JP7379072B2 - Film forming equipment, electronic device manufacturing equipment, film forming method, and electronic device manufacturing equipment - Google Patents

Description

The present invention relates to a film forming apparatus for forming a film of a film forming material on a substrate through a mask, an electronic device manufacturing apparatus, a film forming method, and an electronic device manufacturing apparatus.

The field of application of organic EL display devices (organic EL displays) is expanding not only to smartphones, televisions, and automobile displays, but also to VR-HMDs (Virtual Reality Head Mount Displays) and the like. In these devices, it is desired to form pixel patterns with high precision. In particular, displays used in VR HMDs are required to form pixel patterns with higher precision in order to prevent users from being dizzy.

In the production of organic EL display devices (organic EL displays), when forming the organic light emitting elements (organic EL devices; OLEDs) that constitute the organic EL display devices, the film emitted from the film forming source of the film forming apparatus is An organic layer and a metal layer are formed by depositing a material on a substrate through a mask on which a pixel pattern is formed.

In such a film forming apparatus, in order to improve film forming accuracy, the relative positional relationship between the substrate and the mask is measured before the film forming process, and if the position is misaligned, the substrate and/or mask is These positions are adjusted (aligned) by moving them relatively.

To measure the relative positional relationship between the substrate and mask, use an alignment camera installed on the outside (atmosphere side) top surface of the vacuum chamber to photograph the alignment marks formed on each of the substrate and mask inside the vacuum chamber. It is done by doing.

If the distance from the outer top surface of the vacuum container, which is the installation surface of the alignment camera, to the substrate or mask is long, it may be difficult for the alignment camera to focus on the alignment mark on the substrate or mask. If the image is out of focus, alignment accuracy will decrease.

Additionally, when the thickness of the substrate processed by the film deposition equipment changes, it is difficult for an alignment camera fixed to the top outside of the vacuum chamber to accurately focus on the alignment marks formed on the substrate or mask. , alignment accuracy may decrease.

Japanese Patent Application Publication No. 2012-033468

An object of the present invention is to provide a film forming apparatus, an electronic device manufacturing apparatus, a film forming method, and an electronic device manufacturing apparatus that can improve measurement accuracy using an alignment camera.

The present invention employs the following means to solve the above problems.

That is, the film forming apparatus of the present invention is a film forming apparatus for forming a film forming material onto a substrate through a mask,
a vacuum container,
a substrate holding unit provided in the vacuum container for holding the substrate;
a mask support unit provided in the vacuum container for supporting a mask;
an alignment camera unit installed on the atmospheric side of the vacuum container and having an alignment camera for measuring the relative positional relationship between the substrate and the mask;
a film-forming source provided in the vacuum container, storing a film-forming material, and discharging the film-forming material in particles;
Equipped with
The alignment camera is installed so as to protrude inside the vacuum container ,
The alignment camera unit includes a camera adjustment stage section that can move the alignment camera relative to the vacuum container, and a vibration isolation mount provided between the camera adjustment stage section and the vacuum container. It is characterized by having the following .

Further, the electronic device manufacturing apparatus of the present invention includes:
The above film forming apparatus,
a mask stock device for storing a mask;
a transport device for transporting at least one of the substrate and the mask;
It is characterized by having the following.

Furthermore, the film forming method of the present invention includes:
It has an alignment camera, a camera adjustment stage section that can move the alignment camera relative to the vacuum container, and a vibration isolation pedestal provided between the camera adjustment stage section and the vacuum container. A film deposition method for depositing a deposition material onto a substrate through a mask using an alignment camera unit, the method comprising:
carrying a mask into the vacuum container of the film forming apparatus;
carrying a substrate into the vacuum container;
holding the substrate in a substrate holding unit within the vacuum container;
The relative positional relationship between the substrate and the mask is measured using the alignment camera installed on the atmospheric side of the vacuum container and protruding into the inside of the vacuum container through the vacuum container. step and
adjusting the relative positional relationship between the substrate and the mask by moving the substrate holding unit by an alignment stage mechanism provided in the vacuum container based on the measured relative positional relationship; ,
bringing the mask into close contact with the film-forming surface of the substrate;
forming a film on the substrate through the mask, using a film forming material that has been pulverized by the film forming source in the vacuum container;
It is characterized by having the following.

Furthermore, the method for manufacturing an electronic device of the present invention is characterized in that the electronic device is manufactured using the above film forming method.

According to the present invention, measurement accuracy by an alignment camera can be improved.

FIG. 1 is a schematic configuration diagram showing a part of an electronic device manufacturing apparatus according to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view of a film forming apparatus according to an embodiment of the present invention. FIG. 3 is a schematic configuration diagram of a magnetic levitation stage mechanism according to an embodiment of the present invention. FIG. 4 is a schematic cross-sectional view of a magnetically levitated stage mechanism according to an embodiment of the present invention. FIG. 5 is a schematic configuration diagram of a magnetically levitated linear motor according to an embodiment of the present invention. FIG. 6 is a schematic configuration diagram of a magnetically levitated linear motor according to an embodiment of the present invention. FIG. 7 is a schematic cross-sectional view of the self-weight canceling mechanism according to the embodiment of the present invention. FIG. 8 is a schematic cross-sectional view showing the structure around the alignment camera unit according to the embodiment of the present invention. FIG. 9 is an enlarged view of a part of FIG. 8. FIG. 10 is a schematic configuration diagram of the electronic device.

Hereinafter, preferred embodiments and examples of the present invention will be described with reference to the drawings. However, the following embodiments and examples exemplarily represent preferred configurations of the present invention, and the scope of the present invention is not limited to these configurations. In addition, in the following description, the hardware configuration and software configuration of the device, processing flow, manufacturing conditions, dimensions, materials, shape, etc. are intended to limit the scope of the present invention to only these, unless otherwise stated. It doesn't belong to.

The present invention can be applied to an apparatus that performs film formation by depositing various materials on the surface of a substrate, and can be suitably applied to an apparatus that forms a thin film (material layer) with a desired pattern by vacuum evaporation. .

As the material of the substrate, any material such as semiconductor (for example, silicon), glass, film of polymeric material, metal, etc. can be selected. As the substrate, for example, a silicon wafer or a substrate in which a polyimide film or the like is laminated on a glass substrate can be used. Further, as the film forming material, any material such as an organic material or a metallic material (metal, metal oxide, etc.) can be selected.

Note that the present invention is not limited to a vacuum evaporation apparatus using thermal evaporation, but can also be applied to various film forming apparatuses such as a sputtering apparatus and a CVD (Chemical Vapor Deposition) apparatus. Specifically, the technology of the present invention is applicable to various electronic devices such as semiconductor devices, magnetic devices, and electronic components, and manufacturing equipment for optical components and the like. Specific examples of electronic devices include light emitting elements, photoelectric conversion elements, touch panels, and the like. The present invention is particularly suitably applicable to manufacturing apparatuses for organic light-emitting devices such as OLEDs and organic photoelectric conversion devices such as organic thin-film solar cells. Note that the electronic device in the present invention also includes a display device (for example, an organic EL display device) equipped with a light emitting element, a lighting device (for example, an organic EL lighting device), and a sensor (for example, an organic CMOS image sensor) equipped with a photoelectric conversion element. It will be done.

<Electronic device manufacturing equipment>
With reference to FIG. 1, the overall configuration of an electronic device manufacturing apparatus according to this embodiment will be described. FIG. 1 is a schematic configuration diagram showing a part of an electronic device manufacturing apparatus according to an embodiment of the present invention, and shows the schematic configuration when a part of the electronic device manufacturing apparatus is viewed from above.

This manufacturing apparatus is used, for example, to manufacture a display panel in an organic EL display device for a VR HMD. In the case of a display panel for a VR HMD, for example, after film formation is performed to form organic EL elements on a silicon wafer of a predetermined size, silicon is deposited along areas between element formation areas (scribe areas). The wafer is cut and fabricated into multiple smaller sized panels.

The electronic device manufacturing apparatus according to this embodiment generally includes a plurality of cluster apparatuses 1 and a relay apparatus that connects the cluster apparatuses 1. The cluster device 1 includes a film forming device 11 that performs processing (for example, film formation) on a substrate W, a mask stock device 12 that stores masks M before and after use, and a transfer chamber 13 (transfer device) arranged in the center thereof. It is equipped with The transfer chamber 13 is connected to each of the film forming apparatus 11 and the mask stock apparatus 12, as shown in FIG.

