JP7044745B2 - Mounting device - Google Patents

Description

The present invention relates to a mounting device.

Conventionally, in a mounting device for mounting a component on a substrate, a device for determining whether or not a component is adsorbed to a suction nozzle is known. For example, Patent Document 1 describes an electronic component mounting device that performs the following processing. First, the voice coil motor lowers the suction nozzle by a predetermined distance and then operates the vacuum generator to suck the component to the tip of the suction nozzle. Subsequently, the suction nozzle is further lowered, and it is determined whether or not the current value of the voice coil motor at this time exceeds a predetermined current. When the suction nozzle is sucking the component, if the suction nozzle is further lowered, the load increases and the current value of the voice coil motor increases. Therefore, the presence or absence of suction of the component can be determined based on this current value. .. As a result, it is said that the determination can be made more quickly and accurately than in the case of determining the presence or absence of adsorption of a component by using a pressure sensor attached to the air path of the vacuum generator.

Japanese Unexamined Patent Publication No. 10-163686

However, in the electronic component mounting device described in Patent Document 1, although it is possible to detect that the suction nozzle does not suck the component, the detection of other abnormalities is not considered. For example, the detection when a foreign substance other than the object to be adsorbed is adsorbed when the suction nozzle is lowered is not considered. Further, the detection of an abnormality when mounting a component on the board, for example, when there is a foreign substance on the board, is not considered.

The present invention has been made to solve such a problem, and an object of the present invention is to detect a foreign substance when the holding member is lowered.

The present invention has taken the following measures to achieve the above-mentioned main object.

The mounting device of the present invention is
A mounting head that has a holding member that collects and holds the parts and mounts the held parts on the board.
An elevating part that raises and lowers the holding member,
A contact detection unit that detects that the holding member has come into contact with another object,
An abnormality determination unit that performs determination processing to determine an abnormality when the contact detection unit detects the contact at least at least one of the timings above the normal contact height when the holding member is lowered or earlier than the normal contact timing. When,
It is equipped with.

This mounting device detects that the holding member has come into contact with another object when the holding member is lowered. Then, when contact is detected at least one of the timings above the normal contact height during descent or earlier than the normal contact timing during descent, it is determined to be abnormal. This makes it possible to detect foreign matter when the holding member is lowered. The "foreign matter" includes objects other than the parts to be held, and parts to be held but whose holding posture is abnormal. Further, "the holding member comes into contact with another object" includes a case where the holding member comes into direct contact with another object and a case where the holding member comes into indirect contact with another object. Examples of the case where the holding member indirectly contacts another object include a case where a foreign substance adhered to the holding member or a component held by the holding member comes into contact with another object.

In the mounting device of the present invention, the abnormality determination unit may perform the determination process with respect to the contact when the holding member lowers when the holding member collects a component. In this way, the holding member can detect foreign matter when collecting parts.

In this case, the mounting device of the present invention has the same type as the most recent mounting target by the holding member when the abnormality determining unit determines that the abnormality is abnormal in the determination process when the holding member collects parts. The mounting head and the mounting control unit that controls the elevating unit may be provided so that the component can be mounted at the mounting position of the nearest mounting target. Here, if a foreign substance is detected when the holding member collects a component, the holding member may remain adsorbing the previous component to be mounted. That is, there is a possibility that a phenomenon that the component does not separate from the holding member (so-called take-out phenomenon) occurs after the component is arranged on the substrate. In such a case, by mounting a component of the same type as the latest mounting target at the mounting position of the mounting target, it is possible to appropriately mount the component that was not mounted due to the take-out phenomenon on the board. .. That is, it is possible to recover the take-out phenomenon.

In the mounting device of the present invention, the abnormality determination unit may perform the determination process with respect to the contact of the holding member when the holding member holding the component is mounted on the substrate when the holding member is lowered. .. In this way, it is possible to detect foreign matter when mounting the component on the board.

In the mounting device of the present invention, the contact detection unit may be a load sensor that detects a load applied to the holding member from below when the holding member is lowered. In this way, it is possible to appropriately detect that the holding member has come into contact with another object based on the load applied to the holding member.

Schematic diagram showing an example of a mounting system 10. Explanatory drawing which shows the structure of a mounting head 22. The block diagram which shows the structure of the mounting apparatus 11. A flowchart showing an example of an implementation processing routine. A flowchart showing an example of a contact height acquisition processing routine. An explanatory diagram showing an example of measuring the contact height. Explanatory drawing which shows an example of measuring contact height H2. FIG. 3 is a partial cross-sectional view showing an example of a mounting head 22A of a modified example. FIG. 8 is a sectional view taken along the line CC of FIG.

Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic explanatory view showing an example of a mounting system 10. FIG. 2 is an explanatory diagram showing the configuration of the mounting head 22. FIG. 3 is a block diagram showing the configuration of the mounting device 11. The mounting system 10 is, for example, a system that executes a process of mounting the component P on the board S. The mounting system 10 includes a mounting device 11 and a management computer 50. In the mounting system 10, a plurality of mounting devices 11 for performing a mounting process for mounting the component P on the substrate S are arranged from upstream to downstream. In FIG. 1, only one mounting device 11 is shown for convenience of explanation. Further, in the present embodiment, the left-right direction (X-axis), the front-back direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIG.

As shown in FIGS. 1 to 3, the mounting device 11 includes a board transfer unit 12, a mounting unit 13, a component supply unit 14, an image pickup unit 16, and a control device 40. The board transfer unit 12 is a unit for carrying in, transporting, fixing at a mounting position, and carrying out the board S. The substrate transfer unit 12 has a pair of conveyor belts that are provided at intervals in the front and rear of FIG. 1 and are bridged in the left-right direction. The substrate S is conveyed by this conveyor belt.

The mounting unit 13 collects the component P from the component supply unit 14 and arranges the component P on the substrate S fixed to the substrate transfer unit 12. The mounting unit 13 includes a head moving unit 20, a mounting head 22, and a suction nozzle 28. The head moving unit 20 includes a slider that is guided by a guide rail and moves in the XY direction, and a motor that drives the slider. The mounting head 22 is detachably mounted on the slider and is moved in the XY direction by the head moving portion 20. One suction nozzle 28 is detachably mounted on the lower surface of the mounting head 22. As shown in FIG. 2, the mounting head 22 is provided with one or more syringe members 25 having a long cylindrical shape so as to be rotatable and vertically movable about a central axis. A suction nozzle 28 is detachably attached to the lower end of the syringe member 25. A gear 26 is arranged at the upper end of the syringe member 25. The mounting head 22 is provided with a Q-axis motor 23 having a gear 24. In the Q-axis motor 23, the gear 24 meshes with the gear 26, and the syringe member 25 is axially rotated via the gear 26 to adjust the angle of the component P sucked by the suction nozzle 28.

The suction nozzle 28 is a collection member that uses pressure to suck the component P to the tip of the nozzle and release the component P sucked to the tip of the nozzle. The suction nozzle 28 has a disk-shaped flange 29 and a tubular portion 19 formed on the tip end side (see FIG. 2). The tubular portion 19 is slidably arranged in the main body of the suction nozzle 28 in the Z-axis direction (vertical direction). In the mounting head 22, the syringe member 25 and the suction nozzle 28 are moved up and down in the Z-axis direction at one elevating position located on the tip side of the mounting head 22 in the Y-axis direction. The holding member for collecting and holding the component P is described here as the suction nozzle 28, but is not particularly limited as long as the component P can be collected and held, and the mechanical chuck for sandwiching and collecting the component P is used. And so on.

As shown in FIG. 2, the mounting head 22 includes a first elevating drive unit 30 and a second elevating drive unit 34, and the first elevating drive unit 30 and the second elevating drive unit 34 provide a Z-axis. The height of the suction nozzle 28 is adjusted along the line. The first elevating drive unit 30 raises and lowers the entire syringe member 25 to which the suction nozzle 28 for collecting the component P is attached. The first elevating drive unit 30 includes a first linear motor 31 and a first support member 32. The first linear motor 31 moves the first support member 32 up and down within a relatively large movement range A (see FIG. 2). The first support member 32 is a member formed in the vertical direction and is supported by the first linear motor 31. A second elevating drive unit 34 is arranged at the lower end of the first support member 32. A first engaging portion 33 that engages with a disk-shaped horizontal portion 27 formed on the syringe member 25 is formed on the upper end side of the first support member 32. The second elevating drive unit 34 moves the suction nozzle 28 of the syringe members 25 up and down. The second elevating drive unit 34 includes a second linear motor 35, a second support member 36, a second engaging unit 37, and a detection unit 38. The second linear motor 35 moves the second support member 36 up and down in a movement range B (see FIG. 2) that is shorter than the movement range A. The second support member 36 is a member formed in the vertical direction and is supported by the second linear motor 35. A second engaging portion 37 is formed at the lower end of the second support member 36. The second engaging portion 37 is engaged with the flange 29 of the suction nozzle 28. The second elevating drive unit 34 directly moves the suction nozzle 28 up and down via the second engaging portion 37 and the flange 29 by the driving force of the second linear motor 35. A detection unit 38, which is a load cell, is arranged on the second support member 36. The detection unit 38 is configured as a load sensor capable of detecting the load applied to the second engaging unit 37. The mounting head 22 lowers the suction nozzle 28 at high speed by the first elevating drive unit 30, lowers the suction nozzle 28 at low speed by the second elevating drive unit 34, and the component P is a substrate based on the detection result by the detection unit 38. Drive control is performed when the component P comes into contact with the S, and the load applied to the component P is reduced. The mounting device 11 is provided with a reference member 17 on which a reference surface that serves as a reference for height is formed.

