JP6938362B2 - RFID label - Google Patents

Description

The present invention relates to RFID labels.

In recent years, RFID (Radio Frequency Identification) has been used for various purposes in order to efficiently perform product manufacturing control, product distribution control, and the like. This RFID is called an RFID tag or RFID label, and is a short-range radio using an electromagnetic field, radio waves, or the like between an electronic device equipped with an IC chip and an antenna and an information reading / writing device (reader / writer). By performing communication, information can be written to the electronic device in a non-contact manner, or information can be read from the electronic device in a non-contact manner.

For example, the RFID label is visually printed with identification information about the object (product, etc.) attached to the surface of the RFID label, and the identification information about the object is recorded on the IC chip.

Since the RFID label bulges due to the thickness of the built-in IC chip, the IC chip may be damaged by an external force (point pressure or surface pressure).
As an RFID medium that solves the problem caused by the swelling due to the thickness of the IC chip, for example, an RFID base material, an antenna provided on one surface of the inlet base material, and an RFID inlet provided with an IC chip connected to the antenna. It is known that the RFID inlet is covered with a surface base material on which the surface is printed, and the fiber sheet is arranged at least in the region corresponding to the IC chip (see, for example, Patent Document 1). ).

International Publication No. 2017/11209

However, since the RFID medium described in Patent Document 1 is intended to eliminate printing defects such as missing prints and faint prints when printing by a printing machine, it is sufficient to prevent damage to the IC chip. Did not have sufficient strength.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an RFID label in which an IC chip is prevented from being damaged by an external force.

The RFID label of the present invention comprises an IC chip, an inlet having an antenna connected to the IC chip, and a laminate having at least a wet non-woven tape attached to the IC chip and covering at least the IC chip, and the laminate. A surface substrate provided on one surface or the other surface of the body and printed on the surface, and a double-sided tape provided on the surface of the laminate opposite to the surface provided with the surface substrate. It is characterized by having.

In the RFID label of the present invention, the thickness of the wet non-woven fabric is preferably 0.07 mm or more.

In the RFID label of the present invention, the basis weight of the wet non-woven fabric ^{is preferably 30 g / m 2} or more.

According to the present invention, it is possible to provide an RFID label that prevents the IC chip from being damaged by an external force.

It is a figure which shows the main part structure of the RFID label by embodiment of this invention, (a) is the perspective view, (b) is the cross-sectional arrow view along the line AA in (a). It is an exploded perspective view which shows the main part structure of the RFID label by embodiment of this invention. It is a figure which shows the relationship between the measurement result of the surface pressure of an RFID label, and the thickness of a non-woven fabric in an experimental example. It is a figure which shows the relationship between the measurement result of the surface pressure of the RFID label, and the basis weight of the non-woven fabric in the experimental example. It is a figure which shows the relationship between the measurement result of the point pressure of an RFID label, and the thickness of a non-woven fabric in an experimental example. It is a figure which shows the relationship between the measurement result of the point pressure of an RFID label and the basis weight of a non-woven fabric in an experimental example.

Hereinafter, the RFID label according to the embodiment of the present invention will be described in detail with reference to the drawings.
It should be noted that the embodiments described below are specifically described in order to better understand the gist of the present invention, and do not limit the present invention. Further, in the drawings referred to below, in order to facilitate understanding, the dimensions of each member are appropriately changed and shown.

1A and 1B are views showing a main configuration of an RFID label according to an embodiment of the present invention, in which FIG. 1A is a perspective view, and FIG. 1B is a cross-sectional view taken along the line AA in FIG. It is a figure. FIG. 2 is an exploded perspective view showing a main configuration of an RFID label according to an embodiment of the present invention.
As shown in FIGS. 1 and 2, the RFID label 10 of the present embodiment is attached to the IC chip 21 and the inlet 20 having the antenna 22 connected to the IC chip 21, and at least the IC chip 21, and at least the IC. A laminate 40 having a wet non-woven fabric 30 covering the chip 21, a surface base material 40 provided on one surface 40a of the laminate 40 and printed on the surface 40a, and a surface substrate 40 provided on the other surface 40b of the laminate 40. It is roughly composed of a double-sided tape 50. Specifically, the surface base material 50 is provided on the surface (upper surface) 30a opposite to the surface (lower surface) 30b in contact with the inlet 20 of the wet non-woven fabric 30. Further, the double-sided tape 60 is provided on the surface (lower surface) 20b opposite to the surface (upper surface) 20a to which the wet non-woven fabric 30 is attached in the inlet 20.

