JP7315648B2 - SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD AND ROLL SPONGE FOR SUBSTRATE CLEANING APPARATUS - Google Patents

Description

The present disclosure relates to a substrate cleaning apparatus, a substrate cleaning method, and a roll sponge for the substrate cleaning apparatus.

A substrate polishing apparatus first polishes a substrate and then cleans the substrate. A roll sponge, for example, is used for substrate cleaning. A substrate cleaning device included in a conventional substrate polishing device cannot necessarily clean the substrate effectively.

JP 2009-246190 A JP 2009-267368 A

In view of such problems, a substrate cleaning apparatus and a substrate cleaning method capable of effectively cleaning a substrate, and a roll sponge for the substrate cleaning apparatus are provided.

According to one aspect of the present disclosure, there is provided a substrate cleaning apparatus including a substrate holding section that holds a substrate, and a nozzle cleaning liquid supply section that supplies cleaning liquid to the held substrate at an irradiation angle of 5 degrees or more and less than 30 degrees.
The substrate can be effectively cleaned by supplying the cleaning liquid to the substrate at an appropriate irradiation angle.

According to another aspect of the present disclosure, there is provided a substrate cleaning apparatus that includes a substrate holding part that holds a substrate and a nozzle that supplies cleaning liquid to the held substrate, wherein the ratio Fy/Fx of the force component Fx in the direction parallel to the substrate and the force component Fy in the direction perpendicular to the substrate of the force applied to the substrate by the cleaning liquid when supplying the cleaning liquid is 0.0875 or more and less than 0.577.
The substrate can be effectively cleaned by supplying the cleaning liquid to the substrate at an appropriate irradiation angle.

According to another aspect of the present disclosure, a substrate holding part that holds a substrate, a cleaning part that is in contact with at least a central portion of the held substrate and cleans the substrate, and one or more nozzles that supply a cleaning liquid to a part of the held substrate are provided. When the cleaning part is in contact with the substrate and the substrate is cleaned, the at least one nozzle supplies the cleaning liquid to a position different from the cleaning part on the substrate, and the substrate is rinsed without the cleaning part coming into contact with the substrate. A substrate cleaning apparatus is provided wherein at least one said nozzle supplies cleaning liquid to at least a central portion of said substrate.
As a result, even the central portion of the substrate can be effectively cleaned.

It is desirable to provide a nozzle control unit for adjusting the supply position of the cleaning liquid by at least one of the nozzles.
As a result, the cleaning liquid can be supplied to a position different from the cleaning portion on the substrate during cleaning, and to the central portion of the substrate during rinsing.

It is preferable that the nozzle control unit moves the supply position of the cleaning liquid from the central portion of the substrate to the outer periphery when the substrate is rinsed without the cleaning unit contacting the substrate.
As a result, the cleaning liquid can be efficiently discharged to the outside of the substrate.

According to another aspect of the present disclosure, there is provided a substrate cleaning apparatus that includes a substrate holding portion that holds a substrate, a first nozzle that supplies cleaning liquid to the held substrate, and a second nozzle that supplies cleaning liquid to the held substrate, wherein the first nozzle and the second nozzle do not supply cleaning liquid to the substrate at the same time.
As a result, the cleaning liquid from the first nozzle and the cleaning liquid from the second nozzle are prevented from being mixed, and the substrate W can be cleaned effectively.

It is preferable that a cleaning unit that comes into contact with at least a central portion of the held substrate and cleans the substrate is provided, wherein the first nozzle supplies cleaning liquid to at least the central portion of the substrate, and the second nozzle supplies cleaning liquid to a position on the substrate different from that of the cleaning unit.
As a result, even the central portion of the substrate can be effectively cleaned.

According to another aspect of the present disclosure, a substrate cleaning apparatus is provided that includes a substrate holding part that holds a substrate, and a nozzle that unsteadily supplies cleaning liquid to the held substrate.
By unsteadily supplying the cleaning liquid, pressure fluctuations can be applied to the substrate, and the substrate can be effectively cleaned.

The nozzle may intermittently supply the cleaning liquid, or may vary the supply amount of the cleaning liquid.

According to another aspect of the present disclosure, there is provided a substrate cleaning method comprising: bringing a cleaning unit into contact with at least a central portion of a substrate; cleaning the substrate with the cleaning unit while supplying cleaning liquid to a position on the substrate different from that of the cleaning unit; separating the cleaning unit from the substrate; and supplying the cleaning liquid to at least a central portion of the substrate.
As a result, even the central portion of the substrate can be effectively cleaned.

According to another aspect of the present disclosure, there is provided a roll sponge for a substrate cleaning apparatus, comprising a cylindrical roll body and a plurality of nodule portions projecting cylindrically outward from the outer peripheral surface thereof, wherein at least a portion of the surface of the plurality of nodule portions lacks a skin layer.
Utilizing the characteristics of the skin layer, the substrate can be effectively cleaned.

