JP7160992B2 - Mounting equipment - Google Patents

Description

The present invention relates to a mounting device.

2. Description of the Related Art Conventionally, in a mounting apparatus for mounting components on a board, there is known one that determines whether or not a component is sucked by a suction nozzle. For example, Patent Literature 1 describes an electronic component mounting apparatus that performs the following processes. First, after the voice coil motor lowers the suction nozzle by a predetermined distance, the vacuum generator is operated to suck the component at the tip of the suction nozzle. Subsequently, the suction nozzle is further lowered, and it is determined whether or not the current value of the voice coil motor at this time has exceeded a predetermined current. When the suction nozzle is picking up a component, if the suction nozzle is lowered further, the load increases and the current value of the voice coil motor increases. . It is said that this makes it possible to make a quick and accurate judgment as compared with the case of judging whether or not a component is adsorbed using a pressure sensor attached to the air path of the vacuum generator.

JP-A-10-163686

However, in the electronic component mounting apparatus described in Patent Document 1, although it is possible to detect that the suction nozzle does not pick up the component, detection of other abnormalities is not taken into consideration. For example, no consideration has been given to the detection of foreign objects other than objects to be sucked when the suction nozzle is lowered. In addition, no consideration has been given to the detection of abnormalities when mounting components on a board, such as when there is a foreign object on the board.

SUMMARY OF THE INVENTION The present invention has been made to solve such problems, and its main object is to detect a foreign object when a holding member is lowered.

The present invention employs the following means in order to achieve the above main object.

The mounting device of the present invention is
a mounting head that has a holding member that picks up and holds a component, and that mounts the held component on a substrate;
an elevating unit that elevates the holding member;
a contact detection unit that detects contact of the holding member with another object;
An abnormality determination unit that performs a determination process of determining an abnormality when the contact detection unit detects the contact at least at a timing higher than the normal contact height when the holding member is lowered or at a timing earlier than the normal contact timing. When,
is provided.

In this mounting apparatus, when the holding member is lowered, it is detected that the holding member has come into contact with another object. Then, when contact is detected at least at a timing above the normal contact height during descent or earlier than the normal contact timing during descent, it is determined to be abnormal. This makes it possible to detect a foreign object when the holding member is lowered. Note that the "foreign matter" includes an object other than the part to be held, a part to be held but whose holding posture is abnormal, and the like. In addition, "the holding member comes into contact with another object" includes cases where the holding member comes into direct contact with another object and cases where the holding member comes into indirect contact with the other object. Examples of cases where the holding member indirectly contacts another object include, for example, cases where a foreign object adhering to the holding member or a component held by the holding member contacts another object.

In the mounting apparatus of the present invention, the abnormality determination section may perform the determination process regarding the contact when the holding member descends when the holding member picks up the component. In this way, foreign matter can be detected when the holding member picks up the component.

In this case, in the mounting apparatus of the present invention, when the abnormality determination unit determines that there is an abnormality in the determination process when the holding member picks up the component, the mounting apparatus of the present invention detects a component of the same type as the object to be mounted immediately by the holding member. A mounting control section may be provided for controlling the mounting head and the lifting section so that the component is mounted at the mounting position of the nearest mounting target. Here, if a foreign object is detected when the holding member picks up the component, there is a possibility that the holding member may still be sucking the previous component to be mounted. That is, there is a possibility that a phenomenon (so-called take-home phenomenon) occurs in which the component is not separated from the holding member after the component has been placed on the board. In such a case, by mounting a component of the same type as the most recent mounting target at the mounting position of that mounting target, the component that was not mounted due to the take-home phenomenon can be appropriately mounted on the board. . That is, the take-home phenomenon can be recovered.

In the mounting apparatus of the present invention, the abnormality determination unit may perform the determination process regarding the contact when the holding member holding the component is lowered when the component is mounted on the substrate. . By doing so, it is possible to detect a foreign substance when a component is mounted on the board.

In the mounting apparatus of the present invention, the contact detection section may be a load sensor that detects a load applied to the holding member from below when the holding member is lowered. This makes it possible to appropriately detect that the holding member has come into contact with another object based on the load applied to the holding member.

1 is a schematic explanatory diagram showing an example of a mounting system 10; FIG. FIG. 2 is an explanatory diagram showing the configuration of a mounting head 22; 2 is a block diagram showing the configuration of the mounting apparatus 11; FIG. 4 is a flowchart showing an example of an implementation processing routine; 4 is a flowchart showing an example of a contact height acquisition processing routine; Explanatory drawing showing an example which measures contact height. Explanatory drawing showing an example which measures the contact height H2. FIG. 4 is a partial cross-sectional view showing an example of a mounting head 22A of a modified example; CC sectional view of FIG.

