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JP7387466B2 - Observation jig - Google Patents
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JP7387466B2 - Observation jig - Google Patents

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JP7387466B2
JP7387466B2 JP2020012700A JP2020012700A JP7387466B2 JP 7387466 B2 JP7387466 B2 JP 7387466B2 JP 2020012700 A JP2020012700 A JP 2020012700A JP 2020012700 A JP2020012700 A JP 2020012700A JP 7387466 B2 JP7387466 B2 JP 7387466B2
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chip
base
opening
protrusion
frame
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JP2021118332A (en
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欣浩 楠
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Disco Corp
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Disco Corp
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Priority to KR1020200186383A priority patent/KR20210097019A/en
Priority to CN202110097309.7A priority patent/CN113189098B/en
Priority to TW110102951A priority patent/TWI868300B/en
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27Structural arrangements therefor
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01Arrangements or apparatus for facilitating the optical investigation
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501Semiconductor wafers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties

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  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Physics & Mathematics (AREA)
  • Pathology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Dicing (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Description

本発明は、チップの側面を観察する際に用いる観察用治具に関する。 The present invention relates to an observation jig used when observing the side surface of a chip.

IC、LSI等の複数のデバイスが分割予定ラインによって区画され表面に形成されたウエーハは、切削ブレードを回転可能に備えたダイシング装置によって個々のデバイスチップに分割され、分割された各デバイスチップは携帯電話、パソコン等の電気機器に利用される。 The wafer, on which multiple devices such as ICs and LSIs are divided by dividing lines and formed on the surface, is divided into individual device chips by a dicing machine equipped with a rotatable cutting blade, and each divided device chip is made into a portable device. Used in electrical equipment such as telephones and computers.

また、デバイスチップを配線基板に複数整列させてモールド樹脂によってパッケージングしたQFN(Quad Flat Non-leaded package)と称されるチップサイズパッケージ基板もダイシング装置によって個々のパッケージデバイスチップに分割される(たとえば特許文献1参照)。 In addition, a chip size package substrate called QFN (Quad Flat Non-leaded package), in which multiple device chips are arranged on a wiring board and packaged with mold resin, is also divided into individual packaged device chips by a dicing machine (for example, (See Patent Document 1).

そして、QFNは、隣接するデバイスに跨って電極が形成され分割予定ラインを横切って配設されていることから切削ブレードで分割予定ラインを切断すると、金属の延性によって電極が伸びて電極同士が短絡するおそれがある。このため、パッケージデバイスチップは、側面が上を向くように粘着テープに貼り付けられ、顕微鏡により側面が観察され電極が短絡しているか否かが検出される。 In QFN, electrodes are formed across adjacent devices and are arranged across the planned dividing line, so when the planned dividing line is cut with a cutting blade, the electrodes stretch due to the ductility of the metal, causing a short circuit between the electrodes. There is a risk of For this reason, the packaged device chip is attached to an adhesive tape with the side surface facing upward, and the side surface is observed using a microscope to detect whether or not the electrodes are short-circuited.

特開2019-145558号公報JP 2019-145558 Publication

しかし、パッケージデバイスは数mm角程度と小さく、かつパッケージデバイスの厚みも薄いため、パッケージデバイスチップの側面を粘着テープに貼り付けるには相当の注意力が必要であると共に、パッケージデバイスチップの側面が上を向いた状態を保つことが困難であり、顕微鏡によりパッケージデバイスチップの側面を観察することには手間がかかるという問題がある。 However, since the package device is small, measuring only a few mm square, and the thickness of the package device is thin, considerable care is required to attach the side surface of the package device chip to the adhesive tape, and the side surface of the package device chip is There is a problem in that it is difficult to keep the device facing upward, and it takes time and effort to observe the side surface of the packaged device chip using a microscope.

上記事実に鑑みてなされた本発明の課題は、パッケージデバイスチップ等のチップの側面を容易に観察するための観察用治具を提供することである。 An object of the present invention, made in view of the above facts, is to provide an observation jig for easily observing the side surface of a chip such as a packaged device chip.