1 is a schematic plan view of a substrate processing apparatus provided with a substrate cleaning apparatus according to this embodiment; FIG. 1 is a perspective view schematically showing a substrate cleaning apparatus according to a first embodiment; FIG. FIG. 2 is a cross-sectional view schematically showing a substrate W and foreign matter P adhering to its surface; The graph which shows typically the relationship between irradiation angle (theta) and a removal rate. The perspective view which shows typically the substrate cleaning apparatus which concerns on 2nd Embodiment. FIG. 4 is a perspective view schematically showing supply of a cleaning liquid in a cleaning process; FIG. 4 is a perspective view schematically showing supply of cleaning liquid in a rinsing process; The schematic perspective view of the substrate cleaning apparatus which concerns on 3rd Embodiment. The schematic perspective view of the substrate cleaning apparatus which concerns on 4th Embodiment. The schematic perspective view of the substrate cleaning apparatus which concerns on 5th Embodiment. The schematic perspective view of the substrate cleaning apparatus which concerns on 6th Embodiment. The perspective view which shows typically the substrate cleaning apparatus which concerns on 7th Embodiment. FIG. 4 is a diagram showing cleaning liquid supply timing by nozzles 32a and 32b; FIG. 12 is a diagram schematically showing the supply flow rate of cleaning liquid according to an example of the eighth embodiment; FIG. 12 is a diagram schematically showing the supply flow rate of the cleaning liquid according to another example of the eighth embodiment; FIG. 4 is a diagram showing a first example of a roll sponge 33; FIG. 8 shows a second example of the roll sponge 33; FIG. 8 shows a third example of the roll sponge 33; FIG. 8 is a diagram showing a fourth example of the roll sponge 33; FIG. 4 shows a first example of a pencil sponge 38; FIG. 8 is a diagram showing a second example of a pencil sponge 38; FIG. 8 is a diagram showing a third example of a pencil sponge 38; FIG. 10 is a diagram showing a fourth example of a pencil sponge 38; The figure which shows the 5th example of the pencil sponge 38. FIG. The figure which shows another washing|cleaning part 391. FIG. FIG. 11 is a diagram showing another cleaning unit 392; FIG. 11 is a diagram showing another cleaning unit 393; FIG. 10 is a diagram showing another cleaning unit 394; FIG. 10 is a diagram showing another cleaning unit 395;

Hereinafter, embodiments will be specifically described with reference to the drawings.

FIG. 1 is a schematic plan view of a substrate processing apparatus provided with a substrate cleaning apparatus according to this embodiment. As shown in FIG. 1, this substrate processing apparatus has a substantially rectangular housing 1. The interior of the housing 1 is partitioned into a loading/unloading section 2, a polishing section 3, and a cleaning section 4 by partition walls 1a and 1b. These loading/unloading section 2, polishing section 3, and cleaning section 4 are independently assembled and independently exhausted. The polishing unit 3 polishes the substrate. The cleaning section 4 cleans and dries the polished substrate. The substrate processing apparatus also has a control unit 5 for controlling substrate processing operations.

The loading/unloading section 2 includes two or more (four in this embodiment) front loading sections 20 on which substrate cassettes stocking a large number of substrates (eg, semiconductor wafers) are placed. These front load sections 20 are arranged adjacent to the housing 1 and arranged along the width direction (perpendicular to the longitudinal direction) of the substrate processing apparatus.

In the loading/unloading section 2, a traveling mechanism 21 is laid along the line of the front loading section 20. On the traveling mechanism 21, two transfer robots (loaders) 22 that can move along the arrangement direction of the substrate cassettes are installed. The transfer robot 22 can access the substrate cassette mounted on the front loading section 20 by moving on the travel mechanism 21 . Each transfer robot 22 has two upper and lower hands. The upper hand is used when the processed substrate is returned to the substrate cassette, and the lower hand is used when the substrate before processing is taken out of the substrate cassette, so that the upper and lower hands can be used properly. Furthermore, the lower hand of the transport robot 22 is configured to be able to turn over the substrate by rotating around its axis.

The polishing section 3 is an area where substrate polishing (flattening) is performed, and includes, for example, four substrate polishing apparatuses 3A to 3D arranged in order from the load/unload section 2 side.

The cleaning unit 4 is an area where substrates are cleaned and dried, and is divided into a cleaning chamber 190, a transfer chamber 191, a cleaning chamber 192, a transfer chamber 193, and a drying chamber 194 in order from the opposite side of the loading/unloading unit 2.

Two substrate cleaning apparatuses 201 (only one is shown in FIG. 1) are arranged in the cleaning chamber 190 along the vertical direction. Similarly, disposed within the cleaning chamber 192 are two vertically arranged substrate cleaning apparatuses 202 (only one is shown in FIG. 1). The substrate cleaning apparatuses 201 and 202 are cleaning machines that clean substrates using a cleaning liquid. Since these substrate cleaning apparatuses 201 and 202 are arranged along the vertical direction, they have the advantage of a small footprint area.

Two substrate drying devices 203 (only one is shown in FIG. 1) are arranged in the drying chamber 194 along the longitudinal direction. These two substrate drying devices 203 are isolated from each other. Filter fan units for supplying clean air into the substrate drying device 203 are provided above the substrate drying device 203 .