Preferred embodiments of the invention are described below with reference to the drawings. FIG. 1 is a schematic explanatory diagram showing an example of a mounting system 10. As shown in FIG. FIG. 2 is an explanatory diagram showing the configuration of the mounting head 22. As shown in FIG. FIG. 3 is a block diagram showing the configuration of the mounting apparatus 11. As shown in FIG. The mounting system 10 is a system that executes a process of mounting a component P on a substrate S, for example. This mounting system 10 includes a mounting device 11 and a management computer 50 . In the mounting system 10, a plurality of mounting apparatuses 11 that perform a mounting process of mounting a component P on a board S are arranged from upstream to downstream. In FIG. 1, only one mounting device 11 is shown for convenience of explanation. In this embodiment, the left-right direction (X-axis), the front-rear direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIG.

The mounting apparatus 11 includes a board transfer unit 12, a mounting unit 13, a component supply unit 14, an imaging unit 16, and a control device 40, as shown in FIGS. The substrate transport unit 12 is a unit that carries in the substrate S, transports it, fixes it at the mounting position, and carries it out. The substrate transport unit 12 has a pair of conveyor belts that are spaced apart from each other in the front and rear of FIG. The substrate S is conveyed by this conveyor belt.

The mounting unit 13 picks up the component P from the component supply unit 14 and places it on the board S fixed to the board transfer unit 12 . The mounting unit 13 includes a head moving section 20 , a mounting head 22 and a suction nozzle 28 . The head moving unit 20 includes a slider that is guided by guide rails and moves in the XY directions, and a motor that drives the slider. The mounting head 22 is detachably attached to the slider and is moved in the XY directions by the head moving section 20 . One suction nozzle 28 is detachably attached to the lower surface of the mounting head 22 . As shown in FIG. 2, one or more elongated cylindrical syringe members 25 are arranged on the mounting head 22 so as to be rotatable about a central axis and vertically movable. A suction nozzle 28 is detachably attached to the lower end of the syringe member 25 . A gear 26 is arranged at the upper end of the syringe member 25 . The mounting head 22 is provided with a Q-axis motor 23 having a gear 24 . The Q-axis motor 23 has a gear 24 meshing with a gear 26 , and adjusts the angle of the component P sucked by the suction nozzle 28 by rotating the syringe member 25 through the gear 26 .

The suction nozzle 28 is a picking member that uses pressure to suck the component P to the tip of the nozzle and release the suction of the component P that has been sucked to the tip of the nozzle. The suction nozzle 28 has a disc-shaped flange 29 and a tubular portion 19 formed on the tip side (see FIG. 2). The tubular portion 19 is arranged in the main body of the suction nozzle 28 so as to be slidable in the Z-axis direction (vertical direction). In the mounting head 22 , the syringe member 25 and the suction nozzle 28 are moved up and down in the Z-axis direction at one elevation position located on the tip side of the mounting head 22 in the Y-axis direction. Note that the holding member that picks up and holds the component P is here described as the suction nozzle 28, but is not particularly limited as long as it can pick up and hold the component P, and a mechanical chuck that clamps and picks up the component P is used. and so on.

As shown in FIG. 2, the mounting head 22 includes a first elevation drive section 30 and a second elevation drive section 34. The first elevation drive section 30 and the second elevation drive section 34 move along the Z axis. The height of the suction nozzle 28 is adjusted along the line. The first elevation driving section 30 raises and lowers the entire syringe member 25 to which the suction nozzle 28 for picking up the component P is mounted. The first elevation drive section 30 includes a first linear motor 31 and a first support member 32 . The first linear motor 31 vertically moves the first support member 32 within a relatively large movement range A (see FIG. 2). The first support member 32 is a member formed vertically and supported by the first linear motor 31 . A second elevation drive section 34 is arranged at the lower end of the first support member 32 . A first engaging portion 33 that engages with a disk-shaped horizontal portion 27 formed on the syringe member 25 is formed on the upper end side of the first supporting member 32 . The second elevation driving section 34 raises and lowers the suction nozzle 28 of the syringe member 25 . The second elevation drive section 34 includes a second linear motor 35 , a second support member 36 , a second engagement section 37 and a detection section 38 . The second linear motor 35 moves the second support member 36 up and down within a movement range B (see FIG. 2) that is shorter than the movement range A. As shown in FIG. The second support member 36 is a member that extends vertically and is supported by the second linear motor 35 . A second engagement portion 37 is formed at the lower end of the second support member 36 . The second engaging portion 37 is engaged with the flange 29 of the suction nozzle 28 . The second elevation driving section 34 directly moves the suction nozzle 28 vertically via the second engaging section 37 and the flange 29 by the driving force of the second linear motor 35 . A detector 38 that is a load cell is arranged on the second support member 36 . The detection portion 38 is configured as a load sensor capable of detecting the load applied to the second engaging portion 37 . The mounting head 22 lowers the suction nozzle 28 at high speed by the first elevation driving section 30 , lowers the suction nozzle 28 at low speed by the second elevation driving section 34 , and detects the part P on the board based on the detection result of the detection section 38 . The load applied to the part P is reduced by performing drive control when contacting the part S. The mounting apparatus 11 is provided with a reference member 17 having a reference surface as a height reference.

