JP6953259B2 - Imprint device, imprint method, and article manufacturing method - Google Patents

Description

The present invention relates to an imprinting apparatus, an imprinting method, and an article manufacturing method.

There is an imprint device as one of the lithography devices for manufacturing articles such as semiconductor devices and liquid crystal displays. The imprinting apparatus cures the uncured imprint material on the substrate in contact with the mold, and separates the mold from the cured imprint material to form a fine pattern on the substrate.

The contact of the mold with the imprint material is performed by facing the pattern forming surface of the substrate on which the pattern of the imprint material is formed and the pattern surface provided with the pattern portion in contact with the imprint material on the substrate. .. The mold and substrate can be replaced with molds and substrates prepared outside the device, respectively. At this time, the pattern forming surface of the substrate and the pattern surface of the mold must be exchanged so as to face each other.

In the method of loading and unloading a template by the imprinting apparatus of Patent Document 1, the template is taken out from a cassette housed so that the front surface on which the transfer pattern is formed faces upward, and the front and back surfaces are inverted by an inversion unit to lower the transfer pattern. Towards.

Japanese Patent No. 5443070

However, the imprinting apparatus of Patent Document 1 only performs inversion with a specific surface facing upward facing downward, and cannot cope with a case where a specific surface facing downward should be inverted facing upward.

An object of the present invention is, for example, to provide an imprinting apparatus which is advantageous in terms of mold and substrate exchange efficiency.

In order to solve the above problems, the present invention is an imprinting apparatus for forming a pattern of an imprint material on a substrate using a mold, and a mold holding portion for holding the mold and a substrate holding for holding the substrate. From the unit, the mold transfer path from the first opening for loading and unloading the mold to the device to the mold holding portion, and from the second opening for loading and unloading the substrate to the device to the substrate holding portion. The reversing part that reverses the orientation of the mold surface or the orientation of the substrate surface in the substrate transport path, and whether or not to invert the orientation of the mold surface based on the orientation of the mold surface are determined, and the orientation of the substrate surface is determined. It is characterized in that it includes a control unit that determines whether or not to invert the orientation of the surface of the substrate based on the above and controls the inversion unit based on the determination result.

According to the present invention, for example, it is possible to provide an imprinting apparatus which is advantageous in terms of mold and substrate exchange efficiency.

It is the schematic which shows the structure of the imprint apparatus which concerns on 1st Embodiment. It is a flowchart explaining the imprint method (mold making method) using the imprint apparatus which concerns on 1st Embodiment. It is a schematic diagram for demonstrating the transfer method of the master mold and the replica mold which concerns on 1st Embodiment. It is sectional drawing of the master mold and the replica mold in the state stored in the cassette which concerns on 1st Embodiment. It is a flowchart explaining the transfer method of the replica mold which concerns on 1st Embodiment. It is a figure which shows the list of the transport path of the replica mold which concerns on 1st Embodiment. It is a schematic diagram which shows the transport path of the replica mold which concerns on 1st Embodiment. It is a schematic diagram for demonstrating the transfer method of the master mold which concerns on 2nd Embodiment. It is sectional drawing of the master mold and the replica mold in the state stored in the cassette which concerns on 2nd Embodiment. It is a schematic diagram for demonstrating the transfer method of the master mold and the replica mold which concerns on 3rd Embodiment. It is a schematic diagram for demonstrating the transfer method of the replica mold which concerns on 4th Embodiment. It is a figure which shows an example of a replica mold. It is a figure explaining an example of the instruction method which concerns on 4th Embodiment. It is a figure for demonstrating the manufacturing method of an article.

Hereinafter, embodiments for carrying out the present invention will be described with reference to drawings and the like. In each drawing, the same members or elements are given the same reference numbers, and duplicate description will be omitted.
(First Embodiment)

FIG. 1 is a schematic view showing the configuration of the imprinting apparatus 100 according to the first embodiment. The imprinting apparatus 100 performs an imprinting process of forming a pattern of an imprinting material on a substrate using a mold. The imprint process is to bring the imprint material supplied on the substrate into contact with the mold (seal), cure the imprint material in the contacted state, and peel (release) the mold from the cured imprint material. This is a process of transferring the pattern formed in the mold on the substrate. As a method of curing the imprint material, there are a method of irradiating light and a method of using other energy (for example, heat).

The imprinting apparatus 100 in this embodiment can be used in the replica mold manufacturing process. In the replica mold manufacturing process, a replica mold (blank mold) in which a pattern is not formed is used as the substrate to be processed. In the replica mold manufacturing step, the imprinting apparatus 100 transfers the uneven pattern of the master mold, which is a mold, onto the blank mold.

In this embodiment, a photocuring method using a photocurable resin that is cured by ultraviolet rays as an imprint material is adopted. Further, the replica mold is duplicated with the mold as the master mold MM and the substrate as the replica mold RM. In FIG. 1, the Z-axis is taken parallel to the optical axis of the ultraviolet light emitted to the imprint material on the replica mold, and the X-axis and the Y-axis are orthogonal to each other in a plane perpendicular to the Z-axis. taking it.

The master mold MM as a mold has a pattern portion P having a rectangular outer peripheral portion and a predetermined uneven pattern formed in a three-dimensional shape on a surface facing the replica mold RM. The pattern portion P of the master mold MM is transferred to the imprint material R coated on the replica mold RM. As the material of the master mold MM, for example, a material that transmits ultraviolet rays such as quartz is used. The master mold MM may have a mold-side recess 101 on the light incident surface side.

