JP7383941B2 - Soldering systems, jigs and adjustment methods - Google Patents

Description

The present invention relates to a soldering system, a jig, and an adjustment method.

2. Description of the Related Art Conventionally, a jet soldering apparatus is known that uses a jet of molten solder to solder a board. In a jet soldering device, the height of the jet is adjusted in order to stabilize the contact state between the substrate and the jet of molten solder.

Japanese Patent Laid-Open No. 2000-357865 (Patent Document 1) discloses a method in which a light-transmitting plate-shaped body is arranged at a location facing the spouting part in a substrate conveyance path, and the state of molten solder hitting the plate-shaped body is observed through the plate-shaped body. and discloses a method for adjusting the supply of molten solder based on the observation results. Specifically, a plurality of surfaces are formed in a stepwise manner on the plate-shaped body so that the distance from the ejection location differs stepwise in the conveyance direction. The degree of contact of the molten solder with each of the plurality of surfaces is observed.

Japanese Patent Application Publication No. 2000-357865

However, in the technique disclosed in Patent Document 1, only a submillimeter level difference is formed between two adjacent surfaces among the plurality of surfaces. Therefore, when molten solder hits a certain surface of the plurality of surfaces, the molten solder is also pulled to the surface adjacent to the surface due to the surface tension of the plate-shaped body. As a result, it is not possible to accurately observe how the molten solder contacts each of the plurality of surfaces, and it is not possible to accurately adjust the jet height to a desired height.

The present disclosure has been made in view of the above-mentioned problems, and its purpose is to provide a soldering system, a jig, and an adjustment method that can accurately adjust the height of a jet of molten solder. be.

According to an example of the present disclosure, a soldering system includes a transport device for transporting a board, and a nozzle, and a jet stream that spouts molten solder from the nozzle to the board transported by the transport device to perform soldering. Equipped with a type soldering device. The soldering system further includes a jig that can be transported by the transport device. The jig includes a plurality of plate-like bodies and a support section. The plurality of plate-shaped bodies face the nozzle when the jig is transported by the transport device. The support section is configured such that when the jig is transported by the transport device, the plurality of plate-like bodies are arranged with gaps in the transport direction, and the distances between the plurality of plate-like bodies and the nozzle are different from each other. A plurality of plate-shaped bodies are supported. The soldering system further includes a measurement unit that measures the contact state between each of the plurality of plate-like bodies and the molten solder jetted from the nozzle when the jig is conveyed by the conveyance device; and a control unit that controls the amount of molten solder ejected from the nozzle based on the contact state of each of the nozzles.

According to this disclosure, even if molten solder comes into contact with a plate-shaped body located above a nozzle among a plurality of plate-shaped bodies, the molten solder is pulled to the plate-shaped body adjacent to the plate-shaped body due to surface tension. can be suppressed. Therefore, the measurement unit can accurately measure the contact state between each of the plurality of plate-shaped bodies and the molten solder spouted from the nozzle. Thereby, the control unit can accurately adjust the height of the molten solder jet by controlling the amount of molten solder jetted from the nozzle based on the contact state.

In the above disclosure, the control unit estimates the height of the jet of molten solder from the nozzle from the contact state of each of the plurality of plate-shaped bodies, and adjusts the jet amount so that the height of the jet falls within a predetermined range. Control.

According to this disclosure, by predetermining a jet height range that allows stable soldering, the jet amount is controlled so that the jet height from the nozzle falls within the range. As a result, stable soldering to the board can be achieved.

In the above disclosure, the measurement unit measures the contact area between each of the plurality of plate-shaped bodies and the molten solder ejected from the nozzle as a contact state. The control unit controls the amount of ejection so that the contact area of each of the plurality of plate-like bodies falls within a predetermined range.

According to this disclosure, by predetermining a range of contact area that allows stable soldering, the amount of ejection is controlled so that the contact area measured by the measurement unit falls within the range. As a result, stable soldering to the board can be achieved.

In the above disclosure, the plurality of plate-like bodies are transparent. The soldering system further includes an imaging device disposed above the nozzle for imaging the jig conveyed by the conveyance device. The measurement unit measures the contact state by processing an image obtained by imaging with the imaging device. According to this disclosure, the measurement unit can accurately measure the contact state based on the image.

In the above disclosure, each of the plurality of plate-like bodies has a plurality of conductive parts arranged in a plane facing the nozzle. The measurement unit measures the contact state based on the presence or absence of electrical continuity between each of the plurality of conductive parts and the molten solder.

According to this disclosure, the contact state can be measured with high accuracy without using an imaging device.

In the above disclosure, the plurality of conductive parts are arranged in a matrix in a surface of each of the plurality of plate-like bodies facing the nozzle.

According to this disclosure, the contact state between the plate-like body and the molten solder can be accurately determined based on the presence or absence of electrical continuity between each of the plurality of conductive parts and the molten solder at the timing when the plate-like body reaches above the jet. It can be measured.

In the above disclosure, the plurality of conductive parts are arranged in a line in a direction orthogonal to the conveyance direction in a surface of each of the plurality of plate-like bodies facing the nozzle.

According to this disclosure, the contact between the plate-shaped body and the molten solder is determined based on the presence or absence of electrical continuity between each of the plurality of conductive parts and the molten solder at a plurality of timings when the plate-shaped body passes above the jet. The condition can be measured with high precision.

In the above disclosure, the gap is 10 mm or more along the conveyance direction. According to this disclosure, the resolution of jet height can be improved.

According to one example of the present disclosure, a jig is used to adjust the amount of ejection from a nozzle in a soldering system. The soldering system includes a transport device for transporting a board, and a jet soldering device that includes a nozzle and performs soldering by jetting molten solder from the nozzle onto a board transported by the transport device. The jig includes a plurality of plate-like bodies and a support section. The plurality of plate-shaped bodies face the nozzle when the jig is transported by the transport device. The support section is configured such that when the jig is transported by the transport device, the plurality of plate-like bodies are arranged with gaps in the transport direction, and the distances between the plurality of plate-like bodies and the nozzle are different from each other. A plurality of plate bodies are supported.

According to this disclosure, even if molten solder comes into contact with a plate-shaped body located above a nozzle among a plurality of plate-shaped bodies, the molten solder is pulled to the plate-shaped body adjacent to the plate-shaped body due to surface tension. can be suppressed. Therefore, by using the above-mentioned jig, it is possible to accurately observe the state of contact between each of the plurality of plate-shaped bodies and the molten solder spouted from the nozzle. Thereby, the height of the molten solder jet can be adjusted with high accuracy based on the observation results.

In the above disclosure, each of the plurality of plate-like bodies has a plurality of conductive parts arranged in a plane facing the nozzle. The jig further includes a sensor that detects the presence or absence of electrical continuity between each of the plurality of conductive parts and the molten solder. According to this disclosure, the contact state can be measured with high accuracy without using an imaging device.

According to an example of the present disclosure, a method of adjusting adjusts an amount of molten solder ejected from a nozzle in a soldering system. The soldering system includes a transport device for transporting a board, and a jet soldering device that includes a nozzle and performs soldering by jetting molten solder from the nozzle onto a board transported by the transport device. The adjustment method includes a step of transporting the jig by a transport device. The jig includes a plurality of plate-like bodies and a support section. The plurality of plate-shaped bodies face the nozzle when the jig is transported by the transport device. The support section is configured such that when the jig is transported by the transport device, the plurality of plate-like bodies are arranged with gaps in the transport direction, and the distances between the plurality of plate-like bodies and the nozzle are different from each other. A plurality of plate bodies are supported. The adjustment method further includes the step of measuring the contact state between each of the plurality of plate-like bodies and the molten solder jetted from the nozzle, and the step of measuring the contact state between each of the plurality of plate-like bodies and the molten solder from the nozzle based on the contact state of each of the plurality of plate-like bodies. and controlling the amount of ejection. According to this disclosure as well, the height of the jet of molten solder can be adjusted with high precision.

According to the present disclosure, the height of the jet of molten solder can be adjusted with high precision.

