31 by crushing the O-ring 33, so that the misalignment can be absorbed. This allows stress concentration on the connecting pin 15b to be suppressed. As a result, it is possible to suppress the occurrence of poor connection between the connection pin 15b and the circuit board KB.

また、ピンヘッダー１５をＯリング３３に載置することでピンヘッダー１５の位置決めを行うことができ、シリコーン樹脂１６の充填時に冶具を不要とすることができる。 Further, by placing the pin header 15 on the O-ring 33, the pin header 15 can be positioned, and a jig can be eliminated when filling the silicone resin 16.

１０，２０，３０超音波振動子、１１，３１ケース、１２整合層、１３圧電素子、１４バッキング材、１５ピンヘッダー、１５ａ基板、１５ｂ接続ピン、１５ｃ固定樹脂、１６シリコーン樹脂、１７ａ，１７ｂリード線、１８第１のシリコーン樹脂、１９第２のシリコーン樹脂、３１ａ第１の収容部、３１ｂ第２の収容部、３２段部、３３Ｏリング、ＫＢ回路基板、ＦＰａ回路基板固定部、ＦＰｂ超音波振動子固定部。

10,20,30 Ultrasonic vibrator, 11,31 case, 12 matching layer, 13 piezoelectric element, 14 backing material, 15 pin header, 15a substrate, 15b connection pin, 15c fixing resin, 16 silicone resin, 17a, 17b lead Wire, 18 1st silicone resin, 19 2nd silicone resin, 31a 1st accommodating part, 31b 2nd accommodating part, 32 steps, 33 O ring, KB circuit board, FPa circuit board fixing part, FPb super Sound oscillator fixing part.

Claims

A tubular case, a piezoelectric element arranged on one end side inside the case, a substrate arranged on the other end side inside the case and electrically connected to the piezoelectric element, and fixed to the substrate. A connection pin whose one end is led out to the outside of the case and a resin filled inside the case are provided.
The substrate is held by the resin in a non-contact state with respect to the case.
The resin is a first resin filled around the piezoelectric element and on the substrate side of the piezoelectric element, and a second resin filled around the substrate on the substrate side of the first resin. With resin,
The connection pin is connected to a circuit board fixed to a circuit board fixing portion outside the case.
The case is fixed to an ultrasonic vibrator fixing portion provided separately from the circuit board fixing portion.
The elastic modulus of the first resin, the second rather smaller than the elastic modulus of the resin, the second resin is characterized by having a degree of elasticity capable of the connecting pins and the substrate is moved Ultrasonic transducer.

In the ultrasonic vibrator according to claim 1,
A backing material arranged adjacent to the piezoelectric element is provided inside the case with respect to the piezoelectric element.
An ultrasonic vibrator characterized in that the first resin is filled around the piezoelectric element and the backing material and on the substrate side of the backing material.

A tubular case, a piezoelectric element arranged on one end side of the inside of the case, a backing material arranged inside the case relative to the piezoelectric element and adjacent to the piezoelectric element, and the inside of the case. A substrate arranged on the end side and electrically connected to the piezoelectric element, a connection pin fixed to the substrate and one end led out to the outside of the case, and a resin filled inside the case. The piezoelectric element, the periphery of the backing material, and the resin filled on the substrate side of the backing material are provided.
The connection pin is connected to a circuit board fixed to a circuit board fixing portion outside the case.
The case is fixed to an ultrasonic vibrator fixing portion provided separately from the circuit board fixing portion.
The substrate is held by the resin in a non-contact state with respect to the case, and the resin has elasticity to the extent that the connection pin and the substrate can move. Child.

A tubular case, a piezoelectric element arranged on one end side inside the case, a substrate arranged on the other end side inside the case and electrically connected to the piezoelectric element, and fixed to the substrate. A connection pin whose one end is led out to the outside of the case and a resin filled inside the case are provided.
The case is
A first accommodating portion accommodating the piezoelectric element and
A second accommodating portion in which the substrate is accommodating, and
It has a step formed at the boundary between the first accommodating portion and the second accommodating portion, and has a step extending inward from the second accommodating portion.
The substrate is placed on the step and is placed on the step.
The resin is a first resin filled around the piezoelectric element and on the substrate side of the piezoelectric element, and a second resin filled around the substrate on the substrate side of the first resin. With resin,
The connection pin is connected to a circuit board fixed to a circuit board fixing portion outside the case.
The case is fixed to an ultrasonic vibrator fixing portion provided separately from the circuit board fixing portion.
The elastic modulus of the first resin, the second rather smaller than the elastic modulus of the resin, the second resin is characterized by having a degree of elasticity capable of the connecting pins and the substrate is moved Ultrasonic transducer.

In the ultrasonic vibrator according to claim 4,
A backing material arranged adjacent to the piezoelectric element is provided inside the case with respect to the piezoelectric element.
An ultrasonic vibrator characterized in that the first resin is filled around the piezoelectric element and the backing material and on the substrate side of the backing material.

A tubular case, a piezoelectric element arranged on one end side of the inside of the case, a backing material arranged inside the case relative to the piezoelectric element and adjacent to the piezoelectric element, and the inside of the case. A substrate arranged on the end side and electrically connected to the piezoelectric element, a connection pin fixed to the substrate and one end led out to the outside of the case, and a resin filled inside the case. The piezoelectric element, the periphery of the backing material, and the resin filled on the substrate side of the backing material are provided.
The case is
A first accommodating portion accommodating the piezoelectric element and
A second accommodating portion in which the substrate is accommodating, and
It has a step formed at the boundary between the first accommodating portion and the second accommodating portion, and has a step extending inward from the second accommodating portion.
The connection pin is connected to a circuit board fixed to a circuit board fixing portion outside the case.
The case is fixed to an ultrasonic vibrator fixing portion provided separately from the circuit board fixing portion.
Said substrate, said rests on the step, the resin is an ultrasonic transducer, characterized in Rukoto which have a degree of elasticity capable of the connecting pins and the substrate is moved.

The ultrasonic vibrator according to any one of claims 4 to 6.
An ultrasonic vibrator characterized in that the substrate is placed on the step via an elastic member and held in the case.

The ultrasonic vibrator according to claim 7.
The elastic member is an ultrasonic vibrator characterized by being an annular silicone rubber.