The component supply unit 14 includes a plurality of reels and is detachably attached to the front side of the mounting device 11, as shown in FIG. A tape is wound around each reel, and a plurality of components P are held on the surface of the tape along the longitudinal direction of the tape. This tape is unwound rearward from the reel and fed by the feeder section to a pickup position where the parts P are picked up by the suction nozzle 28 in a state where the parts P are exposed.

The image pickup unit 16 is a unit that picks up an image of the suction nozzle 28 that has picked up the component P from the side. The image pickup unit 16 includes an image pickup device, a mirror, and an image processing section. The control device 40 uses the image captured by the imaging unit 16 to detect deviation of the pickup position of the component P, deformation of the component P, presence or absence of damage, and the like.

As shown in FIG. 3, the control device 40 is configured as a microprocessor centered on a CPU 41, and includes a ROM 42 for storing processing programs, an HDD 43 for storing various data, a RAM 44 used as a work area, an external device and an electric It has an input/output interface 45 and the like for exchanging signals, and these are connected via a bus 46 . The control device 40 outputs control signals to the board transport unit 12 , the mounting unit 13 , the component supply unit 14 and the imaging unit 16 and receives signals from the mounting unit 13 , the component supply unit 14 and the imaging unit 16 .

The management computer 50 is a computer that manages information on each device of the mounting system 10 . The management computer 50 includes an input device 52 such as a keyboard and a mouse for the operator to input various commands, and a display 54 for displaying various information.

Next, the operation of the mounting system 10 of this embodiment configured in this way, specifically, the mounting process in which the mounting apparatus 11 mounts the component P on the board S will be described. FIG. 4 is a flowchart showing an example of a mounting processing routine executed by the CPU 41 of the control device 40. As shown in FIG. This routine is stored as a program in the HDD 43 of the control device 40 and is executed by the operator's start instruction.

When this routine starts, the CPU 41 of the control device 40 first acquires mounting job information from the management computer 50 (step S100). The mounting job information includes the mounting order of the components P, the type (type of component) and size such as thickness (height) of the component P to be mounted, the mounting position (XY coordinates) of the component P on the board S, the component P information of the suction nozzle 28 that sucks the . The mounting job information also includes height threshold values H1ref and H2ref for determining whether contact heights H1 and H2 of the suction nozzle 28, which will be described later, are normal for each component P to be mounted. include.

Next, the CPU 41 executes contact height acquisition processing for acquiring the height at which the suction nozzle 28 contacts another object (step S110). Here, the CPU 41 executes the contact height acquisition process to acquire a reference height R that serves as a reference for contact heights H1 and H2, which will be described later. FIG. 5 is a flow chart showing an example of a contact height acquisition processing routine. This routine is stored in the HDD 43 of the control device 40 as a program. Moreover, FIG. 6 is explanatory drawing showing an example which measures contact height. FIG. 6(a) is a diagram showing an example of measurement of the reference height R, and FIGS. 6(b) and (c) are diagrams showing an example of measurement of the contact height H1.

When the contact height acquisition processing routine is started, the CPU 41 first moves the mounting head 22 in the XY directions to the contact height measurement position (step S300). In order to measure the reference height R in the contact height acquisition process of step S110, the CPU 41 moves the mounting head 22 above the reference member 17, which is the measurement position. Subsequently, the CPU 41 lowers the first support member 32 by the first elevation drive unit 30, thereby lowering the entire syringe member 25 and the suction nozzle 28 (step S310). Next, the CPU 41 causes the second lifting drive section 34 to lower the second support member 36 (step S320), and determines whether or not the detection section 38 has detected a load based on the signal of the detection section 38 (step S330). When the detection unit 38 does not detect the load, the CPU 41 continues the process of step S320. Assuming that there is contact, the contact height at this time is acquired and stored in the RAM 44 (step S340), and this routine ends. Here, the CPU 41 acquires the contact height at this time as the reference height R (see FIG. 6A) and stores it in the RAM 44 . The reference height R is, for example, a value based on the encoder value of the first linear motor 31 and the encoder value of the second linear motor 35 .

