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JP6950148B2 - Aluminum Nitride-Boron Nitride Composite Agglomerated Particles and Their Manufacturing Methods - Google Patents
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JP6950148B2 - Aluminum Nitride-Boron Nitride Composite Agglomerated Particles and Their Manufacturing Methods - Google Patents

Aluminum Nitride-Boron Nitride Composite Agglomerated Particles and Their Manufacturing Methods Download PDF

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JP6950148B2
JP6950148B2 JP2016070502A JP2016070502A JP6950148B2 JP 6950148 B2 JP6950148 B2 JP 6950148B2 JP 2016070502 A JP2016070502 A JP 2016070502A JP 2016070502 A JP2016070502 A JP 2016070502A JP 6950148 B2 JP6950148 B2 JP 6950148B2
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boron nitride
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桂 池宮
桂 池宮
山崎 正典
正典 山崎
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Mitsubishi Chemical Corp
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本発明は窒化アルミニウム−窒化ホウ素複合凝集粒子(以下「AlN−BN複合凝集粒子」と称す。)、該粒子の製造方法に係り、詳しくは、窒化アルミニウム一次粒子(以下「AlN一次粒子」と称する。)および窒化ホウ素一次粒子(以下「BN一次粒子」と称す。)が凝集してなるAlN−BN複合凝集粒子及びその製造方法に関する。 The present invention relates to aluminum nitride-boron nitride composite agglomerated particles (hereinafter referred to as "AlN-BN composite agglomerated particles") and a method for producing the particles, and more specifically, it is referred to as aluminum nitride primary particles (hereinafter referred to as "AlN primary particles"). ) And boron nitride primary particles (hereinafter referred to as “BN primary particles”) are aggregated to form AlN-BN composite agglomerated particles and a method for producing the same.

窒化ホウ素(以下「BN」と称す。)は、絶縁性の物質であり、ダイヤモンド構造を持つc−BN、黒鉛構造をもつh−BN、乱層構造を持つα−BN、β−BNなど様々な結晶型が知られている。
これらの中で、h−BNは、黒鉛と同じ層状構造を有し、合成が比較的容易でかつ熱伝導性、固体潤滑性、化学的安定性、耐熱性に優れるという特徴を備えていることから、電気・電子材料分野で多く利用されている。
Boron nitride (hereinafter referred to as "BN") is an insulating substance, and has various types such as c-BN having a diamond structure, h-BN having a graphite structure, α-BN having a multi-layer structure, and β-BN. Crystal type is known.
Among these, h-BN has the same layered structure as graphite, is relatively easy to synthesize, and has the characteristics of being excellent in thermal conductivity, solid lubricity, chemical stability, and heat resistance. Therefore, it is widely used in the fields of electrical and electronic materials.

近年、特に電気・電子分野では集積回路の高密度化に伴う発熱が大きな問題となっており、いかに熱を放熱するかが緊急の課題となっている。h−BNは、絶縁性であるにもかかわらず、高い熱伝導性を有するという特徴を活かして、このような放熱部材用熱伝導性フィラーとして注目を集めている。 In recent years, especially in the fields of electricity and electronics, heat generation due to high density of integrated circuits has become a big problem, and how to dissipate heat has become an urgent issue. Although h-BN is insulating, it is attracting attention as such a heat conductive filler for a heat radiating member by taking advantage of its feature of having high heat conductivity.

h−BNは板状結晶であり、その板面方向(ab面内あるいは(002)面内)には高い熱伝導性を示すものの(通常、熱伝導率として400W/mK程度)、板厚方向(c軸方向)には低い熱伝導性(通常、熱伝導率として2〜3W/mK程度)しか示さない。また一般に、板状結晶をフィラーとして樹脂などに配合して複合材組成物を作製する際、原料混合、プレス成型、射出成形などの過程に於いて、板状結晶の板面が特定方向に配向する現象が起こる。即ち、h−BN板状結晶を樹脂に配合して複合材組成物を作製した場合、h−BN板状結晶の配向によって複合材組成物に大きな熱伝導異方性が生じてしまう。例えば、プレス成型によって板状成形体を作製した場合、h−BN板状結晶の板面が成型体板面と平行に配向する。その結果、得られた板状成型体の熱伝導率が、板面方向には高く、厚み方向には低くなるという問題が生じる。 h-BN is a plate-like crystal, and although it exhibits high thermal conductivity in the plate surface direction (in the ab plane or (002) plane) (usually, the thermal conductivity is about 400 W / mK), it is in the plate thickness direction. (C-axis direction) shows only low thermal conductivity (usually, the thermal conductivity is about 2 to 3 W / mK). In general, when a composite composition is prepared by blending a plate-shaped crystal as a filler with a resin or the like, the plate surface of the plate-shaped crystal is oriented in a specific direction in a process such as raw material mixing, press molding, or injection molding. Phenomenon occurs. That is, when a composite material composition is prepared by blending h-BN plate crystals with a resin, a large thermal conduction anisotropy occurs in the composite composition due to the orientation of the h-BN plate crystals. For example, when a plate-shaped molded product is produced by press molding, the plate surface of the h-BN plate-shaped crystal is oriented parallel to the plate surface of the molded product. As a result, there arises a problem that the thermal conductivity of the obtained plate-shaped molded body is high in the plate surface direction and low in the thickness direction.

そこで、このようなh−BN板状結晶が複合材組成物に与える熱伝導性異方性を改良するために、上記のような配向が起こりにくい鱗片状以外の形状を有するh−BN凝集粒子が検討されてきた。このようなh−BN凝集粒子としては、噴霧乾燥などにより造粒されたh−BN凝集粒子、h−BNを焼結し焼結体を粉砕して製造されたh−BN凝集粒子などがある(特許文献1、2)。また、ホウ酸とメラミンの混合物から製造したh−BN凝集粒子であって、一次粒子が配向せずに凝集した松ぼっくり状のh−BN凝集粒子も提案されている(特許文献3)。 Therefore, in order to improve the thermal conductivity anisotropy that such h-BN plate-like crystals give to the composite composition, h-BN agglomerated particles having a shape other than the scaly shape in which orientation is unlikely to occur as described above. Has been considered. Examples of such h-BN agglomerated particles include h-BN agglomerated particles granulated by spray drying or the like, and h-BN agglomerated particles produced by sintering h-BN and crushing a sintered body. (Patent Documents 1 and 2). Further, h-BN agglomerated particles produced from a mixture of boric acid and melamine, which are pine-shaped h-BN agglomerated particles in which the primary particles are agglomerated without being oriented, have also been proposed (Patent Document 3).

h−BN板状結晶の熱伝導異方性は非常に大きいため(通常、熱伝導率としてab面内には400W/mK程度、c軸方向には2〜3W/mK程度)、h−BN凝集粒子内外に於いてh−BN一次粒子同士がどの様に接触するかによって、それらの間に形成される熱伝導パスの熱伝導率は大きく変化する。具体的には、ab面内を通る様に形成された熱伝導パス(以下「ab面内パス」と称す。)は高熱伝導率であり、c軸方向に形成された熱伝導パス(以下「c軸方向パス」と称す。)は低熱伝導率である。従って、h−BN一次粒子同士がh−BN凝集粒子内外に形成する熱伝導パスが、高い割合でab面内パスであれば、複合材組成物には高い熱伝導率が発現する。 Since the thermal conductivity anisotropy of the h-BN plate-like crystal is very large (usually, the thermal conductivity is about 400 W / mK in the ab plane and about 2 to 3 W / mK in the c-axis direction), h-BN The thermal conductivity of the heat conduction path formed between the h-BN primary particles varies greatly depending on how the h-BN primary particles come into contact with each other inside and outside the agglomerated particles. Specifically, the heat conduction path formed so as to pass through the ab plane (hereinafter referred to as "ab in-plane pass") has high thermal conductivity, and the heat conduction path formed in the c-axis direction (hereinafter referred to as "" The "c-axis direction path") has a low thermal conductivity. Therefore, if the heat conduction path formed by the h-BN primary particles inside and outside the h-BN agglomerated particles is an ab in-plane path at a high ratio, high heat conductivity is exhibited in the composite composition.

そこで、噴霧乾燥という量産に適した簡便な手法によって、ab面内パスを高い割合で形成する様なh−BN凝集粒子が作製され、この様なh−BN凝集粒子が複合材組成物に与える熱伝導率を飛躍的に高める事が確かめられた(特許文献2)。 Therefore, h-BN agglomerated particles that form ab in-plane paths at a high rate are produced by a simple method suitable for mass production called spray drying, and such h-BN agglomerated particles are provided to the composite composition. It was confirmed that the thermal conductivity was dramatically increased (Patent Document 2).

この様なh−BN凝集粒子が複合材組成物に与える熱伝導率を更に高めようとする場合、h−BN一次粒子同士がh−BN凝集粒子内外に形成するab面内パスの割合を更に増加させる、もしくは、c軸方向パスの割合を更に減少させる必要がある。しかし、この様なh−BN凝集粒子に於いては、h−BN一次粒子の配置は自己組織化的に決まるため、h−BN一次粒子の配置を大きく変化させる事は困難であった。すなわち、これまで以上にab面内パスの割合を増加させる、もしくは、c軸方向パスの割合を減少させる事は困難であった。 When trying to further increase the thermal conductivity given to the composite composition by such h-BN agglomerated particles, the ratio of ab in-plane paths formed by the h-BN primary particles inside and outside the h-BN agglomerated particles is further increased. It is necessary to increase or further decrease the proportion of c-axis paths. However, in such h-BN agglomerated particles, since the arrangement of the h-BN primary particles is determined by self-organization, it is difficult to significantly change the arrangement of the h-BN primary particles. That is, it has been difficult to increase the ratio of ab in-plane paths or decrease the ratio of c-axis direction paths more than ever.

特開2006−257392号公報Japanese Unexamined Patent Publication No. 2006-257392 特表2008−510878号公報Japanese Patent Application Laid-Open No. 2008-510878 特開平9−202663号公報Japanese Unexamined Patent Publication No. 9-202663

h−BN凝集粒子に於いては、h−BN一次粒子同士がh−BN凝集粒子内外に形成する熱伝導パスが、高い割合でab面内パスであれば、複合材組成物に高い熱伝導率が発現する。従来、噴霧乾燥という量産に適した簡便な手法によって、高い割合でab面内パスを形成する様なh−BN凝集粒子が作製されている(特許文献2)。しかし、この様なh−BN凝集粒子に於けるh−BN一次粒子の配置は自己組織化的に決まることから、これまで以上にab面内パスの割合を増加させる、もしくは、c軸方向パスの割合を減少させる事は困難であった。即ち、この様なh−BN凝集粒子が複合材組成物に与える熱伝導率を更に増大させることは困難であった。 In the h-BN agglomerated particles, if the heat conduction path formed by the h-BN primary particles inside and outside the h-BN agglomerated particles is an ab in-plane path at a high ratio, the heat conduction is high in the composite composition. The rate develops. Conventionally, h-BN agglomerated particles that form ab in-plane paths at a high rate have been produced by a simple method suitable for mass production called spray drying (Patent Document 2). However, since the arrangement of the h-BN primary particles in such h-BN agglomerated particles is determined by self-organization, the ratio of the ab in-plane path is increased more than ever, or the c-axis direction path is increased. It was difficult to reduce the proportion of. That is, it has been difficult to further increase the thermal conductivity given to the composite composition by such h-BN agglomerated particles.

本発明は、上記従来の問題点を解決し、従来よりも大きな熱伝導率を複合材組成物に与えるh−BN凝集粒子を得る事を課題とする。 An object of the present invention is to solve the above-mentioned conventional problems and to obtain h-BN agglomerated particles that give a composite material composition a larger thermal conductivity than the conventional ones.

本発明者らは鋭意検討を重ねた結果、BN一次粒子の作る熱伝導パス中にAlN一次粒子が配置されたAlN−BN複合凝集粒子が、複合材組成物に対して飛躍的に高い熱伝導率を与える事を見出した。窒化アルミニウム(以下「AlN」と称す。)は絶縁性であるという点、そして、高い熱伝導性(通常、熱伝導率として300W/mK程度)を示すという点に於いて、h−BNと類似している。しかし、結晶形状が粒状であるという点、また、熱伝導異方性を持たないという点に於いて、h−BNとは大きく異なる。従って、AlNのみからなるAlN凝集粒子を作製した場合、AlN凝集粒子内外に形成される熱伝導パスの大部分は、h−BNに於けるab面内パスと同様に高熱伝導であると考えられる。しかし、AlN一次粒子は粒状であって板状のh−BN一次粒子と比べて変形性に劣る事から、AlN一次粒子間およびAlN凝集粒子間の接触面積は小さく、従って、AlN一次粒子間およびAlN凝集粒子間に形成される熱伝導パスの密度はh−BNの場合よりも小さいと考えられる。以上のことから、AlN一次粒子とh−BN一次粒子を複合化し、AlN−BN複合凝集粒子とする事によって、熱伝導パスの密度を保ちつつ、高熱伝導なパスの割合を増加させる事が出来ると考えられる。
本発明はこのような知見に基づいて達成されたものであり、以下を要旨とする。
As a result of diligent studies, the present inventors have found that the AlN-BN composite agglomerated particles in which the AlN primary particles are arranged in the heat conduction path created by the BN primary particles have dramatically higher thermal conductivity with respect to the composite material composition. Found to give a rate. Aluminum nitride (hereinafter referred to as "AlN") is similar to h-BN in that it is insulating and exhibits high thermal conductivity (usually, thermal conductivity is about 300 W / mK). doing. However, it is significantly different from h-BN in that the crystal shape is granular and that it does not have thermal conduction anisotropy. Therefore, when AlN agglomerated particles composed of only AlN are produced, most of the heat conduction paths formed inside and outside the AlN agglomerated particles are considered to have high heat conduction as in the ab in-plane path in h-BN. .. However, since the AlN primary particles are granular and inferior in deformability to the plate-shaped h-BN primary particles, the contact area between the AlN primary particles and the AlN agglomerated particles is small, and therefore, between the AlN primary particles and between the AlN primary particles and It is considered that the density of the heat conduction path formed between the AlN agglomerated particles is smaller than that in the case of h-BN. From the above, by combining the AlN primary particles and the h-BN primary particles to form AlN-BN composite agglomerated particles, it is possible to increase the proportion of high thermal conductive paths while maintaining the density of the thermal conductive paths. it is conceivable that.
The present invention has been achieved based on such findings, and the gist of the present invention is as follows.

