JP7413033B2 - Manufacturing method for laminated ceramic electronic components - Google Patents

Description

The present invention relates to a method of manufacturing a multilayer ceramic electronic component including a side margin portion.

In recent years, with the miniaturization and higher performance of electronic devices, there has been an increasing demand for thin and uniform side margins to ensure insulation around internal electrodes in multilayer ceramic electronic components such as multilayer ceramic capacitors. There is.

Patent Document 1 discloses a technique for providing a ceramic protective layer (side margin portion) in a green chip with internal electrodes exposed on the side surface by punching out a ceramic green sheet on the side surface of the green chip. . In this technique, the second cut side surfaces of a plurality of green chips are attached to an adhesive sheet, and one ceramic protective layer is formed on the first cut side surface. After this, the plurality of green chips are rolled on the adhesive sheet, the first cut side surface is stuck to the adhesive sheet, and the second cut side surface is exposed. A ceramic protective layer is then formed on the second cut side surface.

Japanese Patent Application Publication No. 2012-209539

As described in Patent Document 1, after forming a side margin portion on one side of the chip, it is necessary to open the other side that has been adhered to the adhesive sheet. In the method described in Patent Document 1, in which the other side surface is opened by rolling, damage such as chipping easily occurs at the ridge of the green chip, making it difficult to increase the yield.

In view of the above circumstances, an object of the present invention is to provide a method for manufacturing a multilayer ceramic electronic component that can improve production efficiency regarding the formation of side margin portions.

In order to achieve the above object, a method for manufacturing a multilayer ceramic electronic component according to one embodiment of the present invention provides a first side surface that is stacked in a first axis direction and faces a second axis direction perpendicular to the first axis; The method includes the step of attaching the first side surface of the ceramic multilayer chip having a plurality of internal electrodes exposed from the second side surface to a first adhesive sheet.
A side margin portion is formed on the second side surface.
A fixing member attached to a peripheral area of the first adhesive sheet and the second adhesive sheet and arranged around the ceramic laminated chip, wherein a thickness dimension in the second axis direction is equal to that of the side margin portion. The first adhesive sheet and the second adhesive sheet are opposed to each other in the second axis direction via a fixing member larger than the dimension in the second axis direction of the ceramic laminated chip, and the side margin portion is The surface facing the second axis is attached to the second adhesive sheet.
The distance between the tip and the side is greater than the first distance in the second axis direction between the protruding tip of the peeling jig and the peripheral area of the second adhesive sheet, or the thickness dimension of the fixing member. Bending the first adhesive sheet along the tip part in a state where a second distance in the second axis direction between the side margin adhesive area of the second adhesive sheet to which the margin part is attached is smaller; By applying tension to the first adhesive sheet in a direction away from the first side surface, the first adhesive sheet becomes the ceramic laminate to which the second adhesive sheet is attached via the side margin portion. It is peeled off from the first side surface of the chip.

In this configuration, the fixing member is used to suppress the deflection of the first adhesive sheet and the second adhesive sheet, and the first adhesive sheet is attached to the first adhesive sheet while the tip of the peeling jig is brought close to the first side surface. Can be peeled off from the side. Specifically, the side margin adhesive area of the second adhesive sheet is projected in the second axial direction from the peripheral area of the second adhesive sheet, or the tip portion is placed in a state where the side margin adhesive area of the second adhesive sheet is protruded from the first adhesive sheet fixing surface of the fixing member. The first adhesive sheet is peeled off in either the state where it is brought closer to the second adhesive sheet side in the axial direction. Thereby, the component of the tension in the second axis direction that is applied to the first pressure-sensitive adhesive sheet during peeling can be reduced. Therefore, it is possible to prevent a large external force from being applied to the ceramic multilayer chip in the second axis direction via the first adhesive sheet, and thereby preventing the second adhesive sheet from peeling off from the side margin portion. As a result, with the above configuration, the ceramic multilayer chip can be more reliably transferred from the first adhesive sheet to the second adhesive sheet, and the production efficiency regarding the formation of the side margin portion can be improved.

Specifically, in the step of peeling off the first adhesive sheet, the second adhesive sheet is placed on a support base having a support surface facing in the second axis direction, and the peripheral area is closely contacted with the support surface. and the first adhesive sheet may be peeled off from the first side surface with the side margin adhesion region spaced apart from the support surface in the second axis direction.
Thereby, the side margin adhesion region can be made to protrude from the peripheral region in the second axis direction while suppressing production costs using a support stand with a simple configuration.

Alternatively, in the step of peeling off the first adhesive sheet, the second adhesive sheet is placed on a support base having a support surface facing in the second axis direction,
The above supporting surface is
a peripheral support region in which the peripheral region is arranged;
The side margin adhesion region may be arranged and may include a protruding region protruding from the peripheral region in the second axial direction.
This also makes it possible to obtain a configuration in which the side margin adhesive area protrudes from the peripheral edge area in the second axial direction.

As described above, according to the present invention, it is possible to provide a method for manufacturing a multilayer ceramic electronic component that can improve production efficiency regarding the formation of side margin portions.