Returning to the description of the mounting processing routine in FIG. After obtaining the reference height R in step S110, the CPU 41 carries out the process of transporting and fixing the board S (step S120), and sets the component type to be mounted based on the mounting job information (step S130). Next, the CPU 41 executes contact height acquisition processing for acquiring the contact height H1 of the suction nozzle 28 when the component P of the component type to be mounted is suctioned (step S140). The CPU 41 performs this processing by moving the mounting head 22 to the picking position of the component P in the component supply unit 14 in step S300 of FIG. The above-described step S110 is performed in the same manner as in step S110 except that the contact height H1 is obtained. As a result, for example, as shown in FIG. 6B, the contact height when the lower end of the suction nozzle 28 contacts the component P1 to be mounted on the tape 62 fed to the feeder portion 61 is defined as the contact height H1. to get as The CPU 41 measures the contact height H1 as the height from the reference height R to the tip of the suction nozzle 28 based on the encoder value of the first linear motor 31 and the encoder value of the second linear motor 35 .

After acquiring the contact height H1 in step S140, the CPU 41 performs contact height determination processing to determine whether or not the contact height H1 exceeds the height threshold value H1ref (step S150). The height threshold value H1ref is a value predetermined, for example, by experiment as the upper limit of the range in which the contact height of the component P during suction by the suction nozzle 28 can be regarded as normal. The height threshold H1ref is, for example, a value determined for each component type to be mounted, and is set as a value with a margin for the height of the upper surface of the component P of each component type. For example, as shown in FIG. 6B, when no foreign matter adheres to the suction nozzle 28 and the suction nozzle 28 normally contacts the component P1 to be mounted, the contact height H1 acquired in step S140 is is equal to or less than the height threshold H1ref. On the other hand, as shown in FIG. 6(c), if a foreign object such as another component P0 that is not to be mounted is adhered to the suction nozzle 28, the contact height H1 is a value that is greater by the thickness of the component P0. , which exceeds the height threshold value H1ref. In this manner, the CPU 41 determines whether there is an abnormality during suction, that is, whether there is a foreign object, based on whether the contact height H1 of the suction nozzle 28 when it is lowered is higher than the normal contact height.

When the contact height H1 does not exceed the height threshold value H1ref in step S150, the CPU 41 applies negative pressure to the lower end of the suction nozzle 28 to suck the component P (step S160). As a result, the suction nozzle 28 sucks the component P to be mounted that has come into contact with the suction nozzle 28 in the contact height acquisition process (step S140). Subsequently, the CPU 41 causes the imaging unit 16 to take an image of the suction nozzle 28 from the side, and uses the imaged image to determine whether there is an abnormality in the suction of the component P sucked by the suction nozzle 28 (step S170). The CPU 41 determines, for example, the presence or absence of displacement of the pick-up position, deformation of the component P, damage, and the like.

When there is no suction abnormality in step S170, the CPU 41 executes contact height acquisition processing for acquiring the contact height H2 of the suction nozzle 28 when the component P of the component type to be mounted is mounted on the board S (step S180). ). The CPU 41 performs this process by moving the mounting head 22 to the mounting position of the substrate S in step S300 of FIG. Except for the point of acquiring, it is performed in the same manner as in step S110 described above. FIG. 7 is an explanatory diagram showing an example of measuring the contact height H2. FIG. 7(a) is a diagram when there is no foreign matter at the mounting position of the substrate S, and FIG. 7(b) is a diagram when there is a foreign matter F at the mounting position of the substrate S. FIG. The CPU 41 measures the contact height H2 as the height from the reference height R to the tip of the suction nozzle 28 based on the encoder value of the first linear motor 31 and the encoder value of the second linear motor 35 .

After acquiring the contact height H2 in step S230, the CPU 41 performs contact height determination processing to determine whether or not the contact height H2 exceeds the height threshold value H2ref (step S190). The height threshold value H2ref is a value predetermined by experiment, for example, as the upper limit of the range in which the contact height when mounting the component P on the mounting position of the board S can be regarded as normal. The height threshold value H2ref is a value determined according to, for example, the height of the upper surface of the mounting position on the board S and the type of component to be mounted, and the height of the upper surface of the component P of each component type when mounted on the board S. is set as a value with a margin for For example, as shown in FIG. 7A, when there is no foreign matter at the mounting position of the board S and the component P1 to be mounted which is sucked by the suction nozzle 28 normally contacts the board S, in step S180 The acquired contact height H2 is equal to or less than the height threshold value H2ref. On the other hand, as shown in FIG. 7B, when the foreign matter F exists on the substrate S, the contact height H2 becomes a value larger by the thickness of the foreign matter F and exceeds the height threshold value H2ref. be a value. In this manner, the CPU 41 determines whether there is an abnormality during mounting, that is, whether there is a foreign object, depending on whether the contact height H2 when the suction nozzle 28 is lowered is higher than the normal contact height.

