JP7022032B2 - Vacuum stacking system and vacuum stacking method - Google Patents

Description

The present invention relates to a vacuum laminating system and a vacuum laminating method in which a laminated molded product is conveyed into a chamber of a vacuum laminating apparatus to perform laminating molding using a transport film.

The vacuum laminating system described in Patent Document 1 is known as a vacuum laminating system in which a laminated molded product is conveyed into a chamber of a vacuum laminating apparatus to perform laminating molding using a transport film. The transport film referred to as a carrier film in Patent Document 1 serves to transport a laminated material and a molded product (hereinafter, these are referred to as a laminated molded product) to a laminated molding apparatus. By using a transport film, the laminated molded product can be supplied from a narrow space between the upper plate and the lower plate of the laminated molding apparatus to a molding position in a chamber where molding is performed without human intervention. Alternatively, even if the molten resin or the like has the property of flowing from the laminated molded product during laminating molding, the molten resin or the like is vacuum-laminated by sandwiching the laminated molded product between the transport films provided above and below. It also has the effect of preventing it from adhering to the diaphragm of the device.

Further, in a vacuum laminating apparatus using a transport film, a vacuum laminating apparatus described in Patent Document 2 is known in which a semiconductor is placed on a wafer ring with a dying tape and carried in / out by the transport film. In Patent Document 2, the laminating device is provided with a diaphragm on the side of the upper plate.

JP-A-2002-103439 (Claim 1, 0008, FIG. 1) JP-A-2015-5709 (Claim 1, 0020, FIG. 1)

However, even in the method of directly placing and transporting the laminated molded product on the transport film as in Patent Document 1, the transport jig in which the molded product such as a wafer is attached on the transport film as in Patent Document 2. Even in the method of mounting (these are also collectively referred to as a laminated molded product), the conveyed film is started to move together with the conveyed film until it is stopped at the forming position in the chamber of the vacuum laminating apparatus. On the other hand, there is a problem that the laminated molded product may be misaligned. Since the misalignment occurs more frequently when the feed rate of the transport film is increased, it is necessary to slow down the feed rate of the transport film when the misalignment occurs, which also leads to an extension of the molding cycle time.

Furthermore, even if the laminated molded product can be accurately stopped at the molded position in the chamber by transferring the transport film, the laminated molded product may be displaced from the molded position when the chamber is closed and the vacuum state is established. be. This is mainly caused by the vibration of the transport film due to the air flow generated when the air in the chamber is evacuated. Furthermore, in a vacuum laminating device of the type using a diaphragm, there is a possibility that the laminated molded product may be displaced from the molding position due to the bulging of the diaphragm at the start of pressurization. If pressure is applied by a pressurizing means such as a diaphragm in a state where the laminated molded product is displaced from the correct molding position in the vacuum laminating device for the above reasons, the center where molding is assumed. Since it was not possible to mold in the part that can be uniformly pressurized, it led to an increase in defective products (decrease in yield of laminated molded products).

As a countermeasure to these problems, it is conceivable to adhere the laminated molded product to the upper surface of the transport film with an adhesive so as not to cause misalignment. However, when the laminated molded product is adhered to the upper surface of the conveyed film with an adhesive, it cannot be peeled off well when the laminated molded product is taken out at the take-out position after pressure molding by the vacuum laminating device, and the laminated molded product cannot be peeled off well. It may be damaged or a large-scale unloading device may be required.

In view of the above problems, the present invention provides a vacuum laminating system or a vacuum laminating method that prevents a decrease in the yield of the laminated molded product due to misalignment of the laminated molded product with respect to the conveyed film and also considers the ease of taking out the laminated molded product. The purpose is to do.

The vacuum laminating system according to claim 1 of the present invention is a vacuum laminating system in which a laminated molded product is conveyed into a chamber of a vacuum laminating apparatus to perform laminating molding by using a conveying film, and the laminated molded product of the conveyed film is placed on the vacuum laminating system. Forming a movement blocking portion that forms a movement blocking portion that blocks or restricts the movement of the laminated molded product with respect to the transport film without adhering the mounted portion to the laminated molded product at a position that is in contact with or close to the periphery of the mounted portion. The means is provided in the pre-process of the vacuum laminating apparatus .

The vacuum laminating system according to claim 2 of the present invention, in claim 1, the movement blocking portion forming means locally comprises a protrusion forming means or a conveying film provided with a suction device for locally sucking the conveying film. It is characterized in that it is a protrusion forming means provided with a pressurizing device for pressurizing.

In the vacuum laminating system according to claim 3, in claim 1, the movement blocking portion forming means is a protrusion adhering means for adhering another member to the transport film or an upper transport film and a lower transport film. It is characterized by being a temporary pasting means for temporary pasting.