FIG. 1 is a perspective view of a multilayer ceramic capacitor according to a first embodiment of the present invention. 2 is a cross-sectional view of the multilayer ceramic capacitor taken along line AA' in FIG. 1. FIG. 2 is a cross-sectional view of the multilayer ceramic capacitor taken along line BB' in FIG. 1. FIG. It is a flowchart which shows the manufacturing method of the said laminated ceramic capacitor. It is a perspective view showing the manufacturing process of the above-mentioned multilayer ceramic capacitor. It is a perspective view showing the manufacturing process of the above-mentioned multilayer ceramic capacitor. FIG. 3 is a cross-sectional view showing the manufacturing process of the multilayer ceramic capacitor. FIG. 3 is a cross-sectional view showing the manufacturing process of the multilayer ceramic capacitor. FIG. 3 is a cross-sectional view showing the manufacturing process of the multilayer ceramic capacitor. FIG. 3 is a cross-sectional view showing the manufacturing process of the multilayer ceramic capacitor. FIG. 3 is a cross-sectional view showing the manufacturing process of the multilayer ceramic capacitor. FIG. 3 is a cross-sectional view showing the manufacturing process of the multilayer ceramic capacitor. FIG. 3 is a plan view showing the manufacturing process of the multilayer ceramic capacitor. FIG. 3 is a cross-sectional view showing a manufacturing process of a multilayer ceramic capacitor according to a comparative example of the present embodiment. FIG. 3 is a cross-sectional view showing a manufacturing process of a multilayer ceramic capacitor according to a comparative example of the present embodiment. FIG. 7 is a cross-sectional view showing a manufacturing process of a multilayer ceramic capacitor according to a second embodiment of the present invention. FIG. 7 is a cross-sectional view showing a manufacturing process of a multilayer ceramic capacitor according to a third embodiment of the present invention. FIG. 3 is a plan view showing the manufacturing process of the multilayer ceramic capacitor.

Embodiments of the present invention will be described below with reference to the drawings.
In the drawings, mutually orthogonal X, Y, and Z axes are shown as appropriate. The X, Y, and Z axes are common to all figures.

<First embodiment>
[Structure of multilayer ceramic capacitor]
1 to 3 are diagrams showing a multilayer ceramic capacitor 10 according to a first embodiment of the present invention. FIG. 1 is a perspective view of a multilayer ceramic capacitor 10. FIG. 2 is a cross-sectional view of the multilayer ceramic capacitor 10 taken along line AA' in FIG. FIG. 3 is a cross-sectional view of the multilayer ceramic capacitor 10 taken along line BB' in FIG.

The multilayer ceramic capacitor 10 includes a ceramic body 11, a first external electrode 14, and a second external electrode 15. The ceramic body 11 typically has two main surfaces facing the Z-axis direction, two end faces facing the X-axis direction, and two side faces facing the Y-axis direction.

The multilayer ceramic capacitor 10 is configured to be small, for example. Specifically, the dimension of the multilayer ceramic capacitor 10 in the X-axis direction may be 1 mm or less, and the dimension in the Y-axis direction and the dimension in the Z-axis direction may be 0.5 mm or less. The dimensions of the multilayer ceramic capacitor 10 in each direction mean the maximum dimensions in each direction.

The external electrodes 14 and 15 cover the end face of the ceramic body 11 and are opposed to each other in the X-axis direction with the ceramic body 11 in between. The external electrodes 14 and 15 extend from the end surface of the ceramic body 11 to the main surface and side surfaces. Note that the shapes of the external electrodes 14 and 15 are not limited to those shown in FIG.

The external electrodes 14 and 15 are made of a good electrical conductor. Examples of good electrical conductors forming the external electrodes 14 and 15 include copper (Cu), nickel (Ni), tin (Sn), palladium (Pd), platinum (Pt), silver (Ag), and gold (Au). Examples include metals or alloys whose main components are

The ceramic body 11 includes a ceramic laminate (laminate) 16 and a side margin portion 17 .

The laminate 16 has a substantially rectangular parallelepiped shape, and has a first end surface 16a and a second end surface 16b facing the X-axis direction, a first side surface 16c and a second side surface 16d facing the Y-axis direction, and a first end surface 16c and a second side surface 16d facing the Y-axis direction. It includes a first main surface 16e and a second main surface 16f facing toward each other. The end surfaces 16a and 16b extend along the Y-axis direction and the Z-axis direction. The side surfaces 16c and 16d extend along the Z-axis direction and the X-axis direction. The main surfaces 16e and 16f extend along the X-axis direction and the Y-axis direction.

End surfaces 16a, 16b, side surfaces 16c, 16d, and main surfaces 16e, 16f of the laminate 16 are all configured as flat surfaces. The flat surface according to the present embodiment does not have to be strictly a flat surface as long as it is recognized as flat when viewed as a whole. It also includes surfaces with gently curved shapes.

The laminate 16 includes a capacitor forming portion 18 and cover portions 19 provided on both sides of the capacitor forming portion 18 in the Z-axis direction. The capacitor forming portion 18 includes a first internal electrode 12 and a second internal electrode 13 that are stacked in the Z-axis direction with a ceramic layer interposed therebetween.

The first internal electrode 12 and the second internal electrode 13 are each formed into a sheet shape extending along the XY plane. The first internal electrode 12 extends in the X-axis direction to the first end surface 16a and is connected to the first external electrode 14. The second internal electrode 13 extends in the X-axis direction to the second end surface 16b and is connected to the second external electrode 15. As a result, when a voltage is applied between the first external electrode 14 and the second external electrode 15, the voltage is applied to the ceramic layer between the first internal electrode 12 and the second internal electrode 13, and the capacitance forming portion A charge corresponding to the voltage is stored in 18.