FIG. 1 is a schematic diagram showing the overall configuration of a soldering system according to the present embodiment. 2 is a perspective view showing a jig included in the soldering system shown in FIG. 1. FIG. 3 is a sectional view taken along the line XX in FIG. 2. FIG. FIG. 1 is a schematic diagram showing an example of a hardware configuration of an image processing device. It is a figure which shows an example of the contact state of each of several plate-shaped bodies and the molten solder (primary jet) spouted from the primary jet nozzle. It is a figure which shows an example of the contact state of each of several plate-shaped bodies and the molten solder (secondary jet) spouted from the secondary jet nozzle. FIG. 2 is a schematic diagram showing the hardware configuration of a controller. It is a flowchart which shows the flow of the adjustment process of the jet height in a soldering system. FIG. 3 is a diagram showing the results of a verification experiment. FIG. 7 is a schematic diagram showing the overall configuration of a soldering system according to Modification 3. 7 is a cross-sectional view showing a plurality of plate-like bodies included in a jig according to modification example 3. FIG. FIG. 7 is a bottom view showing a plate-like body included in a jig according to modification example 3. 7 is a cross-sectional view showing a plate-like body included in a jig according to modification example 3. FIG. FIG. 3 is a diagram showing an example of an output signal from a sensor. It is a figure which shows another example of an output signal from a sensor. It is a figure which shows yet another example of an output signal from a sensor. 12 is a flowchart showing the flow of a jetting height adjustment process in a soldering system according to Modification 3. FIG. 7 is a bottom view showing a plate-like body included in a jig according to modification example 4; 12 is a diagram showing an example of an output signal from a sensor in Modification 4. FIG. 7 is a diagram showing another example of an output signal from a sensor in Modification 4. FIG.

<Application example>
An example of a scene to which the present invention is applied will be described with reference to FIGS. 1 and 2. FIG. 1 is a schematic diagram showing the overall configuration of a soldering system according to this embodiment. FIG. 2 is a perspective view showing a jig included in the soldering system shown in FIG. 1. 3 is a sectional view taken along the line XX in FIG. 2. FIG.

As shown in FIG. 1, the soldering system 1 includes a transport device 10 for transporting a board (not shown), and a jet soldering device that performs soldering by jetting molten solder S onto the board. 20.

The jet soldering device 20 includes a solder bath 21 , ducts 22 and 23 , pumps 24 and 25 , a primary jet nozzle 26 , and a secondary jet nozzle 27 .

Solder bath 21 accommodates molten solder S. The ducts 22 and 23 are installed within the solder bath 21. Pumps 24 and 25 pump molten solder S into ducts 22 and 23, respectively. The pump 24 includes, for example, a motor 24a and an impeller 24b rotated by the motor 24a. The pump 25 includes, for example, a motor 25a and an impeller 25b rotated by the motor 25a.

A primary jet nozzle 26 is connected to the duct 22 . The primary jet nozzle 26 changes the flow of the molten solder S pumped in the duct 22 upward in the vertical direction, and jets the molten solder S from an opening at the upper end. The primary jet nozzle 26 generates a primary jet having a wavy surface.

Secondary jet nozzle 27 is connected to duct 23 . The secondary jet nozzle 27 changes the flow of the molten solder S pumped in the duct 23 upward in the vertical direction, and jets the molten solder S from an opening at the upper end. The secondary jet nozzle 27 generates a secondary jet having a flat surface.

By controlling the rotational speed of the motors 24a and 25a, the jet heights of the primary jet nozzle 26 and the secondary jet nozzle 27 can be adjusted.

The transport device 10 transports the substrate to be soldered above the primary jet nozzle 26 and the secondary jet nozzle 27 . The conveyance device 10 includes a conveyance belt 11 , a plurality of preheaters 12 , a frame 13 , and a cooling device 14 .

The conveyor belt 11 conveys the substrate along the conveyance direction D at a constant speed. The plurality of preheating devices 12 are arranged on the upstream side of the conveyor belt 11 above the primary jet nozzle 26 and the secondary jet nozzle 27, and preheat the substrate.

The frame 13 is installed above the primary jet nozzle 26 and the secondary jet nozzle 27. An observation window 13a is formed in the frame 13, and the primary jet from the primary jet nozzle 26 and the secondary jet from the secondary jet nozzle 27 can be observed from above through the observation window 13a.

The cooling device 14 is disposed on the downstream side of the conveyor belt 11 above the primary jet nozzle 26 and the secondary jet nozzle 27, and cools the substrate.

In the soldering system 1 that includes the conveyance device 10 and the jet soldering device 20, the state of soldering changes depending on how the jet of molten solder S hits the substrate. Therefore, in order to reduce soldering defects, it is preferable to stabilize the contact state between the substrate and the jet of molten solder S. However, the relative positional relationship between the substrate and the jet soldering device 20 may vary slightly. For example, the distance between the substrate and the jet soldering device 20 may change due to expansion of the transport device 10 itself due to the influence of heat from the preheating device 12. In order to stabilize the contact state between the substrate and the jet of molten solder S even if the relative positional relationship between the substrate and the jet soldering device 20 changes, the soldering system 1 includes a jig 30, It further includes a camera 40, an image processing device 50, and a controller 60.

As shown in FIGS. 2 and 3, the jig 30 includes a plurality of plate-like bodies, support parts 35 and 36, and connection parts 37 and 38. In the example shown in FIGS. 2 and 3, the plurality of plate-like bodies includes four plate-like bodies 31 to 34. However, the number of plate-like bodies is not limited to four, and may be two, three, or five or more.

The four plate-like bodies 31 to 34 sequentially face the primary jet nozzle 26 and the secondary jet nozzle 27 when the jig 30 is transported by the transport device 10. The four plate-like bodies 31 to 34 are made of, for example, heat-resistant transparent glass that is rectangular in plan view.

The support portion 35 supports one of the short sides of the four plate-like bodies 31 to 34 by sandwiching it from above and below in the thickness direction. Similarly, the support portion 36 supports the other short sides of the four plate-like bodies 31 to 34 by sandwiching them from above and below along the thickness direction. The connecting parts 37 and 38 connect the two supporting parts 35 and 36.

The support parts 35 and 36 are arranged so that when the jig 30 is transported by the transport device, the four plate-like bodies 31 to 34 are arranged along the transport direction D with a gap 39 therebetween. Supports plate-like bodies 31-34.

Furthermore, the support parts 35 and 36 support the four plate-like bodies 31-34 so that the distances between the four plate-like bodies 31-34 and the primary jet nozzle 26 (and the secondary jet nozzle 27) are different from each other. To support. In the example shown in FIG. 3, among the four plate-like bodies 31 to 34, the plate-like body 31 closest to the jet-type soldering device 20 is connected to the jet-type soldering device 32, 33, and 34. They are supported at positions spaced apart from 20 by h, 2h, and 3h, respectively. That is, the support parts 35 and 36 support the four plate-like bodies 31 to 34 at a height pitch h. The height pitch h is, for example, 0.5 mm. As a result, if the distance between the reference surface, which is the lower surface of the plate-shaped body 31, and the primary jet nozzle 26 is d, the distances between the plate-shaped bodies 32, 33, and 34 and the primary jet nozzle 26 are d+h, d+2h, and d+3h, respectively. becomes.

Note that the plate-like body 31 is supported by the supporting parts 35 and 36 so that its lower surface (reference surface) is at the same height as the lower surface of the substrate being transported by the transporting device 10.

The width (length along the conveying direction D) w of the gap 39 is determined according to the height pitch h and the conveying speed of the conveying device 10, etc., so that the molten solder S is not pulled toward the adjacent plate-shaped bodies due to surface tension. will be set appropriately. The width w of the gap 39 is set to, for example, 10 mm or more.

As shown in FIG. 1, a camera 40, which is an imaging device, is arranged above the primary jet nozzle 26 and the secondary jet nozzle 27, and views the jig 30 transported by the transport device 10 through the observation window 13a. Take an image. Since the four plates 31 to 34 are made of heat-resistant transparent glass, the image obtained by imaging shows the state of the lower surface of each of the four plates 31 to 34 on the jet soldering device 20 side. Contains a statue showing.

