JP7465670B2 - Holding table mechanism and processing device - Google Patents

Description

The present invention relates to a holding table mechanism and a processing device.

In response to a demand for imaging the side of the workpiece being held on the holding table, a processing device has been proposed that includes a holding table with a holding section made of glass and an imaging camera disposed below the holding table (see, for example, Patent Document 1).

JP 2012-232316 A

The above-mentioned processing device has a problem in that if scratches or foreign matter are present on the holding surface, the scratches or foreign matter will appear in the captured image, making it impossible to perform accurate alignment or kerf checks based on the captured image.

The present invention was made in consideration of these problems, and its purpose is to provide a holding table mechanism and processing device that can prevent alignment, kerf checks, etc. from being unable to be performed accurately.

In order to solve the above-mentioned problems and achieve the object, the holding table mechanism of the present invention is a holding table mechanism having an annular base with an opening in the center, a holding portion made of a transparent material and holding a workpiece, and a frame body surrounding the holding portion, and a detachable table arranged to be freely attached and detached to the annular base, wherein the workpiece held by the holding portion is imaged by an imaging camera through the opening and via the holding portion, the annular base has a protective plate made of a transparent material covering the opening, and the holding portion is formed with a suction port opening into the holding surface of the holding portion, and a suction path having one end connected to the suction port and the other end connected to a suction source .

The processing device of the present invention is characterized by comprising the holding table mechanism, the imaging camera arranged below the holding part for imaging the workpiece held by the holding part, and a processing unit for processing the workpiece held by the holding part.

The present invention has the effect of preventing alignment, kerf checks, etc. from being unable to be performed accurately.

FIG. 1 is a perspective view showing an example of the configuration of a processing device according to a first embodiment. FIG. 2 is a perspective view showing a holding table mechanism and an imaging camera of the processing apparatus shown in FIG. FIG. 3 is an exploded perspective view of the holding table mechanism shown in FIG. FIG. 4 is a side view, partly in section, showing the holding table mechanism shown in FIG. 2 holding a workpiece.

The following describes in detail the form (embodiment) for carrying out the present invention with reference to the drawings. The present invention is not limited to the contents described in the following embodiment. The components described below include those that a person skilled in the art can easily imagine and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Various omissions, substitutions, or modifications of the configuration can be made without departing from the spirit of the present invention.

[Embodiment 1]
A holding table mechanism and a processing apparatus according to a first embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view showing a configuration example of the processing apparatus according to the first embodiment. Fig. 2 is a perspective view showing the holding table mechanism and an imaging camera of the processing apparatus shown in Fig. 1. Fig. 3 is a perspective view showing an exploded view of the holding table mechanism shown in Fig. 2. Fig. 4 is a side view, partly in cross section, showing a state in which the holding table mechanism shown in Fig. 2 holds a workpiece.

The processing device 1 according to the first embodiment is a cutting device that cuts (corresponding to processing) a workpiece 200. The workpiece 200 to be processed by the processing device 1 shown in FIG. 1 is a wafer such as a disk-shaped semiconductor wafer or an optical device wafer, with silicon, sapphire, gallium arsenide, SiC (silicon carbide), or the like as a substrate 201. The workpiece 200 has devices 204 formed in areas partitioned in a lattice pattern by a plurality of streets 203 on the surface 202 of the substrate 201.

The device 204 is, for example, an integrated circuit such as an IC (Integrated Circuit) or an LSI (Large Scale Integration), or an image sensor such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor). In the first embodiment, the workpiece 200 has a metal film 206 formed on a back surface 205 behind the front surface 202 of the substrate 201. Since the workpiece 200 has the metal film 206 formed on the back surface 205, the street 203 cannot be detected even if an image is taken from the back surface 205 side with an infrared camera.

In the first embodiment, the workpiece 200 has its front surface 202 attached to tape 211 with an annular frame 210 attached to its outer periphery, is supported by the annular frame 210, and has the metal film 206 on the back surface 205 facing upward. In the first embodiment, the workpiece 200 has the metal film 206 formed on the back surface 205 of the substrate 201, but in the present invention, the metal film 206 does not have to be formed, and the back surface 205 may be attached to tape 211, and the front surface 202 may face upward.

