JP7300846B2 - Cutting equipment and semiconductor package manufacturing method - Google Patents

Description

The present invention relates to a cutting apparatus for cutting a package substrate and a method for manufacturing a semiconductor package.

A package substrate generally has a device chip laminated on the surface of a wiring substrate and the device chip sealed with a sealant such as resin. When cutting this type of package substrate, there is a case where the wiring substrate side is held by a holding table in order to prevent cutting chips from adhering to the rear surface of the wiring substrate, and cutting is performed from the sealant.

However, the package substrate may have an alignment mark formed on the back surface of the wiring substrate in order to form an alignment mark that serves as a reference for alignment when bumps are formed on the back surface of the wiring substrate. . However, since the sealant and the wiring substrate do not transmit infrared rays, it is difficult to align them from the surface side with an infrared camera. For this reason, the applicant of the present application has proposed a processing apparatus that performs alignment from the back side of the wiring board (see, for example, Japanese Patent Application Laid-Open Nos. 2003-100001 and 2004-100000).

JP 2008-100258 A JP 2010-82644 A

The package substrate described above is often processed while being held on a holding table called a jig chuck table, which has an escape groove for a cutting blade and a suction hole for suction holding. Since the base of the holding table called a jig chuck table is made of stainless steel or the like and elastic rubber, there is a problem that the alignment mark cannot be imaged from below. For this reason, the processing apparatus and the processing method using the processing apparatus disclosed in Patent Document 1 and Patent Document 2 described above divide a package substrate having alignment marks formed on the rear surface side of the wiring substrate along a dividing line. It was difficult to process.

SUMMARY OF THE INVENTION The present invention has been made in view of such problems, and an object of the present invention is to provide a cutting apparatus capable of processing a package substrate having alignment marks formed on the rear surface side of the wiring substrate along a planned division line. and to provide a method for manufacturing a semiconductor package.

In order to solve the above-described problems and achieve the object, the cutting apparatus of the present invention has a plurality of device chips mounted on the front side of a wiring board and sealed with resin, and a planned dividing line on the outer periphery of the back side. A cutting device for cutting a package substrate on which an alignment mark serving as a reference is formed, comprising a holding table for holding the back side of the package substrate, and an imaging of the back surface of the package substrate held by the holding table and cutting means for rotatably supporting a cutting blade, wherein the holding table is partitioned by a plurality of cutting blade clearance grooves and the cutting blade clearance grooves a plurality of suction holes formed in each region; a holding surface made of synthetic resin having elasticity ; a transparent member surrounding the holding surface; and a suction path connecting the suction holes and a suction source. and a position corresponding to the alignment mark on the holding table is formed by the transparent member, and the imaging means is installed below the transparent member and images the alignment mark through the transparent member. It is characterized by

The cutting apparatus of the present invention cuts a package substrate in which a plurality of device chips are mounted on the front surface of a wiring substrate and sealed with resin, and alignment marks are formed on the periphery of the back surface to serve as a reference for dividing lines. a cutting device comprising: a holding table for holding the back side of the package substrate; imaging means for imaging the back surface of the package substrate held by the holding table; and a cutting blade rotatably supporting a cutting blade. means, wherein the holding table comprises a plurality of cutting blade relief grooves and a plurality of suction holes formed in each region partitioned by the cutting blade relief grooves. a holding surface made of synthetic resin having elasticity and having a smaller planar shape than the wiring board; a suction path communicating between the suction hole and the suction source; exposing means for exposing the alignment mark formed on the back surface of the package substrate to the back surface side, wherein the imaging means is formed on the back surface of the package substrate exposed by the exposing means. It is characterized by being installed below the alignment mark and taking an image of the alignment mark.
Further, the cutting apparatus of the present invention provides a package substrate in which a plurality of device chips are mounted on the front surface of the wiring substrate and sealed with resin, and alignment marks are formed on the periphery of the back surface to serve as a reference for dividing lines. comprising a holding table for holding the back side of the package substrate, imaging means for imaging the back surface of the package substrate held by the holding table, and a cutting blade that is rotatably supported. a cutting means, wherein the holding table includes a plurality of cutting blade relief grooves and a plurality of suction holes formed in each region partitioned by the cutting blade relief grooves. a holding surface made of synthetic resin having elasticity and having a planar shape similar to that of the wiring board; a suction path communicating between the suction hole and the suction source; and exposure means which is a hole for exposing the alignment mark formed on the back surface of the package substrate held on the holding surface of the holding table to the back surface side, wherein the imaging means comprises the exposure It is characterized by being installed below the means and taking an image of the alignment mark.

A method of manufacturing a semiconductor package according to the present invention is a method of manufacturing a semiconductor package by cutting a package substrate using the cutting apparatus, wherein the back side of the package substrate is held by the holding table. a detection step of imaging the surface of the package substrate held by the holding table and detecting the line to be divided; and cutting the surface along the line to be divided so detected with the cutting blade to form a machined groove. and a shield layer forming step of forming a shield layer with a conductive material on the surface of the sealant and the side surface of the processed groove after performing the processed groove forming step, wherein the processed groove is formed so as to decrease from the front surface toward the back surface of the package substrate.