A transport robot 14 that transports the substrate W and the mask M is arranged within the transport chamber 13 . The transfer robot 14 is, for example, a robot having a structure in which a robot hand for holding a substrate W or a mask M is attached to a multi-joint arm.

In the film forming apparatus 11, a film forming material discharged from a film forming source is formed on a substrate W via a mask M. A series of film formation processes such as transfer operation of the substrate W and mask M by the transfer robot 14, adjustment (alignment) operation of the relative position between the substrate W and the mask M, fixing of the substrate W on the mask, and film formation are performed. , is performed by the film forming apparatus 11.

In an apparatus for manufacturing an organic EL display device, the film forming apparatus 11 can be divided into a film forming apparatus for organic films and a film forming apparatus for metal films, depending on the type of material to be formed. A film forming apparatus for an organic film forms a film on a substrate W using an organic film forming material by vapor deposition or sputtering, and a film forming apparatus for a metal film forms a film on a substrate W by vapor depositing or sputtering a metallic film forming material. do.

In the manufacturing equipment for organic EL display devices, which film-forming device is placed at which position depends on the stacked structure of the organic EL element to be manufactured. A plurality of film forming apparatuses are arranged.

In the case of an organic EL element, it usually has a structure in which a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, an electron injection layer, and a cathode are laminated in this order on a substrate W on which an anode is formed. A film forming apparatus is appropriately arranged along the flow direction of the substrate so that these layers can be sequentially formed.

For example, in FIG. 1, the film forming apparatus 11a forms a hole injection layer HIL and/or a hole transport layer HTL, the film forming apparatuses 11b and 11f form a blue light emitting layer, and the film forming apparatus 11c forms a blue light emitting layer. The film forming apparatuses 11d and 11e form a green light emitting layer, the film forming apparatus 11g forms an electron transport layer ETL and/or an electron injection layer EIL, and the film forming apparatus 11h forms a red light emitting layer. are arranged to form a cathode metal film. Due to the characteristics of the material, the film formation speed of the blue and green light emitting layers is slower than the film formation speed of the red light emitting layer, so in order to balance the processing speed, the blue and green light emitting layers are combined. Films are formed using two film forming apparatuses. However, the present invention is not limited to this, and other arrangement structures may also be adopted.

In the mask stock device 12, a new mask used in the film forming process in the film forming device 11 and a used mask are stored separately in two cassettes. The transport robot 14 transports a used mask from the film forming apparatus 11 to a cassette of the mask stock apparatus 12, and transports a new mask stored in another cassette of the mask stock apparatus 12 to the film forming apparatus 11.

The relay device that connects the plurality of cluster devices 1 is also equipped with a pass chamber 15 for transporting a substrate W from one cluster device 1 to another.

The transport robot 14 disposed in the transport chamber 13 receives the substrate W from the pass chamber 15 on the upstream side and transports it to one of the film forming apparatuses 11 (for example, the film forming apparatus 11a) in the cluster apparatus 1. Further, the transfer robot 14 receives the substrate W for which the film formation process has been completed in the cluster apparatus 1 from one of the plurality of film formation apparatuses 11 (for example, the film formation apparatus 11e), and receives the substrate W from one of the film formation apparatuses 11 (for example, the film formation apparatus 11e), Transfer to room 15.

In addition to the pass chamber 15, the relay device includes a buffer chamber (not shown) for absorbing the difference in processing speed of substrates W between the cluster device 1 on the upstream side and the cluster device 1 on the downstream side, and A turning chamber (not shown) for changing the temperature can be provided. For example, the buffer chamber is equipped with a substrate loading section that temporarily stores a plurality of substrates W. Further, the turning chamber is equipped with a substrate turning mechanism (for example, a rotation stage or a transfer robot) for turning the substrate W by 180 degrees. Thereby, the orientation of the substrates W can be made the same in the upstream cluster device and the downstream cluster device, and substrate processing can be facilitated.

Further, it is also possible to adopt a configuration in which the pass chamber 15 includes a substrate loading section (not shown) for temporarily storing a plurality of substrates W and a substrate rotation mechanism. In other words, the pass chamber 15 can also have the functions of a buffer chamber and a turning chamber.

The film forming device 11, mask stock device 12, transfer chamber 13, etc. that constitute the cluster device 1 are maintained in a high vacuum state during the manufacturing process of the organic light emitting device. The pass chamber 15 of the relay device is normally maintained in a low vacuum state, but may be maintained in a high vacuum state if necessary.

The substrate W on which the formation of the plurality of layers constituting the organic EL element has been completed is processed by a sealing device (not shown) for sealing the organic EL element and a cutting device (not shown) for cutting the substrate into a predetermined panel size. (not shown), etc.

In this embodiment, an electronic device manufacturing apparatus as shown in FIG. It is also possible to adopt a configuration in which the arrangement between the two is different.

For example, the electronic device manufacturing apparatus according to the present invention is applicable not only to a cluster type as shown in FIG. 1 but also to an inline type. In the case of an in-line type electronic device manufacturing apparatus, the substrate W and the mask M are mounted on a carrier, and film formation is performed while the substrate W and the mask M pass together with the carrier through a plurality of film forming apparatuses arranged in a row. be exposed. Further, the electronic device manufacturing apparatus according to the present invention can also employ a structure that combines a cluster type and an in-line type. For example, a cluster type manufacturing apparatus may be used to form the organic layer, and an in-line type manufacturing apparatus may be used to perform the electrode layer (cathode layer) forming process, sealing process, cutting process, and the like.

<Film forming equipment>
With reference to FIG. 2, the film forming apparatus 11 according to this embodiment will be described in more detail. FIG. 2 is a schematic cross-sectional view of a film forming apparatus according to an embodiment of the present invention. In the following description, an XYZ orthogonal coordinate system is used in which the vertical direction is the Z direction and the horizontal plane (the surface of the substrate during film formation) is the XY plane. Further, the rotation angle around the X axis is represented by _θX , the rotation angle around the Y axis is represented by _θY , and the rotation angle around the Z axis is represented by _θZ .

FIG. 2 shows an example of a film forming apparatus 11 that evaporates or sublimates a film forming material by heating and forms a film on a substrate W through a mask M. The film forming apparatus 11 includes a vacuum container 21 maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas, and is provided within the vacuum container 21, and is configured to control the position of the substrate W in at least the X direction, the Y direction, and the θ _Z direction. a magnetically levitated stage mechanism 22 for adjustment, a mask support unit 23 provided in the vacuum container 21 to support the mask M, and a substrate adsorption means provided in the vacuum container 21 to adsorb and hold the substrate W. 24, and a film-forming source 25 that stores a film-forming material and releases the particulate material during film-forming. Further, it is preferable that the film forming apparatus 11 further includes a magnetic force applying means 26 for bringing the mask M into close contact with the substrate W side by magnetic force.

The vacuum container 21 in the film forming apparatus 11 according to the present embodiment includes a first vacuum container section 211 in which the magnetic levitation stage mechanism 22 is arranged, and a second vacuum container section 212 in which the film forming source 25 is arranged. The entire internal space of the vacuum container 21 is maintained in a high vacuum state by, for example, a vacuum pump (not shown) connected to the second vacuum container section 212.

Further, an expandable member 213 is installed at least between the first vacuum container section 211 and the second vacuum container section 212. The expandable member 213 allows vibrations from a vacuum pump connected to the second vacuum container section 212 and vibrations from the floor on which the film forming apparatus 11 is installed to be transmitted through the second vacuum container section 212 to the first vacuum container. 211. For example, a bellows can be used as the expandable member 213. However, the present invention is not limited to this, and other members may be used as long as the transmission of vibration between the first vacuum container section 211 and the second vacuum container section 212 can be reduced. good.

As described above, in this embodiment, the vacuum container 21 is divided into a plurality of container parts (for example, the first vacuum container part 211 and the second vacuum container part 212), and the expandable member 213 is provided between them. ing. Thereby, it is possible to reduce the transmission of external vibrations to the first vacuum container section 211 in which the magnetic levitation stage mechanism 22 is installed.

The vacuum container 21 includes a reference plate 214 to which the magnetic levitation stage mechanism 22 is fixedly connected, and a reference plate support portion 215 for supporting the reference plate 214 at a predetermined height. As shown in FIG. 2, it is preferable to further install an expandable member 213 between the reference plate 214 and the first vacuum container part 211. Thereby, transmission of external vibrations to the magnetically levitated stage mechanism 22 via the reference plate 214 can be further reduced.

