JP6963286B2 - Mold equipment and resin molding method - Google Patents

Description

The present invention relates to a mold apparatus for resin molding and a resin molding method.

Conventionally, as a method of releasing a resin molded product having ribs and bosses from a mold, a round pin is installed on the surface of the resin molded product near the rib groove processed into the mold, and a plate pin is placed on the bottom surface of the rib groove. In addition, a square pin is installed so as to cover the bottom of the rib groove, the side wall of the rib groove, and the surface of the resin molded product connected to the rib groove.
A general conventional mold apparatus will be described with reference to FIGS. 25 (a) to 25 (c).
The mold device 1 has a movable side mold 2 and a fixed side mold 3. A take-out machine 6 to which a suction structure 5 having a suction pad 4 inserted between the movable side mold 2 and the fixed side mold 3 after the movable side mold 2 and the fixed side mold 3 are opened is attached. (Ejection robot) is arranged near the periphery of the mold 1.
Further, the projecting pins 7 are arranged so as to penetrate the movable mold 2. The protruding pins 7 are installed on the extrusion plate 9 so as to face the holes 8 formed in the movable die 2 for forming the ribs and bosses.
When the resin molded product 10 is taken out after resin molding by the conventional mold device 1, the movable mold 2 and the fixed mold 3 are opened, and the protruding pins 7 are held on the mold. By advancing the resin molded product 10 together with the plate 9, the resin molded product 10 is separated from the mold. After that, the mold-released resin molded product 10 is sucked by the suction pad 4 mounted on the take-out machine 6, and then the protruding pins 7 and the resin molded product 10 are separated by the operation of the take-out machine 6.

Further, in Patent Document 1, as a method of releasing a fine resin molded product having protrusions from a mold, a recess for molding the protrusion and the entire peripheral resin molded product are formed of a fine particle void structure and penetrated through the structure. A method of pushing the entire surface of a resin molded product to release it by using compressed air will be disclosed.

Japanese Unexamined Patent Publication No. 2007-283513

In the general conventional method shown in FIGS. 25 (a) to 25 (c) above, the protrusion pins 7 for mold release such as ribs, protrusions and bosses are avoided, and the ribs, protrusions and bosses are cooled by a layer. Since the holes are provided, the cooling of the ribs and bosses is weakened, so that the cooling cycle is long. In addition, since the heat capacity is large around the ribs, protrusions, and the base of the boss, and the heat conduction is low around the inner diameter of the boss, cooling is slower than other resin molded products, causing defects such as warpage and sink marks. ..

In addition, protruding pins and an extruded plate for holding the protruding pins are required, which has been a factor in increasing the mold cost.
Furthermore, regarding the mold release by the suction structure and the take-out machine without using protruding pins for the resin molded product having ribs and bosses, the fulcrum of the withdrawal output of the take-out machine is separated from the suction structure. Since a force exceeding the mold release resistance of the molded product cannot be generated at the position of the adsorption structure, there is a drawback that the resin molded product cannot be released from the mold.

In the method of using the compressed air of Patent Document 1 to push the entire surface of the resin molded product to release the mold, the gas passing through the fine particle void structure is larger in the flat portion smaller than the protrusion portion having the large mold release resistance of the resin molded product. Since it is supplied, the vacuum state of the protruding portion can be released, but there is a problem that the force for pushing the protruding shape is weakened.

In view of the above problems in the prior art, the present invention includes protruding pins that hinder the arrangement of the mold temperature control flow path, which is effective for shortening the molding cycle and preventing molding defects in molding of resin molded products having ribs and bosses. It is an object of the present invention to provide a mold apparatus and a resin molding method capable of separating a resin molded product from a mold without using an extrusion plate for holding pins.

