JP6932906B2 - Electronic components and electronic component equipment - Google Patents

Description

The present invention relates to an electronic component and an electronic component device including the electronic component.

An electronic component having a body and an external electrode arranged on the body is known (see, for example, Patent Document 1). The body has a main surface and a first surface adjacent to the main surface. The external electrode has a first electrode portion arranged on the main surface and a second electrode portion arranged on the first side surface and connected to the first electrode portion. The main surface is a mounting surface facing an electronic device (for example, a circuit board or an electronic component) on which electronic components are solder-mounted.

Japanese Unexamined Patent Publication No. 58-175817

One aspect of the present invention is to provide an electronic component and an electronic component device in which the occurrence of cracks in the element body is suppressed.

As a result of the research conducted by the present inventors, the following matters were found. When an electronic component is solder-mounted on an electronic device, an external force acting on the electronic component from the electronic device may act as a stress on the element body from a solder fillet formed at the time of solder mounting through an external electrode. At this time, the stress tends to be concentrated on the edge of the external electrode, particularly the edge of the first electrode portion located on the main surface which is the mounting surface. There is a risk of cracks in the body.

The electronic component according to one aspect of the present invention has a rectangular body shape, and has a main surface as a mounting surface and a first surface adjacent to the main surface, and a main surface. An external electrode having a first electrode portion arranged above and a second electrode portion arranged on the first side surface and connected to the first electrode portion is provided, and the first electrode portion is provided. The one electrode portion has a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer, and the second electrode portion is baked. A first region having a metal forming layer and a plating layer formed on the sintered metal layer, a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and conductivity. It has a plating layer formed on the sex resin layer, and has a second region located closer to the main surface than the first region.

In the electronic component according to the above one aspect of the present invention, the first electrode portion arranged on the main surface has a conductive resin layer, and the second electrode portion arranged on the first side surface thereof. The second region of the above has a conductive resin layer. Therefore, even when an external force acts on the electronic component through the solder fillet, it is difficult for stress to concentrate on the edge of the external electrode, and the edge is unlikely to be the starting point of cracks. Therefore, the occurrence of cracks in the element body is suppressed.

The ratio of the length of the second region in the direction orthogonal to the first main surface to the length of the element body in the direction orthogonal to the main surface may be 0.2 or more. In this embodiment, it is more difficult for stress to concentrate due to the edge of the external electrode. Therefore, the generation of cracks in the element body is further suppressed.

The element body further has a second side surface adjacent to the main surface and the first side surface, and the external electrode is arranged on the second side surface and is connected to the first electrode part with the third electrode part. , And the third electrode portion has a sintered metal layer, a plating layer formed on the sintered metal layer, a third region, a sintered metal layer, and a sintered metal. A fourth region having a conductive resin layer formed on the layer and a plating layer formed on the conductive resin layer and located closer to the main surface than the third region. You may have. In this embodiment, since the fourth region of the third electrode portion arranged on the second side surface has the conductive resin layer, even if the external electrode has the third electrode portion, the external electrode It is difficult for stress to concentrate on the edge of the. Therefore, the occurrence of cracks in the element body is surely suppressed.

The ratio of the length of the fourth region in the direction orthogonal to the first main surface to the length of the element body in the direction orthogonal to the main surface may be 0.2 or more. In this embodiment, it is more difficult for stress to concentrate due to the edge of the external electrode. Therefore, the generation of cracks in the element body is further suppressed.

An electronic component device according to one aspect of the present invention includes the electronic component and an electronic device having a pad electrode connected to an external electrode via a solder fillet, and the solder fillet is a second electrode. It is formed in the first region and the second region of the part.

In the electronic component apparatus according to one aspect of the present invention, the first electrode portion arranged on the main surface has a conductive resin layer, and the second electrode portion arranged on the first side surface thereof. The second region of the above has a conductive resin layer. Therefore, even when an external force acts on the electronic component through the solder fillet, it is difficult for stress to concentrate on the edge of the external electrode, and the edge is unlikely to be the starting point of cracks. Therefore, the occurrence of cracks in the element body is suppressed.

In the electronic component apparatus according to this aspect, the solder fillet is formed not only in the second region of the second electrode portion but also in the first region. In the electronic component device according to this embodiment, the region where the solder fillet is formed is wider than the configuration in which the solder fillet is formed only in the second region of the second electrode portion, so that the mounting strength of the electronic component is increased. It is secured.

According to each aspect of the present invention, it is possible to provide an electronic component and an electronic component device in which the occurrence of cracks in the element body is suppressed.

It is a top view of the multilayer capacitor which concerns on 1st Embodiment. It is a top view of the multilayer capacitor which concerns on 1st Embodiment. It is a side view of the multilayer capacitor which concerns on 1st Embodiment. It is a side view of the multilayer capacitor which concerns on 1st Embodiment. It is a figure for demonstrating the cross-sectional structure of the multilayer capacitor which concerns on 1st Embodiment. It is a figure for demonstrating the cross-sectional structure of the multilayer capacitor which concerns on 1st Embodiment. It is a top view of the multilayer capacitor which concerns on the modification of 1st Embodiment. It is a top view of the multilayer capacitor which concerns on the modification of 1st Embodiment. It is a side view of the multilayer capacitor which concerns on this modification. It is a side view of the multilayer capacitor which concerns on this modification. It is a top view of the multilayer through capacitor which concerns on 2nd Embodiment. It is a top view of the multilayer through capacitor which concerns on 2nd Embodiment. It is a side view of the multilayer through capacitor which concerns on 2nd Embodiment. It is a side view of the multilayer through capacitor which concerns on 2nd Embodiment. It is a figure for demonstrating the cross-sectional structure of the multilayer penetration capacitor which concerns on 2nd Embodiment. It is a figure for demonstrating the cross-sectional structure of the multilayer penetration capacitor which concerns on 2nd Embodiment. It is a figure for demonstrating the cross-sectional structure of the multilayer penetration capacitor which concerns on 2nd Embodiment. It is a top view of the multilayer capacitor which concerns on 3rd Embodiment. It is a top view of the multilayer capacitor which concerns on 3rd Embodiment. It is a side view of the multilayer capacitor which concerns on 3rd Embodiment. It is a side view of the multilayer capacitor which concerns on 3rd Embodiment. It is a figure for demonstrating the cross-sectional structure of the external electrode provided in the laminated capacitor which concerns on 3rd Embodiment. It is a top view of the multilayer capacitor which concerns on 4th Embodiment. It is a top view of the multilayer capacitor which concerns on 4th Embodiment. It is a side view of the multilayer capacitor which concerns on 4th Embodiment. It is a side view of the multilayer capacitor which concerns on 4th Embodiment. It is a figure for demonstrating the cross-sectional structure of the external electrode provided in the multilayer capacitor which concerns on 4th Embodiment. It is a top view of the multilayer through capacitor which concerns on 5th Embodiment. It is a side view of the multilayer through capacitor which concerns on 5th Embodiment. It is a figure for demonstrating the cross-sectional structure of the multilayer penetration capacitor which concerns on 5th Embodiment. It is a figure for demonstrating the cross-sectional structure of the multilayer penetration capacitor which concerns on 5th Embodiment. It is a figure for demonstrating the cross-sectional structure of the multilayer penetration capacitor which concerns on 5th Embodiment. It is a top view of the multilayer through capacitor which concerns on the modification of 5th Embodiment. It is a top view of the multilayer through capacitor which concerns on this modification. It is a side view of the multilayer penetration capacitor which concerns on this modification. It is a figure for demonstrating the cross-sectional structure of the electronic component apparatus which concerns on 6th Embodiment. It is a side view of the multilayer capacitor which concerns on the modification of 1st Embodiment. It is a side view of the multilayer capacitor which concerns on the modification of 1st Embodiment. It is a side view of the multilayer through capacitor which concerns on the modification of 2nd Embodiment. It is a side view of the multilayer through capacitor which concerns on the modification of 2nd Embodiment. It is a top view of the multilayer through capacitor which concerns on the modification of 2nd Embodiment.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same code will be used for the same element or the element having the same function, and duplicate description will be omitted.