The image processing device 50 performs image processing on the image obtained by capturing the image with the camera 40, thereby determining the relationship between each of the four plate-shaped bodies 31 to 34 and the molten solder S spouted from the primary jet nozzle 26. It operates as a measurement unit that measures the contact state. For example, the image processing device 50 digitizes the contact area between each of the four plate-like bodies 31 to 34 and the molten solder S jetted from the primary jet nozzle 26.

Similarly, the image processing device 50 performs image processing on the image obtained by capturing the image with the camera 40, so that each of the four plate-like bodies 31 to 34 and the melt ejected from the secondary jet nozzle 27 are It operates as a measurement unit that measures the state of contact with the solder S. For example, the image processing device 50 digitizes the contact area between each of the four plate-like bodies 31 to 34 and the molten solder S jetted from the secondary jet nozzle 27.

The controller 60 is configured by, for example, a general-purpose computer, and includes a control unit 161 that controls the amount of molten solder S spouted from the primary jet nozzle 26 and the secondary jet nozzle 27.

The control unit 161 controls the amount of molten solder S spouted from the primary jet nozzle 26 based on the contact state between each of the four plate-like bodies 31 to 34 and the molten solder S jetted from the primary jet nozzle 26. do. Specifically, the control unit 161 controls the rotation speed of the motor 24a of the pump 24.

The control unit 161 controls the amount of molten solder S spouted from the secondary jet nozzle 27 based on the contact state between each of the four plate-like bodies 31 to 34 and the molten solder S jetted from the secondary jet nozzle 27. control. Specifically, the control unit 161 controls the rotation speed of the motor 25a of the pump 25.

According to the soldering system 1 according to the present embodiment, the jig 30 is set in the transport device 10 in order to adjust the degree of contact of the jets (primary jets and secondary jets) of the molten solder S with respect to the substrate. The four plate-like bodies 31 to 34 included in the jig 30 are sequentially moved above the primary jet nozzle 26. As described above, the four plate-like bodies 31 to 34 are arranged along the conveyance direction D with a gap 39 in between.

According to the above configuration, even if the molten solder S comes into contact with the plate-like body located above the primary jet nozzle 26 among the four plate-like bodies 31 to 34, the surface tension causes the plate-like body to be adjacent to the plate-like body. It is possible to suppress the molten solder S from being pulled by the plate-shaped body. Therefore, the image processing device 50 can accurately measure the contact state between each of the four plate-shaped bodies 31 to 34 and the molten solder S jetted from the primary jet nozzle 26 using the image of the camera 40. can. Thereby, the control unit 161 can control the amount of molten solder S spouted from the primary jet nozzle 26 so that the contact state between the substrate and the primary jet becomes a desired state. As a result, the jet height of the primary jet nozzle 26 is precisely adjusted to a height that allows stable soldering to the board. Similarly, the jet height of the secondary jet nozzle 27 is also precisely adjusted to a height that allows stable soldering to the board.

<Specific example>
(Hardware configuration of image processing device)
FIG. 4 is a schematic diagram showing an example of the hardware configuration of the image processing device. The image processing device 50 includes a CPU (Central Processing Unit) 51, a main memory 52, a hard disk 53, a camera interface (I/F) 54, and a communication I/F 55. These units are connected to each other via a bus 56 so as to be able to communicate data.

The CPU 51 loads programs (codes) including the image processing program 531 installed on the hard disk 53 into the main memory 52, and executes them in a predetermined order to perform various calculations. Main memory 52 is typically a volatile storage device such as DRAM (Dynamic Random Access Memory).

The hard disk 53 is an internal memory included in the image processing device 50, and is a nonvolatile storage device. The hard disk 53 stores an image processing program 531 and measurement data 532. Measurement data 532 indicates the measurement results of the connection state between each of the plate-like bodies 31 to 34 and the molten solder S, obtained by image processing. Note that in addition to or in place of the hard disk 53, a semiconductor storage device such as a flash memory may be employed.

Camera I/F 54 mediates data transmission between CPU 51 and camera 40. That is, the camera I/F 54 is connected to the camera 40 that generates image data.

The communication I/F 55 mediates data transmission between the controller 60 and other devices. The communication I/F 55 typically includes Ethernet (registered trademark), USB (Universal Serial Bus), or the like. Communication I/F 55 transmits measurement data 532 to controller 60.

(Measurement of contact state between plate-shaped object and molten solder)
Next, a specific example of a method for measuring the state of contact between each of the plurality of plate-like bodies and the molten solder S will be described. FIG. 5 is a diagram showing an example of a contact state between each of a plurality of plate-shaped bodies and molten solder (primary jet) jetted from a primary jet nozzle. FIG. 6 is a diagram showing an example of a contact state between each of a plurality of plate-like bodies and molten solder (secondary jet) jetted from a secondary jet nozzle. 5 and 6, (a) to (d) respectively show the state of contact between the plate-shaped bodies 31 to 34 and the molten solder S. In FIGS. 5 and 6, the upper rows of (a) to (d) show images taken by the camera 40 when the plate-shaped body reaches above the jet stream. A side view showing the positional relationship between the plate-shaped body and the jet stream is shown in the lower part.

Since the distances between the plate-like bodies 31 to 34 and the primary jet nozzle 26 are different from each other, as shown in FIG. have different areas. Specifically, the area of the contact region R1 decreases in the order of the plate-like bodies 31, 32, 33, and 34. In the example shown in FIG. 5, the molten solder S hardly contacts the plate-like body 34. In the example shown in FIG.

Similarly, since the distances between the plate-shaped bodies 31 to 34 and the secondary jet nozzle 27 are different from each other, as shown in FIG. The areas of the contact regions R2 are different from each other. Specifically, the area of the contact region R2 becomes smaller in the order of the plate-like bodies 31 and 32. In the example shown in FIG. 6, the molten solder S is not in contact with the plate-like bodies 33, 34.

The image processing device 50 measures the areas of contact regions R1 and R2 (contact area) as the state of contact between the plate-shaped body and the molten solder S. For example, the CPU 51 of the image processing device 50 extracts edge pixels corresponding to the contours of the contact regions R1 and R2 by executing the image processing program 531. The CPU 51 calculates the area surrounded by the extracted edge pixels as the contact area between the plate and the molten solder S.

In addition, since the primary jet has a wavy portion, as shown in FIGS. 5(b) and 5(c), a plurality of contact regions R1 can be seen in the plate-like bodies 32 and 33 that come into contact with the wavy portion of the primary jet. . In this case, the image processing device 50 may calculate the sum of the areas of the plurality of contact regions R1 as the contact area.

(Controller hardware configuration)
FIG. 7 is a schematic diagram showing the hardware configuration of the controller 60. The controller 60 is realized by, for example, a general-purpose computer. As shown in FIG. 7, the controller 60 includes a CPU 61 that executes various programs including an OS, a ROM (Read Only Memory) 62 that stores BIOS and various data, and a ROM (Read Only Memory) 62 that stores data necessary for the CPU 61 to execute programs. It includes a memory RAM (Random Access Memory) 63 that provides a work area for storage, and a hard disk (HDD) 64 that non-volatilely stores programs and the like executed by the CPU 61. The control unit 161 shown in FIG. 1 is realized by the CPU 61 executing a control program.

The controller 60 further includes a keyboard 65 and a mouse 66 for accepting operations from the user, and a monitor 67 for presenting information to the user. Further, the controller 60 includes a communication I/F 68 for communicating with the image processing device 50 and the like. These units are connected to each other via a bus 69 so as to be able to communicate data.

(Method of controlling spout amount)
An example of a method of controlling the amount of molten solder S ejected from the primary jet nozzle 26 and the secondary jet nozzle 27 by the control unit 161 of the controller 60 will be described.