As shown in FIG. 1, the component supply unit 14 includes a plurality of reels and is detachably attached to the front side of the mounting device 11. A tape is wound around each reel, and a plurality of parts P are held on the surface of the tape along the longitudinal direction of the tape. This tape is unwound from the reel toward the rear, and in a state where the component P is exposed, it is sent out by the feeder unit to the collection position where it is sucked by the suction nozzle 28.

The image pickup unit 16 is a unit that takes an image from the side of the suction nozzle 28 that has adsorbed the component P. The image pickup unit 16 includes an image pickup element, a mirror, and an image processing unit. The control device 40 detects the deviation of the suction position of the component P, the deformation of the component P, the presence or absence of damage, and the like by using the image captured by the image pickup unit 16.

As shown in FIG. 3, the control device 40 is configured as a microprocessor centered on a CPU 41, and has a ROM 42 for storing a processing program, an HDD 43 for storing various data, a RAM 44 used as a work area, an external device and electricity. An input / output interface 45 for exchanging signals is provided, and these are connected via a bus 46. The control device 40 outputs a control signal to the board transfer unit 12, the mounting unit 13, the component supply unit 14, and the image pickup unit 16, and inputs signals from the mounting unit 13, the component supply unit 14, and the image pickup unit 16.

The management computer 50 is a computer that manages information on each device of the mounting system 10. The management computer 50 includes an input device 52 such as a keyboard and a mouse for an operator to input various commands, and a display 54 for displaying various information.

Next, the operation of the mounting system 10 of the present embodiment configured in this way, specifically, the mounting process in which the mounting device 11 mounts the component P on the substrate S will be described. FIG. 4 is a flowchart showing an example of an implementation processing routine executed by the CPU 41 of the control device 40. This routine is stored as a program in the HDD 43 of the control device 40, and is executed by an operator's start instruction.

When this routine is started, the CPU 41 of the control device 40 first acquires the mounting job information from the management computer 50 (step S100). The mounting job information includes the mounting order of the component P, the size such as the type (component type) and thickness (height) of the component P to be mounted, the mounting position (XY coordinates) of the component P on the substrate S, and the component P. Information such as the suction nozzle 28 for sucking the above is included. Further, the mounting job information also includes information on height threshold values H1ref and H2ref for determining whether or not the contact heights H1 and H2 of the suction nozzles 28, which will be described later, are normal for each of the parts P to be mounted. include.

Next, the CPU 41 executes a contact height acquisition process for acquiring the height at which the suction nozzle 28 is in contact with another object (step S110). Here, the CPU 41 acquires the reference height R, which is the reference for the heights of the contact heights H1 and H2, which will be described later, by executing the contact height acquisition process. FIG. 5 is a flowchart showing an example of the contact height acquisition processing routine. This routine is stored as a program in the HDD 43 of the control device 40. Further, FIG. 6 is an explanatory diagram showing an example of measuring the contact height. FIG. 6A is a diagram showing an example of measurement of the reference height R, and FIGS. 6B and 6C are diagrams showing an example of measurement of the contact height H1.

When the contact height acquisition processing routine is started, the CPU 41 first moves the mounting head 22 to the measurement position of the contact height in the XY directions (step S300). In order to measure the reference height R in the contact height acquisition process in step S110, the CPU 41 moves the mounting head 22 above the reference member 17 which is the measurement position. Subsequently, the CPU 41 lowers the first support member 32 by the first elevating drive unit 30, and lowers the entire syringe member 25 and the suction nozzle 28 (step S310). Next, the CPU 41 lowers the second support member 36 by the second elevating drive unit 34 (step S320), and determines whether or not the detection unit 38 has detected the load based on the signal of the detection unit 38 (step). S330). When the detection unit 38 does not detect the load, the CPU 41 continues the process of step S320, and when the detection unit 38 detects the load, the suction nozzle 28 is attached to another object (here, the upper surface of the reference member 17). Assuming that they are in contact with each other, the contact height at this time is acquired and stored in the RAM 44 (step S340), and this routine is terminated. Here, the CPU 41 acquires the contact height at this time as the reference height R (see FIG. 6A) and stores it in the RAM 44. The reference height R is, for example, a value based on the encoder value of the first linear motor 31 and the encoder value of the second linear motor 35.

