JP7303510B2 - taping device - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tape sticking device that sticks a tape around the end face of a printed circuit board.

Conventionally, when a printed circuit board is immersed in a chemical solution or the like, the chemical solution or the like permeates from the end face of the board, and the chemical solution or the like sometimes deteriorates the properties of the board, for example, the insulation resistance of the board. Therefore, before the printed circuit board is immersed in a chemical solution or the like, an operator manually affixes a tape around the edge surface of the substrate one by one in order to prevent the chemical solution or the like from penetrating from the edge surface of the substrate.

However, if this work is done manually as in the past, the method of application varies depending on the operator. there were. In addition, when the tape is applied, wrinkles are generated, and there are cases in which chemical solutions or the like enter through the wrinkles.
As a result, the worker has to be extremely careful when applying the tape to each surface of the substrate, which causes a problem of poor working efficiency.

Patent Document 1 discloses an invention of a tape applying device and a tape applying method for applying a masking tape to the periphery of a rotating substrate. This tape applying apparatus is an apparatus for applying masking tape to protect the peripheral edge of a substrate such as a wafer. there is

JP 2015-224300 A

However, the invention described in this document is an apparatus for applying a tape to a rotating substrate, and cannot be applied to a rectangular substrate. In addition, it is necessary to rotate the substrate to feed the tape to be affixed.

The present invention is intended to solve the above-mentioned problems. Since many driving means are not required, the tape can be applied to the end surface of the substrate with a simple device. , the work efficiency can be improved and the yield can be improved.

The present invention is an apparatus for preventing permeation of a chemical solution, etc., by attaching a tape around the edge surface of the substrate to prevent the chemical solution, etc. from penetrating from the substrate edge surface when the printed circuit board is immersed in the chemical solution.
That is, in a taping apparatus for applying tape along the edge surface of a substrate, the substrate holding means for holding the substrate by setting the substrate on the table of the tape applying apparatus, and the edge surface of the substrate held by the substrate holding means. A tape sticking device is characterized by comprising a tape sticking unit for sticking a tape around and unit moving means capable of moving the tape sticking unit in a horizontal direction.

With this configuration, the taping device can fix the substrate without moving it, and only horizontally move the taping unit.

Further, the tape applying unit of the tape applying apparatus includes first applying means for applying the tape to the starting end of the lower surface of the substrate, and the tape applied by moving the tape applying unit in the horizontal direction to bend the tape vertically in the lateral direction, It is characterized by comprising first folding means for pressing the tape against the end face of the substrate and second folding means for folding the tape in the lateral direction from vertical to parallel to the plane of the substrate.

With this configuration, tape attachment on the upper and lower surfaces of the substrate is performed by the attachment and folding means in a separate process, so that the tape can be reliably folded and attached. In addition, there is no wrinkle during tape application, and tape application variations are eliminated.

Further, the taping unit includes tape holding means for holding the width of the tape to be applied to the upper and lower surfaces around the edge surface of the substrate so as to be adjustable, and the tape held by the tape holding means moves the tape attaching unit to the edge surface of the substrate. second sticking means for sticking the tape to the upper and lower surfaces of the substrate, detection means for detecting the end of tape sticking on the substrate, and its detection means. and tape start end holding means for holding the tape after cutting the tape.

With this configuration, the upper and lower rollers enable reliable attachment, and the tape is cut and held by detecting the end of the substrate, so the tape attachment can be performed continuously and there is no variation in the protrusion of the tape.

Also, in the taping unit, the tape is attached to the tape holding means, and the position of the tape relative to the position where the substrate is set is moved back and forth in the axial direction along which the tape is wound by the tape folding width adjusting means. The width of the tape applied to the upper surface and the lower surface of the substrate is adjusted, and the first application means, the first bending means, the second bending means and the second application means are applied to the lower surface around the end surface of the substrate, the end surface, and the upper surface in this order. and the tape is cut by the cutting means when the end of the substrate is detected by the detection means for detecting the end of the tape on the substrate.

With this configuration, it is possible to adjust the width of the tape applied to the upper surface and the lower surface around the end surface of the substrate. In addition, since the tape is attached to the upper and lower surfaces of the substrate in a separate process, the tape can be reliably bent and firmly attached to the lower, edge, and upper surfaces of the substrate. Furthermore, since the tape is cut by detecting the terminal end of the substrate, the length of the tape can be kept constant without variations in the amount of protrusion of the tape.

