JP7192207B2 - electronic components - Google Patents

Description

One aspect of the present invention relates to electronic components.

For example, Patent Literature 1 describes an electronic component that includes a rectangular parallelepiped element and terminal electrodes provided on end surfaces of the element. In this electronic component, the terminal electrodes are provided so as to continuously cover not only the end faces of the element but also the upper surface, the lower surface and the pair of side surfaces. The terminal electrode has a first electrode layer formed by baking or plating a metal paste, and a second electrode layer made of a conductive resin and formed on the first electrode layer.

Japanese Patent Application Laid-Open No. 2000-182879

In the electronic component as described above, cracks may occur between the element body and the terminal electrode due to expansion (tensile stress) and contraction (compressive stress) of the terminal electrode due to thermal shock when soldering, etc. .

One aspect of the present invention provides an electronic component capable of improving the durability of terminal electrodes.

According to research and studies by the present inventors, stress due to thermal shock concentrates on the electrode portion provided on the ridge between the first main surface, which is the mounting surface, and the side surface, among the terminal electrodes. Do you get it.

Accordingly, an electronic component according to one aspect of the present invention has a rectangular parallelepiped shape, and includes a first principal surface serving as a mounting surface, a second principal surface facing the first principal surface, and a second principal surface facing the first principal surface. a base body having four side surfaces extending so as to connect between the surface and the second main surface; a portion of the first main surface; and one of the side surfaces of one of the four side surfaces. and a terminal electrode provided so as to continuously cover the part, the terminal electrode having a sintered metal layer and a conductive resin layer provided on the sintered metal layer. , the conductive resin layer has a first electrode portion provided on a ridge portion between the first main surface and one side surface, and a second electrode portion provided on one side surface; and the thickness of the first electrode portion is thicker than the thickness of the second electrode portion.

In this electronic component, in the conductive resin layer, the thickness of the first electrode portion provided on the ridge is thicker than the thickness of the second electrode portion provided on the side surface. The second electrode portion is arranged, for example, between the sintered metal layer and the solder when the electronic component is solder-mounted. Since the thickness of the second electrode portion is thin, even if the electrical conductivity of the conductive resin layer is lower than the electrical conductivity of the sintered metal layer, the second electrode portion causes the sintered metal layer and the solder to separate. It becomes possible to suppress an increase in electrical resistance between Moreover, since the thickness of the first electrode portion is large, stress concentrated on the terminal electrode provided on the ridge portion due to thermal shock can be relieved. As a result, it is possible to improve the durability of the terminal electrode.

In this electronic component, the sintered metal layer has the third electrode portion provided on the ridge, and the thickness of the first electrode portion may be thicker than the thickness of the third electrode portion. In this case, since the conductive resin layer is softer than the sintered metal layer, the durability of the terminal electrode is further improved compared to the case where the thickness of the first electrode portion is thinner than the thickness of the third electrode portion. can be made

In this electronic component, the sintered metal layer has a third electrode portion provided on the ridge and a fourth electrode portion provided on one side surface, and the thickness of the third electrode portion is The thickness may be greater than the thickness of the fourth electrode portion. In this case, the durability of the terminal electrode can be further improved as compared with the case where the thickness of the third electrode portion is thinner than the thickness of the fourth electrode portion.

In this electronic component, the terminal electrodes may be spaced apart from three side surfaces other than one of the four side surfaces. In this case, for example, compared to the case where the terminal electrodes are provided so as to continuously cover the first main surface, the second main surface, one side surface, and two side surfaces adjacent to the one side surface, Therefore, the terminal electrode is easily peeled off. Even in such a case, since the thickness of the first electrode portion is thicker than the thickness of the second electrode portion, the stress concentrated on the terminal electrode provided on the ridge portion due to the thermal shock is relieved, and the peeling of the terminal electrode is prevented. can be suppressed.

In this electronic component, the edge on the main surface of the sintered metal layer may be substantially linear. In this case, compared with the case where the edge on the main surface of the sintered metal layer is convex, it is possible to suppress the concentration of stress on the edge on the main surface of the sintered metal layer.

One aspect of the present invention provides an electronic component capable of improving the durability of terminal electrodes.

FIG. 1 is a perspective view showing an electronic component according to one embodiment. FIG. 2 is a cross-sectional view of a terminal electrode. FIG. 3 is a plan view of the end portion of the terminal electrode. FIG. 4 is a diagram showing an equivalent circuit of an electronic component according to one embodiment. FIG. 5 is an exploded perspective view of the element. FIG. 6 is a perspective view showing the internal structure of the element body. FIG. 7 is a plan view of an end portion of a terminal electrode according to a comparative example.

Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings. In the description of the drawings, the same or corresponding elements are denoted by the same reference numerals, and overlapping descriptions are omitted.

FIG. 1 is a perspective view showing an electronic component according to one embodiment. As shown in FIG. 1, an electronic component 1 includes a base body 2, a first terminal electrode 4, a second terminal electrode 5, a third terminal electrode 6, a fourth terminal electrode 7 and a fifth terminal electrode. 8 and a sixth terminal electrode 9 . The electronic component 1 is, for example, a laminated filter formed by laminating a plurality of insulating layers. Electronic component 1 is a diplexer.

The element body 2 has a rectangular parallelepiped shape. The rectangular parallelepiped shape includes a rectangular parallelepiped shape with chamfered corners and edges, and a rectangular parallelepiped shape with rounded corners and edges. The element body 2 has, as its outer surface, a pair of main surfaces 2a and 2b facing each other and a pair of side surfaces facing each other and extending so as to connect the pair of main surfaces 2a and 2b. 2c and 2d, and a pair of side surfaces 2e and 2f extending to connect the pair of main surfaces 2a and 2b and facing each other. The main surface 2a is defined as a surface (mounting surface) that faces another electronic device (for example, a circuit board or an electronic component) when the electronic component 1 is mounted on another electronic device (for example, a circuit board or an electronic component).

The direction D1 in which the pair of main surfaces 2a and 2b face each other, the direction D2 in which the pair of side faces 2c and 2d face each other, and the direction D3 in which the pair of side faces 2e and 2f face each other are They are substantially perpendicular to each other. The length of the element body 2 in the direction D1 is, for example, 0.9 mm, the length of the element body 2 in the direction D2 is, for example, 2 mm, and the length of the element body 2 in the direction D3 is, for example, 1.0 mm. 25 mm.

The element body 2 is arranged between the main surface 2a and the side surface 2c, between the main surface 2a and the side surface 2d, between the main surface 2a and the side surface 2e, between the main surface 2a and the side surface 2f, between the main surface 2b and the side surface. 2c, between main surface 2b and side surface 2d, between main surface 2b and side surface 2e, between main surface 2b and side surface 2f, between side surface 2c and side surface 2e, between side surface 2e and side surface 2d It has a ridgeline portion 2g located between the side surface 2d and the side surface 2f, and between the side surface 2f and the side surface 2c. In this embodiment, the element body 2 is subjected to so-called R chamfering. Thereby, each ridgeline portion 2g is rounded so as to be curved.

A ridgeline portion 2g between the main surface 2a and the side surface 2c extends along the direction D3. A ridgeline portion 2g between the main surface 2a and the side surface 2d extends along the direction D3. A ridgeline portion 2g between the main surface 2a and the side surface 2e extends along the direction D2. A ridgeline portion 2g between the main surface 2a and the side surface 2f extends along the direction D2. A ridgeline portion 2g between the main surface 2b and the side surface 2c extends along the direction D3. A ridgeline portion 2g between the main surface 2b and the side surface 2d extends along the direction D3. A ridgeline portion 2g between the main surface 2b and the side surface 2e extends along the direction D2. A ridgeline portion 2g between the main surface 2b and the side surface 2f extends along the direction D2. A ridgeline portion 2g between the side surface 2c and the side surface 2e extends along the direction D1. A ridgeline portion 2g between the side surface 2e and the side surface 2d extends along the direction D1. A ridgeline portion 2g between the side surface 2d and the side surface 2f extends along the direction D1. A ridgeline portion 2g between the side surface 2f and the side surface 2c extends along the direction D1.

The element body 2 is constructed by stacking a plurality of insulator layers 10 (see FIG. 5). Each insulator layer 10 is laminated in the direction D1. That is, the stacking direction of each insulator layer 10 matches the direction D1. Each insulator layer 10 has a substantially rectangular shape in plan view. In the actual element body 2, each insulator layer 10 is integrated to such an extent that the boundary between the layers cannot be visually recognized. Each insulator layer 10 is, for example, a ceramic containing a dielectric material (BaTiO3 _- based material, Ba(Ti,Zr)O3 _- based material, (Ba,Ca)TiO3 _- based material, glass material, alumina material, etc.) It is composed of a sintered green sheet.