That is, in the mold apparatus of the present invention, the mold in which the rib forming region and / or the boss forming region and / or the protrusion forming region is provided according to the design based on the attribute of the target product is formed, and the mold is formed with the main body. The main body portion is provided with a gas flow path connected to the rib forming region and / or the boss forming region and / or the protrusion forming region, and the gas flow path is provided in the cavity forming portion. It has a connecting portion for each of the rib forming region and / or the boss forming region and / or the protrusion forming region, and the gas discharge supply means is arranged in the connecting portion.

The connecting portion may connect the gas flow path to the respective tip portions of the rib forming region and / or the boss forming region and / or the protrusion forming region.

The gas discharge supply means may be a gas discharge supply structure including a large number of rectangular holes and reinforcing bars, or may be a porous structure.

Further, the cavity-forming portion may be a porous structure, and the wall surface of the rib-forming region and / or the boss-forming region and / or the protrusion-forming region may be subjected to surface treatment for predeterminedly controlling the surface roughness.

A direction in which the suction pad that is attracted to release the resin molded product molded in the cavity forming portion and the mold surface that has the cavity forming portion and is the target for releasing the resin molded product are separated from each other. It is advisable to provide an urging means to urge the. The urging means may be a cylinder / rod mechanism, and the urging means may be mounted on either the functional member of the suction pad system or the mold to be released from the resin molded product.

Further, in the resin molding method of the present invention, a cavity in which a rib forming region and / or a boss forming region and / or a protrusion forming region is provided according to a design based on the attributes of the target product is formed, and the rib forming region and / or the boss forming region is formed. A gas flow path is connected to each of the and / or protrusion forming regions, and ribs and / or or / or ribs of a resin molded product formed from this gas flow path in the rib forming region and / or the boss forming region and / or the protrusion forming region of the cavity. It is characterized in that compressed air is sent only to the boss and / or the tip surface of the protrusion.

A suction structure of a resin molded product capable of sending compressed air before the end of the resin filling process or the pressure holding process and having a mechanism for pushing the mold surface was arranged, and the resin molded product was sucked by the suction structure. After that, the resin molded product can be released by urging the mold surface on which the cavity for molding the resin molded product is formed.
The case where compressed air is sent before the end of the resin filling step is a case where it is not necessary to perform a pressure holding step for supplementing the resin as the filled resin shrinks after filling the resin.
Further, the case where compressed air is sent before the end of the pressure holding step is a case where it is necessary to perform a pressure holding step of supplementing the resin with shrinkage corresponding to the shrinkage rate of the filled resin after filling the resin.
As described above, by sending compressed air before the end of the resin filling process or the end of the pressure holding process, it is possible to obtain a molded product having few defects and good mold molding.

Further, a film can be integrally molded on the surface of the resin molded product, and the film surface can be adsorbed by the adsorption structure to release the resin molded product. In the process of filling the cavity with the molding resin, the rib forming region and / Alternatively, the gas in the cavity can be discharged from the boss forming region and / or the tip of the protrusion forming region.

The gas discharge supply structure used in the resin molding method according to the present invention takes into consideration one flow path cross section derived from the pressure loss formula, the total area of the flow path satisfying the gas discharge rate, the reinforcing bar derived from the strength calculation formula, and the like. However, the gas discharge supply structure has a grid pattern on the flow path plane and has a depth, and the change in the cross section of the gas flow path is eliminated to prevent the accumulation of gas residue, and the flow path does not use assembly bolts and positioning pins. It can be configured in consideration of preventing the decrease of.

That is, the gas discharge supply structure used in the resin molding method according to the present invention is provided with a plurality of rectangular grooves having a constant width and a constant depth and penetrating on one side plane of the thin piece, and from the flat surface portion via the plurality of rectangular grooves. A unit thin plate provided with a plurality of protruding portions having a constant height to protrude is formed by forming a rectangular groove and a flat surface on the opposite side of the surface having the rectangular groove and the protruding portion from the top plane of the protruding portion and the plane having the rectangular groove and the protruding portion. In addition, a plurality of protrusions can be laminated in the same direction to be joined and integrated so as to be composed of a large number of rectangular holes and reinforcing bars.