As the replica mold RM as a substrate, a material that transmits ultraviolet rays, such as quartz, is used. The replica mold RM has a substrate-side convex portion 102, which is a region to which the pattern of the master mold MM is transferred, in the central portion of the surface on the master mold MM side. The convex portion 102 forms, for example, a convex shape 30 μm higher than the base 103 of the replica mold RM. The convex portion 102 is necessary, for example, in the semiconductor manufacturing process to prevent the replica mold RM and the wafer from being in close contact with each other and being unable to be peeled off when imprinting the replica mold RM as a mold on a wafer as a substrate. be. The imprint material R can be applied to the convex portion 102 of the replica mold RM. Further, the replica mold RM may have a substrate-side concave portion 104 on a surface opposite to the convex portion 102.

In the present embodiment, the case of duplicating the replica mold will be described as an example, but a single crystal silicon wafer, an SOI (Silicon on insulator) wafer, or the like may be used as the substrate in performing the normal imprint processing. ..

(Imprint device)
The imprint device 100 may include an illumination unit 110, a mold holding unit 120, a substrate holding unit 130, a supply unit 140, a mold transport unit 160, a substrate transport unit 170, and a control unit 180.

The illumination unit 110 is an illumination means that irradiates the master mold MM with ultraviolet rays UV that cure the imprint material R during the imprint process. The illumination unit 110 includes a light source 111, an optical element 112 for adjusting the ultraviolet UV emitted from the light source 111 to appropriate light for irradiating the imprint material, and a half mirror HM for guiding the light onto the substrate. including. Further, when it is necessary to scan the light on the surface of the substrate, a scanning means HM for scanning the light may be included.

The mold holding portion 120 is a holding mechanism for holding and fixing the master mold MM. The mold holding unit 120 may include a Z drive mechanism (not shown) for pressing the master mold MM against the replica mold RM while holding the master mold MM. At this time, a correction drive mechanism (not shown) that corrects the height and inclination of the master mold MM according to the height and inclination of the master mold MM and the replica mold RM may also be included.

A TTM (Through The Mask) scope 121 is provided on the upper part of the master mold MM in the mold holding portion 120. The TTM scope 121 is an alignment scope having an alignment mark (not shown) provided on the master mold MM and an optical system and an imaging system for detecting the alignment mark (not shown) provided on the replica mold RM. From the detection result of the alignment mark by the TTM scope 121, the shift deviation and the rotation deviation in the X direction and the Y direction of the master mold MM and the replica mold RM can be measured. The mold and the substrate are aligned using this measurement result.

Further, the mold holding portion 120 may include a pressure adjusting mechanism 122 for adjusting the pressure of the mold side recess 101. When the master mold MM is brought into contact with the imprint material R on the replica mold RM, the pressure in the mold side recess 101 is made higher than the pressure in the external space by the pressure adjusting mechanism 122. Then, the pattern portion P and the peripheral portion 105 can be controlled so as to have a convex shape toward the replica mold RM. As a result, the central portion of the pattern portion P may first contact the imprint material R on the replica mold RM, then the contact portion gradually expands, and finally the entire pattern portion P may come into contact with the imprint material R. .. As a result, it is possible to prevent gas from being trapped between the pattern portion P and the imprint material R.

The substrate holding portion 130 is a holding means that holds the replica mold RM by vacuum suction or electrostatic suction and can move in the XY plane. It is desirable that the substrate holding portion 130 includes a driving mechanism for rotationally driving the replica mold RM around the Z axis.

The substrate holding portion 130 is driven along the stage platen 106 of the imprinting apparatus 100. In this case, the reference for the Z direction and inclination when the substrate holding portion 130 is driven in the XY plane is the stage surface plate 106. The stage surface plate 106 is configured on the mount 107, and the imprint device 100 has a structure that is not easily affected by vibration from the floor. Further, the substrate holding portion 130 may have a drive mechanism for moving the replica mold RM in the Z direction and a rotation mechanism for rotating the replica mold RM around the XY axes. Further, the substrate holding portion 130 may include a pressure adjusting mechanism 131 for adjusting the pressure of the substrate side recess 104, similarly to the mold holding portion.

The substrate holding portion 130 may be provided with a mold measuring sensor 132 (mold detecting means) capable of measuring the surface of the master mold MM. The mold measuring sensor 132 is a distance measuring instrument capable of measuring the distance (shape) in the Z-axis direction to the surface of the master mold MM. The height of the surface of the master mold MM can be obtained based on the measurement result of the mold measurement sensor 132.

By moving the substrate holding portion 130 along the XY plane, the mold measuring sensor 132 can measure each position (entire surface) of the surface of the master mold MM. The type measurement sensor 132 may be provided in a mechanism different from that of the substrate holding portion 130. Even in that case, the surface of the master mold MM can be measured by moving the mold measurement sensor 132 along the XY plane.

Further, the imprint device 100 may include a substrate measurement sensor 108 capable of measuring the surface of the replica mold RM. The substrate measurement sensor 108 is a distance measuring instrument capable of measuring the distance (shape) in the Z-axis direction to the surface of the replica mold RM. The height of the surface of the replica mold RM can be obtained based on the measurement result of the substrate measurement sensor 108. By moving the substrate holding portion 130 along the XY plane, the substrate measuring sensor 108 can measure each position (entire surface) of the surface of the replica mold RM. The surface of the replica mold RM may be measured by moving the substrate measurement sensor 108 along the XY plane.