The first terminal electrode 4 , the second terminal electrode 5 and the third terminal electrode 6 are arranged on the side surface 2 e of the element body 2 . The first terminal electrode 4, the second terminal electrode 5, and the third terminal electrode 6 are formed so as to cover part of the side surface 2e along the stacking direction of the element body 2, and cover part of the main surface 2a. It is formed on a part of main surface 2b. The first terminal electrode 4, the second terminal electrode 5, and the third terminal electrode 6 are provided so as to continuously cover a portion of the main surface 2a, a portion of the side surface 2e, and a portion of the main surface 2b. ing. The first terminal electrode 4, the second terminal electrode 5, and the third terminal electrode 6 are U-shaped when viewed from the direction D2.

In the element body 2, the second terminal electrode 5 is located in the center in the direction D2, the first terminal electrode 4 is located closer to the side surface 2c than the second terminal electrode 5, and the third terminal electrode 6 is located in the It is located closer to the side surface 2d than the two-terminal electrode 5 is. In this embodiment, the first terminal electrode 4, the second terminal electrode 5 and the third terminal electrode 6 are provided only on the side surface 2e and the main surfaces 2a and 2b. The first terminal electrode 4, the second terminal electrode 5, and the third terminal electrode 6 are not provided on the side surfaces 2c, 2d, and 2f, but are provided apart from the side surfaces 2c, 2d, and 2f. The side surfaces 2c, 2d, and 2f are not covered with the first terminal electrode 4, the second terminal electrode 5, and the third terminal electrode 6, and from the first terminal electrode 4, the second terminal electrode 5, and the third terminal electrode 6, Exposed.

The fourth terminal electrode 7 , the fifth terminal electrode 8 and the sixth terminal electrode 9 are arranged on the side surface 2 f side of the element body 2 . The fourth terminal electrode 7, the fifth terminal electrode 8, and the sixth terminal electrode 9 are formed so as to cover part of the side surface 2f along the stacking direction of the element body 2, and cover part of the main surface 2a. It is formed on a part of main surface 2b. The fourth terminal electrode 7, the fifth terminal electrode 8, and the sixth terminal electrode 9 are provided so as to continuously cover a portion of the main surface 2a, a portion of the side surface 2f, and a portion of the main surface 2b. ing. The fourth terminal electrode 7, the fifth terminal electrode 8, and the sixth terminal electrode 9 are U-shaped when viewed from the direction D2.

In the element body 2, the fifth terminal electrode 8 is located in the center in the direction D2, the fourth terminal electrode 7 is located closer to the side surface 2c than the fifth terminal electrode 8, and the sixth terminal electrode 9 is located in the It is located closer to the side surface 2d than the five-terminal electrode 8 is. In this embodiment, the fourth terminal electrode 7, the fifth terminal electrode 8 and the sixth terminal electrode 9 are provided only on the side surface 2f and the main surfaces 2a and 2b. The fourth terminal electrode 7, the fifth terminal electrode 8 and the sixth terminal electrode 9 are not provided on the side surfaces 2c, 2d and 2e, but are provided apart from the side surfaces 2c, 2d and 2e. The side surfaces 2c, 2d, and 2e are not covered with the fourth terminal electrode 7, the fifth terminal electrode 8, and the sixth terminal electrode 9, and from the fourth terminal electrode 7, the fifth terminal electrode 8, and the sixth terminal electrode 9, Exposed.

Each terminal electrode 4 to 9 has, for example, the same shape. The width (length in the direction D2) of each of the terminal electrodes 4 to 9 is, for example, about 15 to 20% of the length of the element body 2 in the direction D2.

2 is a cross-sectional view of the terminal electrode shown in FIG. 1. FIG. FIG. 2 shows a cross-sectional view of the first terminal electrode 4 as an example, but each of the terminal electrodes 4 to 9 in this embodiment has the same cross-sectional structure. In FIG. 2, illustration of coil conductors, internal conductors, and internal electrodes, which will be described later, is omitted. Each terminal electrode 4 to 9 has a first electrode layer E1, a second electrode layer E2, a third electrode layer E3, and a fourth electrode layer E4, as shown in FIG.