The processing device 1 shown in FIG. 1 is a cutting device that holds a workpiece 200 on a holding table mechanism 12 of a holding unit 10 and cuts the workpiece 200 along streets 203 with a cutting blade 21 to divide the workpiece into individual devices 204. As shown in FIG. 1, the processing device 1 includes a holding unit 10, a cutting unit 20, a moving unit 30, an upper camera 40, and a control unit 100.

As shown in FIG. 2, the holding unit 10 includes a housing 11 that is moved in the X-axis direction parallel to the horizontal direction by the X-axis moving unit 31 of the moving unit 30, and a holding table mechanism 12 that is rotatable around an axis parallel to the Z-axis direction that runs vertically on the housing 11.

In the first embodiment, the housing 11 includes a lower plate 111 that is moved in the X-axis direction by the X-axis moving unit 31 and is parallel to the horizontal direction, a side plate 112 that stands upright from the outer edge of the lower plate 111, and an upper plate 113 whose outer edge is connected to the upper end of the side plate 112 and is parallel to the lower plate 111.

The holding table mechanism 12 holds the workpiece 200 on the holding surface 143 and is supported by the upper plate 113 so as to be rotatable about its axis. As shown in Figs. 2 and 3, the holding table mechanism 12 includes an annular base 13 having an opening 131 at its center and supported by the upper plate 113 so as to be rotatable about its axis parallel to the Z-axis direction, a detachable table 14 detachably disposed on the annular base 13, and a plurality of frame fixing parts 15 provided around the detachable table 14 fixed to the annular base 13.

As shown in Figs. 3 and 4, the annular base 13 has a disk-shaped protective plate 132 in the opening 131. The protective plate 132 is made of a transparent material such as quartz glass, borosilicate glass, sapphire, calcium fluoride, lithium fluoride, magnesium fluoride, etc. In the present invention, the term "transparent" refers to being transparent to visible light. The protective plate 132 is formed to a constant thickness, and its outer edge is attached to the entire inner peripheral surface of the opening 131 to cover the opening 131. In the first embodiment, the protective plate 132 is attached to the lower end of the opening 131, and its lower surface is arranged on the same plane as the lower surface of the annular base 13, but in the present invention, the position of the protective plate 132 relative to the annular base 13 is not limited to this, and may be arranged, for example, in the center of the opening 131 in the Z-axis direction.

The removable table 14 has a holding portion 141 made of a transparent material that holds the workpiece 200, and a frame body 142 that surrounds the holding portion 141.

The holding portion 141 is made of a transparent material such as quartz glass, borosilicate glass, sapphire, calcium fluoride, lithium fluoride, or magnesium fluoride, and its upper surface is a holding surface 143 that holds the workpiece 200. In the first embodiment, the front surface 202 side of the workpiece 200 is placed on the holding surface 143 of the holding portion 141 via tape 211. The holding portion 141 is formed in a disk shape with an outer diameter approximately equal to the inner diameter of the opening 131 and a constant thickness.

The holding portion 141 is formed with a suction groove 144, which is a suction port that opens into the holding surface 143, and a suction passage 146, one end of which is connected to the suction groove 144 and the other end of which is connected to a suction source 145. In the first embodiment, a plurality of suction grooves 144 are formed in the holding surface 143, and in the first embodiment, the plurality of suction grooves 144 are formed in circles with different diameters and are arranged concentrically on the outer edge of the holding surface 143. The suction passage 146 is a flow path that is capable of passing gas inward by penetrating the holding portion 141 and has one end connected to the plurality of suction grooves 144.

The frame 142 is made of stainless steel or the like, and is formed in a circular ring shape with an inner diameter equal to the outer diameter of the holding portion 141. The outer edge of the holding portion 141 is fixed to the inner peripheral surface of the frame 142, and the upper surface is disposed on the same plane as the holding surface 143. In the first embodiment, the detachable table 14 is configured such that the frame 142 is placed on the mounting area 133 (shown in FIG. 3) of the inner edge of the annular base 13, and the frame 142 is fixed to the annular base 13 by screws (not shown).

In the first embodiment, the detachable table 14 is detachably attached to the annular base 13 by attaching and detaching a screw (not shown). However, in the present invention, the method for detaching the detachable table 14 from the annular base 13 is not limited to the screw, and the detachable table 14 may be fixed to the annular base 13 by, for example, sucking a hole that opens on the upper surface of the annular base 13 and is blocked by a frame body 142 that is overlapped on the upper surface of the annular base 13 from a suction source. When the detachable table 14 is fixed to the annular base 13 by sucking a hole that opens on the upper surface of the annular base 13 and is blocked by a frame body 142 that is overlapped on the upper surface of the annular base 13 from a suction source, the suction source is switched between operating and stopping, so that the detachable table 14 is detachably attached to the annular base 13. In the first embodiment, the annular base 13 and the detachable table 14 are arranged in coaxial positions.

