JP7149489B2 - Solid-state imaging device - Google Patents

Description

The present invention relates to a compact solid-state imaging device provided in an electronic endoscope or the like.

2. Description of the Related Art Conventionally, medical endoscopes have been used in which an elongated insertion portion is inserted into a body cavity to observe internal organs, etc., and, if necessary, various therapeutic treatments can be performed using a treatment instrument inserted into a treatment instrument channel. Mirrors are widely used. Also in the industrial field, industrial endoscopes are widely used for observing and inspecting internal flaws, corrosion, etc. of boilers, turbines, engines, chemical plants, and the like.

As the endoscope, for example, a solid-state imaging device having a solid-state imaging device such as a charge-coupled device (abbreviated as CCD) and electronic parts provided at the distal end of the insertion portion is built-in. An electronic endoscope is used in which a signal photoelectrically converted by the solid-state imaging device is transmitted through a signal cable and displayed in color on a monitor device via a signal processing means.

Since endoscopes are inserted into narrow and tortuous lumens, it is desired to reduce the diameter of the insertion portion. In the field of electronic endoscopes, it has been desired to reduce the size and diameter of the solid-state imaging device in order to realize an endoscope that can be turned in a small radius and has good operability.

For example, as a solid-state imaging device arranged at the distal end of an electronic endoscope, JP-A-2003-110001 discloses that the mounting area of a flexible substrate is increased without increasing the external size in order to achieve high density or miniaturization. A solid-state imaging device is shown.

JP-A-11-193572

FIG. 8 is a cross-sectional view of the solid-state imaging device of Patent Document 1, and FIG. 9 is a side view of the solid-state imaging device of Patent Document 1. As shown in FIG.

However, in the solid-state imaging device of Patent Document 1, the light-receiving surface 22a of the solid-state imaging element 22, the cover plate 21 which is a transparent member adhered on the light-receiving surface 22a, and the connection terminals 22b at the ends of the solid-state imaging element 22 are arranged. , a pad portion arranged on the connection terminal 22b, a protruding electrode formed on the pad portion, an inner lead of the flexible substrate 32 connected via the protruding electrode, and on the inner lead It is composed of the arranged electronic components 33 and 34, the peripheral portion of the connection terminal 22b, the solid-state imaging device 22, and the sealing resin 26 sealed in the connection portion with the inner lead.

Therefore, in the solid-state imaging device 22, the ratio of the light receiving surface 22a occupied by the connection terminal 22b is reduced, and as a result, the performance efficiency of the solid-state imaging is reduced.

Furthermore, the range of the sealing and fixing portion formed by the sealing resin 26 is widened, which hinders the miniaturization of the solid-state imaging device.

SUMMARY OF THE INVENTION It is an object of the present invention to solve the above-described conventional problems, and to provide a module structure that can minimize the area without impairing the performance efficiency of a solid-state imaging device and that can be miniaturized. .

(independent claims only)
In order to achieve the above object, a solid-state imaging device having a connection terminal for transmitting and receiving an electric signal on the back side with respect to a light-receiving surface, a connection terminal for making an electrical connection with the solid-state imaging device, A solid-state imaging device including: a main substrate having a cavity portion in which an electronic component is arranged; a first conductor pattern formed on an end portion of the connection terminal; and a sealing resin formed on the connection terminal use.

Further, a solid-state imaging device having a connection terminal for transmitting and receiving an electric signal on the back side with respect to the light-receiving surface, a connection terminal for making an electrical connection with the solid-state imaging device, and an electronic component are electrically connected. A solid-state imaging device including a main substrate having a cavity portion disposed through a portion, a second conductor pattern formed at an end portion of the cavity portion, and a sealing resin covering the electronic component. .

As described above, according to the solid-state imaging device of the present invention, the connection terminals are formed on the back surface of the light-receiving surface, so that the light-receiving surface occupancy increases, and as a result, the performance efficiency of the solid-state imaging is not impaired.

Furthermore, the fillet is formed up to the edge of the main substrate without causing the sealing resin to flow down the side surface of the main substrate due to the conductor pattern, so that a highly reliable, compact, and high-performance solid-state imaging device can be provided.

