JP7347262B2 - optical module - Google Patents

Description

The present disclosure relates to optical modules.

2. Description of the Related Art An optical module in which a semiconductor light emitting element is arranged within a package is known (for example, see Patent Document 1). Such optical modules are used as light sources for various devices such as display devices, optical pickup devices, and optical communication devices.

The above-mentioned optical module may include a thermo-electric cooler module (hereinafter sometimes referred to as TEC (Thermo-Electric Cooler)) in order to cool the semiconductor light emitting element. In Patent Document 1, an electronic cooling module is arranged with an adhesive interposed between a base member on which a semiconductor light emitting element is mounted and a support base for heat radiation.

Japanese Patent Application Publication No. 2016-134416

In the optical module disclosed in Patent Document 1, the heat exhaust efficiency depends on the dimensions and thermal conductivity of each member, as well as the bonding area of the adhesive and the performance of the TEC. However, the bonding area of the adhesive may not be fully controlled during the manufacturing process, or when using an optical module in a situation where the environmental temperature changes, the bonding area may be affected due to the difference in linear expansion coefficient of each component. In some cases, peeling progresses due to thermal stress generated in the process, resulting in changes over time. Furthermore, damage to the TEC may progress due to thermal stress, and its power consumption and temperature controllability may deteriorate. Generally, the thermal stress applied to each member depends on the shape of the adhesive (bonding area and thickness). Therefore, when using optical modules over a wide range of environmental temperatures over long periods of time, in order to achieve thermally stable operation with little variation between individual units, it is necessary to control the shape of the adhesive to reduce thermal resistance and It is important to adjust the thermal stress applied to the member and to increase the adhesive strength of the adhesive interface. Therefore, one of the objects is to provide an optical module that enables thermally stable operation.

An optical module according to the present disclosure includes a light forming section configured to form light and a support plate supporting the light forming section. The light forming section includes a semiconductor light emitting element, a base part on which the semiconductor light emitting element is mounted, an electronic cooling module that adjusts the temperature of the semiconductor light emitting element, a first adhesive that adheres the electronic cooling module and the base part, and a support. a second adhesive for bonding the plate and the electronic cooling module. An adhesive holding portion that holds at least one of the first adhesive and the second adhesive is formed on at least one of the base portion, the electronic cooling module, and the support plate. The adhesive holding portion includes at least one of a convex portion projecting in the thickness direction of the support plate and a recess portion recessed in the thickness direction of the support plate.

The optical module described above can operate in a thermally stable manner.

FIG. 1 is an external perspective view showing the structure of an optical module according to an embodiment of the present disclosure. FIG. 2 is an external perspective view showing the optical module shown in FIG. 1 with the cap removed. FIG. 3 is a view of the optical module with the cap shown in FIG. 2 removed, viewed in the thickness direction of the support plate. FIG. 4 is a schematic cross-sectional view showing a part of the optical module with the cap shown in FIG. 2 removed. FIG. 5 is an exploded perspective view of the optical module with the cap shown in FIG. 2 removed. FIG. 6 is a schematic perspective view showing a support plate included in the optical module in the first embodiment. FIG. 7 is a schematic perspective view showing a base plate included in the optical module in the first embodiment. FIG. 8 is a graph showing calculated values of the maximum principal stress generated inside the TEC when the thickness of the adhesive is varied. FIG. 9 is a graph showing the results of the heat shock test. FIG. 10 is a diagram of the optical module according to the second embodiment, with the cap removed, as viewed in the thickness direction of the support plate. FIG. 11 is a diagram of the optical module according to the third embodiment, with the cap removed, as viewed in the thickness direction of the support plate. FIG. 12 is a diagram of the optical module according to Embodiment 4, with the cap removed, as viewed in the thickness direction of the support plate. FIG. 13 is a schematic cross-sectional view showing a part of the optical module with the cap shown in FIG. 12 removed. FIG. 14 is a schematic perspective view showing a support plate included in the optical module in Embodiment 4. FIG. 15 is a schematic perspective view showing a support plate included in the optical module according to the fifth embodiment. FIG. 16 is a schematic cross-sectional view showing a part of the optical module with the cap shown in FIG. 15 removed. FIG. 17 is a schematic perspective view showing a support plate included in the optical module in Embodiment 6. FIG. 18 is a schematic perspective view showing a support plate included in an optical module in Embodiment 7. FIG. 19 is a schematic cross-sectional view of a part of the optical module according to the eighth embodiment with the cap removed. FIG. 20 is a schematic perspective view showing a part of the support plate included in the optical module in Embodiment 9. FIG. 21 is a schematic cross-sectional view showing a part of the optical module with the cap shown in FIG. 20 removed. FIG. 22 is a schematic perspective view showing a support plate included in the optical module in Embodiment 10. FIG. 23 is a schematic cross-sectional view showing a part of the optical module with the cap shown in FIG. 22 removed. FIG. 24 is a schematic perspective view showing a support plate included in the optical module in Embodiment 11. FIG. 25 is a schematic perspective view showing a support plate included in the optical module in Embodiment 12. FIG. 26 is a schematic perspective view showing a TEC included in an optical module in Embodiment 13.

[Description of embodiments of the present disclosure]
First, embodiments of the present disclosure will be listed and described. An optical module according to the present disclosure includes a light forming section configured to form light, and a support plate supporting the light forming section. The light forming section includes a semiconductor light emitting element, a base part on which the semiconductor light emitting element is mounted, an electronic cooling module that adjusts the temperature of the semiconductor light emitting element, a first adhesive that adheres the electronic cooling module and the base part, and a support. a second adhesive for bonding the plate and the electronic cooling module. An adhesive holding portion that holds at least one of the first adhesive and the second adhesive is formed on at least one of the base portion, the electronic cooling module, and the support plate. The adhesive holding portion includes at least one of a convex portion projecting in the thickness direction of the support plate and a recess portion recessed in the thickness direction of the support plate.

According to the optical module of the present disclosure, the adhesive holding portion including at least one of the convex portion projecting in the thickness direction of the support plate and the concave portion recessed in the thickness direction of the support plate is the base portion and the electronic cooling module. and a support plate. Therefore, the shape of the adhesive is regulated by the shape of the adhesive holding portion, making it easy to control the shape of the adhesive.

By including the recessed portion in the thickness direction of the support plate in the adhesive holding portion, it is possible to enhance the role of the adhesive as a buffer material and reduce thermal stress applied to the TEC. Furthermore, adhesive strength can be increased by increasing the area of contact with the wall surface forming the recess to enhance the anchoring effect. Furthermore, since the bonding area of the adhesive held in the recess is stabilized, variations in thermal performance between individual pieces can be suppressed. Since the adhesive holding part includes a convex part that protrudes in the thickness direction of the support plate, gas generated when the adhesive hardens can be discharged from inside the adhesive by utilizing the space on the side surface of the convex part. becomes easier. This prevents the formation of pores in the adhesive or the adhesive interface, and stabilizes the adhesive area, thereby suppressing variations in thermal performance between individual products. As described above, the optical module can operate in a thermally stable manner.

In the above optical module, the adhesive holding portion may have a rectangular outer shape when viewed in the thickness direction of the support plate. Such a shape is easy to process. Note that a rectangle means a quadrilateral whose four corners have the same angle, and includes a square whose four corners have the same angle and all four sides have the same length.

In the above optical module, the adhesive holding portion may have a rectangular shape with rounded corners when viewed in the thickness direction of the support plate. Since the corners of a quadrilateral become stress concentration points, by rounding the corners, it is possible to reduce the possibility of damage to the adhesive, adhesive interface, and TEC due to stress concentration.

In the above optical module, the adhesive holding portion may have a circular or elliptical external shape when viewed in the thickness direction of the support plate. A circular or elliptical shape has no corners and can have a shorter outer circumference than other shapes that have the same area. Therefore, it is possible to reduce the possibility of damage to the adhesive, the adhesive interface, and the TEC due to stress concentration, and also to reduce the rate of moisture intrusion from the outside air, thereby preventing deterioration of the adhesive and the adhesive interface.

In the above optical module, a plurality of adhesive holding parts may be formed at intervals. By doing so, the total amount of adhesive used can be reduced, resulting in an inexpensive configuration. In addition, the gas generated when the adhesive hardens can be easily discharged, the pores created by the gas remaining inside can be reduced, and the bonding area can be stabilized. Further, when the adhesive holding portion includes a recess, the contact area between the wall surface constituting the recess and the adhesive becomes larger, and the anchoring effect can be enhanced, so that the adhesive strength can be increased.