Returning to the description of the implementation processing routine of FIG. When the reference height R is acquired in step S110, the CPU 41 performs the transfer and fixing process of the substrate S (step S120), and sets the component type to be mounted based on the mounting job information (step S130). Next, the CPU 41 executes a contact height acquisition process for acquiring the contact height H1 of the suction nozzle 28 at the time of sucking the component P of the component type to be mounted (step S140). In step S340, the CPU 41 determines the point at which the mounting head 22 is moved to the collection position of the component P in the component supply unit 14 in step S300 of FIG. 5, and the contact height when the detection unit 38 detects the load. The procedure is the same as in step S110 described above, except that the contact height is H1. As a result, for example, as shown in FIG. 6B, the contact height when the lower end of the suction nozzle 28 comes into contact with the component P1 to be mounted on the tape 62 sent to the feeder portion 61 is the contact height H1. Get as. The CPU 41 measures the contact height H1 as the height from the reference height R to the tip of the suction nozzle 28 based on the encoder value of the first linear motor 31 and the encoder value of the second linear motor 35.

When the contact height H1 is acquired in step S140, the CPU 41 performs a contact height determination process for determining whether or not the contact height H1 exceeds the height threshold value H1ref (step S150). The height threshold value H1ref is, for example, a value predetermined by an experiment as an upper limit of a range in which the contact height with the component P at the time of suction by the suction nozzle 28 can be regarded as normal. The height threshold value H1ref is, for example, a value determined for each component type to be mounted, and is set as a value in which the height of the upper surface of the component P of each component type has a margin. For example, as shown in FIG. 6B, when no foreign matter adheres to the suction nozzle 28 and the suction nozzle 28 normally contacts the component P1 to be mounted, the contact height H1 acquired in step S140. Is equal to or less than the height threshold value H1ref. On the other hand, as shown in FIG. 6C, when, for example, another component P0 that is not a mounting target is attached to the suction nozzle 28 as a foreign substance, the contact height H1 is a value larger by the thickness of the component P0. , And the value exceeds the height threshold value H1ref. In this way, the CPU 41 determines whether or not there is an abnormality during suction, that is, whether or not there is a foreign substance, depending on whether or not the contact height H1 when the suction nozzle 28 is lowered is located above the normal contact height.

When the contact height H1 does not exceed the height threshold value H1ref in step S150, the CPU 41 applies a negative pressure to the lower end of the suction nozzle 28 to suck the component P (step S160). As a result, the component P to be mounted that has come into contact with the suction nozzle 28 in the contact height acquisition process (step S140) is sucked by the suction nozzle 28. Subsequently, the CPU 41 causes the image pickup unit 16 to take an image of the suction nozzle 28 from the side, and determines whether or not there is a suction abnormality of the component P sucked by the suction nozzle 28 using the captured image (step S170). The CPU 41 determines, for example, whether or not the suction position is displaced, the component P is deformed, or the component P is damaged.

When there is no suction abnormality in step S170, the CPU 41 executes a contact height acquisition process for acquiring the contact height H2 of the suction nozzle 28 at the time of mounting the component P of the component type to be mounted on the substrate S (step S180). ). In this process, the CPU 41 sets the point at which the mounting head 22 is moved to the mounting position of the substrate S in step S300 of FIG. 5 and the contact height when the detection unit 38 detects the load as the contact height H2 in step S340. The procedure is the same as in step S110 described above, except for the points to be acquired. FIG. 7 is an explanatory diagram showing an example of measuring the contact height H2. FIG. 7A is a diagram when there is no foreign matter at the mounting position of the substrate S, and FIG. 7B is a diagram when foreign matter F is present at the mounting position of the substrate S. The CPU 41 measures the contact height H2 as the height from the reference height R to the tip of the suction nozzle 28 based on the encoder value of the first linear motor 31 and the encoder value of the second linear motor 35.

When the contact height H2 is acquired in step S230, the CPU 41 performs a contact height determination process for determining whether or not the contact height H2 exceeds the height threshold value H2ref (step S190). The height threshold value H2ref is, for example, a value predetermined by an experiment as an upper limit of a range in which the contact height when the component P is mounted at the mounting position of the substrate S can be regarded as normal. The height threshold value H2ref is a value determined according to, for example, the height of the upper surface of the mounting position of the substrate S and the component type to be mounted, and is the height of the upper surface of the component P of each component type when mounted on the substrate S. Is set as a value with a margin. For example, as shown in FIG. 7A, when the component P1 to be mounted is normally in contact with the board S because no foreign matter is present at the mounting position of the board S and the component P1 to be mounted is sucked by the suction nozzle 28, the step S180 is performed. The acquired contact height H2 is equal to or less than the height threshold value H2ref. On the other hand, as shown in FIG. 7B, when the foreign matter F is present on the substrate S, the contact height H2 becomes a value larger by the thickness of the foreign matter F and exceeds the height threshold value H2ref. Become a value. In this way, the CPU 41 determines whether or not there is an abnormality during mounting, that is, whether or not there is a foreign substance, depending on whether or not the contact height H2 when the suction nozzle 28 is lowered is located above the normal contact height.

