JP7389130B2 - Measuring equipment, mounting machine, clamp status acquisition equipment - Google Patents

Description

The present disclosure relates to a clamp state acquisition device that acquires the clamp state of an object by a pair of clamp members.

Patent Document 1 describes a monitoring device that monitors whether or not an object is clamped by an arm when welding is performed on the object while the object is clamped by the arm. There is. In this monitoring device, a master image, which is a captured image of the arm within a predetermined area when the object is in a clamped state, is acquired in advance, and the master image is compared with the actual captured image of the arm. This monitors whether or not the object is clamped by the arm.

Japanese Patent Application Publication No. 2006-115978

Disclosure summary

Issues that this disclosure seeks to solve

An object of the present disclosure is to obtain the clamping state of an object by a pair of clamp members based on the distance between the pair of clamp members.

Means, actions and effects for solving problems

In the clamp state acquisition device according to the present disclosure, the distance between the pair of clamp members is acquired, and the clamp state of the object by the pair of clamp members is acquired based on the acquired distance. For example, if the actual distance between the pair of clamp members is smaller than the reference distance, which is the distance between the pair of clamp members when the target is clamped by the pair of clamp members, the target If the object is not clamped and is approximately at the reference distance, it can be determined that the object is normally clamped. In addition, if the actual distance between the pair of clamp members deviates from the set range determined by the reference distance, an object other than the original object or a foreign object may be clamped, or the original object may be clamped. It can be acquired when the body is in a normal posture and not clamped.

A regular object is an object that is predetermined to be clamped by a pair of clamp members. The normal posture refers to a predetermined posture (which can also be considered as the orientation of the object) of the object when the object is clamped by a pair of clamp members.

The clamped state of the object includes, for example, a state where the object is clamped by a pair of clamp members and a state where the object is not clamped. In detail, the clamped state of an object includes a state in which a regular target is clamped in a normal posture by a pair of clamp members, a state in which an object different from the regular target or a foreign object is clamped, or a state in which a foreign object is clamped by a pair of clamp members. This includes one or more of the following: a state in which the object is not clamped in a normal posture, a state in which the object is not clamped, etc.

FIG. 1 is a perspective view of a mounting machine including a measuring device according to Example 1 of the present disclosure. The measurement device includes a clamp state acquisition device that is an embodiment of the present disclosure. It is a perspective view of the main part of the above-mentioned measuring device. FIG. 3 is a sectional view of a main part of the measuring device. It is an air circuit diagram included in the above-mentioned measuring device. It is a figure conceptually showing the control device of the above-mentioned mounting machine. FIG. 3 is a plan view of the main parts of the measuring device (with components placed on a holding stand). FIG. 2 is a plan view of the main parts of the measuring device (regular parts are clamped in a normal posture). FIG. 3 is a plan view of the main parts of the measuring device (with no parts clamped). FIG. 2 is a plan view of the main parts of the measuring device (normal parts are clamped in an abnormal posture). 3 is a flowchart representing an LCR measurement program stored in a storage unit of the control device. It is a flow chart showing a part of the above-mentioned LCR measurement program. It is a figure showing operation of the above-mentioned measuring device. (12A) A diagram showing an initial state, (12B) a diagram showing an approach state, (12C) a diagram showing a measurement state, and (12D) a diagram showing a discarding state. FIG. 2 is a plan view of a measuring device according to Example 2 of the present disclosure. FIG. 3 is a diagram conceptually showing the structure of a distance sensor of the measuring device.

Embodiments of the present disclosure

Hereinafter, a mounting machine including a measuring device that is an embodiment of the present disclosure will be described in detail based on the drawings.
The mounting machine shown in FIG. 1 mounts components onto a circuit board, and includes a device main body 2, a circuit board conveying and holding device 4, a component supply device 6, a head moving device 8, a measuring device 10, and the like.
The circuit board transport and holding device 4 transports and holds a circuit board (hereinafter abbreviated as a board) in a horizontal position. In FIG. 1, the transport direction of the board P is the x direction, and the width of the board P is The direction is the y direction, and the thickness direction of the substrate P is the z direction. The y direction and the z direction are the front-back direction and the up-down direction of the mounting machine, respectively. These x, y, and z directions are orthogonal to each other.