The substrate processing apparatus may include the controller 5 to control the substrate cleaning apparatuses 201 and 202, or each of the substrate cleaning apparatuses 201 and 202 may include a controller (control device).

Next, a transport mechanism for transporting the substrate will be described. As shown in FIG. 1, a linear transporter 6 is arranged adjacent to the substrate polishing apparatuses 3A and 3B. The linear transporter 6 transports substrates between four transport positions (transport positions TP1 to TP4 in order from the load/unload section 2 side) along the direction in which the substrate polishing apparatuses 3A and 3B are arranged.

A linear transporter 7 is arranged adjacent to the substrate polishing apparatuses 3C and 3D. The linear transporter 7 transports substrates between three transport positions (transport positions TP5 to TP7 in order from the load/unload section 2 side) along the direction in which the substrate polishing apparatuses 3C and 3D are arranged.

The substrate is transported to the substrate polishing apparatuses 3A and 3B by the linear transporter 6. As shown in FIG. Transfer of the substrate to the substrate polishing apparatus 3A is performed at the transfer position TP2. Transfer of the substrate to the polishing apparatus 3B is performed at the transfer position TP3. Transfer of the substrate to the substrate polishing apparatus 3C is performed at the transfer position TP6. Transfer of the substrate to the substrate polishing apparatus 3D is performed at the seventh transfer position TP7.

A lifter 11 for receiving the substrate from the transport robot 22 is arranged at the transport position TP1. The substrate is transferred from the transfer robot 22 to the linear transporter 6 via this lifter 11 . A shutter (not shown) is provided on the partition wall 1a between the lifter 11 and the transport robot 22, and when the substrate is transported, the shutter is opened and the substrate is passed from the transport robot 22 to the lifter 11.

A swing transporter 12 is arranged between the linear transporters 6 and 7 and the cleaning section 4 . The swing transporter 12 has a hand that can move between transport positions TP4 and TP5.

The substrate is transported by the linear transporter 7 to the substrate polishing apparatus 3C and/or the substrate polishing apparatus 3D. Also, the substrate polished by the polishing section 3 is transported to the cleaning section 4 via the swing transporter 12 . On the side of the swing transporter 12, a substrate temporary placement table 180 installed on a frame (not shown) is arranged. The temporary placing table 180 is arranged adjacent to the linear transporter 6 and positioned between the linear transporter 6 and the cleaning section 4, as shown in FIG.

(First embodiment)
The first embodiment relates to a preferable irradiation angle of cleaning liquid to a substrate to be cleaned in a substrate cleaning apparatus.

FIG. 2 is a perspective view schematically showing the substrate cleaning apparatus according to the first embodiment. The substrate cleaning apparatus includes a substrate holding part 31 that holds and rotates a substrate W to be cleaned substantially horizontally, and a nozzle 32 that supplies cleaning liquid to the held substrate W. As shown in FIG. The nozzle 32 is, for example, a single tube nozzle with a diameter of 1 mm, and irradiates a narrow range on the substrate W with the cleaning liquid. The cleaning liquid is pure water, chemical liquid, or the like. In this specification, the angle formed by the substrate surface and the cleaning liquid irradiated from the nozzle 32 is defined as an irradiation angle θ.

First, an appropriate irradiation angle θ is theoretically derived using a simplified model.
FIG. 3 is a cross-sectional view schematically showing the substrate W and foreign matter P adhering to its surface. Here, it is assumed that the foreign matter P is a sphere with a radius of a and that the cleaning liquid is supplied at an irradiation angle θ. In this case, it can be considered that the force F caused by the cleaning liquid acts on the hemisphere of the foreign matter P on the nozzle 32 side. The larger the moment M about the point of contact A between the substrate W and the foreign matter P, the more the foreign matter P can be removed. This moment M can be derived as follows.

On the way, we considered that Fx=Fcos θ and Fy=Fsin θ. As a result, the moment M is proportional to cos θ. That is, it was found that the smaller the irradiation angle θ, the more the foreign matter P could be removed.

Next, an appropriate illumination angle θ is considered experimentally. An experiment was conducted in which the substrate W was contaminated, the cleaning liquid was supplied to the center of the substrate W at various irradiation angles θ, and the foreign matter removal rate was measured.

FIG. 4 is a graph schematically showing the relationship between the irradiation angle θ and the removal rate. As shown, in the range of θ=15 to 40 degrees, the larger the irradiation angle θ, the lower the removal rate. This agrees with the results derived using FIG. When the irradiation angle .theta. exceeds 40 degrees, the removal rate becomes almost constant, presumably because the fluid force of the cleaning liquid becomes constant. In any case, when the irradiation angle .theta.

On the other hand, when the irradiation angle .theta. is 10 degrees or less, the removal rate decreases as the irradiation angle .theta. decreases. This is probably because when the irradiation angle θ is too small, the supplied cleaning liquid branches (so-called liquid threads) on the substrate W, and the amount of the cleaning liquid reaching the foreign matter is reduced. In addition, due to mechanical restrictions of the nozzle 32, it is difficult to make the irradiation angle θ too small.

From the above, the irradiation angle θ is preferably 5 degrees or more and less than 40 degrees, more preferably 5 degrees or more and less than 30 degrees.