(First Embodiment)
The configuration of the multilayer capacitor C1 according to the first embodiment will be described with reference to FIGS. 1 to 6. 1 and 2 are plan views of the multilayer capacitor according to the first embodiment. 3 and 4 are side views of the multilayer capacitor according to the first embodiment. 5 and 6 are views for explaining the cross-sectional configuration of the multilayer capacitor according to the first embodiment. In the first embodiment, the multilayer capacitor C1 will be described as an example of an electronic component.

As shown in FIGS. 1 to 4, the multilayer capacitor C1 has a rectangular parallelepiped body 3 and a pair of external electrodes 5 arranged on the outer surface of the body 3. .. The pair of external electrodes 5 are separated from each other. The rectangular parallelepiped shape includes a rectangular parallelepiped shape in which corners and ridges are chamfered, and a rectangular parallelepiped shape in which corners and ridges are rounded.

As its outer surface, the element body 3 has a pair of rectangular main surfaces 3a and 3b facing each other, a pair of rectangular side surfaces 3c facing each other, and a pair of side surfaces 3e facing each other. And have. The direction in which the pair of main surfaces 3a and 3b face each other is the first direction D1, the direction in which the pair of side surfaces 3c face each other is the second direction D2, and the direction in which the pair of side surfaces 3e face each other. The third direction is D3.

The first direction D1 is a direction orthogonal to the main surfaces 3a and 3b, and is orthogonal to the second direction D2. The third direction D3 is a direction parallel to each of the main surfaces 3a and 3b and each side surface 3c, and is orthogonal to the first direction D1 and the second direction D2. In the first embodiment, the length of the element body 3 in the third direction D3 is larger than the length of the element body 3 in the first direction D1 and larger than the length of the element body 3 in the second direction D2. The third direction D3 is the longitudinal direction of the element body 3.

The pair of side surfaces 3c extend in the first direction D1 so as to connect between the pair of main surfaces 3a and 3b. The pair of side surfaces 3c also extends in the third direction D3. The pair of side surfaces 3e extend in the first direction D1 so as to connect between the pair of main surfaces 3a and 3b. The pair of side surfaces 3e also extends in the second direction D2. The main surfaces 3a and 3b are adjacent to the pair of side surfaces 3c and the first side surface 3e.

The element body 3 is configured by laminating a plurality of dielectric layers in the direction in which the pair of main surfaces 3a and 3b face each other (first direction D1). In the element body 3, the stacking direction of the plurality of dielectric layers coincides with the second direction D2. Each dielectric layer is from a sintered body of a ceramic green sheet containing, for example, a dielectric material (a dielectric ceramic such as BaTiO ₃ series, Ba (Ti, Zr) O ₃ series, or (Ba, Ca) TiO _{3 series).} It is configured. In the actual element body 3, each dielectric layer is integrated to such an extent that the boundary between the respective dielectric layers cannot be visually recognized. In the element body 3, the stacking direction of the plurality of dielectric layers may coincide with the second direction D2.

The multilayer capacitor C1 includes a plurality of internal electrodes 7 and 9, respectively, as shown in FIGS. 5 and 6. The internal electrodes 7 and 9 are made of a conductive material usually used as an internal electrode of a laminated electric element. As the conductive material, a base metal (for example, Ni or Cu) is used. The internal electrodes 7 and 9 are configured as a sintered body of a conductive paste containing the above conductive material. In the first embodiment, the internal electrodes 7 and 9 are made of Ni.

The internal electrode 7 and the internal electrode 9 are arranged at different positions (layers) in the first direction D1. That is, the internal electrodes 7 and the internal electrodes 9 are alternately arranged in the element body 3 so as to face each other with an interval in the first direction D1. The internal electrodes 7 and 9 have different polarities from each other. When the stacking direction of the plurality of dielectric layers is the second direction D2, the internal electrode 7 and the internal electrode 9 are arranged at different positions (layers) in the second direction D2. One end of the internal electrodes 7 and 9 is exposed on the corresponding side surface 3e.

The external electrodes 5 are arranged on the side surface 3e side of the element body 3, that is, at the end of the element body 3 in the third direction D3. The external electrodes 5 include an electrode portion 5a arranged on the main surface 3a, an electrode portion 5b arranged on the main surface 3b, an electrode portion 5c arranged on a pair of side surfaces 3c, and a corresponding side surface 3e. It has an electrode portion 5e arranged in. The external electrodes 5 are formed on five surfaces: a pair of main surfaces 3a and 3b, a pair of side surfaces 3c, and one side surface 3e. The electrode portions 5a, 5b, 5c, and 5e adjacent to each other are connected at the ridge portion of the element body 3 and are electrically connected to each other.

The electrode portion 5e arranged on the side surface 3e covers all the one ends exposed on the side surface 3e of the corresponding internal electrodes 7 and 9. The internal electrodes 7 and 9 are directly connected to the corresponding electrode portion 5e. The internal electrodes 7 and 9 are electrically connected to the corresponding external electrodes 5.

As shown in FIGS. 5 and 6, the external electrode 5 has a first electrode layer E1, a second electrode layer E2, a third electrode layer E3, and a fourth electrode layer E4. The fourth electrode layer E4 constitutes the outermost layer of the external electrode 5.

The electrode portion 5a has a first electrode layer E1, a second electrode layer E2, a third electrode layer E3, and a fourth electrode layer E4. That is, the electrode portion 5a has a four-layer structure. In the electrode portion 5a, the entire first electrode layer E1 is covered with the second electrode layer E2. The electrode portion 5b has a first electrode layer E1, a third electrode layer E3, and a fourth electrode layer E4. The electrode portion 5b does not have the second electrode layer E2. That is, the electrode portion 5b has a three-layer structure.

The electrode portion 5c has a region 5c ₁ and a region 5c ₂ . The region 5c ₂ is located closer to the main surface 3a than the region 5c _1. Region 5c ₁ has a first electrode layer E1, a third electrode layer E3, and a fourth electrode layer E4. Region 5c ₁ does not have a second electrode layer E2. That is, the region 5c ₁ has a three-layer structure. Region 5c ₂ has a first electrode layer E1, a second electrode layer E2, a third electrode layer E3, and a fourth electrode layer E4. That is, the region 5c ₂ has a four-layer structure.

The electrode portion 5e has a region 5e ₁ and a region 5e ₂ . The region 5e ₂ is located closer to the main surface 3a than the region 5e _1. Region 5e ₁ has a first electrode layer E1, a third electrode layer E3, and a fourth electrode layer E4. Region 5e ₁ does not have a second electrode layer E2. That is, the region 5e ₁ has a three-layer structure. Region 5e ₂ has a first electrode layer E1, a second electrode layer E2, a third electrode layer E3, and a fourth electrode layer E4. That is, the region 5e ₂ has a four-layer structure.

The first electrode layer E1 is formed by applying a conductive paste to the surface of the element body 3 and baking it. The first electrode layer E1 is a sintered metal layer formed by sintering a metal component (metal powder) contained in the conductive paste. That is, the first electrode layer E1 is a sintered metal layer formed on the element body 3. In the present embodiment, the first electrode layer E1 is a sintered metal layer made of Cu. The first electrode layer E1 may be a sintered metal layer made of Ni. As described above, the first electrode layer E1 contains a base metal. As the conductive paste, a powder made of Cu or Ni mixed with a glass component, an organic binder, and an organic solvent is used.

The second electrode layer E2 is formed by curing the conductive resin applied on the first electrode layer E1. The second electrode layer E2 is formed so as to cover a part of the first electrode layer E1 (the region corresponding to the electrode portion 5a, the region 5c _{2 of} the electrode portion 5c, and the region 5e _{2 of the electrode portion 5e).} There is. The first electrode layer E1 is also a base metal layer for forming the second electrode layer E2. The second electrode layer E2 is a conductive resin layer formed on the first electrode layer E1. As the conductive resin, a mixture of a thermosetting resin, a metal powder, an organic solvent, or the like is used. As the metal powder, for example, Ag powder, Cu powder, or the like is used. As the thermosetting resin, for example, a phenol resin, an acrylic resin, a silicone resin, an epoxy resin, a polyimide resin, or the like is used.