The first electrode layer E1 is provided on a portion of the principal surface 2a, a portion of the side surface 2e or the side surface 2f, and a portion of the principal surface 2b so as to continuously cover them. The first electrode layer E1 is formed, for example, by baking a conductive paste applied to the surface of the element body 2. As shown in FIG. The first electrode layer E1 is a sintered metal layer formed by sintering the metal component (metal powder) contained in the conductive paste. Ag, Au, Cu, Ag/Pd alloy, for example, is used as the metal component. A conductive paste contains, for example, a metal component, a glass component, an organic binder, and an organic solvent. The first electrode layer E1 is a base metal layer for forming the second electrode layer E2.

The conductive paste is applied, for example, by screen printing. Screen printing is performed, for example, on each of main surface 2a, side surface 2e or side surface 2f, and main surface 2b. Even when screen printing is performed only on the side surface 2e or the side surface 2f, the conductive paste is applied to the main surface 2a and the main surface 2b because the conductive paste wraps around the main surface 2a and the main surface 2b from the side surface 2e or the side surface 2f. can. However, there is a limit to the area of the conductive paste that can be applied by such wrapping. In particular, since the main surface 2a is a mounting surface, if the area of each of the terminal electrodes 4 to 9 on the main surface 2a is small, the mounting strength may decrease when the electronic component 1 is solder-mounted to another electronic device. be.

In addition to the side surface 2e or the side surface 2f, at least the main surface 2a serving as the mounting surface is screen-printed separately, so that the areas of the terminal electrodes 4 to 9 on the main surface 2a can be increased. As a result, when the electronic component 1 is solder-mounted to another electronic device, the bonding area between the solder and the terminal electrodes 4 to 9 can be increased, so that the mounting strength can be improved. For example, after providing electrode pads on the main surface 2a in advance, screen printing is performed only on the side surface 2e or the side surface 2f, and the conductive paste is applied to the main surface 2a, the side surface 2e or the side surface 2f, and the main surface 2b. Then, the first electrode layer E1 may be formed by baking the applied conductive paste. In this case, the electrode pads may be formed by, for example, applying a conductive paste to the surface of the element body 2 before firing, and firing the paste together with the element body 2 .

The first electrode layer E1 includes an electrode portion E1a provided on the main surface 2a or the main surface 2b, an electrode portion E1b provided on the side surface 2e or the side surface 2f, and an electrode portion E1c provided on the ridge line portion 2g. and have The electrode portion E1a overlaps the principal surface 2a or the principal surface 2b when viewed from the direction (direction D1) orthogonal to the principal surface 2a or the principal surface 2b. The electrode portion E1b overlaps the side surface 2e or the side surface 2f when viewed from the direction (direction D2) orthogonal to the side surface 2e or the side surface 2f. The electrode portion E1c is arranged between the electrode portions E1a and E1b and connects the electrode portions E1a and E1b.

The second electrode layer E2 is provided on the first electrode layer E1 so as to cover the entire first electrode layer E1. The second electrode layer E2 is a conductive resin layer formed by curing the conductive resin applied on the first electrode layer E1. The conductive resin includes resin (eg, thermosetting resin), conductive material (eg, metal powder), and organic solvent. Ag, for example, is used as the conductive material. As the thermosetting resin, for example, phenol resin, acrylic resin, silicone resin, epoxy resin, or polyimide resin is used. In this embodiment, the electrical conductivity of the second electrode layer E2 is lower than the electrical conductivity of the first electrode layer E1. Also, the second electrode layer E2 is softer than the first electrode layer E1.

The second electrode layer E2 includes an electrode portion E2a provided on the main surface 2a or the main surface 2b, an electrode portion E2b provided on the side surface 2e or the side surface 2f, and an electrode portion E2c provided on the ridge line portion 2g. and have The electrode portion E2a overlaps the principal surface 2a or the principal surface 2b when viewed from the direction (direction D1) orthogonal to the principal surface 2a or the principal surface 2b. The electrode portion E2b overlaps the side surface 2e or the side surface 2f when viewed from the direction (direction D2) orthogonal to the side surface 2e or the side surface 2f. The electrode portion E2c is arranged between the electrode portion E2a and the electrode portion E2b and connects the electrode portion E2a and the electrode portion E2b.

A thickness t1 of the electrode portion E1c is, for example, 28 μm. A thickness t2 of the electrode portion E2c is, for example, 30 μm. A thickness t3 of the electrode portion E1b is, for example, 12 μm. A thickness t4 of the electrode portion E2b is, for example, 15 μm. A thickness t5 of the electrode portion E1a is, for example, 30 μm. A thickness t6 of the electrode portion E2a is, for example, 32 μm. The thicknesses t1 to t6 are average values. The average value may be the average value of the thicknesses obtained at a plurality of locations of the electrode portions E1a, E1b, E1c, E2a, E2b, and E2c, or may be the overall average value obtained by image processing. .

