JP7109151B2 - Heat dissipation structure, heating module and cooking equipment - Google Patents

Description

This application is filed with the Chinese Patent Office on April 11, 2018, the application number is "201810321525.3", the invention title is "IH heating module", and the Chinese patent application filed on August 23, 2018 A Chinese patent application filed with the Patent Office with the application number "201810965966.7" and the invention title "heating module" and a Chinese patent application filed with the Patent Office on September 11, 2018 with the application number "201811055996.0" , the Chinese patent application titled "Electromagnetic Induction Heating Module and Heat Dissipation Structure" as priority, the entire content of which is incorporated herein by reference.

TECHNICAL FIELD The present invention relates to the field of home appliances, and in particular to a heat dissipation structure, heating module and cooking equipment.

A typical IH heating (induction heating) electrical equipment usually includes parts such as a top cover, a pedestal, a coil disk and a coil support, an electrical control motherboard, a heat sink, and an inner pot. Here, the electrical control motherboard (usually in the form of a PCB circuit board), especially the power devices such as IGBTs mounted on it, generate a large amount of heat during operation. It has not only an electric control motherboard, but also other heat-generating components. For example, an electromagnetic induction heating module utilizes an alternating magnetic field generated by an inductor coil disk to generate eddy currents in a magnetically conductive material placed in the magnetic field to generate heat. Therefore, both the energized inductor coil disk and the electric control motherboard generate a large amount of heat when the electromagnetic induction heating module operates. If this heat is not quickly and efficiently discharged to the outside of the electromagnetic induction heating module, the temperature inside the facility will become too high, affecting the normal operation of the facility parts and possibly damaging the parts.

In addition, the heat dissipation of current commercially available induction heating members is usually performed by the heat dissipation member attached to the coil support. etc.) are separate and customized, with a low degree of standardization and generalization, requiring custom development and design for each product, and finally realizing heating and heat dissipation functions by assembly. Therefore, the versatility between different heating elements and heat radiating elements is poor, the integrated design is poor, and the development period of the same type of product is long. In addition, the separate assembly has the disadvantages of difficult manufacturing assembly and high material and process costs.

SUMMARY OF THE INVENTION An object of the present invention is to provide an electromagnetic induction heating module and a heat dissipation structure for one or more of the above technical problems.

A heat dissipation structure, the heat dissipation structure comprising: a support including a horizontal support portion; a vertical support portion connected to the horizontal support portion; a heat sink disposed on the support; A blower arranged on a horizontal support portion and a control member arranged on said longitudinal support portion, wherein the vertical projection of said control member and the vertical projection of said blower do not intersect.

In one embodiment thereof, the heat sink is located between the blower and the control member.

In one embodiment thereof, the heat sink is arranged on the horizontal support portion and close to the inner side of one end of the vertical support portion, or the heat sink is arranged on the vertical support portion and the said vertical support portion. Adjacent to the inside of the horizontal support portion, said control member is arranged inside said longitudinal support portion.

In one embodiment thereof, the heat sink is arranged on the horizontal support portion and adjacent to the outside of one end of the vertical support portion, or the heat sink is arranged on the vertical support portion and the said vertical support portion. Adjacent to the outside of a horizontal support portion, the blower is arranged outside the horizontal support portion and the control member is arranged outside the longitudinal support portion.

In one embodiment thereof, the blower is arranged at or near the center of the horizontal support portion, and the blower is arranged at or near the center of the outer side of the horizontal support portion. .

In one embodiment, the support is an L-shaped support, and the structure comprising the control member and the heat sink and the support cooperate to form a T-shape.

In one embodiment thereof, the flow of airflow by the blower includes any one or more of the following situations, wherein the airflow passes through the rack surface of the heat sink, through the heat sink, and at the support: It is blown out from the gap of the connection part connecting the horizontal support part and the horizontal support part, and blows through the control member through the gap at the top of the heat sink and blows through to the horizontal support at the support. It is blown out from the gap of the connecting portion that connects the portion and the horizontal support portion.

In one embodiment thereof, the heat dissipation structure comprises an air channel wall structure, the air channel wall structure is disposed on the horizontal support part and surrounds or semi-encloses the blower, and the air channel wall The structure guides the side of the airflow by the blower towards the heat sink or the control member.

In one embodiment thereof, the air channel wall structure directs airflow passing through a gap between the top of the heat sink and the outer surface of the support toward the component of the control member, the air channel wall structure contains the part of the module that guides it to exit from the middle or top of the

In one embodiment thereof, the channel wall structure includes a first portion and a second portion,
the first portion has an arch shape and surrounds one side of the blower;
The second portion extends in the direction of the control member along both ends of the first portion of the channel wall.

In one embodiment thereof, the duct wall structure further includes a third portion and a fourth portion, wherein the third portion extends from the tail end of the second portion of the duct wall to the second portion of the duct wall. extending outwardly away from two portions and then extending upwardly along an outer portion of the support to a position adjacent to the top of the support, the fourth portion extending from the top of the support; and connected to the extended end of the third portion of the channel wall.

In one embodiment thereof, the duct wall structure further includes a fifth portion corresponding to the second portion of the duct wall, each one side portion of the fifth portion of the duct wall comprising: From a position close to the tip of the corresponding second portion, it gradually approaches the other side of the fifth portion and extends in a direction toward the control member.

In one embodiment, the airflow blown out from the side of the fan is collected through the second portion of the air passage wall and the fifth portion of the air passage wall to form wind pressure. blows on the heat sink, passes through the rack surface of the heat sink and carries the heat out of the heat dissipating structure, and some of the airflow crosses the gap between the top of the heat sink and the outer surface of the support. It passes through and blows on the control member, passes through the parts of the control member and the fence groove of the fourth part of the air channel wall in order from bottom to top, and is discharged out of the heat dissipation structure.

In one embodiment thereof, the horizontal support section includes a motherboard support and a blower cover, the control member is fixed to the motherboard support, and the air channel wall structure further comprises a peripheral air channel wall. wherein said air duct peripheral wall is a closed all-enclosed structure, and two sections of said duct peripheral wall extending upward along the outer side of said support are each provided with a slide rail. The motherboard support is engaged with the air duct peripheral wall from the slide rail and connected to the fan cover, and the air duct peripheral wall surrounds the motherboard support and the fan cover together to form an air duct cavity. forming.

In one embodiment thereof, the control member includes an electromagnetic heating IH control module and an external memory controller EMC module, wherein both the IH control module and the EMC module are integrated on a circuit board of the control member. or, the IH control module and the EMC module are installed separately, the IH control module is installed on the circuit board, and the EMC module is installed at another position on the outer side of the support. It is

In one embodiment thereof, the horizontal support portion and the vertical support portion are connected by a hinge connection or engagement, or the horizontal support portion and the vertical support portion are integrally molded. It is connected.

A heating module comprising a heat dissipation structure according to any one of the above embodiments, further comprising a heating member, wherein the projection of the blower is located within the projection of the heating member, and the support is the projection of the heating member. cover the outside.

In one embodiment thereof, said support further comprises a support peripheral wall, said support peripheral wall being arranged laterally of said horizontal support portion and laterally of said longitudinal support portion, The outer edge of the support peripheral wall substantially conforms to the shape of the outer edge of the heating element, and the support and heating element together define an air passage cavity.

In one embodiment thereof, the heating element is sleeved in the support, the blower is arranged under the bottom of the support, and the heat sink is arranged horizontally on the side of the blower. and the circuit board is vertically disposed on top of the heat sink.

In one embodiment thereof, the projection of the heat sink lies at least partially within the projection of the heating element, and the projection of the control element and the projection of the heating element do not intersect.

In one embodiment, a notch is provided in the bottom of the support, and the airflow blown out from the top of the blower flows through the notch into the gap between the support and the heating member. and discharged out of the heating module.

In one embodiment, the heating member has the shape of a concave container, the support covers the outside of the heating member, and a plurality of array ribs are arranged on the outer surface of the heating member. each array rib including a plurality of spacers distributed on the outer portion of the heating element, the outer bottom portion, and the corners connecting the outer portion and the outer bottom portion, and between two adjacent spacers; Coil grooves are formed to accommodate coils, and the coils are wound around the outer surface of the heating member according to the order of the coil grooves.

In one embodiment thereof, a striped rib is provided below each said array rib, said striped rib extending upwardly from the outer bottom of the heating element to the outer side of the heating element, said The striped ribs support the coil so as to form a gap between the outer peripheral surfaces of the coil and the heating member, and form a ventilation path between the inner surface of the support and the outer surface of the heating member. A fence cutout is provided at the bottom of the support, and the airflow blown out from the top of the blower passes through the fence cutout and the air passage in order and is discharged out of the heating module. be.

In one embodiment, a coil is tightly wound around the outer surface of the heating member, and an air passage is formed between the inner surface of the support and the outer surface of the heating member, A fence cutout is provided at the bottom of the support, and the airflow blown out from the top of the blower passes through the fence cutout and the air passage in order and is discharged out of the heating module.

In one embodiment thereof, the interior of the support is provided with recessed grooves corresponding to the locations of the alignment ribs for mounting the magnetic stripe, and the top of the heating member is provided with a plurality of heating member mounting ears. a portion, wherein the heating member mounting ears are secured to the support by screws or down structure after sleeve connection of the heating member and the support;
Inside the support, quick mounting posts corresponding to the heating elements are distributed, and outside the support, a plurality of support mounting ears for mounting with the whole machine are distributed. there is

In one embodiment thereof, the heating module includes a temperature measuring member attached to the bottom of the heating member.

In one embodiment thereof, a mounting hole is provided near the center of the bottom of the heating member, and a boss is formed on the inner surface of the heating member around the mounting hole, the boss being formed on the inner surface of the heating member. A drainage channel is opened to guide the water flow of the heating member to the mounting hole, and an annular sleeve connection peripheral wall is formed around the mounting hole on the outer surface of the heating member, and the temperature measurement member is attached downward to the sleeve connection peripheral wall. the top of the temperature measuring member is exposed above the boss,
A water leakage hole is provided near the center of the horizontal support part of the support, the support is provided with a water leakage pipe around the outer bottom of the water leakage hole, and the sleeve connecting peripheral wall passes through the water leakage hole. After that, the water flow inside the heating member is discharged from the leak pipe after flowing into the sleeve connection peripheral wall through the drainage channel of the boss portion.