The component supply device 6 supplies electronic components (hereinafter abbreviated as components) s to be mounted on the board P, and includes a plurality of tape feeders 14 and the like. The head moving device 8 holds the head 16 and moves it in the x and y directions, and the head 16 includes a suction nozzle 18 as a component holder, a first camera 19 as an imaging device, and It has a lifting device that moves the main body in the z direction. The suction nozzle 18 is for suctioning and holding the component s, and the first camera 19 is for taking an image of the reference mark Mp etc. provided on the substrate P, and can be called a mark camera. In this embodiment, a working device 20 is composed of the head 16, the head moving device 8, and the like.

The measuring device 10 measures the electrical characteristics of a component s, which is an example of a target object. The measuring device 10 is installed in the main body of the circuit board conveying and holding device 4 via a waste box 26 . The waste box 26 and the measuring device 10 are connected by a waste passage 28, and the parts s whose electrical characteristics have been measured are stored in the waste box 26 via the waste passage 28.

As shown in FIGS. 2 and 3, the measuring device 10 includes a main body 30, a holding table 32 capable of holding a component s, a stator 34, and a movable member 36. ), a holding table moving device 40 for moving the holding table 32, a moving piece moving device 41 for moving the mover 36 toward and away from the stator 34, and an LCR measuring section 42 as an electrical characteristic measuring section. , air supply device 43, etc. In this embodiment, the component s has electrodes p1 and p2 at both ends, as shown in FIG. 6, and can be clamped by a pair of probes 37. An example of the component s is a so-called square chip.

In this embodiment, the main body 30 is provided so as to be movable relative to the waste box 26, and as shown in FIG. 3, a through hole 30a communicating with the waste passage 28 is provided at the bottom.

The holding table 32 includes a component placement section 44 and a placement section holder 46 that holds the component placement section 44 . A V-groove 44c is formed on the upper surface of the component placement section 44, and the component s is placed thereon.
The component placement portion 44 may be made of a material that has conductivity, wear resistance, and is resistant to oxidation. The component mounting section 44 is electrically connected to the main body 30 via a plurality of conductive members, and when the main body 30 is grounded, the component mounting section 44 is also grounded. In this embodiment, the component placement part 44 contacts the placement part holder 46 and is fixed by the fastening part 47, and the placement part holder 46 is attached to the main body 30 by the stopper 80 (see FIG. 3). contact through. The placing part holder 46, the stopper 80, the main body 30, the fastening part 47, etc. are electrically conductive. Therefore, the component mounting section 44 is grounded.
In this way, by making the component mounting section 44 from a conductive material and grounding it, static electricity can be removed from the component s placed on the component mounting section 44. For example, the component mounting portion 44 may be made of aluminum alloy, stainless steel, or the like. A cover portion 50 is attached to the holding base 32. The cover portion 50 will be described later.

The stator 34 and the movable element 36 are provided so as to be able to approach and separate from each other. The stator 34 is fixed to the main body 30 via a stator holder 55. The movable element 36 is held by a movable element holder 56 at one end (the end on the retreating side) and is movable integrally with the movable element holder 56.
The stator 34 and the movable element 36 each have opposing surfaces 34f and 36f that face each other, and the component s is clamped (held) by these pair of opposing surfaces 34f and 36f. In this embodiment, the opposing surface 36f has a generally triangular cross section and is movable along the V-groove 44c. In other words, the shape of the facing surface 36f of the movable element 36 is made to correspond approximately to the V-groove 44c, and the facing surface 36f of the movable element 36, the facing surface 34f of the stator 34, and the V-groove 44c of the holding base 32 are , located at almost the same height. Therefore, no matter where the component s is in the V-groove 44c, the component s can be clamped by the pair of opposing surfaces 34f, 36f.