The vacuum laminating method according to claim 4 of the present invention is a vacuum laminating method in which a laminated molded product is transported into a chamber of a vacuum laminating device using a transport film to perform laminating molding, and the laminated molded product is conveyed on the upper side with respect to the laminated molded product. Temporarily attach the upper transport film and the lower transport film at positions that are in contact with or close to the periphery of the laminated molded product without directly adhering the film and the lower transport film, and then temporarily attach the upper transport film and the lower transport film. The feature is that the laminated molded product is horizontally prevented from moving or restricted with respect to the film, and the upper transport film and the lower transport film are moved to carry the laminated molded product into the vacuum laminating device. do.

The vacuum laminating method according to claim 5 of the present invention is a vacuum laminating method in which a laminated molded product is conveyed into a chamber using a conveying film to perform laminating molding, before the laminated molded product is placed on the conveying film or. In a mounting stage where a laminated molded product is placed on a transport film, the mounted portion and the laminated molded product are not adhered to a position where the laminated molded product of the transport film is placed in contact with or close to the surrounding of the mounted portion. It is characterized by forming a movement blocking portion that blocks or restricts the movement of the laminated molded product with respect to the transport film .

The vacuum laminating system of the present invention is a vacuum laminating system in which a laminated molded product is transported into a chamber of a vacuum laminating device to perform laminating molding using a transport film, and is a mounting portion on which the laminated molded product of the transport film is placed . The vacuum laminating device is a means for forming a movement blocking portion that forms a movement blocking portion that blocks or restricts the movement of the laminated molded product with respect to the transport film without adhering the mounted portion to the laminated molded product at a position that is in contact with or close to the surroundings . Since it is provided in the previous process, it is possible to prevent a decrease in yield due to misalignment of the laminated molded product with respect to the conveyed film.

It is a schematic diagram of the vacuum stacking system of this embodiment. It is a figure which shows the main part of the vacuum stacking system of this embodiment. It is a schematic diagram of the vacuum stacking system of 2nd Embodiment. It is a schematic diagram of the vacuum stacking system of 3rd Embodiment. It is a schematic diagram of the vacuum stacking system of 4th Embodiment. It is a schematic diagram of the vacuum stacking system of 5th Embodiment.

The vacuum stacking system 11 of the present embodiment will be described with reference to FIGS. 1 and 2. In the vacuum laminating system 11 of the present embodiment, the laminated lumber and the laminated lumber constituting the laminated molded product M are conveyed to the molding position in the chamber C of the vacuum laminating apparatus 12 by using the conveying films F1 and F2, and the vacuum laminating apparatus is used. It is laminated and molded at 12 molding positions. In the vacuum laminating device 12, a chamber C capable of vacuum suction is formed when the upper plate 13 and the lower plate 14 are closed, and the elastic film body 15 (silicon rubber or the like) provided on at least one of the plates 13 and 14 is formed. A diaphragm made of heat-resistant rubber) is swelled in the chamber C toward the other plates 14 and 13, and the laminated molded product M is pressed and laminated.

More specifically, the lower plate 14 is opposed to the upper plate 13 and can be separated from each other in close proximity to each other, and when the upper plate 13 and the lower plate 14 are closed, a predetermined volume that can be evacuated by the vacuum pump 16 is possible. Chamber C is formed. A hot plate 17 and a hot plate 18 that can be heated are attached to the center of the lower surface of the upper plate 13 and the upper surface of the lower plate 14, respectively. A frame-shaped side wall portion 19 is attached to the peripheral portion of the upper surface of the lower plate 14. Further, the elastic film body 15 (diaphragm) is attached so as to be sandwiched between the lower surface of the side wall portion 19 and the lower plate 14 and to cover the upper surface of the hot plate 18. The molding position of the central portion of the chamber C can be pressurized with a uniform pressure by the elastic film body 15, but the end portion of the chamber C may not have a uniform pressure. Further, the end portion of the chamber C may protrude from the upper and lower transport films F1 and F2.

A pipe line is connected to the hot plate 18 or the like below the elastic film body 15, and the on-off valves 20 and 21 provided in the pipe line enable switching to both the vacuum pump 16 and the pressurizing compressor 22 for connection. ing. Therefore, when the conduit on the back surface side of the elastic membrane 15 is connected to the vacuum pump 16, the elastic membrane 15 is in close contact with the hot plate 18, and when it is connected to the compressor 22, the elastic membrane 15 is in the chamber C. It swells inward. The elastic film body 15 and the compressor 22 constitute a pressurizing means for the vacuum laminating device 12. Further, a side wall portion 23 is provided at a position facing the side wall portion 19 in a portion around the lower surface of the upper plate 13. An elastic film body 24 made of heat-resistant rubber such as a silicon rubber film is attached to the hot plate 17 of the upper plate 13.