A rectangular groove having a constant width and a constant depth and penetrating the unit thin plate and a plurality of protrusions having a constant height protruding from the flat surface through the plurality of rectangular grooves are photoetched, milled, ground and molded. It can be formed by one or more of carving electric discharge machining and wire cutting electric discharge machining. As a result, it is possible to precisely eliminate the change in the cross section of the gas flow path and prevent the accumulation of gas residue. In particular, by forming the rectangular groove by etching without processing pressure, a thinner plate can be used as needed, and the number of laminated sheets per unit thickness can be increased. Further, the ratio of the rectangular groove depth to the thickness of the thin plate can be increased, and a high aperture ratio can be realized at the time of laminating.

The plane opposite to the surface having the rectangular groove and the protrusion and the top plane of the protrusion can be joined by diffusion joining. By forming the entire surface excluding the rectangular groove by diffusion joining in this way, it is possible to form an integrated gas discharge supply structure that does not require the use of assembly bolts and positioning pins. At the same time, it is possible to prevent the flow path from decreasing. Furthermore, the reinforcing bar can be set thinner, and a high aperture ratio can be realized.

According to the mold apparatus and the resin molding method of the present invention, in the molding of a resin molded product having ribs and bosses, protruding pins that hinder the arrangement of the mold temperature control flow path effective for shortening the molding cycle and preventing molding defects. The resin molded product can be efficiently separated from the mold without using an extruded plate that holds the or its pins.

It is a schematic diagram of the mold apparatus of one Embodiment of this invention, and shows (a) before mold release and (b) after mold release. It is a partial schematic diagram of the mold apparatus of one Embodiment shown in FIG. It is a partial perspective view of the mold apparatus of one Embodiment shown in FIG. It is a front view of the component of the mold apparatus of one Embodiment shown in FIG. It is a partial front view of the component of the mold apparatus of one Embodiment shown in FIG. It is a top view of the part shown in FIG. It is a side view of the component shown in FIG. It is a partially enlarged view of the component shown in FIG. It is explanatory drawing which shows the manufacturing process of the part shown in FIG. It is explanatory drawing which shows the resin molding process by the resin molding method of this invention. The step of retreating the resin molded product and (d) the step of transferring the resin molded product out of the mold are shown. It is explanatory drawing of the other embodiment of the mold apparatus and resin molding method of this invention. It is explanatory drawing of the further embodiment of the mold apparatus and the resin molding method of this invention. It is explanatory drawing of another embodiment of the mold apparatus and resin molding method of this invention. It is explanatory drawing of still another Embodiment of the mold apparatus and resin molding method of this invention. It is explanatory drawing of still another Embodiment of the mold apparatus and resin molding method of this invention. It is a photograph of the product produced by the example of the resin molding die which concerns on this invention. It is explanatory drawing which shows the other aspect of the component manufacturing process of the mold apparatus of one Embodiment of this invention. It is explanatory drawing which shows another aspect of the component manufacturing process of the mold apparatus of one Embodiment of this invention. It is explanatory drawing which shows the other aspect of the part manufacturing process of the mold apparatus of one Embodiment of this invention. It is explanatory drawing which shows still another aspect of the component manufacturing process of the mold apparatus of one Embodiment of this invention, (a) is the plan view, (b) is the front view. It is a perspective view of another aspect of the gas discharge supply structure which is a part of the mold apparatus of one Embodiment of this invention. It is a right side view of the gas discharge supply structure shown in FIG. It is a perspective view of the gas discharge supply structure which is a part of the mold apparatus of one Embodiment of this invention. It is a partially enlarged perspective view of the gas discharge supply structure shown in FIG. 23. It is explanatory schematic diagram of a general conventional mold apparatus, and shows (a) before mold opening, (b) after mold opening, and (c) after mold release.