The thickness t2 is thicker than the thickness t1 (t1<t2). The thickness t4 is thicker than the thickness t3 (t3<t4). The thickness t6 is thicker than the thickness t5 (t5<t6). The thickness t1 is thicker than the thickness t3 (t3<t1). The thickness t2 is thicker than the thickness t4 (t4<t2). In the present embodiment, even if the thicknesses t1 to t6 are the maximum values, their magnitude relationships are established.

In this embodiment, the minimum thickness of the electrode portion E2c is greater than the maximum thickness of the electrode portion E1c. The minimum thickness of the electrode portion E2b is greater than the maximum thickness of the electrode portion E1b. The minimum thickness of the electrode portion E2a is greater than the maximum thickness of the electrode portion E1a. The maximum thickness of the electrode portion E1b is greater than the minimum thickness of the electrode portion E1c. The maximum thickness of the electrode portion E2b is greater than the minimum thickness of the electrode portion E2c.

The third electrode layer E3 is provided on the second electrode layer E2 so as to cover the entire second electrode layer E2. The third electrode layer E3 is a plated layer formed on the second electrode layer E2 by a plating method. The third electrode layer E3 is a Ni plating layer formed by Ni plating, for example. That is, the third electrode layer E3 contains Ni. The third electrode layer E3 may be a Sn plating layer, a Cu plating layer, or an Au plating layer. That is, the third electrode layer E3 may contain Sn, Cu, or Au.

The fourth electrode layer E4 is provided on the third electrode layer E3 so as to cover the entire third electrode layer E3. The fourth electrode layer E4 is a plated layer formed on the third electrode layer E3 by a plating method. The fourth electrode layer E4 is a Sn-plated layer formed by, for example, Sn-plating. That is, the fourth electrode layer E4 contains Sn. The fourth electrode layer E4 may be a Cu plating layer or an Au plating layer. That is, the fourth electrode layer E4 may contain Cu or Au.

In this way, each of the terminal electrodes 4 to 9 of this embodiment has a multi-layer structure (specifically Typically, it has a four-layer structure). The plated layer formed on the second electrode layer E2 has a multilayer structure (specifically, a two-layer structure) including a third electrode layer E3 and a fourth electrode layer E4. Each of the terminal electrodes 4-9 may not have the third electrode layer E3 and the fourth electrode layer E4.

FIG. 3 is a plan view of the end portion of the terminal electrode. FIG. 3 shows, as an example, a plan view of the end portion on the main surface 2a of the first terminal electrode 4, but the main surface 2a and the main surface 2b of each of the terminal electrodes 4 to 9 in the present embodiment are shown. each end of has the same shape. In FIG. 3, illustration of the third electrode layer E3 and the fourth electrode layer E4 is omitted. As shown in FIG. 3, the edge E1e on the main surface 2a of the first electrode layer E1 of the first terminal electrode 4 is substantially linear when viewed from the direction (direction D1) perpendicular to the main surface 2a. . The edge E1e extends along the direction (direction D2) in which the ridgeline portion 2g between the main surface 2a and the side surface 2e extends. The electrode portion E1a, which is the portion provided on the main surface 2a, has a substantially rectangular shape. The second electrode layer E2 is arranged so as to entirely cover the first electrode layer E1.

Next, after explaining the circuit configuration of the electronic component 1, the internal configuration of the electronic component 1 will be explained. As shown in FIG. 4, the electronic component 1 has an input terminal T _IN to which a signal is input, a first output terminal T _OUT1 to which a signal is output, a second output terminal T _OUT2 to which a signal is output, A _first filter F1 provided on the line S1 connecting the input terminal _TIN and the first output terminal _TOUT1 , and a second filter provided on the line S2 connecting the input terminal _TIN and the second output terminal _TOUT2 . _F2 and an open inductor L _OPEN .