本発明は上記課題を解決するために以下の観察用治具を提供する。すなわち、チップの側面を観察する際に用いる観察用治具であって、チップを保持する粘着層を表面に備えたテーブルと、該テーブルを伏せた状態から起立した状態に変化するように回転可能に支持すると共に該テーブルの裏面に対応して形成された貫通開口を備えた枠体と、該貫通開口に挿入され該テーブルを伏せた状態から起立した状態にする突起を備えた基台と、を有する観察用治具を本発明は提供する。 In order to solve the above problems, the present invention provides the following observation jig. That is, it is an observation jig used to observe the side surface of a chip, and includes a table with an adhesive layer on the surface for holding the chip, and a table that can be rotated to change from a face down state to an upright state. a frame body supporting the table and having a through opening formed corresponding to the back surface of the table; a base having a protrusion that is inserted into the through opening and changes the table from a down state to an upright state; The present invention provides an observation jig having:

好ましくは、該枠体は該テーブルを複数支持し、該基台は該複数のテーブルに対応して該突起を複数備える。 Preferably, the frame supports a plurality of the tables, and the base includes a plurality of the protrusions corresponding to the plurality of tables.

本発明の観察用治具は、チップを保持する粘着層を表面に備えたテーブルと、該テーブルを伏せた状態から起立した状態に変化するように回転可能に支持すると共に該テーブルの裏面に対応して形成された貫通開口を備えた枠体と、該貫通開口に挿入され該テーブルを伏せた状態から起立した状態にする突起を備えた基台と、を有するので、パッケージデバイスチップ等のチップの側面を容易に上に向けて顕微鏡で観察することが可能となり、顕微鏡での観察に手間がかかるという問題が解消する。 The observation jig of the present invention includes a table having an adhesive layer on its surface that holds chips, a rotatable support for the table so as to change from a face down state to an upright state, and a support for the back surface of the table. It has a frame body having a through-opening formed as a through-hole, and a base having a protrusion that is inserted into the through-opening and changes the table from a down state to an upright state. It is now possible to easily turn the side of the object upward and observe it with a microscope, which solves the problem of time-consuming observation with a microscope.

本発明に従って構成された観察用治具の分解斜視図。FIG. 1 is an exploded perspective view of an observation jig constructed according to the present invention. 図1に示すテーブルにチップを保持させている状態を示す斜視図。FIG. 2 is a perspective view showing a state in which chips are held on the table shown in FIG. 1; (a)チップを保持したテーブルと共に枠体を基台に載せる状態を示す斜視図、(b)テーブルが伏せた状態から起立した状態に変化した状態を示す斜視図。(a) A perspective view showing a state in which the frame body is placed on a base together with a table holding a chip, and (b) a perspective view showing a state in which the table changes from a face down state to an upright state.

以下、本発明に従って構成された観察用治具の好適実施形態について図面を参照しつつ説明する。 Hereinafter, preferred embodiments of an observation jig constructed according to the present invention will be described with reference to the drawings.

図1に全体を符号2で示す観察用治具は、チップを保持する粘着層を表面に備えたテーブル4と、テーブル4を伏せた状態から起立した状態に変化するように回転可能に支持すると共にテーブル4の裏面に対応して形成された貫通開口を備えた枠体6と、貫通開口に挿入されテーブル4を伏せた状態から起立した状態にする突起を備えた基台8とを有する。 The observation jig, which is generally designated by the reference numeral 2 in FIG. 1, includes a table 4 whose surface is provided with an adhesive layer for holding chips, and a table 4 that is rotatably supported so as to change from a face down state to an upright state. It also has a frame 6 having a through opening formed corresponding to the back surface of the table 4, and a base 8 having a protrusion that is inserted into the through opening and changes the table 4 from a down state to an upright state.

