JP7472601B2 - Method for manufacturing substrate with wiring electrodes - Google Patents

Description

The present invention relates to a method for manufacturing a substrate with wiring electrodes.

In recent years, touch panels have come into widespread use as an input method. A touch panel is composed of a display unit such as a liquid crystal panel and a touch panel sensor that detects information input at a specific position. Touch panel types are broadly classified into resistive film type, capacitive type, optical type, electromagnetic induction type, ultrasonic type, etc., depending on the method of detecting the input position. Among these, capacitive type touch panels are widely used due to their optical brightness, excellent design, simple structure, and excellent functionality.

A capacitive touch panel sensor has a second electrode that is perpendicular to a first electrode via an insulating layer, and outputs the contact position obtained by applying a voltage to the electrodes on the touch panel surface and detecting the change in capacitance when a conductive object such as a finger touches the electrode, as a signal. Known examples of capacitive touch panel sensors include a structure in which electrodes and external connection terminals are formed on a pair of opposing transparent substrates, and a structure in which electrodes and external connection terminals are formed on both sides of a single transparent substrate. Transparent electrodes using ITO electrodes or the like have generally been used as wiring electrodes for touch panel sensors in order to make the wiring electrodes less visible, but in recent years, opaque wiring electrodes using metal materials have become more common due to increased sensitivity and larger screens.

Touch panel sensors with opaque wiring electrodes made of metal materials have a problem in that the opaque wiring electrodes are visible due to their metallic luster. As a method for making the opaque wiring electrodes less visible, as proposed in Patent Document 1, a black positive light-shielding material is applied onto the opaque wiring electrodes, and the opaque wiring electrodes are exposed to light using the opaque wiring electrodes as a mask, and then developed to form a light-shielding layer on the opaque wiring electrodes.

International Publication No. 2018/168325

However, in the method of forming a light-shielding layer described in Patent Document 1, the light-shielding layer is formed over the entire opaque wiring electrode portion, so that the light-shielding layer is also formed in places where it is necessary to ensure electrical continuity with external elements, such as terminal portions, which causes problems such as making it impossible to ensure electrical continuity. Therefore, when trying to remove the light-shielding layer from a portion where it is desired to expose the opaque wiring electrode, such as a terminal portion, an additional operation such as flipping the substrate and re-exposing and developing is required, which requires steps and time, posing an issue with mass productivity.

The present invention aims to reduce the time required to form a light-shielding layer compared to conventional manufacturing methods when manufacturing a substrate with wiring electrodes having a light-shielding layer, even when it is necessary to expose part of the wiring electrodes.

To solve the above problems, the present invention mainly has the following configuration.

forming a first opaque wiring electrode on a transparent substrate;
forming an insulating layer on the first opaque wiring electrode;
forming a second opaque wiring electrode on the insulating layer;
A step of applying a positive photosensitive composition to the second opaque wiring electrode forming surface;
a step of exposing the positive photosensitive composition from a coated surface side of the positive photosensitive composition using an exposure mask;
a step of exposing the positive photosensitive composition from a surface opposite to the coated surface using the first opaque wiring electrode and the second opaque wiring electrode as a mask;
and developing the positive photosensitive composition exposed from both sides to form a light-shielding layer in desired locations on the first opaque wiring electrode and the second opaque wiring electrode.

According to the present invention, when manufacturing a substrate with a wiring electrode having a light-shielding layer, even in cases where it is necessary to expose a portion of the wiring electrode, the time required for forming the light-shielding layer can be shortened as compared to conventional manufacturing methods.

1 is a schematic diagram showing a substrate with wiring electrodes according to a first embodiment. 1A to 1C are schematic diagrams illustrating a method for manufacturing a substrate with wiring electrodes according to a first embodiment. FIG. 4 is a schematic diagram showing a substrate with wiring electrodes according to a second embodiment. FIG. 11 is a schematic diagram showing a substrate with wiring electrodes according to a third embodiment. FIG. 13 is a schematic diagram showing a substrate with wiring electrodes according to a fourth embodiment. FIG. 11 is a top view of a substrate with wiring electrodes according to a second embodiment.

Below, a description will be given of a form (hereinafter, "embodiment") for carrying out the method for manufacturing a substrate with wiring electrodes according to the present invention with reference to the drawings. Note that the drawings are schematic. Furthermore, the present invention is not limited to the embodiment described below.

[First embodiment]
Fig. 1 is a schematic diagram of a substrate with a wiring electrode having an opaque wiring electrode 2 on a transparent substrate 1 and a light-shielding layer 3 at a desired portion on the opaque wiring electrode 2. Fig. 2 is a schematic diagram of an example of a method for manufacturing a substrate with a wiring electrode according to this embodiment.

The method for producing a substrate with wiring electrodes according to this embodiment includes the steps of:
A step of forming an opaque wiring electrode on a transparent substrate (FIG. 2(a));
A step of applying a positive-type photosensitive composition onto the surface on which the opaque wiring electrode is formed (FIG. 2(b));
a step of exposing the positive-type photosensitive composition from the coated surface side of the positive-type photosensitive composition using an exposure mask (FIG. 2(c));
a step of exposing the positive photosensitive composition from the side opposite to the coated surface using the opaque wiring electrode as a mask (FIG. 2(d));
and a step of developing the positive photosensitive composition exposed from both sides to form a light-shielding layer in a desired portion on the opaque wiring electrode (FIG. 2(e)).

Here, "desired areas on the opaque wiring electrode" refers to areas where the opaque wiring electrode is not desired to be visible. For example, when manufacturing a touch panel sensor, areas where the opaque wiring electrode is not desired to be visible include areas that have touch panel functions. On the other hand, there is no need to provide a light-shielding layer in areas around the screen where the opaque wiring electrode is unlikely to be visible, areas where electrical continuity with external elements must be ensured, areas where alignment marks are formed, and the like.

<Step of forming opaque wiring electrode>
The method for manufacturing a substrate with wiring electrodes according to this embodiment includes a step of forming opaque wiring electrodes on a transparent substrate.

Methods for forming opaque wiring electrodes include, for example, a method of forming a pattern by photolithography using a photosensitive conductive composition described below, a method of forming a pattern by screen printing, gravure printing, inkjet, etc. using a conductive composition (conductive paste), and a method of forming a film of a metal, a metal composite, a composite of a metal and a metal compound, a metal alloy, etc., and forming it by photolithography using a resist. Among these, the method of forming by photolithography using a photosensitive conductive composition is preferred because it is possible to form fine wiring.