ADVANTAGE OF THE INVENTION This invention is effective in making it possible to process the package board|substrate in which the alignment mark was formed in the back surface side of a wiring board along a division|segmentation line.

FIG. 1 is a perspective view showing a configuration example of a cutting device according to Embodiment 1. FIG. FIG. 2 is a plan view of the package substrate to be processed by the cutting apparatus shown in FIG. 1, viewed from the surface side. FIG. 3 is a plan view of the package substrate to be processed by the cutting apparatus shown in FIG. 1, viewed from the back side. 4 is a side view of a package substrate to be processed by the cutting apparatus shown in FIG. 1. FIG. 5 is a cross-sectional view of a main part of a package substrate to be processed by the cutting apparatus shown in FIG. 1. FIG. 6 is a cross-sectional view schematically showing a holding table of the cutting device shown in FIG. 1. FIG. FIG. 7 is a cross-sectional view showing a state in which grooves are formed in the package substrate shown in FIG. 5 by the cutting apparatus shown in FIG. FIG. 8 is a cross-sectional view of a semiconductor package manufactured by the semiconductor package manufacturing method according to the first embodiment. FIG. 9 is a flow chart showing the flow of the semiconductor package manufacturing method according to the first embodiment. FIG. 10 is a cross-sectional view schematically showing a step of holding the semiconductor package shown in FIG. 9; FIG. 11 is a cross-sectional view schematically showing a detection step for the semiconductor package shown in FIG. FIG. 12 is a cross-sectional view schematically showing a process groove forming step of the semiconductor package shown in FIG. 13A and 13B are cross-sectional views schematically showing a step of forming a shield layer of the semiconductor package shown in FIG. 9. FIG. 14 is a cross-sectional view schematically showing a holding table of a cutting device according to Embodiment 2. FIG. 15 is a cross-sectional view schematically showing a holding table of a cutting device according to Modification 1 of Embodiment 2. FIG. 16 is a cross-sectional view schematically showing a holding table of a cutting device according to Modification 2 of Embodiment 2. FIG. 17 is a cross-sectional view schematically showing a holding table of a cutting device according to Modification 3 of Embodiment 2. FIG.

A form (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. In addition, the components described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. In addition, various omissions, substitutions, or changes in configuration can be made without departing from the gist of the present invention.

[Embodiment 1]
A cutting device according to Embodiment 1 of the present invention will be described based on the drawings. FIG. 1 is a perspective view showing a configuration example of a cutting device according to Embodiment 1. FIG. FIG. 2 is a plan view of the package substrate to be processed by the cutting apparatus shown in FIG. 1, viewed from the surface side. FIG. 3 is a plan view of the package substrate to be processed by the cutting apparatus shown in FIG. 1, viewed from the back side. 4 is a side view of a package substrate to be processed by the cutting apparatus shown in FIG. 1. FIG. 5 is a cross-sectional view of a main part of a package substrate to be processed by the cutting apparatus shown in FIG. 1. FIG. 6 is a cross-sectional view schematically showing a holding table of the cutting device shown in FIG. 1. FIG. FIG. 7 is a cross-sectional view showing a state in which grooves are formed in the package substrate shown in FIG. 5 by the cutting apparatus shown in FIG.

A cutting device 1 according to Embodiment 1 shown in FIG. 1 is a device for cutting the package substrate 100 shown in FIGS. In Embodiment 1, the package substrate 100 to be processed by the cutting apparatus 1 includes a wiring substrate 101 and a plurality of device chips 102 (shown only in FIG. 5), as shown in FIGS. and a sealant 103 .

The wiring board 101 includes an insulating insulating plate 104 and a ground line 105 provided inside the insulating plate 104, as shown in FIG. The ground line 105 is embedded inside the insulating plate 104 of the wiring board 101 and is made of a conductive metal. Electrodes and various wirings connected to the device chip 102 and the like are formed on the front surface 101-1 and the back surface 101-2 of the wiring substrate 101. FIG.

Further, the wiring substrate 101 has a device area 106 on which a plurality of device chips 102 are mounted and an outer peripheral surplus area 107 surrounding the device area 106 on the surface 101-1 side. In Embodiment 1, three device regions 106 are formed on one wiring substrate 101 , that is, one package substrate 100 . In the device area 106, the device chip 102 is mounted in each area partitioned by a plurality of grid-like dividing lines 108 (shown in FIG. 2). The device chip 102 is not mounted in the peripheral surplus area 107 .