The vacuum container 21 is provided with a reference plate 214, that is, a vacuum compatible cylinder 212 installed on the upper container wall of the vacuum container 21 so as to protrude inside the vacuum container 21 (see FIG. 8). The alignment camera of the alignment camera unit 27 is inserted into the atmosphere side of the vacuum compatible tube 212. The vacuum compatible tube 212 will be explained in more detail later.

A vibration isolation unit 216 is installed between the reference plate support section 215 and the installation stand 217 of the film forming apparatus 11. The vibration isolating unit 216 plays a role of suppressing vibrations from being transmitted from the floor or the like on which the film forming apparatus 11 is installed to the reference plate support part 215 through the installation stand 217 of the film forming apparatus 11 . As for the vibration isolating unit 216, a mechanism that absorbs vibrations from the outside using pneumatic pressure or hydraulic pressure can be adopted, or a mechanism that absorbs vibrations using elastic means such as a spring can be adopted. can also be adopted.

The magnetic levitation stage mechanism 22 is an example of an alignment stage mechanism for adjusting the position of the substrate W or the substrate suction means 24 based on information photographed by the alignment camera unit 27. The magnetic levitation stage mechanism 22 according to the present embodiment is a stage mechanism for adjusting the position of the substrate W or the substrate adsorption means 24 by a magnetic levitation linear motor, and is at least in the X direction, Y direction, θ _{and Z} direction, preferably , the X direction, the Y direction, the Z direction, the θ _X direction, the θ _Y direction, and the θ _Z direction.

The magnetically levitated stage mechanism 22 includes a stage reference plate portion 221 (first plate portion) that functions as a fixed table, a fine movement stage plate portion 222 (second plate portion) that functions as a movable table, and a fine movement stage plate portion 222 that A magnetic levitation unit 223 is provided for moving the stage with respect to the stage reference plate portion 221 while levitating it by force. A specific configuration and mechanism for moving the substrate W and the substrate adsorption means 24 by the magnetic levitation stage mechanism 22 will be described in more detail later.

The mask support unit 23 has a function of receiving the mask M transported by the transport robot 14 provided in the transport chamber 13 and holding the mask, and is also called a mask holder.

The mask support unit 23 is installed so as to be movable up and down at least in the vertical direction. Thereby, the distance between the substrate W and the mask M in the vertical direction can be easily adjusted. As in this embodiment, when the position of the substrate W is adjusted by the magnetically levitated stage mechanism 22, the mask support unit 23 that supports the mask M is moved by a motor (not shown) and a ball screw or a guide (not shown). It is desirable to be able to move up and down mechanically.

Further, for the mask support unit 23, a configuration that is movable in the horizontal direction (that is, in the _XYθZ directions) can also be adopted. In this case, even if the mask M is out of the field of view of the alignment camera, it can be quickly moved into the field of view.

The mask support unit 23 further includes a mask pickup 231 for temporarily receiving the mask M carried into the vacuum container 21 by the transfer robot 14. The mask pickup 231 is configured to be able to move up and down relative to the mask support surface of the mask support unit 23. For example, as shown in FIG. 2, the mask pickup 231 is configured to be movable up and down relative to the mask support surface of the mask support unit 23 by the mask pickup elevating mechanism 232. However, the present invention is not limited to this, and may have other configurations as long as the mask pickup 231 and the mask support surface of the mask support unit 23 can be moved up and down relative to each other. For example, the mask pickup 231 may be fixed to the reference plate 214 or the stage reference plate portion 221 of the magnetically levitated stage mechanism 22, and instead, the mask support unit 23 may be configured to be movable up and down. Alternatively, a configuration in which both the mask pickup 231 and the mask support unit 23 can be raised and lowered may be adopted.

The mask pickup 231 that has received the mask M from the hand of the transfer robot 14 descends relative to the mask support surface of the mask support unit 23 and lowers the mask M onto the mask support surface of the mask support unit 23 . Conversely, when carrying out a used mask M, the mask M is lifted from the mask support surface of the mask support unit 23, and the hand of the transfer robot 14 receives the mask M.

The mask M has an opening pattern corresponding to the thin film pattern formed on the substrate W, and is supported by the mask support unit 23. For example, the mask M used to manufacture organic EL display panels for VR-HMDs is a fine metal mask on which fine opening patterns are formed that correspond to the RGB pixel patterns of the light emitting layer of organic EL elements. A metal mask (Fine Metal Mask) and an open mask used to form common layers (hole injection layer, hole transport layer, electron transport layer, electron injection layer, etc.) of organic EL elements are used. be done. The opening pattern of the mask M is defined by a blocking pattern that does not allow particles of the deposition material to pass through.

The substrate suction means 24 is an example of a substrate holding unit for holding the substrate W. The substrate suction means 24 has a function of suctioning and holding the substrate W, which is a film-forming object and an adsorbed object, which is transported by the transport robot 14 . This substrate adsorption means 24 is fixed to a fine movement stage plate section 222 which is a movable base in the magnetically levitated stage mechanism 22.

As the substrate adsorption means 24, for example, an electrostatic chuck having a structure in which an electric circuit such as a metal electrode is embedded in a dielectric or insulator (eg, ceramic material) matrix can be employed.

The electrostatic chuck as the substrate adsorption means 24 uses a Coulomb force, in which a dielectric material with relatively high resistance is interposed between the electrode and the adsorption surface, and adsorption is performed by the Coulomb force between the electrode and the object to be adsorbed. type electrostatic chuck can be adopted. In addition, as an electrostatic chuck, a dielectric material with relatively low resistance is interposed between the electrode and the attraction surface, and the attraction is achieved by the Johnson-Rahbeck force generated between the attraction surface of the dielectric material and the object to be attracted. Electrostatic chucks of the Johnson-Rahbek force type can also be employed. Further, as the electrostatic chuck, a gradient force type electrostatic chuck that attracts an object to be attracted by a non-uniform electric field can also be employed.

When the object to be attracted is a conductor or a semiconductor (silicon wafer), it is preferable to use a Coulomb force type electrostatic chuck or a Johnson-Rahbek force type electrostatic chuck. In this case, it is preferable to use a gradient force type electrostatic chuck.

The electrostatic chuck may be formed with one plate or may be formed with a plurality of sub-plates. Furthermore, even when the plate is formed of a single plate, it is preferable to include a plurality of electric circuits therein so that the electrostatic attraction force can be controlled to vary depending on the position within the single plate.

Although not shown in FIG. 2, the film forming apparatus 11 temporarily holds the substrate W carried into the vacuum container 21 by the transport robot 14 before the substrate suction means 24 adsorbs and holds the substrate W. The device may further include a substrate support unit that holds the substrate. For example, the substrate support unit can be provided integrally with the mask support unit 23. That is, in the mask support unit 23, the substrate support unit can be configured by providing a substrate support surface that supports the substrate W at a position different from the mask support surface that supports the mask M.

Although not shown in FIG. 2, cooling means (for example, a cooling plate) for suppressing the temperature rise of the substrate W may be provided on the side opposite to the suction surface of the substrate suction means 24. This makes it possible to suppress alteration and deterioration of the organic material deposited on the substrate W.

The film-forming source 25 includes a crucible (not shown) in which a film-forming material to be deposited on the substrate W is stored, a heater (not shown) for heating the crucible, and a constant evaporation rate from the film-forming source 25. A shutter (not shown) or the like is provided to prevent the film-forming material from scattering onto the substrate until the film reaches the temperature. The film forming source 25 may have various configurations depending on the application, such as a point film forming source or a linear film forming source. Note that the film-forming source 25 can also be configured to include a plurality of crucibles containing different film-forming materials. In such a configuration, a plurality of crucibles containing different film-forming materials may be movably installed at the film-forming position so that the film-forming material can be changed without opening the vacuum container 21 to the atmosphere.

The magnetic force applying means 26 has a function of drawing the mask M to the substrate W side by magnetic force during the film forming process and bringing it into close contact with the substrate W, and is configured to be able to move up and down in the vertical direction. For example, the magnetic force applying means 26 is composed of an electromagnet and/or a permanent magnet.

Although not shown in FIG. 2, the film forming apparatus 11 preferably includes a film thickness monitor (not shown) and a film thickness calculation unit (not shown) for measuring the thickness of the film deposited on the substrate. It is.

On the upper outside (atmospheric side) of the vacuum container 21, that is, on the reference plate 214, there is a mask pickup lifting mechanism 232 for lifting and lowering the mask pickup 231, and a magnetic force applying means lifting and lowering mechanism for lifting and lowering the magnetic force applying means 26. A mechanism 261 and the like are installed. Although a mask support unit elevating mechanism (not shown) for elevating and lowering the mask support unit 23 may be installed on the reference plate 214, the present invention is not limited thereto. ) may be installed at the lower part of the first vacuum container section 211 on the atmosphere side.