An embodiment of the mold apparatus of the present invention will be described below.
1 to 3 show a mold apparatus 1 according to an embodiment of the present invention. The parts corresponding to the conventional mold apparatus will be described with the same reference numerals.
The mold device 1 includes a movable side mold 2 and a fixed side mold 3.
A suction pad 4 that is arranged near the periphery of the mold device 1 and is inserted between the movable side mold 2 and the fixed side mold 3 after the movable side mold 2 and the fixed side mold 3 are opened. An air cylinder rod mechanism 11 is provided in the take-out machine 6 to which the suction structure 5 (frame) to be provided is attached.
The air cylinder 11a of the air cylinder rod mechanism 11 is fixed to the suction structure 5 to which a plurality of suction pads 4 are attached, while one end of the rod 11b of the air cylinder rod mechanism 11 is outside the mold of the movable mold 2. It is possible to contact the side surface.

A cavity 12 is formed between the fixed-side mold 3 and the movable-side mold 2. The cavity 12 is provided with a rib forming region 12a, a boss forming region 12b, a protrusion forming region 12c, and the like according to a design based on the attributes of the target product.
On the other hand, the movable mold 2 is configured by combining the main body portion 13 and the cavity forming portion 14, and the cooling hole 15 is arranged in the cavity forming portion 14. Further, the main body 13 is provided with a gas flow path 16 connected to a rib forming region 12a, a boss forming region 12b, and a protrusion forming region 12c.
The gas flow path 16 has a connecting portion for each of the rib forming region 12a, the boss forming region 12b, and the protrusion forming region 12c in the cavity forming portion 14, and the gas discharge supply structure 17 is arranged in each connecting portion.
The wall surface of the movable mold 2 in the rib forming region 12a, the boss forming region 12b, and the protrusion forming region 12c is surface-treated so that the surface roughness Ra ≦ 0.5 μm.

As shown in FIGS. 4 to 8, the gas discharge supply structure 17 that can be used in the mold apparatus 1 of the present embodiment is formed by laminating a plurality of unit thin plates 18 and joining and integrating them. A plurality of rectangular grooves 20 having a constant width and a constant depth and penetrating the unit thin plate 18 are provided on one side flat surface 19. A plurality of projecting portions 21 having a constant height projecting from the one-sided flat surface 19 are provided through the plurality of rectangular grooves 20.
The directions of the rectangular groove 20 and the protrusion 21 are aligned with each other so that the top plane 23 of the protrusion 21 is brought into contact with the plane 22 on the opposite side of the one-side plane 19 of the unit thin plate 18, and a plurality of the unit thin plates 18 are laminated.
In this state, by joining and integrating the flat surface 22 and the top flat surface 23 of the protruding portion 21, the gas discharge supply structure 17 of the present embodiment including a large number of rectangular holes 24 and reinforcing bars 25 can be obtained.
The unit thin plate thickness of the gas discharge supply structure 17 is 1 mm or less, the depth of the rectangular groove 20 is 0.03 mm or less, the width / depth ratio which is the ratio of the width to the depth is 50 or more, and the rectangular groove. The length of 20 rectangles can be set to 1 mm or less, the end-processed portions at both ends can be set to 0.5 mm or more, and the number of laminated layers can be set to 5 or more.

A rectangular groove 20 having a constant width and a constant depth and penetrating the unit thin plate 18 and a plurality of projecting portions 21 having a constant height protruding from the flat surface portion through the plurality of rectangular grooves 20 are formed by a photoetching step. be able to.
As shown in FIG. 9, this photo-etching removes and cleans the front and back surfaces of the material flakes, applies a photosensitive resin (resist), and then applies a groove pattern film prepared in advance to the photosensitive resin (resist). A groove pattern is formed by affixing to and generally baking by UV irradiation. After etching this to form a groove in the material, the photosensitive resin is removed by peeling, washing and drying. By forming by etching in this way, a thinner unit thin plate 18 can be used as needed, and the number of laminated sheets per unit thickness can be increased. Further, the ratio of the depth of the rectangular groove 20 to the thickness of the unit thin plate 18 can be increased, and a high opening ratio of the rectangular hole 24 can be realized at the time of stacking.

