JP7495232B2 - measuring device - Google Patents

Description

The present invention relates to a measurement device that is configured to measure a predefined measured quantity based on a high-frequency signal input from a measurement object.

As an example of this type of measurement device, the following patent document discloses an inspection device capable of electrically inspecting a module in which a component mounting surface of a circuit board provided with multiple mounting electrodes is covered with a shield conductive layer. This inspection device is equipped with a measurement board, a nozzle, a drive mechanism, and a control device.

The measurement board is a connector for connecting each mounting electrode on the circuit board of the module to the control device, and multiple measurement terminals that are brought into contact with each mounting electrode are provided on the mounting surface of the module. The outer surface of the measurement board is provided with multiple connection terminals that are connected to each measurement terminal, and each mounting electrode can be connected to the control device via a cable connected to the connection terminal. The nozzle is configured to be able to hold the module by adsorbing the shield conductive layer, and the part that contacts the shield conductive layer is made of a conductive material and is configured to function as a "probe." The nozzle is electrically connected to the control device by a cable.

The drive mechanism moves the nozzle holding the module to transport the module onto the measurement board and place it on the mounting surface, and presses the module towards the measurement board so that each mounting electrode is pressed against each measurement terminal. The control device controls the holding of the module by the nozzle and the movement of the nozzle by the drive mechanism. The control device also measures the electrical characteristics of the module by sequentially inputting and outputting inspection signals to the module (each mounting electrode) via each measurement terminal, and performs inspections of the electrical continuity by measuring the resistance between the nozzle in contact with the shield conductive layer and the measurement terminal in contact with the mounting electrode.

When inspecting a module with this inspection device, first the nozzle is moved by the drive mechanism so that it contacts the shield conductive layer of the module to be inspected, and the nozzle adsorbs and holds the module. At this time, the shield conductive layer is connected to the control device via the nozzle (probe) and cable. Next, the nozzle holding the module is moved above the measurement board, and the module is placed on the mounting surface of the measurement board. At this time, each mounting electrode of the module is brought into contact with each measurement terminal of the measurement board, and each mounting electrode is connected to the control device.

Next, a test signal is input to the module via each measurement terminal to measure the electrical characteristics of the module, and the resistance between the shield conductive layer that the nozzle (probe) is in contact with and each mounting electrode that each measurement terminal is in contact with is measured. The module is then inspected for quality based on the measurement results. After this, the module that has completed inspection is transported to a collection tray for inspected modules, completing the series of inspection processes.

JP 2012-159359 A (pages 4-5, Figures 1-4)

However, the inspection device disclosed in the above patent document has the following problems to be solved. Specifically, the above inspection device employs a configuration in which a nozzle (probe) is brought into contact with the shield conductive layer of the module, and each measurement terminal of a measurement board is brought into contact with the circuit board of the module (each mounting electrode formed on the circuit board), thereby connecting the module to a control device for inspection. In this case, the number and arrangement of the mounting electrodes to be contacted with each measurement terminal differs depending on the type of module to be inspected. Therefore, when inspecting a different type of module with the above inspection device, it is necessary to manufacture a new measurement board on which measurement terminals are arranged in accordance with the number and arrangement of mounting electrodes in the new module to be inspected, which makes it difficult to reduce inspection costs.

In order to solve these problems, the applicant has prototyped an inspection device that uses several contact probes (hereinafter simply referred to as "probes") instead of the measurement terminals of the measurement board in the inspection device disclosed in the above patent document, and connects the module to a control device by sequentially probing each mounting electrode on the circuit board of the module with the probes. The inspection device prototyped by the applicant makes it possible to inspect various modules simply by changing the number of probings and the probing positions in response to the number and arrangement of mounting electrodes formed on the circuit board. Therefore, with the inspection device prototyped by the applicant, there is no need to manufacture a measurement board corresponding to the type of module, which reduces inspection costs.

However, the applicant discovered that when a configuration in which a probe is brought into sequential contact with each mounting electrode of a module (circuit board) is adopted instead of the configuration of the inspection device disclosed in the above patent document, errors in the measurement values may occur depending on the formation position of each mounting electrode.

Specifically, in the inspection device prototyped by the applicant, the signal generation unit and the probe that outputs a signal to the module are connected via a signal cable, and the probe that inputs a signal from the module and the signal processing circuit (such as an A/D conversion unit) that processes the input signal are connected via another signal cable. In addition, the inspection device prototyped by the applicant employs a configuration in which the signal generation unit and the signal processing circuit are placed stationary together with the base of the movement mechanism, and both probes are moved to any probing position (the position where each mounting electrode is formed) by the movement mechanism.

In addition, in this type of inspection device, for example, when measuring the impedance (through measurement) between each mounting electrode in the module under inspection, a high-frequency signal is output from the inspection device to one of a pair of mounting electrodes, while this signal is input to the inspection device from the other of the two mounting electrodes, and a through measurement between both mounting electrodes is performed based on the output signal and the input signal (for example, based on the amplitude and phase of the output signal and the amplitude and phase of the input signal).

In this case, when the probe that inputs and outputs a high-frequency signal is moved to probe each mounting electrode, the distance between the signal generating unit and the signal processing circuit and both probes, and the shape of the cable connecting them, change depending on the formation position of the mounting electrode to be probed (i.e., the probing position), and the level difference between the amplitude of the output signal and the amplitude of the input signal and the phase difference between the phase of the output signal and the phase of the input signal increase or decrease depending on the degree of this change. Therefore, not only the level difference and phase difference between the output signal and the input signal caused by the electrical characteristics between a pair of mounting electrodes, but also the level difference and phase difference between the output signal and the input signal caused by the formation position of the mounting electrodes, i.e., the difference in the position of the probe probed to the mounting electrode and the signal generating unit and the signal processing circuit may be taken into account when detecting, which may make it difficult to perform a through measurement with high accuracy. Therefore, it is preferable to improve this point.

On the other hand, in the inspection device disclosed in the above patent document, the measured value of the inspection object may change due to wear and tear of the measurement terminals and nozzles (probes) on the measurement board, temperature changes in the inspection device, etc. Therefore, it is preferable to periodically perform a calibration operation to obtain correction data that can correct the measured value according to the state of the inspection device. In this case, as an example, in the calibration operation for this type of inspection device (measurement device), a calibration reference part (calibration measurement body) that measures the same measured value as the inspection object (measurement object) is prepared, and correction data is generated based on the measured value of this calibration reference part. However, in the inspection device disclosed in the above patent document, since the measurement terminals are arranged on the measurement board in correspondence with the mounting electrodes in the module to be inspected, it is necessary to prepare a calibration reference part for each type of module in order to be able to connect to such a measurement board. For this reason, it is difficult to reduce the cost required for calibration of the inspection device disclosed in the above patent document.

In addition, in this type of inspection device (measurement device), in view of the current situation that it is difficult to prepare a calibration reference part for each type of inspection object as described above, for example, the measurement board is disconnected from the control device, and instead, the calibration reference part is connected directly to the control device (the calibration reference part is connected to the control device without going through the measurement board), and the measurement process is performed, and correction data is generated based on the measured value. According to this type of calibration work, it is possible to detect changes in the measured value caused by temperature changes in the control device, etc., by simply preparing one type of calibration reference part. However, since it is impossible to detect the temperature change of the measurement board that is actually brought into contact with each mounting electrode during module inspection, or the effect of wear and tear of each measurement terminal on the measurement board, it is not possible to obtain correction data that can accurately correct the measured value of the module to be inspected. In addition, since it takes a long time to disconnect the measurement board and connect the calibration reference part before the calibration work, and to disconnect the calibration reference part and connect the measurement board after the calibration work, the time for which the inspection must be interrupted is long, which is a problem that leads to a decrease in inspection efficiency.

The present invention was made in consideration of the above-mentioned problems to be solved, and its main objective is to provide a measuring device that can accurately measure the amount to be measured of the object to be measured without increasing the cost of measurement or reducing the efficiency of measurement.

In order to achieve the above object, the measuring device according to claim 1 includes a holding section configured to be able to hold a measurement object, a probe that is caused to probe the measurement object and input a first high frequency signal from the measurement object, a first moving mechanism configured to be able to move the probe at least relative to the holding section so that the probe can be probed to the measurement object held by the holding section, a signal processing section having a first A/D conversion section that performs A/D conversion on the first high frequency signal to generate first data and provided with a probe connection section to which the probe is connected, and a signal processing section that controls the first moving mechanism to move the probe to the a processing unit that executes a measurement process for probing a measurement object and generating measurement result data that can identify a predefined measured quantity for the measurement object based on the first data, the measurement device including a plurality of the signal processing units and a calibration standard unit disposed within a probing area in which the probe can be probed by relative movement of the probe with respect to the holding unit by the first moving mechanism, the holding unit being configured to be able to place the measurement object and the calibration standard unit side by side within the probing area, and the first moving mechanism moving the holding unit and the calibration standard unit the signal processing unit includes the probe connecting unit , the first A/D conversion unit, a first component constituting a first signal transmission path from the probe connecting unit to the first A/D conversion unit, a signal generating unit that generates a second high frequency signal, a second A/D conversion unit that A/D converts the second high frequency signal to generate second data, a second component constituting a second signal transmission path from the signal generating unit to the probe connecting unit, and a third component constituting a third signal transmission path from the signal generating unit to the second A/D conversion unit; The first A/D conversion unit, the first component , the signal generation unit, the second A/D conversion unit, the second component, and the third component are attached to the first moving mechanism together with the probe in a state in which they are positioned relative to one another and positional deviation between them is regulated, and the processing unit controls the first moving mechanism to cause the probe to probe the calibration reference unit and input the first high-frequency signal from the calibration reference unit, and generates correction data for correcting the measurement result data for the measurement target based on the first data generated by the first A/D conversion unit. and in the measurement process, the first moving mechanism is controlled to cause the probe to probe the object to be measured, and the second high-frequency signal generated by the signal generating unit is output to the object to be measured via the probe, and the measurement result data is generated based on the first data generated by the first A/D conversion unit and the second data generated by the second A/D conversion unit; and in the correction data generation process, the first moving mechanism is controlled to cause the probe to probe the calibration standard unit, and the second high-frequency signal generated by the signal generating unit is output to the calibration standard unit via the probe, and the correction data is generated based on the first data generated by the first A/D conversion unit and the second data generated by the second A/D conversion unit, and the second high-frequency signal is output from the probe connected to any of the signal processing units, and the first high-frequency signal is input from the probe connected to any of the signal processing units, and the first data generated by the first A/D conversion unit in any of the signal processing units and the signal processing unit of any of the signal processing units are generated. a first process of generating the measurement result data during the measurement process and generating the correction data during the correction data generation process based on the second data generated by the second A/D conversion unit in one of the signal processing units; and a second process of generating the measurement result data during the measurement process and generating the correction data during the correction data generation process based on the first data generated by the first A/D conversion unit in one of the other signal processing units and the second data generated by the second A/D conversion unit in one of the other signal processing units, in a state in which the second high frequency signal is output from the probe connected to any of the signal processing units and the first high frequency signal is input from the probe connected to any of the other signal processing units. When a second measurement process is performed as the measurement process in which the second high frequency signal of a first frequency is output in the second process, after a first measurement process as the measurement process in which the second high frequency signal of a first frequency is output in the second process, the correction data generation process is performed to output the second high frequency signal of the second frequency in the second process .