Here, the force component Fx in the horizontal direction (precisely, the direction parallel to the substrate W) and the force component Fy in the same vertical direction (precisely, the direction perpendicular to the substrate W) applied by the cleaning liquid to the substrate W, and the irradiation angle θ satisfy the following relationship.
tan θ=Fy/Fx

Therefore, in other words, the preferable irradiation angle θ described above, the range of the ratio Fy/Fx of the vertical force Fy to the horizontal force Fx is preferably 0.0875 (=tan5) or more and less than 0.839 (=tan40), and more preferably 0.0875 (=tan5) or more and less than 0.577 (=tan30).

As described above, in the first embodiment, since the irradiation angle θ of the cleaning liquid is set to an appropriate value, the substrate W can be cleaned effectively. The concept of the present embodiment can be applied regardless of the specific configuration of the substrate cleaning apparatus, and for example, the substrate W may be held vertically. Also, the nozzle 32 may supply the cleaning liquid to the lower surface of the substrate W instead of the upper surface.

(Second embodiment)
A second embodiment to be described next relates to the position at which the cleaning liquid is supplied by the nozzle 32 in a substrate cleaning apparatus that cleans the substrate using a cleaning unit such as a roll sponge.

FIG. 5 is a perspective view schematically showing a substrate cleaning apparatus according to the second embodiment. The substrate cleaning apparatus includes a substrate holding portion 31 and one or more nozzles 32, as well as a roll sponge 33 as a cleaning portion. The roll sponge 33 extends horizontally and contacts at least the central portion of the upper surface of the held substrate W to clean the substrate W. As shown in FIG.

The substrate cleaning apparatus first brings the roll sponge 33 into contact with the substrate W, and in this state, supplies cleaning liquid from the nozzle 32 to the upper surface of the substrate W to clean the substrate W (hereinafter referred to as a cleaning process). Next, the substrate cleaning apparatus separates the roll sponge 33 from the substrate W, and rinses the substrate W by supplying cleaning liquid from the nozzle 32 in this state (hereinafter referred to as a rinsing step).

Here, the roll sponge 33 is in contact with the center of the substrate W in the cleaning process. Therefore, the nozzle 32 supplies the cleaning liquid to a position shifted from the center of the substrate W so that the cleaning liquid does not collide with the roll sponge 33 . That is, the cleaning liquid is not supplied to the center of the substrate W much in the cleaning process.

If the nozzle 32 were to supply the cleaning liquid to a position deviated from the center of the substrate W in the subsequent rinsing process as well, cleaning of the center of the substrate W would be insufficient.

Therefore, in this embodiment, in the cleaning process, the nozzle 32 supplies the cleaning liquid to a position shifted from the center of the substrate W, that is, a position different from the roll sponge 33 (see FIG. 6). After the roll sponge 33 is separated from the substrate W, the nozzle 32 supplies the cleaning liquid to a position including the central portion of the substrate W in the rinse step (see FIG. 7). As a result, the central portion of the substrate W can also be cleaned effectively.

Various methods for switching the supply position of the cleaning liquid are conceivable. For example, one nozzle 32 may be provided and the position at which the cleaning liquid is supplied by the nozzle 32 may be adjusted. A specific method thereof will be described in third to sixth embodiments.

As another example, two or more nozzles 32 (for example, a single tube nozzle and a fan-shaped nozzle that sprays the cleaning liquid in a spray form) may be provided, one nozzle 32 may supply the cleaning liquid to a position shifted from the center of the substrate W in the cleaning process, and another nozzle 32 may supply the cleaning liquid to a position including the center of the substrate W in the rinsing process.

Alternatively, two or more nozzles 32 may be provided, and the position at which the cleaning liquid is supplied by one or more of the nozzles 32 may be adjusted.

Thus, in the second embodiment, the cleaning liquid is supplied to a different position from the roll sponge 33 in the cleaning process using the roll sponge 33, and to the central portion of the substrate W in the rinsing process not using the roll sponge 33. Therefore, the central portion of the substrate W can also be effectively cleaned.

The preferred range of the irradiation angle θ from the nozzle 32 is as described in the first embodiment. The concept of the present embodiment can be applied regardless of the specific configuration of the substrate cleaning apparatus. For example, a roll sponge for cleaning the bottom surface of the substrate W and a nozzle for supplying cleaning liquid to the bottom surface of the substrate W may be provided. Alternatively, the substrate W may be held vertically.

(Third Embodiment)
In the second embodiment, it has been stated that the nozzle 32 supply position of the cleaning liquid may be adjusted. Third to sixth embodiments described below show specific configuration examples for adjusting the supply position of the cleaning liquid.

FIG. 8 is a schematic perspective view of a substrate cleaning apparatus according to the third embodiment. The substrate cleaning apparatus includes four substrate holders 31, nozzles 32, roll sponges 33a and 33b that contact the upper and lower surfaces of the substrate W, rotation mechanisms 34a and 34b that rotate the roll sponges 33a and 33b, guide rails 35, an elevating mechanism 36, and a nozzle control unit 60 that adjusts the position (supply direction) of the cleaning liquid supplied by the nozzles 32. Although only the nozzle 32 that supplies the cleaning liquid to the upper surface of the substrate W held by the substrate holding section 31 and the corresponding nozzle control section 60 are illustrated, the nozzle that supplies the cleaning liquid to the lower surface of the substrate W and the corresponding nozzle control section may be further provided.