The joining and integration of the flat surface 22 and the top flat surface 23 of the protruding portion 21 can be performed by diffusion joining.
Diffusion bonding is performed by bringing the flat surface 22 and the top flat surface 23 of the protruding portion 21 into close contact with each other and pressurizing and heating in a controlled atmosphere such as in a vacuum or in an inert gas. As a result, the bonding can be performed by utilizing the diffusion of atoms generated on the bonding surface. In the case of diffusion joining in this way, an integrated gas discharge supply structure 17 that does not require the use of assembly bolts or positioning pins can be obtained. At the same time, it is possible to prevent the flow path from decreasing. Further, the reinforcing bar 25 can be set thin, and a high opening ratio of the rectangular hole 24 can be realized.

The gas discharge supply structure 17 has a strength to withstand the resin pressure and easily discharges the gas in the cavity in the vicinity of the end of the unidirectional flow of the resin and the vicinity of the confluence of the countercurrent over the entire mass production period. It has a high aperture ratio that enables this, and it has an integrated structure that does not have fastening bolts or positioning pins to eliminate the need for assembly and positioning work, and the gas flow path is straight to prevent gas residue accumulation. It is possible to satisfy the fact that there is no step in the shape at the same time.

Resins to be injection-molded using the mold apparatus 1 include polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polybutylene-ethylene terephthalate (PBT-PET copolymer resin), polyether ether ketone (PEEK resin), and the like. Polyphenylene terephide (PPS), polyetherimide (PEI), 6 nylon (PA6), 6-6 nylon (PA66), 6T nylon (PA6T), polyphthalamide (PPA), polystyrene (PS), ABS resin (ABS) , Vinyl chloride resin (PVC), polyacetal (POM), liquid crystal polymer (LCP), polysulphon (PSU), polypropylene (PP), polycarbonate (PC), and the like. These can be used alone or in combination. Further, thermosetting resins such as phenol resin (PF), epoxy resin (EP), diallyl phthalate resin (PDAP), silicone resin (SI), polyimide resin (PI), melamine resin (MF), and urea resin (UF). Is. Inorganic fillers such as glass fibers, glass beads, and talc may be appropriately added to these thermoplastic resins and thermosetting resins for the purpose of improving heat resistance and dimensional stability. Further, an organic filler such as cellulose nanofibers may be appropriately blended.

Next, the resin molding method of the present invention performed using the mold apparatus 1 will be described with reference to FIG.
After the cavity 12 is filled with resin and molded, a pressurized gas is supplied from the gas discharge supply structure 17 to the cavity 12 immediately before the resin molded product 10 shrinks. As a result, gas is generated only in the gaps generated between the ribs and protrusions and bosses of the resin molded product 10 formed by the rib forming region 12a, the boss forming region 12b, and the protrusion forming region 12c, and the mold forming them. It is filled and extrudes the tips of ribs, protrusions, bosses, etc. This pushes the bottoms of the ribs, protrusions and bosses and reduces the mold release resistance on both sides of them.

Next, the resin molded product 10 is vacuum-sucked by the suction pad 4 to hold the resin molded product 10.
In this state, the rod 11b of the air cylinder / rod mechanism 11 is advanced, and the resin molded product 10 is released from the movable mold 2 and pulled out.
Next, the rod 11b of the air cylinder / rod mechanism 11 is retracted to prevent interference / collision when the resin molded product 10 is taken out of the system.
In that state, the resin molded product 10 vacuum-sucked by the suction pad 4 is moved up and moved out of the mold.