The measurement device according to claim 2 includes a holding section configured to be able to hold a measurement object, a probe that is caused to be probed by the measurement object and to input a first high frequency signal from the measurement object, a first moving mechanism configured to be able to move the probe at least relative to the holding section so that the probe can be probed to the measurement object held by the holding section, a signal processing section having a first A/D conversion section that performs A/D conversion on the first high frequency signal to generate first data and provided with a probe connection section to which the probe is connected, and a signal processing section that controls the first moving mechanism to move the probe to the measurement object by probing the measurement object. a processing unit that performs measurement processing to generate measurement result data capable of identifying a predefined measured quantity for the measurement target based on the first data, the measurement device including a plurality of the signal processing units and a calibration reference unit disposed within a probing area in which the probe can be probed by relative movement of the probe with respect to the holding unit by the first moving mechanism, the holding unit being disposed alongside the calibration reference unit within the probing area, and the first moving mechanism separates and independents each of the signal processing units with respect to the holding unit and the calibration reference unit. the signal processing unit includes the probe connection unit, the first A/D conversion unit , a first component constituting a first signal transmission path from the probe connection unit to the first A/D conversion unit, a signal generation unit that generates a second high-frequency signal, a second A/D conversion unit that A/D converts the second high-frequency signal to generate second data, a second component constituting a second signal transmission path from the signal generation unit to the probe connection unit, and a third component constituting a third signal transmission path from the signal generation unit to the second A/D conversion unit; the signal generating unit, the second A/D converting unit, the second component, and the third component are attached to the first moving mechanism together with the probe in a state in which they are positioned relative to one another and positional deviation between them is regulated, and the processing unit is configured to execute a correction data generating process for controlling the first moving mechanism to cause the probe to probe the calibration reference unit and input the first high-frequency signal from the calibration reference unit, and for generating correction data for correcting the measurement result data for the measurement target based on the first data generated by the first A/D converting unit. in the measurement process, the first moving mechanism is controlled to cause the probe to probe the object to be measured, and the second high frequency signal generated by the signal generating unit is output to the object to be measured via the probe, while generating the measurement result data based on the first data generated by the first A/D conversion unit and the second data generated by the second A/D conversion unit; and in the correction data generation process, the first moving mechanism is controlled to cause the probe to probe the calibration standard unit, and the second high frequency signal generated by the signal generating unit is output to the calibration standard unit via the probe, while generating the correction data based on the first data generated by the first A/D conversion unit and the second data generated by the second A/D conversion unit, while outputting the second high frequency signal from the probe connected to any of the signal processing units, and inputting the first high frequency signal from the probe connected to any of the signal processing units, The digital signal processing device is configured to be capable of executing a first process of generating the measurement result data during the measurement process and generating the correction data during the correction data generation process based on the second data generated by the second A/D conversion unit, and a second process of generating the measurement result data during the measurement process and generating the correction data during the correction data generation process based on the first data generated by the first A/D conversion unit in any of the other signal processing units and the second data generated by the second A/D conversion unit in any of the other signal processing units, in a state in which the second high frequency signal is output from the probe connected to any of the signal processing units and the first high frequency signal is input from the probe connected to any of the other signal processing units. When a second measurement process is executed as the measurement process in which the second high frequency signal of a first frequency is output in the second process, the digital signal processing device executes the correction data generation process to output the second high frequency signal of the second frequency in the second process .

The measurement device according to claim 3 includes a holding section configured to be able to hold a measurement object, a probe that is caused to be probed by the measurement object and inputs a first high frequency signal from the measurement object, a first moving mechanism configured to be able to move the probe at least relative to the holding section so that the probe can be probed to the measurement object held by the holding section, a plurality of signal processing sections having a first A/D conversion section that performs A/D conversion on the first high frequency signal to generate first data and provided with a probe connection section to which the probe is connected, and a control section for controlling the first moving mechanism to move the probe to the measurement object. a processing unit that executes measurement processing for detecting a measured quantity of a measurement target based on the first data and generating measurement result data that can identify a predetermined measured quantity for the measurement target based on the first data, the measurement device comprising: a calibration reference unit; and a second moving mechanism configured to be able to move the calibration reference unit into a probing area where the probe can be probed by the relative movement of the probe with respect to the holding unit by the first moving mechanism, the signal processing unit including the probe connection unit, a signal generating unit that generates a second high frequency signal, the first A/D conversion unit, and a second A/D conversion unit that A/D converts the second high frequency signal to generate second data. a probe connecting section, a first component constituting a first signal transmission path from the probe connecting section to the first A/D conversion section, a second component constituting a second signal transmission path from the signal generating section to the probe connecting section, and a third component constituting a third signal transmission path from the signal generating section to the second A/D conversion section, wherein the probe connecting section, the signal generating section, the first A/D conversion section, the second A/D conversion section, the first component, the second component and the third component are attached to the first moving mechanism together with the probe in a state where they are positioned relative to each other and positional deviation between them is restricted, a first moving mechanism configured to be able to move each of the signal processing units separately and independently with respect to the holding unit and the calibration standard unit, and the processing unit configured to control the second moving mechanism to move the calibration standard unit into the probing area and to control the first moving mechanism to cause the probe to probe the calibration standard unit and input the first high-frequency signal from the calibration standard unit, and to execute a correction data generation process to generate correction data for correcting the measurement result data for the measurement target based on the first data generated by the first A/D conversion unit, and in the measurement process, a first moving mechanism is controlled to cause the probe to probe the object to be measured, and the second high frequency signal generated by the signal generating unit is output to the object to be measured via the probe, while generating the measurement result data based on the first data generated by the first A/D conversion unit and the second data generated by the second A/D conversion unit; and in the correction data generating process, the second moving mechanism is controlled to move the calibration standard unit into the probing possible area, the first moving mechanism is controlled to cause the probe to probe the calibration standard unit, and the second high frequency signal generated by the signal generating unit is output to the calibration standard unit via the probe, while generating the correction data based on the first data generated by the first A/D conversion unit and the second data generated by the second A/D conversion unit, while outputting the second high frequency signal from the probe connected to any of the signal processing units, and inputting the first high frequency signal from the probe connected to any of the signal processing units, and a second process of generating the measurement result data during the measurement process and generating the correction data during the correction data generation process based on the first data generated by the first A/D conversion unit in any of the other signal processing units and the second data generated by the second A/D conversion unit in any of the other signal processing units, in a state in which the second high frequency signal is output from the probe connected to any of the signal processing units and the first high frequency signal is input from the probe connected to any of the other signal processing units.The digital signal processor is configured to be capable of executing a first process of generating the measurement result data during the measurement process and generating the correction data during the correction data generation process based on the first data generated by the first A/D conversion unit in any of the other signal processing units and the second data generated by the second A/D conversion unit in any of the other signal processing units, and when a second measurement process is executed as the measurement process in which the second high frequency signal of a first frequency is output in the second process, the digital signal processor executes the correction data generation process of outputting the second high frequency signal of the second frequency in the second process.

The measuring device of claim 4 is the measuring device of any one of claims 1 to 3 , wherein the processing unit monitors whether or not predefined conditions are satisfied among a condition that the measuring device has been started up, a condition that the probe has been replaced, a condition that the temperature of the signal processing unit has changed beyond a predetermined temperature, a condition that the number of probings of the probe against the measurement object and the calibration standard unit has reached a predefined number, a condition that the continuous operating time of the measuring device has reached a predefined time, and a condition that the value of the measurement result data differs from the corresponding reference value by more than a predefined difference amount, and executes the correction data generation process when the predefined condition is satisfied.

According to a fifth aspect of the present invention, in the measuring apparatus of any one of the first to fourth aspects, the processing unit executes a data correction process for correcting the measurement result data for the measurement object based on the correction data.

In the measuring device described in claims 1 and 2 , a calibration reference section is provided that is arranged within a probing area where the probe can be probed by relative movement of the probe with respect to the holding section by a first moving mechanism, and a signal processing section is provided with a probe connection section, a first A/D conversion section, and a first component that constitutes a first signal transmission path, which are attached to the first moving mechanism together with the probe with these positioned relative to each other and positional deviation between them is regulated, and the processing section controls the first moving mechanism to cause the probe to probe the calibration reference section and input a first high-frequency signal from the calibration reference section, and executes a correction data generation process that generates correction data for correcting measurement result data for the measurement object based on the first data generated by the first A/D conversion section.

Therefore, according to the measuring device described in claims 1 and 2 , unlike the inspection device disclosed in the above patent document, it is not necessary to manufacture a measurement board or a calibration reference unit for each different type of measurement object, and the first high frequency signal can be input from the measurement object or the calibration reference unit by moving the probe with the first moving mechanism to probe various measurement objects and calibration reference units, and the measurement process and the correction data generation process can be performed. Therefore, the cost required for the measurement process and the correction data generation process can be sufficiently reduced. In addition, since there is no positional deviation between the probe connection unit, the first A/D conversion unit, and the first component when probing the measurement object or the calibration reference unit with the probe, the situation in which an error occurs in the measurement value due to the positional deviation (change in the positional relationship) is preferably avoided, and as a result, accurate measurement result data can be reliably and easily generated. Furthermore, since the probe to be probed for the measurement object is moved by the first moving mechanism to be probed to the calibration reference portion and the measurement process is performed while the correction data is generated based on the first data generated during the measurement process, the generation of the correction data can be completed in a very short time that is the sum of the time required for moving the probe by the first moving mechanism and the time required for the measurement process. As a result, the time for interrupting the measurement (inspection) process for the measurement object can be shortened, and the efficiency of the measurement (inspection) process is not significantly reduced even if new correction data is frequently generated, so that the measurement result data can be corrected with high accuracy based on the latest correction data.

In the measuring device according to claims 1 and 2 , the signal processing unit further includes a signal generating unit, a second A/D converting unit, a second component constituting the second signal transmission path, and a third component constituting a third signal transmission path, and the probe connection unit, the first A/D converting unit, the second A/D converting unit, the signal generating unit, the first component, the second component, and the third component are attached to the first moving mechanism together with the probe in a state in which they are positioned relative to each other and positional deviation between them is restricted, and the processing unit, in a correction data generation process, controls the first moving mechanism to cause the probe to probe the calibration reference unit and generates correction data based on the first data generated by the first A/D converting unit and the second data generated by the second A/D converting unit in a state in which the second high-frequency signal generated by the signal generating unit is output to the calibration reference unit via the probe.

Therefore, according to the measuring device of claims 1 and 2 , the probe is moved by the first moving mechanism to various measurement objects and calibration reference parts to perform probing, and in that state, the second high frequency signal is output to the measurement object or calibration reference part and the first high frequency signal is input, thereby performing measurement processing and correction data generation processing. Therefore, the cost required for measurement processing and correction data generation processing can be sufficiently reduced. In addition, when probing the measurement object or calibration reference part with the probe, there is no positional deviation between the signal generating unit, the probe connecting unit, the first A/D conversion unit, the second A/D conversion unit, the first component, the second component, and the third component. Therefore, it is possible to suitably avoid a situation in which an error occurs in the measurement value due to the positional deviation (change in the positional relationship) of these components, and as a result, accurate measurement result data can be easily generated. Furthermore, since the probe to be probed for the measurement object is moved by the first moving mechanism to be probed to the calibration reference portion and the measurement process is performed while the correction data is generated based on the first data and the second data generated during the measurement process, the generation of the correction data can be completed in a very short time, which is the sum of the time required for moving the probe by the first moving mechanism and the time required for the measurement process. As a result, the time for interrupting the measurement (inspection) process for the measurement object can be shortened, and the efficiency of the measurement (inspection) process is not significantly reduced even if new correction data is frequently generated, so that the measurement result data can be corrected with high accuracy based on the latest correction data.

In a measuring device according to a third aspect of the present invention, the measuring device includes a calibration reference part, and a second moving mechanism capable of moving the calibration reference part into a probing area where the probe can be probed by relative movement of the probe with respect to the holding part by the first moving mechanism, and the signal processing part includes a probe connection part, a first A/D conversion part, and a first component constituting a first signal transmission path, which are attached to the first moving mechanism together with the probe in a state in which these are positioned relative to each other and positional deviation between them is restricted, and the processing part controls the second moving mechanism to move the calibration reference part into the probing area and controls the first moving mechanism to probe the probe to the calibration reference part and input a first high-frequency signal from the calibration reference part, and executes a correction data generation process to generate correction data for correcting measurement result data for the measurement object based on the first data generated by the first A/D conversion part.