Further, in this embodiment, the movable member 36 is a longitudinal member extending in the y direction (movement direction), and has a distal end portion 36a including a facing surface 36f, and a rear portion 36b that is a portion on the rear end side from the distal end portion 36a. including. The rear portion 36b has a shape in which the bottom of the tip portion 36a is cut out. Therefore, the holding base 32 and the movable element 36 are allowed to move relative to each other. Furthermore, marks Ma and Mb are provided on predetermined portions of the upper surfaces of each of the stator 34 and the movable element 36. Marks Ma and Mb will be described later.

The LCR measurement section 42 measures electrical characteristics such as L (inductance), C (capacity), and R (resistance) of the component s, and is composed of the LCR measurement section 42, a mover 36, and a stator 34. An electric circuit 58 including a pair of probes 37, a power supply device (not shown), etc. is formed. For example, the current flowing between the stator 34 and the movable element 36 is detected, and the electrical characteristics such as L, C, and R of the component s are measured based on the detected current. Note that reference numerals 58a and 58b in FIGS. 2 and 3 are connection portions of the pair of probes 37 to the electric circuit 58.

The holding table moving device 40 moves the holding table 32 and includes an air cylinder 64 as a driving source. As shown in FIG. 4, in the air cylinder 64, the inside of the housing is partitioned into two air chambers 64a and 64b by a piston, and the mounting portion holder 46 is connected to a piston rod 66 of the piston. A solenoid valve device 69 is provided between the two air chambers 64a and 64b, the air source 68, the air passage 60 of the air supply device 43, and the filter (atmosphere). The solenoid valve device 69 includes a plurality of solenoid valves, and the holding base 32 is moved forward and backward under control of the solenoid valve device 69. Specifically, the air passage 60 is communicated with the air chamber 64a, and the air source 68 is communicated with the air chamber 64b, so that the holding table 32 is moved forward, the atmosphere is communicated with the air chamber 64b, and the air source 68 is communicated with the air chamber 64a. By communicating the air source 68 with the chamber 64a, the holding table 32 is moved backward. In this way, air is supplied to the air passage 60 when the holding table 32 moves forward.

The movable element moving device 41 moves the movable element 36 and includes an air cylinder 70 as a driving source. Similarly, in the air cylinder 70, two air chambers 70a and 70b partitioned by a piston are formed inside the housing, and the movable element holder 56 is connected to the piston rod 71 of the piston. An air source 68, an air passage 60, and a filter (atmosphere) are connected to the two air chambers 70a and 70b via a solenoid valve device 72. The movable element 36 is moved forward and backward under the control of the electromagnetic valve device 72. Note that by communicating the air source 68 with the air chamber 70a and the air passage 60 with the air chamber 70b, the mover 36 is retracted, and the air source 68 is communicated with the air chamber 70b and the atmosphere is communicated with the air chamber 70a. , are brought into communication with each other, thereby causing the movable element 36 to retreat. Air is supplied to the air passage 60 as the movable element 36 retreats.

As shown in FIG. 4, the electromagnetic valve devices 69 and 72 include a plurality of flow control valves, directional switching valves, etc., but are not limited thereto. For example, it may include a plurality of on-off valves.

The air supply device 43 supplies air to the facing surface 36f of the movable element 36, and includes the above-mentioned air cylinders 64, 70, air passage 60, ionizer 62, and the like. The air passage 60 is provided in a member on the stator side {for example, the upper part of the stator 34 or the upper part of the stator 34 of the stator holder 55 or the main body 30}, and as shown in FIG. , 70, and an air jet passage 60s that communicates with the main passage 60h and has an opening 60a in a stepped surface of a member on the stator side facing the facing surface 36f of the movable element 36. including. The air jet passage 60s generally extends in the y direction as shown in FIG. It extends upward or into part R. The portion R is a portion where the component s of the facing surface 36f of the movable element 36 is frequently clamped, and can be referred to as a clamp portion. The air hits the portion where the extension line k of the opposing surface 36f intersects from diagonally above. Further, an ionizer 62 is provided in a portion of the air passage 60 on the downstream side of the air cylinders 64 and 70. The ionizer 62 generates corona discharge to ionize air, and ionized air can be supplied to the opposing surface 36f. Note that the ionizer 62 is not essential.