In the mold release process of the resin molded product 10 in the resin molding method of the present invention, the mold device 1 of the present invention has a protruding pin like the conventional mold device 1 shown in FIGS. 25 (a) to 25 (c). It is a mold configuration that does not have an extrusion plate 9 that holds the class 7 and the protruding pins 7, and can provide a cooling hole 15 in the vicinity of the rib forming region 12a, the boss forming region 12b, the protrusion forming region 12c, and the like. The molded product 10 and the cooling hole 15 can be brought close to each other evenly to improve the cooling efficiency.

Further, in the mold release process of the resin molded product 10 in the above resin molding method, the air cylinder 11a of the air cylinder rod mechanism 11 is fixed to the suction structure 5 to which a plurality of suction pads 4 are attached, and the air cylinder rod mechanism is fixed to the suction structure 5. One end of the rod 11b of 11 is made to be able to come into contact with the mold surface of the movable mold 2, and after adsorbing the resin molded product 10, the reaction force generated by pushing the movable mold 2 is used to utilize the resin. The resin molded product 10 can be pulled out with a strong force exceeding the mold release resistance of the molded product 10. At that time, since the surface treatment of the movable side mold 2 in the rib forming region 12a, the boss forming region 12b, and the protrusion forming region 12c is performed so that the surface roughness Ra ≦ 0.5 μm, the resin molded product 10 is used. The mold release resistance is reduced, which also allows the resin molded product 10 to be efficiently pulled out.

11 (a) and 11 (b) show other embodiments.
In the previous embodiment, the air cylinder 11a of the air cylinder rod mechanism 11 is fixed to the suction structure 5, whereas in the present embodiment, the air cylinder 11a of the air cylinder rod mechanism 11 is a movable side mold 2. One end of the rod 11b of the air cylinder rod mechanism 11 is fixed to the suction structure 5 so that it can come into contact with the suction structure 5. In the present embodiment, the resin molded product 10 can be pulled out with a strong force exceeding the mold release resistance of the resin molded product 10 by the force generated when one end of the rod 11b of the air cylinder rod mechanism 11 pushes the suction structure 5.

FIG. 12 shows still another embodiment. In each of the above embodiments, the resin molded product 10 is left in the movable mold 2 when the mold is opened, but in the present embodiment, the resin molded product 10 is left. Is left in the fixed-side mold 3, the same configuration as the movable-side mold 2 of each of the previous embodiments is adopted for the fixed-side mold 3, and the other configurations are the same as those of the previous embodiments. It is a method of releasing the mold by the method.

FIG. 13 shows still another embodiment, in which the film 26 is integrally molded on the surface of the resin molded product 10, the surface of the film 26 is adsorbed by the suction pad 4, and the mold is released by the same configuration and method. ..

FIG. 14 shows yet another embodiment. In the present embodiment, the cavity forming portion 14 of the movable mold 2 is a porous structure made of a porous material. Moreover, in the cavity forming portion 14 which is a porous structure made of the porous material, the connecting portion 27 of the gas flow path 16 with respect to each of the rib forming region 12a, the boss forming region 12b, and the protrusion forming region 12c is selectively coarse. As a porous structure, the other cavity forming portion 14 is used as a dense porous structure not only on the bottom surface of the rib forming region 12a, the boss forming region 12b, and the protrusion forming region 12c, but also on the side surface as necessary. The method is to release the mold by supplying high-pressure gas. Therefore, in this embodiment, the gas discharge supply structure 17 used in each of the above embodiments is not arranged.

FIG. 15 shows yet another embodiment. In the present embodiment, in the cavity forming portion 14 of the movable mold 2, the gas discharge supply structure 17 is arranged at the connecting portion of the gas flow path 16 with respect to each of the rib forming region 12a, the boss forming region 12b, and the protrusion forming region 12c. The other cavity forming portion 14 is a porous structure made of a porous material. In the present embodiment, the mold is released by supplying high-pressure gas not only to the bottom surface of the rib forming region 12a, the boss forming region 12b, and the protrusion forming region 12c but also to the side surface as needed.

