JP7159671B2 - Plating equipment - Google Patents

Description

The present invention relates to a plating apparatus.

In Patent Document 1, in a plating bath containing a copper sulfate plating bath containing an organic additive, a soluble or insoluble anode is used, an object to be plated is used as a cathode, and the plating bath is flowed from the plating bath into an overflow tank while overflowing. In addition to returning the plating bath in the tank to the plating tank, an oxidative decomposition tank is provided, and the plating bath is returned from the oxidative decomposition tank to the plating tank via an overflow tank, and the plating bath is circulated between the plating tank and the oxidative decomposition tank. By circulating and immersing the metallic copper in the plating bath in the oxidative decomposition tank and subjecting the metallic copper to air bubbling, the decomposition/modified organic products generated during the electrolytic copper plating are oxidized and decomposed. A method for continuously electroplating copper on an article is disclosed.

Japanese Unexamined Patent Application Publication No. 2009-030118

SUMMARY OF THE INVENTION An object of the present invention is to provide a plating apparatus that discharges a larger amount of electrolytic solution from the inside of a pipe than in the case where a discharge port for discharging gas is formed on the upper side of the cross section of the pipe.
In addition, the present invention provides the plating formed on each base material, compared to the case where each discharge port is arranged closer to the container (overflow tank) with respect to the corresponding base material, or farther than the set discharge port. It is an object of the present invention to provide a plating apparatus that suppresses variations in the thickness of layers in the vertical direction.

A plating apparatus according to a first embodiment includes a plurality of substrates having at least a conductive surface and arranged in one direction, and a plurality of substrates arranged in the one direction to face each of the substrates. a tank having an electrolytic solution in which a metal is immersed; a power supply for applying a voltage between the base material and the metal; a pipe extending in the one direction below the base material through which gas flows; and a plurality of gas outlets formed below the pipe corresponding to each substrate.

In the plating apparatus of the second embodiment, the outlet is formed within a range of 0 to 50 degrees with respect to a vertical line extending downward from the cross-sectional center of the pipe.

In the plating apparatus of the third embodiment, the discharge port is formed within a range of 20 to 50 degrees with respect to a vertical line extending downward from the cross-sectional center of the pipe.

A plating apparatus of a fourth embodiment includes a liquid pipe extending along the pipe through which the electrolyte flows; a container provided at one end of the tank in the one direction for collecting the electrolyte from the tank; a pump for pumping the electrolytic solution from the container toward the liquid tube; and a plurality of discharge ports for the electrolytic solution formed in the liquid tube corresponding to each of the base materials, the discharge ports being provided on the corresponding base materials. and the ejection port located near the other end in the one direction.

In the plating apparatus of the fifth embodiment, each discharge port is positioned closer to the other end in the one direction with respect to the corresponding base material, and the discharge port is closer to the base material than the discharge port. is provided in

In the plating apparatus of the sixth aspect, the liquid pipe is provided between the base material and the metal in plan view of the tank, and the discharge port corresponding to one base material is located on the side of the base material. and the metal side, respectively.

In the plating apparatus of the seventh embodiment, the ejection openings at both ends in the one direction in the liquid pipe have a larger opening area than the ejection openings at the central side in the one direction.

In the eighth embodiment of the plating apparatus, a plurality of liquid tubes are arranged, and the end portions of the respective liquid tubes are connected.

In the plating apparatus of the ninth embodiment, each of the plurality of liquid pipes is provided with a control valve for adjusting the flow rate of the electrolytic solution.

In the tenth embodiment of the plating apparatus, the gas is pressure-fed from both ends of the pipe in the one direction.

In the plating apparatus of the eleventh embodiment, the introduction pipes connected to both ends of the pipe in the one direction are provided with pressure regulating valves for regulating the pressure of the gas.

The plating apparatus of the twelfth form further includes additional ports provided outside the discharge ports at both ends of the pipe in the one direction and formed below the cross section of the pipe.

In the plating apparatus of the thirteenth form, the anode is provided in the power supply and is connected between the cathode of the power supply and the substrate, and the anode is connected between the cathode of the power supply and the base material, and the anode is provided in the power supply and feeds back from the base material to the power supply. and a control unit that controls the current to a predetermined value.

In the plating apparatus of the fourteenth form, the controller controls the current for each substrate.

The plating apparatus of the fifteenth embodiment includes a rotating section that rotates the substrate.

In the sixteenth form of the plating apparatus, the rotating part has a brush having a plurality of contacts.

According to the plating apparatus of the first embodiment, more electrolyte can be discharged from the inside of the pipe than in the case where the discharge port for discharging the gas is formed above the cross section of the pipe.

According to the plating apparatus of the second embodiment, compared to the case where the discharge port is formed in the range of 50 to 90 degrees with respect to the vertical line extending downward from the center of the cross section of the pipe, more electrolyte inside the pipe is discharged. be able to.

According to the plating apparatus of the third embodiment, compared to the case where the discharge port is formed in the range of 0 to 20 degrees with respect to the vertical line extending downward from the center of the cross section of the pipe, more electrolyte solution inside the pipe is discharged. can do.

According to the plating apparatus of the fourth embodiment, variations in the thickness of the plating layer for each base material can be suppressed compared to the case where each discharge port is arranged closer to the container with respect to the corresponding base material. .

According to the plating apparatus of the fifth embodiment, compared to the case where each discharge port is arranged closer to the container than the corresponding base material, or farther than the set discharge port, it is formed in each base material Variation in the thickness of the plating layer in the vertical direction can be suppressed.

According to the plating apparatus of the sixth aspect, variations in the thickness of the plating layer for each substrate can be suppressed compared to the case where the electrolytic solution is supplied from each discharge port only to the substrate side.

According to the plating apparatus of the seventh embodiment, the discharge amount of the electrolytic solution from the discharge ports at both ends of the liquid pipe is lower than that at the center of the liquid pipe, compared to the case where the opening areas of the discharge ports are equal. can be suppressed.

According to the plating apparatus of the eighth embodiment, variation in the flow rate of the electrolytic solution in each liquid tube can be suppressed as compared with the case where the end portions of the liquid tubes are sealed when a plurality of liquid tubes are arranged. can be done.

According to the plating apparatus of the ninth embodiment, variations in the flow rate of the electrolytic solution due to differences in the shapes and paths of the liquid pipes can be adjusted as compared with the case where a common adjustment valve is provided for each liquid pipe.

According to the plating apparatus of the tenth embodiment, the plating layer between the end in one direction and the center of each substrate is reduced compared to the case where the end of the pipe is sealed and the gas is pumped from one end. Variation in thickness can be suppressed.

According to the plating apparatus of the eleventh embodiment, it is possible to adjust variations in gas pressure due to differences in the shapes and paths of the pipes and the introduction pipes, compared to the case where a common pressure regulating valve is provided for each introduction pipe.

According to the plating apparatus of the twelfth embodiment, the amount of electrolyte remaining in the pipe can be further reduced as compared with the case where the pipe is provided with only the outlet.

According to the plating apparatus of the thirteenth embodiment, variations in the thickness of the plating layer formed on the surface of the substrate can be suppressed as compared with the case where the current output from the power source to the metal is controlled.

According to the plating apparatus of the fourteenth embodiment, variations in the thickness of the plating layer for each substrate can be suppressed compared to the case where the current flowing for each substrate is collectively controlled.

According to the plating apparatus of the fifteenth embodiment, variations in the thickness of the plated layer formed on the surface of the base material in the circumferential direction can be suppressed as compared with the case where the base material is stationary in the circumferential direction.

According to the plating apparatus of the sixteenth embodiment, it is possible to suppress the change in the current value when the contact is corroded, compared to the case where the brush has only one contact.

