JP7234841B2 - Manufacturing method for multilayer ceramic electronic component - Google Patents

Description

The present invention relates to a method for manufacturing a laminated ceramic electronic component.

After stacking a plurality of ceramic green sheets in which internal circuit elements are formed on specific ceramic green sheets, pressing is performed in the stacking direction, and then necessary treatments such as firing are performed to manufacture a multilayer ceramic electronic component. method is known.

As an example of a method for manufacturing such a laminated ceramic electronic component, Patent Document 1 describes a preliminary press by a rigid press and a final press by an isostatic press when pressing a laminate in which a plurality of ceramic green sheets are laminated. It describes how to do The press pressure applied in the preliminary press is 5 to 75% of the press pressure applied in the final press. According to this method for manufacturing a laminated ceramic electronic component, it is possible to suppress the occurrence of unevenness on the surface of the laminate and the occurrence of partial insufficient rolling.

JP-A-10-270283

In the method for manufacturing an electronic component described in Patent Document 1, in the final pressing step, the laminate is placed in a bag to be vacuum-packed, and is then subjected to isostatic pressing. However, when isostatically pressing through a bag, it is difficult to apply adequate pressure to the entire surface of the laminate. For this reason, in order to obtain a desired laminate by pressing, it is necessary to apply a pressure greater than the originally necessary pressure, but in this case, thinning and deformation occur at the ends of the internal circuit elements.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method for manufacturing a multilayer ceramic electronic component that can suppress partial thinning and deformation of internal circuit elements due to pressing of a multilayer body. and

The manufacturing method of the multilayer ceramic electronic component of the present invention comprises:
preparing a plurality of ceramic green sheets;
forming internal circuit elements on specific ones of the plurality of ceramic green sheets;
a step of producing a laminate by laminating a plurality of the ceramic green sheets;
a first pressing step of pressing the laminate;
a second pressing step of pressing the laminate with a pressing pressure stronger than the pressing pressure in the first pressing step;
with
In the second pressing step, isostatic pressing is performed in a state in which a press medium is brought into direct contact with the surface of the laminate.

The ceramic green sheet contains a binder resin incompatible with the press medium,
The temperature of the pressing medium may be higher than the glass transition temperature of the binder resin.

the pressing medium is water;
The binder resin may be a butyral resin.

The pressing pressure in the first pressing step is 3 MPa or more and 15 MPa or less,
A pressing pressure in the second pressing step may be 20 MPa or more and 40 MPa or less.

In the second pressing step, isostatic pressing may be performed in a state in which a shape deformation suppressing member for suppressing deformation of the laminate is brought into contact with or close to the laminate.

The shape deformation suppressing member has a bottom surface facing one of a pair of main surfaces facing the stacking direction of the laminate, and a top surface facing the other main surface,
The top surface and the bottom surface may have a porous shape.

The first pressing step includes
a step of wrapping the entire laminate in a bag while a first rigid body having higher rigidity than the laminate is in contact with one main surface of a pair of main surfaces facing each other in the stacking direction of the laminate;
A step of making the inside of the bag in a vacuum state or a near-vacuum state;
a step of isostatically pressing the laminate through the bag;
may be provided.

The first pressing step includes
a step of bringing a second rigid body having higher rigidity than the laminate into contact with one of a pair of main surfaces of the laminate facing each other in the stacking direction;
a step of contacting the other main surface of the laminate with a third rigid body having a rigidity higher than that of the laminate;
pressing the laminate in the stacking direction by bringing the third rigid body relatively close to the second rigid body;
with
The third rigid body may have a convex portion that contacts a peripheral edge portion on the other main surface of the laminate when the third rigid body contacts the other main surface of the laminate.

The multilayer ceramic electronic component is a multilayer ceramic capacitor,
a step of firing the laminated body pressed by the second pressing step;
A step of providing an external electrode on the laminated body after firing;
may further include

According to the method for manufacturing a laminated ceramic electronic component of the present invention, after performing the first pressing step of pressing the laminate, the first step of pressing the laminate with a pressing pressure stronger than the pressing pressure in the first pressing step is performed. In the second pressing step, isostatic pressing is performed while the pressing medium is in direct contact with the surface of the laminate. By pressing the laminate by such a method, it is possible to suppress partial thinning and deformation of the internal circuit elements formed on the ceramic green sheets. That is, after preliminary pressing is performed in the first pressing step, in the second pressing step, main pressing is performed by isostatic pressing while the pressing medium is in direct contact with the surface of the laminate. , uniform pressure can be applied to the entire surface of the laminate, and partial thinning and deformation of internal circuit elements can be suppressed. As a result, the reliability of the manufactured multilayer ceramic electronic component can be improved.