As shown in FIGS. 2 and 3, a pair of guide rods 74 and 75 extending in the y direction are provided between the main body 30 or the stator holder 55 and the movable element holder 56. A pair of guide rods 76 and 77 extending in the y direction are provided between the child holder 56 and the child holder 56 . These guide rods 74, 75, 76, and 77 allow the stator 34 and the mover 36 to move relative to each other in the y direction (approach/separate), and the holding table 32 and the mover 36 can move relative to each other in the y direction. Allows relative movement.
Further, a stopper 82 is provided on the stator side of the movable element holder 56, and a stopper 80 is provided in a portion of the main body 30 that holds the stator holder 55. The stopper 82 defines the approach limit between the movable element holder 56 and the holding base 32 (mounting part holder 46), and the stopper 80 defines the approach limit between the movable element holder 56 and the holding base 32 (mounting part holder 46). This defines the approach limit to the part holder 46).
In this embodiment, the guide rods 74 to 77 are shared by the holding table moving device 40 and the mover moving device 41, and the stoppers 80 and 82 can be considered to be components of the holding table moving device 40.

Note that the reference numeral 90 indicates a second camera separate from the first camera 19. The second camera 90 is for capturing an image of the component s held by the suction nozzle 18, and the component s is scheduled to be mounted on the circuit board P based on the image captured by the second camera 90. It is determined whether or not.

The mounting machine includes a control device 100. As shown in FIG. 5, the control device 100 includes a controller 102 mainly composed of a computer, and a plurality of drive circuits 104. The controller 102 includes an execution section 110, a storage section 112, an input/output section 114, and the like. At the same time, the electromagnetic valve devices 69 and 72 of the holding table moving device 40 and the movable element moving device 41 are also connected. Further, the LCR measuring section 42, the display 116, the movable element position sensor 118, the holding table position sensor 120, the nozzle height sensor 122, the first camera 19, the second camera 90, etc. are connected. The storage unit 112 stores a plurality of programs such as the LCR measurement program shown in the flowchart of FIG. 10, tables, and the like. Further, time is measured by a timer 124 provided in the controller 102. The movable element position sensor 118 outputs an ON signal when the movable element holder 56 is at the backward end position, and the holder position sensor 120 outputs an ON signal when the holder 32 is at the forward end position. The nozzle height sensor 122 detects the height of the nozzle 18.

In this embodiment, the first camera 19 captures an image of the pair of probes 37 in a state in which the component s is estimated to be clamped by the pair of probes 37 . The first camera 19 images the mark Mp formed on the substrate P as described above, and has a shallow depth of field. The depth of field refers to the distance range on the subject side that is approximately in focus, and the focus is approximately aligned with the distance between the substrate P and the lens of the first camera 19. On the other hand, the distance between the upper surfaces of the movable element 36 and the stator 34 and the lens of the first camera 19 is approximately the same as the distance between the substrate P and the lens of the first camera 19. Therefore, without adjusting the height of the first camera 19 (while keeping the height of the first camera 19 almost constant), the mark Mp on the substrate P can also be changed from the mark Ma formed on the pair of probes 37 to Mb can also be imaged well.

Further, the component s can be imaged by the first camera 19, but the component s is often clamped at the portion R of the mover 36, and the distance between the component s and the lens is determined by the distance between the substrate P and the lens. It is different from the distance between. Therefore, it is difficult to properly image the component s without adjusting the height of the first camera 19.
Furthermore, in order to specify the part s based on the captured image, the operator is required to input data such as the shape and color of the regular part s in advance. Moreover, depending on the light irradiation conditions, it may be difficult to recognize the color etc. of the component s based on the captured image. On the other hand, the marks Ma and Mb can be recognized with high accuracy based on the captured images of the pair of probes 37.
As described above, it is appropriate to form the marks Ma and Mb on the pair of tracing stylus 37, respectively, and to obtain the distance between the marks Ma and Mb by recognizing the marks Ma and Mb.
Note that the regular part s refers to a part that is predetermined to be an object whose electrical characteristics are to be measured.

