JP7610566B2 - Vacuum lamination system and vacuum lamination method - Google Patents

Description

The present invention relates to a vacuum lamination system and a vacuum lamination method that use a carrier film to transport a laminated molded product into the chamber of a vacuum lamination device and perform laminate molding.

In the case of a vacuum lamination system in which a transport film is used to transport a laminate molded product into the chamber of a vacuum lamination device for lamination molding, the laminate molded product on the transport film may become misaligned when, for example, vacuum suction is applied to the chamber. When such misalignment occurs, the laminate molded product that is pressure molded often has molding defects. The techniques described in Patent Documents 1 and 2 are known to address this problem.

Patent Document 1 describes a method of forming a protrusion on the conveying film or temporarily attaching upper and lower conveying films to form a movement prevention section to prevent the laminated molded product from shifting out of position. Patent Document 2 describes a method of temporarily attaching the ends of a pair of conveying films using a crimping mechanism to prevent the laminated molded product from shifting out of position.

JP 2020-29002 A JP 2020-44703 A

However, when forming a movement preventing portion on the conveying film around the portion on which the laminated molded product is placed or when temporarily bonding the upper and lower conveying films as in Patent Documents 1 and 2, the following problems arise. That is, when the movement preventing portion is formed at a sufficient distance from the outer periphery of the laminated molded product, the laminated molded product may be misaligned inside the movement preventing portion. Also, when the movement preventing portion is formed in the very vicinity of the outer periphery of the laminated molded product, the precision of the device for forming the movement preventing portion is required. Also, when the laminated molded product is placed on the conveying film with the movement preventing portion, the laminated molded product may be placed overlapping the movement preventing portion. Also, when the laminated molded product to be laminated in the vacuum lamination device is changed to a laminated molded product of a different size, the device for forming the movement preventing portion must be adjusted or changed, but such adjustments and changes are not easy.

In view of the above problems, the present invention aims to provide a vacuum lamination system or method that can relatively easily prevent the laminated molded product from shifting in position relative to the conveying film. Other problems and novel features will become apparent from the description of this specification and the accompanying drawings.

The vacuum lamination system according to one embodiment is a vacuum lamination system that uses a conveying film to convey a laminate molded product into the chamber of a vacuum lamination device and perform laminate molding, and is characterized in that the laminate molded product is conveyed using a conveying film that has an adhesive material attached to the portion that comes into contact with the laminate molded product.

The vacuum lamination system of the present invention is a vacuum lamination system that uses a conveying film to convey a laminate molded product into the chamber of a vacuum lamination device and perform laminate molding. The laminate molded product is conveyed using a conveying film that has an adhesive material attached to the part that comes into contact with the laminate molded product, so that it is relatively easy to prevent the laminate molded product from shifting in position relative to the conveying film.

FIG. 1 is a schematic explanatory diagram of a vacuum lamination system according to an embodiment of the present invention. 1A to 1C are diagrams illustrating an example of a transfer film used in the vacuum lamination system of the present embodiment. 3 is a cross-sectional view showing the AA section and the BB section of FIG. 2. FIG. 13 is a schematic diagram illustrating a vacuum lamination system according to a second embodiment.

The vacuum lamination system 11 of this embodiment will be described with reference to Fig. 1. The vacuum lamination system 11 of this embodiment transports the laminating material and the material to be laminated that constitute the laminated molded product M to a molding position in a chamber C of a vacuum lamination device 12 using transport films F1, F2, and laminates and molds the laminated product M at the molding position of the vacuum lamination device 12. When the upper plate 13 and the lower plate 14 of the vacuum lamination device 12 are closed, a chamber C that can be suctioned by vacuum is formed, and an elastic membrane body 15 (a diaphragm made of heat-resistant rubber such as silicone rubber) provided on at least one of the plates 13, 14 is expanded toward the other plate 14, 13 within the chamber C to pressurize and laminate the laminated product M.
<Structure of the vacuum lamination device of the vacuum lamination molding system>