When the contact height H2 does not exceed the height threshold value H2ref in step S190, the CPU 41 controls the second elevating drive unit 34 so as to have a predetermined mounting load, and releases the suction of the component P (step S200). .. As a result, the component P to be mounted is mounted on the board S. When the component P is released from adsorption, the CPU 41 determines whether or not the mounting process of the current board is completed (step S210), and if not, executes the processes after step S130. That is, the CPU 41 sets the next component type to be mounted, controls the mounting unit 13, determines an abnormality based on the contact heights H1 and H2, and arranges the component P on the substrate S. On the other hand, when the mounting process of the current board is completed in step S210, the CPU 41 discharges the mounted board S to the board transfer unit 12 (step S220), and determines whether or not the production is completed (step S230). When the production is not completed, the CPU 41 executes the processes after step S120. That is, the CPU 41 conveys and fixes the new substrate S, and executes the processes after step S130. On the other hand, when the production is completed in step S230, the CPU 41 ends this routine as it is.

On the other hand, when the contact height H1 exceeds the height threshold H1ref in step S150, the CPU 41 is the most recent mounting target on which the suction nozzle 28 is mounted on the current substrate S (mounting in the previous mounting order). Whether or not there is a target) is determined based on the mounting job information (step S240), and if there is, the latest mounting target component type is set as the current mounting target (step S250). Here, for example, when the contact height H1 of the component P1 to be mounted is abnormal, there is a possibility that another component P0 is attached to the suction nozzle 28 as a foreign substance as shown in FIG. 6 (c). That is, there is a possibility that the component P0 does not separate from the suction nozzle 28 after the component P0 is placed on the substrate S (so-called take-out phenomenon), and the component P1 to be mounted next is being sucked as it is. .. In such a case, the mounting of the nearest mounting target (here, component P0) by the suction nozzle 28 on the substrate S is not completed. Therefore, the CPU 41 recovers the take-out phenomenon by setting the latest mounting target (the same component type as the component P0) as the mounting target again. It should be noted that the cause of such a take-out phenomenon is considered to be, for example, the case where static electricity is generated at the tip of the suction nozzle 28.

Next, the CPU 41 performs a disposal process of discarding the take-out parts adhering to the suction nozzle 28 (step S260). Specifically, the CPU 41 applies a negative pressure to the lower end of the suction nozzle 28, moves the mounting head 22 onto a waste box (not shown), and then releases the negative pressure. Then, the CPU 41 acquires the contact height H1 for the component P of the component type set as the mounting target in step S250 (step S270), and the contact height H1 is the height threshold value H1ref as in step S150. The contact height determination process for determining whether or not the above value is exceeded is performed (step S280). When the contact height H1 does not exceed the height threshold value H1ref in step S280, the CPU 41 performs the processing after step S160. That is, the CPU 41 sucks the component P to be mounted, which has come into contact with the suction nozzle 28 in the contact height acquisition process (step S270), to the suction nozzle 28, confirms the suction abnormality, and determines the abnormality based on the contact height H2. The adsorbed component P is mounted on the substrate S.

Further, when there is an adsorption abnormality in step S170, the CPU 41 executes the processes after step S260. That is, the CPU 41 discards the component P having the adsorption abnormality, and re-determines the abnormality of the component P to be mounted based on the contact height H1 at the time of adsorption.

On the other hand, when there is no nearest mounting target in step S240, when the contact height H1 exceeds the height threshold value H1ref in step S280, or when the contact height H2 exceeds the height threshold value H2ref in step S190. The CPU 41 notifies the operator of the abnormality (step S290), interrupts the mounting process, and ends this routine. For example, the CPU 41 displays a screen indicating the presence of foreign matter on a display panel of the mounting device 11 (not shown), or outputs a warning sound or a voice indicating the presence of foreign matter. When the contact height H1 exceeds the height threshold value H1ref in step S280, for example, a take-out component P or a component determined to be abnormal in step S160 due to solder adhering to the tip of the suction nozzle 28. It is conceivable that P and the like could not be separated and could not be discarded. Alternatively, it is conceivable that foreign matter other than the parts is attached to the suction nozzle 28. Further, when the contact height H2 exceeds the height threshold value H2ref in step S190, it is considered that foreign matter is attached to the substrate S. In such a case, it is desirable that the operator confirms the state of the suction nozzle 28 and the substrate S without continuing the mounting process, so that the mounting process is stopped and the abnormality is notified.

