JP7330606B2 - 加工装置及びカセット載置機構 - Google Patents
加工装置及びカセット載置機構 Download PDFInfo
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- JP7330606B2 JP7330606B2 JP2018209753A JP2018209753A JP7330606B2 JP 7330606 B2 JP7330606 B2 JP 7330606B2 JP 2018209753 A JP2018209753 A JP 2018209753A JP 2018209753 A JP2018209753 A JP 2018209753A JP 7330606 B2 JP7330606 B2 JP 7330606B2
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- Prior art keywords
- cassette
- mounting table
- cover
- workpiece
- processing apparatus
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3218—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3406—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door or cover
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/14—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/18—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] characterised by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1911—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by materials, roughness, coatings or the like
- H10P72/1912—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by materials, roughness, coatings or the like characterised by shock absorbing elements, e.g. retainers or cushions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1918—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3312—Vertical transfer of a batch of workpieces
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3402—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3404—Storage means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Engineering & Computer Science (AREA)
- Robotics (AREA)
Description
2 加工装置
2a 正面
3 テープ
4 モニター
5 環状フレーム
6 搬送アーム
8 制御部
9 ウェーハユニット
10 カセット載置機構
12 基台部
12a 開口部
12b ペダル(フットスイッチ部)
14 載置台
16 カバー部
16a 第1側面部
16b 第2側面部
16c 正面部
16d 上端部
18 昇降機構
20 ブラケット
20a 第1直線部
20b 第2直線部
20c 第3直線部
20d 第1角部
20e 第2角部
22a、22b ロッドレスシリンダ
24a、24b ボディ部
24c、24d シリンダチューブ
24e、24f 基部
24g、24h スライダ
24i、24j ガイドレール
26 フレーム部
26a 正面
26b 背面
26c 開口部
26d キャスター
28 ドア部
30 カセット
32a 第1側面部
32b 第2側面部
32c 接続部
32d 把手
32e 棚板
32f 係止部側
32g 搬出入部側
A 領域
40 発光素子
42 受光素子
Claims (5)
- 板状の被加工物を加工する加工装置及び該加工装置に併設されるカセット載置機構であって、
該加工装置は、該カセット載置機構に電気的に接続された制御部を備え、
該カセット載置機構は、
該被加工物を収容するカセットが載置される載置台と、
該載置台の側方に配置され、該載置台に載置された該カセットから該被加工物を搬送するときに該被加工物を通過させる開口部を有するフレーム部と、
該フレーム部の該載置台とは反対側に設けられ、該開口部を閉じるドア部と、
該フレーム部の該載置台側に設けられ、該載置台に載置される該カセットの該フレーム部側の一部を除く側部を保護できるように構成されたカバー部と、
該カセットの該フレーム部側の該一部を除く該側部を保護する保護位置と、該保護位置よりも下方の退避位置との間で該カバー部を昇降させる昇降機構と、
該載置台の下方に設けられており、該昇降機構を動作させることができるフットスイッチ部と、
該載置台に該カセットが載置されている旨を示す所定の情報を該制御部へ送るセンサー部と、
を備え、
該カバー部は、互いに向かい合う様に配置された各々板状の第1側面部及び第2側面部と、該第1側面部及び該第2側面部における該フレーム部側とは反対側に位置する一端側を接続する板状の正面部と、を有し、該載置台の上方に位置する該カバー部の上部は、常に開放されており、
該制御部が該センサー部から該所定の情報を受信し、且つ、該カバー部を上昇させる旨の指示が該フットスイッチ部を介して該制御部へ送られた場合に、該制御部は、該カバー部を該退避位置から該保護位置へ移動させることを特徴とする加工装置及びカセット載置機構。 - 該カセット載置機構は、
該カバー部が該保護位置に上昇させられたことを条件として、該ドア部が該開口部を閉じる閉位置から該開口部を開く開位置へ移動させられ、且つ、
該ドア部が該開位置から該閉位置に移動させられたことを条件として、該カバー部が該退避位置に下降させられるように構成されていることを特徴とする請求項1に記載の加工装置及びカセット載置機構。 - 該被加工物の搬送中及び該被加工物の加工中に、該カバー部を上昇させる旨の指示が該フットスイッチ部を介して該制御部へ送られた場合、該制御部は、該カバー部を該保護位置から該退避位置へ移動させないことを特徴とする請求項1又は2に記載の加工装置及びカセット載置機構。
- 該フットスイッチ部は、発光素子及び受光素子を有する透過検出方式又は反射検出方式の他のセンサー部を含むことを特徴とする請求項1から3のいずれかに記載の加工装置及びカセット載置機構。
- 該加工装置は、該被加工物にレーザービームを照射するレーザー加工装置、該被加工物を切削する切削装置、該被加工物を研削する研削装置、又は、該被加工物を研磨する研磨装置であることを特徴とする請求項1から4のいずれかに記載の加工装置及びカセット載置機構。
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018209753A JP7330606B2 (ja) | 2018-11-07 | 2018-11-07 | 加工装置及びカセット載置機構 |
| KR1020190137284A KR102721340B1 (ko) | 2018-11-07 | 2019-10-31 | 카세트 배치 기구 |