The internal electrodes 12 and 13 are made of a good electrical conductor. Typical good electrical conductors forming the internal electrodes 12 and 13 include nickel (Ni), and also include copper (Cu), palladium (Pd), platinum (Pt), silver (Ag), Examples include metals or alloys containing gold (Au) as a main component.

In the laminate 16, dielectric ceramics with a high dielectric constant are used to increase the capacitance of each ceramic layer between the internal electrodes 12 and 13. Examples of high dielectric constant dielectric ceramics include materials with a perovskite structure containing barium (Ba) and titanium (Ti), typified by barium titanate (BaTiO ₃ ).

The ceramic layer is made of strontium titanate (SrTiO ₃ )-based, calcium titanate (CaTiO ₃ )-based, magnesium titanate (MgTiO ₃ )-based, calcium zirconate (CaZrO ₃ )-based, calcium zirconate titanate (Ca( It may be composed of Zr, Ti)O ₃ ), barium zirconate (BaZrO ₃ ), titanium oxide (TiO ₂ ), or the like.

The cover portion 19 is formed of insulating ceramics, but may also include, for example, the dielectric ceramics used in the ceramic body 11. This suppresses internal stress that may occur between the cover portion 19 and the capacitance forming portion 18.

The internal electrodes 12 and 13 are formed over the entire width of the capacitor forming portion 18 in the Y-axis direction, and are exposed on both side surfaces 16c and 16d of the stacked body 16. The positions of the ends of these internal electrodes 12 and 13 are aligned within a range of 0.5 μm in the Y-axis direction. Side margin portions 17 are provided on both side surfaces 16c and 16d from the viewpoint of ensuring insulation between the internal electrodes 12 and 13 and between these and the outside.

The side margin portion 17 covers the first side surface 16c and the second side surface 16d of the laminate 16, respectively. The side margin portion 17 has a substantially flat plate shape extending along the XZ plane. The side margin portion 17 is formed of insulating ceramic, but may be formed of the dielectric ceramic used in the laminate 16 similarly to the cover portion 19 from the viewpoint of suppressing internal stress. The side margin portion 17 is formed, for example, by pressing and punching a ceramic green sheet at the side surfaces 16c and 16d, as described below.

[Method for manufacturing multilayer ceramic capacitor 10]
FIG. 4 is a flowchart showing a method for manufacturing the multilayer ceramic capacitor 10. 5 to 13 are diagrams schematically showing the manufacturing process of the multilayer ceramic capacitor 10. The method for manufacturing the multilayer ceramic capacitor 10 will be described below along with FIG. 4 and with appropriate reference to FIGS. 5 to 13.

(Step S01: Preparation of ceramic multilayer chip)
In step S01, the first ceramic sheet 101 and the second ceramic sheet 102 for forming the capacitance forming part 18 and the third ceramic sheet 103 for forming the cover part 19 are laminated and cut. An unfired ceramic multilayer chip (multilayer chip) 116 is produced.

Ceramic sheets 101, 102, and 103 shown in FIG. 5 are configured as unfired dielectric green sheets containing dielectric ceramic as a main component. An unfired first internal electrode 112 corresponding to the first internal electrode 12 is formed on the first ceramic sheet 101 . An unfired second internal electrode 113 corresponding to the second internal electrode 13 is formed on the second ceramic sheet 102 . No internal electrodes are formed on the third ceramic sheet 103.

Each internal electrode 112, 113 has a plurality of strip-shaped electrode patterns extending across a cutting line Lx parallel to the X-axis direction and along a cutting line Ly parallel to the Y-axis direction. These internal electrodes 112 and 113 are formed by applying conductive paste to the ceramic sheets 101 and 102 by a printing method or the like.

The ceramic sheets 101 and 102 are alternately stacked in the Z-axis direction, as shown in FIG. A stack of ceramic sheets 101 and 102 corresponds to the capacitance forming portion 18. The ceramic sheets 103 are laminated on the top and bottom surfaces of the laminate of the ceramic sheets 101 and 102 in the Z-axis direction. The stack of ceramic sheets 103 corresponds to the cover part 19.
Note that the number of stacked ceramic sheets 101, 102, 103, etc. can be adjusted as appropriate.

Subsequently, the laminate of ceramic sheets 101, 102, and 103 is crimped from the Z-axis direction and cut along cutting lines Lx and Ly. As a result, a stacked chip 116 shown in FIG. 6 is manufactured.

As shown in FIG. 6, the laminated chip 116 includes an unfired capacitor forming portion 118 including unfired internal electrodes 112 and 113 stacked in the Z-axis direction, and an unfired cover portion 119. The laminated chip 116 has a first side surface 116c and a second side surface 116d that are cut surfaces corresponding to the cutting line Lx, and a first end surface 116a and a second end surface 116b that are cut surfaces that correspond to the cutting line Ly. be done. Ends of the unfired internal electrodes 112, 113 are exposed from the side surfaces 116c, 116d.