Further, the imprint device 100 may also include an off-axis scope 109 for detecting a reference mark or an alignment mark provided on a reference plate (not shown) arranged on the substrate holding portion 130. The off-axis scope 109 can also detect the alignment mark of the replica mold RM.

The supply unit 140 is a supply means for supplying the imprint material R onto the replica mold RM. The supply unit 140 has a discharge port (not shown), and supplies the imprint material to the replica mold RM from the discharge port. The imprint material of the present embodiment uses a resin having a property of being cured by irradiating with ultraviolet rays. Further, the amount of imprint material to be supplied is determined by the control unit 180, for example, depending on the required thickness of the imprint material, the pattern density to be transferred, and the like.

The observation unit 150 includes, for example, an imaging unit such as a camera, and observes the replica mold RM. The observation unit 150 can observe the contact state between the master mold MM and the imprint material R on the replica mold RM. Further, the observation unit 150 observes, for example, the filling state of the imprint material R in the pattern portion P of the master mold MM, the mold release state of the master mold MM from the cured imprint material R on the replica mold RM, and the like. It is also possible to do. In the present embodiment, the observation unit 150 observes the light transmitted from the master mold MM and the replica mold RM through the half mirror HM. However, the arrangement of the light source unit 111 and the observation unit 150 may be opposite.

The mold transfer unit 160 is a transfer means for carrying the master mold MM into the mold holding unit 120 and carrying it out from the imprint device 100. Further, the substrate transfer unit 170 is a transfer means for carrying the replica mold RM into the substrate holding unit 130 and carrying it out from the imprint device 100.

The control unit 180 controls the operation of each component unit of the imprint device 100 and acquires various sensor values and the like. Further, the control unit 180 determines whether or not to reverse the orientation of the surface of the replica mold RM based on the orientation of the surface of the replica mold RM, and controls the inversion unit described later based on the determination result. The control unit 180 is composed of a computer, a sequencer, or the like (not shown) connected to each component unit of the imprint device 100, and may have a processing unit or a storage unit. The control unit 180 may be provided in the imprint device 100, or may be installed in a place different from the imprint device 100 and controlled remotely.

(Imprint method)
A mold manufacturing method for manufacturing a replica mold by transferring the pattern formed on the master mold MM to the replica mold RM using the imprint device 100 of FIG. 1 will be described. FIG. 2 is a flowchart illustrating an imprinting method (mold manufacturing method) using the imprinting apparatus 100 according to the first embodiment. Each flow is mainly executed by the control of each unit by the control unit 180.

First, the master mold MM is carried into the imprint device 100 by the mold transfer unit 160. Similarly, the replica mold RM is carried into the imprinting apparatus 100 by the substrate conveying unit 170 (S201). If the master mold MM has already been carried into the imprinting apparatus 100, the master mold MM is not carried in.

After that, in order to detect the state of the mold, the inclination and height of the surface of the master mold MM are measured by the mold measurement sensor 132. Similarly, in order to detect the state of the replica mold RM, the substrate measurement sensor 108 measures the inclination and height of the surface of the replica mold RM. From the measurement results of the two sensors, the mold measurement sensor 132 and the substrate measurement sensor 108, the inclination of the mold holding portion 120 is corrected so that the surfaces of the master mold MM and the replica mold RM are parallel (S202).

Next, the supply unit 140 supplies the imprint material R to the imprint region (convex portion 102) of the replica mold RM (S203). The imprint material R is supplied to the convex portion 102 while the replica mold RM is scanned driven under the supply unit 140 by the substrate holding portion 130. At this time, the control unit 180 controls the supply of the imprint material R by reading the supply information of the imprint material for which the supply amount and the supply position of the imprint material are set from a storage unit (not shown).

Next, by driving the substrate holding portion 130, the replica mold RM to which the imprint material R is supplied is arranged directly under the master mold MM. In this state, the TTM scope 121 detects the alignment marks formed on the master mold MM and the replica mold RM, and measures the misalignment. Based on the measured misalignment between the master mold MM and the replica mold RM, the substrate holding portion 130 is driven to perform alignment (S204).

Next, the pressure adjusting mechanisms 122 and 131 are controlled to make the opposite surfaces of the master mold MM and the replica mold RM convex. After that, the mold holding portion 120 is driven in the direction of the surface facing the replica mold RM, and the master mold MM and the replica mold RM are brought into contact with each other via the imprint material R (S205). The substrate holding portion 130 may be driven in the direction of the surface facing the master mold MM to be brought into contact with the master mold MM. Upon contact, the imprint material R is filled in the pattern portion P. After that, the pressure adjusting mechanisms 122 and 131 are controlled to gradually reduce the pressure to increase the contact area between the master mold MM and the replica mold RM.

Then, while observing the alignment marks of the master mold MM and the replica mold RM with the TTM scope 121, the substrate holding portion 130 is driven to perform die-by-die alignment for alignment (S206).