1 is a plan view of a plating apparatus according to an embodiment; FIG. FIG. 2 is a side cross-sectional view (cross-sectional view taken along line 2-2 in FIG. 1) of the plating apparatus according to the embodiment; 1 is a cross-sectional view of a rotating unit in a plating apparatus according to an embodiment; FIG. It is a front view of the brush provided in the rotation unit of the embodiment. 3A and 3B are a perspective view and a cross-sectional plan view of a terminal provided in an anode basket according to an embodiment; FIG. 1A and 1B are a schematic diagram of a power supply circuit and a schematic diagram of a control unit of a plating apparatus according to an embodiment; FIG. 1 is a plan view illustrating a circulation device, which is a plating apparatus according to an embodiment; FIG. FIG. 8 is a cross-sectional view (cross-sectional view along line 8-8 in FIG. 7) of a liquid pipe including a discharge port in the circulation device of the embodiment; It is a plating apparatus according to an embodiment, and is a plan view for explaining an aeration device. In the aeration device of the embodiment, (A) a cross-sectional view of a pipe including an exhaust port (a cross-sectional view along the line 10A-10A in FIG. 9), and (B) a cross-sectional view of a pipe including an additional port (10B-10B in FIG. 9 line). It is a figure explaining the effect|action of the circulation apparatus and aeration apparatus in the plating apparatus which concerns on embodiment, Comprising: (A) The figure which expanded the top view, (B) It is the figure which expanded the side sectional view. FIG. 5 is a cross-sectional view of a driven portion of a rotating unit, which is a modification of the plating apparatus according to the embodiment;

An example of a plating apparatus according to an embodiment of the present invention will be described with reference to the drawings. An arrow H shown in each figure indicates the vertical direction of the device, an arrow W indicates the width direction of the device, and an arrow D indicates the depth direction of the device. In addition, in the depth direction of the device, the side on which an overflow tank 13, which will be described later, is arranged is the back side, and the side facing the overflow tank 13 is the front side. Note that the device depth direction corresponds to one direction of the present invention.
Furthermore, when a numerical range is described using "~", the numerical values before and after "~" are included as the lower and upper limits.

(Constitution)
For example, the plating apparatus 10 of the present embodiment applies a metal layer (hereinafter referred to as "plated layer") by electrolytic plating to the surface of a polyimide belt (hereinafter referred to as "belt") B for a fixing device of an image forming apparatus. ). Belt B is an example of a base material.

As shown in FIGS. 1, 2 and 6A, the plating apparatus 10 includes a plating bath 12, a rotating unit 20, an anode basket 40, a power supply device 100, a control section 120, and a circulation device 60. and an aeration device 80. Here, the plating bath 12 is an example of a bath, the rotating unit 20 is an example of a rotating part, the anode basket 40 is an example of a cage, and the power supply device 100 is an example of a power supply.

The plating bath 12 stores a plating solution L, which is an example of an electrolytic solution. In this plating tank 12, a belt B and an anode basket 40 containing a metal M described later are immersed. As shown in FIG. 1, an overflow tank 13, which is a container smaller than the plating bath 12, is provided on the outer wall surface of the plating bath 12 at one end in the apparatus depth direction. The overflow tank 13 and the plating bath 12 are connected by a rectangular opening 14 formed in the wall of the plating bath 12 . When the liquid surface of the plating solution L in the plating tank 12 reaches the opening 14, it flows into the overflow tank 13. As shown in FIG. That is, the overflow tank 13 has the function of regulating the upper limit of the liquid surface of the plating solution L in the plating bath 12 and recovering the plating solution L overflowing from the plating bath 12 . A circulation pipe 66 , which will be described later, is connected to the bottom of the overflow tank 13 .

Above the plating tank 12, along the inner wall surface of the plating tank 12 on the outside in the width direction of the apparatus, an anode bus 16 in the shape of a prismatic rod extending in the depth direction of the apparatus is provided. The anode baths 16 are provided on both sides of the plating bath 12 in the apparatus width direction. A conductive mesh anode basket 40 is suspended from the anode bus 16 .

The rotating unit 20 is an example of a rotating section. As shown in FIG. 2, the rotation units 20 are arranged in two rows in the width direction of the plating bath 12 and five rows in the depth direction of the device, for a total of ten units. As shown in FIG. 1, on one side in the device width direction (upper side in the figure), the rotation units 20 are spaced from the front side toward the back side in the order of rotation units 20A, 20B, 20C, 20D, and 20E. are placed in Further, on the other side in the device width direction (lower side in the drawing), the rotating units 20 are arranged at predetermined intervals in order of the rotating units 20F, 20G, 20H, 20I, and 20J from the front side toward the back side. . In the following description, when there is no need to distinguish between the rotating units 20, the suffixes "A" to "J" are omitted (the anode basket 40, the discharge port 70, the discharge port 90, the first input section 132 and second input section 134).

As shown in FIG. 3, the rotation unit 20 extends in the vertical direction of the apparatus, and includes a driven portion 22 to which the belt B is fixed, and a drive portion 30 for driving the driven portion 22 to rotate. there is The belt B is a cylindrical body that extends in the vertical direction of the apparatus when fixed to the rotation unit 20 .

The driven portion 22 includes a cylindrical holding portion 24, an upper support portion 25 that supports the upper portion of the holding portion 24, a lower support portion 26 that supports the lower portion of the holding portion 24, and a cylindrical metal member extending in the vertical direction of the device. A rod 27 and a holder 29 provided at the upper end of the upper support portion 25 are provided. The holding part 24 is an insulating pipe, and is made of vinyl chloride or polycarbonate in this embodiment. The length of the holding portion 24 in the vertical direction of the device is equal to the length of the belt B or slightly longer than the belt B. As shown in FIG. The holding portion 24 holds the belt B at its outer peripheral portion. At least a portion of the driven portion 22 including the holding portion 24 is immersed in the plating solution L. As shown in FIG.

The upper support part 25 is a conductive part and is made of stainless steel in this embodiment. The upper support portion 25 is an inverted T-shaped cylindrical member when viewed in cross section. In the upper support portion 25 , the outer diameter of the main body portion 210 on the lower side of the device is slightly larger than the outer diameter of the holding portion 24 , and the outer diameter of the extension portion 212 on the upper side of the device is smaller than the outer diameter of the holding portion 24 . The upper support portion 25 has a through hole 214 that penetrates in the vertical direction of the device at the central portion thereof. An insulating adhesive tape T is wrapped around the upper end of the belt B held by the holding portion 24 so as to straddle the boundary between the belt B and the outer peripheral portion of the main body portion 210 .

A plurality of plate spring portions 216 extending toward the holding portion 24 are provided on the outer peripheral portion of the main body portion 210 . The plate spring portion 216 is a conductor and is made of stainless steel like the upper support portion 25 . The leaf spring portion 216 is fixed to the main body portion 210 at the ring portion of the upper end portion of the device, and the lower portion of the device can be displaced in the radial direction. In a state in which the upper support portion 25 supports the holding portion 24 , the leaf spring portion 216 presses the belt B on the lower side of the device. Thereby, the belt B is electrically connected to the upper support portion 25 . The upper support portion 25 is an example of an electrode provided at the end of the belt B. As shown in FIG.

The lower support part 26 is a conductive part and is made of stainless steel in this embodiment. The lower support portion 26 is a T-shaped and columnar member when viewed in cross section. In the lower support portion 26 , the outer diameter of the body portion 220 on the upper side of the device is slightly larger than the outer diameter of the holding portion 24 , and the outer diameter of the extended portion 222 on the lower side of the device is smaller than the outer diameter of the holding portion 24 . The lower support portion 26 has an insertion hole 224 formed in the upper surface of the main body portion 220 toward the lower side of the device. At the lower end of the belt B held by the holding portion 24 , an adhesive tape T is wound so as to straddle the boundary between the belt B and the outer peripheral portion of the main body portion 220 .

A plurality of plate spring portions 226 extending toward the holding portion 24 are provided on the outer peripheral portion of the main body portion 220 . The leaf spring portion 226 is a conductor and is made of the same stainless steel as the lower support portion 26 . The leaf spring portion 226 is fixed to the main body portion 220 at the ring portion at the lower end of the device, and the upper side of the device can be displaced in the radial direction. In a state in which the lower support portion 26 supports the holding portion 24, the leaf spring portion 226 presses the belt B on the upper side of the apparatus. The belt B is thereby electrically connected to the lower support portion 26 . The lower support portion 26 is an example of an electrode provided at the end of the belt B. As shown in FIG.