An O-ring 25 is attached to the upper surface of the side wall portion 19 (the surface facing the upper plate 13) so as to surround the chamber C. The portion between one side portion of the side wall portion 23 of the upper plate 13 and the one side portion of the side wall portion 19 of the lower plate 14 is a carry-in port where the laminated molded product M is carried in together with the transport films F1 and F2. Further, in the portion between the other side portion of the side wall portion 23 of the upper plate 13 and the other side portion of the side wall portion 19 of the lower plate 14, the laminated molded product M having been pressure-molded is carried out together with the transport films F1 and F2. It is the exit 27.

Chamber C formed between the upper plate 13 and the lower plate 14 when the lower plate 14 is raised (Since FIG. 1 shows the time of transfer, it is described as chamber C with the lower plate 14 lowered. Chamber C is closed and formed) is connected to the vacuum pump 16 via a conduit 48 and an on-off valve 49. The vacuum laminating device 12 is not limited to the above as long as the laminated molded product M can be pressure-molded at a molding position in the chamber C where vacuum suction is possible. As an example, in the chamber of the vacuum laminating device, the molded product may be laminated and molded by a pressurizing means using a combination of an elastic plate other than the diaphragm and a pressurizing cylinder. Alternatively, the laminated molded product M may be laminated and molded via the transport films F1 and F2 by a pressurizing means using atmospheric pressure (including a relative pressure difference).

Next, a transfer device for the upper and lower transfer films F1 and F2 of the vacuum lamination system 11 and the laminated molded product M will be described. The vacuum laminating system 11 is a lower transfer film F1 for carrying the laminated molded product M into the vacuum laminating device 12 below one side of the vacuum laminating device 12 (on the right side in FIG. 1 on the front-end process side). An unwinding roll 28 is provided. The unwinding roll 28 is driven and controlled by a servomotor (not shown). The lower transport film F1 unwound from the unwind roll 28 is horizontally changed in the transport direction by the driven roll 29. A supply stage S1 for the laminated molded product M is provided at a portion where the lower transport film F1 is fed in the horizontal direction.

In the present embodiment, the laminated molded product M is placed on the mounting portion F3 of the lower transport film F1 by the carry-in device 30 provided with a holder such as a suction tool in the supply stage S1. At this time, the laminated molded product M may be a product in which a film as a laminated material is set with a substrate or a semiconductor to be molded from the beginning, or may be laminated in the supply stage S1. Alternatively, it may be mounted on a mounting object such as a wafer ring as in Patent Document 2. In order to improve the accuracy of the placement position of the laminated molded product M, it is also desirable to control the carry-in device 30 by a servomotor.

An unwinding roll 31 of the upper transport film F2 is provided on one side of the vacuum laminating device 12 above the portion between the vacuum laminating device 12 and the supply stage S1. The unwinding roll 31 is also driven and controlled by a servomotor (not shown). The upper transport film F1 unwound from the unwinding roll 31 is overlapped with the lower transport film F1 by the driven roll 32, and the transport direction is changed in the horizontal direction. The upper and lower transport films F1 and F2 are fed into the chamber C from the carry-in inlet 26 of the vacuum laminating apparatus 12 with the laminated molded product M sandwiched between them.

Further, above the other side of the vacuum laminating device 12, a take-up roll 33 of the upper transport film F2 is provided. The take-up roll 33 is driven and controlled by a servomotor (not shown). The upper transport film F2 coming out of the carry-out port 27 of the vacuum laminating device 12 is peeled off from the lower transport film F1 by the driven roll 34, transferred upward, and wound around the upper take-up roll 33. Taken. In the present invention, the upper transport film F2 is not indispensable, and by covering each laminated molded product M with a cover film larger than the laminated molded product M on the laminated molded product M, the molten resin vacuum laminating device 12 can be obtained. The purpose of preventing adhesion can be achieved.

Further, a take-up roll 35 for the lower transport film F1 is provided below the other side of the vacuum laminating device 12. The take-up roll 35 is driven and controlled by a servomotor (not shown). Then, the molding is completed at the position where the lower transfer film F1 is horizontally transferred after the upper transfer film F2 is removed after passing through the carry-in inlet 26, the chamber C, and the carry-out port 27 of the vacuum laminating device 12. An take-out stage S2 is provided to take out the laminated molded product M to the outside. Then, a carry-out device 36 provided with an adsorbent is provided above the take-out stage S2, and the laminated molded product M is taken out for a subsequent process. Then, the lower transport film F1 is changed in direction by the driven roll 37 and wound on the take-up roll 35.

The unwinding rolls 28, 31 and the take-up rolls 33, 35 of the transfer device are not limited to those driven by the servomotor, and may be those using other electric motors. A servomotor may be used only for driving the take-up rolls 33 and 35, and a torque motor or the like may be used for the take-up rolls 28 and 31 for applying tension in the opposite direction. Further, the transfer device may be made to accurately perform horizontal movement for one pitch by a device such as the chuck 7 of Patent Document 1, in which case the take-up rolls 33 and 35 may not use a servomotor. ..