In one embodiment, the leak pipe includes a lid portion and a drainage portion that are sleeve-connected to the outside of the sleeve-connecting peripheral wall, and the lid portion is provided with a through hole on the side away from the blower. , the edge of the through-hole extends downward in a direction away from the lid portion to form the drain portion.

In one embodiment thereof, the heating element comprises a coil disc.

A cooking installation, the cooking installation comprising a heating module according to any of the above embodiments.

The heat dissipation structure, heating module and cooking equipment of the present invention can fully utilize the space around the support by installing the heat sink, the blower and the control member on the support. and to improve the compactness of the design of the cooking equipment, reduce the volume of the equipment, and prevent the vertical projection of the control member and the vertical projection of the blower from intersecting, so that the airflow from the blower can be blown to multiple parts. , can improve the heat dissipation efficiency. In addition, with such a compact design, the heat dissipation structure can be provided in the heating module as a single integrated structure, and the integrated design of the heat dissipation structure and the heating module can be realized, standardization is possible, and versatility is high. It is possible to avoid customized development for each product and shorten the development period for cooking equipment. At the same time, the difficulty of assembling the heating module and cooking equipment is also reduced, reducing material and process costs.

In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the drawings required for the description of the embodiments or the prior art will be briefly described. It is obvious that the drawings in the following description are only part of the embodiments of the present invention, and that those skilled in the art can obtain other drawings based on these drawings without creative efforts.

1 is a structural schematic diagram of a heat dissipation structure according to an embodiment; FIG. FIG. 2 is a structural schematic diagram of the L-shaped support of the heat dissipation structure shown in FIG. 1 according to one embodiment; FIG. 4 is a structural schematic diagram of a heat dissipation structure according to another embodiment; FIG. 4 is a structural schematic diagram of a heat dissipation structure according to another embodiment; FIG. 5 is a structural schematic diagram of a heat dissipation structure according to another embodiment; 1 is a schematic diagram of a three-dimensional structure of a heating module according to an embodiment; FIG. FIG. 4 is a three-dimensional schematic diagram of a heating module according to another embodiment; FIG. 4 is a schematic diagram of a three-dimensional structure of a heating module according to another embodiment; 1 is a perspective view of an assembled heating module according to one embodiment; FIG. 1 is a perspective structural schematic diagram of a heating module of one embodiment; FIG. 11 is a partially exploded view of the heating module shown in FIG. 10 according to one embodiment; FIG. 11 is a schematic half cross-sectional view of the heating module shown in FIG. 10 according to one embodiment; FIG. FIG. 2 is a structural schematic diagram of a support according to an example; FIG. 3 is a schematic diagram of air passages and waterproofing according to an embodiment; FIG. 2 is a schematic diagram of an air channel wall structure according to one embodiment; 11 is a partially exploded view of the heating module shown in FIG. 10 according to another embodiment; FIG. FIG. 4 is a structural schematic diagram of a support according to another embodiment;

In order to make the above objects, features and advantages of the present invention clearer, embodiments of the present invention are described in detail below with reference to the drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, the invention can be embodied in many other ways different from those described herein, and similar modifications can be made by those skilled in the art without departing from the spirit of the invention, thus , the invention is not limited to the specific examples disclosed below. The embodiments and specific features in the examples of the present application are detailed descriptions of the technical solutions of the present application and are not intended to limit the technical solutions of the present application. And it should be understood that the technical features in the examples can be combined with each other.

Note that when an element is referred to as being "fixed to" another element, it may reside on or be fixed through the other element. When one element is referred to as being "connected" to another element, it may be directly connected to the other element or connected via the other element. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for the purpose of illustration only and do not indicate the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art of this application. The terminology used in the specification of this application is for the purpose of describing particular embodiments only and is not intended to limit the application.

As used herein, ordinal terms such as “first,” “second,” etc. may be used to describe various components, which are referred to by these terms. Not limited. These terms are only used to distinguish one component from another. For example, a first component could be named a second component, and similarly a second component could be named a first component, without departing from the scope of the present invention.

The present invention provides a heating module, the heating module includes a coil disk, a coil support, an electric control motherboard, a blower and an air channel wall structure, the coil support is the main part, the coil disk, the electric A control motherboard, a blower and an air channel wall structure are attached to corresponding structures on the exterior and interior of the coil support, respectively. By making full use of the empty space below and laterally below the coil support, it is possible to achieve a compact configuration and ensure good heat dissipation.

The present invention provides a heat dissipation structure. The heat dissipation structure includes a support including a horizontal support and a vertical support connected to the horizontal support, a heat sink disposed on the support, and a blower disposed on the horizontal support. and a control member arranged on the longitudinally oriented support portion, wherein the vertical projection of the control member and the vertical projection of the fan do not intersect, i.e. the control member and the fan do not intersect in vertical projection.

In one embodiment, this "connection" may include connections in various combinations such as hinged, engaged, etc., and may include connections in which multiple members are integrally formed in a single piece. That is, the horizontal support portion and the vertical support portion may be connected by a combination of hinge connection, engagement, or the like, or the support may be formed by integral molding.

In one embodiment, the support is a component that serves to support components such as the blower, the control member and the heat sink of the heat dissipation structure or serves to hook or fasten to the blower, the control member and the heat sink of the heat dissipation structure. and the shape of the support may be an L-shaped support. For example, the support can be support 600 as shown in FIGS. 1-4, where support 600 shown in FIGS. , may exist in other forms and may have other names. For example, if there is no support 600 as shown in FIG. 1 in a heat dissipating structure, heating module or cooking equipment, and parts such as blowers, control members and heat sinks are fixed to the housing, then the housing is the heat dissipating Serving to support or latch or secure the blowers, control members and heat sinks of the structure, the housing provides support.

A control member is a component used to control one or more components, such as a fan, a heat sink, etc., of a heat dissipation structure, and also to control a heating module or other component of a cooking installation containing the heat dissipation structure. It may be used, for example, to control the coil discs of a heating module. The control member may be an electrical control motherboard. The blower blows air to discharge the heat generated from the heat dissipation structure, the heating module, and some of the heat-generating components of the cooking equipment, and may be a fan or other equipment with a blowing effect. good too. A heat sink may be positioned between the blower and the control member.

In one embodiment, as shown in FIGS. 1 to 4, the corresponding heat dissipation structure includes a duct-type heat sink 300 for heat dissipation of the power devices of the electrical control motherboard 100, and the electrical control motherboard 100 is attached to the heat sink 300. It is erected and supported to form an integrated structure together with the heat sink 300 . The overall structure consisting of the electrical control motherboard 100 and the heat sink 300 may form a generally L-shaped structure. It should be noted that the L-shaped structure here is only for the convenience of naming and explanation, and the heat sink 300 and the electrical control motherboard 100 are not assembled in a very standard L-shape, and the shape may change slightly. For example, if the horizontal length of the heat sink 300 is too long, its left end will protrude from the electrical control motherboard. In this case, the original L-shaped structure becomes a structure similar to the L-shaped structure, and if there are many protruding parts, it can be said that it is an inverted T-shaped structure. Of course, these designs can also achieve the purpose of the present invention, and likewise utilize the space under the electromagnetic induction coil disk, and fall within the protection scope of the present invention. In reality, the space between the heat sink and the electrical control motherboard does not need to be perfectly vertical due to design needs and assembly errors, and in some cases the electrical control motherboard may be arranged at an angle to the vertical direction. Alternatively, the heatsink may be placed at an angle to the horizontal, but in this case the L-shaped structure will not have the standard L-shape when viewed from the side, but will have a slightly deformed shape. This results in an L-shaped structure, and practical experience shows that even an inclination of less than 30° can achieve the purpose of the present application.

Attaching the structure consisting of the electrical control motherboard 100 and the heat sink 300 to the L-shaped support 600 mainly means that the heat sink 300 is placed on the horizontal support part 610, and the electrical control motherboard 100 is placed on the vertically oriented support portion 620, and "above" here does not only mean that the heat sink is placed above the horizontal support portion, but also the top, bottom, . Locations such as center, side, etc. may be included. As shown in several embodiments of the present invention, the mounting position of the heat sink and the electrical control motherboard is relatively flexible, and the final assembled overall structure presents a substantially L shape, and a part of the structure is the heating wire. It only needs to be able to get into the bottom of the disc and make good use of the space.

The heat dissipation structure includes a fan 200 mounted on the horizontal support portion 610 and located on the side of the heat sink 300 . The vertical projection of the electrical control motherboard 100 and the vertical projection of the fan 200 do not intersect. Normally, the heat sink is installed horizontally, and the side surface of the fan 200 faces the port of the duct of the heat sink 300. In this case, the side airflow blown out from the fan 200 can be controlled without a separate guide device. The heat is blown directly into the duct of the heat sink 300 to improve heat dissipation efficiency and simplify the structure.

In one embodiment, as shown in FIG. 1, the heat sink is located on the horizontal support portion and adjacent to the inside of one end of the vertical support portion, or the heat sink is located on the vertical support portion, Adjacent to the inside of the horizontal support section. The control member is arranged inside the longitudinal support part.

The heat sink 300 includes a heat absorbing substrate 310 vertically attached to the electrical control motherboard 100 and a plurality of fins 320 vertically formed on the heat absorbing substrate 310 . Two adjacent fins 320 cooperate with the heat absorbing substrate 310 to form a duct. The direction in which the ducts of the heat sink 300 extend matches the radial direction of the fan 200 . This allows the side airflow generated by the fan 200 to flow directly through the ducts of the heat sink 300 and quickly carry away the heat of the heat sink 300 .