Therefore, according to the measuring device described in claim 3 , unlike the inspection device disclosed in the above patent document, it is not necessary to manufacture a measurement board or a calibration reference unit for each different type of measuring object, and the first high frequency signal can be input from the measuring object or the calibration reference unit by moving the probe with the first moving mechanism to probe various measuring objects and calibration reference units, and the measurement process and the correction data generation process can be performed. Therefore, the cost required for the measurement process and the correction data generation process can be sufficiently reduced. In addition, since no positional deviation occurs between the probe connection unit, the first A/D conversion unit, and the first component when probing the measuring object or the calibration reference unit with the probe, the situation in which an error occurs in the measured value due to the positional deviation (change in the positional relationship) between these components is suitably avoided, and as a result, accurate measurement result data can be reliably and easily generated. Furthermore, since the probe to be probed for the measurement object is moved by the first moving mechanism to be probed to the calibration reference part and the measurement process is performed while the correction data is generated based on the first data generated at that time, the generation of the correction data can be completed in a very short time obtained by adding up the time required for moving the calibration reference part by the second moving mechanism, the time required for moving the probe by the first moving mechanism, and the time required for the measurement process. As a result, the time for interrupting the measurement (inspection) process for the measurement object can be shortened, and the efficiency of the measurement (inspection) process is not significantly reduced even if new correction data is frequently generated, so that the measurement result data can be corrected with high accuracy based on the latest correction data.

In a measurement device according to a third aspect of the present invention, the signal processing unit further includes a signal generating unit, a second A/D converting unit, a second component constituting the second signal transmission path, and a third component constituting a third signal transmission path, and the probe connection unit, the first A/D converting unit, the second A/D converting unit, the signal generating unit, the first component, the second component, and the third component are attached to the first moving mechanism together with the probe in a state in which they are positioned relative to each other and positional deviation between them is restricted, and the processing unit, in a correction data generation process, controls the second moving mechanism to move the calibration reference unit into a probing area and controls the first moving mechanism to cause the probe to probe the calibration reference unit, and generates correction data based on the first data generated by the first A/D converting unit and the second data generated by the second A/D converting unit in a state in which the second high-frequency signal generated by the signal generating unit is output to the calibration reference unit via the probe.

Therefore, according to the measuring device of claim 3 , the probe is moved by the first moving mechanism to various measurement objects and calibration reference parts to perform probing, and in that state, the second high frequency signal is output to the measurement object and the calibration reference part to input the first high frequency signal, thereby performing measurement processing and correction data generation processing. Therefore, the cost required for measurement processing and correction data generation processing can be sufficiently reduced. In addition, when the calibration reference part is moved into the probing possible area and when the probe is probing the measurement object or the calibration reference part, there is no positional deviation between the signal generating part, the probe connecting part, the first A/D conversion part, the second A/D conversion part, the first component, the second component, and the third component. Therefore, a situation in which an error occurs in the measurement value due to the positional deviation (change in the positional relationship) of these components is preferably avoided, and accurate measurement result data can be easily generated. Furthermore, the calibration reference part is moved into the probing area by the second moving mechanism, and the probe to be probed against the measurement object is moved by the first moving mechanism to be probed against the calibration reference part, and the correction data can be generated based on the first data and the second data generated at that time, so that the generation of the correction data can be completed in a very short time that is the sum of the time required to move the calibration reference part by the second moving mechanism, the time required to move the probe by the first moving mechanism, and the time required for the measurement process. As a result, the time for interrupting the measurement (inspection) process for the measurement object can be shortened, and the efficiency of the measurement (inspection) process is not significantly reduced even if new correction data is frequently generated, so that the measurement result data can be corrected with high accuracy based on the latest correction data.

In the measuring device according to claims 1, 2 and 3 , the first moving mechanism is configured to move each signal processing unit independently with respect to the holding unit and the calibration reference unit. The processing unit is configured to execute a first process of generating measurement result data during the measurement process and generating correction data during the correction data generation process based on first data generated by the first A/D conversion unit in any of the signal processing units and second data generated by the second A/D conversion unit in any of the signal processing units, when a second high frequency signal is output from a probe connected to any of the signal processing units and a first high frequency signal is input from a probe connected to any of the signal processing units, and a second process of generating measurement result data during the measurement process and generating correction data during the correction data generation process, based on first data generated by the first A/D conversion unit in any of the other signal processing units and second data generated by the second A/D conversion unit in any of the signal processing units, when a second high frequency signal is output from a probe connected to any of the signal processing units and a first high frequency signal is input from a probe connected to any of the other signal processing units.

Therefore, according to the measurement device described in claims 1, 2 and 3, by executing the first process in parallel at multiple locations on the measurement object or the calibration standard portion, it is possible to shorten the time required to generate the first data and the second data for these multiple locations, and for locations on the measurement object or the calibration standard portion that are spaced apart to a certain extent, the probing position of the probe of one of the signal processing portions can be arbitrarily changed to the probing position of the probe of the other signal processing portion to execute the second process, so that the first data and the second data for various measurement objects and calibration standard portions can be reliably and easily generated to generate measurement result data and correction data.

In addition, in the measuring device according to claims 1, 2 and 3 , when the processing unit executes a second measurement process in which a second high frequency signal of a first frequency is output in the second processing, after the first measurement process in which a second high frequency signal of a first frequency is output in the second processing, the processing unit executes a correction data generation process in which a second high frequency signal of a second frequency is output in the second processing. As a result, when the phase relationship between the signal processing unit that outputs the second high frequency signal and the signal processing unit that inputs the first high frequency signal changes with a change in the frequency of the second high frequency signal, correction data can be obtained that can correct the measurement result data calculated based on the measurement value output from such a signal processing unit to an accurate value.

In the measuring device of claim 4 , the processing unit monitors whether or not predefined conditions are satisfied among the conditions that the measuring device has been started, that the probe has been replaced, that the temperature of the signal processing unit has changed beyond a preset temperature, that the number of times the probe has been probing the measurement object and the calibration reference unit has reached a preset number of times, that the continuous operating time of the measuring device has reached a preset time, and that the value of the measurement result data differs from the corresponding reference value by more than a preset difference amount, and executes a correction data generation process when the predefined conditions are satisfied. Therefore, according to the measuring device of claim 4 , even if the operating state of the measuring device is not monitored, correction data that can correct the measurement result data to an accurate value can be automatically obtained.

In the measuring device according to claim 5 , the processing unit executes a data correction process to correct the measurement result data for the object to be measured based on the correction data, thereby making it possible to provide accurate measurement result data after the data correction process.

FIG. 1 is a configuration diagram of an inspection device 1. FIG. 2 is a configuration diagram of a signal processing unit 3. FIG. 1 is a configuration diagram of an inspection device 1A.

The following describes an embodiment of the measuring device with reference to the attached drawings.

The inspection device 1 shown in FIG. 1 is an example of a "measurement device" and includes a holding unit 2, signal processing units 3, 3, probes 4a, 4a, 4b, 4b, moving mechanisms 5, 5, an operation unit 6, a display unit 7, a processing unit 8, a memory unit 9, and a calibration reference unit 10, and is configured to perform measurement processing on an inspection object X (an example of a "measurement object") and inspection of the inspection object X based on the measurement results. Note that the inspection object X is not particularly limited, but as an example, an example will be described in which a module that is an inspection object of the inspection device disclosed in the aforementioned patent document is inspected as the inspection object X. Also, the calibration reference unit 10 is an example of a "calibration reference unit", and is formed with a measured circuit (dummy circuit: not shown) that can perform the same measurement processing as that performed on various "inspection objects (measurement objects)" including the inspection object X.

The holding unit 2 corresponds to the "holding unit", and as an example, a configuration in which the holding unit 2 is connected to a vacuum pump (not shown) to suck and hold the test object X, or a configuration in which the test object X is clamped and held via a contact device that can contact the side of the test object X (neither of which is shown) is adopted. In this case, in this example in which the above-mentioned module is tested as the test object X, the test object X is held so that the shield conductive layer of the test object X is in contact with the holding unit 2 (i.e., so that the formation surface of each mounting electrode on the circuit board faces upward), thereby making it possible to probe each mounting electrode of the test object X. In addition, in this example, at least a part of the part of the holding unit 2 that contacts the test object X (shield conductive layer) functions as an electrode, and this part that functions as an electrode is connected to the processing unit 8 via the signal cable Ca, so that the test object X (shield conductive layer) is connected to the processing unit 8.

The signal processing unit 3 is an example of a "signal processing unit", and as shown in Figure 2, includes a signal generating unit 11, A/D conversion units 12o, 12i, and a signal separating unit 13. The signal processing unit 3 is provided with probe connecting units 14a, 14b (hereinafter also referred to as "probe connecting unit 14" when no distinction is made) to which the probes 4a, 4b can be connected, and cable connecting units 15a-15c (hereinafter also referred to as "cable connecting unit 15" when no distinction is made) to which the data cable Cb connected to the processing unit 8 can be connected, and is configured to be detachable from the moving mechanism 5.

In this case, in the signal processing unit 3 of this example, the probe 4a corresponds to the "probe", and the probe connection section 14a to which the probe 4a is connected corresponds to the "probe connection section". Furthermore, the probe connection section 14b to which the probe 4b is connected is connected to the ground potential in the signal processing unit 3, so that the part of the test object X or the calibration reference section 10 where the probe 4b is probed is connected to the ground potential. In this case, in the inspection device 1 of this example, when the probes 4a, 4b (hereinafter also referred to as "probe 4" when not distinguishing between them) become worn or damaged, it is possible to remove the worn or damaged probe 4 from the signal processing unit 3 and replace it with a new probe 4.

The signal generating unit 11 is an example of a "signal generating unit" and generates an output signal So equivalent to a "second high frequency signal" via a signal line of the data cable Cb connected to the cable connecting unit 15a. In this case, the signal generating unit 11 generates an output signal So of a frequency that is predefined according to the shape, size, and material of the conductor to be inspected for quality, the distance between the probing positions (inspection points described later) of the probes 4a and 4b, and the like, according to the control data Dc output from the processing unit 8. The A/D converting unit 12o is an example of a "second A/D converting unit" and A/D converts the output signal So generated by the signal generating unit 11 and output to the inspection target X to generate measurement data Dmo, which is an example of "second data", and outputs it to the processing unit 8 via the signal line of the data cable Cb connected to the cable connecting unit 15b.

The A/D conversion unit 12i is an example of a "first A/D conversion unit" that A/D converts an input signal Si (an example of a "first high-frequency signal") input from the test object X to generate measurement data Dmi, which is an example of "first data", and outputs the measurement data Dmi to the processing unit 8 via the signal line of the data cable Cb connected to the cable connection unit 15c. The signal separation unit 13 is configured as a so-called coupler, and separates the output signal So generated by the signal generation unit 11 from the input signal Si input from the probe connection unit 14a, and outputs the output signal So to the probe connection unit 14a and the A/D conversion unit 12o, and outputs the input signal Si to the A/D conversion unit 12i.

In this case, in the signal processing unit 3, the signal transmission path L1 from the signal generating unit 11 to the probe connecting unit 14a corresponds to the "second signal transmission path", and the components constituting this signal transmission path L1 (such as the wiring pattern and the signal separating unit 13) correspond to the "second components". In addition, in the signal processing unit 3, the signal transmission path L2 from the signal generating unit 11 to the A/D converting unit 12o corresponds to the "third signal transmission path", and the components constituting this signal transmission path L2 (such as the wiring pattern and the signal separating unit 13) correspond to the "third components". In addition, in the signal processing unit 3, the signal transmission path L3 from the probe connecting unit 14a to the A/D converting unit 12i corresponds to the "first signal transmission path", and the components constituting this signal transmission path L3 (such as the wiring pattern and the signal separating unit 13) correspond to the "first components".

