JP7143082B2 - Electronic component mounting device - Google Patents

Description

The technology disclosed in this specification relates to an electronic component mounting apparatus that mounts a component on a board.

An electronic component mounting apparatus mounts a component on a board by picking up the component with a nozzle, positioning the nozzle with respect to the board, and stopping picking up the component on the board. Some of the components mounted on the board are mounted on the board so that structures (e.g., bumps, pillars, etc.) provided on the adsorption surface of the component are positioned in advance on the board. . In such parts, it is necessary to control the position of the structure, so it is necessary to know where the structure is relative to the nozzle.

As a technology capable of recognizing the position of a structure provided on the suction surface of a component, there is a technology disclosed in Japanese Patent Application Laid-Open No. 2002-200010. In the technique of Patent Document 1, a prism is provided inside a transparent nozzle, and a camera is arranged on the side of the nozzle. A recognition mark for alignment provided on the attraction surface of the component is imaged by a camera via a prism. Then, the position of the recognition mark for alignment is calculated from the image captured by the camera. By using this technique, it is possible to recognize the position of the structure provided on the suction surface of the component.

WO 03/041478

In the technique of Patent Document 1 described above, since the structure is photographed by a camera, the nozzle must be transparent, and the material of the nozzle is limited. In addition, since it is necessary to calculate the position of the structure by processing the image captured by the camera, time is required for image processing. This specification provides a technique that can relax the restrictions on the material of the nozzle and shorten the time required to recognize the position of the structure.

An electronic component mounting apparatus disclosed in the present specification positions a component having a structure on one of its top surface and bottom surface so that the structure is at a preset position with respect to the substrate, and mounts the component on the substrate. to be worn. This electronic component mounting apparatus includes a nozzle for sucking a surface on which a structure of a component is provided, and a contact sensor section arranged on the suction surface of the nozzle and capable of recognizing the position of the structure with respect to the suction surface.

The electronic component mounting apparatus described above has a contact sensor section on the suction surface of the nozzle. Therefore, when a component is sucked onto the suction surface of the nozzle, the position of the structure with respect to the suction surface can be recognized by the contact sensor section. Therefore, based on the recognized position information of the structure, the structure can be positioned with respect to the board, and the component can be mounted on the board. Since this electronic component mounting device uses a contact-type sensor, restrictions on the material of the nozzle can be relaxed, and image processing is not required. can be shortened.

1 is a schematic diagram showing the configuration of an electronic component mounting apparatus 10 according to an embodiment; FIG. FIG. 2 is a vertical cross-sectional view of a nozzle 12 of the electronic component mounting apparatus 10; FIG. 2 is a bottom view of the nozzle 12 of the electronic component mounting apparatus 10; FIG. 4 is a diagram showing an arrangement state of contacts 14a of the contact sensor section 14; The position of the bump 32a of the component 32 sucked onto the suction surface 12a of the nozzle 12 (indicated by solid line A in FIG. 5) is the ideal position of the bump 32a relative to the suction surface 12a of the nozzle 12 ( shows a state in which a deviation occurs with respect to B) indicated by a dotted line. The mounting position of the component 32 with respect to the board 34 is corrected according to the displacement of the bumps 32a of the component 32 sucked on the suction surface 12a. 4 is a flow chart showing a method of mounting a component 32 on a substrate 34; The bottom view of the nozzle 112 which is a modified example of the nozzle 12. FIG. The bottom view of the nozzle 212 which is a modified example of the nozzle 12. FIG.

In one embodiment of the present technology, the electronic component mounting apparatus further includes a moving device that moves the nozzle with respect to the substrate, and a controller that drives the moving device to position the nozzle with respect to the component or the substrate. good. The control unit corrects the mounting position of the component with respect to the substrate based on the position of the structure with respect to the attraction surface detected by the contact sensor unit, and drives the moving device so that the component is mounted at the corrected mounting position. good. Since the position of the structure on the attraction surface is directly detected, even if the position of the structure varies from component to component, the structure can be placed at a desired position on the substrate with high accuracy.