Further, in the present embodiment, a protrusion forming means 38, which is a kind of movement blocking portion forming means for forming the movement blocking portion, is arranged below the transport film F1 of the supply stage S1. The protrusion forming means 38 prevents the lower transfer film F1 from moving to a contact position around the mounting portion F3 on which the laminated molded product M is placed or to a nearby position where the movement of the laminated molded product alone can be restricted. It forms a protrusion F4 which is a portion. As shown in FIG. 2, the protrusion forming means 38 includes a suction device 39 that locally sucks the lower transport film F1. The protrusion forming plate 40 of the protrusion forming means 38 has a flat surface portion 41 formed on the upper surface side thereof in contact with the lower transport film F1 and at a position where the protrusion F4 is provided around the end portion M1 of the laminated molded product M. Correspondingly, a plurality of circular recesses 42 are formed. At the center of the bottom surface 43 of the recess 42, a needle-shaped or conical protrusion forming portion 44 is formed at a height slightly lower than that of the flat surface portion 41. Further, a negative pressure suction hole 45 is provided around the protrusion forming portion 44 on the bottom surface 43 of the recess 42.

In the protrusion forming plate 40, a plurality of positions where the recess 42 and the protrusion forming portion 44 are provided are provided around the recess 42 according to the shape of the laminated molded product M. In this embodiment, four points are provided for the laminated molded product M made of one circular wafer for semiconductors. However, 3 to 8 points may be provided. Since the wafer for semiconductors needs to be uniformly pressurized and is lightweight, it is liable to cause misalignment during vacuum suction, so that the present invention is preferably used. In addition, when 4 to 16 wafers, etc. are transferred and laminated at the same time, the pressure balance may differ if the placement position on the lower transport film F1 moves, or the wafers, etc. may overlap in the worst case. Therefore, the present invention is preferably used. Further, when the laminated molded product M is a quadrangle, at least four points, preferably eight points, of protrusions F4 are provided. Further, the protrusion forming portion 44 may be a pyramid or a ridge having a long side and a short side. When forming a ridge, which is a kind of protrusion, the shape of the recess 42 is naturally formed in a groove shape. When forming ridges on the lower transport film F1, the number may be smaller than when forming conical or pyramidal protrusions, and when forming the entire circumference, one ridge is required. But it may be.

The protrusion forming plate 40 is detachably fitted into a box-shaped suction box 46 in which an O-ring (not shown) is fitted on the inner circumference. The opening on the back surface side of the negative pressure suction hole 45 of the protrusion forming plate 40 is connected to the internal space of the suction box 46. A communication hole 47 is provided at the bottom of the internal space of the suction box 46, and the communication hole 47 is connected to the vacuum pump 16 via a pipeline 50. An opening / closing valve 51 for turning on / off vacuum suction, a vacuum regulator (not shown) for controlling the degree of suction, and the like are arranged in the pipeline 50.

A plurality of these protrusion forming plates 40 are prepared according to the laminated molded product M to be molded, and one of them is fitted into the suction box 46 to be used. Further, in the present embodiment, by providing the protrusion forming means 38 provided with the suction device 39 below the lower transport film F1, the upper side of the transport film F1 of the supply stage S1 is opened for the carry-in device 30. And the two do not interfere with each other. The protrusion forming means 38 may be provided with a means for heating the lower transport film F1, such as providing a heater on the protrusion forming plate 40, so that the transport film F1 can be easily deformed. Alternatively, the suction device 39 may be provided above the lower transport film F1 and the transport film F1 may be sucked from the hole to form the protrusion F4 upward.

Next, the vacuum stacking method of the vacuum stacking system 11 of the present embodiment will be described with reference to FIGS. 1 and 2. First, in the supply stage S1, the protrusion F4, which is a movement blocking portion, is formed on the lower transport film F1 by using the suction device 39 of the protrusion forming means 38. At this time, first, the servomotor of the unwinding roll 28 is controlled to weaken the tension of the lower transport film F1. Then, when the opening / closing valve 51 of the suction device 39 is opened and suction is performed, the transport film F1 is attached to the flat surface portion 41 and a part thereof is sucked into the recess 42. However, as shown in FIG. 2, since the protrusion forming portion 44 is erected in the center of the recess 42, the sucked transfer film F1 is in the state of (A) in FIG. At this time, as shown in FIG. 2A, when an attempt is made to form a sharp protrusion F4, a hole is often opened in the center of the tip thereof. However, the height of the protrusion forming portion 44 can be lowered, the top thereof can be curved, or the above-mentioned heating means can be used to prevent the transport film F1 from having holes, which is appropriately selected.