(1)窒化アルミニウム一次粒子及び粒子の長軸が0.1μm以上の窒化ホウ素一次粒子が凝集してなる窒化アルミニウム−窒化ホウ素複合凝集粒子。
(2)前記窒化ホウ素一次粒子がカードハウス構造を形成している(1)に記載の複合凝集粒子。
(3)少なくとも、ホウ素、炭素、窒素、及び酸素からなる成分を含有する(1)又は(2)に記載の複合凝集粒子。
(4)窒化アルミニウム一次粒子及び窒化ホウ素一次粒子が凝集してなる窒化アルミニウム−窒化ホウ素複合凝集粒子の製造法であって、酸化アルミニウムの還元窒化ステップ、を含む製造法。
(5)前記還元窒化ステップは、カーボンブラック存在下、非酸化性ガス又は還元性ガス雰囲気下にて行われる、(4)に記載の製造法。
請求項1から3のいずれか1項に記載の複合凝集粒子と、樹脂よりなる複合材組成物。(6)(1)から(3)に記載の複合凝集粒子の何れかと、樹脂よりなる複合材組成物。(7)(6)に記載の複合材組成物を成形してなるシート又は基板。
(8)放熱用部材である、(7)に記載のシート又は基板。
(1) Aluminum nitride-boron nitride composite agglomerated particles formed by agglomerating aluminum nitride primary particles and boron nitride primary particles having a major axis of the particles of 0.1 μm or more.
(2) The composite agglomerated particles according to (1), wherein the boron nitride primary particles form a card house structure.
(3) The composite agglomerated particles according to (1) or (2), which contain at least a component consisting of boron, carbon, nitrogen, and oxygen.
(4) A method for producing aluminum nitride-boron nitride composite agglomerated particles, which is formed by aggregating aluminum nitride primary particles and boron nitride primary particles, and includes a step of reducing and nitriding aluminum oxide.
(5) The production method according to (4), wherein the reduction nitriding step is performed in the presence of carbon black and in a non-oxidizing gas or reducing gas atmosphere.
A composite composition composed of the composite agglomerated particles according to any one of claims 1 to 3 and a resin. (6) A composite composition composed of any of the composite agglomerated particles according to (1) to (3) and a resin. (7) A sheet or substrate obtained by molding the composite composition according to (6).
(8) The sheet or substrate according to (7), which is a heat radiating member.

本発明により、BN一次粒子の作る熱伝導パス中にAlN一次粒子が配置されたAlN−BN複合凝集粒子が提供される。本発明のAlN−BN複合凝集粒子を樹脂などのマトリクスに配合した複合材組成物は、高い熱伝導率を示す。すなわち、放熱部材用熱伝導性フィラーとして有用なAlN−BN複合凝集粒子が提供される。 INDUSTRIAL APPLICABILITY The present invention provides AlN-BN composite agglomerated particles in which AlN primary particles are arranged in a heat conduction path created by BN primary particles. The composite composition in which the AlN-BN composite aggregated particles of the present invention are blended in a matrix such as a resin exhibits high thermal conductivity. That is, AlN-BN composite agglomerated particles useful as a heat conductive filler for a heat radiating member are provided.

比較例1、2に係る熱処理粒子のXRDパターンである。It is an XRD pattern of the heat-treated particles which concerns on Comparative Examples 1 and 2. 比較例1、2に係る熱処理粒子のSEM像である。3 is an SEM image of the heat-treated particles according to Comparative Examples 1 and 2. 比較例1、2、実施例1、2、3に係る複合材組成物の熱伝導率グラフである。It is a thermal conductivity graph of the composite material composition which concerns on Comparative Examples 1, 2, and Examples 1, 2, and 3. 実施例1、2、3に係る熱処理粒子のXRDパターンである。5 is an XRD pattern of heat-treated particles according to Examples 1, 2 and 3. 実施例1、2、3に係る熱処理粒子のSEM像である。3 is an SEM image of the heat-treated particles according to Examples 1, 2 and 3. 実施例1、2、3に係る高純度還元窒化粒子のXRDパターンである。5 is an XRD pattern of high-purity reduced nitrided particles according to Examples 1, 2 and 3. 実施例1、2、3に係る高純度還元窒化粒子および熱処理粒子のXRDパターンである。5 is an XRD pattern of high-purity reduced nitriding particles and heat-treated particles according to Examples 1, 2 and 3. 実施例1、2、3に係る高純度還元窒化粒子のSEM像である。3 is an SEM image of high-purity reduced nitriding particles according to Examples 1, 2 and 3. 実施例1、2、3に係る高純度還元窒化粒子のSEM−EDX分析結果である。It is the SEM-EDX analysis result of the high-purity reduced nitriding particle which concerns on Examples 1, 2 and 3. 比較例3に係る熱処理粒子のXRDパターンである。It is an XRD pattern of the heat-treated particles which concerns on Comparative Example 3. 比較例3に係る熱処理粒子のSEM像である。6 is an SEM image of the heat-treated particles according to Comparative Example 3. 比較例1、2、3、4に係る複合材組成物の熱伝導率グラフである。It is a thermal conductivity graph of the composite material composition which concerns on Comparative Examples 1, 2, 3 and 4.

以下、本発明を詳細に説明するが、本発明の範囲は具体的な実施形態のみに限定されない。
[AlN−BN複合凝集粒子]
本発明のAlN−BN複合凝集粒子は、AlN一次粒子及びBN一次粒子が凝集して形成されたものであり、本願発明の効果を損なわない範囲で、上記AlN一次粒子または上記BN一次粒子以外の成分を含有してもよい。AlN一次粒子またはBN一次粒子以外の成分としては、後記の[BN凝集粒子の製造方法]で述べる、スラリーに添加してもよいバインダー、界面活性剤、溶媒に由来する成分を挙げることができる。
Hereinafter, the present invention will be described in detail, but the scope of the present invention is not limited to specific embodiments.
[AlN-BN composite aggregate particles]
The AlN-BN composite agglomerated particles of the present invention are formed by aggregating AlN primary particles and BN primary particles, and are other than the AlN primary particles or the BN primary particles as long as the effects of the present invention are not impaired. Ingredients may be included. Examples of the components other than the AlN primary particles or the BN primary particles include a binder, a surfactant, and a solvent-derived component that may be added to the slurry, which will be described later in [Method for producing BN agglomerated particles].

本発明のAlN−BN複合凝集粒子の形態は、特に制限はないが、好ましくは球状の形態を有する。また、AlN−BN複合凝集粒子の形態はSEMにより確認することができる。ここで「球状」とは、アスペクト比(長径と短径の比)が1以上2以下、好ましくは
1以上1.5以下であることをさす。本発明のAlN−BN複合凝集粒子のアスペクト比は、SEMで撮影された画像から200個以上の粒子を任意に選択し、それぞれの長径と短径の比を求めて平均値を算出することにより決定する。
The form of the AlN-BN composite agglomerated particles of the present invention is not particularly limited, but preferably has a spherical shape. Further, the morphology of the AlN-BN composite aggregated particles can be confirmed by SEM. Here, "spherical" means that the aspect ratio (ratio of major axis to minor axis) is 1 or more and 2 or less, preferably 1 or more and 1.5 or less. The aspect ratio of the AlN-BN composite agglomerated particles of the present invention is obtained by arbitrarily selecting 200 or more particles from the image taken by SEM, calculating the ratio of the major axis and the minor axis of each, and calculating the average value. decide.

また、AlN−BN複合凝集粒子は、AlN−BN複合凝集粒子においてBN一次粒子の結晶がAlN−BN複合凝集粒子の中心側から表面側へ向けて放射状に成長しているウニ様の形態、BN一次粒子が小板でありそれらが焼結凝集しているウニ様の球状の形態であることが好ましい。また、AlN−BN複合凝集粒子は、カードハウス構造を有することが好ましい。カードハウス構造とは、例えばセラミックス 43 No.2(2008年 日本セラミックス協会発行)に記載されており、板状粒子が配向せずに複雑に積層したような構造である。より具体的には、カードハウス構造を有するAlN−BN複合凝集粒子とは、AlN一次粒子およびBN一次粒子の集合体であって、BN一次粒子の平面部と端面部が接触している構造中にAlN一次粒子が含有されるAlN−BN複合凝集粒子であり、好ましくは球状である。また、カードハウス構造は粒子の内部においても同様の構造であることが好ましい。これらのAlN−BN複合凝集粒子の凝集形態及び内部構造は走査型電子顕微鏡(SEM)により確認することができる。 Further, the AlN-BN composite agglomerated particles are BN-like morphologies in which the crystals of the BN primary particles of the AlN-BN composite agglomerated particles grow radially from the center side to the surface side of the AlN-BN composite agglomerated particles. It is preferable that the primary particles are small plates and have a uni-like spherical shape in which they are sintered and aggregated. Further, the AlN-BN composite agglomerated particles preferably have a card house structure. The card house structure is, for example, ceramics 43 No. It is described in 2 (published by the Japan Ceramics Association in 2008), and has a structure in which plate-like particles are intricately laminated without being oriented. More specifically, the AlN-BN composite agglomerated particles having a cardhouse structure are aggregates of AlN primary particles and BN primary particles, and have a structure in which the plane portion and the end face portion of the BN primary particles are in contact with each other. AlN-BN composite agglomerated particles containing AlN primary particles, preferably spherical. Further, the card house structure is preferably the same structure inside the particles. The aggregated morphology and internal structure of these AlN-BN composite aggregated particles can be confirmed by a scanning electron microscope (SEM).

また、AlN−BN複合凝集粒子に於いては、それを構成するAlN一次粒子またはBN一次粒子の表面に、ホウ素、炭素、窒素、そして酸素からなる成分(化合物)が存在する事が好ましい。AlN結晶およびBN結晶に於いては、結晶中に溶存する酸素原子が熱伝導率を低下させる。従って、酸素を化合物として結晶表面に留める事で、この様な熱伝導率の低下を防ぐことが出来る。ホウ素、炭素、窒素、そして酸素からなる化合物の存在は、その化合物が結晶質である場合はX線回折測定(XRD)測定によって、非晶質である場合はエネルギー分散型X線分析(EDX)等による元素分析によって確認することが出来る。 Further, in the AlN-BN composite agglomerated particles, it is preferable that a component (compound) composed of boron, carbon, nitrogen and oxygen is present on the surface of the AlN primary particles or the BN primary particles constituting the AlN-BN composite agglomerated particles. In AlN crystals and BN crystals, oxygen atoms dissolved in the crystals reduce the thermal conductivity. Therefore, by retaining oxygen as a compound on the crystal surface, it is possible to prevent such a decrease in thermal conductivity. The presence of a compound consisting of boron, carbon, nitrogen, and oxygen is measured by X-ray diffraction measurement (XRD) if the compound is crystalline, or by energy dispersive X-ray analysis (EDX) if it is amorphous. It can be confirmed by elemental analysis such as.

本発明のAlN−BN複合凝集粒子は、AlN−BN複合凝集粒子を構成するAlN一次粒子およびBN一次粒子が特定の物性を有する。以下詳細に説明する。なお、本明細書で規定する物性測定に供する試料(粉体)は、成形体に成形する前のAlN−BN複合凝集粒子粉体でもよいし、AlN−BN複合凝集粒子を含有した成形体しくは成形体から取り出されたAlN−BN複合凝集粒子であってもよい。好ましくは、成形体に成形する前のAlN−BN複合凝集粒子粉体である。 In the AlN-BN composite agglomerated particles of the present invention, the AlN primary particles and the BN primary particles constituting the AlN-BN composite agglomerated particles have specific physical properties. This will be described in detail below. The sample (powder) to be used for the physical property measurement specified in the present specification may be an AlN-BN composite agglomerated particle powder before being molded into a molded body, or may be a molded body containing AlN-BN composite agglomerated particles. May be AlN-BN composite agglomerated particles taken out from the molded body. It is preferably an AlN-BN composite agglomerated particle powder before being molded into a molded product.

(AlN−BN複合凝集粒子の特性)
・一次粒子の大きさ
AlN−BN複合凝集粒子を構成するBN一次粒子の長軸は通常0.1μm以上、好ましくは0.3μm以上、より好ましくは、0.5μm以上、更に好ましくは0.7μm以上、特に好ましくは1.0μm以上である。また通常10μm以下、好ましくは7μm以下、より好ましくは5μm以下である。尚、上記長軸とはSEM測定により得られたBN凝集粒子1粒を拡大し、1粒のBN凝集粒子を構成しているBN一次粒子について、画像上で観察できるBN一次粒子の最大長を平均した値である。
AlN−BN複合凝集粒子を構成するAlN一次粒子の長軸は通常0.1μm以上、好ましくは0.5μm以上、より好ましくは、1.0μm以上、更に好ましくは2.0μm以上、特に好ましくは3.0μm以上である。また通常20μm以下、好ましくは15μm以下、より好ましくは10μm以下である。尚、上記長軸とはSEM測定により得られたAlN−BN複合凝集粒子1粒を拡大し、1粒のAlN−BN複合凝集粒子を構成しているAlN一次粒子について、画像上で観察できるAlN一次粒子の最大長を平均した値である。
(Characteristics of AlN-BN composite aggregated particles)
-Size of primary particles The major axis of the BN primary particles constituting the AlN-BN composite agglomerated particles is usually 0.1 μm or more, preferably 0.3 μm or more, more preferably 0.5 μm or more, still more preferably 0.7 μm. As mentioned above, it is particularly preferably 1.0 μm or more. Further, it is usually 10 μm or less, preferably 7 μm or less, and more preferably 5 μm or less. The major axis is the maximum length of the BN primary particles that can be observed on the image for the BN primary particles that make up one BN agglomerated particle by enlarging one BN agglomerated particle obtained by SEM measurement. It is an average value.
The major axis of the AlN primary particles constituting the AlN-BN composite agglomerated particles is usually 0.1 μm or more, preferably 0.5 μm or more, more preferably 1.0 μm or more, still more preferably 2.0 μm or more, and particularly preferably 3. It is 0.0 μm or more. Further, it is usually 20 μm or less, preferably 15 μm or less, and more preferably 10 μm or less. The major axis is an AlN primary particle that can be observed on an image by enlarging one AlN-BN composite agglomerated particle obtained by SEM measurement and constituting one AlN-BN composite agglomerated particle. It is a value obtained by averaging the maximum lengths of primary particles.

・一次粒子の結晶構造
BN一次粒子の結晶構造は、特に限定されないが、合成の容易さと熱伝導性の点で六方晶系のh−BNを主成分として含むものが好ましい。また、バインダーとしてBN以外の無機成分が含まれる場合、熱処理の過程でそれらが結晶化するが、BNが主成分として含まれていればよい。なお、上記BN一次粒子の結晶構造は、XRD測定により確認することができる。
-Crystal structure of primary particles The crystal structure of BN primary particles is not particularly limited, but those containing hexagonal h-BN as a main component are preferable in terms of ease of synthesis and thermal conductivity. When an inorganic component other than BN is contained as the binder, they crystallize in the process of heat treatment, but BN may be contained as the main component. The crystal structure of the BN primary particles can be confirmed by XRD measurement.

・AlN−BN複合凝集粒子の平均粒子径(D50
AlN−BN複合凝集粒子の平均粒子径(D50)は、通常1.0μm以上であり、好ましくは5.0μm以上、より好ましくは10μm以上、更に好ましくは20μm以上であり、特に好ましくは30μm以上、最も好ましくは40μm以上であり、50μm以上であっても好ましく、60μm以上であっても好ましい。また、通常200μm以下、好ましくは150μm以下、更に好ましくは100μm以下である。大きすぎると成形体とした際に表面の平滑性が悪くなる、AlN−BN複合凝集粒子間の間隙が多くなる等により、熱伝導性が向上しない傾向がある。小さすぎると成形体とした際にAlN−BN複合凝集粒子間の接触抵抗が大きくなる、AlN−BN複合凝集粒子自体の熱伝導性が低くなる等の傾向がある。
-Average particle size of AlN-BN composite agglomerated particles (D 50 )
The average particle size (D 50 ) of the AlN-BN composite agglomerated particles is usually 1.0 μm or more, preferably 5.0 μm or more, more preferably 10 μm or more, still more preferably 20 μm or more, and particularly preferably 30 μm or more. Most preferably, it is 40 μm or more, 50 μm or more is preferable, and 60 μm or more is preferable. Further, it is usually 200 μm or less, preferably 150 μm or less, and more preferably 100 μm or less. If it is too large, the smoothness of the surface of the molded product will be poor, the gaps between the AlN-BN composite agglomerated particles will increase, and the thermal conductivity will not be improved. If it is too small, the contact resistance between the AlN-BN composite agglomerated particles will increase when the molded product is formed, and the thermal conductivity of the AlN-BN composite agglomerated particles themselves will tend to decrease.