When the contact height H2 does not exceed the height threshold value H2ref in step S190, the CPU 41 controls the second lifting drive unit 34 so as to achieve a predetermined mounting load and releases the suction of the component P (step S200). . As a result, the component P to be mounted is mounted on the board S. As shown in FIG. When the component P is released from suction, the CPU 41 determines whether or not the mounting process for the current board has been completed (step S210). That is, the CPU 41 sets the type of component to be mounted next, controls the mounting unit 13, and places the component P on the board S while determining abnormality based on the contact heights H1 and H2. On the other hand, when the mounting process of the current board is completed in step S210, the CPU 41 discharges the board S on which the mounting is completed to the board transport unit 12 (step S220), and determines whether or not the production is completed (step S230). When the production has not been completed, the CPU 41 executes the processing from step S120. That is, the CPU 41 transports and fixes a new substrate S, and executes the processes after step S130. On the other hand, when the production is completed in step S230, the CPU 41 ends this routine as it is.

On the other hand, when the contact height H1 exceeds the height threshold value H1ref in step S150, the CPU 41 determines the most recent mounting object (the mounting order one before) to which the suction nozzle 28 has mounted on the current board S. It is determined based on the mounting job information whether or not there is an object) (step S240), and if there is, the component type of the most recent mounting object is set as the current mounting object (step S250). Here, for example, if there is an abnormality in the contact height H1 of the component P1 to be mounted, there is a possibility that another component P0 adheres to the suction nozzle 28 as a foreign substance as shown in FIG. 6(c). That is, there is a phenomenon that the component P0 does not leave the suction nozzle 28 after the component P0 is placed on the substrate S (so-called take-home phenomenon), and there is a possibility that the next component P1 to be mounted is going to be sucked as it is. . In such a case, mounting of the most recent mounting target (in this case, the component P0) on the board S by the suction nozzle 28 is not completed. Therefore, the CPU 41 recovers from the take-out phenomenon by setting the most recent mounting target (the same component type as the component P0) as the mounting target again. It should be noted that, for example, static electricity generated at the tip of the suction nozzle 28 can be considered as a cause of such a take-away phenomenon.

Next, the CPU 41 performs a discarding process of discarding the take-home component adhering to the suction nozzle 28 (step S260). Specifically, the CPU 41 applies negative pressure to the lower end of the suction nozzle 28, moves the mounting head 22 onto a disposal box (not shown), and then releases the negative pressure. Then, the CPU 41 obtains the contact height H1 of the component P of the component type set as the mounting target in step S250 (step S270), similarly to step S140. is performed (step S280). When the contact height H1 does not exceed the height threshold value H1ref in step S280, the CPU 41 performs the processes after step S160. That is, in the contact height acquisition process (step S270), the CPU 41 causes the suction nozzle 28 to suck the component P to be mounted that has come into contact with the suction nozzle 28, confirms the suction abnormality, and determines the abnormality based on the contact height H2. The sucked component P is mounted on the board S.

Further, when there is an adsorption abnormality in step S170, the CPU 41 executes the processes after step S260. In other words, the CPU 41 discards the component P having the adsorption abnormality, and performs again the abnormality determination for the component P to be mounted based on the contact height H1 at the time of adsorption.

On the other hand, when there is no immediate mounting target in step S240, when the contact height H1 exceeds the height threshold H1ref in step S280, or when the contact height H2 exceeds the height threshold H2ref in step S190, The CPU 41 notifies the operator of the abnormality (step S290), interrupts the mounting process, and ends this routine. For example, the CPU 41 displays a screen indicating the presence of a foreign object on the display panel of the mounting apparatus 11 (not shown), or outputs a warning sound or a voice indicating the presence of a foreign object. In addition, when the contact height H1 exceeds the height threshold value H1ref in step S280, for example, solder adheres to the tip of the suction nozzle 28, which is the take-home part P or the part determined to be abnormal in step S160. It is conceivable that P etc. could not be discarded without being separated. Alternatively, it is conceivable that the suction nozzle 28 may have adhered foreign matter other than the component. Further, when the contact height H2 exceeds the height threshold value H2ref in step S190, it is conceivable that a foreign object is attached to the substrate S. In such cases, it is desirable for the operator to check the state of the suction nozzle 28 and the substrate S without continuing the mounting process, so the mounting process is stopped and the abnormality is notified.