(a) to (b) Cross-sectional views showing the configuration of the solid-state imaging device according to Embodiment 1 of the present invention. (a) to (b) are plan views showing the configuration of the solid-state imaging device according to Embodiment 1 of the present invention. Sectional view showing wetting and spreading of sealing resin in Embodiment 1 of the present invention (a) to (f) Cross-sectional views showing the steps of forming the solid-state imaging device according to Embodiment 1 of the present invention. FIG. 2 is a cross-sectional view showing the configuration of a solid-state imaging device according to Embodiment 2 of the present invention; (a) to (b) are plan views showing the configuration of the solid-state imaging device according to Embodiment 2 of the present invention. (a) to (b) are plan views showing the configuration of a solid-state imaging device according to Embodiment 3 of the present invention. Cross-sectional view showing the configuration of a conventional solid-state imaging device Plan view showing the configuration of a conventional solid-state imaging device

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment 1)
1(a) and 1(b) are cross-sectional views of a solid-state imaging device according to Embodiment 1 of the present invention. It is a top view of a solid-state imaging device in the broken line A of FIG. 1, Fig.2 (a) is before sealing, FIG.2(b) is after sealing.

FIG. 3 is a cross-sectional view showing wetting and spreading of the sealing resin in region B of FIG. 1(a) in Embodiment 1 of the present invention.

<Structure>
As shown in FIGS. 1A and 1B, the structure of the solid-state imaging device according to Embodiment 1 of the present invention includes a solid-state imaging device 3, and one surface of the solid-state imaging device 3 is a light receiving surface. 3a has a plurality of first connection terminals 9 arranged on the other surface.

A cover glass 1 is arranged so as to face the light receiving surface 3 a , and the solid-state imaging device 3 and the cover glass 1 are fixed with an adhesive 2 .

A main substrate 8 is arranged so as to face the surface 3 b of the solid-state imaging device 3 . , are electrically connected, and the connecting portion between the solid-state imaging device 3 and the main substrate 8 is fixed with the sealing resin 4 .

Then, as shown in FIG. 1A, the sealing resin 4 spreads and wets the outside of the first conductor pattern 5a formed at the end of the joint without flowing down.

Here, the first conductor pattern 5a is also used as a recognition mark for alignment in a mounting machine used when connecting the main substrate 8 and the solid-state imaging device 3. FIG. The first conductor pattern 5 a has a shape different from that of the second connection terminal 11 .

Further, as shown in FIG. 1(b), a plurality of electronic components 6 are arranged in cavity portions 7 formed on both sides of the joint portion between the main substrate 8 and the solid-state imaging device 3, and the third connection of the main substrate 8 is provided. It is electrically connected to the terminal 13 through the bonding material 12 .

A plurality of cable connection terminals 14 are formed on the main board 8 .
<Manufacturing method>
Such a solid-state imaging device can be manufactured by the steps shown in FIGS. 4(a) to 4(f).

First, as shown in FIG. 4A, first connection terminals 9 are formed on the solid-state imaging device 3, and a cover glass 1 is placed on the light-receiving surface of the solid-state imaging device and fixed with an adhesive 2. As shown in FIG.

On the other hand, as shown in FIG. 4B, the first conductor pattern 5a, the second connection terminal 11, the third connection terminal 13, and the cable connection terminal 14 are formed on the main substrate 8 in which the cavity portion 7 is formed.

The first conductor pattern 5a is formed in the same process as the second connection terminal 11, the third connection terminal 13, and the cable connection terminal 14. FIG.

Next, as shown in FIG. 4C, the projecting electrodes 10 are formed on the second connection terminals 11, and the electronic component 6 and the bonding material 12 are arranged on the third connection terminals 13 of the cavity portion 7. Next, as shown in FIG.

Next, as shown in FIG. 4D , the bonding material 12 is melted by heating, and the electronic component 6 and the third connection terminal 13 are electrically connected via the bonding material 12 .

Next, as shown in FIG. 4E, the surface of the main substrate 8 on which the protruding electrodes 10 are formed and the surface of the solid-state imaging device 3 on which the first connection terminals 9 are formed are arranged to face each other, and the first connection is performed. The terminal 9 and the second connection terminal 11 are electrically connected via the projecting electrode 10 .

Finally, as shown in FIG. 4(f), the joints of the first connection terminals 9 and the second connection terminals 11 are sealed with the sealing resin 4 to fix the joints, thereby completing the solid-state imaging device. .
<Action>
In FIG. 1A, the light is received by the solid-state imaging device 3 through the cover glass 1 on the light receiving surface 3a, and converted into an electric signal.