The metal rod 27 is a conductor rod penetrating through the axial center portions of the upper support portion 25 and the holding portion 24 in the vertical direction of the device. Here, the metal rod 27 of this embodiment is made of copper. This metal rod 27 is an example of wiring. Since the outer diameter of the metal rod 27 is smaller than the inner diameter of the through hole 214 and the inner diameter of the holding portion 24 , the metal rod 27 does not come into contact with the upper support portion 25 and the holding portion 24 . A collar 28 made of resin, which is an insulator, is provided between the metal rod 27 and the upper support portion 25 on the device upper side of the driven portion 22 . Also, the metal rod 27 is fitted into the insertion hole 224 of the lower support portion 26 . Therefore, the metal bar 27 is not electrically connected to the upper support portion 25 but is electrically connected to the lower support portion 26 .

The holder 29 is a substantially cylindrical member. The holder 29 is fixed to an outer shaft portion 310 of the shaft portion 31 described later at the end portion on the upper side of the device.

The drive unit 30 includes a substantially cylindrical shaft portion 31, a plurality of bearings 32 that rotatably support the shaft portion 31, a gear portion 33 that transmits rotational power, and an input portion 130 of the control portion 120, which will be described later. and a holding portion 36 that is a connection portion with the driven portion 22 . The drive unit 30 also includes a box-shaped case 38 in which the shaft 31, bearings 32, gears 33 and brushes 34 are housed. The case 38 is fixed above the plating bath 12 .

The shaft portion 31 includes a cylindrical outer shaft portion 310 provided on the radially outer side, an inner shaft portion 312 provided on the radially inner side and having a substantially T-shaped columnar shape in a cross-sectional view, the outer shaft portion 310 and the inner shaft portion 312 . and an intermediate portion 314 provided between the shaft portions 312 . Here, the outer shaft portion 310 and the inner shaft portion 312 are conductors, and the intermediate portion 314 is an insulator. As an example, both the outer shaft portion 310 and the inner shaft portion 312 are made of stainless steel, and the intermediate portion 314 is made of resin. Therefore, the outer shaft portion 310 and the inner shaft portion 312 are insulated. The shaft portion 31 has an inner shaft portion 312 exposed on the outer periphery on the upper side of the device, and an outer shaft portion 310 exposed on the outer periphery on the lower side of the device.

The bearing 32 rotatably supports the shaft portion 31 with respect to the case 38 . The bearing 32 has a first bearing 320 that is a radial bearing that supports the upper side of the device of the shaft portion 31 and a second bearing 322 that is a radial bearing that supports the lower side of the device of the shaft portion 31 . Further, the bearing 32 has a third bearing 324 which is a thrust bearing supporting the device lower end of the shaft portion 31 on the device lower side than the second bearing 322 .

The gear portion 33 is provided between the first bearing 320 and the second bearing 322 in the vertical direction of the device. The gear portion 33 has a worm 330 connected to a driving device (not shown) and a worm wheel 332 fixed to the outer peripheral portion of the outer shaft portion 310 . When the driving device operates, the gear portion 33 rotates the shaft portion 31 and the driven portion 22 connected to the shaft portion 31 .

The brush 34 has a first brush 340 provided between the first bearing 320 and the worm wheel 332 in the vertical direction of the device, and a second brush 342 provided above the first bearing 320 in the device. there is The first brush 340 is in contact with the outer peripheral portion of the outer shaft portion 310 and the second brush 342 is in contact with the outer peripheral portion of the inner shaft portion 312 . As shown in FIG. 4, each brush 34 is formed by plating the surface of an approximately E-shaped copper plate with platinum. That is, each brush 34 has a plurality of (three in this embodiment) contacts 35 with respect to the shaft portion 31 .

As shown in FIG. 3 , the holding portion 36 is a substantially inverted U-shaped member in cross section provided at the lower end of the inner shaft portion 312 and housed inside the holder 29 . The clamping portion 36 is fitted with a substantially cylindrical adapter 37 on the lower side of the device. A metal rod 27 is fitted into the adapter 37 from below.

As shown in FIG. 2, the anode basket 40 is longer than the belt B in the vertical direction of the apparatus and is immersed in the plating solution L together with the belt B. As shown in FIG. As shown in FIG. 1, the anode baskets 40 are arranged in two rows in the width direction of the plating bath 12 and five rows in the depth direction of the device, for a total of 10 anode baskets 40 . Supplementally, the anode baskets 40 are arranged at predetermined intervals in the order of anode baskets 40A, 40B, 40C, 40D, and 40E from the front side toward the back side on one side in the device width direction (upper side in the drawing). . In addition, the anode baskets 40 are arranged at predetermined intervals in the order of anode baskets 40F, 40G, 40H, 40I, and 40J from the front side toward the back side on the other side in the device width direction (lower side in the figure). . Each anode basket 40 is provided facing the rotating unit 20 (driven portion 22) in the device width direction. For example, in the device width direction, the anode basket 40A faces the driven portion 22 of the rotation unit 20A, and the anode basket 40F faces the driven portion 22 of the rotation unit 20F.

As shown in FIG. 2, the anode basket 40 includes a cylindrical and net-like storage portion 41 that stores the metal M to be ionized, and a substantially inverted J-shaped hook portion for hanging the storage portion 41 from the anode bus 16. 42. A terminal 50, which will be described later, is fixed to the hook portion 42 (see FIG. 5A).

Here, the metal M accommodated in the accommodation portion 41 differs depending on the metal to be plated. For example, when copper plating is applied to the belt B, copper balls are accommodated in the accommodating portion 41 . Further, for example, when the belt B is plated with nickel, nickel balls are accommodated in the accommodating portion 41 . In the housing portion 41, the metal M is stacked so as to be longer than the length of the belt B. As shown in FIG.

Further, in the anode basket 40 of the present embodiment, the outer peripheral portion of the storage portion 41 is covered with the anode back 43, which is polyester cloth. In FIG. 2, the anode basket 40A is shown partially through the anode bag 43 for the sake of explanation. According to the present embodiment, anode slime, which is an impurity, does not flow out from the anode basket 40 into the plating tank 12, so that the plated layer on the belt B is less rough than when the housing portion 41 is not covered with the anode back 43. be done. Here, the anode slime means a residue that does not electrochemically dissolve when electrolysis is performed using a metal as an anode. Roughness refers to roughness (concavo-convex defects) caused by solid foreign particles in the plating tank entering the plating layer.

Furthermore, in the anode basket 40 of the present embodiment, a portion of the containing portion 41 covered with the anode back 43 is shielded by being covered with the anode mask 44, which is an insulator. For example, the anode mask 44 of this embodiment is made of vinyl chloride. Anode mask 44 is an example of an insulator. The anode mask 44 has a cylindrical upper mask 46 that covers the housing portion 41 above the device, and a cylindrical lower mask 48 that covers the housing portion 41 below the device. The upper mask 46 is installed across the liquid surface of the plating solution L, and the lower mask 48 has a cylindrical lower end closed.

The exposed portion of the accommodating portion 41 not covered with the anode mask 44 is the same range as the belt B in the vertical direction of the apparatus (see dotted line in FIG. 2). That is, the position of the lower end of the upper mask 46 in the vertical direction of the device is the same as the upper end of the belt B, and the upper end of the lower mask 48 is the lower end of the belt B. Equivalent to the position of the side edge. In other words, in the accommodating portion 41 of the anode basket 40 of the present embodiment, both sides in the vertical direction of the device that do not face the belt B in the width direction of the device are covered with the anode mask 44 . Around the shielded portion of the housing portion 41 covered with the anode mask 44, current radiation is suppressed with respect to the exposed portion.

Terminal 50 is a conductive member provided to ensure electrical connection between anode 102 of power supply device 100 and anode basket 40 . The terminal 50 of this embodiment is made of copper. As shown in FIG. 5A, in this embodiment, a crimp terminal 152 is provided at the tip of a cable 150 extending from the anode 102, and the terminal 50 is formed so that the crimp terminal 152 can be fixed. As shown in FIG. 5B, the terminal 50 has a groove portion 51 provided along the vertical direction of the device on one wall surface in the depth direction of the device (left side in the drawing). In addition, the terminal 50 is formed in a first female screw portion 52 formed in a through hole extending from the wall surface on one side in the device width direction (lower side in the drawing) toward the groove portion 51, and formed in parallel with the first female screw portion 52. and a second female threaded portion 53 .