In the above optical module, the thickness of at least one support plate of the first adhesive and the second adhesive held by the adhesive holding section may be 50 μm or more. By doing this, the adhesive acts as a thermal stress buffer, reducing the thermal stress applied to the TEC, and improving the power consumption and temperature control of the TEC when using the optical module over a wide environmental temperature range over a long period of time. can be prevented from worsening.

In the above optical module, the thickness of at least one support plate of the first adhesive and the second adhesive held by the adhesive holding section may be 100 μm or more. By doing this, the adhesive acts as a thermal stress buffer, further reducing the thermal stress applied to the TEC, and controlling the power consumption and temperature of the TEC when using the optical module over a wide environmental temperature range over a long period of time. This can further prevent sexual deterioration.

In the above optical module, the light forming section may further include a lens that converts a spot size of light emitted from the semiconductor light emitting element. By doing so, light having a desired spot size can be emitted from the optical module.

In the above optical module, the light forming section may further include a plurality of semiconductor light emitting elements and a filter that multiplexes light emitted from the plurality of semiconductor light emitting elements. By doing so, the optical module can emit light that is a combination of a plurality of lights.

The above optical module may further include a cap that covers the light forming section. By doing so, the semiconductor light emitting elements constituting the optical module can be effectively protected from the external environment, and high reliability can be ensured.

[Details of embodiments of the present disclosure]
Next, an optical module according to an embodiment of the present disclosure will be described below with reference to the drawings. In the following drawings, the same or corresponding parts are given the same reference numerals and the description thereof will not be repeated.

(Embodiment 1)
Embodiment 1, which is an embodiment of an optical module according to the present disclosure, will be described with reference to FIGS. 1 to 5. FIG. 1 is an external perspective view showing the structure of an optical module according to an embodiment of the present disclosure. FIG. 2 is an external perspective view showing the optical module shown in FIG. 1 with the cap removed. FIG. 3 is a view of the optical module with the cap shown in FIG. 2 removed, viewed in the thickness direction of the support plate. FIG. 4 is a schematic cross-sectional view showing a part of the optical module with the cap shown in FIG. 2 removed. FIG. 5 is an exploded perspective view of the optical module with the cap shown in FIG. 2 removed. In addition, in FIG. 3, the optical axis is shown by a dashed line. Further, except for FIG. 4, illustrations of the first adhesive and the second adhesive are omitted in FIGS. 1 to 5.

Referring to FIGS. 1 to 5, an optical module 1A in Embodiment 1 includes a support plate 11A as a support base having a flat plate shape, and is disposed on one surface 12A of the support plate 11A to emit light. a light forming unit 13 as a light forming unit configured to form a light forming unit; a cap 14 disposed in contact with one surface 12A of the support plate 11A so as to cover the light forming unit 13; It is provided with a plurality of lead pins 16 that penetrate from the other surface 12B side to the one surface 12A side and protrude from both sides of the one surface 12A side and the other surface 12B side. The support plate 11A and the cap 14 are made airtight by welding, for example. That is, the light forming section 13 is hermetically sealed by the support plate 11A and the cap 14. The space surrounded by the support plate 11A and the cap 14 is filled with gas with reduced moisture content, such as dry air. The cap 14 is formed with an exit window 15 coated with a glass AR (Anti Reflection) coating that transmits the light from the light forming section 13 . Note that, when viewed in the thickness direction of the support plate 11A (when viewed in the Z-axis direction), the support plate 11A is a rectangle with rounded four corners. The cap 14 also has a rectangular shape with rounded four corners when viewed in the thickness direction of the support plate 11A. The area of the support plate 11A is larger than the area of the cap 14, and when the cap 14 is placed in contact with the support plate 11A, the outer periphery of the support plate 11A is separated from the outer periphery of the cap 14. It protrudes like a brim. For example, iron or copper is selected as the material of the support plate 11A. The linear expansion coefficient of iron is, for example, 12 ppm/°C, and the linear expansion coefficient of copper is, for example, 17 ppm/°C.

The light forming section 13 includes a base plate 20A having a plate-like shape as a base member. The base plate 20A has one surface 21A having a rectangular shape when viewed in the thickness direction of the support plate 11A, and the other surface 21B located on the opposite side of the one surface 21A in the thickness direction. The direction in which the long sides of the base plate 20A extend is the same as the direction in which the long sides of the support plate 11A extend (X-axis direction). The direction in which the short side of the base plate 20A extends is the same as the direction in which the short side of the support plate 11A extends (Y-axis direction). The surface 21A includes a base region 22 and a chip mounting region 23. The thickness of the chip mounting area 23 is larger than that of the base area 22. For example, iron or copper is selected as the material of the base plate 20A.

On the chip mounting area 23, a flat first submount 31, a second flat submount 32, and a third flat submount 33 are formed in areas 24A, 24B, and 24C, respectively. A red laser diode 41, which is a first semiconductor laser serving as a first semiconductor light emitting element, is arranged on the first submount 31. A green laser diode 42, which is a second semiconductor laser serving as a second semiconductor light emitting element, is arranged on the second submount 32. A blue laser diode 43, which is a third semiconductor laser serving as a third semiconductor light emitting element, is arranged on the third submount 33. The red light emitted from the red laser diode 41, the green light emitted from the green laser diode 42, and the blue light emitted from the blue laser diode 43 have their respective emission directions in the Y-axis direction. parallel. Note that a thermistor 17 for measuring the temperature of the light forming section 13 is mounted on the chip mounting area 23 . The thermistor 17 is attached to the region 27 at a distance from the third submount 33.

A first lens 51, a second lens 52, and a third lens 53 each having a lens surface are arranged in the base region 22. That is, a first lens 51, a second lens 52, and a third lens 53 are mounted on the base plate 20A. The central axes of the first lens 51, the second lens 52, and the third lens 53, that is, the optical axes of the respective lens surfaces, are arranged so as to coincide with the optical axes of the red laser diode 41, the green laser diode 42, and the blue laser diode 43, respectively. has been adjusted to. The adjustment of the optical axes, that is, the process of aligning the optical axes and attaching the first lens 51, the second lens 52, and the third lens 53 to the base region 22, is performed at a predetermined temperature, for example, room temperature.

The first lens 51, the second lens 52, and the third lens 53 change the spot size of the light emitted from the red laser diode 41, green laser diode 42, and blue laser diode 43, respectively. The first lens 51, the second lens 52, and the third lens 53 are each bonded to the regions 25A, 25B, and 25C of the base region 22 using, for example, an ultraviolet curing adhesive.

A first filter 61, a second filter 62, and a third filter 63 are arranged in the base region 22. The first filter 61, the second filter 62, and the third filter 63 are each bonded to the regions 26A, 26B, and 26C of the base region 22, respectively, using, for example, an ultraviolet curing adhesive. The first filter 61, the second filter 62, and the third filter 63 are, for example, wavelength selective filters. Further, the first filter 61, the second filter 62, and the third filter 63 are dielectric multilayer filters. Specifically, the first filter 61 reflects red light. The second filter 62 transmits red light and reflects green light. The third filter 63 transmits red light and green light and reflects blue light. The main surfaces of the first filter 61, the second filter 62, and the third filter 63 are inclined in the direction in which light is emitted from the red laser diode 41, the green laser diode 42, and the blue laser diode 43, respectively. Specifically, the main surfaces of the first filter 61, the second filter 62, and the third filter 63 are arranged with respect to the emission direction of the light emitted from the red laser diode 41, the green laser diode 42, and the blue laser diode 43, respectively. It is tilted at 45°. As a result, the first filter 61, the second filter 62, and the third filter 63 combine the lights emitted from the red laser diode 41, the green laser diode 42, and the blue laser diode 43.

The optical module 1A includes a TEC 70. The TEC 70 is arranged between the base plate 20A and the support plate 11A. The TEC 70 is a Peltier module (Peltier element), and includes a heat absorbing plate 71, a heat dissipating plate 72, and a plurality of columnar columns arranged at intervals between the heat absorbing plate 71 and the heat dissipating plate 72 with electrodes in between. and a semiconductor pillar 73. For example, alumina is selected as the material for the heat absorbing plate 71 and the heat sink plate 72. The linear expansion coefficient of alumina is, for example, 7 ppm/°C. As the material of the semiconductor pillar 73, for example, BiTe is selected. The linear expansion coefficient of BiTe is, for example, 15 ppm/°C. The heat absorbing plate 71 is adhered to the surface 21B of the base plate 20A. The heat sink 72 is adhered to a part of the surface 12A of the support plate 11A. By supplying a current to the TEC 70 and causing the current to flow, the heat of the base plate 20A bonded to the heat absorbing plate 71 moves toward the support plate 11A side, and the base plate 20A is cooled. As a result, the temperature rise of the red laser diode 41, the green laser diode 42, and the blue laser diode 43 can be suppressed. That is, by providing this TEC 70, the temperature of the red laser diode 41, the green laser diode 42, and the blue laser diode 43 can be adjusted and the output can be stabilized.