Next, the servomotor of the unwinding roll 28 is controlled to increase the tension of the lower transport film F1 (see the arrow in FIG. 2B). Then, the concave portion of the lower transport film F1 is pulled and becomes substantially flat, and a conical protrusion F4 protruding upward is formed as shown in FIG. 2B. At this time, there is no problem even if a portion recessed from the flat surface remains slightly around the protrusion F4.

Next, the circular wafer, which is the laminated molded product M, is placed on the mounting portion F3 inside the protrusions F4 formed at four points of the lower transport film F1 by the carry-in device 30. At this time, it goes without saying that the mounting portion F3 of the transport film F1 and the laminated molded product M do not adhere to each other, but the description is made just in case. In the present embodiment, for convenience, the example of one wafer to be molded is described, but when a plurality of laminated molded products M are molded at the same time, each of the laminated molded products M of the lower transport film F1 is mounted. A protrusion F4 is formed at a contact position or a close position around the placement position. In the present embodiment, the protrusion F4 is formed around the mounting portion F3 in the supply stage S1, but the wafer, which is the laminated molded product M, is first mounted on the mounting portion F3, and then the protrusion forming means 38 is used. The protrusion F4 may be formed on the lower transport film F1. Alternatively, the transport film F1 on the lower side of the laminated molded product M may be placed on the mounting portion F3 and the protrusion F4 may be formed on the transport film F1 at substantially the same time.

During the formation of the protrusion F4 on the transport film F1, the previously fed laminated molded product M is pressure-molded in the vacuum laminating apparatus 12. When the pressure molding is completed, the lower plate 14 is lowered and the chamber C is opened. Next, the servomotor of the take-up roll 35 of the lower transport film F1 is driven, and the lower transport film F1 on which the laminated molded product M is placed on the supply stage S1 is the chamber C of the vacuum laminating device 12 on the other side. Will be transferred towards. At this time, the take-up roll 33 servomotor is also driven on the upper transport film F2. Then, from the portion of the driven roll 32, the upper transport film F2 is superposed on the laminated molded product M on the lower transport film F1, and the upper and lower transport films F1 and F2 are carried in at the same speed as the carry-in inlet of the vacuum laminating device 12. Transferred towards 26. At this time, the unwinding roll 28 of the lower transport film F1 and the unwinding roll 31 of the upper transport film F2 apply torque in the direction of winding the rolls 28 and 31 by the servomotor, and the upper and lower transport films F1 and F2 are applied. It is desirable to apply tension to.

Then, the upper and lower transport films F1 and F2 are moved by a certain distance, and when the laminated molded product M reaches the molding position of the chamber C of the vacuum laminating device 12, the feeding of the upper and lower transport films F1 and F2 is stopped. Even if a force that is moved forward by an inertial force acts on the laminated molded product M when the lower transport film F1 is stopped, the transport film F1 has a protrusion F4 around the laminated molded product M. Is formed, so that the laminated molded product M comes into contact with the wall surface of the protrusion F4 and is prevented from moving. Further, the protrusion F4 also prevents the laminated molded product M from moving laterally or backward due to a shock when the lower transport film F1 stops moving.

When the laminated molded product M is set at the molding position, the lower plate 14 rises to form a chamber C with the upper plate 13, and the chamber C is sucked by the vacuum pump 16 and reduced to a predetermined pressure (vacuum). Will be done. At this time, as described in the column of "Problems to be solved by the invention", the laminated molded product M is displaced from the molding position due to the air flow generated in the chamber C and the vibration of the transport films F1 and F2 accompanying the flow. However, in the present invention, the misalignment is prevented by the protrusion F4 formed on the lower transport film F1. Similarly, misalignment of the laminated molded product M due to swelling of the elastic film body 15 during pressurization is also prevented. In these cases, when the end portion M1 of the laminated molded product M and the end portion of the protrusion F4 are not in contact with each other and are in close proximity to each other, the end portion M1 of the laminated molded product M hits the end portion of the protrusion F4. Although it may move a short distance until it comes into contact with each other, it is a movement of a distance within the mounting portion F3 that does not hinder molding, and the laminated molded product M is prevented from moving in the horizontal direction (problematic position). It is included in the state where there is no deviation).

Then, when pressure forming is performed in the vacuum laminating device 12 for a predetermined time, the vacuum in the chamber C is then broken, and then the lower plate is lowered to open the chamber C. Then, by driving the winding rolls 33 and 35 of the upper and lower transport films F1 and F2, the upper and lower transport films F1 and F2 and the laminated molded product M having been molded are sent to the other side from the carry-out port 27 of the vacuum laminating device 12. Then, the upper transport film F2 is peeled off at the portion of the driven roll 34, and the lower transport film F1 and the laminated molded product M are fed to the take-out stage S2 and stopped. Then, the laminated molded product M is taken out by the carry-out device 36.