In addition, in this signal processing unit 3, the signal generating section 11, the A/D conversion sections 12o, 12i, the probe connection sections 14a, 14b and each component of the signal transmission paths L1 to L3 (such as the wiring pattern and the signal separation section 13) are packaged and integrated. As a result, in the signal processing unit 3 of this example, the signal generating unit 11, the A/D converting units 12o, 12i, the probe connecting units 14a, 14b, and the components of the signal transmission paths L1 to L3 are positioned relative to one another, and the positional deviation between the signal generating unit 11, the A/D converting units 12o, 12i, the probe connecting units 14a, 14b, and the components of the signal transmission paths L1 to L3 is restricted (one example of a state in which "the probe connecting unit, the first A/D converting unit, and the first component are positioned relative to one another, and the positional deviation between them is restricted" and a state in which "the signal generating unit, the probe connecting unit, the second A/D converting unit, the second component, and the third component are positioned relative to one another, and the positional deviation between them is restricted").

The moving mechanism 5 is an example of a "first moving mechanism", and moves each probe 4 to the test object X held by the holding unit 2 under the control of the processing unit 8 to probe an arbitrary probing position (the position where the mounting electrode is formed on the test object X: the test point). In this case, in the test device 1 of this example, as shown in FIG. 1, as an example, the test object X is held by the stationary holding unit 2, and the test object X is probed by the moving mechanism 5 having four mechanisms (none of which are shown): an X-axis moving mechanism that moves the test object X in the X-axis direction (a direction along the mounting surface of the holding unit 2), a Y-axis moving mechanism that moves the test object X in the Y-axis direction (a direction along the mounting surface of the holding unit 2 and intersects (e.g., perpendicular) with the X-axis), a θ-axis rotating mechanism that rotates the test object X in the θ direction (rotates the test object X along the mounting surface of the holding unit 2), and a Z-axis moving mechanism that moves the test object X in the Z-axis direction (a direction intersecting (e.g., perpendicular) with the mounting surface of the holding unit 2).

In this example of the inspection device 1, in which the probe 4 is attached to the signal processing unit 3 by connecting the probe 4 to the probe connection portion 14 of the signal processing unit 3 attached to the moving mechanism 5, the probe 4 is moved relative to the holding portion 2 together with the signal processing unit 3 by moving the signal processing unit 3 relative to the holding portion 2 (one example of a configuration in which "each signal processing portion can be moved independently of the holding portion"). Therefore, in this example of the inspection device 1, the movement of the signal processing unit 3 by the moving mechanism 5 corresponds to "relative movement of the probe with respect to the holding portion by the first moving mechanism."

In addition, in the inspection device 1 of this example, the range within which the signal processing unit 3 (probe 4) can be moved by the moving mechanism 5 corresponds to the "probing area", and the holding unit 2 and calibration reference unit 10 are disposed within this moving range (probing area). Note that while FIG. 1 illustrates a state in which the inspection object X and calibration reference unit 10 are placed on the holding unit 2, the calibration reference unit 10 can also be disposed alongside the holding unit 2 within the above-mentioned moving range (probing area).

The operation unit 6 has various operation switches that can set the execution conditions of the inspection process for the inspection object X and the execution conditions of the calibration process (processing for generating correction data) described below, and can instruct the start of the inspection process or the calibration process, and outputs operation signals according to switch operations to the processing unit 8. The display unit 7, under the control of the processing unit 8, displays a setting screen for setting each of the above execution conditions, a screen showing the operating status of the inspection device 1, and a display screen for the inspection results for the inspection object X (none of which are shown).

The processing unit 8 controls the overall inspection device 1. Specifically, the processing unit 8 is an example of a "processing unit" and controls the movement of the probe 4 (signal processing unit 3) by the moving mechanism 5 and the generation of the output signal So by the signal generating unit 11 (output of the output signal So to the inspection target X), and also performs processing (an example of a "measurement process") related to the calculation of the measured quantity based on the measurement value data Dmo, Dmi generated by the A/D conversion units 12o, 12i, and the generation of measurement result data Dr (an example of "measurement result data") based on the calculation result.

In addition, in the present example, the inspection device 1 is configured to be able to perform one of four measurements (inspections) depending on the content to be inspected when inspecting the inspection object X: "open measurement (inspection)", "short measurement (inspection)" and "load measurement inspection" which are performed for each signal processing unit 3 using both signal processing units 3 individually, and "through measurement (inspection)" which is performed using both signal processing units 3, 3 in combination.

In this case, as an example of the "open measurement (inspection)", "short measurement (inspection)" and "load measurement inspection", a process (an example of a "first process") is executed in which the above-mentioned measurement result data Dr is generated using, for example, a voltage value or a reflected power value at a probing point using a probe 4 attached to one of the signal processing units 3, 3 as the "predefined measured quantity for the measurement object". As the "through measurement (inspection)", a process (an example of a "second process") is executed in which the above-mentioned measurement result data Dr is generated using, for example, a probing point (mounting electrode) of a probe 4 attached to one of the signal processing units 3, 3 and a probing point (mounting electrode) of a probe 4 attached to the other of the signal processing units 3, 3 as the "predefined measured quantity for the measurement object".

Furthermore, depending on the content to be inspected, a process is executed to generate the above-mentioned measurement result data Dr, using the impedance value between the probing point (mounting electrode) of the probe 4 attached to either of the signal processing units 3, 3 and the shield conductive layer with which the holding part 2 is in contact as the "predefined measured quantity for the measurement object."

The processing unit 8 in the inspection device 1 of this example is also configured to correct the value of the measurement result data Dr generated by the above-mentioned "measurement process" based on the correction data Dp generated by the calibration process (correction data generation process) described below (one example of a "data correction process"), and to inspect the quality of the inspection object X by comparing the corrected value with a comparison reference value.

Furthermore, the processing unit 8 monitors whether the "pre-set start condition" described below is satisfied, and when the "start condition" is satisfied, it controls both moving mechanisms 5, 5 to cause each probe 4a, 4b to probe a predetermined probing point (circuit under test (dummy circuit)) of the calibration reference unit 10, outputting an output signal So from the signal generating unit 11 to the calibration reference unit 10 while inputting an input signal Si from the calibration reference unit 10, and executes a "correction data generation process" to generate correction data Dp for correcting the measurement result data Dr for the test object X based on the measurement value data Dmo, Dmi generated by the A/D conversion units 12o, 12i and the reference value data Ds for the calibration reference unit 10 stored in the memory unit 9.

In the inspection device 1 of this example, the above-mentioned "start conditions (conditions for executing the calibration process)" include the condition that "the inspection device 1 has been started," the condition that "the probe 4 has been replaced," the condition that "the temperature of the signal processing unit 3 detected by a temperature sensor not shown has changed beyond a set temperature (an example of a "preset temperature")" (an example of a condition that "the temperature of the signal processing unit has changed beyond a preset temperature")," the condition that "the number of times the probe 4 has probed the inspection object X and the calibration reference unit 10 has reached a set number (an example of a "preset number")," and the condition that "the continuous execution time of the inspection process (during continuous operation of the inspection device 1) has reached a set number of times (an example of a "preset number of times")," and It is possible to select and set any of the following conditions: "The time between the measurement result data Dr and the corresponding reference value data Ds reaches a set time (preset time)," "The value of the measurement result data Dr differs from the value (reference value) of the corresponding reference value data Ds by more than a preset difference amount," "After the [first measurement process] as the measurement process in which the output signal So of the [first frequency] is output in the [second process], the [second measurement process] as the measurement process is executed in which the output signal So of the [second frequency] different from the [first frequency] is output in the [second process]," and "The execution is instructed by the user."

In this case, in this example, the conditions selected by the user from among the above conditions correspond to the "predefined conditions". In addition, in the inspection device 1 of this example, the user can arbitrarily change the "set temperature", "set number of times", "set time", and "difference amount" among the above conditions according to the type of inspection object X and the installation environment (operating environment) of the inspection device 1. Furthermore, in the inspection device 1 of this example, a configuration is adopted in which the "correction data generation process" is executed again when valid measurement result data Dr cannot be obtained in the "correction data generation process" executed according to the above-mentioned predefined conditions (for example, when the value of the measurement result data Dr differs greatly from the value of the corresponding reference value data Ds by more than the predefined difference amount).

The memory unit 9 stores the operation program of the processing unit 8, the reference value data Ds for the calibration reference unit 10 (data recording the measured values (e.g., impedance and reflection coefficient) to be measured when the calibration reference unit 10 is measured at room temperature when the probe 4 is not worn out or dirty, and the measured values (e.g., impedance and reflection coefficient) to be measured when the probe 4 is probed in a normal contact state to the calibration reference unit 10), and the reference value data Ds for the test object X (data recording the measured values (e.g., impedance and reflection coefficient) to be measured when the test object X is measured at room temperature when the probe 4 is not worn out or dirty, and the measured values (e.g., impedance and reflection coefficient) to be measured when the test object X is probed in a normal contact state to the probe 4), and the measurement result data Dr and correction data Dp generated by the processing unit 8.

When the inspection device 1 is powered on and started up, the processing unit 8 starts the calibration process (correction data generation process) as one of the execution conditions for the calibration process (predefined start conditions) is satisfied. In this calibration process, the processing unit 8 first performs a measurement process for the reflection coefficient of the calibration reference unit 10, which is composed of, for example, a 50 Ω reference device and has one of a pair of electrodes (as an example, an electrode unit for "load measurement") connected to a reference potential.

Specifically, the processing unit 8 controls the moving mechanism 5 to cause both probes 4 of the signal processing unit 3 to probe the other electrode portion provided on the calibration reference unit 10, and outputs control data Dc to the signal generating unit 11 to generate an output signal So. At this time, the output signal So generated by the signal generating unit 11 is output from the probe 4a to the calibration reference unit 10 via the signal transmission path L1 and the probe connection portion 14a, and the A/D conversion unit 12o A/D converts the output signal So input via the signal transmission path L2 to generate measurement value data Dmo, and outputs the generated measurement value data Dmo to the processing unit 8. In addition, a reflected signal as an input signal Si input from the calibration reference unit 10 to the signal processing unit 3 via the probe 4a is input to the A/D conversion unit 12i via the signal transmission path L3, and the A/D conversion unit 12i A/D converts the input signal Si to generate measurement value data Dmi, and outputs the generated measurement value data Dmi to the processing unit 8.

In this case, as described above, in the inspection device 1 of this example, the signal generating section 11, the A/D converting sections 12o and 12i, the probe connecting section 14a, and each component of the signal transmission paths L1 to L3 (wiring patterns and signal separating section 13) of the signal processing unit 3 are positioned relative to each other to regulate misalignment between them, and the probes 4a and 4b are connected and attached to the probe connecting sections 14a and 14b of the signal processing unit 3. Therefore, in the inspection device 1 of this example, when probing during the measurement process of the calibration reference section 10 or during the measurement process of the inspection object X described below, all components through which the input signal Si and the output signal So (high frequency signal) pass are moved together with the probes 4a and 4b by the moving mechanism 5 without changing the relative positions between them.

Therefore, in the inspection device 1 of this example, the distance between the signal generating unit 11 and the probe 4a, the distance between the probe 4a and the A/D conversion units 12o and 12i, and the shapes of each signal transmission path L1 to L3 do not change during probing. Therefore, in the inspection device 1 of this example, even if the probe 4 is probed to any part within the movable range of the signal processing unit 3 (probe 4) by the moving mechanism 5, the amplitude of the output signal So and the input signal Si, and the phase difference between the phase of the output signal So and the phase of the input signal Si do not change depending on the probing position of the probe 4, so that the occurrence of measurement errors when measuring the reflection coefficient based on the measurement value data Dmo and Dmi described later is preferably avoided.