テーブル4は矩形板状に形成されており、テーブル4の表面にはチップを保持する矩形状の粘着層10が設けられている。テーブル4の表面のサイズと同一でよい粘着層10のサイズは、様々なサイズのチップを保持できるサイズが好ましく、たとえば1cm×1cm程度でよい。図1を参照することによって理解されるとおり、テーブル4の表面は平坦に形成されている一方、テーブル4の裏面には段差が形成されており、テーブル4は、厚みが比較的大きい第一の部分12と、第一の部分12よりも厚みが小さい第二の部分14とを有する。図示の実施形態の各テーブル4には、第一の部分12の側面16から突出する円柱状の一対の軸18が付設されており、一対の軸18は互いに対向する位置に配置されている。 The table 4 is formed into a rectangular plate shape, and a rectangular adhesive layer 10 for holding chips is provided on the surface of the table 4. The size of the adhesive layer 10, which may be the same as the size of the surface of the table 4, is preferably a size that can hold chips of various sizes, and may be, for example, about 1 cm x 1 cm. As can be understood by referring to FIG. 1, the surface of the table 4 is formed flat, while the back surface of the table 4 is formed with a step, and the table 4 has a relatively thick first surface. It has a portion 12 and a second portion 14 that is thinner than the first portion 12. Each table 4 in the illustrated embodiment is provided with a pair of cylindrical shafts 18 protruding from the side surface 16 of the first portion 12, and the pair of shafts 18 are arranged at positions facing each other.

枠体6は、全体として長方形状に形成されており、テーブル4を収容可能な矩形状の一対の貫通開口20が枠体6の長手方向に間隔をおいて形成されている。枠体6の内周面22には、テーブル4の軸18が挿入される円形の複数の支持孔24が形成されており、各支持孔24は互いに対向する位置に配置されている。そして、枠体6においては、各支持孔24にテーブル4の各軸18が挿入されると、テーブル4を伏せた状態から起立した状態に変化するように回転可能に支持するようになっている。 The frame body 6 is formed into a rectangular shape as a whole, and a pair of rectangular through openings 20 capable of accommodating the table 4 are formed at intervals in the longitudinal direction of the frame body 6. A plurality of circular support holes 24 into which the shaft 18 of the table 4 is inserted are formed in the inner circumferential surface 22 of the frame 6, and the support holes 24 are arranged at positions facing each other. The frame body 6 rotatably supports the table 4 so that when each shaft 18 of the table 4 is inserted into each support hole 24, the table 4 changes from a face down state to an upright state. .

図1に示すとおり、各貫通開口20には、内周面22の下側部分から突出する一対の突出片26が枠体6の長手方向に間隔L1をおいて配置されている。そして、枠体6にテーブル4が支持された際は、テーブル4の第二の部分14が各突出片26に支持されるようになっている。このように、各貫通開口20の形状はテーブル4の裏面の形状に対応して形成されている。 As shown in FIG. 1, a pair of protruding pieces 26 protruding from the lower portion of the inner circumferential surface 22 are arranged in each through-opening 20 at an interval L1 in the longitudinal direction of the frame 6. As shown in FIG. When the table 4 is supported by the frame 6, the second portion 14 of the table 4 is supported by each protruding piece 26. In this way, the shape of each through opening 20 is formed to correspond to the shape of the back surface of the table 4.