The device chip 102 is mounted on the device region 106 on the surface 101-1 of the wiring board 101. FIG. The device chip 102 includes an IC (Integrated Circuit), LSI (Large Scale Integration), or the like. In the first embodiment, the device chip 102 is connected to the surface 101-1 of the wiring substrate 101 by so-called wire bonding, in which one end of the wire 109 is connected and the other end of the wire 109 is connected to the surface 101-1 of the wiring substrate 101. Implemented.

The sealant 103 is made of an insulating synthetic resin and seals (covers) the device chip 102 and the wire 8 mounted in each device region 106 . That is, in Embodiment 1, three sealants 103 are provided for each package substrate 100 . The sealant 103 is made of epoxy resin, silicone resin, urethane resin, unsaturated polyester resin, acrylic urethane resin, polyimide resin, or the like.

In addition, as shown in FIG. 3, the package substrate 100 is formed with an alignment mark 110, which serves as a reference for the division line 108 during alignment by the cutting device 1, outside the device region 106 on the back surface 101-2 side of the wiring substrate 101. It is That is, the alignment mark 110 is formed on the rear surface 101 - 2 of the outer peripheral surplus region 107 of the wiring substrate 101 . The alignment mark 110 has a predetermined position relative to the division line 108 . In Embodiment 1, the alignment marks 110 are formed together with electrodes and the like formed on the rear surface 101-2 of the wiring board 101. FIG.

As shown in FIG. 1, the cutting apparatus 1 according to the first embodiment includes a holding table 10, a cutting unit 20 as cutting means, a cutting feed unit (not shown) as cutting feed means, and an index feed as index feed means. It comprises at least a unit 30 , a cutting feeding unit 40 as a cutting feeding means, and a control unit 90 .

The holding table 10 sucks and holds the rear surface 101 - 2 side of the wiring board 101 of the package substrate 100 with the holding surface 11 . The holding table 10 includes a base 12, a rubber member 13, and a transparent member 14, as shown in FIG. The base 12 is made of metal such as stainless steel, and is formed in the shape of a thick flat plate. In Embodiment 1, the flat plate shape of the base 12 is formed in a rectangular shape similar to the planar shape of the package substrate 100 and smaller than the planar shape of the package substrate 100 . In Embodiment 1, the planar shape of the base 12 is formed to have the same planar shape as the combined planar shape of the three sealants 103 of the package substrate 100, and is slightly larger than the combined planar shape of the three sealants 103. It is Further, the base 12 is formed with a recess 12-2 which is recessed from the upper surface 12-1.

The rubber member 13 is made of elastic synthetic resin such as rubber, and is formed in a flat plate shape. The planar shape of the rubber member 13 is the same as the planar shape of the upper surface 12 - 1 of the base 12 . The rubber member 13 is attached to the base 12 while being superimposed on the upper surface 12-1. The surface of the rubber member 13 is formed flat along both the X-axis direction parallel to the horizontal direction and the Y-axis direction parallel to the horizontal direction and perpendicular to the X-axis direction. The holding surface 11 holds the rear surface 101-2 of the wiring board 101 of 100. As shown in FIG.

The transparent member 14 is made of a transparent material such as glass (quartz glass in the first embodiment), and surrounds the base 12 and the rubber member 13 on the outer peripheral side. That is, the transparent member 14 is formed at a position corresponding to the alignment mark 110 of the wiring substrate 101 of the package substrate 100 held on the holding surface 11 of the holding table 10 by suction. In Embodiment 1, the transparent member 14 moves along the entire circumference of the base 12 and the rubber member 13. However, the present invention is not limited to this, and at least the alignment marks of the holding table 10 are moved. It is sufficient if it is formed at a position corresponding to 110 . Further, the upper surface 14-1 of the transparent member 14 is located on the same plane as the holding surface 11. As shown in FIG.

Further, the holding surface 11 of the holding table 10 includes a plurality of cutting blade relief grooves 15 for releasing the cutting blade 21 of the cutting unit 20 and a plurality of suction holes 16 . The cutting blade clearance groove 15 and the suction hole 16 are provided in the rubber member 13 and open onto the holding surface 11 . The cutting blade clearance groove 15 is provided at a position corresponding to the dividing line 203 of the package substrate 100 suction-held on the holding surface 11 and formed concavely from the holding surface 11 . A suction hole 16 is formed in each area partitioned by the cutting blade escape groove 15 (one is formed in each area in the first embodiment). The suction hole 16 is provided at a position corresponding to the device chip 102 of the package substrate 100 suction-held on the holding surface 11 and penetrates the rubber member 13 . In this specification, the corresponding position indicates a position overlapping in the Z-axis direction.

The holding table 10 also has a suction path 17 . The suction path 17 communicates the inside of the recess 12 - 2 below the rubber member 13 with the suction source 18 via the on-off valve 19 . That is, the suction path 17 communicates the suction hole 16 and the suction source 18 via the on-off valve 19 . The suction source 18 is composed of, for example, a vacuum pump.