The frame fixing parts 15 are arranged at intervals in the circumferential direction on the outer edge of the annular base 13, and include frame support parts 151 on whose upper surface the annular frame 210 is placed, and vacuum pads 152 that suction-hold the annular frame 210 placed on the upper surface of the frame support parts 151. The vacuum pads 152 are connected to a suction source (not shown).

The holding table mechanism 12 has the suction groove 144 and the vacuum pad 152 connected to a vacuum suction source (not shown), and is sucked by the vacuum suction source to hold the workpiece 200 placed on the holding surface 143 to the holding surface 143 and to hold the annular frame 210 placed on the upper surface of the frame support part 151 to the frame fixing part 15 by suction. In the first embodiment, the holding table mechanism 12 holds the surface 202 side of the workpiece 200 to the holding surface 143 by suction via the tape 211, and holds the annular frame 210 to the frame fixing part 15 by suction via the tape 211. In the first embodiment, the holding unit 10 has a circular through hole 114 in the upper plate 113 of the housing 11. The through hole 114 is arranged in a position where the annular base 13 of the holding table mechanism 12 and the detachable table 14 are coaxial with each other.

The moving unit 30 includes an X-axis moving unit 31 which is a processing feed unit shown in FIG. 2, a Y-axis moving unit 32 which is an indexing feed unit shown in FIG. 1, a Z-axis moving unit 33 which is a cutting feed unit shown in FIG. 1, and a rotational moving unit 34 which rotates the holding table mechanism 12 shown in FIG. 2 around an axis parallel to the Z-axis direction.

The X-axis moving unit 31 moves the lower plate 111 of the housing 11 of the holding unit 10 in the X-axis direction, thereby moving the holding table mechanism 12 and the cutting unit 20 relatively in the X-axis direction. The X-axis moving unit 31 moves the holding table mechanism 12 in the X-axis direction across the loading/unloading area 4 where the workpiece 200 is loaded and unloaded from the holding table mechanism 12, and the processing area 5 where the workpiece 200 held by the holding table mechanism 12 is cut. The Y-axis moving unit 32 moves the cutting unit 20 in the Y-axis direction, which is parallel to the horizontal direction and perpendicular to the X-axis direction, thereby moving the holding table mechanism 12 and the cutting unit 20 relatively in the Y-axis direction. The Z-axis moving unit 33 moves the cutting unit 20 in the Z-axis direction, thereby moving the holding table mechanism 12 and the cutting unit 20 relatively in the Z-axis direction.

The X-axis moving unit 31, the Y-axis moving unit 32, and the Z-axis moving unit 33 each include a well-known ball screw that is rotatable about its axis, a well-known motor that rotates the ball screw about its axis, and a well-known guide rail that supports the holding table mechanism 12 or the cutting unit 20 so that it can move freely in the X-axis, Y-axis, or Z-axis direction.

The rotational movement unit 34 rotates the holding table mechanism 12 around an axis parallel to the Z-axis direction. The rotational movement unit 34 rotates the holding table mechanism 12 around the axis in a range of more than 180 degrees and less than 360 degrees. The rotational movement unit 34 includes a motor 341 fixed to the side plate 112 of the housing 11, a pulley 342 connected to the output shaft of the motor 341, and a belt 343 wound around the outer periphery of the annular base 13 of the holding table mechanism 12 and rotated around the axis by the pulley 342. When the rotational movement unit 34 rotates the motor 341, it rotates the holding table mechanism 12 around the axis via the pulley 342 and the belt 343. In addition, in the first embodiment, the rotational movement unit 34 can rotate the holding table mechanism 12 220 degrees in both one direction around the axis and the other direction opposite to the one direction.

The cutting unit 20 is a processing unit that uses a cutting blade 21 to cut the workpiece 200 held by the holding portion 141 of the holding table mechanism 12. The cutting unit 20 is provided so as to be movable in the Y-axis direction by the Y-axis moving unit 32 relative to the workpiece 200 held by the holding portion 141 of the holding table mechanism 12, and is provided so as to be movable in the Z-axis direction by the Z-axis moving unit 33. The cutting unit 20 is provided on a support frame 3 that stands upright from the device main body 2, via the Y-axis moving unit 32 and the Z-axis moving unit 33, etc.

