JP7221821B2 - Method for manufacturing adhesive substrate - Google Patents

Description

The present invention relates to a method for manufacturing an adhesive substrate.

Conventionally, as a holding jig for holding or transporting electronic components such as ceramic capacitors, chip resistors, coils, and silicon wafers in close contact, a metal substrate and an adhesive rubber elastic member provided on the metal substrate have been used. It is known to consist of Such a holding jig is disclosed in Patent Document 1, for example.
As a method for manufacturing the holding jig, it can be obtained by coating and curing a resin composition for a rubber elastic member having adhesiveness on a substrate.

JP 2018-187895 A

However, various investigations on materials for the substrate and the adhesive rubber elastic member have revealed that wavy unevenness occurs on the surface of the coating film of the resin composition, resulting in poor appearance and uneven film thickness. If the thickness of the adhesive layer varies, the adherents such as parts cannot be held uniformly, which may cause them to come off.
SUMMARY OF THE INVENTION It is an object of the present invention to provide a method for producing a high-quality adhesive substrate having a flat surface of the adhesive layer.

As a result of verifying the appearance defects and film thickness variations of the adhesive layer, the present inventors found that when the substrate was removed from the coating device after applying the composition of the adhesive layer, it did not occur on the metal substrate, and in the case of the insulating substrate. Since the poor appearance was remarkable, the inventors found that the poor appearance and variations in film thickness were caused by peeling electrification, leading to the present invention.
That is, the present invention is a method for producing an adhesive substrate having an adhesive layer on an insulating substrate, comprising: a first step of providing a heat-resistant antistatic agent on the back surface of the insulating substrate; A second step of forming a coating film by placing it on a support table of a coating device and coating a thermosetting resin composition containing a fluorine-based elastomer for an adhesive layer on an insulating substrate to form the coating film. and a third step of removing the insulating substrate from the supporting table and then curing the coating film to form an adhesive layer.

The insulating substrate is preferably at least one selected from glass epoxy, polyimide, polyester, and phenolic resin.

According to the method for producing an adhesive substrate of the present invention, it is possible to obtain a high-quality adhesive substrate having a flat surface of the adhesive layer.

It is a schematic sectional drawing which shows the manufacturing method of the adhesive board|substrate of this invention. FIG. 4 is a plan view showing an example of use of the adhesive substrate;

An embodiment of the present invention will be described below, but the following embodiment is presented for the purpose of illustration, and the present invention is not limited to the embodiment shown below.

[Method for producing adhesive substrate]
One embodiment of the method for producing an adhesive substrate of the present invention is a method for producing an adhesive substrate having an adhesive layer on an insulating substrate, wherein a heat-resistant antistatic agent is provided on the back surface of the insulating substrate. A first step of placing an insulating substrate on a support table of a coating device and applying a thermosetting resin composition containing a fluorine-based elastomer for an adhesive layer on the insulating substrate to form a coating film. 2 steps and a third step of removing the insulating substrate with the coating film formed thereon from the support base and then curing the coating film to form an adhesive layer.
Details of each step of the present invention will be described below with reference to FIG.

(First step)
The first step is to provide a heat-resistant antistatic agent 14 on the back surface 12 b of the insulating substrate 12 .
The insulating substrate 12 is preferably at least one selected from glass epoxy, polyimide, polyester, and phenol resin. The insulating substrate 12 may be a mixture of these materials or a laminate of two or more substrates.
The thickness of the insulating substrate 12 is preferably 0.1 mm or more and 2 mm or less, more preferably 0.3 mm or more and 1 mm or less, from the viewpoint of workability and prevention of bending of the base material.

As the antistatic agent 14, although it will be described later, since the coating film 13a of the thermosetting resin composition containing the fluorine-based elastomer for the adhesive layer is heat-cured, it has heat resistance of 100 ° C. or more except for volatile substances. is preferred. Examples of the antistatic agent 14 include metal salts, surfactants, metal-containing colloids, polymer solid electrolytes, and the like. Among them, metal salts and surfactants are more preferable.