The optical module 1A includes a first adhesive 18 that bonds the support plate 11A and the TEC 70 together. The support plate 11A and the TEC 70 are bonded together using a first adhesive 18. The first adhesive 18 is placed between the support plate 11A and the TEC 70. As the first adhesive 18, a conductive adhesive, such as a paste adhesive in which silver particles are dispersed in a resin binder, is used. Such an adhesive is cured by heating and functions as an adhesive. Such adhesives have good thermal conductivity.

The optical module 1A includes a second adhesive 19 that bonds the base plate 20A and the TEC 70 together. The TEC 70 and the base plate 20A are bonded together using a second adhesive 19. The second adhesive 19 is placed between the base plate 20A and the TEC 70. As the material of the second adhesive 19, the same material as that of the first adhesive 18 described above is used.

A first recess 81A is formed in the support plate 11A as an adhesive holding portion 80A for holding the first adhesive 18, which is recessed in the thickness direction of the support plate 11A. FIG. 6 is a schematic perspective view showing the support plate 11A included in the optical module 1A in the first embodiment. Referring also to FIG. 6, the first recess 81A is formed on the surface 12A of the support plate 11A. The first recess 81A includes a bottom wall surface 82A arranged parallel to the XY plane and a side wall surface 83A rising perpendicularly from the bottom wall surface 82A. The depth _D1 of the first recess 81A is 100 μm or more. The outer shape of the first recess 81A is elliptical when viewed in the thickness direction of the support plate 11A. Specifically, in FIG. 3, the direction in which the long axis extends is the X-axis direction, and the direction in which the short axis extends is the Y-axis direction. The first recess 81A is covered by the base plate 20A when viewed in the thickness direction of the support plate 11A. When viewed in the thickness direction of the support plate 11A, the first recess 81A is not exposed from the base plate 20A. A portion of the first adhesive 18 is accommodated in the first recess 81A. A portion of the first adhesive 18 exposed in the Z-axis direction from the first recess 81A contacts the TEC 70.

A second recess 91A that is recessed in the thickness direction of the base plate 20A is formed in the base plate 20A as an adhesive holding portion 80A that holds the second adhesive 19. FIG. 7 is a schematic perspective view showing a base plate 20A included in the optical module 1A in the first embodiment. Referring also to FIG. 7, the second recess 91A is formed on the surface 21B of the base plate 20A. The second recess 91A includes a bottom wall surface 92A arranged parallel to the XY plane and a side wall surface 93A rising perpendicularly from the bottom wall surface 92A. The depth _D2 of the second recess 91A is 100 μm or more. The outer shape of the second recess 91A is an ellipse when viewed in the thickness direction of the support plate 11A. When viewed in the thickness direction of the support plate 11A, the outer shape and position of the second recess 91A are the same as the first recess 81A.

In the optical module 1A, an adhesive holding portion 80A including a first recess 81A recessed in the thickness direction of the support plate 11A is formed in the support plate 11A. Therefore, the shape of the first adhesive 18 is regulated by the shape of the first recess 81A included in the adhesive holding portion 80A, and it becomes easy to control the shape of the first adhesive 18. Further, in the optical module 1A, an adhesive holding portion 80A including a second recess 91A recessed in the thickness direction of the support plate 11A is formed on the base plate 20A. Therefore, the shape of the second adhesive 19 is regulated by the shape of the second recess 91A included in the adhesive holding portion 80A, and the shape of the second adhesive 19 can be easily controlled.

By including the first recess 81A recessed in the thickness direction of the support plate 11A, the adhesive holding portion 80A can enhance the role of the first adhesive 18 as a buffer material and reduce thermal stress applied to the TEC 70. . Furthermore, adhesive strength can be increased by increasing the area of contact with the side wall surface 83A forming the first recess 81A to enhance the anchoring effect. Furthermore, since the bonding area of the first adhesive 18 held in the first recess 81A is stabilized, variations in thermal performance between individual pieces can be suppressed. Furthermore, by including the second recess 91A recessed in the thickness direction of the support plate 11A, the adhesive holding portion 80A enhances the role of the second adhesive 19 as a buffer material and reduces thermal stress applied to the TEC 70. I can do it. Further, adhesive strength can be increased by increasing the contact area with the side wall surface 93A forming the second recess 91A to enhance the anchor effect. Furthermore, since the bonding area of the second adhesive 19 held in the second recess 91A is stabilized, variations in thermal performance between individual pieces can be suppressed. As described above, the optical module 1A can operate in a thermally stable manner.

In the optical module 1A, the first recess 81A and the second recess 91A included in the adhesive holding portion 80A each have an elliptical outer shape when viewed in the thickness direction of the support plate 11A. The elliptical shape has no corners and can have a shorter outer circumference than other shapes with the same area. Therefore, the possibility that the first adhesive 18, the second adhesive 19, their respective adhesive interfaces, and the TEC 70 are damaged due to stress concentration can be reduced, and the rate of intrusion of moisture in the outside air can be reduced, and the first adhesive 18, Deterioration of the second adhesive 19 and the adhesive interface can be prevented. Note that by making the outer shapes of the first recess 81A and the second recess 91A circular, the length of the outer periphery can be further shortened.

In the optical module 1A, the thickness of the support plate 11A of the first adhesive 18 and the second adhesive 19 held by the adhesive holding portion 80A is each 100 μm or more. Therefore, the first adhesive 18 and the second adhesive 19 each work as a thermal stress buffer to further reduce the thermal stress applied to the TEC 70, and when the optical module 1A is used over a long period of time in a wide environmental temperature range, Deterioration of power consumption and temperature controllability can be further prevented.

FIG. 8 is a graph showing calculated values of the maximum principal stress generated inside the TEC 70 when the thickness of the adhesive is varied. In Fig. 8, the vertical axis shows the maximum principal stress (MPa), and the horizontal axis shows, in order from the left (closest to the vertical axis), when the adhesive thickness is 20 μm, when the adhesive thickness is 50 μm, the adhesion The case where the thickness of the agent is 100 μm is shown. Furthermore, in the graph shown in FIG. 8, the value of the maximum principal stress at which the TEC 70 is considered to be damaged is indicated by a broken line.

Referring to FIG. 8, when the thickness of the adhesive is 20 μm, the maximum principal stress exhibits a high value of 130 MPa. On the other hand, when the thickness of the adhesive is 50 μm, the maximum principal stress is 118 MPa, which is significantly reduced compared to when the thickness of the adhesive is 20 μm. When the thickness of the adhesive is 100 μm, the maximum principal stress is 108 MPa, which is an even greater reduction. That is, the thicker the adhesive, the smaller the maximum principal stress generated inside the TEC 70.

FIG. 9 is a graph showing the results of the heat shock test. In FIG. 9, the vertical axis shows the amount of change in electrical resistance (Ω), and the horizontal axis shows the number of heat shock cycles (times). In the heat shock test shown in Figure 9, the environment in which the optical module is placed is set from -40°C to 95°C, and the electrical resistance of TEC70 is measured by placing it in each environment alternately for 30 minutes, and the change in electrical resistance is It is evaluated by deriving the In FIG. 9, different lines indicate the case where the thickness of the adhesive is 50 μm and the case where the thickness of the adhesive is 100 μm. In FIG. 9, when the thickness of the adhesive was 20 μm, the TEC 70 was damaged after 5 cycles of heat shock, and the electrical resistance could not be measured. It is not shown because the change in electrical resistance could not be calculated.

Referring to FIG. 9, in both cases where the adhesive thickness is 50 μm and when the adhesive thickness is 100 μm, the TEC70 does not fail even when the number of heat shock cycles is 600 or more. , the amount of change in electrical resistance is minute.

As derived from the results shown in Figures 8 and 9, by ensuring the thickness of the adhesive is 50 μm or more, or even 100 μm or more, TEC70 can be damaged even when used for a long period of time in an environment with large temperature changes. It is possible to greatly reduce the risk of this happening, and also prevent deterioration of power consumption.