The first filter F1 has a _first LC resonant circuit RC1 and a second LC resonant circuit RC2. The first LC resonant circuit RC1 and the second LC resonant circuit RC2 are connected in series. The first LC resonant circuit RC1 constitutes a high-pass filter. The first LC resonant circuit RC1 selects one of a first signal having a frequency within a first frequency band and a second signal having a frequency within a second frequency band which is a higher frequency band than the first frequency band. , to selectively pass the second signal. The first LC resonant circuit RC1 includes an inductor L1 and three capacitors C1 ₁ , C1 ₂ and C1 ₃ . Capacitor C1 ₁ and capacitor C1 ₃ are connected in series. Capacitor _C1-2 is connected in parallel with capacitor _C1-1 and capacitor _C1-3 . The inductor L1 has _one end connected between the capacitors C1-1 and _C1-3 and the other end connected to the ground terminal.

The second LC resonance circuit RC2 constitutes a low-pass filter. The second LC resonant circuit RC2 selectively passes the first signal out of the first signal and the second signal. The second LC resonant circuit RC2 includes an inductor L2 and a capacitor C2. Inductor L2 and capacitor C2 are connected in parallel.

The _second filter F2 has a third LC resonant circuit RC3, a fourth LC resonant circuit RC4, and a capacitor C. The third LC resonant circuit RC3 and the fourth LC resonant circuit RC4 are connected in series. The third LC resonant circuit RC3 and the fourth LC resonant circuit RC4 constitute a low-pass filter. The third LC resonance circuit RC3 includes an inductor L3 and a capacitor C3. Inductor L3 and capacitor C3 are connected in parallel. The fourth LC resonant circuit RC4 is configured including an inductor L4 and a capacitor C4. Inductor L4 and capacitor C4 are connected in parallel. The capacitor C has one end connected between the third LC resonance circuit RC3 and the fourth LC resonance circuit RC4 and the other end connected to the ground terminal G.

The open inductor L _OPEN has one end connected to the ground terminal G and the other end open.

The first terminal electrode 4 shown in FIG. 1 constitutes a ground terminal G. As shown in FIG. The second terminal electrode 5 constitutes an _input terminal TIN. The third terminal electrode 6 constitutes a ground terminal G. As shown in FIG. The fourth terminal electrode 7 constitutes the second output terminal _TOUT2 . The fifth terminal electrode 8 constitutes a ground terminal G. As shown in FIG. The sixth terminal electrode 9 constitutes the first output terminal _TOUT1 . A first filter F ₁ , a second filter F ₂ and an open inductor L _OPEN are arranged in the element body 2 .

The inductor L1 is composed of a coil conductor 12, a coil conductor 15, and a coil conductor 17, as shown in FIGS. The inductor L1 is configured in a loop shape with the direction along the stacking direction as the axis. One end of the coil conductor 12 is connected to the fifth terminal electrode 8 . One end of the coil conductor 17 is electrically connected to the internal electrodes 28 and 31 by through-hole conductors. The coil conductor 12 and the coil conductor 17 are formed containing at least one of Ag and Pd as a conductive material, for example. The coil conductor 12 and the coil conductor 17 are configured as sintered bodies of conductive paste containing at least one of Ag and Pd as a conductive material. In the following description, coil conductors and internal electrodes are similarly formed.

_The capacitor C11 is composed of an internal electrode 32 and an internal electrode 34 . The internal electrode 34 is connected to the second terminal electrode 5 . _The capacitor C12 is composed of an internal electrode 31 and an internal electrode 34 . The capacitor C13 is composed of an internal electrode 28 and an internal electrode ₃₂ .

The inductor L2 is composed of a coil conductor 13, a coil conductor 16, and a coil conductor . The inductor L2 is configured in a loop shape with the direction along the stacking direction as the axis. One end of the coil conductor 18 is electrically connected to the internal electrode 32 by a through-hole conductor. The capacitor C<b>2 is composed of an internal electrode 32 and an internal electrode 35 . The internal electrode 35 is connected to the sixth terminal electrode 9 .

The inductor L3 is composed of a coil conductor 11 and a coil conductor . The inductor L3 is configured in a loop shape with the direction along the stacking direction as the axis. One end of the coil conductor 11 is connected to the second terminal electrode 5 . The capacitor C3 is composed of an internal electrode 26 and an internal electrode 27 . The internal electrode 26 is connected to the second terminal electrode 5 . The internal electrode 27 is electrically connected to the coil conductor 22 by a through-hole conductor.

The inductor L4 is composed of the coil conductor 19 and the coil conductor 22 . The inductor L4 is configured in a loop shape with the direction along the stacking direction as the axis. One end of the coil conductor 22 is electrically connected to one end of the coil conductor 14 by a through-hole conductor. The capacitor C4 is composed of the internal electrode 30, the internal electrode 27 and the internal electrode 33. As shown in FIG. The internal electrode 30 is connected to the fourth terminal electrode 7 .