It should be noted that even when the take-home phenomenon is recovered (steps S240 to S280), there is a case where the take-home phenomenon does not actually occur and foreign matter adheres to the tip of the suction nozzle . Even in such a case, the CPU 41 can detect an abnormality in at least one of step S170 and step S280. Further, even if an abnormality cannot be detected in step S170 or step S280 because the foreign matter is close to the shape of the component P to be mounted, if it is not a carry-out phenomenon, the nearest mounting target has already been mounted on the board S, and recovery is performed. The contact height H2 is measured at the same mounting position as the component P that has already been mounted. In this case, the contact height H2 is a value obtained by adding the height of the foreign matter to the mounted component P, so the CPU 41 can detect an abnormality in step S190.

Here, correspondence relationships between the components of the present embodiment and the components of the present invention will be clarified. The suction nozzle 28 of this embodiment corresponds to the holding member of the present invention, the mounting head 22 corresponds to the mounting head, the first lifting drive section 30 and the second lifting drive device 34 correspond to the lifting section, and the detection section 38 corresponds to the contact detection section, and the control device 40 corresponds to the abnormality determination section. Also, the control device 40 corresponds to the mounting control unit.

The mounting apparatus 11 of the embodiment described above includes a mounting head 22 having a suction nozzle 28 for sucking and holding a component P, and a mounting head 22 for mounting the sucked component P on a substrate S, and a first lifting drive for raising and lowering the suction nozzle 28. 30, a second up-and-down drive device 34, and a detection unit 38 for detecting contact of the suction nozzle 28 with another object. In this mounting apparatus 11, the control device 40 determines that there is an abnormality when the detection unit 38 detects contact between the suction nozzle 28 and another object above the normal contact height when the suction nozzle 28 descends. contact height determination processing is performed. As a result, foreign matter can be detected when the suction nozzle 28 is lowered.

Further, the control device 40 performs the contact height determination processing in steps S150 and S200 regarding the contact during the downward movement of the suction nozzle 28 when the suction nozzle 28 picks up the component P. FIG. As a result, foreign matter can be detected when the suction nozzle 28 picks up the component P. FIG. Also, when the take-out phenomenon described above occurs, the component (for example, the component P0 in FIG. 6C) brought back by the suction nozzle 28 and the component to be mounted (for example, the component P1 in FIG. 6C) are constant. They may be parts of the same shape with differences. In this case, the judgment using the image pickup unit 16 in step S170 may not be able to distinguish between the parts P0 and P1, and may not be able to detect an abnormality. In this embodiment, even in such a case, the control device 40 performs the contact height determination process in step S150, thereby detecting an abnormality caused by the carry-out phenomenon.

Furthermore, when the control device 40 determines that the contact height determination process of step S150 when the suction nozzle 28 picks up the component P is abnormal, the control device 40 performs the processing of steps S240 to S280. That is, the control device 40 controls the mounting head 22, the first elevation driving section 30, and the second elevation driving device 34 so as to mount the component P of the same type as the most recent mounting target by the suction nozzle 28 at the mounting position of the most recent mounting target. to control. As a result, the component P that has not been mounted due to the carry-out phenomenon can be properly mounted on the board S. That is, the take-home phenomenon can be recovered.

Furthermore, the control device 40 performs the contact height determination process of step S190 regarding the contact when the suction nozzle 28 holding the component P mounts the component P on the substrate S when the suction nozzle 28 descends. As a result, foreign matter when the component P is mounted on the substrate S can be detected.

Further, the detection unit 38 is a load sensor that detects the load applied to the suction nozzle 28 from below when the suction nozzle 28 is lowered. Thereby, based on the load applied to the suction nozzle 28, it is possible to appropriately detect that the suction nozzle 28 has come into contact with another object.

It goes without saying that the present invention is not limited to the above-described embodiments, and can be implemented in various forms as long as they fall within the technical scope of the present invention.