The transparent substrate is preferably transparent to the irradiation energy of the exposure light. Specifically, the transmittance of the transparent substrate at a wavelength of 365 nm is preferably 50% or more, and more preferably 80% or more. By making the transmittance at a wavelength of 365 nm at 50% or more, the positive photosensitive composition can be efficiently exposed. The transmittance of the transparent substrate at a wavelength of 365 nm can be measured using an ultraviolet-visible spectrophotometer (U-3310, manufactured by Hitachi High-Technologies Corporation).

Examples of transparent substrates include inflexible and flexible transparent substrates. Examples of inflexible transparent substrates include glass substrates such as quartz glass, soda glass, chemically strengthened glass, and Pyrex (registered trademark) glass, as well as synthetic quartz plates, epoxy resin substrates, polyetherimide resin substrates, polyetherketone resin substrates, and polysulfone resin substrates.

Examples of flexible transparent substrates include transparent films made of resins such as polyethylene terephthalate film (hereinafter referred to as "PET film"), cycloolefin polymer film, polyimide film, polyester film, and aramid film, as well as optical resin plates. These may be used in multiple layers, for example, by bonding multiple transparent substrates together with an adhesive layer. In addition, the surfaces of these transparent substrates may have an insulating layer.

The thickness of the transparent substrate is appropriately selected according to the material within the range that can stably support the opaque wiring electrode and has the aforementioned transparency. For example, from the viewpoint of more stably supporting the opaque wiring electrode, in the case of a non-flexible transparent substrate such as glass, the thickness is preferably 0.3 mm or more, and in the case of a flexible transparent substrate such as a PET film, the thickness is preferably 25 μm or more. On the other hand, from the viewpoint of further improving the transparency of the exposure light, in the case of a non-flexible transparent substrate such as glass, the thickness is preferably 1.5 mm or less, and in the case of a flexible transparent substrate such as a PET film, the thickness is preferably 300 μm or less.

It is preferable that the opaque wiring electrode has a light-shielding property against the irradiation energy of the exposure light. Specifically, the transmittance of the opaque wiring electrode at a wavelength of 365 nm is preferably 20% or less, and more preferably 10% or less. By making the transmittance of light at a wavelength of 365 nm 20% or less, the effect of the opaque wiring electrode as a mask is increased, and it becomes easier to form a light-shielding layer in the area corresponding to the opaque wiring electrode. The transmittance can be measured by a microsurface spectrophotometer (VSS 400: manufactured by Nippon Denshoku Kogyo Co., Ltd.) for opaque wiring electrodes of 0.1 mm square or more on the transparent substrate.

Materials constituting the opaque wiring electrode include, for example, metals such as silver, gold, copper, platinum, lead, tin, nickel, aluminum, tungsten, molybdenum, chromium, titanium, and indium, as well as conductive particles of alloys of these metals. Among these, silver, copper, and gold are preferred from the viewpoint of electrical conductivity.

As the conductor, it is preferable to use conductive particles, the average particle size of which is preferably 0.01 μm or more from the viewpoint of improving the dispersibility of the conductive particles, and is preferably 1.0 μm or less from the viewpoint of making the ends of the pattern of the opaque wiring electrode sharp.

The opaque wiring electrode may contain an organic component in addition to the conductive particles. The opaque wiring electrode may be formed, for example, from a cured product of a photosensitive conductive composition containing conductive particles, an alkali-soluble resin, and a photopolymerization initiator. In this case, the opaque wiring electrode contains the photopolymerization initiator and/or its photodecomposition product. The photosensitive conductive composition may contain additives such as a heat curing agent and a leveling agent, as necessary.

Examples of the pattern shape of the opaque wiring electrode include a mesh shape and a stripe shape. Examples of the mesh shape include a lattice shape whose unit shapes are triangles, squares, polygons, circles, etc., or a lattice shape consisting of a combination of these unit shapes. Among these, the mesh shape is preferred from the viewpoint of making the conductivity of the pattern uniform. It is more preferable that the opaque wiring electrode is a metal mesh made of the above-mentioned metal and has a mesh-like pattern.

From the viewpoint of further improving the light blocking properties, the thickness of the opaque wiring electrode is preferably 0.01 μm or more, more preferably 0.05 μm or more, and even more preferably 0.1 μm or more. On the other hand, from the viewpoint of forming fine wiring, the thickness of the opaque wiring electrode is preferably 10 μm or less, more preferably 5 μm or less, and even more preferably 3 μm or less.

The line width of the wiring electrode is preferably 1 to 10 μm. From the viewpoint of improving the conductivity, the line width of the wiring electrode is preferably 1 μm or more, more preferably 1.5 μm or more, and even more preferably 2 μm or more. On the other hand, from the viewpoint of making the wiring electrode less visible, the line width of the wiring electrode is preferably 10 μm or less, preferably 7 μm or less, and even more preferably 6 μm or less.

<Step of applying positive photosensitive composition>
The method for producing a substrate with wiring electrodes according to this embodiment includes a step of applying a positive-type photosensitive composition onto a surface on which an opaque wiring electrode is to be formed.

A positive photosensitive composition is a composition that has positive photosensitivity in which the light-irradiated portion dissolves in a developer. For example, it is preferable that the composition contains a photosensitizer (dissolution inhibitor) and an alkali-soluble resin.

Since the positive-type photosensitive composition is used to form a light-shielding layer as described below, it is preferable that the composition contains, for example, a colorant.

Colorants include, for example, dyes, organic pigments, and inorganic pigments. Two or more of these may be included.

Examples of dyes include oil-soluble dyes, disperse dyes, reactive dyes, acid dyes, and direct dyes. Examples of the skeletal structure of the dye include anthraquinones, azos, phthalocyanines, methines, oxazines, and metal-containing complex salts thereof. Specific examples of dyes include "SUMIPLAST (registered trademark)" dyes (trade name, manufactured by Sumitomo Chemical Co., Ltd.), Zapon and "Neozapon (registered trademark)" (trade names, manufactured by BASF Corporation), Kayaset and Kayakalan dyes (trade names, manufactured by Nippon Kayaku Co., Ltd.), Valifastcolors dyes (trade name, manufactured by Orient Chemical Industries Co., Ltd.), and Savinyl (trade name, manufactured by Clariant).

As an organic pigment, carbon black is preferred. Specific examples of carbon black include furnace black, thermal black, channel black, and acetylene black.