(Adjustment of primary jet height)
The control unit 161 estimates the jet height H1 of the primary jet from the contact state (contact area) between each of the plate-shaped bodies 31 to 34 and the molten solder S jetted from the primary jet nozzle 26. The control unit 161 controls the amount of molten solder S spouted from the primary jet nozzle 26 so that the estimated jet height H1 falls within a predetermined range (hereinafter referred to as "first setting range"). .

As shown in Figure 5, when only the upper part of the wave-like part of the primary jet is in contact with the plate-shaped body, the contact area between the plate-shaped body and the primary jet is small (see (c) in Figure 5). . In addition, when the lower part of the wave-like part of the primary jet is in contact with the plate-like body, the contact area between the plate-like body and the primary jet is about half the area of the entire lower surface of the plate-like body (( b)). Furthermore, when a portion of the primary jet below the wavy portion is in contact with the plate-like body, the contact area between the plate-like body and the primary jet becomes close to the area of the entire lower surface of the plate-like body. From this, the jet height H1 can be estimated from the contact area between each of the plate-like bodies 31 to 34 and the primary jet.

The jet height H1 is indicated by, for example, the height of the highest point of the trough of the wavy portion of the primary jet with respect to the reference plane, which is the lower surface of the plate-shaped body 31 (see FIG. 5).

For example, when only the wavy portion (excluding valleys) of the primary jet is in contact with the plate, the upper limit Th1 of the possible contact area between the plate and the primary jet is set in advance through experiments, etc. . Further, a lower limit value Th2 of the range of the contact area between the plate-like body and the primary jet is set in advance through experiments or the like when the highest point of the trough of the wavy portion of the primary jet is in contact with the plate-like body.

The control unit 161 specifies, as the first plate-like body, the highest-positioned plate-like body whose contact area is equal to or larger than the lower limit Th2 from among the plate-like bodies 31 to 34. Furthermore, the control unit 161 specifies, as the second plate-like body, the lowest-positioned plate-like body whose contact area is less than or equal to the upper limit value Th1 from among the plate-like bodies 31 to 34. The control unit 161 sets the height (for example, an intermediate value) between the height of the lower surface of the first plate-like body with respect to the reference plane and the height of the lower face of the second plate-like member with respect to the reference plane to the jet height H1 of the primary jet. Estimated as.

According to such a method of estimating the jet height H1, the resolution of the jet height H1 becomes the same value as the height pitch h of the plate-like bodies 31 to 34.

The range of the ideal jet height H1 of the primary jet that allows stable soldering to the reference surface is set in advance as the first setting range through experiments or the like. For example, if the highest point of the trough of the wavy part of the primary jet is higher than the reference plane by h~2h, and stable soldering is possible with respect to the reference plane, then h~h2 is set as the first setting range. .

When the estimated jet height H1 is within the first setting range, the control unit 161 maintains the jet amount from the primary jet nozzle 26 at the current level. The control unit 161 increases the amount of ejection from the primary jet nozzle 26 when the estimated jet height H1 is less than or equal to the lower limit of the first setting range. Specifically, the control unit 161 increases the rotation speed of the motor 24a of the pump 24 by one step. The control unit 161 reduces the amount of ejection from the primary jet nozzle 26 when the estimated jet height H1 is greater than or equal to the upper limit of the first setting range. Specifically, the rotation speed of the motor 24a of the pump 24 is reduced by one step.

(Adjustment of secondary jet height)
Using a similar method, the control unit 161 calculates the jet height H2 of the secondary jet from the contact state (contact area) between each of the plate-shaped bodies 31 to 34 and the molten solder S jetted from the secondary jet nozzle 27. presume. The control unit 161 controls the amount of molten solder S spouted from the secondary jet nozzle 27 so that the estimated jet height H2 falls within a predetermined range (hereinafter referred to as "second setting range"). do.

The jet height H2 is indicated by, for example, the height of the highest point of the secondary jet with respect to the reference plane, which is the lower surface of the plate-shaped body 31 (see FIG. 6).

The control unit 161 specifies, as the third plate-like object, the highest-positioned plate-like object whose contact area is equal to or larger than a preset threshold value Th3 from among the plate-like objects 31 to 34. The threshold Th3 is, for example, a value slightly larger than 0. Further, the control unit 161 specifies the lowest plate-like body whose contact area is equal to or less than the threshold Th3 from among the plate-like bodies 31 to 34 as the fourth plate-like body. The control unit 161 determines the height (for example, an intermediate value) between the height of the lower surface of the third plate-like body with respect to the reference plane and the height of the lower face of the fourth plate-like body with respect to the reference plane as the jet height of the secondary jet. Estimated as H2.

According to such a method of estimating the jet height H2, the resolution of the jet height H2 becomes the same value as the height pitch h of the plate-like bodies 31 to 34.

An ideal jet height range of the secondary jet that allows stable soldering to the reference surface is set in advance as the second setting range through experiments or the like. For example, if the highest point of the secondary jet is higher than the reference plane by h~2h and stable soldering to the reference plane is possible, then h~h2 is set as the second setting range.

When the estimated jet height H2 is within the second setting range, the control unit 161 maintains the jet amount from the secondary jet nozzle 27 at the current level. The control unit 161 increases the amount of ejection from the secondary jet nozzle 27 when the estimated jet height H2 is less than or equal to the lower limit of the second setting range. Specifically, the control unit 161 increases the rotation speed of the motor 25a of the pump 25 by one step. The control unit 161 reduces the amount of ejection from the secondary jet nozzle 27 when the estimated jet height H2 is greater than or equal to the upper limit of the second setting range. Specifically, the control unit 161 reduces the rotation speed of the motor 25a of the pump 25 by one step.

(Flow of jet height adjustment process)
FIG. 8 is a flowchart showing the flow of jet height adjustment processing in the soldering system. The adjustment process shown in FIG. 8 is executed for each of the primary jet flow and the secondary jet flow.

First, the jig 30 is set on the transport device 10 (step S1). Next, the image processing device 50 determines whether one of the plate-shaped bodies 31 to 34 included in the jig 30 has moved above the jet (step S2). For example, the image processing device 50 may determine whether or not the plate has moved above the jet based on the operating time and the transport speed of the transport device 10. If the plate has not moved above the jet (NO in step S2), the adjustment process returns to step S2.

When one plate-like object moves above the jet stream (YES in step S2), the image processing device 50 outputs an imaging instruction to the camera 40 to image the plate-like object (step S3). The image processing device 50 measures the contact area between the plate-shaped body and the molten solder S by performing image processing on the image acquired from the camera 40 (step S4).

Next, the image processing device 50 determines whether all the plate-like bodies 31 to 34 have been imaged (step S5). If not all the plate-like bodies 31 to 34 have been imaged (NO in step S5), steps S2 to S4 are repeated for the remaining plate-like body.

When all the plate-like bodies 31 to 34 are imaged (YES in step S5), the control unit 161 of the controller 60 adjusts the jet height based on the contact area between each of the plate-like bodies 31 to 34 and the molten solder S. (H1 for the primary jet and H2 for the secondary jet) is estimated (step S6).

The control unit 161 determines whether the estimated jet height is within a set range (a first set range for the primary jet and a second set range for the secondary jet) (step S7). If the estimated jet height is within the set range, the jet height adjustment process ends.

If the estimated jet height is less than or equal to the lower limit of the setting range, the control unit 161 increases the motor output (step S8). Specifically, the control unit 161 increases the rotation speed of the motor 24a of the pump 24 by one step for the primary jet flow. The control unit 161 increases the rotation speed of the motor 25a of the pump 25 by one step for the secondary jet flow.

If the estimated jet height is greater than or equal to the upper limit of the setting range, the control unit 161 lowers the motor output (step S9). Specifically, the control unit 161 increases the rotation speed of the motor 24a of the pump 24 by one step for the primary jet flow. The control unit 161 reduces the rotation speed of the motor 25a of the pump 25 by one step regarding the secondary jet flow.

After step S8 or step S9, the adjustment process returns to step S1, and the jig 30 is set on the conveyance device 10 again. Thereafter, the processes of steps S2 to S9 are repeated.