According to the present invention, a tape applying device can be realized by a simple method, and wrinkles due to excessive tape feeding can be prevented because no tape feeding means is required, and excess tape at the beginning and end of tape bonding on a substrate can be prevented. variation is eliminated. Moreover, since the tape is applied in the order of the lower surface, the end surface and the upper surface of the substrate, the tape can be reliably bent and applied.
Furthermore, by using the tape sticking device, variations in sticking and working efficiency due to the ability of workers are eliminated, and work efficiency and yield are improved.

1 is a schematic diagram of a taping device according to an embodiment of the present invention; FIG. It is a schematic diagram of the front of the taping unit which concerns on this invention. 1 is a schematic plan view of a taping unit according to the present invention; FIG. FIG. 10 is a diagram for explaining the operation of horizontal movement of the taping unit; Fig. 3 is a perspective view showing the shape of a tape application guide (1); Fig. 3 is a perspective view showing the shape of a tape application guide (2); Fig. 2 shows the positions of the taping guides (1) and (2) and the substrate, and how the guides are attached. It is a figure explaining the tape sticking method of a tape sticking unit. It is sectional drawing of four places shown by the figure explaining the tape sticking method.

A taping device according to an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a schematic diagram of a taping device according to an embodiment of the present invention. The taping device 1 comprises a tape applying unit 2 , a unit moving means 3 for the tape applying unit, a substrate fixing clamp 4 , a substrate setting table 5 and a switch box 6 . The dotted line portion of the square shown in FIG. 1 is the position where the substrate 30 is set.

The tape applying unit 2 includes a tape holder, two types of tape applying guides capable of bending the tape along its lateral direction, a tape cutter, and the like. , tape is applied to the substrate held while moving horizontally.
A substrate 30 is set on the substrate setting table 5 and held by the substrate fixing clamp 4 . The substrate fixing clamp 4 and the substrate setting table 5 are substrate holding means.

Although the unit moving means 3 of the tape applying unit is composed of a servomotor, a ball screw, etc., the circuit for operating the control circuit and the substrate fixing clamp 4, the operation procedure, etc. are not shown in the figure. do not have.
Further, although the unit moving means 3 of the tape applying unit 2 has been described as moving only in the horizontal direction in this embodiment, it may be a means for moving in the vertical direction as well.

2 and 3 are schematic front and top views of a taping unit 2 according to the present invention.
The tape applying unit 2 includes a tape holder (tape holding means) 13 for holding the tape 11, a tape guide roller 14, a tape starting edge applying guide (first applying means) 15, a tape holding guide (tape starting edge holding means) 16, A tape cutter (cutting means) 17 is provided. A tape turn-up width adjustment knob (tape turn-up width adjustment means) 12 adjusts the positions of the substrate 30 and the tape 11 to be stuck, and adjusts the width of tape to be stuck on the upper and lower surfaces of the substrate 30 .

Further, the substrate feeding guide roller 18 holds the substrate 30 to which the tape is to be applied, but functions to feed and position the substrate 30 which moves relatively because the tape applying unit 2 moves.
A tape cut sensor (detection means) 19 is a sensor for detecting the end of the tape applied to the substrate 30 . When this sensor operates, the tape cutter 17 operates to cut the tape 11 .

A tape application guide (1) (first bending means) 20 bends the tape 11 applied to the lower surface of the substrate 30 and stretched straight in the lateral direction by 90 degrees, and presses the tape 11 against the substrate end surface.
The tape application guide (2) (second folding means) 21 is arranged immediately after the tape application guide (1) 20 in the direction in which the substrate advances, and bends the tape 11 in the vertical direction parallel to the substrate end face to the substrate. Fold again so that it is parallel to the horizontal plane of 30.

The upper tape applying roller 22 and the lower tape applying roller 23 (the upper and lower rollers are the second applying means) are a pair of upper and lower rollers, and the substrate 30 passes between the two rollers. A tape 11 is pressed and attached to the upper and lower surfaces of the .
These two rollers are urged by a spring 28 in a direction in which the rollers press the substrate together.
The tape application end sensor 24 is a sensor that detects that the substrate 30 has passed by the movement of the tape application unit 2 .

The guide mounting base 25 is a thick plate-like base on which the tape application guide (1) 20 and the tape application guide (2) 21 are attached. Further, the taping guide (1) 20 is urged in the direction of being pressed against the end face of the substrate 30 by the springs 26 and 27, and the taping guide (2) 21 is pushed onto the upper surface of the substrate 30 by the springs 26 and 27. It is biased in the pressing direction.