Examples of inorganic pigments include manganese oxide, titanium oxide, titanium oxynitride, chromium oxide, vanadium oxide, iron oxide, cobalt oxide, and niobium oxide.

The content of the colorant in the positive-type photosensitive light-shielding composition is preferably 1% by mass or more, more preferably 2% by mass or more, based on the total solid content, from the viewpoint of further reducing the reflectance of the light-shielding layer and making the opaque wiring electrode less visible. On the other hand, from the viewpoint of effectively promoting the photoreaction of the positive-type photosensitive light-shielding composition and suppressing residues, the content of the colorant is preferably 30% by mass or less, more preferably 20% by mass or less, based on the total solid content.

As the photosensitizer (dissolution inhibitor), one that generates an acid by exposure energy is preferred. Examples include diazodisulfone compounds, triphenylsulfonium compounds, and quinone diazide compounds. Examples of diazodisulfone compounds include bis(cyclohexylsulfonyl)diazomethane, bis(tertiarybutylsulfonyl)diazomethane, and bis(4-methylphenylsulfonyl)diazomethane. Examples of triphenylsulfonium compounds include diphenyl-4-methylphenylsulfonium trifluoromethanesulfonate, diphenyl-2,4,6-trimethylphenylsulfonium p-toluenesulfonate, and diphenyl(4-methoxyphenyl)sulfonium trifluoromethanesulfonate. Examples of quinone diazide compounds include those in which the sulfonic acid of quinone diazide is bonded to a polyhydroxy compound via an ester bond, those in which the sulfonic acid of quinone diazide is bonded to a polyamino compound via a sulfonamide bond, and those in which the sulfonic acid of quinone diazide is bonded to a polyhydroxy polyamino compound via an ester bond and/or a sulfonamide bond. Two or more of these may be contained.

The content of the photosensitizer (dissolution inhibitor) in the positive photosensitive composition is preferably 5 parts by mass or more, more preferably 15 parts by mass or more, per 100 parts by mass of the alkali-soluble resin, from the viewpoint of suppressing the dissolution of the alkali-soluble resin in the unexposed parts. On the other hand, from the viewpoint of suppressing excessive light absorption by the photosensitizer (dissolution inhibitor) in the exposed parts and suppressing the generation of residues, the content of the photosensitizer (dissolution inhibitor) is preferably 40 parts by mass or less, more preferably 30 parts by mass or less, per 100 parts by mass of the alkali-soluble resin.

Examples of alkali-soluble resins include resins having hydroxyl groups and/or carboxyl groups.

Examples of resins having hydroxyl groups include novolac resins such as phenol novolac resins having phenolic hydroxyl groups and cresol novolac resins, polymers of monomers having hydroxyl groups, and copolymers of monomers having hydroxyl groups with styrene, acrylonitrile, acrylic monomers, etc.

Examples of monomers having a hydroxy group include monomers having a phenolic hydroxy group such as 4-hydroxystyrene and hydroxyphenyl (meth)acrylate; and monomers having a non-phenolic hydroxy group such as 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-methyl-3-hydroxybutyl (meth)acrylate, 1,1-dimethyl-3-hydroxybutyl (meth)acrylate, 1,3-dimethyl-3-hydroxybutyl (meth)acrylate, 2,2,4-trimethyl-3-hydroxypentyl (meth)acrylate, 2-ethyl-3-hydroxyhexyl (meth)acrylate, glycerin mono(meth)acrylate, polypropylene glycol mono(meth)acrylate, and polyethylene glycol mono(meth)acrylate.

Examples of resins having carboxyl groups include carboxylic acid-modified epoxy resins, carboxylic acid-modified phenolic resins, polyamic acids, carboxylic acid-modified siloxane resins, polymers of monomers having carboxyl groups, and copolymers of monomers having carboxyl groups with styrene, acrylonitrile, acrylic monomers, etc.

Examples of monomers having a carboxyl group include acrylic acid, methacrylic acid, maleic acid, fumaric acid, crotonic acid, itaconic acid, citraconic acid, and cinnamic acid.

Examples of resins having a hydroxyl group and a carboxyl group include copolymers of a monomer having a hydroxyl group and a monomer having a carboxyl group, and copolymers of a monomer having a hydroxyl group, a monomer having a carboxyl group, and styrene, acrylonitrile, an acrylic monomer, or the like. Two or more of these may be contained.

Among them, resins containing phenolic hydroxyl groups and carboxyl groups are preferred. When a quinone diazide compound is used as a photosensitizer (dissolution inhibitor), the phenolic hydroxyl group and the quinone diazide compound form hydrogen bonds by containing a phenolic hydroxyl group, and the solubility of the unexposed portion of the positive photosensitive composition layer in the developer can be reduced, and the difference in solubility between the unexposed portion and the exposed portion can be increased, allowing the development margin to be expanded. Furthermore, the inclusion of a carboxyl group improves the solubility in the developer, and the development time can be easily adjusted depending on the content of the carboxyl group.

The acid value of the alkali-soluble resin having a carboxyl group is preferably 50 mgKOH/g or more from the viewpoint of solubility in the developer, and is preferably 250 mgKOH/g or less from the viewpoint of suppressing excessive dissolution of the unexposed areas. The acid value of the alkali-soluble resin having a carboxyl group can be measured in accordance with JIS K 0070 (1992).

The positive photosensitive composition may contain a thermosetting compound. By containing a thermosetting compound, the hardness of the light-shielding layer is improved, which can suppress chipping or peeling due to contact with other members and improve adhesion to the opaque wiring electrode. Examples of the thermosetting compound include monomers, oligomers, or polymers having an epoxy group.

The positive photosensitive composition preferably contains a solvent, which allows the viscosity of the composition to be adjusted to a desired range. Examples of the solvent include N,N-dimethylacetamide, N,N-dimethylformamide, N-methyl-2-pyrrolidone, 2-pyrrolidone, dimethylimidazolidinone, dimethylsulfoxide, diethylene glycol monoethyl ether, diethylene glycol monoethyl ether acetate, diethylene glycol monomethyl ether acetate, γ-butyrolactone, ethyl lactate, 1-methoxy-2-propanol, ethylene glycol mono-n-propyl ether, diacetone alcohol, tetrahydrofurfuryl alcohol, and propylene glycol monomethyl ether acetate. Two or more of these may be contained.