Even when the take-out phenomenon is recovered (steps S240 to S280), the take-out phenomenon may not actually occur and foreign matter may be attached to the tip of the suction nozzle 28. Even in such a case, the CPU 41 can detect an abnormality in at least one of step S170 or step S280. Further, even if an abnormality cannot be detected in step S170 or step S280 because the foreign matter is close to the shape of the component P to be mounted, if it is not a take-out phenomenon, the nearest mounting target has already been mounted on the board S, and recovery is possible. The contact height H2 will be measured at the same mounting position as the mounted component P. In this case, since the contact height H2 is the value obtained by adding the height of the foreign matter to the mounted component P, the CPU 41 can detect the abnormality in step S190.

Here, the correspondence between the constituent elements of the present embodiment and the constituent elements of the present invention will be clarified. The suction nozzle 28 of the present embodiment corresponds to the holding member of the present invention, the mounting head 22 corresponds to the mounting head, the first elevating drive unit 30 and the second elevating drive device 34 correspond to the elevating unit, and the detection unit 38. Corresponds to the contact detection unit, and the control device 40 corresponds to the abnormality determination unit. Further, the control device 40 corresponds to the mounting control unit.

The mounting device 11 of the embodiment described above has a suction nozzle 28 that sucks and holds the component P, a mounting head 22 that mounts the sucked component P on the substrate S, and a first elevating drive that raises and lowers the suction nozzle 28. A unit 30 and a second elevating drive device 34, and a detection unit 38 for detecting that the suction nozzle 28 has come into contact with another object are provided. Then, in the mounting device 11, the control device 40 determines that the abnormality is obtained when the detection unit 38 detects the contact between the suction nozzle 28 and another object above the normal contact height when the suction nozzle 28 is lowered. The contact height determination process is performed. As a result, foreign matter can be detected when the suction nozzle 28 is lowered.

Further, the control device 40 performs the contact height determination process in steps S150 and S200 regarding the contact when the suction nozzle 28 sucks the component P when the suction nozzle 28 is lowered. As a result, foreign matter can be detected when the suction nozzle 28 sucks the component P. Further, when the above-mentioned take-out phenomenon occurs, the component brought back by the suction nozzle 28 (for example, the component P0 in FIG. 6 (c)) and the component to be mounted (for example, the component P1 in FIG. 6 (c)) are constant. It may be a part of the same shape with a difference. In this case, in the determination using the image pickup unit 16 in step S170, the component P0 and the component P1 cannot be distinguished, and the abnormality may not be detected. In the present embodiment, even in such a case, the control device 40 can detect the abnormality caused by the take-out phenomenon by performing the contact height determination process in step S150.

Further, when the control device 40 determines that the contact height determination process of step S150 when the suction nozzle 28 sucks the component P is abnormal, the control device 40 performs the processes of steps S240 to S280. That is, the control device 40 mounts the mounting head 22, the first elevating drive unit 30, and the second elevating drive device 34 so that the component P of the same type as the latest mounting target by the suction nozzle 28 is mounted at the mounting position of the nearest mounting target. To control. As a result, the component P that has not been mounted due to the take-out phenomenon can be appropriately mounted on the substrate S. That is, it is possible to recover the take-out phenomenon.

Furthermore, the control device 40 performs the contact height determination process in step S190 regarding the contact of the suction nozzle 28 holding the component P when the suction nozzle 28 holds the component P on the substrate S when the suction nozzle 28 is lowered. As a result, foreign matter can be detected when the component P is mounted on the substrate S.

Further, the detection unit 38 is a load sensor that detects the load applied to the suction nozzle 28 from below when the suction nozzle 28 is lowered. Thereby, it is possible to appropriately detect that the suction nozzle 28 has come into contact with another object based on the load applied to the suction nozzle 28.

It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that the present invention can be carried out in various embodiments as long as it belongs to the technical scope of the present invention.