1 is a perspective view of a laminated ceramic capacitor, which is an example of a laminated ceramic electronic component; FIG. 2 is a cross-sectional view of the multilayer ceramic capacitor shown in FIG. 1 taken along line II-II. FIG. FIG. 2 is a cross-sectional view along line III-III of the multilayer ceramic capacitor shown in FIG. 1; 4 is a flow chart for explaining a method for manufacturing a multilayer ceramic electronic component according to the first embodiment; FIG. 10 is a diagram showing a state in which the laminate is entirely wrapped in a bag while the first rigid body is in contact with one main surface of the laminate when the first pressing is performed by hydrostatic pressing. FIG. 10 is a diagram showing how a laminate wrapped in a bag is submerged in water and isostatically pressed when the first pressing is performed by isostatically pressing. It is a figure which shows a mode that a 2nd press is performed by a hydrostatic press. FIG. 10 is a diagram showing how isostatic pressing is performed in a second pressing step with the shape deformation suppressing member in contact with the laminate. FIG. 11A is a diagram for explaining a first pressing step of a method for manufacturing an electronic component according to a third embodiment, and FIG. , shows a state in which a third rigid body is brought into contact with the other principal surface, and (b) shows a state in which the laminated body is pressed in the lamination direction by bringing the third rigid body relatively close to the second rigid body. Show how to do it. FIG. 11 is a perspective view showing the external configuration of a third rigid body;

Embodiments of the present invention will be shown below to specifically describe features of the present invention.

(Structure of laminated ceramic electronic component)
First, the structure of a multilayer ceramic electronic component manufactured by a method for manufacturing a multilayer ceramic electronic component will be described. Here, description will be made assuming that the laminated ceramic electronic component is a laminated ceramic capacitor. However, the laminated ceramic electronic component is not limited to a laminated ceramic capacitor, and may be a laminated ceramic inductor, a laminated ceramic thermistor, or the like.

FIG. 1 is a perspective view of a laminated ceramic capacitor 10, which is an example of a laminated ceramic electronic component. FIG. 2 is a cross-sectional view of the multilayer ceramic capacitor 10 shown in FIG. 1 along line II-II. FIG. 3 is a cross-sectional view of the multilayer ceramic capacitor 10 shown in FIG. 1 along line III-III.

As shown in FIGS. 1 to 3, the multilayer ceramic capacitor 10 is an electronic component having a rectangular parallelepiped shape as a whole, and includes a fired ceramic multilayer body 11, a first external electrode 14a and a second external electrode 14b. It has The first external electrode 14a and the second external electrode 14b are arranged to face each other, as shown in FIG.

Here, the direction in which the first external electrode 14a and the second external electrode 14b face each other is defined as the length direction L of the multilayer ceramic capacitor 10, and the dielectric layer 12 and internal electrodes 13a and 13b, which will be described later, are laminated. A direction perpendicular to both the length direction L and the stacking direction T is defined as a width direction W. As shown in FIG.

The ceramic laminate 11 has a first end face 15a and a second end face 15b facing each other in the length direction L, a first principal face 16a and a second principal face 16b facing each other in the lamination direction T, and a width direction W It has a first side 17a and a second side 17b facing each other.

The ceramic laminate 11 preferably has rounded corners and ridges. Here, the corner portion is a portion where three surfaces of the ceramic laminate 11 intersect, and the ridge portion is a portion where two surfaces of the ceramic laminate 11 intersect.

As shown in FIGS. 2 and 3, the ceramic laminate 11 includes a plurality of dielectric layers 12, and a plurality of first internal electrodes 13a and second internal electrodes 13a drawn out toward the first end surface 15a of the ceramic laminate 11. As shown in FIGS. and a plurality of second internal electrodes 13b drawn out to the end surface 15b side of the . That is, the ceramic laminate 11 is formed by alternately stacking a plurality of first internal electrodes 13a and a plurality of second internal electrodes 13b with dielectric layers 12 interposed therebetween.

The dielectric layer 12 is made of, for example, a ceramic material containing BaTiO ₃ as its main component.

The first internal electrode 13a and the second internal electrode 13b contain, for example, metals such as Ni, Cu, Ag, Pd, and Au, or an alloy of Ag and Pd. The first internal electrode 13 a and the second internal electrode 13 b may further contain dielectric particles having the same composition as the ceramic contained in the dielectric layer 12 .