The substrate holding portion 31 is, for example, a roller, and has a two-stage structure of a holding portion 311 and a shoulder portion (support portion) 312 . The diameter of the shoulder 312 is larger than the diameter of the retainer 311 and the retainer 311 is formed on the shoulder 312 . At least some of the four substrate holders 31 (for example, two adjacent ones) are movable in directions of approaching and separating from each other by a drive mechanism (for example, an air cylinder).

The rotating mechanism 34a rotates the upper roll sponge 33a. The rotating mechanism 34 a is attached to a guide rail 35 that guides its vertical movement, and is supported by a lifting mechanism 36 . The rotating mechanism 34a and the upper roll sponge 33a are vertically moved by an elevating mechanism 36. As shown in FIG.

Although not shown, a rotating mechanism 34b for rotating the lower roll sponge 33b is also attached to the guide rail, and the rotating mechanism 34b and the lower roll sponge 33b are moved vertically by an elevating mechanism (not shown).
As the elevating mechanism 36, for example, a motor drive mechanism using a ball screw or an air cylinder is used.

The lift mechanism 36 moves the roll sponges 33a and 33b as follows.
When the substrate W is carried in and out, the roll sponges 33a and 33b are separated from each other. That is, the roll sponge 33a is in an elevated state, and the roll sponge 33b is in a lowered state.

In the cleaning step, the roll sponge 33a descends and the roll sponge 33b ascends. Thereby, the roll sponge 33a contacts the upper surface of the substrate W, and the roll sponge 33b contacts the lower surface of the substrate W. As shown in FIG.

In the rinsing step, the roll sponge 33a is raised and the roll sponge 33b is lowered. As a result, the roll sponges 33a and 33b are separated from the substrate W. As shown in FIG.

The nozzle control unit 60 controls where on the substrate W the nozzle 32 supplies the cleaning liquid. Specifically, in the cleaning process, the nozzle control unit 60 controls the nozzle 32 so that the cleaning liquid is supplied to a position different from the roll sponge 33a (a position shifted from the center of the substrate W). In the rinsing process, the nozzle control unit 60 controls the nozzle 32 so that the cleaning liquid is supplied from the nozzle 32 to the central portion of the substrate W. FIG. It can also be said that the nozzle control unit 60 controls the irradiation direction of the cleaning liquid by the nozzle 32 .

Specifically, the nozzle control section 60 has a tube 61 , a disc 62 , a motor 63 , a shaft 64 , a guide 65 and a fixture 66 .

The tube 61 communicates with the nozzle 32 and guides the cleaning liquid to the nozzle 32 . One end of the shaft 64 is fixed to the terminal end of the disk 62 rotated by the motor 63 and the other end is fixed to the distal end of the nozzle 32 . The guide 65 has an elongated opening into which the distal end of the nozzle 32 fits. An opening is formed in the fixture 66, and the nozzle 32 passes through this opening.

As the motor 63 rotates the disk 62, the shaft 64 moves. The nozzle 32 fixed to the shaft 64 moves up and down along the opening of the guide 65, and as a result, the angle of the nozzle 32 changes with the fixture 66 as the axis. Thereby, the irradiation direction of the cleaning liquid is controlled.

(Fourth embodiment)
A fourth embodiment described below differs from the third embodiment in the configuration of the nozzle control section. The nozzle control section will be described below.

FIG. 9 is a schematic perspective view of a substrate cleaning apparatus according to a fourth embodiment. The nozzle control section 70 shown in the figure has a cam 71 , a motor 72 , a shaft 73 , a roller 74 , a guide 75 and a fixture 76 .

One end of shaft 73 is connected to cam 71 rotated by motor 72 via roller 74 , and the other end is fixed to the distal end of nozzle 32 . The guide 75 has an elongated opening into which the distal end of the nozzle 32 fits. The fixture 76 has an opening through which the nozzle 32 passes.

As the motor 72 rotates the cam 71 , the roller 74 moves along the shape of the cam 71 . As a result, the shaft 73 moves up and down, and the nozzle 32 fixed to the shaft 73 moves up and down along the opening of the guide 75 . As a result, the angle of the nozzle 32 changes with the fixture 76 as the axis. Thereby, the irradiation direction of the cleaning liquid is controlled.

(Fifth embodiment)
A fifth embodiment described below differs from the third embodiment in the configuration of the nozzle control section. The nozzle control section will be described below.

FIG. 10 is a schematic perspective view of a substrate cleaning apparatus according to the fifth embodiment. A nozzle control unit 80 shown in the figure has a disc 81 , a motor 82 and a shaft 83 . It should be noted that a cam may be used instead of the disc 81 .

One end of the shaft 83 is connected to the disk 81 rotated by the motor 82 and the other end is fixed to the tip side of the nozzle 32 . Rotation of the disk 81 by the motor 82 changes the position of the shaft 83 connected to the tip of the nozzle 32 . Thereby, the irradiation direction of the cleaning liquid is controlled.