The third electrode layer E3 is formed on the second electrode layer E2 and on the region exposed from the second electrode layer E2 of the first electrode layer E1 by a plating method. In the present embodiment, the third electrode layer E3 is a Ni plating layer formed by Ni plating on the second electrode layer E2 and on the region exposed from the second electrode layer E2 of the first electrode layer E1. be. The third electrode layer E3 may be a Sn plating layer, a Cu plating layer, or an Au plating layer. As described above, the third electrode layer E3 contains Ni, Sn, Cu, or Au.

The fourth electrode layer E4 is formed on the third electrode layer E3 by a plating method. In the present embodiment, the fourth electrode layer E4 is a Sn plating layer formed by Sn plating on the third electrode layer E3. The fourth electrode layer E4 may be a Cu plating layer or an Au plating layer. As described above, the fourth electrode layer E4 contains Sn, Cu, or Au. The third electrode layer E3 and the fourth electrode layer E4 form a plating layer formed on the second electrode layer E2. That is, in the present embodiment, the plating layer formed on the second electrode layer E2 has a two-layer structure.

The first electrode layer E1 included in each of the electrode portions 5a, 5b, 5c, and 5e is integrally formed. The second electrode layer E2 included in each of the electrode portions 5a, 5c, 5e is integrally formed. The third electrode layer E3 included in each of the electrode portions 5a, 5b, 5c, and 5e is integrally formed. The fourth electrode layer E4 included in each of the electrode portions 5a, 5b, 5c, and 5e is also integrally formed.

The ratio (L2 / L1) of the length L2 of _{the region 5c 2} in the first direction D1 to the length L1 of the element 3 in the first direction D1 is 0.2 or more. To the length L1 of the element body 3, the ratio of the length L3 in the first direction D1 of the region 5e ₂ (L3 / L1) is 0.2 or more.

The multilayer capacitor C1 is solder-mounted on an electronic device (for example, a circuit board or an electronic component). In the multilayer capacitor C1, the main surface 3a is a mounting surface facing the electronic device.

As described above, in the first embodiment, the electrode portions 5a the second electrode layer E2 together have (conductive resin layer), a region 5e ₂ of the electrode portions 5e the second electrode layer E2 (conductive resin Layer). Therefore, even when an external force acts on the multilayer capacitor C1 through the solder fillet, it is difficult for stress to concentrate on the edge of the external electrode 5, and the edge is unlikely to be the starting point of cracks. Therefore, in the multilayer capacitor C1, the generation of cracks in the element body 3 is suppressed.

In the first embodiment, since the region 5c ₂ of the electrode portion 5c has the second electrode layer E2 (conductive resin layer), the external electrode 5 even when the external electrode 5 has the electrode portion 5c. It is difficult for stress to concentrate on the edge of the. Therefore, in the multilayer capacitor C1, the generation of cracks in the element body 3 is surely suppressed.

The ratio (L3 / L1) of the length L3 of the _{region 5e 2 to} the length L1 of the element body 3 is 0.2 or more. As a result, stress is less likely to be concentrated on the edge of the external electrode 5. Therefore, in the multilayer capacitor C1, the generation of cracks in the element body 3 is further suppressed.

The ratio (L2 / L1) of the length L2 of the _{region 5c 2 to} the length L1 of the element body 3 is 0.2 or more. Even with this, it is more difficult for stress to concentrate due to the edge of the external electrode 5. Therefore, in the multilayer capacitor C1, the generation of cracks in the element body 3 is further suppressed.

Next, the configuration of the multilayer capacitor C2 according to another modification of the first embodiment will be described with reference to FIGS. 7 to 10. 7 and 8 are plan views of the multilayer capacitor according to this modification. 9 and 10 are side views of the multilayer capacitor according to this modification.

Like the multilayer capacitor C1, the multilayer capacitor C2 includes a body 3, a pair of external electrodes 5, a plurality of internal electrodes 7, and a plurality of internal electrodes 9 (not shown). In the multilayer capacitor C2, the shape of the element body 3 is different from that of the multilayer capacitor C1.

In this modification, the length of the element body 3 in the second direction D2 is larger than the length of the element body 3 in the first direction D1 and larger than the length of the element body 3 in the third direction D3. The second direction D2 is the longitudinal direction of the element body 3. Also in this modified example, the generation of cracks in the element body 3 is suppressed.

(Second Embodiment)
The configuration of the multilayer penetration capacitor C3 according to the second embodiment will be described with reference to FIGS. 11 to 17. 11 and 12 are plan views of the multilayer through-capacitor according to the second embodiment. 13 and 14 are side views of the multilayer through-capacitor according to the second embodiment. 15 to 17 are views for explaining the cross-sectional configuration of the multilayer through-capacitor according to the second embodiment. In the second embodiment, the multilayer through-capacitor C3 will be described as an example of an electronic component.

As shown in FIGS. 11 to 14, the monolithic penetration capacitor C3 has an element body 3, a pair of external electrodes 13 arranged on the outer surface of the element body 3, and a pair of external electrodes 15. The pair of external electrodes 13 and the pair of external electrodes 15 are separated from each other. The pair of external electrodes 13 function as, for example, signal terminal electrodes, and the pair of external electrodes 15 function, for example, as grounding terminal electrodes.

The multilayer penetration capacitor C3 includes a plurality of internal electrodes 17 and 19, respectively, as shown in FIGS. 15 to 17. Like the internal electrodes 7 and 9, the internal electrodes 17 and 19 are made of a conductive material usually used as an internal electrode of a laminated electric element. Also in the second embodiment, the internal electrodes 17 and 19 are made of Ni.

The internal electrode 17 and the internal electrode 19 are arranged at different positions (layers) in the first direction D1. That is, the internal electrodes 17 and the internal electrodes 19 are alternately arranged in the element body 3 so as to face each other with an interval in the first direction D1. The internal electrode 17 and the internal electrode 19 have different polarities from each other. When the stacking direction of the plurality of dielectric layers is the second direction D2, the internal electrode 17 and the internal electrode 19 are arranged at different positions (layers) in the second direction D2. The ends of the internal electrodes 17 are exposed on the pair of side surfaces 3e. The ends of the internal electrodes 19 are exposed on the pair of side surfaces 3c.

The external electrode 13 is arranged at the end of the element body 3 in the third direction D3. The external electrodes 13 include an electrode portion 13a arranged on the main surface 3a, an electrode portion 13b arranged on the main surface 3b, an electrode portion 13c arranged on a pair of side surfaces 3c, and a corresponding side surface 3e. It has an electrode portion 13e arranged in the. The external electrodes 13 are formed on five surfaces: a pair of main surfaces 3a and 3b, a pair of side surfaces 3c, and one side surface 3e. The electrode portions 13a, 13b, 13c, and 13e adjacent to each other are connected to each other at the ridge portion of the element body 3 and are electrically connected to each other.

The electrode portion 13e arranged on the side surface 3e covers all the end portions exposed on the side surface 3e of the internal electrode 17. The internal electrode 17 is directly connected to each electrode portion 13e. The internal electrode 17 is electrically connected to the pair of external electrodes 13.

As shown in FIGS. 15 and 16, the external electrode 13 has a first electrode layer E1, a second electrode layer E2, a third electrode layer E3, and a fourth electrode layer E4. The fourth electrode layer E4 constitutes the outermost layer of the external electrode 13.