For example, in the embodiment described above, the detection unit 38 is a load sensor, but it is not limited to this as long as it can detect that the suction nozzle 28 has come into contact with another object. For example, it may be a touch sensor. Alternatively, the detection unit 38 may be omitted and the control device 40 may detect contact based on an increase in the load current of the second linear motor 35 . Further, when the suction nozzle comes into contact with another object during descent, a plurality of members included in the suction nozzle may move relative to each other, and contact may be detected based on the presence or absence of this relative movement. FIG. 8 is a partial cross-sectional view showing an example of a mounting head 22A of a modified example in this case. 9 is a cross-sectional view taken along line CC of FIG. 8. FIG. The mounting head 22</b>A does not include the detection section 38 in the second elevation drive device 34 , and instead includes the detection section 70 . The suction nozzle 28A has the same structure as the suction nozzle 28, except that it has a tubular portion 81, a spring 82, and a suction portion 83 instead of the tubular portion 19. As shown in FIG. The tubular portion 81 is raised and lowered by the first elevation driving portion 30 and the second elevation driving device 34 in the same manner as the tubular portion 19 . The suction portion 83 is a cylindrical member connected to the tubular portion 81 via a spring 82, and is capable of sucking the component P at its tip (lower end). The suction portion 83 has an inner peripheral surface in contact with the outer peripheral surface of the tubular portion 81 and is slidable up and down relative to the tubular portion 81 . In addition, the adsorption section 83 has a cylindrical shielding section 84 at its upper end. The detector 70 is configured as an optical sensor including a light projector 71 and a light receiver 72 . In this mounting head 22A, the relative position between the tubular portion 81 and the suction portion 83 is maintained by the elastic force of the spring 82 when the lower end of the suction portion 83 is not in contact with another object, and the light from the light projector 71 is received. The optical axis L to the device 72 is not blocked. On the other hand, when the suction nozzle 28A descends and another object comes into contact with the lower end of the suction portion 83, the suction portion 83 moves upward relative to the tubular portion 81, and the optical axis L is shielded by the shielding portion 84. Therefore, the controller 40 can detect that the suction nozzle 28A has come into contact with another object when the light receiver 72 no longer receives the optical axis from the light projector 71 . Even when detecting the vertical relative movement of a plurality of members included in the suction nozzle in this way, it is possible to detect a foreign object when the suction nozzle is lowered, as in the above-described embodiment. Note that the detection unit that detects the relative movement of the plurality of members included in the suction nozzle is not limited to the example of the detection unit 70 shown in FIGS. For example, a light emitter and a light receiver are attached to the lower part of the flange 29, the light from the light emitter is reflected on the upper surface of the shielding part 84, and the light receiver receives the reflected light, thereby detecting the relative movement between the flange 29 and the shielding part 84. may

In the above-described embodiment, the control device 40 determines that there is an abnormality when the detection unit 38 detects contact between the suction nozzle 28 and another object above the normal contact height when the suction nozzle 28 descends. , but not limited to this. The control device 40 may determine that there is an abnormality when the detection unit 38 detects contact between the suction nozzle 28 and another object at a timing earlier than the normal contact timing when the suction nozzle 28 descends. For example, the control device 40 measures the time from the start of the descent of the suction nozzle 28 by the first lift drive unit 30 and the second lift drive device 34 to the detection of the load by the detection unit 38 as the fall time. It may be determined as abnormal when the time taken is shorter than a predetermined time threshold. Also in this way, as in the above-described embodiment, it is possible to detect a foreign object when the suction nozzle is lowered.

In the embodiment described above, when the contact height H1 exceeds the height threshold value H1ref in step S150, the control device 40 may notify an abnormality in step S290 without performing the processes of steps S240 to S280. That is, it is not necessary to recover the take-home phenomenon. Here, when the take-home phenomenon occurs, the take-home component has been placed on the board S once, so the solder on the board S may be crushed by the component at this time. If the operator does not want the product in such a state, it is preferable not to perform the recovery. Alternatively, the control device 40 may switch whether to perform recovery based on an instruction input by the operator via an operation unit (not shown). Also, even if the recovery of the take-home component is not performed, the control device 40 may perform the processing from step S260 onward when there is an adsorption abnormality in step S170.

In the above-described embodiment, the control device 40 detects foreign matter during suction (steps S140 and S150) and detects foreign matter during mounting (steps S180 and S190). may Even in this way, foreign matter can be detected when the suction nozzle 28 is lowered during at least one of suction and mounting.

In the above-described embodiment, the mounting head 22 is provided with two elevation driving units, the first elevation driving unit 30 and the second elevation driving device 34, but is limited to this as long as the suction nozzle 28 can be moved up and down. do not have. For example, the mounting head 22 may have one elevation driving unit, or may have three or more.

In the above-described embodiment, the number of suction nozzles 28 is one, but the number may be one or more. For example, the mounting head 22 may include a plurality of suction nozzles 28 . In this case, the "immediate mounting target" set as the mounting target in step S240 is not simply the mounting target that is one ahead in the mounting order, but the suction nozzle 28 determined to be abnormal in step S150 among the plurality of suction nozzles 28. It is the most recent implementation target by When the mounting head 22 has a plurality of suction nozzles 28, the control device 40 recovers the take-home component by using the suction nozzles 28 other than the suction nozzles 28 for which an abnormality was detected in the contact height determination process. good too. Alternatively, the control device 40 may prevent the suction nozzle 28 determined to be abnormal in the contact height determination process from being used in subsequent processes.