(Sixth embodiment)
A sixth embodiment described below differs from the third embodiment in the configuration of the nozzle control section. The nozzle control section will be described below.

FIG. 11 is a schematic perspective view of a substrate cleaning apparatus according to the sixth embodiment. A nozzle control unit 90 in the figure has a robot arm 91 and a holder 92 .

The robot arm 91 is rotatable around a rotating shaft 911 and has a holder 92 attached to its tip. A holder 92 holds the nozzle 32 . Rotation of the robot arm 91 changes the direction of the nozzle 32 held by the holder 92 . Thereby, the irradiation direction of the cleaning liquid is controlled.

Although several nozzle control units have been exemplified above, it goes without saying that various modifications can be conceived. For example, the nozzle control unit may include an elevating mechanism that elevates the nozzle 32 (or a member that supports the nozzle 32) so that the nozzle 32 can be moved vertically. Alternatively, the nozzle control section may include a swinging mechanism for swinging the nozzle 32 (or a member supporting the nozzle 32) in the horizontal plane. In this case, in the rinsing process, the cleaning liquid may be discharged more effectively by moving the cleaning liquid supply position from the central portion of the substrate W to the outer peripheral portion thereof.
In any case, it is desirable that the nozzle control section be configured so as to be able to supply the cleaning liquid not only to the central portion of the substrate W but also to other positions.

As another configuration example, an arm may be attached to a post and one or more nozzles may be mounted on the arm. A pen cleaning mechanism may be provided on the arm. Further, the nozzle may be a single tube nozzle, a fan-shaped nozzle, a two-fluid jet nozzle, a three-fluid jet nozzle, or the like, and any combination thereof is also possible. Further, the nozzle may be translatable in the horizontal plane by the nozzle control, vertically by the action of the strut, or may be moved in a trajectory through the center (or off-center) of the substrate by rotating about the strut. If multiple nozzles are provided, only one of them may move on a center trajectory and the others on off-center trajectories. Also, the cleaning liquid irradiation angle from the nozzle may be adjustable, and the appropriate angle is as described in the first embodiment.

A plurality of nozzles may supply the same chemical liquid, or may supply different chemical liquids. The chemical may be alkaline, acidic, or neutral, and may be pure water, pure water mixed with gas, functional water, or pure water mixed with a small amount of chemical.

(Seventh embodiment)
A seventh embodiment described below relates to the supply timing of the cleaning liquid by each nozzle 32 in a substrate cleaning apparatus having a plurality of nozzles 32 . The following description focuses on differences from the first embodiment.

FIG. 12 is a perspective view schematically showing a substrate cleaning apparatus according to the seventh embodiment. The substrate cleaning apparatus has a substrate holder 31 and two nozzles 32a and 32b. As an example, the nozzle 32a is a single tube nozzle and the nozzle 32b is a fan nozzle. Alternatively, the nozzles 32a and 32b may be nozzles that eject multiple fluids. Alternatively, one nozzle 32a may supply the cleaning liquid to the central portion of the substrate W, and the other nozzle 32b may supply the cleaning liquid to the substrate W other than the central portion (for example, the peripheral portion). The cleaning liquid from nozzle 32a may be the same as or different from the cleaning liquid from nozzle 32b.

If the cleaning liquid is supplied from the two nozzles 32a and 32b at the same time, the cleaning effect may be reduced in the area on the substrate W where the cleaning liquid from the nozzle 32a and the cleaning liquid from the nozzle 32b are mixed.

Therefore, in this embodiment, as shown in FIG. 13, the nozzles 32a and 32b are prevented from supplying the cleaning liquid to the substrate W at the same time. More specifically, the nozzle 32a supplies the cleaning liquid to the substrate W first. After stopping the supply of the cleaning liquid from the nozzle 32a, the nozzle 32b supplies the substrate W with the cleaning liquid. Thereafter, after stopping the supply of the cleaning liquid from the nozzle 32b, the nozzle 32a supplies the substrate W with the cleaning liquid. Of course, there may be a period during which both nozzles 32a and 32b do not supply cleaning liquid.

Thus, in the seventh embodiment, the nozzles 32a and 32b exclusively supply the cleaning liquid to the substrate W, so the substrate W can be cleaned effectively. Even if three or more nozzles are provided, it is sufficient that these nozzles supply the cleaning liquid to the substrate W exclusively.

(Eighth embodiment)
An eighth embodiment, which will be described next, unsteadily supplies cleaning liquid from the nozzle 32 . The configuration of the substrate cleaning apparatus is the same as that shown in FIG.

FIG. 14 is a diagram schematically showing the supply flow rate of cleaning liquid according to an example of the eighth embodiment. In this example, the nozzle 32 intermittently supplies cleaning liquid. For example, the nozzle 32 supplies cleaning liquid during periods T1, T3, and T5, and does not supply cleaning liquid during periods T2 and T4 therebetween. That is, the period of supplying the cleaning liquid and the period of not supplying the cleaning liquid are alternately repeated.