A platinum-plated fixing bolt 54 is screwed into the first female screw portion 52 . The fixing bolt 54 of the present embodiment is formed so that the tip portion 55 comes into contact with the metal plate forming the hook portion 42 when screwed into the first female thread portion 52 . The terminal 50 is fixed to the hook portion 42 by sandwiching the metal plate forming the hook portion 42 between the wall portion of the terminal 50 and the tip portion 55 of the fixing bolt 54 in the groove portion 51 .

A crimping screw 56 plated with platinum is screwed into the second female screw portion 53 . The crimp terminal 152 is fixed to the terminal 50 by screwing the crimp screw 56 of the present embodiment into the second female screw part 53 after passing the shaft part 57 through the hole of the crimp terminal 152 .

In the case where the anode bus 16 is hooked on the hook portion 42 and the anode bus 16 and the anode basket 40 are electrically connected, if the anode bus 16 and the hook portion 42 are corroded due to the influence of the plating solution L, the flow from the anode bus 16 to the anode basket 40 will occur. Increases resistance. On the other hand, by providing the terminal 50 of the present embodiment, the resistance from the anode 102 of the power supply device 100 to the anode basket 40 is reduced, and compared to the case where the hook portion 42 is hooked to the anode bus 16 to make it conductive, Stabilization of conduction can be achieved.

The power supply device 100 applies a voltage between the belt B fixed to the rotating unit 20 and the metal M housed in the housing portion 41 of the anode basket 40 . Power supply device 100 is an example of a power supply.

As shown in FIG. 6A, power supply device 100 has anode 102 connected to anode basket 40 via cable 150 and terminal 50 , and cathode 104 connected to output section 136 of control section 120 . A cable 151 extending from each rotation unit 20 is connected to the input section 130 of the control section 120 . Specifically, the upper support portion 25 is connected to the first input portion 132 of the input portion 130 via the first brush 340 and the cable 151, and the lower support portion 26 is connected to the input portion 130 via the second brush 342 and the cable 151. It is connected to the second input section 134 . The first input section 132 and the second input section 134 are formed for each rotating unit 20 . Although omitted in FIG. 6A, the first input section 132 includes a first input section 132A to a first input section 132J, and the second input section 134 includes a second input section 134A to a second input section. Contains 134J.

In the plating apparatus 10 connected as described above, a power supply circuit is formed in which current flows in the following order of parentheses. Two systems are formed from the belt B toward the control unit 120 .
(1) power supply 100, (2) anode 102, (3) cable 150, (4) terminal 50, (5) anode basket 40, (6) metal M, (7) plating solution L, (8) belt B ,
(9-1) upper support portion 25, (10-1) holder 29, (11-1) outer shaft portion 310, (12-1) first brush 340, (13-1) cable 151, (14-1) ) first input unit 132
(9-2-1) lower support portion 26, (9-2-2) metal rod 27, (10-2-1) adapter 37, (10-2-2) clamping portion 36, (11-2) inside Shaft portion 312, (12-2) second brush 342, (13-2) cable 151, (14-2) second input portion 134
(15) control unit 120, (16) output unit 136, (17) cathode 104, (18) power supply device 100

The control unit 120 is provided between the cathode 104 and the belt B in the power supply circuit, and controls the current fed back from the belt B to the power supply device 100 to a predetermined value. As described above, the controller 120 of the present embodiment is connected to both ends of each belt B in the vertical direction of the apparatus.

Further, the control unit 120 of this embodiment can individually control the current values in the first input units 132A to 132J and the second input units 134A to 134J. For example, as shown in FIG. 6B, by providing a variable resistor (including a current control circuit using a semiconductor) on the circuit from each input section 130 to the output section 136, the current value can be controlled individually. can be controlled. As a result, for example, the current values of the belts B can be uniformed, or different current values can be set for each of the plurality of belts B. FIG. Although omitted in FIG. 6B, the circuit that controls the current value is not limited to the first input section 132A and the second input section 134A, but the first input section 132B to the first input section 132J, and They are also provided in the second input section 134B to the second input section 134J, respectively.

Furthermore, in this embodiment, a processing execution unit 140 for executing plating processing is connected to the power supply device 100 and the control unit 120 . The process execution unit 140 can apply a voltage between the belt B and the metal M by operating the power supply device 100 to perform the plating process. In addition, the processing execution unit 140 individually sets the current value of the current that is input to each input unit 130 of the control unit 120, is output from the output unit 136 of the control unit 120, and is fed back to the power supply device 100. do. That is, the processing execution unit 140 can manage the thickness of the plating layer of the belt B fixed to each rotation unit 20 .

The circulation device 60 circulates the plating solution L, which is an electrolytic solution, in the plating tank 12 . As shown in FIG. 2, the circulation device 60 has a liquid pipe 62 installed along the device depth direction on the device bottom side of the rotation unit 20, that is, on the device bottom side of the belt B. As shown in FIG. As shown in FIG. 7, the liquid pipe 62 is provided between the belt B fixed to the rotating unit 20 and the anode basket 40 in plan view. In addition, the liquid pipe 62 includes a first liquid pipe 62P installed on the lower side of the apparatus between the rotation units 20A to 20E and a second liquid pipe 62S installed on the lower side of the apparatus between the rotation units 20F to 20J. have. Each liquid pipe 62 is provided with a discharge port 70 for discharging the plating solution L into the plating bath 12 .

The first liquid pipe 62P and the second liquid pipe 62S are connected at the rear end by a connecting pipe 63, and at the front end, an inflow pipe 64 extending to the outside of the plating bath 12 is connected. The inflow pipe 64 has a first inflow pipe 64P connected to the first liquid pipe 62P and a second inflow pipe 64S connected to the second liquid pipe 62S.

Each inflow pipe 64 is provided with an adjustment valve 65 for adjusting the flow rate of the plating solution L flowing through the liquid pipe 62 . For example, a resin ball valve or needle valve is used as the adjustment valve 65 . The adjustment valve 65 includes a first adjustment valve 65P provided in the first inflow pipe 64P for adjusting the flow rate of the first liquid pipe 62P, and a second inflow pipe 65P for adjusting the flow rate of the second liquid pipe 62S. and a second control valve 65S provided at 64S.

A circulation pipe 66 is connected between the inflow pipe 64 and the overflow tank 13 . The circulation pipe 66 is connected to the first inflow pipe 64P at the first regulating valve 65P, and is connected to the second inflow pipe 64S at the second regulating valve 65S. A pump 67 for pressure-feeding the plating solution L is provided between the overflow tank 13 and the inflow pipe 64 in the circulation pipe 66 . This pump 67 is provided with a filter for removing impurities in the plating solution L. As shown in FIG.

As described above, according to the circulation device 60 of the present embodiment, the following circulation system for the plating solution L is formed. That is, the plating solution L consists of (1) plating tank 12, (2) overflow tank 13, (3) circulation pipe 66 (pump 67), (4) inflow pipe 64, (5) liquid pipe 62, (6) plating Circulate in the order of tank 12. In the plating bath 12, the front side of the inflow pipe 64 is upstream of the flow F of the plating solution L, and the back side of the overflow tank 13 is downstream of the flow F.

On the other hand, each liquid pipe 62 is provided with a pair of discharge ports 70 for discharging the plating solution L into the plating bath 12 . Specifically, in the first liquid pipe 62P, discharge ports 70A to 70E are provided corresponding to the respective belts B fixed to the rotation units 20A to 20E. Further, in the second liquid pipe 62S, discharge ports 70F to 70J are provided corresponding to the respective belts B fixed to the rotation units 20F to 20J.

Each discharge port 70 is arranged on the front side of the corresponding belt B, that is, on the upstream side of the flow F of the plating solution L in plan view of the plating tank 12 . For example, the ejection port 70B is located between the rotating units 20A and 20B in the device depth direction, and the ejection port 70C is located between the rotating units 20B and 20C in the device depth direction.

