JP7308680B2 - Production method - Google Patents

Description

The present invention relates to a manufacturing method for dividing a plate-shaped work to form rectangular chips with chamfered corners.

For optical lenses and the like, rectangular chips such as rectangular lenses are cut out from optical glass with a cutting blade. A cutting device (see, for example, Japanese Unexamined Patent Application Publication No. 2002-100002) is sometimes used to cut off the corners of a rectangular chip and form a chamfered state.

Japanese Unexamined Patent Application Publication No. 2017-143098

However, in the method of manufacturing rectangular chips using the cutting apparatus disclosed in Patent Document 1 and the like, rectangular chips are manufactured by cutting a plate-shaped work along four mutually intersecting directions. For this reason, there is a problem that the number of rectangular chips obtained from one plate-like work is reduced, and there is a demand to suppress the decrease in the number of rectangular chips obtained from one plate-like work. .

SUMMARY OF THE INVENTION The present invention has been made in view of such problems, and its object is to provide a manufacturing method capable of suppressing a decrease in the number of rectangular chips obtained from one plate-like work.

In order to solve the above-described problems and achieve the object, the manufacturing method of the present invention is a manufacturing method for dividing a plate-shaped work to form rectangular chips with chamfered corners, which are arranged at the tip of a spindle. A first dividing step of cutting a plate-like work in a first direction with a provided cutting blade to form a first dividing groove; a second dividing step of cutting in a direction to form a second dividing groove ; The axis of the spindle is positioned above the bisector that bisects the halves, and the cutting blade is lowered from above the plate-shaped work at the intersection of the first and second dividing grooves to cut the corners. and a chamfering step of cutting to form a chamfer at each corner of the rectangular chip.

In the manufacturing method, before performing the first dividing step, the second dividing step, and the chamfering step, an arrangement step of arranging the plate-shaped work on the support member, the first dividing step and the chamfering step. After performing the second dividing step and the chamfering step, the step of removing the individual rectangular chips from the support member may be further included.

Advantageous Effects of Invention The present invention has the effect of suppressing a decrease in the number of rectangular chips obtained from one plate-like work.

FIG. 1 is a perspective view showing an example of a plate-like work to be processed by the manufacturing method according to the first embodiment. FIG. 2 is a perspective view showing an example of a rectangular chip manufactured by the manufacturing method shown in Embodiment 1. FIG. FIG. 3 is a flow chart showing the flow of the manufacturing method according to the first embodiment. 4 is a perspective view of the plate-like workpiece after the disposing step of the manufacturing method shown in FIG. 3. FIG. 5 is a perspective view of a configuration example of a cutting device used in the first division step, the second division step and the chamfering step of the manufacturing method shown in FIG. 3. FIG. FIG. 6 is a plan view of the main part of the plate-like workpiece after the first dividing step and the second dividing step of the manufacturing method shown in FIG. 7 is a plan view showing a first chamfering step of the chamfering step of the manufacturing method shown in FIG. 3. FIG. 8 is a plan view showing a second chamfering step of the chamfering step of the manufacturing method shown in FIG. 3. FIG. FIG. 9 is a plan view of the main part of the plate-shaped workpiece after the first dividing grooves are formed in the conventional manufacturing method. FIG. 10 is a plan view of the main part of the plate-shaped workpiece after the second dividing grooves are formed in the conventional manufacturing method. FIG. 11 is a plan view of the main part of the plate-shaped workpiece after the third dividing grooves are formed in the conventional manufacturing method. FIG. 12 is a plan view of a main part of the plate-like work after forming the fourth dividing groove in the conventional manufacturing method.

A form (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. In addition, the components described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. In addition, various omissions, substitutions, or changes in configuration can be made without departing from the gist of the present invention.

[Embodiment 1]
A manufacturing method according to Embodiment 1 of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing an example of a plate-like work to be processed by the manufacturing method according to the first embodiment. FIG. 2 is a perspective view showing an example of a rectangular chip manufactured by the manufacturing method shown in Embodiment 1. FIG. FIG. 3 is a flow chart showing the flow of the manufacturing method according to the first embodiment.

The manufacturing method according to the first embodiment is a method for manufacturing rectangular chips 10 in which the plate-shaped workpiece 1 shown in FIG. 1 is divided to form rectangular chips 10 shown in FIG. A plate-like workpiece 1 to be processed by the manufacturing method according to the first embodiment is optical glass having a constant thickness, and includes a pair of first outer edges 2 parallel to each other and a pair of first outer edges 2 parallel to each other and perpendicular to the first outer edges 2. It has a second outer edge 3 and has a quadrangular planar shape. A direction parallel to the first outer edge 2 is hereinafter referred to as a first direction 4 , and a direction parallel to the second outer edge 3 is hereinafter referred to as a second direction 5 .