なお、D50は測定に供した粉体の体積を100%として累積曲線を描かせた際に丁度累積体積が50%となる時の粒子径を意味し、その測定方法は、湿式測定法としては、分散安定剤としてヘキサメタリン酸ナトリウムを含有する純水媒体中にBN凝集粒子を分散させた試料に対して、レーザ回折/散乱式粒度分布測定装置などを用いて測定することができ、乾式測定法としては、Malvern社製「Morphologi」を用いて測定することができる。 Note that D 50 means the particle size when the cumulative volume is exactly 50% when the cumulative volume is drawn with the volume of the powder used for measurement as 100%, and the measurement method is a wet measurement method. Can be measured using a laser diffraction / scattering particle size distribution measuring device or the like on a sample in which BN agglomerated particles are dispersed in a pure water medium containing sodium hexametaphosphate as a dispersion stabilizer. As a method, it can be measured using "Morgrafi" manufactured by Malvern.

・AlN−BN複合凝集粒子中のAlN:BN比
AlN−BN複合凝集粒子中のAlNとBNとの組成比は特段限定されないが、AlN:BN比(質量比)は通常3:97〜85:15であり、好ましくは10:90〜80:20であり、更に好ましくは20:80〜55:45である。上記範囲内とすることで、BN一次粒子によるカードハウス構造が形成され、好ましい。
-AlN: BN ratio in AlN-BN composite agglomerated particles The composition ratio of AlN and BN in AlN-BN composite agglomerated particles is not particularly limited, but the AlN: BN ratio (mass ratio) is usually 3: 97 to 85 :. It is 15, preferably 10:90 to 80:20, and more preferably 20:80 to 55:45. Within the above range, a card house structure made of BN primary particles is formed, which is preferable.

[AlN−BN複合凝集粒子の製造方法]
{スラリーの調製}
<原料BN粉末>
・原料BN粉末の種類
本発明で用いる原料BN粉末としては、市販のh−BN、市販のαおよびβ−BN、ホウ素化合物とアンモニアの還元窒化法により作製されたBN、ホウ素化合物とメラミンなどの含窒素化合物から合成されたBNなど何れも制限なく使用できるが、特にh−BNが本発明の効果をより発揮する点で好ましく用いられる。
[Method for Producing AlN-BN Composite Agglomerated Particles]
{Preparation of slurry}
<Raw material BN powder>
Types of Raw Material BN Powder Examples of the raw material BN powder used in the present invention include commercially available h-BN, commercially available α and β-BN, BN produced by the reduction nitride method of boron compounds and ammonia, and boron compounds and melamine. Any BN synthesized from a nitrogen-containing compound can be used without limitation, but h-BN is particularly preferably used because it exerts the effect of the present invention more.

・原料BN粉末の結晶性
本発明で用いる原料BN粉末の形態としては、XRD測定により得られるピークの半値幅が広く、結晶性が低い粉末状のBN粒子が好適である。結晶性の目安として、XRD測定から得られる(002)面のピーク半値幅が、2θの角度で、通常0.4°以上、好ましくは0.45°以上、より好ましくは0.5°以上である。また、通常2.0°以下、好ましくは1.5°以下、更に好ましくは1°以下である。上記上限より大きいと、結晶子が十分大きくならず、大きくするためには長時間を要するため、生産性が悪くなる傾向がある。上記下限未満だと、結晶性が高すぎて、十分な結晶成長が見込めず、また、スラリー作製時の分散安定性が悪くなる傾向がある。
Crystalline of Raw Material BN Powder As the form of the raw material BN powder used in the present invention, powdery BN particles having a wide half-value width of the peak obtained by XRD measurement and low crystallinity are preferable. As a measure of crystallinity, the peak half-value width of the (002) plane obtained from the XRD measurement is usually 0.4 ° or more, preferably 0.45 ° or more, more preferably 0.5 ° or more at an angle of 2θ. be. Further, it is usually 2.0 ° or less, preferably 1.5 ° or less, and more preferably 1 ° or less. If it is larger than the above upper limit, the crystallites do not become sufficiently large, and it takes a long time to make them large, so that the productivity tends to deteriorate. If it is less than the above lower limit, the crystallinity is too high, sufficient crystal growth cannot be expected, and the dispersion stability during slurry preparation tends to deteriorate.

・原料BN粉末中の酸素原子濃度
BN結晶成長の観点からは、原料BN粉末中に酸素原子がある程度存在することが好ましく、本発明では、原料BN粉末中の全酸素濃度は、通常1質量%以上、好ましくは2質量%以上、より好ましくは3質量%以上、更に好ましくは4質量%以上である。また、通常、20質量%以下、更に好ましくは10質量%以下である。上記上限より大きいと、熱処理後も酸素が残存しやすくなるため、熱伝導性の改善効果が小さくなる傾向がある。上記下限未満だと、結晶性が高すぎて、結晶成長が見込めず、XRD測定から確認できるピーク強度比が所望の範囲から外れる傾向がある。
-Oxygen Atom Concentration in Raw Material BN Powder From the viewpoint of BN crystal growth, it is preferable that some oxygen atoms are present in the raw material BN powder, and in the present invention, the total oxygen concentration in the raw material BN powder is usually 1% by mass. As mentioned above, it is preferably 2% by mass or more, more preferably 3% by mass or more, and further preferably 4% by mass or more. Further, it is usually 20% by mass or less, more preferably 10% by mass or less. If it is larger than the above upper limit, oxygen tends to remain even after the heat treatment, so that the effect of improving the thermal conductivity tends to be small. If it is less than the above lower limit, the crystallinity is too high, crystal growth cannot be expected, and the peak intensity ratio that can be confirmed from the XRD measurement tends to deviate from the desired range.

なお、原料BN粉末の全酸素濃度を上記範囲に調製する方法としては、例えばBN合成時の合成温度を1500℃以下の低温で行う方法、500℃〜900℃の低温の酸化雰囲気中で原料BN粉末を熱処理する方法などが挙げられる。
なお、原料BN粉末の全酸素濃度は、不活性ガス融解−赤外線吸収法により、株式会社堀場製作所製の酸素・窒素分析計を用いて測定することができる。
As a method of adjusting the total oxygen concentration of the raw material BN powder within the above range, for example, a method of performing the synthesis temperature at the time of BN synthesis at a low temperature of 1500 ° C. or lower, or a method of performing the raw material BN in a low temperature oxidizing atmosphere of 500 ° C. to 900 ° C. Examples thereof include a method of heat-treating the powder.
The total oxygen concentration of the raw material BN powder can be measured by an inert gas melting-infrared absorption method using an oxygen / nitrogen analyzer manufactured by HORIBA, Ltd.

<原料Al粉末>
・原料Al粉末の種類
本発明で用いる原料Al粉末としては、市販のα、γ、δおよびθ−Al、アモルファスAlなど何れも制限なく使用できる。
原料Al粉末の粒子径は特段限定されないが、通常0.005μm〜10μmであり、好ましくは0.01μm〜5μmであり、更に好ましくは0.1μm〜1μmである。上記範囲内とすることで、原料BN粉末と原料Al粉末がスラリー中で分離しにくくなり、かつ、スラリーが高粘度化しすぎなくなる。
<Raw material Al 2 O 3 powder>
- The material Al 2 O 3 powder used in the raw material Al 2 O 3 powder types present invention, commercially available alpha, gamma, [delta] and θ-Al 2 O 3, any such amorphous Al 2 O 3 can be used without limitation.
The particle size of the raw material Al 2 O 3 powder is not particularly limited, but is usually 0.005 μm to 10 μm, preferably 0.01 μm to 5 μm, and more preferably 0.1 μm to 1 μm. Within the above range, it becomes difficult for the raw material BN powder and the raw material Al 2 O 3 powder to separate in the slurry, and the slurry does not become too viscous.

<カーボンブラック粉末>
・カーボンブラックの種類
本発明で用いるカーボンブラック粉末としては、市販のカーボンブラックなど何れも制限なく使用できる。
カーボンブラックは、ファーネス法、チャンネル法などのカーボンブラック、アセチレンブラックなどを使用することができる。これらカーボンブラックの粒径は、任意であるが、0.01〜20μmのものが好ましい。カーボンブラックの代替として、黒鉛、高温でカーボン源となり得るカーボン前駆体を使用する事も出来る。カーボン前駆体としては、フェノール樹脂、メラミン樹脂、エポキシ樹脂、フランフェノール樹脂等の合成樹脂縮合物やピッチ、タール等の炭化水素化合物、セルロース、ショ糖、ポリ塩化ビニリデン、ポリフェニレンなどの有機化合物が挙げられる。特に、フェノール樹脂、セルロース、ポリフェニレンなど金属不純物などが少ないものが好ましい。
<Carbon black powder>
-Types of carbon black As the carbon black powder used in the present invention, any commercially available carbon black or the like can be used without limitation.
As the carbon black, carbon black such as the furnace method and the channel method, acetylene black and the like can be used. The particle size of these carbon blacks is arbitrary, but preferably 0.01 to 20 μm. As an alternative to carbon black, graphite or a carbon precursor that can be a carbon source at high temperatures can also be used. Examples of the carbon precursor include synthetic resin condensates such as phenol resin, melamine resin, epoxy resin and furanphenol resin, hydrocarbon compounds such as pitch and tar, and organic compounds such as cellulose, sucrose, polyvinylidene chloride and polyphenylene. Be done. In particular, those having few metal impurities such as phenol resin, cellulose, and polyphenylene are preferable.

<媒体>
Al−BNスラリーの調製に用いる媒体としては特に制限はなく、水及び/又は各種の有機溶媒を用いることができるが、噴霧乾燥の容易さ、装置の簡素化などの観点から、水を用いることが好ましく、純水がより好ましい。
<Medium>
The medium used for preparing the Al 2 O 3- BN slurry is not particularly limited, and water and / or various organic solvents can be used, but water can be used from the viewpoint of ease of spray drying and simplification of the apparatus. Is preferable, and pure water is more preferable.

<バインダー>
Al−BNスラリーは、原料Al粉末および原料BN粉末を効果的に粒子状に造粒するために、バインダーを含んでもよい。バインダーは、一次粒子同士を強固に結びつけ、造粒粒子を安定化するために作用する。
Al−BNスラリーに用いるバインダーとしては、一次粒子同士の接着性を高めることができるものであればよいが、本発明においては、造粒粒子は粒子化後に加熱処理されるため、この加熱処理工程における高温条件に対する耐熱性を有するものが好ましい。
<Binder>
The Al 2 O 3- BN slurry may contain a binder in order to effectively granulate the raw material Al 2 O 3 powder and the raw material BN powder into particles. The binder acts to firmly bind the primary particles to each other and stabilize the granulated particles.
The binder used in the Al 2 O 3- BN slurry may be any binder capable of enhancing the adhesiveness between the primary particles, but in the present invention, the granulated particles are heat-treated after being granulated. Those having heat resistance to high temperature conditions in the heat treatment step are preferable.

このようなバインダーとしては、酸化アルミニウム、酸化マグネシウム、酸化イットリウム、酸化カルシウム、酸化珪素、酸化ホウ素、酸化セリウム、酸化ジルコニウム、酸化チタンなどの金属の酸化物などが好ましく用いられる。これらの中でも、酸化物としての熱伝導性と耐熱性、一次粒子同士を結合する結合力などの観点から、酸化アルミニウム、酸化イットリウムが好適である。なお、バインダーはアルミナゾルのような液状バインダーを用いてもよく、加熱処理中に反応して、他の無機成分に変換されるものであってもよい。これらのバインダーは、1種を単独で用いてもよく、2種以上を混合して用いてもよい。 As such a binder, metal oxides such as aluminum oxide, magnesium oxide, yttrium oxide, calcium oxide, silicon oxide, boron oxide, cerium oxide, zirconium oxide and titanium oxide are preferably used. Among these, aluminum oxide and yttrium oxide are preferable from the viewpoints of thermal conductivity and heat resistance as oxides and a bonding force for binding primary particles to each other. As the binder, a liquid binder such as alumina sol may be used, or a binder that reacts during the heat treatment and is converted into other inorganic components may be used. One of these binders may be used alone, or two or more of these binders may be mixed and used.

バインダーの使用量(液状バインダーの場合は、固形分としての使用量)は、Al−BNスラリー中の原料粉末全量に対して、通常0質量%以上30質量%以下であり、好ましくは0質量%以上20質量%以下、より好ましくは0質量%以上15質量%以下である。上記上限を超えると造粒粒子中の原料Al粉末および原料BN粉末の含有量が少なくなり、結晶成長に影響するばかりか熱伝導性のフィラーとして用いた場合に熱伝導性改善効果が小さくなる。 (If a liquid binder, as the amount of solids) binders usage, Al the raw material powder total amount of 2 O 3 -BN slurry is usually less than 30 wt% or more 0 wt%, preferably It is 0% by mass or more and 20% by mass or less, more preferably 0% by mass or more and 15% by mass or less. When the above upper limit is exceeded, the contents of the raw material Al 2 O 3 powder and the raw material BN powder in the granulated particles decrease, which not only affects the crystal growth but also has the effect of improving the thermal conductivity when used as a thermally conductive filler. It becomes smaller.

<スラリー調製方法>
スラリー調製方法は、原料Al粉末および原料BN粉末、更に必要により、媒体、バインダー、界面活性剤が均一に分散し、所望の粘度範囲に調製されていれば特に限定されないが、原料BN粉末、原料Al粉末及び媒体、更に必要により、バインダー、界面活性剤を用いる場合、好ましくは以下のように調製する。
<Slurry preparation method>
The slurry preparation method is not particularly limited as long as the raw material Al 2 O 3 powder, the raw material BN powder, and if necessary, the medium, the binder, and the surfactant are uniformly dispersed and prepared in a desired viscosity range, but the raw material BN is not particularly limited. When a powder, a raw material Al 2 O 3 powder and a medium, and if necessary, a binder and a surfactant are used, the preparation is preferably as follows.