In an embodiment of the present technology, the contact sensor section may include a plurality of contacts, and the plurality of contacts may be two-dimensionally arranged on the suction surface of the nozzle. By arranging a plurality of contacts two-dimensionally, it is possible to specify the position of the structure with respect to the attraction surface.

In one embodiment of the present technology, the contact sensor unit is capable of measuring the load acting on the contact sensor unit from the component when the component is adsorbed and/or mounted, and the electronic component mounting device adsorbs the component. And/or it may further include a storage unit that stores the load measured by the contact sensor unit when worn. Accordingly, by storing the load measured by the contact sensor portion when the component is picked up and/or mounted, it is possible to check the load under which the component was picked up and/or mounted. can.

In an embodiment of the present technology, in addition to the above, each of the plurality of boards manufactured by the electronic component mounting apparatus has board identification information for identifying the board, and is mounted on the board. A plurality of parts may have position information for specifying the position where the part is mounted for each part. The storage unit may further associate and store the board identification information of the board, the position information of the part, and the load measured by the contact sensor when the part is mounted on the board. By storing this series of information, it is possible to confirm the adsorption load and/or the mounting load of each component mounted on the board for each board. In addition, if a manufacturing defect occurs in the substrate, a series of stored information can be used for factor analysis.

In one embodiment of the present technology, the electronic component mounting apparatus determines whether the picking and/or mounting work is normally performed based on the load measured by the contact sensor unit when picking and/or mounting the component. It may further include a determination unit that determines whether or not. According to such a configuration, it is determined whether or not the pickup work and/or mounting work has been performed normally based on the load measured by the contact sensor portion when the component is picked up and/or mounted. Therefore, it is possible to quickly deal with failures in component pickup and/or component mounting.

In one embodiment of the present technology, in addition to or instead of the above, the control unit acts on the contact sensor unit from the component based on the load measured by the contact sensor unit when the component is adsorbed and/or mounted. The position of the nozzle may be controlled so that the applied load is smaller than a predetermined value. As a result, it is possible to prevent an excessive load from being applied to the nozzle when picking up the component and/or mounting the component, thereby preventing damage to the nozzle.

In one embodiment of the present technology, the component may be mounted to the substrate such that the other of its upper and lower surfaces abuts the substrate.

An electronic component mounting apparatus 10 of an embodiment will be described with reference to the drawings. The electronic component mounting apparatus 10 of this embodiment mounts a component 32 having bumps (projections) 32a on its upper surface on a substrate 34 . As shown in FIGS. 2 and 3, the upper surface of the component 32 is provided with a plurality of bumps 32a. The bumps 32a are arranged planarly on the upper surface of the component 32 . Specifically, the bumps 32a are arranged in a matrix of 4 rows×4 columns at intervals in the x direction and the y direction. The intervals between the bumps 32a adjacent in the x direction are made equal, and the intervals between the bumps 32a adjacent in the y direction are made equal. The x-direction spacing of the bumps 32a is equal to the y-direction spacing of the bumps 32a.

The positions of the bumps 32a provided on the upper surfaces of the components 32 vary from component to component. In this embodiment, it is necessary to mount the component 32 on the substrate 34 so that the bumps 32a provided on the component 32 are positioned on the substrate 34 at desired positions. Therefore, even if the component 32 can be mounted at a predetermined position on the substrate 34, the bumps 32a cannot be arranged at desired positions on the substrate 34 due to variations in the bumps 32a. For this reason, in this embodiment, the position of the bump 32a is detected for each component, and the variation in the position of the bump 32a for each component is corrected, so that the bump 32a of the component 32 is at a preset position with respect to the substrate 34. As such, component 32 is mounted on substrate 34 .

As shown in FIG. 1, the electronic component mounting apparatus 10 includes a nozzle 12, a moving device 16, a decompression device 20, and a control device 18. As shown in FIG. The control device 18 is electrically connected to the nozzle 12, the moving device 16 and the decompression device 20 and controls these parts 12, 16 and 20. As shown in FIG.