From the viewpoint of conductivity, the metal salt type antistatic agent is more preferably an alkali metal salt such as a sodium salt, a tium salt, or a potassium salt. Sodium salt type antistatic agents include sodium perchlorate. Lithium salt type antistatic agents include lithium perchlorate, lithium carboxylate, lithium sulfonate, lithium sulfate, and lithium phosphate. Carboxylic acid lithium salts include, for example, aliphatic monocarboxylic acid lithium salts, polyoxyethylene alkyl ether carboxylic acid lithium salts, N-acylsarcosinate lithium salts, N-acylglutamic acid lithium salts and the like. Sulfonic acid lithium salts include, for example, dialkylsulfosuccinic acid lithium salts, alkanesulfonic acid lithium salts, alpha-olefin sulfonic acid lithium salts, alkylbenzenesulfonic acid lithium salts including linear types, and alkylnaphthalenesulfonic acid lithium salts. be
The sulfate lithium salt is, for example, an alkyl sulfate lithium salt.
Phosphate lithium salts include, for example, alkyl phosphate lithium salts, polyoxyethylene alkyl ether phosphate lithium salts, and polyoxyethylene alkylphenyl ether phosphate lithium salts.
Examples of other lithium salt-based antistatic agents include lithium chloride, lithium nitride salts, and imide-based lithium sulfonate salts such as lithium bis(trifluoromethanesulfonyl)imide. The metal salt antistatic agents may be used singly or in combination of two or more.

Surfactant-type antistatic agents adsorb moisture in the air to the surface of an object through the action of the surfactant, and by imparting electrical conductivity to the surface of the object, it prevents electrification. The surfactant-type antistatic agent is not particularly limited, and conventionally known cationic surfactants, anionic surfactants, nonionic surfactants, amphoteric surfactants, and the like can be used.

Examples of nonionic surfactants include alcohol-type (ethanol, isopropyl alcohol, polyethylene glycol, etc.), ether-type (polyoxyethylene alkyl ether, polyoxyalkylene alkyl ether, polyoxyethylene alkylphenyl ether, etc.), and ester-type surfactants. (Sorbitan fatty acid ester, polyoxyethylene sorbitan fatty acid ester, polyoxyethylene sorbitol fatty acid ester, glycerin fatty acid ester, etc.), glycerin type (polyoxyethylene glyceride, etc.).

The metal salt type antistatic agent and the surfactant type antistatic agent may be used alone, or two or more different types of surfactants may be used in combination.

The antistatic agent 14 can be applied to the insulating substrate 12 by spray coating, spin coating, slit coating, roll coating, dip coating, vacuum deposition, or the like, as a stock solution or a solution dissolved in an appropriate solvent.

Although the thickness of the antistatic agent 14 is not particularly limited, it is preferably 1 μm or less. When the thickness is within the above range, it is possible to satisfactorily prevent electrification of the insulating substrate 12 provided with the coating film 13a of the resin composition.

(Second step)
In the second step, as shown in FIG. 1(b), an insulating substrate 12 is placed on a support table 11 of a coating device, and a thermosetting adhesive layer 13 containing a fluorine-based elastomer is placed on the insulating substrate 12. In this step, the coating film 13a is formed by applying a flexible resin composition.

The adhesive layer 13 is made of a rubber elastic member and is made of an adhesive composition containing a rubber material. Examples of the rubber material forming the adhesive surface include various elastomers such as silicone rubber, fluorine-based elastomer, urethane-based elastomer, natural rubber, and styrene-butadiene copolymer elastomer. Among them, silicone rubber and fluoroelastomer having excellent strength and chemical resistance are preferable. As the silicone rubber, for example, one obtained by the adhesive composition described in Japanese Patent No. 4656582 is preferable. Examples of fluorine-based elastomers are described in JP-A-2006-198541, JP-A-08-199070, JP-A-2000-007835, JP-A-2001-106893, JP-A-2003-201401, etc. preferably.

As a method for applying the thermosetting resin composition, a known method capable of applying to a desired thickness can be applied. printing, dipping, spraying, casting, discharging, brushing, and the like. In addition, when the viscosity of the thermosetting resin composition is low, an enclosure (bank) may be provided around the application area, and the thermosetting resin composition may be applied by injecting it into the enclosure. .

Examples of the support base 11 of the coating device include a plate-shaped member made of metal or resin, a conveyor belt made of resin, and the like. From the viewpoint of thinly and evenly applying the coating film 13a of the thermosetting resin composition, it is preferable that the support base 11 is made of metal or resin and has a suction source (not shown). In particular, in the case of the support table 11 made of resin, when the insulating substrate 12 is removed from the support table 11, separation electrification is likely to occur, so the manufacturing method of the present invention is effective.

(Third step)
As shown in FIG. 1(c), after removing the insulating substrate 12 with the coating film 13a formed thereon from the support base 11, the coating film 13a is cured to form the adhesive layer 13. As shown in FIG. When the support table 11 is provided with a suction device, the suction is released and the substrate is conveyed to the curing device by a gripping device or the like.
Curing conditions may be appropriately adjusted depending on the material of the thermosetting resin composition, preferably 100° C. or higher and 150° C. or lower, more preferably 100° C. or higher and 130° C. or lower. The heating time is preferably several seconds to 1 hour, more preferably 30 seconds to 10 minutes.
In the present invention, since the antistatic agent 14 is provided on the back surface 12b of the substrate, when the insulating substrate 12 is removed from the support base 11, peeling electrification does not occur and the coating film 13a has wavy irregularities. There is no Therefore, it is possible to obtain a flat adhesive layer 13 with a good appearance.