原料Al粉末および原料BN粉末を容器に所定量計量し、次いで、バインダーを所定量添加する。さらに、界面活性剤を所定量添加した後、ハンドミキサーを用いて均一になるまで程度撹拌する。
添加の順番は特に制限はないが、大量の原料Al粉末および原料BN粉末をスラリー化する場合、だまなどの凝集物ができやすくなるため、水に界面活性剤とバインダーを加えた水溶液を作製した後、所定量の原料Al粉末および原料BN粉末を少量ずつ添加し、これを家庭用ハンドミキサーを用いて撹拌してスラリー化しても良い。
The raw material Al 2 O 3 powder and the raw material BN powder are weighed in a predetermined amount in a container, and then a predetermined amount of a binder is added. Further, after adding a predetermined amount of the surfactant, the mixture is stirred with a hand mixer until it becomes uniform.
The order of addition is not particularly limited, but when a large amount of raw material Al 2 O 3 powder and raw material BN powder are slurried, agglomerates such as lumps are likely to be formed. After producing the above, a predetermined amount of the raw material Al 2 O 3 powder and the raw material BN powder may be added little by little, and this may be stirred using a household hand mixer to form a slurry.

また、分散に際しては、ハンドミキサーのほかに、ポットミル、ビーズミル、プラネタリーミキサーなどの分散装置を使用しても良い。スラリー化に際して、スラリーの温度は、10℃以上60℃以下で行う。下限よりも低いと、スラリー粘度が上昇し、所望の粘度範囲から外れる傾向にあり、上限よりも高いと原料BN粉末が水溶液中でアンモニアに分解しやすくなる。通常、10℃以上60℃以下であるが、好ましくは15℃以上50℃以下、より好ましくは15℃以上40℃以下、更に好ましくは15℃以上35℃以下である。
原料Al粉末および原料BN粉末の含有比は特段限定されないが、原料Al粉末:原料BN粉末比(質量比)は通常1:99〜90:10であり、好ましくは2:98〜85:15であり、更に好ましくは13:87〜60:40である。上記範囲内とすることで、BN一次粒子によるカードハウス構造が形成され、好ましい。
In addition to the hand mixer, a dispersion device such as a pot mill, a bead mill, or a planetary mixer may be used for dispersion. At the time of slurrying, the temperature of the slurry is 10 ° C. or higher and 60 ° C. or lower. If it is lower than the lower limit, the viscosity of the slurry increases and tends to deviate from the desired viscosity range, and if it is higher than the upper limit, the raw material BN powder is easily decomposed into ammonia in the aqueous solution. Usually, it is 10 ° C. or higher and 60 ° C. or lower, preferably 15 ° C. or higher and 50 ° C. or lower, more preferably 15 ° C. or higher and 40 ° C. or lower, and further preferably 15 ° C. or higher and 35 ° C. or lower.
The content ratio of the raw material Al 2 O 3 powder and the raw material BN powder is not particularly limited, but the raw material Al 2 O 3 powder: raw material BN powder ratio (mass ratio) is usually 1:99 to 90:10, preferably 2: It is 98 to 85:15, more preferably 13:87 to 60:40. Within the above range, a card house structure made of BN primary particles is formed, which is preferable.

{造粒}
Al−BN複合スラリーから造粒粒子を得るには、スプレードライ法、転動法、流動層法、そして撹拌法などの一般的な造粒方法を用いることができ、この中でもスプレードライ法が好ましい。
スプレードライ法では、原料となるスラリーの濃度、装置に導入する単位時間当たりの送液量と送液したスラリーを噴霧する際の圧空圧力及び圧空量により、所望の大きさの造粒粒子を製造することが可能であって、球状の造粒粒子を得ることも可能である。
{Granulation}
In order to obtain granulated particles from the Al 2 O 3- BN composite slurry, general granulation methods such as a spray-drying method, a rolling method, a fluidized bed method, and a stirring method can be used, and among these, spray-drying can be used. The method is preferred.
In the spray-drying method, granulated particles of a desired size are produced by the concentration of the slurry as a raw material, the amount of liquid to be introduced into the apparatus per unit time, and the compressed air pressure and the amount of compressed air when spraying the supplied slurry. It is also possible to obtain spherical granulated particles.

造粒により得られたAl−BN複合造粒粒子の平均粒子径は、本発明のAlN−BN複合凝集粒子の体積基準の平均粒子径の範囲を好ましくは5μm以上150μm以下とする場合には、体積基準の平均粒子径D50で通常1.0μm以上であり、好ましくは5.0μm以上、より好ましくは10μm以上、更に好ましくは20μm以上であり、特に好ましくは30μm以上、最も好ましくは40μm以上であり、50μm以上であっても好ましく、60μm以上であっても好ましい。また、通常200μm以下、好ましくは150μm以下、更に好ましくは100μm以下である。ここで、造粒粒子の体積基準の平均粒子径D50は、例えば、湿式では堀場製作所製「LA920」、乾式ではMalvern社製「Morphorogi」などで測定することができる。 The average particle size of the Al 2 O 3- BN composite granulated particles obtained by granulation is preferably 5 μm or more and 150 μm or less in the volume-based average particle size range of the AlN-BN composite agglomerated particles of the present invention. The average particle size D 50 on a volume basis is usually 1.0 μm or more, preferably 5.0 μm or more, more preferably 10 μm or more, still more preferably 20 μm or more, particularly preferably 30 μm or more, and most preferably. It is 40 μm or more, preferably 50 μm or more, and preferably 60 μm or more. Further, it is usually 200 μm or less, preferably 150 μm or less, and more preferably 100 μm or less. Here, the average particle size D 50 based on the volume of the granulated particles can be measured by, for example, "LA920" manufactured by HORIBA, Ltd. for the wet type and "Morphorogi" manufactured by Malvern for the dry type.

{仮加熱処理}
上記のAl−BN複合造粒粒子を更に酸化雰囲気下で加熱処理することで、Al−BN複合仮加熱処理粒子を製造することができる。
ここで、酸化雰囲気とは、酸素ガスなどを含む酸化性ガス雰囲気のことである。ここで用いる酸性ガスの種類によりAl−BN複合造粒粒子中の有機成分の燃焼による除去加減が異なってくる。
仮加熱処理温度は通常500℃以上、900℃以下であるが、好ましくは700℃以上であり、また好ましくは800℃以下である。仮加熱処理温度が低すぎると、有機成分の燃焼による除去が不十分となり、後述する加熱処理工程に於いて窒素および炭素を含有する有毒ガスが発生する恐れがある。仮加熱処理温度が高すぎると、BNが酸化されてしまうおそれがある。
{Temporary heat treatment}
By further heat-treating the above-mentioned Al 2 O 3- BN composite granulated particles in an oxidizing atmosphere, Al 2 O 3- BN composite temporary heat-treated particles can be produced.
Here, the oxidizing atmosphere is an oxidizing gas atmosphere containing oxygen gas and the like. Depending on the type of acid gas used here, the amount of removal of organic components in the Al 2 O 3-BN composite granulated particles by combustion differs.
The tentative heat treatment temperature is usually 500 ° C. or higher and 900 ° C. or lower, but is preferably 700 ° C. or higher, and preferably 800 ° C. or lower. If the tentative heat treatment temperature is too low, the removal of organic components by combustion becomes insufficient, and toxic gas containing nitrogen and carbon may be generated in the heat treatment step described later. If the temporary heat treatment temperature is too high, the BN may be oxidized.

仮加熱処理の加熱処理時間は、通常1時間以上、好ましくは2時間以上、また通常12時間以下、好ましくは5時間以下である。仮加熱処理の加熱処理時間が上記下限未満の場合、有機成分の燃焼による除去が不十分となり、上記上限を超えるとBNが一部酸化するおそれがある。 The heat treatment time of the temporary heat treatment is usually 1 hour or more, preferably 2 hours or more, and usually 12 hours or less, preferably 5 hours or less. If the heat treatment time of the temporary heat treatment is less than the above lower limit, the removal of the organic component by combustion becomes insufficient, and if it exceeds the above upper limit, BN may be partially oxidized.

仮加熱処理の加熱処理に用いる焼成炉としては、マッフル炉、管状炉、雰囲気炉などのバッチ式炉やロータリーキルン、スクリューコンベヤ炉、トンネル炉、ベルト炉、プッシャー炉、竪型連続炉などの連続炉が挙げられ、目的に応じて使い分けられる。 As the firing furnace used for the heat treatment of the temporary heat treatment, a batch type furnace such as a muffle furnace, a tubular furnace, and an atmosphere furnace, and a continuous furnace such as a rotary kiln, a screw conveyor furnace, a tunnel furnace, a belt furnace, a pusher furnace, and a vertical continuous furnace are used. Can be used according to the purpose.

{加熱処理}
上記のAl−BN複合仮加熱処理粒子を更に非酸化性ガス雰囲気下に加熱処理することで、Al−BN複合熱処理粒子を製造することができる。
ここで、非酸化性ガス雰囲気とは、窒素ガス、ヘリウムガス、アルゴンガス、アンモニアガス、水素ガス、メタンガス、プロパンガス、一酸化炭素ガスなどの雰囲気のことである。ここで用いる雰囲気ガスの種類によりAl粒子またはBN粒子の結晶化速度が異なるものとなり、結晶化を短時間で行うためには特に窒素ガス、もしくは窒素ガスと他のガスを併用した混合ガスが好適に用いられる。
加熱処理温度は通常1500℃以上、2000℃以下であるが、好ましくは1600℃以上であり、また好ましくは1900℃以下である。加熱処理温度が低すぎると、BNの平均結晶子の成長が不十分となり、BN凝集粒子および成形体の熱伝導率が小さくなる場合がある。加熱処理温度が高すぎると、AlまたはBNの分解などが生じてしまうおそれがある。
{Heat treatment}
By further heat-treating the above-mentioned Al 2 O 3- BN composite temporary heat-treated particles in a non-oxidizing gas atmosphere, Al 2 O 3- BN composite heat-treated particles can be produced.
Here, the non-oxidizing gas atmosphere is an atmosphere of nitrogen gas, helium gas, argon gas, ammonia gas, hydrogen gas, methane gas, propane gas, carbon monoxide gas and the like. The crystallization rate of Al 2 O 3 particles or BN particles differs depending on the type of atmospheric gas used here, and in order to carry out crystallization in a short time, nitrogen gas or a mixture of nitrogen gas and another gas is particularly used. Gas is preferably used.
The heat treatment temperature is usually 1500 ° C. or higher and 2000 ° C. or lower, preferably 1600 ° C. or higher, and preferably 1900 ° C. or lower. If the heat treatment temperature is too low, the growth of the average crystallites of BN may be insufficient, and the thermal conductivity of the BN agglomerated particles and the molded product may be reduced. If the heat treatment temperature is too high , decomposition of Al 2 O 3 or BN may occur.

加熱処理時間は、通常1時間以上、好ましくは5時間以上、より好ましくは12時間以上、また通常72時間以下、好ましくは48時間以下である。加熱処理時間が上記下限未満の場合、結晶成長が不十分となり、上記上限を超えるとAlまたはBNが一部分解するおそれがある。 The heat treatment time is usually 1 hour or more, preferably 5 hours or more, more preferably 12 hours or more, and usually 72 hours or less, preferably 48 hours or less. If the heat treatment time is less than the above lower limit, the crystal growth becomes insufficient, and if it exceeds the above upper limit, Al 2 O 3 or BN may be partially decomposed.

加熱処理は、非酸化性ガス雰囲気下で行うために、好ましくは、通常、焼成炉内を真空ポンプを用いて排気した後、非酸化性ガスを導入しながら、所望の温度まで加熱して昇温するが、焼成炉内が十分に非酸化性ガスで置換できる場合は、常圧下で非酸化性ガスを導入しながら加熱昇温しても良い。焼成炉としては、マッフル炉、管状炉、雰囲気炉などのバッチ式炉やロータリーキルン、スクリューコンベヤ炉、トンネル炉、ベルト炉、プッシャー炉、竪型連続炉などの連続炉が挙げられ、目的に応じて使い分けられる。 Since the heat treatment is performed in a non-oxidizing gas atmosphere, preferably, the inside of the firing furnace is usually exhausted by using a vacuum pump, and then heated to a desired temperature while introducing the non-oxidizing gas to raise the temperature. Although it is heated, if the inside of the firing furnace can be sufficiently replaced with a non-oxidizing gas, the temperature may be raised by heating while introducing the non-oxidizing gas under normal pressure. Examples of the firing furnace include batch type furnaces such as muffle furnaces, tubular furnaces, and atmospheric furnaces, and continuous furnaces such as rotary kilns, screw conveyor furnaces, tunnel furnaces, belt furnaces, pusher furnaces, and vertical continuous furnaces, depending on the purpose. It can be used properly.

{還元窒化処理}
上記のAl−BN複合熱処理粒子を還元窒化処理することで、AlN−BN複合凝集粒子を製造することができる。
ここで、還元窒化処理とは、Al−BN複合熱処理粒子とカーボンブラックとの混合物を非酸化性ガス雰囲気下もしくは還元性ガス雰囲気下にて加熱処理することである。
ここで、非酸化性ガス雰囲気とは、窒素ガス、ヘリウムガス、アルゴンガス、アンモニアガス、水素ガス、メタンガス、プロパンガス、一酸化炭素ガスなどの雰囲気のことである。また、ここで、還元性ガス雰囲気下とは、アンモニアガス、水素ガス、一酸化炭素ガスなどを含む雰囲気のことである。
加熱処理温度は通常1000℃以上、2000℃以下であるが、好ましくは1600℃以上であり、また好ましくは1900℃以下である。加熱処理温度が低すぎると、還元窒化が不十分となり、AlN−BN複合凝集粒子および成形体の熱伝導率が小さくなる場合がある。加熱処理温度が高すぎると、Al、AlN、またはBNの分解などが生じてしまうおそれがある。
還元窒化処理においてカーボンブラックの含有量は特段限定されないが、Al−BN複合熱処理粒子中のAl100質量部に対し通常30質量部以上、好ましくは35質量部以上であり、また通常75質量部以下、好ましくは55質量部以下である。
{Reduction nitriding treatment}
By reducing and nitriding the above Al 2 O 3- BN composite heat-treated particles, AlN-BN composite aggregated particles can be produced.
Here, the reduction nitriding treatment is to heat-treat a mixture of Al 2 O 3- BN composite heat-treated particles and carbon black in a non-oxidizing gas atmosphere or a reducing gas atmosphere.
Here, the non-oxidizing gas atmosphere is an atmosphere of nitrogen gas, helium gas, argon gas, ammonia gas, hydrogen gas, methane gas, propane gas, carbon monoxide gas and the like. Further, here, the reducing gas atmosphere is an atmosphere containing ammonia gas, hydrogen gas, carbon monoxide gas, and the like.
The heat treatment temperature is usually 1000 ° C. or higher and 2000 ° C. or lower, preferably 1600 ° C. or higher, and preferably 1900 ° C. or lower. If the heat treatment temperature is too low, reductive nitriding may be insufficient, and the thermal conductivity of the AlN-BN composite agglomerated particles and the molded product may be reduced. If the heat treatment temperature is too high , decomposition of Al 2 O 3 , Al N, or BN may occur.
The content of carbon black in the reduction nitriding is not otherwise limited, Al 2 O 3 -BN composite heat treatment to Al 2 O 3 100 parts by weight of the particles generally 30 parts by weight or more, preferably 35 parts by mass or more, Further, it is usually 75 parts by mass or less, preferably 55 parts by mass or less.