The film forming apparatus 11 also includes an alignment camera unit 27 that includes an alignment camera for photographing alignment marks formed on the substrate W and the mask M to measure the relative positional relationship between the substrate W and the mask M. ing. This alignment camera unit 27 is installed on the upper outside (atmospheric side) of the vacuum container 21 , more specifically, on the atmospheric side above the support plate 214 that serves as the upper container wall of the vacuum container 21 . Further, this alignment camera unit 27 is installed so as to protrude inside the vacuum container 21.

The film forming apparatus 11 includes a control section (not shown). The control unit has roles and functions such as transport control of the substrate W and mask M, alignment control of the substrate W and mask M, control of the film forming source 25, and control of film forming. Further, the control unit can also have a function of controlling voltage application to the electrostatic chuck.

The control unit can be configured by, for example, a computer having a processor, memory, storage, I/O, and the like. In this case, the functions of the control unit are realized by the processor executing a program stored in memory or storage. As the computer, a general-purpose personal computer, a built-in computer, or a PLC (programmable logic controller) may be used. Alternatively, part or all of the functions of the control section may be configured by a circuit such as ASIC or FPGA. Further, a control section may be installed for each film forming apparatus, or one control section may be configured to control a plurality of film forming apparatuses.

<Magnetic levitation stage mechanism>
In particular, the magnetic levitation stage mechanism 22 will be described in more detail with reference to FIGS. 3 to 7. As described above, the magnetic levitation stage mechanism 22 includes the stage reference plate section 221, the fine movement stage plate section 222, and the magnetic levitation unit 223.

The stage reference plate section 221 is a member that serves as a reference for movement of the fine movement stage plate section 222, and is installed so that its position is fixed. For example, as shown in FIG. 2, the stage reference plate section 221 is installed so as to be fixed to the reference plate 214 of the vacuum container 21 in parallel to the XY plane. However, the present invention is not limited thereto, and the stage reference plate portion 221 may not be directly fixed to the reference plate 214 but may be fixed to another member (for example, another reference frame) as long as its position can be fixed. good.

Since the stage reference plate section 221 is a member that serves as a reference for the movement of the fine movement stage plate section 222, it is not affected by disturbances such as vibrations from the vacuum pump or the floor due to the expandable and contractible member 213 and the vibration isolation unit 216. It is preferable to install it so that it does not.

The fine movement stage plate part 222 is installed movably with respect to the stage reference plate part 221, and a substrate adsorption means 24 such as an electrostatic chuck is installed on the main surface (for example, the bottom surface) of the fine movement stage plate part 222. Ru. Therefore, by moving the fine movement stage plate section 222, the position of the substrate suction means 24 and the substrate W suctioned thereon can be adjusted.

The magnetic levitation unit 223 includes a magnetic levitation linear motor 31 for generating a driving force for moving the fine movement stage plate part 222, which is a movable table, with respect to the stage reference plate part 221, which is a fixed table, and a magnetic levitation linear motor 31 for generating a driving force for moving the fine movement stage plate part 222, which is a movable table, with respect to the stage reference plate part 221, which is a fixed table. A position measuring means for measuring the position, a self-weight canceling means 33 for canceling (offsetting) the gravity applied to the fine movement stage plate part 222 by applying a floating force to make the fine movement stage plate part 222 levitate, and a fine movement stage plate. and an origin positioning means 34 for determining the origin position of the portion 222.

The magnetic levitation linear motor 31 is a drive source that generates a driving force for moving the fine movement stage plate section 222. In this embodiment, the following three types of magnetically levitated linear motors are provided. The first type is two X-direction magnetic levitation linear motors 311 that generate driving force for moving the fine movement stage plate section 222 in the X-direction. The second type is two Y-direction magnetically levitated linear motors 312 that generate driving force for moving the fine movement stage plate portion 222 in the Y-direction. The third type is three Z-direction magnetic levitation linear motors 313 that generate driving force for moving the fine movement stage plate section 222 in the Z direction.

Using these plurality of magnetically levitated linear motors 31, the fine movement stage plate section 222 can be moved in six directions (X direction, Y direction, Z direction, θX direction, θY direction, and θZ direction).

For example, for translation in the X direction, Y direction, and Z direction, if the X direction magnetic levitation linear motor 311, the Y direction magnetic levitation linear motor 312, and the Z direction magnetic levitation linear motor 313 are each driven in the same direction. good.

For rotational movement in the _θZ direction, the driving directions of the two X-direction magnetic levitation linear motors 311 and the two Y-direction magnetic levitation linear motors 312 may be adjusted. For example, the X-direction magnetic levitation linear motor 311a is moved in the +X direction, the X-direction magnetic levitation linear motor 311b is moved in the -X direction, the Y-direction magnetic levitation linear motor 312a is moved in the +Y direction, and the Y-direction magnetic levitation linear motor 312b is moved in the -Y direction. If the fine movement stage plate section 222 is driven as shown in FIG. Similarly, for _rotational movement in the _θ

The number and arrangement of the magnetically levitated linear motors 31 shown in FIG. 3 are merely exemplary, and the present invention is not limited thereto. Other configurations can be adopted regarding the number and arrangement.

Note that by employing the magnetic levitation stage mechanism 22 instead of the alignment stage that uses a mechanical motor and a ball screw/linear guide, the accuracy of position adjustment of the substrate W can be further improved.

Furthermore, unlike a mechanical stage mechanism, the magnetically levitated stage mechanism 22 has less risk of contamination due to particles or lubricant evaporation, and the magnetically levitated stage mechanism 22 can be installed inside the vacuum container 21. Become. As a result, the distance between the holding means for the substrate W (the substrate suction means 24) and the stage mechanism is reduced, so that the effects of swinging and disturbances during driving of the stage mechanism on the substrate suction means 24 can be reduced. can.

FIG. 5 is a schematic cross-sectional view showing the structure of the Z-direction magnetically levitated linear motor 313, and FIG. 6 is a schematic cross-sectional view showing the structure of the X-direction magnetically levitated linear motor 311 or the Y-direction magnetically levitated linear motor 312. be.

The magnetically levitated linear motor 31 includes a stator 314 installed on the stage reference plate section 221 and a movable element 315 installed on the fine movement stage plate section 222. Note that the stator 3 is attached to one of the stage reference plate section 221 and the fine movement stage plate section 222.
14 and the movable element 315 may be provided on the other side. Therefore, it is also possible to adopt a configuration in which the stage reference plate section 221 is provided with the mover 315 and the fine movement stage plate section 222 is provided with the stator 314.

As illustrated, the stator 314 of the magnetically levitated linear motor 31 includes a magnetic field generating means, for example, a coil 3141 through which a current flows, and the mover 315 includes a magnetic body, for example, a permanent magnet 3151.

The magnetically levitated linear motor 31 applies a driving force to the permanent magnets 3151 of the movable element 315 using a magnetic field generated by passing a current through the coil 3141 of the stator 314 . In the magnetically levitated linear motor 31, by adjusting the direction of the current flowing through the stator 314, the direction of the force applied to the permanent magnet 3151, which is the movable element 315, can be adjusted.

For example, if the direction of the current flowing through the coil 3141 of the stator 314 is made counterclockwise on the paper as shown in FIG. 5(b), then in FIG. ), a north pole is induced, and a south pole is induced on the right side (+X side). As a result, the movable element 315 receives a force in the downward (-Z) direction and moves downward. Conversely, when the direction of the current flowing through the coil 3141 is made clockwise, the movable element 315 moves upward (+Z).

Similarly, the X-direction magnetically levitated linear motor 311 or the Y-direction magnetically levitated linear motor 312 shown in FIG. , can be moved in the Y direction.

The position measuring means of the magnetically levitated unit 223 according to the present embodiment is a means for measuring the position of the fine movement stage plate section 222, and includes a laser interferometer 32 and a position of the fine movement stage plate section 222 facing the laser interferometer 32. and a reflective section 324 installed. As the reflecting section 324, for example, a plane mirror can be used.

The laser interferometer 32 measures the position of the reflection part 324 (the position of the fine movement stage plate part 222) by irradiating a measurement beam onto a reflection part 324 installed on the fine movement stage plate part 222 and detecting the reflected beam. do. More specifically, the laser interferometer 32 can measure the position of the fine movement stage plate section 222 based on the interference light between the reflected light of the measurement beam and the reflected light of the reference beam.