On the other hand, the processing unit 8 measures the reflection coefficient of the calibration reference unit 10 based on the amplitude and phase of the output signal So determined based on the value of the measurement data Dmo output from the A/D conversion unit 12o of the signal processing unit 3 and the amplitude and phase of the input signal Si determined based on the value of the measurement data Dmi output from the A/D conversion unit 12i, and generates measurement result data Dr indicating the impedance value of the calibration reference unit 10 (an example of a "first process" targeting the calibration reference unit 10). In addition, the processing unit 8 generates correction data Dp for correcting the measurement result data Dr for the test object X generated later during the measurement process for the test object X (in this example, during "load measurement") based on the value of the generated measurement result data Dr and the reference value data Ds (reference impedance value) read from the storage unit 9 (an example of a "correction data generation process"), and stores the generated correction data Dp in the storage unit 9.

Although detailed explanations are omitted, during the "correction data generation process", the correction data Dp for "open measurement" and the correction data Dp for "short measurement" are sequentially generated based on the measurement result data Dr and the reference value data Ds generated by the "measurement process" targeting the calibration reference unit 10, and stored in the memory unit 9. In addition, the process of outputting an output signal So from a probe 4a attached to one signal processing unit 3, inputting an input signal Si from a probe 4a attached to the same signal processing unit 3 to generate measurement value data Dmo, Dmi, and calculating the measurement result data Dr based on the generated measurement value data Dmo, Dmi to generate the correction data Dp (an example of generating correction data Dp capable of correcting the measurement result data Dr of the "load measurement") has been described, but when generating correction data Dp capable of correcting the measurement result data Dr of the "through measurement", the following process is performed.

Specifically, the processing unit 8 controls the moving mechanisms 5, 5 to cause the probe 4a attached to one signal processing unit 3 to probe one end of the conductor section for "through measurement" provided in the calibration reference section 10, and the probe 4b to probe the reference potential for "through measurement" provided in the calibration reference section 10, and the probe 4a attached to the other signal processing unit 3 to probe the other end of the conductor section for "through measurement" of the calibration reference section 10, and the probe 4b to probe the reference potential for "through measurement" provided in the calibration reference section 10. Next, the processing unit 8 outputs control data Dc to the signal generating section 11 of one signal processing unit 3 to generate an output signal So, and causes the generated output signal So to be output from the probe 4a attached to that signal processing unit 3 to the calibration reference section 10.

At this time, the input signal Si from the calibration reference unit 10 is input to the signal processing unit 3 via the probe 4a attached to the other signal processing unit 3. Next, the processing unit 8 executes a measurement process (an example of a "second process") to calculate measurement result data Dr for the impedance of the conductor part for "through measurement" based on the measurement value data Dmo for the amplitude and phase of the output signal So output from the A/D conversion unit 12o in the one signal processing unit 3 and the measurement value data Dmi for the amplitude and phase of the input signal Si output from the A/D conversion unit 12i in the other signal processing unit 3, and generates correction data Dp based on the calculated measurement result data Dr and the corresponding reference value data Ds. In this way, various correction data Dp that can correct various measurement result data Dr are sequentially generated, thereby completing a series of calibration processes.

Meanwhile, when the calibration process is completed as described above and the storage of various correction data Dp in the memory unit 9 is completed, and the test object X transported by a transport mechanism (not shown) is held on the holder 2, the processing unit 8 starts the test process for the test object X. During the test process for the test object X, "open measurement", "short measurement", "load measurement" and "through measurement" are performed depending on the content of the test. As an example, the procedure for performing a "load measurement" and the procedure for performing a "through measurement" are described below.

First, the procedure for performing the "load measurement" will be described. The processing unit 8 controls the moving mechanism 5 in the same manner as during the calibration process to cause both probes 4 of the signal processing unit 3 to probe the electrode portion of the test object X, and outputs control data Dc to the signal generating unit 11 to generate an output signal So. At this time, the output signal So generated by the signal generating unit 11 is output from the probe 4a to the test object X via the signal transmission path L1 and the probe connection portion 14a, and the A/D conversion unit 12o A/D converts the output signal So input via the signal transmission path L2 to generate measurement value data Dmo, and outputs the generated measurement value data Dmo to the processing unit 8. Also, the input signal Si input from the test object X to the signal processing unit 3 via the probe 4a is input to the A/D conversion unit 12i via the signal transmission path L3, and the A/D conversion unit 12i A/D converts the input signal Si to generate measurement value data Dmi, and outputs the generated measurement value data Dmi to the processing unit 8.

In this case, in the inspection device 1 of this example, all components through which the input signal Si and the output signal So (high frequency signal) pass are moved together with the probes 4a and 4b by the movement mechanism 5 without changing the relative positions between them, in the same manner as in the "correction data generation process" described above. Therefore, in the inspection device 1 of this example, even if the probe 4 is probed at any location within the movable range of the signal processing unit 3 (probe 4) by the movement mechanism 5, the phase difference between the phase of the output signal So and the phase of the input signal Si does not change depending on the probing position of the probe 4, and therefore the occurrence of measurement errors in the reflection coefficient based on the measurement value data Dmo and Dmi is preferably avoided.

Next, the processing unit 8 generates measurement result data Dr indicating a reflection coefficient determined based on the values of the measurement data Dmo, Dmi output from the signal processing unit 3 (A/D conversion units 12o, 12i) (an example of a "first process" for the test object X). Next, the processing unit 8 corrects the value of the generated measurement result data Dr based on the correction data Dp (an example of a "data correction process"), and stores the corrected measurement result data Dr in the memory unit 9.

In this case, at this point immediately after the start of the inspection process for the inspection object X, the temperature of each part of the inspection device 1 (the temperature of the signal processing unit 3) is low compared to the state after a large number of inspection objects X have been inspected consecutively. Therefore, the value of the measurement result data Dr measured at this point may differ from the measurement result data Dr measured when the temperature of each part of the inspection device 1 (the signal processing unit 3) has risen to the standard temperature during operation. Therefore, in the inspection device 1 of this example, the measurement result data Dr for the inspection object X, which is the first inspection object, is corrected based on the correction data Dp generated in advance, so that it is possible to obtain accurate measurement result data Dr by appropriately correcting the measurement error caused by the inspection device 1 (signal processing unit 3) not having risen in temperature. As a result, accurate measurement result data Dr indicating the result of the "load measurement" for one inspection object X is stored in the memory unit 9.

On the other hand, in the "through measurement", the processing unit 8 controls the movement mechanisms 5, 5 to cause both probes 4 attached to one signal processing unit 3 to probe one of any pair of mounting electrodes in the test object X and the reference potential, and causes both probes 4 attached to the other signal processing unit 3 to probe the other of any pair of mounting electrodes in the test object X and the reference potential. Next, the processing unit 8 outputs control data Dc to the signal generating unit 11 of one signal processing unit 3 to generate an output signal So, and causes the generated output signal So to be output from the probe 4a attached to that signal processing unit 3.

At this time, an input signal Si from the test object X is input to the signal processing unit 3 via the probe 4a attached to the other signal processing unit 3. Next, the processing unit 8 calculates measurement result data Dr for the impedance between any pair of mounting electrodes in the test object X based on measurement value data Dmo for the amplitude and phase of the output signal So output from the A/D conversion unit 12o in the one signal processing unit 3 and measurement value data Dmi for the amplitude and phase of the input signal Si output from the A/D conversion unit 12i in the other signal processing unit 3 (an example of "second processing").

The processing unit 8 also corrects the calculated measurement result data Dr based on the correction data Dp (another example of "data correction processing"), and stores the corrected measurement result data Dr in the memory unit 9. This results in accurate measurement result data Dr indicating the results of the "through measurement" for any pair of mounting electrodes in the test object X being stored in the memory unit 9. Note that the "data correction processing" of the measurement result data Dr based on the correction data Dp may be performed each time the measurement result data Dr for each test point is generated, or may be performed when the generation of the measurement result data Dr for multiple test points (for example, all test points for the test object X) is completed.

In this case, the test object X includes various conductors with different shapes, sizes, and materials. In addition, the test object X has multiple test points (probing positions for probing with the probes 4a and 4b) at various distances depending on the shape, size, and material of the conductor to be tested for quality. Furthermore, in the "through measurement" described above, it is preferable to output an output signal So of a frequency that can obtain a highly accurate measurement result depending on the shape, size, and material of the conductor to be measured (tested) and the distance (separation) between the probing positions of the probes 4a and 4b. Therefore, in the test device 1 of this example, the signal generating unit 11 is configured to be able to generate an output signal So of various frequencies, and a configuration is adopted in which the output signal So of an arbitrary frequency is output according to the control data Dc from the processing unit 8.

In addition, as described above, in the inspection device 1 of this example, in the "through measurement", an output signal So is output from one of the two signal processing units 3, 3 arranged separately and input as an input signal Si to the other signal processing unit 3, and the impedance between a pair of inspection points is measured based on the amplitude and phase of the output signal So (measurement data Dmo) and the amplitude and phase of the input signal Si (measurement data Dmi). In this case, the signal generating unit 11 that generates the output signal So in one signal processing unit 3 and the A/D conversion unit 12o that A/D converts the output signal So are not synchronized with the A/D conversion unit 12i that A/D converts the input signal Si in the other signal processing unit 3. Therefore, when the frequency of the output signal So output from one signal processing unit 3 is changed in the "through measurement" using the two signal processing units 3, 3, the phase relationship in the signal processing units 3, 3 becomes different from that before the frequency change.

Therefore, when performing a "through measurement (an example of a "second measurement process")" in which an output signal So of a frequency (an example of a "second frequency") different from the frequency (an example of a "first frequency") of the output signal So output in the last performed "through measurement (an example of a "first measurement process")" is output, it is necessary to perform a "correction data generation process for outputting an output signal So of the [second frequency] in the [second process]" to generate correction data Dp that can measure an accurate impedance (can correct to an accurate impedance) based on the amplitude and phase of the output signal So and the amplitude and phase of the input signal Si. Note that the "measurement process" during the "correction data generation process" that generates the correction data Dp for correcting the measurement result data Dr generated by the above-mentioned "second measurement process" is similar to the process during the "through measurement" performed on the test object X, so a detailed description will be omitted, but such a "correction data generation process" may be performed either before or after the "second measurement process".

On the other hand, in the inspection device 1 of this example, as the start conditions of the "correction data generation process", as described above, in addition to the above-mentioned condition that "the inspection device 1 is started" and the condition that "after the [first measurement process] as the measurement process in which the output signal So of the [first frequency] is output in the [second process], the [second measurement process] as the measurement process in which the output signal So of the [second frequency] different from the [first frequency] is output in the [second process]", any other condition can be selected to execute the "correction data generation process".

For example, when the probes 4a, 4b connected to the signal processing unit 3 are replaced with new probes 4a, 4b, the positional relationship between the components through which the output signal So and the input signal Si pass changes. As a result, the relationship between the amplitude and phase of the output signal So and the amplitude and phase of the input signal Si will be different from that before the probes 4a, 4b were replaced. Therefore, it is preferable to select the condition "probe 4 has been replaced" as the start condition, and execute the "correction data generation process" when any of the probes 4 is replaced, thereby generating correction data Dp that can correct the measurement result data Dr to an accurate value according to the new positional relationship after the probe 4 is replaced.