The cutting unit 20 can position the cutting blade 21 at any position on the holding surface 143 of the holding table mechanism 12 by the Y-axis moving unit 32 and the Z-axis moving unit 33. The cutting unit 20 includes the cutting blade 21, a spindle housing 22 that is movable in the Y-axis and Z-axis directions by the Y-axis moving unit 32 and the Z-axis moving unit 33, a spindle 23 that is rotatable about its axis on the spindle housing 22 and is rotated by a motor, and has the cutting blade 21 attached to its tip, and a cutting water nozzle 24.

The cutting blade 21 is an extremely thin cutting wheel having a roughly ring shape, which cuts the workpiece 200 held by the holding table mechanism 12. In the first embodiment, the cutting blade 21 is a so-called hub blade that includes a circular base and a circular cutting blade disposed on the outer periphery of the circular base and cuts the workpiece 200. The cutting blade is made of abrasive grains such as diamond or CBN (Cubic Boron Nitride) and a bonding material such as metal or resin, and is formed to a predetermined thickness. In the present invention, the cutting blade 21 may be a so-called washer blade that is made of only the cutting blade.

The spindle 23 is rotated around its axis by a motor, causing the cutting blade 21 to rotate around its axis. The axes of the cutting blade 21 and spindle 23 of the cutting unit 20 are parallel to the Y-axis direction. The cutting water nozzle 24 is provided at the tip of the spindle housing 22, and supplies cutting water to the workpiece 200 and the cutting blade 21 while the cutting blade 21 is cutting the workpiece 200.

The upper camera 40 is fixed to the cutting unit 20 so as to move integrally with the cutting unit 20. The upper camera 40 has multiple imaging elements that capture images of the workpiece 200 held by the holding table mechanism 12 from above. The imaging elements are, for example, CCD (Charge-Coupled Device) imaging elements or CMOS (Complementary MOS) imaging elements. The upper camera 40 captures an image of the workpiece 200 held by the holding portion 141 of the holding table mechanism 12, and outputs the obtained image to the control unit 100.

As shown in FIG. 2, the processing device 1 also includes an imaging camera 50 that is disposed below the holding portion 141 of the holding table mechanism 12 and images the surface 202, which is the held surface of the workpiece 200 held by the holding portion 141, through the holding portion 123. The imaging camera 50 images the surface 202 side of the workpiece 200 held by the holding portion 141 of the holding table mechanism 12 from below the workpiece 200 through the holding portion 123. For this reason, the workpiece 200 held by the holding portion 141 is imaged by the imaging camera 50 through the opening 131 and the holding portion 141.

2 shows the imaging camera 50 next to the holding unit 10 in the Y-axis direction. However, in the actual processing device 1, the imaging camera 50 is arranged below the holding portion 141 of the holding table mechanism 12 as shown in FIG. 4. The imaging camera 50 is arranged so as to be movable in the Y-axis direction by the second Y-axis moving unit 35 provided on the device main body 2, and is arranged so as to be movable in the Z-axis direction by the second Z-axis moving unit 38 provided on the erected column 37 erected from the moving plate 36 moved in the Y-axis direction by the second Y-axis moving unit 35. In the first embodiment, the imaging camera 50 is attached to one end of a horizontally extending member 39, the other end of which is attached to a lifting member movable in the Z-axis direction by the second Z-axis moving unit 38.

The second Y-axis moving unit 35 and the second Z-axis moving unit 38 are equipped with a well-known ball screw that is rotatable around its axis, a well-known motor that rotates the ball screw around its axis, and a well-known guide rail that supports the moving plate or the imaging camera 50 so that it can move freely in the Y-axis or Z-axis direction.

The imaging camera 50 is equipped with an imaging element that captures an image of the workpiece 200 held by the holding table mechanism 12 from below through the holding portion 123. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary MOS) imaging element. The imaging camera 50 captures an image of the workpiece 200 held by the holding table mechanism 12 and outputs the obtained image to the control unit 100.