(Step S02: Pasting the first adhesive sheet)
In step S02, as shown in FIG. 7, the first side surface 116c is attached to the first adhesive sheet S1. As a result, the second side surface 116d of the laminated chip 116 is opened and faces opposite to the first adhesive sheet S1. In the example shown in FIG. 7, a plurality of laminated chips 116 are attached to the first adhesive sheet S1. These stacked chips 116 are arranged at intervals in the Z-axis direction, for example. Note that the stacked chips 116 may be arranged at intervals in the X-axis direction.

The first adhesive sheet S1 includes a first adhesive surface S11 having adhesive properties. More specifically, the first adhesive sheet S1 includes a base material and an adhesive layer including a first adhesive surface S11. The base material is formed of a resin material including polyester, polyethylene, etc., for example. The adhesive layer is formed of an adhesive containing, for example, acrylic resin, silicone resin, or the like.

As shown in FIG. 7, for example, a first frame F1 is attached to the first adhesive surface S11 of the first adhesive sheet S1. The first frame F1 constitutes a part of a fixing member F, which will be described later, and is configured as a frame body made of metal, resin, or the like, for example. The first frame F1 includes a first fixing surface F11 attached to the first adhesive sheet S1 and a first connecting surface F12 opposite to the first fixing surface F11, and is arranged around the laminated chip 116. ing. The first connection surface F12 includes a first engagement portion (not shown) that engages with a second connection surface F22, which will be described later.

By attaching the first frame F1 to the first adhesive sheet S1, a tension in a direction in which the first adhesive sheet S1 is pulled toward the first fixing surface F11 is applied to the first adhesive sheet S1. Thereby, the bending of the first adhesive sheet S1 can be suppressed, and the posture of the laminated chip 116 on the first adhesive sheet S1 can be maintained favorably.

(Step S03: Formation of side margin portion 1)
In step S03, a side margin portion 117 is formed on the second side surface 116d. The side margin portion 117 is formed by punching the ceramic sheet 117s at the second side surface 116d, as described below. Note that this step is performed, for example, with the first frame F1 pasted, but illustration of the first frame F1 is omitted in FIG. 8 .

First, as shown in FIG. 8A, the second side surface 116d of the laminated chip 116 is arranged to face the ceramic sheet 117s in the Y-axis direction. The first side surface 116c of the laminated chip 116 is attached to the first adhesive sheet S1. The ceramic sheet 117s is arranged on the elastic member E which can be elastically deformed.

Subsequently, as shown in FIG. 8B, the second side surface 116d of the laminated chip 116 is pushed into the ceramic sheet 117s in the Y-axis direction. As a result, a shear force acts on the ceramic sheet 117s along the outer edge of the second side surface 116d, and when this shear force exceeds the shear strength of the ceramic sheet 117s, the ceramic sheet 117s is punched out.

At this time, the laminated chip 116 is pushed toward the elastic member E to such an extent that the unnecessary portion 117p of the ceramic sheet 117s other than the punched portion comes into contact with the first adhesive sheet S1. This can prevent problems such as the unnecessary portion 117p being stuck to the first adhesive sheet S1 and the unnecessary portion 117p being stuck to the laminated chip 116, for example.

Through this step, as shown in FIG. 8C, a side margin portion 117 is formed on the second side surface 116d.

(Step S04: Pasting the second adhesive sheet)
In step S04, the surface of the side margin portion 117 facing the Y-axis direction is attached to the second adhesive sheet S2.

9 to 11 are schematic cross-sectional views illustrating this step.
In this step, first, as shown in FIG. 9, a second adhesive sheet S2 including a second adhesive surface S21 having adhesive properties is prepared. The second adhesive sheet S2 is arranged, for example, on a support base G1 including a support surface G11 orthogonal to the Y-axis direction.

More specifically, the second adhesive sheet S2 includes a base material and an adhesive layer including a second adhesive surface S21. The second adhesive sheet S2 may have the same configuration as the first adhesive sheet S1. The base material is formed of a resin material including polyester, polyethylene, etc., for example. The adhesive layer is formed of an adhesive containing, for example, acrylic resin, silicone resin, or the like.

In this embodiment, a second frame F2 is attached to the second adhesive sheet S2. The second frame F2 has, for example, the same planar shape as the first frame F1 described above, is connected to the first frame F1, and constitutes a part of a fixing member F, which will be described later. The second frame F2 is configured as a frame body made of metal, resin, or the like, for example. The second frame F2 includes a second fixing surface F21 attached to the second adhesive sheet S2, and a second connecting surface F22 on the opposite side of the second fixing surface F21. The second connection surface F22 includes a second engagement portion (not shown) that engages with the first connection surface F12.

By attaching the second frame F2 to the second adhesive sheet S2, tension in the direction in which the second adhesive sheet S2 is pulled toward the second fixing surface F21 is applied to the second adhesive sheet S2. Thereby, bending of the second adhesive sheet S2 can be suppressed, and handling of the second adhesive sheet S2 can be facilitated.

Subsequently, as shown in FIG. 10, the second connection surface F22 of the second frame F2 is connected to the first connection surface F12 of the first frame F1. As a result, a fixing member F consisting of the first frame F1 and the second frame F2 is formed, and the first adhesive sheet S1 and the second adhesive sheet S2 face each other in the Y-axis direction. Specifically, the first adhesive surface S11 and the second adhesive surface S21 face each other in the Y-axis direction. A plurality of laminated chips 116 on which side margin portions 117 are formed are attached to the first adhesive surface S11 of the first adhesive sheet S1. Note that, in FIG. 10, the first adhesive sheet S1 and the plurality of laminated chips 116 attached thereto are shown in a reversed manner in the Y-axis direction from FIG. 8.