More specifically, in the vacuum lamination device 12, the lower platen 14 faces the upper platen 13. The lower platen 14 can be moved toward or away from the upper platen 13 by a lifting device (not shown). When the lower platen 14 rises relative to the upper platen 13 and the space between the upper platen 13 and the lower platen 14 is closed, a chamber C of a predetermined volume is formed between the two plates that can be evacuated by the vacuum pump 16. A heatable hot platen 17 is attached to the center of the lower surface of the upper platen 13. An elastic membrane 26 made of heat-resistant rubber such as a silicone rubber membrane is attached to the entire lower surface of the hot platen 17 of the upper platen 13. A side wall 25 is provided around the periphery of the lower surface of the upper platen 13 in a position facing the side wall 19 on the lower platen 14 side.

Meanwhile, a heatable hot plate 18 is also attached to the center of the upper surface of the lower platen 14. A frame-shaped side wall portion 19 is attached to the peripheral portion of the upper surface of the lower platen 14. An elastic membrane 15 (diaphragm) is attached between the lower surface of the side wall portion 19 and the lower platen 14, covering the upper surface of the hot plate 18. The molding position in the center of the chamber C can be pressurized with uniform pressure by the elastic membrane 15, but the end of the chamber C may not be pressurized with uniform pressure. An O-ring 45 is attached to the upper surface of the side wall portion 19 (the surface facing the upper platen 13) so as to surround the chamber C. The portion between one side portion of the side wall portion 25 of the upper platen 13 (the previous process side, the right side in Figure 1) and one side portion of the side wall portion 19 of the lower platen 14 is an entrance 27 through which the laminated molding M is carried in together with the conveying films F1 and F2. In addition, the area between the other side of the side wall 25 of the upper platen 13 and the other side of the side wall 19 of the lower platen 14 (the post-process side, which is the left side in FIG. 1) is the discharge opening 28 through which the laminated product M that has been pressure-molded is discharged together with the transport films F1 and F2.

A pipe 20 is connected to the hot plate 18 or its periphery below the elastic membrane 15, and the pipe 20 is connected to a compressor 22 for pressurization via an on-off valve 21. A pipe 23 branched from the part of the pipe 20 between the on-off valve and the compressor 22 is connected to a vacuum pump 16 via an on-off valve 24. Therefore, the lower part of the elastic membrane 15 can be connected to both the vacuum pump 16 for depressurization and the compressor 22 for pressurization by controlling the on-off valves 21 and 24. When the pipe on the back side of the elastic membrane 15 is connected to the vacuum pump 16, the elastic membrane 15 is in close contact with the hot plate 18, and when connected to the compressor 22, the elastic membrane 15 is expanded into the chamber C. The elastic membrane 15 and the compressor 22 constitute the pressurization means of the vacuum lamination device 12.

The pipe 29 connected to the vacuum pump 16 is connected to the chamber C formed between the upper platen 13 and the lower platen 14 via an opening/closing valve 30 provided at the end where the pipe 23 branches off. More specifically, the pipe 29 is connected to a pipe 31 connected to the upper platen 13, and the air in the chamber C can be sucked in approximately evenly from a suction port 46 between the entire periphery of the heat platen 17 and the side wall portion 25.

The vacuum lamination device 12 is not limited to the above, so long as it can perform pressure molding of the laminated molded product M at a molding position in the chamber C that can suction vacuum. As an example, the molded product may be laminated in the chamber of the vacuum lamination device using a pressure means that uses a combination of an elastic flat plate other than a diaphragm and a pressure cylinder. Alternatively, the laminated molded product M may be laminated through the transport films F1, F2 using a pressure means that applies pressure only by air pressure (including a relative pressure difference).
<Laminated product conveying mechanism of vacuum laminated molding system>

Next, the upper and lower conveying films F1, F2 of the vacuum lamination system 11 and the conveying mechanism 32 of the laminated molded product M will be described. The conveying mechanism 32 of the vacuum lamination system 11 is provided with a lower conveying film F1 unwinding roll 33 for conveying the laminated molded product M to the vacuum lamination device 12 below one side (the front process side, the right side in FIG. 1) of the vacuum lamination device 12. The unwinding roll 33 is driven and controlled by a servo motor (not shown). The lower conveying film F1 set on the unwinding roll 33 and unwound from the unwinding roll 33 has its transport direction changed horizontally by a rotatable driven roll 34. In addition, a winding roll 35 for the lower conveying film F1 is provided below the other side of the vacuum lamination device 12. The winding roll 35 is driven and controlled by a servo motor (not shown). The lower conveying film F1 coming out of the discharge port 28 of the vacuum lamination device 12 has its direction changed by a rotatable driven roll 36 and is wound up by the lower winding roll 35.