When the alignment is completed, ultraviolet UV is irradiated from the illumination unit 110 to cure the imprint material R on the replica mold RM (S207). Then, the pressure adjusting mechanisms 122 and 131 are controlled again to make the surfaces of the master mold MM and the replica mold RM facing each other convex, and the mold holding portion 120 is driven in the direction opposite to the surface facing the replica mold RM. do. As a result, the master mold MM is peeled (released) from the replica mold RM (S208). As a result, a pattern of the cured imprint material R is formed on the replica mold RM. It is desirable to apply an adhesion layer in advance to the surface of the replica mold RM so that the cured imprint material R remains on the replica mold RM. Finally, the replica mold RM for which the imprint processing has been completed is carried out from the imprint device 100 by the substrate transport unit 170 (S209).

(Transport method)
The method of transporting the master mold MM and the replica mold RM in the present embodiment will be described. FIG. 3 is a schematic view for explaining a method of transporting the master mold MM and the replica mold RM according to the first embodiment.

The first opening 301 (first loading / unloading section) is an opening for loading / unloading the master mold MM into / from the imprinting apparatus 100. The second opening 302 (second loading / unloading section) is an opening for loading / unloading the replica mold RM into / from the imprint device 100. Each is provided in the imprint device 100.

The master mold MM is carried in and out of the imprint device 100 from the first opening 301, and is carried in by the mold transfer unit 160 to the mold holding unit 120 via the reading unit QR, the external positioning unit PA, and the like. Similarly, it is carried out from the mold holding portion 120 to the first opening 301. The path through which the master mold MM is conveyed by the mold transfer unit 160 is defined as the mold transfer route.

The replica mold RM is carried in and out of the imprint device 100 through the second opening 302. The replica mold RM is carried into the substrate holding unit 130 by the substrate conveying unit 170 via the reading unit QR, the external positioning unit PA, etc., and is similarly carried out from the substrate holding unit 130 to the second opening 302. NS. The path through which the replica mold RM is conveyed by the substrate transfer unit 170 is defined as the substrate transfer path.

The substrate transport path is provided with a reversing portion 303 that reverses the orientation of the surface of the replica mold RM. The replica mold RM is conveyed to the reversing unit 303 according to the determination result of the control unit 180, and the orientation of the surface is reversed. The control unit 180 determines whether or not to invert based on the orientation of the surface of the replica mold RM before inversion.

The reading unit QR detects, for example, a QR code (registered trademark) or a barcode drawn on the master mold MM and the replica mold RM, and outputs the information read from the detected QR code or the barcode to the control unit 180. The external positioning unit PA positions the master mold MM and the replica mold RM in the XY directions and the rotational directions.

The reversing unit 303 reverses the orientation of the surface of the replica mold RM as needed. The reversing unit 303 is, for example, an actuator having a rotation mechanism or the like, but its configuration is diverse and the reversing method is not limited to this.

The method of carrying in the master mold MM will be described. This step describes S201 in FIG. 2 in detail. FIG. 4 is a cross-sectional view of the master mold and the replica mold stored in the cassette according to the first embodiment. In the present embodiment, as shown in FIG. 4A, it is assumed that the master mold MM is stored in the cassette 401 with the pattern portion P on the replica mold RM side (lower side).

The cassette 401 containing the master mold MM is installed in the first opening 301. After that, it is conveyed into the imprint device 100 by an operation from a console (not shown) or a remote control from the user, and the master mold MM is taken out from the cassette 401. The master mold MM is conveyed to the reading unit QR by the mold transfer unit 160, and the information is read by the reading unit QR. The information read by the reading unit QR is output to the control unit 180.

After that, the master mold MM is conveyed to the external positioning unit PA, and positioning is performed in the XY directions and the rotational directions. Then, the master mold MM is conveyed to the mold holding portion 120.

FIG. 5 is a flowchart illustrating a method of transporting the replica mold according to the first embodiment. Each flow is mainly executed by the control of each unit by the control unit 180, and the replica mold RM is conveyed by the substrate transfer unit 170. First, in S201 in FIG. 2, the replica mold RM is carried into the imprinting apparatus. The method of transporting the replica mold at that time will be described.

Returning to FIG. 5, first, the cassette in which the replica mold RM is stored is installed in the second opening 302 (S501). The replica mold RM is usually stored in a cassette before being carried into the imprinting apparatus 100. In the present embodiment, when the cassette in which the replica mold RM is stored is installed in the second opening, it is assumed that the cassette 402 is stored in the state shown in FIG. 4B, for example. That is, it is assumed that the replica mold RM is stored in the cassette 402 with the convex portion 102, which is the surface to be transferred, on the opposite side (lower side) of the master mold MM.

Returning to FIG. 5, the cassette 402 is then carried into the imprinting apparatus 100 by the substrate transport unit 170, and the replica mold RM is taken out from the cassette 402 (S502). The replica mold RM is conveyed from the cassette 402 to the reading unit QR by the substrate conveying unit 170, and information is output to the control unit 180 by the reading unit QR (S503). The transfer path from the cassette 402 to the reading unit QR is set as the path A.

After that, it is determined whether or not there is an interruption factor due to the information output in S503, an abnormality, an operation instruction, or the like (S504). If there is a factor of interruption (Yes), the replica mold RM is conveyed from the reading unit QR to the cassette 402. The replica mold RM conveyed to the cassette 402 is stored in the cassette 402 and carried out from the second opening (S512). The transfer path from the reading unit QR to the cassette 402 is defined as the path B.