基台8は、全体として直方体状の主部28と、主部28の長手方向に間隔をおいて主部28の上面から上方に突出する一対の突起30とを備える。各突起30は、主部28の短手方向片側に配置されていると共に、主部28の上面に枠体6が載せられた際に、各貫通開口20に形成された一対の突出片26間に位置するように配置されている。主部28の長手方向における突起30の寸法L2は、各貫通開口20に形成された一対の突出片26の間隔L1よりも若干小さい。また、主部28の短手方向他側には、主部28の長手方向に間隔をおいて矩形状の一対の収容開口32が形成されている。 The base 8 includes a main portion 28 having an overall rectangular parallelepiped shape, and a pair of protrusions 30 that protrude upward from the upper surface of the main portion 28 at intervals in the longitudinal direction of the main portion 28 . Each protrusion 30 is arranged on one side of the main part 28 in the lateral direction, and is located between a pair of protruding pieces 26 formed in each through opening 20 when the frame 6 is placed on the upper surface of the main part 28. It is located so that it is located at The dimension L2 of the protrusion 30 in the longitudinal direction of the main portion 28 is slightly smaller than the interval L1 between the pair of protrusion pieces 26 formed in each through opening 20. Further, a pair of rectangular accommodation openings 32 are formed on the other side of the main portion 28 in the longitudinal direction at intervals in the longitudinal direction of the main portion 28 .

そして、テーブル4を支持した枠体6が基台8の主部28の上面に載せられると共に、枠体6の各貫通開口20に基台8の各突起30が挿入され、各貫通開口20に形成された一対の突出片26間を各突起30が通過すると、各テーブル4の第二の部分14の裏面を各突起30が上方に押し、各テーブル4を回転させて伏せた状態から起立した状態に変化させるようになっている。また、各テーブル4が起立した状態に変化した際には、各テーブル4の第一の部分12が基台8の各収容開口32に収容される。 Then, the frame 6 supporting the table 4 is placed on the upper surface of the main part 28 of the base 8, and each protrusion 30 of the base 8 is inserted into each through opening 20 of the frame 6. When each protrusion 30 passes between the pair of protruding pieces 26 formed, each protrusion 30 pushes the back surface of the second portion 14 of each table 4 upward, causing each table 4 to rotate and stand up from its prone position. It is designed to change the state. Moreover, when each table 4 changes to an upright state, the first portion 12 of each table 4 is accommodated in each accommodation opening 32 of the base 8.

次に、上述したとおりの観察用治具2を用いてチップの側面を観察する方法について説明する。図示の実施形態では図2に示すとおり、まず、枠体6に回転自在に支持されたテーブル4の粘着層10にチップ34を保持させる。 Next, a method of observing the side surface of a chip using the observation jig 2 as described above will be explained. In the illustrated embodiment, as shown in FIG. 2, first, the chip 34 is held on the adhesive layer 10 of the table 4 rotatably supported by the frame 6.

図示の実施形態におけるチップ34は、QFNと称されるチップサイズパッケージ基板が個々のパッケージデバイスチップに分割された矩形板状のチップであり、チップ34の表面34aおよび側面34bに電極36が露出している。 The chip 34 in the illustrated embodiment is a rectangular plate-shaped chip in which a chip size package substrate called QFN is divided into individual package device chips, and electrodes 36 are exposed on the front surface 34a and side surface 34b of the chip 34. ing.

次いで、図3に示すとおり、枠体6を基台8の主部28の上面に載せ、枠体6の各貫通開口20に基台8の各突起30を挿入して、各貫通開口20に形成された一対の突出片26間に各突起30を通過させる。そうすると、各テーブル4の第二の部分14の裏面が各突起30によって上方に押され、各テーブル4が回転して伏せた状態から起立した状態に変化すると共に、各テーブル4の第一の部分12が基台8の各収容開口32に収容される。これによって、図3(b)に示すとおり、各テーブル4に保持されたチップ34の側面34bを上に向けることができ、顕微鏡によってチップ34の側面34bを観察することが可能となる。各テーブル4が回転する際や、各テーブル4が回転して起立した状態に変化した後においても、チップ34はテーブル4の粘着層10に保持されているので、チップ34の側面34bが上を向いた状態が安定して保たれる。 Next, as shown in FIG. 3, the frame 6 is placed on the upper surface of the main part 28 of the base 8, and each protrusion 30 of the base 8 is inserted into each through opening 20 of the frame 6. Each protrusion 30 is passed between the pair of protrusion pieces 26 formed. Then, the back surface of the second portion 14 of each table 4 is pushed upward by each protrusion 30, and each table 4 rotates and changes from a prone state to an upright state, and the first portion of each table 4 12 are housed in each housing opening 32 of the base 8. As a result, as shown in FIG. 3(b), the side surfaces 34b of the chips 34 held on each table 4 can be turned upward, and the side surfaces 34b of the chips 34 can be observed using a microscope. Even when each table 4 rotates or after each table 4 rotates and changes to an upright state, the chip 34 is held by the adhesive layer 10 of the table 4, so the side surface 34b of the chip 34 is The facing state is maintained stably.