A rotatable peeling driven roll 37 is provided between the unwinding roll 33 and the driven roll 34, and only the peeling film F1c of the transport film F1 is peeled off by this peeling driven roll 37. The peeling film F1c is then taken up by a take-up roll 38 for the peeling film F1c. In this embodiment, the take-up roll 38 is in contact with the unwinding roll 33 by its own weight, and is rotated in a driven state together with the rotation of the unwinding roll 33. The take-up roll 38 may be rotated by a motor.

The supply stage S1 for the laminated molded product M is provided in the area where the lower conveying film F1 is fed horizontally. In this embodiment, the laminated molded product M is placed on the lower conveying film F1 in the supply stage S1 by a carry-in device 39 equipped with a holder such as a suction device. At this time, the laminated molded product M may be one in which the substrate or semiconductor to be molded and the film serving as the laminate material are set from the beginning, or one which is laminated in the supply stage S1.

On one side of the vacuum lamination device 12, above the area between the vacuum lamination device 12 and the supply stage S1, a winding roll 40 for the upper transport film F2 is provided. The winding roll 40 is also driven and controlled by a servo motor (not shown). The upper transport film F1, which is set on the winding roll 40 and unwound from the winding roll 40, is overlapped with the lower transport film F1 by a rotatable driven roll 41, and the transport direction is changed horizontally. The upper and lower transport films F1, F2 are fed into the chamber C from the entrance 27 of the vacuum lamination device 12 with the laminated molded product M sandwiched between them.

A take-up roll 42 for the upper transport film F2 is provided above the other side of the vacuum lamination device 12. The take-up roll 42 is driven and controlled by a servo motor (not shown). The upper transport film F2 emerging from the discharge port 28 of the vacuum lamination device 12 is peeled off from the lower transport film F1 by a rotatable driven roll 43, transported upward, and taken up by the upper take-up roll 42. Note that the upper transport film F2 is not essential to the present invention, and the purpose of preventing the molten resin from adhering to the vacuum lamination device 12 can also be achieved by covering the laminated molded product M with a cover film having a larger area than the laminated molded product M.

Then, at the position where the lower transport film F1 is transported horizontally after passing through the entrance 27, chamber C, and exit 28 of the vacuum lamination device 12 and the upper transport film F2 is removed, there is provided an unloading stage S2 for removing the completed laminated molded product M to the outside. Above the unloading stage S2, there is provided an unloading device 44 equipped with a suction device, and the laminated molded product M is removed for the subsequent process. The lower transport film F1 is then redirected by the driven roll 36 as described above and taken up by the take-up roll 35.

The unwinding rolls 33, 40 and the winding rolls 35, 42 of the conveying mechanism 32 are not limited to those driven by a servo motor, and may be other electric motors. Also, a servo motor may be used only for driving the winding rolls 35, 42, and a torque motor or the like may be used for the unwinding rolls 33, 40 that apply tension in the opposite direction. Furthermore, a part of the conveying mechanism 32 may be a film transport device that grips the sides of the conveying films F1, F2 and moves them from right to left in FIG. 1 to accurately move the conveying films F1, F2 horizontally by one pitch, and in that case, the winding rolls 35, 42 may not use a servo motor. Also, one or two flattening press devices for the purpose of further flattening the surface of the laminated molded product M may be installed in a process downstream of the vacuum lamination device 12.
<Transport film used in vacuum lamination molding systems>

The transport film F1 used in the vacuum lamination system and vacuum lamination method of this embodiment is also called a carrier film, and has an adhesive material attached to the portion that contacts the laminated molded product M. Specifically, the transport film F1 has a core film F1a made of a thermoplastic resin such as polyethylene terephthalate or polyethylene. The core film F1a is also called a base film, and is preferably made of a thermoplastic resin such as those mentioned above due to cost considerations. The core film F1a is not limited to a single layer, and may have other resin layers such as a fluorine resin coating layer. The thickness of the core film F1a is not limited to this, but is preferably 0.05 mm to 0.30 mm, for example.