The fixing member F has a first fixing surface F11 attached to the first adhesive sheet S1, a second fixing surface F21 facing in the opposite direction to the first fixing surface F11 and attached to the second adhesive sheet S2, including. The fixing member F has a frame shape that is arranged around the plurality of stacked chips 116 as a whole.

The fixing member F can apply tension in the direction of pulling the fixing member F to the first adhesive sheet S1 and the second adhesive sheet S2. Thereby, it is possible to suppress the bending of the first adhesive sheet S1 and the second adhesive sheet S2 and the large change in the posture of the laminated chip 116.

In this embodiment, the thickness T1 of the fixing member F in the Y-axis direction is larger than the dimension T2 of the stacked chip 116 including the side margin portion 117 in the Y-axis direction. Furthermore, the thickness dimension T1 may be twice or more the dimension T2. Thereby, sufficient rigidity of the fixing member F can be ensured, and deformation of the fixing member F during handling can be suppressed. Therefore, deflection of the first adhesive sheet S1 and second adhesive sheet S2 and large changes in the posture of the laminated chip 116 can be suppressed more reliably.

In the example shown in FIG. 10, the thickness dimension T1 is larger than the dimension T2, and tension is applied to the first adhesive surface S11 by the fixing member F, so that the surface of the side margin portion 117 and the second adhesive surface S21 are separated. are doing. In this case, by pressing the plurality of laminated chips 116 in the Y-axis direction using a pressure plate or the like from above the first adhesive sheet S1, as shown in FIG. 2. Paste it on the adhesive surface S21.

(Step S05: Peeling off the first adhesive sheet)
In step S05, the first adhesive sheet S1 is peeled off from the first side surface 116c of the laminated chip 116 to which the second adhesive sheet is attached via the side margin portion 117. As a result, the first side surface 116c is opened with the second adhesive sheet S2 attached to the side margin portion 117.

FIG. 12 is a schematic cross-sectional view illustrating this step.
In this step, as shown in FIG. 12, a peeling jig H including a protruding tip H1 is used. The peeling jig H includes, for example, a guiding surface H2 that guides the first adhesive sheet S1 in a direction away from the first side surface 116c, a facing surface H3 that faces the first side surface 116c, and a guiding surface H2 and a facing surface H3. and a connecting protruding tip H1. Although the angle between the guiding surface H2 and the opposing surface H3 is an acute angle in the example shown in FIG. 12, it is not limited to this. In the example shown in FIG. 12, the opposing surface H3 is arranged perpendicular to the Y-axis direction, but is not limited to this arrangement.

In this step, the tip H1 of the peeling jig H is placed above the first side surface 116c to be peeled in the Y-axis direction. Then, the first adhesive sheet S1 is bent along the tip end H1, and tension is applied along the guide surface H2. As a result, tension is applied to the first adhesive sheet S1 in a direction away from the first side surface 116c, and the first adhesive sheet S1 is peeled off from the first side surface 116c.

Further, while tension is applied to the first adhesive sheet S1 along the guide surface H2, the peeling jig H moves in a direction opposite to the protruding direction of the tip end H1 (for example, in the Z-axis direction). As a result, the first adhesive sheet S1 is completely peeled off from the first side surface 116c. Furthermore, by moving the peeling jig H, the first adhesive sheet S1 can be continuously peeled off from the plurality of first side surfaces 116c.

In this embodiment, the first adhesive sheet S1 may be automatically peeled from each first side surface 116c by a peeling mechanism (not shown) including a peeling jig H. The peeling mechanism includes, for example, a peeling jig H, a tension applying section that applies tension to the first adhesive sheet S1 in a direction away from the first side surface 116c, and a drive that moves the peeling jig H and the tension applying section. and a control section. The tension applying section includes, for example, a take-up roller that winds up the first adhesive sheet S1, a motor that rotates the take-up roller, and the like. The drive unit includes, for example, a guide that guides the peeling jig H, a motor that moves the peeling jig H on the guide, and the like. The control section is configured by a computer and controls the operation of each section.

The peeling jig H (tip H1) is positioned above the first fixing surface F11 of the fixing member F in the Y-axis direction (in the direction away from the second adhesive surface S21), and It is configured to be movable in the direction.

FIG. 13 is a diagram showing an example of the arrangement of the fixing member F and the peeling jig H, and is a plan view seen from the Y-axis direction. The fixing member F includes, for example, two rectangular openings F3. For example, the opening F3 has a rectangular shape with a long side in the Z-axis direction and a short side in the X-axis direction. The first adhesive sheet S1 and the second adhesive sheet S2 extend, for example, over the entire fixing member F including the two openings F3. The plurality of stacked chips 116 are arranged in the opening F3, for example, in a line in the Z-axis direction.

As shown in FIG. 13, for example, the peeling jig H has a rod shape that extends over the entire length of the fixing member F in the X-axis direction when viewed from the Y-axis direction. Accordingly, the tip portion H1 is also configured in a linear shape extending along the X-axis direction. A guide (not shown) for guiding the peeling jig H is arranged, for example, on the outside of the fixing member F in the X-axis direction and extends along the Z-axis direction. With such a configuration, the peeling jig H is movable in the Z-axis direction above the fixed member F in the Y-axis direction.