The first external electrode 14 a is provided on the first end surface 15 a of the ceramic laminate 11 . More specifically, the first external electrode 14a is formed over the entire first end surface 15a of the ceramic laminate 11, and extends from the first end surface 15a to the first main surface 16a and the second main surface. 16b, the first side surface 17a, and the second side surface 17b. The first external electrode 14a is electrically connected to the first internal electrode 13a drawn out to the first end face 15a.

The second external electrode 14 b is provided on the second end surface 15 b of the ceramic laminate 11 . More specifically, the second external electrode 14b is formed over the entire second end surface 15b of the ceramic laminate 11, and extends from the second end surface 15b to the first main surface 16a and the second main surface 16a. 16b, the first side surface 17a, and the second side surface 17b. The second external electrode 14b is electrically connected to the second internal electrode 13b drawn out to the second end surface 15b.

(Manufacturing method of laminated ceramic electronic component)
<First Embodiment>
FIG. 4 is a flow chart for explaining the manufacturing method of the multilayer ceramic electronic component according to the first embodiment. Also here, the explanation will be made assuming that the laminated ceramic electronic component is a laminated ceramic capacitor.

In step S1, a plurality of ceramic green sheets are prepared. A well-known thing can be used as a ceramic green sheet.

In step S2 following step S1, internal circuit elements are formed on specific ones of the plurality of ceramic green sheets. When the laminated ceramic electronic component is a laminated ceramic capacitor, the internal circuit element is an internal electrode pattern that becomes the first internal electrode 13a and the second internal electrode 13b after firing. The internal electrode pattern can be formed by coating a ceramic green sheet with a conductive paste for internal electrodes. The conductive paste for internal electrodes can be applied by screen printing or gravure printing, for example.

In step S3 following step S2, a laminate is produced by laminating a plurality of ceramic green sheets. When the laminated ceramic electronic component is a laminated ceramic capacitor, a predetermined number of ceramic green sheets without internal electrode patterns are laminated, and ceramic green sheets with internal electrode patterns are sequentially laminated thereon. A laminate is produced by laminating a predetermined number of ceramic green sheets on which no internal electrode pattern is formed. This laminate is an unfired mother laminate.

In the case of manufacturing a laminated ceramic capacitor, when laminating ceramic green sheets having internal electrode patterns formed thereon, in the finished laminated ceramic capacitor, the first internal electrodes 13a are drawn out to the first end surfaces 15a, Lamination is performed while shifting so that the second internal electrode 13b is pulled out to the second end surface 15b.

In step S4 following step S3, the laminate is pressed. This press is referred to herein as the first press. The first press is a temporary press that precedes the second press that follows.

In this embodiment, the first pressing step includes:
(a) a step of wrapping the entire laminate in a bag while a first rigid body having higher rigidity than the laminate is in contact with one main surface in the stacking direction of the laminate;
(b) evacuating or substantially vacuuming the interior of the bag;
(c) isostatically pressing the laminate through a bag;
Prepare.

In the above step (a), as shown in FIG. 5, a first rigid body 21 having higher rigidity than the laminate 20 is brought into contact with one main surface 20a of the laminate 20 in the lamination direction. The whole is wrapped with a bag 22. Bag 22 is made of a sealable material for isostatic pressing. Also, the first rigid body 21 is, for example, stainless steel.

In the step (b) above, for example, a vacuum pump or the like is used to evacuate the inside of the bag 22 to a vacuum state or a substantially vacuum state. Thereby, the bag 22 is in close contact with the laminate 20 and the first rigid body 21 .

In the step (c) above, isostatic pressing is performed on the laminate 20 through the bag 22 . An isostatic press is a press in which the applied pressure is equal in all pressurizing directions. As an example of isostatic pressing, as shown in FIG. 6, a laminate 20 wrapped in a bag 22 is submerged in water 23 and subjected to isostatic pressing. However, the pressing medium used in isostatic pressing is not limited to water, and liquids other than water, such as oil and gas, may be used. The water may be pure water or may contain impurities. Water also includes heated hot water as well as unheated water.

In the second pressing, which will be described later, performed after the first pressing, isostatic pressing is performed in a state in which the pressing medium is brought into direct contact with the surface of the laminate 20 . A liquid, for example, can be used as the pressing medium. The first pressing is performed to prevent the liquid from entering the inside of the laminate 20 when performing isostatic pressing using liquid.