For example, in the above-described embodiment, the detection unit 38 is a load sensor, but the detection unit 38 is not limited to this as long as it can detect that the suction nozzle 28 has come into contact with another object. For example, it may be a touch sensor. Alternatively, the detection unit 38 may be omitted, and the control device 40 may detect the contact based on the increase in the load current of the second linear motor 35. Further, when the suction nozzle comes into contact with another object during descent, a plurality of members included in the suction nozzle may move relative to each other, and the contact may be detected depending on the presence or absence of this relative movement. FIG. 8 is a partial cross-sectional view showing an example of the mounting head 22A of the modified example in this case. FIG. 9 is a sectional view taken along the line CC of FIG. In the mounting head 22A, the second elevating drive device 34 does not include the detection unit 38, but instead includes the detection unit 70. Further, the suction nozzle 28A has the same configuration as the suction nozzle 28 except that the tubular portion 81 is provided with the tubular portion 81, the spring 82, and the suction portion 83 instead of the tubular portion 19. The tubular portion 81 is moved up and down by the first elevating drive unit 30 and the second elevating drive device 34, similarly to the tubular portion 19. The suction portion 83 is a cylindrical member connected to the tubular portion 81 via a spring 82, and the component P can be sucked to the tip (lower end). The inner peripheral surface of the suction portion 83 is in contact with the outer peripheral surface of the tubular portion 81, and the suction portion 83 can slide up and down relatively with respect to the tubular portion 81. Further, the suction portion 83 has a cylindrical shielding portion 84 at the upper end thereof. The detection unit 70 is configured as an optical sensor including a floodlight 71 and a light receiver 72. When no other object is in contact with the lower end of the suction portion 83, the mounting head 22A maintains the relative position between the tubular portion 81 and the suction portion 83 by the elastic force of the spring 82, and receives light from the floodlight 71. The optical axis L to the vessel 72 is not shielded. On the other hand, when the suction nozzle 28A descends and another object comes into contact with the lower end of the suction portion 83, the suction portion 83 moves upward relative to the tubular portion 81, and the optical axis L is shielded by the shielding portion 84. Therefore, the control device 40 can detect that the suction nozzle 28A has come into contact with another object because the light receiver 72 no longer receives the optical axis from the floodlight 71. Even when the relative movement of the plurality of members included in the suction nozzle is detected in the vertical direction as described above, it is possible to detect the foreign matter when the suction nozzle is lowered, as in the above-described embodiment. The detection unit for detecting the relative movement of the plurality of members included in the suction nozzle is not limited to the example of the detection unit 70 shown in FIGS. 8 and 9. For example, a floodlight and a light receiver are attached to the lower part of the flange 29, the light from the floodlight is reflected on the upper surface of the shield 84, and the light receiver receives the reflected light to detect the relative movement between the flange 29 and the shield 84. You may.

In the above-described embodiment, the control device 40 determines that it is abnormal when the detection unit 38 detects the contact between the suction nozzle 28 and another object above the normal contact height when the suction nozzle 28 is lowered. , Not limited to this. The control device 40 may determine that it is abnormal when the detection unit 38 detects the contact between the suction nozzle 28 and another object at a timing earlier than the normal contact timing when the suction nozzle 28 descends. For example, the control device 40 measures and measures the time from the start of descent of the suction nozzle 28 by the first elevating drive unit 30 and the second elevating drive unit 34 until the detection unit 38 detects the load as the descent time. If the time is shorter than a predetermined time threshold, it may be determined to be abnormal. In this way as well, it is possible to detect the foreign matter when the suction nozzle is lowered, as in the above-described embodiment.

In the above-described embodiment, when the contact height H1 exceeds the height threshold value H1ref in step S150, the control device 40 may notify the abnormality in step S290 without performing the processing of steps S240 to S280. That is, it is not necessary to recover the take-out phenomenon. Here, when the take-out phenomenon occurs, since the take-out component is once placed on the substrate S, the solder of the substrate S may be crushed by the component at this time. If the operator does not want the product in such a state, it is preferable not to perform recovery. Further, the control device 40 may switch whether or not to perform recovery based on an instruction input from the operator via an operation unit (not shown). Further, even if the take-out parts are not recovered, the control device 40 may perform the processing after step S260 if there is a suction abnormality in step S170.

In the above-described embodiment, the control device 40 detects the foreign matter at the time of adsorption (steps S140, S150) and the foreign matter at the time of mounting (steps S180, S190), but one of these is omitted. You may. Even in this way, it is possible to detect the foreign matter when the suction nozzle 28 is lowered at at least one of the time of suction and the time of mounting.

In the above-described embodiment, the mounting head 22 includes two elevating drive units, a first elevating drive unit 30 and a second elevating drive device 34, but the mounting head 22 is limited to this as long as the suction nozzle 28 can be moved up and down. do not have. For example, the mounting head 22 may have one elevating drive unit or three or more elevating drive units.

In the above-described embodiment, the number of suction nozzles 28 has been described as one, but the number may be one or more, and for example, the mounting head 22 may include a plurality of suction nozzles 28. In this case, the "most recent mounting target" set as the mounting target in step S240 is not simply the mounting target immediately before the mounting order, but the suction nozzle 28 for which an abnormality is determined in step S150 among the plurality of suction nozzles 28. It is the latest implementation target by. Further, when the mounting head 22 includes a plurality of suction nozzles 28, the control device 40 recovers the take-out parts by using the suction nozzles 28 other than the suction nozzle 28 in which the abnormality is detected in the contact height determination process. May be good. Alternatively, the control device 40 may not use the suction nozzle 28 whose abnormality is determined in the contact height determination process in the subsequent processes.