The electrode portion 13a has a first electrode layer E1, a second electrode layer E2, a third electrode layer E3, and a fourth electrode layer E4. That is, the electrode portion 13a has a four-layer structure. In the electrode portion 13a, the entire first electrode layer E1 is covered with the second electrode layer E2. The electrode portion 13b has a first electrode layer E1, a third electrode layer E3, and a fourth electrode layer E4. The electrode portion 13b does not have the second electrode layer E2. That is, the electrode portion 13b has a three-layer structure.

The electrode portion 13c has a region 13c ₁ and a region 13c ₂ . The region 13c ₂ is located closer to the main surface 3a than the region 13c _1. Region 13c ₁ has a first electrode layer E1, a third electrode layer E3, and a fourth electrode layer E4. Region 13c ₁ does not have a second electrode layer E2. That is, the region 13c ₁ has a three-layer structure. Region 13c ₂ has a first electrode layer E1, a second electrode layer E2, a third electrode layer E3, and a fourth electrode layer E4. That is, the region 13c ₂ has a four-layer structure.

The electrode portion 13e has a region 13e ₁ and a region 13e ₂ . The region 13e ₂ is located closer to the main surface 3a than the region 13e _1. Region 13e ₁ has a first electrode layer E1, a third electrode layer E3, and a fourth electrode layer E4. Region 13e ₁ does not have a second electrode layer E2. That is, the region 13e ₁ has a three-layer structure. Region 13e ₂ has a first electrode layer E1, a second electrode layer E2, a third electrode layer E3, and a fourth electrode layer E4. That is, the region 13e ₂ has a four-layer structure.

The ratio (L4 / L1) of the length L4 of _{the region 13c 2} in the first direction D1 to the length L1 of the element body 3 is 0.2 or more. The ratio (L5 / L1) of the length L5 of _{the region 13e 2} in the first direction D1 to the length L1 of the element body 3 is 0.2 or more.

The first electrode layer E1 included in each of the electrode portions 13a, 13b, 13c, 13e is integrally formed. The second electrode layer E2 included in each of the electrode portions 13a, 13c, 13e is integrally formed. The third electrode layer E3 included in each of the electrode portions 13a, 13b, 13c, 13e is integrally formed. The fourth electrode layer E4 included in each of the electrode portions 13a, 13b, 13c, 13e is also integrally formed.

The external electrode 15 is arranged at the central portion of the element body 3 in the third direction D3. The external electrode 15 has an electrode portion 15a arranged on the main surface 3a, an electrode portion 15b arranged on the main surface 3b, and an electrode portion 15c arranged on the side surface 3c. The external electrodes 15 are formed on three surfaces, a pair of main surfaces 3a and 3b, and one side surface 3c. The electrode portions 15a, 15b, and 15c adjacent to each other are connected at the ridge portion of the element body 3 and are electrically connected to each other.

The electrode portion 15c arranged on the side surface 3c covers all the end portions exposed on the side surface 3c of the internal electrode 19. The internal electrode 19 is directly connected to each electrode portion 15c. The internal electrode 19 is electrically connected to the pair of external electrodes 15.

As shown in FIG. 17, the external electrode 15 also has a first electrode layer E1, a second electrode layer E2, a third electrode layer E3, and a fourth electrode layer E4. The fourth electrode layer E4 constitutes the outermost layer of the external electrode 15.

The electrode portion 15a has a first electrode layer E1, a second electrode layer E2, a third electrode layer E3, and a fourth electrode layer E4. That is, the electrode portion 15a has a four-layer structure. In the electrode portion 15a, the entire first electrode layer E1 is covered with the second electrode layer E2. The electrode portion 15b has a first electrode layer E1, a third electrode layer E3, and a fourth electrode layer E4. The electrode portion 15b does not have the second electrode layer E2. That is, the electrode portion 15b has a three-layer structure.

The electrode portion 15c has a region 15c ₁ and a region 15c ₂ . The region 15c ₂ is located closer to the main surface 3a than the region 15c _1. Region 15c ₁ has a first electrode layer E1, a third electrode layer E3, and a fourth electrode layer E4. Region 15c ₁ does not have a second electrode layer E2. That is, the region 15c ₁ has a three-layer structure. Region 15c ₂ has a first electrode layer E1, a second electrode layer E2, a third electrode layer E3, and a fourth electrode layer E4. That is, the region 15c ₂ has a four-layer structure.

The ratio (L6 / L1) of the length L6 of _{the region 15c 2} in the first direction D1 to the length L1 of the element body 3 is 0.2 or more. The first electrode layer E1 included in each of the electrode portions 15a, 15b, and 15c is integrally formed. The second electrode layer E2 included in each of the electrode portions 15a and 15c is integrally formed. The third electrode layer E3 included in each of the electrode portions 15a, 15b, and 15c is integrally formed. The fourth electrode layer E4 included in each of the electrode portions 15a, 15b, and 15c is also integrally formed.

The monolithic penetration capacitor C3 is also solder-mounted on the electronic device. In the multilayer penetration capacitor C3, the main surface 3a is a mounting surface facing the electronic device.

As described above, in the second embodiment, the electrode portions 13a and 15a have the second electrode layer E2 (conductive resin layer), and the regions 13c ₂ and 15c ₂ of the electrode portions 13c and 15c are the second. It has an electrode layer E2 (conductive resin layer). Therefore, even when an external force acts on the laminated through capacitor C3 through the solder fillet, it is difficult for stress to concentrate on the edge edges of the external electrodes 13 and 15, and the edge edge is unlikely to be the starting point of cracks. Therefore, in the multilayer penetration capacitor C3, the generation of cracks in the element body 3 is suppressed.

The ratio (L5 / L1) of the length L5 of the _{region 13e 2 to} the length L1 of the element body 3 is 0.2 or more. As a result, stress is less likely to be concentrated on the edge of the external electrode 13. Therefore, in the multilayer penetration capacitor C3, the generation of cracks in the element body 3 is further suppressed.

The ratio (L4 / L1) of the length L4 of the _{region 13c 2 to} the length L1 of the element body 3 is 0.2 or more. Even with this, it is more difficult for stress to concentrate due to the edge of the external electrode 13. Therefore, in the multilayer penetration capacitor C3, the generation of cracks in the element body 3 is further suppressed.

In the second embodiment, the ratio (L6 / L1) of the length L6 of the _{region 15c 2 to} the length L1 of the element body 3 is 0.2 or more. As a result, stress is less likely to be concentrated on the edge of the external electrode 15. Therefore, in the multilayer penetration capacitor C3, the generation of cracks in the element body 3 is further suppressed.

(Third Embodiment)
The configuration of the multilayer capacitor C4 according to the third embodiment will be described with reference to FIGS. 18 to 22. 18 and 19 are plan views of the multilayer capacitor according to the third embodiment. 20 and 21 are side views of the multilayer capacitor according to the third embodiment. FIG. 22 is a diagram for explaining the cross-sectional configuration of the external electrode. In the third embodiment, the multilayer capacitor C4 will be described as an example of an electronic component.

As shown in FIGS. 18 to 21, the multilayer capacitor C4 has a body 3, a plurality of external electrodes 21, and a plurality of internal electrodes (not shown). The plurality of external electrodes 21 are arranged on the outer surface of the element body 3 and are separated from each other. In this embodiment, the multilayer capacitor C4 has eight external electrodes 21. The number of external electrodes 21 is not limited to eight.

Each external electrode 21 has an electrode portion 21a arranged on the main surface 3a, an electrode portion 21b arranged on the main surface 3b, and an electrode portion 21c arranged on the side surface 3c. .. The external electrodes 21 are formed on three surfaces, a pair of main surfaces 3a and 3b, and one side surface 3c. The electrode portions 21a, 21b, and 21c adjacent to each other are connected at the ridge portion of the element body 3 and are electrically connected to each other.

The electrode portion 21c arranged on the side surface 3c covers all the end portions exposed on the side surface 3c of the corresponding internal electrode. The electrode portion 21c is directly connected to the corresponding internal electrode. The external electrode 21 is electrically connected to the corresponding internal electrode.