In one embodiment, the L-shaped structure is attached to the inside of the L-shaped support 600 . The power device of the electrical control motherboard 100 is located on the side of the vertical support portion 620 behind the substrate body of the electrical control motherboard 100 . It should be noted that the L-shape is used here only for convenience of naming and description, and the horizontal support body portion 610 and the vertical support body portion 620 are not assembled in a very standard L-shape. Instead, in some situations, the shape of the L-shaped structure changes due to changes in the shape of the heatsink 300 and the electrical control motherboard 100, for example, if the heatsink 300 lateral length is too long, its left end is It may protrude from the control motherboard 100 . At that time, the designer may extend the base of the L-shaped support as necessary in order to ensure the support strength and the neat outer shell. It has a structure similar to a mold, and actually has a shape like an inverted T.

In one embodiment, in addition to the main part, the support has attached structures such as baffles, connecting parts, mounting holes, positioning parts, etc., which may cause changes in the specific shape of the support. Overall, the supports are still connected by horizontal and vertical parts. Any adjustment of these designs can still achieve the purpose of the present invention and is within the scope of protection of the present application. The L-shaped support 600 includes a horizontal support portion 610 and a vertical support portion 620 to which the horizontal support portion 610 is connected, the heat sink 300 is mounted on the horizontal support portion 610, and the electrical control motherboard 100 is located on the longitudinal support portion 620 . Further, the horizontal support portion 610 is provided with mounting holes 611 , and the fan 200 is mounted in the corresponding mounting holes 611 . Of course, providing the mounting holes in the horizontal support portion 610 is just one way of installing the fan 200, and in fact, the fan 200 can be installed in various ways using supports, fan baffles, etc. It may be mounted on a horizontal support portion 610 .

Partially or wholly closed mounting structures may be used to ensure airflow stabilization and accuracy. In addition to meeting the requirements of structural strength, it can also be more advantageous for guiding airflow, and finally improve aesthetics and dust resistance. Thus, through the L-shaped support 600, it can be realized that the relative positions of the fan 200, the heat sink 300 and the electrical control motherboard 100 are fixed.

In one example, references herein to "inside" and "outside" are references to relative positions, where "inside" a component is generally within the space enclosed or semi-enclosed by the corresponding component. and "outside" of a component generally refers to being located on one side outside of the space enclosed or semi-enclosed by the corresponding component. For example, inside the L-shaped structure generally means located in a region semi-enclosed by the L-shaped structure. Similarly, the inner side of the horizontal support portion of the support means being located in a region close to the horizontal support portion among the regions included in the horizontal support portion and the vertical support portion. The inner side of the vertical support portion of the support means being located in a region close to the vertical support portion among the regions surrounded by the horizontal support portion and the vertical support portion. The outer side of the horizontal support section and the outer side of the vertical support section are opposite to the description.

Description will be made with reference to FIGS. 3 to 5. FIG. Taking the upright position of the L-shaped support part as an example, the inner side of the horizontal support part 610 of the support 600 may be a region located at the upper end of the horizontal support part. The outer side of the portion 610 may be the region located at the lower end of the horizontal support portion, and the inner side of the vertical support portion 620 of the support 600 may be the region located at the right end of the vertical support portion, The outer side of the longitudinal support portion 620 may be the area located at the left end of the longitudinal support portion.

In one embodiment, the heat sink is arranged on the horizontal support portion and is adjacent to the outside of one end of the vertical support portion, or the heat sink is arranged on the vertical support portion and is outside the horizontal support portion. Adjacent, the blower is arranged outside the horizontal support portion and the control member is arranged outside said longitudinal support portion.

In one embodiment, the blower is located at or near the center of the horizontal support portion and the blower is located at or near the center of the outside of the horizontal support portion.

FIG. 3 is a structural schematic diagram of a heat dissipation structure according to another embodiment. Among them, the electrical control motherboard 100 is installed on the vertical support part 620, the heat sink 300 is installed horizontally in the opposite direction of the horizontal support part 610, and the fan 200 is on the horizontal support part 610 (not on the top here). so that the L-shaped structure and the L-shaped support 600 cooperate to form an approximately T-shape (inverted). Since the power device of the electronic control board 100 is located on the side surface of the vertical support portion 620 on the back of the board body of the electronic control board 100, it is easy to install, the mounting structure is relatively simple, and the heat sink is also relatively simple. In this embodiment, the airflow of the fan does not hit the components of the electrical control motherboard 100 directly, but blows on the board through the gap between the vertical support part 620 and the electronic control board 100, so the previous implementation The heat dissipation effect is slightly inferior to that of the example. However, by shortening the length of the horizontal support portion 610, it is possible to perform its function when the shape of the lower portion of the inductor coil disk 400 is not suitable for the arrangement of the L-shaped support.

FIG. 4 is a structural schematic diagram of a heat dissipation structure according to another embodiment of the present application. Here, the L-shaped structure is attached to the outside of its L-shaped support 600 . The power devices of the electronic control board 100 are located on the side of the board body of the electronic control board 100 facing the vertical support portion 620, but may of course be located on the other side. However, in this embodiment, the airflow of the fan does not hit the components of the electrical control motherboard 100 directly, but instead blows onto the electronic control board 100 through the vertical support portion 620, but passes through the frame structure, Heat dissipation efficiency does not decrease. In addition, since the electrical control motherboard 100 is located outside the L-shaped support, it is easy to assemble and can be directly inserted.

FIG. 5 is a structural schematic diagram of a heat dissipation structure according to another embodiment of the present application. Here, the fan 200 is separated from the side of the horizontal support part 610, and the fan 200 is not fixed to the L-shaped support 600 but is fixed separately. This of course affects the integrity of the present application, but the fan 200 is always placed on the side of the horizontal support portion 610 so that the space-saving inventive object of the present application can be achieved.

In addition, the L-shaped support 600 cooperates with the housing 500 to form the air passage wall structure 700, so that the complexity of the heat dissipation structure can be reduced and the difficulty of assembly can be reduced. Similarly, a support perimeter wall 630 may be added, although the mounting location differs from some of the examples above.

The heat dissipation structure of the embodiment of the present invention can be a universal integrated component, including heat dissipation components (fan, air channel wall, L-shaped support), and some heat generating components (heat sink, electric control motherboard parts). Such integrated heat dissipation structure can be applied to many induction coil heating electric equipment having arc-shaped inner pots such as rice cookers, voltage cookers, and rice cookers. Attachment to the body completes assembly of the entire induction heating module. INDUSTRIAL APPLICABILITY The heat dissipation structure according to the embodiment of the present invention is highly versatile, applicable to electric equipment heated by an induction coil having an arc-shaped inner pot, and having a fan portion and a heat sink portion (L-shaped support horizontal part) are located below or on the side of the heating module after assembly, and are installed so as to "stick" to the outer edge of the inner pot, so that the space at the bottom of the pot is fully utilized and the configuration is compact. , leaving sufficient space for other parts, which is very advantageous for the designer to complete the design of other parts.

In one embodiment, this heat dissipation structure may be applied to a heating module. Wherein, the heating module may include the heat dissipation structure according to any embodiment of the present invention, and further includes a heating member, and the projection of the blower is located within the projection of the heating member. The support covers the exterior of the heating element.

In one embodiment, the heating member may be the above-described coil disc, such as heating by electromagnetic induction, and the heating member may further include a heating member that heats by other methods, such as resistance heating.

In one embodiment, the heating module can be an electromagnetic induction heating module, as shown in FIG. 400 and the electrical control motherboard 100 . Inductor coil 400 is positioned above fan 200 . The inductor disk 400 is spirally wound into a concave shape, and guides the airflow generated by the fan 200 to the electronic control board 100 in this concave shape.

In this embodiment, the electromagnetic induction heating module further comprises an inwardly recessed heating wire disk 420 , which is located directly above the fan 200 . The electromagnetic induction heating module further includes a winding groove 421 in which the outer bottom surface and outer surface of the heating wire disk 420 are formed by arc-shaped ribs, and the inductor coil disk 400 is wound around the winding groove 421 . A part of the airflow generated by the fan 200 flows along the heating wire disk 420, like the airflow route 1 in FIG.

As shown in FIG. 6, by adopting the heat dissipation structure of this embodiment, the airflow generated by the fan 200 flows through three routes. Here, the airflow route 1 is such that the upward axial airflow generated by the fan 200 flows along the airflow passage between the inductor coil disk 400 and the support wall 413 and finally from the upper outlet of the housing 500 . This is the outflow route. In the airflow route 2, the side airflow of the fan 200 passes through the electronic control board 100 along the airflow passage between the support wall 413 and the L-shaped structure, bypasses the electronic control board 100 above, and flows downward. This is the path through which it flows and finally out of the outlet 520 . An airflow route 3 is a path through which the airflow on the side of the fan 200 flows out from the outlet 520 along the extending direction of the duct of the heat sink 300 .

After assembling the heat dissipation structure of the present invention into the inductor coil disk 400, such a layout of the L-shaped support 600, the inductor coil disk 400, the fan 200, the electronic control board 100, the heat sink 300 and the air channel wall can be replaced with the conventional layout. It is obviously different from the vertical stacking installation method, avoiding the problem that the conventional axial upward air flow dissipates the heat of the inductor coil disk 400 while dissipating the heat of the electronic control board and the heat sink, and the height of the heat dissipating structure is improved. , and part of the volume can be put under the inductor coil disc of products such as rice cookers, saving a lot of space, providing it as one main part, and improving the level of integration of the parts. Improve.

The present invention achieves precise control of airflow in the space of a compact integrated structure, dividing the airflow of the fan 200 into three parts, and two tangential airflows are used for the heat dissipation of the electric control motherboard 100 and the heat sink 300 respectively. and the axial airflow is used to dissipate heat from the inductor coil disk 400 (including the heating wire disk 420, etc.), so that each of the three airflows has its own route and can operate independently without interfering with each other. Reduces turbulence inside the housing and reduces energy loss. Airflow passes through all heat generating components within the housing and their paths do not overlap. Therefore, the entire heating module or housing does not have airflow "stagnation areas" and all airflows in the space co-operate well without interfering with each other.