(Verification experiment)
A plurality of types of jigs were prepared in which the height pitch h of the plate-like bodies 31 to 34 and the width w of the gap 39 were different, and the estimation accuracy of the jet height was verified using the plurality of jigs. The height pitch h is 0.2 mm, 0.4 mm, 0.6 mm, 0.8 mm, or 1.0 mm. The width w of the gap 39 is 0 mm, 5 mm, or 10 mm. Using each jig, the ratio of the jet height estimated by the control unit 161 to the actual jet height (hereinafter referred to as "normal estimated ratio") was evaluated. As described above, the resolution of the jet height estimated from the contact area between each of the plate-like bodies 31 to 34 and the molten solder S has the same value as the height pitch h of the plate-like bodies 31 to 34. Therefore, the normal estimation rate was evaluated with a resolution according to the height pitch h.

FIG. 9 is a diagram showing the results of a verification experiment. As shown in FIG. 9, when the height pitch h is 1.0 mm (that is, when the jet height resolution is 1.0 mm), even if the width w of the gap 39 is 0 mm, the jet We were able to accurately estimate the height. This is because the difference in level between two adjacent plate-shaped bodies is relatively large, so even if there is no gap between the two plate-shaped bodies, even if molten solder S comes into contact with one of the plate-shaped bodies, surface tension will cause This is because the molten solder S is not pulled to the other plate-like body.

However, when the width w of the gap 39 is 0 mm, the jet height could not be accurately estimated by setting the height pitch h to 0.8 mm or less. In other words, if there is no gap 39, the jet height cannot be accurately estimated with a resolution of 0.8 mm or less. This is because the difference in level between two adjacent plate-shaped bodies becomes small, and when the molten solder S comes into contact with one plate-shaped body, the molten solder S is pulled toward the other plate-shaped body due to surface tension.

On the other hand, by setting the width w of the gap 39 to 10 mm, the jet height could be accurately estimated even if the height pitch h was 0.4 mm. In other words, the jet height could be accurately estimated with a resolution of 0.4 mm. This is because the gap 39 with a width of 10 mm between two adjacent plate-shaped bodies prevents the molten solder S from being pulled toward the other plate-shaped body due to surface tension even if the molten solder S comes into contact with one of the plate-shaped bodies. It's for a reason.

(advantage)
As described above, the soldering system 1 according to the present embodiment includes the jig 30 that can be transported by the transport device 10. The jig 30 includes plate-shaped bodies 31 to 34 and support parts 35 and 36. The plate-like bodies 31 to 34 face the nozzles (the primary jet nozzle 26 and the secondary jet nozzle 27) when the jig 30 is transported by the transport device 10. The supporting parts 35 and 36 are arranged such that when the jig 30 is transported by the transport device, the plate-like bodies 31 to 34 are arranged with a gap 39 in between, and the plate-like bodies 31 to 34 are arranged with a gap 39 between them. The plate-like bodies 31 to 34 are supported so that the distances from the nozzles are different from each other. The soldering system 1 further includes an image processing device 50 and a control section 161. The image processing device 50 measures the state of contact between each of the plate-like bodies 31 to 34 and the molten solder S jetted from the nozzle when the jig 30 is transported by the transport device 10. The control unit 161 controls the amount of molten solder S spouted from the nozzle based on the contact state of each of the plate-shaped bodies 31 to 34.

According to the above configuration, even if the molten solder S comes into contact with the plate-like body located above the nozzle among the plate-like bodies 31 to 34, the molten solder S contacts the plate-like body adjacent to the plate-like body due to surface tension. S can be prevented from being pulled. Therefore, the image processing device 50 can accurately measure the contact state between each of the plate-shaped bodies 31 to 34 and the molten solder S jetted from the nozzle. Thereby, the control unit 161 can accurately adjust the jet height of the molten solder S by controlling the amount of the molten solder S jetted from the nozzle based on the contact state.

The control unit 161 estimates the height of the jet of molten solder S from the nozzle (H1 for the primary jet and H2 for the secondary jet) from the contact state of each of the plate-shaped bodies 31 to 34. The control unit 161 controls the jet amount so that the jet height falls within a predetermined range (a first setting range for the primary jet and a second setting range for the secondary jet). Thereby, by predetermining a jet height range in which stable soldering can be performed, the jet amount is controlled so that the jet height from the nozzle falls within the range. As a result, stable soldering to the board can be achieved.

The plate-like bodies 31 to 34 are transparent. The soldering system 1 further includes a camera 40 that is arranged above the nozzle and captures an image of the jig 30 that is transported by the transport device 10. The image processing device 50 measures the contact state by processing the image obtained by the camera 40 . Thereby, the image processing device 50 can accurately measure the contact state based on the image.

The gap is 10 mm or more along the conveyance direction D. As a result, the resolution of the jet height can be improved to 0.4 mm from the above verification experiment.

(Modification 1)
In the above description, the contact area is measured as the state of contact between each of the plurality of plate-shaped bodies and the jet stream. However, the image processing device 50 may measure the presence or absence of contact between each of the plurality of plate-shaped bodies and the molten solder S.

In the case of a secondary jet with a flat surface, as shown in FIG. The plate-like bodies 33 and 34 located above the point do not come into contact with the secondary jet. Therefore, the control unit 161 identifies the highest plate-like body that is in contact with the secondary jet among the plate-like bodies 31 to 34 as the third plate-like body that is not in contact with the secondary jet. The plate-like body at the lowest position may be specified as the fourth plate-like body. Thereby, the control unit 161 determines the height (for example, an intermediate value) between the height of the lower surface of the third plate-like body with respect to the reference plane and the height of the lower face of the fourth plate-like member with respect to the reference plane of the secondary jet. It can be estimated as the jet height H2.

(Modification 2)
In the above description, the control unit 161 estimates the jet height from the contact state of the molten solder S with each of the plurality of plate-like bodies, and adjusts the jet amount so that the estimated jet height falls within the set range. It was decided that However, the control unit 161 may adjust the amount of ejection so that the contact area between each of the plurality of plate-shaped bodies and the molten solder S falls within a predetermined range.

For example, if the highest point of the secondary jet is higher than the reference surface by h~2h and stable soldering is possible with respect to the reference surface, the control unit 161 may adjust the jet amount as follows. good.

A lower limit value Th4 of the range in which the contact area between the secondary jet flow and the plate-shaped body 32, the highest point of which is higher than the reference plane by h~2h, is set in advance. Further, an upper limit value Th5 of the range in which the contact area between the secondary jet flow and the plate-shaped body 33 can be set is preset, the highest point of which is higher than the reference plane by h~2h.

The control unit 161 receives the contact area between the plate-like body 32 and the secondary jet and the contact area between the plate-like body 33 and the secondary jet from the image processing device 50 . The control unit 161 determines whether the contact area between the plate-like body 32 and the secondary jet is equal to or greater than the lower limit Th4, and whether the contact area between the plate-like body 33 and the secondary jet is equal to or less than the upper limit Th5. to decide.

If the contact area between the plate-shaped body 32 and the secondary jet is equal to or greater than the lower limit Th4, and the contact area between the plate-shaped body 33 and the secondary jet is equal to or less than the upper limit Th5, the control unit 161 controls the The amount of ejection from the jet nozzle 27 is maintained at the current level. When the contact area between the plate-shaped body 32 and the secondary jet is less than the lower limit Th4, the control unit 161 increases the amount of jet from the secondary jet nozzle 27. When the contact area between the plate-shaped body 33 and the secondary jet exceeds the upper limit Th5, the control unit 161 reduces the amount of jet from the secondary jet nozzle 27.

According to the second modification, the jet height of the secondary jet nozzle 27 can be precisely adjusted to a height that allows stable soldering to the board.

(Modification 3)
In the above description, it is assumed that the contact state between the plate-shaped body and the molten solder S is measured by the camera 40 and the image processing device 50. However, the method of measuring the contact state between the plate-shaped body and the molten solder S is not limited to this.