As described above, the holding table 10 of the cutting apparatus 1 according to the first embodiment includes the cutting blade clearance groove 15 and the suction hole 16, and directly holds the package substrate on the holding surface 11 without a tape interposed therebetween. It is a so-called jig chuck table that holds the 100 or the like by suction.

The holding table 10 sucks and holds the package substrate 100 on the holding surface 11 by the suction holes 16 being sucked by the suction source 18 . The holding table 10 is supported by a rotary drive source 9 movable in the X-axis direction by a cutting feed unit (not shown). The rotary drive source 9 is provided so as to rotate the holding table 10 about an axis parallel to the Z-axis direction parallel to the vertical direction.

The cutting unit 20 includes a cutting blade 21 that cuts the package substrate 100 held by the holding table 10 . The cutting unit 20 supports a cutting blade 21 by a spindle (not shown) so as to be rotatable about an axis parallel to the Y-axis direction. The cutting unit 20 is provided movably in the Y-axis direction by the index feed unit 30 and movably in the Z-axis direction by the cutting feed unit 40 with respect to the package substrate 100 held on the holding table 10. ing.

In Embodiment 1, the cutting unit 20 is provided on the gate-shaped support frame 3 erected from the apparatus main body 2 via the indexing feed unit 30 and the cutting feed unit 40 . The cutting unit 20 can position the cutting blade 21 at an arbitrary position on the holding surface 11 of the holding table 10 by the indexing feed unit 30 and the cutting feed unit 40 . The cutting blade 21 is an extremely thin cutting grindstone having a substantially ring shape and is electrically conductive. In Embodiment 1, the cutting edge of the cutting blade 21 is formed in a chevron whose thickness decreases toward the tip so that the center in the thickness direction protrudes most toward the tip.

The cutting unit 20 is indexed and fed in the Y-axis direction by the indexing and feeding unit 30 and is fed by the cutting and feeding unit 40, and the holding table 10 is cut and fed by the cutting and feeding unit 30 in the X-axis direction. Cut 100.

The cutting feed unit relatively feeds the holding table 10 and the cutting unit 20 in the X-axis direction, and in the first embodiment, moves the holding table 10 in the X-axis direction. The index feed unit 30 index feeds (moves) the cutting unit 20 in the Y-axis direction. The cutting feed unit 40 feeds (moves) the cutting unit 20 in the Z-axis direction. The cutting feed unit, the indexing feed unit 30, and the notch feed unit 40 are known ball screws 31, 41 provided rotatably about their axes, and a known pulse motor 42 for rotating the ball screws 31, 41 about their axes. and well-known guide rails 33, 43 for supporting the holding table 10 or the cutting unit 20 so as to be movable in the X-axis direction, the Y-axis direction, or the Z-axis direction.

The cutting apparatus 1 also includes an imaging unit 50 that is imaging means for imaging the rear surface 101 - 2 , which is the surface of the wiring substrate 101 of the package substrate 100 held by the holding table 10 . The imaging unit 50 includes an imaging element that captures an image of the alignment mark 110 of the package substrate 100 before cutting held on the holding table 10 . The imaging device is, for example, a CCD (Charge-Coupled Device) imaging device or a CMOS (Complementary MOS) imaging device. The imaging unit 50 captures an image of the package substrate 100 held by the holding table 10, acquires an image for performing alignment for aligning the package substrate 100 and the cutting blade 21, and controls the acquired image. output to unit 90;

In the first embodiment, the imaging unit 50 is attached to an arm 63 that can be raised and lowered in the Z-axis direction by an elevation unit 60 . In the first embodiment, the elevating unit 60 is raised and lowered in the Z-axis direction by a linear cylinder 61 attached to a Z-axis moving table 44 that is raised and lowered in the Z-axis direction together with the cutting unit 20 by the cutting feed unit 40 . and a locking mechanism 68 . An arm 63 is attached to the lifting plate 62 .

In the first embodiment, the arm 63 extends downward from the lifting plate 62 in the Z-axis direction below the transparent member 14 of the holding table 10 while the lifting plate 62 is positioned at a lower point by the linear cylinder 61 . The alignment marks 110 of the package substrate 100 held by the holding surface 11 under the transparent member 14 toward the holding table 10 in the Y-axis direction from the downwardly extending portion 64 as shown in FIG. and a horizontally extending portion 65 extending downward. The arm 63 has the imaging unit 50 attached to the tip of the horizontally extending portion 65 .