As shown in FIGS. 7 to 9, in this embodiment, a pair of probes 37 are brought close to each other on a holding base 32, and then, with the holding base 32 being moved back, the first camera 19 detects a pair of probes 37. The tracing stylus 37 is imaged, and the captured image is supplied to the controller 102. The controller 102 recognizes the marks Ma and Mb provided on the pair of tracing stylus 37 based on the captured image, and obtains the distance D between these marks Ma and Mb. On the other hand, marks Ma and Mb are provided at predetermined positions on each of the stator 34 and the movable element 36. For example, the distances c and m between the opposing surfaces 34f and 36f and the marks Ma and Mb are known. Therefore, when the distance D between the marks Ma and Mb is known, the distance ds between the pair of opposing surfaces 34f and 36f is also known. The distance ds between the pair of opposing surfaces 34f and 36 corresponds to the length between the poles p1 and p2 of the part s. Therefore, in order to obtain the distance D between the pair of marks Ma and Mb, when the part s is clamped by the pair of probes 37, the length ds between the poles p1 and p2 of the part s can be obtained. It can be thought of as corresponding to what is measured.

In this way, when the component s is a square chip, the component s is placed in a position where the electrical characteristics can be measured by the pair of probes 37, that is, the pair of electrodes p1 and p2 are placed in the position of the probe 37, respectively. The posture in which the component s contacts the opposing surfaces 34f and 36f corresponds to the normal posture of the component s.

Then, whether the distance D is shorter than the set distance Dth determined based on the length between the pair of electrodes p1 and p2 of the regular part s, or is within the set range Da to Db determined by the regular part s. It is determined whether or not. The set distance Dth is, for example, the distance between the pair of marks Ma and Mb when the component s is not clamped by the pair of probes 37, and the distance between the pair of marks Ma and Mb when the regular component s is clamped by the pair of probes 37. It is determined based on the distance between the pair of marks Ma and Mb, and the setting range Da to Db is determined based on the distance between the pair of marks Ma and Mb when the regular part s is clamped and the above-mentioned value of the regular part s. It can be determined based on the variation in length, etc.

As shown in FIG. 7, if the distance D between the pair of marks Ma and Mb measured based on the captured image is within the set range (Da<D<Db), the genuine part s is normal. It is determined that the object is in a clamped state. As shown in FIG. 8, when the distance D is smaller than the set distance Dth (D<Dth), it is determined that the regular part s is not clamped. As shown in FIG. 9, if the distance D is larger than the set distance Dth and is outside the set range Da to Db (Da>D>Dth or D>Db), the part is not a regular part s or It is determined that the foreign object is in a clamped state or that the regular part s is not clamped in a normal posture.

In this embodiment, a case has been described in which the entire mounting machine is controlled by the control device 100, but the board transfer and holding device 4, the component supply device 6, the head moving device 8, the measuring device 10, etc. are each controlled separately from each other. It can also be controlled by a control device.

The operation of the mounting machine will be explained below.
When there is a request to acquire the electrical characteristics of the component s, the measuring device 10 measures the electrical characteristics of the component s.

The electrical characteristics of the component s are measured by executing the LCR measurement program shown in the flowchart of FIG. In this embodiment, the solenoid valve devices 69 and 72 are controlled by using the output of the holding table position sensor 120, the movable element position sensor 118, the time measured by the timer 124, etc., and the holding table 32 and the movable element 36 are controlled respectively. Being moved forward and backward.