When there is no interruption factor (No), the replica mold RM is conveyed from the reading unit QR to the external positioning unit PA, and positioning is performed in the XY directions and the rotational directions (S505). The transfer path from the reading unit QR to the external positioning unit PA is defined as the path C.

After that, as a result of positioning in S505, it is determined whether or not there is an interruption factor due to an abnormality or an operation instruction (S506). If there is a factor of interruption (Yes), the replica mold RM is conveyed from the external positioning unit PA to the cassette 402. The replica mold RM conveyed to the cassette 402 is stored in the cassette 402 and carried out from the second opening (S512). The transfer path from the external positioning unit PA to the cassette 402 is defined as the path D.

When there is no interruption factor (No), the replica mold RM is conveyed to the reversing unit 303, and the direction of the surface of the replica mold RM is reversed by the reversing unit 303. That is, the convex portion 102, which is the surface to be transferred, is inverted so as to be on the master mold MM side (upper side) (S507). This is because the replica mold RM is conveyed to the substrate holding portion 130 with the surface to be transferred facing the master mold MM side. The path E from the external positioning section PA to the substrate holding section 130 is defined as the path E.

After that, in the step of reversing the replica mold of S507, it is determined whether there is an interruption factor due to an abnormality or an operation instruction (S508). When there is a factor of interruption (Yes), it is determined whether or not the surface to be transferred of the replica mold RM is on the master mold side (upper side) (S509). When the surface to be transferred is on the upper side (Yes), the replica mold RM is conveyed to the reversing portion 303, and the orientation of the surface of the replica mold RM is reversed by the reversing portion 303. That is, the surface to be transferred is inverted so as to be on the opposite side (lower side) from the master mold MM (S511). This is because the surface to be transferred is stored in the cassette 402 in a downward state. After that, the replica mold RM is stored in the cassette and carried out from the second opening (S512). The transfer path from the reversing portion 303 to the cassette 402 when the transfer surface is on the upper side is defined as the path F.

When the surface to be transferred of the replica mold RM is not on the upper side (S509, No), the replica mold RM is stored in the cassette and carried out from the second opening (S512). When the transfer surface is not on the upper side (lower side), the transfer path from the reversing portion 303 to the cassette 402 is defined as the path G.

When there is no factor for interruption (S508, No), the replica mold RM is conveyed to the substrate holding portion 130 and imprint processing is performed (S510). The step S510 corresponds to the steps S202 to 208 in FIG.

Returning to FIG. 5, when the imprint process (S510) is completed, the replica mold RM is conveyed from the substrate holding portion 130 to the reversing portion 303, and the orientation of the surface of the replica mold RM is reversed by the reversing portion 303. That is, the surface to be transferred is inverted so as to be on the opposite side (lower side) from the master mold MM (S511). This is because, as shown in FIG. 4B, the surface to be transferred is stored in the cassette 402 in a downward state. Then, the replica mold RM is stored in the cassette and carried out from the second opening (S512). The transfer path from the substrate holding portion 130 to the cassette 402 is defined as the path H.

FIG. 6 is a diagram showing a list of transport routes of the replica mold RM according to the first embodiment. In the list, the above-mentioned routes A to G are shown. As described above, in the present embodiment, since it is necessary to invert the replica mold RM in the paths E, F, and H, the control unit 180 determines to invert the direction of the surface of the replica mold RM, and the inversion unit 303. To control. For example, the control unit 180 determines whether or not to reverse the orientation of the surface of the replica mold RM while transporting the replica mold RM from the transport source to the transport destination.

FIG. 7 is a schematic view showing a transport path of the replica mold RM according to the first embodiment. When there is no interruption factor due to an abnormality or an operation instruction, the replica mold RM is first conveyed from the cassette 402 installed in the second opening 302 to the reading unit QR (path A). Then, it is conveyed from the reading unit QR to the external positioning unit PA (path C). Next, it is conveyed from the external positioning unit PA to the reversing unit 303 (path E1), and the orientation of the surface is reversed. After that, it is conveyed from the reversing portion 303 to the substrate holding portion 130 (path E2), and finally from the substrate holding portion 130 to the cassette 402 installed in the second opening 302 (path H).

In the present embodiment, as an example, the replica mold RM has been described as an example in which the convex portion 102, which is the surface to be transferred, is stored in the cassette 402 in a downward state. In addition to this, for example, when the replica mold RM having a pattern formed (after imprint processing) is put into an external cleaning device or inspection device, the cassette 402 is placed with the pattern surface (transferred surface) facing upward. When it is stored in, it is not necessary to invert it in the path H. That is, the control unit 180 determines whether or not to reverse the orientation of the surface of the replica mold RM based on the carry-out destination. According to this embodiment, it is possible to deal with the above-mentioned non-steady operation, and it is possible to improve the replacement efficiency of the substrate.

In the present embodiment, the reversing section 303 different from the substrate transport section 170 is provided, but for example, the substrate transport section 170 itself may be provided with a rotation mechanism, and the substrate transport section 170 may be used as the reversing section 303.

(Second Embodiment)
FIG. 8 is a schematic view for explaining a method of transporting the master mold MM according to the second embodiment. The same configurations as those in the first embodiment are shown by the same reference numerals, and the description thereof will be omitted. In the present embodiment, the reversing portion 303 is provided in the mold transfer path.