The positive photosensitive composition may contain a plasticizer, a leveling agent, a surfactant, a silane coupling agent, an antifoaming agent, a stabilizer, etc., to the extent that the desired properties are not impaired. Examples of the plasticizer include dibutyl phthalate, dioctyl phthalate, polyethylene glycol, and glycerin. Examples of the leveling agent include special vinyl polymers and special acrylic polymers. Examples of the silane coupling agent include methyltrimethoxysilane, dimethyldiethoxysilane, phenyltriethoxysilane, hexamethyldisilazane, 3-methacryloxypropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, and vinyltrimethoxysilane.

Examples of methods for applying a positive photosensitive composition include spin coating using a spinner, spray coating, roll coating, screen printing, offset printing, gravure printing, letterpress printing, flexographic printing, and methods using a blade coater, die coater, calendar coater, meniscus coater, or bar coater.

When the positive photosensitive composition contains a solvent, it is preferable to dry the applied positive photosensitive composition film to volatilize and remove the solvent. Examples of drying methods include heat drying and vacuum drying. The heat drying device may be one that heats with electromagnetic waves or microwaves, and examples of such devices include ovens, hot plates, electromagnetic ultraviolet lamps, infrared heaters, and halogen heaters. From the viewpoint of suppressing the remaining of the solvent, the heating temperature is preferably 50°C or higher, and more preferably 70°C or higher. On the other hand, from the viewpoint of suppressing the deactivation of the photosensitizer (dissolution inhibitor), the heating temperature is preferably 150°C or lower, and more preferably 110°C or lower. The heating time is preferably 1 minute to several hours, and more preferably 1 minute to 50 minutes.

The coating thickness of the positive photosensitive composition is preferably 0.1 μm or more, more preferably 0.5 μm or more, and even more preferably 1 μm or more. On the other hand, the coating thickness is preferably 20 μm or less, more preferably 10 μm or less, and even more preferably 5 μm or less. Here, when the positive photosensitive composition contains a solvent, the coating thickness refers to the film thickness after drying.

<Step of Exposing Using an Exposure Mask>
The method for producing a substrate with wiring electrodes according to this embodiment includes a step of exposing the positive photosensitive composition to light from the coated surface side of the positive photosensitive composition using an exposure mask.

Specifically, the areas of the light-shielding layer applied to the opaque wiring electrode that do not require a light-shielding layer are exposed from the side on which the positive photosensitive composition is applied, using the openings of an exposure mask. This allows the positive photosensitive composition in the areas that do not require a light-shielding layer to be removed through a subsequent development process, making it possible to omit the process of exposing and developing separately by, for example, inverting the substrate.

The exposure light preferably has an emission in the ultraviolet region that matches the absorption wavelength of the photosensitizer (dissolution inhibitor) contained in the positive photosensitive composition, that is, in the wavelength region of 200 nm to 450 nm. Examples of light sources for obtaining such exposure light include mercury lamps, halogen lamps, xenon lamps, LED lamps, semiconductor lasers, KrF or ArF excimer lasers, etc. Among these, the i-line (wavelength 365 nm) of a mercury lamp is preferred. From the viewpoint of the solubility of the exposed portion in the developer, the exposure amount is preferably 50 mJ/cm ² or more in terms of a wavelength of 365 nm, more preferably 100 mJ/cm ² or more, and even more preferably 200 mJ/cm ² or more.

<Step of Exposing Using Opaque Wiring Electrode as a Mask>
The method for producing a substrate with wiring electrodes according to this embodiment includes a step of exposing a positive photosensitive composition to light from the side opposite to the coating surface, using the opaque wiring electrodes as a mask.

This allows the positive photosensitive composition in areas where the opaque wiring electrode is not formed to be accurately removed in a subsequent development process. In addition, by combining this with exposure from the coating surface of the positive photosensitive composition, a light-shielding layer can be formed in desired areas on the opaque wiring electrode.

In the process of exposing the positive photosensitive composition from the side opposite to the coating surface, it is preferable to use an LED lamp as the light source from the viewpoint of saving space in the equipment.

By its nature, LED lamps only emit light of a single wavelength, but it is preferable to use LED lamps that emit wavelengths corresponding to the i-line (wavelength 365 nm) and h-line (wavelength 405 nm) that are widely used in exposure devices that use general mercury lamps, as these are versatile enough to be used in processing a variety of photosensitive materials that are sensitive to current exposure machines.

The LED lamp is preferably a line-type UV irradiator (CKL-500365, manufactured by CCS), etc. The irradiance is preferably 2.5 W/ ^cm2 or more, and more preferably 3.5 W/ ^cm2 or more.

It is preferable to install the LED lamps at the bottom of the substrate conveying line. In this way, after the substrate is set on the substrate conveying jig, the substrate can be irradiated with LED light as it passes through the LED lamp installation section, and the positive photosensitive composition can be exposed in a series of steps without flipping the substrate.

Due to the nature of the LED lamp, the intensity of the light emitted by the lamp decreases significantly as the distance from the lamp increases. Therefore, it is preferable to keep the distance from the transparent substrate to which the light is emitted to 20 mm or less, and more preferably 10 mm or less.

<Step of forming light-shielding layer>
The method for producing a substrate with wiring electrodes according to this embodiment includes a step of developing a positive photosensitive composition exposed from both sides to form a light-shielding layer in a desired portion on the opaque wiring electrodes.

By developing the exposed coating film of the positive photosensitive composition, the exposed areas can be removed and a light-shielding layer can be formed in the desired areas on the opaque wiring electrode. The developer is preferably one that does not inhibit the conductivity of the opaque wiring electrode, and an alkaline developer is preferred.

Examples of alkaline developers include aqueous solutions of alkaline substances such as tetramethylammonium hydroxide, diethanolamine, diethylamine, diethylaminoethanol, sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate, triethylamine, diethylamine, methylamine, dimethylamine, dimethylaminoethyl acetate, dimethylaminoethanol, dimethylaminoethyl methacrylate, cyclohexylamine, ethylenediamine, and hexamethylenediamine. To these aqueous solutions, polar solvents such as N-methyl-2-pyrrolidone, N,N-dimethylformamide, N,N-dimethylacetamide, dimethylsulfoxide, and γ-butyllactone; alcohols such as methanol, ethanol, and isopropanol; esters such as ethyl lactate and propylene glycol monomethyl ether acetate; ketones such as cyclopentanone, cyclohexanone, isobutyl ketone, and methyl isobutyl ketone; and surfactants may be added.