A layer of adhesive material F1b mainly made of silicone is attached to one side of the core film F1a of the conveying film F1. Here, the "adhesive material mainly made of silicone" refers to silicone rubber and silicone resin with various additives added. In the following specification, the "adhesive material mainly made of silicone" is referred to as the silicone-based adhesive material F1b. The silicone-based adhesive material F1b is also generally referred to as a silicone adhesive. The compounding ratio of silicone rubber in the silicone-based adhesive material F1b is, for example, 30 to 80% by weight, but is not limited thereto. The adhesive material usable in the present invention may be a urethane-based adhesive material, an acrylic-based adhesive material, or a fluorine-based adhesive material other than silicone rubber, or a combination of these materials. The thickness of the layered adhesive material F1b is, for example, 0.005 mm to 0.080 mm, but is not limited thereto, and more preferably 0.018 mm to 0.050 mm. The adhesive strength of the silicone-based adhesive material F1b of this embodiment is determined by the crosslinking method of the silicone rubber and the adjustment of the compounding ratio of the silicone rubber and the silicone resin, but it is preferable that the adhesive strength is weak. More specifically, but not limited to, as an example, the adhesive strength to a smooth glass surface is preferably 0.1 gf25 mm to 10.0 gf25 mm, and even more preferably 0.5 gf25 mm to 5.0 gf25 mm.

A release film made of a thermoplastic resin such as polyethylene terephthalate or polyethylene is disposed on one side of the layer of the silicone adhesive material F1b (the side opposite to the side on which the silicone adhesive material F1b and the core film F1a are attached). Although the release film is not essential in the present invention, when the film roll F1d is unwound,
As described above, the transport film F1 is a laminate of the core film F1a, the silicone-based adhesive material F1b attached to the core film F1a, and the release film F1c, and is set on the unwinding roll 33 of the transport mechanism 32 in the form of a film roll F1d wound up to a length of 1,000 m, although this is not limited thereto.
<Form of adhesive material of transport film>

As shown in FIG. 2(a) and FIG. 3(a), the conveying film F1 of this embodiment has a silicone-based adhesive material F1b attached in a layer of approximately uniform thickness over the entire surface of the core film F1a, and the surface is a smooth surface. However, as shown in FIG. 2(b), the silicone-based adhesive material F1b may be attached in a layer over the entire surface, and the layered portion may further have a lattice-shaped protrusion of the silicone-based adhesive material F1b. As shown in FIG. 2(c), the silicone-based adhesive material F1b may be attached over the entire surface, and a large number of circular or polygonal protrusions of the silicone-based adhesive material F1b may be formed to provide an embossed surface. As shown in FIG. 2(d), the silicone-based adhesive material F1b may not be attached to the portions on both sides where the laminated molded product M is not placed or abutted, and the silicone-based adhesive material F1b with a smooth layer or embossed surface may be attached only to the portion where the laminated molded product M is placed or abutted on the center side. The surface roughness of the silicone-based adhesive material F1b may be adjusted appropriately. FIG. 3(a) shows the A-A cross section of FIG. 2(a), in which the back surface M1 of the laminated molded product M, such as a semiconductor wafer, and the surface of the silicone-based adhesive material F1b are in almost intimate contact with each other.