The rectangular chip 10 shown in FIG. 2 is a lens having a rectangular planar shape. After the plate-like workpiece 1 is divided along the first direction 4 and the second direction 5, the rectangular chip 10 is chamfered and removed from the corners 11, 12, 13, 14 indicated by dotted lines in FIG. As a result, the corners 11, 12, 13, and 14 are formed with chamfered surfaces 15 which are flat chamfers. The chamfered surface 15 is an imaginary line 16 (indicated by a dashed line in FIG. 2) that is a bisector that bisects the angles formed by the corners 11, 12, 13, and 14 in a plan view of the rectangular chip 10. , and is formed flat in a direction perpendicular to both surfaces of the rectangular chip 10 .

In this specification, one of the corners 11, 12, 13, and 14 is hereinafter referred to as the first corner 11, and the one located on the diagonal between the first corner 11 and the rectangular chip 10 is referred to as the first corner 11. The second corner portion 12 is referred to as the second corner portion 12 , one of the corners positioned on the diagonal line of the remaining rectangular chip 10 is referred to as the third corner portion 13 , and the other is referred to as the fourth corner portion 14 . Further, in Embodiment 1, the chamfered surfaces 15 formed on the first corner 11 and the second corner 12 located on the diagonal line of the rectangular chip 10 are parallel to each other and on the diagonal line of the rectangular chip 10 . The chamfered surfaces 15 formed at the located third corner 13 and fourth corner 14 are parallel to each other.

The manufacturing method according to the first embodiment includes, as shown in FIG. 3, an arrangement step ST1, a first division step ST2, a second division step ST3, a chamfering step ST4, and a removal step ST5.

(Arrangement step)
4 is a perspective view of the plate-like workpiece after the disposing step of the manufacturing method shown in FIG. 3. FIG. The disposing step ST1 is a step of disposing the plate-like work 1 on the adhesive tape 20 as a supporting member before performing the first dividing step ST2, the second dividing step ST3 and the chamfering step ST4.

In the first embodiment, in the disposing step ST1, as shown in FIG. An annular frame 21 is attached to the periphery. The adhesive tape 20 includes a base layer made of an insulating synthetic resin and an adhesive glue layer laminated on the surface of the base layer. In Embodiment 1, the adhesive layer is cured by irradiation with ultraviolet rays, which is an external stimulus, and the adhesive strength is reduced. .

Further, in Embodiment 1, the adhesive tape 20 larger than the planar shape of the plate-like work 1 is used as the support member, but in the present invention, the support member is not limited to the adhesive tape 20, and the plate-like work 1 can be An adhesive tape having the same shape as the planar shape and having a base layer and a glue layer may be used, or a hard plate having the same shape as the planar shape of the plate-like work 1 and made of a hard material may be used. When the adhesive tape 20 is attached to one surface of the plate-like work 1, the manufacturing method proceeds to the first dividing step ST2.

(First division step and second division step)
5 is a perspective view of a configuration example of a cutting device used in the first division step, the second division step and the chamfering step of the manufacturing method shown in FIG. 3. FIG. FIG. 6 is a plan view of the main part of the plate-like workpiece after the first dividing step and the second dividing step of the manufacturing method shown in FIG.

In the first dividing step ST2, the plate-like workpiece 1 is cut in the first direction 4 by a cutting blade 41 arranged at the tip of the spindle 42 of the cutting device 40 shown in FIG. In the second dividing step ST3, the cutting blade 41 cuts the plate-like workpiece 1 in the second direction 5 that intersects (perpendicularly in the first embodiment) the first direction 4 to form the second direction. This is the step of forming the two-divided groove 32 . In addition, FIG. 6 shows the first dividing groove 31 and the second dividing groove 32 by shading.

In the first embodiment, in the first dividing step ST2, the cutting device 40 receives processing content information via an input device (not shown), and the plate-shaped work 1 is placed on the holding surface 44 of the chuck table 43 via the adhesive tape 20. placed. In the first division step ST2, when the cutting device 40 receives an instruction to start the machining operation, the plate-like workpiece 1 is held by suction on the holding surface 44 of the chuck table 43, and the annular frame 21 is clamped by the clamping portion 45.