As shown in FIG. 22, the external electrode 21 has a first electrode layer E1, a second electrode layer E2, a third electrode layer E3, and a fourth electrode layer E4. The fourth electrode layer E4 constitutes the outermost layer of the external electrode 21.

The electrode portion 21a has a first electrode layer E1, a second electrode layer E2, a third electrode layer E3, and a fourth electrode layer E4. That is, the electrode portion 21a has a four-layer structure. In the electrode portion 21a, the entire first electrode layer E1 is covered with the second electrode layer E2. The electrode portion 21b has a first electrode layer E1, a third electrode layer E3, and a fourth electrode layer E4. The electrode portion 21b does not have the second electrode layer E2. That is, the electrode portion 21b has a three-layer structure.

The electrode portion 21c has a region 21c ₁ and a region 21c ₂ . The region 21c ₂ is located closer to the main surface 3a than the region 21c _1. Region 21c ₁ has a first electrode layer E1, a third electrode layer E3, and a fourth electrode layer E4. Region 21c ₁ does not have a second electrode layer E2. That is, the region 21c ₁ has a three-layer structure. Region 21c ₂ has a first electrode layer E1, a second electrode layer E2, a third electrode layer E3, and a fourth electrode layer E4. That is, the region 21c ₂ has a four-layer structure.

The ratio (L7 / L1) of the length L7 of _{the region 21c 2} in the first direction D1 to the length L1 of the element body 3 is 0.2 or more. The first electrode layer E1 included in each of the electrode portions 21a, 21b, 21c is integrally formed. The second electrode layer E2 included in each of the electrode portions 21a and 21c is integrally formed. The third electrode layer E3 included in each of the electrode portions 21a, 21b, 21c is integrally formed. The fourth electrode layer E4 included in each of the electrode portions 21a, 21b, 21c is also integrally formed.

The multilayer capacitor C4 is also solder-mounted on the electronic device. In the multilayer capacitor C4, the main surface 3a is a mounting surface facing the electronic device.

As described above, in the third embodiment, the electrode portion 21a has the second electrode layer E2 (conductive resin layer), and the region 21c ₂ of the electrode portion 21c is the second electrode layer E2 (conductive resin). Layer). Therefore, even when an external force acts on the multilayer capacitor C4 through the solder fillet, it is difficult for stress to concentrate on the edge of the external electrode 21, and the edge is unlikely to be the starting point of cracks. Therefore, in the multilayer capacitor C4, the generation of cracks in the element body 3 is suppressed.

The ratio (L7 / L1) of the length L4 of the _{region 21c 2 to} the length L1 of the element body 3 is 0.2 or more. Even with this, it is more difficult for stress to concentrate due to the edge of the external electrode 21. Therefore, in the multilayer capacitor C4, the generation of cracks in the element body 3 is further suppressed.

(Fourth Embodiment)
The configuration of the multilayer capacitor C5 according to the fourth embodiment will be described with reference to FIGS. 23 to 27. 23 and 24 are plan views of the multilayer capacitor according to the fourth embodiment. 25 and 26 are side views of the multilayer capacitor according to the fourth embodiment. FIG. 27 is a diagram for explaining the cross-sectional configuration of the external electrode. Also in the fourth embodiment, the multilayer capacitor C5 will be described as an example as an electronic component.

As shown in FIGS. 23 to 26, the multilayer capacitor C5 has a body 3, a plurality of external electrodes 31, and a plurality of internal electrodes (not shown). The plurality of external electrodes 31 are arranged on the outer surface of the element body 3 and are separated from each other. In this embodiment, the multilayer capacitor C5 has four external electrodes 31.

The length of the element body 3 in the first direction D1 is smaller than the length of the element body 3 in the second direction D2, and is smaller than the length of the element body 3 in the third direction D3. The length of the element body 3 in the second direction D2 and the length of the element body 3 in the third direction D3 are equivalent.

Each external electrode 31 is arranged at each corner of the element body 3. Each external electrode 31 is arranged on the electrode portion 31a arranged on the main surface 3a, the electrode portion 31b arranged on the main surface 3b, the electrode portion 31c arranged on the side surface 3c, and the side surface 3e. It has an electrode portion 31e that is formed. The external electrodes 31 are formed on four surfaces of a pair of main surfaces 3a and 3b, one side surface 3c, and one side surface 3e. The electrode portions 31a, 31b, 31c, and 31e adjacent to each other are connected to each other at the ridge portion of the element body 3 and are electrically connected to each other.

The electrode portions 31c and 31e arranged on the side surface 3c and the side surface 3e cover all the end portions exposed on the side surface 3c and the side surface 3e of the corresponding internal electrodes. The electrode portions 31c and 31e are directly connected to the corresponding internal electrodes. The external electrode 31 is electrically connected to the corresponding internal electrode.

As shown in FIGS. 27A and 27, the external electrode 31 has a first electrode layer E1, a second electrode layer E2, a third electrode layer E3, and a fourth electrode layer E4. .. The fourth electrode layer E4 constitutes the outermost layer of the external electrode 31.

The electrode portion 31a has a first electrode layer E1, a second electrode layer E2, a third electrode layer E3, and a fourth electrode layer E4. That is, the electrode portion 31a has a four-layer structure. In the electrode portion 31a, the entire first electrode layer E1 is covered with the second electrode layer E2. The electrode portion 31b has a first electrode layer E1, a third electrode layer E3, and a fourth electrode layer E4. The electrode portion 31b does not have the second electrode layer E2. That is, the electrode portion 31b has a three-layer structure.

The electrode portion 31c has a region 31c ₁ and a region 31c ₂ . The region 31c ₂ is located closer to the main surface 3a than the region 31c _1. Region 31c ₁ has a first electrode layer E1, a third electrode layer E3, and a fourth electrode layer E4. Region 31c ₁ does not have a second electrode layer E2. That is, the region 31c ₁ has a three-layer structure. Region 31c ₂ has a first electrode layer E1, a second electrode layer E2, a third electrode layer E3, and a fourth electrode layer E4. That is, the region 31c ₂ has a four-layer structure.

The electrode portion 31e has a region 31e ₁ and a region 31e ₂ . The region 31e ₂ is located closer to the main surface 3a than the region 31e _1. Region 31e ₁ has a first electrode layer E1, a third electrode layer E3, and a fourth electrode layer E4. Region 31e ₁ does not have a second electrode layer E2. That is, the region 31e ₁ has a three-layer structure. Region 31e ₂ has a first electrode layer E1, a second electrode layer E2, a third electrode layer E3, and a fourth electrode layer E4. That is, the region 31e ₂ has a four-layer structure.

The ratio (L8 / L1) of the length L8 of _{the region 31c 2} in the first direction D1 to the length L1 of the element body 3 is 0.2 or more. The ratio (L9 / L1) of the length L9 of _{the region 31e 2} in the first direction D1 to the length L1 of the element body 3 is 0.2 or more.

The first electrode layer E1 included in each of the electrode portions 31a, 31b, 31c, 31e is integrally formed. The second electrode layer E2 included in each of the electrode portions 31a, 31c, 31e is integrally formed. The third electrode layer E3 included in each of the electrode portions 31a, 31b, 31c, 31e is integrally formed. The fourth electrode layer E4 included in each of the electrode portions 31a, 31b, 31c, 31e is also integrally formed.

The multilayer capacitor C5 is also solder-mounted on the electronic device. In the multilayer capacitor C5, the main surface 3a is a mounting surface facing the electronic device.

As described above, in the fourth embodiment, the electrode portion 31a has the second electrode layer E2 (conductive resin layer), and the regions 31c ₂ , 31e ₂ of the electrode portions 31c, 31e are the second electrode layers. It has E2 (conductive resin layer). Therefore, even when an external force acts on the laminated capacitor C5 through the solder fillet, it is difficult for stress to concentrate on the edge of the external electrode 31, and the edge is unlikely to be the starting point of cracks. Therefore, in the multilayer capacitor C5, the generation of cracks in the element body 3 is suppressed.