The light forming unit 13 included in the optical module 1A includes a first lens 51, a second lens 52, and a second lens that convert the spot size of the light emitted from the red laser diode 41, the green laser diode 42, and the blue laser diode 43, respectively. 3 lenses 53 are included. Therefore, the optical module 1A is an optical module that can emit light having a desired spot size.

In the optical module 1A, the light forming section 13 combines the red laser diode 41, the green laser diode 42, and the blue laser diode 43 with the light emitted from the red laser diode 41, the green laser diode 42, and the blue laser diode 43. A third filter 63 is included. Therefore, the optical module 1A is an optical module that can emit light that is a combination of a plurality of lights.

Since the optical module 1A includes a cap 14 that covers the light forming section 13, it effectively protects the red laser diode 41, the green laser diode 42, and the blue laser diode 43, which are semiconductor light emitting elements constituting the optical module 1A, from the external environment. can do. Furthermore, the cap 14 can effectively protect the optical components included in the light forming section 13, such as the first lens, second lens, third lens, first filter, second filter, and third filter, from the external environment. . Therefore, the optical module 1A is an optical module that can ensure high reliability.

In the above embodiment, when viewed in the thickness direction of the support plate 11A, the outer shape of the first recess 81A and the second recess 91A included in the adhesive holding portion 80A may be formed by a curved line. good. In other words, the outer shape of the adhesive holding portion 80A may be a curved line. Also by doing this, when viewed in the thickness direction of the support plate 11A, corners in the external shapes of the first recess 81A and the second recess 91A included in the adhesive holding portion 80A are eliminated, and the first It is possible to reduce the risk of stress concentration occurring in the adhesive 18 and the second adhesive 19.

Further, in the above embodiment, the outer shape of the first recess 81A and the second recess 91A included in the adhesive holding portion 80A may be circular when viewed in the thickness direction of the support plate 11A. . That is, the outer shape of the adhesive holding portion 80A may be a circle or an ellipse. A circular or elliptical shape has no corners and can have a shorter outer circumference than other shapes that have the same area. Therefore, it is possible to reduce the possibility that the adhesive, the adhesive interface, and the TEC 70 are damaged due to stress concentration, and also to reduce the rate of moisture intrusion from the outside air, thereby preventing deterioration of the adhesive and the adhesive interface.

(Embodiment 2)
Next, Embodiment 2, which is another embodiment, will be described. FIG. 10 is a diagram of the optical module 1B according to the second embodiment, with the cap removed, as viewed in the thickness direction of the support plate 11B. The optical module 1B of the second embodiment is different from the first embodiment in that the size (area) of the first recess 81B formed in the support plate 11B is different when viewed in the thickness direction of the support plate 11B. are different.

Referring to FIG. 10, a first recess 81B recessed in the thickness direction of support plate 11B as an adhesive holding portion 80B is formed in surface 12A of support plate 11B included in optical module 1B in the second embodiment. ing. The first recess 81B has an elliptical shape when the optical module 1B is viewed in the thickness direction of the support plate 11B. The long axis of the first recess 81B extending in the X-axis direction is longer than the long axis of the first recess 81A in the first embodiment. The short axis of the first recess 81B extending in the Y-axis direction is longer than the short axis of the first recess 81A in the first embodiment. When viewed in the thickness direction of the support plate 11B, the area occupied by the first recess 81B on the surface 12A of the second embodiment is larger than that of the first embodiment. A portion of the first recess 81B is not covered by the base plate 20B.

Since the optical module 1B includes the first recess 81B having the above configuration, the shape of the first adhesive 18 is regulated by the shape of the first recess 81B included in the adhesive holding part 80B, and the first adhesive 18 It becomes easier to control the shape of the Furthermore, by including the first recess 81B recessed in the thickness direction of the support plate 11A, the adhesive holding portion 80B enhances the role of the first adhesive 18 as a buffer material and reduces thermal stress applied to the TEC 70. I can do it. Moreover, adhesive strength can be increased by increasing the contact area with the side wall surface forming the first recess 81B to enhance the anchor effect. Further, since the bonding area of the first adhesive 18 held in the first recess 81B is stabilized, variations in thermal performance between individual pieces can be suppressed. As described above, the optical module 1B can operate in a thermally stable manner.

(Embodiment 3)
Next, Embodiment 3, which is still another embodiment, will be described. FIG. 11 is a diagram of the optical module 1C according to the third embodiment, with the cap removed, as viewed in the thickness direction of the support plate 11C. The optical module 1C of the third embodiment differs from the first embodiment in that the outer shape of the first recess 81C formed in the support plate 11C is rectangular. Note that the rectangular shape does not have to be a geometrically strict rectangle; for example, opposing sides may not be strictly parallel, and the sides may be connected by a curved line.

Referring to FIG. 11, a first recess 81C recessed in the thickness direction of the support plate 11C as an adhesive holding portion 80C is formed on the surface 12A of the support plate 11C included in the optical module 1C in the third embodiment. ing. The first recess 81C is rectangular when viewed in the thickness direction of the support plate 11C. The first recess 81C has four corners formed by curved lines (arcs) when viewed in the thickness direction of the support plate 11C. The long side of the first recess 81C extends in the X-axis direction. The short side of the first recess 81C extends in the Y-axis direction. The first recess 81C is covered by the base plate 20C.

Since the optical module 1C includes the first recess 81C having the above configuration, the shape of the first adhesive 18 is regulated by the shape of the first recess 81C included in the adhesive holding portion 80C. It becomes easier to control the shape of the Furthermore, by including the first recess 81C recessed in the thickness direction of the support plate 11A, the adhesive holding portion 80C enhances the role of the first adhesive 18 as a buffer material and reduces thermal stress applied to the TEC 70. I can do it. Furthermore, adhesive strength can be increased by increasing the area of contact with the side wall surface forming the first recess 81C to enhance the anchor effect. Further, since the bonding area of the first adhesive 18 held in the first recess 81C is stabilized, variations in thermal performance between individual pieces can be suppressed. As described above, the optical module 1C can operate in a thermally stable manner.

In this embodiment, the outer shape of the first recess 81C, which is the adhesive holding portion 80C, is rectangular when viewed in the thickness direction of the support plate 11C. Such a shape is easy to process.

In this embodiment, when viewed in the thickness direction of the support plate 11C, the first recess 81C, which is the adhesive holding portion 80C, has a rectangular shape with rounded corners. Since the corners of the rectangle serve as stress concentration points, by rounding the corners, it is possible to reduce the possibility that the first adhesive 18, the adhesive interface, and the TEC 70 will be damaged due to stress concentration.

(Embodiment 4)
Next, Embodiment 4, which is still another embodiment, will be described. FIG. 12 is a diagram of the optical module 1D according to the fourth embodiment, with the cap removed, as viewed in the thickness direction of the support plate 11D. FIG. 13 is a schematic cross-sectional view showing a part of the optical module 1D with the cap shown in FIG. 12 removed. FIG. 14 is a schematic perspective view showing a support plate 11D included in an optical module 1D according to the fourth embodiment. In the optical module 1D of the fourth embodiment, when viewed in the thickness direction of the support plate 11D, the shape and number of the first recess formed in the support plate 11D and the second recess formed in the base plate 20D are different. This differs from the first embodiment in this point.

Referring to FIGS. 12 to 14, a surface 12A of a support plate 11D included in an optical module 1D in Embodiment 4 has four first grooves recessed in the thickness direction of the support plate 11D as an adhesive holding portion 80D. Recesses 84A, 84B, 84C, and 84D are formed. The first recesses 84A, 84B, 84C, and 84D are shaped by cutting an elliptical recess in a region including a short axis and a region including a long axis when viewed in the thickness direction of the support plate 11D, respectively. They are formed at intervals. The outer shape of each of the first recesses 84A to 84D is a part of an elliptical arc that is the same as the outer shape of the first recess 81A in the first embodiment when viewed in the thickness direction of the support plate 11D, and It is composed of a line segment extending in the Y-axis direction and a line segment extending in the Y-axis direction. In the surface 21B of the base plate 20D included in the optical module 1D in the fourth embodiment, four second recesses 94A, 94B, 94C, and 94D recessed in the thickness direction of the support plate 11D are provided as adhesive holding portions 80D. include.