In addition, when the temperature of the signal processing unit 3 rises due to heat generated by the moving mechanism 5 or the signal processing unit 3 itself, or when the temperature of the signal processing unit 3 falls due to heat dissipation during processing interruption (pause), the operating speed of the signal generating unit 11, the A/D conversion units 12o, 12i, the signal separating unit 13, etc. may change, or the conductors in the signal processing unit 3 may expand/contract, making it difficult to output accurate measurement data Dmo, Dmi. Therefore, it is preferable to select the condition that "the temperature of the signal processing unit 3 detected by a temperature sensor (not shown) has changed beyond a set temperature" as the start condition, and execute the "correction data generation process" when the temperature of the signal processing unit 3 rises or falls beyond the set temperature, thereby generating correction data Dp that can correct the measurement result data Dr generated based on the measurement data Dmo, Dmi to an accurate value according to the changed temperature. The temperature of the signal processing unit 3 is not limited to being directly detected by a temperature sensor disposed near the signal processing unit 3 or a radiation type temperature sensor, but may be detected indirectly by detecting the temperature of any part of the inspection device 1 whose temperature changes together with the signal processing unit 3, or by detecting the temperature of the location where the inspection device 1 is installed.

Furthermore, when the inspection of the inspection object X takes a long time, or when inspections of other inspection objects X are performed consecutively as described below, the inspection environment (such as temperature, humidity, and the influence of disturbances entering the inspection device 1) may change. Therefore, it is preferable to select as the start condition the condition that "the number of times the probe 4 has probed the inspection object X and the calibration reference part 10 has reached a set number" or the condition that "the continuous execution time of the inspection process has reached a set time" and execute the "correction data generation process" when either of the conditions is satisfied, thereby periodically generating correction data Dp according to the changed inspection environment.

In addition to the factors mentioned above, various causes (events that occur irregularly) can make it difficult to generate accurate measurement result data Dr. Therefore, it is preferable to select the condition that "the value of the measurement result data Dr differs from the value of the corresponding reference value data Ds by more than a preset difference amount" as the starting condition, and execute the "correction data generation process" when the difference amount from the reference value becomes large, thereby generating correction data Dp that can correct the measurement result data Dr to an accurate value.

In this case, the inspection device 1 of this example is configured to perform a "contact check" to confirm whether the probes 4a, 4b have been properly probing (contacted) each time the probes 4a, 4b are probed against the inspection object X or the calibration reference unit 10 during the "measurement process" for the inspection object X or the "correction data generation process" for the calibration reference unit 10. The measurement values measured to determine whether the probes 4a, 4b have been properly probing during this "contact check" are approximately the same at each probing point. For this reason, a common reference value is used for each probing point.

Therefore, by selecting the condition "the value of the measurement result data Dr at the time of the contact check differs from the value of the reference value data Ds for the contact check by more than a preset difference amount" as the start condition and having the processing unit 8 monitor it, it is possible to execute the "correction data generation process" at the right timing when it becomes difficult to generate accurate measurement result data Dr due to an irregular event, and further, since it is possible to determine whether or not to execute the "correction data generation process" by comparing with a common reference value, it is possible to avoid a situation in which a large load is placed on the processing unit 8.

By selecting any of the various conditions described above and having the processing unit 8 monitor whether or not the condition is met, the "correction data generation process" can be automatically executed at any timing without the need to give instructions by operating the operation unit 6. Furthermore, when the user wants to execute the "correction data generation process" at a timing desired by the user, the user instructs the start of the process by operating a switch on the operation unit 6. This allows the correction data Dp to be generated at a timing desired by the user.

Then, the processing unit 8 compares the corrected accurate measurement result data Dr with the reference value data Ds for the test object X, and if the difference between the values of the two data is within the reference range for determining whether the test point is good (between the two mounting electrodes), it determines that the test point where the probes 4a and 4b are in contact is good. In this case, the pass/fail determination for each test point based on the corrected measurement result data Dr and the reference value data Ds may be performed when the corrected measurement result data Dr for multiple test points (for example, all test points for the test object X) is obtained, or may be performed individually for each test point each time the corrected measurement result data Dr for one test point is generated. The test process for the test object X is completed by the above series of processes.

After this, the processing unit 8 sequentially executes the inspection process for the inspection object X of the other inspection objects in place of the inspection object X for which the inspection has been completed. In addition, when the set "calibration process execution condition" is satisfied, the processing unit 8 executes the measurement process for the calibration reference part 10 in the same manner as in the above-mentioned calibration process to generate the measurement result data Dr, compares the generated measurement result data Dr with the reference value data Ds for the calibration reference part 10, and generates the correction data Dp to overwrite the memory unit 9.

As a result, when the inspection device 1 is restarted, when the probe 4 is replaced, when the temperature of the signal processing unit 3 detected by a temperature sensor (not shown) changes beyond the set temperature, when the number of times the probe 4 is probing the inspection object X, etc. exceeds the set number of times, when the continuous execution time of the inspection process exceeds the set time, when the value of the measurement result data Dr differs from the value of the reference value data Ds by more than a preset difference amount, when a "second measurement process as a measurement process" is executed in which an output signal So of the "second frequency" is output in the "second process" after the "first measurement process as a measurement process" in which an output signal So of the "first frequency" is output in the "second process", and when instructed by the user, the calibration process is automatically executed and the latest correction data Dp is stored in the memory unit 9, and as a result, the measurement result data Dr of the inspection object X after the calibration process is accurately corrected.

In this way, in this inspection device 1, the signal processing unit 3 includes the signal generating unit 11, the A/D converting units 12o and 12i, the probe connecting unit 14, the "first component (in this example, the signal separating unit 13 and the wiring pattern)" constituting the signal transmission path L3, the "second component (in this example, the signal separating unit 13 and the wiring pattern)" constituting the signal transmission path L1, and the "third component (in this example, the signal separating unit 13 and the wiring pattern)" constituting the signal transmission path L2, which are attached to the moving mechanism 5 together with the probe 4 in a state where they are positioned relative to each other and the positional deviation between them is regulated, and in the "correction data generation process", the processing unit 8 controls the moving mechanism 5 to cause the probe 4 to probe the calibration reference unit 10, and generates correction data Dp based on the measurement data Dmi generated by the A/D converting unit 12i and the measurement data Dmo generated by the A/D converting unit 12o in a state where the output signal So generated by the signal generating unit 11 is output to the calibration reference unit 10 via the probe 4.

Therefore, according to this inspection device 1, the probe 4 is moved by the moving mechanism 5 to various inspection objects X and calibration reference parts 10 for probing, and in that state, the output signal So is output to the inspection object X and calibration reference part 10 and the input signal Si is input, thereby performing measurement processing and correction data Dp generation processing. Therefore, the cost required for measurement processing and correction data Dp generation processing can be sufficiently reduced. In addition, when probing the inspection object X and the calibration reference part 10 with the probe 4, there is no positional deviation between the signal generation part 11, the probe connection part 14, the A/D conversion parts 12o, 12i, the "first component", the "second component", and the "third component", so that the situation in which errors occur in the measured value due to these positional deviations (changes in the positional relationship) is preferably avoided, and as a result, accurate measurement result data Dr can be easily generated. Furthermore, the probe 4 to be probed against the test object X is moved by the movement mechanism 5 to the calibration reference unit 10, and the measurement process is performed while the correction data Dp is generated based on the measurement data Dmo, Dmi generated during the process. This allows the generation of the correction data Dp to be completed in a very short time, which is the sum of the time required for the movement of the probe 4 by the movement mechanism 5 and the time required for the measurement process. As a result, the time for which the measurement (test) process for the test object X is interrupted can be shortened, and even if new correction data Dp is frequently generated, the efficiency of the measurement (test) process is not significantly reduced, so the measurement result data Dr can be corrected with high accuracy based on the latest correction data Dp.

In addition, in this inspection device 1, the moving mechanism 5 is configured to be able to move each signal processing unit 3 separately and independently relative to the holding section 2 and the calibration reference section 10. In addition, in this inspection device 1, the processing unit 8 outputs an output signal So from the probe 4 connected to any one of the signal processing units 3 and inputs an input signal Si from the probe 4 connected to that signal processing unit 3, and based on the measurement data Dmi generated by the A/D conversion unit 12i in that signal processing unit 3 and the measurement data Dmo generated by the A/D conversion unit 12o in that signal processing unit 3, generates measurement result data Dr during the measurement process and generates correction data Dp during the correction data generation process. It is configured to be able to execute a "first process" and a "second process" in which the processing unit 8 outputs an output signal So from the probe 4 connected to any one of the signal processing units 3 and inputs an input signal Si from the probe 4 connected to any other signal processing unit 3, and based on the measurement data Dmi generated by the A/D conversion unit 12i in any other signal processing unit 3 and the measurement data Dmo generated by the A/D conversion unit 12o in any of the above signal processing units 3, generates measurement result data Dr during the measurement process and generates correction data Dp during the correction data generation process.

Therefore, according to this inspection device 1, by performing the "first process" in parallel at multiple locations (two locations in this example) on the inspection object X or the calibration reference unit 10, the time required to generate the measurement data Dmo, Dmi for these multiple locations (two locations) can be shortened, and for locations on the inspection object X or the calibration reference unit 10 that are separated by a certain amount, the probing position of the probe 4 of one of the signal processing units 3 can be arbitrarily changed to the probing position of the probe 4 of the other signal processing unit 3 to perform the "second process". Therefore, it is possible to reliably and easily generate the measurement data Dmo, Dmi for various inspection objects X and calibration reference units 10, and generate the measurement result data Dr and the correction data Dp.

Furthermore, in this inspection device 1, when the processing unit 8 executes a "second measurement process" in which an output signal So of a "second frequency" is output in the "second process" after a "first measurement process" in which an output signal So of a "first frequency" is output in the "second process", the processing unit 8 executes a "correction data generation process" in which an output signal So of a "second frequency" is output in the "second process". As a result, when the phase relationship between the signal processing unit 3 that outputs the output signal So and the signal processing unit 3 that inputs the input signal Si changes with a change in the frequency of the output signal So, correction data Dp can be obtained that can correct the measurement result data Dr calculated based on the measurement value data Dmo, Dmi output from such signal processing units 3, 3 to an accurate value.

In addition, in this inspection device 1, the processing unit 8 monitors whether or not the following predefined conditions are satisfied: "The inspection device 1 has been started", "The probe 4 has been replaced", "The temperature of the signal processing unit 3 has changed beyond a preset temperature", "The number of times the probe 4 has been probing the inspection object X and the calibration reference unit 10 has reached a preset number of times", "The continuous operation time of the inspection device 1 has reached a preset time", and "The value of the measurement result data Dr and the value of the corresponding reference value data Ds differ by more than a preset difference amount". When the predefined conditions are satisfied, the "correction data generation process" is executed. Therefore, according to this inspection device 1, the correction data Dp that can correct the measurement result data Dr to an accurate value can be automatically obtained without monitoring the operating state of the inspection device 1.

Furthermore, in this inspection device 1, the processing unit 8 executes a "data correction process" in which the measurement result data Dr for the inspection object X is corrected based on the correction data Dp, thereby making it possible to provide accurate measurement result data Dr after the "data correction process."

The configuration of the "measurement device" is not limited to the example of the configuration of the inspection device 1 described above. For example, the "measurement device" is provided with a "calibration reference unit" arranged in a probing area where the "probe" can be probed by the relative movement of the "probe" to the "holding unit" by the "first moving mechanism", and the "processing unit" controls the "first moving mechanism" to probe the "calibration reference unit". However, instead of such a configuration, a "second moving mechanism" is provided that is configured to be able to move the "calibration reference unit" into a probing area where the "probe" can be probed by the relative movement of the "probe" to the "holding unit" by the "first moving mechanism", and the "processing unit" controls the "second moving mechanism" to move the "calibration reference unit" into the probing area and controls the "first moving mechanism" to probe the "probe" to the "calibration reference unit".