Examples of development methods include a method in which a developing solution is sprayed onto the surface of the coating film of the positive photosensitive composition while the substrate on which the coating film of the positive photosensitive composition has been formed is left stationary, rotated or transported, a method in which the coating film of the positive photosensitive composition is immersed in the developing solution, and a method in which ultrasonic waves are applied while the coating film of the positive photosensitive composition is immersed in the developing solution.

The pattern obtained by development may be subjected to a rinse treatment using a rinse liquid. Examples of the rinse liquid include water; aqueous solutions of alcohols such as ethanol and isopropyl alcohol; and aqueous solutions of esters such as ethyl lactate and propylene glycol monomethyl ether acetate.

It is preferable that the opaque wiring electrode includes a terminal portion, and the positive photosensitive composition on the terminal portion is removed by development. This is because the light-shielding layer on the opaque wiring electrode in the terminal portion, where electrical continuity with the external terminal must be ensured, can be removed in a short period of time.

The obtained light-shielding layer may be further heated at 100°C to 250°C. Heating improves the hardness of the light-shielding layer, suppresses chipping or peeling due to contact with other members, and improves adhesion to the opaque wiring electrode. Examples of heating devices include those exemplified as heating and drying devices for positive-type photosensitive composition films.

The light-shielding layer is preferably made of a photocured product of a positive-type photosensitive light-shielding composition containing a colorant. This makes the opaque wiring electrode less visible.

The light-shielding layer is preferably formed in a portion corresponding to the opaque wiring electrode, and reduces the reflectance of the opaque wiring electrode. Specifically, the reflectance of the light-shielding layer at a wavelength of 550 nm is preferably 25% or less, and more preferably 10% or less. By setting the reflectance of the light-shielding layer to 25% or less, the reflection of the opaque wiring electrode can be suppressed, making the wiring electrode less visible. The reflectance of the light-shielding layer can be measured by a reflectometer (VSR-400: manufactured by Nippon Denshoku Kogyo Co., Ltd.) for a light-shielding layer of 0.1 mm square or more on a transparent substrate.

Examples of methods for setting the reflectance of the light-shielding layer at a wavelength of 550 nm within the above range include a method using a positive-type photosensitive light-shielding composition having the preferred composition described above, and a method for setting the film thickness of the light-shielding layer within the preferred range described below.

The thickness of the light-shielding layer is preferably 0.1 μm or more, more preferably 0.5 μm or more, and even more preferably 1 μm or more, from the viewpoint of further reducing the reflectance of the opaque wiring electrode. On the other hand, from the viewpoint of suppressing residues and forming a fine pattern, the thickness is preferably 20 μm or less, more preferably 10 μm or less, and even more preferably 5 μm or less.

[Second embodiment]
Fig. 3 is a schematic diagram of a substrate with wiring electrodes, which has an opaque wiring electrode 2 (first opaque wiring electrode), a light-shielding layer 3 (first light-shielding layer) and an insulating layer 4 on a transparent substrate 1, and an opaque wiring electrode 5 (second opaque wiring electrode) and a light-shielding layer 6 (second light-shielding layer) on the insulating layer 4. The substrate with wiring electrodes shown in Fig. 3 can be obtained by forming the first opaque wiring electrode and the first light-shielding layer on one side of the transparent substrate in the first embodiment, then forming the insulating layer and the second opaque wiring electrode, and further coating a positive photosensitive composition, exposing and developing it in the same manner as the first time.

That is, in the method for manufacturing a substrate with a wiring electrode according to the present embodiment, the opaque wiring electrode is a first opaque wiring electrode,
After the step of forming a light-shielding layer in a desired portion on the first opaque wiring electrode,
forming an insulating layer on the first opaque wiring electrode forming surface;
forming a second opaque wiring electrode on the insulating layer;
A step of applying a second positive photosensitive composition to the second opaque wiring electrode forming surface;
a step of exposing the second positive photosensitive composition to light from a coated surface side of the second positive photosensitive composition using an exposure mask;
a step of exposing the second positive photosensitive composition to light from a side opposite to the coated surface using the second opaque wiring electrode as a mask;
and developing the second positive photosensitive composition exposed from both sides to form a second light-shielding layer in desired locations on the first opaque wiring electrode and the second opaque wiring electrode.

Methods for forming the insulating layer include, for example, applying an insulating composition (insulating paste) and drying it, and bonding a transparent substrate to the surface on which the opaque wiring electrode is formed via an adhesive. In the latter case, the adhesive and the transparent substrate form the insulating layer.

Examples of methods for applying the insulating paste include spin coating using a spinner, spray coating, roll coating, screen printing, offset printing, gravure printing, letterpress printing, flexographic printing, and methods using a blade coater, die coater, calendar coater, meniscus coater, or bar coater. In the method of applying and drying the insulating paste, the dried film can be cured by ultraviolet treatment and/or heat treatment. As a method for bonding a transparent substrate via an adhesive, for example, an adhesive may be formed on a substrate with an opaque wiring electrode, and a transparent substrate may be bonded thereto, or a transparent substrate with an adhesive may be bonded thereto. Examples of the transparent substrate to be bonded include those exemplified above as transparent substrates.

The insulating paste preferably contains a resin that provides insulating properties, such as acrylic resin, polyimide resin, cardo resin, epoxy resin, melamine resin, urethane resin, silicone resin, or fluorine resin. It may contain two or more of these.

[Third embodiment]
Fig. 4 is a schematic diagram of a substrate with wiring electrodes, which has an opaque wiring electrode 2 (first opaque wiring electrode) and an insulating layer 4 on a transparent substrate 1, and an opaque wiring electrode 5 (second opaque wiring electrode) and a light-shielding layer 6 on the insulating layer 4. The substrate with wiring electrodes shown in Fig. 4 can be obtained by forming a first opaque wiring electrode on one side of the transparent substrate in the first embodiment, forming an insulating layer and a second opaque wiring electrode, applying a positive photosensitive composition, and exposing and developing the composition in the same manner as in the other embodiments.

That is, the method for manufacturing a substrate with a wiring electrode according to this embodiment includes a step of forming a first opaque wiring electrode on a transparent substrate;
forming an insulating layer on the first opaque wiring electrode;
forming a second opaque wiring electrode on the insulating layer;
A step of applying a positive photosensitive composition to the second opaque wiring electrode forming surface;
a step of exposing the positive photosensitive composition from a coated surface side of the positive photosensitive composition using an exposure mask;
a step of exposing the positive photosensitive composition from a surface opposite to the coated surface using the first opaque wiring electrode and the second opaque wiring electrode as a mask;
and developing the positive photosensitive composition that has been exposed from both sides to form a light-shielding layer in desired locations on the first opaque wiring electrode and the second opaque wiring electrode.