The conveying film F1 may also have a silicone-based adhesive material F1b attached to a portion of the surface of the core film f1a, as shown in Figures 2(e), (f), (g), (h), and 3(e). In Figure 2(e), protrusions of the silicone-based adhesive material F1b are formed in a linear shape. The direction in which the convex stripes of the silicone-based adhesive material F1b are formed may be the same as the conveying direction of the conveying film F1 or the other direction. In Figure 2(f), protrusions of the silicone-based adhesive material F1b are formed in a lattice shape on the core film F1a. Furthermore, in Figure 2(g), the core film F1a has an embossed surface on which a large number of protrusions of the silicone-based adhesive material F1b, such as circles and polygons, are formed on the core film F1a. In Figure 2(h), the silicone-based adhesive material F1b is randomly attached to the core film F1a. In each of the above examples, the surface roughness of the silicone-based adhesive material F1b is appropriately adjusted. In these Figures 2(e), (f), (g), and (h), a part of the core film F1a, such as polyethylene terephthalate, is exposed on the surface. Therefore, the carrier films F1 in Figures 2(e), (f), (g), and (h) may be able to reduce the amount of silicone-based adhesive material F1b used. Figure 3(e) shows the B-B cross section of Figure 2(e), in which the back surface M1 of the laminated molded product M, such as a semiconductor wafer, placed on the substrate is supported only by the protruding part of the silicone-based adhesive material F1b, and a gap D is formed between the back surface M1 other than the supported part and the surface of the core film F1a.

Including Figures 2(b) and (c), if a gap D is formed between the back surface M1 of the laminated product M and the surface of the core film F1a, the release between the conveying film F1 and the laminated product M is often good when the laminated product M is removed after being laminated in the vacuum lamination device 12. However, depending on the material of the laminated product M and the hardness of the adhesive material, if the gap D is large, only the protruding parts of the silicone-based adhesive material F1b may be strongly pressurized during lamination, resulting in uneven pressure, so the optimal conveying film F1 is selected according to the laminated product M. Similarly, the optimal relationship between the adhesive strength of the silicone-based adhesive material F1b itself, the surface roughness, and the releasability are also selected.

The transport film F1 to which the adhesive material (silicone-based adhesive material F1b) mainly composed of silicone rubber of the present invention is attached is more expensive than the commonly available transport film made only of polyethylene terephthalate, so in the present invention, it is used only for the lower transport film F1 on which the laminated molded product M is placed. And the upper transport film F2 is a transport film F2 made only of general polyethylene terephthalate. This is because the lower transport film F1 is subjected to the weight of the laminated molded product M, and the friction coefficient between the upper surface of the transport film F1 and the lower back surface M1 of the laminated molded product M has the greatest effect on the positional deviation of the laminated molded product M.

However, depending on the type of laminated molded product M, a carrier film with a silicone-based adhesive material F1b attached to the upper and lower carrier films F1, F2 may be used. When a carrier film with a silicone-based adhesive material F1b attached to the upper carrier film F2 is used, the silicone-based adhesive material F1b is attached to the surface that will be the lower side of the core film during horizontal transport, and the silicone-based adhesive material F1b is used in contact with the laminated molded product M. Alternatively, depending on the laminated molded product M, a carrier film with a silicone-based adhesive material F1b attached to only the upper carrier film F2 may be used, and the carrier film with a silicone-based adhesive material F1b attached to at least one of the upper and lower carrier films F1, F2 may be used.
<Vacuum Lamination Method for Vacuum Lamination Molding System>

Next, the vacuum lamination method of the vacuum lamination system 11 of this embodiment will be described with reference to FIG. 1. Before lamination molding is started, the transport film F1 to which the silicone-based adhesive material F1b is attached is set so that the film roll F1d is set on the unwinding roll 33 of the transport mechanism 32, and is unwound from the unwinding roll 33 and wound around the take-up roll 35 via the vacuum lamination device 12. Then, only the release film F1c of the transport film F1 unwound from the unwinding roll 33 is separated from the layer of the core film F1a and the silicone-based adhesive material F1b at the peeling driven roll 37, folded back, and wound around the release film take-up roll 38. The upper transport film F2 is also set so that the film roll F2a is set on the unwinding roll 40, and is unwound from the unwinding roll 40 and wound around the take-up roll 42 via the vacuum lamination device 12.