還元窒化処理における加熱処理時間は、通常1時間以上、好ましくは5時間以上、より好ましくは12時間以上、また通常72時間以下、好ましくは48時間以下である。加熱処理時間が上記下限未満の場合、還元窒化が不十分となり、上記上限を超えるとAl、AlN、またはBNが一部分解するおそれがある。 The heat treatment time in the reduction nitriding treatment is usually 1 hour or more, preferably 5 hours or more, more preferably 12 hours or more, and usually 72 hours or less, preferably 48 hours or less. If the heat treatment time is less than the above lower limit, the reduction nitriding becomes insufficient, and if the heat treatment time exceeds the above upper limit, Al 2 O 3 , Al N, or BN may be partially decomposed.

還元窒化処理は、非酸化性ガス雰囲気下または還元性ガス雰囲気下で行うために、好ましくは、通常、焼成炉内を真空ポンプを用いて排気した後、非酸化性ガスまたは還元性ガスを炉内導入しながら、所望の温度まで加熱して昇温する。焼成炉内が十分に非酸化性ガスまたは還元性ガスで置換できる場合は、常圧下で非酸化性ガスまたは還元性ガスを導入しながら加熱昇温してもよい。焼成炉としては、マッフル炉、管状炉、雰囲気炉などのバッチ式炉やロータリーキルン、スクリューコンベヤ炉、トンネル炉、ベルト炉、プッシャー炉、竪型連続炉などの連続炉が挙げられ、目的に応じて使い分けられる。 Since the reduction nitriding treatment is performed in a non-oxidizing gas atmosphere or a reducing gas atmosphere, it is preferable that the inside of the firing furnace is usually exhausted by using a vacuum pump, and then the non-oxidizing gas or the reducing gas is blown into the furnace. While introducing the gas, it is heated to a desired temperature to raise the temperature. If the inside of the firing furnace can be sufficiently replaced with a non-oxidizing gas or a reducing gas, the temperature may be raised by heating while introducing the non-oxidizing gas or the reducing gas under normal pressure. Examples of the firing furnace include batch type furnaces such as muffle furnaces, tubular furnaces, and atmospheric furnaces, and continuous furnaces such as rotary kilns, screw conveyor furnaces, tunnel furnaces, belt furnaces, pusher furnaces, and vertical continuous furnaces, depending on the purpose. It can be used properly.

{カーボンブラック除去処理}
上記のAlN−BN複合凝集粒子を更に酸化雰囲気下で加熱処理することで、高純度AlN−BN複合凝集粒子を製造することができる。
ここで、酸化雰囲気とは、酸素ガスなどを含む酸化性ガス雰囲気のことである。ここで用いる酸性ガスの種類によりAlN−BN複合凝集粒子に残留する余剰カーボンブラックの燃焼による除去加減が異なってくる。
カーボンブラック除去処理温度は通常500℃以上、900℃以下であるが、好ましくは700℃以上であり、また好ましくは800℃以下である。カーボンブラック除去処理温度が低すぎると、カーボンブラックの燃焼による除去が不十分となり、AlN−BN複合凝集粒子の絶縁性が低下する恐れがある。カーボンブラック除去処理温度が高すぎると、BNが酸化されてしまうおそれがある。
{Carbon black removal treatment}
High-purity AlN-BN composite agglomerated particles can be produced by further heat-treating the above AlN-BN composite agglomerated particles in an oxidizing atmosphere.
Here, the oxidizing atmosphere is an oxidizing gas atmosphere containing oxygen gas and the like. Depending on the type of acid gas used here, the amount of excess carbon black remaining in the AlN-BN composite agglomerated particles will be removed by combustion.
The carbon black removal treatment temperature is usually 500 ° C. or higher and 900 ° C. or lower, but is preferably 700 ° C. or higher, and preferably 800 ° C. or lower. If the carbon black removal treatment temperature is too low, the removal of carbon black by combustion may be insufficient, and the insulating property of the AlN-BN composite agglomerated particles may be lowered. If the carbon black removal treatment temperature is too high, the BN may be oxidized.

カーボンブラック除去処理における加熱処理時間は、通常1時間以上、好ましくは2時間以上、また通常12時間以下、好ましくは5時間以下である。加熱処理時間が上記下限未満の場合、カーボンブラックの燃焼による除去が不十分となり、上記上限を超えるとBNが一部酸化するおそれがある。 The heat treatment time in the carbon black removal treatment is usually 1 hour or more, preferably 2 hours or more, and usually 12 hours or less, preferably 5 hours or less. If the heat treatment time is less than the above lower limit, the removal of carbon black by combustion becomes insufficient, and if it exceeds the above upper limit, BN may be partially oxidized.

加熱処理に用いる焼成炉としては、マッフル炉、管状炉、雰囲気炉などのバッチ式炉やロータリーキルン、スクリューコンベヤ炉、トンネル炉、ベルト炉、プッシャー炉、竪型連続炉などの連続炉が挙げられ、目的に応じて使い分けられる。 Examples of the firing furnace used for heat treatment include batch type furnaces such as muffle furnaces, tubular furnaces, and atmospheric furnaces, and continuous furnaces such as rotary kilns, screw conveyor furnaces, tunnel furnaces, belt furnaces, pusher furnaces, and vertical continuous furnaces. It can be used properly according to the purpose.

上記説明したAlN−BN複合凝集粒子の製造方法は、本発明の別の実施形態であり、
窒化アルミニウム一次粒子及び窒化ホウ素一次粒子が凝集してなる窒化アルミニウム−窒化ホウ素複合凝集粒子の製造法であって、酸化アルミニウムの還元窒化ステップ、を含む製造法である。
上記還元窒化ステップは、カーボンブラック存在下、非酸化性ガス又は還元性ガス雰囲気下にて行われることが好ましい。
The method for producing AlN-BN composite agglomerated particles described above is another embodiment of the present invention.
It is a production method of aluminum nitride-boron nitride composite aggregated particles formed by agglomerating aluminum nitride primary particles and boron nitride primary particles, and is a production method including a reduction nitride step of aluminum oxide.
The reduction nitriding step is preferably carried out in the presence of carbon black and in a non-oxidizing gas or reducing gas atmosphere.

<複合材組成物>
本発明の別の実施形態は、上記AlN−BN複合凝集粒子をマトリクスに配合させてなる、複合材組成物である。
用いるマトリクスは熱伝導性が高いことが好ましく、マトリクスの熱伝導率は0.2W/mK以上であることが好ましく、特に0.22W/mK以上であることが好ましい。
なお、マトリクスの熱伝導率の測定方法は以下の装置を用いて、熱拡散率、比重、及び比熱を測定し、この3つの測定値を乗じることで熱伝導率を求める。
(1)熱拡散率:アイフェイズ社製 「アイフェイズ・モバイル 1u」
(2)比重:メトラー・トレド社製 「天秤 XS−204」(固体比重測定キット使用)
(3)比熱:セイコーインスツル社製 「DSC320/6200」
<Composite composition>
Another embodiment of the present invention is a composite composition obtained by blending the above AlN-BN composite agglomerated particles into a matrix.
The matrix used preferably has high thermal conductivity, and the thermal conductivity of the matrix is preferably 0.2 W / mK or more, and particularly preferably 0.22 W / mK or more.
As a method for measuring the thermal conductivity of the matrix, the thermal diffusivity, the specific gravity, and the specific heat are measured using the following devices, and the thermal conductivity is obtained by multiplying these three measured values.
(1) Thermal diffusivity: "Eye Phase Mobile 1u" manufactured by Eye Phase
(2) Specific gravity: "Balance XS-204" manufactured by METTLER TOLEDO (using solid density measurement kit)
(3) Specific heat: Seiko Instruments Inc. "DSC320 / 6200"

マトリクスとしては通常樹脂が用いられ、硬化性樹脂、熱可塑性樹脂のいずれも制限なく用いることが出来る。硬化性樹脂としては、熱硬化性、光硬化性、電子線硬化性などの架橋可能なものであればよいが、耐熱性、吸水性、寸法安定性などの点で、熱硬化性樹脂が好ましく用いられる。
熱硬化性樹脂、熱硬化性樹脂としては、例えばWO2013/081061に例示されたものを用いることができる。このうち、熱硬化性樹脂を用いることが好ましく、特にエポキシ樹脂を用いることが好ましい。
エポキシ樹脂としては、ナフタレン骨格、フルオレン骨格、ビフェニル骨格、アントラセン骨格、ピレン骨格、キサンテン骨格、アダマンタン骨格及びジシクロペンタジエン骨格からなる群から選択された少なくとも1つの骨格を有するフェノキシ樹脂が好ましい。中でも、耐熱性がより一層高められることから、フルオレン骨格及び/又はビフェニル骨格を有するフェノキシ樹脂が特に好ましく、とりわけビルフェノールA骨格、ビスフェノールF骨格及びビフェニル骨格のうちの少なくとも1つ以上の骨格を有するフェノキシ樹脂であることが好ましい。
A resin is usually used as the matrix, and either a curable resin or a thermoplastic resin can be used without limitation. The curable resin may be any crosslinkable resin such as thermosetting, photocurable, and electron beam curable, but a thermosetting resin is preferable in terms of heat resistance, water absorption, dimensional stability, and the like. Used.
As the thermosetting resin and the thermosetting resin, for example, those exemplified in WO2013 / 081061 can be used. Of these, it is preferable to use a thermosetting resin, and it is particularly preferable to use an epoxy resin.
As the epoxy resin, a phenoxy resin having at least one skeleton selected from the group consisting of a naphthalene skeleton, a fluorene skeleton, a biphenyl skeleton, an anthracene skeleton, a pyrene skeleton, a xanthene skeleton, an adamantane skeleton and a dicyclopentadiene skeleton is preferable. Among them, a phenoxy resin having a fluorene skeleton and / or a biphenyl skeleton is particularly preferable because heat resistance is further enhanced, and in particular, it has at least one or more skeletons of a bilphenol A skeleton, a bisphenol F skeleton and a biphenyl skeleton. It is preferably a phenoxy resin.

複合材組成物中のマトリクスの含有量は、通常2wt%以上、好ましくは5wt%以上、より好ましくは7wt%以上であり、通常70wt%以下、好ましくは60wt%以下、より好ましくは40wt%以下である。
また、複合材組成物中の(高純度)AlN−BN複合凝集粒子の含有量は、通常30wt%以上、好ましくは40wt%以上、より好ましくは50wt%以上であり、通常99wt%以下、好ましくは98wt%以下、より好ましくは95wt%以下である。
The content of the matrix in the composite composition is usually 2 wt% or more, preferably 5 wt% or more, more preferably 7 wt% or more, usually 70 wt% or less, preferably 60 wt% or less, more preferably 40 wt% or less. be.
The content of the (high-purity) AlN-BN composite agglomerated particles in the composite composition is usually 30 wt% or more, preferably 40 wt% or more, more preferably 50 wt% or more, and usually 99 wt% or less, preferably 99 wt% or less. It is 98 wt% or less, more preferably 95 wt% or less.

複合材組成物の調製には、有機溶剤を用いることができる。有機溶剤としては、アルコール系溶剤、芳香族系溶剤、アミド系溶剤、アルカン系溶剤、エチレングリコールエーテル及びエーテル・エステル系容易剤、プロピレングリコールエーテル及びエーテル・エステル系溶剤、ケトン系溶剤、エステル系溶剤の中から、樹脂の溶解性等を考慮して、好適に選択して用いることができる。
有機溶剤の具体例としては、WO2013/081061に例示されたものを用いることができる。
有機溶剤は、1種を単独で用いてもよく、2種以上を任意の組合せ及び比率で併用してもよい。
An organic solvent can be used to prepare the composite composition. Examples of the organic solvent include alcohol-based solvents, aromatic solvents, amide-based solvents, alkane-based solvents, ethylene glycol ethers and ether / ester-based easy agents, propylene glycol ethers and ether-ester-based solvents, ketone-based solvents, and ester-based solvents. From the above, it can be suitably selected and used in consideration of the solubility of the resin and the like.
As a specific example of the organic solvent, those exemplified in WO2013 / 081061 can be used.
As the organic solvent, one type may be used alone, or two or more types may be used in combination in any combination and ratio.

複合材組成物は、必要に応じて硬化剤を含有していてもよい。
硬化剤とは、エポキシ樹脂のエポキシ基等などの、マトリクスの架橋基間の架橋反応に寄与する物質を示す。
エポキシ樹脂においては、必要に応じて、エポキシ樹脂用の硬化剤、硬化促進剤が共に用いられる。
硬化剤としては例えば、酸無水物系硬化剤やアミン系硬化剤が挙げられる。酸無水物系硬化剤としては、例えば、テトラヒドロフタル酸無水物、メチルテトラヒドロフタル酸無水物、ヘキサヒドロフタル酸無水物、及びベンゾフェノンテトラカルボン酸無水物が挙げられる。アミン系硬化剤としては、例えば、エチレンジアミン、ジエチレントリアミン、トリエチレンテトラミン等の脂肪族ポリアミン、ジアミノジフェニルスルホン、ジアミノジフェニルメタン、ジアミノジフェニルエーテル、m−フェニレンジアミン等の芳香族ポリアミン及びジシアンジアミド等が挙げられる。これらは1種を単独で用いてもよく、2種以上を混合して用いてもよい。
The composite composition may contain a curing agent, if necessary.
The curing agent refers to a substance that contributes to the cross-linking reaction between the cross-linking groups of the matrix, such as the epoxy group of the epoxy resin.
In the epoxy resin, a curing agent and a curing accelerator for the epoxy resin are used together, if necessary.
Examples of the curing agent include an acid anhydride-based curing agent and an amine-based curing agent. Examples of the acid anhydride-based curing agent include tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, and benzophenone tetracarboxylic acid anhydride. Examples of the amine-based curing agent include aliphatic polyamines such as ethylenediamine, diethylenetriamine and triethylenetetramine, aromatic polyamines such as diaminodiphenylsulfone, diaminodiphenylmethane, diaminodiphenyl ether and m-phenylenediamine, and dicyandiamide. One of these may be used alone, or two or more thereof may be mixed and used.

また、機能性の更なる向上を目的として、本発明の効果を損なわない範囲において、各種の添加剤(その他の添加剤)を含んでいてもよい。その他の添加剤としては、例えば、液晶性エポキシ樹脂等の、前記のマトリクスに機能性を付与した機能性樹脂、窒化アルミニウム、窒化ケイ素、繊維状窒化ホウ素等の窒化物粒子、アルミナ、繊維状アルミナ、酸化亜鉛、酸化マグネシウム、酸化ベリリウム、酸化チタン等の絶縁性金属酸化物、ダイヤモンド、フラーレン等の絶縁性炭素成分、樹脂硬化剤、樹脂硬化促進剤、粘度調整剤、分散安定剤が挙げられる。 Further, for the purpose of further improving the functionality, various additives (other additives) may be contained as long as the effects of the present invention are not impaired. Examples of other additives include functional resins having functionality added to the matrix, such as liquid crystal epoxy resins, nitride particles such as aluminum nitride, silicon nitride, and fibrous boron nitride, alumina, and fibrous alumina. , Insulating metal oxides such as zinc oxide, magnesium oxide, beryllium oxide and titanium oxide, insulating carbon components such as diamond and fullerene, resin curing agents, resin curing accelerators, viscosity modifiers and dispersion stabilizers.