In the RFID label 10, as shown in FIG. 1, the double-sided tape 60, the inlet 20, the wet non-woven fabric 30, and the surface base material 50 are laminated in this order. Each of these components is laminated via an adhesive or by direct welding or the like.
The thickness of the RFID label 10 is not particularly limited, but is, for example, 0.2 mm to 0.4 mm in consideration of suitability for ribbon printing and thermal printing.

The inlet 20 is roughly composed of a base material 23, an IC chip 21 provided on one surface 23a of the base material 23 (upper surface 20a of the inlet 20), and an antenna 22 electrically connected to the IC chip 21. There is.
The wet non-woven fabric 30 is attached to at least the IC chip 21, and is provided on one surface 23a of the base material 23 so as to cover at least the IC chip 21 provided on one surface 23a of the base material 23. .. More specifically, the wet non-woven fabric 30 is attached to at least the IC chip 21 without using a film or the like. The wet nonwoven fabric 30 may be attached to at least the IC chip 21 via an adhesive layer (not shown) formed by curing the liquid adhesive.

The antenna 22 has a main line portion 24, two impedance adjusting portions 25A and 25B, and two radiating portions 26A and 26B.
The main line portion 24 is connected to the impedance adjusting portions 25A and 25B. Further, the main line portion 24 is connected to the radiating portions 26A and 26B on the opposite side of the impedance adjusting portions 25A and 25B. Further, the main line portion 24 and the radiating portion 26A form a radiating element 27A, and the main line portion 24 and the radiating portion 26B form a radiating element 27B.

Examples of materials constituting the antenna 22 include known polymer-type conductive inks, conductive inks such as silver ink compositions, metal foils, metal thin films formed by electroplating or electrostatic plating, and metal vapor deposition. Examples thereof include a metal thin film and a metal plate formed by a thin film forming method.

The IC chip 21 is not particularly limited as long as it can write and read information in a non-contact state via the antenna 22. As the IC chip 21, any contactless IC tag, contactless IC label, or anything applicable to RFID media such as a contactless IC card can be used.
The thickness of the IC chip 21 is, for example, 120 μm to 150 μm.

The base material 23 is not particularly limited, and examples thereof include a base material made of various resins, a base material made of high-quality paper, thin paper, glassine paper, parchment paper, and the like.

The wet non-woven fabric 30 is a non-woven fabric obtained by mixing fibers having a length of 2 mm to 15 mm and water, straining them on a mesh-like net, and dehydrating them with pressure or heat.
The material of the fibers constituting the wet non-woven fabric 30 is not particularly limited, and those generally used for non-woven fabric can be applied.

The thickness of the wet non-woven fabric 30 is preferably 0.07 mm or more, more preferably 0.15 mm or more. On the other hand, the upper limit of the thickness of the wet non-woven fabric 30 is appropriately adjusted within a range in which the thickness of the entire RFID label 10 does not exceed 0.5 mm.
When the thickness of the wet non-woven fabric 30 is 0.07 mm or more, when a force is applied to the region of the RFID label 10 where the IC chip 21 is arranged with a stainless steel disk having a diameter of 30 mm in the thickness direction of the RFID label 10. As a result, it is possible to prevent the IC chip 21 from being damaged by an external force. If the thickness of the wet non-woven fabric 30 is 0.15 mm or more, the IC chip 21 on the RFID label 10 is arranged by a method conforming to IEC-J60950-1 (information device / touch confirmation by test finger). When a force is applied to the region in the thickness direction of the RFID label 10 with a test finger, the pressure (point pressure) becomes large, and as a result, the effect of preventing damage to the IC chip 21 can be further enhanced.