The fan 200 is installed near the center below the inductor coil disk 400 so that the space at the bottom of the inductor coil disk 400 can be fully utilized. The air inlet of a conventional heat dissipation fan is often provided at the bottom of the housing, and the height of the fan can be kept small. Since the width of the part is remarkably reduced, it can be said that the space for installing other parts is also increased. In addition, by arranging the air outlet of the fan 200 in the axial direction close to the inductor disk 400, the wind pressure loss can be minimized, and the airflow can flow well along the gap on the outer surface of the inductor coil disk 400. , and the heat dissipation of the inductor coil disk 400 as a whole can be performed satisfactorily. This arrangement has its advantages even when the inductor coil disc 400 is in a substantially closed configuration, the axial airflow needing little to be directed through extraneous parts, and is directly pre-installed. is blown into the air gap between the inductor coil plate 400 and the support structure 410 through the cutouts, and quickly flows along the actual air path consisting of magnetic strips, coils, etc. to each part of the inductor coil disc 400, and finally The heating module is expelled through the inductor coil disk 400 or the outlet on the top of the support structure 410 .

The heat sink 300 is provided on the side surface of the fan 200 to effectively utilize the tangential airflow of the fan 200, and the hot air blown out from the heat sink 300 is directly discharged from the housing and blown to other electronic control board 100 components. , without interfering with other heat-dissipating airflows, ensuring the durability and effectiveness of heat dissipation. Also, in general, the duct of the heat sink 300 faces the side of the fan 200 away from the center of the inductor coil disk 400, and the height of the duct of the heat sink 300 is the side or side of the fan 200. In addition to being almost the same as the mouth, the distance is also very close. Thus, the tangential airflow of the fan 200 directly enters the duct of the heat sink 300 with higher wind pressure and air volume, improving heat dissipation efficiency. Preferably, the thickness of the motor is approximately the same as the thickness of the heat sink, the heat radiation fins are erected, the extending direction of the heat radiation fins is the same as the direction of air flow, and the width of the outlet formed by the air flow guide member is the width of the heat radiation. It is formed to substantially match the width of the fin or slightly larger than it. Thus, in guiding the lateral airflow, the horizontal airflow enters the radiating fins of the heat sink duct almost uniformly. If the direction of the heat sink duct and the direction of the airflow do not match, an additional airflow guide member is required to send the airflow in the same direction as the duct. This method can be used in certain cases, for example when the direction of the hot air flow is specifically required. In addition, by providing a bottom plate below the radiation fins, the directivity of the air current is given, and the heating of the bottom of the housing is avoided, so that the overall appearance can be improved.

As shown in FIG. 6 , the heat sink 300 is at least partially located within the vertical projection range of the inductor coil disk 400 , that is, the volume of the larger portion of the heat sink 300 is within the lateral lower space of the inductor coil disk 400 . This extra space can be fully utilized, which is particularly advantageous for products such as high-pressure cookers of rice cookers. The heatsink 300 is also installed horizontally, and its top cover isolates the hot air from the electronic control board and other parts of the heatsink, and also serves to guide the tangential airflow that blows through the air gap to the other parts. The heat sink 300 additionally fulfills the role of the bottom wall of the air passage, further saving space and improving the air flow passage. Of course, "horizontally installed" is not absolute, but can be considered to be substantially horizontal. If the space around the coil support can be fully utilized, the heat sink 300 may be installed on the side of the fan 200 at an angle of less than 30° to the horizontal.

In one embodiment, the electrical control motherboard 100 is erected with the short side down to keep most of the components away from the bottom and bottom edge regions of the inductor coil disk 400 where electromagnetic interference is strongest. and facilitates protection of components. Also, in products such as rice cookers, the diameter of the fan is usually no greater than the length of the short side of the circuit board. Since the electronic control board 100 is erected, the depth of the pot body can be fully utilized, and the space can be saved as much as possible. The electronic control board 100 is erected on the heat sink 300, for example, by being installed at the end of the heat sink 300 farther from the fan 200, so as to form a substantially L shape as shown in FIG. It is Both ends of this L-shaped structure may be inclined to some extent. That is, in certain cases, the heat sink and circuit board are arranged obliquely. As a result, most of the tangential airflow from the fan 200 flows outside the heat sink 300 , and a part of the tangential airflow flows through the end of the heat sink 300 close to the fan 200 side and the outer wall of the inductance coil disk 400 . The electronic control board and other parts of the heat sink 300 are sprayed upward from below through the gap between the . Of course, the electronic control board 100 may be installed at another position above the heat sink 300 , and the surface of the electronic control board 100 on which the components are arranged may not face the fan 200 .

Of course, erecting is not absolute, but may be considered to be substantially vertical. For example, if the inclination from the horizontal direction is within 5°, it is included in the allowable range. If enough space around the coil support is available, the electronic control board 100 may be placed on top of the heat sink 300 at an angle of less than 30° to the vertical, e.g. If there is enough space on the lower side, the electronic control board 100 is installed obliquely on the upper side of the heat sink 300, one end is inserted into the lower side of the inductor coil disk 400, and the other end is placed within the range of the heat sink as much as possible. Consider installing. This further reduces the height occupied by the circuit board, making the structure more compact. At the same time, the heat dissipation airflow can still be blown away from the surface of the components on the circuit board.

Since the L-shaped support 600 is the main part of the heat dissipation structure, the components such as the electric control motherboard 100, the heat sink 300, the fan 200, the air passage wall, etc. are assembled on the basis of the L-shaped support 600, and are originally dispersed. The individual parts are assembled in an L-shaped support 600 and integrated into a standard module of very small dimensions. Each component can be installed at its corresponding mounting position on the L-shaped support 600, and each component can be directly mounted on the L-shaped support 600 during production. Therefore, the heat dissipating structure of the present invention is very easy to assemble, the positioning accuracy between each part is very high, and the repair and replacement of related parts is very convenient. The module can be generalized, and can be applied to induction coil heating electric equipment having an arc-shaped inner pot such as various types or modes of rice cookers, voltage pots, and rice cookers as a single common part or common module. A person can develop a new product just by adding some additional functions and designing the appearance, housing, and panel of the product, which significantly reduces the overall development period and cost.

In one embodiment, the L-shaped support 600 further includes a support perimeter wall 630 that surrounds and surrounds the inner edges of the horizontal support portion 610 and the vertical support portion 620 . The edge of the portion extending outside of the support peripheral wall 630 substantially matches the shape of the arc-shaped outer edge of the heating wire disk 420, and the support peripheral wall 630, the electrical control motherboard 100, the heat sink 300, the fan 200 and the heating wire disk 420 are , close together to form an air passage cavity. Through the guidance of the peripheral wall, the side airflow of the fan 200 is guided to the electrical control motherboard 100 and blown out from the top of the airway cavity.

Mounting ears 631 are provided on the sides of the support perimeter wall 630 . The vertical support section 620 includes a support section stopper rib 621 vertically connected to the support peripheral wall 630 and a window frame 622 provided inside the vertical support section to provide an L-shaped support. The positioning of 600 and housing 500 can be facilitated and the weight of the support can be reduced. After the airflow generated by the fan 200 passes through the electronic control board 100 , a portion of the airflow may enter and pass through the window frame 622 through the lateral gap of the electronic control board 100 . However, most of the airflow can be overcome from above through the entire electrical control motherboard 100, directing this portion of the airflow out the bottom or center exhaust port of the housing. At this time, the heat radiation airflow with a certain wind pressure flows on the back side of the electronic control board and takes heat from the electronic control board. No reheating, rational installation of air channels, no mutual interference, no repeated heating.

In addition, the heat dissipation structure further includes an air passage wall structure 700 mounted on the horizontal support portion 610 to semi-enclose the fan 200 and guide the airflow generated by the fan 200 to the heat sink 300 . Specifically, the duct wall structure 700 includes a first duct wall 710 and a second duct wall 720 that are provided on both sides of the fan 200 and are parallel to each other. and an arc-shaped third air passage wall 730 connecting the second air passage wall 720, respectively. The first air passage wall 710 and the second air passage wall 720 also extend to both sides of the heat sink 300 . The airflow generated by the fan 200 is collected by the first airway wall 710 , the second airway wall 720 and the third airway wall 730 .

Since the heat-dissipating airflow generated by the fan 200 usually does not flow along the desired route, it is necessary to provide an air passage wall structure to guide the airflow. The air channel wall structure 700 of the present application is mainly used to guide airflow to the heat sink 300 and the electrical control motherboard 100 . Other elements of the electronic control board do not heat up as much, but a new airflow passage is formed, so the heat dissipation of the elements in this part is more uniform, the heat dissipation efficiency is improved, and all the air passages are effective as much as possible. to make the airflow in the module flow well, form a positive wind pressure around the electronic control board and the heat sink to avoid the airflow from interfering with each other, and the jetted airflow to the back side of the circuit board It fills the space and prevents hot air generated from other heat dissipating members from flowing back into the circuit board area. The mutual plug-in connection of each part improves the strength of the whole heat dissipation structure, makes the appearance neat and the internal structure compact. Of course, the configuration of the air passage wall is not limited to this, and it may be separate or integral, or may be distant or close to the blades, and various shapes are possible. , as long as it fulfills the side guide function.

Moreover, in this embodiment, the heat dissipation structure further comprises a support structure 410 for supporting the inductor coil disk 400 attached to the L-shaped support 600 . Corresponding to inductor coil disk 400, support structure 410 also has a concave shape. In one embodiment, the entire heat dissipation structure is attached to support structure 410 .

Further, in this embodiment, the support structure 410 further comprises a hollow support bridge 411 attached to the top of the channel wall structure 700 and a support part 412 attached to the support bridge 411, in particular, the support bridge 411: It is provided across the first air passage wall 710 and the second air passage wall 720 .

In one embodiment, as shown in FIG. 7, FIG. 7 shows a schematic diagram of the combination of the inductor coil disc, support structure and L-shaped support of the heat dissipation structure shown in FIG. Support structure 410 further includes an annular hollow support wall 413 positioned around support 412 . Thus, an airflow passage is formed between the inductor coil disk 400 and the support wall 413, and an airflow passage is also formed between the support wall 413 and the L-shaped structure. Such a multi-passage arrangement makes the flow of airflow by the fan more stable.