Then, the remaining transport film F1 from which the release film F1c has been peeled off is folded back at the driven roll 34 and moved to the loading stage S1 in a state in which a layer of silicone-based adhesive material F1b is laminated on the core film F1a. At the loading stage S1, a laminated molded product M is placed on the layer of silicone-based adhesive material F1b using a loading device 39. The laminated molded product M to be laminated and molded in this embodiment is not particularly limited, but is targeted to those that are prone to misalignment during transportation or vacuum suction in the chamber C of the vacuum lamination device 12. Therefore, laminated molded products that are lightweight or have a smooth back surface with a small coefficient of friction are targeted. In particular, in the case of wafers, those with an average back surface roughness Ra of 0.2 um or less are targeted because they are slippery. In addition, there is no limit to the number of laminated molded products that can be laminated at one time, but when a large number of products (for example, nine or more) are molded simultaneously in the vacuum lamination device 12, or when small amounts of laminated molded products of different sizes are molded sequentially in the vacuum lamination device 12, adjustments are difficult when using devices such as those described in Patent Document 1 and Patent Document 2 above, so it is effective to use the transport film F1 of the present invention.

When the previous laminate molding is completed in the vacuum lamination device 12, the lower platen 14 is lowered and the chamber C is opened. Next, the servo motor (not shown) of the winding roll 35 of the lower conveying film F1 of the conveying mechanism 32 is driven, and the lower conveying film F1 is unwound from the film roll F1d and pulled and moved toward the other side (the later process side, the left side in FIG. 1). Accordingly, the laminate molding M placed on the supply stage S1 is conveyed toward the chamber C of the vacuum lamination device 12 together with the lower conveying film F1. At this time, the servo motor of the winding roll 42 of the upper conveying film F2 is also driven, and the upper conveying film F2 is unwound from the film roll F2a and pulled and moved toward the other side. Then, from the driven roll 41, the upper conveying film F2 is superimposed on the laminate molding M on the lower conveying film F1, and the upper and lower conveying films F1 and F2 are conveyed together with the laminate molding M toward the entrance 27 of the vacuum lamination device 12 at the same speed. At this time, it is desirable to apply torque to the unwinding roll 33 of the lower transport film F1 and the unwinding roll 40 of the upper transport film F2 by a servo motor in the direction of winding the transport films F1, F2 onto the film rolls F1d, F2a, so that the upper and lower transport films F1, F2 are kept under tension.

Then, the upper and lower transport films F1, F2 are moved by one pitch, and when the laminated molded product M is transported to the molding position in chamber C of the vacuum lamination device 12, transport by the upper and lower transport films F1, F2 is stopped. At this time, even if a forward inertial force acts on the laminated molded product M due to the shock caused by the stopping of the lower transport film F1, at least a part of the part of the upper surface of the transport film F1 that abuts against the laminated molded product M is made of a silicone-based adhesive material F1b, which has an adhesive effect on the back surface M1 of the laminated molded product M, so that the laminated molded product M is prevented from shifting in position.

When the laminated molded product M is set at the molding position, the lower platen 14 is raised by the operation of a lifting device (not shown) to form a chamber C between the lower platen 14 and the upper platen 13. Then, the opening and closing valves 24 and 30 are controlled, and the atmosphere in the chamber C is sucked by the vacuum pump 16 to reduce the pressure (vacuum) to a predetermined level. At this time, in the case of a conventional conveying film made only of polyethylene terephthalate, the laminated molded product M may move unexpectedly from the initial molding position to another position due to the air flow generated in the chamber C and the vibration of the conveying films F1 and F2 associated with the air flow, causing a "displacement". However, in the present invention, at least a part of the part of the upper surface of the lower conveying film F1 that abuts against the laminated molded product M is made of a silicone-based adhesive material F1b, so that the displacement is prevented even if an air flow or vibration of the conveying films F1 and F2 occurs in the chamber C. Similarly, the displacement of the laminated molded product M due to the expansion of the elastic membrane body 15 when pressurized is also prevented.