The basis weight of the wet non-woven fabric ^{is preferably 30 g / m 2} or more, and more preferably 50 g / m ² or more. On the other hand, the upper limit of the basis weight of the wet nonwoven fabric 30 is not particularly limited, but is appropriately adjusted in consideration of the buffering action of the wet nonwoven fabric 30 to relax the external force and the flexibility of the entire RFID label 10. The finer the mesh of the wet non-woven fabric 30, the greater the buffering action of the wet non-woven fabric 30.
When the texture of the wet non-woven fabric is 30 g / m ² or more, a force is applied to the region of the RFID label 10 where the IC chip 21 is arranged with a stainless steel disk having a diameter of 30 mm in the thickness direction of the RFID label 10. In this case, the pressure (surface pressure) becomes large, and as a result, it is possible to prevent the IC chip 21 from being damaged by an external force. If the texture of the wet non-woven fabric 30 is 50 g / m ² or more, the IC chip 21 on the RFID label 10 is arranged by a method compliant with IEC-J60950-1 (information device / touch confirmation by test finger). When a force is applied to the region in the thickness direction of the RFID label 10 with a test finger, the pressure (point pressure) becomes large, and as a result, the effect of preventing damage to the IC chip 21 can be further enhanced.

The surface base material 50 is made of a paper medium or the like for ribbon printing or thermal printing.

The double-sided tape 60 is not particularly limited, but those generally used for labels can be applied.
Further, a release paper (not shown) may be provided on the surface (attachment surface) 60a opposite to the surface of the double-sided tape 60 that is adhered to the inlet 20.

According to the RFID label 10 of the present embodiment, since the wet non-woven fabric 30 which is attached to at least the IC chip 21 and covers at least the IC chip 21 is provided, the pressure resistance and the buffering action of the wet non-woven fabric 30 provide an external force. Therefore, it is possible to prevent the IC chip 21 from being damaged. Further, the RFID label 10 of the present embodiment is excellent in flexibility because it is a laminated body in which the double-sided tape 60, the inlet 20, the wet non-woven fabric 30 and the surface base material 50 are laminated in this order.

The RFID label 10 of the present embodiment illustrates the case where the wet non-woven fabric 30 covers at least the IC chip 21, but the present invention is not limited to this. In the present invention, the wet non-woven fabric 30 may cover one surface 23a of the IC chip 21 and the base material 23 around it.

In the present embodiment, the laminate 40 having the wet non-woven fabric 30 attached to the inlet 20 and the upper surface 20a thereof, the surface base material 50 provided on one surface 40a of the laminate 40, and the laminate 40 Although the RFID label 10 provided with the double-sided tape 60 provided on the other surface 40b has been illustrated, the RFID label 10 of the present embodiment is not limited to this. The RFID label 10 of the present embodiment includes a laminate 40 having a wet non-woven fabric 30 attached to an inlet 20 and its upper surface 20a, a surface base material 50 provided on the other surface 40b of the laminate 40, and a laminate. A double-sided tape 60 provided on one side 40a of the 40 may be provided. The RFID label 10 having such a configuration also has the above-mentioned effect.

Hereinafter, the present invention will be described in more detail with reference to Experimental Examples, but the present invention is not limited to the following Experimental Examples.

[Experimental Example 1]
FIG. 1 and FIG. The RFID label of Experimental Example 1 as shown in FIG. 2 was produced.
As the non-woven fabric, a wet non-woven fabric made of polyolefin (PO) fiber, having a thickness of 0.28 mm and a basis weight of 62 g / m ^{2, was used.}

[Experimental Example 2]
As the non-woven fabric, the RFID label of Experimental Example 2 was produced in the same manner as in Experimental Example 1 except that a wet non-woven fabric made of polyolefin fiber and having a thickness of 0.16 mm and a grain size of 52 g / m ^{2 was used.}

[Experimental Example 3]
As the non-woven fabric, the RFID label of Experimental Example 3 was produced in the same manner as in Experimental Example 1 except that a wet non-woven fabric made of polyolefin fiber and having a thickness of 0.12 mm and a grain size of 40 g / m ^{2 was used.}

[Experimental Example 4]
As the non-woven fabric, the RFID label of Experimental Example 4 was produced in the same manner as in Experimental Example 1 except that a wet non-woven fabric made of polyolefin fiber and having a thickness of 0.1 mm and a grain size of 43 g / m ^{2 was used.}

[Experimental Example 5]
The RFID label of Experimental Example 5 was produced in the same manner as in Experimental Example 1 except that the non-woven fabric was not used.