8 is a schematic diagram showing another configuration of the heat dissipation structure shown in FIG. The heat dissipation structure includes a housing 500 with an opening 510 on the bottom and an outlet 520 on the side toward the duct of the heat sink 300 . The L-shaped support 600 is arranged such that the mounting hole 611 is coaxial with the aperture 510 and the vertical support portion 620 is spaced from the side of the housing 500 having the outlet 520. Attached to housing 500 . Furthermore, the opening 510 is provided with a first fence 511 and the exit 520 is provided with a second fence 521 . Of course, the positions of the air outlets may be adjusted as necessary. For example, corresponding air outlets may be provided in the central part and upper part of the housing 500 so as to independently guide a plurality of airflows from the fan. good too.

In addition, the present application further provides an electromagnetic induction heating module, including the heat dissipation structure described in the above embodiments, further comprising a heating wire disk 420, the projection of the fan 200 is located within the projection of the heating wire disk 420 do. The outer edge of the extending portion of the support inner side of the support peripheral wall 630 substantially matches the shape of the outer edge of the heating wire disk 420, and the support peripheral wall 630, the L-shaped support 600, and the heating wire disk 420 are all closed to allow air flow. forming a road cavity.

In one embodiment, as shown in FIG. 9, FIG. 9 shows an assembled perspective view of another embodiment of the electromagnetic induction heating module of the present application. As can be seen from this figure, the advantages of the integrated heat dissipation structure are that the fan and heat sink are hidden under the inductor coil disk 400, and the entire integrated heat dissipation structure is attached to the support structure 410 via the L-shaped support 600. By fixing, by attaching a bottom plate to the heat sink 300 or by making the horizontal support part 610 cover the bottom of the heat sink 300, by providing the vertical support part with outlets so that the two air streams, horizontal and upward, can easily flow out of the heat dissipation structure. the outer edge of the portion of the support peripheral wall 630 extending inwardly of the support substantially matches the shape of the outer edge of the heating wire disk 420; becomes more rigorous and accurate. With the above design, all parts of the heat dissipation structure can be integrated into one, the structural strength is improved, the coupling with the coil disc is tight, the overall appearance is very neat and beautiful, and the internal gas is The flow is independent and orderly, and the heat dissipation air flow is directionless and does not rage, so the heat dissipation efficiency is high.

The electromagnetic induction heating module and heat dissipation structure of the present invention are designed by creatively designing the heat dissipation structure of the electromagnetic induction heating module, so that the structure is compact and the consistency is strong. It is also used for heat dissipation of other heat-generating parts (eg, inductor coil disk). The electromagnetic induction heating module and heat dissipation structure of the present invention are cleverly designed, highly practical, low cost and applicable to all kinds of cooking products.

10-17, in one embodiment of the present invention, the heating module comprises a coil disk 1, a coil support 2, an electrical control motherboard 4, a blower 5 and an air channel wall structure. The coil disk 1 is sleeve-connected inside the coil support 2, the blower 5 is placed below the bottom of the coil support 2, its central projection is located in the projection of the coil disk 1, the electrical control motherboard 4 is the heat sink It has a circuit board 41 arranged vertically on the upper part of 42 and a heat sink 42 arranged horizontally on the side of the blower 5 . The airway wall structure guides the airflow from the side of the blower 5 toward the electrical control motherboard 4 .

The coil support is the main part. The projection of the blower 5 is located within the projection of the coil disc 1 . The projection of heat sink 42 lies at least partially within the projection of coil disk 1 . The projection of the circuit board 41 and the projection of the coil disk 1 do not intersect.

Here, projection may be projection in the depth or height direction of the coil support 2 . That is, they may be projected onto a plane parallel to the bottom of the coil support 2 .

The coil support 2 generally covers the outside of the coil disk 1, and has a notch 21 at its bottom. It enters the gap between the coil disk 1 and is finally discharged out of the module.
A blower mounting structure 25 is provided near the center below the bottom of the coil support 2 .

The electronic control board 4 is formed in a substantially L shape, and the port of the duct of the heat sink 42 faces the side surface of the blower 5 .

Part of the airflow blown out from the side of the fan 5 is blown to the duct of the heat sink 42 and part is blown to the circuit board 41 through the gap between the top of the heat sink 42 and the outer surface of the coil support 2. .

In addition, the air passage wall structure guides the air flow that has passed through the gap between the top of the heat sink 42 and the outer surface of the coil support 2 and blows it onto the components on the circuit board 41, so that the center of the support air passage wall 23 It has support channel walls 23 for discharging out of the module from the top or the top.

Circuit board 41 may be provided on top of heat sink 42 at an angle of less than 30° to the vertical. The heat sink 42 may be provided on the side of the blower 5 at an angle of less than 30° with respect to the horizontal direction.

Such arrangement of the coil support 2, the blower 5, the circuit board 41, the heat sink 42, and the air passage wall differs greatly from the conventional arrangement in which they are vertically stacked. While dissipating the heat of 1, the problem of dissipating the heat of the electronic control board 4 is avoided, and the volume and assembly difficulty are greatly reduced. Progressively complete the precision control of airflow in a very compact structure space, divide the airflow of the blower 5 into three parts, the two tangential airflows are respectively connected to the circuit board 41 of the electric control motherboard 4 and the heat sink. 42 is used for heat dissipation, and the axial airflow is used for the heat dissipation of the coil disk 1 (including the disk body, coil, magnetic strip, etc.), so that the three airflows each have their own route and do not interfere with each other. can operate independently, reducing turbulence inside the housing and reducing energy loss. Multiple airflows pass through all heat-generating components in the housing to fill nearly each space, and their paths do not overlap. Therefore, the entire heating module or housing has no "stagnation areas" for airflow and all airflows in the space flow without interfering with each other and cooperate well.

The blower 5 is arranged near the center below the coil disk 1, so that the space at the bottom of the coil disk 1 can be fully utilized. Conventionally, the air inlet of the heat radiating fan is often provided on the bottom surface of the housing, and the height of the fan can be kept low. Therefore, it can be said that the space for installing other parts is increased. In addition, by arranging the axial outlet of the blower 5 close to the coil disk 1, the wind pressure loss can be suppressed as much as possible, and the airflow can flow well along the gap on the outer surface of the coil disk 1. , the heat dissipation of the entire coil disk 1 can be performed well. This arrangement has its advantages even when the coil support 2 is substantially closed over the coil disc 1, since the axial airflow hardly needs to be guided by any extra parts, It is blown directly through the notch 21 into the air gap between the coil disk 1 and the coil support 2, and blows each of the coil disks 1 along the actual air path consisting of the magnetic strip 26, the coil 3, the ribs 12 of the strip, etc. part and finally exits the heating module through the upper outlet of the coil disk 1 .

The heat sink 42 is provided on the side surface of the blower 5, effectively utilizing the tangential airflow of the blower 5, and the hot air blown out from the heat sink 42 is directly discharged from the housing and blown to other electronic control board 41 components. , without interfering with other heat-dissipating airflows, ensuring the durability and effectiveness of heat dissipation. Also, normally, the duct of the heat sink 42 faces the side face away from the center of the coil support 2 of the blower 5, and the duct port of the heat sink 42 is located at the side or side outlet of the blower 5. and the distance is very close, the tangential airflow of the blower 5 directly enters the duct of the heat sink 42 with higher wind pressure and air volume, improving heat dissipation efficiency. Of course, it is preferable that the thickness of the motor and the thickness of the heat sink are substantially the same, the radiation fins are erected, and the direction of extension of the fins is the same as the direction of the airflow. In this way, the airflow enters the radiating fins of the duct of the heat sink relatively uniformly when guiding the side airflow.

In addition, directivity is imparted to the flow of the air current by further providing one bottom plate below the heat radiating fins. If the direction of the heat sink duct and the direction of the airflow do not match, an additional airflow guide member is required to send the airflow in the same direction as the duct. In certain cases, this method can be used, for example, when there are special demands on the direction of the hot air flow.

In one embodiment, contrary to the above description, the blower has a function of blowing outside air into the air passage cavity and a function of drawing out the air inside the air passage cavity from the blower. Become a wind inlet.

In one embodiment, as shown in FIG. 14, at least a portion of heat sink 42 is located within the vertical projection range of coil disk 1, i.e., the volume of the greater portion of heat sink 42 is lateral to inductor coil disk 1. Located in the lower space, the extra space can be fully utilized, which is particularly advantageous for products such as high-pressure cookers of rice cookers. Also, the heat sink 42 is installed horizontally, and its top cover isolates the hot air from the other parts of the electronic control board 4, and serves to guide the tangential airflow that blows the other parts through the gap. That is, the heat sink 42 also fulfills the role of the bottom wall of the air passage, further saving space and improving the air flow passage. Of course, "horizontally installed" is not absolute, but can be considered to be substantially horizontal. The heat sink 42 may be mounted on the side of the blower at an angle of less than 30° to the horizontal if the space around the coil support can be fully utilized.

The circuit board 41 is preferably erected with the short side down and the long side sideways, but the object of the present application can be achieved even if the long side is down. With the short side down, most of the components can be kept away from the bottom and bottom edge regions of the coil disk 1 where electromagnetic interference is strongest, facilitating protection of the components. For products such as rice cookers and voltage cookers, the circuit board 100 is installed upright so that the depth of the pot body can be fully utilized and the space can be saved as much as possible. In the present application, the circuit board 41 is erected above the heat sink 42 , and the most suitable position is the end of the heat sink 42 away from the blower 5 . In this way, as shown in FIG. 14, a substantially L-shaped structure is obtained.