The moving device 16 is a device that moves the nozzle 12 with respect to the substrate 34 and is driven by the control device 18 . The moving device 16 can include, for example, a head on which the nozzle 12 is mounted, and an xy robot mechanism that drives the head in xy directions. By moving the nozzle 12 with the moving device 16, the nozzle 12 can move between the position where the component 32 is supplied and the board 34 on which the component 32 is mounted. The parts 32 can be supplied by a known device, for example, the parts 32 can be supplied by a parts feeder. A substrate 34 on which a component 32 is mounted is positioned at a mounting position within the electronic component mounting apparatus 10, and the component 32 is mounted at that mounting position. After the component 32 is mounted on the board 34, the board 34 is transported from the mounting position to the outside of the electronic component mounting apparatus 10. FIG.

The position to mount the component 32 is preset on the board 34 . As described above, the positions of the bumps 32a of the component 32 vary from component to component. On the other hand, the mounting position of the component 32 stored in the storage unit 24 of the control device 18 is the mounting position of the component 32 when the bump 32a is manufactured at the position as designed. Therefore, in this embodiment, the position of the bump 32a is detected for each component, and the mounting position stored in the storage unit 24 is corrected based on the detection result so that the bump 32a is positioned at the desired position. A component 32 is attached to the substrate 34 at the bottom.

The decompression device 20 is connected to the nozzle 12 and decompresses or cancels the decompression inside the suction hole 12 b of the nozzle 12 . The part 32 is sucked by the nozzle 12 by decompressing the inside of the suction hole 12b of the nozzle 12 . On the other hand, the component 32 can be removed from the nozzle 12 when the vacuum inside the suction hole 12 b is released while the component 32 is sucked by the nozzle 12 . The control device 18 controls the decompression and decompression of the inside of the suction hole 12 b by the decompression device 20 . The decompression device 20 does not necessarily have to be installed in the electronic component mounting device 10, and the decompression device 20 provided outside the electronic component mounting device 10 can be connected to the electronic component mounting device 10 and used. good too.

As shown in FIGS. 2 and 3, the nozzle 12 is a tubular member and has a suction surface 12a and a suction hole 12b. The suction surface 12a of the nozzle 12 is provided at the lower end of the nozzle 12 and contacts the surface of the component 32 on which the bumps 32a are provided. That is, since the surface of the component 32 on which the bumps 32 a are provided is the upper surface, the adsorption surface 12 a of the nozzle 12 contacts the upper surface of the component 32 . The suction hole 12b penetrates the nozzle 12 from the upper end to the lower end (attraction surface 12a) along the axis of the nozzle 12 . As shown in FIG. 3, the suction hole 12b has a circular cross-sectional shape. A decompression device 20 is connected to the upper end of the suction hole 12b. When the decompression device 20 is driven, the air inside the suction hole 12b of the nozzle 12 is exhausted. Therefore, the inside of the suction hole 12b of the nozzle 12 is decompressed, and the component 32 in contact with the suction surface 12a is sucked by the suction surface 12a. On the other hand, when the pressure reduction by the decompression device 20 is released from the state in which the component 32 is adsorbed on the adsorption surface 12 a , the component 32 is released from the adsorption surface 12 a of the nozzle 12 . Therefore, by canceling the pressure reduction by the decompression device 20, the component 32 that has been sucked by the suction surface 12a can be mounted on the substrate . Since the upper surface of the component 32 is sucked by the nozzle 12 , when the component 32 is attached to the substrate 34 , the lower surface of the component 32 contacts the substrate 34 . Although the bumps 32a provided on the upper surface of the component 32 cannot be seen from the lower surface of the component 32, FIG. , bumps 32a are shown for convenience. 8 and 9 also show the bumps 32a.

A contact sensor portion 14 is provided on the adsorption surface 12 a of the nozzle 12 . The contact sensor unit 14 is a contact sensor, and for example, a pressure sensor that detects pressure can be used. As shown in FIG. 2, the contact sensor section 14 is formed in a film shape or a sheet shape. As shown in FIG. 3, the contact sensor portion 14 is arranged in a donut shape surrounding the suction hole 12b. The contact sensor section 14 is electrically connected to the control device 18 , and detection signals from the contact sensor section 14 are input to the control device 18 .