The converted electric signal is transmitted to the main board 8 electrically connected to the solid-state imaging device 3 .

The electrical signal transmitted to the main board 8 is transmitted to the electronic component 6 electrically connected to the main board 8 .

The electronic component 6 performs processing incorporated in the electronic component 6 on the transmitted electrical signal, and transmits the processed signal to the main substrate 8 again.

After passing through all the electronic components 6, the electrical signal is transmitted from the cable connection terminal 14 to the external device.
<Each element>
The size of each member is as follows: main substrate 8: 1 mm x 1 mm x thickness 0.6 mm; electronic component 6: 0.6 mm x 0.3 mm x thickness 0.3 mm or less; cover glass 1: 1 mm x 1 mm x The thickness is 0.3 mm, and the solid-state imaging device 3 is 1 mm.times.1 mm.times.0.1 mm thick.

<Electronic component 6>
The electronic component 6 is, for example, a capacitor, but may be a resistor.
<Cover glass 1>
The cover glass 1 is a transparent rectangular parallelepiped optical member.

Further, the width dimension of the solid-state imaging device is the same as that of the solid-state imaging device 3, and the width dimension of the cover glass 1 is equal to or smaller than that of the solid-state imaging device 3 in order to reduce the size.

<Solid-state image sensor 3>
The solid-state imaging device 3 is a CCD image sensor or CMOS image sensor that detects light and converts it into an electric signal. A circuit for signal processing may be incorporated. It may be stacked with an element having a function of performing signal processing. A first connection terminal 9 is provided for transmitting and receiving electrical signals.

<First connection terminal 9, second connection terminals 11, 13, 14>
The first connection terminals 9, 11, 13, and 14 are made of, for example, aluminum, but a metal such as copper having a higher conductivity than aluminum, or tungsten may be used. Further, the copper may be subjected to nickel/gold plating treatment to make it difficult to oxidize.

<Cable connection terminal 14>
The cable connection terminal 14 is made of, for example, aluminum, but a metal such as copper having a higher conductivity than aluminum, or tungsten may be used. Further, the copper may be subjected to nickel/gold plating treatment to make it difficult to oxidize.

<Protruding electrode 10>
The projecting electrodes 10 are made of, for example, solder, but may be made of metal such as copper or gold.

<Main board 8>
The main board 8 is formed of, for example, a ceramic board, but a build-up board, an aramid epoxy board, a glass epoxy board, or the like may be used.

<Cavity part 7>
The size of the cavity portion 7 is 1.0 mm×0.35 mm×0.35 mm in thickness. can be kept the same.

Two cavities 7 are formed symmetrically on the surface of the main substrate 8 connected to the solid-state image pickup device 3, and the heat dissipation of the solid-state image pickup device 3 is symmetrical, thereby reducing in-plane variations in characteristics. can be pressed.

<Adhesive 2>
The adhesive 2 is a transparent adhesive such as an ultraviolet curable adhesive, and has a width equal to or smaller than that of the solid-state imaging device.
<Encapsulation resin 4>
The sealing resin 4 is an epoxy-based adhesive and has a width equal to or smaller than that of the solid-state imaging device 3 .

Also, as shown in FIG. 2(a), by forming the first conductor pattern 5a at the end of the main substrate 8, as shown in FIGS. 2(b) and 3, the sealing resin 4 is It is prevented from flowing down to the outside of the first conductor pattern 5a formed at the end of the . Furthermore, by plating the first conductor pattern 5a, the sealing resin 4 wets and spreads to the end of the first conductor pattern 5a, forming a fillet C. As shown in FIG.

Also, the sealing resin 4 may be formed in the area of the cavity portion 7 as long as it does not flow down to the outside of the main substrate 8 .

<First conductor pattern 5a>
The first conductor pattern 5a is made of, for example, aluminum, but a metal such as copper having a higher conductivity than aluminum, or tungsten may be used. Further, the copper may be subjected to nickel/gold plating treatment to make it difficult to oxidize.