In this step, the first adhesive sheet S1 is peeled from the first side surface 116c with the tip H1 of the peeling jig H brought close to the first side surface 116c in the Y-axis direction. In this embodiment, as described above, the peeling jig H is located above the fixed member F in the Y-axis direction, and it is difficult to adjust the position of the peeling jig H in the Y-axis direction. Therefore, by making the side margin adhesive region R1 of the second adhesive sheet S2 protrude from the peripheral region R2 toward the tip H1 side, the tip H1 is brought closer to the first side surface 116c. For example, the distance between the tip portion H1 and the first adhesive sheet S1 in the Y-axis direction is smaller than the dimension T2 (see FIG. 10) of the laminated chip 116 including the side margin portion 117 in the Y-axis direction.

In this embodiment, the peripheral region R2 of the second adhesive surface S21 is the region to which the second fixing surface F21 of the fixing member F is pasted.

More specifically, the peeling of the first adhesive sheet S1 in this step is performed in a state where the second distance D2 is smaller than the first distance D1, as shown in FIG. The first distance D1 is the distance in the Y-axis direction between the tip H1 and the peripheral area R2 of the second adhesive sheet S2 to which the second fixing surface F21 of the fixing member F is attached. The second distance D2 is the distance in the Y-axis direction between the tip H1 and the side margin adhesive region R1 of the second adhesive sheet S2. The second distance D2 means the smallest distance among the distances in the Y-axis direction between the tip portion H1 and the side margin adhesive region R1 to which the plurality of stacked chips 116 are attached.

The peeling of the first adhesive sheet S1 in this step is performed without fixing the second adhesive sheet S2 to the support surface G11 of the support base G1 on which the second adhesive sheet S2 is placed. As a result, the first adhesive sheet S1 and the laminated chip 116 adhered thereto are lifted upward in the Y-axis direction by the tension generated by the peeling jig H that includes a component in the Y-axis direction. Accordingly, the side margin adhesion region R1 becomes separated from the support surface G11. On the other hand, the peripheral region R2 is in close contact with the support surface G11 because the fixing member F is disposed therein.

FIG. 14 is a schematic cross-sectional view showing a peeling process according to a comparative example of this embodiment. In this figure, components corresponding to those in FIG. 12 will be described with the same reference numerals.
In FIG. 14, the structure of the support stand G2 is different from the structure of the support stand G1 shown in FIG. The support base G2 includes a suction surface G21 capable of suctioning the second adhesive sheet S2, and a plurality of suction holes G22 that are open to the suction surface G21. The suction surface G21 is composed of a flat surface orthogonal to the Y-axis direction. Thereby, the second adhesive sheet S2 is in a state of being adsorbed to the adsorption surface G21 during the peeling process.

As shown in FIG. 14, in this configuration, the side margin adhesive region R1 is arranged on the same plane as the peripheral region R2, and the second distance D2 is the same distance as the first distance D1. Furthermore, since the tip H1 of the peeling jig H is located above the first fixing surface F11 of the fixing member F in the Y-axis direction, the first distance D1 and the second distance D2 are the thickness dimension T1 of the fixing member F. becomes larger than As a result, the distance between the first side surface 116c of the laminated chip 116 and the tip H1 of the peeling jig H also increases, and a large tension component in the Y-axis direction is applied to the first adhesive sheet S1. . Due to this tension, an external force including an upward component in the Y-axis direction is also applied to the stacked chip 116.

On the other hand, a suction force downward in the Y-axis direction is applied to the second adhesive sheet S2 from the suction surface G21. As a result, opposing forces act between the side margin portion 117 and the second adhesive surface S21. Therefore, as shown in FIG. 15, the second adhesive sheet S2 is peeled off from the side margin portion 117, making it difficult to transfer the laminated chip 116 to the second adhesive sheet S2.

In addition, when the thickness T1 of the fixing member F is larger than the dimension T2 in the Y-axis direction of the laminated chip 116 including the side margin portion 117, the first adhesive sheet S1 also has a thickness from the first fixing surface F11. Tension including a component in the Y-axis direction is applied. This also makes it easier for the side margin portion 117 to peel off from the second adhesive sheet S2.

On the other hand, as shown in FIG. 12, in the peeling process of this embodiment, since the second adhesive sheet S2 is not fixed to the support surface G11, the side margin adhesive region R1 protrudes from the peripheral region R2 in the Y-axis direction, and the second adhesive sheet S2 is not fixed to the support surface G11. It is possible to make the second distance D2 smaller than the first distance D1. Therefore, the peeling jig H can be brought close to the first side surface 116c, and the Y-axis direction component of the tension applied from the peeling jig H to the first adhesive sheet S1 can be changed from the example shown in FIG. can also be made smaller. Thereby, external force in the Y-axis direction that may be applied to the stacked chip 116 can be reduced.

Furthermore, since the second adhesive sheet S2 is not fixed on the support surface G11, no adhesion force to the support surface G11 is applied to the second adhesive sheet S2. This makes it difficult for external forces to be applied in opposite directions to the boundary between the side margin portion 117 and the second adhesive sheet S2, and it is possible to prevent the second adhesive sheet S2 from peeling off from the side margin portion 117.