The measuring device 10 is always in the initial state shown in FIG. 12A. The movable element 36 is at the backward end position, and the holding base 32 is at the forward end position, that is, at a position where it abuts against the stopper 80. In this state, the component mounting portion 44 is grounded due to internal conduction or the like. The movable element 36 does not exist above the V-groove 44c of the holding table 32, and the component s can be placed thereon.
In step 1 (hereinafter abbreviated as S1; the same applies to other steps), it is determined whether a command to measure the electrical characteristics of component s has been issued. If the determination in S1 is YES, the head 16 is moved in S2, and, for example, the component s fed by the tape feeder 14 is picked up by the suction nozzle 18 and placed on the V-groove 44c of the holding table 32. It will be posted. It can be seen that the suction nozzle 18 is lowered and the component s is released, so that the component s is placed on the V-groove 44c.

Thereafter, when the suction nozzle 18 reaches the rising end, the movable element 36 is moved forward under the control of the electromagnetic valve device 72 in S3. The opposing surface 36f at the tip of the movable element 36 is moved forward along the V-groove 44c of the component placement section 44 (FIG. 12B). The component s is supposed to be clamped (held) by the opposing surface 36f and the opposing surface 34f of the stator 34. The state in which the mover 36 is advanced can be referred to as an approach state.

In S4, the holding stand 32 is moved backward under the control of the electromagnetic valve device 69, and the holding stand 32 is moved back until it abuts against the stopper 82 (FIG. 12C). By separating the holding table 32 from the component s, it is possible to reduce measurement errors in electrical characteristics caused by the component mounting section 44 being located near the component s. Furthermore, by positioning the holding base 32 behind the tip end 36a of the movable element 36, the holding base 32 can be spaced apart from the movable element 36 in a favorable manner.

In S5, the clamping state of the component by the pair of probes 37 is acquired, and in S6, based on the state of the flag as described later, it is determined whether the regular component s is clamped in a normal posture by the pair of probes 37. It is determined whether or not. S5 will be described later.

In S7, it is waited for the static elimination time, which is a set time, to elapse from the time when the component s is placed on the V-groove 44c. The charge on the component s is removed via the holding stand 32, and after the holding stand 32 is moved back, it is discharged into the air. The time required to remove static electricity from the component s is determined by the characteristics, size, etc. of the component s, and is determined in advance. When the neutralization time has elapsed and the determination becomes YES, the electrical characteristics are measured in S8. This state is the measurement state.

When the measurement time has elapsed and the measurement of the electrical characteristics of the component s is completed, the mover 36 is moved backward under the control of the solenoid valve device 72 in S9, and the holding table 32 is moved backward under the control of the solenoid valve device 69 in S10. is retracted until it abuts against the stopper 82 (FIG. 12D). The holding base 32 is located behind the facing surface 36f of the movable element 36, and does not exist below between the pair of facing surfaces 34f and 36f. The fallen parts s are stored in the waste box 26 through the opening 30a and the waste passage 28. This state is the discarded state.
Furthermore, when the movable element 36 is retreating, air is ejected from the opening 60a of the ejection passage 60s and hits the portion R of the movable element 36. Further, the cover portion 50 covers the space between the pair of opposing surfaces 34f and 36f from the x direction. As a result, the component s can be dropped from the opposing surface 36f favorably, and the component s can be prevented from scattering.

In S11, the holding base 32 is moved forward under the control of the electromagnetic valve device 69 and returned to the initial state shown in FIG. 12A. Further, as the holding table 32 moves forward, air is supplied to the facing surface 36f of the movable element 36. Thereby, the static electricity on the facing surface 36f of the movable element 36 can be effectively eliminated.

Acquisition of the clamp state in S5 is performed according to the flowchart of FIG. 11.
In S31, the head 16 is moved and the first camera 19 captures an image of the pair of probes 37, and in S32, the distance D between the pair of marks Ma and Mb is obtained based on the captured image. Then, in S33, it is determined whether the distance D is smaller than the set distance Dth, and in S34, it is determined whether the distance D is between the set ranges Da to Db. If the determination in S33 is NO and the determination in S34 is YES, flag 1 is set in S35, and it is determined that the genuine part s is clamped in a normal posture by the pair of probes 37. Ru. On the other hand, if the determination in S33 is YES, flag 2 is set in S36, and it is determined that the regular part s is not clamped. For example, it is determined that clamping of part s has failed. If the determinations in S33 and S34 are NO, flag 3 is set in S37, indicating that the regular part is not clamped (a foreign object or a part different from the regular part is clamped), or that the regular part is not clamped. It is determined that the parts are in a normal position and not clamped.