FIG. 10 is a schematic diagram showing the overall configuration of a soldering system according to modification 3. As shown in FIG. 10, compared to the soldering system 1 shown in FIG. The difference is that a jig 130, a receiving device 70, and a controller 60A are provided.

FIG. 11 is a cross-sectional view showing a plurality of plate-like bodies included in a jig according to modification example 3. The jig 130 differs from the jig 30 shown in FIG. 2 in that it includes plate-like bodies 131-134 shown in FIG. 11 instead of the plate-like bodies 31-34. That is, the supporting parts 35 and 36 (see FIG. 2) support the four plate-like bodies 131 to 134 along the transport direction D when the jig 130 is transported along the transport direction D by the transport device 10. Four plate-like bodies 131 to 134 are supported so that they are arranged with gaps 39 in between. Furthermore, the support parts 35 and 36 support the four plate-like bodies 131-134 so that the distances between the four plate-like bodies 131-134 and the primary jet nozzle 26 (and the secondary jet nozzle 27) are different from each other. To support.

FIG. 12 is a bottom view showing a plate-like body included in a jig according to modification example 3. FIG. 13 is a cross-sectional view showing a plate-like body included in a jig according to modification example 3.

As shown in FIGS. 12 and 13, each of the plate-shaped bodies 131 to 134 has a base 139 and a plurality of conductive parts 140. The base body 139 has a rectangular shape in plan view and is made of an insulating material such as heat-resistant glass.

The plurality of conductive parts 140 are made of a conductive material such as copper. The plurality of conductive parts 140 are arranged in the lower surface 141a of each of the plate-like bodies 131 to 134 on the jet soldering device 20 side when the jig 130 is transported by the transport device 10. In the example shown in FIG. 12, 7×17 conductive parts 140 are arranged in a matrix. As shown in FIG. 13, each of the plurality of conductive parts 140 is embedded in the base 139 so as to be exposed from the lower surface 141a and the upper surface 141b of each of the plate-like bodies 131-134.

Jig 130 further includes sensors 142 corresponding to each of plate-shaped bodies 131-134. The sensor 142 is attached to the supporting parts 35, 36 or the connecting parts 37, 38 (see FIG. 2). The sensor 142 includes a battery 143 and a plurality of resistors 144 respectively connected to a plurality of conductive parts 140 included in the corresponding plate-shaped body. Each of the plurality of resistors 144 is connected between the positive electrode of the battery 143 and the corresponding conductive part 140. The negative electrode of the battery 143 is electrically connected to the molten solder S in the solder bath 21 .

When the jet of molten solder S comes into contact with the lower surface 141a of each of the plate-shaped bodies 131 to 134, a current flows through the resistor 144 connected to the conductive part 140 that came into contact with the jet. On the other hand, no current flows through the resistor 144 connected to the conductive portion 140 that is not in contact with the jet stream.

The sensor 142 monitors the current value of each of the plurality of resistors 144, and outputs a signal indicating the monitoring result for each resistor 144. For example, the sensor 142 outputs an on signal when the current value exceeds a predetermined threshold, and outputs an off signal when the current value is below the threshold. When the conductive part 140 and the jet of molten solder S are electrically connected, a current flows through the resistor 144 connected to the conductive part 140, and an ON signal is output for the resistor 144. When the conductive part 140 and the jet of molten solder S are not electrically connected, the current value of the resistor 144 connected to the conductive part 140 is 0, so that an off signal is output for the resistor 144.

FIG. 14 is a diagram showing an example of an output signal from a sensor. FIG. 15 is a diagram showing another example of the output signal from the sensor. FIG. 16 is a diagram showing yet another example of the output signal from the sensor. FIG. 14 shows an example in which the jet stream contacts most of the plate-shaped body 131. FIG. 15 shows an example in which the jet stream contacts only the vicinity of the center of the plate-shaped body 131. FIG. 16 shows an example when the jet stream is not in contact with the plate-shaped body 131. 14 to 16, the upper row shows a plan view showing the lower surface 141a of the plate-like body 131, and the lower row shows the states (on/off) of a plurality of output signals corresponding to the plurality of resistors 144, respectively. It will be done.

As shown in FIGS. 14 to 16, the output signal corresponding to the resistor 144 connected to the conductive part 140 disposed within the contact area R between the plate-shaped body 131 and the jet of molten solder S becomes an on signal. Become. Therefore, by checking the output signals from each resistor 144, it is possible to grasp the contact state (for example, the size of the contact area R) between the plate-shaped body 131 and the jet stream.

As shown in FIG. 13, the jig 130 further includes a transmitter 145 that transmits the output signal from the sensor 142. The transmitting device 145 is attached to the supporting parts 35, 36 or the connecting parts 37, 38 (see FIG. 2). The transmitting device 145 transmits the output signal from the sensor 142 to the receiving device 70 (see FIG. 10) by wireless communication.

For each of the plate-like bodies 131 to 134, the receiving device 70 shown in FIG. The output signal from the transmitter 145 is received from the transmitter 145 . Receiving device 70 outputs the received output signal to controller 60A.

The controller 60A is different from the controller 60 shown in FIG. 1 in that it further includes a measuring section 162. The controller 60A, like the controller 60, has a hardware configuration as shown in FIG. The measurement unit 162 is realized by the CPU 61 executing a measurement program.

For each of the plate-like bodies 131 to 134, the measuring unit 162 measures the contact state (here, contact area) between the plate-like body and the jet of molten solder S, based on the output signal of the sensor 142 received from the receiving device 70. Measure.

As shown in FIGS. 14 to 16, the number of resistors 144 corresponding to the ON signal among the plurality of resistors 144 correlates with the area of the contact region R (contact area). Therefore, the measuring unit 162 counts the number of ON signals among the output signals of the sensor 142. The measuring unit 162 converts the counted number into a contact area, and outputs the converted contact area to the control unit 161. Thereby, the control unit 161 can control the amount of molten solder ejected based on the contact area between each of the plate-shaped bodies 31 to 34 and the molten solder S using a method similar to that described above.

FIG. 17 is a flowchart showing the flow of the ejection height adjustment process in the soldering system according to the third modification. The flowchart shown in FIG. 17 differs from the flowchart shown in FIG. 8 in that it includes steps S12 to S15 instead of steps S2 to S5.

The receiving device 70 determines whether one of the plate-shaped bodies 131 to 134 included in the jig 130 has moved above the jet (step S12). If none of the plate-like bodies has moved above the jet (NO in step S12), the adjustment process returns to step S12.

If the plate has moved above the jet (YES in step S12), the receiving device 70 receives the output signal of the sensor 142 corresponding to the plate from the transmitting device 145 (step S13). The measuring unit 162 of the controller 60A measures the contact area between the plate-shaped body and the molten solder S using the output signal of the sensor 142 (step S14).

Next, the receiving device 70 determines whether the output signals of the sensor 142 have been received for all the plate-shaped bodies 131 to 134 (step S15). If the output signals of the sensor 142 have not been received for all of the plate-like bodies 131-134 (NO in step S15), steps S12-S14 are repeated for the remaining plate-like body.

When the output signals of the sensor 142 are received for all the plate-like bodies 131 to 134 (YES in step S15), the adjustment processing moves to step S6.

(Modification 4)
In the third modification described above, in each of the plate-like bodies 131 to 134, the plurality of conductive parts 140 are arranged in a matrix on the lower surface 141a on the jet soldering device 20 side. However, the plurality of conductive parts 140 may be arranged in a line.

FIG. 18 is a bottom view showing a plate-like body included in a jig according to modification example 4. As shown in FIG. 18, the plurality of conductive parts 140 are arranged perpendicularly to the conveyance direction D within a lower surface 141a on the jet soldering device side (that is, a surface facing the primary jet nozzle 26 and the secondary jet nozzle 27). arranged in a line in the direction of

The receiving device 70 receives, for each of the plate-like bodies 131 to 134, the output signal from the sensor 142 corresponding to the plate-like body from the transmitting device 145 at a plurality of timings. The plurality of timings are from the first timing when the plurality of conductive parts 140 reach the upper end of the jet flow (either the primary jet flow or the secondary jet flow) on the upstream side in the transport direction D, to the downstream timing in the transport direction D of the jet flow. These are n timings up to the n-th timing when the plurality of conductive parts 140 reach above the side ends.