The lock mechanism 68 has a lock cylinder 66 attached to the lifting plate 62 and a lock hole 67 provided in the Z-axis moving table 44 . In the lock mechanism 68, the lift plate 62, i.e., the image is captured, by engaging the lock pin of the lock cylinder 66 with the lock hole 67 while the lift plate 62 is positioned by the linear cylinder 61 at the low point indicated by the solid line in FIG. It regulates the relative movement of the unit 50 with respect to the cutting unit 20 . The lock mechanism 68 engages the lock pin of the lock cylinder 66 with the lock hole 67 while the lift plate 62 is positioned at a lower position by the linear cylinder 61 when the image pickup unit 50 picks up the image of the alignment mark 110 . The relative movement of the imaging unit 50 with respect to the cutting unit 20 is restricted. Thus, when the image pickup unit 50 picks up an image of the alignment mark 110, the lock pin of the lock cylinder 66 is inserted into the lock hole 67 while the lift plate 62 is positioned by the linear cylinder 61 at a low point indicated by the solid line in FIG. The engagement secures it to the cutting unit 20 for integral movement therewith. The imaging unit 50 is positioned below the holding surface 11 by engaging the lock pin of the lock cylinder 66 with the lock hole 67 while the lift plate 62 is positioned by the linear cylinder 61 at a low point indicated by the solid line in FIG. , and images the alignment mark 110 through the transparent member 14 of the holding table 10 .

When the imaging unit 50 finishes imaging the alignment mark 110 , the lock mechanism 68 releases the engagement of the lock pin of the lock cylinder 66 with the lock hole 67 , and locks the lift plate 62 , that is, the imaging unit 50 with respect to the cutting unit 20 . Allow relative movement. When the lifting unit 60 finishes imaging the alignment mark 110 of the imaging unit 50 and releases the engagement of the lock pin of the lock cylinder 66 with the lock hole 67, the lifting plate 62 is moved by the linear cylinder 61 to the position indicated by the two-dot chain line in FIG. Move to a high point indicated by .

The control unit 90 is a computer that controls the above-described components of the cutting device 1 and causes the cutting device 1 to perform cutting operations on the package substrate 100 . The control unit 90 includes an arithmetic processing device having a microprocessor such as a CPU (central processing unit), a storage device having a memory such as ROM (read only memory) or RAM (random access memory), and an input/output interface device. and The arithmetic processing device of the control unit 90 performs arithmetic processing according to a computer program stored in the storage device, and outputs a control signal for controlling the cutting device 1 to the above-described control signal of the cutting device 1 via the input/output interface device. output to the configured element.

In addition, the control unit 90 is connected to a display unit (not shown) constituted by a liquid crystal display device for displaying the state of the machining operation and images, etc., and an input unit (not shown) used by the operator to register machining content information. there is The input unit is composed of at least one of a touch panel provided on the display unit and an external input device such as a keyboard.

The cutting apparatus 1 configured as described above holds the rear surface 101-2 side of the wiring board 101 of the package substrate 100 by suction on the holding surface 11 of the holding table 10, and seals the cutting edge of the cutting blade 21 along the dividing line 108. The sealing agent 103 is cut and cut to form a processed groove 120 in the sealing agent 103 as shown in FIG. Since the cutting edge of the cutting blade 21 is formed in the above-described mountain shape, the machined groove 120 has a width that decreases from the front surface 101-1 of the wiring substrate 101 of the package substrate 100 toward the rear surface 101-2. It is formed in a V-shaped cross section. In Embodiment 1, the processed groove 120 is formed only in the sealant 103 without being cut into the wiring substrate 101, but the present invention is not limited to the shape shown in FIG.

Next, this specification describes a method for manufacturing a semiconductor package according to the first embodiment. FIG. 8 is a cross-sectional view of a semiconductor package manufactured by the semiconductor package manufacturing method according to the first embodiment. FIG. 9 is a flow chart showing the flow of the semiconductor package manufacturing method according to the first embodiment. FIG. 10 is a cross-sectional view schematically showing a step of holding the semiconductor package shown in FIG. 9; FIG. 11 is a cross-sectional view schematically showing a detection step for the semiconductor package shown in FIG. FIG. 12 is a cross-sectional view schematically showing a process groove forming step of the semiconductor package shown in FIG. 13A and 13B are cross-sectional views schematically showing a step of forming a shield layer of the semiconductor package shown in FIG. 9. FIG.

The manufacturing method of the semiconductor package according to the first embodiment is a method of cutting the package substrate 100 as shown in FIG. 7 using the cutting apparatus 1 shown in FIG. 1 to manufacture the semiconductor package 200 shown in FIG. . In FIG. 8, the semiconductor package 200 will be described by assigning the same reference numerals to the same parts as the package substrate 100. As shown in FIG.

The semiconductor package 200 shown in FIG. 8 manufactured by the semiconductor package manufacturing method according to the first embodiment includes an inner side surface (also referred to as a side surface) 120-1 of the processed groove 120 of the package substrate 100 shown in FIG. After the shield layer 130 is formed on the upper surface 103-1 of the agent 103, the wiring substrate 101 is divided along the dividing lines 108 to be manufactured. The semiconductor package 200 shown in FIG. 8 is a semiconductor device for all packages that require blocking of so-called EMI (Electro-Magnetic Interference). It is configured.