Here, the reason why the side shape of the electronic control board 4 is L-shaped is to explain the positional relationship between the circuit board and the heat sink in an easy-to-understand manner. It is not limited. Since the thickness of the heat sink 42 is different from the thickness of the circuit board 41 and various parts are mounted on the circuit board 41, it is practically impossible to limit the shape to an L shape. The two sides of the L-shaped structure may be slanted to some extent. In certain cases, the L-shape formed at this time is not a standard L-shape because the heat sink and circuit board are placed at an angle. Also, if the circuit board 41 does not adhere to the edge of the heat sink 42, for example, if it is slightly offset from the left edge, the overall electronic control board 4 does not look like a standard L-shape. However, any of these installation methods can be regarded as approximately L-shaped and can achieve the purpose of the present application. Most of the tangential airflow blown out from the blower 5 flows to the heat sink 42, and a part of the tangential airflow passes through the gap between the end of the heat sink 42 close to the blower 5 and the outer wall of the coil support 2 to the electrons. The air is blown up from below to other parts of the control board 4, and the heat generated in this part is not so intense. By effectively utilizing the air path, the air flow in the housing is sufficiently circulated to form positive air pressure around the electronic control board 4, fill the space behind the circuit board, and generate heat from other heat dissipating members. To avoid the hot air generated from flowing around the area of the circuit board.

In one embodiment, the electronic control board 4 may be installed at another location on top of the heat sink 42 , and the side of the circuit board 41 on which the components are arranged may not face the blower 5 . Of course, the vertical installation is not absolute, but can be considered to be approximately vertical. For example, if the inclination is within 5°, it is included in the allowable range. The circuit board 41 may be placed on top of the heat sink 42 at an angle of less than 30° to the vertical if sufficient space around the coil support is available. For example, if there is enough space in the side lower part of the coil support 2, the circuit board 41 is obliquely installed on the upper part of the heat sink 42, one end is inserted into the side lower part of the coil support 2, and the other end is inserted into the side lower part of the coil support 2. should be placed as close to the heat sink as possible. As a result, the height of the circuit board can be further reduced to make it more compact. At the same time, the heat dissipation airflow can still be blown away from the surface of the components on the circuit board.

In the heating module, the coil support 2 may be the main part. That is, the parts such as the coil disk 1, the electric control motherboard 4, the blower 5, the temperature measuring member 6, and the wall of the air passage can all be assembled with the coil support 2 as a reference. These parts can fully utilize the space around, under and directly below the coil support 2, concentrating the originally dispersed parts near the coil support 2 and making the dimensions very large. Can be integrated into small standard modules. Since each component has a corresponding mounting structure on the coil support 2, each component can be directly inserted into the coil support 2 during production. Therefore, the heating module of the present invention is very easy to assemble, the positioning accuracy between each part is very high, and the repair and replacement of related parts is very convenient. In addition, it is possible to increase the versatility of the module with a compact structure, and to reduce the overall cost. It can be applied to induction coil heating electrical equipment with an arc-shaped inner pot such as , and designers can develop new products by adding some additional functions and adding product appearance, housing, and panel design. The overall development period is significantly shortened and the cost is significantly reduced.

10 to 11, the coil disk 1 of the present invention has a downwardly recessed container shape. For example, referring to FIG. 1, in this embodiment the coil disk 1 is generally bowl-shaped. In a preferred embodiment, the coil support 2 covers the outside of the coil disc 1 and the shape of the coil support 2 may be adapted to the coil disc 1 . In this case, between the coil disk 1 and the coil support 2 a substantially closed space is formed in which the coil 3 is accommodated. With this configuration, a plurality of air passages surrounding the coils are formed by using the existing coil disk 1 and the coil support 2, so that the axial airflow blown upward from the blower 5 is guided to quickly complete the module. It is possible to prevent the heat of the coil disk 1 from diffusing to a poorly dissipated area while allowing it to pass through and flow out. Of course, the coil support 2 may also be of non-closed construction. In this case, the coil support 2 does not cover the entire area of the coil disk 1, leaving only enough support to support the coil disk 1, magnetic strip supports and the like. In this case, the weight and production cost can be reduced, and the main purpose of the present application can be achieved, the module volume is better controlled, but the heat dissipation effect is inevitably reduced, and the airflow control is also large. descend.

Referring to FIG. 17, a fan mounting structure 25 is provided near the center of the outer bottom of the coil support 2, and the fan mounting structure 25 is mainly two fan fixing ears.

In order to guide the airflow from the blower 5 to the electronic control board 4 to discharge the heat, the present invention provides an air channel wall structure on the side and bottom of the coil support 2 . Of course, in different embodiments, the fan channel wall structure may be provided on the fan.

The channel wall structure has a fan channel wall 22 and a support channel wall 23 . The blower air passage wall 22 guides the side airflow generated by the blower 5 toward the heat sink 42 and the circuit board 41 . The support airway wall 23 guides the airflow passing through the gap between the top of the heat sink 42 and the outer surface of the coil support 2 to blow it toward the components on the circuit board 41 . (above the circuit board) for ejection from the module. Theoretically, the air channel wall structure can comprise only the fan channel wall 22, and this design can also substantially achieve the purpose of the present invention. However, since there is no air passage wall provided between the circuit board 41 and the housing of the coil support 2, the airflow through the gap between the top of the heat sink 42 and the outer surface of the coil support 2 is substantially restricted to the circuit. Blow in the direction of the substrate. The airflow blown onto the circuit board may not be properly directed and may be discharged around the circuit board, increasing the temperature of the housing and impairing heat dissipation efficiency.

In one embodiment, the air passage wall structure includes a first portion and a second portion, the first portion being arched and surrounding one side of the fan, and the second portion being a wind wall. It extends along both ends of the first portion of the passageway wall in the direction of the control member.

In one embodiment, the channel wall structure includes a third portion and a fourth portion, the third portion being away from the second portion of the channel wall from the trailing edge of the second portion of the channel wall. direction and then extending upward along the outer side of the support to a position near the top of the support, the fourth part being near the top of the support and the fourth part of the channel wall. It connects to the extended ends of the three parts.

In one embodiment, the channel wall structure includes a fifth portion corresponding to the second portion of the channel wall, and each one side portion of said fifth portion of the channel wall has a corresponding second portion. From a position close to the tip of section 2, it extends progressively closer to the other side of section 5 and in a direction toward the control member.

The first portion of the air passage wall is the first air passage wall, the second portion is the second air passage wall, the third portion is the third air passage wall, the fourth portion is the fourth air passage wall, and the fifth portion is the fourth air passage wall. An example in which the portion is the fifth air passage wall will be described. The fan air passage wall 22 has a first air passage wall 201 , two second air passage walls 202 and two fifth air passage walls 202 .

The first air channel wall 201 is connected to both ends of the fan mounting structure 25 away from the electric control motherboard 4 at both ends, and surrounds one side of the fan 5 . Preferably, the first airway wall 201 is arcuate.

The two second air passage walls 202 are respectively connected to the two ends of the blower mounting structure 25 near the electric control motherboard 4 at the ends, and each second air passage wall 202 is connected to the opposite second air passage wall 202 , and extends in a direction toward the electrical control motherboard 4 . Preferably, the two second air passage walls 202 are formed in a fan shape in contact with the first air passage wall 201 and extend toward the electrical control motherboard 4 .

The two fifth air passage walls 205 correspond one-to-one with the two second air passage walls 202, and each fifth air passage wall 205 is positioned close to the tip of the corresponding second air passage wall 202. , gradually approaches the fifth air passage wall 205 on the opposite side and extends in the direction toward the electric control motherboard 4 .

Of course, the fan channel wall 22 may further comprise a sixth channel wall (not shown) for tangentially guiding some of the axial airflow.

The support airway wall 23 has two third airway walls 203 and a fourth airway wall 204 .

The two third air duct walls 203 extend upward from the tail ends of the two second air duct walls 202 along the outer side of the coil support 2 after extending away from the second air duct walls 202 . It extends to a position close to the top of the coil support 2 . Preferably, the two third air channel walls 203 are arranged substantially parallel to the plane of symmetry of the two fan fixing ears of the fan mounting structure 25 .

A fourth channel wall 204 is located close to the top of the coil support 2 and is connected to the extended ends of the two third channel walls 203 . Here, the electrical control motherboard 4 is fixed in an air passage cavity consisting of two third air passage walls 203 and a fourth air passage wall 204 .

Of course, if the coil support 2 is non-closed, the support channel wall 23 may further comprise a seventh channel wall (not shown) for covering part of the outer surface of the coil support 2. can. The seventh air channel wall can effectively separate the air currents blown against the coil support 2 and the circuit board 41 to avoid interference with each other. However, this isolation is not as effective as a closed coil support.

Also, in other embodiments, the channel wall structure may be a one-piece, or nearly one-piece structure. In practice, any known structure for guiding airflow can be adopted as the airflow wall structure, and the airflow wall structure may be used as long as it functions to guide airflow to the electric control motherboard.

Referring to FIG. 14, there are mainly the following three air passage paths along which the air flow passes in this embodiment.

Air path 1: The airflow enters from the bottom of the blower 5 and is blown out sideways. As shown in F1 in FIG. 14, the airflow blown out to the side is collected through the fifth air passage wall 205 and becomes wind pressure, and a part of the airflow is blown toward the heat sink 42, and the rack of the heat sink 42 is blown. Carry heat out of the module through the surface.

Air passage 2: The airflow enters from the bottom of the blower 5 and is blown out sideways. As shown in F2 of FIG. 14, the airflow blown out to the side of the blower 5 is collected via the second air passage wall 202 and the fifth air passage wall 205 and becomes wind pressure, and a part of the airflow is applied to the heat sink. 42 and the outer surface of the coil support 2, and then pass through the parts of the circuit board 41 and the fence grooves of the fourth air passage wall 204 from the bottom to the top in order. It is discharged outside the module.

Air passage 3: The airflow enters from the bottom of the blower 5 and is blown out sideways. As shown by F3 in FIG. 14, the airflow blown to the top of the blower 5 passes through the notch 21 at the bottom of the coil support 2, the gap between the inner surface of the coil support 2 and the outer surface of the coil disk 1, in order. It is discharged out of the module via

The heating module of the present invention has a coil support as its main component, and integrates a coil disk, an electronic control board, a blower, a temperature measuring member, and an airflow passage into a standard module with very small dimensions, which is easy to install and versatile. High , low overall cost, extremely short overall development period, high heat dissipation effect, suitable for cooking products such as IH rice cooker and pressure cooker.