The position measuring means of the magnetically levitated unit 223 according to this embodiment includes an X-direction position measuring section for measuring the position of the fine movement stage plate section 222 in the X direction, and a Y-direction position measuring section for measuring the position in the Y direction. and a Z-direction position measuring section for measuring the position in the Z-direction.

As shown in FIG. 3, the laser interferometer 32, which is the position measuring means according to this embodiment, includes two X-direction laser interferometers 321 for detecting the position of the fine movement stage plate section 222 in the X-axis direction, and a fine movement stage plate part 222. One Y-direction laser interferometer 322 for detecting the position of the stage plate section 222 in the Y-axis direction and three Z-direction laser interferometers 323 for detecting the position of the fine movement stage plate section 222 in the Z-axis direction. used.

A reflection section 324 that reflects measurement beams from these laser interferometers 32 is installed in the fine movement stage plate section 222 so as to face the laser interferometers 32 . For example, the reflection section 324 includes an X-direction reflection section 3241 installed to face the X-direction laser interferometer 321, a Y-direction reflection section 3242 installed to face the Y-direction laser interferometer 322, and a Z-direction reflection section 3242 installed to face the Y-direction laser interferometer 322. Z-direction reflecting section 3243 installed to face the direction laser interferometer 323
is used.

The X-direction position measurement section includes an X-direction laser interferometer 321 and an X-direction reflection section 3241, and the Y-direction position measurement section includes a Y-direction laser interferometer 322 and a Y-direction reflection section 3242, and performs Z-direction position measurement. The section includes a Z-direction laser interferometer 323 and a Z-direction reflection section 3243.

With this configuration of the position measuring means, the position of the fine movement stage plate section 222 can be precisely measured in six degrees of freedom. That is, the X-direction position, Y-direction position, and Z-direction position of the fine movement stage plate section 222 can be measured by the X-direction laser interferometer 321, the Y-direction laser interferometer 322, and the Z-direction laser interferometer 323. Further, by installing a plurality of X-direction laser interferometers 321, the position in the rotational (θ _Z ) direction around the Z-axis can also be measured. Furthermore, by installing _a plurality of Z-direction laser interferometers 323, the position in the rotational direction ( _θ can be measured.

The control unit of the film forming apparatus 11 according to the present embodiment controls the magnetic levitation linear motor based on the position information of the fine movement stage plate part 222 (or the substrate adsorption means 24 installed thereon) measured by the laser interferometer 32. 31. For example, the control unit of the film forming apparatus 11 may adjust the position of the fine movement stage plate part 222 or the substrate suction means 24 to the position of the fine movement stage plate part 222 or the substrate suction means 24 measured by the laser interferometer 32, and the position of the alignment camera unit 27. The substrate W and the mask M are moved to a positioning target position determined by the amount of relative positional deviation between the substrate W and the mask M measured in . Thereby, the position of the fine movement stage plate section 222 or the substrate suction means 24 can be controlled with high precision in nanometer units.

The self-weight canceling means 33 is a means for canceling (offsetting) the weight of the fine movement stage plate section 222. For example, as shown in FIG. 4(c) and FIG. Using the repulsion or attraction force between the second magnet part 332 and the second magnet part 332, a floating force corresponding to the gravity applied to the fine movement stage plate part 222 is generated in a direction opposite to the gravity.

The first magnet section 331 and the second magnet section 332 can be configured with electromagnets or permanent magnets. In the first magnet part 331 and the second magnet part 332 shown in FIG. 4(c) and FIG. The magnetic pole (S pole or N pole) is shown.

For example, as shown in FIG. 4(c), the first magnet section 331 provided on the stage reference plate section 221 side and the second magnet section 332 provided on the fine movement stage plate section 222 side are arranged in opposite polarities. By arranging the magnetic poles of the magnets to face each other, the first magnet part 331 provided on the stage reference plate part 221 side attracts the second magnet part 332 provided on the fine movement stage plate part 222 side upward. , the gravity applied to the fine movement stage plate portion 222 can be offset.

Alternatively, the gravity of the fine movement stage plate part 222 is caused by the repulsive force between the first magnet part 331 provided on the stage reference plate part 221 side and the second magnet part 332 provided on the fine movement stage plate part 222 side. can also be offset.

For example, as shown in FIG. 7, the first magnet part 331 and the second magnet part 332 are arranged so that the magnetic poles of the same polarity face each other, and the fine movement stage plate part 222 and the second magnet part 3
32, a spacer 333 extending in the Z direction is interposed between the second magnet part 332 and the lower end (end part) of the second magnet part 332. good. In other words, the length of the spacer 333 in the Z direction is determined such that the lower end of the second magnet part 332 provided on the fine movement stage plate part 222 side is longer than the lower end of the first magnet part 331 provided on the stage reference plate part 221 side. (that is, further away from the fine movement stage plate section 222).

With the configuration shown in FIG. 7, the second magnet part 332 provided on the fine movement stage plate part 222 side receives an upward repulsive force from the first magnet part 331 provided on the stage reference plate part 221 side, and The gravity applied to the stage plate portion 222 can be offset.

In order to support the fine movement stage plate part 222 more stably, as shown in FIG. 3, it is preferable that the self-weight canceling means 33 be installed at at least three positions within the XY plane. For example, it is preferable to install them symmetrically around the center of gravity of the fine movement stage plate section 222.

In this way, by employing the self-weight canceling means 33, the load on the magnetically levitated linear motor 31 can be reduced, and the amount of heat generated by the magnetically levitated linear motor 31 can be suppressed. Thereby, thermal denaturation of the organic material formed on the substrate W can be suppressed.

The origin positioning means 34 of the magnetically levitated unit 223 according to the present embodiment is a means for determining the origin position of the fine movement stage plate section 222, and is a kinematic cup including a triangular pyramid-shaped recess 341 and a hemispherical convex part 342. It can be configured with a ring (kinematic coupling).

For example, as shown in FIG. 4B, a triangular pyramid-shaped recess 341 is provided on the stage reference plate portion 221 side, and a hemispherical convex portion 342 is provided on the fine movement stage plate portion 222 side. When the hemispherical convex portion 342 is inserted into the triangular pyramid-shaped concave portion 341, the convex portion 342 contacts the inner surface of the concave portion 341 at three fulcrums, and the position of the fine movement stage plate portion 222 is determined.

As shown in FIG. 3, three such kinematic coupling type origin positioning means 34 are arranged at equal intervals around the center of the fine movement stage plate section 222 on a plane including the X direction and the Y direction. (For example, by installing at 120° intervals, the center position of the fine movement stage plate portion 222 can be determined.) That is, when the fine movement stage plate part 222 is brought close to the stage reference plate part 221 and the convex parts 342 of the three origin positioning means are seated in the recesses 341, the position of the fine movement stage plate part 222 is determined by the laser interferometer 32. Measure and use this as the origin position.

As described above, according to the film forming apparatus 11 according to the present embodiment, the stage and its drive mechanism can be used to form a film by using a magnetic levitation drive mechanism (magnetic levitation linear motor) without using a mechanical drive mechanism. It can be placed in a vacuum vessel 21 of the device 11. Thereby, the influence of vibration due to disturbance can be effectively reduced. Furthermore, vibrations caused by mechanical driving can be reduced, and as a result, the accuracy of position adjustment of the substrate can be improved. Furthermore, by employing a position measuring means including a laser interferometer 32, a self-weight canceling means 33, and an origin positioning means 34 consisting of a kinematic coupling, the accuracy of substrate position adjustment can be further improved.

However, in the present invention, the mechanism for adjusting the positions of the substrate W and the substrate suction means 24 is not limited to the magnetic levitation stage mechanism 22, and various known techniques can be employed.

<Alignment camera unit>
The alignment camera unit 27 according to this embodiment will be described with reference to FIGS. 8 and 9. FIG. 8 is a schematic cross-sectional view showing the configuration and arrangement of the alignment camera unit 27, and FIG. 9 is an enlarged view of the dotted circle portion in FIG.

The alignment camera unit 27 includes an alignment camera 27a, a camera adjustment stage section 27b, a vibration isolation pedestal 27c, and an illumination means 27d.

The alignment camera 27a is a device for measuring the relative positional relationship between the substrate W and the mask M by photographing alignment marks on each of the substrate W and the mask M.