The pressing pressure during the first pressing is, for example, 3 MPa or more and 15 MPa or less. If the press pressure during the first pressing is lower than 3 MPa, the liquid may enter the laminate 20 when isostatic pressing is performed using liquid in the second pressing described later. . Further, if the pressing pressure during the first pressing is higher than 15 MPa, thinning or deformation may occur at the ends of the internal circuit elements formed on the ceramic green sheets.

In step S5 following step S4 in FIG. 4, the laminate 20 is pressed with a press pressure stronger than the press pressure in the first press step in step S4. This press is referred to herein as the second press. The second press is a final press performed after the first press, which is a preliminary press.

The pressing pressure during the second pressing is, for example, 20 MPa or more and 40 MPa or less. If the pressing pressure during the second pressing is lower than 20 MPa, pores (voids) may remain inside the laminate 20 . Also, if the pressing pressure during the second pressing is higher than 40 MPa, the laminate 20 becomes too hard.

In the second pressing step, isostatic pressing is performed while the pressing medium is in direct contact with the surface of the laminate 20 .

Here, the ceramic green sheets used for producing the laminate 20 contain a binder resin that is incompatible with the pressing medium, and the temperature of the pressing medium is higher than the glass transition temperature of the binder resin. is preferably high. Since the temperature of the pressing medium is higher than the glass transition temperature of the binder resin, the binder resin is softened during pressing, and the adhesion between adjacent ceramic green sheets can be improved. In addition, since the binder resin is incompatible with the pressing medium, it is possible to prevent the binder resin from eluting into the pressing medium.

As an example, the pressing medium is water (hot water) and the binder resin is water-insoluble butyral resin. In that case, the glass transition temperature of the butyral resin is, for example, 60°C, and the temperature of the water (hot water) used as the pressing medium is, for example, 90°C.

FIG. 7 shows how the second pressing is performed by isostatic pressing using hot water 26 as the pressing medium. As described above, the temperature of hot water 26 is preferably higher than the glass transition temperature of the binder resin. When the first pressing step is performed by the above steps (a) to (c), the laminate 20 wrapped in the bag 22 is taken out from water, the first rigid body 21 is removed, and warm water 26 is removed. Isostatic pressing is performed by submerging the laminate 20 in. Since the plurality of laminated ceramic green sheets are bonded by the first pressing process, even if the hot water 26 directly contacts the surface of the laminate 20, the hot water 26 does not enter the inside of the laminate 20. Suppressed.

However, the pressing medium used in the second pressing step is not limited to water (warm water), and liquids other than water, such as oil and gas, may be used.

In step S6 following step S5 in FIG. 4, the pressed laminate is separated into chips by various methods such as dicing and press cutting.

In step S7 following step S6, a ceramic laminate is produced by firing the separated chips. The firing temperature is, for example, 900° C. or higher and 1300° C. or lower, although it depends on the materials of the ceramic layers and internal electrodes. After that, the corners and ridges of the ceramic laminate are rounded by barrel polishing or the like.

In step S8 following step S7, external electrodes are formed on both end surfaces of the ceramic laminate.

For example, external A base electrode layer is formed by applying a conductive paste for electrodes and baking it. Then, a plating layer is formed on the base electrode layer.

A laminated ceramic capacitor, which is a laminated ceramic electronic component, is produced by the above-described method. Even when manufacturing a laminated ceramic electronic component other than a laminated ceramic capacitor, at least steps S1 to S5 in FIG. 4 are performed.

According to the method for manufacturing an electronic component according to the present embodiment, after temporary pressing is performed in the first pressing step, in the second pressing step, the pressing medium is in direct contact with the surface of the laminate 20, and so on. Since the main pressing is performed by a method of performing a lateral pressing, a uniform pressure can be applied to the entire surface of the laminate 20 . In addition, in the second pressing step, pressing can be performed with a lower pressing pressure than in the conventional method of isostatically pressing through a bag. Therefore, it is possible to suppress partial thinning and deformation of the internal circuit element, and improve the reliability of the manufactured multilayer ceramic electronic component. When the laminated ceramic electronic component is a laminated ceramic capacitor, it is possible to suppress a decrease in capacity due to partial thinning or deformation of internal circuit elements.

<Second embodiment>
The electronic component manufacturing method according to the second embodiment differs from the electronic component manufacturing method according to the first embodiment in the method of performing the second pressing. The second pressing method in this embodiment will be described in detail below.