4A and 4B are diagrams for explaining the operation of horizontal movement of the tape applying unit described above, and are diagrams for explaining three states of the positional relationship between the tape applying unit 2 and the substrate 30. FIG. That is, FIG. 4A shows a state in which the substrate 30 is set on the substrate setting table 5 of the taping device 1 and the tape application of the substrate 30 is started, and FIG. That is, the tape cut sensor 19 detects the end of the substrate and operates the tape cutter 17 to cut the tape. FIG. 4C shows a state in which the tape application to the substrate 30 has been completed, that is, a state in which the tape application end sensor 24 has detected the end of the substrate 30 .

Here, the shape of the tape applying guide (1) 20 and the tape applying guide (2) 21 that constitute the tape applying unit 2 and the position of the substrate 30 to which the tape 11 is applied will be described.
FIG. 5 is a perspective view showing the shape of the tape application guide (1) 20. FIG. The shape is shown by a change in cross-sectional view. Since the tape application guide (1) 20 smoothly bends the tape 11 from the horizontal direction to the vertical direction, the shape gradually changes along the moving direction of the tape 11 . That is, since one end in the width direction of the tape 11 applied to the lower surface of the substrate protrudes horizontally, the leading end of the tape application guide (1) 20 is shaped like a thin plate in order to scoop up the tape 11. The tape 11 is gradually bent in the vertical direction at the portion in contact with the tape in the intermediate portion, so that the angle .theta.1 becomes larger, and the angle in the latter half becomes the vertical shape.

FIG. 6 is a perspective view showing the shape of the tape application guide (2) 21. As shown in FIG. FIG. 6 also shows the shape by changing the sectional view. The tape application guide (2) 21 is a guide for further bending the vertically bent tape 11 to the horizontal surface of the substrate 30. As shown in FIG. Therefore, the surface in contact with the tape 11 at the leading portion is substantially vertical, but the angle θ2 in the intermediate portion is small, and the surface in contact with the tape 11 in the rear half is substantially horizontal.
The surfaces of the two tape application guides, which are in contact with the tape 11, are curved surfaces. Also, the tape applying guide (2) 21 may have the same shape as the tape applying guide (1) 20, but may be attached by rotating it by 90 degrees.

Next, the position where the tape applying guide (1) 20 and the tape applying guide (2) 21 are arranged and the position of the end surface of the substrate 30 through which they pass will be described.
FIG. 7 is a diagram showing the positions of the tape application guides (1) and (2) and the substrate, and how the guides are attached. In order to show the shape of the tape application guide (2) 21, its attachment portion is indicated by a dotted line.
The tape applying guide (1) 20 is arranged so as to be in contact with the end surface of the substrate 30 to which the tape 11 is applied. The tip of the tape application guide (1) 20 picks up the tape 11 protruding horizontally. In the latter half of 20, the tape 11 is in a vertically raised state.

This taping guide (1) 20 can be moved horizontally by expansion and contraction of springs 26 and 27. As shown in FIG. That is, when the tape applying guide (1) 20 comes into contact with the end face of the substrate 30, the springs 26 and 27 are pressed by the end face of the substrate 30 and contract. is pressed against the end face of the
In addition, the mounting portion of the tape applying guide (1) 20 to the guide mounting base 25 is carved and dug down, and the tip of the tape applying guide (1) 20 is adhered to the lower surface of the substrate 30 and extends horizontally. You may attach so that it may become below the tape 11 which carried out.

The tip of the tape application guide (2) 21 disposed immediately after the tape application guide (1) 20 is positioned so as not to contact the end face of the substrate 30, i.e., slightly shifted to the right in the traveling direction of the substrate 30. placed in position. When the substrate 30 moves and comes into contact with the tape application guide (2) 21, the vertical tape 11 is gradually bent by the shape of this guide so as to become horizontal with the substrate 30, and the latter half of the guide is bent. , the tape 11 is folded so as to be horizontal to the plane of the substrate 30. In FIG.

At this point, the tape application guide (2) 21 is placed on the horizontal surface of the substrate 30, that is, the tape 11 is pressed against the substrate 30 by the tape application guide (2)21.
This is because the taping guide ( 2 ) 21 can be moved vertically by expansion and contraction of the springs 26 and 27 . That is, when it comes into contact with the upper surface of the substrate 30 , the upper surface of the substrate 30 pushes the springs 26 and 27 to contract, and the force of these springs presses the tape application guide ( 2 ) 21 against the upper surface of the substrate 30 .

Due to the shape and arrangement of the two tape application guides (1) 20 and the tape application guide (2) 21, the tape 11 applied to the lower surface of the substrate 30 is vertically bent and pressed against the end surface of the substrate 30. Furthermore, it is bent so as to be parallel to the horizontal plane of the substrate 30 . After the tape 11 is applied to the end face of the substrate 30 by the two tape applying guides, the tape is horizontally bent, so that the tape is reliably bent and the tape is applied without forming a gap between the substrate 30 and the tape 11.例文帳に追加be able to.