In one embodiment, referring to FIG. 10, an IH heating module includes a coil disk 1, a coil support 2, an electrical control motherboard 4, a blower 5, and a temperature measurement member 6. The coil support 2 is the main component, the coil disk 1 is sleeve-connected inside the coil support 2, the temperature measurement member 6 is mounted on the bottom of the coil disk 1, and the electric control motherboard is mounted on the outer side of the coil support 2. 4 are attached and a blower 5 is attached to the outer bottom of the coil support 2 .

Details of each configuration in the first embodiment will be described below.

10 to 11, the coil disk 1 of the present invention has a downwardly recessed container shape. For example, referring to FIG. 10, the coil disc 1 is generally bowl-shaped. The coil support 2 covers the outside of the coil disk 1, and the shape of the coil support 2 may be adapted to the coil disk 1. As shown in FIG. Quick mounting posts 25 corresponding to the coil disk 1 are distributed inside the coil support 2, and a plurality of coil disk mounting ears 13 are provided on the top of the coil disk 1, and the coil disk mounting ears 13 After the coil disk 1 and the coil support 2 are sleeve-connected, they are fixed to the quick mounting column 25 of the coil support 2 by screws or a downward structure to realize quick mounting. Outside the coil support 2, a plurality of support mounting ears 22 for mounting with the whole machine are distributed, the support mounting ears 22 having a sleeve shape and sleeve-connected to the upper and lower housing structures respectively, Provides quick and easy installation.

14 and 9, a mounting hole is provided near the center of the bottom of the coil disk 1, and a boss 14 is formed on the inner surface of the coil disk 1 around the mounting hole. A drainage channel is opened on the inner surface of the coil disk 1 to guide the water flow to the mounting hole, and the outer surface of the coil disk 1 is formed with an annular sleeve connection peripheral wall 15 around the mounting hole.

The temperature measuring member 6 includes a temperature measuring device 61 and a spring 62. After the temperature measuring device 61 is downwardly tightened on the sleeve connecting peripheral wall 15, the spring 62 supports the temperature measuring device 61 and the temperature measuring device 61 is exposed above the boss 14 and pushes down the temperature measuring device 61 after the heating container is put in.

As shown in S1 of FIG. 14 , a water leakage hole is provided near the center of the bottom of the coil support 2 to realize waterproof and drainage, and a water leakage pipe 23 is provided around the outer bottom of the water leakage hole of the coil support 2 . is provided, and when the coil disc 1 is inserted into the coil support 2, the sleeve connection peripheral wall 15 is sleeve-connected inside the leak pipe 23 after passing through the leak hole, and the water flow inside the coil disc 1 flows through the boss portion 14 After flowing into the sleeve connection peripheral wall 15 through the drainage channel, the water is discharged from the leakage pipe 23 .

More preferably, in order to prevent the water flow from entering the blower 5 and spraying the electronic control board 4 to short-circuit the electronic components, see FIG. 13, the water leakage pipe 23 is divided into two sections, That is, it is divided into a lid portion 231 sleeve-connected to the outside of the sleeve connection peripheral wall 15 and a drainage portion 232, and a semicircular through hole is formed on the side of the lid portion 231 away from the blower 5. The through hole may have a shape of , and the edge of the through hole may extend downward in a direction away from the lid portion 231 to form a drainage portion 232 .

11 and 12 , a plurality of arranging ribs 11 are installed on the outer surface of the coil disk 1 , each arranging rib 11 includes a spacer 111 and a coil groove 112 , and the spacers 111 form the coil disk 1 . A coil groove 112 for accommodating the coil 3 is formed between two adjacent spacers 111 distributed in the outer part, the outer bottom part, and the corner connecting the outer part and the outer bottom part. It provides coil grooves 112 and prevents short circuits between the coils 3 . The coil 3 is wound around the outer peripheral surface of the coil disk 1 according to the order of the coil grooves 112, and the effect of simultaneously heating the bottom and sides of a heating container such as a pot can be obtained, and the heating effect of the heating container can be made more uniform. can be done. In order to make heat generation more uniform, it is preferable that the plurality of array ribs 11 be distributed uniformly radially on the outer surface of the coil disk 1 with the sleeve connection peripheral wall 15 as the center.

In order to enhance the heat dissipation effect of the coil 3, one stripe-shaped rib 12 is provided under each array rib. extending to the outer part of the The striped ribs 12 support the coil 3 so as to form a gap between the outer peripheral surfaces of the coil 3 and the coil disk 1 . Referring to FIG. 13 , a fence cutout 21 is provided at the bottom of the coil support 2 , and the airflow blown out from the top of the blower 5 flows through the fence cutout 21 , the inner surface of the coil support 2 and the coil disk 1 . It is discharged out of the heating module through the gap with the outer surface.

The direction in which the array ribs 11 and the striped ribs 12 extend is not limited as long as it covers the outer portion, the corner portions, and the outer bottom portion from below. In this embodiment, the direction in which all the array ribs 11 and the stripe-shaped ribs 12 extend is parallel to the longitudinal section of the coil disk 1 .

Here, the inside of the coil support 2 is provided with recessed grooves corresponding to the positions of the alignment ribs 11 for mounting the magnetic stripe. Since the magnetic stripe generally has a striped shape, the concave groove in this embodiment is divided into a horizontal portion and an inclined portion so that the vertical magnetic grains 24 and the bottom magnetic stripe 25 are formed to facilitate mounting of the magnetic stripe. Located in the horizontal part of the groove, the vertical magnetic grains 24 are close to the leak hole, and the outer magnetic stripe 26 is positioned in the slope of the groove.

In one embodiment, the heating member may not be provided with alignment ribs and winding grooves, and the coil is wound around the outer surface of the heating member in a close-wound manner, and between the inner surface of the support and the outer surface of the heating member. A ventilation channel is formed in the support and a fence cutout is provided in the bottom of the support. The airflow blown out to the top of the blower passes through the cutout of the fence and the ventilation passage in order and is discharged out of the heating module. The close winding method can reduce the number of parts of the heating module and reduce the complexity of manufacturing the heating module.

Referring to FIG. 11, the electronic control board 4 is L-shaped and includes a circuit board 41 and a heat sink 42. In this embodiment, after the module is assembled, the circuit board 41 is installed vertically and the heat sink is 42 is installed horizontally, the heat sink 42 is designed in the shape of a rack, and the direction of the rack and the flow direction of the air flow match. Of course, it goes without saying that the heat sink 42 may be installed vertically and the circuit board 41 may be installed horizontally.

In this embodiment, the electromagnetic heating control module and the EMC module are integrated on the circuit board 41 . The electromagnetic heating control module and the EMC module can also be separately installed, the electromagnetic heating control module is installed on the circuit board 41, and the EMC module is installed at another position on the outer side of the coil support 2. Good and understandable. As indicated by the dotted line in FIG. 14, 100 indicates an EMC module circuit board provided separately.

13, the fan mounting structure 25 is installed near the center of the outer bottom of the coil support 2. The fan mounting structure 25 is mainly two fan fixing ears, and the airflow blown out from the fan 5 is In order to guide the heat to the electronic control board 4 and discharge the heat, the present application installed an air channel wall structure at the bottom of the coil support 2 .

Specifically, the air passage wall structure of this embodiment includes a first air passage wall, two second air passage walls, two third air passage walls, a fourth air passage wall, and two fifth air passage walls. an air channel wall;

The first air passage wall 201 is connected to both ends of the blower mounting structure 25 on the side away from the electric control motherboard 4 at both ends, and surrounds one side of the blower 5 . Preferably, the first airway wall 201 is arcuate.

The two second air passage walls 202 are respectively connected to the two ends of the blower mounting structure 25 close to the electric control motherboard 4 side, and each second air passage wall 202 is connected to the second air passage wall on the opposite side. It extends in the direction away from 202 and toward the electrical control motherboard 4 . The two second air passage walls 202 are formed in a fan shape in contact with the first air passage wall 201 and preferably extend in the direction of the electrical control motherboard 4 .

The two third air passage walls 203 extend upward from the tail ends of the two second air passage walls 202 along the outer side of the coil support 2 after extending in a direction away from the second air passage walls 202 . and extends to a position close to the top of the coil support 2 . The two third air channel walls 203 are preferably arranged substantially parallel to the plane of symmetry of the two fan fixing ears of the fan mounting structure 25 .

A fourth channel wall 204 is located close to the top of the coil support 2 and is connected to the extended ends of the two third channel walls 203 . Here, the electrical control motherboard 4 is fixed in an air passage cavity consisting of two third air passage walls 203 and a fourth air passage wall 204 .

The two fifth air passage walls 205 are in one-to-one correspondence with the two second air passage walls 202, and each fifth air passage wall 205 is viewed from a position near the tip of the corresponding second air passage wall 202. , gradually approaches the fifth air passage wall 205 on the opposite side and extends in the direction toward the electric control motherboard 4 .

In one embodiment, referring to FIGS. 9, 15 and 17, the heat dissipation structure further comprises a motherboard support 7 and a fan cover 8, the electrical control motherboard 4 is fixed to the motherboard support 7, and the fan cover 8 covers the blower 5. The air channel wall structure has a first air channel wall 201 , two fifth air channel walls 205 and a peripheral air channel wall 206 .

The first air passage wall 201 is connected to both ends of the blower mounting structure 25 on the side away from the electric control motherboard 4 , has an arch shape, and surrounds one side of the blower 5 .

The two fifth air passage walls 205 are connected at their ends to the ends of the blower mounting structure 25 near the electric control motherboard 4, and each fifth air passage wall 205 extends in the direction toward the electric control motherboard 4. .

The air duct peripheral wall 206 is a closed whole enclosing structure, and two sections extending upward along the outer side of the coil support 2 of the air duct peripheral wall 206 are provided with slide rails 2061 to support the motherboard. The body 7 is engaged with the air passage peripheral wall 206 from the slide rail 2061 and connected to the blower cover 8, and the air passage peripheral wall 206 is closed together with the motherboard support 7 and the fan cover 8 to form an air passage cavity.

In this embodiment, the heating module can be further integrated by using the air passage peripheral wall 206 instead of the above-described second air passage wall 202, third air passage wall 203, and fourth air passage wall 204. .