Since the optical module 1D includes the first recesses 84A to 84D having the above configuration, the shape of the first adhesive 18 is regulated by the shape of the first recesses 84A to 84D included in the adhesive holding portion 80D, and 1. The shape of the adhesive 18 can be easily controlled. Furthermore, since the optical module 1D includes the second recesses 94A to 94D having the above configuration, the shape of the second adhesive 19 is regulated by the shape of the second recesses 94A to 94D included in the adhesive holding portion 80D. , it becomes easy to control the shape of the second adhesive 19. Furthermore, by including the first recesses 84A to 84D recessed in the thickness direction of the support plate 11D, the adhesive holding portion 80D enhances the role of the first adhesive 18 as a buffer material and reduces thermal stress applied to the TEC 70. can do. Furthermore, adhesive strength can be increased by increasing the area of contact with the side wall surfaces forming the first recesses 84A to 84D to enhance the anchoring effect. Further, since the bonding area of the first adhesive 18 held in the first recesses 84A to 84D is stabilized, variations in thermal performance between individual pieces can be suppressed. Furthermore, by including the second recesses 94A to 94D recessed in the thickness direction of the support plate 11D, the adhesive holding portion 80D enhances the role of the second adhesive 19 as a buffer material and reduces thermal stress applied to the TEC 70. can do. Furthermore, adhesive strength can be increased by increasing the area of contact with the side wall surfaces forming the second recesses 94A to 94D to enhance the anchoring effect. Further, since the adhesion area of the second adhesive 19 held in the second recesses 94A to 94D is stabilized, variations in thermal performance between individual pieces can be suppressed. As described above, the optical module 1D can operate in a thermally stable manner.

In this embodiment, the first recesses 84A to 84D included in the adhesive holding portion 80D are formed with intervals between each other. Therefore, the total amount of the first adhesive 18 used can be reduced, resulting in an inexpensive configuration. Can be done. Further, the gas generated when the first adhesive 18 hardens can be easily discharged by the gaps 84E between the first adhesives 18 held in the first recesses 84A to 84D, and the voids formed by the gas remaining inside. can be reduced and the adhesive area can be stabilized. Further, the second recesses 94A to 94D included in the adhesive holding portion 80D are formed with intervals between each other, so that the total amount of the second adhesive 19 used can be reduced, resulting in an inexpensive configuration. Further, the gas generated when the second adhesive 19 hardens can be easily discharged by the gaps 94E between the second adhesives 19 held in the second recesses 94A to 94D, and the voids formed by the gas remaining inside. can be reduced and the adhesive area can be stabilized.

(Embodiment 5)
Next, Embodiment 5, which is still another embodiment, will be described. FIG. 15 is a schematic perspective view showing a support plate 11E included in an optical module 1E in the fifth embodiment. FIG. 16 is a schematic cross-sectional view showing a part of the optical module 1E with the cap removed. The cross section shown in FIG. 16 is a cross section taken parallel to the XZ plane passing through the centers of first recesses 85E, 85F, 85G, and 85H, which will be described later. In the optical module 1E of the fifth embodiment, when viewed in the thickness direction of the support plate 11E, the shape and number of the first recess formed in the support plate 11E and the second recess formed in the base plate 20E are different. This differs from the first embodiment in this point.

Referring to FIGS. 15 and 16, on the surface 12A of the support plate 11E included in the optical module 1E in the fifth embodiment, there are 12 recesses recessed in the thickness direction of the support plate 11E as adhesive holding portions 80E. 1 recesses 85A, 85B, 85C, 85D, 85E, 85F, 85G, 85H, 85I, 85J, 85K, and 85L are formed. The outer shapes of the first recesses 85A to 85L are circular when viewed in the thickness direction of the support plate 11E, and are spaced apart from each other in the X-axis direction and the Y-axis direction. Further, twelve second recesses 95A to 95L are formed as adhesive holding portions 80E on the surface 21B of the base plate 20E included in the optical module 1E in the fifth embodiment. Among the twelve second recesses 95A to 95L, in FIG. 16, the second recesses 95E, 95F, 95G, and 95H provided at positions facing the first recesses 85E, 85F, 85G, and 85H, respectively, are illustrated. ing. The twelve second recesses 95A to 95L have a circular shape when viewed in the thickness direction of the support plate 11E, and are spaced apart from each other in the X-axis direction and the Y-axis direction.

Since the optical module 1E includes the first recesses 85A to 85L having the above configuration, the shape of the first adhesive 18 is regulated by the shape of the first recesses 85A to 85L included in the adhesive holding portion 80E, and 1. The shape of the adhesive 18 can be easily controlled. Furthermore, since the optical module 1E includes the second recesses 95A to 95L having the above configuration, the shape of the second adhesive 19 is regulated by the shape of the second recesses 95A to 95L included in the adhesive holding portion 80E. , it becomes easy to control the shape of the second adhesive 19. Furthermore, by including the first recesses 85A to 85L recessed in the thickness direction of the support plate 11E, the adhesive holding portion 80E enhances the role of the first adhesive 18 as a buffer material and reduces thermal stress applied to the TEC 70. can do. Furthermore, adhesive strength can be increased by increasing the area of contact with the side wall surfaces forming the first recesses 85A to 85L to enhance the anchoring effect. Furthermore, since the bonding area of the first adhesive 18 held in the first recesses 85A to 85L is stabilized, variations in thermal performance between individual pieces can be suppressed. Furthermore, by including the second recesses 95E to 95G recessed in the thickness direction of the support plate 11E, the adhesive holding portion 80E enhances the role of the second adhesive 19 as a buffer material and reduces thermal stress applied to the TEC 70. can do. Furthermore, adhesive strength can be increased by increasing the area of contact with the side wall surfaces forming the second recesses 95E to 95G to enhance the anchoring effect. Further, since the adhesion area of the second adhesive 19 held in the second recesses 95E to 95G is stabilized, variations in thermal performance between individual pieces can be suppressed. As described above, the optical module 1E can operate in a thermally stable manner.

In this embodiment, the first recesses 85A to 85L included in the adhesive holding portion 80E are formed with intervals between each other. Therefore, the total amount of the first adhesive 18 used can be reduced, resulting in an inexpensive configuration. Can be done. Further, the gas generated when the first adhesive 18 hardens can be easily discharged by the gaps 85M between the first adhesives 18 held in the first recesses 85A to 85L, and the voids formed by the gas remaining inside. can be reduced and the adhesive area can be stabilized. Further, the second recesses 95E to 95G included in the adhesive holding portion 80E are formed with intervals between each other, so that the total amount of the second adhesive 19 used can be reduced, resulting in an inexpensive configuration. Further, the gas generated when the second adhesive 19 hardens can be easily discharged by the gaps 95M between the second adhesives 19 held in the second recesses 95E to 95G, and the voids formed by the gas remaining inside. can be reduced and the adhesive area can be stabilized.

(Embodiment 6)
Next, Embodiment 6, which is still another embodiment, will be described. FIG. 17 is a schematic perspective view showing a support plate 11F included in the optical module according to the sixth embodiment. The optical module of the sixth embodiment differs from the fifth embodiment in that the shape of the first recess formed in the support plate 11F is different when viewed in the thickness direction of the support plate 11F.

Referring to FIG. 17, a surface 12A of a support plate 11F included in the optical module according to the sixth embodiment has 12 first recesses 86A recessed in the thickness direction of the support plate 11F as an adhesive holding portion 80F. , 86B, 86C, 86D, 86E, 86F, 86G, 86H, 86I, 86J, 86K, and 86L are formed. The first recesses 86A to 86L have a square outer shape when viewed in the thickness direction of the support plate 11F, and are spaced apart from each other.

Since the optical module 1F includes the first recesses 86A to 86L having the above configuration, the shape of the first adhesive 18 is regulated by the shape of the first recesses 86A to 86L included in the adhesive holding portion 80F, and 1. The shape of the adhesive 18 can be easily controlled. Furthermore, by including the first recesses 86A to 86L recessed in the thickness direction of the support plate 11F, the adhesive holding portion 80F enhances the role of the first adhesive 18 as a buffer material and reduces thermal stress applied to the TEC 70. can do. Furthermore, adhesive strength can be increased by increasing the area of contact with the side wall surfaces forming the first recesses 86A to 86L to enhance the anchoring effect. Further, since the bonding area of the first adhesive 18 held in the first recesses 86A to 86L is stabilized, variations in thermal performance between individual pieces can be suppressed. As described above, the optical module 1E can operate in a thermally stable manner.

In this embodiment, the first recesses 86A to 86L included in the adhesive holding portion 80F are formed with intervals between each other. Therefore, the total amount of the first adhesive 18 used can be reduced, resulting in an inexpensive configuration. Can be done. Further, the gas generated when the first adhesive 18 hardens can be easily discharged by the gaps between the first adhesives 18 held in the first recesses 86A to 86L, and the pores created by the gas remaining inside can be easily discharged. The adhesive area can be stabilized.