In the above-described embodiment, the control device 40 discards the component P once in step S260 even when recovering the take-out component, but the component P does not have to be discarded. That is, when the contact height H1 exceeds the height threshold value H1ref in step S150, it is considered that the component P to be mounted closest to the suction nozzle 28 is sucked by the take-out phenomenon, and the control device 40 steps. S250 may be executed, and the processes after step S270 may be executed. Even in this way, it is possible to recover the take-out phenomenon.

In the above-described embodiment, the reference height R is the height of the upper surface of the reference member 17, but the reference height R is not limited to this. For example, the initial height of the suction nozzle 28 (such as the height when the first elevating drive unit 30 and the second elevating drive device 34 are raised to the maximum) may be set as the reference height R, or the upper surface of the substrate S may be used. The height of may be set as the reference height R.

In the above-described embodiment, the height threshold value H2ref is set to a predetermined value, but the height threshold value is not limited to this. For example, the control device 40 may actually measure the height of the upper surface of the substrate S and the thickness (height) of the component P to be mounted, and set the height threshold value H2ref based on the measured values. For example, the control device 40 measures the height of the upper surface of the substrate S by moving the mounting head 22 onto the substrate S and performing a contact height acquisition processing routine in a state where the suction nozzle 28 does not suck the component P. You may. Further, the control device 40 measures the thickness of the component P by moving the mounting head 22 onto the reference member 17 in a state where the suction nozzle 28 has attracted the component P and performing a contact height acquisition processing routine. May be good. Alternatively, the control device 40 may measure the thickness of the component P based on the image captured by the image pickup unit 16.

In the above-described embodiment, the contact height H2 is the height of the lower end of the suction nozzle 28, but the height of the lower end of the component P to be mounted that will be sucked by the suction nozzle 28 may be the contact height H2. good. In this case, for example, the contact height H2 may be a value obtained by subtracting the thickness of the component P to be mounted from the height of the lower end of the suction nozzle 28. Further, the height threshold value H2ref in this case may be set according to the height of the upper surface of the mounting position of the substrate S.

In the above-described embodiment, the CPU 41 has attracted the component P in step S160 when the contact height H1 does not exceed the height threshold value H1ref in the contact height determination process (steps S150 and S280), but this is limited to this. I can't. For example, in step S320 of the contact height acquisition process (steps S140 and S270), the CPU 41 lowers the second support member 36 and applies a negative pressure to the lower end of the suction nozzle 28 to detect the load in step S330. At the same time, the component P may be attracted to the suction nozzle 28.

INDUSTRIAL APPLICABILITY The present invention can be used for a device that performs a mounting process for mounting components on a substrate.

10 mounting system, 11 mounting device, 12 board transfer unit, 13 mounting unit, 14 component supply unit, 16 imaging unit, 17 reference member, 19 tubular part, 20 head moving part, 22, 22A mounting head, 23 Q-axis motor, 24, 26 gears, 25 syringe members, 27 horizontal parts, 28, 28A suction nozzles, 29 flanges, 30 first elevating drive parts, 31 first linear motors, 32 first support members, 33 first engagement parts, 34th 2 Lifting drive unit, 35 2nd linear motor, 36 2nd support member, 37 2nd engaging unit, 38 detector unit, 40 control device, 41 CPU, 42 ROM, 43 HDD, 44 RAM, 45 input / output interface, 46 Bus, 50 management computer, 52 input device, 54 display, 61 feeder, 62 tape, 70 detector, 71 floodlight, 72 receiver, 81 tubular, 82 spring, 83 suction, 84 shield, A, B move Range, F foreign matter, H1, H2 contact height, H1ref, H2ref height threshold, L optical axis, P, P0, P1 parts, R reference height, S substrate.

Claims (1)

A mounting head that has a holding member that collects and holds the parts and mounts the held parts on the board.
An elevating part that raises and lowers the holding member,
A contact detection unit that detects that the holding member has come into contact with another object,
An abnormality determination unit that performs a determination process for determining an abnormality when the contact detection unit detects the contact above the normal contact height when the holding member is lowered.
A reference member on which a reference plane that serves as a reference for height is formed,
Equipped with
The abnormality determination unit performs the determination process based on the reference height of the holding member acquired by bringing the holding member into contact with the reference member and the height threshold value according to the component type to be mounted.
The height threshold value is set based on the measured height value of the upper surface of the substrate.
Mounting device.

Images