The gas discharge supply structure 17 shown in FIGS. 4 to 8 was prepared as follows, and resin molding was performed by the resin molding method of the present invention by the mold apparatus 1 of the present invention using the gas discharge supply structure 17.
L21.6 mm x W10.1 mm x t0.2 mm SUS plate L21.6 mm, W10.1 mm on one side, 1.0 mm apart from both ends of L21.6 mm, and the grooves are evenly spaced L0.4 mm, L3 A rectangular groove 20 having a size of .6 mm × D0.025 mm was repeatedly provided at five locations by etching. Forty-five unit thin plates 18 similarly grooved are stacked with the direction and outer shape of the rectangular groove 20 aligned, and SUS plates for reinforcement of L21.6 mm × W10.1 mm × t0.5 mm are further laminated on both longitudinal surfaces thereof, 47. A thin plate laminated product, which is a laminated product composed of a single thin plate, was constructed. After that, 47 thin plate laminated products were made into an integral component of L21.6 mm × W10.1 mm × H10 mm by utilizing diffusion bonding. Looking at the gas discharge supply structure 17 which is an integral component from the direction of L21.6 mm × H10 mm, the rectangular groove 20 of L3.6 mm × D0.025 mm has a pitch of 0.2 mm in the H10 mm direction and a pitch of 4 in the L21.6 mm direction. 225 pieces were formed so as to penetrate the back surface of L21.6 mm × H10 mm at equal intervals of 0.0 mm. As a result, it has a high opening ratio of about 9.4%, a degassing rectangular hole 24 with no step in the depth direction, a reinforcing bar 25 for forming pressure resistance, etc., and an integrated structure that does not require bolt fastening or positioning pins. The gas discharge supply structure 17 forming the above can be realized.

The specification of the suction structure 5 is that an air cylinder 11a in which rods 11b are connected to four corners of a frame made of an aluminum material and suction pads 4 are provided in five places in the same direction. The air cylinder 11a and the suction pad 4 can be individually moved by the air piping of a separate circuit.

In the mold release method, after the mold cavity 12 in which the PP resin is set to 40 ° C is filled with the molding internal pressure of 400 kg / cm2, the gas discharge supply structure 17 is started to be supplied with compressed air of 6 kg / cm2 for cooling and molding. After the opening step, the resin molded product 10 was vacuum-sucked using the suction pad 4 of the suction structure 5. Then, 6 kg / cm2 of compressed air was flowed through the air cylinder of the adsorption structure 5, and the surface of the mold other than the product part was pushed by the rod 11b. As a result, the suction structure 5 was released from the movable mold 2 in a state where the resin molded product 10 was sucked. The supply of compressed air supplied to the gas discharge supply structure 17 was stopped from the completion of mold release of the resin molded product 10 to the completion of resin filling in the next cycle.

The resin molded product obtained as described above is shown in FIG. The specific specifications of this molded product are: length 500 x width 500 x height 30 mm, product wall thickness 2.8 mm, height 10 mm, 8 ribs in the horizontal direction, 6 in the vertical direction, and one side wall to the other. Is connected to.

Hereinafter, various aspects of the manufacturing process of the gas discharge supply structure 17 that can be used in the mold apparatus 1 of the present invention will be described with reference to the drawings. The rectangular groove 20 having a constant width and a constant depth of the unit thin plate 18 and the plurality of projecting portions 21 having a constant height protruding from the flat surface portion through the rectangular groove 20 and the plurality of rectangular grooves 20 are photoetched, milled, and ground. It can be formed by one or more steps of machining, die-sinking electric discharge machining, and wire-cut electric discharge machining.

When milling is applied, a flat surface 19 on one side of the unit thin plate 18 is cut using a milling drill 28 that rotates at high speed as shown in FIG. The unit thin plate 18 is fixed on a table (not shown), and the milling drill 28 moves in the Z direction (up and down) and moves the table in the XY directions (front and back, left and right) for processing.