Then, in S6, it is determined whether flag 1 is set. If the determination is YES, S7 and subsequent steps are executed, and if the determination is NO, that is, if flag 2 or flag 3 is set, that fact is notified via the display 116 in S12. After that, S9 to S11 are executed.

In this manner, in this embodiment, the first camera 19 that is previously installed in the mounting machine is used, so it is possible to obtain the clamping state of the component s while suppressing cost increases. In addition, since it is not based on the shape, color, etc. of the part s, but on the distance between the pair of probes 37, the data input work of the operator is reduced, and the clamping state of the part s can be accurately obtained. .

Furthermore, if R (resistance) of the component s is 0Ω, it is difficult to obtain the clamp state of the component s based on the measured value of the electrical characteristics. In contrast, in this embodiment, the distance between the pair of probes 37 is not based on the measured value of the electrical characteristics, so even if the component s has a resistance of 0Ω, the pair of probes 37 It is possible to satisfactorily obtain whether or not the object is in a clamped state.
Further, the clamp state is acquired after the execution of S4, that is, after the operation of the holding table 32 for measurement, etc. is completed. The clamping state of the component s by the pair of probes 37 may change due to the retraction of the holding table 32. However, in this embodiment, the clamping state is acquired after the holding table 32 is retracted. The clamping state of the component s by the probe 37 can be accurately obtained.

As described above, in this embodiment, the clamp state acquisition device is configured by the part that stores and executes S5, 6, 12 of the electrical characteristic acquisition program shown in the flowchart of FIG. 10 of the control device 100. 1 camera 19, a part for storing S31 and S32 of the control device 100, a part for executing S32, and the like constitute a distance acquisition device. Further, a holding table movement control device is constituted by a part that stores and executes S4, 10, and 11 of the electrical characteristic acquisition program shown in the flowchart of FIG. 10 of the control device 100, and a part that stores S31, A work equipment control device is configured by the parts to be executed.

In the above embodiment, the clamp state is acquired after S4 of the LCR measurement program in FIG. 10, that is, after the holding table 32 is separated from the component s, but after S3, , the clamping state may be acquired before the holding base 32 is separated from the component s.

Further, the distance between the pair of probes 37 can also be measured by a distance sensor 150 as a distance acquisition device, as shown in FIGS. 13 and 14. Distance sensor 150 includes a main body 152 and a detection rod 154 extendably held by main body 152 at its base end. The detection rod 154 is held by the main body 152 with its tip end biased in a direction away from the main body 152 by a spring 156, and the amount of protrusion of the detection rod 154 with respect to the main body 152 is detected magnetically, optically, or mechanically. 158. The main body 152 is provided on one of the movable element holder 166 and the stator holder 165 (e.g., the movable element holder 166), and the tip of the detection rod 154 is insulated from the other (e.g., the stator holder 165). They are in constant contact via the body 160.
When the distance between the pair of probes 37 changes, the amount of protrusion of the detection rod 154 relative to the main body 152 changes. In the distance sensor 150, the distance between the pair of probes 37 is obtained by measuring the amount of protrusion of the detection rod 154 with respect to the main body 152.

Furthermore, the distance sensor can be of a non-contact type that uses electromagnetic waves or the like. For example, the distance sensor includes an irradiation section and a reception section provided on either one of the movable element holder 166 and the stator holder 165, and from the time when the irradiation section emits electromagnetic waves, the electromagnetic waves hit the other and are reflected. The distance between the movable element holder 166 and the stator holder 165 can be acquired based on the time up to the time when the signal is received by the receiving section.

Further, it is not essential to provide the marks Ma and Mb on each of the pair of tracing stylus 37, and for example, it is also possible to obtain the distance between the pair of opposing surfaces 34f and 36f based on the captured image.