As shown in FIG. 8, the semiconductor package 200 includes a wiring substrate 101, a device chip 102 mounted on a surface 101-1 of the wiring substrate 101, and a surface 101-1 of the wiring substrate 101 and the device chip 102 sealed. A sealant 103 and a shield layer 130 are provided.

The shield layer 130 is a multi-layered film made of one or more conductive metals such as copper, titanium, nickel, and gold, and having a thickness of several μm or more. The shield layer 130 is connected to the upper surface 103-1 of the sealing agent 103 parallel to the surface 101-1 of the wiring substrate 101 and the upper surface 103-1 and is inclined in the direction toward the outside of the semiconductor package 200 toward the wiring substrate 101. is formed on the side surface 120-1 of the sealant 103. The shield layer 130 suppresses leakage of electromagnetic noise from the device chip 102 to the surroundings.

The manufacturing method of the package substrate according to the first embodiment includes, as shown in FIG. 9, a holding step ST1, a detecting step ST2, a processed groove forming step ST3, a shield layer forming step ST4, and a dividing step ST5. .

The holding step ST1 is a step of holding the rear surface 101-2 side of the wiring board 101 of the package substrate 100 on the holding surface 11 of the holding table 10 by suction. In the first embodiment, in the holding step ST1, the operator places the wiring substrate 101 of the package substrate 100 on the holding surface 11, registers processing content information in the control unit 90, and the control unit 90 starts the processing operation from the operator. When the instruction is received, the cutting device 1 starts. In the holding step ST1, as shown in FIG. 10, the cutting apparatus 1 connects the suction hole 16 and the suction source 18 by the on-off valve 19, and attaches the wiring substrate 101 of the package substrate 100 to the holding surface 11 through the suction hole 16. is sucked and held, and the process proceeds to the detection step ST2.

The detection step ST2 is a step of capturing an image of the rear surface 101-2 of the wiring board 101 of the package substrate 100 held on the holding table 10 of the holding table 10 of the package substrate 100 by the image pickup unit 50, and detecting the dividing line 108. . In the detection step ST2, the cutting device 1 causes the lifting unit 60 to position the lifting plate 62 at a low point indicated by a solid line in FIG. , restricts the movement of the imaging unit 50 relative to the cutting unit 20 . In the detection step ST2, the cutting feed unit or the like moves the package substrate 100 on the holding surface 11 below the cutting unit 20, and moves the imaging unit 50 below the transparent member 14 of the holding table 10. 11, the imaging unit 50 is positioned below the alignment mark 110 of the package substrate 100 held on the holding surface 11 by suction.

In the detection step ST2, the cutting apparatus 1 causes the imaging unit 50 to image the alignment mark 110 of the package substrate 100, detects the position of the planned division line 108 of the package substrate 100, and cuts the package substrate 100 and the cutting unit 20. Alignment with respect to the blade 21 is performed, and the processing proceeds to the processing groove forming step ST3. Thus, in the first embodiment, alignment is performed with reference to the alignment mark 110 formed on the rear surface 101-2 of the wiring board 101. FIG. In the present application, the alignment mark 110 is shown in a large size for easy understanding, and although it appears as if it is embedded inside the holding table 10 in FIG. It is placed on the holding table 10 with minute unevenness.

In the processing groove forming step ST3, the cutting blade 21 cuts the sealant 103 from the front surface 101-1 side of the wiring substrate 101 along the position of the dividing line 108 detected in the detection step ST2 to form the processing groove 120. It is a step to In the machined groove forming step ST3, the cutting device 1 causes the feed units 30 and 40 and the rotary drive source 9 to relatively move the holding table 10 and the cutting blade 21 of the cutting unit 20 along the dividing line 108. Then, as shown in FIG. 12 , the cutting blade 21 is cut into the sealant 103 to form a machined groove 120 in the sealant 103 . In the machined groove forming step ST3, when the cutting device 1 forms the machined grooves 120 along all the dividing lines 108, the cutting by the cutting blade 21 and the suction holding of the package substrate 100 on the holding table 10 are finished, and the shield It progresses to layer formation step ST4.

The shield layer forming step ST4 is a step of forming the shield layer 130 with a conductive material on the upper surface 103-1, which is the surface of the sealant 103, and the inner side surface 120-1 of the processed groove 120 after the processed groove forming step ST3. is. In the shield layer forming step ST4, the package substrate 100 is accommodated in a container of a sputtering apparatus, and metal, which is a conductive material, is adhered to the package substrate 100 from the upper surface 103-1 side of the sealant 103 by sputtering, thereby forming the shield layer 130. to form

Thus, in the first embodiment, the shield layer forming step ST4 forms the shield layer 130 by so-called sputtering, but in the present invention, the shield layer 130 may be formed by electroplating. In the semiconductor package manufacturing method, as shown in FIG. 13, once the shield layer 130 is formed, the process proceeds to the dividing step ST5. After the shield layer forming step ST4, as shown in FIG. 1 a shield layer 130 is formed.