The first conductor pattern 5a is also used as a recognition mark for alignment in a mounting machine used when connecting the main substrate 8 and the solid-state imaging device 3. As shown in FIG. It is desirable that the shape of the first conductor pattern 5a is different from that of the second connection terminal 11 and that the sealing resin 4 does not flow down to the outside of the main substrate 8. A corner mark of 3 mm×0.1 mm and 0.15 mm×0.1 mm in the lateral direction is obtained.

(Embodiment 2)
5A and 5B are cross-sectional views of a solid-state imaging device according to Embodiment 2 of the present invention, and FIGS. It is a top view of a device, Fig.6 (a) is before sealing, FIG.6(b) is after sealing. Matters not explained are the same as in the first embodiment.
<Structure>
As shown in FIG. 5, the structure of the solid-state imaging device according to Embodiment 2 of the present invention includes a solid-state imaging device 3, one surface of which has a light receiving surface 3a, and the other surface has a light receiving surface 3a. , a plurality of first connection terminals 9 are arranged.

A cover glass 1 is arranged so as to face the light receiving surface 3 a , and the solid-state imaging device 3 and the cover glass 1 are fixed with an adhesive 2 .

A main substrate 8 is arranged so as to face the surface 3 b of the solid-state imaging device 3 . , are electrically connected, and the connecting portion between the solid-state imaging device 3 and the main substrate 8 is fixed with the sealing resin 4 .

A plurality of electronic components 6 are arranged in a cavity portion 7 formed on one side of the joint portion between the main substrate 8 and the solid-state imaging device 3, and are electrically connected to the main substrate 8 via the third connection terminals 13 and the joint material 12. Connected.

A plurality of cable connection terminals 14 are formed on the main board 8 .
<Cavity part 7>
The size of the cavity portion 7 is 1.0 mm×0.7 mm×0.35 mm in thickness. can be kept the same.

One cavity portion 7 is formed on one side of the second connection terminal 11 of the solid-state imaging device 3 of the main substrate 8. By reducing the number of the cavity portions 7, the manufacturing process of the main substrate 8 can be shortened. can.
<Encapsulation resin 4>
The sealing resin 4 is an epoxy-based adhesive and has a width equal to or smaller than that of the solid-state imaging device 3 .

Further, as shown in FIG. 6(a), first conductor patterns 5a and 5b are formed at the ends of the second connection terminals 11 of the main substrate 8 and the solid-state imaging device 3, and second conductive patterns 5a and 5b are formed at the ends of the cavity portion 7. As shown in FIG. Forming the conductor pattern 5c prevents the sealing resin 4 from flowing down to the outside of the main substrate 8, as shown in FIG. 6(b). The second conductor pattern 5 c has a shape different from that of the third connection terminal 13 .

<First Conductor Patterns 5a, 5b, Second Conductor Pattern 5c>
The first conductor patterns 5a and 5b and the second conductor pattern 5c are made of, for example, aluminum, but a metal such as copper having a higher conductivity than aluminum, or tungsten may be used. Further, the copper may be subjected to nickel/gold plating treatment to make it difficult to oxidize.

The first conductor patterns 5a and 5b and the second conductor pattern 5c are preferably formed in the same process as the second connection terminal 11 and the third connection terminal 13 are formed.

Further, the first conductor patterns 5a and 5b and the second conductor pattern 5c are also used as recognition marks for alignment in a mounting machine used when connecting the main substrate 8 and the solid-state imaging device 3. FIG. It is desirable that the first conductor patterns 5a, 5b and the second conductor pattern 5c have a shape different from that of the second connection terminal 11 and that the sealing resin 4 does not flow down to the outside of the main substrate 8. The size of the first conductor patterns 5a and 5b is a corner mark of 0.3 mm×0.1 mm in the longitudinal direction and 0.15 mm×0.1 mm in the width direction, and the size of the first conductor pattern 5b is 0.1 mm. The size of the second conductor pattern 5c is a rectangle of 0.7 mm×0.08 mm.

Alternatively, only the second conductor pattern 5c may be provided without the first conductor patterns 5a and 5b of the first embodiment.

(Embodiment 3)
7A and 7B are plan views of a solid-state imaging device according to Embodiment 3 of the present invention, where FIG. 7A is before sealing and FIG. 7B is after sealing. be. Matters not explained are the same as those in the first and second embodiments.

<Encapsulation resin 4>
The sealing resin 4 is an epoxy-based adhesive and has a width equal to or smaller than that of the solid-state imaging device 3 .