In addition, since the laminated chip 116 is lifted upward in the Y-axis direction during the peeling process, the tension including the Y-axis direction component from the first fixed surface F11 that may be generated in the first adhesive sheet S1 is also reduced. . This also makes it possible to reduce the external force in the Y-axis direction that may be applied to the stacked chip 116.

Moreover, in this embodiment, there is no need to provide a mechanism for adsorption and fixation on the support base G1, and it is possible to prevent the second adhesive sheet S2 from peeling off with a simple device configuration.

Furthermore, in this embodiment, since the unnecessary portion 117p of the ceramic sheet 117s is attached to the first adhesive sheet S1, this unnecessary portion 117p can also be removed in this step. This can also prevent problems such as the unnecessary portion 117p sticking to the surface of the laminated chip 116 or the second adhesive sheet S2.

(Step S06: Formation of side margin portion 2)
In step S06, a side margin portion 117 is formed on the open first side surface 116c. The side margin portion 117 is formed similarly to step S03. As a result, an unfired ceramic body 11 is produced. Note that the second adhesive sheet S2 is peeled off from the laminated chip 116 after this step.

(Step S07: Baking)
In step S07, the unfired ceramic body 11 obtained in step S06 is fired to produce the ceramic body 11 of the multilayer ceramic capacitor 10 shown in FIGS. 1 to 3. The firing temperature can be determined based on the sintering temperature of the unfired ceramic body 11. Further, the firing can be performed, for example, under a reducing atmosphere or under a low oxygen partial pressure atmosphere.

(Step S08: External electrode formation)
In step S08, external electrodes 14 and 15 are formed at both ends in the X-axis direction of the ceramic body 11 obtained in step S07. As an example, first, a conductive paste is applied to both ends of the ceramic body 11 in the X-axis direction, and this conductive paste is baked to form a base film. Next, one or more plated films are formed by immersing the ceramic body 11 on which the base film has been formed in a plating solution and performing electrolytic plating.
As a result, a multilayer ceramic capacitor 10 as shown in FIGS. 1 to 3 is formed.

Note that part of the processing in step S08 above may be performed before step S07. For example, before step S07, an unfired electrode material is applied to both end surfaces of the unfired ceramic body 11 in the X-axis direction, and in step S07, the unfired ceramic body 11 is fired and at the same time The base layer of the external electrodes 14 and 15 may be formed by baking the material. Alternatively, an unfired electrode material may be applied to the ceramic body 11 which has been subjected to the binder removal process, and these may be fired at the same time.

As described above, according to the present embodiment, it is possible to transfer the first adhesive sheet S1 to the second adhesive sheet S2 in the laminated chip 116 more reliably. Therefore, it is possible to suppress a decrease in yield when forming the side margin portions 117 and increase production efficiency.

<Second embodiment>
FIG. 16 is a schematic cross-sectional view showing the peeling step (step S05) of the first adhesive sheet S1 according to the second embodiment of the present invention. In addition, in the following embodiment, the same code|symbol is attached|subjected about the structure similar to the above-mentioned 1st Embodiment, and description is abbreviate|omitted.

Also in step S05 of the present embodiment, the first adhesive sheet S1 is attached to the laminated chip 111 with the side margin adhesive region R1 of the second adhesive sheet S2 protruding from the peripheral region R2 in the Y-axis direction (toward the tip H1 side). It peels off from the first side surface 116c. As a result, the first side surface 116c is opened with the second adhesive sheet S2 attached to the side margin portion 117. In step S05 of this embodiment, the second adhesive sheet S2 is placed on a support stand G3 different from the support stand G1 of the first embodiment.

The support stand G3 has a support surface G31 facing in the Y-axis direction. The support stand G3 includes a plurality of suction holes G32 that open in the support surface G31, and the support surface G31 is configured as a suction surface capable of suctioning, for example, the second adhesive sheet S2.

The support surface G31 includes a peripheral edge support region G312 in which the peripheral edge region R2 is arranged, and a protrusion region G311 in which the side margin adhesive region R1 is arranged and protrudes from the peripheral edge support region G312 in the Y-axis direction. The protruding region G311 is formed of, for example, a flat surface perpendicular to the Y-axis direction. In this case, as shown in FIG. 16, a step is formed between the peripheral edge support region G312 and the protrusion region G311.

Even with the support base G3 having such a configuration, the side margin adhesive region R1 protrudes from the peripheral region R2 in the Y-axis direction, and the first adhesive sheet S1 is attached with the second distance D2 being smaller than the first distance D1. Peeling can be performed. Therefore, the tension including the component in the Y-axis direction applied from the peeling jig H to the first adhesive sheet S1 can be reduced. Therefore, the external force in the Y-axis direction applied to the laminated chip 116 including the side margin portion 117 can be reduced, and the problem of the second adhesive sheet S2 peeling off from the side margin portion 117 can be prevented.

<Third embodiment>
FIG. 17 is a schematic cross-sectional view showing the peeling step (step S05) of the first adhesive sheet S1 according to the third embodiment of the present invention.

In step S05 of the present embodiment, the first adhesive sheet is S1 is peeled off from the first side surface 116c. That is, in step S05 of the present embodiment, by arranging the tip H1 lower in the Y-axis direction (on the second adhesive sheet S2 side) than the first fixing surface F11 of the fixing member F, the tip H1 is placed in the first fixing surface F11. It is brought close to the side surface 116c.