_{The ratio of the length L8 of the region 31c 2 to} the length L1 of the element body 3 (L8 / L1) is 0.2 or more, and the ratio of the length L9 of the _{region 31e 2 to the length L1 of the element body 3} (L9 / L1) is 0.2 or more. Therefore, it is more difficult for stress to concentrate due to the edge of the external electrode 31. Therefore, in the multilayer capacitor C5, the generation of cracks in the element body 3 is further suppressed.

(Fifth Embodiment)
The configuration of the multilayer penetration capacitor C6 according to the fifth embodiment will be described with reference to FIGS. 28 to 32. FIG. 28 is a plan view of the multilayer through capacitor according to the fifth embodiment. FIG. 29 is a side view of the multilayer through capacitor according to the fifth embodiment. 30 to 32 are views for explaining the cross-sectional configuration of the multilayer through-capacitor according to the fifth embodiment. In the fifth embodiment, the multilayer through-capacitor C6 will be described as an example of an electronic component.

As shown in FIGS. 28 and 29, the multilayer penetration capacitor C6 has a body 3, a pair of external electrodes 13, a pair of external electrodes 15, a plurality of internal electrodes 17, and a plurality of internal electrodes 19. There is. The monolithic penetration capacitor C6 is also solder-mounted on the electronic device. In the multilayer penetration capacitor C6, the main surface 3a is a mounting surface facing the electronic device.

As shown in FIGS. 30 and 31, the external electrode 13 has a first electrode layer E1, a third electrode layer E3, and a fourth electrode layer E4. In the multilayer penetration capacitor C6, the external electrode 13 does not have the second electrode layer E2. The electrode portion 13a, the electrode portion 13c, and the electrode portion 13e have a first electrode layer E1, a third electrode layer E3, and a fourth electrode layer E4, each of which has a four-layer structure. The fourth electrode layer E4 constitutes the outermost layer of the external electrode 13.

As shown in FIG. 32, the external electrode 15 has a first electrode layer E1, a second electrode layer E2, a third electrode layer E3, and a fourth electrode layer E4, similarly to the multilayer penetration capacitor C3.

The multilayer penetration capacitor C6 includes a pair of insulating films I. The insulating film I is made of an electrically insulating material (for example, an insulating resin or glass). In the present embodiment, the insulating film I is made of an insulating resin such as an epoxy resin.

Insulating film I along the edges 13c _e edge 13a _e and the electrode portion 13c of the electrode portions 13a, and covers a part of the portion of the external electrode 13 and the body 3. The electrode portion 13b, the electrode portion 13e, and the main surface 3b are not covered with the insulating film I.

Insulating film I, a part of the edge 13a _e and edge 13c _e along the (main surface 3a side of the portion in the first direction D1) only, only a portion of the edge 13a _e and the edge 13c _e And continuously cover the main surface 3a and the side surface 3c. The insulating film I is located on the film portion Ia located on the electrode portion 13a, the film portion Ib located on the electrode portion 13c, the film portion Ic located on the main surface 3a, and the side surface 3c. It has a film portion Id that is formed. The membrane portions Ia, Ib, Ic, and Id are integrally formed.

The surface of the electrode portion 13a has a region covered with an insulating film I (membrane portion Ia) along the edge 13a _e, and a region exposed from the insulating film I. The region exposed from the insulating film I is located closer to the side surface 3e than the region covered by the film portion Ia. The surface of the electrode portion 13c has a region covered with an insulating film I (membrane portion Ib) along the edge 13c _e, and a region exposed from the insulating film I.

The main surface 3a has a region covered with an insulating film I (membrane portion Ic) along the edge 13a _e, and a region exposed from the insulating film I. Side 3c has a region covered with an insulating film I (membrane portion Id) along the edge 13c _e, and a region exposed from the insulating film I.

In the fifth embodiment, the ratio (L11 / L1) of each length L11 of the film portion Ib and the film portion Id in the first direction D1 to the length L1 of the element body 3 is 0.1 or more and 0.4. It is as follows. Further, the ratio (L13 / L12) of the length L13 of the film portion Ia in the third direction D3 to the length L12 of the electrode portion 13a in the third direction D3 is 0.3 or more.

As described above, in the fifth embodiment, since the insulating film I covers the only part of the edge 13a _e and edge 13c _e consecutively, the solder fillet, edges 13a _e and, does not reach a part of the edge 13c _e (edge portion positioned in the vicinity of the main surface 3a of the electrode portion 13c). Therefore, even when external force is applied to the multilayer feedthrough capacitor C6 through solder fillet edges _13a e, stress is hardly concentrated on 13c _e, edge _13a e, 13c _e hardly become a starting point of cracks.

In the multilayer penetration capacitor C6, the electrode portion 15a has the second electrode layer E2, and the region 15c ₂ of the electrode portion 15c has the second electrode layer E2. Therefore, even when an external force acts on the laminated through capacitor C6 through the solder fillet, it is difficult for stress to concentrate on the edge of the external electrode 15, and the edge is unlikely to be the starting point of cracks.

As a result, in the multilayer penetration capacitor C6, the generation of cracks in the element body 3 is suppressed.

In the fifth embodiment, the insulating film I, along with Mito part edge 13a _e and the edge 13c _e, since continuously covers the main surface 3a and the side surface 3c, and the edge 13a _e a portion of the edge 13c _e are reliably covered with the insulating film I. Therefore, the multilayer feedthrough capacitor C6, the edges _13a e, 13c _e hardly more become a starting point of cracks.

In the fifth embodiment, since the entire electrode portion 13b is exposed from the insulating film I, a solder fillet is formed on the electrode portion 13b. Therefore, the mounting strength of the multilayer penetration capacitor C6 is ensured.

In the fifth embodiment, the ratio (L11 / L1) of each length L11 of the film portion Ib and the film portion Id to the length L1 of the element body 3 is 0.1 or more and 0.4 or less. In this case, the size of the insulating film I is reduced while ensuring the effect of suppressing the occurrence of cracks. Therefore, the cost of the multilayer penetration capacitor C6 can be reduced. If the ratio (L11 / L1) is less than 0.1, the edges _13a e, large stress acts on 13c _e, edge _13a e, 13c _e tends to be a starting point of cracks.

In the fifth embodiment, the ratio (L13 / L12) of the length L13 of the film portion Ia to the length L12 of the electrode portion 13a is 0.3 or more. In this case, since it is difficult to concentrate more stress by edge 13a _e, the cracks occur in the element 3 is further suppressed. That is, when the ratio (L13 / L12) is less than 0.3, a large stress acting on the edge 13a _e, easy edge 13a _e becomes a starting point of cracks.

Next, the configuration of the multilayer penetration capacitor C7 according to the modified example of the fifth embodiment will be described with reference to FIGS. 33 to 35. 33 and 34 are plan views of the multilayer penetrating capacitor according to this modification. FIG. 35 is a side view of the multilayer through capacitor according to this modification.

Similar to the multilayer penetration capacitor C6, the multilayer penetration capacitor C7 includes a body 3, a pair of external electrodes 13, a pair of external electrodes 15, a plurality of internal electrodes 17 (not shown), and a plurality of internal electrodes 19 (not shown). It has. In the multilayer penetration capacitor C7, the shape of the insulating film I is different from that of the multilayer penetration capacitor C6.

The multilayer penetration capacitor C7 includes a pair of insulating films I as shown in FIGS. 33 to 35. Insulating film I has edge 13a _e of the electrode unit 13a, the edge 13b _e of the electrode portion 13b, and along the edge 13c _e of the electrode portion 13c, and a portion of the part and the element body 3 of the external electrodes 13 Covering. The electrode portion 13e is not covered with the insulating film I.

Insulating film I has edge 13a _e, edges 13b _e, and along all of the edges 13c _e, edge 13a _e, edges 13b _e, and with an edge 13c _e covers continuously, The main surface 3a, the main surface 3b, and the side surface 3c are continuously covered. The insulating film I is located on the film portion Ia located on the electrode portion 13a, the film portion Ib located on the electrode portion 13c, the film portion Ic located on the main surface 3a, and the side surface 3c. It has a film portion Id, a film portion Ie located on the electrode portion 13b, and a film portion If located on the main surface 3b. Each film portion Ia, Ib, Ic, Id, Ie, If is integrally formed.