In the second pressing step in the present embodiment, isostatic pressing is performed in a state in which a shape deformation suppressing member for suppressing deformation of the laminate 20 is brought into contact with or close to the laminate 20 . The shape deformation suppressing member is made of a material having higher rigidity than the laminate 20 . Thereby, deformation of the laminate 20 can be suppressed. As isostatic pressing, for example, isostatic pressing is performed.

FIG. 8 is a diagram showing how isostatic pressing is performed with the shape deformation suppressing member 30 in contact with the laminate 20 . However, the shape deformation suppressing member 30 may be close to the laminate 20 without being in contact with it. Here, too, water (warm water) 26 having a temperature higher than the glass transition temperature of the binder resin contained in the ceramic green sheets can be used as a press medium for isostatic pressing.

The shape deformation suppressing member 30 has a bottom surface 30a facing one main surface 20a of a pair of main surfaces facing the stacking direction T of the laminate 20, and a top surface 30b facing the other main surface 20b. are doing. A bottom surface 30a and a top surface 30b of the shape deformation suppressing member 30 have a porous shape, and are, for example, porous plates.

The side surface of the shape deformation suppressing member 30 can be of any shape. For example, the side surfaces may have a porous shape like the bottom surface 30a and the top surface 30b, may have a columnar shape connecting the bottom surface 30a and the top surface 30b, or may have a plate shape.

Isostatic pressing is performed in a state in which the bottom surface 30a of the shape deformation suppressing member 30 is in contact with or close to one main surface 20a of the laminate 20, and the top surface 30b is in contact with or close to the other main surface 20b. conduct. By performing isotropic pressing in such a manner, the laminate 20 can be prevented from being distorted in the lamination direction T. As shown in FIG. Further, when isostatic pressing is performed with the bottom surface 30a and the top surface 30b in contact with each other, distortion in the length direction L and the width direction W can also be suppressed.

In addition, by configuring the bottom surface 30a and the top surface 30b of the shape deformation suppressing member 30 to have a porous shape, when isostatic pressing is performed using a liquid as a press medium, the laminate One major surface 20a and the other major surface 20b of 20 can be pressed by liquid.

<Third Embodiment>
The electronic component manufacturing method according to the third embodiment differs from the electronic component manufacturing methods according to the first and second embodiments in the method of performing the first pressing.

In the first pressing step in this embodiment,
(I) a step of bringing a second rigid body having higher rigidity than the laminate into contact with one of a pair of main surfaces of the laminate facing each other in the stacking direction;
(II) a step of contacting the other main surface of the laminate with a third rigid body having higher rigidity than the laminate;
(III) pressing the stack in the stacking direction by bringing the third rigid body relatively closer to the second rigid body;
Prepare.

Also, the third rigid body has a convex portion that abuts on the peripheral edge portion on the other main surface of the laminate when it abuts on the other main surface of the laminate.

FIG. 9 is a diagram for explaining the steps (I) to (III). As shown in FIG. 9A, a second rigid body 41 having higher rigidity than that of the laminate 20 is brought into contact with one principal surface 20a of the pair of principal surfaces of the laminate 20 (step (I)). ), and a third rigid body 42 having higher rigidity than the laminate 20 is brought into contact with the other main surface 20b of the laminate 20 (step (II)). The second rigid body 41 and the third rigid body 42 are, for example, stainless steel.

As described above, the third rigid body 42 has a convex portion 42a that abuts on the peripheral portion 20c on the other main surface 20b of the laminate 20. As shown in FIG. FIG. 10 is a perspective view showing the external configuration of the third rigid body 42. As shown in FIG. FIG. 9 shows a state in which the convex portion 42a of the third rigid body 42 is arranged in a downward protruding direction, while FIG. 10 shows a state in which the convex portion 42a is arranged in an upward protruding direction. ing.

Contacting the third rigid body 42 with the other main surface 20b of the laminate 20 in the step (II) described above causes the third rigid body It means that the convex portion 42a of 42 is brought into contact. When the protrusion 42 a of the third rigid body 42 is in contact with the peripheral edge 20 c of the other main surface 20 b of the laminate 20 , the portion of the third rigid body 42 other than the protrusion 42 a does not correspond to the laminate 20 . not in contact

Subsequently, as shown in FIG. 9B, the laminate 20 is pressed in the lamination direction T by bringing the third rigid body 42 relatively closer to the second rigid body 41 . The third rigid body 42 is moved relatively closer to the second rigid body 41 at least until the portion of the third rigid body 42 other than the convex portion 42a comes into contact with the other principal surface 20b of the laminate 20. to press. The press pressure during pressing is, for example, 10 MPa.