7(a), by forming the first conductor pattern 5a at the edge of the main substrate 8, the sealing resin 4 is formed at the edge of the joint as shown in FIG. 7(b). It is prevented from flowing down to the outside of the first conductor pattern 5a formed in the .

Furthermore, by plating the first conductor pattern 5a, the sealing resin 4 wets and spreads to the end of the conductor pattern 5, forming a fillet C. As shown in FIG.

Here, the second conductor pattern 5c is also used as a recognition mark for alignment in a mounting machine used when connecting the main substrate 8 and the solid-state imaging device 3. FIG. The shape of the first conductor pattern 5a is a circle larger than that of the second connection terminal 11. As shown in FIG.

Also, the sealing resin 4 may be formed in the area of the cavity portion 7 as long as it does not flow down to the outside of the main substrate 8 .

<First conductor pattern 5a>
The first conductor pattern 5a is made of, for example, aluminum, but a metal such as copper having a higher conductivity than aluminum, or tungsten may be used. Further, the copper may be subjected to nickel/gold plating treatment to make it difficult to oxidize.

The first conductor pattern 5a is also used as a recognition mark for alignment in a mounting machine used when connecting the main substrate 8 and the solid-state imaging device 3. As shown in FIG. It is desirable that the shape of the first conductor pattern 5a is a circle larger than the second connection terminal 11 and that the sealing resin 4 does not flow down to the outside of the main substrate 8. is 0.1 mm in diameter, the size of the first conductor pattern 5a is 0.2 mm in diameter.

<effect>
By forming the connection terminals on the back surface of the light receiving surface as in the above structure, the solid-state image pickup device occupies more light-receiving surface. By forming a fillet up to the edge of the main substrate without the sealing resin flowing down the sides of the main substrate due to the formed conductor pattern, it is possible to provide a highly reliable, compact, and high-performance solid-state imaging device. .

(as a whole)
Embodiments 1 to 3 can be combined.

The solid-state imaging device of the present application is widely used as a small-sized solid-state imaging device such as a solid-state imaging device for endoscopes.

1 Cover glass 2 Adhesive 3 Solid-state imaging device 3a Light-receiving surface 3b Surface 4 Sealing resin 5 Conductor pattern 5a First conductor pattern 5b First conductor pattern 5c Second conductor pattern 6 Electronic component 7 Cavity 8 Main board 9 First connection Terminal 10 Protruding electrode 11 Second connection terminal 12 Bonding material 13 Third connection terminal 14 Cable connection terminal 21 Cover plate 22 Solid-state imaging element 22a Light receiving surface 22b Connection terminal 26 Sealing resin 32 Flexible substrate 33 Electronic component

Claims (8)

a solid-state imaging device having a first connection terminal for transmitting and receiving electric signals on the back surface with respect to the light-receiving surface;
a main substrate having a second connection terminal for electrical connection with the solid-state imaging device and a cavity portion in which electronic components are arranged;
a first conductor pattern formed at the end of the first connection terminal;
a sealing resin formed on the first connection terminal;
Solid-state imaging device including 2. The solid-state imaging device according to claim 1, wherein said second connection terminal and said first conductor pattern have different shapes. 3. The solid-state imaging device according to claim 1, wherein the sealing resin wets and spreads over the first conductor pattern but does not protrude to the side surfaces of the solid-state imaging device. 4. The solid-state imaging device according to claim 1, wherein the first conductor pattern is a recognition mark for alignment between the main substrate and the solid-state imaging device. a solid-state imaging device having a first connection terminal for transmitting and receiving electric signals on the back surface with respect to the light-receiving surface;
a main substrate having second connection terminals for electrical connection with the solid-state imaging device, and a cavity portion in which electronic components are arranged via third connection terminals;
a second conductor pattern formed at the end of the cavity;
a sealing resin covering the electronic component;
Solid-state imaging device including 6. A solid-state imaging device according to claim 5 , wherein said sealing resin spreads over said second conductor pattern. 7. The solid-state imaging device according to claim 5 , wherein the sealing resin wets and spreads over the second conductor pattern but does not protrude to the side surfaces of the solid-state imaging device. 8. The solid-state imaging device according to any one of claims 1 to 7, wherein there are two cavities and the cavities are bilaterally symmetrical.

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