FIG. 19 is a diagram illustrating an example of an output signal from a sensor in Modification 4. FIG. 20 is a diagram showing another example of the output signal from the sensor in Modification 4. FIG. 19 shows an example in which the jet stream contacts most of the plate-like body 131. FIG. 20 shows an example in which the jet stream contacts about half of the plate-like body 131. A plan view showing the lower surface of the plate-like body 131 is shown in the upper part of FIG. 19 and FIG. 20 . The states (on/off) of the output signal of the sensor 142 at the first to seventh timings are shown in the lower rows of FIGS. 19 and 20. The first timing is the timing when the plurality of conductive parts 140 reach the upper end of the jet flow on the upstream side in the conveying direction D (see the upper dotted line). The seventh timing is the timing when the plurality of conductive parts 140 reach the upper end of the jet flow on the downstream side in the conveyance direction D (see the upper double-dashed line).

As shown in FIGS. 19 and 20, during the period when the conductive part 140 is included in the contact area R between the plate-shaped body 131 and the jet, the output signal corresponding to the resistor 144 connected to the conductive part 140 is turned on. It becomes a signal. Therefore, by checking the output signals from each resistor 144 at the first to seventh timings, it is possible to understand the connection state (for example, the size of the contact area R) between the plate-shaped body 131 and the jet stream.

The number of ON signals among the plurality of output signals corresponding to the plurality of resistors 144 at the first to seventh timings correlates with the contact area between the plate-shaped body 131 and the jet stream. Therefore, the measuring unit 162 of the controller 60A may convert the number of ON signals among the output signals of the sensor 142 at the first to seventh timings into a contact area. Thereby, the control unit 161 of the controller 60A can control the amount of molten solder ejected based on the contact area between each of the plate-like bodies 31 to 34 and the molten solder S, using a method similar to that described above.

<Additional notes>
As described below, this embodiment includes the following disclosures.

(Configuration 1)
a transport device (10) for transporting the substrate;
A jet-type soldering device that includes a nozzle (26, 27) and performs soldering by jetting molten solder (S) from the nozzle (26, 27) to the substrate transported by the transport device (10). (20) A soldering system (1, 1A) comprising:
Further comprising a jig (30, 130) that can be transported by the transport device (10),
The jig (30, 130) is
a plurality of plate-like bodies (31-34, 131-134) facing the nozzles (26, 27) when the jig (30, 130) is transported by the transport device (10);
When the jig (30, 130) is transported by the transport device (10), the plurality of plate-like bodies (31 to 34, 131 to 134) are arranged with gaps (39) in the transport direction. and the distances between the plurality of plate-like bodies (31-34, 131-134) and the nozzles (26, 27) are different from each other. ) supporting portions (35, 36) that support the
The soldering system (1, 1A) further includes:
When the jig (30, 130) is transported by the transport device (10), each of the plurality of plate-like bodies (31 to 34, 131 to 134) is sprayed from the nozzle (26, 27). a measurement unit (50, 162) that measures the contact state with the molten solder (S);
a control unit (161) that controls the amount of the molten solder (S) ejected from the nozzle (26, 27) based on the contact state of each of the plurality of plate-like bodies (31-34, 131-134); ) A soldering system (1, 1A) comprising:

(Configuration 2)
The control unit (161)
Estimating the height of the jet of the molten solder (S) from the nozzle (26, 27) from the contact state of each of the plurality of plate-like bodies (31 to 34, 131 to 134),
The soldering system (1, 1A) according to Configuration 1, wherein the jet amount is controlled so that the jet height falls within a predetermined range.

(Configuration 3)
The measurement unit (50, 162) measures the contact area between each of the plurality of plate-shaped bodies (31 to 34, 131 to 134) and the molten solder (S) spouted from the nozzle (26, 27). Measured as the contact state,
The control unit (161) includes:
The soldering system (1, 1A).

(Configuration 4)
The plurality of plate-like bodies (31 to 34) are transparent,
The soldering system (1) includes:
Further comprising an imaging device (40) arranged above the nozzles (26, 27) and configured to take an image of the jig (30) transported by the transport device (10),
4. The soldering system (1) according to any one of configurations 1 to 3, wherein the measurement unit (50) measures the contact state by processing an image obtained by imaging with the imaging device (40).

(Configuration 5)
Each of the plurality of plate-shaped bodies (131 to 134) has a plurality of conductive parts (140) arranged in a surface (141a) facing the nozzle (26, 27),
The measurement unit (162) measures the contact state based on the presence or absence of electrical continuity between each of the plurality of conductive parts (140) and the molten solder (S), according to any one of configurations 1 to 3. Soldering system (1A).

(Configuration 6)
In configuration 5, the plurality of conductive parts (140) are arranged in a matrix in a surface (141a) facing the nozzle (26, 27) of each of the plurality of plate-like bodies (131 to 134). The described soldering system (1A).

(Configuration 7)
The plurality of conductive parts (140) are arranged in a line in a direction perpendicular to the transport direction within a surface (141a) of each of the plurality of plate-like bodies (131 to 134) facing the nozzles (26, 27). The soldering system (1A) according to configuration 5, arranged in a configuration.

(Configuration 8)
8. The soldering system (1, 1A) according to any one of configurations 1 to 7, wherein the gap (39) is 10 mm or more along the conveyance direction.

(Configuration 9)
a transport device (10) for transporting the substrate;
A jet-type soldering device that includes a nozzle (26, 27) and performs soldering by jetting molten solder (S) from the nozzle (26, 27) to the substrate transported by the transport device (10). (20) A jig (30, 130) used for adjusting the amount of ejection from the nozzle (26, 27) in a soldering system (1, 1A) comprising:
a plurality of plate-like bodies (31-34, 131-134) facing the nozzles (26, 27) when the jig (30, 130) is transported by the transport device (10);
When the jig (30, 130) is transported by the transport device (10), the plurality of plate-like bodies (31 to 34, 131 to 134) are spaced apart from each other with a gap (39) along the transport direction. The plurality of plate-like bodies (31-34, 131-134) are arranged such that the distances between the plurality of plate-like bodies (31-34, 131-134) and the nozzles (26, 27) are different from each other. 134);

(Configuration 10)
Each of the plurality of plate-shaped bodies (131 to 134) has a plurality of conductive parts (140) arranged in a surface (141a) facing the nozzle (26, 27),
The jig (130) is
The jig (130) according to configuration 9, further comprising a sensor (142) that detects the presence or absence of electrical continuity between each of the plurality of conductive parts (140) and the molten solder (S).

(Configuration 11)
a transport device (10) for transporting the substrate;
A jet-type soldering device that includes a nozzle (26, 27) and performs soldering by jetting molten solder (S) from the nozzle (26, 27) to the substrate transported by the transport device (10). (20) A method for adjusting the amount of the molten solder (S) ejected from the nozzle (26, 27) in a soldering system (1, 1A) comprising:
A step of transporting the jig (30, 130) by the transport device (10),
The jig (30, 130) is
a plurality of plate-like bodies (31-34, 131-134) facing the nozzles (26, 27) when the jig (30, 130) is transported by the transport device (10);
When the jig (30, 130) is transported by the transport device (10), the plurality of plate-like bodies (31 to 34, 131 to 134) are arranged with gaps (39) in the transport direction. and the distances between the plurality of plate-like bodies (31-34, 131-134) and the nozzles (26, 27) are different from each other. ) supporting portions (35, 36) that support the
The adjustment method further includes:
a step of measuring the contact state between each of the plurality of plate-like bodies (31 to 34, 131 to 134) and the molten solder (S) jetted from the nozzle (26, 27);
and controlling the amount of the molten solder (S) ejected from the nozzle (26, 27) based on the contact state of each of the plurality of plate-like bodies (31-34, 131-134). , adjustment method.