[Fourth embodiment]
Fig. 5 is a schematic diagram of a substrate with wiring electrodes, which has an opaque wiring electrode 2 (first opaque wiring electrode) and an insulating layer 4 on a transparent substrate 1, an opaque wiring electrode 5 (second opaque wiring electrode) and a second insulating layer 7 on the insulating layer 4, and further has a light-shielding layer 8 at desired positions on the first opaque wiring electrode and the second opaque wiring electrode on the second insulating layer 7. The substrate with wiring electrodes shown in Fig. 5 can be obtained through the steps of forming a first opaque wiring electrode on one side of the transparent substrate in the first embodiment, forming a first insulating layer, a second opaque wiring electrode, and a second insulating layer, applying a positive photosensitive composition, and exposing and developing the resultant in the same manner as in the other embodiments.

That is, the method for manufacturing a substrate with a wiring electrode according to this embodiment includes a step of forming a first opaque wiring electrode on a transparent substrate;
forming a first insulating layer on the first opaque wiring electrode forming surface;
forming a second opaque wiring electrode on the first insulating layer;
forming a second insulating layer on the second opaque wiring electrode forming surface;
A step of applying a positive photosensitive composition to the surface on which the second insulating layer is formed;
a step of exposing the positive photosensitive composition from a coated surface side of the positive photosensitive composition using an exposure mask;
a step of exposing the positive photosensitive composition from a surface opposite to the coated surface using the first opaque wiring electrode and the second opaque wiring electrode as a mask;
and developing the positive photosensitive composition exposed from both sides to form a light-shielding layer in desired locations on the first and second opaque wiring electrodes.

The substrate with wiring electrodes obtained by the manufacturing method according to each embodiment described above can be suitably used in applications where it is necessary that the wiring electrodes are difficult to see. Examples of applications where it is particularly required to suppress the visibility of the wiring electrodes include touch panel components, electromagnetic shielding components, and transparent LED light components. In particular, it can be suitably used as a touch panel component, which has a high demand for miniaturization and making the wiring electrodes difficult to see.

The present invention will be described in more detail below with reference to examples, but the present invention is not limited thereto. Example 1-2 below should be read as Reference Example 1-2.

The materials used in each example are as follows. The transmittance of the transparent substrate at a wavelength of 365 nm was measured using a UV-Vis spectrophotometer (U-3310, Hitachi High-Technologies Corporation).

(Transparent substrate)
Transparent substrate (soda glass; thickness: 1.1 mm, transmittance of light with a wavelength of 365 nm: 90%) (a).

(Coloring Agent)
Carbon black (MA100 manufactured by Mitsubishi Chemical Corporation) (b).

(Photosensitive conductive paste)
Photosensitive conductive paste (Type: SFAG-M200 manufactured by Toray Industries, Inc., containing silver conductive particles) (c). Low viscosity (2.7 mPa·s) paste for coater application.

(Quinone diazide compounds)
Under a dry nitrogen stream, 21.22 g (0.05 mol) of α,α,-bis(4-hydroxyphenyl)-4-(4-hydroxy-α,α-dimethyldimethylbenzylethylbenzene (trade name TrisP-PA, manufactured by Honshu Chemical Industry Co., Ltd.) and 33.58 g (0.125 mol) of 5-naphthoquinone diazide sulfonyl acid chloride were dissolved in 450 g of 1,4-dioxane and brought to room temperature. 15.18 g of triethylamine mixed with 50 g of 1,4-dioxane was added dropwise so that the temperature in the system did not exceed 35° C. After the dropwise addition, the mixture was stirred at 30° C. for 2 hours. The triethylamine salt was filtered, and the filtrate was poured into water, and the precipitate that separated out was collected by filtration. The precipitate was dried in a vacuum dryer to obtain quinone diazide compound (D-1).

(Acrylic copolymer)
In a reaction vessel in a nitrogen atmosphere, 150 g of diethylene glycol monoethyl ether acetate (hereinafter, "DMEA") was charged, and the temperature was raised to 80°C using an oil bath. To this, a mixture consisting of 20 g of ethyl acrylate (hereinafter, "EA"), 40 g of 2-ethylhexyl methacrylate (hereinafter, "2-EHMA"), 20 g of styrene (hereinafter, "St"), 15 g of acrylic acid (hereinafter, "AA"), 0.8 g of 2,2'-azobisisobutyronitrile, and 10 g of DMEA was dropped over 1 hour, and after completion, the polymerization reaction was carried out for another 6 hours. Thereafter, 1 g of hydroquinone monomethyl ether was added to stop the polymerization reaction. Subsequently, a mixture consisting of 5 g of glycidyl methacrylate (hereinafter, "GMA"), 1 g of triethylbenzylammonium chloride, and 10 g of DMEA was dropped over 0.5 hours. After completion of the dropwise addition, the addition reaction was carried out for another 2 hours. The resulting reaction solution was purified with methanol to remove unreacted impurities, and then vacuum dried for 24 hours to obtain an acrylic copolymer (D-2).

(Positive Photosensitive Composition)
Into a 100 mL clean bottle were placed 3.09 g of photosensitive polymer WR-101 (manufactured by DIC Corporation), 0.77 g of quinone diazide compound (D-1), and 40.14 g of propylene glycol monomethyl ether acetate (hereinafter, "PGMEA") (manufactured by Kuraray Co., Ltd.), and mixed using a rotation-revolution vacuum mixer "Awatori Rentaro ARE-310" (manufactured by Thinky Corporation) to obtain 44.0 g of a resin solution. 44.0 g of the obtained resin solution, 0.6 g of carbon black (b), 0.18 g of the acrylic copolymer (D-2) and 0.36 g of a leveling agent BYK-LP21116 (manufactured by BYK-Chemie K.K.) were mixed and kneaded using an Ultra Apex Mill (manufactured by Kotobuki Industries Co., Ltd.) equipped with a centrifugal separator filled with 70 vol % of 0.05 mmφ zirconia beads (manufactured by Toray Industries, Inc.) to obtain a positive photosensitive composition (d).

(insulating paste)
Insulating paste (Type: OCM-1000 manufactured by Toray Industries, Inc.) (e).