As shown in FIG. 4, the contact sensor section 14 includes a plurality of contacts 14a. A plurality of contacts 14 a are two-dimensionally arranged on the suction surface 12 a of the nozzle 12 . As is clear from FIG. 4, in the contact sensor unit 14 of this embodiment, a plurality of contactor groups each including a plurality of contactors 14a arranged at intervals dx in the x direction are arranged at intervals dy in the y direction. It is Each contactor 14a constituting the contactor group is arranged at a position shifted by dx/2 from the corresponding contactor 14a of the adjacent contactor group in the y direction. note that. The mode of arranging the contacts 14a is not limited to the example shown in FIG. 4, and may be arranged in a matrix, for example.

Here, each of the plurality of contactors 14a can detect the pressure acting on the contactor 14a. Since the plurality of contacts 14a are two-dimensionally arranged on the attraction surface 12a, the contact sensor section 14 can two-dimensionally detect the pressure acting on the attraction surface 12a. That is, the contact sensor section 14 can detect the surface pressure distribution acting on the attraction surface 12a. Since a plurality of bumps 32a are arranged at intervals on the upper surface of the component 32, when the component 32 is adsorbed on the adsorption surface 12a of the nozzle 12, only some of the plurality of contactors 14a come into contact with the bumps 32a. . A relatively large pressure acts on the contactor 14a that contacts the bump 32a, while a relatively small pressure acts on the contactor 14a that does not contact the bump 32a. The bumps 32a provided on the upper surface of the component 32 are regularly arranged in a matrix as shown in FIG. 3, and the arrangement information of the bumps 32a is known. Therefore, when the contact sensor section 14 detects the pressure distribution of the pressure acting on the attraction surface 12a from the component 32, the position of each bump 32a of the component 32 can be recognized (identified) from the detection result.

The control device 18 includes a CPU. ROM. It consists of a computer with RAM. The control device 18 executes a pre-installed program to drive the moving device 16 to control the position of the nozzle 12; It functions as a determination unit 26 that specifies the position of the bump 32 a of the component 32 with respect to the nozzle 12 .

Next, a method of mounting the component 32 on the substrate 34 using the electronic component mounting apparatus 10 will be described with reference to FIGS. 5-7. First, in step S<b>12 , the control device 18 picks up the component 32 with the nozzle 12 . Specifically, the control device 18 drives the moving device 16 to position the nozzle 12 at the component pickup position, and brings the suction surface 12 a of the nozzle 12 into contact with the upper surface of the component 32 . When the upper surface of the component 32 contacts the suction surface 12 a , the control device 18 operates the decompression device 20 to suck the component 32 onto the suction surface 12 a of the nozzle 12 .

FIG. 5 shows a state in which the component 32 is sucked at a regular position on the suction surface 12a of the nozzle 12. As shown in FIG. Although the component 32 is sucked at a regular position on the suction surface 12a, as shown in FIG. 32a is displaced from the position (position B indicated by the dotted line) when it is manufactured at the designed position. Note that FIG. 5 emphasizes that the bump 32a is displaced. As already described, the storage unit 24 of the control device 18 stores the mounting position of the component 32 when the bump 32a is manufactured at the position as designed. Therefore, when the component 32 is mounted at the mounting position stored in the storage unit 24, the position of the bump 32a with respect to the substrate 34 is not the desired position.

Therefore, in step S<b>14 , the control device 18 detects the position of the bump 32 a with respect to the suction surface 12 a of the nozzle 12 . Specifically, the control device 18 detects the pressure acting on each contact 14 a of the contact sensor section 14 . In order to detect the pressure acting on each of the contacts 14a, the control device 18 acquires the pressure distribution acting on the adsorption surface 12a of the nozzle 12 (specifically, the contact sensor section 14). As described above, the pressure acting on the contact sensor portion 14 increases at the position of the bump 32a and decreases at positions other than the bump 32a. Therefore, the position where the pressure acting on the contact sensor portion 14 is high is specified as the position of the bump 32a. In the example shown in FIG. 5, the four bumps 32a in the first row and the four bumps 32a in the fourth column located at the upper end are detected, and the other bumps 32a are not detected because they do not exist on the contact sensor section 14. .