In the vacuum lamination device 12, the temperature of the hot plates 17 and 18 is set to 100°C to 180°C, for example, and compressed air is sent from the compressor 22 to the back side of the elastic membrane 15 through the pipe 20 to expand the elastic membrane 15, and the laminated molded product M is pressurized and molded for a predetermined time through the conveying films F1 and F2. However, the heat resistance temperature of silicone rubber is higher than the temperature of the hot plates 17 and 18, so the silicone adhesive material F1b of the conveying film F1 does not deteriorate and adversely affect the laminated molding. When the pressurized molding is completed, the vacuum in the chamber C is broken, and then the lower platen 14 is lowered to open the chamber C. Then, the upper and lower conveying films F1 and F2 and the laminated molded product M are sent to the other side from the discharge port 28 of the vacuum lamination device 12 by driving the winding rolls 35 and 42 of the upper and lower conveying films F1 and F2. Then, the upper transport film F2 is peeled off at the driven roll 34, and the lower transport film F1 and the laminated molding M are sent to the removal stage S2 and stopped.

Then, the laminated molded product M is removed by the discharge device 44. At this time, the silicone-based adhesive material F1b attached to the core film F1a of the transport film F1 is slightly adhesive and has an optimal peeling force (adhesive force) for releasing the laminated molded product M, and since the core film F1a of the transport film F1 and the laminated molded product M are not firmly bonded, good release is possible without damaging the laminated molded product M. Paradoxically speaking, an adhesive material with the optimal type, shape, thickness, etc. is selected and used for the transport film F1 based on the balance of the performance of preventing the laminated molded product M from shifting, the laminated molding performance, and the release performance.

In relation to the above, the conveying film F1 in which the silicone-based adhesive material F1b of this embodiment is attached in a layer on the entire pressure surface may be effective not only in preventing the positional deviation of the laminated molded product M, but also in molding the laminated molded product M. Specifically, the hardness of the silicone-based adhesive material F1b (JIS-K 6353 durometer type A hardness) can be selected between 15 and 80, but is not limited thereto. Therefore, when the A hardness is low, it may contribute to improving the embedding property of the molten resin film in the recess on the substrate or wafer side of the laminated molded product M. This is particularly effective when the recess or groove of the substrate or wafer is narrow or deep. And when the silicone-based adhesive material F1b is attached in a layer on the lower conveying film F1 only, pressure molding is performed with the side of the substrate or wafer with the recess or groove facing the conveying film F1 toward the lower surface. Also, when the recess or groove is present on both sides of the substrate or the like, the embedding property may be improved by using conveying films with a silicone-based adhesive material such as a silicone rubber layer on the upper and lower conveying films F1 and F2.

Next, the vacuum lamination system 51 of the second embodiment will be described with reference to FIG. 4, focusing on the differences from the present embodiment of FIG. 1. However, the same parts as those in FIG. 1 will be given the same reference numerals and the description will be omitted. In the second embodiment, the upper and lower transport films F1, F2 are transport films made only of general polyethylene terephthalate or the like. An adhesive material such as a silicone-based adhesive material F1b is applied by an adhesive applicator 52 of the vacuum lamination system 51 to the surface of the transport film F1, which corresponds to the core film F1a unwound from the unwinding roll 33 of the transport mechanism 32 of the laminated product, that comes into contact with the laminated product M. The type of adhesive applicator 52 is not limited, and an appropriate one can be selected from various types such as a die coater or a roll type.

The adhesive material such as silicone-based adhesive material F1b may be applied to the entire surface of the transport film F1, which is made of polyethylene terephthalate or the like, as shown in each example in FIG. 2, or may be applied partially. The transport film F1 coated with the adhesive material is moved to the mounting stage S1 for the laminated product M after going through the number of pitches (number of lamination moldings) required for drying. In the second embodiment, the time required for lamination molding in the vacuum lamination device 12 (including the time to evacuate the chamber C) is about 1 minute, and the adhesive material is dried in about 2 minutes for two pitches. If necessary, a heating and drying device 53 for the adhesive material may be placed at a position opposite the transport path of the transport film F1 to promote drying of the adhesive material.

According to the second embodiment, the cost of the vacuum lamination system 51 itself, including the adhesive application device 52, increases, but because it is possible to use a common transport film such as inexpensive polyethylene terephthalate, it is often possible to reduce running costs even if a separate adhesive material is prepared and applied.