In this embodiment, the alignment camera 27a is a rough alignment camera used to roughly adjust the relative positional relationship between the substrate W and the mask M, and a rough alignment camera used to roughly adjust the relative positional relationship between the substrate W and the mask M. A fine alignment camera is used to adjust the A rough alignment camera has a relatively wide viewing angle and low resolution, and a fine alignment camera has a relatively narrow viewing angle but high resolution. However, the present invention is not limited thereto, and for example, the alignment camera 27a may be only a rough alignment camera or only a fine alignment camera.

A rough alignment camera and a fine alignment camera are installed at positions corresponding to alignment marks formed on the substrate W and the mask M. For example, for a fine alignment camera, four cameras can be installed at each of the four corners of a rectangle, and for a rough alignment camera, two cameras can be installed at the center of two opposing sides of the rectangle. . However, the present invention is not limited thereto, and the number and arrangement position of each camera may be appropriately set according to the positions of the alignment marks on the substrate W and the mask M.

The alignment camera 27a according to this embodiment is arranged on the atmosphere side, which is the outside of the vacuum container 21 in the film forming apparatus 11, but is installed so as to protrude inside the vacuum container 21. As a result, since the magnetically levitated stage mechanism 22 is provided, even if the substrate W and the mask M are relatively far away from the reference plate 214, the focus of the alignment camera 27a is on the alignment mark formed on the substrate W and the mask M. can be matched accurately.

In order to arrange the alignment camera 27a as described above, the vacuum container 21 according to the present embodiment is equipped with a vacuum compatible cylinder 212 that is installed so as to protrude from the container wall 211 to the inside of the vacuum container 21. . However, the present invention is not limited to such a configuration, and other structures may be adopted as long as the alignment camera 27a can be installed so as to protrude inside the vacuum container 21.

The vacuum compatible tube 212 is installed so as to protrude inside the vacuum container 21 through the container wall 211 (corresponding to the reference plate 214 in FIG. 2) of the vacuum container 21, and has a cylindrical structure with an open top surface. It is a thing. The interior of the vacuum-compatible tube 212, which is communicated with the outside via the open top surface, is exposed to the atmosphere. The alignment camera 27a is installed so as to be inserted into the atmosphere side of the vacuum compatible tube 212. Thereby, the alignment camera 27a is installed so that at least a portion thereof protrudes inside the vacuum container 21.

Further, the vacuum compatible cylinder 212 is configured so that the inside of the vacuum container 21 is maintained in a vacuum state. Therefore, the vacuum compatible cylinder 212 is provided so as to surround the alignment camera 27a placed on the atmosphere side, and is provided so as to separate the inside of the vacuum container 21 from the alignment camera 27a.

The vacuum compatible tube 212 is composed of, for example, a cylindrical side wall portion 212a fixed to the container wall 211 of the vacuum container 21, and a tip portion 212b provided at the lower end of the side wall portion 212a. The side wall portion 212a is fixed to the container wall 211 with a sealing material (not shown) interposed therebetween so that air does not enter the interior through the portion where the side wall portion 212a and the container wall 211 are fixed.

The tip portion 212b is made of a transparent material so that alignment marks on the substrate W and the mask M can be photographed with an alignment camera 27a inserted into the atmosphere side of the vacuum compatible cylinder 212. For example, the tip portion 212b can be made of glass. However, the material of the tip portion 212b is not limited to glass.

It is preferable that the vacuum compatible tube 212 includes a connecting portion 212c that connects the side wall portion 212a and the tip portion 212b. This connecting portion 212c plays a role of sealing the gap between the side wall portion 212a and the tip portion 212b. Thereby, it is possible to prevent air from entering the inside from the connecting portion between the side wall portion 212a and the tip portion 212b. Note that the structure of the connecting portion 212c shown in FIG. 9 is merely an example. As for the connecting portion 212c, other structures may be adopted as long as it is possible to prevent air from entering the inside from the connecting portion between the side wall portion 212a and the tip portion 212b.

The lower end (tip) of the vacuum compatible tube 212, that is, the position of the tip 212b, is appropriately set according to the depth of focus of the alignment camera 27a and the distances between the substrate W and mask M and the container wall 211.

For example, the tip of the vacuum compatible cylinder 212 is provided so as to be located between the container wall 211 and the substrate suction means 24 (see FIG. 2). In particular, the tip of the vacuum compatible tube 212 is preferably located between the stage reference plate section 221 (first plate section) and the fine movement stage plate section 222 (second plate section) (see FIG. 2). . By employing such a configuration, alignment marks on the substrate W and the mask M can be photographed at a position where the alignment camera 27a is close to the substrate W and the mask M.

On the other hand, the distance between the tip of the vacuum compatible cylinder 212 and the top surface of the substrate W attracted by the substrate suction means 24 is equal to the thickness of the magnetic force applying means 26 and the thickness of the substrate suction means 24. It is preferable to arrange them so that they are longer than the total length.

The camera adjustment stage section 27b is connected to the alignment camera 27a, and has a function of moving the alignment camera 27a relative to the vacuum container 21. More specifically, the camera adjustment stage section 27b moves the alignment camera 27a at least in the vertical direction (Z-axis direction), that is, in the direction from the container wall 211 of the vacuum container 21 toward the substrate suction means 24 and/or in the opposite direction. (eg, in a direction perpendicular to the container wall 211). By adopting such a configuration, even if there is some error in the thickness of the substrate W, the distance between the alignment camera 27a and the substrate W can be appropriately adjusted, and the alignment camera can be accurately aligned with the alignment mark on the substrate W. 27a can be focused.

For the camera adjustment stage section 27b, a known mechanism such as a Z-axis actuator that can move the alignment camera 27a in the vertical direction may be used. However, the present invention is not limited thereto, and the camera adjustment stage section 27b moves the alignment camera 27a in a direction parallel to the substrate surface, that is, in the front-back and/or left-right direction (X-axis and/or Y-axis direction). It may be possible to do so. That is, the camera adjustment stage section 27b may further include driving means such as an X-axis actuator and/or a Y-axis actuator.

It is more preferable that the camera adjustment stage section 27b has a function of adjusting the attitude of the alignment camera 27a. More specifically, the camera adjustment stage section 27b preferably has a function of moving the alignment camera 27a so as to change the angle of the alignment camera 27a with respect to the container wall 211 of the vacuum container 21. When adopting this configuration, for example, the camera adjustment stage section 27b may include a rotary actuator that can change the upright angle of the alignment camera 27a with respect to the container wall 211.

If such a configuration is adopted, when the vacuum container 21 is deformed during evacuation and the alignment camera 27a is tilted with respect to the substrate W or the mask M, the container wall of the vacuum container 21 of the alignment camera 27a is By adjusting the angle with respect to 211, the alignment camera 27a can be made to face the substrate W and the mask M perpendicularly. Thereby, the alignment camera 27a can be focused on the alignment marks on the substrate W and the mask M.

The vibration isolation pedestal 27c is installed between the camera adjustment stage section 27b and the vacuum container 21 (for example, the container wall 211 of the vacuum container 21). The vibration isolation pedestal 27c has a function of reducing vibrations from the vacuum container 21 from being transmitted to the camera adjustment stage section 27b and the alignment camera 27a connected thereto. The vibration isolation pedestal 27c can adopt various structures. For example, the vibration isolation pedestal 27c may have a structure including a support base fixedly installed on the vacuum container 21 and a vibration isolation unit disposed between the support base and the camera adjustment stage section 27b.

The illumination means 27d is disposed on the opposite side of the alignment camera 27a via the substrate suction means 24 and/or the mask support unit 23, and has a function of illuminating the alignment marks on the substrate W and the mask M. Note that in FIG. 8, the substrate suction means 24 and the mask support unit 23 are omitted. The illumination means 27d is used especially when the alignment camera 27a, which is installed to protrude inside the vacuum container 21, is so dark that it is difficult to photograph the alignment marks on the substrate W or the mask M. The light can be illuminated with enough light to photograph the mark.

<Alignment method>
Hereinafter, an alignment method for adjusting the relative position between the substrate W and the mask M using the magnetically levitated stage mechanism 22 of the present invention will be described.

First, the mask M and the substrate W are carried into the vacuum container 21 and supported by the mask support unit 23 and the substrate support unit, respectively. Next, the control section of the film forming apparatus 11 moves the substrate W supported by the substrate support unit toward the substrate suction means 24 installed on the fine movement stage plate part 222 of the magnetically levitated stage mechanism 22. Then, when the substrate W approaches the substrate suction means 24 sufficiently, the control unit of the film forming apparatus 11 applies a substrate suction voltage to the substrate suction means 24, and causes the substrate W to be attracted to the substrate suction means 24 by electrostatic attraction. . Note that when the control unit of the film forming apparatus 11 adsorbs the substrate W to the substrate suction means 24, it is also possible to adopt a configuration in which the entire surface of the substrate W is simultaneously adsorbed on the entire suction surface of the substrate suction means 24, It is also possible to adopt a configuration in which the substrates W are sequentially attracted from one region to another of the plurality of regions of the substrate suction means 24.