The capacitor C is composed of the internal electrodes 29 and 36 and the internal electrodes 27 and 33 . The internal electrode 29 is connected to the first terminal electrode 4 . The internal electrode 36 is connected to the first terminal electrode 4 and the fifth terminal electrode 8 .

The open inductor L _OPEN is composed of a coil conductor 20 , a coil conductor 23 , a coil conductor 24 and a coil conductor 25 . The open inductor L _OPEN is configured in a loop shape with the direction along the stacking direction as the axis. One end of the coil conductor 20 is connected to the third terminal electrode 6 . The open inductor L _OPEN is arranged at a position facing the inductor L2 of the second LC resonant circuit RC2. That is, the open inductor L _OPEN and the inductor L2 are adjacent to each other in the stacking direction. Specifically, the coil conductor 20 of the open inductor L _OPEN is arranged at a position facing (overlapping when viewed from the stacking direction of the element body 2) the coil conductor 18 of the inductor L2 with the insulator layer 10 interposed therebetween. .

As described above, in the electronic component 1, the thickness t2 of the electrode portion E2c, which is the portion provided on the ridge line portion 2g, of the second electrode layer E2 is equal to the thickness t2 of the portion provided on the side surface 2e or the side surface 2f. is thicker than the thickness t4 of the electrode portion E2b. In this embodiment, the electrical conductivity of the second electrode layer E2 is lower than the electrical conductivity of the first electrode layer E1. However, when the electronic component 1 is solder-mounted, the thickness t4 of the electrode portion E2b arranged between the solder and the first electrode layer E1 is thin, so the electrode portion E2b causes the first electrode layer It is possible to suppress an increase in electrical resistance between E1 and solder. Moreover, since the thickness t2 of the electrode portion E2c is large, the stress concentrated on the terminal electrodes 4 to 9 in the ridgeline portion 2g due to thermal shock can be relieved. As a result, the durability of each of the terminal electrodes 4-9 can be improved. Furthermore, since the thickness t4 of the electrode portion E2b is thin, the length of the electronic component 1 in the direction D2 can be suppressed.

The thickness t2 of the electrode portion E2c is thicker than the thickness t1 of the electrode portion E1c, which is the portion of the first electrode layer E1 provided on the ridgeline portion 2g. The second electrode layer E2 is a conductive resin layer, and is softer than the first electrode layer E1, which is a sintered metal layer. The durability of 9 can be further improved.

The first terminal electrode 4, the second terminal electrode 5 and the third terminal electrode 6 are provided apart from the side surfaces 2c, 2d and 2f. The fourth terminal electrode 7, the fifth terminal electrode 8 and the sixth terminal electrode 9 are provided apart from the side surfaces 2c, 2d and 2e. For this reason, for example, five surfaces consisting of the main surface 2a, the main surface 2b, the side surface 2c, and the side surfaces 2e and 2f adjacent to the side surface 2c via the ridge line portion 2g are continuously covered. Compared to the terminal electrodes, the terminal electrodes 4 to 9 of the present embodiment, which are provided so as to continuously cover the three surfaces, are easily peeled off. Even in such a case, since the thickness t2 of the electrode portion E2c is thicker than the thickness t4 of the electrode portion E2b, the stress can be alleviated and peeling of the terminal electrodes 4-9 can be suppressed.

The thickness t1 of the electrode portion E1c is thicker than the thickness t3 of the electrode portion E1b, which is the portion of the first electrode layer E1 provided on the side surface 2e or the side surface 2f. Therefore, the durability of each of the terminal electrodes 4 to 9 can be further improved as compared with the case where the thickness t1 is thinner than the thickness t3.

FIG. 7 is a plan view of an end portion of a terminal electrode according to a comparative example. FIG. 7 shows, as an example, a plan view of an end portion on the main surface 2a of the terminal electrode 50 according to the comparative example, but each end portion on the main surface 2a and the main surface 2b of the terminal electrode 50 is , have the same shape. The terminal electrode 50 is different from the terminal electrodes 4 to 9 according to the embodiment in terms of the shapes of the ends on the main surface 2a and the main surface 2b. In FIG. 7, illustration of the third electrode layer E3 and the fourth electrode layer E4 is omitted. An edge E1e on the main surface 2a of the first electrode layer E1 in the terminal electrode 50 is arcuate and convex toward the side surface 2f when viewed from the direction (direction D1) perpendicular to the main surface 2a. . The length in the direction D3 of the electrode portion E1a, which is the portion provided on the main surface 2a, increases from both ends in the width direction (direction D2) toward the center.