[Experimental Example 6]
The RFID label of Experimental Example 6 was produced in the same manner as in Experimental Example 1 except that a dry nonwoven fabric having a thickness of 0.038 mm and a grain size of 15 g / m ^{2 made of polyethylene terephthalate (PET) fiber was used as the non-woven fabric.}

[Experimental Example 7]
The RFID label of Experimental Example 7 was produced in the same manner as in Experimental Example 1 except that a dry nonwoven fabric having a thickness of 0.07 mm and a grain size of 23 g / m ^{2 made of polyethylene terephthalate fiber was used as the non-woven fabric.}

[Experimental Example 8]
The RFID label of Experimental Example 8 was produced in the same manner as in Experimental Example 1 except that a dry nonwoven fabric having a thickness of 0.07 mm and a grain size of 30 g / m ^{2 made of polyethylene terephthalate fiber was used as the non-woven fabric.}

[Experimental Example 9]
The RFID label of Experimental Example 9 was produced in the same manner as in Experimental Example 1 except that a dry nonwoven fabric having a thickness of 0.08 mm and a grain size of 45 g / m ^{2 made of polyethylene terephthalate fiber was used as the non-woven fabric.}

[Experimental Example 10]
The RFID label of Experimental Example 10 was produced in the same manner as in Experimental Example 1 except that a dry nonwoven fabric having a thickness of 0.13 mm and a grain size of 70 g / m ^{2 made of polyethylene terephthalate fiber was used as the non-woven fabric.}

[Experimental Example 11]
The RFID label of Experimental Example 11 was produced in the same manner as in Experimental Example 1 except that a dry nonwoven fabric having a thickness of 0.17 mm and a grain size of 75 g / m ^{2 made of polyethylene terephthalate fiber was used as the non-woven fabric.}

[Experimental Example 12]
As the non-woven fabric, the RFID label of Experimental Example 12 was produced in the same manner as in Experimental Example 1 except that a dry non-woven fabric made of polyolefin fiber and having a thickness of 0.3 mm and a grain size of 61 g / m ^{2 was used.}

[Experimental Example 13]
As the non-woven fabric, the RFID label of Experimental Example 13 was used in the same manner as in Experimental Example 1 except that a dry non-woven fabric made of polyethylene terephthalate / nylon (PET / Ny) fiber and having a thickness of 0.45 mm and a grain size of 85 g / m ^{2 was used.} Made.

[Experimental Example 14]
As the non-woven fabric, the RFID label of Experimental Example 14 was produced in the same manner as in Experimental Example 1 except that a dry non-woven fabric made of rayon fiber having a thickness of 0.5 mm and a grain size of 90 g / m ^{2 was used.}

[Experimental Example 15]
RFID of Experimental Example 15 in the same manner as in Experimental Example 1 except that a dry non-woven fabric made of polyethylene terephthalate fiber / acrylic binder (PET / acrylic binder) having a thickness of 0.15 mm and a grain size of 45 g / m ^{2 was used as the non-woven fabric.} Labels were made.

[Experimental Example 16]
The RFID label of Experimental Example 16 was produced in the same manner as in Experimental Example 1 except that a dry nonwoven fabric having a thickness of 0.25 mm and a grain size of 45 g / m ^{2 made of polyethylene terephthalate fiber / acrylic binder was used as the non-woven fabric.}

[Experimental Example 17]
The RFID label of Experimental Example 17 was produced in the same manner as in Experimental Example 1 except that a dry nonwoven fabric having a thickness of 0.35 mm and a grain size of 55 g / m ^{2 made of polyethylene terephthalate fiber / acrylic binder was used as the non-woven fabric.}

[Experimental Example 18]
As the non-woven fabric, the RFID label of Experimental Example 18 was produced in the same manner as in Experimental Example 1 except that a dry non-woven fabric made of polyester elastomer and having a thickness of 0.09 mm and a grain size of 30 g / m ^{2 was used.}

[evaluation]
(1) Surface pressure measurement The surface pressure was measured for the RFID labels of Experimental Examples 1 to 18.
In the surface pressure measurement of the RFID label, the pressure when a force is applied in the thickness direction of the RFID label with a stainless steel disk having a diameter of 30 mm is measured in the region where the IC chip is arranged in the RFID label.
FIG. 3 shows the relationship between the measurement result of the surface pressure of the RFID label and the thickness of the non-woven fabric. Further, FIG. 4 shows the relationship between the measurement result of the surface pressure of the RFID label and the basis weight of the non-woven fabric.