Next, the control section of the film forming apparatus 11 drives the mask support unit elevating mechanism to bring the substrate suction means 24 and the mask support unit 23 relatively close to each other. At this time, the control unit of the film forming apparatus 11 determines that the distance between the substrate W adsorbed by the substrate adsorption means 24 and the mask M supported by the mask support unit 23 becomes a preset rough alignment measurement distance. until the substrate suction means 24 and the mask support unit 23 are relatively close together (for example, when the mask support unit 23
increase).

When the distance between the substrate W and the mask M reaches the rough alignment measurement distance, the control unit of the film forming apparatus 11 causes the rough alignment camera to image the alignment marks of the substrate W and the mask M, and aligns the substrate W in the XYθ _Z directions. The relative positional relationship between the mask M and the mask M is measured, and based on this, the amount of relative positional shift between them is calculated.

Based on the position of the fine movement stage plate section 222 (or substrate adsorption means 24) measured by the laser interferometer and the relative positional shift amount calculated by the rough alignment camera, the control unit of the film forming apparatus 11 performs the following steps. The coordinates of the movement target position of the fine movement stage plate section 222 (or substrate suction means 24) are calculated.

The control unit of the film forming apparatus 11 moves the fine movement stage plate part ₂₂₂ (or The substrate suction means 24) is moved to the movement target position. Thereby, the relative positional relationship between the substrate W and the mask M is adjusted. In the rough alignment, it has been explained that the fine movement stage plate part 222 is moved by a magnetically levitated linear motor, but the mask support unit 23 is moved in the XYθ and _Z directions depending on the amount of positional deviation between the substrate W and the mask M. rough alignment may be performed.

When the rough alignment is completed, the control section of the film forming apparatus 11 further raises the mask support unit 23 using the mask support unit elevating mechanism, and moves the mask M relative to the substrate W to the fine alignment measurement position.

When the mask M moves to the fine alignment measurement position with respect to the substrate W, the control unit of the film forming apparatus 11 causes the fine alignment camera to image the alignment marks of the substrate W and the mask M, and aligns the substrate W and the mask M in the XYθ _Z directions. The amount of relative positional deviation is measured.

If the relative positional deviation amount between the substrate W and the mask M at the fine alignment measurement position is larger than a predetermined threshold value, the control unit of the film forming apparatus 11 lowers the mask M again to separate the substrate W and the mask M. Separate. After that, the control unit of the film forming apparatus 11 controls the fine movement stage plate part 222 based on the position of the fine movement stage plate part 222 measured by the laser interferometer 32 and the relative positional shift amount between the substrate W and the mask M. Calculate the movement target position.

The control unit of the film forming apparatus 11 moves the fine movement stage plate part 222 in the XYθ and _Z directions using the magnetic levitation linear motor while measuring the position of the fine movement stage plate part 222 with a laser interferometer based on the calculated movement target position. By moving the substrate W to the target position, the relative positional relationship between the substrate W and the mask M is adjusted.

If necessary, the position and/or posture of the rough alignment camera and/or fine alignment camera can be adjusted during or before or after performing the rough alignment and/or fine alignment. For example, the rough alignment camera and/or the fine alignment camera can be moved in the Z-axis direction so that the substrate W is located at an appropriate focal position with respect to the rough alignment camera and/or the fine alignment camera. Furthermore, when the rough alignment camera and/or the fine alignment camera do not face the substrate W perpendicularly, the inclination of the rough alignment camera and/or the fine alignment camera with respect to the container wall can also be adjusted.

Such a process is repeated until the amount of relative positional deviation between the substrate W and the mask M becomes smaller than a predetermined threshold.

When the relative positional shift amount between the substrate W and the mask M becomes smaller than a predetermined threshold value, the control unit of the film forming apparatus 11 causes the film forming surface of the substrate W attracted by the substrate attracting means 24 to come into contact with the upper surface of the mask M. The mask support unit 23 is raised to the vapor deposition position. When the deposition position where the substrate W and the mask M are in contact is reached, the control unit of the film forming apparatus 11 lowers the magnetic force applying means 261 and draws the mask M toward the substrate W, thereby bringing the substrate W and the mask M into close contact with each other. let

In this process, in order to confirm whether a positional shift has occurred between the substrate W and the mask _M in the The positional relationship is measured, and if the measured amount of relative positional deviation is greater than or equal to a predetermined threshold, the substrate W and the mask M are separated again to a predetermined distance (for example, by lowering the mask support unit 23). After that, the relative positional relationship between the substrate W and the mask M is adjusted, and the same process is repeated. When the relative positional shift amount of the substrate W and the mask M becomes smaller than a predetermined threshold value with the substrate W and the mask M located at the vapor deposition position, the alignment process ends and the process moves to the film forming process.

<Film formation process>
A film forming method using the alignment method according to this embodiment will be described below.

With the mask M supported by the mask support unit 23 in the vacuum container 21 , the substrate W is carried into the vacuum container 21 of the film forming apparatus 11 by the transfer robot 14 in the transfer chamber 13 . The hand of the transfer robot 14 that has entered the vacuum container 21 places the substrate W on the support portion of the substrate support unit. After the substrate support unit sufficiently approaches or contacts the substrate suction means 24, a substrate suction voltage is applied to the electrostatic chuck 24, and the substrate W is suctioned by the electrostatic chuck 24.

With the substrate W being attracted to the substrate suction means 24, a series of operations in the alignment process are performed according to the alignment method according to the embodiment described above.

According to the alignment method of this embodiment, when the amount of relative positional deviation between the substrate W and the mask M becomes smaller than a predetermined threshold value, the shutter of the film forming source 25 is opened, and a thin film of the film forming material is applied to the substrate S through the mask. is formed. After a thin film with a desired thickness is formed, the control section of the film forming apparatus 11 raises the magnetic force applying means 26 to separate the mask M, and lowers the mask support unit 23.

Next, the hand of the transfer robot 14 enters the vacuum container 21 of the film forming apparatus 11, and a zero (0) or reverse polarity substrate separation voltage is applied to the electrode portion of the substrate suction means 24, and the substrate W is suctioned. Separated from means 24. The separated substrates are carried out from the vacuum container 21 by the transfer robot 14.

In the above example, the film forming apparatus 11 adopts a so-called upward evaporation method (deposit-up) configuration in which film formation is performed with the film forming surface of the substrate W facing vertically downward. I explained it using an example. However, the present invention is not limited to this method, and the substrate W is placed vertically on the side surface of the vacuum container 21, and the film-forming surface of the substrate W is parallel to the direction of gravity. It is also applicable to a method in which film formation is performed.

<Method for manufacturing electronic devices>
Next, an example of a method for manufacturing an electronic device using the film forming apparatus of this embodiment will be described. The configuration and manufacturing method of an organic EL display device will be illustrated below as an example of an electronic device. First, referring to FIG. 10, an organic EL display device to be manufactured will be described. FIG. 10(a) is an overall view of the organic EL display device 60, and FIG. 10(b) is a cross-sectional view of one pixel.

As shown in FIG. 10A, in the display area 61 of the organic EL display device 60, a plurality of pixels 62 each including a plurality of light emitting elements are arranged in a matrix. Although details will be explained later, each light emitting element has a structure including an organic layer sandwiched between a pair of electrodes. Note that the pixel herein refers to the smallest unit that can display a desired color in the display area 61. In the case of the organic EL display device according to the present embodiment, a pixel 62 is configured by a combination of a first light emitting element 62R, a second light emitting element 62G, and a third light emitting element 62B that emit light different from each other. The pixel 62 is often composed of a combination of a red light emitting element, a green light emitting element, and a blue light emitting element, but it may also be a combination of a yellow light emitting element, a cyan light emitting element, and a white light emitting element. There are no restrictions.