Next, the vacuum stacking system 61 of the second embodiment will be described with reference to FIG. In the second embodiment, the position and structure of the protrusion forming means 62 are different from those in the embodiment shown in FIG. 1, but the other configurations are the same as those in the present embodiment shown in FIG. The explanation of is omitted. In the second embodiment, the protrusion forming stage S0 is provided in the pre-process of the supply stage S1. The protrusion forming means 62, which is a kind of movement blocking portion forming means, comprises a pressurizing device that locally pressurizes the transport film F1. Specifically, the protrusion forming portion 63 made of a conical rod whose tip is a curved surface is projected from below the lower transport film F1 and pressed to push the lower transport film F1 upward from the back surface side. It is processed so that the protrusion F4 is formed toward the surface. In the example of FIG. 3, the elevator board 66 is guided by the guide rod 67 attached to the base 64 and moved up and down by the operation of the actuator such as the cylinder 65 attached to the base 64. Further, protrusion forming portions 63 are attached to the elevating board 66 at a plurality of locations. When the laminated molded product M to be laminated is changed, it is changed for each elevating board 66 to which the protrusion forming portion 63 is attached, or the position of the protrusion forming portion 63 on the elevating board 66 is changed.

The pressing plate 68 is arranged above the transport film F1 on the lower side of the protrusion forming stage S0. In the pressing plate 68, a hole 69 having a cross-sectional area slightly larger than the cross-sectional area of the protrusion-forming portion 63 is formed in a portion corresponding to the protrusion-forming portion 63. Therefore, when the protrusion forming portion 63 is projected upward by the operation of the cylinder 65 or the like, only the portion of the transport film F1 that is pressed by the protrusion forming portion 63 is lifted upward. It has become. The pressing plate 68 is not essential when the protrusion forming means 62 is provided with a heating means. As a modification of the example of FIG. 3, after stacking the upper transport films F2, the protrusion forming portion 63 is projected from the lower side to the upper side of the lower transport film F1, or the protrusion forming portion 63 is projected from the upper side to the lower side of the upper transport film F2. The protrusion forming portion 63 may be projected toward the protrusion to form the protrusion F4 which is a movement blocking portion. In any case, the protrusion F4 is formed from the side where the laminated molded product M of the transport films F1 and F2 is not present to the side where the laminated molded product M is present.

Next, the vacuum stacking system 71 of the third embodiment will be described with reference to FIG. In the third embodiment, the position and structure of the protrusion forming means 72 are different from those in the embodiment of FIG. 1, but the other configurations are the same as those of the present embodiment of FIG. 1, so the same reference numerals are used. Those explanations will be omitted. In the third embodiment, the protrusion forming stage S0 is provided in the pre-process of the supply stage S1. The protrusion forming means 72 is a pressurizing device that locally pressurizes the lower transport film F1, and a servomotor (not shown) having a roll 74 in which the protrusion forming portion 73 is formed below the lower transport film F1. It is formed to be rotatable by an electric motor such as. The position where the protrusion forming portion 73 on the outer periphery of the roll 74 is formed corresponds to the position where the protrusion F4 on the outer periphery of the mounting portion F3 of the laminated molded product M placed on the transport film F1 is formed. .. Further, a roll 75 in which an elastic body such as rubber or sponge is wound around the roll 74 is arranged above the roll 74 with the transport film F1 interposed therebetween. The motor is not essential for the upper roll 75, and the upper roll 75 itself is not essential when the protrusion forming means 72 is provided with the heating means. At the time of laminating molding, the roll 74 is rotated by the servomotor in synchronization with the feeding of the lower transport film F1, and the protrusion forming portion 73 of the roll 74 bites the lower transport film F1 and the upper roll 75. The protrusion F4 is formed from the lower side to the upper side by biting into. Also in the example of FIG. 4, when the laminated molded product M is changed, the roll is changed to a roll corresponding to the outer peripheral position of the laminated molded product M.

Next, the vacuum stacking system 81 of the fourth embodiment will be described with reference to FIG. In the fourth embodiment, the structure of the movement blocking portion forming means is different from that of the embodiment of FIG. 1, but since the other configurations are the same as those of the present embodiment of FIG. 1, they are used with the same reference numerals. The explanation is omitted. In the fourth embodiment, the movement blocking portion forming means is the protrusion adhering means 82 for adhering another member to the lower transport film F1. Here, at least a plurality of nozzles 83 for supplying another member for the protrusion are arranged around the suction cup 30a of the loading device 30 for the laminated molded product. An on-off valve (not shown) is provided in the pipe line 84 connected to the tank from the nozzle 83 (not shown). Alternatively, an extrusion cylinder may be used depending on the type of another member to be supplied. The position of the nozzle 83 and the position of the suction cup 30a can be adjusted according to the shape of the laminated molded product M, or the entire protrusion-attaching means 82 to which the nozzle 83 is fixedly provided can be replaced. ing. The carry-in device 30 and the protrusion attaching means 82 may be separate devices.