さらに、その他の添加剤としては、マトリクスと(高純度)AlN−BN複合凝集粒子との接着性を向上させるための添加成分として、シランカップリング剤やチタネートカップリング剤等のカップリング剤、保存安定性向上のための紫外線防止剤、酸化防止剤、可塑剤、難燃剤、着色剤、分散剤、流動性改良剤等が挙げられる。 Further, as other additives, as an additive component for improving the adhesiveness between the matrix and the (high-purity) AlN-BN composite agglomerated particles, a coupling agent such as a silane coupling agent or a titanate coupling agent, and storage. Examples thereof include UV inhibitors, antioxidants, plasticizers, flame retardants, colorants, dispersants, fluidity improvers and the like for improving stability.

その他、組成物中での各成分の分散性を向上させる、界面活性剤や、乳化剤、低弾性化剤、希釈剤、消泡剤、イオントラップ剤等を添加することもできる。
これらは、いずれも1種を単独で用いてもよく、2種以上を任意の組み合わせ及び比率で混合して用いてもよい。
添加剤の具体例については、WO2013/081061に例示されたものを用いることができ、添加量についてもWO2013/081061に記載の範囲とすることができる。
In addition, a surfactant, an emulsifier, a low elasticity agent, a diluent, an antifoaming agent, an ion trapping agent, etc., which improve the dispersibility of each component in the composition, can be added.
One of these may be used alone, or two or more thereof may be mixed and used in any combination and ratio.
As a specific example of the additive, those exemplified in WO2013 / 081061 can be used, and the amount of the additive can also be within the range described in WO2013 / 081061.

複合材組成物の調製は、(高純度)AlN−BN複合凝集粒子、マトリクス、溶剤およびその他の添加剤を分散・混合することを目的として、ペイントシェーカーやビーズミル、プラネタリーミキサー、攪拌型分散機、自公転攪拌混合機、三本ロール、ニーダー、単軸又は二軸混練機等の一般的な混練装置などを用いて混合することが好ましい。
複合材組成物の各配合成分の混合順序も、反応や沈殿物が発生するなど特段の問題がない限り任意であり、組成物の構成成分のうち、何れか2成分又は3成分以上を予め混合し、その後に残りの成分を混合してもよいし、一度に全部を混合してもよい。
The composition of the composite material is prepared by a paint shaker, a bead mill, a planetary mixer, a stirring type disperser for the purpose of dispersing and mixing (high-purity) AlN-BN composite aggregated particles, a matrix, a solvent and other additives. , It is preferable to mix using a general kneading device such as a self-revolving stirring mixer, a three-roll, kneader, a single-screw or twin-screw kneader.
The mixing order of each compounding component of the composite material composition is also arbitrary as long as there are no particular problems such as reaction or precipitation, and any two components or three or more components of the composition are mixed in advance. Then the remaining ingredients may be mixed or all at once.

上記複合材組成物は、成形体とすることでシート、基板などの放熱部材となり得る。
この成形体を成形する方法は、樹脂組成物の成形に一般に用いられる方法を用いることができる。
ここでいう基板とは、シートの片面ないしは両面に対して、金属ないしはセラミックスからなる板を貼り合せたものをいう。
例えば、放熱シート用塗布液を所望の形状で、例えば、型へ充てんした状態で硬化させることによって成形することができる。このような成形体の製造法としては、射出成形法、射出圧縮成形法、押出成形法、及び圧縮成形法を用いることができる。
また、複合材組成物がエポキシ樹脂やシリコーン樹脂等の熱硬化性樹脂組成物を含む場合、成形体の成形、すなわち硬化は、それぞれの組成に応じた硬化温度条件で行うことができる。
本実施形態に係る複合材組成物を成形したシート・基板は、含有される複合凝集粒子が熱伝導性に優れることから高い放熱性を有し、パワーデバイス用途の放熱シート及び放熱基板などの放熱用部材として好適に用いられる。
By forming the composite material composition into a molded body, it can be a heat radiating member such as a sheet or a substrate.
As a method for molding this molded product, a method generally used for molding a resin composition can be used.
The substrate referred to here means a board in which a plate made of metal or ceramics is bonded to one side or both sides of a sheet.
For example, it can be molded by curing the coating liquid for a heat radiating sheet in a desired shape, for example, in a state of being filled in a mold. As a method for producing such a molded product, an injection molding method, an injection compression molding method, an extrusion molding method, and a compression molding method can be used.
When the composite composition contains a thermosetting resin composition such as an epoxy resin or a silicone resin, the molded product can be molded, that is, cured under curing temperature conditions according to the respective compositions.
The sheet / substrate obtained by molding the composite composition according to the present embodiment has high heat dissipation because the composite agglomerated particles contained therein are excellent in thermal conductivity, and dissipate heat from the heat dissipation sheet and the heat dissipation substrate for power device applications. It is suitably used as a member.

また、複合材組成物が熱可塑性樹脂組成物を含む場合、成形体の成形は、熱可塑性樹脂の溶融温度以上の温度及び所定の成形速度や圧力の条件で行うことができる。また、複合材組成物を成形硬化した固形状の材料から所望の形状に削り出すことによって成形体を得ることもできる。 When the composite material composition contains the thermoplastic resin composition, the molded product can be molded under the conditions of a temperature equal to or higher than the melting temperature of the thermoplastic resin and a predetermined molding speed and pressure. Further, a molded product can also be obtained by cutting the composite material composition into a desired shape from a solid material that has been molded and cured.

以下、実施例により本発明を更に詳細に説明するが、本発明はその要旨を超えない限り以下の実施例に限定されるものではない。なお、下記の実施例における各種の条件や評価結果の値は、本発明の実施態様における好ましい範囲同様に、本発明の好ましい範囲を示すものであり、本発明の好ましい範囲は前記した実施態様における好ましい範囲と下記実施例の値または実施例同士の値の組合せにより示される範囲を勘案して決めることができる。 Hereinafter, the present invention will be described in more detail with reference to Examples, but the present invention is not limited to the following Examples as long as the gist of the present invention is not exceeded. The values of various conditions and evaluation results in the following examples indicate the preferable range of the present invention as well as the preferable range in the embodiment of the present invention, and the preferable range of the present invention is the preferred range in the above-described embodiment. It can be determined in consideration of the preferable range and the range indicated by the combination of the values of the following examples or the values of the examples.

{測定条件}
本発明における特性は以下に記載の方法にて測定した。
・平均粒子径(D50):
平均粒子径は、HORIBA社製「LA−300」を用いてD50(μm)を測定した。
・XRDパターン
XRD測定は、PANalytical社製X線回折装置「X‘Pert Pro MPD」を用いた。なお、X線源はCuKαである。
・粒子形状
粒子形状観察は、SEM(Zeiss Ultra55)を用いた。
・元素分析
元素分析は、BRUKER AXS社製エネルギー分散型X線分析(SEM−EDX)装置「QUANTAX 200」を用いた。
・成形体の厚み方向熱伝導率
成形体の厚み方向の熱拡散率を株式会社アイフェイズ製の熱拡散率測定装置「ai―Phase Mobile 1u」を用いて測定し、以下により求めた。
成形体の厚み方向熱伝導率=成形体の厚み方向の熱拡散率×成形体の比重×成形体の比熱
{Measurement condition}
The characteristics in the present invention were measured by the methods described below.
-Average particle size (D 50 ):
The average particle size was measured D 50 (μm) using a HORIBA Ltd. "LA-300".
-XRD pattern For XRD measurement, an X-ray diffractometer "X'Pert Pro MPD" manufactured by PANalytical Co., Ltd. was used. The X-ray source is CuKα.
-Particle shape The particle shape was observed using SEM (Zeiss Ultra55).
-Elemental analysis For elemental analysis, an energy dispersive X-ray analysis (SEM-EDX) device "QUANTAX 200" manufactured by BRUKER AXS was used.
-Thermal conductivity in the thickness direction of the molded body The thermal diffusivity in the thickness direction of the molded body was measured using a thermal diffusivity measuring device "ai-Phase Mobile 1u" manufactured by iPhase Co., Ltd., and was determined as follows.
Thermal conductivity in the thickness direction of the molded body = Thermal diffusivity in the thickness direction of the molded body × Specific gravity of the molded body × Specific heat of the molded body

(比較例1)
BNのみからなる凝集粒子が複合材組成物に与える熱伝導率を評価し、AlN−BN複合凝集粒子との比較対象とした。
<凝集粒子の作製>
[スラリーの調製]
バインダー(多木化学(株)製「タキセラムM160L」、固形分濃度21質量%)を容器に秤取り、そこへ原料h−BN粉末(酸素濃度7.5質量%)を秤取った。バインダー量は、原料h−BN粉末量の1.15倍とした。各物質の配合量は表1に示す。これをハンドミキサーで均一になるまで撹拌した。
(Comparative Example 1)
The thermal conductivity given to the composite composition by the agglomerated particles consisting only of BN was evaluated and used as a comparison target with the AlN-BN composite agglomerated particles.
<Preparation of aggregated particles>
[Preparation of slurry]
A binder (“Taxerum M160L” manufactured by Taki Chemical Co., Ltd., solid content concentration 21% by mass) was weighed in a container, and raw material h-BN powder (oxygen concentration 7.5% by mass) was weighed therein. The amount of binder was 1.15 times the amount of raw material h-BN powder. The blending amount of each substance is shown in Table 1. This was stirred with a hand mixer until uniform.

[造粒粒子の作製]
スラリーからの造粒は、藤崎電機株式会社製マイクロミストスプレードライヤ(MDL−050M)Laboを用いて実施し、球状の造粒粒子を得た。造粒粒子のD50は表1に示す。
[Preparation of granulated particles]
Granulation from the slurry was carried out using a micro mist spray dryer (MDL-050M) Labo manufactured by Fujisaki Electric Co., Ltd. to obtain spherical granulated particles. D of the granulated particles 50 are shown in Table 1.

[仮熱処理粒子の作製]
上記造粒粒子を、大気下で700℃まで700℃/時で昇温し、700℃到達後そのまま2時間保持し、その後室温まで冷却することで、仮熱処理粒子を得た。
[Preparation of temporary heat-treated particles]
The granulated particles were heated to 700 ° C. at 700 ° C./hour in the atmosphere, held as they were for 2 hours after reaching 700 ° C., and then cooled to room temperature to obtain temporary heat-treated particles.

[熱処理粒子の作製]
上記仮熱処理粒子を、室温で真空引きをした後、窒素ガスを導入して復圧し、そのまま窒素ガスを0.5L/minで導入しながら1600℃まで230℃/時で昇温し、1600℃到達後、そのまま窒素ガスを導入しながら24時間保持した。その後、室温まで冷却し、カードハウス構造を有する球状の熱処理粒子を得た。
[Preparation of heat-treated particles]
After vacuuming the tentative heat-treated particles at room temperature, nitrogen gas is introduced to repressurize the particles, and the temperature is raised to 1600 ° C. at 230 ° C./hour while introducing nitrogen gas at 0.5 L / min as it is, and the temperature is raised to 1600 ° C. After reaching, it was held for 24 hours while introducing nitrogen gas as it was. Then, it cooled to room temperature, and spherical heat-treated particles having a card house structure were obtained.

<凝集粒子の評価>
[熱処理粒子の組成]
熱処理粒子のXRDパターンは図1の様になった。ピークはh−BN(丸印)、そしてAlBO(無印)に帰属された。AlBOのピーク強度は弱いため、その含有率は極小さいと考えられる。また、このAlBOは、バインダー由来のアルミ酸化物とh−BN中のホウ素酸化物の反応によって形成されたと考えられる。
(原料AlN粉末量)×100/(原料AlN粉末量+原料BN粉末量)で定義した熱処理粒子中のAlN量、(原料BN粉末量)×100/(原料AlN粉末量+原料BN粉末量)で定義した熱処理粒子中のBN量は、表1の様になった。
[熱処理粒子の構造]
熱処理粒子のSEM像は図2の様になった。板状のh−BN一次粒子によるカードハウス構造の形成が確認された。
<Evaluation of aggregated particles>
[Composition of heat-treated particles]
The XRD pattern of the heat-treated particles is as shown in FIG. Peaks were assigned to h-BN (circled) and Al 5 BO 9 (unmarked). Since the peak intensity of Al 5 BO 9 is weak, its content is considered to be extremely small. Further, it is considered that this Al 5 BO 9 was formed by the reaction of the binder-derived aluminum oxide and the boron oxide in h-BN.
The amount of AlN in the heat-treated particles defined by (raw material AlN powder amount) × 100 / (raw material AlN powder amount + raw material BN powder amount), (raw material BN powder amount) × 100 / (raw material AlN powder amount + raw material BN powder amount) The amount of BN in the heat-treated particles defined in Table 1 is as shown in Table 1.
[Structure of heat-treated particles]
The SEM image of the heat-treated particles is as shown in FIG. The formation of a card house structure by plate-shaped h-BN primary particles was confirmed.

<複合材組成物の作製>
[複合材組成物の作製]
(原料)
得られた熱処理粒子、ダイソー社製エポキシ樹脂「LX−01」、BYK社製分散剤「BYK−2155」、そして、四国化成社製硬化剤「C11Z−CN」を用いた。
(複合材組成物の調製)
得られた熱処理粒子、エポキシ樹脂、分散剤を蓋付容器に秤取り、自公転攪拌機(シンキー社製、ARV−310))を用いて混合した。次いで、そこに硬化剤を秤取り、自公転攪拌機を用いて混合した。分散材量は還元窒化粒子量の0.02倍とし、硬化剤量はエポキシ樹脂量の0.06倍とした。各物質の配合量は表2に示す。得られた混合物を、離形処理を施したガラス板に、シリコーンゴム製の500μmギャップと共に挟み込み、160℃で4時間加熱硬化させて熱伝導率評価用の複合材組成物を得た。
<Preparation of composite composition>
[Preparation of composite composition]
(material)
The obtained heat-treated particles, an epoxy resin "LX-01" manufactured by Daiso, a dispersant "BYK-2155" manufactured by BYK, and a curing agent "C11Z-CN" manufactured by Shikoku Kasei Co., Ltd. were used.
(Preparation of composite composition)
The obtained heat-treated particles, epoxy resin, and dispersant were weighed in a container with a lid and mixed using a self-revolving stirrer (Sinky, ARV-310). Then, the curing agent was weighed there and mixed using a self-revolving stirrer. The amount of the dispersant was 0.02 times the amount of the reduced nitride particles, and the amount of the curing agent was 0.06 times the amount of the epoxy resin. The blending amount of each substance is shown in Table 2. The obtained mixture was sandwiched between a glass plate subjected to a shape-removing treatment together with a 500 μm gap made of silicone rubber, and heat-cured at 160 ° C. for 4 hours to obtain a composite material composition for evaluation of thermal conductivity.

<複合材組成物の評価>
上記複合材組成物について、厚み方向の熱伝導率を測定した。測定結果は表2の様になった。また、凝集粒子の含有率に対して熱伝導率をプロットすると図3の様になった。
<Evaluation of composite composition>
The thermal conductivity in the thickness direction of the composite composition was measured. The measurement results are shown in Table 2. Moreover, when the thermal conductivity was plotted with respect to the content rate of agglomerated particles, it was as shown in FIG.