FIG. 10(b) is a schematic partial cross-sectional view taken along line AB in FIG. 10(a). The pixel 62 has an organic EL element including an anode 64, a hole transport layer 65, one of the light emitting layers 66R, 66G, and 66B, an electron transport layer 67, and a cathode 68 on a substrate 63. There is. Among these, the hole transport layer 65, the light emitting layers 66R, 66G, and 66B, and the electron transport layer 67 correspond to organic layers. Further, in this embodiment, the light emitting layer 66R is an organic EL layer that emits red, the light emitting layer 66G is an organic EL layer that emits green, and the light emitting layer 66B is an organic EL layer that emits blue. The light-emitting layers 66R, 66G, and 66B are formed in patterns corresponding to light-emitting elements (sometimes referred to as organic EL elements) that emit red, green, and blue, respectively. Further, the anode 64 is formed separately for each light emitting element. The hole transport layer 65, the electron transport layer 67, and the cathode 68 may be formed in common with the plurality of light emitting elements 62R, 62G, and 62B, or may be formed for each light emitting element. Note that an insulating layer 69 is provided between the anodes 64 in order to prevent short circuits between the anodes 64 and cathodes 68 due to foreign matter. Furthermore, since the organic EL layer is degraded by moisture and oxygen, a protective layer 70 is provided to protect the organic EL element from moisture and oxygen.

In FIG. 10(b), the hole transport layer 65 and electron transport layer 67 are shown as one layer, but depending on the structure of the organic EL display element, they may be formed of multiple layers including a hole blocking layer and an electron blocking layer. may be done. Further, a hole injection layer having an energy band structure that allows holes to be smoothly injected from the anode 64 to the hole transport layer 65 is provided between the anode 64 and the hole transport layer 65. It can also be formed. Similarly, an electron injection layer may be formed between the cathode 68 and the electron transport layer 67.

Next, an example of a method for manufacturing an organic EL display device will be specifically described.

First, a substrate 63 on which a circuit (not shown) for driving an organic EL display device and an anode 64 are formed is prepared. Acrylic resin is formed by spin coating on the substrate 63 on which the anode 64 is formed. Then, the acrylic resin is patterned by a lithography method so that an opening is formed in the portion where the anode 64 is formed, and an insulating layer 69 is formed. This opening corresponds to the light emitting region where the light emitting element actually emits light.

The substrate 63 on which the insulating layer 69 has been patterned is carried into a first organic material film forming apparatus, where the substrate 63 is held by an electrostatic chuck, and a hole transport layer is formed as a common layer on the anode 64 in the display area. 65 is deposited. Note that the hole transport layer 65 is formed by vacuum deposition. In reality, the hole transport layer 65 is formed to have a larger size than the display area 61, so a high-definition mask is not required.

Next, the substrate 63 on which up to the hole transport layer 65 has been formed is carried into a second organic material film forming apparatus and held by an electrostatic chuck. After that, alignment between the substrate and the mask is performed, and a light emitting layer 66R that emits red light is formed on a portion of the substrate 63 where an element that emits red light is to be arranged. Then, similarly to the formation of the light-emitting layer 66R, a light-emitting layer 66G that emits green light is formed by the third organic material film-forming device, and a light-emitting layer 66B that emits blue light is further formed by the fourth organic material film-forming device. Filmed. After the film formation of the light emitting layers 66R, 66G, and 66B is completed, the electron transport layer 67 is formed over the entire display area 61 by the fifth film forming apparatus. The electron transport layer 67 is formed as a layer common to the three color light emitting layers 66R, 66G, and 66B.

The substrate on which the electron transport layer 67 has been formed is transferred to a metal vapor deposition material deposition apparatus, and a cathode 68 is deposited thereon. The metal vapor deposition material film forming apparatus may be an evaporative heating type film forming apparatus or a sputtering type film forming apparatus.

According to this embodiment, since the alignment camera is installed so as to protrude inside the vacuum container 21, even if the distance between the ceiling of the vacuum container 21 and the substrate or mask becomes long, the alignment camera can be aligned to the substrate or mask. The camera can be focused. Furthermore, since the alignment camera is configured so that its position and orientation can be adjusted, the accuracy of alignment can be further improved.

The substrate 63 on which the cathode 68 has been formed is transferred to a plasma CVD apparatus, where a protective layer 70 is formed, and the organic EL display device 60 is completed. Note that from the time the substrate 63 on which the insulating layer 69 has been patterned is carried into the film-forming apparatus until the film-forming of the protective layer 70 is completed, if it is exposed to an atmosphere containing moisture or oxygen, the organic EL material There is a risk that the light-emitting layer will deteriorate due to moisture and oxygen. Therefore, substrates are transferred between film forming apparatuses in a vacuum atmosphere or an inert gas atmosphere.

The embodiments described so far are examples of the present invention, and the present invention is not limited to the configurations of the above-described embodiments, and may be appropriately modified within the scope of the technical idea thereof.

11 Film forming apparatus 21 Vacuum container 22 Magnetic levitation stage mechanism 23 Mask support unit 24 Substrate adsorption means 25 Film forming source 26 Magnetic application means 27 Alignment camera unit

Claims (13)

A film forming apparatus for forming a film forming material onto a substrate via a mask,
a vacuum container,
a substrate holding unit provided in the vacuum container for holding the substrate;
a mask support unit provided in the vacuum container for supporting a mask;
an alignment camera unit installed on the atmospheric side of the vacuum container and having an alignment camera for measuring the relative positional relationship between the substrate and the mask;
a film-forming source provided in the vacuum container, storing a film-forming material, and discharging the film-forming material in particles;
Equipped with
The alignment camera is installed so as to protrude inside the vacuum container ,
The alignment camera unit includes a camera adjustment stage section that can move the alignment camera relative to the vacuum container, and a vibration isolation mount provided between the camera adjustment stage section and the vacuum container. A film forming apparatus comprising : The vacuum container includes a vacuum compatible cylinder provided on the container wall so as to protrude from the container wall to the inside of the vacuum container,
2. The film forming apparatus according to claim 1, wherein the alignment camera is placed so as to be inserted into the atmosphere side of the vacuum compatible tube. 3. The film forming apparatus according to claim 2, wherein the vacuum compatible tube is installed such that its tip is located between the container wall and the substrate holding unit in the vacuum container. an alignment stage mechanism for adjusting the position of the substrate holding unit;
The alignment stage mechanism includes a first plate part installed to be fixed to the vacuum container, and a second plate part installed movably with respect to the first plate part,
4. The film forming apparatus according to claim 2, wherein the vacuum compatible cylinder is installed such that its tip is located between the first plate part and the second plate part. 5. The film forming apparatus according to claim 2, wherein the vacuum compatible tube includes a side wall portion provided on the wall of the vacuum container, and a tip portion made of a transparent material. The vacuum-compatible cylinder includes a connecting portion that connects the side wall portion and the tip portion,
6. The film forming apparatus according to claim 5, wherein the connecting portion seals a gap between the side wall portion and the tip portion. 2. The film forming apparatus according to claim 1 , wherein the camera adjustment stage section is capable of moving the alignment camera in a direction from a container wall of the vacuum container toward the substrate holding unit. 8. The film forming apparatus according to claim 7 , wherein the camera adjustment stage section is capable of moving the alignment camera so as to change an angle of the alignment camera with respect to a wall of the vacuum container. The film forming apparatus according to any one of claims 1 to 8 , wherein the alignment camera unit has an illumination unit provided on a side opposite to the alignment camera via the substrate holding unit. 10. The film forming apparatus according to claim 1, wherein the substrate is a silicon wafer. A film forming apparatus according to any one of claims 1 to 10 ,
a mask stock device for storing a mask;
a transport device for transporting at least one of the substrate and the mask;
An electronic device manufacturing apparatus comprising: It has an alignment camera, a camera adjustment stage section that can move the alignment camera relative to the vacuum container, and a vibration isolation pedestal provided between the camera adjustment stage section and the vacuum container. A film deposition method for depositing a deposition material onto a substrate through a mask using an alignment camera unit, the method comprising:
carrying a mask into the vacuum container of the film forming apparatus;
carrying a substrate into the vacuum container;
holding the substrate in a substrate holding unit within the vacuum container;
The relative positional relationship between the substrate and the mask is measured using the alignment camera installed on the atmospheric side of the vacuum container and protruding into the inside of the vacuum container through the vacuum container. step and
adjusting the relative positional relationship between the substrate and the mask by moving the substrate holding unit by an alignment stage mechanism provided in the vacuum container based on the measured relative positional relationship; ,
bringing the mask into close contact with the film-forming surface of the substrate;
forming a film on the substrate through the mask, using a film forming material that has been pulverized by the film forming source in the vacuum container;
A film forming method characterized by having the following. A method for manufacturing an electronic device, comprising manufacturing the electronic device using the film forming method according to claim 12 .

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