When the protrusion M2 is formed on the lower transport film F1, the nozzle 83 of the protrusion attachment means 82 is moved upward by several millimeters to several tens of millimeters of the protrusion formation position around the laminated molded product M. , An on-off valve or the like (not shown) is operated to supply another member onto the transport film F1 to form the protrusion M2 by adhesion. It is desirable that the separate member forming the protrusion M2 has a viscosity of a certain level or higher and does not cause stringing from the nozzle 83. Further, it is desirable that the separate member is quick-drying or quick-curing in relation to the molding cycle. As an example, as another member, a molten thermoplastic resin may be used, or a material containing an ultraviolet curing agent, which is subjected to ultraviolet curing after supply, or the like may be used. Although not limited to this, it is generally preferable to first supply another member from the nozzle 83 of the protrusion adhering means 82, wait for the protrusion F4 to cure, and then supply the laminated molded product M by the carry-in device 30. .. As a modification of the protrusion adhering means 82, a solid material having an adhesive layer on the lower surface side may be attached to the lower transport film F1 to form a protrusion (movement blocking portion).

Next, the vacuum stacking system 91 of the fifth embodiment will be described with reference to FIG. The fifth embodiment is different from the embodiment in FIG. 1 in that the movement blocking portion forming means is the temporary sticking means 92 and does not include the protrusion forming means, but the other configurations are the present embodiment of FIG. Since it is the same as the above, the same reference numerals are used and the description thereof will be omitted. In the fifth embodiment, the movement blocking portion forming means is the temporary sticking means 92 for temporarily sticking the upper transport film F2 and the lower transport film F1. The temporary sticking means 92 is provided on the sticking stage S3 provided between the supply stage S1 and the vacuum laminating device 12. Here, the temporary sticking means 92 includes a thermocompression bonding pin 93 having a built-in heater. The thermocompression bonding pin 93 is provided so as to be able to move up and down from above toward the upper transfer film F2 by an elevating device (not shown). Further, a pedestal 94 is provided below the lower transport film F1, and the pedestal may also be heated by a heater. Then, when the laminated molded product M is placed on the mounting portion F3 of the lower transport film F1 and is sent to the sticking stage S3 in a state where the upper transport film F2 is stacked and stopped, the thermocompression bonding pin 93 Is lowered, and the upper transport film F2 and the lower transport film in the peripheral portion of the laminated molded product M are melted and temporarily attached (bonded) between the pedestal 94 and the pedestal 94. The temporary attachment means 92 may be a laser irradiation device or the like.

Alternatively, in the previous step, an adhesive is placed around the laminated molded product M of the lower transport film F1, and the upper and lower transport films F1 and F2 are heated, pressured, and placed in a state where the upper transport films F2 are stacked. It may be adhered by ultraviolet rays or the like. Due to the formation of the movement blocking portion M3 by the temporary attachment, the laminated molded product M is not directly adhered to the upper and lower transport films F1 and F2, but does not cause misalignment. However, if the upper transfer film F2 and the lower transfer film F2 are temporarily bonded together too strongly, the upper transfer film F2 cannot be peeled off well after the laminated molding. Adhere slightly so that the position does not shift. In the examples of FIGS. 5 and 6, since the transport film F1 and the like do not have holes, there is no concern that the molten resin during laminating molding will flow out from the holes into the chamber.

In all of the embodiments of FIGS. 1, 3, 4, and 5, the positions where the protrusion forming means is provided are the stage before the supply stage S1, the supply stage S1, and the stage between the supply stage and the vacuum laminating device 12. Either may be used. However, if the protrusion forming means is provided in addition to the supply stage S1, the total length of the vacuum stacking system becomes long. Therefore, it is desirable to provide the protrusion forming means in the supply stage S1 in terms of shortening the total length of the device.

The vacuum laminating system 11 and the like of each of these embodiments may be provided with another pressurizing device in a post-process of the vacuum laminating device 12 and the like. The pressurizing device may be the same device as the vacuum laminating device 12 or the like, or may be a pressing device. In that case, the laminated molded product M sent to the pressurizing device along with the movement of the lower transport film F1 is also prevented from being displaced by the protrusions F4, M2 and the like which are movement blocking portions.

The transport films F1 and F2 used in the embodiments of FIGS. 1 to 6 are carrier films called PTH25. PTH25 is a film having a thickness of 25 μm formed from polyethylene terephthalate, and its surface is mud-treated (roughened). However, the present invention is applicable to all carrier films other than PTH25. The present invention can also be applied to a dry film having an adhesive film coated on a conveying film. Further, the transport films F1 and F2 may be different types of transport films, and the lower transport film F1 may be a film made of a material that easily forms the protrusions F4.