The arrangement pattern of the plurality of bumps 32a arranged on the upper surface of the component 32 is known, and this arrangement pattern is stored in the storage section 24 of the control device 18. FIG. Therefore, the control device 18 can specify the position of the bump 32a detected by the contact sensor unit 14 from the layout pattern of the bumps 32a stored in the storage unit 24. can be done. For example, in the example shown in FIG. 5, the positions of seven bumps 32a are specified, and it is found that the bumps 32a are arranged in a matrix of 4 rows×4 columns. Therefore, the seven bumps 32a detected by the contact sensor unit 14 are identified as the four bumps 32a in the first row and the four bumps 32a in the fourth column arranged on the upper surface of the component 32. can do.

Next, in step S16, the control device 18 corrects the mounting position of the component 32 based on the position of the bump 32a detected in step S14. That is, the storage unit 24 of the control device 18 stores the mounting position when the component 32 is sucked onto the suction surface 12a of the nozzle 12 at the regular position when the bump 32a is manufactured at the designed position. ing. Further, the position of the bump 32a when the component 32 manufactured with the bump 32a positioned as designed is attracted to the normal position of the attraction surface 12a is known, and this position is also stored in the storage unit 24 of the controller 18. ing. Therefore, the deviation amount of the bump 32a is calculated from the difference between the position of the bump 32a detected in step S14 and the normal position of the corresponding bump 32a. Then, the mounting position stored in the storage unit 24 is corrected using the calculated deviation amount. In the example shown in FIG. 5, the deviation amount is calculated from the difference between the actual position A of the bump 32a on the first row and first column and the reference position B of the bump 32a on the first row and first column.

Finally, in step S18, the control device 18 mounts the component 32 at the corrected mounting position calculated in step S16. The state in which the component 32 is installed is shown in FIG. As is clear from FIG. 6, the mounting position of the component 32 (the position indicated by the solid line) deviates from the normal position (the position indicated by the dotted line), but the position of the bump 32a on the upper surface of the component 32 is not the normal position. placed in position. This completes the mounting of the component 32 on the board 34 .

The electronic component mounting apparatus 10 of this embodiment includes a contact sensor section 14 on the suction surface 12 a of the nozzle 12 . Therefore, when the component 32 is adsorbed on the adsorption surface 12a of the nozzle 12, the pressure distribution acting on the contact sensor section 14 from the component 32 is detected, and the position of the bump 32a with respect to the nozzle 12 is specified based on this detection result. Therefore, when the bump 32a is deviated from the normal reference position, the mounting position of the component 32 with respect to the board 34 is corrected in consideration of the deviation amount, and the component 32 is mounted at the corrected mounting position. Therefore, even if the positions of the bumps 32a of the component 32 are not uniform or the picking position of the component 32 is shifted with respect to the nozzle 12, the component 32 is mounted on the substrate 34 so that the bumps 32a are positioned at desired positions. can do.

Further, in the electronic component mounting apparatus 10 of the present embodiment, since the position of the bump 32a is specified using the surface pressure detected by the contact sensor, the nozzle 12 need not be made of a transparent material. , there is no need to perform heavy-load processing such as image processing to specify the position of the bump 32a. Therefore, it is possible to shorten the time required from when the component 32 is picked up by the nozzle 12 until when the component 32 is mounted on the board 34 .

In the above-described embodiment, the structure provided on the component 32 was the bump 32a protruding from the upper surface of the component 32, but the example of the structure is not limited to this example. For example, the structures provided on the upper surface of the component 32 may be grooves or holes that are concave with respect to the upper surface of the component 32 . In this case, the pressure acting on the contact sensor section 14 is reduced at the position of the structure such as a groove, hole, recess, etc., whereby the position of the structure can be specified.