For example, the third rigid body 42 may be brought closer to the second rigid body 41 while the second rigid body 41 is fixed, or the second rigid body 41 may be moved closer to the third rigid body 41 while the third rigid body 42 is fixed. may be brought closer to the rigid body 42 of . Alternatively, the second rigid body 41 may be brought closer to the third rigid body 42 and the third rigid body 42 may be brought closer to the second rigid body 41 .

Lamination is performed while the third rigid body 42 is brought relatively closer to the second rigid body 41 in a state in which the convex portion 42a of the third rigid body 42 is in contact with the peripheral edge portion 20c of the other main surface 20b of the laminated body 20. By pressing the body 20, the outer peripheral region of the laminate 20 including the peripheral portion 20c is pressed with a stronger pressing pressure than other regions. As a result, even when the subsequent second pressing is performed by isostatic pressing using a liquid, it is possible to more effectively suppress the liquid from entering from the outer peripheral portion of the laminate 20 to the inside. .

The present invention is not limited to the above embodiments, and various applications and modifications can be made within the scope of the present invention.

10 Multilayer ceramic capacitor 11 Ceramic laminate 12 Dielectric 13a First internal electrode 13b Second internal electrode 14a First external electrode 14b Second external electrode 20 Laminate 20a One main surface 20b of laminate Laminate Other Principal Surface 20c Peripheral Edge 21 on Other Principal Surface of Laminate First Rigid Body 22 Bag 23 Water 26 Hot Water 30 Shape Deformation Control Member 41 Second Rigid Body 42 Third Rigid Body 42a Third Rigid Body Projection

Claims (9)

preparing a plurality of ceramic green sheets;
forming internal circuit elements on specific ones of the plurality of ceramic green sheets;
a step of producing a laminate by laminating a plurality of the ceramic green sheets;
a first pressing step of pressing the laminate;
a second pressing step of pressing the laminate with a pressing pressure stronger than the pressing pressure in the first pressing step;
with
In the second pressing step, isostatic pressing is performed in a state in which a pressing medium is brought into direct contact with the surface of the laminate. The ceramic green sheet contains a binder resin incompatible with the press medium,
2. The method of manufacturing a laminated ceramic electronic component according to claim 1, wherein the temperature of said pressing medium is higher than the glass transition temperature of said binder resin. the pressing medium is water;
3. The method of manufacturing a multilayer ceramic electronic component according to claim 2, wherein the binder resin is a butyral resin. The pressing pressure in the first pressing step is 3 MPa or more and 15 MPa or less,
4. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the pressing pressure in said second pressing step is 20 MPa or more and 40 MPa or less. 3. The isotropic pressing is performed in the second pressing step in a state in which a shape deformation suppressing member for suppressing deformation of the laminate is brought into contact with or close to the laminate. 5. A method for producing a multilayer ceramic electronic component according to any one of 1 to 4. The shape deformation suppressing member has a bottom surface facing one of a pair of main surfaces facing the stacking direction of the laminate, and a top surface facing the other main surface,
6. The method of manufacturing a multilayer ceramic electronic component according to claim 5, wherein the top surface and the bottom surface have a porous shape. The first pressing step includes
a step of wrapping the entire laminate in a bag while a first rigid body having higher rigidity than the laminate is in contact with one main surface of a pair of main surfaces facing each other in the stacking direction of the laminate;
A step of making the inside of the bag in a vacuum state or a near-vacuum state;
a step of isostatically pressing the laminate through the bag;
The method for manufacturing a multilayer ceramic electronic component according to any one of claims 1 to 6, comprising: The first pressing step includes
a step of bringing a second rigid body having higher rigidity than the laminate into contact with one of a pair of main surfaces of the laminate facing each other in the stacking direction;
a step of contacting the other main surface of the laminate with a third rigid body having a rigidity higher than that of the laminate;
pressing the laminate in the stacking direction by bringing the third rigid body relatively close to the second rigid body;
with
1-, wherein the third rigid body has a convex portion that contacts a peripheral portion on the other main surface of the laminate when the third rigid body contacts the other main surface of the laminate. 7. The method for producing a laminated ceramic electronic component according to any one of 6. The multilayer ceramic electronic component is a multilayer ceramic capacitor,
a step of firing the laminated body pressed by the second pressing step;
A step of providing an external electrode on the laminated body after firing;
9. The method for manufacturing a multilayer ceramic electronic component according to claim 1, further comprising:

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