(比較例2)
AlNのみからなる凝集粒子が複合材組成物に与える熱伝導率を評価し、AlN−BN複合凝集粒子との比較対象とした。
<凝集粒子の作製>
原料h−BN粉末を原料AlN粉末(東洋アルミニウム(株)製トーヤルナイトJC)に変えた以外は、比較例1と同様に行った。
(Comparative Example 2)
The thermal conductivity given to the composite composition by the agglomerated particles composed only of AlN was evaluated and used as a comparison target with the AlN-BN composite agglomerated particles.
<Preparation of aggregated particles>
The same procedure as in Comparative Example 1 was carried out except that the raw material h-BN powder was changed to the raw material AlN powder (Toyo Aluminum Co., Ltd. Toyalnite JC).

<凝集粒子の評価>
[熱処理粒子の組成]
熱処理粒子のXRDパターンは図1の様になった。ピークはAlN(星印)、そしてCaAl1219に帰属された。CaAl1219のピーク強度は弱いため、その含有率は極小さいと考えられる。また、このCaAl1219は、バインダー中に微量不純物として含まれるカルシウム化合物とAlNの反応によって形成されたと考えられる。
[熱処理粒子の構造]
熱処理粒子のSEM像は図4の様になった。粒状のAlN一次粒子が確認された。
<Evaluation of aggregated particles>
[Composition of heat-treated particles]
The XRD pattern of the heat-treated particles is as shown in FIG. Peaks were assigned to AlN (stars), and CaAl 12 O 19. Since the peak intensity of CaAl 12 O 19 is weak, its content is considered to be extremely small. Further, it is considered that this CaAl 12 O 19 was formed by the reaction of AlN with the calcium compound contained as a trace impurity in the binder.
[Structure of heat-treated particles]
The SEM image of the heat-treated particles is as shown in FIG. Granular AlN primary particles were confirmed.

<複合材組成物の作製>
比較例1と同様に行った。
<Preparation of composite composition>
This was done in the same manner as in Comparative Example 1.

<複合材組成物の評価>
比較例1と同様に行った。測定結果は表2の様になった。また、凝集粒子の含有率に対して熱伝導率をプロットすると図3の様になった。すなわち、AlNのみからなる凝集粒子が複合材組成物に与える熱伝導率は、BNのみからなる凝集粒子と同等であることが確認された。
<Evaluation of composite composition>
This was done in the same manner as in Comparative Example 1. The measurement results are shown in Table 2. Moreover, when the thermal conductivity was plotted with respect to the content rate of agglomerated particles, it was as shown in FIG. That is, it was confirmed that the thermal conductivity given to the composite composition by the agglomerated particles composed only of AlN is equivalent to that of the agglomerated particles composed only of BN.

Figure 0006950148
Figure 0006950148

Figure 0006950148
Figure 0006950148

(実施例1、2、3)
AlN−BN複合凝集粒子が複合材組成物に与える熱伝導率を評価し、AlN一次粒子とBN一次粒子を複合凝集粒子化することが熱伝導率に与える効果を確認した。
<凝集粒子の作製>
[スラリーの調製]
バインダー(多木化学(株)製「タキセラムM160L」、固形分濃度21質量%)を容器に秤取り、そこへ原料Al粉末(住友化学(株)製「スミコランダムAA03」)および原料h−BN粉末(酸素濃度7.5質量%、一次粒子径0.05μm)を秤取った。バインダー量は、原料Al粉末および原料h−BN粉末の合計量の1.15倍とした。各物質の配合量は表3に示す。これをハンドミキサーで均一になるまで撹拌した。
(Examples 1, 2, 3)
The thermal conductivity of the AlN-BN composite agglomerated particles on the composite composition was evaluated, and the effect of converting the AlN primary particles and the BN primary particles into composite agglomerated particles was confirmed on the thermal conductivity.
<Preparation of aggregated particles>
[Preparation of slurry]
A binder ("Taxerum M160L" manufactured by Taki Chemical Co., Ltd., solid content concentration 21% by mass) is weighed in a container, and the raw material Al 2 O 3 powder ("Sumicolund AA03" manufactured by Sumitomo Chemical Co., Ltd.) and raw materials are placed therein. The h-BN powder (oxygen concentration 7.5% by mass, primary particle diameter 0.05 μm) was weighed. The amount of the binder was 1.15 times the total amount of the raw material Al 2 O 3 powder and the raw material h-BN powder. The blending amount of each substance is shown in Table 3. This was stirred with a hand mixer until uniform.

[造粒粒子の作製]
スラリーからの造粒は、藤崎電機株式会社製マイクロミストスプレードライヤ(MDL−050M)Laboを用いて実施し、球状の造粒粒子を得た。造粒粒子のD50は表3に示す。
[Preparation of granulated particles]
Granulation from the slurry was carried out using a micro mist spray dryer (MDL-050M) Labo manufactured by Fujisaki Electric Co., Ltd. to obtain spherical granulated particles. D of the granulated particles 50 are shown in Table 3.

[仮熱処理粒子の作製]
上記造粒粒子を、大気下で700℃まで700℃/時で昇温し、700℃到達後そのまま2時間保持し、その後室温まで冷却することで、仮熱処理粒子を得た。
[Preparation of temporary heat-treated particles]
The granulated particles were heated to 700 ° C. at 700 ° C./hour in the atmosphere, held as they were for 2 hours after reaching 700 ° C., and then cooled to room temperature to obtain temporary heat-treated particles.

[熱処理粒子の作製]
上記仮熱処理粒子を、室温で真空引きをした後、窒素ガスを導入して復圧し、そのまま窒素ガスを0.5L/minで導入しながら1600℃まで230℃/時で昇温し、1600℃到達後、そのまま窒素ガスを導入しながら24時間保持した。その後、室温まで冷却し、カードハウス構造を有する球状の熱処理粒子を得た。
[Preparation of heat-treated particles]
After vacuuming the tentative heat-treated particles at room temperature, nitrogen gas is introduced to repressurize the particles, and the temperature is raised to 1600 ° C. at 230 ° C./hour while introducing nitrogen gas at 0.5 L / min as it is, and the temperature is raised to 1600 ° C. After reaching, it was held for 24 hours while introducing nitrogen gas as it was. Then, it cooled to room temperature, and spherical heat-treated particles having a card house structure were obtained.

[還元窒化粒子の作製]
上記熱処理粒子およびカーボンブラックを容器に所定量計量し、蓋をした。各物質の配合量は表3に示す。これを手で5分間振って混合し、カーボンブラック混合物を得た。カーボンブラック混合物を、室温で真空引きをした後、窒素ガスを導入して復圧し、そのまま窒素ガスを0.5L/minで導入しながら1600℃まで230℃/時で昇温し、1600℃到達後、そのまま窒素ガスを導入しながら24時間保持した。その後、室温まで冷却した。この粒子を、大気下で700℃まで700℃/時で昇温し、700℃到達後、そのまま5時間保持した。その後、室温まで冷却し、球状の還元窒化粒子を得た。
[Preparation of reduced nitrided particles]
The heat-treated particles and carbon black were weighed in a predetermined amount in a container and covered. The blending amount of each substance is shown in Table 3. This was shaken by hand for 5 minutes to mix to give a carbon black mixture. After vacuuming the carbon black mixture at room temperature, nitrogen gas is introduced to repressurize, and the temperature is raised to 1600 ° C. at 230 ° C./hour while introducing nitrogen gas at 0.5 L / min as it is, reaching 1600 ° C. After that, it was held for 24 hours while introducing nitrogen gas as it was. Then, it cooled to room temperature. The particles were heated to 700 ° C. at 700 ° C./hour in the atmosphere, and after reaching 700 ° C., they were kept as they were for 5 hours. Then, it cooled to room temperature, and spherical reduced nitriding particles were obtained.

[高純度還元窒化粒子の作製]
上記還元窒化粒子を、大気下で700℃まで700℃/時で昇温し、700℃到達後そのまま5時間保持し、その後室温まで冷却することで、高純度還元窒化粒子を得た。
[Preparation of high-purity reduced nitrided particles]
High-purity reduced nitriding particles were obtained by raising the temperature of the reduced nitriding particles to 700 ° C. at 700 ° C./hour in the atmosphere, holding the reduced nitriding particles as they were for 5 hours after reaching 700 ° C., and then cooling to room temperature.

<凝集粒子の評価>
[熱処理粒子の組成]
熱処理粒子のXRDパターンは図4の様になった。ピークはAl(三角印)、h−BN(丸印)、そしてAlBO(無印)に帰属された。AlBOのピーク強度は弱いため、AlBO含有率は小さいと考えられる。また、このAlBOは、バインダー由来のアルミ酸化物とh−BN中のホウ素酸化物の反応によって形成されたと考えられる。
(原料Al粉末量)×100/(原料Al粉末量+原料BN粉末量)で定義した熱処理粒子中のAl量、(原料BN粉末量)×100/(原料Al粉末量+原料BN粉末量)で定義した熱処理粒子中のBN量は、表3の様になった。
<Evaluation of aggregated particles>
[Composition of heat-treated particles]
The XRD pattern of the heat-treated particles is as shown in FIG. Peaks were assigned to Al 2 O 3 (triangular), h-BN (circle), and Al 5 BO 9 (unmarked). Since the peak intensity of Al 5 BO 9 is weak, it is considered that the Al 5 BO 9 content is small. Further, it is considered that this Al 5 BO 9 was formed by the reaction of the binder-derived aluminum oxide and the boron oxide in h-BN.
(Raw material Al 2 O 3 powder amount) x 100 / (Raw material Al 2 O 3 powder amount + Raw material BN powder amount) Al 2 O 3 amount in the heat-treated particles, (Raw material BN powder amount) x 100 / (Raw material) The amount of BN in the heat-treated particles defined by (Al 2 O 3 powder amount + raw material BN powder amount) is as shown in Table 3.

[熱処理粒子の構造]
熱処理粒子のSEM像は図5の様になった。粒状のAl一次粒子および、板状のh−BN一次粒子によるカードハウス構造が確認された。なお、図5から、h−BN一次粒子の長軸の長さは、実施例1が1.29μm程度、実施例2が0.72μm程度、実施例3が0.65μ程度であった。
[Structure of heat-treated particles]
The SEM image of the heat-treated particles is as shown in FIG. A cardhouse structure consisting of granular Al 2 O 3 primary particles and plate-shaped h-BN primary particles was confirmed. From FIG. 5, the length of the major axis of the h-BN primary particles was about 1.29 μm in Example 1, about 0.72 μm in Example 2, and about 0.65 μm in Example 3.

[高純度還元窒化粒子の組成]
高純度還元窒化粒子のXRDパターンは図6の様になった。ピークはAlN(星印)およびh−BN(丸印)に帰属された。また、熱処理粒子と高純度還元窒化粒子のXRDパターンを重ねてプロットすると、図7の様になった(前者:細線、後者:太線)。h−BNピーク形状は両者で全く同じであった。従って、熱処理粒子に見られたものと全く同じ板状および結晶性を持ったh−BN一次粒子が、還元窒化粒子に於いても存在すると考えられる。原料Al粉末全量の窒化によって得られるAlNの重量をαとすると、α×100/(α+原料BN粉末量)で定義した還元窒化粒子中のAlN量、そして、原料BN粉末量×100/(α+原料BN粉末量)で定義した還元窒化粒子中のBN量は表3の様になった。
[Composition of high-purity reduced nitrided particles]
The XRD pattern of the high-purity reduced nitride particles is as shown in FIG. Peaks were assigned to AlN (stars) and h-BN (circles). Further, when the XRD patterns of the heat-treated particles and the high-purity reduced nitride particles were superimposed and plotted, the results were as shown in FIG. 7 (former: thin line, latter: thick line). The h-BN peak shape was exactly the same in both cases. Therefore, it is considered that h-BN primary particles having exactly the same plate shape and crystallinity as those found in the heat-treated particles are also present in the reduced nitride particles. Assuming that the weight of AlN obtained by nitriding the entire amount of the raw material Al 2 O 3 powder is α, the amount of AlN in the reduced nitride particles defined by α × 100 / (α + the amount of the raw material BN powder) and the amount of the raw material BN powder × 100. The amount of BN in the reduced nitride particles defined by / (α + amount of raw material BN powder) is as shown in Table 3.

[高純度還元窒化粒子の構造]
高純度還元窒化粒子のSEM像及は図8の様になった。粒子表面がアモルファス質に覆われている事が判った。また、原料Al粉末を大明化学工業(株)製TM−DAに変えた以外は、実施例2と全く同様に作製した高純度還元窒化粒子のSEM−EDX分析結果は図9の様になった。また、SEM像中の矢印部分に於いて、EDX点分析を行った。このアモルファス質はホウ素、炭素、窒素、そして酸素からなることが判った。
[Structure of high-purity reduced nitrided particles]
The SEM image of the high-purity reduced nitride particles is as shown in FIG. It was found that the particle surface was covered with amorphous material. The SEM-EDX analysis results of the high-purity reduced nitride particles produced in exactly the same manner as in Example 2 except that the raw material Al 2 O 3 powder was changed to TM-DA manufactured by Taimei Chemicals Co., Ltd. are as shown in FIG. Became. In addition, EDX point analysis was performed at the arrow portion in the SEM image. This amorphous material was found to consist of boron, carbon, nitrogen, and oxygen.

<複合材組成物の作製>
[複合材組成物の作製]
(原料)
得られた高純度還元窒化粒子、ダイソー社製エポキシ樹脂「LX−01」、BYK社製分散剤「BYK−2155」、そして、四国化成社製硬化剤「C11Z−CN」を用いた。
(複合材組成物の調製)
得られた高純度還元窒化粒子、エポキシ樹脂、分散剤を蓋付容器に秤取り、自公転攪拌機(シンキー社製、ARV−310))を用いて混合した。次いで、そこに硬化剤を秤取り、自公転攪拌機を用いて混合した。分散材量は高純度還元窒化粒子量の0.02倍とし
、硬化剤量はエポキシ樹脂量の0.06倍とした。各物質の配合量は表4に示す。得られた混合物を、離形処理を施したガラス板に、シリコーンゴム製の300μmギャップと共に挟み込み、160℃で4時間加熱硬化させて熱伝導率評価用の複合材組成物を得た。
<Preparation of composite composition>
[Preparation of composite composition]
(material)
The obtained high-purity reduced nitride particles, an epoxy resin "LX-01" manufactured by Daiso, a dispersant "BYK-2155" manufactured by BYK, and a curing agent "C11Z-CN" manufactured by Shikoku Kasei Co., Ltd. were used.
(Preparation of composite composition)
The obtained high-purity reduced nitride particles, epoxy resin, and dispersant were weighed in a container with a lid and mixed using a self-revolving stirrer (manufactured by Shinky Co., Ltd., ARV-310). Then, the curing agent was weighed there and mixed using a self-revolving stirrer. The amount of the dispersant was 0.02 times the amount of high-purity reduced nitrided particles, and the amount of the curing agent was 0.06 times the amount of the epoxy resin. The blending amount of each substance is shown in Table 4. The obtained mixture was sandwiched between a glass plate subjected to a shape-removing treatment together with a 300 μm gap made of silicone rubber, and heat-cured at 160 ° C. for 4 hours to obtain a composite material composition for evaluation of thermal conductivity.