At this time, the tip portion H1 may move in the Z-axis direction while pressing the first side surface 116c in the Y-axis direction.

In this embodiment, the second adhesive sheet S2 may be placed on a support base G4 including a substantially flat support surface G41 orthogonal to the Y-axis direction. The support stand G4 includes a plurality of suction holes G42 that open in the support surface G41, and the support surface G41 is configured as a suction surface capable of suctioning, for example, the second adhesive sheet S2.

With such a configuration, the tip portion H1 can be brought close to the first side surface 116c, and the tension including the Y-axis direction component applied from the peeling jig H to the first adhesive sheet S1 can be reduced. can be reduced. Thereby, the external force in the Y-axis direction that is applied to the stacked chip 116 including the side margin portion 117 can be reduced. Therefore, even if the second adhesive sheet S2 is fixed to the support surface G41, it is possible to prevent the second adhesive sheet S2 from peeling off from the side margin portion 117.

Further, the facing surface H3 of the peeling jig H can also be brought close to the first adhesive sheet S1. Thereby, the influence of the tension including the Y-axis direction component applied by the first fixing surface F11 can be suppressed, and the external force applied to the laminated chip 116 in the Y-axis direction can be further reduced. This also makes it possible to more reliably prevent the second adhesive sheet S2 from peeling off from the side margin portion 117.

In this embodiment, for example, a fixing member F' as shown in the plan view of FIG. 18 may be used. This fixing member F' has one large opening F'3. The opening F'3 can accommodate components such as a peeling jig H and a guide for a peeling mechanism. This makes it possible to move the distal end H1 within the opening F3 while arranging it below the first fixing surface F11 of the fixing member F' in the Y-axis direction.

Although each embodiment of the present invention has been described above, the present invention is not limited only to the above-described embodiments, and it goes without saying that various changes can be made without departing from the gist of the present invention. For example, an embodiment of the present invention can be a combination of each embodiment.

The method for forming the side margin portion is not limited to the above-described punching of the side margin sheet, and may also be, for example, pasting of a molded side margin sheet, application of ceramic paste, or the like.

In the second and third embodiments described above, the support surface is an adsorption surface, but it may be a surface on which the second adhesive sheet S2 is not fixed, instead of an adsorption surface.

The configuration of the fixing member is not limited to the above-mentioned example, and any configuration may be used as long as the first adhesive sheet and the second adhesive sheet are opposed to each other in the Y-axis direction and the deflection of these sheets can be suppressed.

In the above embodiment, a multilayer ceramic capacitor has been described as an example of a multilayer ceramic electronic component, but the present invention is applicable to all multilayer ceramic electronic components having a pair of external electrodes. Examples of such laminated ceramic electronic components include chip varistors, chip thermistors, and laminated inductors.

10...Multilayer ceramic capacitor (multilayer ceramic electronic component)
112, 113... (unfired) internal electrode 116... Laminated chip (ceramic laminated chip)
116c...First side surface (of the laminated chip) 116d...Second side surface (of the laminated chip) 117...Side margin (unfired) S1...First adhesive sheet S2...Second adhesive sheet H...Peeling jig H1... Tip part F, F'...Fixing member

Claims (3)

The first side surface of a ceramic multilayer chip has a plurality of internal electrodes stacked in a first axis direction and exposed from a first side surface and a second side surface facing in a second axis direction perpendicular to the first axis. 1Paste it on the adhesive sheet,
forming a side margin portion on the second side surface;
A fixing member attached to peripheral areas of the first adhesive sheet and the second adhesive sheet and arranged around the ceramic laminated chip, the thickness dimension in the second axis direction being the same as that of the side margin portion. The first adhesive sheet and the second adhesive sheet are made to face each other in the second axial direction via a fixing member that is larger than the dimension in the second axial direction of the ceramic multilayer chip, and the side margin portion is affixing the surface facing the second axis direction to the second adhesive sheet;
The distance between the tip and the side is longer than the first distance in the second axis direction between the protruding tip of the peeling jig and the peripheral area of the second adhesive sheet, or the thickness dimension of the fixing member. Bending the first adhesive sheet along the tip part in a state where a second distance in the second axis direction between the side margin adhesive area of the second adhesive sheet to which the margin part is attached is smaller; By applying tension to the first adhesive sheet in a direction away from the first side surface, the first adhesive sheet is bonded to the ceramic laminate to which the second adhesive sheet is attached via the side margin portion. A method for manufacturing a multilayer ceramic electronic component, comprising peeling off from the first side surface of a chip. A method for manufacturing a laminated ceramic electronic component according to claim 1, comprising:
In the step of peeling off the first adhesive sheet, the second adhesive sheet is placed on a support base having a support surface facing in the second axis direction, the peripheral area is brought into close contact with the support surface, and the side A method for manufacturing a multilayer ceramic electronic component, wherein the first adhesive sheet is peeled from the first side surface while the margin adhesion region is spaced apart from the support surface in the second axis direction. A method for manufacturing a laminated ceramic electronic component according to claim 1, comprising:
In the step of peeling off the first adhesive sheet, the second adhesive sheet is placed on a support base having a support surface facing in the second axis direction,
The support surface is
a peripheral support region in which the peripheral region is arranged;
A method for manufacturing a multilayer ceramic electronic component, comprising: a protruding area in which the side margin bonding area is arranged and protruding from the peripheral area in the second axial direction.

Images