In the dividing step ST5, a shield formed on the inner surface 120-1 along the processed groove 120 by a cutting blade (not shown) thinner than the cutting blade 21 used in the processed groove forming step ST3 after the shield layer forming step ST4 is performed. The step is to divide the package substrate 100 into individual semiconductor packages 200 by cutting to a width that does not remove the layer 130 .

The tip of the cutting blade used in the dividing step ST5 is formed substantially flat along the axis of the cutting blade. In Embodiment 1, in the dividing step ST5, the cutting device sucks and holds the rear surface 101-2 side of the wiring substrate 101 of the package substrate 100, performs the same alignment as in the detection step ST2, and then separates the package substrate 100 and the cutting blade. and are relatively moved along the dividing line 108, the cutting blade is cut into the processing groove 120 until reaching the rear surface 101-2 of the wiring substrate 101, thereby dividing the package substrate 100 into individual semiconductor packages 200. . The method of manufacturing a semiconductor package is finished when the cutting blade is cut into the processing grooves 120 of all the dividing lines 108 of the package substrate 100 .

The cutting apparatus 1 according to the first embodiment has a transparent member 14 at a position corresponding to at least the alignment mark 110 of the holding table 10 , so that the package substrate 100 held by the holding table 10 can be aligned from below the holding table 10 . An imaging unit 50 capable of imaging is provided. As a result, the cutting apparatus 1 can perform alignment even for the package substrate 100 having the alignment mark 110 formed on the rear surface 101-2 side of the wiring substrate 101, and the package substrate 100 can be aligned along the dividing line 108. There is an effect that it is possible to process along.

Since the semiconductor package manufacturing method according to the first embodiment uses the above-described cutting apparatus 1, even the package substrate 100 having the alignment mark 110 formed on the rear surface 101-2 side of the wiring substrate 101 can be aligned. Therefore, it is possible to process the package substrate 100 along the dividing lines 108 .

Further, in the manufacturing method of the semiconductor package according to the first embodiment, in the processed groove forming step ST3, the processed groove whose width gradually decreases from the front surface 101-1 of the wiring board 101 of the package substrate 100 toward the back surface 101-2. 120 is formed, the shield layer 130 can be formed on the inner side surface 120-1 of the processed groove 120. FIG.

[Embodiment 2]
A cutting device according to Embodiment 2 of the present invention will be described with reference to the drawings. 14 is a cross-sectional view schematically showing a holding table of a cutting device according to Embodiment 2. FIG. 15 is a cross-sectional view schematically showing a holding table of a cutting device according to Modification 1 of Embodiment 2. FIG. 16 is a cross-sectional view schematically showing a holding table of a cutting device according to Modification 2 of Embodiment 2. FIG. 17 is a cross-sectional view schematically showing a holding table of a cutting device according to Modification 3 of Embodiment 2. FIG. 14, 15, 16 and 17, the same reference numerals are assigned to the same parts as in the first embodiment, and the description thereof is omitted.

In the cutting apparatus 1 according to the second embodiment, instead of the transparent member 14 of the first embodiment, the holding table 10 attaches the alignment mark 110 of the package substrate 100 which is suction-held to the holding surface 11 of the holding table 10 to the back surface of the wiring substrate 101 . The configuration is the same as that of Embodiment 1 except that exposure means 80-1, 80-2, 80-3, and 80-4 for exposing to the side of 101-2 are provided.

In the exposing means 80-1 of the holding table 10 shown in FIG. 14, the planar shape of the base 12 and the rubber member 13 is formed to be the same as the planar shape of the three sealants 103 of the package substrate 100. The alignment mark 110 is formed to be slightly larger than the planar shape of the two sealants 103 combined, and is formed to have a size that exposes the alignment mark 110 to the rear surface 101-2 side.

Further, in the holding table 10 shown in FIG. 15, the planar shape of the base 12 and the rubber member 13 is formed to be the same as the planar shape of the wiring substrate 101 of the package substrate 100, and the exposing means 80-2 is formed so that the holding surface 11 The hole is provided at a position corresponding to the alignment mark 110 of the package substrate 100 sucked and held in the vacuum chamber, penetrates the rubber member 13 and the base 12 in the Z-axis direction, and has a size that exposes the alignment mark 110 to the back surface 101-2 side. is. Also, the portion corresponding to the exposing means 80-2 may be formed of a transparent member.

16, the rubber member 13 is formed in the same size as the first embodiment, and the base 12 is formed in the same size as the holding table 10 shown in FIG. The exposing means 80-3 is located on the outer peripheral side of the rubber member 13 and in the space between the wiring board 101 of the package substrate 100 held on the holding surface 11 of the holding table 10 and the upper surface 12-1 of the base 12. be. The space is entered by the horizontally extending portion 65 of the arm 63, that is, the imaging unit 50 in the detection step ST2.