The film of the cleaning liquid disappears from the substrate W during the periods T2 and T4 in which the cleaning liquid is not supplied. In such a state, the cleaning effect is improved by rapidly supplying the cleaning liquid (periods T3 and T5) to give a shock (pressure fluctuation) to the substrate W. FIG.

Such control is realized, for example, by opening and closing an electromagnetic valve at the root of the nozzle 32 .

FIG. 15 is a diagram schematically showing the supply flow rate of cleaning liquid according to another example of the eighth embodiment. In this example, the nozzle 32 varies the amount of cleaning liquid supplied. For example, the nozzle 32 gradually reduces the supply amount of the cleaning liquid in the period T11, sharply increases the supply amount in the subsequent period T12, keeps the supply amount substantially constant in the subsequent period T13, and sharply reduces the supply amount in the subsequent period T14. In other words, the supply amount of the cleaning liquid may gradually decrease/increase, rapidly decrease/increase, or be substantially constant.

Also in such a mode, a shock can be given to the substrate W particularly during a period in which the supply amount of the cleaning liquid is rapidly increased, and the cleaning effect is improved.

Such control is realized, for example, by adjusting the pressure applied to the supply tank located at the base of the nozzle 32 using a regulator.

As described above, in the eighth embodiment, since the cleaning liquid is unsteadily supplied from the nozzle to one substrate W, the cleaning power is improved.

(Ninth embodiment)
A ninth embodiment described below relates to the surface material of the roll sponge 33 .

When the roll sponge 33 is manufactured by molding a resin such as polyvinyl alcohol (PVA), a surface layer portion (hereinafter referred to as a skin layer) that is in contact with the mold during molding and an inner lower layer portion are formed. The fact that there is no skin layer and the lower layer is exposed is also called lack of skin layer.

The skin layer is a hard layer having a thickness of about 1 to 10 μm and a small pore diameter of several μm to several tens of μm. Therefore, although it is easy to retain the cleaning liquid, the surface of the substrate may be damaged during cleaning.

On the other hand, the lower layer without the skin layer has large pore diameters of 10 μm to several hundred μm and is a soft layer. Therefore, it is easy to fit on the surface of the substrate, and the surface of the substrate is less likely to be damaged. In addition, the cleaning liquid can easily enter and exit, and can easily flow out.

In consideration of the above characteristics, it is desirable to design which part of the roll sponge 33 is to be the skin layer and which part is to have no skin layer. Various specific modes are conceivable.

FIG. 16 is a diagram showing a first example of the roll sponge 33. FIG. 1(a) is a longitudinal side view of the roll sponge 33a, and FIG. 1(b) is a side view of FIG. 1(a). In Figure 16 and subsequent figures, the spotted areas indicate the absence of the skin layer. The roll sponge 33 has a cylindrical roll body 331 and a plurality of nodule portions 332 projecting outward from the outer peripheral surface of the roll body 331 in a cylindrical shape. As shown, only both sides of the roll body 331 may lack skin layers. That is, the roll body 331 may be covered with the skin layer except for both side surfaces.

FIG. 17 is a diagram showing a second example of the roll sponge 33. As shown in FIG. As illustrated, only the surface of the roll body 331 and the side surface of the nodule portion 332 may lack the skin layer. That is, the side surface of the roll body 331 and the tip of the nodule portion 332 may be covered with the skin layer.

FIG. 18 is a diagram showing a third example of the roll sponge 33. As shown in FIG. As shown, only the tip of the nodule portion 332 may lack the skin layer. That is, the side surfaces of the roll body 331 and the nodule portion 332 may be covered with a skin layer.

FIG. 19 is a diagram showing a fourth example of the roll sponge 33. As shown in FIG. As shown, only the tips of some nodule portions 332 may lack the skin layer. That is, the nodule portions 332 and the roll main body 331 other than the tips of these nodule portions 332 may be covered with a skin layer.

In addition, all surfaces of the roll sponge 33 may be covered with the skin layer, or all surfaces may lack the skin layer. In addition, any two or more aspects of the exemplified roll sponge 33 may be combined, and the skin layer may be absent or covered with a skin layer on the surface, the side surface of the roll body 331, the side surface of the nodule portion 332 and/or the tip of the nodule portion 332 partially or entirely.

(Tenth embodiment)
A tenth embodiment to be described next relates to a cleaning portion having a shape other than the roll sponge 33. FIG. First, the case where the cleaning unit is a pencil sponge that cleans while contacting and rotating a portion including the center of the substrate W will be described.

FIG. 20 shows a first example of the pencil sponge 38. FIG. The pencil sponge 38 in the figure is cylindrical, and its lower surface is the cleaning surface. As shown, only the sides may lack skin layers. That is, the top and bottom surfaces may be covered with skin layers.

FIG. 21 shows a second example of the pencil sponge 38. As shown in FIG. As shown, only the side and bottom surfaces may lack skin layers. That is, the top surface may be covered with a skin layer.

FIG. 22 shows a third example of the pencil sponge 38. FIG. As shown, only the top surface may lack the skin layer. That is, the side and bottom surfaces may be covered with a skin layer.