FIG. 9 is a cross-sectional view of the master mold MM and the replica mold RM stored in the cassette according to the second embodiment. In the present embodiment, when the cassette 401 is installed in the first opening, for example, as shown in FIG. 9A, in the master mold MM, the pattern portion P is on the opposite side (upper side) of the replica mold RM. It is assumed that the cassette 401 is stored in this state. Further, as shown in FIG. 9B, it is assumed that the replica mold RM is stored in the cassette 402 in a state where the convex portion 102, which is the surface to be transferred, is on the master mold MM side (upper side).

The cassette 401 containing the master mold MM is installed in the first opening 301. Then, as in the first embodiment, the master mold MM is conveyed into the apparatus 100 and taken out from the cassette 401. The master mold MM is conveyed to the reading unit QR by the mold transfer unit 160, and the information read by the reading unit QR is output to the control unit 180.

After that, the master mold MM is conveyed to the external positioning unit PA, and positioning is performed in the XY directions and the rotational directions. Next, the master mold MM is conveyed to the reversing section 303, and the orientation of the surface is reversed by the reversing section 303, as in the replica mold RM according to the first embodiment. That is, the pattern portion P is inverted so as to be on the replica mold RM side (lower side). The inverted master mold MM is conveyed to the mold holding unit 120.

After that, imprint processing is performed. After all the imprint processing is completed, the master mold MM is conveyed from the mold holding portion 120 to the reversing portion 303, and the orientation of the surface is reversed by the reversing portion 303. That is, the pattern portion P is inverted so as to be on the opposite side (upper side) of the replica mold RM. The inverted master mold MM is stored in the cassette 401 and carried out from the first opening 301.

In the mold transfer path, the master mold MM may be returned to the first opening 301 due to an abnormality or an operation instruction. When returning from the reading unit QR or the external positioning unit PA to the first opening 301, the pattern portion P of the master mold MM is on the upper side, so that the first opening is not inverted by the reversing unit 303. Transport to 301.

When returning from the reversing portion 303 to the first opening 301, if the pattern portion P of the master mold MM is on the lower side, the master mold MM is turned upside down so that the pattern portion P is on the upper side, and then the master mold MM is on the upper side. If so, it is conveyed to the first opening 301 as it is.

In the present embodiment, since the convex portion 102, which is the surface to be transferred, faces the master mold MM side (upper side) in the state of being stored in the cassette 402, the replica mold RM is a replica mold in the substrate transport path. There is no need to invert the RM.

According to this embodiment, it is possible to deal with non-steady operations of the master mold, and it is possible to improve the mold exchange efficiency.

(Third Embodiment)
FIG. 10 is a schematic diagram for explaining a method of transporting the master mold MM and the replica mold RM according to the third embodiment. Also in this embodiment, the same configurations as those in the first embodiment are indicated by the same reference numerals, and the description thereof will be omitted. The imprinting apparatus 100 of the present embodiment is characterized in that one reversing unit 303 is installed over the mold transfer path and the substrate transfer path.

The reversing portion 303 is installed in the mold transfer path and the substrate transfer path, and reverses the orientation of the surfaces of the master mold MM and the replica mold RM. In addition, different reversing portions 303 may be provided in each of the mold transport path and the substrate transport path. According to this embodiment, it is possible to deal with non-steady operation of both the master mold MM and the replica mold RM, and it is possible to improve the mold and substrate exchange efficiency.

In the first to third embodiments, the first opening 301 and the second opening 302 have been described as different openings, but the same opening is referred to as the first opening 301 and the first opening 301. 2 The opening 302 may be used.

(Fourth Embodiment)
FIG. 11 is a schematic view for explaining a method of transporting the replica mold RM according to the fourth embodiment. Also in this embodiment, the same configurations as those in the first embodiment are indicated by the same reference numerals, and the description thereof will be omitted. The imprinting apparatus 100 of the present embodiment includes a discriminating unit 1101 that discriminates the orientation of the surface of the replica mold RM in the substrate transport path.

The replica mold RM may be stored in the cassette in a state where the convex portion 102, which is the surface to be transferred, is on the opposite side (lower side) of the master mold MM (FIG. 4 (B)). Further, there is a case where the convex portion 102 is stored in the cassette in an upward state in which the convex portion 102 is on the master mold MM side (upper side) (FIG. 9 (B)). The determination unit 1101 determines whether the transfer surface of the replica mold RM is on the master mold MM side (upper side) or on the opposite side (lower side) of the master mold MM. The discrimination unit 1101 is, for example, a height sensor such as a laser displacement meter or a spectroscopic interference meter. FIG. 12 is a diagram showing an example of the replica mold RM. The determination unit 1101 determines the orientation of the surface of the replica mold RM by, for example, measuring the presence / absence of the convex portion 102 on the substrate side and the presence / absence of the concave portion 104 on the substrate side.

The discriminating unit 1101 may be, for example, a height sensor or a contact sensor, and may discriminate the orientation of the surface of the replica mold RM by measuring the notch 1201 of the replica mold RM. Further, the discrimination unit 1101 determines the orientation of the surface of the replica mold RM by measuring and detecting, for example, an image sensor, an alignment mark (not shown), a barcode, and a QR code drawn on the replica mold RM. You may.