Further, in the above-described embodiment, the surface pressure detected by the contact sensor unit 14 is used only to specify the position of the bump 32a, but the technology disclosed in this specification is not limited to such a form. . For example, based on the surface pressure detected by the contact sensor unit 14, the load when the component 32 is attracted to the nozzle 12 is further calculated, and the load when the component 32 is attached to the substrate 34 is further calculated. good too. That is, by integrating the surface pressure detected by the contact sensor unit 14, the load acting on the nozzle 12 from the component 32 when the component is sucked or the load when the component is mounted may be measured. By measuring the load when the component is sucked and the load when the component is mounted, it is possible to determine whether an excessive load is applied to the component 32 when the component is suctioned or mounted. Further, from the surface pressure detected by the contact sensor section 14, it can be determined that the component 32 is attracted to the attraction surface 12a in an inclined state. By making such a judgment, it is possible to quickly deal with the case where the suction of the component 32 and/or the mounting of the component 32 are not performed normally.

For example, if the component 32 is tilted with respect to the suction surface 12 a of the nozzle 12 , an excessive load may be applied by the nozzle 12 from the component 32 when the component 32 is suctioned by the nozzle 12 . In this case, it is possible to suppress damage to the component 32 and the nozzle 12 by stopping suction by the nozzle 12 or the like. In addition, by stopping the suction by the nozzle 12, it is possible to prevent the component 32 from falling from the suction surface 12a of the nozzle 12 in advance. Similarly, during attachment, if the substrate 34 is tilted with respect to the suction surface 12a of the nozzle 12, or if another component already attached to the substrate 34 comes into contact with the component 32 sucked by the nozzle 12, An excessive load acting on the contact sensor portion 14 is detected, and as a result, mounting of the component 32 to the substrate 34 can be stopped. As a result, damage to the component 32 and the nozzle 12 can be suppressed.

When measuring the load when the component is sucked or the load when the component is attached, the measured load when the component is picked up or the load when the component is attached may be stored. The load when the component is picked up and/or the load when the component is mounted may be stored in the storage unit 24 of the control device 18 or may be stored in an external host computer. By storing the load at the time of picking up the component and/or the load at the time of mounting the component in this manner, the traceability of the manufactured board 34 is facilitated, and the picking and/or mounting of the component 32 can be performed correctly afterwards. You can check whether it has been

When the suction load and/or the mounting load of the component 32 are stored at the time of manufacturing the board, each of the plurality of boards 34 manufactured by the electronic component mounting apparatus 10 has a board identifier for specifying the board 34 . Information may be provided. Further, the plurality of components 32 mounted on the board 34 are provided with component identification information (including position information for identifying the position where the component 32 is mounted) for identifying the component 32 for each component. may have been Then, the component identification information of the component 32, the board identification information of the board 34, and the adsorption load and/or mounting load measured by the contact sensor section 14 may be associated and stored in the storage section 24 or the like. By storing this series of information as traceability information, factor analysis can be easily performed in the event that a manufacturing defect occurs in subsequent steps. Moreover, by storing such information, it becomes possible to use it as a guideline for load control of the nozzle 12 at the time of manufacturing.

In the above-described embodiment, the controller 18 detects the load acting on the contact sensor section 14 from the component 32 based on the load measured by the contact sensor section 14 when the component 32 is picked up and/or mounted. You may control the position of the nozzle 12 so that it may become smaller than a predetermined value. As a result, even if there are variations in the dimensions of the component 32 and the dimensions of the substrate 34 (for example, the thickness of the component 32 ) due to manufacturing errors, the variation causes the nozzle to pick up the component 32 and/or mount the component 32 . It is possible to prevent an excessive load from acting on the nozzle 12 and prevent the nozzle 12 from being damaged or the like.

(Modification 1) A nozzle 112 according to a modification of the nozzle 12 will be described with reference to FIG. As shown in FIG. 8, the cross-sectional shape of the suction surface 112a of the nozzle 112 and the suction hole 112b may be rectangular. In this case, the contact sensor portion 114 of the nozzle 112 may be arranged to surround the suction hole 112b and have a rectangular shape along the cross-sectional shape of the suction hole 112b of the nozzle 112 . That is, the cross-sectional shapes of the attraction surface 112a and the suction holes 112b are not limited to circular or rectangular shapes, and may be arbitrary shapes (for example, polygonal shapes). Similarly, the shape of the contact sensor portion 114 of the nozzle 112 is not limited, and may have any shape (for example, polygonal shape).