The shape of the adhesive layer 13 may be any shape having an adhesive surface capable of adhering and holding an adherend such as an electronic component, and is preferably rectangular or circular. The thickness of the adhesive layer 13 is not particularly limited, and can be set to, for example, approximately 0.005 mm or more and 5 mm or less.
The area of the adhesive surface of the adhesive layer 13 is appropriately set according to the application, and can be, for example, 100 cm ² (10 cm×10 cm) or more and 3600 cm ² (60 cm×60 cm) or less.

The adhesive surface of the adhesive layer 13 has an adhesive force capable of adhering and holding an adherend such as an electronic component. The adhesive strength of the strongly adhesive portion is measured by the measurement method described below from the viewpoint of sufficiently holding the adherend. The adhesive strength of the strongly adhesive portion is preferably 0.1 N/10 mm or more and 5 N/10 mm or less, more preferably 0.2 N/10 mm or more and 2 N or less.
Electronic parts such as silicon wafers, flexible printed circuit boards, glass plates for large-screen display devices, chip capacitors, ceramic capacitors, coil filters, resistive elements, conductive circuits, capacitors, LSIs, inductors, etc. can be easily adhered and retained and easily removed if desired.

The adhesive force is measured by the following method with reference to JISZ0237. First, the adhesive surface to be measured is horizontally fixed, and the measurement environment is set to 23±1° C. and 50±5% humidity. Next, after cutting a polyimide film having a thickness of 25 μm into a width of 25 mm, it is attached to the adhesive surface using a 2 kg rubber roller. A 90 degree peel test is then performed within 1 minute.
In the peel test, after chucking the polyimide film on a tensile tester, it is operated at a speed of 5±0.2 mm/sec. The results were converted to Newtons per 10 mm (N/10 mm).
In the measurement of the adhesive strength, a combination of a digital force gauge, an electric stand, and a 90-degree peel test jig manufactured by IMADA Co., Ltd. was used, and a Kapton film manufactured by DuPont Toray Co., Ltd. was used as the polyimide film.

The surface roughness of the adhesive layer 13 may be adjusted from the viewpoint of facilitating attachment and detachment of the adherend. is preferably adjusted to The ten-point average roughness Rz exemplified here is a value obtained by arithmetically averaging measured values at a plurality of points measured under conditions of a cutoff of 0.8 mm and a measurement length of 2.4 mm.

The hardness (JIS K 6253 [durometer A]) of the adhesive layer 13 may be adjusted from the viewpoint of facilitating attachment and detachment of the adherend, and is preferably adjusted to about 5 to 60, for example. . When the hardness is 5 or more, sufficient adhesive strength can be easily obtained, and when it is 60 or less, the adherend can be easily removed.

(Other processes)
The present invention may have a step of removing the antistatic agent 14 as a fourth step after the third step, as shown in FIG. 1(d).
A method for removing the antistatic agent 14 includes wiping with a fibrous member containing a volatile organic solvent. When the volatile antistatic agent 14 is used, the wiping step may not be required.

According to the method for producing the adhesive substrate 10 of the present invention, since the adhesive layer 13 has a flat surface, the adhesive layer has uniform adhesiveness, and semiconductor parts such as electronic parts can be manufactured satisfactorily. can be retained and released at The adhesive substrate 10 manufactured by the manufacturing method of the present invention is used for holding and removing a plurality of semiconductor chips 21 as shown in FIG. 2, for example.

REFERENCE SIGNS LIST 10 adhesive substrate 11 support base 12 insulating substrate 12b rear surface 13a coating film 13 adhesive layer 14 antistatic agent 21 semiconductor chip

Claims (2)

A method for producing an adhesive substrate having an adhesive layer on an insulating substrate,
A first step of providing a heat-resistant antistatic agent on the back surface of the insulating substrate;
A second step of placing the insulating substrate on a support table of a coating device and applying a thermosetting resin composition containing a fluorine-based elastomer for the adhesive layer onto the insulating substrate to form a coating film. and,
a third step of removing the insulating substrate on which the coating film is formed from the support base and then curing the coating film to form the adhesive layer;
A method for producing an adhesive substrate having 2. The method for producing an adhesive substrate according to claim 1, wherein said insulating substrate is at least one selected from glass epoxy, polyimide, polyester, and phenol resin.

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