Further, by detecting the positional relationship between the long side and the short side of the convex portion 102 and the positions of the notch portion 1201, the alignment mark, the barcode, and the QR code in the discriminating portion, not only the orientation of the surface of the replica mold RM can be discriminated. It is also possible to detect an error in the rotational posture.

The method of transporting the replica mold RM according to the present embodiment will be described. The replica mold RM taken out from the cassette 402 is first conveyed to the discriminating unit 1101. The determination unit 1101 determines the orientation of the surface of the replica mold RM.

The control unit 180 determines whether or not to reverse the replica mold RM based on the determination result of the determination unit 1101. For example, when the determination unit 1101 determines that the surface to be transferred is on the master mold MM side (upper side), the control unit 180 determines that the inversion is not performed. When the surface to be transferred is on the opposite side (lower side) of the master mold MM, the control unit 180 determines to perform inversion, and the replica mold RM is conveyed to the inversion unit 303. The replica mold RM conveyed to the inversion unit 303 is inverted by the inversion unit 303 so that the surface to be transferred is on the master mold MM side (upper side).

After that, the replica mold RM is conveyed to the substrate holding unit 130 after passing through the reading unit QR and the external positioning unit PA, and is subjected to the impprint processing. These steps are the same as in the first embodiment.

In the present embodiment, as an example, the imprint device 100 including the discriminating unit 1101 in the substrate transport path has been described. In addition to this, it is also possible to similarly provide the discriminating unit 1101 in the mold transfer path, discriminate the orientation of the surface of the master mold MM, and determine whether or not to perform inversion based on the discriminating result. In this case, for example, the pattern portion P (mold-side convex portion) corresponds to the substrate-side convex portion 102 to be measured, and the mold-side concave portion 101 corresponds to the substrate-side concave portion 104. Further, the discrimination unit 1101 may be provided in both the substrate transfer path and the mold transfer path, or one discrimination unit 1101 may be provided across the substrate transfer path and the mold transfer path.

According to this embodiment, the master mold and the replica mold in the imprinting apparatus 100 can be easily managed.

(Fourth Embodiment)
The control unit 180 of the imprint device 100 according to the fourth embodiment is connected to an instruction unit (not shown), and the orientation of the surfaces of the master mask MM (mold) and the replica mold RM (board) at the time of carrying out by the instruction unit. Is characterized by setting. The indicator unit may include a display unit (not shown) and an input unit (not shown).

FIG. 13 is a diagram illustrating an example of the instruction method according to the fourth embodiment. The display unit displays, for example, an item for setting the orientation of the replica mold RM to be transferred at the time of loading / unloading by a method as shown in FIG. The import 1310 has, as options, a pattern to be transferred upward (Pattern Side Up) 1311 and a surface to be transferred downward (Pattern Side Down) 1312. In the pattern upward (Pattern Side Up) 1311, the convex portion 102 faces the master mold side. In the Pattern Side Down 1312, the convex portion 102 faces the opposite side of the master mold.

Further, the item for setting the direction of the surface to be transferred at the time of carrying out, the instruction at the time of carrying out (Export) 1320, has options of the surface to be transferred upward (Pattern Side Up) 1321 and the surface to be transferred downward (Pattern Side Down) 1322.

For example, as shown in the second embodiment, a case where the replica mold RM is carried in and out of the imprinting apparatus 100 with the surface to be transferred on the master mold side (upward) (FIG. 9B) will be described. In this case, the user selects, as shown in FIG. 13, 1311 and 1321 facing upward on the transfer surface for both the carry-in instruction 1310 and the carry-out instruction 1320 by the input unit.

Further, as shown in the first embodiment, a case where the replica mold RM is carried in and out of the imprinting apparatus 100 with the surface to be transferred on the opposite side (downward) to the master mold (FIG. 4B) will be described. do. In this case, the user selects 1312 and 1322 with the transfer surface downward as options for both the carry-in instruction 1310 and the carry-out instruction 1320 by the input unit.

Further, for example, when the surface to be transferred is carried in downward (FIG. 4 (B)), but the surface to be transferred is temporarily carried out in an upward state (FIG. 9 (B)), the carry-in instruction 1310 is an option. The transfer surface downward 1312 is selected, and the carry-out instruction 1320 selects the transfer surface upward 1321. Then, for example, when the surface to be transferred is carried in upward (FIG. 9 (B)), but the surface to be transferred is temporarily carried out in a downward state (FIG. 4 (B)), the carry-in instruction 1310 is an option. 1311 facing upward on the surface to be transferred is selected, and 1322 facing downward on the surface to be transferred is selected for the carry-out instruction 1320.

In this way, under the control of the control unit 180 according to the user's instruction, the operation of maintaining and carrying out the transfer surface orientation at the time of loading into the imprint device 100 and the operation of changing the transfer surface orientation and carrying out are performed. be able to. In addition, it is possible to carry out the transfer instruction of the master mold MM (mold) by the same method.
(Manufacturing method of goods)

The pattern of the cured product formed by using the imprint device is used permanently for at least a part of various articles or temporarily in manufacturing various articles. The article is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, a mold, or the like. Examples of the electric circuit element include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA. Examples of the mold include a mold for imprinting.

The cured product pattern is used as it is as a constituent member of at least a part of the above-mentioned article, or is temporarily used as an imprint material mold. The imprint material mold is removed after etching, ion implantation, or the like is performed in the substrate processing process.