When an electronic component having such a terminal electrode 50 is solder-mounted to another electronic device (for example, a circuit board or an electronic component), the edge E1e is arc-shaped, so that one point of the tip of the edge E1e stress tends to concentrate on In contrast, in the electronic component 1 according to the embodiment, since the edges E1e of the terminal electrodes 4 to 9 are linear, the stress is dispersed. Therefore, according to the electronic component 1, the mounting strength can be improved.

The present invention is not necessarily limited to the above-described embodiments, and various modifications are possible without departing from the scope of the invention.

In the above embodiments, a diplexer has been described as an example of an electronic component, but the present invention is not limited to this example and may be applied to electronic components such as capacitors, inductors, varistors, or thermistors.

In the above embodiment, the terminal electrodes 4 to 9 are arranged on the side surface 2e or the side surface 2f and the main surfaces 2a and 2b. Not limited.

Each of the terminal electrodes 4 to 9 is provided so as to continuously cover at least a portion of the main surface 2a serving as the mounting surface and a portion of any one of the side surfaces 2c, 2d, 2e, and 2f. All you have to do is For example, the terminal electrodes 4 to 9 may not be provided on the main surface 2b, but may be provided apart from the main surface 2b. In other words, the main surface 2b may be exposed from the terminal electrodes 4-9 without being covered with the terminal electrodes 4-9.

In the above embodiment, the terminal electrodes 4 to 9 of the electronic component 1 are provided so as to continuously cover three surfaces, but may be provided so as to continuously cover four or more surfaces. good. For example, terminal electrodes provided so as to continuously cover five surfaces of the electronic component 1 (for example, the entire side surface 2c or the side surface 2d, the main surface 2a, the main surface 2b, the side surface 2e, and part of the side surface 2f). may be provided.

In the above embodiment, the ends of the main surfaces 2a and 2b of the terminal electrodes 4 to 9 have the same shape, but they may have different shapes.

DESCRIPTION OF SYMBOLS 1... Electronic component, 2... Element body, 2a... Main surface (first main surface), 2b... Main surface (second main surface), 2c, 2d, 2e, 2f... Side surface, 2g... Ridge line part, 4... Second main surface 1 terminal electrode, 5... second terminal electrode, 6... third terminal electrode, 7... fourth terminal electrode, 8... fifth terminal electrode, 9... sixth terminal electrode, E1... first electrode layer, E1b... electrode part (fourth electrode portion), E1c... electrode portion (third electrode portion). E1e... Edge, E2... Second electrode layer, E2b... Electrode portion (second electrode portion), E2c... Electrode portion (first electrode portion).

Claims (6)

a first principal surface serving as a mounting surface; a second principal surface facing the first principal surface; and a space between the first principal surface and the second principal surface. a body having four connectingly extending side surfaces;
a terminal electrode provided so as to continuously cover a portion of the first main surface and a portion of one of the four side surfaces;
The terminal electrode has a sintered metal layer and a conductive resin layer provided on the sintered metal layer so as to cover the entire sintered metal layer,
The conductive resin layer includes: a first electrode portion provided only on a ridge portion between the first main surface and the one side surface; a second electrode portion provided in the
The electronic component, wherein the average thickness of the first electrode portions is greater than the average thickness of the second electrode portions. The sintered metal layer has a third electrode portion provided on the ridge,
2. The electronic component according to claim 1, wherein the thickness of said first electrode portion is thicker than the thickness of said third electrode portion. The sintered metal layer has a third electrode portion provided on the ridge and a fourth electrode portion provided on the one side surface,
2. The electronic component according to claim 1, wherein the thickness of said third electrode portion is thicker than the thickness of said fourth electrode portion. 4. The electronic component according to claim 3, wherein the thickness of said first electrode portion is thicker than the thickness of said third electrode portion. The electronic component according to any one of claims 1 to 4, wherein said terminal electrodes are provided apart from three side surfaces other than said one side surface among said four side surfaces. The electronic component according to any one of claims 1 to 5, wherein an edge of said sintered metal layer on said first main surface is substantially linear.

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