Example 1
<Formation of Opaque Wiring Electrodes>
On one side of the transparent substrate (a), the photosensitive conductive paste (c) was printed by a spin coater so that the film thickness after drying was 1 μm, and dried at 90 ° C. for 8 minutes. Through an exposure mask having a mesh shape with a pitch of 300 μm and a mesh line width of 4 μm and a terminal pattern of 500 μm in length and 1000 μm in width, the exposure was performed at an exposure dose of 200 mJ / cm ² (converted to a wavelength of 365 nm) using an exposure device (PEM-6M; manufactured by Union Optical Co., Ltd.). Thereafter, spin development was performed for 80 seconds with a 0.08 mass % tetramethylammonium hydroxide (hereinafter, "TMAH") aqueous solution, and further, after rinsing with ultrapure water, the substrate was heated for 60 minutes in an IR heater furnace at 240 ° C. to obtain a substrate with an opaque wiring electrode. The line width of the opaque wiring electrode was measured with an optical microscope and found to be 4 μm. The transmittance of the terminal at a wavelength of 365 nm was 5%. The transmittance of the non-transparent wiring electrode was measured by a microsurface spectrophotometer (VSS 400, manufactured by Nippon Denshoku Industries Co., Ltd.).

<Coating of Positive Photosensitive Composition>
A positive photosensitive composition (d) was printed on the opaque wiring electrode-formed surface of the obtained substrate with the opaque wiring electrode by a spin coater so that the film thickness after drying would be 1 μm, and then dried for 5 minutes at 80° C. to obtain a substrate with the positive photosensitive composition. The reflectance of the obtained substrate with the positive photosensitive composition was measured using a reflectometer (VSR-400: manufactured by Nippon Denshoku Industries Co., Ltd.), and the reflectance at a wavelength of 550 nm was 7%.

<Exposure using a mask>
The obtained substrate with the positive photosensitive composition was exposed from above using the above-mentioned exposure device, with an exposure mask placed on the same side as the surface on which the positive photosensitive composition was applied. The exposure conditions were an exposure dose of 200 mJ/ ^cm2 (converted to a wavelength of 365 nm). The exposure mask was molded so that the openings were such that only the positive photosensitive composition on the terminals was irradiated.

<Exposure from the side opposite to the coated side>
The obtained substrate with the positive photosensitive composition was set on a substrate conveying jig so that the transparent substrate was facing downward. An LED lamp was set on the substrate conveying line at a predetermined position below the jig. When the substrate with the positive photosensitive composition passed through the LED lamp installation section, it was irradiated with LED light. The LED lamp was a CCS (L037) with an irradiation wavelength of 365 nm and a light emitting surface of 5 mm x 190 mm.

<Developing>
The obtained substrate with exposed positive-type photosensitive composition was shower-developed with a 0.08% TMAH solution to obtain a substrate with wiring electrodes as shown in FIG. 1, which has a light-shielding layer on the mesh-shaped pattern of the opaque wiring electrodes and no light-shielding layer on the terminal portions.

Example 2
<Formation of insulating layer>
On the substrate with wiring electrodes obtained in Example 1, the insulating paste (e) was printed by a spin coater so that the film thickness after drying would be 0.5 μm, and then dried at 80° C. for 5 minutes to form an insulating layer. The obtained substrate with insulating layer was exposed to light through an exposure mask using the above-mentioned exposure device at an exposure dose of 100 mJ/cm ² (converted to a wavelength of 365 nm). The exposure mask used was one molded so that the terminal portion of the above-mentioned opaque wiring electrode (the first opaque wiring electrode in this example) would not be exposed. Thereafter, shower development was performed with a 0.08 mass % TMAH aqueous solution for 80 seconds to develop the insulating layer.

<Formation of second opaque wiring electrode>
On the obtained insulating layer, a second opaque wiring electrode was formed by using the photosensitive conductive paste (c) in the same manner as in the formation of the above-mentioned opaque wiring electrode.

<Coating of second positive-type photosensitive composition>
A positive-type photosensitive composition (d) was printed on the second opaque wiring electrode-forming surface of the obtained substrate with opaque wiring electrode using a spin coater so that the film thickness after drying would be 1 μm, and then dried at 80° C. for 5 minutes to obtain a substrate with a second positive-type photosensitive composition.

<Exposure using a mask>
The obtained substrate with the second positive photosensitive composition was exposed from above using the above-mentioned exposure device, with an exposure mask placed on the same side as the surface on which the second positive photosensitive composition was applied. The exposure mask was shaped so that the openings were located at the positions of the second positive photosensitive composition on the terminals.

<Exposure from the side opposite to the coated side>
The obtained substrate with the second positive photosensitive composition was set on a substrate conveying jig so that the transparent substrate side was facing downward. An LED lamp was set on the jig at a predetermined position below the substrate conveying line. When the substrate with the second positive photosensitive composition passed through the LED lamp installation section, it was irradiated with LED light. The LED lamp was a CCS (L037) with an irradiation wavelength of 365 nm and a light emitting surface of 5 mm x 190 mm.

<Developing>
The obtained substrate with the exposed second positive photosensitive composition was shower-developed with a 0.08% TMAH solution to obtain a substrate with wiring electrodes as shown in Fig. 3, which has a light-shielding layer at the positions corresponding to the mesh-shaped patterns of the first and second opaque wiring electrodes and has no light-shielding layer on the terminals. As shown in the top view of Fig. 6, the terminals of the first opaque wiring electrode can ensure electrical continuity through the portions exposed from the insulating paste.

Example 3
<Formation of insulating layer>
In Example 1, after forming an opaque wiring electrode (first opaque wiring electrode in this example), the insulating paste (e) was printed by a spin coater so that the film thickness after drying would be 0.5 μm, and dried at 80° C. for 5 minutes to form an insulating layer. The obtained substrate with the insulating layer was exposed through an exposure mask using the above-mentioned exposure device at an exposure dose of 100 mJ/cm ² (converted to a wavelength of 365 nm). The exposure mask used was one molded so that the terminal portion of the first opaque wiring electrode would not be exposed. Thereafter, shower development was performed with a 0.08 mass % TMAH aqueous solution for 80 seconds to develop the insulating layer.

<Formation of second opaque wiring electrode>
On the obtained insulating layer, a second opaque wiring electrode was formed by using the photosensitive conductive paste (c) in the same manner as in the formation of the above-mentioned opaque wiring electrode.

<Coating of Positive Photosensitive Composition>
A positive-type photosensitive composition (d) was printed on the second opaque wiring electrode-forming surface of the obtained substrate with opaque wiring electrode using a spin coater so that the film thickness after drying would be 1 μm, and then dried at 80° C. for 5 minutes to obtain a substrate with a positive-type photosensitive composition.