| CN201911059612.7A CN111162033B (zh) | 2018-11-07 | 2019-11-01 | 加工装置 |
| TW108140132A TWI827722B (zh) | 2018-11-07 | 2019-11-05 | 加工裝置及片匣載置機構 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018209753A JP7330606B2 (ja) | 2018-11-07 | 2018-11-07 | 加工装置及びカセット載置機構 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2020077737A JP2020077737A (ja) | 2020-05-21 |
| JP7330606B2 true JP7330606B2 (ja) | 2023-08-22 |
Family
ID=70555898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018209753A Active JP7330606B2 (ja) | 2018-11-07 | 2018-11-07 | 加工装置及びカセット載置機構 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7330606B2 (ja) |
| KR (1) | KR102721340B1 (ja) |
| CN (1) | CN111162033B (ja) |
| TW (1) | TWI827722B (ja) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6906674B1 (ja) * | 2020-12-11 | 2021-07-21 | リンテック株式会社 | フレーム収容装置およびフレーム収容方法 |
| CN112242338B (zh) * | 2020-12-18 | 2021-03-02 | 西安奕斯伟硅片技术有限公司 | 能够保持foup的盖部的洁净度的装载端口及设备前端模块 |
| WO2024161644A1 (ja) * | 2023-02-03 | 2024-08-08 | ヤマハ発動機株式会社 | レーザ加工装置、半導体チップおよび半導体チップの製造方法 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003249535A (ja) | 2002-02-22 | 2003-09-05 | Tokyo Electron Ltd | 被処理体の導入ポート構造 |
| JP2007250563A (ja) | 2006-03-13 | 2007-09-27 | Disco Abrasive Syst Ltd | 研削装置 |
| JP2012216752A (ja) | 2011-03-31 | 2012-11-08 | Tokyo Electron Ltd | ロードロックモジュール、ウエハ加工処理システム及びウエハの加工処理方法 |
| JP2016181655A (ja) | 2015-03-25 | 2016-10-13 | 株式会社テックインテック | カセットステージおよび基板処理装置 |
| WO2017094694A1 (ja) | 2015-11-30 | 2017-06-08 | シンフォニアテクノロジー株式会社 | ロードポート |
| JP2017103286A (ja) | 2015-11-30 | 2017-06-08 | シンフォニアテクノロジー株式会社 | ロードポート |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0358443B1 (en) * | 1988-09-06 | 1997-11-26 | Canon Kabushiki Kaisha | Mask cassette loading device |
| JPH07211764A (ja) * | 1994-01-20 | 1995-08-11 | Nikon Corp | レーザ応用装置 |
| JPH10261686A (ja) * | 1997-03-17 | 1998-09-29 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板搬入搬出装置 |
| JPH10308440A (ja) * | 1997-05-01 | 1998-11-17 | Tokyo Electron Ltd | 操作器付きキャリア |
| JP2000091411A (ja) | 1998-09-11 | 2000-03-31 | Disco Abrasive Syst Ltd | カセット |
| JP5796279B2 (ja) * | 2009-07-10 | 2015-10-21 | シンフォニアテクノロジー株式会社 | ロードポート装置、並びにその蓋体着脱装置及びマッピング装置の各昇降機構の制御方法 |
| JP6804146B2 (ja) * | 2016-11-10 | 2020-12-23 | 株式会社ディスコ | 搬送装置、加工装置及び搬送方法 |
-
2018
- 2018-11-07 JP JP2018209753A patent/JP7330606B2/ja active Active
-
2019
- 2019-10-31 KR KR1020190137284A patent/KR102721340B1/ko active Active
- 2019-11-01 CN CN201911059612.7A patent/CN111162033B/zh active Active
- 2019-11-05 TW TW108140132A patent/TWI827722B/zh active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003249535A (ja) | 2002-02-22 | 2003-09-05 | Tokyo Electron Ltd | 被処理体の導入ポート構造 |
| JP2007250563A (ja) | 2006-03-13 | 2007-09-27 | Disco Abrasive Syst Ltd | 研削装置 |
| JP2012216752A (ja) | 2011-03-31 | 2012-11-08 | Tokyo Electron Ltd | ロードロックモジュール、ウエハ加工処理システム及びウエハの加工処理方法 |
| JP2016181655A (ja) | 2015-03-25 | 2016-10-13 | 株式会社テックインテック | カセットステージおよび基板処理装置 |
| WO2017094694A1 (ja) | 2015-11-30 | 2017-06-08 | シンフォニアテクノロジー株式会社 | ロードポート |
| JP2017103286A (ja) | 2015-11-30 | 2017-06-08 | シンフォニアテクノロジー株式会社 | ロードポート |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI827722B (zh) | 2024-01-01 |
| JP2020077737A (ja) | 2020-05-21 |
| TW202018853A (zh) | 2020-05-16 |
| CN111162033A (zh) | 2020-05-15 |
| KR102721340B1 (ko) | 2024-10-23 |
| KR20200052836A (ko) | 2020-05-15 |
| CN111162033B (zh) | 2025-03-04 |
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