The processing device 1 also includes an X-axis position detection unit 51 (shown in FIG. 2) for detecting the position of the holding table mechanism 12 in the X-axis direction, a Y-axis position detection unit (not shown) for detecting the position of the cutting unit 20 in the Y-axis direction, and a Z-axis position detection unit for detecting the position of the cutting unit 20 in the Z-axis direction. The X-axis position detection unit 51 and the Y-axis position detection unit can be configured with a linear scale parallel to the X-axis direction or the Y-axis direction, and a reading head. The Z-axis position detection unit detects the position of the cutting unit 20 in the Z-axis direction with motor pulses. The X-axis position detection unit 51, the Y-axis position detection unit, and the Z-axis position detection unit output the position of the holding table mechanism 12 in the X-axis direction and the position of the cutting unit 20 in the Y-axis direction or the Z-axis direction to the control unit 100.

The processing device 1 also includes a second Y-axis position detection unit 55 (shown in FIG. 2) that detects the position of the imaging camera 50 in the Y-axis direction. The second Y-axis position detection unit 55 can be configured with a linear scale parallel to the Y-axis direction and a reading head. The second Y-axis position detection unit 55 outputs the position of the imaging camera 50 in the X-axis direction and the position of the cutting unit 20 in the Y-axis direction or the Z-axis direction to the control unit 100. The positions of the holding table mechanism 12, the cutting unit 20, and the imaging camera in each axis direction detected by each position detection unit 51, 55 are determined based on a predetermined reference position of the processing device 1. That is, in the processing device 1 according to the first embodiment, each position is determined based on a predetermined reference position.

The processing device 1 also includes a cassette elevator 91 on which a cassette 90 that contains multiple workpieces 200 before and after cutting is placed and which moves the cassette 90 in the Z-axis direction, a cleaning unit 92 that cleans the workpieces 200 after cutting, and a transport unit (not shown) that moves the workpieces 200 in and out of the cassette 90 and transports the workpieces 200.

The control unit 100 controls each of the above-mentioned components of the processing device 1, causing the processing device 1 to perform processing operations on the workpiece 200. The control unit 100 is a computer having an arithmetic processing device having a microprocessor such as a CPU (central processing unit), a storage device having a memory such as a ROM (read only memory) or a RAM (random access memory), and an input/output interface device. The arithmetic processing device of the control unit 100 performs arithmetic processing according to a computer program stored in the storage device, and outputs control signals for controlling the processing device 1 to the above-mentioned components of the processing device 1 via the input/output interface device.

The processing device 1 is also connected to a display unit (not shown) that is connected to the control unit 100 and is configured with a liquid crystal display device or the like for displaying the status of the processing operation and images, and an input unit that is connected to the control unit 100 and is used by an operator to register processing content information, etc. In the first embodiment, the input unit is configured with at least one of a touch panel provided on the display unit and an external input device such as a keyboard.

The processing device 1 having the above-mentioned configuration starts a processing operation when the operator registers processing content information in the control unit 100, a cassette 90 containing multiple workpieces 200 before cutting is placed in the cassette elevator 91, and the control unit 100 receives an instruction to start the processing operation from the operator. In the processing operation, the control unit 100 controls the transport unit to take out one workpiece 200 from the cassette 90 and place it on the holding surface 143 of the holding table mechanism 12 positioned in the loading/unloading area 4. In the processing device 1, the control unit 100 controls the vacuum suction source to suction and hold the workpiece 200 on the holding surface 143 via the tape 211, and suction and hold the annular frame 210 on the frame support part 151 via the tape 211.

In the machining operation, the control unit 100 of the machining device 1 controls the X-axis movement unit 31 and the second Y-axis movement unit 35 to position the imaging camera 50 below the workpiece 200 held by the holding portion 141 of the holding table mechanism 12, as shown in FIG. 4. In the machining device 1, the control unit 100 uses the imaging camera 50 to image the workpiece 200 from below through the holding portion 123, and obtains an image to perform alignment to align the workpiece 200 with the cutting blade 21.

In the machining operation, the control unit 100 of the machining device 1 detects the street 203 from the image captured by the imaging camera 50 and performs alignment. In the machining operation, the control unit 100 of the machining device 1 controls the X-axis moving unit 31 to move the holding table mechanism 12 to the machining area 5, and the control unit 100 controls the moving unit 30 and the cutting unit 20 to relatively move the holding table mechanism 12 and the cutting blade 21 of the cutting unit 20 along the street 203, and while supplying cutting water from the cutting water nozzle 24, cuts the cutting blade 21 into the street 203 until it reaches the tape 211, thereby cutting the workpiece 200 along the street 203.