Although the embodiments of the present invention have been described, the embodiments disclosed this time should be considered to be illustrative in all respects and not restrictive. The scope of the present invention is indicated by the claims, and it is intended that all changes within the meaning and range equivalent to the claims are included.

1, 1A soldering system, 10 conveyance device, 11 conveyance belt, 12 preheating device, 13 frame, 13a observation window, 14 cooling device, 20 jet soldering device, 21 solder bath, 22, 23 duct, 24, 25 Pump, 24a, 25a Motor, 24b, 25b Impeller, 26 Primary jet nozzle, 27 Secondary jet nozzle, 30, 130 Jig, 31 to 34, 131 to 134 Plate body, 35, 36 Support part, 37, 38 Connection part, 39 Gap, 40 Camera, 50 Image processing device, 51, 61 CPU, 52 Main memory, 53, 64 Hard disk, 54 Camera I/F, 55, 68 Communication I/F, 56, 69 Bus, 60, 60A Controller; 62 ROM; 63 RAM; 65 Keyboard; 66 Mouse; Section, 162 Measurement section, 531 Image processing program, 532 Measurement data, S Molten solder.

Claims (14)

a transport device for transporting the substrate;
A soldering system comprising: a jet soldering device that includes a nozzle and performs soldering by jetting molten solder from the nozzle to the substrate transported by the transport device,
further comprising a jig that can be transported by the transport device,
The jig is
a plurality of plate-like bodies facing the nozzle when the jig is transported by the transport device;
When the jig is transported by the transport device, the plurality of plate-like bodies are arranged with gaps in the transport direction, and the distances between the plurality of plate-like bodies and the nozzle are different from each other. and a support part that supports the plurality of plate-like bodies,
The soldering system further includes:
a measurement unit that measures a contact state between each of the plurality of plate-shaped bodies and the molten solder ejected from the nozzle when the jig is transported by the transport device;
a control unit that controls the amount of the molten solder ejected from the nozzle based on the contact state of each of the plurality of plate-like bodies ,
Each of the plurality of plate-like bodies covers the molten solder ejected from the nozzle . a transport device for transporting the substrate;
A soldering system comprising: a jet soldering device that includes a nozzle and performs soldering by jetting molten solder from the nozzle to the substrate transported by the transport device,
further comprising a jig that can be transported by the transport device,
The jig is
a plurality of plate-like bodies facing the nozzle when the jig is transported by the transport device;
When the jig is transported by the transport device, the plurality of plate-like bodies are arranged with gaps in the transport direction, and the distances between the plurality of plate-like bodies and the nozzle are different from each other. and a support part that supports the plurality of plate-like bodies,
The soldering system further includes:
a measurement unit that measures a contact state between each of the plurality of plate-shaped bodies and the molten solder ejected from the nozzle when the jig is transported by the transport device;
a control unit that controls the amount of the molten solder ejected from the nozzle based on the contact state of each of the plurality of plate-like bodies,
The soldering system, wherein the gap is 10 mm or more along the conveyance direction. The control unit includes:
Estimating the height of the jet of the molten solder from the nozzle from the contact state of each of the plurality of plate-like bodies,
The soldering system according to claim 1 or 2 , wherein the jetting amount is controlled so that the jetting height falls within a predetermined range. The measurement unit measures a contact area between each of the plurality of plate-shaped bodies and the molten solder ejected from the nozzle as the contact state,
The control unit includes:
The soldering system according to claim 1 or 2 , wherein the ejection amount is controlled so that the contact area of each of the plurality of plate-shaped bodies falls within a predetermined range. The plurality of plate-like bodies are transparent,
The soldering system includes:
further comprising an imaging device arranged above the nozzle and configured to take an image of the jig transported by the transport device,
The soldering system according to any one of claims 1 to 4 , wherein the measuring unit measures the contact state by processing an image obtained by imaging with the imaging device. Each of the plurality of plate-like bodies has a plurality of conductive parts arranged in a plane facing the nozzle,
The soldering system according to any one of claims 1 to 4 , wherein the measuring unit measures the contact state based on the presence or absence of electrical continuity between each of the plurality of conductive parts and the molten solder. The soldering system according to claim 6 , wherein the plurality of conductive parts are arranged in a matrix in a surface of each of the plurality of plate-like bodies facing the nozzle. 7. The soldering system according to claim 6 , wherein the plurality of conductive parts are arranged in a line in a direction perpendicular to the conveyance direction in a surface of each of the plurality of plate-like bodies facing the nozzle. The soldering system according to claim 1 , wherein the gap is 10 mm or more along the conveyance direction. a transport device for transporting the substrate;
Adjustment of the amount of spouting from the nozzle in a soldering system comprising a jet soldering device that includes a nozzle and performs soldering by jetting molten solder from the nozzle to the substrate transported by the transporting device. A jig used for
a plurality of plate-like bodies facing the nozzle when the jig is transported by the transport device;
When the jig is transported by the transport device, the plurality of plate-like bodies are arranged with gaps in the transport direction, and the distances between the plurality of plate-like bodies and the nozzle are different from each other. and a support part that supports the plurality of plate-like bodies ,
Each of the plurality of plate-like bodies covers the molten solder ejected from the nozzle . a transport device for transporting the substrate;
Adjustment of the amount of spouting from the nozzle in a soldering system comprising a jet soldering device that includes a nozzle and performs soldering by jetting molten solder from the nozzle to the substrate transported by the transporting device. A jig used for
a plurality of plate-like bodies facing the nozzle when the jig is transported by the transport device;
When the jig is transported by the transport device, the plurality of plate-like bodies are arranged with gaps in the transport direction, and the distances between the plurality of plate-like bodies and the nozzle are different from each other. and a support part that supports the plurality of plate-like bodies,
The jig, wherein the gap is 10 mm or more along the conveyance direction . Each of the plurality of plate-like bodies has a plurality of conductive parts arranged in a plane facing the nozzle,
The jig is
The jig according to claim 10 or 11 , further comprising a sensor that detects the presence or absence of electrical continuity between each of the plurality of conductive parts and the molten solder. a transport device for transporting the substrate;
Spouting of the molten solder from the nozzle in a soldering system comprising a jet soldering device that includes a nozzle and performs soldering by jetting molten solder from the nozzle to the substrate transported by the transport device. An adjustment method for adjusting the amount,
comprising a step of transporting the jig by the transport device,
The jig is
a plurality of plate-like bodies facing the nozzle when the jig is transported by the transport device;
When the jig is transported by the transport device, the plurality of plate-like bodies are arranged with gaps in the transport direction, and the distances between the plurality of plate-like bodies and the nozzle are different from each other. and a support part that supports the plurality of plate-like bodies,
The adjustment method further includes:
measuring the contact state between each of the plurality of plate-shaped bodies and the molten solder ejected from the nozzle;
controlling the amount of the molten solder ejected from the nozzle based on the contact state of each of the plurality of plate-like bodies ,
Each of the plurality of plate-like bodies covers the molten solder ejected from the nozzle . a transport device for transporting the substrate;
Spouting of the molten solder from the nozzle in a soldering system comprising a jet soldering device that includes a nozzle and performs soldering by jetting molten solder from the nozzle to the substrate transported by the transport device. An adjustment method for adjusting the amount,
comprising a step of transporting the jig by the transport device,
The jig is
a plurality of plate-like bodies facing the nozzle when the jig is transported by the transport device;
When the jig is transported by the transport device, the plurality of plate-like bodies are arranged with gaps in the transport direction, and the distances between the plurality of plate-like bodies and the nozzle are different from each other. and a support part that supports the plurality of plate-like bodies,
The adjustment method further includes:
measuring the contact state between each of the plurality of plate-shaped bodies and the molten solder ejected from the nozzle;
controlling the amount of the molten solder ejected from the nozzle based on the contact state of each of the plurality of plate-like bodies,
The adjustment method wherein the gap is 10 mm or more along the conveyance direction.

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