When grinding is applied, a grinding wheel 29 rotating at a high speed is used as shown in FIG. 18, and the unit thin plate 18 is scraped off by extremely hard and fine abrasive grains constituting the grinding wheel 29. Mold into the shape of.

When the die-sinking electric discharge machining is applied, as shown in FIG. 19, sparks are intermittently blown between the electrode 31 and the unit thin plate 18 in the machining fluid 30 10 to 100,000 times per second. The metal is melted by the heat, and the shape of the electrode 31 is machined so as to be carved into the unit thin plate 18.

When wire electric discharge machining is applied, as shown in FIG. 20, the metal is melted by the heat of electric spark discharge between the wire electrode 32 and the unit thin plate 18 in the processing liquid 30, and the wire electrode 32 is formed on the unit thin plate 18. It is processed so as to be carved into a shape corresponding to the movement locus 33.

Other aspects of the gas discharge supply structure, which is a component of the mold apparatus of the present invention, will be described below with reference to the drawings.
The gas discharge supply structure 17 shown in FIGS. 21 and 22 has a brim 17a on the upper surface. By having the brim 17a, it is possible to prevent the brim 17a from coming off after being incorporated into the mold device 1. The brim 17a is formed by, for example, removing the upper surface portion of the gas discharge supply structure 17 shown in FIG. 8 by wire-cut electric discharge machining, milling, grinding, or the like.
The gas discharge supply structure 17 shown in FIGS. 23 and 24 is assumed to have brims 17b on both sides. The brim 17b can also be prevented from coming off after being incorporated into the mold apparatus 1, and is formed by performing a process of removing a necessary portion by wire-cut electric discharge machining, milling, grinding, or the like.

1 ... Mold device, 2 ... Movable side mold, 3 ... Fixed side mold, 4 ... Suction pad, 5 ... Suction structure, 6 ... Extractor, 7 ... Pins, 8 ... Holes, 9 ... Extruded plates, 10 ... Resin molded products, 11 ... Air cylinder / rod mechanism, 11a ... Air cylinder, 11b ... Rod, 12 ... Cavity, 12a ... Rib forming region, 12b ... Boss forming region, 12c ... Protrusion forming region, 13 ... Main body, 14 ... Cavity forming, 15 ... Cooling hole, 16 ... Gas flow path, 17 ...・ Gas discharge supply structure, 18 ... unit thin plate, 19 ... one side plane (of thin plate), 20 ... rectangular groove, 21 ... protrusion, 24 ... rectangular hole, 22 ... flat surface, 23 ... Top plane, 25 ... Reinforcing bar, 26 ... Film, 27 ... Connecting part (of gas flow path).

Claims (3)

A suction pad provided with a urging means capable of contacting the outer surface of the mold forming the cavity and urging the outer surface of the mold to urge the mold surface and a suction pad capable of sucking the resin molded product. A mold device characterized by arranging a structure. The mold in which the rib forming region and / or the boss forming region and / or the protrusion forming region is provided according to the design based on the attribute of the target product is formed by combining the main body portion and the cavity forming portion. The main body is provided with a gas flow path connected to the rib forming region and / or the boss forming region and / or the protrusion forming region, and this gas flow path is the rib forming region and / or the boss forming region in the cavity forming portion. The mold device according to claim 1, which has a connecting portion for each of the and / or protrusion forming regions, and a gas discharge supply means is arranged in the connecting portion. A suction pad provided with an urging means capable of contacting the outer surface of the mold forming the cavity and urging the outer surface of the mold to urge the mold surface and a suction pad capable of sucking the resin molded product. The structure is characterized by adsorbing a resin molded product and then urging the outer surface of the mold to urge the mold surface on which a cavity for molding the resin molded product is formed to release the resin molded product. Resin molding method.

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