In the first division step ST2, the cutting device 40 moves the chuck table 43 downward of the imaging unit 48 attached to the cutting unit 47 by the X-axis moving unit 46, and the imaging unit 48 images the plate-like workpiece 1. do. In the first division step ST2, the cutting device 40 causes the rotary movement unit 49 to make the first direction 4 of the plate-like workpiece 1 parallel to the X-axis direction, which is the direction in which the X-axis movement unit 46 moves the chuck table 43, so that cutting is performed. Alignment to align cutting blade 41 of unit 47 is performed. Note that the X-axis direction is parallel to the horizontal direction.

In the first division step ST2, the cutting device 40 moves the chuck table 43 and the plate along the first direction 4 by using the X-axis moving unit 46, the Y-axis moving unit 50, and the Z-axis moving unit 51 based on the processing content information. The cutting blade 41 is caused to cut into the plate-like work 1 until it reaches the adhesive tape 20 while moving the plate-like work 1 relatively to form a plurality of mutually parallel first dividing grooves 31 in the plate-like work 1 . When all the first dividing grooves 31 are formed in the plate-like work 1, the manufacturing method proceeds to the second dividing step ST3.

In the second dividing step ST3, the cutting device 40 rotates the plate-like work 1 about the axis by the rotary movement unit 49 so that the second direction 5 of the plate-like work 1 is parallel to the X-axis direction. In the first division step ST2, the cutting device 40 moves the chuck table 43 and the plate along the second direction 5 by using the X-axis moving unit 46, the Y-axis moving unit 50, and the Z-axis moving unit 51 based on the processing content information. The cutting blade 41 is caused to cut into the plate-like work 1 until it reaches the adhesive tape 20 while moving the plate-like work 1 relatively, and as shown in FIG. A plurality of grooves 32 are formed. Thus, the plate-like workpiece 1 is divided into rectangular chips 10-1 having corners 11, 12, 13, and 14 shown in FIG. After forming all the second dividing grooves 32 in the plate-like work 1, the manufacturing method proceeds to the chamfering step ST4.

(Chamfering step)
7 is a plan view showing a first chamfering step of the chamfering step of the manufacturing method shown in FIG. 3. FIG. 8 is a plan view showing a second chamfering step of the chamfering step of the manufacturing method shown in FIG. 3. FIG.

In the chamfering step ST4, the axis 52 of the spindle 42 is positioned on the imaginary line 16 of the corners 11, 12, 13, 14 of the rectangular chip 10 to be formed, and the plate is chamfered at the intersection of the first dividing groove 31 and the second dividing groove 32. In this step, the chamfered surfaces 15 are formed at the respective corners 11, 12, 13 and 14 of the rectangular chip 10 by cutting the cutting blade 41 from above the workpiece 1 having the shape. The chamfering step ST4 includes a first chamfering step ST41 and a second chamfering step ST42, as shown in FIG.

The first chamfering step ST41 is a step of removing the first corner portion 11 and the second corner portion 12 of the rectangular chip 10 to form the chamfered surface 15 . In the first chamfering step ST41, when removing the first corner portion 11, the cutting device 40 controls each of the moving units 46, 50, 51 and the rotary moving unit 49 so that the cutting device 40 is held on the chuck table 43. The cutting blade 41 of the cutting unit 47 is positioned above the first corner 11 of the rectangular tip 10-1 with respect to the plate-like work 1. As shown in FIG. At this time, the axis 52 of the spindle 42 of the cutting unit 47 is positioned above the imaginary line 16 that bisects the first corner 11 . In the first chamfering step ST41, the cutting device 40 controls the Z-axis moving unit 51 to lower the cutting blade 41, cut the first corner 11 with the cutting blade 41, and form the rectangular chip 10-1. A chamfered surface 15 is formed by removing the first corner 11 .

In the first chamfering step ST41, when removing the second corner portion 12, the cutting device 40 controls each of the moving units 46, 50, 51 and the rotary moving unit 49 to hold the chuck table 43. The cutting blade 41 of the cutting unit 47 is positioned above the second corner 12 of the rectangular tip 10-1 with respect to the plate-shaped work 1. As shown in FIG. At this time, the axis 52 of the spindle 42 of the cutting unit 47 is positioned above the imaginary line 16 that bisects the second corner 12 . In the first chamfering step ST41, the cutting device 40 controls the Z-axis moving unit 51 to lower the cutting blade 41, cut the second corner 12 with the cutting blade 41, and cut the rectangular chip 10-1. A chamfered surface 15 is formed by removing the second corner 12 of the .