The holding table 10 shown in FIG. 17 has the base 12 and the rubber member 13 formed in the same size as the holding table 10 shown in FIG. and the rubber member 13 are made of a transparent material such as glass (quartz glass in the first embodiment).

The cutting apparatus 1 according to the second embodiment includes exposing means 80- for exposing the alignment mark 110 of the package substrate 100, which is suction-held on the holding surface 11 of the holding table 10, to the rear surface 101-2 side of the wiring substrate 101. 1, 80-2, 80-3, and 80-4, even the package substrate 100 having the alignment mark 110 formed on the back surface 101-2 side of the wiring substrate 101 can be aligned. It is possible to process the package substrate 100 along the dividing line 108 .

It should be noted that the present invention is not limited to the above-described embodiments and the like. That is, various modifications can be made without departing from the gist of the present invention.

Reference Signs List 1 cutting device 10 holding table 11 holding surface 14 transparent member 15 escape groove for cutting blade 16 suction hole 17 suction path 20 cutting unit (cutting means)
21 cutting blade 50 imaging unit (imaging means)
80-1, 80-2, 80-3, 80-4 Exposure means 100 Package substrate 101 Wiring substrate 101-1 Front surface 101-2 Back surface (surface)
102 device chip 103 sealing agent 103-1 upper surface (surface)
108 Division planned line 110 Alignment mark 120 Processed groove 120-1 Inner surface (side surface)
200 semiconductor package ST1 holding step ST2 detecting step ST3 machined groove forming step ST4 shield layer forming step

Claims (4)

A cutting apparatus for cutting a package substrate in which a plurality of device chips are mounted on the front surface of the wiring substrate and sealed with resin, and alignment marks are formed on the periphery of the back surface to serve as a reference for dividing lines,
a holding table for holding the back side of the package substrate;
imaging means for imaging the back surface of the package substrate held by the holding table;
A cutting device comprising cutting means for rotatably supporting a cutting blade,
The holding table is
a holding surface comprising a plurality of cutting blade escape grooves and a plurality of suction holes formed in each region partitioned by the cutting blade escape grooves, and made of elastic synthetic resin ;
a transparent member surrounding the holding surface;
a suction path that communicates the suction hole and the suction source,
a position corresponding to the alignment mark on the holding table is formed by the transparent member;
The cutting device, wherein the imaging means is installed below the transparent member and images the alignment mark through the transparent member . A cutting apparatus for cutting a package substrate in which a plurality of device chips are mounted on the front surface of the wiring substrate and sealed with resin, and alignment marks are formed on the periphery of the back surface to serve as a reference for dividing lines,
a holding table for holding the back side of the package substrate;
imaging means for imaging the back surface of the package substrate held by the holding table;
A cutting device comprising cutting means for rotatably supporting a cutting blade,
The holding table is
It comprises a plurality of cutting blade clearance grooves and a plurality of suction holes formed in each region partitioned by the cutting blade clearance grooves, is made of elastic synthetic resin, and has a planar shape of the wiring board. a holding surface smaller than the planar shape ;
a suction path connecting the suction hole and the suction source;
exposing means for exposing the alignment mark formed on the back surface of the package substrate held on the holding surface of the holding table to the back surface side;
The cutting device, wherein the imaging means is installed below the alignment mark formed on the back surface of the package substrate exposed by the exposing means , and images the alignment mark. A cutting apparatus for cutting a package substrate in which a plurality of device chips are mounted on the front surface of the wiring substrate and sealed with resin, and alignment marks are formed on the periphery of the back surface to serve as a reference for dividing lines,
a holding table for holding the back side of the package substrate;
imaging means for imaging the back surface of the package substrate held by the holding table;
A cutting device comprising cutting means for rotatably supporting a cutting blade,
The holding table is
It comprises a plurality of cutting blade clearance grooves and a plurality of suction holes formed in each region partitioned by the cutting blade clearance grooves, is made of elastic synthetic resin, and has a planar shape of the wiring board. a holding surface formed to have the same planar shape ;
a suction path connecting the suction hole and the suction source;
an exposing means that is a hole that opens to the holding surface and exposes the alignment mark formed on the back surface of the package substrate held on the holding surface of the holding table to the back surface side;
The cutting apparatus, wherein the imaging means is installed below the exposing means to take an image of the alignment mark. A semiconductor package manufacturing method for manufacturing a semiconductor package by cutting a package substrate using the cutting apparatus according to any one of claims 1 to 3,
a holding step of holding the back side of the package substrate on the holding table;
a detection step of imaging the surface of the package substrate held by the holding table and detecting the line to be divided;
a machined groove forming step of cutting the surface with the cutting blade along the detected dividing line to form a machined groove;
a shield layer forming step of forming a shield layer with a conductive material on the surface of the sealant and on the side surface of the processed groove after performing the processed groove forming step;
The width of the processed groove is
A method of manufacturing a semiconductor package, wherein the semiconductor package is formed so as to become smaller from the front surface toward the back surface of the package substrate.

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