Further, the ejection port 70 has an inner ejection port 72 formed on the rotation unit 20 (belt B) side and an outer ejection port 74 formed on the anode basket 40 (metal M) side. As shown in FIG. 8, each discharge port 70 is formed above the device in the cross section of each liquid tube 62 . As an example, the inner ejection port 72 and the outer ejection port 74 are formed at positions where the angle X of the center line with respect to the vertical line extending upward from the cross-sectional center of each liquid tube 62 is 45 degrees.

Furthermore, in each liquid tube 62, the inner diameters of the discharge ports 70 at both ends in the device depth direction are larger than the inner diameters of the discharge ports 70 on the central side in the device depth direction. Specifically, in the first liquid pipe 62P, the inner diameters of the outlets 70A and 70E are larger than the inner diameters of the outlets 70B, 70C and 70D. In addition, in the second liquid pipe 62S, the inner diameters of the ejection ports 70F and 70J are larger than the inner diameters of the ejection ports 70G, 70H and 70I. Supplementally, the opening areas of the ejection ports 70 at both ends in the depth direction of the device are set to be 10% to 20% larger than the opening area of the ejection ports 70 on the central side in the depth direction of the device.

The aeration device 80 supplies air A as a gas into the interior of the plating solution L. As shown in FIG. As shown in FIG. 2, the aeration device 80 has a pipe 82 installed along the device depth direction on the device bottom side of the rotation unit 20, that is, on the device bottom side of the belt B. As shown in FIG. As shown in FIG. 9, the pipes 82 are a first pipe 82P installed below the rotating units 20A to 20E, and a first pipe 82P installed below the rotating units 20F to 20J. It has two pipes 82S. The first pipe 82P is arranged along the first liquid pipe 62P, and the second pipe 82S is arranged along the second liquid pipe 62S (see FIGS. 1 and 2). Each pipe 82 is provided with a discharge port 90 for discharging the air A toward the plating solution L in the plating bath 12 .

An introduction pipe 84 is connected to both ends of the first pipe 82P and the second pipe 82S in the apparatus depth direction. Specifically, a first introduction pipe 84P extending to the outside of the plating tank 12 is connected to the front end of the first pipe 82P and the second pipe 82S, and the rear end of the first pipe 82P and the second pipe 82S is connected. A second introduction pipe 84S extending to the outside of the plating tank 12 is connected to the end. The second introduction pipe 84S bypasses the outside of the plating bath 12 and extends to the front side.

Each introduction pipe 84 is provided with a pressure regulating valve 86 for regulating the pressure of the air A in the pipe 82 . For example, the pressure regulating valve 86 may be a resin ball valve or needle valve. The pressure regulating valve 86 has a first pressure regulating valve 86P provided on the first introduction pipe 84P and a second pressure regulating valve 86S provided on the second introduction pipe 84S.

In addition, each introduction pipe 84 is connected to an air supply source (eg, a compressor) (not shown) via a connecting pipe 87 . Therefore, according to the aeration device 80 of this embodiment, the air A is discharged in the following flow. That is, the air A flows through (1) the compressor, (2) the connecting pipe 87, (3) the introduction pipe 84, (4) the pipe 82, and (5) the plating bath 12 in this order. The introduction pipe 84 pumps the air A from both ends in the device depth direction to the first pipe 82P and the second pipe 82S.

On the other hand, each pipe 82 is provided with a pair of discharge ports 90 for discharging the air A into the plating bath 12 . Specifically, in the first pipe 82P, discharge ports 90A to 90E are provided corresponding to the respective belts B of the rotation units 20A to 20E. Further, in the second pipe 82S, discharge ports 90F to 90J are provided corresponding to the respective belts B of the rotation units 20F to 20J.

Each discharge port 90 is arranged on the front side of the corresponding belt B, that is, on the upstream side of the flow F of the plating solution L in plan view of the plating tank 12 . Further, when each belt B is used as a reference, the discharge port 90 is provided closer to the belt B than the discharge port 70 is. For example, the discharge port 90B is positioned between the rotation unit 20A and the rotation unit 20B in the device depth direction, and is arranged closer to the rotation unit 20B than the ejection port 70B (see FIG. 1). In addition, the discharge port 90C is positioned between the rotation unit 20B and the rotation unit 20C in the device depth direction, and is arranged at a position closer to the rotation unit 20C than the ejection port 70C (see FIG. 1).

Further, the discharge port 90 has an inner discharge port 92 formed on the rotation unit 20 (belt B) side and an outer discharge port 94 formed on the anode basket 40 (metal M) side. As shown in FIG. 10A, each discharge port 90 is formed below the device in the cross section of each pipe 82 . As an example, the inner discharge port 92 and the outer discharge port 94 each have a center line in the range of 0 to 50 degrees (angle Y), preferably 20 to 50 degrees, with respect to a vertical line extending downward from the center of the cross section of each pipe 82. (angle Z).

Further, each pipe 82 has an additional port 96 provided outside the discharge ports 90 at both ends in the device depth direction and formed below the device in the cross section of each pipe 82 . Specifically, the additional port 96 has an additional port 96P1 formed on the front side of the discharge port 90A and an additional port 96P2 formed on the back side of the discharge port 90E. The additional port 96 has an additional port 96S1 formed on the front side of the discharge port 90F and an additional port 96S2 formed on the back side of the discharge port 90J.

As shown in FIG. 10(B), the additional port 96, like the inner discharge port 92, is preferably in the range of 0 to 50 degrees (angle Y) with respect to the vertical line extending downward from the cross-sectional center of the pipe 82. is formed in the range of 20 to 50 degrees (angle Z). Further, the opening area of the additional port 96 is set to be half or less of the total sum of the opening areas of the inner discharge port 92 and the outer discharge port 94 .

(action)
In the plating apparatus 10 of the present embodiment, the belt B is plated through the following steps to manufacture plated parts.
Belt B is subjected to electroless nickel plating and strike copper plating on the polyimide base material in a pretreatment process. Then, electrolytic copper plating and electrolytic nickel plating are applied using the plating apparatus 10 . Through this pretreatment process, the belt B becomes conductive.

First, the belt B that has undergone the pretreatment process is fixed to the rotating units 20A to 20J. Specifically, the operator sandwiches the holding portion 24 covered with the belt B between the upper support portion 25 and the lower support portion 26 . Then, the operator fixes the belt B to the upper support portion 25 and the lower support portion 26 with the adhesive tape T. As shown in FIG. Further, the operator fixes the plate spring portion 216 to the main body portion 210 at the upper support portion 25 and fixes the plate spring portion 226 to the main body portion 220 at the lower support portion 26 . The driven part 22 is thereby assembled.

Next, the operator fixes the holder 29 of the driven part 22 to the outer shaft part 310 of the driving part 30 (see FIG. 3). At this time, the adapter 37 connected to the tip of the metal rod 27 is fitted into the holding portion 36 . As a result, the driven portion 22 is attached to the driving portion 30, and the rotating unit 20 is assembled.

The rotating unit 20 to which the belt B is fixed is first accommodated in the plating bath 12 for copper plating. That is, each belt B is immersed in the copper plating solution. Next, each rotating unit 20 starts rotating, the circulation device 60 starts operating, and the aeration device 80 starts operating. Then, the power supply device 100 starts up, and a voltage is applied between the anode basket 40 containing copper balls as the metal M and the rotating unit 20 to which the belt B is fixed, thereby starting copper plating as a plating process. be done. During the plating process, the control unit 120 connected between the cathode 104 of the power supply device 100 and the belt B controls the current value to a predetermined value. Further, the circulation device 60 circulates the plating solution L in the plating bath 12, and the aeration device 80 discharges the air A from the discharge port 90, thereby bubbling the belt B.

When the copper plating is completed, the rotating unit 20 is taken out of the plating tank 12 for copper plating and then transferred to the plating tank 12 for nickel plating. Each belt B is immersed in the nickel plating solution by being accommodated in the plating bath 12 for nickel plating. And nickel plating is started as a plating process like copper plating. Details of the process are the same as in the case of copper plating.