<複合材組成物の評価>
上記複合材組成物について、厚み方向の熱伝導率を測定した。測定結果は表4の様になった。また、凝集粒子の含有率に対して熱伝導率をプロットすると図3の様になった。図3を見ると、実施例1、2、そして、3の熱伝導率は、比較例1または2の熱伝導率よりも高いことが判る。即ち、AlN一次粒子とh−BN一次粒子を複合化し、AlN−BN複合凝集粒子とする事は、凝集粒子が複合材組成物に与える熱伝導率を大きく増大させることが示された。
<Evaluation of composite composition>
The thermal conductivity in the thickness direction of the composite composition was measured. The measurement results are shown in Table 4. Moreover, when the thermal conductivity was plotted with respect to the content rate of agglomerated particles, it was as shown in FIG. Looking at FIG. 3, it can be seen that the thermal conductivity of Examples 1, 2 and 3 is higher than that of Comparative Example 1 or 2. That is, it was shown that the composite of the AlN primary particles and the h-BN primary particles to form the AlN-BN composite agglomerated particles greatly increases the thermal conductivity given to the composite material composition by the agglomerated particles.

Figure 0006950148
Figure 0006950148

Figure 0006950148
Figure 0006950148

(比較例3)
原料Al粉末の代わりに原料AlN粉末を用いてAlN−BN複合凝集粒子を作製し、それを用いた複合材組成物の熱伝導率を評価し、原料Al粉末を用いた場合との比較対象とした。
(Comparative Example 3)
AlN-BN composite agglomerated particles were prepared using the raw material AlN powder instead of the raw material Al 2 O 3 powder, the thermal conductivity of the composite material composition using the particles was evaluated, and the raw material Al 2 O 3 powder was used. It was used as a comparison target with the case.

<凝集粒子の作製>
[スラリーの調製]
バインダー(多木化学(株)製「タキセラムM160L」、固形分濃度21質量%)を容器に秤取り、そこへ原料h−BN粉末(酸素濃度7.5質量%)および原料AlN粉末(東洋アルミニウム(株)製「トーヤルナイトJC」)を秤取った。バインダー量は、原料h−BN粉末および原料AlN粉末の合計量の1.15倍とした。各物質の配合量は表5
に示す。これをハンドミキサーで均一になるまで撹拌した。
<Preparation of aggregated particles>
[Preparation of slurry]
A binder (“Taxerum M160L” manufactured by Taki Chemical Co., Ltd., solid content concentration 21% by mass) is weighed in a container, and the raw material h-BN powder (oxygen concentration 7.5% by mass) and the raw material AlN powder (Toyo Aluminum) are placed therein. "Toyal Night JC" manufactured by Co., Ltd.) was weighed. The amount of the binder was 1.15 times the total amount of the raw material h-BN powder and the raw material AlN powder. Table 5 shows the blending amount of each substance.
Shown in. This was stirred with a hand mixer until uniform.

[造粒粒子の作製]
スラリーからの造粒は、藤崎電機株式会社製マイクロミストスプレードライヤ(MDL−050M)Laboを用いて実施し、球状の造粒粒子を得た。
[Preparation of granulated particles]
Granulation from the slurry was carried out using a micro mist spray dryer (MDL-050M) Labo manufactured by Fujisaki Electric Co., Ltd. to obtain spherical granulated particles.

[仮熱処理粒子の作製]
上記造粒粒子を、大気下で700℃まで700℃/時で昇温し、700℃到達後そのまま2時間保持し、その後室温まで冷却することで、仮熱処理粒子を得た。
[Preparation of temporary heat-treated particles]
The granulated particles were heated to 700 ° C. at 700 ° C./hour in the atmosphere, held as they were for 2 hours after reaching 700 ° C., and then cooled to room temperature to obtain temporary heat-treated particles.

[熱処理粒子の作製]
上記仮熱処理粒子を、室温で真空引きをした後、窒素ガスを導入して復圧し、そのまま窒素ガスを0.5L/minで導入しながら1600℃まで230℃/時で昇温し、1600℃到達後、そのまま窒素ガスを導入しながら24時間保持した。その後、室温まで冷却し、粒状構造を有する球状の熱処理粒子を得た。
[Preparation of heat-treated particles]
After vacuuming the tentative heat-treated particles at room temperature, nitrogen gas is introduced to repressurize the particles, and the temperature is raised to 1600 ° C. at 230 ° C./hour while introducing nitrogen gas at 0.5 L / min as it is, and the temperature is raised to 1600 ° C. After reaching, it was held for 24 hours while introducing nitrogen gas as it was. Then, it cooled to room temperature, and spherical heat-treated particles having a granular structure were obtained.

<凝集粒子の評価>
[熱処理粒子の組成]
熱処理粒子のXRDパターンは図10の様になった。ピークはh−BN(丸印)、AlN(星印)、そしてCaAl1219(無印)に帰属された。CaAl1219のピーク強度は弱いため、その含有率は極小さいと考えられる。また、このCaAl1219は、バインダー中に微量不純物として含まれるカルシウム化合物とAlNの反応によって形成されたと考えられる。h−BNピークの半値幅は実施例1、2、そして3の場合よりも大きく、板状のh−BN一次粒子が十分に成長しなかったことが示唆される。
<Evaluation of aggregated particles>
[Composition of heat-treated particles]
The XRD pattern of the heat-treated particles is as shown in FIG. Peaks were assigned to h-BN (circles), AlN (stars), and CaAl 12 O 19 (unmarked). Since the peak intensity of CaAl 12 O 19 is weak, its content is considered to be extremely small. Further, it is considered that this CaAl 12 O 19 was formed by the reaction of AlN with the calcium compound contained as a trace impurity in the binder. The half width of the h-BN peak was larger than that of Examples 1, 2, and 3, suggesting that the plate-shaped h-BN primary particles did not grow sufficiently.

[熱処理粒子の構造]
熱処理粒子のSEM像は図11の様になった。h−BN一次粒子の長軸は50nm程度であり、板状のh−BN一次粒子が十分に成長しなかった(0.1μm未満である)ことが判る。
[Structure of heat-treated particles]
The SEM image of the heat-treated particles is as shown in FIG. The major axis of the h-BN primary particles is about 50 nm, and it can be seen that the plate-shaped h-BN primary particles did not grow sufficiently (less than 0.1 μm).

<複合材組成物の作製>
[複合材組成物の作製]
(原料)
得られた熱処理粒子、ダイソー社製エポキシ樹脂「LX−01」、BYK社製分散剤「BYK−2155」、そして、四国化成社製硬化剤「C11Z−CN」を用いた。
(複合材組成物の調製)
得られた熱処理粒子、エポキシ樹脂、分散剤を蓋付容器に秤取り、自公転攪拌機(シンキー社製、ARV−310))を用いて混合した。次いで、そこに硬化剤を秤取り、自公転攪拌機を用いて混合した。分散材量は還元窒化粒子量の0.02倍とし、硬化剤量はエポキシ樹脂量の0.06倍とした。各物質の配合量は表6に示す。得られた混合物を、離形処理を施したガラス板に、シリコーンゴム製の500μmギャップと共に挟み込み、160℃で4時間加熱硬化させて熱伝導率評価用の複合材組成物を得た。
<Preparation of composite composition>
[Preparation of composite composition]
(material)
The obtained heat-treated particles, an epoxy resin "LX-01" manufactured by Daiso, a dispersant "BYK-2155" manufactured by BYK, and a curing agent "C11Z-CN" manufactured by Shikoku Kasei Co., Ltd. were used.
(Preparation of composite composition)
The obtained heat-treated particles, epoxy resin, and dispersant were weighed in a container with a lid and mixed using a self-revolving stirrer (Sinky, ARV-310). Then, the curing agent was weighed there and mixed using a self-revolving stirrer. The amount of the dispersant was 0.02 times the amount of the reduced nitride particles, and the amount of the curing agent was 0.06 times the amount of the epoxy resin. The blending amount of each substance is shown in Table 6. The obtained mixture was sandwiched between a glass plate subjected to a shape-removing treatment together with a 500 μm gap made of silicone rubber, and heat-cured at 160 ° C. for 4 hours to obtain a composite material composition for evaluation of thermal conductivity.

<複合材組成物の評価>
上記複合材組成物について、厚み方向の熱伝導率を測定した。測定結果は表6の様になった。また、凝集粒子の含有率に対して熱伝導率をプロットすると図12の様になった。比較のために、比較例1および2の結果も併せてプロットする。すると、比較例3の凝集粒子が複合体組成物に与える熱伝導率は、比較例1および2の場合と同程度もしくはそれ以下であることが判る。以上の様に、熱処理段階でAlNが存在すると、h−BN一次粒子の板状成長が阻害されることが判った。また、この様な凝集粒子が複合材組成物に与え
る熱伝導率は低いことが示された。
<Evaluation of composite composition>
The thermal conductivity in the thickness direction of the composite composition was measured. The measurement results are shown in Table 6. Moreover, when the thermal conductivity was plotted with respect to the content rate of agglomerated particles, it was as shown in FIG. For comparison, the results of Comparative Examples 1 and 2 are also plotted. Then, it can be seen that the thermal conductivity given to the complex composition by the agglomerated particles of Comparative Example 3 is about the same as or less than that of Comparative Examples 1 and 2. As described above, it was found that the presence of AlN in the heat treatment stage inhibits the plate-like growth of the h-BN primary particles. Moreover, it was shown that the thermal conductivity given to the composite composition by such agglomerated particles is low.

(比較例4)
Alの熱伝導はAlNと同じく等方的であるが、その大きさはAlNよりもはるかに小さい(通常、熱伝導率として40W/mK程度。)。Al−BN複合凝集粒子を用いた複合材組成物の熱伝導率を評価しAlN−BN複合凝集粒子との比較対象とした。
<凝集粒子の作製>
凝集粒子として、実施例2に於いて得た熱処理粒子を用いた。
<凝集粒子の評価>
実施例2の熱処理粒子と同様である。
(Comparative Example 4)
The heat conduction of Al 2 O 3 is isotropic like Al N, but its size is much smaller than that of Al N (usually, the thermal conductivity is about 40 W / mK). The thermal conductivity of the composite composition using the Al 2 O 3- BN composite agglomerated particles was evaluated and used as a comparison target with the AlN-BN composite agglomerated particles.
<Preparation of aggregated particles>
As the agglomerated particles, the heat-treated particles obtained in Example 2 were used.
<Evaluation of aggregated particles>
It is the same as the heat-treated particles of Example 2.

<複合材組成物の作製>
比較例3と同様に行った。
<Preparation of composite composition>
This was done in the same manner as in Comparative Example 3.

<複合材組成物の評価>
比較例3と同様に行った。測定結果は表6の様になった。また、凝集粒子の含有率に対して熱伝導率をプロットすると図12の様になった。比較のために、比較例1および2の結果も併せてプロットする。すると、比較例4の凝集粒子が複合体組成物に与える熱伝導率は、比較例1および2の場合と同程度もしくはそれ以下であることが判る。即ち、熱伝導異方性の無い物質であっても、その熱伝導率が小さければ、h−BN一次粒子と複合化してBN複合凝集粒子としても、凝集粒子が複合材組成物に与える熱伝導率は低いことが示された。
<Evaluation of composite composition>
This was done in the same manner as in Comparative Example 3. The measurement results are shown in Table 6. Moreover, when the thermal conductivity was plotted with respect to the content rate of agglomerated particles, it was as shown in FIG. For comparison, the results of Comparative Examples 1 and 2 are also plotted. Then, it can be seen that the thermal conductivity given to the complex composition by the agglomerated particles of Comparative Example 4 is about the same as or less than that of Comparative Examples 1 and 2. That is, even if the substance does not have thermal conductivity anisotropy, if its thermal conductivity is small, even if it is composited with h-BN primary particles to form BN composite aggregated particles, the thermal conductivity given to the composite material composition by the aggregated particles. The rate was shown to be low.

Figure 0006950148
Figure 0006950148

Figure 0006950148
Figure 0006950148

Claims (5)

窒化アルミニウム一次粒子及び窒化ホウ素一次粒子が凝集してなる窒化アルミニウム−窒化ホウ素複合凝集粒子の製造法であって
化アルミニウム−窒化ホウ素複合造粒粒子を得るステップ、該酸化アルミニウム−窒化ホウ素複合造粒粒子を加熱処理した後に冷却するステップ、及び前記加熱した後に冷却するステップで得られた熱処理粒子を還元窒化処理する酸化アルミニウムの還元窒化ステップ、を含み、かつ
記窒化アルミニウム−窒化ホウ素複合凝集粒子が
窒化アルミニウム一次粒子及び粒子の長軸が0.1μm以上5μm以下の窒化ホウ素一次粒子が凝集してなり、
窒化ホウ素一次粒子の原料窒化ホウ素粉末中の全酸素濃度が、3質量%以上10質量%以下であり、
窒化アルミニウム−窒化ホウ素複合凝集粒子中の窒化アルミニウムと窒化ホウ素の質量比が3:97〜85:15である、複合凝集粒子である、製造法。
A method for producing aluminum nitride-boron nitride composite agglomerated particles, which is formed by aggregating aluminum nitride primary particles and boron nitride primary particles .
Acid aluminum - obtaining a boron nitride composite granulated particles, the aluminum oxide - reduction step of cooling the boron nitride composite granulated particles after heat treatment, and heat treatment particles obtained in the step of cooling after the heating nitriding reduction nitriding step in the process is aluminum oxide, include, and,
Before SL aluminum nitride - boron nitride composite agglomerated particles,
Aluminum nitride primary particles and boron nitride primary particles having a major axis of 0.1 μm or more and 5 μm or less are aggregated.
The total oxygen concentration in the raw material boron nitride powder of the boron nitride primary particles is 3% by mass or more and 10% by mass or less.
A method for producing composite agglomerated particles, wherein the mass ratio of aluminum nitride to boron nitride in the aluminum nitride-boron nitride composite agglomerated particles is 3: 97 to 85:15.
前記還元窒化ステップは、カーボンブラック存在下、非酸化性ガス又は還元性ガス雰囲気下にて行われる、請求項に記載の製造法。 The production method according to claim 1 , wherein the reduction nitriding step is performed in the presence of carbon black and in a non-oxidizing gas or a reducing gas atmosphere. 前記加熱処理における加熱処理温度が、1500℃以上、2000℃以下である、請求項又はに記載の製造法。 The production method according to claim 1 or 2 , wherein the heat treatment temperature in the heat treatment is 1500 ° C. or higher and 2000 ° C. or lower. 前記窒化ホウ素一次粒子がカードハウス構造を形成している請求項1〜3のいずれか1項に記載の製造法。 The production method according to any one of claims 1 to 3, wherein the boron nitride primary particles form a card house structure. 窒化アルミニウム−窒化ホウ素複合凝集粒子が、少なくともホウ素、炭素、窒素、及び酸素からなる成分を含有する請求項1〜4のいずれか1項に記載の製造法。 The production method according to any one of claims 1 to 4, wherein the aluminum nitride-boron nitride composite aggregate particles contain at least a component consisting of boron, carbon, nitrogen, and oxygen.
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