Specifically, the inspection device 1A shown in FIG. 3 is another example of a "measurement device", and in addition to the components of the inspection device 1 described above, it includes a moving mechanism 5a equivalent to a "second moving mechanism", a calibration reference part 10 is attached to the moving mechanism 5a, and a processing unit 8 controls the moving mechanism 5a to move the calibration reference part 10 within the moving range (an example of a "probing area") of the signal processing unit 3 (probe 4) by the moving mechanism 5. Note that components in this inspection device 1A that are similar to those in the inspection device 1 described above are given the same reference numerals and duplicated descriptions are omitted, and duplicated descriptions of processes similar to those executed in the inspection device 1 described above are omitted.

This inspection device 1A employs a configuration in which, when calibration processing is not being performed (for example, when inspection processing is being performed), the movement mechanism 5a maintains a state in which the calibration reference part 10 has been moved to outside the movable range of the signal processing unit 3 (probe 4) by the movement mechanism 5 (a "state of being retracted to outside the probing range") under the control of the processing unit 8. Also, in this inspection device 1A, when a "start condition" selected and set from among the aforementioned "start conditions (conditions for executing calibration processing)" is satisfied, the processing unit 8 starts the calibration processing (processing for generating correction data).

In this calibration process, the processing unit 8 first controls the moving mechanism 5a to move the calibration reference unit 10 within the movable range of the signal processing unit 3 (probe 4) by the moving mechanism 5. Next, the processing unit 8 controls the moving mechanism 5 to cause both probes 4 of the signal processing unit 3 to probe the calibration reference unit 10. After this, the processing unit 8, as an example, acquires the measurement data Dmo, Dmi in the same manner as during the calibration process in the above-mentioned inspection device 1 to generate measurement result data Dr, generates correction data Dp based on the value of the measurement result data Dr and the reference value data Ds, and stores it in the memory unit 9. In addition, during the inspection process for the inspection object X, the quality of each inspection point on the inspection object X is inspected by comparing the accurate measurement result data Dr corrected based on the correction data Dp with the reference value data Ds.

In this manner, in the inspection device 1A, the signal processing unit 3 includes the signal generating section 11, the A/D converting sections 12o and 12i, the probe connecting section 14, the "first component (in this example, the signal separating section 13 and the wiring pattern)" constituting the signal transmission path L3, the "second component (in this example, the signal separating section 13 and the wiring pattern)" constituting the signal transmission path L1, and the "third component (in this example, the signal separating section 13 and the wiring pattern)" constituting the signal transmission path L2, and these are attached to the moving mechanism 5 together with the probe 4 in a state in which they are positioned relative to each other and the positional deviation between them is regulated. At the same time, the calibration reference unit 10 is attached to the moving mechanism 5a, and in the "correction data generation process", the processing unit 8 controls the moving mechanism 5a to move the calibration reference unit 10 into the "probing area", controls the moving mechanism 5 to cause the probe 4 to probe the calibration reference unit 10, and generates correction data Dp based on the measurement data Dmi generated by the A/D conversion unit 12i and the measurement data Dmo generated by the A/D conversion unit 12o while the output signal So generated by the signal generation unit 11 is output to the calibration reference unit 10 via the probe 4.

Therefore, according to this inspection device 1A, similarly to the above-mentioned inspection device 1, the probe 4 is moved by the moving mechanism 5 to various inspection objects X and calibration reference parts 10 for probing, and in that state, the output signal So is output to the inspection object X and calibration reference part 10 and the input signal Si is input, thereby performing measurement processing and correction data Dp generation processing. Therefore, the cost required for measurement processing and correction data Dp generation processing can be sufficiently reduced. In addition, when the calibration reference part 10 is moved into the "probing possible area" and when the probe 4 is probing the inspection object X and the calibration reference part 10, there is no positional deviation between the signal generation part 11, the probe connection part 14, the A/D conversion parts 12o, 12i, the "first component", the "second component", and the "third component", so that the situation in which errors occur in the measured value due to these positional deviations (changes in the positional relationship) is preferably avoided, and as a result, accurate measurement result data Dr can be easily generated. Furthermore, the calibration reference part 10 is moved into the "probing area" by the moving mechanism 5a, and the probe 4 for probing the test object X is moved by the moving mechanism 5 to probe the calibration reference part 10, and the measurement process is performed in this state. The correction data Dp can be generated based on the measurement value data Dmo and Dmi generated at that time, so that the generation of the correction data Dp can be completed in a very short time, which is the sum of the time required for the movement of the calibration reference part 10 by the moving mechanism 5a, the time required for the movement of the probe 4 by the moving mechanism 5, and the time required for the measurement process. As a result, the time for interrupting the measurement (test) process for the test object X can be shortened, and even if new correction data Dp is frequently generated, the efficiency of the measurement (test) process is not significantly reduced, so the measurement result data Dr can be corrected with high accuracy based on the latest correction data Dp.

Also, an example has been described in which the output signal So output to the test object X or the calibration standard unit 10 is input as the input signal Si from the test object X or the calibration standard unit 10 and A/D converted in the A/D conversion units 12o, 12i to generate the measurement value data Dmo, Dmi. However, instead of outputting a "second high frequency signal" such as the output signal So to a "measurement object" such as the test object X or a "calibration standard unit" such as the calibration standard unit 10, a "first high frequency signal" output from the "measurement object" or "calibration standard unit" can be input and A/D converted in the "A/D conversion unit" to generate "first data".

Specifically, the measuring device includes a calibration reference section disposed within a probing area where the probe can be probed by the relative movement of the probe with respect to the holding section by the first moving mechanism, the probe connection section, the first A/D conversion section, and the first component are positioned relative to each other to regulate the misalignment between the probe connection section, the first A/D conversion section, and the first component, and the probe connection section, the first A/D conversion section, and the first component are attached to the first moving mechanism together with the probe, and the processing section controls the first moving mechanism to cause the probe to probe the calibration reference section and input the first high frequency signal from the calibration reference section, and the measuring device can be configured to execute a correction data generation process that generates correction data for correcting the measurement result data for the measurement target based on the first data generated by the first A/D conversion section.

The device also includes a "calibration reference part" and a "second moving mechanism" that moves the "calibration reference part" into a probing area where the "probe" can be probed by the relative movement of the "probe" with respect to the "holding part" by the "first moving mechanism," and the "probe connection part," the "first A/D conversion part," and the "first component" are positioned relative to each other to regulate misalignment between the "probe connection part," the "first A/D conversion part," and the "first component," and the "probe connection part," the "first A/D conversion part," and the "first component" are aligned relative to the "probe." Both are attached to the "first moving mechanism," and the "processing unit" controls the "second moving mechanism" to move the "calibration reference unit" into a probing area, and controls the "first moving mechanism" to cause the "probe" to probe the "calibration reference unit" and input a "first high-frequency signal" from the "calibration reference unit," and the "measurement device" can be configured to execute a "correction data generation process" that generates "correction data" for correcting the "measurement result data" for the "measurement target" based on the "first data" generated by the "first A/D conversion unit."

In this case, when the output of the "second high-frequency signal (output signal So in the above-mentioned inspection device 1)" is not required, the cable connection parts 15a, 15b, signal generation part 11, A/D conversion part 12o, signal separation part 13 and signal transmission paths L1, L2 in the signal processing unit 3 of the above-mentioned inspection device 1 are not provided, and instead, the cable connection part 15c, the A/D conversion part 12i, the probe connection parts 14a, 14b, the signal transmission path L3, and the probes 4a, 4b connected to the probe connection parts 14a, 14b are positioned relative to each other to regulate the positional deviation between them, thereby making it possible to preferably avoid the occurrence of measurement errors such as reflection coefficients due to differences in the probing positions of both probes 4.

In addition, in a "measurement device" that uses such a "signal processing unit," a "calibration reference unit" that includes a reference signal generating unit that generates (outputs) a reference signal as a "first high-frequency signal" is disposed in a "probing area where the probe can be probed by relative movement of the probe with respect to the holding unit by a first moving mechanism," or such a "calibration reference unit" is moved into the "probing area" by a "second moving mechanism," and during the "correction data generation process," the high-frequency signal output from such a "calibration reference unit" is input, and "correction data" is generated based on the amplitude, phase, etc. of the signal.

Therefore, according to the "measurement device" having such a configuration, unlike the inspection device disclosed in the above patent document, it is not necessary to manufacture a measurement board or a calibration reference unit for each different type of "measurement object", and the "first high frequency signal" can be input from the "measurement object" or the "calibration reference unit" by moving and probing the "probe" with respect to various "measurement objects" and "calibration reference units" by the "first moving mechanism", and it is possible to perform the "measurement process" and the "correction data generation process". Therefore, it is possible to sufficiently reduce the cost required for the "measurement process" and the "correction data generation process". In addition, since there is no positional deviation between the "probe connection unit", the "first A/D conversion unit" and the "first component" when probing the "measurement object" or the "calibration reference unit" with the "probe", a situation in which an error occurs in the measurement value due to these positional deviations (changes in the positional relationship) is preferably avoided, and as a result, accurate "measurement result data" can be reliably and easily generated.

Furthermore, a "probe" to be probed against the "object to be measured" is moved by a "first moving mechanism" to probe a "calibration reference part" within a "probing area", and a "measurement process" is performed while the "probing process" is being performed, and "correction data" can be generated based on the "first data" generated during the process. Therefore, when a configuration in which the "calibration reference part" is disposed within the "probing area" is adopted, the generation of "correction data" can be completed in an extremely short time calculated by adding up the time required to move the "probe" by the "first moving mechanism" and the time required for the "measurement process". When a configuration in which the "calibration reference part" is moved into the "probing area" by a "second moving mechanism" is adopted, the generation of "correction data" can be completed in an extremely short time calculated by adding up the time required to move the "calibration reference part" by the "second moving mechanism", the time required to move the "probe" by the "first moving mechanism", and the time required for the "measurement process". As a result, the time for which the measurement (inspection) process for the "measurement object" is interrupted can be shortened, and the efficiency of the measurement (inspection) process does not decrease significantly even if new "correction data" is frequently generated, so the "measurement result data" can be corrected with high accuracy based on the latest "correction data."

In addition, the above description uses an example of a configuration in which the probe 4 is moved relative to the test object X (holding unit 2) and the calibration reference unit 10 by the moving mechanism 5 having four mechanisms, namely, an X-axis moving mechanism, a Y-axis moving mechanism, a θ-axis rotating mechanism, and a Z-axis moving mechanism. However, the configuration of the "first moving mechanism" is not limited to this, and it is also possible to adopt a configuration in which the probe 4 is moved by a "first moving mechanism" having at least one mechanism among the X-axis moving mechanism, the Y-axis moving mechanism, the θ-axis rotating mechanism, and the Z-axis moving mechanism, and the test object X (holding unit 2) and the calibration reference unit 10 are moved relative to the probe 4 by another mechanism among the X-axis moving mechanism, the Y-axis moving mechanism, the θ-axis rotating mechanism, and the Z-axis moving mechanism (not shown).

In addition, a single signal processing unit 3 is packaged and integrated into one system of "signal processing units (signal generating unit 11, A/D converting units 12o, 12i, signal separating unit 13, and probe connecting units 14a, 14b)," and a set of probes 4a, 4b are connected (attached) to the single signal processing unit 3, which is then attached to the moving mechanism 5, thereby moving the single system of "signal processing units" and the set of probes 4a, 4b using the single moving mechanism 5. However, a configuration can also be adopted in which multiple sets of "probes" are connected (attached) to a single "signal processing unit" that is packaged and integrated into multiple systems of "signal processing units," which is then attached to the "first moving mechanism," thereby moving multiple systems of "signal processing units" and multiple sets of "probes."

...

The present invention relates to a measurement device configured to be capable of measuring a predetermined measured quantity based on a high-frequency signal input from a measurement object, and without producing a measurement board or a calibration reference unit for each different type of measurement object, a first high-frequency signal can be input from the measurement object or the calibration reference unit by moving the probe with a first moving mechanism to various measurement objects and calibration reference units and performing measurement processing and correction data generation processing, thereby sufficiently reducing the cost required for measurement processing and correction data generation processing, and since no positional deviation occurs between the probe connection unit, the first A/D conversion unit, and the first component when probing the measurement object or the calibration reference unit with the probe, a situation in which an error occurs in the measurement value due to these positional deviations (changes in the positional relationship) can be suitably avoided, and accurate measurement result data can be reliably and easily generated.