The surface of the electrode portion 13a has a region covered with an insulating film I (membrane portion Ia) along the edge 13a _e, and a region exposed from the insulating film I. The region exposed from the insulating film I on the surface of the electrode portion 13a is located closer to the side surface 3e than the region covered by the film portion Ia. The surface of the electrode portion 13c has a region covered with an insulating film I (membrane portion Ib) along the edge 13c _e, and a region exposed from the insulating film I. The region exposed from the insulating film I on the surface of the electrode portion 13c is located closer to the side surface 3e than the region covered by the film portion Ib. The surface of the electrode portion 13b has a region covered with an insulating film I (membrane portion Ie) along the edge 13b _e, and a region exposed from the insulating film I. The region exposed from the insulating film I on the surface of the electrode portion 13b is located closer to the side surface 3e than the region covered by the film portion Ie.

The main surface 3a has a region covered with an insulating film I (membrane portion Ic) along the edge 13a _e, and a region exposed from the insulating film I. Side 3c has a region covered with an insulating film I (membrane portion Id) along the edge 13c _e, and a region exposed from the insulating film I. Major surface 3b has a region covered with an insulating film I (membrane portion If) along the edge 13b _e, and a region exposed from the insulating film I.

In this modification, the insulating film I has edges 13a _e, edges 13b _e, and since all the edges 13c _e covers continuously, is reliably prevented from cracking in the element 3 NS.

Insulating film I has edge 13a _e, along all edges 13b _e, and edges 13c _e, the main surface 3a, so continuously covers the major surface 3b, and the side surface 3c, the edges 13a _e all edges 13b _e, and edges 13c _e are reliably covered with the insulating film I. Therefore, the edges 13a _e and the edge 13c _e hardly more become a starting point of cracks.

(Sixth Embodiment)
The configuration of the electronic component device ECD according to the sixth embodiment will be described with reference to FIG. 36. FIG. 36 is a diagram for explaining a cross-sectional configuration of the electronic component device according to the sixth embodiment.

As shown in FIG. 36, the electronic component device ECD includes a multilayer capacitor C1 and an electronic device ED. The electronic device ED is, for example, a circuit board or other electronic component.

The multilayer capacitor C1 is solder-mounted on the electronic device ED. The electronic device ED has a main surface EDa and two pad electrodes PE1 and PE2. The pad electrodes PE1 and PE2 are arranged on the main surface EDa. The two pad electrodes PE1 and PE2 are separated from each other. The multilayer capacitor C1 is arranged in the electronic device ED so that the main surface 3a, which is the mounting surface, and the main surface EDa face each other.

When the multilayer capacitor C1 is solder-mounted, the molten solder wets the external electrode 5 (fourth electrode layer E4). A solder fillet SF is formed on the external electrode 5 by solidifying the wet solder. The corresponding external electrode 5 and the pad electrodes PE1 and PE2 are connected via a solder fillet SF.

The solder fillet SF is formed in _{the region 5e 1} and the region 5e _{2 of the electrode portion 5e.} That is, _{not only the region 5e 2 but also the region 5e 1} having no second electrode layer E2 (conductive resin layer) is connected to the pad electrodes PE1 and PE2 via the solder fillet SF. Although not shown, the solder fillet SF is also formed in _{the region 5c 1} and the region 5c _{2 of the electrode portion 5c.}

In the electronic component device ECD, the area in which the solder fillet SF is formed is wider than that in the electronic component device in which the solder fillet SF is formed only in _{the region 5e 2 of the electrode portion 5e, so that the mounting strength of the multilayer capacitor C1 is large.} Is secured.

The region 5e ₂ protrudes from the region 5e ₁ in the second direction D2 and the third direction D3. Therefore, a step is formed at the boundary between the region 5e ₂ and the region 5e _1. In the vicinity of the boundary between the _{region 5e 2} and the region 5e _{1 , the surface area of the region 5e 1} is smaller than the surface area of the region 5e ₂ , so that the path through which the molten solder gets wet is small. As a result, the molten solder tends to get wet _{from the region 5e 2} to the region 5e ₁ , and the solder tends to accumulate in the step formed by the _{region 5e 2} and the region 5e _1. A solder pool is formed in the step formed by the region 5e ₂ and the region 5e _1.

In the electronic component device ECD shown in FIG. 36 formed, as compared with the electronic component device which is not a step is formed in the boundary between the region 5e ₂ and the region 5e _1, the solder sump through the region 5e ₂ and the region 5e ₁ Since it is formed in the above-mentioned step, _{the volume of the solder fillet formed in the region 5e 2} and the pad electrodes PE1 and PE2 is small. Therefore, the force acting on the multilayer capacitor C1 from the solder fillet SF is small, and the stress concentrated on the edge of the first electrode layer E1 located on the main surface 3a, which is the mounting surface, is also small. As a result, the edge of the first electrode layer E1 is unlikely to be the starting point of cracks, and the occurrence of cracks in the element body 3 is suppressed.

In the electronic component device ECD, a solder fillet SF is formed because the amount of solder that gets wet in _{the area 5e 1} is larger than that in the electronic component device in which a step is not formed at the boundary between _{the area 5e 2} and the area 5e _1. The area is wide. As a result, the mounting strength of the multilayer capacitor C1 is improved.

The second electrode layer E2 (conductive resin layer) is included in the step formed by the region 5e ₂ and the region 5e _1. Therefore, the _{solder pool formed in the step formed by the region 5e 2} and the region 5e ₁ is unlikely to be the starting point of the crack. Therefore, cracks are unlikely to occur in the external electrode 5.

As shown in FIGS. 1 and 4, the region 5c ₂ protrudes from the region 5c ₁ in the second direction D2 and the third direction D3. Therefore, a step is formed at the boundary between the region 5c ₂ and the region 5c _1. In the vicinity of the boundary between the _{region 5c 2} and the region 5c _{1 , the surface area of the region 5c 1} is smaller than the surface area of the region 5c ₂ , so that the path through which the molten solder gets wet is small. As a result, the molten solder tends to get wet _{from the region 5c 2} to the region 5c ₁ , and the solder tends to accumulate in the step formed by the _{region 5c 2} and the region 5c _1. Although not shown, a solder pool is also formed in the step formed by the _{region 5c 2} and the region 5c _1.

In the electronic component device ECD, as compared with the electronic component device which is not a step is formed at the boundary between the regions 5c ₂ and the region 5c _1, formed in the step in which solder pool is formed by the region 5c ₂ and the region 5c ₁ Therefore, the volume of the solder fillet formed in the region 5c ₂ and the pad electrodes PE1 and PE2 is small. Therefore, the force acting on the multilayer capacitor C1 from the solder fillet SF is small, and the stress concentrated on the edge of the first electrode layer E1 located on the main surface 3a, which is the mounting surface, is also small. As a result, the edge of the first electrode layer E1 is unlikely to be the starting point of cracks, and the occurrence of cracks in the element body 3 is suppressed.

In the electronic component device ECD, a solder fillet SF is formed because the amount of solder that gets wet in _{the area 5c 1} is larger than that in the electronic component device in which a step is not formed at the boundary between _{the region 5c 2} and the region 5c _1. The area is wide. As a result, the mounting strength of the multilayer capacitor C1 is further improved.

The second electrode layer E2 (conductive resin layer) is included in the step formed by the region 5c ₂ and the region 5c _1. Therefore, the _{solder pool formed in the step formed by the region 5c 2} and the region 5c ₁ is unlikely to be the starting point of the crack. Therefore, cracks are less likely to occur in the external electrode 5.