In the first embodiment, in the first chamfering step ST41, the cutting device 40 controls the rotary movement unit 49 to adjust the orientation of the chuck table 43 so that the virtual line 16 is perpendicular to the X-axis direction, and each movement unit By controlling 46, 50, 51, as indicated by the arrow in FIG. 7, rectangular chips 10-1 arranged in the second direction 5 from one end side to the other end side in the second direction 5 are selected. After removing the first corners 11 of the rectangular chips 10 in order and removing the second corners 12 of the rectangular chips 10 from the other end side to the one end side in the second direction 5 in order, the chips are arranged in the second direction 5 . Similarly, the first corners 11 and the second corners 12 of the rectangular chips 10 in the row are removed. After removing the first corners 11 and the second corners 12 of all the rectangular chips 10-1 to form the rectangular chips 10-2, the manufacturing method proceeds to the second chamfering step ST42.

The second chamfering step ST42 is a step of removing the third corner portion 13 and the fourth corner portion 14 of the rectangular chip 10 to form the chamfered surface 15 . In the second chamfering step ST42, when removing the third corner portion 13, the cutting device 40 controls each of the moving units 46, 50, 51 and the rotary moving unit 49 to hold the chuck table 43. The cutting blade 41 of the cutting unit 47 is positioned above the third corner 13 of the rectangular tip 10-2 with respect to the plate-like work 1. As shown in FIG. At this time, the axis 52 of the spindle 42 of the cutting unit 47 is positioned above the imaginary line 16 that bisects the third corner 13 . In the second chamfering step ST42, the cutting device 40 controls the Z-axis moving unit 51 to lower the cutting blade 41, cut the third corner 13 with the cutting blade 41, and form the rectangular tip 10-2. A chamfered surface 15 is formed by removing the third corner 13 .

In the second chamfering step ST42, when removing the fourth corner portion 14, the cutting device 40 controls the moving units 46, 50, 51 and the rotary moving unit 49 so that the cutting device 40 is held on the chuck table 43. The cutting blade 41 of the cutting unit 47 is positioned above the fourth corner 14 of the rectangular tip 10-2 with respect to the plate-like work 1. As shown in FIG. At this time, the axis 52 of the spindle 42 of the cutting unit 47 is positioned above the imaginary line 16 that bisects the fourth corner 14 . In the second chamfering step ST42, the cutting device 40 controls the Z-axis moving unit 51 to lower the cutting blade 41, cut the fourth corner 14 with the cutting blade 41, and cut the rectangular chip 10-2. A fourth corner 14 of is removed to form a chamfered surface 15 .

In the first embodiment, in the second chamfering step ST42, the cutting device 40 controls the rotary movement unit 49 to rotate the chuck table 43 by 90 degrees after the first chamfering step ST41 so that the imaginary line 16 is aligned with the X-axis direction. By adjusting the orientation of the chuck table 43 in the orthogonal direction and controlling each of the moving units 46 , 50 , 51 , one of the plurality of rectangular chips 10 arranged in the first direction 4 is moved from one end side in the first direction 4 to the other. The third corner 13 of the rectangular chip 10 on the end side is removed in order, and the fourth corner 14 of the rectangular chip 10 on the one end side is removed in order from the other end side in the first direction 4, and then the first corner is removed. Similarly, the third corners 13 and the fourth corners 14 of the rectangular chips 10 in another row aligned in the direction 4 are removed. When the third corners 13 and the fourth corners 14 of all the rectangular chips 10-2 are removed to form the rectangular chips 10, the manufacturing method proceeds to the removal step ST5. 7 and 8 show the first dividing groove 31 and the second dividing groove 32 by shading.

(removal step)
The removing step ST5 is a step of removing each rectangular chip 10 from the adhesive tape 20 after performing the first dividing step ST2, the second dividing step ST3, and the chamfering step ST4.

In the first embodiment, in the removing step ST5, the adhesive layer of the adhesive tape 20 is irradiated with ultraviolet rays to harden the adhesive layer and reduce the adhesive strength of the adhesive layer. In the first embodiment, in the removing step ST5, the rectangular chip 10 attached to the adhesive tape 20 is removed from the adhesive tape 20 using a picker (not shown). The manufacturing method ends when all the rectangular chips 10 are removed from the adhesive tape 20 .