In one embodiment, a cooking facility is provided comprising a heating module according to each embodiment of the present disclosure.

The heating module of the present invention, with the coil support as the main component, integrates the coil disk, electronic control motherboard, blower, temperature measurement member, and airflow passage into a standard module with very small dimensions, which is easy to install and versatile. It has high heat dissipation, low overall cost, extremely short overall development period, high heat dissipation and waterproof effect, and can be applied to cooking products such as IH rice cookers and pressure cookers.

Although the embodiments of the present invention have been described above with reference to the drawings, the present invention is not limited to the above-described embodiments, and the above-described embodiments are illustrative and restrictive. Instead, a person skilled in the art can make many forms after receiving the teaching of the present invention without departing from the spirit and scope of the claims of the present invention, which fall within the protection scope of the present invention.

It is understood that a person skilled in the art may make modifications or changes based on the above description, and all such modifications and changes fall within the protection scope of the appended claims of the present application.

Claims (30)

a support comprising a horizontal support portion and a vertically oriented support portion connected to said horizontal support portion;
a heat sink disposed on the support;
a fan positioned on the horizontal support;
a control member disposed on the longitudinally oriented support portion;
the vertical projection of the control member and the vertical projection of the blower do not intersect,
The heat dissipation structure, wherein the blower is a fan that sucks air toward the control member. The heat dissipation structure of claim 1, wherein the heat sink is positioned between the blower and the control member. The heat sink is arranged on the horizontal support portion and proximate to the inside of one end of the vertical support portion, or the heat sink is arranged on the vertical support portion and inside the horizontal support portion. close to
2. The heat dissipation structure according to claim 1, wherein said control member is arranged inside said longitudinal support portion. The heat sink is arranged on the horizontal support portion and adjacent to the outside of one end of the vertical support portion, or the heat sink is arranged on the vertical support portion and outside the horizontal support portion. close to
The blower is arranged outside the horizontal support,
2. The heat dissipation structure according to claim 1, wherein said control member is arranged outside said longitudinal support portion. The blower is positioned at or near the center of the horizontal support,
The heat dissipation structure according to claim 3 or 4, wherein the blower is arranged at or near the center of the outer side of the horizontal support portion. 5. The support according to claim 4, wherein the support is an L-shaped support, and the structure comprising the control member and the heat sink and the support together form a T-shape. heat dissipation structure. The flow of airflow by the blower includes any one or more of the following situations,
The airflow passes through the heat sink via the rack surface of the heat sink and is blown out from the gap between the connecting portions that connect the horizontal support portion and the horizontal support portion in the support,
The air is blown onto the control member through a gap at the top of the heat sink, blows through the control member, and is blown out from a gap of a connecting portion connecting the horizontal support portion and the horizontal support portion in the support. The heat dissipation structure according to claim 1. The heat dissipation structure includes an air passage wall structure,
The air passage wall structure is disposed on the horizontal support portion and surrounds or semi-encloses the blower, the air passage wall structure directing the side of the airflow by the blower toward the heat sink or the control member. 2. The heat dissipation structure according to claim 1, wherein the heat dissipation structure is guided. The air channel wall structure directs the airflow passing through the gap between the top of the heat sink and the outer surface of the support toward the component of the control member and discharges from the middle or upper part of the air channel wall structure. 9. The heat dissipation structure of claim 8, including a portion of the module that guides the heat dissipation structure. the channel wall structure includes a first portion and a second portion;
the first portion has an arch shape and surrounds one side of the blower;
9. The heat dissipation structure according to claim 8, wherein the second portion extends in the direction of the control member along both ends of the first portion of the air passage wall. the channel wall structure further includes a third portion and a fourth portion;
The third portion extends outward from the tail end of the second portion of the air channel wall in a direction away from the second portion of the air channel wall and then upwardly along the outer side of the support. extending to a position proximate to the top of the support,
11. The heat dissipation structure as claimed in claim 10, wherein the fourth portion is located near the top of the support and connects to the extended end of the third portion of the channel wall. The channel wall structure further includes a fifth portion corresponding to the second portion of the channel wall,
Each one-side portion of the fifth portion of the air passage wall gradually approaches the other side of the fifth portion from a position close to the tip of the corresponding second portion and moves toward the control member. 12. The heat dissipation structure as claimed in claim 11, wherein the heat dissipation structure extends in two directions. The airflow blown out from the side of the blower is collected through the second portion of the air passage wall and the fifth portion of the air passage wall to form wind pressure, and a portion of the air flow is blown against the heat sink, A portion of the airflow passes through the gap between the top of the heat sink and the outer surface of the support to carry heat out of the heat dissipation structure through the rack surface of the heat sink. from bottom to top, passing through the parts of the control member and the fence groove of the fourth part of the air passage wall in order, and discharged out of the heat dissipation structure. The heat dissipation structure described in . said horizontal support section including a motherboard support and a blower cover, said control member being secured to said motherboard support;
Said channel wall structure further comprises a channel peripheral wall, said channel peripheral wall being a closed full enclosure structure extending upwardly along an outer side of said support in said channel peripheral wall 2. Each of the two sections is provided with a slide rail,
The motherboard support is engaged with the air duct peripheral wall from the slide rail and connected to the blower cover, and the air duct peripheral wall surrounds the motherboard support and the fan cover to form an air duct cavity. The heat dissipation structure according to claim 8, characterized in that: the control member includes an electromagnetic heating IH control module and an external memory controller EMC module;
both the IH control module and the EMC module are integrated on a circuit board of the control member, or
The IH control module and the EMC module are installed separately, the IH control module is installed on the circuit board, and the EMC module is installed at another position on the outer side of the support. The heat dissipation structure according to claim 1, characterized in that: said horizontal support portion and said vertical support portion are connected by a hinge connection or engagement, or
2. The heat dissipation structure according to claim 1, wherein the horizontal support portion and the vertical support portion are connected by integral molding. A heating module comprising the heat dissipation structure according to any one of claims 1 to 15,
further comprising a heating element, wherein the projection of the blower is located within the projection of the heating element;
A heating module, wherein the support covers the exterior of the heating member. the support further comprises a support perimeter wall;
The support peripheral wall is disposed laterally of the horizontal support portion and laterally of the vertical support portion,
18. The method of claim 17, wherein the outer edge of the support peripheral wall substantially conforms to the shape of the outer edge of the heating element, the support and the heating element together defining an air passage cavity. heating module. The heating element is sleeved in the support, the blower is arranged under the bottom of the support, the heat sink is arranged horizontally on the side of the blower, and the circuit board 18. A heating module according to claim 17, characterized in that are arranged vertically on top of the heat sink. 18. Heating module according to claim 17, characterized in that the projection of the heat sink lies at least partly within the projection of the heating element, and the projection of the control element and the projection of the heating element do not intersect. A notch is provided in the bottom of the support, and the airflow blown out from the top of the blower enters the gap between the support and the heating member through the notch, and the heating module is blown. 18. A heating module according to claim 17, characterized in that it is discharged out of the . The heating member has a container shape that is recessed downward, the support covers the outside of the heating member, and a plurality of array ribs are arranged on the outer surface of the heating member, and each array rib is a plurality of spacers distributed on the outer portion of the heating member, the outer bottom portion, and the corner portion connecting the outer portion and the outer bottom portion, and between two adjacent spacers, a coil groove for accommodating a coil; 18. The heating module according to claim 17, wherein the coils are wound around the outer surface of the heating element according to the order of the coil grooves. A striped rib is provided below each of the array ribs, the striped rib extends upward from the outer bottom of the heating member to the outer side of the heating member, and the striped rib is: The coil is supported so as to form a gap between the outer peripheral surfaces of the coil and the heating member, an air passage is formed between the inner surface of the support and the outer surface of the heating member, A fence cutout is provided at the bottom, and the airflow blown out from the top of the blower passes through the fence cutout and the ventilation passage in order, and is discharged out of the heating module. 23. Heating module according to claim 22 . Inside the support, a plurality of heating member mounting ears are provided on the top of the heating member, and the heating member mounting ears are supported by screws or downward structure after sleeve connection of the heating member and the support. fixed to the body,
Quick attachment posts corresponding to the heating elements are distributed inside the support, and a plurality of support attachment ears for attachment with the whole machine are distributed outside the support. 18. Heating module according to claim 17, characterized in that it comprises a the heating module includes a temperature measuring member attached to the bottom of the heating member;
18. Heating module according to claim 17, characterized in that: A mounting hole is provided near the center of the bottom of the heating member, and a boss is formed on the inner surface of the heating member around the mounting hole, and the boss directs water flow on the inner surface of the heating member to the mounting hole. An annular sleeve connection peripheral wall is formed around the mounting hole on the outer surface of the heating member, the temperature measurement member is attached downward to the sleeve connection peripheral wall, and the temperature measurement member is mounted on the sleeve connection peripheral wall facing downward. The top is exposed above the boss,
A water leakage hole is provided near the center of the horizontal support part of the support, the support is provided with a water leakage pipe around the outer bottom of the water leakage hole, and the sleeve connecting peripheral wall passes through the water leakage hole. 25. A sleeve is connected to the inside of the leaking pipe after the heating member is discharged, and the water flow inside the heating member is discharged from the leaking pipe after flowing into the sleeve connection peripheral wall through the drainage channel of the boss portion. A heating module as described in . The leak pipe includes a lid portion and a drainage portion that are sleeve-connected to the outside of the sleeve-connecting peripheral wall,
A through hole is provided in the lid portion on the side away from the blower, and an edge of the through hole extends downward in a direction away from the lid portion to form the drainage portion. 27. The heating module of claim 26. A coil is tightly wound around the outer surface of the heating member,
a ventilation passage is formed between the inner surface of the support and the outer surface of the heating member, and a fence cutout is provided at the bottom of the support;
18. The heating module according to claim 17, wherein the airflow blown out from the top of the blower passes through the fence cutout and the air passage in order and is discharged outside the heating module. 29. A heating module according to any one of claims 17 to 28, wherein the heating member comprises a coil disc. comprising a heating module according to any one of claims 17 to 29,
A cooking facility characterized by:

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