(Embodiment 7)
Next, Embodiment 7, which is still another embodiment, will be described. FIG. 18 is a schematic perspective view showing a support plate 11G included in the optical module according to the seventh embodiment. The optical module of Embodiment 7 differs from Embodiment 6 in that the shape and number of the first recesses formed in support plate 11G are different when viewed in the thickness direction of support plate 11G. .

Referring to FIG. 18, a surface 12A of a support plate 11G included in the optical module according to the seventh embodiment includes four first recesses 87A recessed in the thickness direction of the support plate 11G as an adhesive holding portion 80G; 87B, 87C, and 87D are formed. The four first recesses 87A to 87D are groove-shaped extending in the Y-axis direction, and are spaced apart from each other in the X-axis direction. The outer shape of the four first recesses 87A to 87D is a rectangle whose longitudinal direction is the Y-axis direction when viewed in the thickness direction of the support plate 11G.

Since the optical module includes the first recesses 87A to 87D having the above configuration, the shape of the first adhesive 18 is regulated by the shape of the first recesses 87A to 87D included in the adhesive holding portion 80G, and the first It becomes easier to control the shape of the adhesive 18. Furthermore, by including the first recesses 87A to 87D recessed in the thickness direction of the support plate 11F, the adhesive holding portion 80G enhances the role of the first adhesive 18 as a buffer material and reduces thermal stress applied to the TEC 70. can do. Furthermore, adhesive strength can be increased by increasing the area of contact with the side wall surfaces forming the first recesses 87A to 87D to enhance the anchoring effect. Furthermore, since the bonding area of the first adhesive 18 held in the first recesses 87A to 87D is stabilized, variations in thermal performance between individual pieces can be suppressed. As described above, the optical module can operate in a thermally stable manner. In this embodiment, since the first recesses 87A to 87D are groove-shaped, the wall surfaces forming the first recesses 87A to 87D and the first adhesive 18 are aligned in a direction perpendicular to the direction in which the grooves extend. The contact area becomes larger, and the adhesive strength in this direction can be selectively increased.

In this embodiment, the first recesses 87A to 87D included in the adhesive holding portion 80F are formed with intervals between each other. Therefore, the total amount of the first adhesive 18 used can be reduced, resulting in an inexpensive configuration. Can be done. Further, the gas generated when the first adhesive 18 hardens can be easily discharged by the gaps between the first adhesives 18 held in the first recesses 87A to 87D, and the pores created by the gas remaining inside can be easily discharged. The adhesive area can be stabilized.

(Embodiment 8)
Next, Embodiment 8, which is still another embodiment, will be described. FIG. 19 is a schematic cross-sectional view showing a part of the optical module 1H in Embodiment 8 with the cap removed. The optical module 1H of Embodiment 8 has the following points: instead of the first recess 81A formed in the support plate 11A, a first convex portion protruding in the thickness direction of the support plate is formed on the surface 12A; This is different from the case of Embodiment 1 in that a second convex portion that protrudes in the thickness direction of the support plate is formed on the surface 21B instead of the second concave portion 91A formed on the base plate 20A. are different.

Referring to FIG. 19, a surface 12A of a support plate 11H included in an optical module 1H in Embodiment 8 has a first convex portion 101A protruding in the thickness direction of the support plate 11H as an adhesive holding portion 80H. is formed. The first convex portion 101A includes a top surface 101B arranged parallel to the XY plane and a side wall surface 101C rising perpendicularly from the top surface 101B. The outer shape of the first convex portion 101A is elliptical when viewed in the thickness direction of the support plate 11H. Specifically, the direction in which the long axis extends is the X-axis direction, and the direction in which the short axis extends is the Y-axis direction. When viewed in the thickness direction of the support plate 11H, the first convex portion 101A is not exposed from the base plate 20H. The first adhesive 18 is held on the top surface 101B of the first convex portion 101A. The first adhesive 18 held on the top surface 101B contacts the TEC 70.

A second convex portion 111A protruding in the thickness direction of the support plate 11H is formed as an adhesive holding portion 80H on the surface 21B of the base plate 20H included in the optical module 1H in the eighth embodiment. The second convex portion 111A includes a top surface 111B arranged parallel to the XY plane and a side wall surface 111C rising perpendicularly from the top surface 111B. The outer shape of the second convex portion 111A is elliptical when viewed in the thickness direction of the support plate 11H. Specifically, the direction in which the long axis extends is the X-axis direction, and the direction in which the short axis extends is the Y-axis direction. The second adhesive 19 is held on the top surface 111B of the second convex portion 111A. The second adhesive 19 held on the top surface 111B contacts the TEC 70.

In the optical module 1H, an adhesive holding portion 80H including a first convex portion 101A protruding in the thickness direction of the support plate 11H is formed on the support plate 11H. Therefore, the shape of the first adhesive 18 is regulated by the shape of the first convex portion 101A included in the adhesive holding portion 80H, and it becomes easy to control the shape of the first adhesive 18. Further, in the optical module 1H, an adhesive holding portion 80H including a second convex portion 111A protruding in the thickness direction of the support plate 11H is formed on the base plate 20H. Therefore, the shape of the second adhesive 19 is regulated by the shape of the second convex portion 111A included in the adhesive holding portion 80H, and it becomes easy to control the shape of the second adhesive 19.

Since the adhesive holding portion 80H includes the first protrusion 101A that protrudes in the thickness direction of the support plate 11H, the first adhesive 18 is cured by utilizing the space on the side surface of the first protrusion 101A. This makes it easier to exhaust the gas that sometimes occurs from inside the adhesive. This prevents the formation of pores in the adhesive or the adhesive interface, and stabilizes the adhesive area, thereby suppressing variations in thermal performance between individual products. Since the adhesive holding portion 80H includes the second protrusion 111A that protrudes in the thickness direction of the support plate 11H, the second adhesive 19 can be cured by utilizing the space on the side surface of the second protrusion 111A. This makes it easier to exhaust the gas that sometimes occurs from inside the adhesive. This prevents the formation of pores in the adhesive or the adhesive interface, and stabilizes the adhesive area, thereby suppressing variations in thermal performance between individual products. As described above, the optical module can operate in a thermally stable manner.

(Embodiment 9)
Next, a ninth embodiment, which is still another embodiment, will be described. FIG. 20 is a schematic perspective view showing a part of the support plate 11J included in the optical module 1J in Embodiment 9. FIG. 21 is a schematic cross-sectional view showing a part of the optical module 1J with the cap shown in FIG. 20 removed. The optical module 1J of the ninth embodiment has the following features: first convex portions 102A, 102B, 102C, and 102D are formed in place of the first concave portions 84A, 84B, 84C, and 84D in the fourth embodiment; This embodiment is different from the fourth embodiment in that second protrusions 112A to 112D are formed instead of the second recesses 94A to 94D in the fourth embodiment.

Referring to FIGS. 20 and 21, on the surface 12A of the support plate 11J included in the optical module 1J in Embodiment 9, there are four grooves protruding in the thickness direction of the support plate 11J as adhesive holding portions 80J. 1 convex portions 102A, 102B, 102C, and 102D are formed. Surface 21B of base plate 20J included in optical module 1J in Embodiment 9 includes four second protrusions 112A to 112D that protrude in the thickness direction of support plate 11J as adhesive holding portions 80J. Of the four second protrusions 112A to 112D, FIG. 21 shows the second protrusions 112A and 112B provided at positions facing the first protrusions 102A and 102B, respectively. The outer shape of the four second protrusions 112A to 112D is the same as the outer shape of the four first protrusions 102A to 102D when viewed in the thickness direction of the support plate 11.

Since the optical module 1J includes the first convex portions 102A to 102D and the second convex portions 112A to 112D having the above configuration, variations in the adhesive strength of the first adhesive 18 and adhesive strength of the second adhesive 19 are Variations can be suppressed. In this embodiment, a gap 102E is created between the first adhesive 18 held by each of the first protrusions 102A to 102D. Gas generated when the first adhesive 18 is cured can easily escape through this gap 102E. Similarly, gas generated when the second adhesive 19 is cured can easily escape through the gap 112E created between the second adhesive 19 held by the second convex portions 112A to 112D. Therefore, the adhesive strength can be further increased. Therefore, the optical module 1J can ensure stable operation.

Since the optical module 1J includes the first convex portions 102A to 102D having the above configuration, the shape of the first adhesive 18 is regulated by the shape of the first convex portions 102A to 102D included in the adhesive holding portion 80J. , it becomes easier to control the shape of the first adhesive 18. Further, since the optical module 1J includes the second convex portions 112A to 112D having the above configuration, the shape of the second adhesive 19 depends on the shape of the second convex portions 112A to 112D included in the adhesive holding portion 80J. This makes it easy to control the shape of the second adhesive 19.