From the results of FIGS. 3 and 4, the RFID labels of Experimental Examples 1 to 4 using a wet non-woven fabric as the non-woven fabric have a higher surface pressure than the RFID labels of Experimental Examples 5 to 18 using a dry non-woven fabric as the non-woven fabric. It was confirmed that the pressure resistance was high and the pressure resistance was excellent.
Further, from the results of FIG. 3, since the RFID labels of Experimental Examples 1 to 4 have a thickness of 0.07 mm or more of the wet non-woven fabric, they are more than the RFID labels of Experimental Examples 5 to 18 using the dry non-woven fabric. It was confirmed that the surface pressure was high and the pressure resistance was excellent.
Further, from the results of FIG. 4, since the RFID labels of Experimental Examples 1 to 4 have a wet non-woven fabric with a grain size of 30 g / m ² or more, the RFID labels of Experimental Examples 5 to 18 using the dry non-woven fabric are used. It was confirmed that the surface pressure was higher than that and the pressure resistance was excellent.

(2) Point pressure measurement The point pressure was measured for the RFID labels of Experimental Examples 1 to 18.
In the point pressure measurement of the RFID label, the thickness of the RFID label is measured by using the test finger to determine the area where the IC chip is placed on the RFID label by a method based on IEC-J60950-1 (information device / touch confirmation by test finger). The pressure when a force was applied in the direction was measured.
FIG. 5 shows the relationship between the measurement result of the point pressure of the RFID label and the thickness of the non-woven fabric. Further, FIG. 6 shows the relationship between the measurement result of the point pressure of the RFID label and the basis weight of the non-woven fabric.

From the results of FIGS. 5 and 6, the RFID labels of Experimental Examples 1 to 4 using a wet non-woven fabric as the non-woven fabric have a higher point pressure than the RFID labels of Experimental Examples 5 to 18 using a dry non-woven fabric as the non-woven fabric. It was confirmed that the pressure resistance was high and the pressure resistance was excellent.
Further, from the results of FIG. 5, since the RFID labels of Experimental Examples 1 to 4 have a thickness of 0.15 mm or more of the wet non-woven fabric, they are more than the RFID labels of Experimental Examples 5 to 18 using the dry non-woven fabric. It was confirmed that the point pressure was high and the pressure resistance was excellent.
Further, from the results of FIG. 6, since the RFID labels of Experimental Examples 1 to 4 have a wet non-woven fabric with a grain size of 50 g / m ² or more, the RFID labels of Experimental Examples 5 to 18 using the dry non-woven fabric are used. It was confirmed that the point pressure was higher than that and the pressure resistance was excellent.

10 ... RFID label, 20 ... inlet, 21 ... IC chip, 22 ... antenna, 23 ... base material, 24 ... main line part, 25A, 25B ... impedance adjustment part, 26A, 26B ... Radiating part, 27A, 27B ... Radiating element, 30 ... Wet non-woven fabric, 40 ... Laminated body, 50 ... Surface base material, 60 ... Double-sided tape.

Claims (3)

An IC chip, an inlet having an antenna connected to the IC chip, and a laminate having at least a wet non-woven fabric attached to the IC chip and covering at least the IC chip.
A surface base material provided on one surface or the other surface of the laminate and printed on the surface,
An RFID label comprising: a double-sided tape provided on a surface of the laminate opposite to the surface on which the surface base material is provided. The RFID label according to claim 1, wherein the wet nonwoven fabric has a thickness of 0.07 mm or more. The RFID label according to claim 1 or 2, wherein the wet non-woven fabric has a basis weight of 30 g / m ^{2 or more.}

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