以上のとおりであり、図示の実施形態の観察用治具2は、チップ34を保持する粘着層10を表面に備えたテーブル4と、テーブル4を伏せた状態から起立した状態に変化するように回転可能に支持すると共にテーブル4の裏面に対応して形成された貫通開口20を備えた枠体6と、貫通開口20に挿入されテーブル4を伏せた状態から起立した状態にする突起30を備えた基台8と、を有するので、チップ34の側面34bを容易に上に向けて顕微鏡で観察することが可能となり、顕微鏡での観察に手間がかかるという問題が解消する。 As described above, the observation jig 2 of the illustrated embodiment includes a table 4 having an adhesive layer 10 on its surface that holds a chip 34, and a table 4 that changes from a face down state to an upright state. A frame body 6 rotatably supported and provided with a through opening 20 formed corresponding to the back surface of the table 4, and a protrusion 30 inserted into the through opening 20 to change the table 4 from a down state to an upright state. Since the chip 34 has a base 8 that has a base 8, it is possible to easily turn the side surface 34b of the chip 34 upward and observe it with a microscope, thereby solving the problem that observation with a microscope takes time and effort.

なお、図示の実施形態の枠体6は一対のテーブル4を支持するようになっているが、枠体6は1個のテーブル4を支持するようになっていてもよく、あるいは3個以上のテーブル4を支持するようになっていてもよい。図示の実施形態の基台8は一対の突起30を備えているが、基台8はテーブル4の数量に対応して1個または3個以上の突起30を備えていてもよい。また、図示の実施形態の観察用治具2を複数個連結してもよい。 Although the frame 6 in the illustrated embodiment supports a pair of tables 4, the frame 6 may also support one table 4, or three or more tables 4. The table 4 may be supported. Although the base 8 in the illustrated embodiment includes a pair of protrusions 30, the base 8 may include one or more protrusions 30 depending on the number of tables 4. Further, a plurality of observation jigs 2 of the illustrated embodiment may be connected.

2:観察用治具
4:テーブル
6:枠体
8:基台
10:粘着層
20:貫通開口
30:突起
34:チップ
34a:チップの表面
34b:チップの側面
2: Observation jig 4: Table 6: Frame 8: Base 10: Adhesive layer 20: Through opening 30: Protrusion 34: Chip 34a: Surface of chip 34b: Side surface of chip

Claims (2)

チップの側面を観察する際に用いる観察用治具であって、
チップを保持する粘着層を表面に備えたテーブルと、
該テーブルを伏せた状態から起立した状態に変化するように回転可能に支持すると共に該テーブルの裏面に対応して形成された貫通開口を備えた枠体と、
該貫通開口に挿入され該テーブルを伏せた状態から起立した状態にする突起を備えた基台と、を有する観察用治具。
An observation jig used for observing the side surface of a chip,
a table with an adhesive layer on its surface that holds chips;
a frame body rotatably supporting the table so as to change from a face down state to an upright state, and having a through opening formed corresponding to the back surface of the table;
An observation jig comprising: a base having a protrusion that is inserted into the through opening and changes the table from a down state to an upright state.
該枠体は該テーブルを複数支持し、該基台は該複数のテーブルに対応して該突起を複数備える請求項1記載の観察用治具。 2. The observation jig according to claim 1, wherein the frame supports a plurality of the tables, and the base includes a plurality of the protrusions corresponding to the plurality of tables.
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