The ratio (L3 / L1) of the length L3 of the _{region 5e 2 to} the length L1 of the element body 3 may be 0.8 or less. When the ratio (L3 / L1) is 0.8 or less, the solder is formed on the step formed by the _{region 5e 2} and the region 5e ₁ as compared with the case where the ratio (L3 / L1) is larger than 0.8. A puddle is surely formed.

The ratio (L2 / L1) of the length L3 of the _{region 5c 2 to} the length L1 of the element body 3 may be 0.8 or less. When the ratio (L2 / L1) is 0.8 or less, the solder is formed on the step formed by the _{region 5c 2} and the region 5c ₁ as compared with the case where the ratio (L2 / L1) is larger than 0.8. A puddle is surely formed.

Although the embodiments of the present invention have been described above, the present invention is not necessarily limited to the above-described embodiments, and various modifications can be made without departing from the gist thereof.

The electronic component device ECD may include a multilayer capacitor C2, C4, C5 or a multilayer through capacitor C3, C6, C7 instead of the multilayer capacitor C1.

When the electronic component device ECD includes the multilayer penetration capacitor C3, the solder fillet SF is formed in _{the regions 13e 1} and the regions 13e _{2 of the electrode portion 13e.} Further, the solder fillet SF is also formed in _{the region 15c 1} and the region 15c _{2 of the electrode portion 15c.}

When the electronic component device ECD includes the multilayer capacitor C4, the solder fillet SF is formed in _{the region 21c 1} and the region 21c _{2 of the electrode portion 21c.} When the electronic component device ECD includes the multilayer capacitor C5, the solder fillet SF is formed in _{the regions 31c 1} , 31e ₁ and the regions 31c ₂ , 31e _{2 of the electrode portions 31c, 31e.}

When the electronic component device ECD includes the multilayer penetration capacitors C6 and C7, the solder fillet SF is formed in _{the region 15c 1} and the region 15c _{2 of the electrode portion 15c.} Further, the solder fillet SF is formed on the electrode portion 13e.

In the multilayer capacitor C1, as shown in FIGS. 37 and 38 _{, the width of the region 5c 2} in the third direction D3 may increase as the distance from the region 5c _{1 increases.} In the multilayer penetration capacitor C3, as shown in FIGS. 39 and 40 _{, the width of the region 13c 2} in the third direction D3 may increase as the distance from the region 13c _{1 increases.} In either case, the molten solder _{tends to get wet from the regions 5c 2} , 13c ₂ to the regions 5c ₁ , 13c ₁ , so that cracks are further suppressed from occurring in the element body 3 and the mounting strength is further suppressed. Is improved.

The multilayer penetration capacitor C3 may include one external electrode 15 as shown in FIG. 41. In this case, the electrode portion 15a extends on the main surface 3a in the second direction D2. In this modified example as well, in the electrode portion 15a, the entire first electrode layer E1 is covered with the second electrode layer E2.

In the present embodiment, multilayer capacitors C1, C2, C4, C5 and multilayer penetration capacitors C3, C6, and C7 have been described as examples of electronic components, but applicable electronic components are not limited to multilayer capacitors and multilayer penetration capacitors. .. Applicable electronic components are, for example, laminated electronic components such as laminated inductors, laminated varistor, laminated piezoelectric actuators, laminated thermistors, or laminated composite components, or electronic components other than laminated electronic components.

3 ... Elementary body, 3a, 3b ... Main surface, 3c, 3e ... Side surface, 5,13,15,21,31 ... External electrodes, 5a, 5b, 5c, 5e, 13a, 13b, 13c, 13e, 15a, 15b , 15c, 21a, 21b, 21c, 31a, 31b, 31c, 31e ... Electrodes, 5c ₁ , 5c ₂ , 5e ₁ , 5e ₂ , 13c ₁ , 13c ₂ , 13e ₁ , 13e ₂ , 15c ₁ , 15c ₂ , 21c ₁ , 21c ₂ , 31c ₁ , 31c ₂ , 31e ₁ , 31e ₂ ... Electrode region, C1, C2, C4, C5 ... Multilayer capacitor, C3, C5, C7 ... Multilayer through capacitor, E1 ... First electrode layer , E2 ... second electrode layer, E3 ... third electrode layer, E4 ... fourth electrode layer, ECD ... electronic component device, ED ... electronic device, PE1, PE2 ... pad electrode, SF ... solder fillet.

Claims (11)

An element body having a rectangular parallelepiped shape and having a main surface as a mounting surface and a pair of first side surfaces adjacent to the main surface and facing each other.
A plurality of internal electrodes arranged in the body and having an end exposed on the corresponding first side surface of the pair of first side surfaces, and a plurality of internal electrodes.
A first electrode portion arranged on the main surface and a first electrode portion arranged on the corresponding first side surface so as to cover the end portion of the internal electrode and connected to the first electrode portion. It is provided with a two-electrode portion and a plurality of external electrodes having the same.
The first electrode portion has a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer.
The second electrode portion is
A first region having a sintered metal layer and a plating layer formed on the sintered metal layer,
It has a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer, and has the main component rather than the first region. Has a second area, which is located closer to the surface,
In the first region, the sintered metal layer is exposed from the conductive resin layer.
In the first electrode portion, an electronic component in which the entire sintered metal layer is covered with the conductive resin layer. An element body having a rectangular parallelepiped shape and having a main surface as a mounting surface and a pair of first side surfaces adjacent to the main surface and facing each other.
A plurality of internal electrodes arranged in the body and having an end exposed on the corresponding first side surface of the pair of first side surfaces, and a plurality of internal electrodes.
A first electrode portion arranged on the main surface and a first electrode portion arranged on the corresponding first side surface so as to cover the end portion of the internal electrode and connected to the first electrode portion. It is provided with a two-electrode portion and a plurality of external electrodes having the same.
The first electrode portion has a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer.
The second electrode portion is
A first region having a sintered metal layer and a plating layer formed on the sintered metal layer,
It has a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer, and has the main component rather than the first region. Has a second area, which is located closer to the surface,
In the first region, the sintered metal layer is exposed from the conductive resin layer.
In the first electrode portion, the conductive resin layer is an electronic component extending to the main surface. According to claim 1 or 2 , the ratio of the length of the second region in the direction orthogonal to the main surface to the length of the element body in the direction orthogonal to the main surface is 0.2 or more. Described electronic components. Claim that the ratio of the length of the second region in the direction orthogonal to the main surface to the length of the element body in the direction orthogonal to the main surface is 0.8 or less. The electronic component according to 3. The electronic component according to any one of claims 1 to 4, wherein in the second region, the conductive resin layer extends to the corresponding first side surface. The element body further has a second side surface adjacent to the main surface and the pair of first side surfaces.
The external electrode further includes a third electrode portion that is arranged on the second side surface and is connected to the first electrode portion.
The third electrode portion is
A third region having a sintered metal layer and a plating layer formed on the sintered metal layer,
It has a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer, and has the main component rather than the third region. It has a fourth area, which is located closer to the surface , and
In the third region, the sintered metal layer is exposed from the conductive resin layer.
The electronic component according to any one of claims 1 to 4, wherein in the fourth region, the conductive resin layer extends to the second side surface. The sixth aspect of claim 6, wherein the ratio of the length of the fourth region in the direction orthogonal to the main surface to the length of the element body in the direction orthogonal to the main surface is 0.2 or more. Electronic components. Claim that the ratio of the length of the fourth region in the direction orthogonal to the main surface to the length of the element body in the direction orthogonal to the main surface is 0.8 or less. 7. The electronic component according to 7. The electronic component according to any one of claims 6 to 8, wherein the width of the fourth region in the direction in which the pair of first side surfaces face each other increases as the distance from the third region increases. .. The electronic component according to any one of claims 1 to 9, wherein the conductive resin layer is in contact with the sintered metal layer and also with the plating layer. The electronic component according to any one of claims 1 to 10 and
An electronic device having a pad electrode connected to the external electrode via a solder fillet.
The solder fillet is an electronic component device formed in the first region and the second region of the second electrode portion.

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