During the machining operation, the machining device 1 determines whether the control unit 100 has cut a predetermined number of streets 203 since the previous kerf check. The kerf check is to check the machining state of the workpiece 200 to see whether the deviation of the cutting groove 400 formed by cutting from the desired position and the size of chipping occurring on both edges of the cutting groove are within a predetermined range.

When the control unit 100 of the processing device 1 determines that a predetermined number of streets 203 have been cut, the control unit 100 controls the X-axis movement unit 31 and the second Y-axis movement unit 35 to position the imaging camera 50 below the workpiece 200 held by the holding table mechanism 12, as shown in FIG. 4. In the processing device 1, the control unit 100 uses the imaging camera 50 to capture an image of the workpiece 200 from below through the holding portion 123, and obtains an image for performing a kerf check.

In the machining operation, the control unit 100 of the machining device 1 checks whether the deviation of the cut groove formed in the workpiece 200 from the desired position and the size of chipping occurring on both edges of the cut groove 400 are within a predetermined range, stores the confirmation result, and performs a kerf check. In the present invention, the machining device 1 may perform a kerf check based on an image acquired by capturing an image of the workpiece 200 with the upper camera 40.

In the machining operation, when the control unit 100 cuts all of the streets 203 of the workpiece 200 held by the holding table mechanism 12, the machining device 1 causes the X-axis moving unit 31 to move the holding table mechanism 12 to the loading/unloading area 4, and controls the vacuum suction source to stop suction holding of the workpiece 200 and the annular frame 210. In the machining device 1, the control unit 100 controls the transport unit to transport the workpiece 200 to the cleaning unit 92, where it is cleaned and then stored in the cassette 90. When the machining device 1 cuts all of the workpieces 200 in the cassette 90, the machining operation ends.

The holding table mechanism 12 according to the first embodiment described above includes an annular base 13 having an opening 131 in the center and a detachable table 14 that is detachably attached to the annular base 13. Therefore, even if the holding surface 143 is scratched or has foreign matter, the detachable table 14 can be replaced. By replacing the detachable table 14, scratches on the holding surface 143 and foreign matter can be prevented from being captured by the imaging camera 50. As a result, the holding table mechanism 12 has the effect of preventing alignment, kerf checks, and the like from being unable to be performed accurately.

In addition, if a foreign object falls into the opening 131 while the detachable table 14 is being removed, there is a risk of scratches or foreign objects adhering to the imaging camera 50, and if the fallen object is a screw or a jig, it may damage the imaging camera 50. However, the holding table mechanism 12 further includes a protective plate 132 that covers the opening 131, which can prevent foreign objects from adhering to or damaging the imaging camera 50.

In addition, since the processing device 1 according to the first embodiment is equipped with the holding table mechanism 12 described above, it has the effect of preventing alignment, kerf checks, etc. from being unable to be performed accurately.

The present invention is not limited to the above embodiment. In other words, various modifications can be made without departing from the gist of the present invention. In the above embodiment, the processing device 1 is a cutting unit 20 that cuts the workpiece 200, but the present invention is not limited to the cutting unit 20 and may be a laser beam irradiation unit equipped with a laser oscillator, a focusing lens, etc. In other words, the processing device in the present invention may be a laser processing device.

REFERENCE SIGNS LIST 1 Processing device 12 Holding table mechanism 13 Annular base 14 Detachable table 20 Cutting unit (processing unit)
50: imaging camera 131: opening 132: protective plate 141: holding portion 142: frame 143: holding surface 144: suction groove (suction port)
145 Suction source 146 Suction path 200 Work

Claims (2)

A holding table mechanism,
an annular base having a central opening;
a detachable table including a holding portion made of a transparent member and configured to hold a workpiece, and a frame surrounding the holding portion, the detachable table being detachably disposed on the annular base;
The workpiece held by the holding part is imaged by an imaging camera through the opening and the holding part,
The annular base has a protective plate made of a transparent member that covers the opening,
The holding table mechanism has a suction port that opens into the holding surface of the holding portion, and a suction path that has one end communicating with the suction port and the other end connected to a suction source, formed in the holding portion. The holding table mechanism according to claim 1 ;
The imaging camera is disposed below the holding portion and captures an image of the workpiece held by the holding portion;
and a processing unit that processes the workpiece held by the holding portion.

Images