Next, a tape applying method of the tape applying device 1 will be described.
8A and 8B are diagrams for explaining the tape application method of the tape application unit 2. FIG. FIG. 8A shows the initial state of the tape applying unit 2, in which the substrate 30 is not set yet, FIG. 8B shows the substrate 30 set in the tape applying device 1, and FIG. Substrate 30 passes through taping guide (1) 20, (D) shows substrate 30 passing through taping guide (2) 21, and (E) shows substrate 30 passing through upper and lower taping rollers 22 and 23, and (F) is a view after the substrate 30 has been taped.

FIG. 9 is a cross-sectional view of four points shown in FIG. The aa section is shown in FIG. 9(A), and the same applies to the bb section (B), (C) and (D). These four cross-sectional views show only major parts such as the substrate 30, the tape 11, and the guides that contribute to the application work.

When the tape application device 1 is first started, the tape application unit 2 moves from the standby state to the tape application start position (FIG. 8(A)).
Next, the substrate 30 to which the tape 11 is to be applied is set at the substrate setting position on the substrate setting table 5, and a tape application start button (not shown) of the switch box 6 shown in FIG. 1 is pressed. The substrate fixing clamp 4 shown in FIG. 1 is actuated to hold the substrate 30 . In this embodiment, the substrate fixing clamp 4 presses and holds the substrate 30, but a method of fixing by suction or the like can also be adopted, or both can be used together.

After the substrate 30 is held by the substrate fixing clamp 4 , the cylinder of the tape start end application guide 15 rises from the tape application start portion held by the tape holding guide 16 to apply the tape 11 to the substrate 30 . It is attached by pressing it against the lower surface of the position (FIG. 8(B)). FIG. 9A shows a state in which the substrate 30 is placed above the tape 11 and the tape 11 is attached to the lower surface of the substrate by the tape start end attaching guide 15 from below.

After the lower surface of the substrate is adhered, the tape start end application guide 15 is lowered, and the tape application unit 2 is moved horizontally. At this time, as the tape applying unit 2 moves horizontally, that is, as the substrate 30 moves, the tape 11 is sent out and adheres to the lower surface of the substrate 30 .
While the tape applying unit 2 moves horizontally, the tape applying guide (1) 20 provided in the tape applying unit 2 bends the tape 11 in the lateral direction by 90 degrees and presses the tape 11 against the end face of the substrate 30 (FIG. 8). (C)). FIG. 9(B) shows a state in which the tape 11 is being bent by the tape application guide (1) 20 so as to be parallel to the substrate edge surface. The cross section of the rear half of the tape application guide (1) 20 rises in the vertical direction parallel to the end surface of the substrate.

Further, when the tape application unit 2 moves horizontally, the tape application guide (2) 21 further bends the tape 90 degrees in the lateral direction, that is, the tape 11 is bent 180 degrees from the bottom surface of the substrate (FIG. 8 ( D)). FIG. 9C shows a state in which the tape 11 is being bent by the tape application guide (2) 21 so as to be horizontal to the substrate 30. FIG. Also, the cross section of the rear half of the tape application guide (2) 21 is parallel to the horizontal surface of the substrate.

The tape application guide (1) 20 and the tape application guide (2) 21 function as the first folding means and the second folding means, respectively, and when the tape is folded, the tape is stuck to the end surface and the upper surface of the substrate. It will also happen. The tape application rollers 22 and 23 in the next step press the tape 11 against the upper and lower surfaces of the substrate 30 to ensure adhesion.

When the tape cut sensor 19 detects the end of the substrate 30 while the tape 11 is being bent by the tape applying guide (2) 21, the tape cutter 17 rises and cuts the tape 11 (FIG. 8(D)). The tape holding guide 16 holds the leading end of the remaining cut tape 11 . Although a cutter is used to cut the tape 11, it is also possible to use scissors or the like.

8, the tape 11 is cut when the tape 11 is bent by the tape sticking guide (2) 21, but the timing of cutting the tape 11 changes depending on the size of the substrate 30. FIG.

Further, when the tape application unit 2 moves horizontally, tape application rollers 22 and 23 provided on the upper and lower sides press and apply the tape 11 on the lower surface and the upper surface of the substrate 30 with rollers urged by springs 28 (Fig. 8(E)). FIG. 9D shows a state in which the tape 11 is pressed against the substrate 30 by two rollers.