In the conventional manufacturing method shown in FIGS. 9, 10, 11 and 12, after forming the first dividing groove 31 as shown in FIG. 9 with a cutting device 40, as shown in FIG. A groove 32 is formed. After that, according to the conventional manufacturing method, the cutting blade 41 is applied to the plate-like workpiece 1 along the third direction 6 parallel to the chamfered surface 15 of the first corner 11 and the chamfered surface 15 of the second corner 12 . is moved, the cutting blade 41 is cut into the plate-like work 1 to form the third dividing groove 33 as shown in FIG.

In the conventional manufacturing method, the cutting blade 41 is moved with respect to the plate-like workpiece 1 along the fourth direction 7 parallel to the chamfered surface 15 of the third corner 13 and the chamfered surface 15 of the fourth corner 14. As shown in FIG. 12, the cutting blade 41 is cut into the plate-like work 1 to form the fourth dividing grooves 34 to divide the plate-like work 1 into individual rectangular chips 10 . As described above, in the conventional manufacturing method, since the third dividing grooves 33 and the fourth dividing grooves 34 are formed in about half of the rectangular chips 10-1, the number of rectangular chips 10 that can be manufactured from the plate-shaped workpiece 1 is decreases.

Note that FIG. 9 is a plan view of a main part of the plate-like work after the first dividing grooves are formed in the conventional manufacturing method. FIG. 10 is a plan view of the main part of the plate-shaped workpiece after the second dividing grooves are formed in the conventional manufacturing method. FIG. 11 is a plan view of the main part of the plate-shaped workpiece after the third dividing grooves are formed in the conventional manufacturing method. FIG. 12 is a plan view of a main part of the plate-like work after forming the fourth dividing groove in the conventional manufacturing method. In addition, in FIGS. 9, 10, 11 and 12, the same reference numerals are assigned to the same parts as in the first embodiment, and the description thereof is omitted. 9, 10, 11 and 12 show the first dividing groove 31, the second dividing groove 32, the third dividing groove 33 and the fourth dividing groove 34 by shading.

In the processing method according to the first embodiment described above, after dividing the plate-like work 1 into rectangles in the first dividing step ST2 and the second dividing step ST3, in the chamfering step ST4, a cutting blade is cut from above the plate-like work 1. 41 is cut to form the chamfered surface 15, the number of rectangular chips 10 obtained from one plate-shaped workpiece 1 is reduced compared to the conventional manufacturing method shown in FIGS. can be increased. As a result, the manufacturing method according to the first embodiment has the effect of suppressing a decrease in the number of rectangular chips 10 obtained from one plate-like workpiece 1 .

Further, in the manufacturing method according to the first embodiment, the plate-like work 1 is disposed on the adhesive tape 20 and the first dividing step ST2, the second dividing step ST3 and the chamfering step ST4 are performed. Compared to the case where the chamfered surfaces 15 are formed after dividing into individual rectangular chips 10, the handling and operation of the plate-like workpiece 1 and rectangular chips 10 are facilitated.

In addition, this invention is not limited to the said embodiment. That is, various modifications can be made without departing from the gist of the present invention.

REFERENCE SIGNS LIST 1 plate-like work 4 first direction 5 second direction 10 rectangular chip 11 first corner (corner)
12 second corner (corner)
13 third corner (corner)
14 fourth corner (corner)
15 chamfered surface (chamfer)
20 Adhesive tape (support member)
31 First division groove 32 Second division groove 41 Cutting blade 42 Spindle ST1 Installation step ST2 First division step ST3 Second division step ST4 Chamfering step ST5 Removal step

Claims (2)

A manufacturing method for forming rectangular chips with chamfered corners by dividing a plate-shaped work,
a first dividing step of cutting the plate-shaped work in a first direction with a cutting blade provided at the tip of the spindle to form a first dividing groove;
a second dividing step of cutting the plate-shaped work with the cutting blade in a second direction orthogonal to the first direction to form a second dividing groove;
The axis of the spindle is positioned above the bisector that bisects the angle formed by the corners of the rectangular chip divided by the first division step and the second division step and having corners. A cutting blade is lowered from above the plate-shaped work at the intersection of the first dividing groove and the second dividing groove to cut the corners and chamfer the corners of the rectangular chip. a step;
manufacturing method with an arrangement step of arranging the plate-shaped workpiece on the support member before performing the first division step, the second division step, and the chamfering step;
a removing step of removing the individual rectangular chips from the support member after performing the first dividing step, the second dividing step and the chamfering step;
The manufacturing method of claim 1, further comprising:

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