Next, a specific manufacturing method of the article will be described. As shown in FIG. 14A, a substrate 1z such as a silicon wafer on which a work material 2z such as an insulator is formed on the surface is prepared, and subsequently, a substrate 1z such as a silicon wafer is introduced into the surface of the work material 2z by an inkjet method or the like. The printing material 3z is applied. Here, a state in which a plurality of droplet-shaped imprint materials 3z are applied onto the substrate is shown.

As shown in FIG. 14B, the imprint mold 4z is opposed to the imprint material 3z on the substrate with the side on which the uneven pattern is formed facing. As shown in FIG. 14 (c), the substrate 1z to which the imprint material 3z is applied is brought into contact with the mold 4z, and pressure is applied. The imprint material 3z is filled in the gap between the mold 4z and the work material 2z. In this state, when light is irradiated through the mold 4z as energy for curing, the imprint material 3z is cured.

As shown in FIG. 14D, when the mold 4z and the substrate 1z are separated from each other after the imprint material 3z is cured, a pattern of the cured product of the imprint material 3z is formed on the substrate 1z. The pattern of the cured product has a shape in which the concave portion of the mold corresponds to the convex portion of the cured product and the concave portion of the mold corresponds to the convex portion of the cured product, that is, the uneven pattern of the mold 4z is transferred to the imprint material 3z. It will be done.

As shown in FIG. 14E, when etching is performed using the cured product pattern as an etching resistant mold, the portion of the surface of the work material 2z that has no cured product or remains thin is removed, and the groove 5z is formed. Become. As shown in FIG. 14 (f), when the pattern of the cured product is removed, an article in which the groove 5z is formed on the surface of the work material 2z can be obtained. Here, the pattern of the cured product is removed, but it may not be removed even after processing, and may be used, for example, as a film for interlayer insulation contained in a semiconductor element or the like, that is, as a constituent member of an article.

(Other embodiments)
Although the embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications can be made within the scope of the gist thereof.

100 Imprint device 110 Lighting unit 120 type holding unit 130 Board holding unit 150 type transport unit 160 Board transport unit 170 Control unit 301 1st opening 302 2nd opening 303 Inverting unit MM Master mold RM Replica mold

Claims (12)

An imprinting device that forms a pattern of imprinting material on a substrate using a mold.
A mold holder that holds the mold and
A substrate holding portion that holds the substrate and
A mold transfer path from the first opening for loading and unloading the mold to the device to the mold holding portion, and from the second opening for loading and unloading the substrate to the device to the substrate holding portion. A reversing part that reverses the orientation of the surface of the mold or the orientation of the surface of the substrate in the substrate transport path of
It is determined whether or not the orientation of the surface of the mold is reversed based on the orientation of the surface of the mold, and whether or not the orientation of the surface of the substrate is reversed based on the orientation of the surface of the substrate. A control unit that controls the reversing unit based on a determination result is provided.
An imprinting device characterized by this. The control unit determines whether or not to reverse the orientation of the surface of the mold based on the destination of the mold, and determines whether or not to reverse the orientation of the surface of the substrate based on the destination of the substrate. decide,
The imprinting apparatus according to claim 1. The imprinting apparatus according to claim 1 or 2, wherein the reversing portion transports the mold or the substrate. The imprinting apparatus according to any one of claims 1 to 3, wherein one inversion unit is installed over the mold transfer path and the substrate transfer path. The imprinting apparatus according to any one of claims 1 to 3, wherein the reversing portion is installed in each of the mold transport path and the substrate transport path. The imprinting apparatus according to any one of claims 1 to 5, wherein the first opening and the second opening are provided as the same opening. A discriminator for determining the orientation of the surface of the mold and the orientation of the surface of the substrate is provided.
The control unit determines whether or not to perform the inversion based on the determination result of the determination unit.
The imprinting apparatus according to any one of claims 1 to 6, wherein the imprinting apparatus is characterized. The discriminating portion is based on the presence or absence of a mold-side convex portion provided on any of the mold surfaces or a substrate-side convex portion provided on any of the substrate surfaces, and the orientation of the mold surface or the substrate. The imprinting apparatus according to claim 7, wherein the orientation of the surface of the imprint is determined. The discriminating unit determines the orientation of the surface of the mold or the orientation of the surface of the substrate based on the presence or absence of a recess provided on any of the surfaces of the mold or a recess provided on any of the surfaces of the substrate. The imprinting apparatus according to claim 7 or 8. The control unit is connected to an instruction unit that instructs the control unit whether or not to reverse the orientation of the surface of the mold or the substrate.
The instruction unit gives the instruction based on the preset orientation of the surface of the mold or the substrate at the time of carrying in and the orientation of the surface at the time of carrying out.
The imprinting apparatus according to any one of claims 1 to 9. An imprint method in which a pattern of imprint material is formed on a substrate using a mold.
While transporting the mold and the substrate from the transport source to the transport destination,
A step of determining whether or not to reverse the orientation of the surface of the mold based on the orientation of the surface of the mold, and
A step of determining whether or not to reverse the orientation of the surface of the substrate based on the orientation of the surface of the substrate is included.
An imprint method characterized by that. A step of forming a pattern on a substrate using the imprinting apparatus according to any one of claims 1 to 10.
A step of processing the substrate on which the pattern was formed in the step and a step of processing the substrate.
A method for manufacturing an article, which comprises.

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