(Modification 2) A nozzle 212 according to another modification of the nozzle 12 will be described with reference to FIG. The contact sensor portion 214 of the nozzle 212 is arranged so as to surround the suction hole 212b. The contact sensor section 214 may be divided into a plurality of contact sensor sections 214, and the plurality of contact sensor sections 214 may be arranged so as to surround the suction hole 212b. At this time, the shape of the contact sensor portion 214 may be any shape, and may be rectangular like the first modification.

As another modified example of the nozzle 12 , a plurality of suction holes 12 b of the nozzle 12 may be provided at the lower end of the nozzle 12 . In this case, a plurality of openings corresponding to the positions of the suction holes 12b may also be provided on the contact sensor portion 14 provided on the attraction surface 12a. According to such a configuration, the contact sensor section 14 can also be provided in the central portion of the adsorption surface 12 a of the nozzle 12 . Thereby, the positions of the bumps 32a of the component 32 on the attraction surface 12a can be recognized more precisely. The number and arrangement of the openings of the suction holes 12b and the contact sensor section 14 provided on the suction surface 12a of the nozzle 12 are not particularly limited, and may be arranged in a matrix, for example.

Although several specific examples have been described in detail above, these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and changes of the specific examples illustrated above. The technical elements described in this specification or drawings exhibit technical usefulness alone or in various combinations.

10: Electronic component mounting device 12, 112, 212: Nozzle 12a, 112a, 212a: Adsorption surface 12b, 112b, 212b: Suction hole 14, 114, 214: Contact sensor section 14a: Contactor 16: Moving device 18: Control device 20: decompression device 22: control section 24: storage section 26: determination section 32: component 32a: bump 34: substrate

Claims (6)

An electronic component mounting apparatus that positions a component having a structure on its upper surface so that the structure on the upper surface is at a predetermined desired position with respect to a substrate, and mounts the component on the substrate. There is
a nozzle for sucking the surface of the component on which the structure is provided;
a contact sensor unit arranged on the adsorption surface of the nozzle and capable of recognizing the position of the structure with respect to the adsorption surface;
An electronic component mounting apparatus that mounts the component by bringing the lower surface of the component into contact with the board so that the component is positioned at the desired position based on the position of the structure recognized by the contact sensor unit. The electronic component mounting device includes:
a moving device for moving the nozzle with respect to the substrate;
a control unit that drives the moving device to position the nozzle with respect to the component or the substrate;
The control unit corrects the mounting position of the component with respect to the substrate based on the position of the structure with respect to the attraction surface detected by the contact sensor unit so that the component is mounted at the corrected mounting position. 2. The electronic component mounting apparatus according to claim 1, which drives said moving device. The contact sensor unit includes a plurality of contacts,
3. The electronic component mounting apparatus according to claim 1, wherein said plurality of contacts are two-dimensionally arranged on said suction surface of said nozzle. The contact sensor section is capable of measuring a load acting on the contact sensor section from the component when the component is adsorbed and/or mounted,
The electronic device according to any one of claims 1 to 3, wherein the electronic component mounting device further comprises a storage unit that stores the load measured by the contact sensor unit when the component is sucked and/or mounted. Parts mounting device. Each of the plurality of boards manufactured by the electronic component mounting apparatus has board identification information for specifying the board,
Each of the plurality of components mounted on the board has position information for specifying the position where the component is mounted,
When the component is mounted on the board, the storage unit associates and stores the board identification information of the board, the position information of the component, and the load measured by the contact sensor unit. The electronic component mounting apparatus according to claim 4. The contact sensor section is capable of measuring a load acting on the contact sensor section from the component when the component is adsorbed and/or mounted,
The electronic component mounting device includes:
a moving device for moving the nozzle with respect to the substrate;
a control unit that drives the moving device to position the nozzle with respect to the component or the substrate;
Based on the load measured by the contact sensor unit when the component is sucked and/or mounted, the control unit controls the load acting on the contact sensor unit from the component to be smaller than a predetermined value. The electronic component mounting apparatus according to any one of claims 1 to 5, wherein the position of the nozzle is controlled.

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