As described above, the effects of the plating apparatus 10 of the present embodiment are summarized as follows.
(1) Effects of Current Control In electroplating, the value of the current flowing through the belt B depends on the momentum of the plating solution L and the molar concentration of metal ions. Therefore, if the current value flowing through the belt B varies depending on the state of the plating solution L, the thickness of the plating layer will vary.

Therefore, in the plating apparatus 10 of the present embodiment, the controller 120 is provided in the current circuit to control the current fed back from the belt B to the power supply device 100 . In the case of a power supply that controls the current on the output side (anode side) of the constant current power supply, such as the plating apparatus of Patent Document 1, environmental changes in the plating solution affect the current value as described above. In contrast, according to the present embodiment, the change in the value of the current flowing through the belt B can be suppressed as compared with the case where the current is controlled on the output side from the power supply to the metal. Thereby, variations in the thickness of the plating layer formed on the base material surface can be suppressed.

Further, in the plating apparatus 10 of this embodiment, a plurality of belts B can be plated. The controller 120 can control the current for each belt B. FIG. That is, according to the present embodiment, variations in the thickness of the plated layer for each belt B can be suppressed compared to the case where the current flowing for each belt B is collectively controlled.

In addition, in the plating apparatus 10 of the present embodiment, the belt B is connected to the controller 120 at both ends in the vertical direction of the apparatus, and the current value is separately controlled by the controller 120 . According to the present embodiment, variations in the thickness of the plated layer formed on the surface of the belt B in the longitudinal direction of the belt B can be suppressed as compared with the case where the control unit 120 is connected to the control unit 120 at one location. Although the electrodes are connected to both ends of the belt B in this embodiment, the electrodes may be connected at a plurality of locations along the length of the belt B without being limited to this.

Here, in the plating apparatus 10 of the present embodiment, the cylindrical belt B is plated. Therefore, the wiring from the control unit 120 to the lower end of the belt B can pass through the inside of the belt B. As shown in FIG. Specifically, in this embodiment, by passing the metal rod 27 inside the belt B, the circuit from the upper end of the belt B to the control unit 120 and the circuit from the lower end of the belt B to the control unit 120 are separated. ing. According to this embodiment, the number of electrodes connected to the ends of the belt B can be easily increased compared to the case where the surface of a solid member is plated.

(2) Effect of Anode Mask In the anode basket 40 of the present embodiment, the anode mask 44 covers both portions in the vertical direction of the apparatus that do not face the belt B in the width direction of the apparatus. Here, when the exposed portion of the anode basket 40 (anode back 43) is longer than the length of the belt B, current radiation is greater at the upper and lower ends of the belt B than at the central portion. Therefore, it is conceivable that the plating layer grows more at the ends of the belt B than at the center. On the other hand, according to the present embodiment, compared to the case where both sides of the portion of the anode basket 40 facing the belt B in the vertical direction of the device are exposed, the plating layer on both ends of the belt B is thicker than the other portions. thickening can be suppressed.

Further, in this embodiment, the upper mask 46 is placed across the surface of the plating solution L, and the lower mask 48 is closed at the cylindrical lower end. Therefore, current radiation from the upper side of the anode basket 40 in the upper mask 46 and from the lower side of the anode basket 40 in the lower mask 48 is suppressed. That is, by allowing the belt B to receive current radiation from the anode basket 40 in the horizontal direction, it is possible to suppress an increase in the current density at the ends of the belt B (edge effect). It is possible to suppress the thickness of the plating layer from increasing as compared with

(3) Effect of Rotating Unit In this embodiment, the rotating unit 20 that rotates the belt B is provided. In electroplating, the speed of metal ions moving in the plating solution L depends on the molar concentration of the metal ions. Therefore, by increasing the surface area of the object to be plated, the molar concentration of metal ions decreases around the object to be plated. For example, as in this embodiment, in the belt B of the rotating unit 20A, a difference in metal ion concentration occurs between the anode basket 40A side and the rotating unit 20F side. If there is a difference in concentration of metal ions in the plating bath 12, a difference in current density also occurs.

Therefore, by rotating the belt B with the rotation unit 20 as in the present embodiment, the following effects can be obtained. That is, according to the present embodiment, variations in the current density received by the belt B are suppressed as compared with the case where the belt B is stationary in the circumferential direction. As a result, variations in the thickness of the plated layer formed on the surface of the belt B in the circumferential direction can be suppressed.

Further, in the present embodiment, the rotating unit 20 is provided with a brush 34 in order to apply current while rotating the belt B. As shown in FIG. This brush 34 has a plurality of contacts 35 that come into contact with the shaft portion 31 . According to the brush 34 of this embodiment, by dividing the contact 35 into a plurality of parts, corrosion of one contact 35 is suppressed from spreading to the other contacts 35 . Thereby, compared with the case where the brush 34 has only one contact, it is possible to suppress the change in the current value when the contact 35 is corroded.

(4) Effect of Circulation Device The plating solution L in the plating tank 12 of the present embodiment flows toward the overflow tank 13 side in the depth direction of the device when viewed from a broad perspective. The plating solution L collected in the overflow tank 13 is pressure-fed to the liquid pipe 62 via the pump 67 and discharged into the plating bath 12 again from the discharge port 70 provided for each rotation unit 20 in the liquid pipe 62 . In the present embodiment, the ejection port 70 is located on the front side of each belt B fixed to the corresponding rotating unit 20, that is, on the upstream side of the flow F of the plating solution L in plan view of the plating tank 12. .

Around the belt B on the most upstream side of the flow F, that is, the belt B of the rotation unit 20A and the belt B of the rotation unit 20F, if the plating solution L is not discharged from the upstream side, the belt B on the most upstream side The concentration of metal ions will decrease. On the other hand, according to the plating apparatus 10 of the present embodiment, compared to the case where each discharge port 70 is arranged closer to the overflow tank 13 which is the back side with respect to the corresponding belt B, more power is provided to each belt B. It is possible to suppress variations in concentration of the metal ions to be applied. As a result, variations in the thickness of the plated layer for each belt B are suppressed.

The position of the ejection port 70 in the depth direction of the apparatus is preferably set upstream by the vector of the flow F of the plating solution L. FIG.

Further, in the circulation device 60 of the present embodiment, the liquid pipe 62 is provided between the belt B fixed to the rotation unit 20 and the metal M accommodated in the anode basket 40 in plan view of the plating tank 12. , the ejection port 70 corresponding to one belt B has an inner ejection port 72 on the rotation unit 20 (belt B) side and an outer ejection port 74 on the anode basket 40 (metal M) side. As shown in FIGS. 11A and 11B, a flow f1 directed from the inner ejection port 72 toward the belt B and a flow f2 directed from the outer ejection port 74 toward the anode basket 40 are locally generated. there is

Therefore, according to the plating apparatus 10 of the present embodiment, by supplying the plating solution L from each discharge port 70 not only to the belt B side but also to the metal M side, the metal produced from the metal M of each anode basket 40 Variation in ion concentration can be suppressed. As a result, variations in the thickness of the plating layer for each belt B are suppressed compared to the case where the plating solution L is supplied from the ejection ports 70 only to the belt B side.

Further, in each liquid tube 62 of the present embodiment, the ejection ports 70 at both ends in the device depth direction have an opening area larger by 10% to 20% than the ejection port 70 on the center side in the device depth direction. Specifically, in the first liquid pipe 62P, the inner diameters of the outlets 70A and 70E are larger than the inner diameters of the outlets 70B, 70C and 70D. In addition, in the second liquid pipe 62S, the inner diameters of the ejection ports 70F and 70J are larger than the inner diameters of the ejection ports 70G, 70H and 70I.

In the first liquid pipe 62P, the plating solution L that has flowed in from the first inflow pipe 64P reaches in order from the discharge port 70A to the discharge port 70E. Also, in the second liquid pipe 62S, the plating solution L that has flowed from the second inflow pipe 64S reaches in order from the discharge port 70F to the discharge port 70J. Here, an ejector effect may occur due to the flow velocity of the plating solution L at the outlets 70 (discharge outlets 70A and 70F) on the most upstream side. In addition, pressure reflection occurs at the end of the liquid pipe 62 at the outlets 70 (discharge outlets 70E and 70J) on the most downstream side.