Furthermore, since the adhesive holding portion 80J includes the first protrusions 102A to 102D that protrude in the thickness direction of the support plate 11J, the spaces on the side surfaces of the first protrusions 102A to 102D can be used to 1. Gas generated when the adhesive 18 is cured can be easily discharged from inside the adhesive. This prevents the formation of pores in the adhesive or the bonding interface, and stabilizes the bonding area, making it possible to suppress variations in thermal performance between individual pieces. Since the adhesive holding portion 80J includes the second protrusions 112A to 112D that protrude in the thickness direction of the support plate 11J, the second adhesive Gas generated during curing of the adhesive 19 can be easily discharged from inside the adhesive. This prevents the formation of pores in the adhesive or the bonding interface, and stabilizes the bonding area, making it possible to suppress variations in thermal performance between individual pieces. As described above, the optical module 1J can operate in a thermally stable manner.

In this embodiment, the first convex parts 102A to 102D included in the adhesive holding part 80J are formed with intervals between each other. Therefore, the total amount of the first adhesive 18 used can be reduced and the cost is reduced. Can be configured. Further, the gas generated when the first adhesive 18 hardens can be easily discharged by the gaps 102E between the first adhesives 18 held by the first protrusions 102A to 102D, and the air space created by the gas remaining inside can be easily discharged. Pores can be reduced and the bonding area can be stabilized. Further, the second convex portions 112A to 112D included in the adhesive holding portion 80J are formed at intervals, so that the total amount of the second adhesive 19 used can be reduced, resulting in an inexpensive configuration. Further, the gas generated when the second adhesive 19 hardens can be easily discharged by the gaps 112E between the second adhesives 19 held by the second convex parts 112A to 112D, and the voids formed by the gas remaining inside. Pores can be reduced and the bonding area can be stabilized.

(Embodiment 10)
Next, Embodiment 10, which is still another embodiment, will be described. FIG. 22 is a schematic perspective view showing a support plate 11K included in an optical module 1K in Embodiment 10. FIG. 23 is a schematic cross-sectional view showing a part of the optical module 1K with the cap removed. The cross section shown in FIG. 23 is a cross section taken parallel to the XZ plane passing through the centers of first convex portions 103E, 103F, 103G, and 103H, which will be described later. The optical module 1K of the tenth embodiment has first convex portions 103A, 103B, 103C, 103D, 103E, 103F, 103G, 103H, 103I, 103J, instead of the first concave portions 85A to 85L in the fifth embodiment. 103K and 103L are formed, and second convex portions 113A to 113L are formed instead of the second concave portions 95A to 95L in the fifth embodiment. There is.

Referring to FIGS. 22 and 23, a surface 12A of a support plate 11K included in an optical module 1K in Embodiment 10 has 12 adhesive holding portions 80K protruding in the thickness direction of the support plate 11K. First convex portions 103A to 103L are formed. The outer shape of the first convex portions 103A to 103L is a circle when viewed in the thickness direction of the support plate 11K, and is spaced apart from each other in the X-axis direction and the Y-axis direction. Further, on the surface 21B of the base plate 20K included in the optical module 1K in the tenth embodiment, twelve second convex portions 113A to 113L are formed as an adhesive holding portion 80K. Among the twelve second protrusions 113A to 113L, in FIG. 23, second protrusions 113E, 113F, 113G, and 113H are provided at positions facing the first protrusions 103E, 103F, 103G, and 103H, respectively. is illustrated. The outer shape of the twelve second protrusions 113A to 113L is a circle when viewed in the thickness direction of the support plate 11K, and is spaced apart from each other in the X-axis direction and the Y-axis direction.

Since the optical module 1K includes the first convex portions 103A to 103L having the above configuration, the shape of the first adhesive 18 is regulated by the shape of the first convex portions 103A to 103L included in the adhesive holding portion 80K. , it becomes easier to control the shape of the first adhesive 18. Further, since the optical module 1K includes the second convex portions 113A to 113L having the above configuration, the shape of the second adhesive 19 depends on the shape of the second convex portions 113A to 113L included in the adhesive holding portion 80K. This makes it easy to control the shape of the second adhesive 19.

Furthermore, since the adhesive holding portion 80K includes the first convex portions 103A to 103L that protrude in the thickness direction of the support plate 11K, the space on the side surface side of the first convex portions 103A to 103L is used to create a first convex portion. 1. Gas generated when the adhesive 18 is cured can be easily discharged from inside the adhesive. This prevents the formation of pores in the adhesive or the adhesive interface, and stabilizes the adhesive area, thereby suppressing variations in thermal performance between individual products. Since the adhesive holding portion 80K includes the second protrusions 113A to 113L that protrude in the thickness direction of the support plate 11K, the second adhesive Gas generated during curing of the adhesive 19 can be easily discharged from inside the adhesive. This prevents the formation of pores in the adhesive or the adhesive interface, and stabilizes the adhesive area, thereby suppressing variations in thermal performance between individual products. As described above, the optical module 1K can operate in a thermally stable manner.

In this embodiment, the first convex parts 103A to 103L included in the adhesive holding part 80K are formed with intervals between each other. Therefore, the total amount of the first adhesive 18 used can be reduced and the cost is reduced. Can be configured. Further, the gas generated when the first adhesive 18 hardens can be easily discharged by the gaps 103M between the first adhesives 18 held by the first protrusions 103A to 103L, and the air space created by the gas remaining inside can be easily discharged. Pores can be reduced and the bonding area can be stabilized. Further, the second convex portions 113A to 113L included in the adhesive holding portion 80K are formed at intervals, so that the total amount of the second adhesive 19 used can be reduced, resulting in an inexpensive configuration. Further, the gas generated when the second adhesive 19 hardens can be easily discharged by the gaps 113M between the second adhesives 19 held by the second convex portions 113A to 113L, and the voids formed by the gas remaining inside. Pores can be reduced and the bonding area can be stabilized.

(Embodiment 11)
Next, Embodiment 11, which is still another embodiment, will be described. FIG. 24 is a schematic perspective view showing a support plate 11L included in the optical module according to the eleventh embodiment. The optical module of the eleventh embodiment has twelve first convex portions 104A, 104B, 104C, 104D, which protrude in the thickness direction of the support plate 11L, instead of the first concave portions 86A to 86L in the sixth embodiment. This embodiment differs from the sixth embodiment in that 104E, 104F, 104G, 104H, 104I, 104J, 104K, and 104L are formed.

Referring to FIG. 24, a surface 12A of a support plate 11L included in the optical module in Embodiment 11 has 12 first protrusions protruding in the thickness direction of the support plate 11L as an adhesive holding portion 80L. Sections 104A to 104L are formed. The first protrusions 104A to 104L have a square outer shape when viewed in the thickness direction of the support plate 11L, and are spaced apart from each other.

Since the optical module includes the first convex portions 104A to 104L having the above configuration, the shape of the first adhesive 18 is regulated by the shape of the first convex portions 104A to 104L included in the adhesive holding portion 80L, It becomes easier to control the shape of the first adhesive 18.

In addition, since the adhesive holding portion 80L includes the first protrusions 104A to 104L that protrude in the thickness direction of the support plate 11L, the space on the side surface of the first protrusions 104A to 104L can be used to 1. Gas generated when the adhesive 18 is cured can be easily discharged from inside the adhesive. This prevents the formation of pores in the adhesive or the adhesive interface, and stabilizes the adhesive area, thereby suppressing variations in thermal performance between individual products. As described above, the optical module 1K can operate in a thermally stable manner.

In this embodiment, the first convex parts 104A to 104L included in the adhesive holding part 80L are formed with intervals between each other, so that the total amount of the first adhesive 18 used can be reduced and the cost is reduced. Can be configured. Further, the gas generated when the first adhesive 18 hardens can be easily discharged by the gaps between the first adhesives 18 held by the first protrusions 104A to 104L, and the voids formed by the gas remaining inside. can be reduced and the adhesive area can be stabilized.