FIG. 23 shows a fourth example of the pencil sponge 38. FIG. As shown, only the bottom surface may lack the skin layer. That is, the sides and top may be covered with a skin layer.

FIG. 24 shows a fifth example of the pencil sponge 38. FIG. The pencil sponge 38 shown in FIG. Only the lower surface of the nodule portion 381 may be covered with the skin layer, the entire surface of the nodule portion 381 may lack the skin layer, only the side surface of the nodule portion 381 may lack the skin layer, only the tip of the nodule portion 381 may lack the skin layer, or only the tip of some of the nodule portions 381 may lack the skin layer. Alternatively, any of the nodule portions 381 described above may be added to the pencil sponge 38 shown in FIGS. 20-23, respectively.

In addition, the entire surface may be covered with the skin layer, or the entire surface may lack the skin layer.

FIG. 25 is a diagram showing another cleaning unit 391. As shown in FIG. The cleaning portion 391 has a circular brush 391b attached substantially in the center of a base portion 391a, and four brushes 391c arranged at equal intervals and extending along the radial direction, and the lower surfaces of these brushes are cleaning surfaces. Part or all of the base portion 391a, brushes 391b and/or brushes 391c may be devoid of skin layers, or both cleaning surfaces may be covered with skin layers.

FIG. 26 is a diagram showing another cleaning section 392. As shown in FIG. The cleaning section 392 has a cross-shaped brush 392b attached to a base section 392a, and its lower surface is a cleaning surface. The central portion of the brush 392b is open, and cleaning liquid may be supplied through this opening. Part or all of the base portion 392a and/or the brush 392b may lack the skin layer or may be covered with the skin layer.

FIG. 27 is a diagram showing another cleaning unit 393. As shown in FIG. The cleaning portion 393 has a sponge portion 393b and a brush portion 393c formed in a part of a scrubbing member 393a. Some or all of the scrubbing member 393a, the sponge portion 393b and/or the brush portion 393c may lack the skin layer or may be covered with the skin layer.

FIG. 28 is a diagram showing another cleaning section 394. As shown in FIG. This cleaning portion 394 has protrusions 394b and 394c formed on a sheet 394a. The protrusion 394b extends in a ridge form from the vicinity of the center of the sheet 394a to the outer periphery, and the protrusion 394c extends in a ridge form from the outer peripheral side of the protrusion 394b to the outer periphery of the sheet 394a. Some or all of the protrusions 394b and/or protrusions 394c may lack the skin layer or may be covered with the skin layer.

FIG. 29 is a diagram showing another cleaning unit 395. As shown in FIG. The cleaning section 395 has a base 395a and a brush 395b attached to the lower surface thereof. Some or all of the brush 395b may lack the skin layer, or may be covered with the skin layer.

You may combine each embodiment mentioned above arbitrarily. In addition to the substrate processing apparatus shown in FIG. 1, the substrate cleaning apparatus described above can also be applied to a bevel polishing apparatus that polishes the bevel of a substrate, a back surface polishing apparatus that polishes the back surface, a partial polishing apparatus that performs partial polishing, and can also be applied to a cleaning apparatus for an exposure apparatus.

The operations in each embodiment can also be performed using the following software/system. The software/system consists of, for example, a main controller having a CPU, memory, recording medium and software, unit controllers, and units that execute operations. In the examples of each embodiment, taking the substrate cleaning apparatus as a unit, the unit controller controls the amount, angle, time, positional movement, etc. of the fluid (cleaning liquid) jetted from the multiple nozzles, and the position, rotational speed, etc. of the roll. The main controller monitors this control and instructs the operation. Sensors necessary for control include a pressure sensor for supplying cleaning liquid to nozzles, a position sensor such as an encoder, a timer, a roll position sensor, a load cell for measuring frictional force, a rotation speed sensor, and the like. Also, the software can be installed later by updating the initial software.

The above-described embodiments are described for the purpose of enabling a person having ordinary knowledge in the technical field to which the present invention belongs to implement the present invention. Various modifications of the above-described embodiments can be naturally made by those skilled in the art, and the technical idea of the present invention can also be applied to other embodiments. Therefore, the present invention should not be limited to the described embodiments, but should have the broadest scope in accordance with the spirit defined by the claims.

31 substrate holding parts 32, 32a, 32b nozzles 33, 33a, 33b roll sponge 331 roll body 332 nodule part 60 nozzle control part

Claims (4)

a cylindrical roll body;
a plurality of nodule portions protruding cylindrically outward from the outer peripheral surface,
The side surface of the roll body is covered with a skin layer,
A roll sponge for a substrate cleaning apparatus, wherein at least part of the surface of the plurality of nodule portions lacks a skin layer. 2. The roll sponge for a substrate cleaning apparatus according to claim 1, wherein the skin layer on the surface of said roll main body and the skin layer on the side surface of said nodule portion are absent. 2. The roll sponge for a substrate cleaning apparatus according to claim 1, wherein the skin layer at the tips of all the nodule portions is absent. 2. The roll sponge for a substrate cleaning apparatus according to claim 1, wherein the skin layer at the tips of only some of the plurality of nodule portions is lacking.