Furthermore, the clamp state acquisition device according to the present disclosure is applicable not only to measurement devices that measure electrical characteristics, but also to a wide range of work devices, measurement devices, jigs, etc. that perform work by clamping an object with a pair of clamp members. In addition to the aspects described in the embodiments described above, the present disclosure can be implemented with various changes and improvements based on the knowledge of those skilled in the art.

19: First camera 10: Measuring device 32: Holding table 34: Stator 36: Mover 34f, 36f: Opposing surface 40: Holding table moving device 41: Mover moving device 42: LCR measuring section 44: Component placement section 55: Stator holder 56: Mover holder 100: Control device 150: Distance sensor

Claims (7)

A mounting machine that picks up electronic components supplied by a component supply device and mounts them on a circuit board,
a measuring device that measures the electrical characteristics of the electronic component by clamping the electronic component with a pair of probes;
a working device comprising: a head having a component holder that holds the electronic component supplied by the component supply device; and an imaging device; and a head moving device that moves the head;
a work equipment control device that controls the work equipment;
The measurement device includes a distance acquisition device that acquires the distance between the pair of measurement elements, and a distance acquisition device that acquires the distance between the pair of measurement elements, and a distance acquisition device that acquires the distance between the pair of measurement elements based on the distance between the pair of measurement elements acquired by the distance acquisition device. and a clamp state acquisition device that acquires the clamp state of the electronic component,
The working device control device controls the head moving device to cause the component holder of the head to hold the electronic component supplied by the component supply device, and to cause the electronic component held by the component holder to hold the electronic component supplied by the component supply device. After placing the component on the measuring device, the head is moved to a position where the pair of probes of the measuring device can be imaged by the imaging device, and the imaging device is caused to image the pair of probes. It is a thing,
The mounting machine, wherein the distance acquisition device acquires the distance between the pair of probes based on a captured image obtained by imaging the pair of probes of the imaging device. The distance acquisition device includes an inter-mark distance acquisition unit that provides a mark on each of the pair of measuring stylus and acquires the distance between the pair of marks based on the captured image, and the inter-mark distance acquisition unit The mounting machine according to claim 1, wherein the distance between the pair of probes is obtained based on the obtained distance between the pair of marks. Each of the pair of probes is provided with opposing surfaces facing each other, and the electronic component as a target is clamped by the pair of opposing surfaces,
The mounting machine according to claim 1 or 2, wherein the distance acquisition device acquires the distance between the pair of opposing surfaces as the distance between the pair of probes. When the distance acquired by the distance acquisition device is less than or equal to a set distance, the clamp state acquisition device acquires that the electronic component as a target object is not clamped by the pair of probes. The mounting machine according to any one of claims 1 to 3. When the distance acquired by the distance acquisition device is out of a setting range determined by the electronic component as the target object , the clamp state acquisition device is configured to clamp an object different from the target object using the pair of probes. The mounting machine according to any one of claims 1 to 4, wherein the mounting machine is acquired when the mounting machine is in a state where the mounting machine is in a state where The measuring device is
a holding stand capable of holding the electronic component as a target object ;
a holding table moving device that moves the holding table;
a holding table movement control device that controls the holding table moving device to move the holding table away from the object after the pair of probes approach each other on the holding table on which the object is held; including,
The distance acquisition device detects two cases: a case where the pair of probes approaches each other on the holding table on which the object is held, and a case where the holding table is moved away from the object by the holding table moving device. The mounting machine according to any one of claims 1 to 5, wherein the distance is acquired in at least one of the mounting machines. a pair of probes that can approach and separate from each other and that can clamp an object and measure the electrical characteristics of the object;
a distance acquisition device that acquires the distance between the pair of probes;
a clamp state acquisition device that acquires a clamp state of the object by the pair of probes based on the distance acquired by the distance acquisition device;
The pair of measurement elements includes a stator and a movable element that can approach and move away from the stator,
A measuring device, wherein the distance acquisition device includes an imaging device that images the pair of measuring elements, and acquires a distance between the pair of measuring elements based on an image captured by the imaging device.

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