In the above-described embodiment, the control device 40 once discarded the part P in step S260 even when recovering the take-home part, but it does not have to be discarded. That is, when the contact height H1 exceeds the height threshold value H1ref in step S150, it is assumed that the pick-up nozzle 28 is picking up the component P to be mounted closest to the pick-up nozzle 28 due to the take-out phenomenon, and the control device 40 proceeds to step S150. S250 may be executed and the processing after step S270 may be executed. Even in this way, the take-home phenomenon can be recovered.

In the embodiment described above, the reference height R is the height of the upper surface of the reference member 17, but it is not limited to this. For example, the initial height of the suction nozzle 28 (such as the height when the first lifting drive unit 30 and the second lifting drive device 34 are lifted to the maximum) may be used as the reference height R, or the upper surface of the substrate S may be may be used as the reference height R.

In the embodiment described above, the height threshold value H2ref is a predetermined value, but it is not limited to this. For example, the control device 40 may actually measure the height of the upper surface of the substrate S and the thickness (height) of the component P to be mounted, and set the height threshold H2ref based on the measured values. For example, the control device 40 measures the height of the upper surface of the board S by moving the mounting head 22 onto the board S while the suction nozzle 28 does not pick up the component P and performing the contact height acquisition processing routine. may Further, the control device 40 measures the thickness of the component P by moving the mounting head 22 above the reference member 17 while the component P is being sucked by the suction nozzle 28 and performing the contact height acquisition processing routine. good too. Alternatively, the control device 40 may measure the thickness of the component P based on the image captured by the imaging unit 16 .

In the above-described embodiment, the contact height H2 is the height of the lower end of the suction nozzle 28, but the height of the lower end of the component P to be mounted, which is likely to be suctioned by the suction nozzle 28, may be the contact height H2. good. In this case, for example, the contact height H2 may be obtained by subtracting the thickness of the component P to be mounted from the height of the lower end of the suction nozzle 28 . Further, the height threshold value H2ref in this case may be determined according to the height of the upper surface of the board S at the mounting position.

In the embodiment described above, the CPU 41 picks up the part P in step S160 when the contact height H1 does not exceed the height threshold value H1ref in the contact height determination process (steps S150 and S280). can't For example, in step S320 of the contact height acquisition process (steps S140 and S270), the CPU 41 lowers the second support member 36 and applies a negative pressure to the lower end of the suction nozzle 28, thereby detecting the load in step S330. The part P may be sucked by the suction nozzle 28 at the same time.

INDUSTRIAL APPLICABILITY The present invention can be used for a device that performs mounting processing for mounting components on a substrate.

10 Mounting System 11 Mounting Apparatus 12 Board Transfer Unit 13 Mounting Unit 14 Component Supply Unit 16 Imaging Unit 17 Reference Member 19 Tubular Section 20 Head Moving Section 22, 22A Mounting Head 23 Q-axis Motor 24, 26 gear, 25 syringe member, 27 horizontal portion, 28, 28A suction nozzle, 29 flange, 30 first lifting drive section, 31 first linear motor, 32 first support member, 33 first engaging section, 34 second 2 lifting drive section, 35 second linear motor, 36 second support member, 37 second engagement section, 38 detection section, 40 control device, 41 CPU, 42 ROM, 43 HDD, 44 RAM, 45 input/output interface, 46 bus, 50 management computer, 52 input device, 54 display, 61 feeder section, 62 tape, 70 detection section, 71 floodlight, 72 light receiver, 81 tubular section, 82 spring, 83 suction section, 84 shield section, A, B movement range, F foreign object, H1, H2 contact height, H1ref, H2ref height threshold, L optical axis, P, P0, P1 component, R reference height, S substrate.

Claims (1)

A mounting apparatus that mounts a component held by a holding member on a substrate by means of a mounting head having a holding member that picks up and holds the component,
an elevating unit that elevates the holding member;
an optical sensor comprising a light emitter and a light receiver;
a shielding portion that shields the optical axis of the optical sensor by relative movement with respect to the optical sensor when the holding member comes into contact with another object;
an abnormality determination unit that performs a determination process of determining an abnormality when the shielding unit blocks the optical axis of the optical sensor above a normal contact height when the holding member is lowered;
with
The abnormality determination unit performs the determination process based on a height threshold set based on the actually measured value of the height of the upper surface of the substrate.
mounting equipment.

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