The position where the protrusion F4 is provided on the lower transport film F1 with respect to the end portion M1 of the laminated molded product M differs depending on the type of the laminated molded product M and the accuracy of the apparatus, and therefore cannot be unequivocally stated. That is, it is desirable that the protrusion F4 is provided at a position in contact with the end portion M1 of the laminated molded product M (the end portion of the mounting portion F3) at the time of transfer, but the protrusion forming means and the loading device 30 for the laminated molded product M are provided. , It is necessary to make the film transfer device highly accurate. Alternatively, the possibility of a placement error of the laminated molded product M or a formation error of the protrusion F4 increases. Further, in the case where the end portion M1 of the laminated molded product M is in a molten state during vacuum laminating molding, if a hole is opened in the protrusion F4 of the lower transport film F1, the molten resin enters through the hole and the diaphragm becomes dirty. Is also possible. The opposite can be said when the protrusion F4 is close to the end M1 of the laminated molded product M but there is a distance between them.

Further, when the laminated molded product M is, for example, donut-shaped and has a space on the central portion side or a concave portion on the back surface side, the position where the protrusion F4 is provided on the transport film F1 is the mounting portion F3 on which the laminated molded product M is placed. It may be located in contact with or close to the space on the center side of the space or the end of the recess. This includes the case where the protrusion F4 is provided at a position in contact with or close to the inner circumference of the mounting jig such as the wafer ring of Patent Document 2 described above. In these cases as well, it corresponds to forming the protrusion F4 at a position where the movement of the laminated molded product alone can be restricted.

In the present invention, the heights of the protrusions F4 and M2 differ depending on the laminated molded product M and cannot be unequivocally determined, but as an example, it is preferably 0.1 mm or more and less than or equal to the plate thickness of the laminated molded product M. Further, as shown in FIG. 2, the protrusions F4 and M2 are viewed in cross section, and the inclination angle of the wall portion F5 on the laminated molded product M side is set to the wall portion F6 on the side not facing the conveyed film F1 and the laminated molded product M. It is desirable to make it larger than the tilt angle. Alternatively, it is desirable to increase the tilt angles of all sides so that they are as close to vertical as possible. That is, if the inclination angle of the wall portion F5 is increased so as to be close to the vertical, the ability to lock the laminated molded product M is increased, and it is possible to prevent the laminated molded product M from moving over the protrusions F4 and M2. ..

Although the present invention is not listed one by one, it is not limited to the above-described embodiment, and those skilled in the art have been modified based on the gist of the present invention, and each part of the above-described embodiment is combined. It goes without saying that things also apply.

11,61,71,81,91 Vacuum stacking system 12 Vacuum stacking device 38 62,72 Projection forming means 39 Suction device 44,63,73 Projection forming part 82 Projection bonding means 92 Temporary pasting means C Chamber F1 lower side Conveying film F2 Upper transport film F3 Placement part F4, M2 Protrusion part M Laminated molded product

Claims (5)

In a vacuum laminating system in which a laminated molded product is transported into a chamber of a vacuum laminating device using a transport film for laminating molding.
Movement that prevents or restricts the movement of the laminated molded product to the conveyed film without adhering the mounted portion and the laminated molded product to a position that is in contact with or close to the periphery of the mounted portion on which the laminated molded product of the conveyed film is placed. A vacuum stacking system characterized in that a movement blocking portion forming means for forming a blocking portion is provided in a pre-process of a vacuum stacking device . The movement blocking portion forming means is characterized by being a protrusion forming means provided with a suction device for locally sucking the transport film or a protrusion forming means provided with a pressurizing device for locally pressurizing the transport film. The vacuum lamination system according to claim 1. The first aspect of the present invention is characterized in that the movement blocking portion forming means is a protrusion attaching means for attaching another member to the conveying film or a temporary attaching means for temporarily attaching the upper conveying film and the lower conveying film. Vacuum stacking system. In a vacuum laminating method in which a laminated molded product is transported into a chamber of a vacuum laminating device using a transport film for laminating molding.
Temporarily attach the upper transport film and the lower transport film at positions that are in contact with or close to the periphery of the laminated molded product without directly adhering the upper transport film and the lower transport film to the laminated molded product. The laminated molded product is horizontally prevented or restricted from moving with respect to the upper transport film and the lower transport film.
A vacuum laminating method comprising moving the upper transport film and the lower transport film to carry the laminated molded product into a vacuum laminating device. In a vacuum laminating method in which a laminated molded product is transported into a chamber using a transport film to perform laminating molding.
Before placing the laminated molded product on the transport film, or on the mounting stage where the laminated molded product is placed on the transport film, it comes into contact with or is close to the periphery of the mounting portion on which the laminated molded product of the transport film is placed. A vacuum laminating method comprising forming a movement blocking portion that prevents or restricts the movement of the laminated molded product with respect to the transport film without adhering the mounted portion to the laminated molded product at a position.

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