(Embodiment 12)
Next, Embodiment 12, which is still another embodiment, will be described. FIG. 25 is a schematic perspective view showing a support plate 11M included in the optical module according to the twelfth embodiment. In the optical module of the twelfth embodiment, four first convex portions 105A, 105B, 105C, and 105D protruding in the thickness direction of the support plate 11M are formed instead of the first concave portions 87A to 87D in the seventh embodiment. This embodiment differs from the seventh embodiment in that it is

Referring to FIG. 25, a surface 12A of a support plate 11M included in the optical module in Embodiment 12 has four first convex portions protruding in the thickness direction of the support plate 11M as an adhesive holding portion 80M. 105A to 105D are formed. The four first protrusions 105A to 105D have a ridge shape extending in the Y-axis direction, and are spaced apart from each other in the X-axis direction. The outer shape of the four first convex portions 105A to 105D is a rectangle whose longitudinal direction is the Y-axis direction when viewed in the thickness direction of the support plate 11M.

Since the optical module includes the first convex portions 105A to 105D having the above configuration, the shape of the first adhesive 18 is regulated by the shape of the first convex portions 105A to 105D included in the adhesive holding portion 80M, It becomes easier to control the shape of the first adhesive 18.

Furthermore, since the adhesive holding portion 80M includes the first protrusions 105A to 105D that protrude in the thickness direction of the support plate 11M, the spaces on the side surfaces of the first protrusions 105A to 105D can be used to 1. Gas generated when the adhesive 18 is cured can be easily discharged from inside the adhesive. This prevents the formation of pores in the adhesive or the adhesive interface, and stabilizes the adhesive area, thereby suppressing variations in thermal performance between individual products. As described above, the optical module can operate in a thermally stable manner.

In this embodiment, the first convex portions 105A to 105D included in the adhesive holding portion 80M are formed at intervals, so that the total amount of the first adhesive 18 used can be reduced and the cost is reduced. Can be configured. Further, the gas generated when the first adhesive 18 hardens can be easily discharged by the gaps between the first adhesive 18 held by the first convex parts 105A to 105D, and the voids formed by the gas remaining inside. can be reduced and the adhesive area can be stabilized.

(Embodiment 13)
Next, a thirteenth embodiment, which is still another embodiment, will be described. FIG. 26 is a schematic perspective view showing the TEC 120 included in the optical module according to the thirteenth embodiment. The optical module of Embodiment 13 is different from Embodiment 1 in that a concave portion recessed in the thickness direction of the support plate is formed in heat absorption plate 71 instead of heat absorption plate 71 included in TEC 70 of Embodiment 1. The case is different.

Referring to FIG. 26, a recess 123 recessed in the thickness direction of the support plate is formed as an adhesive holding portion 80N on the surface 122 of the heat absorption plate 121 of the TEC 120 included in the optical module in the thirteenth embodiment. . The outer shape of the recess 123 is an ellipse when viewed in the thickness direction of the support plate.

Since the optical module includes the recess 123 having the above configuration, the shape of the second adhesive 19 is regulated by the shape of the recess 123 included in the adhesive holding part 80N, and the shape of the second adhesive 19 can be controlled. becomes easier. Further, since the adhesive holding portion 80N includes the recessed portion 123 recessed in the thickness direction of the support plate, the role of the second adhesive 19 as a buffer material can be enhanced and the thermal stress applied to the TEC 70 can be reduced. Moreover, adhesive strength can be increased by increasing the contact area with the side wall surface constituting the recess 123 to enhance the anchoring effect. Furthermore, since the bonding area of the second adhesive 19 held in the recess 123 is stabilized, variations in thermal performance between individual pieces can be suppressed. As described above, the optical module can operate in a thermally stable manner.

It should be understood that the embodiments disclosed herein are illustrative in all respects and are not restrictive in any respect. The scope of the present invention is defined not by the above description but by the claims, and it is intended that all changes within the meaning and scope equivalent to the claims are included.

The optical module of the present disclosure can be particularly advantageously applied when thermally stable operation is required.

1A, 1B, 1C, 1D, 1E, 1H, 1J, 1K Optical module 11A, 11B, 11C, 11D, 11E, 11F, 11G, 11H, 11J, 11K, 11L, 11M Support plate 12A, 12B, 21A, 21B, 122 Surface 13 Light forming part 14 Cap 15 Output window 16 Lead pin 17 Thermistor 18 First adhesive 19 Second adhesive 20A, 20B, 20C, 20D, 20E, 20H, 20H, 20J, 20K Base plate 22 Base area 23 Chip mounting Regions 24A, 24B, 24C, 25A, 25B, 25C, 26A, 26B, 26C, 27 Region 31 First submount 32 Second submount 33 Third submount 41 Red laser diode 42 Green laser diode 43 Blue laser diode 51 1 lens 52 2nd lens 53 3rd lens 61 1st filter 62 2nd filter 63 3rd filter 70, 120 TEC
71, 121 Heat absorbing plate 72 Heat dissipating plate 73 Semiconductor pillars 80A, 80B, 80C, 80D, 80E, 80F, 80G, 80H, 80J, 80K, 80L, 80M, 80N Adhesive holding part 81A, 81B, 81C, 84A, 84B, 84C, 84D, 85A, 85B, 85C, 85D, 85E, 85F, 85G, 85H, 85I, 85J, 85K, 85L, 86A, 86B, 86C, 86D, 86E, 86F, 86G, 86H, 86I, 86J, 86K, 86L, 87A, 87B, 87C, 87D, 91A, 94A, 94B, 94C, 94D, 95E, 95F, 95G, 95H, 123 Recess 82A, 92A Bottom wall surface 83A, 93A, 101C, 111C Side wall surface 84E, 85M, 94E, 95M, 102E, 103M, 112E, 113M Gap 101A, 102A, 102B, 102C, 102D, 103A, 103B, 103C, 103D, 103E, 103F, 103G, 103H, 103I, 103J, 103K, 103L, 104A, 104B, 1 04C, 104D, 104E, 104F, 104G, 104H, 104I, 104J, 104K, 104L, 105A, 105B, 105C, 105D, 111A, 112A, 112B, 113E, 113F, 113G, 113H Convex portion 101B, 111B Top surface D ₁ , D ₂ depth

Claims (10)

a light forming section configured to form light;
a support plate that supports the light forming section;
The light forming section is
A semiconductor light emitting device,
a base portion on which the semiconductor light emitting device is mounted;
an electronic cooling module that adjusts the temperature of the semiconductor light emitting device;
a first adhesive for bonding the electronic cooling module and the base portion;
a second adhesive for bonding the support plate and the electronic cooling module;
At least one of the base portion, the electronic cooling module, and the support plate includes an adhesive holding portion that holds at least one of the first adhesive and the second adhesive. is formed,
The adhesive holding portion is at least one of a convex portion protruding in the thickness direction of the support plate and a concave portion recessed in the thickness direction of the support plate,
When the adhesive holding portion is the convex portion, the first adhesive or the second adhesive is held on the top surface of the convex portion, and the held first adhesive is The second adhesive that is in contact with or held by the cooling module and the base portion is in contact with the support plate and the electronic cooling module,
When the adhesive holding portion is a recess, a portion of the first adhesive or the second adhesive in the thickness direction of the support plate is accommodated in the recess , and the thickness of the support plate is When viewed in the horizontal direction, the shape is regulated by the shape of the recess , and a portion of the first adhesive exposed from the recess in the thickness direction of the support plate contacts the electronic cooling module or the base portion. Alternatively, an optical module, wherein a portion of the second adhesive exposed from the recess in the thickness direction of the support plate contacts the support plate or the electronic cooling module. The optical module according to claim 1, wherein the adhesive holding portion has a rectangular outer shape when viewed in the thickness direction of the support plate. The optical module according to claim 1, wherein the adhesive holding portion has an outer shape of a rectangle with rounded corners when viewed in the thickness direction of the support plate. The optical module according to claim 1, wherein the adhesive holding portion has a circular or elliptical external shape when viewed in the thickness direction of the support plate. The optical module according to any one of claims 1 to 4, wherein a plurality of said adhesive holding parts are formed at intervals. From claim 1, wherein the thickness of at least one of the first adhesive and the second adhesive held by the adhesive holding portion in the thickness direction of the support plate is 50 μm or more. The optical module according to claim 5. The optical module according to claim 6, wherein the support plate of at least one of the first adhesive and the second adhesive held by the adhesive holding portion has a thickness of 100 μm or more. The optical module according to any one of claims 1 to 7, wherein the light forming section further includes a lens that converts a spot size of light emitted from the semiconductor light emitting element. The light forming section is
a plurality of the semiconductor light emitting devices;
The optical module according to any one of claims 1 to 8, further comprising a filter that multiplexes light emitted from the plurality of semiconductor light emitting elements. The optical module according to any one of claims 1 to 9, further comprising a cap that covers the light forming section.

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