REFERENCE SIGNS LIST 1, 1A Inspection device 2 Holding section 3 Signal processing unit 4a, 4b Probe 5, 5a Moving mechanism 8 Processing section 9 Memory section 10 Calibration reference section 11 Signal generation section 14a, 14b Probe connection section 15a to 15c Cable connection section 12 A/D conversion section Ca Signal cable Cb Data cable Dc Control data Dmo, Dmi Measurement value data Dp Correction data Dr Measurement result data Ds Reference value data L1, L2, L3 Signal transmission path Si Input signal So Output signal X Inspection object

Claims (5)

A holding unit configured to be able to hold a measurement object;
a probe that is probed to the object to be measured and inputs a first high frequency signal from the object to be measured;
a first moving mechanism configured to be capable of moving the probe at least relative to the holding unit so as to be able to probe the measurement object held by the holding unit;
a signal processing unit including a first A/D conversion unit that performs A/D conversion on the first high frequency signal to generate first data, and provided with a probe connection unit to which the probe is connected;
a processing unit that executes a measurement process for controlling the first moving mechanism to cause the probe to probe the measurement object and generating measurement result data that can identify a predetermined measured quantity of the measurement object based on the first data,
a calibration reference unit including a plurality of the signal processing units and disposed within a probing area in which the probe can be probed by the relative movement of the probe with respect to the holding unit by the first moving mechanism;
the holding section is configured so that the measurement target and the calibration reference section can be placed side by side within the probing area;
the first moving mechanism is configured to be able to move each of the signal processing units independently of each other with respect to the holding unit and the calibration reference unit;
the signal processing unit includes the probe connecting unit, the first A/D converting unit , a first component constituting a first signal transmission path from the probe connecting unit to the first A/D converting unit , a signal generating unit generating a second high frequency signal, a second A/D converting unit performing A/D conversion on the second high frequency signal to generate second data, a second component constituting a second signal transmission path from the signal generating unit to the probe connecting unit, and a third component constituting a third signal transmission path from the signal generating unit to the second A/D converting unit;
the probe connection unit, the first A/D conversion unit, the first component , the signal generation unit, the second A/D conversion unit, the second component, and the third component are attached to the first moving mechanism together with the probe in a state in which they are positioned relative to each other and positional deviation between them is restricted;
The processing unit is configured to execute a correction data generation process for controlling the first moving mechanism to cause the probe to probe the calibration standard unit and input the first high frequency signal from the calibration standard unit, and for generating correction data for correcting the measurement result data for the measurement object based on the first data generated by the first A/D conversion unit, and in the measurement process, the processing unit controls the first moving mechanism to cause the probe to probe the measurement object, and outputs the second high frequency signal generated by the signal generation unit to the measurement object via the probe, and generates correction data for correcting the measurement result data for the measurement object based on the first data generated by the first A/D conversion unit. the measurement result data is generated based on the second data generated by a D conversion unit, and in the correction data generation process, the first moving mechanism is controlled to cause the probe to probe the calibration standard unit, and the correction data is generated based on the first data generated by the first A/D conversion unit and the second data generated by the second A/D conversion unit in a state in which the second high-frequency signal generated by the signal generation unit is output to the calibration standard unit via the probe, and the second high-frequency signal is output from the probe connected to any of the signal processing units, and the first data is generated from the probe connected to any of the signal processing units. a first process of generating the measurement result data during the measurement process and generating the correction data during the correction data generation process, based on the first data generated by the first A/D conversion unit in any one of the signal processing units and the second data generated by the second A/D conversion unit in any one of the signal processing units, in a state in which a high frequency signal of and a second process of generating the measurement result data during the measurement process and generating the correction data during the correction data generation process based on the second data generated by the second A/D conversion unit in any of the signal processing units, wherein when a second measurement process is executed as the measurement process in which the second high-frequency signal of a second frequency different from the first frequency is output in the second process after a first measurement process as the measurement process in which the second high-frequency signal of a first frequency is output in the second process, the measurement device executes the correction data generation process to output the second high-frequency signal of the second frequency in the second process . A holding unit configured to be able to hold a measurement object;
a probe that is probed to the object to be measured and inputs a first high frequency signal from the object to be measured;
a first moving mechanism configured to be capable of moving the probe at least relative to the holding unit so as to be able to probe the measurement object held by the holding unit;
a signal processing unit including a first A/D conversion unit that performs A/D conversion on the first high frequency signal to generate first data, and provided with a probe connection unit to which the probe is connected;
a processing unit that executes a measurement process for controlling the first moving mechanism to cause the probe to probe the measurement object and generating measurement result data that can identify a predetermined measured quantity of the measurement object based on the first data,
a calibration reference unit including a plurality of the signal processing units and disposed within a probing area in which the probe can be probed by the relative movement of the probe with respect to the holding unit by the first moving mechanism;
The holding portion is disposed next to the calibration reference portion within the probing area,
the first moving mechanism is configured to be able to move each of the signal processing units independently of each other with respect to the holding unit and the calibration reference unit;
the signal processing unit includes the probe connecting unit, the first A/D converting unit , a first component constituting a first signal transmission path from the probe connecting unit to the first A/D converting unit , a signal generating unit generating a second high frequency signal, a second A/D converting unit performing A/D conversion on the second high frequency signal to generate second data, a second component constituting a second signal transmission path from the signal generating unit to the probe connecting unit, and a third component constituting a third signal transmission path from the signal generating unit to the second A/D converting unit;
the probe connection unit, the first A/D conversion unit, the first component , the signal generation unit, the second A/D conversion unit, the second component, and the third component are attached to the first moving mechanism together with the probe in a state in which they are positioned relative to each other and positional deviation between them is restricted;
The processing unit is configured to execute a correction data generation process for controlling the first moving mechanism to cause the probe to probe the calibration standard unit and input the first high frequency signal from the calibration standard unit, and for generating correction data for correcting the measurement result data for the measurement object based on the first data generated by the first A/D conversion unit, and in the measurement process, the processing unit controls the first moving mechanism to cause the probe to probe the measurement object, and outputs the second high frequency signal generated by the signal generation unit to the measurement object via the probe, and generates correction data for correcting the measurement result data for the measurement object based on the first data generated by the first A/D conversion unit. the measurement result data is generated based on the second data generated by a D conversion unit, and in the correction data generation process, the first moving mechanism is controlled to cause the probe to probe the calibration standard unit, and the correction data is generated based on the first data generated by the first A/D conversion unit and the second data generated by the second A/D conversion unit in a state in which the second high-frequency signal generated by the signal generation unit is output to the calibration standard unit via the probe, and the second high-frequency signal is output from the probe connected to any of the signal processing units, and the first data is generated from the probe connected to any of the signal processing units. a first process of generating the measurement result data during the measurement process and generating the correction data during the correction data generation process, based on the first data generated by the first A/D conversion unit in any one of the signal processing units and the second data generated by the second A/D conversion unit in any one of the signal processing units, in a state in which a high frequency signal of and a second process of generating the measurement result data during the measurement process and generating the correction data during the correction data generation process based on the second data generated by the second A/D conversion unit in any of the signal processing units, wherein when a second measurement process is executed as the measurement process in which the second high-frequency signal of a second frequency different from the first frequency is output in the second process after a first measurement process as the measurement process in which the second high-frequency signal of a first frequency is output in the second process, the measurement device executes the correction data generation process to output the second high-frequency signal of the second frequency in the second process . A holding unit configured to be able to hold a measurement object;
a probe that is probed to the object to be measured and inputs a first high frequency signal from the object to be measured;
a first moving mechanism configured to be capable of moving the probe at least relative to the holding unit so as to be able to probe the measurement object held by the holding unit;
a plurality of signal processing units each having a first A/D conversion unit that performs A/D conversion on the first high frequency signal to generate first data, and each having a probe connection unit to which the probe is connected;
a processing unit that executes a measurement process for controlling the first moving mechanism to cause the probe to probe the measurement object and generating measurement result data that can identify a predetermined measured quantity of the measurement object based on the first data,
A calibration reference portion;
a second moving mechanism configured to be able to move the calibration reference part into a probing area where the probe can be probed by the relative movement of the probe with respect to the holding part by the first moving mechanism;
the signal processing unit includes the probe connection unit, a signal generation unit that generates a second high frequency signal, the first A/D conversion unit, a second A/D conversion unit that A/D converts the second high frequency signal to generate second data, a first component that configures a first signal transmission path from the probe connection unit to the first A/D conversion unit, a second component that configures a second signal transmission path from the signal generation unit to the probe connection unit, and a third component that configures a third signal transmission path from the signal generation unit to the second A/D conversion unit;
the probe connection unit, the signal generation unit, the first A/D conversion unit, the second A/D conversion unit, the first component, the second component, and the third component are attached to the first moving mechanism together with the probe in a state in which they are positioned relative to each other and positional deviation between them is restricted;
the first moving mechanism is configured to be able to move each of the signal processing units independently of each other with respect to the holding unit and the calibration reference unit;
The processing unit includes:
the second moving mechanism is controlled to move the calibration reference unit into the probing area, and the first moving mechanism is controlled to cause the probe to probe the calibration reference unit and input the first high-frequency signal from the calibration reference unit, and a correction data generation process is executed to generate correction data for correcting the measurement result data for the measurement target based on the first data generated by the first A/D conversion unit,
in the measurement process, the first moving mechanism is controlled to cause the probe to probe the measurement object, and the measurement result data is generated based on the first data generated by the first A/D conversion unit and the second data generated by the second A/D conversion unit in a state in which the second high frequency signal generated by the signal generation unit is output to the measurement object via the probe; and in the correction data generation process, the second moving mechanism is controlled to move the calibration reference unit into the probing area, the first moving mechanism is controlled to cause the probe to probe the calibration reference unit, and the correction data is generated based on the first data generated by the first A/D conversion unit and the second data generated by the second A/D conversion unit in a state in which the second high frequency signal generated by the signal generation unit is output to the calibration reference unit via the probe;
a first process of generating the measurement result data during the measurement process and generating the correction data during the correction data generation process, based on the first data generated by the first A/D conversion section in any of the signal processing sections and the second data generated by the second A/D conversion section in any of the signal processing sections, in a state in which the second high frequency signal is output from the probe connected to any of the signal processing sections and the first high frequency signal is input from the probe connected to any of the signal processing sections; a second process of generating the measurement result data during the measurement process and generating the correction data during the correction data generation process, based on the first data generated by the first A/D conversion unit in one of the signal processing units and the second data generated by the second A/D conversion unit in any one of the signal processing units, and wherein, when a second measurement process is executed as the measurement process in which the second high frequency signal of a second frequency different from the first frequency is output in the second process after a first measurement process as the measurement process in which the second high frequency signal of a first frequency is output in the second process, the measurement device executes the correction data generation process to output the second high frequency signal of the second frequency in the second process. 4. The measuring device according to claim 1, wherein the processing unit monitors whether or not predefined conditions are satisfied, among the following: the measuring device has been started up; the probe has been replaced; the temperature of the signal processing unit has changed beyond a predetermined temperature; the number of times the probe has probing the measurement object and the calibration standard unit has reached a predefined number; the continuous operating time of the measuring device has reached a predefined time; and the value of the measurement result data differs from the corresponding reference value by more than a predefined difference amount, and executes the correction data generation process when the predefined conditions are satisfied. The measurement device according to claim 1 , wherein the processing unit executes a data correction process for correcting the measurement result data for the measurement object based on the correction data.

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