Therefore, if the ejection ports 70 have the same diameter in each liquid tube 62, the ejection amount of the ejection ports 70 at both ends in the depth direction of the device may be lower than that of the ejection ports 70 on the central side in the depth direction of the device. In contrast, according to the plating apparatus 10 of the present embodiment, the discharge amount of the plating solution L from the discharge ports 70 at both ends of the liquid pipe 62 is reduced compared to the case where the opening areas of the discharge ports 70 are all equal. Lowering than the central side of the pipe 62 can be suppressed.

In addition, in the circulation device 60 of the present embodiment, two liquid pipes 62 are arranged with respect to the plating tank 12 , and end portions of the respective liquid pipes 62 are connected by connecting pipes 63 .

According to the plating apparatus 10 of the present embodiment, the plating solution L in each liquid pipe 62 through the connection pipe 63 is reduced compared to the case where the end portions of the liquid pipes 62 are sealed when a plurality of liquid pipes 62 are arranged. variation in flow rate can be suppressed. Even when the number of the liquid pipes 62 is three or more, the same effects as in the present embodiment can be obtained by connecting the ends with one connecting pipe.

Further, in the plating apparatus 10 of the present embodiment, each liquid pipe 62 and the corresponding inflow pipe 64 are provided with adjustment valves 65 for flow rate adjustment. Thereby, in the present embodiment, the flow rate of the plating solution L can be adjusted individually in the first liquid pipe 62P and the second liquid pipe 62S. According to the plating apparatus 10 of the present embodiment, the flow rate of the plating solution L varies depending on the shapes and paths of the liquid pipes 62 and the inflow pipes 64, compared to the case where the adjustment valves common to the liquid pipes 62 are provided. Variation can be adjusted.

In addition, when the liquid pipe 62 is added, by providing the regulating valve 65 corresponding to the added liquid pipe 62, the same effect as the present embodiment can be obtained. Alternatively, the regulating valve 65 corresponding to one liquid pipe 62 may be omitted, and the flow rate may be adjusted by the regulating valves 65 corresponding to the remaining liquid pipes 62 to adjust the variation in the flow rate of each liquid pipe 62 .

(5) Effect of Aeration Device In the aeration device 80 of this embodiment, the pipe 82 through which the air A flows extends along the depth direction of the device and is arranged below the rotation unit 20, that is, below the belt B. As shown in FIG. This pipe 82 has a plurality of discharge ports 90 at the bottom of the cross section, an inner discharge port 92 formed on the rotation unit 20 (belt B) side and an outer discharge port 94 formed on the anode basket 40 (metal M) side. and

When the pipe 82 is submerged in the plating solution L, the inside of the pipe 82 is filled with the plating solution L before the air A is pumped. Here, when the outlet is formed above the cross section of the pipe, the plating solution that cannot be pushed out by the compressed air stays inside the pipe filled with the plating solution. In addition, in the piping in this case, the flow velocity of air near the outlets on both sides in the device depth direction is higher than the flow velocity near the outlets on the central side in the device depth direction. This is because the flow channel is narrowed by the plating solution, in order to secure the air discharged from the discharge port on the center side in the depth direction of the device. On both sides in the apparatus depth direction where the air flow velocity is faster than that on the central side in the apparatus depth direction, an ejector effect may occur due to an increase in the air flow velocity. As a result, the occurrence of air bubbles in bubbling may be reduced at the outlets on both sides in the depth direction of the device compared to the outlet at the central side in the depth direction of the device.

Therefore, in the present embodiment, by forming the discharge port 90 below the cross section of the pipe 82, the plating solution L inside the pipe 82 can be discharged, compared to the case where the discharge port 90 is formed above the cross section. As a result, it is possible to suppress unevenness in the amount of bubbles of the air A at each discharge port 90, that is, unevenness in bubbling strength, and unevenness in the concentration of metal ions in the plating bath 12 in the vertical direction of the apparatus. As a result, variation in the thickness of the plated layer formed on each belt B in the vertical direction of the apparatus is suppressed.

Here, the discharge port 90 of each pipe 82 is preferably formed so that the center line is positioned within a range of 0 to 50 degrees with respect to a vertical line extending downward from the center of the cross section of the pipe 82 . When the outlet 90 is formed within such a range, the following effects are obtained. That is, compared to the case where the discharge port 90 is formed so that the center line is located in the range of 50 to 90 degrees with respect to the vertical line extending downward from the center of the cross section of the pipe 82, the plating solution L inside the pipe 82 is increased. can be discharged.

Further, when the plating bath 12 does not have enough depth, the discharge port 90 is formed so that the center line is located in the range of 20 to 50 degrees with respect to the vertical line extending downward from the center of the cross section of the pipe 82. Even better. When the discharge port 90 is formed within such a range, the following effects are obtained in addition to the above. That is, compared to the case where the outlet is formed so that the center line is located in the range of 0 to 20 degrees with respect to the vertical line extending downward from the center of the cross section of the pipe, the pressure reflection received from the bottom surface of the tank can be suppressed. can be done. As a result, more of the plating solution L inside the pipe 82 can be discharged.

Further, the discharge port 90 in the plating apparatus 10 of the present embodiment is located on the front side of the belt B fixed to the corresponding rotation unit 20, that is, on the upstream side of the flow F of the plating solution L in plan view of the plating bath 12. located in Moreover, the discharge port 90 is provided closer to the belt B than the discharge port 70 . For example, the discharge port 90A is located upstream of the flow F with respect to the belt B fixed to the corresponding rotating unit 20A, and is provided closer to the belt B than the discharge port 70A.

According to the plating apparatus 10 in which the discharge port 90 is arranged in this way, as shown in FIGS. , bubbling is performed from the discharge port 90 . Therefore, the supply of the air A is not biased in the circumferential direction of the belt B, and the belt B is entirely covered with bubbles of the air A from the bottom of the device to the top of the device. According to this embodiment, the air supplied to the belt B is less than if the outlet 90 were located downstream of the flow F or further than the mating outlet 70 relative to the corresponding belt B. Variation of foam in A can be suppressed. As a result, variation in the thickness of the plated layer formed on each belt B in the vertical direction of the apparatus is suppressed.

It should be noted that the position of the discharge port 90 is preferably set upstream by a portion corresponding to a vector obtained by synthesizing the vector of the local flow f1 of the plating solution L and the rising vector of the bubbles of the air A. According to this embodiment, the position of the discharge port 90 can be brought closer to the preferred position.

In addition, in the aeration device 80 of the present embodiment, the air A is pressure-fed from an introduction pipe 84 connected to both ends of the pipe 82 in the width direction of the device. Here, when the terminal end of the pipe to be pumped is sealed, air bubbles are generated more at the outlet closest to the sealed end due to the influence of pressure reflection than at the outlet on the central side in the device depth direction. Occurrence is reduced.

On the other hand, according to the plating apparatus 10 of the present embodiment, it is possible to suppress the influence of pressure reflection at the end portion compared to the case where the end portion of the pipe 82 is sealed and the air A is pumped from one end. . That is, in each pipe 82, the amount of air A discharged from each discharge port 90 can be made uniform. As a result, variation in the thickness of the plating layer between the end portion and the central portion of each belt B in the apparatus depth direction is suppressed. Note that even when the number of pipes 82 is three or more, by connecting each end to the introduction pipe 84, the same effects as in the present embodiment can be obtained.

Further, in the aeration device 80 of the present embodiment, each introduction pipe 84 is provided with a pressure control valve 86 for pressure control. Therefore, in this embodiment, the pressure of the air A can be individually adjusted by the first pressure regulating valve 86P and the second pressure regulating valve 86S.

According to the plating apparatus 10 of the present embodiment, variations in the pressure of the air A due to differences in the shapes and paths of the pipes 82 and the introduction pipes 84 can be adjusted compared to the case where the pressure regulating valves common to the introduction pipes 84 are provided. be able to.