Furthermore, when the taping unit 2 moves horizontally and passes the end of the substrate 30 , the tape-applying end sensor 24 detects the end of the substrate 30 . After that, when the taping unit 2 leaves the substrate 30 (FIG. 8(F)), the substrate fixing clamp 4 holding the substrate 30 is released, and the substrate 30 is removed.
When the substrate 30 is removed, the taping unit 2 returns to the starting position shown in FIG. 8(A). When the other surface of the substrate 30 is to be taped subsequently, the position of the end surface of the substrate 30 to which the tape 11 is to be affixed is changed, the substrate is set again on the substrate setting table 5 of the tape affixing device 1, and the same operation is performed.

Although the setting of the substrate 30 to the tape sticking device 1 has been described as being carried out by an operator, the setting of the substrate 30 can also be automated using a robot or the like.
Since this taping device 1 does not require a means for feeding the tape, wrinkles due to excessive feeding of the tape do not occur. The attachment can be reliably performed, and the tape can be attached with a simple structure.

In addition, there is no variation in the amount of tape protruding from the start and end of the tape on the substrate, so that the tape can be reliably applied.
Furthermore, by using a device equipped with a tape sticking unit, variations in the tape sticking state and work efficiency due to the ability of workers are eliminated, and work efficiency and yield are improved.
In addition, complete automation can save workers and improve productivity.

DESCRIPTION OF SYMBOLS 1... Tape sticking apparatus, 2... Tape sticking unit, 3... Unit moving means, 4... Board fixing clamp, 5... Board setting table, 6... Switch box, 11. Tape 12 Tape return width adjustment knob 13 Tape holder 14 Tape guide roller 15 Tape start end pasting guide 16 Tape holding guide 17 Tape cutter 18 Substrate feed guide roller 19 Tape cut sensor 20 Tape application guide (1) 21 Tape application guide (2) 22 Upper tape application Roller 23 Lower tape application roller 24 Tape application end sensor 25 Guide mounting base 26 to 28 Spring 30 Substrate.

Claims (3)

A taping device for applying tape along an edge surface of a substrate,
substrate holding means for holding the substrate by setting the substrate on the table of the taping device;
a tape sticking unit that sticks a tape around the end face of the substrate held by the substrate holding means;
a unit moving means capable of horizontally moving the taping unit;
with
The taping unit is
a first attaching means for attaching the tape to the starting end of the lower surface of the substrate;
first bending means for vertically bending the width direction of the tape delivered by moving the tape applying unit in the horizontal direction and for pressing the tape against the end surface of the substrate;
a second folding means for folding the tape in the transverse direction from vertical to parallel to the plane of the substrate;
with
The first bending means is a tape sticking guide (1) having a curved surface that contacts the tape in the form of a square bar, and the leading end has the shape of a thin plate for scooping up the tape. Since the tape is bent in the vertical direction, the angle between the surface of the middle portion of the tape application guide (1) and the surface in contact with the tape gradually increases with respect to the horizontal surface, and the surface of the rear portion of the tape application guide (1) that contacts the tape. is a shape whose angle with the horizontal plane is vertical,
The second bending means is a tape application guide (2) having a curved surface that contacts the tape in the shape of a square bar. The surface of the middle part of the guide (2) in contact with the tape has a gradually decreasing angle with a horizontal plane, and the surface of the tape application guide (2) in the latter half of the tape application guide (2) in contact with the tape is shaped to be horizontal. A tape pasting device for The taping device according to claim 1 ,
The taping unit is
tape holding means for holding the tape width to be applied to the upper surface and the lower surface around the end surface of the substrate so as to be adjustable;
the tape held by the tape holding means is sent out by moving the tape applying unit along the longitudinal direction of the end surface of the substrate;
a second attaching means for attaching the tape to the upper surface and the lower surface of the substrate;
detection means for detecting the end of the substrate to which the tape is applied;
a cutting means for cutting the tape according to a signal from the detection means;
tape start end holding means for holding the tape after cutting the tape;
A taping device, further comprising: The taping device according to claim 2 ,
The taping unit is
The tape is attached to the tape holding means, and the position of the tape with respect to the position where the substrate is set is moved back and forth in the axial direction in which the tape is wound by the tape turn-back width adjusting means. The width of the tape applied to the upper and lower surfaces is adjusted, and the lower surface around the end surface of the substrate, the end surface, The tape is applied in the order of the upper surface, and the tape is cut by the cutting means when the end of the substrate is detected by a detection means for detecting the end of the tape applied to the substrate. Tape application device.

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