<Exposure using a mask>
The substrate with the positive photosensitive composition thus obtained was exposed from above using the above-mentioned exposure device, with an exposure mask placed on the same side as the surface on which the positive photosensitive composition was applied. The exposure mask was shaped so that the openings were located at the positions of the positive photosensitive composition on the terminals.

<Exposure from the side opposite to the coated side>
The obtained substrate with the positive photosensitive composition was set on a substrate conveying jig so that the transparent substrate side was facing downward. An LED lamp was set on the jig at a predetermined position below the substrate conveying line. When the substrate with the positive photosensitive composition passed through the LED lamp installation section, it was irradiated with LED light. The LED lamp was a CCS (L037) with an irradiation wavelength of 365 nm and a light emitting surface of 5 mm x 190 mm.

<Developing>
The obtained substrate with the exposed positive-type photosensitive composition was shower-developed with a 0.08% TMAH solution to obtain a substrate with wiring electrodes as shown in FIG. 4, which has a light-shielding layer in the positions corresponding to the mesh-shaped patterns of the first opaque wiring electrode and the second opaque wiring electrode, but does not have a light-shielding layer on the terminal portion.

Example 4
<Formation of insulating layer>
In Example 1, after forming the opaque wiring electrode (first opaque wiring electrode in this example), the insulating paste (e) was printed by a spin coater so that the film thickness after drying would be 0.5 μm, and then dried at 80° C. for 5 minutes to form an insulating layer. Furthermore, using the above-mentioned exposure device, exposure was performed through an exposure mask at an exposure dose of 100 mJ/cm ² (converted to a wavelength of 365 nm). The exposure mask used was one molded so that the terminal portion of the first opaque wiring electrode would not be exposed. Thereafter, shower development was performed with a 0.08 mass % TMAH aqueous solution for 80 seconds to develop the insulating layer.

<Formation of second opaque wiring electrode>
On the obtained insulating layer, a second opaque wiring electrode was formed by using the photosensitive conductive paste (c) in the same manner as in the formation of the above-mentioned opaque wiring electrode.

<Formation of second insulating layer>
On the obtained substrate with opaque wiring electrodes, the insulating paste (e) was printed by a spin coater so that the film thickness after drying would be 0.5 μm, and then dried at 80° C. for 5 minutes to form a second insulating layer. Furthermore, using the above-mentioned exposure device, exposure was performed through an exposure mask at an exposure dose of 100 mJ/cm ² (converted to a wavelength of 365 nm). The exposure mask used was one molded so that the terminal parts of the first opaque wiring electrode and the second opaque wiring electrode would not be exposed. Thereafter, shower development was performed with a 0.08 mass % TMAH aqueous solution for 80 seconds to develop the second insulating layer.

<Coating of Positive Photosensitive Composition>
A positive-type photosensitive composition (d) was printed on the second insulating layer-forming surface of the obtained substrate with an opaque wiring electrode using a spin coater so that the film thickness after drying would be 1 μm, and then dried at 80° C. for 5 minutes to obtain a substrate with a positive-type photosensitive composition.

<Exposure using a mask>
The substrate with the positive photosensitive composition thus obtained was exposed from above using the above-mentioned exposure device, with an exposure mask placed on the same side as the surface on which the positive photosensitive composition was applied. The exposure mask was shaped so that the openings were located at the positions of the positive photosensitive composition on the terminals.

<Exposure from the side opposite to the coated side>
The obtained substrate with the positive photosensitive composition was set on a substrate conveying jig so that the substrate side was facing downward. An LED lamp was set on the jig at a predetermined position below the substrate conveying line. When the substrate with the positive photosensitive composition passed through the LED lamp installation section, it was irradiated with LED light. The LED lamp was a CCS (L037) with an irradiation wavelength of 365 nm and a light emitting surface of 5 mm x 190 mm.

<Developing>
The obtained substrate with the exposed positive-type photosensitive composition was shower-developed with a 0.08% TMAH solution to obtain a substrate with wiring electrodes as shown in FIG. 5, which has a light-shielding layer at a position corresponding to the mesh-shaped pattern of the first opaque wiring electrode and the second opaque wiring electrode on the second insulating layer, but does not have a light-shielding layer on the terminal portion.

1 Transparent substrate 2 Opaque wiring electrode 3 Light-shielding layer 4 Insulating layer 5 Opaque wiring electrode 6 Light-shielding layer 7 Insulating layer 8 Light-shielding layer

Claims (5)

forming a first opaque wiring electrode on a transparent substrate;
forming an insulating layer on the first opaque wiring electrode;
forming a second opaque wiring electrode on the insulating layer;
A step of applying a positive photosensitive composition to the second opaque wiring electrode forming surface;
a step of exposing the positive photosensitive composition from a coated surface side of the positive photosensitive composition using an exposure mask;
a step of exposing the positive photosensitive composition from a surface opposite to the coated surface using the first opaque wiring electrode and the second opaque wiring electrode as a mask;
and developing the positive photosensitive composition exposed from both sides to form a light-shielding layer in desired locations on the first opaque wiring electrode and the second opaque wiring electrode. forming a first opaque wiring electrode on a transparent substrate;
forming a first insulating layer on the first opaque wiring electrode forming surface;
forming a second opaque wiring electrode on the first insulating layer;
forming a second insulating layer on the second opaque wiring electrode forming surface;
A step of applying a positive photosensitive composition to the surface on which the second insulating layer is formed;
a step of exposing the positive photosensitive composition from a coated surface side of the positive photosensitive composition using an exposure mask;
a step of exposing the positive photosensitive composition from a surface opposite to the coated surface using the first opaque wiring electrode and the second opaque wiring electrode as a mask;
and developing the positive photosensitive composition exposed from both sides to form a light-shielding layer in desired locations on the first opaque wiring electrode and the second opaque wiring electrode. 3. The method for producing a substrate with wiring electrodes according to claim 1, wherein the opaque wiring electrodes include terminal portions, and the positive photosensitive composition on the terminal portions is removed by the development. 4. The method for producing a substrate with wiring electrodes according to claim 1, wherein an LED lamp is used as a light source in the step of exposing the positive photosensitive composition from the side opposite to the coated surface. 5. The method for producing a substrate with wiring electrodes according to claim 1, wherein the opaque wiring electrodes have a transmittance of 20% or less at a wavelength of 365 nm.