Furthermore, the aeration device 80 of the present embodiment further includes additional ports 96 that are provided outside the discharge ports 90 at both ends in the device depth direction in each pipe 82 and formed below the cross section of the pipe 82 . The additional port 96, like the inner discharge port 92, is positioned so that the center line is in the range of 0 to 50 degrees, preferably in the range of 20 to 50 degrees with respect to the vertical line extending downward from the center of the cross section of the pipe 82. should be formed. According to the plating apparatus 10 of the present embodiment, the amount of the plating solution L remaining in the pipe 82 can be further reduced as compared with the case where the pipe 82 is provided with only the discharge port 90 .

In bubbling, bubbles of air A rising in the plating solution L are each attracted to each other and merged to become larger. Therefore, when the additional port 96 is not provided, the air A discharged from the discharge ports 90A and 90F flows toward the back side as it rises because there is no bubble to merge on the front side, and the air A discharged from the discharge ports 90E and 90J. Since there is no bubble to merge on the back side, it flows to the front side as it rises. In contrast, according to the present embodiment, the air A discharged from the discharge ports 90A, 90E, 90F, and 90J is drawn outward in the apparatus depth direction by providing the additional port 96 . As a result, variations in the air bubbles covering the belts B are suppressed, and variations in the thickness of the plating layer for each belt B are suppressed.

The opening area of the additional port 96 is preferably set to be half or less of the sum of the opening areas of the inner discharge port 92 and the outer discharge port 94 . By setting in this way, it is possible to suppress a decrease in the pressure of the air A at the discharge ports 90 on both sides in the device depth direction in each pipe 82 . That is, in each pipe 82, the amount of air A discharged from each discharge port 90 can be made more uniform.

(Modification)
In the rotation unit 20 of this embodiment, the belt B is electrically connected to the first input portion 132 by the plate spring portion 216 of the upper support portion 25, and the belt B is electrically connected to the first input portion 132 by the plate spring portion 226 of the lower support portion 26. It is electrically connected to the two-input section 134 . However, the connection method is not limited to this. As a modification of this embodiment, as shown in FIG. 12, electrical connection can be achieved by using a copper tape Tc, which is a conductive copper adhesive tape, instead of the adhesive tape T. Specifically, in the upper support portion 25, the copper tape Tc is wound so as to straddle the boundary portion between the outer peripheral portion of the main body portion 210 and the belt B held by the holding portion 24, thereby moving the belt B to the first input portion 132. can be electrically connected to In the lower support portion 26, a copper tape Tc is wound so as to straddle the boundary portion between the outer peripheral portion of the main body portion 220 and the belt B held by the holding portion 24, thereby moving the belt B to the second input portion 134. can be electrically connected.

(remarks)
The plating apparatus 10 of this embodiment is characterized in that the variation in the thickness of the plating layer formed on each belt B is suppressed by controlling the current for each belt B. FIG. On the other hand, according to the present embodiment, by setting a different current value for each belt B, a plurality of types of belts B having different plating layer thicknesses can be simultaneously formed in one plating apparatus 10 .

In the plating apparatus 10 of the present embodiment, an anode basket 40 serving as one anode is arranged to face one belt B in the width direction of the apparatus. On the other hand, when the paired belts B and anode baskets 40 are immersed in a plurality of sets of plating tanks 12 as in the present embodiment, the current density is bias may occur. Specifically, the current from the anode basket 40A mainly flows through the belt B fixed to the rotation unit 20A, and the current from the anode basket 40B also flows. On the other hand, through the belt B fixed to the rotating unit 20B, current mainly flows from the anode basket 40B, and current also flows from the anode baskets 40A and 40C. That is, since the anode baskets 40 adjacent to the opposing anode baskets 40 are only on one side of the belts B on both sides in the device depth direction, the current density is smaller than that of the belts B on the center side in the device depth direction.

In this way, an additional anode basket connected to the anode 102 can be provided outside the anode basket 40 in the depth direction of the device in order to bias the current density in the depth direction of the device. In this case, the distance between the additional anode basket and the anode basket 40A should be the same as the distance between the anode basket 40A and the anode basket 40B. The same applies to the case where additional anode baskets are provided outside the anode baskets 40E, 40F and 40J in the device depth direction. In this embodiment, since the current is controlled by the control unit 120, it is possible to suppress the influence on the plating layer even if the current density is uneven, but even if the current is not controlled by the control unit 120 can also suppress the above bias in current density.

In the plating apparatus 10 of the present embodiment, it is not necessary to control the current for each belt B if the concentration of metal ions and the current density in the plating tank 12 can be suppressed. Electric current can be uniformly controlled. Further, in this case, the belt B may be connected to the control unit 120 at one end in the vertical direction of the apparatus.

The plating apparatus 10 of this embodiment is an apparatus for plating a total of 10 belts B in 2 rows×5 rows, but the arrangement of the belts B that can be applied is not limited to this. The arrangement and number of the belts B are arbitrary as long as the rotation unit 20, the anode basket 40, the discharge port 70, the discharge port 90, the first input section 132 and the second input section 134 corresponding to the belt B can be provided. It is also possible to apply plating to one belt B.

In the present embodiment, the case of forming a plating layer on a polyimide belt has been described, but the base material that can be plated is not limited to this. For example, base materials to be plated include parts such as resin or metal pipes, shafts, and pistons.

10 plating equipment 12 plating bath (an example of a bath)
13 Overflow tank (an example of a container)
20 rotation unit (an example of a rotation part)
34 brush 35 contact 62 liquid pipe 65 control valve 67 pump 70 discharge port 82 pipe 84 introduction pipe 86 pressure regulating valve 90 discharge port 96 additional port 100 power supply (an example of power supply)
120 control unit A air (an example of gas)
B Polyimide belt (an example of base material)
L Plating solution (an example of electrolytic solution)
M metal

Claims (9)

A plurality of substrates having at least a conductive surface and arranged along one direction , each of which is a cylindrical body extending in a vertical direction intersecting the one direction, the inside of which is held by a holding part a plurality of substrates and a plurality of metals arranged opposite to the substrates along the one direction, wherein each of the substrates is placed in a housing portion arranged to face the substrates a tank having an electrolytic solution in which a plurality of ball-shaped metals stacked in the vertical direction and accommodated so as to be longer than the length are immersed;
a power source that applies a voltage between the base material and the metal;
a pipe extending in the one direction on the lower side of the base material and through which gas flows;
a liquid pipe extending along the pipe through which the electrolytic solution flows;
a container provided on one end side of the one direction of the tank for collecting the electrolytic solution from the tank;
a pump for pumping the electrolytic solution from the container toward the liquid tube;
a plurality of discharge ports for the electrolytic solution formed in the liquid tube corresponding to each of the base materials, the discharge ports being positioned toward the other end in the one direction with respect to the corresponding base material;
A plurality of discharge ports for the gas are formed below the pipe corresponding to each base material, and are located near the other end in the one direction with respect to the corresponding base material, and are located from the discharge port. an outlet also provided near the substrate ;
Plating equipment with The liquid pipe is provided between the base material and the metal in a plan view of the tank,
2. The plating apparatus according to claim 1 , wherein the discharge ports corresponding to one base material are formed on the base material side and the metal side respectively. 3. The plating apparatus according to claim 1 , wherein the ejection openings at both ends in the one direction in the liquid pipe have a larger opening area than the ejection openings at the central side in the one direction. 4. The plating apparatus according to any one of claims 1 to 3 , wherein a plurality of said liquid tubes are arranged, and the end portions of each liquid tube are connected. The plating apparatus according to any one of claims 1 to 4 , wherein the gas is pressure-fed from both ends of the pipe in the one direction. The plating apparatus according to any one of claims 1 to 5 , further comprising an additional port provided outside the discharge ports at both ends of the pipe in the one direction and formed below the cross section of the pipe. . an anode provided in the power supply to pass a current toward the metal;
a control unit connected between the cathode of the power source and the substrate for controlling the current returning from the substrate to the power source to a predetermined value;
The plating apparatus according to any one of claims 1 to 6 , comprising: 8. The plating apparatus according to claim 7 , wherein the controller controls the current to each substrate. The plating apparatus according to any one of claims 1 to 8 , further comprising a rotating section that rotates a holding section that holds the substrate.

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