Although we will not list each of the embodiments, it goes without saying that the present invention is not limited to the above-described embodiment, but also applies to modifications made by those skilled in the art based on the spirit of the present invention, and to combinations of parts of the above-described embodiments.

11, 51 Vacuum lamination system 12 Vacuum lamination device 32 Conveying mechanism C Chamber F1 Lower conveying film F1a Core film F1b Silicone adhesive material F1c Release film F2 Upper conveying film M Laminated product

Claims (14)

A vacuum lamination system that conveys a laminated molded product by a conveying film and performs lamination molding,
A vacuum lamination device for laminating the laminated molded product;
A conveying mechanism for conveying the laminated molded product;
a peeling roll for peeling off the release film from the conveying film, the release film being attached via an adhesive material provided on a portion of the core film where the laminated product contacts ,
A vacuum lamination system in which the laminated product is carried into and carried out from the vacuum lamination device while being held by the core film by the adhesive force of the adhesive material. The vacuum lamination system of claim 1 further comprising a release film take-up roll for taking up the release film after peeling. The vacuum lamination system of claim 1, wherein the adhesive material is primarily silicone. The vacuum lamination system of claim 1, wherein the release film is made of a thermoplastic resin. The transport mechanism includes:
a winding roll for feeding the laminated product into the vacuum lamination device;
a take-up roll for carrying the laminate out of the vacuum lamination device;
10. The vacuum lamination system of claim 1, comprising: A vacuum lamination system for laminating a laminate by conveying the laminated molded product using a conveying film,
A vacuum lamination device for laminating the laminated molded product;
A conveying mechanism for conveying the laminated molded product;
an adhesive applicator that applies an adhesive material to a portion of the conveying film that contacts the laminated product ;
A vacuum lamination system in which the laminated product is carried into and carried out from the vacuum lamination device while being held on the carrier film by the adhesive force of the adhesive material. The vacuum lamination system of claim 6, wherein the adhesive material is primarily silicone. The transport mechanism includes:
a winding roll for feeding the laminated product into the vacuum lamination device;
a take-up roll for carrying the laminate out of the vacuum lamination device;
7. The vacuum lamination system of claim 6, comprising: A vacuum lamination method in a vacuum lamination system in which a laminated molding is transported by a transport film and laminated, comprising:
a film peeling step of peeling the release film from a first conveying film including a core film and a release film attached via an adhesive material provided on a portion of the core film where the laminated molding contacts ;
a step of placing the laminate on a portion of the core film on which the adhesive material is provided ;
a carrying-in step of carrying the laminate molded product into a vacuum lamination device in a state in which the laminate molded product is held on the core film by the adhesive force of the adhesive material after the placing step;
a pressurizing step of pressurizing the laminated molded product in a vacuum after the carrying-in step;
a carrying-out step of carrying out the laminated molding from the vacuum lamination device in a state where the laminated molding is held on the core film by the adhesive force of the adhesive material after the pressurizing step;
A vacuum lamination method comprising: The vacuum lamination method according to claim 9, wherein in the pressurizing step, the laminate is transported into the vacuum lamination device while being sandwiched between a second transport film and the core film. The vacuum lamination method according to claim 9, wherein the adhesive material is primarily composed of silicone. The vacuum lamination method according to claim 9, wherein the release film is made of a thermoplastic resin. A vacuum lamination method in a vacuum lamination system in which a laminated molding is transported by a transport film and laminated, comprising:
a coating step of coating an adhesive material on a portion of the conveying film that contacts the laminated product ;
a placing step of placing the laminate on a portion of the conveying film on which the adhesive material is provided ;
a carrying step of carrying the laminate molded product into a vacuum lamination device while the laminate molded product is held on the conveying film by the adhesive force of the adhesive material after the placing step;
a pressurizing step of pressurizing the laminated molded product in a vacuum after the carrying-in step;
a carrying-out step of carrying out the laminated molded product from the vacuum lamination device in a state in which the laminated molded product is held on the conveying film by the adhesive force of the adhesive material after the pressurizing step;
A vacuum lamination method comprising: The vacuum lamination method according to claim 13, wherein the adhesive material is primarily composed of silicone.

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